Method and device for calculating metal material ebsd grain size by image processing software

By using a step size less than one-seventh of the effective grain size of the average equivalent area in EBSD experiments and the image processing software ImagePro Plus 6.0 to calculate the grain size of metallic materials, the measurement deviation problem caused by inappropriate EBSD step size settings was solved, achieving higher measurement accuracy and shorter detection time.

CN116433741BActive Publication Date: 2026-02-17JIANGXI UNIV OF SCI & TECH +1
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Patent Information

Application Number
CN202310300739.3
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-03-24
Publication Date
2026-02-17
Estimated Expiration
2043-03-24

AI Technical Summary

Technical Problem

In the existing technology, EBSD software has a problem of large deviation when measuring the average effective grain size in the measurement of metallic materials, which leads to inappropriate EBSD step size settings and affects measurement accuracy.

Method used

This technique involves calculating the grain size of metallic materials using image processing software. The process utilizes an electron backscatter diffraction (EBSD) device and its associated software to calculate the grain size. The EBSD step size is less than one-seventh of the effective grain size of the average equivalent area. The grain size is then calculated using the ImagePro Plus 6.0 image processing software.

Benefits of technology

It improves the accuracy of EBSD grain size measurement, reduces detection time, and improves measurement accuracy when setting larger EBSD step sizes.

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Abstract

The application discloses a kind of by image processing software calculation metal material EBSD grain size method and device, it is related to the measurement technical field of physics. Including: by electron backscattering diffraction device, the metal material to be measured is carried out electron backscattering diffraction EBSD analysis, and analysis data is obtained;By the supporting software of electron backscattering diffraction device, analysis data is handled, and orientation imaging micrograph is exported;According to orientation imaging micrograph, the numerical value A of measurement target Area is obtained m And the numerical value P of measurement target Perimeter m ;According to numerical value P m And numerical value A m , the average equivalent area effective grain size of metal material to be measured is calculated. When the effective grain size of metal material is obtained using the application, a relatively large EBSD step can be set, the time of detection is reduced under the premise of ensuring the accuracy of the results, and the average grain size obtained is more accurate than other methods.
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Description

TECHNICAL FIELD

[0001] The present application relates to the field of physical measurement technology, in particular to a method and device for calculating the EBSD grain size of a metal material by image processing software. BACKGROUND

[0002] Grain boundaries between adjacent grains are generally considered to be high-angle grain boundaries if the misorientation is greater than 15° or 10°. A large number of studies have found that high-angle boundaries can inhibit crack propagation and are beneficial to enhancing strength and toughness. EBSD (Electron Backscattered Diffraction) is a powerful technique for detecting high-angle grain boundaries. The grains surrounded by high-angle grain boundaries are called effective grains. The average effective grain size is an important factor for evaluating the mechanical properties of materials, including predicting fine-grain strengthening and critical fracture stress.

[0003] The average effective grain size can be directly measured by EBSD software or measured from a digitized image generated by traditional EBSD software. However, due to the limitations of EBSD software in processing grain size, it is usually only used as a reference. When measuring the average effective grain size from a digitized image, several standard methods (ASTM Standard E112-88, Standard test methods for determining average grain size, ASTM International, Pennsylvania, 1994 and People's Republic of China National Standard, GB / T 6394-2002, Metal Average Grain Size Determination Method, China Standard Press, Beijing, 2002) can be used, including the planimetric method, intercept method (linear intercept method and circular intercept method), statistical analysis, etc. These methods are widely used, especially the intercept method and the planimetric method (with the intercept method measurement results as the standard). However, when conducting EBSD experiments, there may be an underestimate of the average effective grain size, resulting in a too large EBSD step size (the step size is a fraction of the actual average effective grain size, mainly to shorten the detection time). This will result in low resolution of the digitized image, thereby causing a large deviation in measuring the average effective grain size. SUMMARY

[0004] The present application is proposed to solve the problem of large deviation in measuring the average effective grain size in the prior art.

[0005] To solve the above technical problems, the present application provides the following technical solutions:

[0006] In one aspect, the present application provides a method for calculating the EBSD grain size of a metal material by image processing software, which is realized by an electronic device, and the method comprises:

[0007] S1. Use an electron backscatter diffraction (EBSD) device to perform EBSD analysis on the metal material to be measured and obtain analysis data.

