Laser cleaning processing head and method applied to laser cleaning of surface of hardware terminal

Abstract

A kind of laser cleaning processing head and method applied to the surface laser cleaning of hardware terminal, including optical fiber joint, collimating assembly, electric displacement table, mirror assembly, two-dimensional galvanometer module and focusing mirror assembly;Optical fiber joint is used to be connected with output optical fiber and locked, optical fiber joint is connected with collimating assembly, collimating assembly is connected with mirror assembly, mirror assembly is connected with two-dimensional galvanometer module, focusing mirror assembly is equipped on two-dimensional galvanometer module;Collimating assembly is used to make the laser beam of output optical fiber transmission carry out beam expansion and collimation, ensure that the diameter of laser beam matches with the diameter of focusing mirror assembly;Electric displacement table is installed on collimating assembly.The collimating optical lens group of laser cleaning processing head of the application can move within a certain range along the axis, so that the light beam after collimating lens group presents divergent or convergent state, finally changes the size and focal depth of focused spot, satisfies the demand of diversified cleaning process.

Description

Technical Field

[0001] This invention belongs to the field of laser cleaning processing technology, and specifically relates to a laser cleaning processing head and method for laser cleaning of metal terminal surfaces. Background Technology

[0002] High-current hardware terminals (generally made of copper, which is inexpensive and has good electrical and thermal conductivity) are important conductive components in the electrical circuits of large hydro-generators. They are mainly used to connect two sections of enclosed busbar conductors. Due to the effects of air sulfidation during use, once the conductive contact surface of the hardware terminals is contaminated with sulfide for a long time, it will significantly increase the heat generation, which can lead to deformation of the hardware terminals, greatly reducing their service life, and even causing shutdown and power loss. Existing cleaning methods, whether manual polishing or dry ice cleaning, cannot be carried out while the unit is energized. The unit must be shut down and the power must be disconnected before cleaning can be carried out. After cleaning, it is necessary to collect and clean the adhering residue around the work area, which has the disadvantages of low efficiency and serious pollution. Therefore, there is an urgent need for a non-contact, environmentally friendly and efficient cleaning method to solve the problem of cleaning the surface sulfide contamination of high-current hardware terminals while energized. At the same time, it should be able to form a denser passivation film on the conductive contact surface of the hardware terminals after cleaning the surface sulfide contamination, thereby improving the ability to resist sulfide contamination. To address the aforementioned issues, many companies are developing laser cleaning equipment, but currently there is a lack of controllable laser cleaning processing heads. Summary of the Invention

[0003] In view of the technical problems existing in the background art, the laser cleaning head and method for laser cleaning of metal terminal surfaces provided by the present invention can move the collimating optical lens group of the laser cleaning head back and forth within a certain range along the axis, so that the beam after passing through the collimating lens group presents a divergent or convergent state, and ultimately changes the size and depth of focus of the focused spot to meet the diverse cleaning process requirements.

[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0005] A laser cleaning head for laser cleaning of hardware terminal surfaces includes an optical fiber connector, a collimation assembly, an electric displacement stage, a reflector assembly, a two-dimensional galvanometer module, and a focusing lens assembly. The optical fiber connector is used to connect and lock with the output optical fiber. The optical fiber connector is connected to the collimation assembly, the collimation assembly is connected to the reflector assembly, and the reflector assembly is connected to the two-dimensional galvanometer module. The two-dimensional galvanometer module is equipped with a focusing lens assembly. The collimation assembly is used to expand and collimate the laser beam transmitted by the output optical fiber, ensuring that the diameter of the laser beam matches the diameter of the focusing lens assembly. The electric displacement stage is mounted on the collimation assembly.

[0006] In a preferred embodiment, the collimation assembly includes a collimating optical lens group;

[0007] The reflector assembly includes reflective lenses;

[0008] The two-dimensional galvanometer module includes an X-axis galvanometer and a Y-axis galvanometer;

[0009] The focusing lens assembly includes a focusing optical lens group;

[0010] The laser beam delivered by the output optical fiber passes sequentially through the collimating optical lens group, the reflecting lens, the X-axis galvanometer, the Y-axis galvanometer, and the focusing optical lens group before reaching the surface of the hardware terminal for cleaning; the electric displacement stage is used to drive the movement of the collimating optical lens group.

[0011] The electric displacement stage can be equipped with an electric actuator. Other linear modules in this invention can also employ an electric actuator structure.

