Housing structure, housing, electronic equipment and method for preparing housing structure

By adopting an integrated microcrystalline glass and metal cluster design in the electronic device housing structure, the interference signal problem caused by transparent materials is solved, the monitoring accuracy is improved, the preparation process is simplified, and the cost and warping risk are reduced.

CN116406106BActive Publication Date: 2025-09-09HUAWEI TECH CO LTD
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Patent Information

Application Number
CN202310201364.5
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-02-22
Publication Date
2025-09-09
Estimated Expiration
2043-02-22

AI Technical Summary

Technical Problem

In the existing electronic device housing structure, the interference signal caused by the transparent material interferes with the monitoring accuracy of the optical receiver, and the existing technology has problems such as high processing difficulty, high cost and warping deformation during the preparation process.

Method used

An integrally formed shell structure is adopted, including a first area and a second area. The second area is composed of microcrystalline glass and metal clusters, formed by local exposure and overall heat treatment. The metal clusters serve as crystal nuclei to improve crystallinity to reduce transmittance and block interference signals.

Benefits of technology

The invention reduces interference signals while improving the mechanical properties and monitoring accuracy of the shell structure, simplifies the preparation process, and reduces costs and the risk of warping deformation.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present application discloses a shell structure, a shell, an electronic device, and a method for preparing the shell structure. The shell structure may include: a first region and a second region. The first region and the second region are an integrally formed structure, so the shell structure has good mechanical properties. The second region includes: microcrystalline glass and metal clusters. The metal clusters serve as crystal nuclei of the microcrystalline glass, which contributes to the formation of the microcrystalline glass, thereby allowing the second region to have a greater degree of crystallinity. Crystallinity is inversely correlated with transmittance. The second region has a greater degree of crystallinity, and the corresponding second region has a smaller transmittance. The second region with a smaller transmittance can block the propagation of interference signals to a certain extent, thereby achieving the purpose of reducing interference signals.
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Description

Technical Field

[0001] The present application relates to the technical field of electronic device housing structures, and more particularly to a housing structure, a housing, an electronic device, and a method for preparing the housing structure. Background Art

[0002] An electronic device may include a housing and an optical sensor disposed within the housing. Opto-sensors, commonly used sensors in electronic devices, may include one or more optical components. These optical components may be configured to emit or monitor optical signals within a specified wavelength range. The housing includes at least one housing structure, which may exemplarily include a bezel, a cover plate, and a base plate.

[0003] Electronic devices can process the light signals detected by light sensors to implement certain functions. The process by which electronic devices utilize light signals detected by light sensors to implement certain functions is as follows: a light signal is emitted by a light emitter; the light signal passes through the housing structure and is incident on a target object; after being absorbed, reflected, or refracted by the target object, the light signal can then pass through the housing structure and return to the light receiver. The light signal absorbed, reflected, or refracted by the target object is related to the properties of the target object, so the light receiver can detect the light signal related to the target object.

[0004] Typically, the housing structure is made of transparent material. A portion of the light signal emitted by the light emitter can pass through the transition region and reach the light receiver. The transition region can be defined as the area between the light emitter's projection on the housing structure and the light receiver's projection on the housing structure. Light signals that pass through the transition region are typically interference signals.

[0005] The presence of interference signals will cause the accuracy of the optical receiver's monitoring results to decrease. Summary of the Invention

[0006] The present application discloses a shell structure, a shell, an electronic device and a method for preparing the shell structure. The shell structure includes a first area and a second area. The second area includes metal clusters, so that the metal clusters contained in the second area make the second area have a lower transmittance, and the second area can block interference signals.

[0007] In a first aspect, the present application discloses a shell structure comprising: a first region and a second region; the first region and the second region are integrally formed, and the transmittance of the first region is greater than the transmittance of the second region; the second region comprises: microcrystalline glass and metal clusters.

[0008] In this implementation, the shell structure may include: a first region and a second region. The first region and the second region are an integrally formed structure, so the shell structure has good mechanical properties. The second region includes: microcrystalline glass and metal clusters. The metal clusters serve as crystal nuclei of microcrystalline glass, which contribute to the formation of microcrystalline glass, thereby allowing the second region to have a greater degree of crystallinity. Crystallinity is inversely correlated with transmittance. The second region has a greater degree of crystallinity, and the corresponding second region has a smaller transmittance. The second region with a smaller transmittance can, to a certain extent, block the propagation of interference signals inside the shell structure, thereby achieving the purpose of reducing interference signals.

[0009] In combination with the first implementation of the first aspect, the metal cluster includes: one or a mixture of Ag clusters, Cu clusters, and Au clusters.

[0010] In combination with the second implementation method of the first aspect, the raw materials used in the shell structure include: photosensitive materials, and the photosensitive materials include: nucleating metals; under the action of light signals, the photosensitive materials convert the nucleating metals in the form of compounds into nucleating metals in an atomic state, and the nucleating metals in an atomic state are used to form metal clusters.

[0011] In this implementation, the photosensitive material can be exposed to light signals, causing the nucleation metal in the form of a compound within it to be converted into atomic nucleation metal. The atomic nucleation metal can then aggregate to form metal clusters upon heating. Therefore, a method of localized light signal exposure plus heating can be employed to reduce the nucleation metal in the exposed area, which is in the form of a compound, to its atomic state, thereby forming metal clusters. During the subsequent overall heat treatment, the portion containing the metal clusters is more likely to crystallize, forming a second region with low transmittance, thereby yielding an integrated first region and second region.

[0012] In combination with the third implementation of the first aspect, the photosensitive material further includes: a photosensitive compound, which releases electrons under the action of a light signal.

[0013] In this implementation, the photosensitive material also includes a photosensitive compound. In response to a light signal, the photosensitive compound releases electrons, which can reduce the nucleation metal in the compound form to free metal atoms. Therefore, a localized exposure plus heating method can be used to create a second region containing metal clusters.

[0014] In combination with the fourth implementation of the first aspect, the photosensitive material further includes: anions, the anions form a photosensitive compound with the nucleation metal, and the photosensitive compound precipitates the nucleation metal in an atomic state under the action of the light signal.

[0015] In this implementation, the photosensitive compound precipitates atomic nucleation metals under the action of light signals. Therefore, a local exposure + heating method can be used to obtain a second region containing metal clusters.

[0016] In combination with the fifth implementation of the first aspect, the raw materials used for the shell structure include: halogen elements.

[0017] In this implementation, the high-temperature halogen element provides an acidic / oxidizing atmosphere, thereby preventing the atomic precipitation of nucleation metals in the raw materials and preventing the formation of metal clusters during the melting process. This reduces the number and density of metal clusters in the unexposed region, lowering the crystallinity of the unexposed region. The resulting first region has a higher transmittance, ensuring minimal loss of both the effective and emitted light signals during transmission through the first region.

[0018] In combination with the sixth implementation of the first aspect, the first region includes: microcrystalline glass and / or ordinary glass.

[0019] In combination with the seventh implementation manner of the first aspect, the second area runs through the shell structure.

[0020] In this implementation, the second area penetrates the shell structure, and the second area can block more interference signals.

[0021] In combination with the eighth implementation manner of the first aspect, the surface of the shell structure includes: a plane, a curved surface, a protrusion, and a groove.

[0022] In combination with the ninth implementation manner of the first aspect, a light-blocking layer is provided in the groove of the second region, and the transmittance of the light-blocking layer is lower than the transmittance of the second region.

[0023] In this embodiment, a light-blocking layer is disposed within the groove on the surface of the second region. Adjacent first regions include the light-blocking layer and the second region. Because the transmittance of the light-blocking layer is lower than that of the second region, the light-blocking layer can block more interference signals. Therefore, the housing structure disclosed in this embodiment can block more interference signals.

[0024] In combination with the tenth implementation manner of the first aspect, the protrusions and the grooves form Fresnel patterns.

[0025] In this implementation, the Fresnel patterns formed by the protrusions / grooves on the surface of the shell structure can play a focusing role, and the signal-to-noise ratio of the effective light signal can be improved by designing the Fresnel patterns.

[0026] By designing the Fresnel pattern on the surface of the shell structure, it is no longer necessary to use an additional film to realize the Fresnel pattern, and the stacking size of the shell structure can be reduced.

[0027] In this implementation, the Fresnel patterns formed by the protrusions and grooves on the surface of the housing structure are integrally formed with the first and second regions. This eliminates any gluing, splicing, or welding interfaces between the first and second regions. This improves the integrity of the housing structure and enhances mechanical performance.

[0028] In combination with the eleventh implementation manner of the first aspect, the shell structure includes: a compressive stress layer and a tensile stress layer; the compressive stress layer is arranged on the surface of the tensile stress layer.

[0029] The shell structure disclosed in this implementation comprises a compressive stress layer and a tensile stress layer; the compressive stress layer is disposed on the surface of the tensile stress layer. This means that the compressive stress layer on the outer surface is subject to compressive stress, while the tensile stress layer on the inner surface is subject to tensile stress. The presence of the compressive stress layer can prevent or eliminate the formation and extension of surface micro-cracks in the shell structure, thereby improving the mechanical properties of the shell structure.

