High frequency assembly and communication device

Abstract

Deterioration of characteristics of a second filter caused by an effect of heat generated in a first filter when transmitting simultaneously using both the first filter and the second filter is suppressed. The high-frequency assembly includes a mounting substrate (30), a first filter (7A), a second filter (7D), a shielding layer (33), and a conductor (401). The mounting substrate (30) has a first main surface (35) and a second main surface (36) facing each other. The shielding layer (33) is provided on an outer surface of a resin layer covering the first filter (7A) and the second filter (7D). Simultaneous transmission using both the first filter (7A) and the second filter (7D) is possible. The conductor (401) is provided on the first main surface (35) of the mounting substrate (30) and is in contact with the first filter (7A) and the mounting substrate (30). The conductor (401) is in contact with the shielding layer (33) on a side of the first filter (7A) different from the side of the second filter (7D).

Description

Technical Field

[0001] The present invention relates to high-frequency components and communication devices, and more specifically, to high-frequency components having a first filter and a second filter, and to communication devices having high-frequency components. Background Technology

[0002] Patent Document 1 discloses a high-frequency power amplifier assembly (high-frequency assembly) comprising two transmitting filters (a first filter and a second filter) that use communication frequency bands of different communication frequency bands as passbands. In this high-frequency power amplifier assembly, the two transmitting filters can operate simultaneously.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: International Publication No. 2016 / 117482 Summary of the Invention

[0006] The problem the invention aims to solve

[0007] In the high-frequency power amplifier assembly described in Patent Document 1, when transmitting simultaneously using two transmit filters (a first filter and a second filter), the first transmit filter heats up, and this heat affects the second transmit filter. As a result, the characteristics of the second transmit filter deteriorate due to this effect.

[0008] The object of the present invention is to provide a high-frequency component and communication device capable of suppressing the degradation of the characteristics of the second filter caused by the heat generated in the first filter when transmitting simultaneously using both the first filter and the second filter.

[0009] Solution for solving the problem

[0010] A high-frequency component according to one aspect of the present invention includes a mounting substrate, a first filter and a second filter, a resin layer, a shielding layer, and a conductor. The mounting substrate has a first main surface and a second main surface opposite to each other. The first filter is mounted on the first main surface of the mounting substrate, using a first frequency band as a passband. The second filter is mounted on the first main surface of the mounting substrate, using a second frequency band as a passband. The resin layer is disposed on the first main surface of the substrate, covering at least a portion of the first filter and the second filter. The shielding layer is disposed on the outer surface of the resin layer. The conductor is disposed on the first main surface of the substrate, contacting the first filter and the substrate. The shielding layer is disposed on the outer surface of the resin layer. Simultaneous transmission using both the first filter and the second filter is possible. The conductor contacts the shielding layer on a side of the first filter different from the side of the second filter.

[0011] A communication device according to one aspect of the present invention includes a high-frequency component and a signal processing circuit as described above. The signal processing circuit is connected to the high-frequency component and performs signal processing on the high-frequency signal.

[0012] The effects of the invention

[0013] The high-frequency components and communication devices of the present invention can suppress the degradation of the characteristics of the second filter caused by the heat generated in the first filter when transmitting simultaneously using both the first filter and the second filter. Attached Figure Description

[0014] Figure 1 This is a block diagram of the high-frequency components and communication device in the implementation method.

[0015] Figure 2 This is a top view of the aforementioned high-frequency components.

[0016] Figure 3 yes Figure 2 Z1-Z1 sectional view.

[0017] Figure 4 This is a top view showing an example of the configuration of two transmitting filters that can operate simultaneously and the conductors corresponding to those two transmitting filters.

[0018] Figure 5 It means Figure 4 A sectional view of the main part of the Z2-Z2 section.

[0019] Figure 6 This is an explanatory diagram illustrating the heat transfer situation generated by the aforementioned transmitting filter.

[0020] Figure 7 This is a top view illustrating the shape of the conductor in variation example 1.

[0021] Figure 8 This is a top view illustrating the shape of the conductor in variation example 2.

[0022] Figure 9 This is a top view illustrating the shape of the conductor in variation example 3.

[0023] Figure 10 This is a top view illustrating the shape of the conductor in variation example 4.

[0024] Figure 11 A is a top view illustrating the structure of the conductor in variation example 5. Figure 11 B represents Figure 11 A sectional view of the main part of section Z3-Z3 of section A.

[0025] Figure 12 This is a cross-sectional view illustrating the structure of the conductor in variation example 6.

[0026] Figure 13 A is a top view illustrating the configuration of the conductor, signal line, and transmitting filter in Modified Example 7. Figure 13 B is Figure 13 Z4-Z4 sectional view of A. Detailed Implementation

[0027] The following implementation methods, etc., refer to Figures 1 to 13 These are all schematic diagrams, and the ratios of the size and thickness of each component in the diagram are not necessarily intended to reflect the actual size ratios.

[0028] (Implementation Method)

[0029] (1) Summary

[0030] like Figure 4 and Figure 5As shown, the high-frequency component 1 of the embodiment includes a mounting substrate 30 (substrate), a transmitting filter 7A and a transmitting filter 7D, a resin layer 32A, a shielding layer 33, and conductors 401 and 404. The mounting substrate 30 has a first main surface 35 and a second main surface 36 facing each other. The transmitting filter 7A is mounted on the first main surface 35 of the mounting substrate 30, using a first frequency band as a passband. The transmitting filter 7D is mounted on the first main surface 35 of the mounting substrate 30, using a second frequency band as a passband. The resin layer 32A is disposed on the first main surface 35 of the mounting substrate 30, covering at least a portion of the transmitting filters 7A and 7D. The shielding layer 33 is disposed on the outer surface of the resin layer 32A. The conductor 401 is disposed on the first main surface 35 of the mounting substrate 30, contacting the transmitting filter 7A and the mounting substrate 30. The conductor 404 is disposed on the first main surface 35 of the mounting substrate 30, contacting the transmitting filter 7D and the mounting substrate 30. Simultaneous transmission using both the transmitting filter 7A and the transmitting filter 7D is possible. Conductor 401 extends from transmit filter 7A (first filter) to a side different from that of transmit filter 7D (second filter) and contacts shielding layer 33. Conductor 404 extends from transmit filter 7A (first filter) to a side different from that of transmit filter 7A (second filter) and contacts shielding layer 33. According to this structure, conductors 401 and 404 can be used to suppress the degradation of the characteristics of transmit filters 7A and 7D caused by the heat generated in transmit filters 7A and 7D during simultaneous transmission using both transmit filters 7A and 7D.

[0031] (2) Detailed explanation

[0032] The following is for reference Figures 1-6 The high-frequency component 1 and the communication device 100 of the embodiment are described in detail.

[0033] (2-1) Structure of the communication device

[0034] like Figure 1 As shown, the communication device 100 is a communication device equipped with a high-frequency component 1. The communication device 100 is, for example, a portable terminal (e.g., a smartphone), but is not limited to this; it could also be a wearable terminal (e.g., a smartwatch). The high-frequency component 1 is, for example, a component compatible with 4G (4th generation mobile communication) and 5G (5th generation mobile communication) standards. The 4G standard is, for example, the 3GPP LTE standard (LTE: Long Term Evolution). The 5G standard is, for example, 5G NR (New Radio). The high-frequency component 1 is a component compatible with carrier aggregation and dual connectivity.

[0035] In addition to the high-frequency component 1, the communication device 100 also includes a signal processing circuit 2 and multiple (three in the example) antennas 3A to 3C.

[0036] The high-frequency component 1 is configured to amplify the transmitted signal (high-frequency signal) input from the signal processing circuit 2 and output it to the antennas 3A to 3C. Additionally, the high-frequency component 1 is configured to amplify the received signal (high-frequency signal) input from the antennas 3A to 3C and output it to the signal processing circuit 2. The high-frequency component 1 is controlled, for example, by the signal processing circuit 2.

[0037] The signal processing circuit 2 is configured to be connected to the high-frequency component 1 and to process the transmitted and received signals exchanged between the high-frequency component 1 and the high-frequency component 1. Here, the transmitted signals are signals transmitted from antennas 3A to 3C, and the received signals are signals received from antennas 3A to 3C. The signal processing circuit 2 includes a baseband signal processing circuit 21 and an RF signal processing circuit 22.

[0038] The baseband signal processing circuit 21 is, for example, a BBIC (Baseband Integrated Circuit). The baseband signal processing circuit 21 generates a transmit signal based on externally input baseband signals (e.g., audio and image signals) and outputs the generated transmit signal to the RF signal processing circuit 22. Additionally, the baseband signal processing circuit 21 outputs a receive signal received from the RF signal processing circuit 22 to the outside. This output signal (receive signal) can be used, for example, as an image signal for image display or as an audio signal for communication.

[0039] The RF signal processing circuit 22 is, for example, an RFIC (Radio Frequency Integrated Circuit) that processes high-frequency signals (transmitted signals and received signals). For example, the RF signal processing circuit 22 performs up-conversion and other signal processing on the transmitted signal output from the baseband signal processing circuit 21 and outputs it to the high-frequency component 1. Additionally, the RF signal processing circuit 22 performs down-conversion and other signal processing on the received signal received from the high-frequency component 1 and outputs it to the baseband signal processing circuit 21.

[0040] (2-2) Circuit structure of high-frequency components

[0041] like Figure 1 As shown, the high-frequency component 1 transmits high-frequency signals (received signals and transmitted signals) between the antennas 3A-3C and the signal processing circuit 2.

[0042] High-frequency component 1 includes multiple (two in the example) power amplifiers 5A and 5B, multiple (four in the example) low-noise amplifiers 6A to 6D, multiple (four in the example) transmit filters 7A to 7D, and multiple (in... Figure 1In this example, there are four receiving filters 8A to 8D. Additionally, the high-frequency component 1 includes multiple (two in the example) output matching circuits 10A and 10B, multiple (four in the example) matching circuits 11A to 11D, and multiple (three in the example) matching circuits 12A to 12C. Furthermore, the high-frequency component 1 includes a first switch 14, a second switch 15, a third switch 16, a controller 17, and multiple (eight in the example) external connection terminals 18A to 18J. Additionally, the high-frequency component 1 includes multiple (two in the example) signal paths T1 to T4 for transmitting signals and multiple (four in the example) signal paths R1 to R4 for receiving signals.

[0043] External connection terminals 18A to 18J include antenna terminals 18A to 18C, signal output terminals 18D to 18F, signal input terminals 18G to 18I, and multiple grounding terminals 18J (see reference). Figure 3 Antenna terminals 18A to 18C are for connecting antennas 3A to 3C. Signal output terminals 18D to 18F are for outputting the received signal processed by the high-frequency component 1 to the RF signal processing circuit 22, and are connected to multiple (three in the example) input sections of the signal processing circuit 2 via a circuit. Signal input terminals 18G and 18H are for inputting the transmitted signal from the RF signal processing circuit 22 of the signal processing circuit 2. Signal input terminals 18G and 18H are connected to multiple (two in the example) output sections of the RF signal processing circuit 22 via a circuit. Signal input terminal 18I is for inputting the control signal from the signal processing circuit 2, and is connected to the output section of the RF signal processing circuit 22 via a circuit. External connection terminal 18J is a ground terminal (hereinafter referred to as ground terminal 18J), which is electrically connected to the ground electrode of the communication device 100 and is given a ground potential.