[0012] In a preferred embodiment, the laser cleaning head is mounted on a three-axis motion mechanism, which includes an X-axis module, a Y-axis module, and a Z-axis module; the laser cleaning head is mounted on the X-axis module of the three-axis motion mechanism.

[0013] In a preferred embodiment, the X-axis galvanometer is dynamically deflected by a motor in the X-direction of the plane, and the Y-axis galvanometer is dynamically deflected by a motor in the Y-direction. The X-axis galvanometer and the Y-axis galvanometer together constitute a two-dimensional deflection galvanometer.

[0014] The laser generator outputs laser light sequentially through the fiber optic connector, the collimating optical lens group, the scanning mirror module, and the focusing optical lens group before irradiating the surface of the workpiece to be cleaned, forming a focused spot. Simultaneously, the electrical control system controls the deflection and scanning angle of the scanning mirror module to achieve extremely rapid movement and scanning of the focused spot, forming a filled pattern of a predetermined shape, thus achieving cleaning and decontamination of the selected area. The collimating optical lens group can be moved axially within a certain range by the electric displacement stage, causing the beam after passing through the collimating optical lens group to exhibit divergence or convergence, thereby changing the focal length, focused spot diameter, and depth of focus to meet diverse cleaning process requirements. The focusing optical lens group is a lens group that defines the laser scanning field area. The focusing optical lens group module consists of one or more optical focusing lenses, and its structure and materials include, but are not limited to, transmission focusing fused silica coated optical lenses. Its collimating focal length can be selected according to actual processing requirements, with a selection range of 40mm-150mm. The moving distance of the collimating optical lens group can be selected according to actual processing requirements, and the selection range of the moving distance of the collimating optical lens group is ±15mm.

[0015] Preferably, the cleaning method for the laser cleaning head applied to the laser cleaning of hardware terminal surfaces includes the following steps:

[0016] S1: Equipment assembly before cleaning: Install the laser cleaning head on the X-axis module of the three-axis motion mechanism. Connect the laser generator through the output fiber optic connector. The laser generator is electrically connected to the electrical control system. The electrical control system is electrically connected to the laser cleaning head and the three-axis motion mechanism.

[0017] S2: Operate the three-axis motion mechanism to focus the laser beam of the laser cleaning head within ±1mm of the workpiece surface;

[0018] S3: Activate the two-dimensional galvanometer module of the laser cleaning head, which adopts an interlaced structure of XY spatial normal directions; adjust the XY scanning amplitude to a suitable cleaning range for the hardware terminals;

[0019] S4: By controlling the positions of the X-axis module, Y-axis module, and Z-axis module of the three-axis motion mechanism, pre-run the cleaning area of ​​the hardware terminal several times; if an alarm occurs during operation, stop the movement immediately, clear the alarm, and then run again. During operation, always pay attention to the smooth movement of the module and avoid any jamming.

[0020] S5: Start the laser generator to emit indicator red light. Following the method in step S3, start the two-dimensional galvanometer module of the laser cleaning head and adjust the XY scanning amplitude until the indicator red light covers the appropriate cleaning range of the hardware terminal. Then, follow the method in step S4 to conduct a trial run to ensure that the indicator red light can completely cover the cleaning area of ​​the hardware terminal during the trial run, and there should be no omissions or exceeding the cleaning area of ​​the hardware terminal.

[0021] S6: Start the laser generator to emit laser and run the process of step S5. At the same time, manually clean and verify the laser power, pulse width and repetition frequency parameters of the laser generator through the electrical control system. Observe whether the cleaning of sulfur contamination on the surface of the hardware terminal is qualified. If it is not qualified, adjust the collimating optical lens group to move back and forth a certain position through the electric displacement stage to change the energy distribution of the cleaning area. Perform the area cleaning verification again until it is qualified.

[0022] S7: After the hardware terminals are cleaned to a satisfactory standard, run the cleaning process of step S5 and step S6 again to thoroughly clean the hardware terminal cleaning area.

[0023] The present invention can achieve the following beneficial effects:

[0024] 1. The collimating optical lens group of the laser cleaning head can move back and forth within a certain range along the axis, causing the beam after passing through the collimating lens group to diverge or converge, ultimately changing the size and depth of focus of the focused spot to meet diverse cleaning process requirements. Employing a three-axis motion mechanism, it can achieve high-precision spatial linear interpolation and circular interpolation motion, meeting the motion requirements of high-current hardware terminal laser cleaning processes.

