Electronic detonator module encapsulation method and encapsulation system

Abstract

The application discloses an electronic detonator module encapsulation method and an encapsulation system, and belongs to the technical field of electronic detonators. The electronic detonator module encapsulation method comprises the following steps: placing a substrate provided with a plurality of electronic detonator modules to be encapsulated into a receiving cavity of an encapsulation mold in an electronic detonator module encapsulation system, wherein a plurality of substrate strips are arranged on the substrate, and a connecting wire and an electronic element are arranged on each of the plurality of substrate strips to form an electronic detonator module; closing the encapsulation mold to confine the plurality of electronic detonator modules to be encapsulated in a to-be-glue-injection cavity formed after the encapsulation mold is closed, and the to-be-encapsulated parts of the plurality of electronic detonator modules are located in the to-be-glue-injection cavities, respectively; injecting a hot glue into the plurality of to-be-glue-injection cavities, and filling the hot glue in the plurality of to-be-glue-injection cavities and wrapping the to-be-encapsulated parts of the electronic detonator modules; and demolding. The electronic detonator module encapsulation method is beneficial to encapsulating the plurality of electronic detonator modules and improving the encapsulation quality.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic detonator, and particularly relates to an electronic detonator module encapsulation method and an encapsulation system. BACKGROUND

[0002] At present, electronic detonators are widely applied to tunnel excavation, danger removal blasting, demolition blasting, mine rock separation, open-pit mine blasting and the like, and an electronic detonator module in the electronic detonator is an initiation control part of the electronic detonator, and the stability of the electronic detonator module will directly affect the stability of the electronic detonator. The electronic detonator module mainly comprises an integrated control chip, an ignition device, an energy storage capacitor and other electronic elements mounted on a circuit board. In addition, the electronic detonator module needs to be encapsulated in the production process of the electronic detonator to protect the electronic elements mounted on the circuit board, so as to have the functions of moisture-proof and dust-proof.

[0003] However, when the electronic detonator module is encapsulated by using the encapsulation method in the prior art, in order to improve the encapsulation efficiency of the electronic detonator module, the plurality of electronic detonator modules are usually connected into a whole by a connecting piece before encapsulation, so as to position the plurality of electronic detonator modules, and then the plurality of electronic detonator modules connected into the whole by the connecting piece are placed in a cavity of an injection mold for encapsulation. However, the plurality of electronic detonator modules connected into the whole by the connecting piece often have the problem of insufficient constraint force of the connecting piece on the plurality of electronic detonator modules, and the electronic detonator modules are prone to deviation in the encapsulation process, thereby reducing the encapsulation quality of the electronic detonator modules.

[0004] Further, the plurality of electronic detonator modules are connected on the connecting piece one by one, which increases the workload of encapsulating the electronic detonator modules. Therefore, there is an urgent need for an encapsulation method which is beneficial to encapsulating the plurality of electronic detonator modules and improves the encapsulation quality. SUMMARY

[0005] The present application aims to overcome at least one of the above-mentioned deficiencies in the prior art, and to provide an electronic detonator module encapsulation method which is beneficial to encapsulating the plurality of electronic detonator modules and improves the encapsulation quality, and to provide an electronic detonator module encapsulation system.

[0006] The technical solution of the present application to solve the above technical problems is as follows:

[0007] According to an aspect of the present application, an electronic detonator module encapsulation method is provided, comprising:

[0008] Put the substrate provided with a plurality of electronic detonator module to be glued into the receiving cavity of the glue mold in the electronic detonator module glue system, wherein the substrate is provided with a plurality of substrate strips, and a plurality of connecting wires and electronic elements are arranged on the substrate strips to form the electronic detonator module.

[0009] The glue mold is closed, and the plurality of electronic detonator modules to be glued are limited in the glue injection cavity formed after the glue mold is closed, and the parts to be glued of the plurality of electronic detonator modules are located in the glue injection cavity.

[0010] Hot glue is injected into the plurality of glue injection cavities, and the hot glue is filled in the plurality of glue injection cavities and wraps the parts to be glued of the electronic detonator modules.

[0011] The plurality of electronic detonator modules with completed glue are demolded.

[0012] The beneficial effects of the present application are that in the electronic detonator module glue method of the embodiment, the substrate provided with a plurality of electronic detonator modules to be glued is put into the receiving cavity of the glue mold in the electronic detonator module glue system, the plurality of electronic detonator modules to be glued are connected to the substrate strips, the substrate strips are part of the substrate, the plurality of electronic detonator modules are fixed by fixing the substrate, the reliability of fixing the plurality of electronic detonator modules is improved, the electronic detonator modules are prevented from deviating during the glue process, and the glue quality of the electronic detonator modules is improved. Further, the plurality of electronic detonator modules to be glued are connected to the substrate strips, which is beneficial to push the substrate during the demolding process of the electronic detonator modules with completed glue, so that the plurality of electronic detonator modules connected to the substrate fall off together, and is beneficial to reduce the deformation of the electronic detonator modules with completed glue during the demolding process, and further improves the glue quality of the electronic detonator modules.

[0013] In addition, on the basis of the above technical solutions, the present application can also be improved as follows, and can have the following additional technical features.

[0014] According to one embodiment of the present application, before the substrate provided with a plurality of electronic detonator modules to be glued is put into the receiving cavity of the glue mold in the electronic detonator module glue system, the electronic detonator module glue method further comprises: a plurality of through holes are arranged on the substrate at intervals, the plurality of through holes are arranged in an array along the length direction of the substrate, and the substrate strips are formed between adjacent two through holes, and the connecting wires and electronic elements are arranged on the substrate strips to form the electronic detonator modules.

[0015] In the embodiment, the plurality of through holes are arranged on the substrate, and the substrate strip for arranging the connecting wires and the electronic components to form the electronic detonator module is formed on the substrate. The electronic detonator module is arranged on the substrate strip to form the electronic detonator module. The plurality of electronic detonator modules are obtained on the substrate. The substrate strip integrally connected with the substrate supports and fixes the plurality of electronic detonator modules. The reliability of the connection and fixation of the plurality of electronic detonator modules is improved. The electronic detonator module is prevented from being deviated during the encapsulation process. The encapsulation quality of the electronic detonator module is improved.

[0016] According to one embodiment of the present application, the electronic detonator module encapsulation method further comprises: a pre-breaking line is arranged at each end of the substrate strip in the length direction, the pre-breaking line is used to break the substrate strip along the pre-breaking line to obtain a plurality of encapsulated electronic detonator modules. In the embodiment, the pre-breaking line is arranged at each end of the substrate strip in the length direction. After the electronic detonator module is encapsulated, the substrate is taken out, and the substrate strip is broken along the pre-breaking line. The single encapsulated electronic detonator module is obtained.

[0017] According to another aspect of the present application, an electronic detonator module encapsulation system is provided for implementing the above-mentioned electronic detonator module encapsulation method. The electronic detonator module encapsulation system comprises:

[0018] a base;

[0019] The encapsulation mold comprises a first mold and a second mold. One of the first mold and the second mold is mounted on the base. The first mold is provided with a space constraint structure one. The second mold is provided with a space constraint structure two opposite to the space constraint structure one on the side for closing the first mold. The first mold or / and the second mold is provided with a runner structure on the side for closing. When the first mold and the second mold are closed, the space constraint structure one and the space constraint structure two define the receiving cavity capable of receiving the substrate. The space constraint structure one and the space constraint structure two further define a plurality of glue injection cavities to be injected with the hot glue. The plurality of glue injection cavities are respectively communicated with the receiving cavity. The runner structure forms a runner communicated with the glue injection cavity. After the substrate is placed in the receiving cavity, the electronic detonator module to be encapsulated is arranged in the glue injection cavity. The hot glue is injected into the glue injection cavity through the runner. The hot glue is filled in the glue injection cavity and wraps the electronic detonator module to be encapsulated.

[0020] a driving device mounted on the base, another of the first module and the second module is mounted on the driving device and can move under the driving of the driving device and perform mold closing and mold opening of the first module and the second module;

[0021] a guide mechanism mounted on the base, the first module or / and the second module is in sliding connection with the guide mechanism and can move under the guidance of the guide mechanism;

[0022] a pushing mechanism mounted on the base or the driving device, the pushing mechanism is used to push out the electronic detonator module group with the encapsulation of the hot glue in the cavity after the mold opening of the first module and the second module to realize demolding;

[0023] an injection molding machine for producing the hot glue and inputting the hot glue into the runner.

[0024] The encapsulation mold in the embodiment includes a first module and a second module. When the first module and the second module are closed, a space constraint structure one on the first module and a space constraint structure two on the second module define a receiving cavity capable of receiving a substrate, and a plurality of cavities to be injected with hot glue are defined between the space constraint structure one and the space constraint structure two. The substrate is placed in the receiving cavity, and the parts to be encapsulated of the plurality of electronic detonator module groups are located in the cavities to be injected with hot glue, which facilitates the injection of hot glue into the cavities to be injected with hot glue and encapsulation of the parts to be encapsulated of the plurality of electronic detonator module groups. Further, the plurality of electronic detonator module groups are fixed by fixing the substrate, thereby improving the reliability of the fixation of the plurality of electronic detonator module groups, avoiding the deviation of the electronic detonator module groups during encapsulation, and improving the encapsulation quality of the electronic detonator module groups.

