Electronic package and method of making the same

Abstract

The present application relates to an electronic package and a manufacturing method thereof, which integrates a first antenna structure and a second antenna structure on a package module, and the radio frequency of the first antenna structure is different from that of the second antenna structure, so that the electronic package can emit / receive different antenna signals according to requirements, so that the electronic product using the electronic package can receive / transmit signals of required frequencies, and the antenna function of the electronic product is improved.

Description

Technical Field

[0001] This invention relates to an electronic package, and more particularly to an electronic package with an antenna structure and its manufacturing method. Background Technology

[0002] Currently, wireless communication technology is widely used in various consumer electronics products (such as mobile phones and tablets) to facilitate the reception and transmission of various wireless signals. Furthermore, to meet the portability and internet access convenience requirements of consumer electronics products, the manufacturing and design of wireless communication modules are evolving towards lighter, thinner, shorter, and smaller designs. Among these, patch antennas are widely used in the wireless communication modules of electronic products due to their small size, light weight, and ease of manufacturing.

[0003] Currently, 5G-related application technologies will be fully commercialized in the future. Its application frequency range is approximately between 1GHz and 1000GHz in high-frequency bands. Its commercial application model is 5G combined with 4G LTE, and outdoor cellular base stations are set up to cooperate with small base stations located indoors. Therefore, 5G mobile communication will use a large number of antennas in the base station to meet the requirements of high-capacity, fast transmission and low latency of the 5G system.

[0004] Figure 1 This is a 3D schematic diagram of a known wireless communication module. (Example:) Figure 1 As shown, the wireless communication module 1 includes: a substrate 10, a plurality of electronic components 11 disposed on the substrate 10, an antenna structure 12, and a packaging material 13. The substrate 10 is a circuit board and is rectangular. The electronic components 11 are disposed on the substrate 10 and electrically connected to the substrate 10. The antenna structure 12 is planar and has an antenna body 120 and a wire 121. The antenna body 120 is electrically connected to the electronic components 11 through the wire 121. The packaging material 13 covers the electronic components 11 and part of the wire 121.

[0005] However, it is known that the wireless communication module 1 can only be configured with a single antenna structure 12, which limits the antenna function of the wireless communication module 1. As a result, the wireless communication module 1 cannot provide the electrical functions required to run the 5G system, and it is difficult to meet the antenna operation requirements of the 5G system.

[0006] Therefore, overcoming the problems of the aforementioned known technologies has become an urgent issue that needs to be addressed. Summary of the Invention

[0007] In view of the aforementioned drawbacks of the known art, the present application provides an electronic package, comprising: a package module, having a plurality of feed lines arranged inside, wherein the plurality of feed lines define a first antenna layer and a second antenna layer; an insulating spacer, disposed on a portion of a surface of the package module; a first antenna body, disposed on the insulating spacer at a position corresponding to the first antenna layer, and such that the first antenna body and the first antenna layer are located on opposite sides of the insulating spacer, so as to form a first antenna structure with the first antenna body and the first antenna layer; and a second antenna body, disposed on a portion of a surface of the package module at a position corresponding to the second antenna layer, and such that the second antenna body is kept at a distance from the second antenna layer, so as to form a second antenna structure with the second antenna body and the second antenna layer.

[0008] The present application also provides a method for manufacturing an electronic package, comprising: providing a package module, having a plurality of feed lines arranged inside, wherein the plurality of feed lines define a first antenna layer and a second antenna layer; disposing an insulating spacer on a portion of a surface of the package module; forming a first antenna body on the insulating spacer at a position corresponding to the first antenna layer, and such that the first antenna body and the first antenna layer are located on opposite sides of the insulating spacer, so as to form a first antenna structure with the first antenna body and the first antenna layer; and forming a second antenna body on a portion of a surface of the package module at a position corresponding to the second antenna layer, and such that the second antenna body is kept at a distance from the second antenna layer, so as to form a second antenna structure with the second antenna body and the second antenna layer.

[0009] In the aforementioned electronic package and method, the first antenna structure has an applicable frequency of 24-52 GHz.