[0030] In combination with the twelfth implementation manner of the first aspect, the second region includes a plurality of sub-regions that are in contact with each other, and adjacent sub-regions have different transmittances.

[0031] In this implementation, two adjacent sub-regions have different transmittances, and a refraction / reflection interface can be formed between the two sub-regions. When the interference signal propagates to the refraction / reflection interface, it will be refracted / reflected, thereby reducing the interference signal transmitted through the second region.

[0032] In combination with the thirteenth implementation manner of the first aspect, the width of the second area is greater than or equal to a set value.

[0033] The larger the width of the second area, the greater the blocking effect of the second area on the interference signal. In this implementation, the width of the second area is greater than or equal to the set value, which can ensure that the second area has a greater blocking effect on the interference signal.

[0034] In combination with the fourteenth implementation manner of the first aspect, the first region does not include metal clusters, or the density of metal clusters in the first region is less than the density of metal clusters in the second region.

[0035] In this implementation, the first region does not include metal clusters, or the density of metal clusters in the first region is less than the density of metal clusters in the second region. Metal clusters contribute to the formation of microcrystalline glass. Therefore, an overall heat treatment method can be used to obtain a first region with a smaller / zero crystallinity and a second region with a larger crystallinity, and the warping between the first region and the second region is smaller. Crystallinity is inversely related to transmittance. The first region has a smaller crystallinity, so that the first region has a larger transmittance, thereby ensuring that the effective light signal is less lost in the process of transmitting through the first region. The second region has a larger crystallinity, and the corresponding second region has a smaller transmittance. The second region with a smaller transmittance can block the propagation of interference signals inside the shell structure to a certain extent, thereby achieving the purpose of reducing interference signals.

[0036] In combination with the fifteenth implementation manner of the first aspect, if the shell structure includes multiple second areas, the transmittances of any two second areas are the same, or the transmittances of any two second areas are different.

[0037] A second aspect of the present application discloses a method for preparing a shell structure, comprising: exposing a portion of a glass plate; performing a nucleation heat treatment on the exposed glass plate to form metal clusters within the exposed region of the glass plate, wherein the glass plate is made of a photosensitive material comprising a nucleating metal; under the action of a light signal, the nucleating metal present in compound form within the photosensitive material is converted into atomic nucleating metal, and the atomic nucleating metal is used to form the metal clusters; and performing a crystallization heat treatment on the nucleated glass plate to obtain a shell structure. The shell structure comprises a first region and a second region, wherein the second region is obtained by crystallizing the exposed region of the glass plate; and the first region is obtained by crystallizing the non-exposed region of the glass plate, and the second region comprises microcrystalline glass and metal clusters.

[0038] In this implementation, a glass plate is used to form a shell structure, and the glass plate includes: a photosensitive material. Under the action of a light signal, the nucleation metal in the form of a compound inside the photosensitive material is converted into an atomic nucleation metal, and the atomic nucleation metal can aggregate to form a metal cluster. Therefore, a local exposure method of a light signal can be used to form a metal cluster in the exposed area. In the subsequent heat treatment process, the exposed area with the metal cluster is easy to crystallize to form a second area with a small transmittance. The second area with a small transmittance can block the propagation of the interference signal inside the shell structure to a certain extent, thereby achieving the purpose of reducing the interference signal. The preparation method disclosed in this implementation can adopt an overall heat treatment method to obtain a first area with a small / zero crystallinity and a second area with a large crystallinity. The warping between the first area and the second area of ​​the prepared glass plate is small.

[0039] In combination with the first implementation of the second aspect, the step of exposing a partial area of ​​the glass plate includes: setting a mask on one side of the glass plate, the mask including a window; and irradiating the partial area of ​​the glass plate with a light signal through the mask window.

[0040] In this implementation, a partial exposure of the glass sheet is achieved using a mask. The resulting shape / size of the second region is consistent with the shape / size of the mask window. By using masks with windows of different shapes / sizes, the shape / size of the second region can be flexibly configured.

[0041] In conjunction with the second implementation of the second aspect, the step of exposing a partial area of ​​the glass plate is specifically: irradiating the partial area of ​​the glass plate with a laser.

[0042] This implementation can control the size and shape of the exposure area by controlling the laser path, without the assistance of a mask, which can reduce the cost of the shell structure to a certain extent.

[0043] In combination with the third implementation manner of the second aspect, the energy flux density of the light signal used in the exposure process is less than or equal to the damage threshold of the glass plate.

[0044] In this implementation, the energy flux density of the optical signal is less than or equal to the damage threshold of the glass plate, so that the internal structure of the exposure area is not damaged during the local exposure stage.

[0045] In combination with the fourth implementation of the second aspect, after the step of heat-treating the exposed glass plate to obtain the shell structure, the preparation method further includes: chemically strengthening the shell structure so that a compressive stress layer is generated on the surface of the shell structure, and the compressive stress layer is arranged on the surface of the tensile stress layer.

[0046] In this implementation, a volume difference is formed on the surface of the shell structure before and after chemical strengthening. This volume difference forms a compressive stress layer within a certain depth range of the shell structure. The presence of the compressive stress layer can prevent / eliminate the generation and extension of surface micro-cracks of the shell structure, thereby achieving the purpose of improving the mechanical properties of the shell structure.

[0047] A third aspect of the present application discloses a housing, which includes at least one housing structure disclosed in the first aspect.

[0048] The fourth aspect of the present application discloses an electronic device, comprising: a light emitter, a light receiver and the shell structure disclosed in the first aspect; the shell structure comprises: a first area and a second area; the light emitter is used to emit a light signal that passes through the first area, and the light receiver is used to receive the light signal that passes through the first area; the second area is located between the projection of the light emitter on the first area and the projection of the light receiver on the first area.

[0049] In combination with the first implementation of the fourth aspect, the electronic device further includes: a cover bottom layer, which is arranged on the inner surface of the shell structure, and the cover bottom layer avoids the projection of the light receiver / light emitter on the first area. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] Figure 1 A physical diagram of a wearable device is shown as an example;

[0051] Figure 2 This is an application scenario diagram for wearable devices;

[0052] Figure 3 This is an application scenario diagram of the shell structure disclosed in the related art;

[0053] Figure 4 A schematic diagram of a shell structure disclosed in a feasible implementation method;

[0054] Figure 5 A schematic diagram of a shell structure disclosed in a feasible implementation method;

[0055] Figure 6 A schematic diagram of a shell structure disclosed in a feasible implementation method;

[0056] Figure 7 A schematic diagram of a shell structure disclosed in a feasible implementation method;

[0057] Figure 8 A schematic diagram of a shell structure disclosed in a feasible implementation method;

[0058] Figure 9 A schematic diagram of a shell structure disclosed in a feasible implementation method;

[0059] Figure 10 A flowchart of a method for preparing a shell structure disclosed in a feasible implementation manner;

[0060] Figure 11 A process flow chart of a shell structure disclosed in a feasible implementation method;

[0061] Figure 12 The present invention is a process flow chart of a shell structure disclosed in a feasible implementation method. DETAILED DESCRIPTION

[0062] Reference will now be made specifically to the representative embodiments shown in the accompanying drawings. It should be understood that the following description is not intended to limit the embodiments to a preferred embodiment. On the contrary, the embodiments are intended to cover alternatives, modifications and equivalents that may be included within the spirit and scope of this disclosure and as defined by the appended claims.

[0063] First, the concepts involved in the embodiments of the present application are explained:

[0064] Crystallinity can be represented by R. Crystallinity is defined as the proportion of crystals in the region (first region / second region). The proportion can include: proportion by mass and proportion by volume.

[0065] For example, it can be calculated by the following formula:

[0066] R=M crystal / (M crystal+M amorphous)×100%.

[0067] Here, Mcrystal represents the mass of crystals contained in the region, and Mamorphous represents the mass of amorphous materials contained in the region.

[0068] Transmittance, denoted by T, is defined as the ratio of the radiant energy of the light signal transmitted through the region to the total radiant energy of the light signal projected onto the region, from the time the light signal enters the region from its inner surface to the time the light signal leaves the region from its outer surface.

[0069] The loss of optical signals during propagation within an area is related to the transmittance of the area. The greater the transmittance of the area, the lower the loss of optical signals during propagation within the area. The smaller the transmittance of the area, the higher the loss of optical signals during propagation within the area.

[0070] The density of metal clusters is defined as the number of metal clusters contained in a region (first region, second region) per unit volume.

[0071] The electronic devices involved in the embodiments of the present application may include, but are not limited to, wearable devices (e.g., electronic bracelets), notebook computing devices (e.g., notebooks or laptops), tablet computing devices (e.g., tablet computers), mobile phones (e.g., cell phones), and other portable electronic devices. The electronic device may also be a desktop computer system, a computer component, an input device, a device, or virtually any other type of electronic product or device component.

[0072] An electronic device may include a housing and electronic components disposed within the housing. The housing may include one or more housing structures, each having a cavity for accommodating the electronic components. Exemplarily, the housing structure may include a cover, a frame, and a bottom plate.