[0025] 2. By using a motion mechanism and electrical control system, the sulfide contamination on the surface of the hardware terminals is cleaned while being electrically removed. At the same time, the heat accumulation of the laser is used to achieve different degrees of reheating and passivation in the cleaning area, generating a denser passivation film layer. This achieves non-contact electric cleaning while improving the surface resistance to sulfide contamination of the hardware terminals. Attached Figure Description

[0026] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0027] Figure 1 This is a schematic diagram of the laser cleaning head of the present invention;

[0028] Figure 2 This is a schematic diagram of the optical path of the dual-axis galvanometer inside the laser cleaning head of the present invention;

[0029] Figure 3 This is a schematic diagram of the optical path of the laser cleaning head of the present invention;

[0030] Figure 4 This is a three-dimensional schematic diagram of the linear module of the present invention;

[0031] Figure 5 This is a system diagram showing the application of the laser cleaning head of the present invention in a laser electrified cleaning device. Figure 1 ;

[0032] Figure 6 This is a system diagram showing the application of the laser cleaning head of the present invention in a laser electrified cleaning device. Figure 2 .

[0033] In the diagram: 1-Output fiber; 2-Laser cleaning head; 3-Three-axis motion mechanism; 4-Laser generator; 5-Chiller; 6-Electrical control system; 7-Laser generator cooling water pipe; 8-Laser cleaning head cooling water pipe; 9-Laser generator control cable; 10-Chiller cable; 11-Three-axis motion mechanism control cable; 12-Laser cleaning head control cable; 13-Fiber optic connector; 14-Collimation assembly; 15-Electric displacement stage; 16-Reflector assembly; 17-Two-dimensional galvanometer module; 18-Focusing lens assembly; 19-X-axis galvanometer; 20-Y-axis galvanometer; 21-Collimating optical lens group; 22-Reflecting lens; 23-Focusing optical lens group; 24-Three-axis motion mechanism X-axis module; 25-Three-axis motion mechanism Y-axis module; 26-Three-axis motion mechanism Z-axis module. Detailed Implementation

[0034] Example 1:

[0035] Preferred solutions include Figures 1 to 4 As shown, a laser cleaning head for laser cleaning of hardware terminal surfaces includes an optical fiber connector 13, a collimation assembly 14, an electric displacement stage 15, a reflector assembly 16, a two-dimensional galvanometer module 17, and a focusing lens assembly 18. The optical fiber connector 13 is used to connect and lock with the output optical fiber 1. The optical fiber connector 13 is connected to the collimation assembly 14, the collimation assembly 14 is connected to the reflector assembly 16, the reflector assembly 16 is connected to the two-dimensional galvanometer module 17, and the focusing lens assembly 18 is provided on the two-dimensional galvanometer module 17. The collimation assembly 14 is used to expand and collimate the laser beam transmitted by the output optical fiber 1, ensuring that the diameter of the laser beam matches the diameter of the focusing lens assembly 18. The electric displacement stage 15 is mounted on the collimation assembly 14.

[0036] Furthermore, the collimation assembly 14 includes a collimating optical lens group 21;

[0037] The mirror assembly 16 includes a reflective mirror 22;

[0038] The two-dimensional galvanometer module 17 includes an X-axis galvanometer 19 and a Y-axis galvanometer 20;

[0039] Focusing lens assembly 18 includes focusing optical lens group 23;

[0040] The laser beam delivered by the output optical fiber 1 passes sequentially through the collimating optical lens group 21, the reflecting lens 22, the X-axis galvanometer 19, the Y-axis galvanometer 20, and the focusing optical lens group 23 before reaching the surface of the hardware terminal for cleaning; the electric displacement stage 15 is used to drive the collimating optical lens group 21 to move.

[0041] The reflector assembly 16 is used to change the direction of the light path, making the structure of the laser cleaning head more compact and facilitating on-site processing; the two-dimensional galvanometer module 17 can control the deflection scanning angle of the scanning mirror module through the control system to achieve extremely fast movement and scanning of the focused spot; the focusing mirror assembly 18 can converge the collimated beam, which is convenient for cleaning processing.