[0044] Signal path T1 connects signal input terminal 18G and selection terminal 14h of the first switch 14. In signal path T1, power amplifier 5A, output matching circuit 10A, and transmitting filter 7A are sequentially arranged from the signal input terminal 18G side towards the first switch 14 side. The input signal (i.e., the transmitted signal) of signal input terminal 18G flows through signal path T1, whereby it is processed by power amplifier 5A, output matching circuit 10A, and transmitting filter 7A respectively, and then output to the first switch 14.

[0045] Signal paths T2 to T4 are signal paths that connect signal input terminal 18H to selection terminals 14i to 14k of the first switch 14. Signal paths T2 to T4 each have a shared path Tc and independent paths T21, T31, and T41. The shared path Tc is the portion of the path shared between signal paths T2 to T4. Independent paths T21, T31, and T41 are independent portions of the path set up for each signal path T2 to T4. The shared path Tc connects signal input terminal 18H to the shared terminal 15a of the second switch 15. Independent paths T21 to T41 connect selection terminals 15b to 15d of the second switch to selection terminals 14i to 14k of the first switch 14, respectively. In the shared path Tc, power amplifier 5B and output matching circuit 10B are arranged sequentially from the signal input terminal 18H side towards the first switch 14 side. Transmitting filters 7B to 7D are provided in each of the independent paths T21 to T41.

[0046] Signal paths T2 to T4 can be selectively switched by the second switch 15. More specifically, the second switch 15 selects one connection target of the shared path Tc from the independent paths T21 to T41, thereby selectively switching signal paths T2 to T4. The second switch 15 selects one of the signal paths T2 to T4, thereby selecting one of the transmission filters 7B to 7C for use during transmission. Furthermore, in this embodiment, the second switch 15 selects one of the signal paths T2 to T4, but it is also possible to select two or more.

[0047] The input signal (i.e. the transmission signal) of the signal input terminal 18H flows through the signal path (any one of T2 to T4) selected by the second switch 15, and is thus processed by the power amplifier 5B, the output matching circuit 10B, and the transmission filter (one of 7B to 7D) selected by the second switch 15 and output to the first switch 14.

[0048] Signal paths R1 to R4 connect the selection terminals 14d to 14g of the first switch 14 and the selection terminals 16d to 16g of the third switch 16. In signal paths R1 to R4, receiving filters 8A to 8D, matching circuits 11A to 11D, and low-noise amplifiers 6A to 6D are sequentially arranged from the first switch 14 side towards the third switch 16 side. The output signal (i.e., the received signal) from the selection terminals 14d to 14g of the first switch 14 flows through signal paths R1 to R4, where it is processed by the receiving filters 8A to 8D, the matching circuits 11A to 11D, and the low-noise amplifiers 6A to 6D, and then output to the third switch 16.

[0049] The first switch 14 is a switch used to selectively connect signal paths T1-T4 and R1-R4 to one of the three antennas 3A-3C. The first switch 14 is, for example, a switch IC.

[0050] The first switch 14 has multiple (three in the example) common terminals 14a-14c and multiple (eight in the example) selectable terminals 14d-14k. The three common terminals 14a-14c are connected to the antenna terminals 18A-18C via matching circuits 12A-12C. That is, the three common terminals 14a-14c are connected to the antennas 3A-3C via matching circuits 12A-12C and antenna terminals 18A-18C. Four of the eight selectable terminals 14d-14k, 14d-14g, are connected to four signal paths R1-R4. That is, the four selectable terminals 14d-14g are connected to the input sections of the receiving filters 8A-8D via signal paths R1-R4. On the other hand, the remaining four selectable terminals 14h-14k are connected to four signal paths T1-T4. That is, the remaining four selection terminals 14h to 14k are connected to the outputs of the transmitting filters 7A to 7D via signal paths T1 to T4, respectively.

[0051] The first switch 14 selects three common terminals 14a to 14c (i.e., the connection targets of the three antennas 3A to 3C) from eight selection terminals 14d to 14k (i.e., eight signal paths T1 to T4, R1 to R4) according to the control signal from the controller 17. The first switch 14 is, for example, a switch capable of one-to-one and one-to-many connections.

[0052] The second switch 15 is used to select the signal path used in transmitting the transmitted signal from signal paths T2 to T4. The second switch 15 is, for example, a switch IC. The second switch 15 has a common terminal 15a and multiple (three in the example) selection terminals 15b to 15d. The common terminal 15a is connected to the common path Tc. That is, the common terminal 15a is connected to the output section of the output matching circuit 10B via the common path Tc. The three selection terminals 15b to 15d are respectively connected to the three signal paths T2 to T4. That is, the three selection terminals 15b to 15d are respectively connected to the input sections of the transmitting filters 7B to 7D via signal paths T2 to T4.

[0053] The second switch 15 selects one common terminal 15a from the three selection terminals 15b to 15d according to the control signal from the controller 17. Thus, the second switch 15 selects one signal path from signal paths T2 to T4 used in transmitting the signal. In this embodiment, the second switch 15 is a switch for one-to-one connections, but it can also be a switch for one-to-many connections.

[0054] The third switch 16 is a switch used to select the signal path used in receiving the received signal from signal paths R1 to R4. The third switch 16 is, for example, a switch IC. The third switch 16 has multiple (three in the example) common terminals 16a to 16c and multiple (four in the example) selection terminals 16d to 16g. The three common terminals 16a to 16c are respectively connected to three signal output terminals 18D to 18F. The four selection terminals 16d to 16g are respectively connected to four signal paths R1 to R4. That is, the four selection terminals 16d to 16f are respectively connected to the output sections of low-noise amplifiers 6A to 6D via signal paths R1 to R4.

[0055] The third switch 16 selects one of the four selection terminals 16d to 16f (i.e., four signal paths R1 to R4) as the connection target for the three common terminals 16a to 16c based on the control signal from the controller 17. Signal paths R1 to R4 are connected to one of the common terminals 16a to 16c, thus being selected as the signal paths to be used. The third switch 16 can be used for either one-to-one connections or one-to-many connections.

[0056] Power amplifiers 5A and 5B are located on signal paths T1 and T2, respectively. More specifically, power amplifier 5B is located on the common path Tc of signal path T2. Power amplifiers 5A and 5B have input sections and output sections. The input sections of power amplifiers 5A and 5B are connected to signal input terminals 18G and 18H, respectively, and the output sections of power amplifiers 5A and 5B are connected to the input sections of output matching circuits 10A and 10B, respectively. Power amplifiers 5A and 5B amplify the transmitted signals input to their input sections and output them from their output sections. Power amplifiers 5A and 5B are controlled by controller 17.

[0057] Low-noise amplifiers 6A to 6D are respectively located in signal paths R1 to R4. Low-noise amplifiers 6A to 6D have input sections and output sections. The input sections of low-noise amplifiers 6A to 6D are connected to the output sections of matching circuits 11A to 11D, respectively. The output sections of low-noise amplifiers 6A to 6D are connected to the selection terminals 16d to 16g of the third switch 16, respectively. Low-noise amplifiers 6A to 6D amplify the received signals input to their input sections and output them from their output sections. Low-noise amplifiers 6A to 6D are controlled by controller 17.

[0058] Transmit filters 7A to 7D are respectively located on signal paths T1 to T4. More specifically, transmit filters 7B to 7D are respectively located on independent paths T21, T31, and T41 of signal paths T2 to T4. Transmit filters 7A to 7D are filters that use the transmit bands of different communication frequency bands (e.g., the first communication frequency band (first frequency band), the second communication frequency band, the third communication frequency band, and the fourth communication frequency band (second frequency band)) as passbands. Transmit filters 7A to 7D have input sections and output sections. The input section of transmit filter 7A is connected to the output section of output matching circuit 10A, and the output section of transmit filter 7A is connected to the selection terminal 14h of the first switch 14. The input sections of transmit filters 7B to 7D are respectively connected to the selection terminals 15b to 15d of the second switch 15, and the output sections of transmit filters 7B to 7D are respectively connected to the selection terminals 14i to 14k of the first switch 14. Transmitting filters 7A to 7D respectively limit the transmitted signals input to the input unit to the transmission frequency bands of the 1st to 4th communication frequency bands and output them from the output unit.

[0059] Transmit filter 7A is connected to power amplifier 5A (amplifier) ​​via output matching circuit 10A. Transmit filters 7B to 7D are connected to power amplifier 5B via second switch 15 and output matching circuit 10B. That is, transmit filters 7A and transmit filters 7B to 7D are connected to power amplifiers 5A and 5B, which are different from each other.

[0060] Receiver filters 8A to 8D are respectively located in signal paths R1 to R4. Receiver filters 8A to 8D are filters that use the receiving frequency bands (communication bands) of different communication frequency bands (e.g., communication bands 1 to 4) as passbands. Receiver filters 8A to 8D have input sections and output sections. The input sections of receiver filters 8A to 8D are respectively connected to the selection terminals 14d to 14f of the first switch 14, and the output sections of receiver filters 8A to 8D are respectively connected to the input sections of matching circuits 11A to 11D. Receiver filters 8A to 8D respectively limit the received signals input to their input sections to signals within the receiving frequency bands of communication bands 1 to 4 and output them from their output sections.

[0061] The receiving filters 8A to 8D are connected to the low-noise amplifiers 6A to 6D via matching circuits 11A to 11D, respectively. That is, the receiving filters 8A to 8D are connected to different low-noise amplifiers 6A to 6D.

[0062] Transmitting filters 7A-7D and receiving filters 8A-8D are, for example, elastic wave filters. Elastic wave filters are, for example, surface elastic wave (SAW) filters utilizing elastic surface waves. Furthermore, transmitting filters 7A-7D and receiving filters 8A-8D are not limited to SAW filters; in addition to SAW, they can also be, for example, BAW (bulk acoustic wave) filters.

[0063] Output matching circuit 10A is provided in signal path T1. Output matching circuit 10B is provided in common path Tc. Output matching circuit 10A is a circuit for achieving impedance matching between power amplifier 5A and transmitting filter 7A, and includes an inductor, for example. Output matching circuit 10A is connected between the output of power amplifier 5A and the input of transmitting filter 7A. Output matching circuit 10B is a circuit for achieving impedance matching between power amplifier 5B and transmitting filters 7B-7D, and includes an inductor, for example. Output matching circuit 10B is connected between the output of power amplifier 5A and the common terminal 15a of the second switch 15.

[0064] Matching circuits 11A to 11D are respectively located in signal paths R1 to R4. Matching circuits 11A to 11D are circuits used to achieve impedance matching between low-noise amplifiers 6A to 6D and receiving filters 8A to 8D, and for example, include inductors. Matching circuits 11A to 11D are respectively connected between the output of receiving filters 8A to 8D and the input of low-noise amplifiers 6A to 6D.

[0065] Matching circuits 12A to 12C are respectively connected between the common terminals 14a to 14c of the first switch 14 and the antenna terminals 18A to 18C. Matching circuits 12A to 12C are circuits used to achieve impedance matching between the first switch 14 and the antennas 3A to 3C, and for example, have inductors.