[0073] As a feasible implementation method, multiple shell structures can be connected together to form a shell by bonding, welding, splicing, etc.

[0074] As a feasible implementation method, the multiple shell structures can be an integrally formed structure.

[0075] The electronic components may include: a sensor assembly, a processor, etc. The sensor assembly may be referred to as a sensor in the embodiment of the present application.

[0076] A central processing unit (CPU) is a data processing device that processes signals detected by sensors to enable electronic devices to perform their functions. These functions may include, but are not limited to, health management, fitness measurement, social interaction, casual gaming, and audiovisual entertainment.

[0077] A transducer (or sensor) is a monitoring device that senses information and converts it into an electrical signal or other desired output format according to a specific pattern. The information being measured can include, but is not limited to, optical and electrical signals.

[0078] Sensors may include, but are not limited to, proximity sensors, light sensors (e.g., health monitoring sensors), biometric sensors (e.g., facial or fingerprint recognition sensors), depth sensors or imaging sensors, audio sensing devices, touch sensors, force sensors, accelerometers, gyroscopes, magnetometers, or similar types of position / orientation sensing devices.

[0079] As a sensor commonly used in electronic devices, a light sensor may include: one or more optical components. In the embodiment of the present application, the optical component is configured to emit or monitor light signals within a specified wavelength range.

[0080] Some optical components may include: one or more light-emitting elements. An optical device including a light-emitting element may also be referred to as a light emitter in the embodiments of the present application.

[0081] A light-emitting element is defined as an element that can emit light signals. Exemplary light-emitting elements include, but are not limited to, light-emitting diodes (LEDs), micro light-emitting diodes (micro light-emitting diodes), lasers, and mini light-emitting diodes. Light signals include, but are not limited to, visible light, infrared light, and ultraviolet light.

[0082] Some optical components may include: one or more light receiving elements. An optical device including a light receiving element may also be referred to as a light receiver in the embodiments of the present application.

[0083] The light receiving element may be configured to monitor light signals within a specified wavelength range. For example, the light receiving element may include, but is not limited to, a photoelectric diode (PD), a charge-coupled device (CCD), and the like.

[0084] The processor of the electronic device can process the light signal detected by the light sensor and then realize some functions.

[0085] The process by which electronic devices use light signals detected by light sensors to implement some functions: the light signal is emitted by the light emitter; the light signal is transmitted through the shell structure and incident on the target object; the light signal incident on the target object can be absorbed, reflected, and refracted by the target object and then returned to the light receiver through the shell structure.

[0086] The light signal absorbed, reflected, and refracted by the target object is related to the properties of the target object. Therefore, the optical receiver can monitor the light signal related to the target object.

[0087] Photoplethysmography (PPG) is a commonly used detection technology in electronic devices. Based on PPG, electronic devices can use optical sensors to monitor light signals related to vital signs, thereby implementing health management functions. Vital signs data can include, but are not limited to, heart rate and blood pressure.

[0088] The implementation process of the health management function is explained below with reference to specific drawings.

[0089] See also Figure 1 and Figure 2 , Figure 1 A physical diagram of a wearable device is shown as an example. Figure 2 This is an application scenario diagram for wearable devices.

[0090] The wearable device may include a housing 10 and a light sensor 20 disposed inside the housing. In some feasible implementations, the wearable device may further include a wristband 30. The wristband 30 is connected to the housing 10 and is used to fit the wearable device around a target object (e.g., a wrist).

[0091] In some feasible implementations, the wristband 30 can be one or two. When there is one wristband, the opposite ends of the wristband are connected to the opposite ends of the housing 10, so that the wristband 30 and the housing 10 form a wearing groove, which can be put on the target object. When there are two wristbands, the two wristbands 30 are connected to the opposite ends of the housing 10, and the ends of the two wristbands away from the housing are buckled together, so that the wristbands and the frame form a wearing groove, which can be put on the target object.

[0092] The housing 10 may include two housing structures, namely a glass bottom plate 101 and a frame 102 .

[0093] The frame 102 is disposed around the glass base 101. The glass base 101 and the frame 102 form a cavity for accommodating the light sensor 20.

[0094] The optical sensor 20 may include at least one light emitter 201 for emitting an optical signal and at least one optical receiver 202 for receiving an optical signal.

[0095] See also Figure 2 When worn, the outer surface of the glass bottom plate 101 of the wearable device is located on the side adjacent to the human body 40, and the light signal A(1) emitted by the light emitter 201 passes through the glass bottom plate 101(1) and reaches the human body 40. After the light signal is reflected by the human blood and tissue 401, a reflected light signal A(2) is obtained. The reflected light signal A(2) can pass through the glass bottom plate 101(2) and return to the light receiver 202. The light receiver 202 can record the changes in the blood vessel volume during the cardiac cycle based on the different intensities of the reflected light signal, and calculate the heart rate based on the pulse waveform obtained.

[0096] Typically, the optical signal monitored by the optical receiver 202 may include a valid signal and an interference signal.

[0097] Among them, the effective signal is defined as the light signal obtained after absorption, reflection and refraction by the target object. The effective signal is related to the properties of the target object. Figure 2 In the application scenario, the effective signal refers to the reflected light signal A(2) after being reflected by human blood and tissue 401.

[0098] The interference signal may include: the light signal obtained after not being absorbed, reflected or refracted by the target object. The interference signal is irrelevant to the properties of the target object. Figure 2 In the application scenario, the invalid signal includes: the reflected light signal A(3) after being reflected by the epidermis 402 and the light signal A(4) propagating inside the glass bottom plate 101(3).

[0099] Typically, the housing structure is made of a transparent material, and part of the light signal emitted by the light emitter can pass through the transition region to reach the light receiver.

[0100] The transition region can be defined as the region between the projection of the light emitter onto the housing structure and the projection of the light receiver onto the housing structure. In this embodiment of the present application, the region where the projection of the light emitter onto the housing structure is located can also be referred to as the region corresponding to the light emitter on the housing structure. The region where the projection of the light receiver onto the housing structure is located can also be referred to as the region corresponding to the light receiver on the housing structure.

[0101] The optical signal in the transmission transition region is a typical interference signal. The presence of the interference signal will cause the accuracy of the optical receiver's monitoring results to decrease.

[0102] In order to improve the accuracy of the monitoring results of the optical receiver 202, the related art has made further improvements to the housing structure of the electronic device. Figure 3 . Figure 3 This is an application scenario diagram of an electronic device disclosed in the related art.

[0103] Figure 3 The middle housing structure 10 is constructed from multiple glass sheets 31. The glass sheets 31 are positioned in the corresponding locations of the emission path of the light emitter 201 and the reception path of the light receiver 202. Optical-proof material 32 is placed between adjacent glass sheets 31, i.e., in the transition region.

[0104] Figure 3 In the disclosed related art, the opaque material 32 can have a certain blocking effect on the interference signal. Figure 3 The disclosed housing structure 10 requires multiple glass plates 31 to be spliced ​​together. The splicing process increases the difficulty of processing the housing structure 10. The splicing process requires controlling the processing tolerances between the glass plates 31. Compared with the one-piece housing structure, Figure 3 The shell structure 10 disclosed in the related art may have a problem of high manufacturing cost. At the same time, the joints of the shell structure 10 may include reliability risks.

[0105] The related art also discloses a preparation process for an integrally formed shell structure.

[0106] Specifically: Ion exchange is performed on glasses of unequal thickness to change the glass composition of a certain thickness, and then the glass is thinned to obtain glass of the same thickness but with different local compositions. Finally, the difference in glass composition will lead to different crystallization tendencies. After heat treatment at a suitable temperature, some areas will crystallize while others will not, forming a composite shell structure with transparent and opaque areas.

[0107] The aforementioned related technology can use opaque areas to block interfering signals. However, the manufacturing process requires pre-forming glass sheets of varying thicknesses, followed by subsequent thinning, making the manufacturing process relatively complex. Furthermore, this technology requires ion exchange, which is a time-consuming process.

[0108] Specifically, by locally heating the glass plate or heating the entire glass plate with local heat shielding, the crystallization speed of the glass plate in the heated area 51 is made greater than the crystallization speed of the glass plate in the non-heated area.

[0109] The transmittance of the heated region after crystallization is greater than the transmittance of the non-heated region after crystallization.

[0110] The aforementioned related technologies require localized heating to create different transmittances between the heated and unheated areas. The heated areas create a second region with lower transmittance, which in turn provides a certain degree of shielding against interfering signals. However, this localized heating approach can result in uneven heating of the housing structure, leading to warping and other problems.

[0111] In summary, the performance of the shell structure disclosed in the related art has some defects.