[0042] Furthermore, the laser cleaning head is used to be mounted on the three-axis motion mechanism 3, which includes a three-axis motion mechanism X-axis module 24, a three-axis motion mechanism Y-axis module 25 and a three-axis motion mechanism Z-axis module 26; the laser cleaning head is mounted on the three-axis motion mechanism X-axis module 24.

[0043] The three-axis motion mechanism 3 includes an X-axis module 24, a Y-axis module 25, and a Z-axis module 26. The laser cleaning head 2 is mounted on the X-axis module 24. The laser cleaning head 2, mounted on the three-axis motion mechanism 3, can move parallel to the surface of the hardware terminal 1. During movement, the laser cleaning head 2, the three-axis motion mechanism 3, the output optical fiber 1, etc., will not collide with any part of the hardware terminal.

[0044] Furthermore, the X-axis galvanometer 19 is dynamically deflected by a motor in the X-direction of the plane, and the Y-axis galvanometer 20 is dynamically deflected by a motor in the Y-direction. The X-axis galvanometer 19 and the Y-axis galvanometer 20 constitute a two-dimensional deflection galvanometer.

[0045] The two-dimensional galvanometer module 17 includes an X-axis galvanometer 19 and a Y-axis galvanometer 20. The X-axis galvanometer 19 and the Y-axis galvanometer 20 are reflector groups with high-precision motor dynamic deflection control in the X and Y directions, respectively. They are arranged in an alternating structure of XY spatial normal directions. The maximum deflection angle of the two-dimensional deflection galvanometer is ±15°. After the light beam passes through the X-axis galvanometer 19 and the Y-axis galvanometer 20 in sequence through the electrical control system 6, the focused spot can move and scan extremely quickly in the X and Y directions.

[0046] The two-dimensional galvanometer module 17 includes an X-axis galvanometer 19 and a Y-axis galvanometer 20. The X-axis galvanometer 19 and the Y-axis galvanometer 20 are reflector groups with high-precision motor dynamic deflection control in the X and Y directions, respectively. They are arranged in an alternating structure of XY spatial normal directions. The maximum deflection angle of the two-dimensional deflection galvanometer is ±15°. After the light beam passes through the X-axis galvanometer 19 and the Y-axis galvanometer 20 in sequence through the electrical control system 6, the focused spot can move and scan extremely quickly in the X and Y directions.

[0047] Example 2:

[0048] like Figure 5-6 As shown in the diagram, the effect of this laser cleaning head being used in a laser electrified cleaning device is as follows. Figure 5-6As shown, the system includes a laser generator 4, an output optical fiber 1, a laser cleaning head 2, a chiller 5, a three-axis motion mechanism 3, and an electrical control system 6. The chiller 5 is used to cool the laser generator 4 and the laser cleaning head 2; the laser generator 4 transmits laser energy to the laser cleaning head 2 through the output optical fiber 1; the electrical control system 6 provides electrical control for the laser generator 4, the chiller 5, and the three-axis motion mechanism 3. The chiller 5 is connected to the laser generator 4 via the laser generator cooling water pipe 7, providing cooling water to maintain the operation of the laser generator 4 and enable it to continuously generate laser energy beams. The laser generator 4 is connected to the laser cleaning head 2 via the output optical fiber 1, transmitting the laser energy beam to the laser cleaning head 2. The chiller 5 is connected to the laser cleaning head 2 via the laser cleaning head cooling water pipe 8, providing cooling water to maintain the thermal balance of the laser cleaning head 2 during operation and prevent damage to the laser cleaning head 2 due to excessive temperature. The electrical control system 6 controls the output laser energy beam magnitude and switching of the laser generator 4 via the laser generator control cable 9. The electrical control system 6 controls the oscillation of the galvanometer and the movement distance of the electric displacement stage of the laser cleaning head 2 via the laser cleaning head control cable 12. The electrical control system 6 controls the motion trajectory and speed of the three-axis motion mechanism 3 via the three-axis motion mechanism control cable 11. The electrical control system 6 supplies power to the chiller 5 via the chiller cable 10.

[0049] Furthermore, the chiller 5, laser generator 4, and electrical control system 6 are placed on the ground below the hardware terminal 1, and the three-axis motion mechanism 3 is fixedly installed on a platform near the hardware terminal. The laser cleaning head 2 is mounted on the three-axis motion mechanism 3. The hardware terminal is the object to be cleaned by this device.