[0008] S2. Use the software supporting the EBSD device to process the analysis data and export an orientation imaging micrograph.

[0009] S3. Obtain the value A of the measurement target Area m and the value P of the measurement target Perimeter m .

[0010] S4. Calculate the average equivalent area effective grain size of the metal material to be measured based on the value P m and the value A. m .

[0011] Optionally, the average equivalent area effective grain size of the metal material to be measured calculated in S4 is as shown in the following formula (1):

[0012]

[0013] where a and b are the lengths and widths of the pixels in the field of view in the orientation imaging micrograph, and E s is the EBSD step size.

[0014] Optionally, in the EBSD analysis in S1, the selected EBSD step size is less than one-seventh of the average equivalent area effective grain size of the metal material to be measured.

[0015] Optionally, the software supporting the EBSD device in S2 is HKL Channel 5 software.

[0016] Optionally, using the software supporting the EBSD device in S2 to process the analysis data and export an orientation imaging micrograph includes:

[0017] Using the software supporting the EBSD device to process the analysis data, selecting the minimum grain boundary angle for dividing effective grain boundaries as 15° or 10°, selecting the grain boundary color as black, with the grain boundary width being 1 pixel, and exporting the orientation imaging micrograph.

[0018] Optionally, obtaining the value A of the measurement target Area m and the value P of the measurement target Perimeter m in S3 includes:

[0019] S31. Import the orientation imaging micrograph into the software, select the Area and Perimeter measurement targets in the software and confirm.

[0020] S32. Select all parts of the orientation imaging micrograph except for the black grain boundaries.

[0021] S33. After the software finishes running, calculate the value P of Sum in Perimeter. m And the value A of Sum in Area m .

[0022] Optionally, the software in S31 is ImagePro Plus 6.0.

[0023] On the other hand, the present invention provides an apparatus for calculating the EBSD grain size of a metallic material using image processing software. This apparatus is used to implement a method for calculating the EBSD grain size of a metallic material using image processing software. The apparatus includes:

[0024] The analysis module is used to perform electron backscatter diffraction (EBSD) analysis on the metal material to be measured using an electron backscatter diffraction device to obtain analytical data.

[0025] The image acquisition module is used to process the analysis data and export orientation imaging micrographs using the software accompanying the electron backscatter diffraction device.

[0026] The data acquisition module is used to obtain the numerical value A of the target area based on the orientation imaging micrograph. m And the value P of the target Perimeter. m .

[0027] The output module is used to output data based on the value P. m And the value A m The average equivalent area and effective grain size of the metal material to be measured are calculated.

[0028] Optionally, the average equivalent area effective grain size of the metal material to be measured is calculated as shown in equation (1) below:

[0029]

[0030] Where a and b are the length and width pixels of the field of view in the orientation imaging micrograph, respectively, and E s This represents the electron backscattering diffraction step size.

[0031] Optionally, in electron backscatter diffraction (EBSD) analysis, the selected electron backscatter diffraction step size is less than one-seventh of the average equivalent area effective grain size of the metal material to be measured.

[0032] Optionally, the accompanying software for the electron backscatter diffraction apparatus is HKL Channel 5 software.

[0033] Optionally, the image acquisition module is further used for:

[0034] The analysis data was processed using the software accompanying the electron backscatter diffraction device. The minimum grain boundary angle for dividing the effective grain boundaries was selected as 15° or 10°, the grain boundary color was selected as black, the grain boundary width was 1 pixel, and the orientation imaging micrograph was exported.

[0035] Optionally, the data acquisition module is further used for:

[0036] S31. Import the orientation imaging micrograph into the software, select the Area and Perimeter measurement targets in the software and confirm.

[0037] S32. Select all parts of the orientation imaging micrograph except for the black grain boundaries.

[0038] S33. After the software finishes running, calculate the value P of Sum in Perimeter. m And the value A of Sum in Area m .

[0039] Optionally, the software is ImagePro Plus 6.0.