[0010] In the aforementioned electronic package and method, the first antenna body and the first antenna layer transmit signals in a coupled manner.

[0011] In the aforementioned electronic package and method, the insulating spacer is a dielectric layer.

[0012] In the aforementioned electronic package and method, the insulating spacer has a dielectric constant less than 3.

[0013] In the aforementioned electronic package and method, the second antenna structure has an applicable frequency of 410-7125 MHz.

[0014] In the aforementioned electronic package and method, the second antenna body and the second antenna layer transmit signals in a coupled manner.

[0015] In the aforementioned electronic package and the manufacturing method thereof, the packaging module includes at least one electronic component and a covering layer covering the electronic component, so that the second antenna body and the second antenna layer are located on opposite sides of the covering layer. For example, the dielectric constant of the covering layer is less than 3.7. Alternatively, the packaging module further includes a plurality of conductive columns embedded in the covering layer, and a carrier structure and a circuit structure arranged on opposite sides of the covering layer to be electrically connected to each other through the plurality of conductive columns, so that the carrier structure is provided with the first antenna layer, and the circuit structure is provided with the second antenna layer, and the insulating spacer and the second antenna body are arranged on a surface of the carrier structure.

[0016] As can be seen from the above, in the electronic package and the manufacturing method thereof, the first antenna structure and the second antenna structure are integrated on the packaging module by using the insulating spacer, and the radio frequency of the first antenna structure is different from that of the second antenna structure, so that the electronic component can emit / receive different antenna signals as required, so that the electronic product using the electronic package can transmit / receive signals of the required frequency. Compared with the prior art, the electronic package is provided with multiple sets of antenna structures, so that the antenna function of the electronic product can be improved, and the electronic product can provide the electrical function required for running the 5G system, so as to meet the requirements of the antenna operation of the 5G system. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is a schematic view of a wireless communication module.

[0018] Figures 2A-2E is a schematic view of a manufacturing method of an electronic package.

[0019] Figure 2F is a schematic view of a top plan view of Figure 2E .

[0020] REFERENCE NUMERALS

[0021] 1: wireless communication module

[0022] 10: substrate

[0023] 11, 21: electronic component

[0024] 12: antenna structure

[0025] 120: antenna body

[0026] 121: wire

[0027] 13: packaging material

[0028] 2: electronic package

[0029] 2a: packaging module

[0030] 20: carrier structure

[0031] 20a: first side

[0032] 20b: second side

[0033] 200: first insulating layer

[0034] 201: first circuit layer

[0035] 21a: active surface

[0036] 21b: non-active surface

[0037] 210: electrode pad

[0038] 211: protective film

[0039] 212: die attach layer

[0040] 22: electrically conductive body

[0041] 23: electrically conductive pillar

[0042] 24: insulating spacer

[0043] 25: cladding layer

[0044] 26: circuit structure

[0045] 260: second insulating layer

[0046] 261: second circuit layer

[0047] 27: electrically conductive element

[0048] 270: under bump metal layer

[0049] 28: first antenna structure

[0050] 28a: first antenna layer

[0051] 28b: first antenna body

[0052] 29: second antenna structure

[0053] 29a: second antenna layer

[0054] 29b: second antenna body

[0055] 9: support plate

[0056] 90: release layer

[0057] 91: adhesive layer DETAILED DESCRIPTION

[0058] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content described in this specification.

[0059] It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content described herein, and are not intended to limit the conditions under which the invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to the size, without affecting the effects and objectives achieved by the invention, should still fall within the scope of the technical content described herein. Furthermore, terms such as "above," "first," "second," and "a" used in this specification are merely for clarity of description and are not intended to limit the scope of the invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should be considered within the scope of the invention's implementation.

[0060] Figures 2A-2E This is a cross-sectional schematic diagram of the manufacturing method of the electronic package 2 of the present invention.

[0061] like Figure 2A As shown, a support structure 20 is attached to a support plate 9. The support structure 20 has a first side 20a and a second side 20b, and the support structure 20 is attached to the support plate 9 with its second side 20b. Next, a plurality of conductive posts 23 electrically connected to the support structure 20 are formed on the first side 20a of the support structure 20, and at least one electronic component 21 is disposed on the first side 20a of the support structure 20.