[0050] The electrical control system 6 is connected to the three-axis motion mechanism 3 via the three-axis motion mechanism control cable 11, providing electrical control. The electrical control system 6 includes three servo drives, each driving a linear module. It also includes a motion controller capable of executing motion programs and controlling the movement of the three-axis motion mechanism 3. The three-axis motion mechanism 3 is capable of performing linear interpolation and circular interpolation movements in three-dimensional space; these two motion modes are essential for completing the sulfurization cleaning of the hardware terminal surfaces.

[0051] Preferably, the cleaning method for the laser cleaning head applied to the laser cleaning of hardware terminal surfaces is characterized by comprising the following steps:

[0052] S1: Equipment assembly before cleaning: Install the laser cleaning head on the X-axis module 24 of the three-axis motion mechanism 3. The fiber optic connector 13 is connected to the laser generator 4 through the output fiber optic 1. The laser generator 4 is electrically connected to the electrical control system 6. The electrical control system 6 is electrically connected to the laser cleaning head and the three-axis motion mechanism 3.

[0053] S2: Operate the three-axis motion mechanism 3 to focus the laser beam of the laser cleaning head within ±1mm of the workpiece surface;

[0054] S3: Start the two-dimensional galvanometer module 17 of the laser cleaning head 2, which is arranged in an alternating structure of XY spatial normal directions; adjust the XY scanning amplitude to a suitable cleaning range for the hardware terminals;

[0055] S4: By controlling the positions of the X-axis module 24, Y-axis module 25, and Z-axis module 26 of the three-axis motion mechanism, pre-run the cleaning area of ​​the hardware terminal several times; if an alarm occurs during operation, stop the movement immediately, clear the alarm, and then run again. During operation, always pay attention to the smooth movement of the module and avoid any jamming.

[0056] S5: Start the laser generator 4 to emit an indicator red light. Following the method in step S3, start the two-dimensional galvanometer module 17 of the laser cleaning head 2 and adjust the XY scanning amplitude until the indicator red light covers the appropriate cleaning range of the hardware terminal. Then, follow the method in step S4 again to conduct a trial run to ensure that the indicator red light can completely cover the cleaning area of ​​the hardware terminal during the trial run, and there should be no omissions or exceeding the cleaning area of ​​the hardware terminal.

[0057] Upon completion of this trial run, the movement program of the three-axis motion mechanism 3 and the parameters of the XY scanning amplitude adjusted by the two-dimensional galvanometer module 17 are saved as the cleaning work program.

[0058] S6: Start the laser generator 4 to emit laser and run the process of step S5. At the same time, manually clean and verify the laser power, pulse width and repetition frequency parameters of the laser generator through the electrical control system 6. Observe whether the cleaning of sulfur contamination on the surface of the hardware terminal is qualified. If it is not qualified, adjust the collimating optical lens group 21 back and forth a certain position through the electric displacement stage 15 to change the energy distribution of the cleaning area and perform the area cleaning verification again until it is qualified.

[0059] Save the laser power, pulse width, and repetition frequency parameters when the cleaning verification is successful as the cleaning process procedure;

[0060] S7: After the hardware terminals are cleaned to a satisfactory standard, run the cleaning process of step S5 and step S6 again to thoroughly clean the hardware terminal cleaning area.

[0061] Complete cleaning can cover all the differences and fluctuations in cleaning effect caused by adjustments to parameters such as laser power, pulse width, and repetition frequency during manual cleaning verification, thereby maintaining the consistency of cleaning effect.

[0062] The above embodiments are merely preferred technical solutions of the present invention and should not be considered as limitations on the present invention. The scope of protection of the present invention should be limited to the technical solutions described in the claims, including equivalent substitutions of the technical features described in the claims. That is, equivalent substitutions and improvements within this scope are also within the scope of protection of the present invention.

