A semiconductor wafer thickness detection device

Abstract

The present invention provides a semiconductor wafer thickness detection device, belonging to the technical field of semiconductor wafer thickness detection. It includes a frame, at both ends of the frame, belt pulleys are fixedly installed, and a belt is drivingly installed between the two belt pulleys; a positioning assembly and a sample to be measured, the positioning assembly is arranged inside the belt; a detection assembly, the detection assembly is fixedly installed above the belt; a sorting assembly, the sorting assembly is arranged in the middle of the inner cavity of the frame. Through the setting of the positioning assembly, the sample to be measured can be clamped, ensuring the safety during its transportation and improving the detection accuracy of the detection assembly for it. With the cooperation of the detection assembly and the sorting assembly, etc., the thickness of the sample to be measured can be detected, and at the same time, the qualified and unqualified samples to be measured can be screened, and the unqualified samples to be measured can be automatically removed, making the device more automated and greatly improving the detection efficiency of the factory for the samples to be measured.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor wafer thickness detection, and more particularly to a semiconductor wafer thickness detection device. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. In the semiconductor manufacturing process, the substrate (wafer) needs to be ground to a specified thickness, and then chip separation (dicing, cutting process) is performed. To ensure product quality, relevant detection of the wafer thickness is required. Semiconductor thickness detection devices can be divided into: contact thickness detection devices and non-contact thickness detection devices according to different detection methods.

[0003] However, some of the existing contact thickness detection devices are generally divided into manual measurement operations or batch detection using height limit devices on an automatic production line. The manual detection method can only take and detect one sample to be tested at a time, which is not suitable for mass production of semiconductor wafers in factories, and the detection efficiency is relatively low. When the factory uses an automatic production line to detect samples to be tested, usually the unqualified products are directly removed on the track. Due to the shape characteristics of the samples to be tested, they may get stuck at the diversion port of the production line, causing blockage, or due to the gravity of the samples to be tested themselves, the unqualified samples generally land with the corners first, which is easy to cause bumps and increase the cost of subsequent repair. Therefore, how to invent a semiconductor wafer thickness detection device to improve these problems has become an urgent problem for those skilled in the art. Summary of the Invention

[0004] To make up for the above deficiencies, the present invention provides a semiconductor wafer thickness detection device, aiming to improve the problems mentioned in the above background art.

[0005] The present invention is implemented as follows:

[0006] The present invention provides a semiconductor wafer thickness detection device, including a frame, both ends of the frame are fixedly installed with pulleys, and a belt is drivingly installed between the two pulleys;

[0007] A positioning component and a sample to be tested, the positioning component is arranged in the inner cavity of the belt, and the positioning component is used for clamping the sample to be tested;

[0008] A detection component, the detection component is fixedly installed above the belt, and the detection component is used for performing qualified detection on the sample to be tested;

[0009] A sorting component, the sorting component is arranged in the middle of the inner cavity of the frame, and the sorting component is used for removing unqualified samples to be tested.

[0010] Preferably, the positioning component includes a support plate rotatably mounted on the inner wall of the belt through a rotating shaft. On one side of the upper end surface of the support plate close to the rotating shaft, a positioning box is fixedly installed. Inside the inner cavity of the left side wall of the positioning box, a threaded sleeve is rotatably installed. Inside the threaded sleeve, a threaded rod is threadedly installed. At the end of the threaded rod, a positioning seat is fixedly installed. At the lower end surface of the positioning seat, a sliding column is fixedly installed.

[0011] By adopting the above technical solution, the test sample placed on the positioning seat can be clamped.

[0012] Preferably, a torsion spring is wound and installed on the side wall of the rotating shaft. The two ends of the torsion spring are respectively fixedly connected to the inner wall of the support plate and the inner wall of the belt. The sliding column is slidably connected to the support plate. The positioning seat is made of rubber material. The test sample is placed on the side wall of the positioning seat.

[0013] By adopting the above technical solution, the support plate can be automatically reset under the torsion of the torsion spring.

[0014] Preferably, the detection component includes a detection box and a limiting plate fixedly installed on the left side wall of the detection box. Inside the inner cavity of the limiting plate, a detection plate is slidably installed. At the end of the detection plate, a detection head is fixedly installed. Inside the inner cavity of the detection plate, a sliding rod is fixedly installed.