[0066] The controller 17 is a control device that controls various circuit components (power amplifiers 5A and 5B, low-noise amplifiers 6A to 6D, switches 1 to 3, etc.) based on control signals from the signal processing circuit 2. The controller 17 is electrically connected to the power amplifiers 5A and 5B, the low-noise amplifiers 6A to 6D, and the aforementioned circuit components. Furthermore, the controller 17 is connected to the output of the signal processing circuit 2 via the signal input terminal 18I. The controller 17 controls the aforementioned circuit components based on the control signals from the signal processing circuit 2 input to the signal input terminal 18I.

[0067] (2-3) Operation of the communication device

[0068] Reference Figure 1 This explains the operation of the communication device 100.

[0069] In the communication device 100, it is possible to simultaneously transmit signals using two communication frequency bands (e.g., one of the second to fourth communication frequency bands and the first communication frequency band). In this case, the second switch 15 selects one signal path (e.g., signal path T2) from signal paths T2 to T4 for transmitting the signal. Furthermore, the first switch 14 selects an antenna (e.g., antenna 3B) connected to signal path T1 and an antenna (e.g., antenna 3C) connected to the signal path (e.g., signal path T2) selected by the second switch 15 from three antennas 3A to 3C.

[0070] Then, the two outputs of the signal processing circuit 2 are output to the two signal input terminals 18G and 18H of the high-frequency component 1. The transmission signal input to the signal input terminal 18G is then processed by each processing unit (power amplifier 5A, output matching circuit 10A, and transmission filter 7A) via signal path T1, and transmitted from the antenna 3B via the first switch 14 and matching circuit 12B. On the other hand, the transmission signal input to the signal input terminal 18H is processed by each processing unit (power amplifier 5B, output matching circuit 10B, and transmission filter 7B) via signal path T2 selected by the second switch 15, and transmitted from the antenna 3C via the first switch 14 and matching circuit 12C.

[0071] In the communication device 100, when transmitting signals simultaneously in two communication frequency bands (e.g., one of the second to fourth communication frequency bands and the first communication frequency band), two transmission filters corresponding to the two communication frequency bands (e.g., one of transmission filters 7B to 7D and transmission filter 7A) operate simultaneously. That is, simultaneous transmission using both of the aforementioned transmission filters is possible.

[0072] Furthermore, this embodiment illustrates the case where the transmitted signal is transmitted simultaneously on two transmission frequency bands, but the transmitted signal can also be transmitted simultaneously on three or more transmission frequency bands. In this case, simultaneous transmission using three or more transmission filters corresponding to the three or more transmission frequency bands is possible.

[0073] Furthermore, in the communication device 100, signals can be received simultaneously in two communication bands (e.g., two communication bands from the first to the fourth communication band). In this case, the third switch 16 selects two signal paths (e.g., signal paths R1 and R2) from signal paths R1 to R4 for receiving the signal. The two selected signal paths R1 and R2 are connected to signal output terminals 18D and 18E by the third switch 16, for example, via common terminals 16a and 16b. Additionally, the first switch 14 selects an antenna (e.g., antenna 3A) connected to the signal path (e.g., signal paths R1 and R2) selected by the third switch 16 from three antennas 3A to 3C.

[0074] Then, when the antenna 3A receives the signal, the received signal receives by the antenna 3A flows through the matching circuit 12A and the first switch 14, branching at the first switch 14 to the two signal paths R1 and R2 selected by the third switch 16. The received signal flowing through signal path R1 is output to the input of the signal processing circuit 2 via the receiving filter 8A, the matching circuit 11A, the low-noise amplifier 6A, the third switch 16, and the signal output terminal 18D. The received signal flowing through signal path R2 is output to the input of the signal processing circuit 2 via the receiving filter 8B, the matching circuit 11B, the low-noise amplifier 6B, the third switch 16, and the signal output terminal 18E. Then, the received signal output to the input of the signal processing circuit 2 is processed by the signal processing circuit 2 and output to the outside.

[0075] In the communication device 100, when receiving signals simultaneously on two communication frequency bands (e.g., the first communication frequency band and the second communication frequency band), two receiving filters (e.g., receiving filters 8A and 8B) corresponding to the two communication frequency bands operate simultaneously. That is, simultaneous reception using the two receiving filters described above is possible.

[0076] Furthermore, in this embodiment, the case where the received signal is received simultaneously in two communication frequency bands is illustrated, but the received signal can also be received simultaneously in three or more communication frequency bands.

[0077] (2-4) Construction of high-frequency components

[0078] Next, refer to Figure 2 and Figure 3 This explains the construction of high-frequency component 1.

[0079] like Figure 2 and Figure 3 As shown, the high-frequency component 1 includes a mounting substrate 30 (substrate), multiple circuit components 31, resin layers 32A and 32B, and a shielding layer 33.

[0080] like Figure 3As shown, the mounting substrate 30 is a substrate for mounting multiple circuit components, for example, it is a rectangular plate. The mounting substrate 30 has a first main surface 35 and a second main surface 36 that are opposite to each other in the thickness direction D1 of the mounting substrate 30. The first main surface 35 and the second main surface 36 are, for example, rectangular in shape (see reference). Figure 2 ).

[0081] The mounting substrate 30 is a multilayer substrate comprising multiple dielectric layers and multiple conductive layers. The multiple dielectric layers and multiple conductive layers are stacked in the thickness direction D1 of the mounting substrate 30. The multiple conductive layers are formed with a predetermined pattern defined for each layer. The multiple conductive layers include a ground layer. In the high-frequency component 1, the ground terminal 18J and the ground layer are electrically connected via via conductors (such as vias) provided in the mounting substrate 30. The mounting substrate 30 is, for example, an LTCC (Low Temperature Co-fired Ceramics) substrate. The mounting substrate 30 is not limited to an LTCC substrate; for example, it may be a printed wiring board, an HTCC (High Temperature Co-fired Ceramics) substrate, or a resin multilayer substrate.

[0082] In the following description, the thickness direction D1 of the mounting substrate 30 may be referred to as the first direction D1. Furthermore, a direction orthogonal to the first direction D1 (e.g., a direction parallel to one of the two sets of opposite sides of the first main surface 35 of the mounting substrate 30) may be referred to as the second direction D2. Additionally, a direction orthogonal to both the first direction D1 and the second direction D2 (e.g., a direction parallel to the other set of opposite sides of the first main surface 35) may be designated as the third direction D3.

[0083] In addition, Figure 2 In this context, there are instances where the upper and lower sides of the second direction D2 on the paper are abbreviated as "rear side" and "front side," and the left and right sides of the third direction D3 are abbreviated as "left side" and "right side." Additionally, in... Figure 3 In the process, there are cases where the upper and lower sides of the first direction D1 on the paper are abbreviated as "upper side" and "lower side".

[0084] Multiple circuit components 31 are mounted on the first main surface 35 or the second main surface 36 of the mounting substrate 30. In this specification, "mounted" includes the case where the circuit components 31 are disposed on the first main surface 35 or the second main surface 36 of the mounting substrate 30 (mechanical connection) and the case where the circuit components 31 are electrically connected to the mounting substrate 30 (appropriate conductor portion).

[0085] like Figure 2As shown, the plurality of circuit components 31 include a controller 17, power amplifiers 5A and 5B, transmitting filters 7A to 7D, receiving filters 8A to 8D, output matching circuits 10A and 10B, matching circuits 11A to 11D, and matching circuits 12A to 12C. These circuit components are mounted on the first main surface 35 of the mounting substrate 30. The outer periphery of each of the circuit components, when viewed from the thickness direction D1 of the mounting substrate 30, is, for example, a quadrilateral shape.

[0086] The first main surface 35 of the mounting substrate 30 has a first single half region 35L and a second single half region 35R. The first single half region 35L is half of one side (left side, first side) of the first main surface 35 in the third direction D3. The second single half region 35R is half of the other side (right side, second side) of the first main surface 35 in the third direction D3.

[0087] The first half-region 35L of the mounting substrate 30 mainly houses transmission-related circuit components (power amplifiers 5A and 5B, transmission filters 7A to 7D, output matching circuits 10A and 10B, and controller 17). More specifically, the controller 17 and transmission filter 7A are arranged on one side (upper side) of the first half-region 35L in the second direction D2, from one side (left side) of the third direction D3 to the other side (right side). Additionally, power amplifiers 5A and 5B, and output matching circuit 10A are arranged in the center of the first half-region 35L in the second direction D2, from one side (left side) of the third direction D3 to the other side (right side). Furthermore, output matching circuit 10B, transmission filter 7B, transmission filter 7C, and transmission filter 7D are arranged on the other side (lower side) of the first half-region 35L in the second direction D2, from one side (left side) of the third direction D3 to the other side (right side).

[0088] The second half-region 35R of the mounting substrate 30 mainly houses receiver-related circuit components (receiver filters 8A-8D, matching circuits 11A-11D, and matching circuits 12A-12C). More specifically, the receiver filters 8A-8D are arranged in two rows and two columns in the center of the second half-region 35R. Matching circuits 11A and 11B are arranged along the third direction D3 on one side (upper side) of the second direction D2 of the second half-region 35R. Matching circuits 11C and 11D are arranged along the second direction D2 on the other side (right side) of the second half-region 35R. Matching circuits 12A-12C are arranged along the third direction D3 on the other side (lower side) of the second half-region 35R.

[0089] In this way, the circuit components related to transmission and the circuit components related to reception are separately arranged in the first single half region 35L and the second single half region 35R. As a result, interference between the signals (transmitted signals and received signals) between the circuit components related to transmission and the circuit components related to reception can be suppressed.

[0090] In addition, the multiple circuit components 31 also include a first switch 14, a second switch 15, a third switch 16, and low-noise amplifiers 6A to 6D. The aforementioned circuit components 31 are mounted on the second main surface 36 of the mounting substrate 30.

[0091] like Figure 3 As shown, resin layer 32A (hereinafter also referred to as the first resin layer 32A) is provided on the first main surface 35 of the mounting substrate 30. The first resin layer 32A covers a plurality of circuit components 31 disposed on the first main surface 35 of the mounting substrate 30. That is, resin layer 32A covers at least a portion of the transmit filters 7A to 7B, which are capable of operating simultaneously during transmission. The first resin layer 32A seals the aforementioned plurality of circuit components 31. Furthermore, in Figure 2 The first resin layer 32A is omitted.

[0092] Additionally, resin layer 32B (hereinafter also referred to as the second resin layer 32B) is provided on the second main surface 36 of the mounting substrate 30. The second resin layer 32B covers a plurality of circuit components 31 mounted on the second main surface 36 of the mounting substrate 30. The second resin layer 32B seals the aforementioned plurality of circuit components 31. More specifically, for the second resin layer 32B, for the plurality of external connection terminals 18A to 18J mounted on the second main surface 36, the top surface is exposed and the portion other than the top surface is covered, and for the circuit components 31, the entire circuit component 31 is covered. The second resin layer 32B comprises resin. The second resin layer 32B may also contain filler in addition to resin. The material of the second resin layer 32B may be the same as the material of the first resin layer 32A, or it may be a different material from the material of the first resin layer 32A.