[0040] On one hand, an electronic device is provided, comprising a processor and a memory, wherein the memory stores at least one instruction, which is loaded and executed by the processor to implement the above-described method for calculating the EBSD grain size of metallic materials using image processing software.

[0041] On the one hand, a computer-readable storage medium is provided, wherein at least one instruction is stored therein, the at least one instruction being loaded and executed by a processor to implement the above-described method for calculating the EBSD grain size of a metallic material using image processing software.

[0042] The above technical solution has at least the following advantages compared with the existing technology:

[0043] The above method yields an average grain size consistent with the stub method and area method when the selected EBSD step size is much smaller than one-seventh of the effective grain size of the sample's average equivalent area. When the selected EBSD step size is equal to or close to one-seventh of the effective grain size of the sample's average equivalent area, the method obtains more accurate calculation results than the stub method and area method. Therefore, when using this method to obtain the effective grain size of metallic materials, a relatively large EBSD step size can be set to reduce detection time while ensuring accurate results. The average grain size obtained by this method is more accurate than other methods. Attached Figure Description

[0044] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0045] Figure 1 This is a schematic diagram of the method for calculating the EBSD grain size of metallic materials using image processing software, provided in an embodiment of the present invention.

[0046] Figure 2 This is a block diagram of a device for calculating the EBSD grain size of metallic materials using image processing software, provided in an embodiment of the present invention.

[0047] Figure 3 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present invention. Detailed Implementation

[0048] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the described embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0049] like Figure 1 As shown, this embodiment of the invention provides a method for calculating the EBSD grain size of metallic materials using image processing software. This method can be implemented by an electronic device. Figure 1 The flowchart shown illustrates a method for calculating EBSD grain size of metallic materials using image processing software. This method's processing flow may include the following steps:

[0050] S1. Electron backscatter diffraction (EBSD) analysis is performed on the metal material to be measured using an electron backscatter diffraction (EBSD) device to obtain analytical data.

[0051] Optionally, in the electron backscatter diffraction (EBSD) analysis in S1, the selected electron backscatter diffraction step size is less than one-seventh of the average equivalent area effective grain size of the metal material to be measured.

[0052] In one feasible implementation, the present invention is applicable to the measurement of the effective grain size of the average equivalent area of ​​equiaxed or non-equiaxed grains in metallic materials.

[0053] Specifically, an electron backscattering diffraction apparatus (e.g., X-MaxN 20mm) is used with a field emission scanning electron microscope (e.g., ZEISS Sigma, Germany, etc.). 2 (OXFORD, UK, etc.) performed electron backscattering diffraction analysis on metallic materials, selecting a field of view that included approximately 50 or more complete grains, and setting an EBSD step size (E... s It is approximately one-seventh of the effective grain size of the average equivalent area.

[0054] S2. Using the software accompanying the electron backscatter diffraction device, process the analysis data, select the minimum grain boundary angle for dividing the effective grain boundary as 15° or 10°, select black as the grain boundary color, and select 1 pixel as the grain boundary width to export the orientation imaging micrograph.

[0055] Optionally, the accompanying software for the electron backscatter diffraction device in S2 is HKL Channel 5 software.

[0056] In one feasible implementation, using the EBSD-compatible HKL Channel 5 software, the minimum grain boundary angle for dividing the effective grain boundary is selected as 15° or 10°, the grain boundary color is selected as black, the grain boundary width is 1 pixel, and an OIM (Orientation Imaging Microscopy) is exported. The OIM image magnification is 1, and the length and width pixels of the field of view in the OIM image are a and b, respectively.

[0057] S3. Based on the orientation imaging micrograph, obtain the numerical value A of the target area to be measured. m And the value P of the target Perimeter. m .

[0058] Optionally, step S3 above may include the following steps S31-S33:

[0059] S31. Import the orientation imaging micrograph into ImagePro Plus 6.0 software, select the Area and Perimeter measurement targets in the software and confirm.

[0060] S32. Select all parts of the orientation imaging micrograph except for the black grain boundaries.

[0061] S33. After the software finishes running, calculate the value P of Sum in Perimeter. m And the value A of Sum in Area m .