[0015] By adopting the above technical solution, the thickness of the test sample can be detected.

[0016] Preferably, a limiting groove is provided on the limiting plate. The detection plate slides inside the limiting groove. A sliding groove is provided inside the detection box. The sliding rod slides inside the sliding groove. A spring seat is fixedly installed on the inner wall of the detection box. The other end of the spring seat abuts against the side wall of the detection plate. A pressure sensor is provided on the inner wall of the detection head.

[0017] By adopting the above technical solution, the position of the detection head can be changed.

[0018] Preferably, the sorting component includes a spiral rod rotatably installed inside the positioning box and a counterweight block threadedly installed on the outer wall of the spiral rod. On the side wall of the counterweight block, a sealing plate is fixedly installed through a support rod. In the middle of the right end surface of the positioning box, a blowing pipe is fixedly installed.

[0019] By adopting the above technical solution, the unqualified test samples can be removed.

[0020] Preferably, the screw rod is fixedly installed on the outer wall of the threaded rod. The lead angle of the screw rod is greater than the equivalent friction angle of the counterweight. The right part of the inner cavity of the screw rod is hollow. The right part of the inner cavity of the screw rod is communicated with the air blowing pipe. An air inlet hole is arranged on the right outer wall of the screw rod. A return spring is fixedly installed on the side wall of the counterweight, and the other end of the return spring is fixedly installed on the inner wall of the positioning box. The right outer wall of the screw rod is set as a smooth curved surface, and the sealing plate is slidably connected with the screw rod.

[0021] By adopting the above technical solution, the air in the positioning box can be ejected from the air blowing pipe onto the side wall of the sample to be measured, avoiding rotation when it falls.

[0022] Preferably, a magnetic column is arranged at the end of the support plate far away from the rotating shaft. The two magnetic columns attract each other. An electromagnet is fixedly installed on the inner wall of the frame. The starter of the electromagnet is electrically connected with the pressure sensor. A material receiving box is fixedly installed in the middle of the inner cavity of the frame.

[0023] The beneficial effects of the present invention are:

[0024] 1. By using rubber as the material of the positioning seat, when the worker places the sample to be measured on the positioning seat, the elastic deformation generated by the positioning seat can well clamp the sample to be measured, and does not affect the subsequent quick removal of the qualified sample by the worker, ensuring the stable clamping of the sample to be measured. On the one hand, it can ensure that the sample to be measured does not fall due to jitter during the operation of the belt, ensuring the safety of the sample to be measured. On the other hand, it can improve the detection accuracy of the detection component for the sample to be measured, so as to improve the detection accuracy of the whole device.

[0025] 2. When the sample to be measured passes by the detection head without contact, the sample to be measured will directly pass under the detection component to determine that the thickness of this sample to be measured is qualified. When the sample to be measured contacts the detection head when passing by, the sample to be measured will squeeze the detection head. Under the limiting action of the limiting groove and the sliding groove, the detection head will gradually lift upward to vacate space for the support plate to rotate and the sample to be measured to fall. After the sample to be measured falls from the two support plates, under the action of the spring seats on the upper and lower sides, the detection plate will drive the detection head to be in the middle of the detection box again, preparing for the detection of the next sample to be measured, avoiding the need for manual reset by the worker and improving the detection efficiency of the whole device.

[0026] 3. When the extrusion detection head of the sample to be tested moves, the pressure sensor will trigger an alarm to activate the starter of the electromagnetic block, and the support plates on both sides will rotate downward simultaneously. With the cooperation of the sorting component, the positioning seat will be disengaged from the sample to be tested, facilitating the unqualified sample to be tested to fall from the support plate. At the same time, the air in the inner cavity of the positioning box will be ejected from the blowing pipe to blow the side wall of the falling unqualified sample to be tested, so that the unqualified sample to be tested will fall horizontally, providing better protection for the unqualified sample to be tested and avoiding the difficulty of subsequent repair caused by the corner bump during its vertical fall. At the same time, multiple unqualified samples falling horizontally can be neatly placed together, avoiding the need for workers to pick up the unqualified samples to be tested frequently and reducing the work intensity of the workers. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0028] Figure 1 FIG. 9 is an overall structural schematic diagram of a semiconductor wafer thickness detection device provided by an embodiment of the present invention;