[0093] The shielding layer 33 is, for example, metal. The shielding layer 33 is disposed on the outer surface (outer peripheral surface and top surface) of the first resin layer 32A, the outer peripheral surface of the second resin layer 32B, and the outer peripheral surface of the mounting substrate 30. The shielding layer 33 covers the entire outer surface of the first resin layer 32A, the entire outer peripheral surface of the mounting substrate 30, and a portion of the outer peripheral surface of the second resin layer 32B (the portion on the mounting substrate 30 side in the first direction D1). The shielding layer 33 is in contact with the ground layer of the mounting substrate 30. Therefore, in the high-frequency assembly 1, the potential of the shielding layer 33 can be made the same as the potential of the ground layer (ground potential).

[0094] (2-5) Heat dissipation path of the transmitting filter

[0095] In high-frequency component 1, as described above (refer to...) Figure 2 In this embodiment, the circuit components 31 related to transmission and the circuit components 31 related to reception are separately arranged in the first single half region 35L and the second single half region 35R. In this embodiment, for example, transmission filters 7A and 7D among the multiple transmission filters 7A to 7D can operate simultaneously during simultaneous transmission. That is, simultaneous transmission using both transmission filters 7A and 7D is possible. The transmission filters 7A and 7D, which can operate simultaneously during transmission, are confined to the first single half region 35L and thus arranged close to each other. In this embodiment, heat dissipation paths for the transmission filters 7A and 7D are designed so that even if the transmission filters 7A and 7D, which can operate simultaneously, are arranged close to each other, their heat generation does not affect each other. Hereinafter, refer to... Figure 4 and Figure 5 The design will be explained in detail.

[0096] like Figure 4 As shown, the high-frequency component 1 has conductors 401 and 404 corresponding to the transmitting filters 7A and 7D at the first main surface 35 of the mounting substrate 30. Conductors 401 and 404 respectively form the heat dissipation paths for the corresponding transmitting filters 7A and 7D. Figure 4 In the first main surface 35, only the transmitting filters 7A and 7D and conductors 401 and 404 in the circuit component 31 are illustrated.

[0097] like Figure 4 As shown, the transmitting filters 7A and 7D are respectively disposed at the center of the third direction D3 and at the ends of both sides of the second direction D2 on the first main surface 35 of the mounting substrate 30. A conductor 401 constituting a heat dissipation path for the transmitting filter 7A and a conductor 404 constituting a heat dissipation path for the transmitting filter 7D are provided on the first main surface 35 of the mounting substrate 30. The conductors 401 and 404 are components other than the wiring conductors of the mounting substrate 30, but may also be composed of the wiring conductors of the mounting substrate 30.

[0098] Conductors 401 and 404 are in contact with the corresponding transmitting filters 7A and 7D and the mounting substrate 30 (see reference). Figure 5 Additionally, conductors 401 and 404 extend from their respective transmitting filters 7A and 7D to a side different from the other transmitting filter 7D and 7A and come into contact with the shielding layer 33 (see reference). Figure 4That is, conductors 401 and 404 contact the shielding layer 33 on the side of their respective transmitting filters 7A and 7D that is different from the side of the other transmitting filter 7D and 7A. More specifically, conductors 401 and 402 correspond to transmitting filters 7A and 7D. Conductor 401 contacts the shielding layer 33 on the side of its corresponding transmitting filter 7A that is different from the side of transmitting filter 7D. Conductor 404 contacts the shielding layer 33 on the side of its corresponding transmitting filter 7B that is different from the side of transmitting filter 7A.

[0099] exist Figure 4 and Figure 5 In the example, the shielding layer 33 has multiple facets (top surface 331 and four side surfaces 332-335) covering the outer surface (top surface and four side surfaces) of the resin layer 32A. In the following description, without distinguishing between the top surface 331 and the four side surfaces 332-335 of the shielding layer 33, there may be a case where the above five facets are referred to together as facets 331-335.

[0100] More specifically, in Figure 4 In this example, when viewed from the thickness direction (first direction D1) of the mounting substrate 30, conductors 401 and 404 extend from their respective transmitting filters 7A and 7D to the side opposite to the other transmitting filter 7D and 7A. Furthermore, conductors 401 and 404 contact one of the four sides 332 to 335 of the shielding layer 33 in the direction in which conductors 401 and 404 extend (e.g., sides 332 and 333). That is, conductor 401 extends upward from the corresponding transmitting filter 7A and contacts the upper side 332 of the shielding layer 33. Conductor 404 extends downward from the corresponding transmitting filter 7B and contacts the lower side 333 of the shielding layer 33.

[0101] In other words, in Figure 4 In this example, conductors 401 and 404 extend toward the sides 332 and 333 of the four sides 332 to 335 of the shielding layer 33, respectively, closest to the corresponding transmitting filters 7A and 7D, and contact the closest sides 332 and 333. In this embodiment, transmitting filters 7A and 7D are closest to the rear side 332 and the front side 333 of the four sides 332 to 335 of the shielding layer 33, respectively. Furthermore, conductors 401 and 404 extend toward the sides 332 and 333 of the four sides 332 to 335 of the shielding layer 33, respectively, closest to the corresponding transmitting filters 7A and 7D, and contact the closest sides 332 and 333.

[0102] Furthermore, the "side closest to the corresponding transmitting filters 7A and 7D among the four sides 332 to 335 of the shielding layer 33" refers to the side with the shortest vertical line drawn from the center of the transmitting filters 7A and 7D to each side 332 to 335 when viewed from the thickness direction (first direction D1) of the mounting substrate 30. Additionally, the "conductors 401 and 404 extending towards the side closest to the corresponding transmitting filters 7A and 7D" refers to conductors 401 and 404 extending along the vertical line drawn from the center of the corresponding transmitting filters 7A and 7D to the closest side 332 and 333. Therefore, when viewed from the thickness direction (first direction D1) of the mounting substrate 30, with conductors 401 and 404 in contact with the aforementioned closest sides 332 and 333, the direction in which conductors 401 and 404 extend is orthogonal to the closest sides 332 and 333.

[0103] Furthermore, in more detail, Figure 5 In the example, in a cross-sectional view taken with a section parallel to the thickness direction (first direction D1) of the mounting substrate 30, conductors 401 and 404 contact the first main surface 35 of the mounting substrate 30 and extend along the first main surface 35. Furthermore, conductors 401 and 404 extend from the first main surface 35 of the mounting substrate 30 into the interior of the corresponding placement area (in other words, the projection area) of the transmitting filters 7A and 7D, and contact the back surface of the corresponding transmitting filters 7A and 7D via connecting members (e.g., solder bumps) 41. More specifically, the transmitting filters 7A and 7D have a support substrate 71 supporting the IDT electrode 71c, and are mounted on the mounting substrate 30 such that the support substrate 71 is located between the mounting substrate 30 and the IDT electrode 71c. Conductors 401 and 404 contact the support substrate 71 of the transmitting filters 7A and 7D via connecting members 41.

[0104] Here, refer to Figure 5 The structure of the transmitting filters 7A and 7D and their mounting configuration relative to the mounting substrate 30 are further explained. Figure 5 This shows a cross-sectional view of the transmitting filter 7A. However, since transmitting filters 7A and 7D have the same structure and the same mounting configuration, therefore... Figure 5 This also serves as a cross-sectional view of the transmitting filter 7D. Furthermore, the structures and mounting configurations of the other transmitting filters 7B and 7C are identical to those of the transmitting filters 7A and 7D. In this embodiment, the transmitting filters 7A and 7D, in addition to the supporting substrate 71, each have a spacer layer 72, a cover member 73, a through electrode 74, and multiple connection terminals 75 (e.g., brazing bumps).

[0105] A circuit section (functional section) including an IDT electrode (comb electrode) 71c and multiple pad electrodes 71d are provided on one main surface 71a of the support substrate 71. That is, the support substrate 71 supports the IDT electrode 71c. The multiple pad electrodes 71d are electrodes used to electrically connect the circuit section to an external substrate (e.g., mounting substrate 30). A spacer layer 72 is a component provided between the support substrate 71 and the cover member 73 to ensure space for accommodating the circuit section (IDT electrode 71c). The spacer layer 72 is formed of an electrically insulating component (e.g., epoxy resin or polyimide) in, for example, a rectangular frame shape. The spacer layer 72 is provided to surround the circuit section (IDT electrode 71c) at the main surface 71a of the support substrate 71.

[0106] The cover member 73 is formed, for example, in a flat plate shape from an electrically insulating material (such as epoxy resin or polyimide). The cover member 73 is disposed on the spacer layer 72 in such a way that it closes the opening on the upper surface of the spacer layer 72. The through electrode 74 is a conductive member that electrically connects the pad electrodes 71d of the main surfaces 71a and 71b on both sides of the support substrate 71 to the connection terminal 75, and is configured to penetrate through the support substrate 71 along the thickness direction. The connection terminal 75 is a conductive member that electrically connects the support substrate 71 to the wiring conductor of the mounting substrate 30, for example, a solder bump. The connection terminal 75 is configured to contact the through electrode 74 at the main surface 71b of the support substrate 71 and to contact the wiring conductor of the mounting substrate 30 at the first main surface 35 of the mounting substrate 30.

[0107] Thus, the transmitting filters 7A and 7D are mounted on the mounting substrate 30 with the support substrate 71 side facing the mounting substrate 30 relative to the IDT electrode 71c. When the transmitting filters 7A and 7D generate heat, the support substrate 71 also generates heat. More specifically, the IDT electrode 71c generates heat, and the support substrate 71 generates heat. Therefore, the transmitting filters 7A and 7D are mounted on the mounting substrate 30 with the support substrate 71 side facing the mounting substrate 30. This allows the heat generated in the transmitting filters 7A and 7D to be effectively transferred to the corresponding conductors 401 and 404 via the connecting member 41.

[0108] Furthermore, the transmitting filters 7B and 7C are constructed in the same manner as the transmitting filters 7A and 7D and are mounted on the mounting substrate 30 in the same manner.

[0109] like Figure 6As shown, imagine a scenario where transmit filters 7A and 7D operate simultaneously during transmission, generating heats Q1 and Q2 from both filters. In this case, the heat Q1 generated by transmit filter 7A flows from transmit filter 7A to a side different from the other transmit filter 7D via the corresponding conductor 401 and is transferred to the shielding layer 33, where it is dissipated. Similarly, the heat Q2 generated by transmit filter 7D flows from transmit filter 7D to a side different from the other transmit filter 7A via the corresponding conductor 404 and is transferred to the shielding layer 33, where it is dissipated. Thus, the conductors 401 and 404 form the heat dissipation paths for transmit filters 7A and 7D, making these paths less susceptible to the influence of the heats Q2 and Q1 generated by the other transmit filters 7D and 7A. This improves the heat dissipation of the transmitting filters 7A and 7D, and as a result, even when the transmitting filters 7A and 7D operate simultaneously and generate heat at the same time during simultaneous transmission, the degradation of the characteristics of the transmitting filters 7A and 7D can be suppressed.