[0062] The carrier structure 20 is a circuit structure or a substrate structure. The substrate structure can be in the form of a core layer or a coreless form. For example, it can be a package substrate with a core layer and a circuit structure or a circuit substrate structure without a core layer. The carrier structure 20 includes at least a first insulating layer 200 and a first circuit layer 201 disposed on the first insulating layer 200, such as a redistribution layer (RDL).

[0063] In this embodiment, the material forming the first circuit layer 201 is copper, and the material forming the first insulating layer 200 is a dielectric material such as polybenzoxazole (PBO), polyimide (PI), or prepreg (PP).

[0064] Furthermore, the support structure 20 is further configured with a first antenna layer 28a electrically connected to the first circuit layer 201. For example, the first antenna layer 28a and the first circuit layer 201 are fabricated together using RDL technology.

[0065] The support plate 9 is, for example, a semiconductor material (such as silicon or glass) plate, on which a release layer 90 and an adhesive layer 91 are sequentially formed by coating, so that the support structure 20 is disposed on the adhesive layer 91.

[0066] The conductive pillar 23 is, for example, a column, a line, or a sphere, which is erected on the first circuit layer 201 and electrically connected to the first circuit layer 201.

[0067] In this embodiment, the material forming the conductive pillar 23 is a metal such as copper or gold, or a solder material, but is not limited to the above.

[0068] The electronic component 21 is an active component, a passive component, or a combination of both, and the active component is, for example, a semiconductor chip, while the passive component is, for example, a resistor, a capacitor, and an inductor.

[0069] In this embodiment, the electronic component 21 is a semiconductor chip with opposing active surfaces 21a and non-active surfaces 21b. The electronic component 21 is bonded to the first side 20a of the support structure 20 via a die-bonding layer 212 with its non-active surface 21b. The active surface 21a has multiple electrode pads 210, and multiple conductors 22 are formed on the multiple electrode pads 210, as well as a protective film 211 covering the multiple electrode pads 210 and the multiple conductors 22. For example, the protective film 211 may be an insulating material such as polybenzoxazole (PBO), and the conductors 22 may be spherical, such as conductive lines or solder balls, or columnar, such as copper pillars or solder bumps, or studs made by a wire bonding machine, but are not limited to these.

[0070] like Figure 2B As shown, a covering layer 25 is formed on the first side 20a of the supporting structure 20 so that the covering layer 25 covers the electronic component 21 and multiple conductive pillars 23. Then, through a leveling process, the upper surface of the covering layer 25 is made coplanar with the upper surface of the protective film 211, the end faces of the multiple conductive pillars 23 and the end faces of the multiple conductors 22, so that the upper surface of the protective film 211, the end faces of the conductive pillars 23 and the end faces of the conductors 22 are exposed in the covering layer 25.

[0071] In this embodiment, the covering layer 25 is an insulating material, such as polyimide (PI), dry film, epoxy resin, or molding compound, which can be formed on the first side 20a of the support structure 20 by lamination or molding.

[0072] Furthermore, the leveling process involves removing part of the material from the conductive pillar 23, protective film 211, conductor 22, and coating layer 25 through grinding, so that the upper surface of the coating layer 25 is coplanar with the upper surface of the protective film 211, the end face of the conductive pillar 23, and the end face of the conductor 22.

[0073] As shown in Figure 2C, a circuit structure 26 is formed on the cover layer 25, and the circuit structure 26 is stacked on the carrier structure 20 to form a package module 2a.

[0074] In this embodiment, the circuit structure 26 includes a plurality of second insulating layers 260 and a plurality of second circuit layers 261, such as RDLs, disposed on the second insulating layers 260, so that the second circuit layers 261 electrically connect the plurality of conductive pillars 23 and the plurality of conductors 22 on the electronic component 21. Alternatively, the circuit structure 26 may also include only a single second insulating layer 260 and a single second circuit layer 261.