[0112] In order to make up for the defects of the related art, the present application discloses a housing structure. Figure 4-Figure 9 , the shell structure may include: a first region 1 and a second region 2. The first region 1 and the second region 2 are an integrally formed structure, so the shell structure has good mechanical properties. The second region 2 includes: microcrystalline glass and metal clusters. The metal clusters serve as the crystal nuclei of the microcrystalline glass. The metal clusters contribute to the formation of the microcrystalline glass, thereby allowing the second region 2 to have a greater degree of crystallinity. Crystallinity is inversely correlated with transmittance. The second region 2 has a greater degree of crystallinity, and the corresponding second region 2 has a smaller transmittance. The second region 2 with a smaller transmittance can, to a certain extent, block the propagation of interference signals inside the shell structure, thereby achieving the purpose of reducing interference signals.

[0113] The shell structure is further described below.

[0114] First, the raw materials used for the shell structure are described. In the embodiments of the present application, unless otherwise specified, the raw materials refer to the raw materials used for the shell structure.

[0115] In the embodiment of the present application, the raw material of the shell structure may include: a glass substrate.

[0116] The present embodiment does not specifically limit the components of the glass substrate.

[0117] For example, the glass substrate may include, but is not limited to, at least one of silicate glass, aluminosilicate glass, phosphate glass, aluminophosphate glass, borate glass, and aluminate glass.

[0118] For example, the glass substrate may include, but is not limited to, a Na-Al-Si glass system, a Li-Al-Si glass system, a Na-Zn-Al-Si glass system, and the like.

[0119] Exemplarily, the glass substrate may include silicon dioxide (SiO2), aluminum oxide (Al2O3), zinc oxide (ZnO), lithium oxide (Li2O), sodium oxide (Na2O), potassium oxide (K2O), zirconium oxide (ZrO2), and bismuth oxide (Sb2O3).

[0120] The embodiments of the present application are merely exemplary introductions of the components of several glass substrates, and the above components do not constitute specific limitations.

[0121] In the embodiment of the present application, the raw materials may further include: a photosensitive material, wherein the photosensitive material includes: a nucleating metal.

[0122] In the embodiment of the present application, the photosensitive material is defined as a photosensitive material in which a nucleation metal in the form of a compound is converted into an atomic metal under the action of a light signal. The atomic metal may also be referred to as a metal atom in the embodiment of the present application.

[0123] A relatively stable microscopic or submicroscopic aggregate of metal atoms formed by physical or chemical bonding. Stable microscopic or submicroscopic aggregates may be referred to as metal clusters in the embodiments of this application. Exemplary metal clusters may include: Cu clusters, Ag clusters, Au clusters, etc.

[0124] In the embodiments of the present application, a nucleating metal is defined as a metal that has good reduction properties and is easily precipitated from a compound to form free atoms. Exemplary nucleating metals include, but are not limited to, copper (Cu), silver (Ag), and gold (Au).

[0125] In the embodiment of the present application, the raw materials also include: photosensitive materials. Under the irradiation of light signals, the nucleation metal in the form of a compound in the photosensitive material can be converted into an atomic nucleation metal, and the atomic nucleation metal can aggregate to form metal clusters. Therefore, a local exposure method can be used to reduce the nucleation metal in the form of a compound in the exposure area to an atomic nucleation metal to form a metal cluster. In the subsequent overall heat treatment process, the part with the metal cluster is more likely to crystallize to form a second area with a small transmittance, thereby obtaining a first area and a second area with different transmittances and integrated formation. The shell structure disclosed in this implementation method can adopt an overall heat treatment method during the generation process, and the warping between the first area and the second area is small.

[0126] As a feasible implementation manner, the photosensitive material may include: a photosensitive compound.

[0127] The photosensitive compound is defined as one that can absorb light signals and release electrons (e-) under the action of light signals. The e- can combine with the nucleating metal in the form of a compound, reducing the nucleating metal in the compound form to free metal atoms.

[0128] For example, the photosensitive compound may include, but is not limited to, cerium oxide (CeO 2 ), cerium trioxide (Ce 2 O 3 ), and the like.

[0129] As a feasible implementation, the photosensitive material may include anions, and the anions may form photosensitive compounds with the nucleation metal.

[0130] Here, a photosensitive compound is defined as a compound that can precipitate metal atoms under the action of a light signal.

[0131] For example, the photosensitive compound may be, but is not limited to, silver bromide (AgBr), silver chloride (AgCl), or silver iodide (AgBr).

[0132] It is worth noting that the embodiments of the present application are merely exemplary introductions of several photosensitive compounds, and the above-mentioned photosensitive compounds do not constitute specific limitations.

[0133] The formation of Ag clusters is described below using photosensitive compounds including AgBr as an example.

[0134] AgBr reacts with light to generate silver atoms (Ag) and bromine vapor (Br2). Br2 exists as a gas, which easily escapes, leaving behind Ag. Ag can form Ag clusters through physical or chemical bonding.

[0135] It is worth noting that the embodiments of this application are merely exemplary introductions of several photosensitive materials. The above-mentioned photosensitive materials do not constitute specific limitations. Any material that can precipitate nucleation metal atoms under the action of a light signal can be used as a photosensitive material and applied in the embodiments of this application.

[0136] In the process of converting raw materials into shell structure, the raw materials need to go through the following processes: melting, local exposure, crystallization / heat treatment, etc. The processes of melting, local exposure, crystallization / heat treatment, etc. will be further explained in the subsequent preparation method.

[0137] For ease of description, the structure before the shell structure is formed is referred to as a glass sheet / raw material. The glass sheet / raw material is divided into an exposed area and an unexposed area. The unexposed area can eventually be converted into the first area of ​​the shell structure, and the exposed area can eventually be converted into the second area of ​​the shell structure.

[0138] As a feasible implementation method, the nucleation metals in the unexposed area all exist in the form of compounds, that is, the unexposed area does not include metal clusters.

[0139] In the implementation method in which the nucleating metals in the unexposed area all exist in the form of compounds. If the raw materials do not include: compound nucleating agents (referring to oxides, fluorides, etc., the same below). During the crystallization heat treatment, the unexposed area may not crystallize. The unexposed area still exists in the form of ordinary glass, that is, the first area includes: ordinary glass. The exposed area can crystallize with metal clusters as crystal nuclei to generate a second area, and the second area includes: microcrystalline glass and metal clusters.

[0140] In an implementation where the nucleating metals in the unexposed regions are all present in the form of compounds, if the raw materials include a compound nucleating agent, during the crystallization heat treatment, the unexposed regions may crystallize to form a first region, in which case the first region comprises glass-ceramics. The exposed regions may crystallize to form a second region, in which the second region comprises glass-ceramics and metal clusters.

[0141] As a feasible implementation method, the nucleation metal in the unexposed area is affected by some unavoidable factors, causing part of the nucleation metal in the unexposed area to precipitate nucleation metal atoms, so that the unexposed area includes metal clusters.

[0142] In an implementation where the unexposed region includes metal clusters, during a crystallization heat treatment, the unexposed region can crystallize using the metal clusters as crystal nuclei to form a first region. The first region can include: glass-ceramics and metal clusters. The exposed region can crystallize to form a second region, wherein the second region includes: glass-ceramics and metal clusters.

[0143] In an implementation method in which metal clusters are included in the unexposed area, the optical signal contributes to the formation of the metal clusters. Therefore, the density of the metal clusters in the exposed area is greater than that in the unexposed area. The crystallinity is positively correlated with the density of the metal clusters. Therefore, the crystallinity of the exposed area is greater than that of the unexposed area. The transmittance of the second area formed by the exposed area is less than the transmittance of the first area formed by the unexposed area. The second area with a smaller transmittance can block the propagation of the interfering optical signal to a certain extent. The first area has a larger transmittance, thereby ensuring that the effective optical signal and the transmitted optical signal are less lost during the process of transmitting through the first area.

[0144] As a feasible implementation method, the raw materials may include: halogen elements. The shell structure formation process requires a melting process.

[0145] In the embodiment of the present application, the melting is carried out in a high-temperature environment, and the raw materials are converted into a molten state in the high-temperature environment, thereby achieving the purpose of uniform mixing of the raw materials.

[0146] In this implementation, the raw materials may include halogen elements. Under high-temperature conditions, halogen elements can provide an acidic / oxidizing atmosphere, thereby preventing the atomic precipitation of nucleation metals in the raw materials, thereby preventing the formation of metal clusters during the melting process. This can reduce the number and density of metal clusters in the unexposed region, lowering the crystallinity of the unexposed region. This results in a higher transmittance for the first region formed by the unexposed region, thereby ensuring minimal loss of the effective light signal and the transmitted light signal during transmission through the first region.

[0147] This completes the description of the shell structure materials.

[0148] The following describes the structure of the housing structure. The embodiment of the present application does not specifically limit the shape of the housing structure. For example, please refer to Figure 4 As a feasible implementation method, the shell structure can have a planar structure. Figure 5 As a feasible implementation method, the shell structure can have a curved surface structure.

[0149] It is worth noting that Figure 4 and Figure 5 The two shell structures are merely exemplarily introduced and do not constitute a specific limitation. In actual application, the shell structure may be, but is not limited to, the two above-mentioned structures.