[0025] According to an embodiment of the present application, the space constraint structure one includes:

[0026] a receiving groove, the profile of the receiving groove is matched with the profile of the substrate, and the substrate can be received in the receiving groove;

[0027] an encapsulation plasticizing groove one, which is in communication with the receiving groove and is used for plasticizing the parts to be encapsulated of the electronic detonator module groups;

[0028] When the first module and the second module are closed, the receiving groove forms the receiving cavity, and the encapsulation plasticizing groove one forms part of the cavity to be injected with hot glue;

[0029] The space constraint structure two includes:

[0030] The second sealing and shaping groove is set opposite to the first sealing and shaping groove and is used to shape the part of the electronic detonator module to be sealed.

[0031] After the first module and the second module are molded together, the second sealing groove forms another part of the cavity to be injected with glue, and the first sealing groove and the second sealing groove define the cavity to be injected with glue.

[0032] In this embodiment, the first spatial constraint structure includes a receiving groove and a first sealing and molding groove. The contour of the receiving groove matches the contour of the substrate, which facilitates the substrate being housed within the receiving groove after it is placed in it, and allows the substrate to be positioned in the circumferential direction through the receiving groove. Furthermore, when the first module and the second module are molded together, the first sealing and molding groove forms part of the cavity to be injected with glue. In addition, the second spatial constraint structure in this embodiment includes a second sealing and molding groove, which is positioned opposite the first sealing and molding groove, and the first sealing and molding groove forms the cavity to be injected with glue. In another part of the body, when the first module and the second module are molded together, the first and second sealing molding grooves define the cavity to be injected with glue, which is beneficial for molding the part of the electronic detonator module to be sealed, so that the sealed body obtained by sealing has the same contour as the cavity to be injected with glue; furthermore, in this embodiment, the cavity to be injected with glue is defined by the first sealing molding groove located on the first module and the second sealing molding groove located on the second module, which is beneficial for demolding the electronic detonator module after sealing by driving the first module and the second module to open the mold.

[0033] According to one embodiment of the present invention, the storage groove includes:

[0034] The peripheral storage section is used to store the peripheral portion of the substrate;

[0035] The substrate strip receiving portion is arranged in an array of multiple portions, which are respectively connected to the sealing molding groove and the peripheral receiving portion. The substrate strip receiving portion is used to receive the substrate strip, and the substrate strip receiving portion forms a limiting block on both sides along the array direction of the substrate strip receiving portion. After the substrate is placed in the receiving groove, the peripheral portion of the substrate is received in the peripheral receiving portion, and the substrate strips are respectively received in the substrate strip receiving portion. The limiting blocks respectively extend into the through-hole.

[0036] The receiving groove in the embodiment comprises a peripheral receiving part and a substrate strip receiving part, the peripheral receiving part is used to receive the peripheral part of the substrate, the substrate strip receiving part is used to receive the substrate strip, the substrate is placed in the receiving groove and is limited in the circumferential direction, and the substrate is fixed in the circumferential direction; further, the substrate strip receiving part is provided with a limiting block on each side along the array direction of the substrate strip receiving part, the substrate strip is received in the substrate strip receiving part, the limiting block extends into the through opening, the substrate is further limited in the circumferential direction, the substrate is fixed in the circumferential direction, and the limiting block prevents the hot glue from flowing into the through opening during the process of sealing the electronic detonator module.

[0037] According to one embodiment of the application, the width of the sealing and plasticizing groove one is greater than the width of the substrate strip receiving part, the outer side wall of the substrate strip is in contact with the inner side wall of the substrate strip receiving part after the substrate is placed in the receiving groove, and the substrate strip fills the substrate strip receiving part and blocks the hot glue entering the sealing and plasticizing groove one in the length direction of the substrate strip.

[0038] The width of the sealing and plasticizing groove one in the embodiment is greater than the width of the substrate strip receiving part, the outer side wall of the substrate strip is in contact with the inner side wall of the substrate strip receiving part after the substrate is placed in the receiving groove, the thickness of the hot glue flowing into the sealing and plasticizing groove one and wrapping the part to be sealed of the electronic detonator module is increased, and the sealing glue with suitable thickness is obtained; further, the substrate strip fills the substrate strip receiving part and blocks the hot glue entering the sealing and plasticizing groove one in the length direction of the substrate strip, and the hot glue flowing out of the sealing and plasticizing groove one in the length direction of the substrate strip is prevented.

[0039] According to one embodiment of the application, the electronic element comprises an energy storage capacitor, the substrate strip is provided with a capacitor mounting groove for mounting the energy storage capacitor, and the energy storage capacitor is mounted in the capacitor mounting groove.

[0040] The sealing mold further comprises:

[0041] The capacitor positioning protrusion is connected to the inner wall of the sealing and plasticizing groove one and / or the sealing and plasticizing groove two and vertically protrudes along the opening direction of the first mold and the second mold, the capacitor positioning protrusion can be in contact with the energy storage capacitor and position the energy storage capacitor after the first mold and the second mold are closed.

[0042] The electronic detonator module encapsulation plastic molding die structure in the embodiment comprises a capacitor positioning protrusion, before encapsulating the electronic detonator module, the capacitor positioning protrusion is used for stopping and abutting the energy storage capacitor, the energy storage capacitor is limited in the capacitor mounting groove and positioning is realized, the position of the energy storage capacitor is fixed, the energy storage capacitor is prevented from deviating during the encapsulation of the electronic detonator module, and the stability of the energy storage capacitor function is ensured.

[0043] According to one embodiment of the present application, the electronic component comprises an ignition device and a connecting pin, the ignition device is connected to one end of the length direction of the substrate strip, and the connecting pin is connected to the other end of the length direction of the substrate strip.

[0044] The first module or the second module is provided with a receiving groove one for receiving the ignition device, and the first module or the second module is further provided with a receiving groove two for receiving the connecting pin.

[0045] After the first module and the second module are combined, the ignition device is inserted into and received in the receiving groove one, and the connecting pin is inserted into and received in the receiving groove two.

[0046] In the embodiment, the receiving groove one and the receiving groove two are arranged on the first module or the second module, so that after the first module and the second module are combined, the ignition device is inserted into and received in the receiving groove one, and the connecting pin is inserted into and received in the receiving groove two, the ignition device and the connecting pin are protected, the ignition device and the connecting pin do not affect the encapsulation process of the part to be encapsulated of the electronic detonator module, the ignition device and the connecting pin do not interfere with the combination of the first module and the second module, and the first module and the second module are tightly combined.

[0047] According to one embodiment of the present application, the first module comprises:

[0048] A first body, the receiving groove is arranged on the first body, and a plurality of groove structures one are arranged on the first body in intervals, each of the groove structures one constitutes part of the encapsulation plastic molding groove one;

[0049] A limiting sliding block one, the first body is provided with a sliding guide through slot one, the sliding guide through slot one is communicated with the groove structure one, one end of the limiting sliding block one close to the groove structure one is provided with a groove structure two for constituting another part of the encapsulation plastic molding groove one, and the limiting sliding block one is slidingly installed in the sliding guide through slot one.

[0050] The first limiting sliding block has a first alignment matching position and a first protruding position relative to the groove structure one, when the first limiting sliding block is located at the first alignment matching position, the profile of the groove structure two is aligned and matched with the profile of the groove structure one and defines the glue sealing plastic groove one, when the first limiting sliding block is located at the first protruding position, the groove structure two protrudes from the groove structure one.

[0051] The first body is provided with a plurality of groove structures one, and the first body is further provided with a sliding guide through slot one, the first limiting sliding block is slidingly installed in the sliding guide through slot one, and one end of the first limiting sliding block is provided with a groove structure two, when the first limiting sliding block is located at the first alignment matching position, the profile of the groove structure two is aligned and matched with the profile of the groove structure one and defines the glue sealing plastic groove one, so that the to-be-sealed part of the electronic detonator module is conveniently plastic molded, the glue sealing plastic groove one is divided into two parts of the groove structure one and the groove structure two, when the first limiting sliding block is located at the first protruding position, the groove structure two protrudes from the groove structure one, the first limiting sliding block pushes the plurality of electronic detonator modules with completed sealing, so that the electronic detonator modules with completed sealing are separated from the groove structure one, the adhesion between the electronic detonator modules with completed sealing and the glue sealing plastic groove one is reduced, and then the electronic detonator modules with completed sealing are conveniently demolded, and the deformation of the electronic detonator modules with completed sealing in the demolding process is reduced.