[0075] Furthermore, the material forming the second circuit layer 261 is copper, and the material forming the second insulating layer 260 is a dielectric material such as polybenzoxazole (PBO), polyimide (PI), or prepreg (PP).

[0076] Furthermore, the circuit structure 26 is further configured with a second antenna layer 29a electrically connected to the second circuit layer 261. For example, the second antenna layer 29a and the second circuit layer 261 are fabricated together using RDL technology.

[0077] Additionally, multiple conductive elements 27, such as solder balls, are formed on the outermost second circuit layer 261. For example, an under bump metallurgy (UBM) 270 may be formed on the outermost second circuit layer 261 to facilitate the bonding of the conductive elements 27. It should be understood that there are many types of packaged modules 2a, and they are not limited to those described above, but are hereby specified.

[0078] like Figure 2D As shown, the support plate 9 and the release layer 90 are removed and then flipped over to form an insulating spacer 24 on a portion of the surface of the adhesive layer 91 on the second side 20b of the support structure 20.

[0079] In this embodiment, the insulating spacer 24 is a dielectric layer, such as polyimide (PI), dry film, or molding compound, but is not limited to these. For example, a dielectric layer is first coated on the entire surface of the adhesive layer 91, and then a portion of the dielectric layer is removed by etching to form the insulating spacer 24.

[0080] likeFigure 2E As shown, a first antenna body 28b corresponding to the first antenna layer 28a is formed on the insulating spacer 24, so that the first antenna body 28b and the first antenna layer 28a are located on opposite sides of the insulating spacer 24 to form a first antenna structure 28, and a second antenna body 29b corresponding to the second antenna layer 29a is formed on a portion of the surface of the adhesive layer 91 on the second side 20b of the carrier structure 20, so that the second antenna body 29b and the second antenna layer 29a are kept at a distance to form a second antenna structure 29, and the second antenna body 29b surrounds the first antenna body 28b, as shown. Figure 2F As shown.

[0081] In this embodiment, the first antenna structure 28 is a high-frequency antenna, i.e., higher than 6 GHz, and the second antenna structure 29 is a low-frequency antenna, i.e., 6 GHz or lower (commonly known as Sub-6 GHz), with 6 GHz as the boundary. For example, the electronic component 21 transmits and receives high-frequency 5G millimeter wave (mmWave) signals of 24-53 GHz frequency through the first antenna structure 28, and transmits and receives low-frequency 5G millimeter wave signals of Sub-6 GHz (about 410-7125 MHz) frequency through the second antenna structure 29.

[0082] Furthermore, the first antenna body 28b and the first antenna layer 28a transmit signals in a coupled manner, and the first antenna layer 28a serves as a feed line of the first antenna structure 28, and the second antenna body 29b and the second antenna layer 29a also transmit signals in a coupled manner, and the second antenna layer 29a serves as a feed line of the second antenna structure 29. For example, the antenna layer and the antenna body can generate radiated energy from alternating voltage, alternating current, or radiation changes, and the radiated energy is an electromagnetic field, so that the antenna layer and the antenna body can be electromagnetically coupled to each other, so that antenna signals can be transmitted between the antenna layer and the antenna body. In addition, there is no other metal layer between the second antenna layer 29a and the second antenna body 29b.

[0083] Moreover, the dielectric constant of the medium region (such as the insulating spacer 24 and the first insulating layer 200) corresponding to the high-frequency antenna needs to be less than 3, for example, SiLK, MSQ, PI (containing nano air, fluorine groups), or other appropriate materials; on the other hand, the dielectric constant of the medium region (such as the first insulating layer 200, the cladding layer 25, and the second insulating layer 260) corresponding to the low-frequency antenna needs to be less than 3.7, for example, epoxy resin, PI, or other appropriate materials.

[0084] In addition, the first antenna body 28b and the second antenna body 29b can be made by sputtering, vaporizing, electroplating, electroless plating, chemical plating, or foiling, etc.