[0150] Please continue reading Figure 4 and Figure 5 The housing structure includes a first region 1 and a second region 2. The first region 1 and the second region 2 are integrally formed, eliminating any interface between the first region 1 and the second region 2, such as gluing, splicing, or welding. This improves the housing structure's integrity and mechanical properties.

[0151] In the embodiment of the present application, the first region 1 penetrates the shell structure so that the transmitted light signal / effective light signal can only pass through the first region 1 during the process of propagating on both sides of the shell structure, and the loss of the transmitted light signal / effective light signal is small.

[0152] The embodiment of the present application does not specifically limit the shape of the first region 1 .

[0153] For example, see Figure 4 and Figure 5 , the shape of the first region 1 can be: columnar.

[0154] For example, see Figure 6 The shape of the first region 1 can be: stepped.

[0155] For example, see Figure 7, the shape of the first region 1 can be: spherical.

[0156] It is worth noting that Figure 4 、 Figure 5 、 Figure 6 and Figure 7 The shapes of several first areas are merely introduced for example. The shapes of the above-mentioned first areas do not constitute specific limitations. In actual application, the shape of the first area can be designed according to actual needs. The embodiments of this application do not impose too many limitations.

[0157] The embodiment of the present application does not specifically limit the number of the first regions. For example, the number of the first regions can be, but is not limited to, 1, 2, 3, 4, 5, etc.

[0158] As mentioned above, in some feasible implementations, the first region 1 may include: ordinary glass. In some feasible implementations, the first region 1 may also include: micro-ceramic glass.

[0159] In an implementation where the first region includes glass-ceramics, the first region may include: metal clusters.

[0160] In an implementation where the first region includes metal clusters, the density of the metal clusters in the first region is less than the density of the metal clusters in the second region. The crystallinity of the first region is less than the crystallinity of the second region. The first region has a high transmittance, and the loss of the transmitted light signal / effective light signal during transmission through the first region is low.

[0161] The housing structure of the embodiment of the present application further includes at least one second region. The second region has a relatively low transmittance and is used to block interference signals from propagating inside the housing structure.

[0162] Please continue reading Figure 4 、 Figure 5 、 Figure 6 As a feasible implementation method, the second region 2 may penetrate the shell structure, so that the second region can block more interference signals.

[0163] In the implementation method in which the second area penetrates the shell structure, the second area 2 is arranged between adjacent first areas 1. The second area has a smaller transmittance. The second area can block the optical signal from crossing between different first areas, thereby achieving the purpose of blocking interference signals.

[0164] In the implementation manner in which the second region 2 penetrates the shell structure, the embodiment of the present application does not specifically limit the shape 1 of the second region.

[0165] For example, see Figure 4 and Figure 5As a feasible implementation method, the shape of the second area can be columnar.

[0166] For example, see Figure 6 As a feasible implementation method, the shape of the second area can be stepped.

[0167] Please continue reading Figure 7 As a feasible implementation method, the second region 2 can be arranged inside the first region 1, that is, the second region 2 does not penetrate the shell structure / the second region 2 is wrapped by the first region 1.

[0168] In the implementation manner in which the second area is arranged inside the first area, the embodiment of the present application does not specifically limit the shape of the second area.

[0169] For example, see Figure 7 As a feasible implementation method, the shape of the second area can be spherical. Since the first area 1 and the second area 2 have different transmittances, the interference signal will be refracted when it propagates to the second area with a larger contact interface with the first area, thereby achieving the effect of blocking the propagation of the interference signal. The larger the interface between the second area and the first area, the greater the blocking effect on the interference signal. The spherical second area has a larger contact interface with the first area, and the shell structure containing the spherical second area can have a greater blocking effect on the interference signal.

[0170] It is worth noting that Figure 4 、 Figure 5 、 Figure 6 and Figure 7 The shapes of several second regions are merely introduced for example. The shapes of the second regions do not constitute specific limitations. In actual application, the shapes of the second regions can be designed according to requirements. The applicant does not make too many limitations here.

[0171] The embodiment of the present application does not specifically limit the number of the second regions. For example, the number of the second regions can be, but is not limited to, 1, 2, 3, 4, 5, etc.

[0172] As a feasible implementation, in an implementation in which the shell structure includes a plurality of second regions, any two second regions may have the same transmittance.

[0173] As a feasible implementation, in an implementation in which the shell structure includes a plurality of second regions, any two second regions may have different transmittances.

[0174] See also Figure 8 As a feasible implementation method, the shell structure includes: a compressive stress layer 6 and a tensile stress layer 7; the compressive stress layer 6 is arranged on the surface of the tensile stress layer 7.

[0175] The shell structure disclosed in this implementation comprises a compressive stress layer and a tensile stress layer; the compressive stress layer is disposed on the surface of the tensile stress layer. This means that the compressive stress layer on the outer surface is subject to compressive stress, while the tensile stress layer on the inner surface is subject to tensile stress. The presence of the compressive stress layer can prevent or eliminate the formation and extension of surface micro-cracks in the shell structure, thereby improving the mechanical properties of the shell structure.

[0176] See also Figure 9 In order to further improve the blocking effect of the shell structure on interference signals, as a feasible implementation method, the second area 2 may include: at least two sub-areas 21 that are in contact with each other, and the two adjacent sub-areas 21 have different transmittances.

[0177] In this implementation, two adjacent sub-regions 21 have different transmittances, and a refractive / reflective interface 22 can be formed between the two sub-regions 21. When the interference signal propagates to the refractive / reflective interface 22, it will be refracted / reflected, and the interference signal transmitted through the second region will be reduced, thereby achieving the purpose of blocking the interference signal.

[0178] The embodiment of the present application does not specifically limit the number of sub-regions 21 included in each second region. For example, the number of sub-regions included in each second region can be, but is not limited to, 1, 2, 3, 4, 5, etc.

[0179] The embodiment of the present application does not specifically limit the shape of the sub-region 21. For example, the shape of the sub-region can be, but is not limited to, a columnar shape, a stepped shape, a spherical shape, etc.

[0180] The larger the width of the second area, the greater the blocking effect of the second area on the interference signal. In order to ensure that the shell structure has a greater blocking effect on the interference signal, as a feasible implementation method, the width of the second area is greater than or equal to the set value.

[0181] The embodiment of the present application does not specifically limit the numerical value of the set value. Exemplary set values ​​may be 1 μm, 2 μm, etc.

[0182] Please continue reading Figure 4 As a feasible implementation method, protrusions 3 and / or grooves 4 can be formed on the surface of the shell structure.

[0183] The embodiment of the present application does not specifically limit the shape and size of the protrusion or groove, and the shape and size of the protrusion or groove can be set according to needs.

[0184] As a feasible implementation, the protrusion 3 / groove 4 can cover the entire surface of the shell structure. As a feasible implementation, the protrusion 3 / groove 4 can cover a portion of the surface of the shell structure.

[0185] For example, as a feasible implementation, the protrusions 3 and grooves 4 may only cover the surface of the first area.

[0186] For example, as a feasible implementation, the protrusions 3 and grooves 4 may only cover the surface of the second area.

[0187] For example, as a feasible implementation, the protrusions 3 and grooves 4 may cover the surfaces of the first area and the second area.

[0188] Please continue reading Figure 4 In order to block more interference signals, in the implementation mode in which the second region penetrates the shell structure, a light blocking layer 5 can be provided in the groove on the surface of the second region.

[0189] In the embodiment of the present application, the light-blocking layer 5 is defined as a material layer having a transmittance lower than that of the second region, and may be, but is not limited to, a material layer such as light-blocking ink or polyethylene (polyvinyl chloride).

[0190] In this embodiment, a light-blocking layer 5 is disposed within the groove on the surface of the second region. Adjacent first regions include the light-blocking layer 5 and the second region 2. Because the transmittance of the light-blocking layer 5 is lower than that of the second region, the light-blocking layer 5 can block more interference signals. Therefore, the housing structure disclosed in this embodiment can block more interference signals.

[0191] In the implementation of forming protrusions / grooves on the surface of the shell structure, as a feasible implementation, the protrusions and grooves form Fresnel patterns.

[0192] In this embodiment, the Fresnel pattern is defined as a surface consisting of a series of sawtooth-shaped grooves with an elliptical arc at the center. Each groove has a different angle from the adjacent grooves, but each pit can concentrate the light signal to form a central focus.

[0193] In this implementation, the Fresnel patterns formed by the protrusions / grooves on the surface of the shell structure can play a focusing role. By designing the Fresnel patterns, the central focus formed on the Fresnel patterns can fall on the optical detector, thereby improving the signal-to-noise ratio of the effective light signal.

[0194] By designing the Fresnel pattern on the surface of the shell structure, it is no longer necessary to use an additional polyethylene glycol terephthalate (PET) film to realize the Fresnel pattern, and the stacking size of the shell structure can be reduced.

[0195] In this implementation, the Fresnel patterns formed by the protrusions / grooves on the surface of the shell structure are integrally formed with the first area / second area, so that there are no process interfaces such as gluing, splicing, and welding between the first area / second area and the Fresnel patterns, thereby making the shell structure have better integrity and better mechanical properties.