[0062] In one feasible implementation, import the OIM image into ImagePro Plus 6.0 software, select "Measure" → "Count / Size" → "Measure" → "Select Measurements", select the two measurement targets "Area (polygon)" and "Perimeter" and confirm. Then, on the panel, select "Manual" and then "Select Colors", select the part of the image except for the black grain boundaries using "Histogram Based", click "Close", then click "Count" on the south panel. After the program finishes running, select "View" → "Statistics". Set the value of "Sum" in the completed "Perimeter" statistics as P. m In "Area(polygon)", the value of "Sum" is set to A. m .

[0063] S4, based on the value P m And the value A m The average equivalent area and effective grain size of the metal material to be measured are calculated.

[0064] In one feasible implementation, when the step size of the EBSD experiment is set to be large, the average grain size obtained by the present invention is more accurate than that of other methods.

[0065] The mathematical principles of this invention are as follows:

[0066] The equivalent area radius r of a two-dimensional grain i It can be calculated as follows (1):

[0067]

[0068] Among them, A i It is the area of ​​a particular grain.

[0069] Assuming the equivalent area radius follows a log-normal distribution, under ideal conditions, the total perimeter P and total area A of the grain can be calculated as follows (2) and (3):

[0070]

[0071]

[0072] Where N is the number of grains on the cross section, p(r,w,μ) is the distribution of grain radii, r is the grain radius, w is the standard deviation, and μ is the expected value.

[0073] Define the following equation (4):

[0074]

[0075] When p(r,w,μ) follows a log-normal distribution (mean size is...), ),have:

[0076]

[0077] Assume y = lnr, and Substituting the values:

[0078]

[0079]

[0080] Substituting equations (6a) and (6b) into equation (4), we can calculate:

[0081]

[0082] In reality, two-dimensional particles tend to be polygonal rather than circular. That is to say, theoretically, the actual total perimeter P... p It will be slightly larger than P, the actual total area A p Approximate to A), therefore the relationship established is:

[0083]

[0084] This item and In comparison, it is actually a minor term. If we ignore the minor term in equation (7), then the equation obtained according to equation (8) is:

[0085]

[0086] This is the equivalent area average grain size obtained through derivation.

[0087] Perimeter (P) measured using ImagePro Plus 6.0 software m ) and Area (polygon) (A m The relationship between the numerical value of ) and the actual perimeter and area is as follows:

[0088] P p ′=[P m -2(a+b)]E s (10a)

[0089] A p ′=A m E s 2 (10b)

[0090] a and b are the length and width pixel counts of the OIM photomicrograph, respectively. s This is the EBSD step size.

[0091] In practice, grain boundaries have a significant impact on the average grain size. Let's assume a grain boundary is shared by two adjacent grains. In this case, the following relationship holds:

[0092] P p >P p ′ (11a)

[0093]

[0094] On the one hand, the increase in grain boundary width leads to an increase in average grain size; therefore, it is obvious that the average grain radius... It should be greater than on the other hand, Right now:

[0095]

[0096] Taking the average value as an approximation, the derived average grain size is:

[0097]

[0098] For example, Example 1

[0099] Annealed equiaxed Fe-0.002C (wt%) alloy samples were prepared and analyzed using a field emission scanning electron microscope (ZEISS Sigma, Germany) with electron backscatter diffraction (X-Max N 20mm) as part of the instrument. 2 EBSD analysis was performed on metallic materials by an Oxford, UK (Oxford, UK) with a field of view of 1005 × 510 μm. 2The EBSD step sizes were set to 0.75 and 6 μm. Using the EBSD software HKL Channel 5, the minimum grain boundary angle for effective grain boundary delineation was selected as 15°, the grain boundary color as black, and the grain boundary width as 1 pixel. OIM images were exported with a magnification of 1. When the step size was 0.75 μm, the field of view dimensions in the OIM image were 1340 and 677 pixels, respectively; when the step size was 6 μm, the field of view dimensions were 168 and 84 pixels, respectively. The OIM images were then imported into ImagePro Plus 6.0 software. The process involved selecting "Measure" → "Count / Size" → "Measure" → "Select Measurements," selecting "Area (polygon)" and "Perimeter" as the measurement targets, and confirming the selection. Then, on the panel, select "Manual" and then "Select Colors." Using "Histogram Based," select the portion of the image excluding the black grain boundaries, click "Close," and then click "Count" on the south panel. After the program finishes running, select "View" → "Statistics." Calculate the "Sum" value in both "Perimeter" and "Area (polygon)." The average equivalent area effective grain size calculated through experimental testing is 46.1 ± 0.38 μm and 49.5 ± 3 μm, respectively.