[0029] Figure 2 FIG. 13 is a cross-sectional structural schematic diagram of a semiconductor wafer thickness detection device provided by an embodiment of the present invention;

[0030] Figure 3 FIG. 17 is a structural schematic diagram of the positioning component of a semiconductor wafer thickness detection device provided by an embodiment of the present invention;

[0031] Figure 4 FIG. 21 is a cross-sectional structural schematic diagram of the positioning box of a semiconductor wafer thickness detection device provided by an embodiment of the present invention;

[0032] Figure 5 FIG. 25 is a cross-sectional structural schematic diagram of the detection box of a semiconductor wafer thickness detection device provided by an embodiment of the present invention;

[0033] Figure 6 FIG. 29 is a schematic diagram of the position of the detection head in the normal state of a semiconductor wafer thickness detection device provided by an embodiment of the present invention;

[0034] Figure 7 FIG. 33 is a schematic diagram of the position of the detection head in the abnormal state of a semiconductor wafer thickness detection device provided by an embodiment of the present invention;

[0035] Figure 8Schematic diagram of the position of the positioning seat in the normal state of a semiconductor wafer thickness detection device provided by an embodiment of the present invention

[0036] Figure 9 Schematic diagram of the position of the positioning seat in the abnormal state of a semiconductor wafer thickness detection device provided by an embodiment of the present invention;

[0037] Figure 10 Schematic diagram of the state when the sample to be measured of a semiconductor wafer thickness detection device provided by an embodiment of the present invention vertically drops;

[0038] Figure 11 Schematic diagram of the state when the sample to be measured of a semiconductor wafer thickness detection device provided by an embodiment of the present invention horizontally turns and drops;

[0039] Figure 12 Schematic diagram of the state when the sample to be measured of a semiconductor wafer thickness detection device provided by an embodiment of the present invention normally falls.

[0040] In the figure: 1, frame; 2, pulley; 3, belt; 4, positioning component; 41, support plate; 42, positioning box; 43, threaded sleeve; 44, threaded rod; 45, positioning seat; 46, sliding column; 47, torsion spring; 5, sample to be measured; 6, detection component; 61, detection box; 611, sliding groove; 62, limiting plate; 621, limiting groove; 63, detection plate; 64, detection head; 65, sliding column; 7, sorting component; 71, screw rod; 711, air inlet hole; 72, counterweight; 73, support rod; 74, sealing plate; 75, blowing pipe; 76, return spring; 77, magnetic column; 78, electromagnet; 79, material receiving box. Specific embodiments

[0041] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present invention.

[0042] Embodiment

[0043] Refer to Figures 1-12 , a semiconductor wafer thickness detection device, including a frame 1, pulleys 2 are fixedly installed at both ends of the frame 1, and a belt 3 is drivingly installed between the two pulleys 2;

[0044] The positioning component 4 and the sample to be measured 5, the positioning component 4 is arranged in the inner cavity of the belt 3, and the positioning component 4 is used to clamp the sample to be measured 5;

[0045] The detection component 6 is fixedly installed above the belt 3 and is used to conduct a pass / fail detection on the sample to be tested 5.

[0046] The sorting component 7 is arranged in the middle of the inner cavity of the frame 1 and is used to reject the unqualified samples to be tested 5.

[0047] Refer to Figures 1-4 , further; the positioning component 4 includes a support plate 41 rotatably installed on the inner wall of the belt 3 through a rotating shaft. On one side of the upper end surface of the support plate 41 close to the rotating shaft, a positioning box 42 is fixedly installed. Inside the left side wall cavity of the positioning box 42, a threaded sleeve 43 is rotatably installed. Inside the threaded sleeve 43, a threaded rod 44 is installed in a threaded manner. At the end of the threaded rod 44, a positioning seat 45 is fixedly installed. At the lower end surface of the positioning seat 45, a sliding column 46 is fixedly installed. A torsion spring 47 is wound and installed on the side wall of the rotating shaft. The two ends of the torsion spring 47 are respectively fixedly connected to the inner wall of the support plate 41 and the inner wall of the belt 3. The sliding column 46 is slidably connected to the support plate 41. The positioning seat 45 is made of rubber material, and the sample to be tested 5 is placed on the side wall of the positioning seat 45.