[0052] According to one embodiment of the application, the second module comprises:

[0053] The second body is provided with a plurality of groove structures three which are spaced apart and each constitute a part of the glue sealing plastic groove two;

[0054] The second body is provided with a sliding guide through slot two which is in communication with the groove structure three, one end of the second limiting sliding block close to the groove structure three is provided with a groove structure four which is used for constituting another part of the glue sealing plastic groove two, the second limiting sliding block is slidingly installed in the sliding guide through slot two, the second limiting sliding block has a second alignment matching position and a second protruding position relative to the groove structure two, when the second limiting sliding block is located at the second alignment matching position, the profile of the groove structure four is aligned and matched with the profile of the groove structure three and defines the glue sealing plastic groove two, when the second limiting sliding block is located at the second protruding position, the groove structure four protrudes from the groove structure three.

[0055] The second body in the embodiment is provided with a plurality of groove structures three, and the second body is further provided with a sliding guide through slot two. A limiting sliding block two is slidingly installed in the sliding guide through slot two, and one end of the limiting sliding block two is provided with a groove structure four. When the limiting sliding block two is located at a second alignment matching position, the profile of the groove structure four is aligned and matched with the profile of the groove structure three and is limited to form a glue sealing plastic groove two, so as to facilitate plastic molding of the to-be-glued part of the electronic detonator module. The glue sealing plastic groove two is divided into two parts, namely the groove structure three and the groove structure four. When the limiting sliding block two is located at a second protruding position, the groove structure four protrudes from the groove structure three. The limiting sliding block two pushes the plurality of electronic detonator modules completed with glue sealing, so as to facilitate separation of the electronic detonator modules completed with glue sealing from the groove structure three. This is beneficial to reducing the bonding force between the electronic detonator modules completed with glue sealing and the glue sealing plastic groove two, and further facilitates demolding of the electronic detonator modules completed with glue sealing and reduces deformation of the electronic detonator modules completed with glue sealing in the demolding process.

[0056] According to one embodiment of the present application, the first module or / and the second module is further provided with a plurality of pusher guide through holes. The plurality of pusher guide through holes can be in communication with the receiving cavity. The plurality of pusher guide through holes are respectively used to install movable pushers capable of pushing the plurality of electronic detonator modules completed with glue sealing to achieve demolding.

[0057] In the embodiment, the first module or / and the second module is further provided with a plurality of pusher guide through holes. This facilitates reliable demolding of the electronic detonator modules completed with glue sealing by the plurality of movable pushers, and further reduces deformation of the electronic detonator modules completed with glue sealing in the demolding process. BRIEF DESCRIPTION OF DRAWINGS

[0058] In order to more clearly illustrate the technical solutions in the present application, the following will briefly introduce the drawings needed in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative effort.

[0059] Figure 1 The flowchart of the electronic detonator module glue sealing method of the embodiment of the present application;

[0060] Figure 2 The structural schematic diagram of the electronic detonator module glue sealing plastic mold structure of the embodiment of the present application;

[0061] Figure 3 The structural schematic diagram of the first module of the embodiment of the present application;

[0062] Figure 4 The enlarged view of the I area in Figure 3 ​

[0063] Figure 5 Figure 1 is a structural schematic diagram of a first module of the present application; Figure 3 Figure 2 is a structural schematic diagram of a disassembly of a limiting sliding block one and the first module in Figure 1;

[0064] Figure 6 Figure 3 is a structural schematic diagram of a second module of the present application after being erected;

[0065] Figure 7 Figure 4 is an enlarged view of a II area in Figure 3; Figure 6

[0066] Figure 8 Figure 5 is a structural schematic diagram of a disassembly of a limiting sliding block two and the second module in Figure 4; Figure 6

[0067] Figure 6 is a structural schematic diagram of connecting wires and electronic components being installed on a substrate strip to form a plurality of electronic detonator modules of the present application; Figure 9

[0068] Figure 7 is a structural schematic diagram of a plurality of electronic detonator modules in Figure 6 being completed by encapsulation. Figure 10 DETAILED DESCRIPTION Figure 9 In order to make the purpose, technical scheme and advantages of the present application more clear, the following will make further detailed description to the embodiments of the present application in combination with the drawings.

[0069] In order to make the purpose, technical scheme and advantages of the present application more clear, the following will make further detailed description to the embodiments of the present application in combination with the drawings.

[0070] In order to make the purpose, technical scheme and advantages of the present application more clear, the following will make further detailed description to the embodiments of the present application in combination with the drawings.

[0071] In the following description, a lot of specific details are set forth in order to provide a thorough understanding of the present application, however, the present application can also be implemented in other ways different from the description, therefore, the protection scope of the present application is not limited by the specific embodiments disclosed below.

[0072] In one aspect of the present application, a kind of electronic detonator module encapsulation method is provided, as shown in Figure 1, comprising: Figure 1

[0073] Step S102, the substrate 3 provided with a plurality of electronic detonator modules to be encapsulated is placed in the receiving cavity of the encapsulation mold in the electronic detonator module encapsulation system, wherein the substrate 3 is provided with a plurality of substrate strips 33, and the connecting wires and electronic components are arranged on the plurality of substrate strips 33 to form electronic detonator modules;

[0074] ​​​Step S104, the glue sealing mold is closed, and the plurality of electronic detonator modules to be sealed are limited in the glue injection cavities formed after the glue sealing mold is closed.

[0075] Step S106, hot glue is injected into the plurality of glue injection cavities, and the hot glue fills the plurality of glue injection cavities and wraps the electronic detonator modules to be sealed.

[0076] Step S108, the plurality of electronic detonator modules after sealing are demolded.

[0077] In the embodiment, as shown in Figure 1 and Figure 9 , the electronic detonator module sealing method of the embodiment is that the substrate 3 provided with the plurality of electronic detonator modules to be sealed is placed in the receiving cavity of the glue sealing mold in the electronic detonator module sealing system, the plurality of electronic detonator modules to be sealed are connected on the substrate strip 33, the substrate strip 33 is part of the substrate 3, the plurality of electronic detonator modules are fixed by fixing the substrate 3, thereby improving the reliability of fixing the plurality of electronic detonator modules, avoiding the electronic detonator modules from being offset during the sealing process, and further improving the sealing quality of the electronic detonator modules; further, the plurality of electronic detonator modules to be sealed are located in the glue injection cavities, which facilitates the placement of the substrate 3 in the receiving cavity, and further facilitates the injection of hot glue into the glue injection cavities and the sealing of the plurality of electronic detonator modules to be sealed; further, the plurality of electronic detonator modules to be sealed are connected on the substrate strip 33, which facilitates the pushing of the substrate 3 during the demolding of the electronic detonator modules after sealing, so that the plurality of electronic detonator modules connected on the substrate 3 are demolded together, and the deformation of the electronic detonator modules after sealing during the demolding process is reduced, and the sealing quality of the electronic detonator modules is further improved.

[0078] An embodiment of the present application is shown in Figure 9 , before the substrate 3 provided with the plurality of electronic detonator modules to be sealed is placed in the receiving cavity of the glue sealing mold in the electronic detonator module sealing system, the electronic detonator module sealing method further comprises: a plurality of through holes 32 are arranged on the substrate 3 at intervals, the plurality of through holes 32 are arranged in an array along the length direction of the substrate 3, and the substrate strip 33 is formed between adjacent two through holes 32, and the connecting wires and the electronic elements are arranged on the substrate strip 33 to form the electronic detonator module.

[0079] In the embodiment, as shown in Figure 9As shown, a plurality of through holes 32 are formed on the substrate 3 in a spaced manner, and a substrate strip 33 for arranging the electronic detonator module formed by the connecting wires and electronic components is formed on the substrate 3, so that the electronic detonator module formed by the connecting wires and electronic components can be arranged on the substrate strip 33, thereby facilitating the manufacture of a plurality of electronic detonator modules on the substrate 3, and the substrate strip 33 connected with the substrate 3 can support and fix the plurality of electronic detonator modules, thereby improving the reliability of the connection and fixation of the plurality of electronic detonator modules, avoiding the deviation of the electronic detonator module during the encapsulation process, and improving the encapsulation quality of the electronic detonator module. In addition, the through holes 32 in the embodiment are formed by laser cutting, and the through holes 32 can also be formed by other processing methods.

[0080] In one embodiment of the present application, the electronic detonator module encapsulation method further comprises:

[0081] Pre-break lines are arranged at both ends of the substrate strip 33 in the length direction, and the pre-break lines are used to break the substrate strip 33 along the pre-break lines to obtain a plurality of encapsulated electronic detonator modules.

[0082] In the embodiment, by arranging the pre-break lines at both ends of the substrate strip 33 in the length direction, the substrate 3 can be taken out after the encapsulation of the electronic detonator module is completed, and the substrate strip 33 can be broken along the pre-break lines to obtain a single encapsulated electronic detonator module.

[0083] It should be noted that the specific operation of demolding the plurality of encapsulated electronic detonator modules in the embodiment can refer to the injection molding method in the art, and other operation steps of the electronic detonator module encapsulation method during the encapsulation process can also refer to the existing technology in the art.