[0110] Furthermore, the improved heat dissipation of transmit filters 7A and 7D suppresses the impact of the heat Q1 and Q2 generated by transmit filters 7A and 7D on the other transmit filter 7D and 7A. This enhances the heat dissipation of the other transmit filter 7D and 7A, resulting in the suppression of characteristic degradation of the other transmit filter 7D and 7A even when they operate simultaneously and generate heat during simultaneous transmission. Thus, the degradation of the individual characteristics of transmit filters 7A and 7D can be suppressed.

[0111] In the above description, transmitting filters 7A and 7D, which are transmitting filters capable of operating simultaneously during transmission, were used as examples. In this embodiment, the high-frequency component 1 includes conductors (not shown) corresponding to transmitting filters 7B and 7C, similar to conductors 401 and 404 corresponding to transmitting filters 7A and 7D. In this embodiment, transmitting filters 7A and 7B can also operate simultaneously during transmission, and the relationship between the conductors of transmitting filters 7A and 7B is based on the same idea as the relationship between the conductors of transmitting filters 7A and 7D. Similarly, transmitting filters 7A and 7C can also operate simultaneously during transmission, and the relationship between the conductors of transmitting filters 7A and 7C is based on the same idea as the relationship between the conductors of transmitting filters 7A and 7D. As a result, the heat dissipation of transmitting filters 7A to 7D that can operate simultaneously during transmission can be improved, and the degradation of the characteristics of transmitting filters 7A to 7D can be prevented.

[0112] (3) Main effects

[0113] The high-frequency component 1 of the above embodiment includes a mounting substrate 30 (substrate), transmitting filters (e.g., 7A, 7D), a resin layer 32A, a shielding layer 33, and conductors (e.g., 401, 404). The mounting substrate 30 has a first main surface 35 and a second main surface 36 facing each other. The transmitting filter 7A is mounted on the first main surface 35 of the mounting substrate 30, using a first frequency band as a passband. The transmitting filter 7D is mounted on the first main surface 35 of the mounting substrate 30, using a second frequency band as a passband. The resin layer 32A is disposed on the first main surface 35 of the mounting substrate 30, covering at least a portion of the transmitting filters 7A and 7D. The shielding layer 33 is disposed on the outer surface of the resin layer 32A. The conductor 401 is disposed on the first main surface 35 of the mounting substrate 30, contacting the transmitting filter 7A and the mounting substrate 30. The conductor 404 is disposed on the first main surface 35 of the mounting substrate 30, contacting the transmitting filter 7D and the mounting substrate 30. Simultaneous transmission using both the transmitting filters 7A and 7D is possible. Conductor 401 contacts the shielding layer 33 on the side of the transmitting filter 7A (first filter) that is different from the side of the transmitting filter 7D (second filter). Conductor 404 contacts the shielding layer 33 on the side of the transmitting filter 7D (first filter) that is different from the side of the transmitting filter 7A (second filter). With this structure, it is possible to suppress the degradation of the characteristics of the transmitting filter 7D caused by the heat generated in the transmitting filter 7A when transmitting simultaneously using both transmitting filters 7A and 7D. Furthermore, it is possible to suppress the degradation of the characteristics of the transmitting filter 7A due to the heat generated in the transmitting filter 7D.

[0114] (4) Variations

[0115] The following describes variations of the above-described implementation method.

[0116] (4-1) Variation Example 1

[0117] This variation illustrates a modification of the extension direction of conductors 401 and 404 in the above-described embodiment. For example... Figure 7 As shown, in this modified example, when viewed from the thickness direction (first direction D1) of the mounting substrate 30, the conductor 401 extends from the corresponding transmitting filter 7A to a direction orthogonal to the arrangement direction (second direction D2) of the transmitting filters 7A and 7D (third direction D3). Furthermore, the conductor 401 contacts the side 334 of the plurality of sides 332 to 335 of the shielding layer 33, located in the direction in which the conductor 401 extends.

[0118] Furthermore, when viewed from the thickness direction (first direction D1) of the mounting substrate 30, the conductor 404 extends from the corresponding transmitting filter 7D toward a direction (third direction D3) orthogonal to the arrangement direction (second direction D2) of the transmitting filters 7A and 7D, opposite to the conductor 401. The conductor 404 contacts the side 335 of the shielding layer 33, which is located in the direction in which the conductor 404 extends, among the plurality of sides 332 to 335. Alternatively, the conductor 404 may extend in the same direction as the conductor 401 and contact the same side 334 as the conductor 401. Also, similarly to the embodiment described above, the conductor 404 extends from the corresponding transmitting filter 7D toward the side 333 on the front side of the shielding layer 33 and contacts the side 333.

[0119] That is, conductor 404 has two constituent conductors 404a and 404b. The two constituent conductors 404a and 404b are connected to each other on the inner side of the configuration area (projection area) where the corresponding transmit filter 7D is configured at the first main surface 35 of the mounting substrate 30. Constituent conductor 404a extends from the corresponding transmit filter 7D toward the front side 333 of the shielding layer 33 and contacts the front side 333. Constituent conductor 404b, when viewed from the thickness direction (first direction D1) of the mounting substrate 30, extends from the corresponding transmit filter 7D toward a direction orthogonal to the constituent conductor 404a (e.g., the right side) and contacts the right side 335 of the shielding layer 33. Alternatively, constituent conductor 404b may extend in the same direction as conductor 401 and contact the same side 334 as conductor 401. That is, two different sides 333 and 335 of the multiple faces 331 to 335 that constitute conductors 404a and 404b and shielding layer 33 are in contact.

[0120] Thus, conductor 404 interacts with two or more of the multiple faces 331-335 of shielding layer 33 (in... Figure 7 In the example, the two sides (333, 335) are in contact. This further improves the heat dissipation of the transmitting filter 7D.

[0121] According to this modified example, the heat dissipation of the transmitting filter 7D can be further improved, and as a result, the degradation of the characteristics of the transmitting filter 7A caused by the heat generated in the transmitting filter 7D can be further suppressed.

[0122] (4-2) Variation Example 2

[0123] This variation illustrates a modification of the arrangement and extension direction of conductors 401 and 404 in the above-described embodiment. For example... Figure 8As shown, in this modified example, two transmitting filters 7A and 7D that are capable of operating simultaneously during transmission are arranged, for example, at the center of the first main surface 35 of the mounting substrate 30 along the front-back direction (second direction D2).

[0124] Conductor 401 extends from the corresponding transmitting filter 7A toward the upper side 332 of the shielding layer 33 and contacts the upper side 332.

[0125] Conductor 404 extends from the corresponding transmit filter 7D toward each of the three sides 332-335 of the shielding layer 33 and contacts the three sides 332-335. More specifically, conductor 404 has three constituent conductors 404a, 404b, and 404c. The three constituent conductors 404a, 404b, and 404c are interconnected on the inner side of the arrangement area (projection area) of the corresponding transmit filter 7D at the first main surface 35 of the mounting substrate 30.

[0126] Conductor 404a extends from the corresponding transmitting filter 7D toward the front side 333 of the shielding layer 33 and contacts the front side 333. Conductors 404b and 404c, when viewed from the thickness direction (first direction D1) of the mounting substrate 30, extend from the corresponding transmitting filter 7D toward both sides in directions orthogonal to conductor 404a (left-right direction, third direction D3), and contact the left and right side surfaces 334 and 335 of the shielding layer 33. Thus, conductor 404 contacts two or more surfaces (in... Figure 8 In the example, three sides (333, 334, 335) are in contact, which further improves the heat dissipation of the transmit filter 7D. As a result, the degradation of the characteristics of the transmit filter 7A caused by the heat generated in the transmit filter 7D can be further suppressed.

[0127] (4-3) Variation Example 3

[0128] This variation illustrates a modification of the arrangement and extension direction of conductors 401 and 404 in the above-described embodiment. For example... Figure 9 As shown, in this modified example, one of the two transmitting filters 7A and 7D that can operate simultaneously, transmitting filter 7D, is disposed at the corner 35s (more specifically, near the corner 35s) of the first main surface 35 of the mounting substrate 30. The other transmitting filter 7A is disposed at an appropriate position (e.g., near the center) of the first main surface 35 of the mounting substrate 30.

[0129] Similar to the case of Modified Example 2, conductor 401 extends from the corresponding transmitting filter 7A toward the rear side 332 of the shielding layer 33 and contacts the rear side 332.

[0130] Conductor 404 extends from the corresponding transmitting filter 7D toward the two sides 333, 335 of shielding layer 33 and contacts sides 332, 335. More specifically, conductor 404 has two constituent conductors 404a, 404b and an extension portion 404d.

[0131] Two constituent conductors 404a and 404b are connected to each other on the inner side of the corresponding transmission filter 7D's configuration area (projection area) at the first main surface 35 of the mounting substrate 30. Constituent conductor 404a extends from the corresponding transmission filter 7D toward the front side 333 of the shielding layer 33 and contacts the front side 333. Constituent conductor 404b, when viewed from the thickness direction (first direction D1) of the mounting substrate 30, extends from the corresponding transmission filter 7D toward a direction orthogonal to the constituent conductor 404a (e.g., the right side) and contacts the right side 335 of the shielding layer 33. Sides 333 and 335 are two sides of the facing diagonal portion 35s among the four sides 332 to 335 of the shielding layer 33.

[0132] The extension portion 404d is formed in an L-shape along the corner 35s at the first main surface 35 of the mounting substrate 30, connecting to the top ends of the two conductors 404a and 404b. The extension portion 404d contacts the two sides 333 and 335 of the four sides 332 to 335 of the shielding layer 33 facing the corner 35s. Furthermore, when viewed from the thickness direction (first direction D1) of the mounting substrate 30, the extension portion 404d (conductor 404) extends along the two sides 333 and 335.

[0133] More specifically, the extension section 404d has a first extension section 50 and a second extension section 51. The first extension section 50 extends along the side surface 333 of the front side of the shielding layer 33 and contacts the side surface 333, extending along the left-right direction (third direction D3) of the mounting substrate 30. Figure 9 In the example, the first extension portion 50 extends, for example, from the corner 35s of the mounting substrate 30 to an end on the side opposite to the corner 35s in the third direction D3. The second extension portion 51 extends along the front-rear direction (second direction D2) of the mounting substrate 30, along the portion that contacts the side surface 335 on the right side of the shielding layer 33. Figure 9 In the example, the second extension setting part 51 extends, for example, from the corner 35s to the vicinity of the end 7a of the transmitting filter 7D in the second direction D2. The end 7a of the mounting substrate 30 is the end of the mounting substrate 30 that is farther from the corner 35s than the other end in the second direction D2.

[0134] According to this modified example, when the transmit filter 7D is disposed at the corner 35s of the first main surface 35 of the mounting substrate 30, the conductor 404 can effectively bring the corresponding transmit filter 7D into contact with two sides (e.g., sides 333, 335) of the corner 35s among the multiple sides 332 to 335 of the shielding layer 33. This further improves the heat dissipation of the transmit filter 7D. As a result, the degradation of the characteristics of the transmit filter 7A caused by the heat generated in the transmit filter 7D can be further suppressed.