[0100] Simultaneously, the effective grain size was statistically analyzed using both the circular intercept method and the area method on the two OIM images. Through conversion, the average equivalent area effective grain size obtained by the circular intercept method was 48.4±1.6 μm and 58.9±8.5 μm, respectively; the average equivalent area effective grain size obtained by the area method was 50.1 μm and 61.0 μm, respectively. When the EBSD step size was 0.75 μm, the OIM image accurately reflected the fine structure of the grains, and therefore the measured average grain size of 48.4±1.6 and 50.1 μm was closer to the true size. However, when the EBSD step size was 6 μm, many small grains were not detected, resulting in a larger detected grain size than the true size. Using the method of this invention, the average grain size obtained was 49.5±3 μm, which is closer to the true size. Therefore, the method of this invention yields more accurate average grain size results when the EBSD step size is larger.

[0101] Example 2

[0102] Samples of rolled non-equiaxed Fe-0.002C-0.042Ti (wt%) alloy were prepared and analyzed using a field emission scanning electron microscope (ZEISS Sigma, Germany) with electron backscatter diffraction (X-Max N 20mm) as part of the microscope.2 EBSD analysis was performed on metallic materials by an Oxford, UK (Oxford, UK) with a field of view of 1005 × 510 μm. 2 The EBSD step sizes were set to 1 and 3 μm. Using the EBSD software HKL Channel 5, the minimum grain boundary angle for effective grain boundary delineation was selected as 15°, the grain boundary color as black, and the grain boundary width as 1 pixel. OIM images were exported with a magnification of 1. When the step size was 0.75 μm, the field of view in the OIM image was 1005 pixels wide and 510 pixels wide, respectively; when the step size was 6 μm, the field of view was 335 pixels wide and 169 pixels wide, respectively. The OIM images were then imported into ImagePro Plus 6.0 software. The process involved selecting “Measure” → “Count / Size” → “Measure” → “Select Measurements”, selecting “Area (polygon)” and “Perimeter” as the measurement targets, and confirming. Then, in the panel, the “Manual” menu was clicked, followed by “Select Colors”. Using “Histogram Based”, the portion of the image excluding the black grain boundaries was selected, and “Close” was clicked. Then, “Count” was clicked in the south panel. After the program finished running, “View” → “Statistics” was selected. The values ​​of "Sum" in "Perimeter" and "Sum" in "Area (polygon)" were statistically analyzed. The average equivalent area effective grain size calculated through industrial experiments was 20.2±0.5μm and 20.2±1.5μm, respectively.

[0103] Simultaneously, the effective grain size was statistically analyzed using both the circular intercept method and the area method on the two OIM images. Through conversion, the average equivalent area effective grain size obtained by the circular intercept method was 20.7±1.2 μm and 24.4±4 μm, respectively; the average equivalent area effective grain size obtained by the area method was 30.2 μm and 34.7 μm, respectively. Clearly, the area method is not suitable for detecting the size of non-equiaxed grains. When the EBSD step size is 0.75 μm, the OIM image can accurately reflect the fine structure of the grains, therefore the average grain size of 20.7±1.2 μm measured by the intercept method is closer to its true size. However, when the EBSD step size is 3 μm, many small grains are not detected, resulting in a detected grain size that is larger than the true size. Using the method of this invention, the average grain size obtained is 20.2±1.5 μm, which is closer to its true size. Therefore, the method of this invention yields more accurate average grain size results when the EBSD step size is larger.