[0084] In another aspect of the present application, an electronic detonator module encapsulation system is provided for implementing the above-mentioned electronic detonator module encapsulation method, as shown in Figures 2 to 10 The electronic detonator module encapsulation system comprises:

[0085] a base;

[0086] The encapsulation mold comprises a first mold 1 and a second mold 2, one of the first mold 1 and the second mold 2 is installed on the base, the first mold 1 is provided with a space constraint structure one, the second mold 2 is provided with a space constraint structure two opposite to the space constraint structure one on the side for closing the first mold 1, and the first mold 1 and the second mold 2 are provided with a runner structure on the side for closing; when the first mold 1 and the second mold 2 are closed, the space constraint structure one and the space constraint structure two define a receiving cavity capable of receiving the substrate 3, and a plurality of glue injection cavities capable of injecting hot glue are defined between the space constraint structure one and the space constraint structure two, the plurality of glue injection cavities are respectively communicated with the receiving cavity, the runner structure forms a runner communicated with the glue injection cavity, and after the substrate 3 is placed in the receiving cavity, the electronic detonator module to be encapsulated is located in the glue injection cavity; hot glue is injected into the glue injection cavity through the runner, and the hot glue fills the glue injection cavity and wraps the electronic detonator module to be encapsulated;

[0087] The driving device is installed on the base, and the other one of the first mold 1 and the second mold 2 is installed on the driving device and can move under the driving of the driving device and close and open the first mold 1 and the second mold 2;

[0088] The guide mechanism is installed on the base, and the first mold 1 and the second mold 2 are slidably connected with the guide mechanism and can move under the guidance of the guide mechanism;

[0089] The pushing mechanism is installed on the driving device, and the pushing mechanism is used to push out the plurality of electronic detonator modules encapsulated in the glue injection cavity after the first mold 1 and the second mold 2 are opened to realize demolding;

[0090] The injection molding machine is used to produce hot glue and input hot glue into the runner.

[0091] In the embodiment, as shown in Figures 2 to 10 The encapsulation mold comprises a first mold 1 and a second mold 2, one of the first mold 1 and the second mold 2 is installed on the base, the first mold 1 is provided with a space constraint structure one, the second mold 2 is provided with a space constraint structure two opposite to the space constraint structure one on the side for closing the first mold 1, and the first mold 1 and the second mold 2 are provided with a runner structure on the side for closing; when the first mold 1 and the second mold 2 are closed, the space constraint structure one and the space constraint structure two define a receiving cavity capable of receiving the substrate 3, and a plurality of glue injection cavities capable of injecting hot glue are defined between the space constraint structure one and the space constraint structure two, the plurality of glue injection cavities are respectively communicated with the receiving cavity, the runner structure forms a runner communicated with the glue injection cavity, and after the substrate 3 is placed in the receiving cavity, the electronic detonator module to be encapsulated is located in the glue injection cavity; hot glue is injected into the glue injection cavity through the runner, and the hot glue fills the glue injection cavity and wraps the electronic detonator module to be encapsulated;

[0092] In the embodiment, the first module 1 and the second module 2 are provided with the runner structure on one side of the combined mold; further, the runner structure can be provided on the first module 1 or the second module 2 only, which is convenient for injecting the hot glue into the cavity to be injected.

[0093] In the embodiment, as shown in Figure 9 , the substrate 3 in the embodiment is in a rectangular plate structure, and the receiving cavity in the embodiment is in a rectangular structure. Further, the electronic detonator module encapsulation and plastic molding mold structure in the embodiment can simultaneously encapsulate two groups of electronic detonator modules, and the two substrates 3 are connected to form two groups of electronic detonator modules to be encapsulated.

[0094] Further, as shown in Figure 9 , the substrate 3 in the embodiment includes a support plate one 30, a support plate two 31, and a substrate strip 33. The support plate one 30 is in a U-shaped structure, the support plate two 31 is in a straight plate structure, and the substrate strip 33 is connected between the support plate one 30 and the support plate two 31. Further, a pre-breaking line segment 311 is provided between the support plate one 30 and the support plate two 31, and the two ends of the substrate strip 33 connected with the support plate one 30 and the support plate two 31 are also respectively provided with pre-breaking lines. After the electronic detonator module is encapsulated, the substrate 3 is taken out, the support plate one 30 and the support plate two 31 are broken along the pre-breaking line segment 311, and then the support plate one 30 and the support plate two 31 are broken along the pre-breaking lines at the two ends of the substrate strip 33, thereby obtaining a single electronic detonator module. Further, in the embodiment, in order to facilitate the fixation of the substrate 3 during the installation of the electronic element on the substrate strip 33, two fixing through holes 301 are respectively provided on the left and right ends of the support plate one 30. During the installation of the electronic element on the substrate strip 33, the substrate 3 is fixed by the fixing member passing through the fixing through holes 301.

[0095] Further, as shown in Figure 10 , the hot glue is filled in the cavity to be injected and wraps the encapsulation part of the electronic detonator module, and the encapsulation part of the electronic detonator module forms an encapsulation body 7, and the encapsulation body 7 wraps the outside of the substrate strip 33 and the electronic element.

[0096] In the embodiment, as shown in Figures 3 to 5As shown, the first module 1 in the embodiment is approximately cuboid structure, four vertical guide holes one 10 are arranged on the first module 1, and the four vertical guide holes one 10 are arranged near the four corners of the first module 1 respectively; the vertical guide holes one 10 are used for mounting vertical guide rods respectively; further, the second module 2 in the embodiment is also approximately cuboid structure, four vertical guide holes three 20 are arranged on the second module 2 respectively opposite to the four vertical guide holes one 10, the vertical guide rods vertically pass through the vertical guide holes one 10 and the vertical guide holes three 20, the vertical guide rods limit the vertical movement of the first module 1 and the second module 2, and avoid the circumferential deviation of the first module 1 and the second module 2; in addition, the vertical guide rods are not shown in the embodiment.

[0097] Further, as shown in the drawings, Figures 3 to 5 In order to better improve the stability of the vertical movement of the first module 1, a plurality of vertical guide holes two 17 are arranged on the left and right ends of the first module 1 in the embodiment, the vertical guide holes two 17 are used for sliding cooperation with the vertically arranged guide rods, the vertical movement of the first module 1 is guided, and the reliable mold closing and mold opening of the first module 1 are facilitated.

[0098] In the embodiment, as shown in the drawings, Figure 2 In order to facilitate the horizontal fixation of the first module 1 and the second module 2, a horizontal mounting hole one 16 is arranged on the first module 1, the horizontal mounting hole one 16 is horizontally arranged along the length direction of the first module 1, and the horizontal mounting hole one 16 passes through the left and right ends of the first module 1; two horizontal mounting hole ones 16 are arranged in the embodiment, and two supporting rods pass through the horizontal mounting hole one 16 respectively, so that the first module 1 is horizontally connected by the two supporting rods. In addition, a horizontal mounting hole two 26 is arranged on the second module 2, the horizontal mounting hole two 26 is horizontally arranged along the length direction of the second module 2, and the horizontal mounting hole two 26 passes through the left and right ends of the second module 2; two horizontal mounting hole two 26 are arranged in the embodiment, and two supporting rods pass through the horizontal mounting hole two 26 respectively, so that the second module 2 is horizontally connected by the two supporting rods.

[0099] It should be noted that the first module 1 and the second module 2 in the embodiment can also be arranged in other structures, the receiving cavity in the embodiment can be adaptively adjusted and designed according to the structure and size of the substrate 3 to be placed, and the structure and size of the glue injection cavity in the embodiment can also be adaptively designed according to the structure and size of the glue sealing body 7 formed by the glue sealing part of the electronic detonator module.

[0100] In the embodiment, as shown in the drawings, Figures 3 to 5As shown, the front middle part of the first module 1 in the embodiment is provided with an avoiding groove one 100 for avoiding the installation of the pouring head, the front side of the first module 1 opposite to the position of the avoiding groove one 100 is provided with a gate groove one 101, the upper side of the first module 1 opposite to the position of the avoiding groove one 100 is provided with a runner groove one 102 which is communicated with the gate groove one 101, the first module 1 is also provided with two transverse distribution grooves one 103 along the length extension direction of the receiving groove 11, the transverse distribution grooves one 103 are communicated with the runner groove one 102, the first module 1 is also provided with a plurality of longitudinal distribution grooves one 104 which are spaced apart along the length extension direction of the receiving groove 11, the longitudinal distribution grooves one 104 are respectively communicated with the transverse distribution grooves one 103, the longitudinal distribution grooves one 104 and the sealing glue molding groove one 12 are not communicated through a flow port 105, the sealing glue molding groove one 12 is communicated with the longitudinal distribution grooves one 104 through the flow port 105.