[0135] (4-4) Variation Example 4

[0136] In this variation, an example is described of conductors 401-403 corresponding to the three transmitting filters 7A-7C, where all three filters (e.g., 7A-7C) can operate simultaneously during simultaneous transmission, as described in the above embodiment. Figure 10 As shown, in this modified example, three transmitting filters 7A, 7B, and 7C are arranged along the second direction D2 at the center of the first main surface 35 of the mounting substrate 30, for example, in the third direction D3.

[0137] Conductor 401 contacts the shielding layer 33 on a side of the corresponding transmitting filter 7A that differs from the sides of the other transmitting filters 7B and 7C. Conductor 402 contacts the shielding layer 33 on a side of the corresponding transmitting filter 7B that differs from the sides of the other transmitting filters 7A and 7C. Conductor 403 contacts the shielding layer 33 on a side of the corresponding transmitting filter 7C that differs from the sides of the other transmitting filters 7A and 7B.

[0138] exist Figure 10 In this example, conductor 401 extends from the corresponding transmit filter 7A toward the upper side 332 of the shielding layer 33 and contacts the upper side 332. Conductor 402 extends from the corresponding transmit filter 7B toward the right side 335 of the shielding layer 33 and contacts the right side 335. Conductor 403 extends from the corresponding transmit filter 7C toward the lower side 333 of the shielding layer 33 and contacts the lower side 333.

[0139] According to this modified example, even when the three transmitting filters 7A to 7C can operate simultaneously during simultaneous transmission, the heat dissipation of the three transmitting filters 7A to 7C can be improved in the same way as in the above-described embodiment. As a result, the degradation of the characteristics of the transmitting filters 7A to 7C can be suppressed.

[0140] (4-5) Variation Example 5

[0141] In this modified example, we will describe the case where, in the above-described embodiment, for example, the conductor 404 corresponding to the transmitting filter 7D is in contact with the top surface 331 of the shielding layer 33. Figure 11 A and Figure 11 As shown in Figure B, in this modified example, the high-frequency component 1 includes a conductive separator 56. The separator 56 is, for example, a comparison shield. More specifically, the separator 56 is, for example, a component disposed at a suitable position on the first main surface 35 of the mounting substrate 30 and separating the interior of the high-frequency component 1 (the portion surrounded by the mounting substrate 30 and the shielding layer 33). The separator 56 is formed of a conductive component (e.g., metal). The separator 56 is wall-shaped and disposed on the first main surface 35 of the mounting substrate 30. For example, the separator 56 is disposed on the first main surface 35 of the mounting substrate 30 along the second direction D2 to the right of the transmitting filters 7A and 7D (see Figure B). Figure 11 (A). The top surface 56a of the separating member 56 contacts the back side of the top surface 331 of the shielding layer 33 (see reference). Figure 11 B).

[0142] In this modified example, conductor 404 includes conductor body 49 and separator member 56. Conductor body 49 is disposed on the first main surface 35 of mounting substrate 30, contacting the corresponding transmitting filter 7D and separator member 56. More specifically, conductor body 49 is, for example, strip-shaped, contacting along the first main surface 35 of mounting substrate 30. Similar to the contact method of conductors 401, 404 and transmitting filters 7A, 7D in the embodiment, one end of conductor body 49 is disposed inside the placement area of ​​the corresponding transmitting filter 7D, contacting the support substrate 71 of transmitting filter 7D via connecting member 41 (e.g., solder bump). The other end of conductor body 49 contacts separator member 56. Figure 10 In this example, the other end of the conductor body 49 is disposed between the separator 56 and the mounting substrate 30. Thus, the conductor 404 is constructed using the existing separator 56.

[0143] In the conductor 404 configured in this way, the heat Q2 generated by the transmitting filter 7D is sequentially transferred through the support substrate 71, the connecting member 41, the conductor body 49 and the separating member 56, from the top surface 56a of the separating member 56 to the top surface 331 of the shielding layer 33, and dissipates heat from the shielding layer 33.

[0144] According to this modified example, the heat Q2 of the transmitting filter 7D can be dissipated to the top surface 331 of the shielding layer 33 without the top surface 7S of the transmitting filter 7D contacting the back side of the top surface 331 of the shielding layer 33. Furthermore, the heat Q2 of the transmitting filter 7D can be dissipated to the top surface 331 of the shielding layer 33 simply by adding the conductor body 49 to the existing separating member 56 (i.e., a simple structure).

[0145] (4-6) Variation Example 6

[0146] In Modification 5, conductor 404 utilizes a wall-shaped separating member 56, but in this modification, conductor 404 (the first conductor) utilizes a separating member 55 having an internal receiving portion 555. More specifically, as... Figure 12 As shown, in this modified example, the partition member 55 is formed from a conductive material (such as copper) in a box shape, for example, a cuboid. An internal storage space (internal storage portion 555) is formed inside the partition member 55 to accommodate a circuit board 53 on which electronic components are mounted. That is, the partition member 55 in this modified example is a member that divides the interior of the high-frequency component 1 (the portion surrounded by the mounting substrate 30 and the shielding layer 33) into an interior and an exterior of the partition member 55. The partition member 55 is mounted on the first main surface 35 of the mounting substrate 30. The top surface 55a of the partition member 55 contacts the back side of the top surface 331 of the shielding layer 33.

[0147] More specifically, the partition member 55 includes a substrate 551, a shielding wall 552, and a connecting member 553. The shielding wall 552 is formed of a conductive material (e.g., copper) and is box-shaped with an opening on its lower surface. The shielding wall 552 is provided on the substrate 551 such that the lower surface opening of the shielding wall 552 is closed by the substrate 551. The space surrounded by the substrate 551 and the shielding wall 552 constitutes the internal storage portion 555 for housing the circuit board 53. The circuit board 53 is mounted on the substrate 551. The connecting member 553 is a component that electrically connects the substrate 551 to the mounting substrate 30, such as a solder bump. The connecting member 553 includes a grounding connecting member. The interior of the partition member 55 is hollow in this embodiment, but it may also be filled with a resin layer. The top surface 552a of the shielding wall 552 (i.e., the top surface 55a of the partition member 55) is in contact with the back side of the top surface 331 of the shielding layer 33.

[0148] In this variation, the conductor 404 corresponding to the transmitting filter 7D includes a conductor body 49 and a separator member 55. The conductor body 49 is formed in the same manner as the conductor body 49 in Variation 5. That is, the conductor body 49 is formed, for example, in a strip shape, and contacts the first main surface 35 of the mounting substrate 30. Similar to the embodiment described above, one end of the conductor body 49 contacts the transmitting filter 7D via a connecting member 41 (e.g., a solder bump). Furthermore, the other end of the conductor body 49 is disposed inside the arrangement area of ​​the separator member 55 on the first main surface 35 of the mounting substrate 30, and contacts the back side of the separator member 55 (i.e., the back side of the substrate 551) via a connecting member 556 (e.g., a solder bump). The connecting member 556 may also contact the shielding wall 552 via a wiring conductor within the substrate 551. That is, the conductor body 49 may also contact the shielding wall 552 via the connecting member 556 and the wiring conductor within the substrate 551. Thus, in this modified example, similar to the case of modified example 5, the conductor 404 is constructed using the existing separator 55.

[0149] In the conductor 404 configured in this way, similar to the modified example 5, the heat Q2 generated by the transmitting filter 7D is sequentially transferred through the support substrate 71, the connecting member 41, the conductor body 49 and the separating member 55, and is transferred from the top surface 55a of the separating member 55 to the top surface 331 of the shielding layer 33, and is dissipated from the top surface 331.

[0150] Similar to Modification 5, in this modified example, the heat of the transmitting filter 7D can be dissipated to the top surface 331 of the shielding layer 33 without the top surface of the transmitting filter 7D contacting the top surface 331 of the shielding layer 33. Furthermore, the heat of the transmitting filter 7D can be dissipated to the top surface 331 of the shielding layer 33 simply by adding the conductor body 49 to the existing separating member 55 (i.e., a simple structure).

[0151] In this modified example, a conductor 54 (second conductor) may also be provided on the bottom surface (front surface 551a of substrate 551) of the internal storage portion 555 of the partition member 55. The conductor 54 is a component that electrically connects the circuit board 53 to the shielding wall 552. The circuit board 53 contacts the shielding wall 552 via the conductor 54. Using this conductor 54, the heat Q3 generated in the circuit board 53 is transferred to the top surface 331 of the shielding layer 33 via the conductor 54 and the shielding wall 552, and dissipated from the top surface 331. That is, the partition member 55 serves as both a heat dissipation path for the transmitting filter 7D and a heat dissipation path for the circuit board 53. Thus, when the circuit board 53 is housed inside the partition member 55, the heat of the circuit board 53 can also be dissipated via the conductor 54, the partition member 55, and the shielding layer 33.

[0152] (4-7) Variation Example 7

[0153] In this variation, such as Figure 13 A and Figure 13 As shown in Figure B, signal lines (e.g., 81, 82) located inside the mounting substrate 30 overlap with conductors (e.g., 402, 501) that form the heat dissipation path of filters (e.g., transmit filter 7B and receive filter 8A). Furthermore, in Figure 13 A and Figure 13 In B, only the transmitting filters 7A and 7B of the transmitting filters 7A to 7D are shown, and only the receiving filter 8A of the receiving filters 8A to 8D is shown.

[0154] More specifically, such as Figure 13 As shown in B, in this modified example, the mounting substrate 30 is, for example, a multilayer substrate. Filters (transmitting filters 7A, 7B and receiving filter 8A) and conductors 401, 402, 501 corresponding to the aforementioned filters (transmitting filter 7A, transmitting filter 7B, receiving filter 8A) are mounted on the first main surface 35 of the mounting substrate 30.

[0155] Conductors 401, 402, and 501 are disposed on the first main surface 35 of the mounting substrate 30 (see reference). Figure 13 (A) One end of conductor 401 extends into the configuration area of ​​the corresponding transmitting filter 7A and contacts the corresponding transmitting filter 7A via connecting member 41. The other end of conductor 401 extends from the corresponding transmitting filter 7A to a side (left side) different from the side of transmitting filter 7B and receiving filter 8A and contacts the side 334 of shielding layer 33. One end of conductor 402 extends into the configuration area of ​​the corresponding transmitting filter 7B and contacts the corresponding transmitting filter 7B via connecting member 41. The other end of conductor 402 extends from the corresponding transmitting filter 7B to a side (rear side) different from the side of transmitting filter 7A and receiving filter 8A and contacts the side 332 of shielding layer 33. One end of conductor 501 extends into the configuration area of ​​the corresponding receiving filter 8A and contacts the corresponding receiving filter 8A via connecting member 41. The other end of conductor 501 extends from the corresponding receiving filter 8A to a side (rear side) different from the side of transmitting filter 7A and transmitting filter 7B and contacts the side 332 of shielding layer 33.

[0156] A first switch 14 is mounted on the second main surface 36 of the mounting substrate 30. Multiple signal lines 81 to 83 are provided inside the mounting substrate 30. These signal lines 81 to 83 are, for example, signal lines for transmitting or receiving signals. Signal lines 81 and 82 electrically connect, for example, transmitting filters 7A and 7B to the selection terminals 14h and 14i of the first switch 14. Signal line 83 electrically connects the receiving filter 8A to the selection terminal 14d of the first switch 14.