[0196] The present application also discloses a method for preparing a shell structure. Figure 10 , the preparation method may include:

[0197] S101: exposing a portion of a glass plate.

[0198] In the embodiment of the present application, the raw materials used for the glass plate include: photosensitive material, the photosensitive material includes: nucleating metal; under the action of the light signal, the nucleating metal in the form of a compound inside the photosensitive material is converted into the nucleating metal in the atomic state, and the nucleating metal in the atomic state is used to form metal clusters.

[0199] As a feasible implementation method, the raw materials can be melted to obtain glass plates. The melting method commonly used in the art can be adopted and is not specifically limited in the embodiments of this application.

[0200] For example, the raw materials may be sequentially subjected to processes such as continuous melting, down-drawing, casting, molding, and cutting to finally obtain a glass sheet of a desired size.

[0201] There are several ways to achieve partial exposure of glass sheets.

[0202] As a feasible implementation method, light signal irradiation can be used to achieve local exposure of the glass plate.

[0203] The process of partially exposing a glass sheet using light signal illumination can be as follows: a mask reticle is placed on one side of the glass sheet. The mask reticle has a light-transmitting window; the light signal passes through the mask window to illuminate a portion of the glass sheet, thereby achieving partial exposure of the glass sheet.

[0204] In this implementation, a partial exposure of the glass sheet is achieved using a mask. The resulting shape / size of the second region is consistent with the shape / size of the mask window. By using masks with windows of different shapes / sizes, the shape / size of the second region can be flexibly configured.

[0205] As a feasible implementation method, laser irradiation can be used to partially illuminate the glass plate. The specific implementation process: The size and shape of the exposure area can be controlled by controlling the laser path. This process does not require the assistance of a mask, which can reduce the cost of the shell structure to a certain extent.

[0206] The embodiments of the present application are merely exemplary introductions of implementation methods for partial exposure of two glass plates, and the above implementation methods do not constitute specific limitations.

[0207] The embodiment of the present application does not specifically limit the wavelength band of the optical signal used in the partial exposure stage. For example, the wavelength band of the optical signal can be: 390nm-780nm, greater than 780nm, less than 390nm, etc.

[0208] The embodiment of the present application does not specifically limit the intensity of the optical signal, and the intensity of the optical signal can be selected according to needs.

[0209] Typically, the intensity of an optical signal can be quantitatively characterized by energy flow density, which is defined as the energy or power generated by the optical signal within a unit space.

[0210] As a feasible implementation, the energy flux density of the optical signal is less than or equal to the damage threshold of the glass plate, so that the internal structure of the exposure area is not damaged during the local exposure stage.

[0211] The present embodiment does not impose specific limitations on the exposure time, and an appropriate exposure time can be selected based on needs. Within a certain range, the number of metal atoms in the exposure area is positively correlated with the exposure time, while the number of metal atoms in the exposure area is inversely correlated with the transmittance of the resulting second area. To achieve a lower transmittance in the second area, the exposure time can be extended.

[0212] The embodiment of the present application does not specifically limit the shape and size of the exposure area. In the implementation method of realizing local exposure with the help of a mask, the shape / size of the exposure area can be adjusted by adjusting the shape / size of the mask window.

[0213] In the implementation method of using laser to achieve local exposure, the shape / size of the exposure area can be adjusted by adjusting the laser path.

[0214] As a feasible implementation method, a patterned exposure area can be achieved by selecting a suitable laser (time, intensity, laser spot size, and wavelength of the light signal).

[0215] For the photosensitive material, please refer to the above description of the photosensitive material, which will not be repeated here.

[0216] S102: performing a nucleation heat treatment on the exposed glass plate to form metal clusters in the exposed area of ​​the glass plate.

[0217] In the embodiment of the present application, the nucleation heat treatment stage includes the stage of metal cluster growth, which can be simply referred to as the nucleation stage.

[0218] The embodiment of the present application does not specifically limit the temperature of the nucleation heat treatment. For example, the temperature of the nucleation heat treatment can be: 480°C, 490°C, 500°C, 510°C, 520°C, or 530°C.

[0219] The embodiment of the present application does not impose any specific limitation on the holding time of the nucleation heat treatment. For example, the holding time of the nucleation heat treatment can be: 0.5h, 1h, 1.5h, 3h, 4h, or 8h.

[0220] As a feasible implementation method, during the nucleation heat treatment, metal clusters may not be formed in the unexposed areas.

[0221] As a feasible implementation method, during the nucleation heat treatment, the unexposed areas can form: metal clusters.

[0222] In the implementation method of forming metal clusters in the unexposed area, since the light signal helps to form the metal clusters, the density of metal atoms in the exposed area is greater than the density of metal atoms in the unexposed area.

[0223] The following uses photosensitive materials including CeO2, Ce2O3, and Ag2O as examples to illustrate the formation process of metal clusters:

[0224] The valence of metal cerium in CeO2 and Ce2O3 is +4 and +3. The +4 valence metal cerium can be expressed as Ce 4 +. +3 valence metal cerium can be expressed as Ce 3 +. Ce 3 + can produce strong absorption of ultraviolet light, Ce 3 + will release e- after absorbing ultraviolet light. e- can be adsorbed on Ce 4 +Nearby.

[0225] During the nucleation heat treatment process, the metallic silver (Ag+) in Ag2O can diffuse and react with Ce 4 + combines with the e- near it, converting Ag+ into atomic metallic silver (Ag).

[0226] When the temperature is further increased, Ag atoms will continue to adsorb Ag+ and e-, and Ag can form relatively stable Ag clusters through physical or chemical binding forces.

[0227] S103: Crystallization heat treatment The glass plate after the nucleation treatment is used to obtain a shell structure.

[0228] In the embodiment of the present application, the shell structure includes: a first area and a second area, the second area is obtained by crystallizing the glass plate in the exposed area; the first area is obtained by crystallizing the glass plate in the non-exposed area, and the second area includes: microcrystalline glass and metal clusters.

[0229] In the embodiment of the present application, the stage of crystallization heat treatment is the stage of glass-ceramics growth. In the embodiment of the present application, the stage of crystallization heat treatment can be simply referred to as the crystallization stage.

[0230] In an implementation where the nucleating metals in the unexposed regions after the nucleation stage are all present in the form of compounds, if the raw materials do not include a compound nucleating agent, the unexposed regions still exist in the form of ordinary glass, i.e., the first region comprises ordinary glass. The exposed regions can be crystallized using metal clusters as crystal nuclei to form a second region, wherein the second region comprises glass-ceramics and metal clusters.

[0231] In an implementation where the nucleating metals in the unexposed regions after the nucleation stage are all present in the form of compounds, if the raw materials include a nucleating agent, during the crystallization stage, the unexposed regions can be crystallized using the compound nucleating agent as nuclei to form a first region comprising glass-ceramics. The exposed regions can then be crystallized to form a second region comprising glass-ceramics and metal clusters.

[0232] In an implementation where metal clusters are included in the unexposed region after the nucleation stage, during the crystallization stage, the unexposed region can be crystallized to form a first region comprising glass-ceramics and metal clusters. The exposed region can be crystallized to form a second region comprising glass-ceramics and metal clusters.

[0233] The light signal promotes the formation of metal clusters, resulting in a higher density of metal clusters in the exposed area than in the unexposed area. Crystallinity is positively correlated with the density of metal clusters, resulting in a higher crystallinity in the exposed area than in the unexposed area. The transmittance of the second region formed by the exposed area is lower than that of the first region formed by the unexposed area.

[0234] The present embodiment does not specifically limit the treatment temperature of the crystallization stage. For example, the heat treatment temperature of the crystallization stage can be: 580°C, 590°C, 600°C, 610°C, 620°C, 630°C.

[0235] The embodiment of the present application does not specifically limit the holding time of the crystallization stage. For example, the holding time of the crystallization stage can be: 0.5h, 1h, 1.5h, 3h, 4h, 8h.

[0236] In this implementation, a glass plate is used to form a shell structure, and the glass plate includes: a photosensitive material. Under the action of a light signal, the nucleation metal in the form of a compound inside the photosensitive material is converted into an atomic nucleation metal, and the atomic nucleation metal can aggregate to form a metal cluster. Therefore, a local exposure method of a light signal can be used to form a metal cluster in the exposed area. In the subsequent overall heat treatment process, the exposed area with the metal cluster is easy to crystallize to form a second area with a small transmittance. The second area with a small transmittance can block the propagation of interference signals inside the shell structure to a certain extent, thereby achieving the purpose of reducing interference signals. The preparation method disclosed in this implementation can adopt an overall heat treatment method to obtain a first area with a small / zero crystallinity and a second area with a large crystallinity. The warping between the first area and the second area of ​​the prepared glass plate is small.

[0237] As a feasible implementation method, the preparation method also includes:

[0238] S104: Chemically strengthen the shell structure so that the shell structure includes: a compressive stress layer and a compressive stress layer.

[0239] Wherein, the compressive stress layer is arranged on the surface of the tensile stress layer.