Claims

1. A laser cleaning machining head applied to laser cleaning of a surface of a hardware terminal, characterized in that: It includes optical fiber joint (13), collimation assembly (14), electric displacement table (15), mirror assembly (16), two-dimensional galvanometer module (17) and focusing mirror assembly (18); optical fiber joint (13) is used for connecting and locking with output optical fiber (1), optical fiber joint (13) is connected with collimation assembly (14), collimation assembly (14) is connected with mirror assembly (16), mirror assembly (16) is connected with two-dimensional galvanometer module (17), two-dimensional galvanometer module (17) is equipped with focusing mirror assembly (18) on it; collimation assembly (14) is used for making the laser beam delivered by output optical fiber (1) to expand and collimate, ensuring that the diameter of laser beam matches the diameter of focusing mirror assembly (18); electric displacement table (15) is installed on collimation assembly (14); The heat accumulation of the laser is used to achieve the back passivation effect of different degrees in the cleaning area, and a denser passivation film layer is generated; The cleaning method of the laser cleaning machining head applied to the laser cleaning of the terminal surface of the hardware, comprising the following steps: S1: equipment assembly before cleaning: install the laser cleaning machining head on the three-axis motion mechanism X-axis module (24) of the three-axis motion mechanism (3), connect the optical fiber joint (13) with the laser generator (4) through the output optical fiber (1), electrically connect the laser generator (4) with the electrical control system (6), and electrically connect the electrical control system (6) with the laser cleaning machining head and the three-axis motion mechanism (3); S2: operate the three-axis motion mechanism (3), and focus the laser beam focus point of the laser cleaning machining head on the workpiece surface within ±1mm; S3: start the two-dimensional galvanometer module (17) of the laser cleaning machining head (2), and adopt X-Y space normal direction staggered structure arrangement; adjust the X-Y scanning amplitude to the appropriate cleaning range of the hardware terminal; S4: by controlling the positions of the three-axis motion mechanism X-axis module (24), the three-axis motion mechanism Y-axis module (25) and the three-axis motion mechanism Z-axis module (26), the cleaning area of the hardware terminal is pre-operated several times; if an alarm occurs during operation, stop the movement immediately, remove the alarm and run again, and pay attention to smooth movement of the module at all times during operation, and no jamming condition should occur; S5: start the laser generator (4) to emit an indicating red light, adjust the X-Y scanning amplitude of the two-dimensional galvanometer module (17) of the laser cleaning machining head (2) according to the method of step S3 until the indicating red light covers the appropriate cleaning range of the hardware terminal, and then perform trial operation according to the method of step S4, to ensure that the indicating red light can completely cover the cleaning area of the hardware terminal during trial operation, and no omission or exceeding of the cleaning area of the hardware terminal should occur; S6: start the laser generator (4) to emit laser, run the process of step S5, and at the same time, adjust the laser power, pulse width and repetition frequency parameters of the laser generator by the electrical control system (6) to manually clean and verify, observe whether the cleaning of the hardware terminal surface sulfurization pollution is qualified, if not, adjust the front and back movement of the collimation optical lens group (21) by the electric displacement table (15) to change the energy distribution of the cleaning area, and then perform area cleaning verification again until it is qualified. S7: After the terminal fittings are cleaned, the cleaning process of step S5 and the cleaning process of step S6 are run again to completely clean the terminal fitting cleaning area.

2. The laser cleaning machining head for laser cleaning of a surface of a metal fitting terminal according to claim 1, characterized by: The collimating assembly (14) comprises a collimating optical lens group (21); The mirror assembly (16) comprises a mirror lens (22); The two-dimensional galvanometer module (17) comprises an X-axis galvanometer (19) and a Y-axis galvanometer (20); The focusing mirror assembly (18) comprises a focusing optical lens group (23); The laser beam delivered by the output optical fiber (1) passes through the collimating optical lens group (21), the mirror lens (22), the X-axis galvanometer (19), the Y-axis galvanometer (20), and the focusing optical lens group (23) in sequence to reach the surface of the terminal fitting for cleaning; the motorized displacement stage (15) is used to drive the collimating optical lens group (21) to move.

3. The laser cleaning machining head for laser cleaning of the surface of a metal fitting terminal according to claim 2, characterized by: The laser cleaning machining head is used to be installed on the three-axis motion mechanism (3), the three-axis motion mechanism (3) comprises a three-axis motion mechanism X-axis module (24), a three-axis motion mechanism Y-axis module (25), and a three-axis motion mechanism Z-axis module (26); the laser cleaning machining head is installed on the three-axis motion mechanism X-axis module (24).

4. The laser cleaning machining head for laser cleaning of a surface of a metal fitting terminal according to claim 3, characterized by: The X-axis galvanometer (19) is controlled by a motor to dynamically deflect in the X-direction, the Y-axis galvanometer (20) is controlled by a motor to dynamically deflect in the Y-direction, and the X-axis galvanometer (19) and the Y-axis galvanometer (20) constitute a two-dimensional deflection galvanometer.

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