[0157] Signal line 81 extends from the transmitting filter 7A through the interior of the mounting substrate 30 and through the underside of conductor 402 to the selection terminal 14h of the first switch 14. Signal line 82 extends from the transmitting filter 7B through the interior of the mounting substrate 30 and through the underside of conductor 403 to the selection terminal 14i of the first switch 14. Signal line 83 extends from the receiving filter 8A through the interior of the mounting substrate 30 to the selection terminal 14d of the first switch 14. Furthermore, signal lines 81 to 83 are disposed inside the mounting substrate 30, but they may be disposed in at least one of the interior of the mounting substrate 30 and the second main surface 36.

[0158] like Figure 13 A and Figure 13As shown in Figure B, in this modified example, when viewed from the thickness direction (first direction D1) of the mounting substrate 30, at least a portion of the signal line 81 overlaps with the conductor 402. Alternatively, when viewed from the thickness direction (first direction D1) of the mounting substrate 30, at least a portion of the signal line 81 overlaps with the conductor 501. Furthermore, at least a portion of the signal line 82 overlaps with the conductor 501.

[0159] In this modified example, when viewed from the thickness direction (first direction D1) of the mounting substrate 30, the signal line 81 overlaps with the conductor 402. Therefore, the conductor 402 can suppress the transmission of noise (electromagnetic waves) generated from the signal line 81 to the transmitting filter 7B. Additionally, the conductor 402 can suppress the transmission of noise generated from the transmitting filter 7B to the signal line 81. Similarly, the signal line 82 overlaps with the conductor 501. Therefore, the conductor 501 can suppress the transmission of noise generated from the signal line 82 to the receiving filter 8A. Additionally, the conductor 501 can suppress the transmission of noise generated from the receiving filter 8A to the signal line 82. As a result, the signal line 81 and the transmitting filter 7B can be electromagnetically shielded from each other. Furthermore, the signal line 82 and the receiving filter 8A can be electromagnetically shielded from each other.

[0160] (4-8) Other variations

[0161] In the above embodiments, the case where transmitting filters 7A and 7D operate simultaneously when transmitting is illustrated. However, when receiving filters 8A to 8D operate simultaneously when receiving is illustrated, the heat dissipation path of the simultaneously operating receiving filters 8A to 8D can also be formed by conductors such as conductors 401 and 404 in the above embodiments.

[0162] In the above embodiments, when the transmitting filters 7A-7D and the receiving filters 8A-8D are operating simultaneously (simultaneous transmission and reception), the present invention can also be applied by combining the transmitting filters 7A-7D and the receiving filters 8A-8D that are operating simultaneously.

[0163] In the above embodiments, the mounting substrate 30 is rectangular, but it can typically be either polygonal or circular. The top view of the shielding layer 33 is the same as that of the mounting substrate 30. Therefore, when the mounting substrate 30 is polygonal or circular, the top view of the shielding layer 33 is also polygonal or circular.

[0164] The above-described embodiments and variations 1 to 7 can also be implemented in combination.

[0165] In the above embodiment, two transmitting filters 7A and 7D that can operate simultaneously during simultaneous transmission are connected to power amplifiers 5A and 5B, respectively. In this case, the maximum output of power amplifier 5A may be greater than the maximum output of power amplifier 5B. Furthermore, in this case, the conductor 401 may be provided only in the transmitting filter 7A connected to the power amplifier 5A with the larger maximum output, while the conductor 404 of the transmitting filter 7D connected to the power amplifier 5B with the smaller maximum output may be omitted. Alternatively, the heat dissipation performance of the conductor 401 of the transmitting filter 7A connected to the power amplifier 5A with the larger maximum output may be set to be higher than that of the conductor 404 of the transmitting filter 7D connected to the power amplifier 5B with the smaller maximum output.

[0166] That is, when the maximum output of power amplifier 5A is greater than the maximum output of power amplifier 5B, the heat generated by power amplifier 5A is greater than that generated by power amplifier 5B. Furthermore, if power amplifier 5A generates more heat, this heat flows into power amplifier 5B, potentially causing a degradation in the characteristics of power amplifier 5B. The same applies to the transmitting filters 7A and 7D connected to power amplifiers 5A and 5B. That is, the transmitting filter 7A connected to the power amplifier 5A with the larger maximum output generates more heat than the transmitting filter 7D connected to the power amplifier 5B with the smaller maximum output. Therefore, in this modified example, conductor 401 is provided in the transmitting filter 7A, which generates more heat, to improve the heat dissipation of the transmitting filter 7A, thereby suppressing the degradation of the characteristics of the transmitting filter 7D caused by the heat generated by the transmitting filter 7A.

[0167] Furthermore, in this modified example, the focus is on the maximum output of power amplifiers 5A and 5B, but the focus could also be on the power class of power amplifiers 5A and 5B. Power class is a classification of the output power of a terminal defined by maximum output power, etc.; a smaller value indicates a higher power output. The maximum output power of a high power class is greater than that of a non-high power class. Maximum output power is measured, for example, using methods defined by 3GPP, etc. In the above description, power amplifier 5A corresponds to a high power class, and power amplifier 5B corresponds to a non-high power class. That is, it is also possible to only provide conductor 401 connected to the transmit filter 7A of the power amplifier 5A with a lower power class, and omit conductor 404 connected to the transmit filter 7D of the power amplifier 5B with a lower power class.

[0168] (5) Method

[0169] The following methods are disclosed in this specification.

[0170] The high-frequency component (1) of the first method includes a mounting substrate (30), a first filter (e.g., 7A) and a second filter (e.g., 7D), a resin layer (32A), a shielding layer (33), and a conductor (e.g., 401). The mounting substrate (30) has a first main surface (35) and a second main surface (36) opposite to each other. The first filter (7A) is mounted on the first main surface (35) of the mounting substrate (30) and uses a first frequency band as a passband. The second filter (7D) is mounted on the first main surface (35) of the mounting substrate (30) and uses a second frequency band as a passband. The resin layer (32A) is disposed on the first main surface (35) of the mounting substrate (30) and covers at least a portion of the first filter (7A) and the second filter (7D). The shielding layer (33) is disposed on the outer surface of the resin layer (32A). Simultaneous transmission or simultaneous reception using both the first filter (7A) and the second filter (7D) is possible. The conductor (401) is disposed on the first main surface (35) of the mounting substrate (30) and is in contact with the first filter (7A) and the mounting substrate (30). The conductor (401) is in contact with the shielding layer (33) on the side of the first filter (7A) that is different from the side of the second filter (7D).

[0171] According to this structure, the conductor (e.g., 401) can be used to suppress the degradation of the characteristics of the second filter (7D) caused by the heat generated in the first filter (7A) when transmitting simultaneously using both the first filter (e.g., 7A) and the second filter (e.g., 7D). More specifically, the conductor (401) can be used to configure the heat dissipation path of the first filter (7A) so that it is less susceptible to the heat generated in the second filter (7D). As a result, the heat dissipation performance of the first filter (7A) is improved, and the heat of the first filter (7A) affecting the second filter (7D) can be suppressed. Consequently, the degradation of the characteristics of the second filter (7D) caused by the heat of the first filter (7A) can be suppressed. In addition, by using the conductor (401) to form the heat dissipation path of the first filter (7A), the heat flowing through the heat dissipation path of the first filter (7A) affecting the second filter (7D) can be suppressed. As a result, the heat dissipation performance of the second filter (7D) is improved, and the heat of the second filter (7D) affecting the first filter (7A) can be suppressed. As a result, it is possible to suppress the degradation of the characteristics of the first filter (7A) caused by the heat of the second filter (7D).

[0172] Based on the first method, the high-frequency component (1) of the second method further includes a first power amplifier (5A) and a second power amplifier (5B). The first power amplifier (5A) is connected to the first filter (7A). The second power amplifier (5B) is connected to the second filter (7D).

[0173] According to this structure, even if the present invention is applied to a structure having a first power amplifier (5A) and a second power amplifier (5B) connected to a first filter (7A) and a second filter (7D), the degradation of the characteristics of the first filter (7A) and the second filter (7D) can be suppressed.

[0174] In the high-frequency component (1) of the third method, based on the second method, the maximum output of the first power amplifier (e.g., 7A) is greater than the maximum output of the second power amplifier (e.g., 7D).

[0175] According to this structure, the heat dissipation of the first filter (7A) connected to the first power amplifier (5A) with a large maximum output can be improved by using the conductor (404).

[0176] In the high-frequency component (1) of the fourth type, based on any of the first to third types, the first filter (e.g., 7A) is an elastic wave filter. The first filter (7A) has an IDT electrode (71c) and a support substrate (71). The support substrate (71) supports the IDT electrode (71c). The first filter (e.g., 7A) is mounted on the mounting substrate (30) such that the support substrate (71) is located between the mounting substrate (30) and the IDT electrode (71c).

[0177] According to this structure, in the first filter (e.g., 7A) where the support substrate (71) generates heat, the heat generated on the support substrate (71) can be effectively transferred to the conductor (401). As a result, the heat dissipation performance of the first filter (e.g., 7A) can be further improved.

[0178] In the high-frequency component (1) of the fifth type, based on any of the first to fourth types, the shielding layer (33) has multiple facets (331 to 335) covering the outer surface of the resin layer (32A). The conductor (401) contacts the facet (331 to 335) located on the side different from the side of the first filter (e.g., 7A) from the side of the second filter (7D).

[0179] According to this structure, even when the shielding layer (33) has multiple faces (331 to 335) (i.e., the first main face (35) of the mounting substrate (30) is polygonal), the present invention can suppress the degradation of the characteristics of the first filter (7A) and the second filter (7D).

[0180] In the high-frequency component (1) of the sixth embodiment, based on the fifth embodiment, multiple faces (331-335) include multiple sides (332-335) of a shielding layer (33). A conductor (e.g., 401) contacts the side of the multiple sides (332-335) closest to the first filter (e.g., 7A).

[0181] According to this structure, the conductor (e.g., 401) (i.e., the heat dissipation path of the first filter (e.g., 7A)) can be minimized. This improves the heat dissipation performance of the first filter (e.g., 7A).

[0182] In the high-frequency component (1) of the seventh method, based on the fifth or sixth method, the conductor (e.g., 401) contacts two or more of the multiple faces (331 to 335) of the shielding layer (33).

[0183] Based on this structure, the heat dissipation of the first filter (e.g., 7A) can be improved.

[0184] In the high-frequency component (1) of the eighth embodiment, based on any of the fifth to seventh embodiments, multiple face surfaces (331 to 335) include multiple sides (332 to 335) of the shielding layer (33). The first main surface (35) of the mounting substrate (30) has a corner (35s). A first filter (e.g., 7D) is disposed at the corner (35s) ​​of the first main surface (35) of the mounting substrate (30). A conductor (e.g., 404) is formed along the corner (35s) ​​at the first main surface (35) of the mounting substrate (30) and contacts two sides (e.g., 333, 335) of the corner (35s) ​​among the multiple sides (332 to 335) of the shielding layer (33).