[0101] In the embodiment, as shown, Figures 6 to 8 the front middle part of the second module 2 is provided with an avoiding groove two 200 for avoiding the installation of the pouring head, the second module 2 is provided with a gate groove two 201 opposite to the gate groove one 101, the lower side of the second module 2 opposite to the position of the avoiding groove two 200 is provided with a runner groove two 202 which is communicated with the gate groove two 201, the runner groove two 202 is opposite to the runner groove one 102, the second module 2 is also provided with two transverse distribution grooves two 203 opposite to the two transverse distribution grooves one 103, the transverse distribution grooves two 203 are communicated with the runner groove two 202, the second module 2 is also provided with a plurality of longitudinal distribution grooves two 204 which are spaced apart opposite to the plurality of longitudinal distribution grooves one 104 respectively, the longitudinal distribution grooves two 204 are respectively communicated with the transverse distribution grooves two 203.

[0102] Further, when the second module 2 is combined with the first module 1, the gate groove one 101 and the gate groove two 201 define a gate, the runner groove one 102 and the runner groove two 202 define a main runner, the transverse distribution grooves one 103 and the transverse distribution grooves two 203 define transverse distribution runners, and the longitudinal distribution grooves one 104 and the longitudinal distribution grooves two 204 define longitudinal distribution runners; thus, the gate, the main runner, the transverse distribution runners, the longitudinal distribution runners and the flow port 105 in the embodiment constitute a runner structure. In addition, the runner structure in the embodiment can also be provided in other ways, which is convenient for injecting hot glue into the cavity to be injected with glue to seal the part to be sealed of the electronic detonator module.

[0103] Further, as shown, Figure 2As shown, in order to facilitate the installation of the pouring head in the embodiment, two pouring head clamping grooves 19 are arranged on the front side of the first module 1, and the two pouring head clamping grooves 19 are respectively located on the left and right sides of the first avoiding groove 100. The pouring head clamping groove 19 in the embodiment has a cuboid structure. In the process of fixing the pouring head, the clamping part of the pouring head is clamped into the pouring head clamping groove 19, so as to fix the pouring head, and facilitate the reliable fixation of the pouring head in the process of injecting the hot glue into the glue injection cavity through the pouring head.

[0104] It should be noted that the "plastic" in the embodiment refers to limiting the flow and forming shape of the hot glue, so that the hot glue forms an external structure matching the profile of the glue injection cavity after cooling.

[0105] Further, the guide mechanism in the embodiment is installed on the base, and the first module 1 and the second module 2 are slidably connected with the guide mechanism and can move under the guidance of the guide mechanism. In addition, only one of the first module 1 and the second module 2 can be slidably connected with the guide mechanism, and the other one of the first module 1 and the second module 2 can be fixed. Further, the pushing mechanism in the embodiment is installed on the driving device, and the pushing mechanism can also be installed on the base, so as to facilitate the ejection of the electronic detonator module group in the glue injection cavity after the glue injection is completed.

[0106] Further, the injection molding machine in the embodiment adopts low-pressure injection when injecting hot glue into the runner, so as to adapt the pressure of the glue injection cavity, avoid the hot glue from causing a large impact on the electronic elements on the electronic detonator module group during the glue injection of the electronic detonator module group, and cause the electronic elements on the electronic detonator module group to loosen or displace.

[0107] In the embodiment, the guide mechanism includes a plurality of vertical guide rods, and the vertical guide rods vertically pass through the vertical guide hole one 10 and the vertical guide hole three 20, and the vertical guide rods limit the movement of the first module 1 and the second module 2 in the vertical direction.

[0108] It should be noted that the driving device, the guide mechanism, the pushing mechanism and the injection molding machine are not shown in the embodiment, and the specific connection and driving mode of the first module 1 and the second module 2 in the embodiment can refer to the injection mold in the prior art. The glue injection operation of the electronic detonator module group in the embodiment can also refer to the injection technology in the art, and will not be described here. Further, the above-mentioned electronic detonator module glue injection method can also be implemented by other glue injection systems.

[0109] An embodiment of the present application is shown in Figure 3 and Figure 6 As shown, the space constraint structure one includes:

[0110] The receiving groove 11 is matched with the profile of the substrate 3, and the substrate 3 can be received in the receiving groove 11;

[0111] The glue sealing and plasticizing groove one 12 is communicated with the receiving groove 11, and is used for plasticizing the part to be sealed and glued of the electronic detonator module;

[0112] When the first module 1 and the second module 2 are combined, the receiving groove 11 forms a receiving cavity, and the glue sealing and plasticizing groove one 12 forms part of the glue injection cavity;

[0113] The space constraint structure two includes:

[0114] The glue sealing and plasticizing groove two 21 is arranged opposite to the glue sealing and plasticizing groove one 12, and is used for plasticizing the part to be sealed and glued of the electronic detonator module;

[0115] After the first module 1 and the second module 2 are combined, the glue sealing and plasticizing groove two 21 forms another part of the glue injection cavity, and the glue sealing and plasticizing groove one 12 and the glue sealing and plasticizing groove two 21 define the glue injection cavity.

[0116] In the embodiment, as shown in Figure 3 and Figure 6 The space constraint structure one includes the receiving groove 11 and the glue sealing and plasticizing groove one 12, the profile of the receiving groove 11 is matched with the profile of the substrate 3, which is beneficial to receiving the substrate 3 in the receiving groove 11 after the substrate 3 is put into the receiving groove 11, and positioning the substrate 3 in the circumferential direction by the receiving groove 11; further, when the first module 1 and the second module 2 are combined, the glue sealing and plasticizing groove one 12 forms part of the glue injection cavity; in addition, the space constraint structure two in the embodiment includes the glue sealing and plasticizing groove two 21, which is arranged opposite to the glue sealing and plasticizing groove one 12, the glue sealing and plasticizing groove one 12 forms another part of the glue injection cavity, and when the first module 1 and the second module 2 are combined, the glue sealing and plasticizing groove one 12 and the glue sealing and plasticizing groove two 21 define the glue injection cavity, which is beneficial to plasticizing the part to be sealed and glued of the electronic detonator module, and further makes the glue body 7 obtained by sealing and gluing have the same profile as the glue injection cavity; further, the glue injection cavity in the embodiment is defined by the glue sealing and plasticizing groove one 12 on the first module 1 and the glue sealing and plasticizing groove two 21 on the second module 2, which is beneficial to driving the first module 1 and the second module 2 to open, and further facilitates demolding of the electronic detonator module after sealing and gluing is completed.

[0117] In the embodiment, as shown in Figure 3As shown, the substrate 3 in the embodiment is in a rectangular plate structure, and the receiving groove 11 is in a rectangular structure, which can be adaptively designed according to the structure and size of the substrate 3 to be placed. Further, the glue sealing plastic groove one 12 in the embodiment is in a semi-cylindrical cavity structure, and the structure of the glue sealing plastic groove one 12 can also be adaptively designed according to the structure and size of the glue body 7 formed by the glue sealing of the to-be-glued part of the electronic detonator module.

[0118] Further, as shown, Figures 6 to 8 the glue sealing plastic groove two 21 in the embodiment is in a semi-cylindrical cavity structure, and the structure of the glue sealing plastic groove two 21 can also be adaptively designed according to the structure and size of the glue body 7 formed by the glue sealing of the to-be-glued part of the electronic detonator module.

[0119] An embodiment of the present application, as shown in Figure 3 the receiving groove 11 comprises:

[0120] a peripheral receiving part for receiving the peripheral part of the substrate 3;

[0121] a substrate strip receiving part, which is arranged in an array and is in communication with the glue sealing plastic groove one 12 and the peripheral receiving part, respectively, and is used for receiving the substrate strip 33, and the substrate strip receiving part is formed with a limiting block 13 on both sides along the array direction of the substrate strip receiving part, respectively, after the substrate 3 is placed in the receiving groove 11, the peripheral part of the substrate 3 is received in the peripheral receiving part, the substrate strip 33 is received in the substrate strip receiving part, respectively, and the limiting block 13 extends into the through hole 32, respectively.

[0122] In the embodiment, as shown in Figure 3 the receiving groove 11 comprises a peripheral receiving part and a substrate strip receiving part, which is convenient for receiving the peripheral part of the substrate 3 through the peripheral receiving part, receiving the substrate strip 33 through the substrate strip receiving part, and is convenient for placing the substrate 3 in the receiving groove 11 and limiting the substrate 3 in the circumferential direction, and is convenient for fixing the substrate 3 in the circumferential direction; further, the substrate strip receiving part is formed with a limiting block 13 on both sides along the array direction of the substrate strip receiving part, respectively, the substrate strip 33 is received in the substrate strip receiving part, respectively, and the limiting block 13 extends into the through hole 32, respectively, which further improves the limitation of the substrate 3 in the circumferential direction, is beneficial to fixing the substrate 3 in the circumferential direction, and the limiting block 13 also avoids the inflow of hot glue into the through hole 32 during the glue sealing of the electronic detonator module.

[0123] In the embodiment, as shown in Figure 4 and Figure 9As shown, the through hole 32 provided on the substrate 3 in the embodiment has a rectangular structure, and the limiting block 13 in the embodiment has a strip structure, the limiting block 13 is matched with the through hole 32, and the limiting block 13 can be clamped into the through hole 32.