[0104] In the embodiments of the present invention, when the selected EBSD step size is much smaller than one-seventh of the average equivalent area effective grain size of the specimen, the average grain size obtained by this method is consistent with methods such as the intercept method and the area method; when the selected EBSD step size is equal to or close to one-seventh of the average equivalent area effective grain size of the specimen, this method can obtain more accurate calculation results than methods such as the intercept method and the area method. Therefore, when using this method to obtain the effective grain size of metal materials, a relatively large EBSD step size can be set, reducing the detection time on the premise of ensuring accurate results, and the average grain size obtained by this method is more accurate than other methods.

[0105] As Figure 2 shown, an embodiment of the present invention provides a device 200 for calculating the EBSD grain size of metal materials through image processing software. This device 200 is applied to implement the method for calculating the EBSD grain size of metal materials through image processing software. The device 200 includes:

[0106] An analysis module 210, configured to perform electron backscatter diffraction (EBSD) analysis on the metal material to be measured through an electron backscatter diffraction device, and obtain analysis data.

[0107] An image acquisition module 220, configured to process the analysis data through the supporting software of the electron backscatter diffraction device and export an orientation imaging micrograph.

[0108] A data acquisition module 230, configured to obtain the value A of the measurement target Area m and the value P of the measurement target Perimeter m .

[0109] An output module 240, configured to calculate the average equivalent area effective grain size of the metal material to be measured according to the value P m and the value A m .

[0110] Optionally, the average equivalent area effective grain size of the metal material to be measured is calculated as shown in the following formula (1):

[0111] [[ID=3—3]]

[0112] where a and b are respectively the lengths and widths of the pixels in the field of view in the orientation imaging micrograph, and E s is the EBSD step size.

[0113] Optionally, in the electron backscatter diffraction (EBSD) analysis, the selected EBSD step size is less than one-seventh of the average equivalent area effective grain size of the metal material to be measured.

[0114] Optionally, the accompanying software for the electron backscatter diffraction apparatus is HKL Channel 5 software.

[0115] Optionally, the image acquisition module 220 is further used for:

[0116] The analysis data was processed using the software accompanying the electron backscatter diffraction device. The minimum grain boundary angle for dividing the effective grain boundaries was selected as 15° or 10°, the grain boundary color was selected as black, the grain boundary width was 1 pixel, and the orientation imaging micrograph was exported.

[0117] Optionally, the data acquisition module 230 is further used for:

[0118] S31. Import the orientation imaging micrograph into the software, select the Area and Perimeter measurement targets in the software and confirm.

[0119] S32. Select all parts of the orientation imaging micrograph except for the black grain boundaries.

[0120] S33. After the software finishes running, calculate the value P of Sum in Perimeter. m And the value A of Sum in Area m .

[0121] Optionally, the software is ImagePro Plus 6.0.

[0122] In this embodiment of the invention, when the selected EBSD step size is much smaller than one-seventh of the effective grain size of the sample's average equivalent area, the average grain size obtained by this method is consistent with methods such as the cross-section method and the area method. When the selected EBSD step size is equal to or close to one-seventh of the effective grain size of the sample's average equivalent area, this method can obtain more accurate calculation results than methods such as the cross-section method and the area method. Therefore, when using this method to obtain the effective grain size of metallic materials, a relatively large EBSD step size can be set, reducing the detection time while ensuring the accuracy of the results. The average grain size obtained by this method is more accurate than other methods.

[0123] Figure 3 This is a schematic diagram of the structure of an electronic device 300 provided in an embodiment of the present invention. The electronic device 300 can vary considerably due to differences in configuration or performance. It may include one or more central processing units (CPUs) 301 and one or more memories 302. The memory 302 stores at least one instruction, which is loaded and executed by the processor 301 to implement the following method for calculating the EBSD grain size of metallic materials using image processing software:

[0124] S1. Use an electron backscatter diffraction (EBSD) device to perform EBSD analysis on the metal material to be measured and obtain analysis data.

[0125] S2. Use the supporting software of the electron backscatter diffraction device to process the analysis data and export an orientation imaging micrograph.

[0126] S3. Obtain the value A of the measurement target Area m and the value P of the measurement target Perimeter m .