[0240] The shell structure may include a compressive stress layer and a compressive stress layer by using a chemical strengthening method commonly used in the art. As a feasible implementation method, the shell structure may be chemically strengthened by using an ion exchange method.

[0241] For example, the shell structure can be placed in a potassium nitrate salt melt or salt solution / sodium nitrate and sodium nitrate mixed melt or salt solution for ion exchange. The sodium ions (Na+) on the surface of the shell structure can interact with the potassium ions (K+) in potassium nitrate. This allows the Na+ on the surface of the shell structure to be replaced by K+ with a larger ionic radius, thereby achieving chemical strengthening.

[0242] A volume difference is formed on the surface of the shell structure before and after chemical strengthening. This volume difference forms a compressive stress layer within a certain depth range of the shell structure. The existence of the compressive stress layer can prevent / eliminate the generation and extension of surface micro-cracks of the shell structure, thereby achieving the purpose of improving the mechanical properties of the shell structure.

[0243] The present embodiment does not specifically limit the heat treatment temperature of the ion interaction process. For example, the heat treatment temperature of the ion interaction process can be: 350°C, 400°C.

[0244] The embodiments of the present application do not specifically limit the heat treatment time of the ion interaction process, and the heat treatment time of the sub-interaction process is: 0.5h, 1h, 1.5h, 3h, 4h, and 8h.

[0245] As a feasible implementation, a second region comprising multiple subregions can be formed through a combination of multiple exposures and heat treatments, with adjacent subregions having different transmittances, thereby forming a refractive / reflective interface between the two subregions. When the interference signal propagates to the refractive / reflective interface, it will be refracted / reflected, thereby reducing the interference signal transmitted through the second region.

[0246] As a feasible implementation method, protrusions / grooves may be formed on the surface of the shell structure.

[0247] The embodiments of the present application do not specifically limit the implementation method for forming the protrusions / grooves. For example, as a feasible implementation method, the protrusions / grooves can be formed on the surface of the shell structure by dry etching. As a feasible implementation method, the protrusions / grooves can be formed on the surface of the shell structure by wet etching. The etching solution used in the wet etching can include, but is not limited to, hydrofluoric acid (HF).

[0248] The preparation disclosed in the embodiments of this application is described below with reference to specific examples.

[0249] Example 1:

[0250] (1) Melting: Please refer to Figure 11 In (1), raw materials (mass fraction by weight): SiO2 (77.18%), Al2O3 (5%), ZnO (1.5%), Li2CO3 (9%), Na2CO3 (2.5%), K2CO3 (4%), ZrO2 (0.5%), Sb2O3 (0.2%), Ag2O (0.1%), and CeO2 (0.02%) are measured. The raw materials are melted, where melting may include continuous melting, down-drawing, casting, molding, and cutting, to obtain a glass sheet 111 of suitable dimensions.

[0251] (2) Please refer to Figure 11 In step (2), the mask B is placed on one side of the glass plate 111 .

[0252] (3) Local exposure: Use ultraviolet light A in the 290nm-330nm band in combination with mask B to partially expose the glass plate 111. Figure 11 In (3), the glass plate is formed into: exposed area 111 (1) and unexposed area 111 (2). Metal atoms (not shown in the figure) are precipitated in the exposed area 111 (1).

[0253] (4) Nucleation: The glass plate obtained in (3) is heated to about 500°C, kept warm, and then annealed. The metal atoms in the exposed area 111 (1) are combined into metal clusters.

[0254] (5) Crystallization: The glass plate obtained in (4) is heated to about 675°C, kept warm, and then cooled in the furnace; the exposed area 111 (1) is crystallized with the metal clusters as crystal nuclei, and the unexposed area 111 (2) remains unchanged. The shell structure obtained can be referred to Figure 11 In (4), the shell structure may include: a first area 1 and a second area 2.

[0255] (6) Polish the shell structure.

[0256] (7) The shell structure is chemically strengthened in a potassium nitrate molten liquid or salt solution at 450°C. The structure of the shell structure after chemical strengthening can be referred to Figure 11 The shell structure after chemical strengthening includes: a compressive stress layer 6 and a tensile stress layer 7.

[0257] (8) The chemically strengthened shell structure is subjected to coating and other processing.

[0258] Example 2:

[0259] (1) Melting: Please refer to Figure 12 In (1), raw materials (by weight): SiO2 (76%), Al2O3 (5%), ZnO (1.7%), Li2CO3 (9%), Na2CO3 (3.5%), K2CO3 (4%), ZrO2 (0.5%), Sb2O3 (0.2%), Ag2O (0.08%), and CeO2 (0.02%) were weighed and melted to obtain a glass plate 121.

[0260] (2) Partial exposure: Please refer to Figure 12 In (2), laser D is used to partially illuminate the glass plate 121, and the glass plate is formed into an exposed area 121 (1) and an unexposed area 121 (2). Metal atoms (not shown in the figure) are precipitated in the exposed area 121 (1).

[0261] (3) Nucleation: The glass plate obtained in (2) is heated to about 500°C, kept warm, and then annealed. The metal atoms in the exposed area 121 (1) are combined into metal clusters.

[0262] (4) Crystallization: The glass plate obtained in (3) is heated to about 675°C, kept warm, and then cooled in the furnace; the exposed area 121 (1) crystallizes with the metal clusters as crystal nuclei, and the unexposed area 121 (2) does not change, thereby obtaining a shell structure. The structure of the shell structure can be referred to Figure 12 In (3), the shell structure may include: a first area 1 and a second area 2.

[0263] (5) Polish the shell structure.

[0264] (6) The shell structure is chemically strengthened at 360°C in a 90% potassium nitrate-10% sodium nitrate melt to obtain a chemically strengthened shell structure. The structure of the chemically strengthened shell structure can be found in Figure 12 The shell structure after chemical strengthening includes: a compressive stress layer 6 and a tensile stress layer 7.

[0265] Example 3:

[0266] (1) Melting: Please refer to Figure 12 In (1), raw materials (by weight): SiO2 (70%), Al2O3 (10.5%), ZnO (1%), Li2CO3 (9%), Na2CO3 (3.5%), NaF (1%), K2CO3 (2%), ZrO2 (1%), AgCl (1%), and CeO2 (1%) were weighed and melted to obtain a glass plate 121.

[0267] (2) Partial exposure: Please refer to Figure 12 In (2), laser D is used to partially illuminate the glass plate 121, and the glass plate is formed into an exposed area 121 (1) and an unexposed area 121 (2). Metal atoms (not shown in the figure) are precipitated in the exposed area 121 (1).

[0268] (3) Nucleation: The glass plate obtained in (2) is heated to about 500°C, kept warm, and then annealed. The metal atoms in the exposed area 121 (1) are combined into metal clusters.

[0269] (4) Crystallization: The glass plate obtained in (3) is heated to about 675°C, kept warm, and then cooled in the furnace; the exposed area 121 (1) crystallizes with the metal clusters as crystal nuclei, and the unexposed area 121 (2) does not change, thereby obtaining a shell structure. The structure of the shell structure can be referred to Figure 12 In (3), the shell structure may include: a first area 1 and a second area 2.

[0270] (5) The shell structure is chemically strengthened in a molten solution of 80% potassium nitrate salt and 20% sodium nitrate salt at 350°C. The structure of the chemically strengthened shell structure can be referred to. Figure 12 The shell structure after chemical strengthening includes: a compressive stress layer and a tensile stress layer.

[0271] (6) The shell structure obtained in (5) is subjected to processing such as coating.

[0272] The shell structure of the embodiments of the present application can be prepared by the methods of the following embodiments of the present application. In addition, it can also be prepared by other methods. The preparation methods of the embodiments of the present application are merely one or more preparation methods of the shell structure of the present application and should not be understood as a limitation on the shell structure disclosed in the embodiments of the present application.

[0273] The embodiment of the present application further discloses a housing, which includes: at least one housing structure disclosed in the embodiment of the present application.

[0274] As a feasible implementation method, the multiple shell structures are split structures, and the multiple shell structures can be connected together by bonding, welding, splicing, etc.

[0275] As a feasible implementation method, the multiple shell structures can be an integrated structure.

[0276] As a feasible implementation method, the shell may further include: a cover bottom layer, which is arranged on the surface of the shell structure.

[0277] In the embodiment of the present application, the cover bottom layer can be obtained by light curing or heat curing of ink having at least one of light reflecting and light absorbing properties. For example, the cover bottom layer can be obtained by light curing or heat curing of black ink or white ink.

[0278] In an implementation in which the cover bottom layer is arranged on the shell structure, if the second region penetrates the shell structure, the cover bottom layer is arranged to avoid the first region of the shell structure.

[0279] For detailed description of the features that are the same between this embodiment and the above embodiment, please refer to the above embodiment, which will not be repeated here.

[0280] The present application also discloses an electronic device, which may include: the housing structure disclosed in the present application, a light emitter, and a light receiver. The light emitter is arranged on one side of the housing structure, close to the first area, and the projection of the light emitter on the housing structure coincides with the first area. The light emitter is used to emit a light signal to the first area. The light receiver is arranged on the same side of the housing structure as the light emitter and close to the first area. The projection of the light receiver on the housing structure coincides with the first area. The light receiver is used to receive the light signal (effective light signal) that is transmitted through the first area and reflected into the first area.