[0124] As shown in the embodiment of the present application, Figure 4 As shown, the width of the glue sealing plastic groove one 12 is greater than the width of the substrate strip receiving part, after the substrate 3 is placed in the receiving groove 11, the outer side wall of the substrate strip 33 is in contact with the inner side wall of the substrate strip receiving part, and the substrate strip 33 fills the substrate strip receiving part and blocks the hot glue entering the glue sealing plastic groove one 12 in the length direction of the substrate strip 33.

[0125] As shown in the embodiment of the present application, Figure 4 As shown, the width of the glue sealing plastic groove one 12 is greater than the width of the substrate strip receiving part, after the substrate 3 is placed in the receiving groove 11, the outer side wall of the substrate strip 33 is in contact with the inner side wall of the substrate strip receiving part, and the substrate strip 33 fills the substrate strip receiving part and blocks the hot glue entering the glue sealing plastic groove one 12 in the length direction of the substrate strip 33.

[0126] As shown in the embodiment of the present application, Figure 6 , Figure 7 and Figure 9 As shown, the electronic element includes an energy storage capacitor 4, and the substrate strip 33 is provided with a capacitor mounting groove for mounting the energy storage capacitor 4, and the energy storage capacitor 4 is mounted in the capacitor mounting groove.

[0127] The glue sealing mold further comprises:

[0128] The capacitor positioning protrusion is connected to the inner wall of the glue sealing plastic groove two 21 and vertically protrudes in the opening direction of the first mold 1 and the second mold 2, and after the first mold 1 and the second mold 2 are closed, the capacitor positioning protrusion can be in contact with the energy storage capacitor 4 and position the energy storage capacitor 4.

[0129] As shown in the embodiment of the present application, Figure 6 , Figure 7 and Figure 9As shown, the electronic detonator module encapsulation plastic molding mold structure comprises a capacitor positioning protrusion. Before encapsulating the electronic detonator module, the capacitor positioning protrusion is used to stop the energy storage capacitor 4, limit the energy storage capacitor 4 in the capacitor mounting groove, and realize positioning. This is beneficial to fixing the position of the energy storage capacitor 4 during the encapsulation of the electronic detonator module, avoiding the displacement of the energy storage capacitor 4 during the encapsulation of the electronic detonator module, and ensuring the stability of the function of the energy storage capacitor 4.

[0130] In the embodiment, as shown in Figure 6 and Figure 7 , in order to facilitate the fixation of the energy storage capacitor 4, the capacitor positioning protrusions are provided as capacitor positioning protrusion one 213 and capacitor positioning protrusion two 242. Two capacitor positioning protrusion ones 213 are arranged on the inner side walls of groove section four 211 and groove section five 212 in encapsulation plastic molding groove two 21. Two capacitor positioning protrusion twos 242 are connected to the inner side walls of groove section six 241 of limiting sliding block two 24. In the embodiment, two capacitor positioning protrusion ones 213 and two capacitor positioning protrusion twos 242 are arranged to facilitate the fixation of the energy storage capacitor 4 installed at different positions of the substrate strip 33, and improve the flexibility of the capacitor positioning protrusion in limiting the energy storage capacitor 4.

[0131] Further, as shown in Figure 6 and Figure 7 , the capacitor positioning protrusion one 213 and the capacitor positioning protrusion two 242 in the embodiment have the same structure, and four recess grooves 70 are formed on the encapsulation body 7 of the encapsulated electronic detonator module. In addition, the capacitor positioning protrusion one 213 and the capacitor positioning protrusion two 242 in the embodiment are both circular ring protrusion structures. The capacitor positioning protrusion one 213 and the capacitor positioning protrusion two 242 can also be provided in other structures to facilitate the limitation of the energy storage capacitor 4.

[0132] Further, as shown in Figure 6 and Figure 7 , the capacitor positioning protrusion is connected to the inner wall of the encapsulation plastic molding groove two 21. The capacitor positioning protrusion can also be connected to the inner wall of the encapsulation plastic molding groove one 12. The capacitor positioning protrusion can also be connected to the inner wall of the encapsulation plastic molding groove one 12 and the encapsulation plastic molding groove two 21, respectively. In addition, the number of capacitor positioning protrusions can also be adjusted as needed.

[0133] In one embodiment of the present application, as shown in Figure 6 and Figure 7 , the electronic element comprises an ignition device 6 and a connecting pin 5. The ignition device 6 is connected to one end of the length direction of the substrate strip 33, and the connecting pin 5 is connected to the other end of the length direction of the substrate strip 33.

[0134] The second module 2 is provided with a receiving groove one 22 for receiving the ignition device 6, and is also provided with a receiving groove two 23 for receiving the connecting pin 5;

[0135] After the first module 1 and the second module 2 are combined, the ignition device 6 extends into and is received in the receiving groove one 22, and the connecting pin 5 extends into and is received in the receiving groove two 23.

[0136] In the embodiment, as shown in Figure 6 and Figure 7 , by providing the receiving groove one 22 and the receiving groove two 23 on the second module 2, after the first module 1 and the second module 2 are combined, the ignition device 6 extends into and is received in the receiving groove one 22, and the connecting pin 5 extends into and is received in the receiving groove two 23, which is conducive to protecting the ignition device 6 and the connecting pin 5, avoiding the influence of the ignition device 6 and the connecting pin 5 on the sealing process of the to-be-sealed glue part of the electronic detonator module, and also avoiding the interference of the ignition device 6 and the connecting pin 5 on the combination of the first module 1 and the second module 2, which is conducive to the close combination of the first module 1 and the second module 2.

[0137] Further, as shown in Figure 6 , Figure 7 , the receiving groove one 22 and the receiving groove two 23 in the embodiment are both provided on the second module 2, and in addition, one or both of the receiving groove one 22 and the receiving groove two 23 can be provided on the first module 1, which is conducive to the extension of the ignition device 6 into and the reception of the ignition device 6 in the receiving groove one 22, and the extension of the connecting pin 5 into and the reception of the connecting pin 5 in the receiving groove two 23.

[0138] Further, as shown in Figure 6 , Figure 7 , the ignition device 6 in the embodiment includes two connecting legs, a sealing block one and an ignition resistance wire, one end of the two connecting legs is connected to the substrate strip 33, the ignition resistance wire is connected between the two connecting legs and located at the other end of the connecting legs, and the sealing block one is wrapped around the end of the connecting legs connected to the substrate strip 33.

[0139] Further, as shown in Figure 6 , Figure 7 , the receiving groove one 22 in the embodiment has a long strip structure, and extends along the length direction of the second module 2, and the connecting legs, the sealing block one and the ignition resistance wire can be received in the receiving groove one 22; in addition, the receiving groove one 22 can also be provided with other structures, which is conducive to the reception of the ignition device 6.

[0140] Further, as shown in Figure 6 , Figure 7As shown, the connecting pin 5 in the embodiment is provided with two branches, one end of the connecting pin 5 is connected to the substrate strip 33, and the other end of the connecting pin 5 forms a connecting end, and the end of the connecting pin 5 connected to the substrate strip 33 is wrapped by the second sealing block. Further, the second receiving groove body 23 in the embodiment is provided with a plurality of corresponding connecting pins 5, the second receiving groove body 23 is a cuboid cavity structure, and the second sealing block and the connecting pin 5 can be accommodated in the second receiving groove body 23. In addition, the second receiving groove body 23 can also be provided with other structures, which is convenient for accommodating the connecting pin 5.

[0141] An embodiment of the present application is as follows, Figure 5 As shown, the first module 1 comprises:

[0142] The first body, the receiving groove 11 is arranged on the first body, and a plurality of groove structures one respectively constituting part of the sealing plastic groove one 12 are arranged on the first body at intervals;

[0143] The first limiting sliding block 14, the first body is provided with a sliding guide through slot one 15, the sliding guide through slot one 15 is communicated with the groove structure one, and the first limiting sliding block 14 is provided with a groove structure two for constituting another part of the sealing plastic groove one 12 on one end of the groove structure one corresponding to the groove structure one, and the first limiting sliding block 14 is slidingly installed in the sliding guide through slot one 15;

[0144] The first limiting sliding block 14 has a first alignment matching position and a first protruding position relative to the groove structure one, when the first limiting sliding block 14 is located at the first alignment matching position, the profile of the groove structure two is aligned and matched with the profile of the groove structure one and is limited to form the sealing plastic groove one 12; when the first limiting sliding block 14 is located at the first protruding position, the groove structure two protrudes from the groove structure one.

[0145] In the embodiment, as shown in Figure 5As shown, the first body is provided with a plurality of groove structures one, the first body is further provided with a sliding guide through slot one 15, a limiting sliding block one 14 is slidingly installed in the sliding guide through slot one 15, and one end of the limiting sliding block one 14 is provided with a groove structure two, when the limiting sliding block one 14 is located at the first alignment matching position, the profile of the groove structure two is aligned and matched with the profile of the groove structure one and limits to form the glue sealing plastic groove one 12, which is convenient for plasticizing the part to be sealed of the electronic detonator module, and the glue sealing plastic groove one 12 is divided into two parts of the groove structure one and the groove structure two, when the limiting sliding block one 14 is located at the first protruding position, the groove structure two protrudes from the groove structure one, the limiting sliding block one 14 pushes the plurality of electronic detonator modules completed with glue sealing, which is convenient for separating the electronic detonator module completed with glue sealing from the groove structure one, is conducive to reducing the adhesion between the electronic detonator module completed with glue sealing and the glue sealing plastic groove one 12, and is further conducive to demolding the electronic detonator module completed with glue sealing, and reduces the deformation of the electronic detonator module completed with glue sealing in the demolding process.