[0127] S4. Calculate the average equivalent area effective grain size of the metal material to be measured based on the value P m and the value A. m

[0128] In an exemplary embodiment, a computer-readable storage medium is also provided, such as a memory including instructions, and the above instructions can be executed by a processor in a terminal to complete the method for calculating the EBSD grain size of a metal material through image processing software. For example, the computer-readable storage medium can be a ROM, a random access memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, and an optical data storage device, etc.

[0129] Those of ordinary skill in the art can understand that all or part of the steps of implementing the above embodiments can be completed by hardware, or can be completed by a program instructing relevant hardware. The program can be stored in a computer-readable storage medium, and the above-mentioned storage medium can be a read-only memory, a magnetic disk, or an optical disc, etc.

[0130] The above are only the preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A method for calculating the EBSD grain size of metallic materials using image processing software, characterized in that, The method includes: S1. Performing electron backscatter diffraction (EBSD) analysis on the metal material to be measured through an electron backscatter diffraction device to obtain analysis data; S2. Processing the analysis data through the supporting software of the electron backscatter diffraction device and exporting an orientation imaging micrograph; S3. Based on the orientation imaging micrograph, obtain the numerical value A of the target area to be measured. m And the value P of the target Perimeter. m ; S4. According to the stated value P m And the value A m The average equivalent area and effective grain size of the metal material to be measured are calculated. The average equivalent area effective grain size of the metal material to be measured calculated in S4 is as shown in the following formula (1): in, E represents the average equivalent area effective grain size of the metallic material, where a and b are the length and width pixels of the field of view in the orientation imaging micrograph, respectively. s The electron backscattering diffraction step size; In the electron backscatter diffraction (EBSD) analysis in S1, the selected electron backscatter diffraction step size is less than one-seventh of the average equivalent area effective grain size of the metal material to be measured.

2. The method according to claim 1, characterized in that, The supporting software of the electron backscatter diffraction device in S2 is HKL Channel 5 software.

3. The method according to claim 1, characterized in that, Processing the analysis data through the supporting software of the electron backscatter diffraction device in S2 and exporting an orientation imaging micrograph includes: Processing the analysis data through the supporting software of the electron backscatter diffraction device, selecting the minimum grain boundary angle for dividing effective grain boundaries as 15° or 10°, selecting the grain boundary color as black, with the grain boundary width being 1 pixel, and exporting an orientation imaging micrograph.

4. The method according to claim 1, characterized in that, In step S3, the numerical value A of the target area is obtained based on the orientation imaging micrograph. m And the value P of the target Perimeter. m ,include: S31. Importing the orientation imaging micrograph into the software, selecting and determining the two measurement targets of Area and Perimeter in the software; S32. Selecting other parts in the orientation imaging micrograph except the black grain boundaries; S33. After the software finishes running, calculate the value P of Sum in Perimeter. m And the value A of Sum in Area m .

5. The method according to claim 4, characterized in that, The software in S31 is ImagePro Plus 6.

0.

6. A device for calculating the EBSD grain size of metallic materials using image processing software, characterized in that, The device includes: An analysis module for performing electron backscatter diffraction (EBSD) analysis on the metal material to be measured through an electron backscatter diffraction device to obtain analysis data; An image acquisition module for processing the analysis data through the supporting software of the electron backscatter diffraction device and exporting an orientation imaging micrograph; The data acquisition module is used to obtain the numerical value A of the target area based on the orientation imaging micrograph. m And the value P of the target Perimeter. m ; Output module, used to output the value P m And the value A m The average equivalent area and effective grain size of the metal material to be measured are calculated. The average equivalent area effective grain size of the metal material to be measured calculated is as shown in the following formula (1): in, E represents the average equivalent area effective grain size of the metallic material, where a and b are the length and width pixels of the field of view in the orientation imaging micrograph, respectively. s The electron backscattering diffraction step size; In the electron backscatter diffraction (EBSD) analysis, the selected electron backscatter diffraction step size is less than one-seventh of the average equivalent area effective grain size of the metal material to be measured.

Citation Information

Patent Citations

  • Measuring method and apparatus for effective grain size of ultrafine lath structure low alloy steel

    CN104111261A

  • EBSD metallographic image grain recognition method and device

    CN112906641A