[0281] It should be understood that in the embodiments of the present application, the overlap of the projection of the light emitter on the housing structure with the first area can be understood as meaning that the light signal emitted by the light emitter can be incident on the first area and at least partially pass through the first area. Similarly, in the embodiments of the present application, the overlap of the projection of the light receiver on the housing structure with the first area can be understood as meaning that the light receiver can receive the light signal emitted by the light emitter and reflected into the first area.

[0282] In an implementation in which the second area is located inside the first area, the second area is located between a projection of the light emitter on the first area and a projection of the light receiver on the first area.

[0283] In an implementation manner in which the second region penetrates the shell structure, the second region is located between adjacent first regions.

[0284] In the implementation method in which the inner surface of the shell structure includes Fresnel patterns, as a feasible implementation method, the Fresnel patterns can be used to achieve a focusing effect, so that the light angle of the light signal emitted by the light emitter is smaller, the light signal emitted by the light emitter is more focused, and more light signals can reach the target object.

[0285] As a feasible implementation method, Fresnel patterns can be used to achieve a focusing effect, narrowing the light angle of the effective signal and allowing the optical receiver to receive more effective signals.

[0286] As a feasible implementation method, the electronic device may further include: a cover bottom layer, which is arranged on the surface of the housing structure.

[0287] In an implementation in which the cover bottom layer is arranged on the shell structure, if the second region penetrates the shell structure, the cover bottom layer is arranged to avoid the first region of the shell structure.

[0288] For detailed description of the features that are the same between this embodiment and the above embodiment, please refer to the above embodiment, which will not be repeated here.

[0289] The electronic device disclosed in the embodiment of this application is further described below with reference to specific data:

[0290] Table 1 shows the data generated by the electronic device disclosed in a feasible embodiment.

[0291] Table 1

[0292]

[0293]

[0294] The PPG signal consists of a direct current (DC) component and an alternating current (AC) component. The DC component reflects the characteristics of non-pulsating tissues, such as epithelial tissue, bone, venous blood, and non-pulsating arterial blood. The AC component is generated by pulsating arterial blood. The ratio of the AC to DC components of the PPG signal at a specific wavelength is also called the perfusion index (PI) for that wavelength.

[0295] (1) From the light leakage data in Table 1, it can be seen that the light leakage (IR, R, G) phenomenon in Examples 4, 5 and 6 is alleviated compared with the comparative example.

[0296] (2) By comparing the light leakage data (IR, R, G) of Example 4 and Example 5, it can be seen that increasing the width of the second region reduces light leakage, and increasing the width of the second region can improve the blocking effect of interference signals.

[0297] (3) Reducing the width of the second region increases light leakage and reduces the perfusion rate, which can reduce the deterioration of power consumption to a certain extent. Therefore, the width of the second region can be selected appropriately according to the needs.

[0298] (4) Example 4 and Example 5 use the same housing structure, with the difference being the difference in transmittance in the second region. By comparing the light leakage data (IR, R, G) of Example 4 and Example 5, it can be found that transmittance has a greater impact on infrared light leakage.

[0299] (5) By comparing the light leakage data (IR, R, G) and PI of Examples 4, 5, and 6, it can be seen that PI is related to transmittance. The smaller the transmittance of the second region, the better the PI value of the electronic device (the larger the absolute value).

[0300] Mentioning "embodiments" and "implementation methods" in this application means that the specific features, structures or characteristics described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of phrases in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments. In addition, it should be understood that the features, structures or characteristics described in the various embodiments of this application can be arbitrarily combined to form another embodiment that does not deviate from the spirit and scope of the technical solution of this application, provided that there is no contradiction between them.

[0301] Finally, it should be noted that the above implementation modes are only used to illustrate the technical solutions of the present application and are not limiting. Although the present application has been described in detail with reference to the above preferred implementation modes, ordinary technicians in this field should understand that the technical solutions of the present application can be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A housing structure, characterized in that: include: First and second regions; The first region and the second region are integrally formed, and the transmittance of the first region is greater than the transmittance of the second region; The second region includes: glass-ceramics and metal clusters; The first region does not include the metal clusters, or the density of the metal clusters in the first region is lower than the density of the metal clusters in the second region.

2. The housing structure according to claim 1, wherein: The metal clusters include: one or a mixture of Ag clusters, Cu clusters, and Au clusters.

3. The housing structure according to claim 1 or 2, characterized in that: The raw materials used in the shell structure include: photosensitive material, and the photosensitive material includes: nucleating metal; under the action of light signals, the nucleating metal in the form of a compound inside the photosensitive material is converted into nucleating metal in an atomic state, and the nucleating metal in the atomic state is used to form the metal cluster.

4. The housing structure according to claim 3, wherein: The photosensitive material further includes: a photosensitive compound; the photosensitive compound includes a compound that releases electrons under the action of a light signal.

5. The housing structure according to claim 4, characterized in that: The photosensitive material further includes anions, which form photosensitive compounds with the nucleation metal. The photosensitive compound includes a compound of the nucleation metal that precipitates atomic state under the action of a light signal.

6. The housing structure according to claim 1 or 2, characterized in that: The raw materials used for the shell structure include: halogen elements.

7. The housing structure according to claim 1 or 2, characterized in that: The first region includes: the microcrystalline glass and ordinary glass.

8. The housing structure according to claim 1 or 2, characterized in that: The second region extends through the housing structure.

9. The housing structure according to claim 1 or 2, characterized in that: The surface of the shell structure includes: a plane, a curved surface, a protrusion, and a groove.

10. The housing structure according to claim 9, characterized in that: A light-blocking layer is provided in the groove on the surface of the second region, and the transmittance of the light-blocking layer is lower than the transmittance of the second region.

11. The housing structure according to claim 10, characterized in that: The protrusions and the grooves form Fresnel patterns.

12. The housing structure according to claim 1 or 2, characterized in that: The shell structure includes: a compressive stress layer and a tensile stress layer; The compressive stress layer is arranged on the surface of the tensile stress layer.

13. The housing structure according to claim 1 or 2, characterized in that: The second region includes a plurality of sub-regions in contact with each other, and adjacent sub-regions have different transmittances.

14. The housing structure according to claim 1 or 2, characterized in that: The width of the second area is greater than or equal to a set value.

15. The housing structure according to claim 1 or 2, characterized in that: The shell structure includes: N second regions, where N is greater than or equal to 2, and the transmittances of any two second regions are the same, or the transmittances of any two second regions are different.

16. A method for preparing a shell structure, characterized in that: include: exposing a partial area of ​​a glass plate, wherein the glass plate is made of a photosensitive material including a nucleating metal; wherein the nucleating metal in the form of a compound within the photosensitive material is converted into an atomic nucleating metal under the action of a light signal, and the atomic nucleating metal is used to form metal clusters; performing a nucleation heat treatment on the exposed glass sheet to form metal clusters in the exposed area of ​​the glass sheet; The glass plate after crystallization heat treatment and nucleation treatment obtains a shell structure, which includes: a first area and a second area, the second area is obtained by crystallizing the glass plate in the exposed area; the first area is obtained by crystallizing the glass plate in the non-exposed area, and the second area includes: microcrystalline glass and metal clusters.

17. The preparation method according to claim 16, characterized in that The step of exposing a partial area of ​​the glass sheet comprises: A mask is provided on one side of the glass plate, wherein the mask comprises: a window; The optical signal passes through the window of the mask to illuminate a partial area of ​​the glass plate.

18. The preparation method according to claim 16, characterized in that The step of exposing a portion of the glass plate is specifically as follows: Laser is used to illuminate a portion of the glass sheet.

19. The preparation method according to any one of claims 16 to 18, characterized in that: The energy flux density of the light signal used in the exposure process is less than or equal to the damage threshold of the glass plate.

20. The preparation method according to any one of claims 16 to 18, characterized in that: After the step of heat-treating the exposed glass plate to obtain a shell structure, the preparation method further comprises: The shell structure is chemically strengthened so that a compressive stress layer is generated on the surface of the shell structure, and the compressive stress layer is arranged on the surface of the tensile stress layer.

21. A housing, characterized in that: The invention comprises at least one housing structure according to any one of claims 1 to 15.

22. An electronic device, characterized in that: include: A light emitter, a light receiver and a housing structure according to any one of claims 1 to 15; The housing structure includes: a first area and a second area; the light emitter is used to emit a light signal that transmits the first area, and the light receiver is used to receive the light signal that transmits the first area; The second area is located between a projection of the light receiver on the first area and a projection of the light emitter on the first area.

23. The electronic device according to claim 22, wherein: The electronic device further comprises: a cover bottom layer; the cover bottom layer is arranged on the inner surface of the housing structure, and the cover bottom layer is arranged to avoid the projection of the light receiver / the light emitter on the first area.

Citation Information

Patent Citations

  • Optical detector, detection module and detection device

    CN215867092U