[0146] In the embodiment, as shown in the drawings, Figure 2 In order to facilitate the connection of the first body, a plurality of connecting holes for connection are arranged at the lower end of the first body in the embodiment, the connecting holes are screw holes in particular, and the first module 1 is fixedly connected through threaded connection.

[0147] In the embodiment, as shown in the drawings, Figure 4 and Figure 5 The sliding guide through slot one 15 is arranged at the middle part of the first body, the limiting sliding block one 14 is installed at the rear of the sliding guide through slot one 15 and located at the middle part of the first body, the groove structure one includes a groove segment one 121 and a groove segment two 122, the groove structure two includes a groove segment three 141, after the limiting sliding block one 14 is installed at the sliding guide through slot one 15 and located at the first alignment matching position, the groove segment three 141 is located between the groove segment one 121 and the groove segment two 122, and the groove segment one 121, the groove segment two 122 and the groove segment three 141 jointly limit to form the glue sealing plastic groove one 12.

[0148] In the embodiment, as shown in the drawings, Figure 4 and Figure 5 The sliding guide through slot one 15 is arranged at the middle part of the first body, the two sides of the groove segment one 121 on the first body are respectively provided with a protruding block segment one 131, the two sides of the groove segment two 122 on the first body are respectively provided with a protruding block segment two 132, the two sides of the groove segment three 141 on the limiting sliding block one 14 are respectively provided with a protruding block segment three 142, after the limiting sliding block one 14 is installed at the sliding guide through slot one 15 and located at the first alignment matching position, the protruding block segment three 142 is located between the protruding block segment one 131 and the protruding block segment two 132, and the protruding block segment one 131, the protruding block segment two 132 and the protruding block segment three 142 are sequentially arranged to form the limiting block 13.

[0149] In the embodiment, in order to facilitate the connection of the limiting sliding block one 14 and the driving structure, a plurality of connecting hole structures for connection are arranged at the lower end of the limiting sliding block one 14. Figure 5 As shown in the figure, the sliding guide through slot one 15 in the embodiment is a cuboid cavity structure, and the limiting sliding block one 14 is a cuboid structure. In addition, the sliding guide through slot one 15 and the limiting sliding block one 14 can also be arranged in other structures according to the needs.

[0150] As shown in the figure, the second module 2 comprises: Figure 8

[0151] A second body, a plurality of groove structures three are arranged on the second body in intervals, and each groove structure three constitutes a part of the glue sealing plastic groove two 21.

[0152] A limiting sliding block two 24, a sliding guide through slot two 25 is arranged on the second body, the sliding guide through slot two 25 is communicated with the groove structure three, and the limiting sliding block two 24 is arranged with a groove structure four for constituting another part of the glue sealing plastic groove two 21 at one end close to the groove structure three. The limiting sliding block two 24 is slidingly installed in the sliding guide through slot two 25, and the limiting sliding block two 24 has a second alignment matching position and a second protruding position relative to the groove structure two. When the limiting sliding block two 24 is located at the second alignment matching position, the profile of the groove structure four is aligned and matched with the profile of the groove structure three, and the glue sealing plastic groove two 21 is defined. When the limiting sliding block two 24 is located at the second protruding position, the groove structure four protrudes from the groove structure three.

[0153] As shown in the figure, a plurality of groove structures three are arranged on the second body, and a sliding guide through slot two 25 is further arranged on the second body. The limiting sliding block two 24 is slidingly installed in the sliding guide through slot two 25, and the limiting sliding block two 24 is arranged with a groove structure four at one end. When the limiting sliding block two 24 is located at the second alignment matching position, the profile of the groove structure four is aligned and matched with the profile of the groove structure three, and the glue sealing plastic groove two 21 is defined. The glue sealing plastic groove two 21 is divided into two parts of the groove structure three and the groove structure four, which facilitates the plastic molding of the glue sealing part of the electronic detonator module. When the limiting sliding block two 24 is located at the second protruding position, the groove structure four protrudes from the groove structure three, the limiting sliding block two 24 pushes the plurality of electronic detonator modules completed with glue sealing, and the electronic detonator modules completed with glue sealing are separated from the groove structure three, which is beneficial to reduce the bonding force between the electronic detonator modules completed with glue sealing and the glue sealing plastic groove two 21, and further facilitates the demolding of the electronic detonator modules completed with glue sealing, and reduces the deformation of the electronic detonator modules completed with glue sealing in the demolding process. Figure 8

[0154] ​​In the embodiment, as shown in Figure 2 , Figure 6 , in order to facilitate the connection of the second body and the driving structure, a plurality of connection holes one 29 are arranged at the upper end of the second body for connection, the connection hole one 29 is a threaded hole and is used for threaded connection with the driving structure, and the second module 2 is fixedly connected.

[0155] In the embodiment, as shown in Figure 7 , Figure 8 , the sliding guide through slot two 25 in the embodiment is arranged at the middle part of the second body, the limiting sliding block two 24 is installed at the rear of the sliding guide through slot two 25, and the limiting sliding block two 24 is located at the middle part of the second body; the groove structure three in the embodiment includes a groove segment four 211 and a groove segment five 212, the groove structure four includes a groove segment six 241, after the limiting sliding block two 24 is installed at the sliding guide through slot two 25 and located at the second alignment matching position, the groove segment six 241 is located between the groove segment four 211 and the groove segment five 212, and the groove segment four 211, the groove segment five 212 and the groove segment six 241 jointly define the glue sealing molding groove two 21.

[0156] In the embodiment, as shown in Figure 7 , Figure 8 , in order to facilitate the connection of the limiting sliding block two 24 and the driving structure, a plurality of connection holes two 243 are arranged at the upper end of the limiting sliding block two 24 for connection, the connection hole two 243 is a threaded hole and is used for threaded connection with the driving structure, and the limiting sliding block two 24 is fixedly connected; further, as shown in Figure 8 , the sliding guide through slot two 25 in the embodiment is a cuboid cavity structure, the limiting sliding block two 24 is a cuboid structure, in addition, the sliding guide through slot two 25 and the limiting sliding block two 24 can also be arranged in other structures according to the needs.

[0157] In an embodiment of the application, as shown in Figure 2 and Figure 3 , a plurality of top pushing piece guide through holes are further arranged on the first module 1 and the second module 2, the plurality of top pushing piece guide through holes can be in communication with the receiving cavity, and the plurality of top pushing piece guide through holes are respectively used for installing a plurality of movable top pushing pieces capable of top pushing the electronic detonator module group with completed glue sealing to realize demolding.

[0158] In the embodiment, as shown in Figure 2 and Figure 3 , by further arranging a plurality of top pushing piece guide through holes on the first module 1 and the second module 2, reliable demolding of the electronic detonator module group with completed glue sealing can be realized by the plurality of movable top pushing pieces, and the deformation of the electronic detonator module group with completed glue sealing generated in the demolding process is further reduced.

[0159] In the embodiment, as shown in Figure 3 In the embodiment, the first module 1 is provided with the pusher guide holes, including the first pusher guide holes 18, which are arranged along the coverage of the receiving groove 11; specifically, the first module 1 is provided with two rows of the first pusher guide holes 18 on the front side and the rear side of the receiving groove 11, and is also provided with two rows of the first pusher guide holes 18 on the left side and the right side of the receiving groove 11, which is beneficial to applying uniform upward pushing force to the electronic detonator module with completed sealing and gluing by the pushers respectively passing through the first pusher guide holes, and achieving demolding of the electronic detonator module with completed sealing and gluing from the first module 1. The pusher in the embodiment is specifically a thimble.

[0160] Further, as shown in Figure 2 and Figure 6 In the embodiment, the second module 2 is provided with the pusher guide holes, including the second pusher guide holes 27 and the third pusher guide holes 28, which are arranged along the coverage of the receiving cavity; specifically, the second module 2 is provided with two rows of the second pusher guide holes 27 and the third pusher guide holes 28 respectively; which is beneficial to applying uniform downward pushing force to the electronic detonator module with completed sealing and gluing by the pushers respectively passing through the second pusher guide holes and the third pusher guide holes, and achieving demolding of the electronic detonator module with completed sealing and gluing from the second module 2. In addition, the pusher guide holes in the embodiment can have various setting modes, which are convenient for achieving demolding of the electronic detonator module with completed sealing and gluing from the first module 1 and the second module 2.

[0161] Further, in order to simplify the structure of the mold, the first module 1 or the second module 2 can be provided with a plurality of pusher guide holes in the embodiment, which is convenient for achieving demolding of the electronic detonator module with completed sealing and gluing.