[0085] Therefore, the method of the present application mainly uses the arrangement of the insulating spacer 24 to facilitate the integration of the first antenna structure 28 and the second antenna structure 29 on the packaging module 2a without interfering with each other, so that the electronic package 2 can emit / receive different antenna signals as required, and thus the electronic package 2 can be configured to include antenna structures of multiple frequencies, so that a single electronic package 2 can meet the requirements of radio frequency products of multiple frequencies, thereby improving the antenna function of the electronic product, so as to provide the electrical function required for the operation of the 5G system, thereby meeting the requirements of the antenna operation of the 5G system.

[0086] The present application further provides an electronic package 2, which comprises a packaging module 2a, an insulating spacer 24, a first antenna body 28b and a second antenna body 29b.

[0087] The packaging module 2a is internally arranged with a plurality of feed lines, wherein the plurality of feed lines define a first antenna layer 28a and a second antenna layer 29a.

[0088] The insulating spacer 24 is arranged on part of the surface of the packaging module 2a.

[0089] The first antenna body 28b is arranged on the insulating spacer 24 corresponding to the position of the first antenna layer 28a, and the first antenna body 28b and the first antenna layer 28a are located on opposite sides of the insulating spacer 24, so that the first antenna body 28b and the first antenna layer 28a form a first antenna structure 28.

[0090] The second antenna body 29b is arranged on part of the surface of the packaging module 2a corresponding to the position of the second antenna layer 29a, and the second antenna body 29b and the second antenna layer 29a are kept apart from each other, so that the second antenna body 29b and the second antenna layer 29a form a second antenna structure 29.

[0091] In one embodiment, the first antenna structure 28 has a frequency of 24-52 GHz.

[0092] In one embodiment, the first antenna body 28b and the first antenna layer 28a transmit signals in a coupled manner.

[0093] In one embodiment, the insulating spacer 24 is a dielectric layer.

[0094] In one embodiment, the dielectric constant of the insulating spacer 24 is less than 3.

[0095] In one embodiment, the second antenna structure 29 has a frequency of 410-7125 MHz.

[0096] In one embodiment, the second antenna body 29b and the second antenna layer 29a transmit signals in a coupled manner.

[0097] In one embodiment, the packaging module 2a comprises at least one electronic component 21 and a covering layer 25 covering the electronic component 21, so that the second antenna body 29b and the second antenna layer 29a are located on opposite sides of the covering layer 25. For example, the dielectric constant of the covering layer 25 is less than 3.7. Further, the packaging module 2a further comprises a plurality of conductive columns 23 embedded in the covering layer 25, and a carrier structure 20 and a circuit structure 26 arranged on opposite sides of the covering layer 25 to be electrically connected to each other through the plurality of conductive columns 23, so that the carrier structure 20 is provided with the first antenna layer 28a, and the circuit structure 26 is provided with the second antenna layer 29a, and the insulating spacer 24 and the second antenna body 29b are both arranged on a surface of the carrier structure 20.

[0098] In summary, the electronic package and the manufacturing method thereof integrate the first antenna structure and the second antenna structure into the packaging module through the design of the insulating spacer, and the radio frequency of the first antenna structure is different from that of the second antenna structure, so that the electronic package comprises signal receiving capability of two frequency bands (Sub-6G or mmWave), and thus the electronic product using the electronic package can meet the demand of radio frequency products of various frequencies.

[0099] The above embodiments are used to illustrate the principles and effects of the present application, but are not used to limit the present application. Any person skilled in the art can modify the above embodiments without departing from the spirit and scope of the present application. Therefore, the protection scope of the present application should be subject to the claims.

Claims

1. An electronic package, comprising: The encapsulation module has multiple feed lines internally configured, wherein the multiple feed lines define a first antenna layer and a second antenna layer. An insulating spacer is disposed on a portion of the surface of the encapsulation module; The first antenna body is disposed on the insulating spacer corresponding to the position of the first antenna layer, and the first antenna body and the first antenna layer are located on opposite sides of the insulating spacer, so that the first antenna body and the first antenna layer form a first antenna structure, and the first antenna layer and the first antenna body are electromagnetically coupled to each other through alternating voltage, alternating current or radiation changes, and the signal is transmitted in the electromagnetic coupling manner. as well as The second antenna body is disposed on a portion of the surface of the packaging module at the position corresponding to the second antenna layer, and a distance is maintained between the second antenna body and the second antenna layer so that the second antenna body and the second antenna layer form a second antenna structure. The second antenna layer and the second antenna body are electromagnetically coupled to each other through alternating voltage, alternating current or radiation changes, and signals are transmitted in the manner of electromagnetic coupling. The radio frequency (RF) of the second antenna structure is different from that of the first antenna structure.