[0185] According to this structure, when the first filter (e.g., 7D) is disposed at the corner (35s) ​​of the first main surface (35) of the mounting substrate (30), the first filter (7D) can be effectively brought into contact with two sides (e.g., 333, 335) of the facing corner (35s) ​​among the multiple sides (332-335) of the shielding layer (33). As a result, the heat dissipation of the first filter (e.g., 7D) can be improved.

[0186] In the high-frequency component (1) of the ninth method, based on the eighth method, when viewed from the thickness direction (D1) of the mounting substrate (30), the conductor (404) extends along each of the two sides (e.g., 333, 335).

[0187] According to this structure, the conductor (404) can be formed into a shape (e.g., an L-shape) contact along the corner (35s).

[0188] In the high-frequency component (1) of the 10th type, based on any of the 1st to 9th types, a signal line (e.g., 81) for transmitting or receiving signals is provided in at least one of the interior of the mounting substrate (30) and the second main surface (36) of the mounting substrate (30). When viewed from the thickness direction (D1) of the mounting substrate (30), at least a portion of the signal line (e.g., 81) overlaps with a conductor (e.g., 402).

[0189] According to this structure, the first filter (e.g., 7B) and the signal line (e.g., 81) can be electromagnetically shielded from each other using a conductor (e.g., 402). More specifically, the conductor (402) can be used to suppress the transmission of electromagnetic noise from the signal line (81) to the conductor (402) side (i.e., the first filter (7B) side). In addition, the conductor (402) can be used to suppress the transmission of electromagnetic noise from the first filter (7B) to the signal line (81).

[0190] In the high-frequency component (1) of the 11th embodiment, based on any of the 1st to 10th embodiments, the conductor (404) includes a conductor body (49) and conductive separators (56, 55). The conductor body (49) is disposed along the first main surface (35) of the mounting substrate (30) and contacts the first filter (7A). The separators (56, 55) are disposed on the first main surface (35) of the mounting substrate (30) and contact the conductor body (49) and the shielding layer (33).

[0191] According to this structure, the heat of the first filter (7D) can be dissipated to the shielding layer (33) (e.g., the top surface) without the first filter (e.g., 7D) (e.g., the top surface (331)) coming into contact with the shielding layer (33) (e.g., the top surface (331)). Furthermore, the heat of the first filter (e.g., 7D) to the shielding layer (33) (e.g., the top surface (331)) can be dissipated simply by adding a conductor body (49) to the existing partition members (56, 55) (i.e., a simple structure).

[0192] In the high-frequency component (1) of the 12th embodiment, based on the 11th embodiment, the conductor (404) is designated as the first conductor (404). The separator (55) has an internal housing portion (555) for housing the substrate (53) on which the circuit components are mounted. The substrate (53) contacts the separator (55) via a second conductor (54) provided on the bottom surface of the separator (55) (i.e., the front surface (551a) of the substrate (551)).

[0193] According to this structure, when the substrate (53) is housed inside the partition member (55), the heat of the substrate (53) can also be dissipated to the top surface (331) of the shielding layer (33) via the second conductor (54) and the partition member (55).

[0194] In the high-frequency component (1) of the 13th embodiment, based on any of the 1st to 12th embodiments, the conductor (401) is designated as the first conductor (401). The high-frequency component (1) also includes a third filter (7C), a second conductor (402), and a third conductor (403). The third filter (7C) is mounted on the first main surface (35) of the mounting substrate (30) and uses the third frequency band as a passband. The second conductor (402) is disposed on the first main surface (35) of the mounting substrate (30) and contacts the second filter (7B) and the mounting substrate (30). The third conductor (403) is mounted on the first main surface (35) of the mounting substrate (30) and contacts the third filter (7C) and the mounting substrate (30). A resin layer (32A) covers at least a portion of the first filter (7A), the second filter (7B), and the third filter (7C). Simultaneous transmission using the first filter (7A), the second filter (7B), and the third filter (7C) is possible. The first conductor (401) contacts the shielding layer (33) on the side of the first filter (7A) that is different from the side of the second filter (7B) and the side of the third filter (7C). The second conductor (402) contacts the shielding layer (33) on the side of the second filter (7B) that is different from the side of the first filter (7A) and the side of the third filter (7C). The third conductor (403) contacts the shielding layer (33) on the side of the third filter (7C) that is different from the side of the first filter (7A) and the side of the second filter (7B).

[0195] According to this structure, the present invention can be applied to the first to third filters (7A to 7C) used in simultaneous transmission. As a result, the heat dissipation of the first to third filters (7A to 7C) used in simultaneous transmission can be improved.

[0196] The communication device (100) of the 14th mode includes a high-frequency component (1) of any of the 1st to 13th modes and a signal processing circuit (2), wherein the signal processing circuit (2) is connected to the high-frequency component (1) and performs signal processing on the high-frequency signal.

[0197] According to this structure, a communication device (100) with a high-frequency component (1) having the above-mentioned effects can be provided.

[0198] Explanation of reference numerals in the attached figures

[0199] 1. High-frequency components; 2. Signal processing circuit; 3A-3C, Antenna; 5A, Power amplifier (1st power amplifier); 5B, Power amplifier (2nd power amplifier); 6A-6D, Low-noise amplifier; 7A, Transmit filter (1st filter, 2nd filter); 7B, Transmit filter (1st filter, 2nd filter); 7C, Transmit filter (3rd filter); 7D, Transmit filter (1st filter, 2nd filter); 8A-8B, Receive filter; 10A, 10B, Output matching circuit; 11A-11D, 12A-12C, Matching circuit; 14, 1st switch; 14a- 14c, Common terminal; 14d-14k, Selector terminals; 15, Second switch; 15a, Common terminal; 15b-15d, Selector terminals; 16, Third switch; 16a-16c, Common terminal; 16d-16g, Selector terminals; 17, Controller; 18A-19j, External connection terminals; 21, Baseband signal processing circuit; 22, RF signal processing circuit; 30, Mounting substrate (first substrate); 31, Circuit components; 32A, First resin layer; 32B, Second resin layer; 33, Shielding layer; 35, First main surface; 35L, First single half region; 35R, Second single half region; 35s, Corner. 36. Second main surface; 401. Conductor (first conductor); 402. Conductor (second conductor); 403. Conductor (third conductor); 404. Conductor (first conductor); 501. Conductor; 41. Connecting member; 49. Conductor body; 50. First extension part; 51. Second extension part; 53. Circuit board (board); 54. Conductor (second conductor); 55. 56. Separating member; 55a, 56a. Top surface; 71. Supporting substrate; 71a, 71b. Main surface; 71c. IDT electrode; 71d. Pad electrode; 72. Spacer layer; 73. Cover member; 74. Through electrode; 75. Connection Terminals; 81-83, signal lines; 100, communication devices; 331, top surface; 331-335, front surface; 332-335, side surface; 404a-404c, conductors; 404d, extension section; 551, substrate; 551a, front surface; 552, shielding wall; 552a, top surface; 553, connecting member; 555, internal storage section; 556, connecting member; D1, first direction (thickness direction); D2, second direction; D3, third direction; Q1-Q3, heat; R1-R4, T1-T4, signal paths; Tc, common path; T21, T31, T41, independent paths.

Claims

1. A high-frequency component, wherein, The high-frequency component includes: The mounting substrate has a first main surface and a second main surface that are opposite to each other; A first filter is mounted on the first main surface of the mounting substrate and uses the first frequency band as a passband. A second filter is mounted on the first main surface of the mounting substrate and uses the second frequency band as a passband. A resin layer is disposed on the first main surface of the mounting substrate, covering at least a portion of the first filter and the second filter; A shielding layer is disposed on the outer surface of the resin layer; and A conductor, disposed on the first main surface of the mounting substrate, in contact with the first filter and the mounting substrate. It is capable of transmitting simultaneously using both the first filter and the second filter. The conductor contacts the shielding layer on the side of the first filter that is different from the side of the second filter.

2. The high-frequency component according to claim 1, wherein, The high-frequency component also includes: A first power amplifier, which is connected to the first filter; and The second power amplifier is connected to the second filter.

3. The high-frequency component according to claim 2, wherein, The maximum output of the first power amplifier is greater than the maximum output of the second power amplifier.

4. The high-frequency component according to any one of claims 1 to 3, wherein, The first filter is an elastic wave filter. The first filter has IDT electrodes and a support substrate supporting the IDT electrodes. The first filter is mounted on the mounting substrate such that the support substrate is located between the mounting substrate and the IDT electrode.

5. The high-frequency component according to any one of claims 1 to 3, wherein, The shielding layer has a plurality of facets covering the outer surface of the resin layer. The conductor contacts the face of the plurality of faces located on the side of the first filter that is different from the side of the second filter.

6. The high-frequency component according to claim 5, wherein, The plurality of faces includes the plurality of sides of the shielding layer. The conductor contacts the side closest to the first filter among the plurality of sides.

7. The high-frequency component according to claim 5, wherein, The conductor contacts two or more of the plurality of faces of the shielding layer.

8. The high-frequency component according to claim 5, wherein, The plurality of faces includes the plurality of sides of the shielding layer. The first main surface of the mounting substrate has a corner portion. The first filter is disposed at the corner of the first main surface of the mounting substrate. The conductor is formed along the corner at the first main surface of the mounting substrate and contacts two of the plurality of sides of the shielding layer that face the corner.

9. The high-frequency component according to claim 8, wherein, When viewed from the thickness direction of the mounting substrate, the conductor extends along each of the two sides.

10. The high-frequency component according to any one of claims 1 to 3, wherein, In the mounting substrate, at least one of the interior of the mounting substrate and the second main surface is provided with signal lines for the flow of transmitting or receiving signals. When viewed from the thickness direction of the mounting substrate, at least a portion of the signal line overlaps with the conductor.

11. The high-frequency component according to any one of claims 1 to 3, wherein, The conductor comprises: A conductor body, disposed along the first main surface of the mounting substrate, and in contact with the first filter; and A conductive separator is disposed on the first main surface of the mounting substrate and is in contact with the conductor body and the shielding layer.

12. The high-frequency component according to claim 11, wherein, Designate the conductor as the first conductor. The separating member has an internal storage portion for accommodating a substrate on which circuit components are mounted. The substrate contacts the separator via a second conductor located on the bottom surface of the separator.

13. The high-frequency component according to any one of claims 1 to 3, wherein, Designate the conductor as the first conductor. The high-frequency component also includes: A third filter is mounted on the first main surface of the mounting substrate and uses the third frequency band as a passband. A second conductor, disposed on the first main surface of the mounting substrate, in contact with the second filter and the mounting substrate; and The third conductor, which is mounted on the first main surface of the mounting substrate, is in contact with the third filter and the mounting substrate. The resin layer covers at least a portion of the first filter, the second filter, and the third filter. It is capable of transmitting simultaneously using the first filter, the second filter, and the third filter. The first conductor contacts the shielding layer on the side of the first filter that is different from the side of the second filter and the side of the third filter. The second conductor contacts the shielding layer on the side of the second filter that is different from the side of the first filter and the side of the third filter. The third conductor contacts the shielding layer on the side of the third filter that is different from the side of the first filter and the side of the second filter.

14. A communication device, wherein, The communication device includes: The high-frequency component according to any one of claims 1 to 13; and A signal processing circuit, connected to the high-frequency component, performs signal processing on the high-frequency signal.

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