[0162] In addition, in addition to the technical solutions disclosed in the embodiment, the structure and working principle of the driving device, the energy storage capacitor 4, and the injection molding machine in the application can refer to the conventional technical solutions in the technical field, and these conventional technical solutions are not the focus of the application, and the application will not be described in detail here.

[0163] In the application, the term "a plurality of" refers to two or more, unless otherwise explicitly limited. The terms "mounting", "connecting", "connecting", "fixing" and the like should be understood in a broad sense, for example, "connecting" can be fixed connection, or detachable connection, or integrally connected; "connected" can be directly connected, or indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the application can be understood according to the specific circumstances.

[0164] In the description of the application, it is to be understood that the terms "upper", "lower", "front", "rear", and the like are words of reference to the positions of the components shown in the drawings in which the application is shown in the drawings, and are merely intended to facilitate the description of the application and simplify the description, and do not indicate or imply that the devices or units referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the application.

[0165] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "a specific embodiment" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0166] The above is only the preferred embodiment of the present application and is not intended to limit the present application. The present application can have various modifications and changes for those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A method for sealing an electronic detonator module, characterized in that, include: A substrate with multiple electronic detonator modules to be sealed is placed into the receiving cavity of the sealing mold in the electronic detonator module sealing system. The substrate has multiple substrate strips, and the multiple substrate strips are respectively provided with connecting wires and electronic components to form the electronic detonator module. The sealing mold is closed, and the multiple electronic detonator modules to be sealed are confined in the injection cavity formed after the sealing mold is closed. The parts of the multiple electronic detonator modules to be sealed are respectively located in the injection cavity. A hot glue is injected into a plurality of the cavity to be glued, the hot glue filling the plurality of the cavity to be glued and covering the glue-to-be-sealed portion of the electronic detonator module; Demolding is performed on the multiple electronic detonator modules that have been sealed with adhesive.

2. The sealing method for an electronic detonator module according to claim 1, characterized in that, Before placing the substrate containing multiple electronic detonator modules to be sealed into the receiving cavity of the sealing mold in the electronic detonator module sealing system, the electronic detonator module sealing method further includes: Multiple openings are spaced apart on the substrate, and the multiple openings are arranged in an array along the length of the substrate. A substrate strip is formed between two adjacent openings, and connecting wires and electronic components are arranged on the substrate strip to form the electronic detonator module.

3. The sealing method for an electronic detonator module according to claim 2, characterized in that, The sealing method for the electronic detonator module further includes: Pre-cut lines are provided at both ends of the substrate strip along its length. The pre-cut lines are used to break the substrate strip along the pre-cut lines to obtain multiple encapsulated electronic detonator modules.

4. An electronic detonator module sealing system, used to implement the electronic detonator module sealing method according to any one of claims 2 to 3, characterized in that, The electronic detonator module sealing system includes: Base; The sealing mold includes a first module and a second module. One of the first module and the second module is mounted on the base. The first module has a first spatial constraint structure, and the second module has a second spatial constraint structure on the side facing the first spatial constraint structure, which is used for mold closing with the first module. The side of the first module and / or the second module used for mold closing has a gating structure. When the first module and the second module are molded together, the first spatial constraint structure and the second spatial constraint structure define a space capable of accommodating the substrate. The housing cavity further defines multiple injection cavities for injecting the hot adhesive between the first and second spatial constraint structures. These multiple injection cavities are respectively connected to the housing cavity. The gating structure forms a gating channel connected to the injection cavities. After the substrate is placed in the housing cavity, the portion of the electronic detonator module to be sealed is located within each injection cavity. The hot adhesive is injected into the injection cavities through the gating channels, filling the injection cavities and covering the portion of the electronic detonator module to be sealed. A drive device is mounted on the base. The other of the first module and the second module is mounted on the drive device and can move under the drive of the drive device to perform mold closing and mold opening of the first module and the second module. A guide mechanism is installed on the base, and the first module and / or the second module are slidably connected to the guide mechanism and are able to move under the guidance of the guide mechanism; A push mechanism is installed on the base or the drive device. The push mechanism is used to push out the multiple electronic detonator modules that have been sealed in the glue injection cavity after the first module and the second module are opened to achieve demolding. An injection molding machine is used to produce the hot colloid and input the hot colloid into the runner; The spatial constraint structure includes: A receiving groove, the contour of which is adapted to the contour of the substrate, so that the substrate can be received in the receiving groove; The first sealing and shaping groove is connected to the storage groove, and the first sealing and shaping groove is used to shape the part of the electronic detonator module to be sealed. When the first module and the second module are molded together, the receiving groove forms the receiving cavity, and the sealing molding groove forms part of the cavity to be injected with glue. The second spatial constraint structure includes: The second sealing and shaping groove is set opposite to the first sealing and shaping groove and is used to shape the part of the electronic detonator module to be sealed. After the first module and the second module are molded together, the second sealing and molding groove forms another part of the cavity to be injected with glue, and the first sealing and molding groove and the second sealing and molding groove define the cavity to be injected with glue; The storage recess includes: The peripheral storage section is used to store the peripheral portion of the substrate; The substrate strip receiving portion is arranged in an array of multiple portions, which are respectively connected to the sealing molding groove and the peripheral receiving portion. The substrate strip receiving portion is used to receive the substrate strip, and the substrate strip receiving portion forms a limiting block on both sides along the array direction of the substrate strip receiving portion. After the substrate is placed in the receiving groove, the peripheral portion of the substrate is received in the peripheral receiving portion, and the substrate strips are respectively received in the substrate strip receiving portion. The limiting blocks respectively extend into the through-hole.

5. The electronic detonator module sealing system according to claim 4, characterized in that, The width of the first sealing and molding groove is greater than the width of the substrate strip receiving portion. After the substrate is placed in the receiving groove, the outer sidewall of the substrate strip abuts against the inner sidewall of the substrate strip receiving portion. The substrate strip fills the substrate strip receiving portion and seals the thermoplastic material entering the first sealing and molding groove along the length of the substrate strip.

6. The electronic detonator module sealing system according to claim 4, characterized in that, The electronic component includes an energy storage capacitor, and the substrate strip is provided with a capacitor mounting slot for mounting the energy storage capacitor, and the energy storage capacitor is mounted in the capacitor mounting slot. The sealing mold also includes: A capacitor positioning protrusion is connected to the inner wall of the first or / and the second sealing molding groove and protrudes vertically along the mold opening direction of the first module and the second module. After the first module and the second module are molded together, the capacitor positioning protrusion can abut against the energy storage capacitor and position the energy storage capacitor.

7. The electronic detonator module sealing system according to claim 4, characterized in that, The electronic component includes an ignition element and a connection pin. The ignition element is connected to one end of the substrate strip along its length, and the connection pin is connected to the other end of the substrate strip along its length. The first module or the second module is provided with a storage slot one for storing the ignition element, and the first module or the second module is also provided with a storage slot two for storing the connection pins; After the first module and the second module are molded together, the ignition element extends into and is housed in the first housing slot, and the connecting pin extends into and is housed in the second housing slot.

8. The electronic detonator module sealing system according to claim 4, characterized in that, The first module includes: The first body has a storage groove disposed on it, and the first body has a plurality of groove structures that are each part of the sealing and molding groove. The first body has a sliding guide groove, which is connected to the groove structure. The end of the first limiting sliding block near the groove structure is provided with a groove structure two corresponding to the groove structure for forming another part of the sealing molding groove. The first limiting sliding block is slidably installed in the sliding guide groove. The limiting sliding block one slides relative to the groove structure one and has a first alignment matching position and a first protruding position. When the limiting sliding block one is located at the first alignment matching position, the contour of the groove structure two is aligned and matched with the contour of the groove structure one and defines the sealing molding groove one. When the limiting sliding block one is located at the first protruding position, the groove structure two protrudes from the groove structure one.

9. The electronic detonator module sealing system according to claim 4, characterized in that, The second module includes: The second body has a plurality of groove structures three that are spaced apart and each constitute a part of the sealing molding groove two; The second limiting sliding block has a sliding guide groove on its second body, which communicates with the groove structure three. One end of the limiting sliding block near the groove structure three corresponds to a groove structure four forming another part of the sealing and molding groove two. The limiting sliding block two is slidably installed within the sliding guide groove two. The limiting sliding block two has a second alignment position and a second protruding position relative to the groove structure three. When the limiting sliding block two is in the second alignment position, the contour of the groove structure four aligns and matches with the contour of the groove structure three, defining and forming the sealing and molding groove two. When the limiting sliding block two is in the second protruding position, the groove structure four protrudes from the groove structure three.

10. The electronic detonator module sealing system according to any one of claims 4 to 9, characterized in that, The first module and / or the second module are further provided with multiple pusher guide holes, which can communicate with the receiving cavity. The multiple pusher guide holes are respectively used to install movable pushers that can push the multiple electronic detonator modules that have been sealed to achieve demolding.

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