2. The electronic package according to claim 1, wherein the applicable frequency of the first antenna structure is 24~52 GHz.

3. The electronic package according to claim 1, wherein the insulating spacer is a dielectric layer.

4. The electronic package according to claim 1, wherein the dielectric constant of the insulating spacer is less than 3.

5. The electronic package according to claim 1, wherein the applicable frequency of the second antenna structure is 410~7125 MHz.

6. The electronic package of claim 1, wherein the package module comprises at least one electronic component and a cover layer covering the electronic component, such that the second antenna body and the second antenna layer are located on opposite sides of the cover layer.

7. The electronic package according to claim 6, wherein the dielectric constant of the covering layer is less than 3.

7.

8. The electronic package according to claim 6, wherein the package module further comprises a plurality of conductive pillars embedded in the cover layer, and a carrier structure and a circuit structure disposed on opposite sides of the cover layer to be electrically connected to each other through the plurality of conductive pillars, such that the carrier structure is provided with the first antenna layer and the circuit structure is provided with the second antenna layer, and the insulating spacer and the second antenna body are disposed on a surface of the carrier structure.

9. A method for manufacturing an electronic package, comprising: A package module is provided, which is internally configured with multiple feed lines, wherein the multiple feed lines define a first antenna layer and a second antenna layer. An insulating spacer is disposed on a portion of the surface of the encapsulation module; A first antenna body is formed on the insulating spacer corresponding to the position of the first antenna layer, and the first antenna body and the first antenna layer are located on opposite sides of the insulating spacer, so that the first antenna body and the first antenna layer form a first antenna structure, and the first antenna layer and the first antenna body are electromagnetically coupled to each other through alternating voltage, alternating current or radiation changes, and the signal is transmitted in the manner of electromagnetic coupling. as well as A second antenna body is formed on a portion of the surface of the packaging module corresponding to the position of the second antenna layer, and a distance is maintained between the second antenna body and the second antenna layer so that the second antenna body and the second antenna layer form a second antenna structure. The second antenna layer and the second antenna body are electromagnetically coupled to each other through alternating voltage, alternating current or radiation changes and signals are transmitted in the manner of electromagnetic coupling. The radio frequency (RF) of the second antenna structure is different from that of the first antenna structure.

10. The method for manufacturing an electronic package according to claim 9, wherein the applicable frequency of the first antenna structure is 24~52 GHz.

11. The method for manufacturing an electronic package according to claim 9, wherein the insulating spacer is a dielectric layer.

12. The method for manufacturing an electronic package according to claim 9, wherein the dielectric constant of the insulating spacer is less than 3.

13. The method for manufacturing an electronic package according to claim 9, wherein the applicable frequency of the second antenna structure is 410~7125 MHz.

14. The method for manufacturing an electronic package according to claim 9, wherein, The packaging module includes at least one electronic component and a covering layer that encapsulates the electronic component, such that the second antenna body and the second antenna layer are located on opposite sides of the covering layer.

15. The method for manufacturing an electronic package according to claim 14, wherein, The dielectric constant of the coating layer is less than 3.

7.

16. The method of manufacturing an electronic package according to claim 14, wherein the package module further comprises a plurality of conductive pillars embedded in the cover layer, and a carrier structure and a circuit structure disposed on opposite sides of the cover layer to be electrically connected to each other through the plurality of conductive pillars, such that the carrier structure is provided with the first antenna layer and the circuit structure is provided with the second antenna layer, and the insulating spacer and the second antenna body are disposed on a surface of the carrier structure.

Images