[0048] It should be noted that: when using this device to detect the thickness of semiconductor wafers, by starting the external motor, the pulleys 2 on both sides rotate. At this time, the belt 3 installed on the pulleys 2 will rotate back and forth continuously. At this time, the sample to be tested 5 is placed in the positioning component 4 on the left side of the belt 3, specifically on the positioning seat 45. It should be noted that at this time, the return spring 76 is in its original length state, and the sealing plate 74 is at the rightmost side of the inner cavity of the positioning box 42. The positioning seat 45 will be in its initial position and can be used for the same batch of samples to be tested 5 with the same size. By using rubber material for the positioning seat 45, when the worker places the sample to be tested 5 on the positioning seat 45, the elastic deformation generated by the positioning seat 45 can well clamp the sample to be tested 5, and it does not affect the subsequent quick removal of qualified samples by the worker, ensuring the stability of the clamping of the sample to be tested 5. On the one hand, it can ensure that the sample to be tested 5 does not fall due to jitter during the operation of the belt 3, ensuring the safety of the sample to be tested 5. On the other hand, it can improve the accuracy of the detection component 6 in detecting the sample to be tested 5, so as to improve the accuracy of the entire device's detection.

[0049] Refer to Figures 1-7, Further, the detection component 6 includes a detection box 61 and a limiting plate 62 fixedly installed on the left side wall of the detection box 61. A detection plate 63 is slidably installed in the inner cavity of the limiting plate 62. A detection head 64 is fixedly installed at the end of the detection plate 63. A sliding rod 65 is fixedly installed in the inner cavity of the detection plate 63. A limiting groove 621 is provided on the limiting plate 62. The detection plate 63 slides in the inner cavity of the limiting groove 621. A sliding groove 611 is provided in the inner cavity of the detection box 61. The sliding rod 65 slides in the inner cavity of the sliding groove 611. A spring seat 66 is fixedly installed on the inner wall of the detection box 61. The other end of the spring seat 66 abuts against the side wall of the detection plate 63. A pressure sensor is provided on the inner wall of the detection head 64.

[0050] It should be noted that when the sample to be tested 5 passes by the detection head 64 without contacting it, the sample to be tested 5 can directly pass under the detection component 6 at this time to determine that the thickness of the sample to be tested 5 is qualified. When the sample to be tested 5 contacts the detection head 64 when passing by it, the sample to be tested 5 will squeeze the detection head 64, causing it to drive the detection plate 63 to move to the right side of the inner cavity of the detection box 61 (as Figures 6-7 shown). At this time, under the limiting action of the limiting groove 621 and the sliding groove 611, the detection plate 63 will move upward in the limiting groove 621, and the sliding rod 65 will move to the upper side of the sliding groove 611. Thus, the detection plate 63 will gradually lift upward at this time, making room for the support plate 41 to rotate and the sample to be tested 5 to fall. When the sample to be tested 5 falls from the two support plates 41, at this time, the detection plate 63 is separated from the sample to be tested 5. Under the action of the spring seats 66 on the upper and lower sides, the detection plate 63 will be in the middle of the detection box 61 again, preparing for the detection of the next sample to be tested 5.

[0051] Refer to Figures 1-9, Further, the sorting component 7 includes a screw rod 71 rotatably installed in the inner cavity of the positioning box 42, and a counterweight 72 threadedly installed on the outer wall of the screw rod 71. A sealing plate 74 is fixedly installed on the side wall of the counterweight 72 through a support rod 73. A blow pipe 75 is fixedly installed in the middle of the right end face of the positioning box 42. The screw rod 71 is fixedly installed on the outer wall of the threaded rod 44. The lead angle of the screw rod 71 is greater than the equivalent friction angle of the counterweight 72. The right part of the inner cavity of the screw rod 71 is hollow and is connected to the blow pipe 75. An air inlet hole 711 is arranged on the right outer wall of the screw rod 71. A return spring 76 is fixedly installed on the side wall of the counterweight 72, and the other end of the return spring 76 is fixedly installed on the inner wall of the positioning box 42. The right outer wall of the screw rod 71 is set as a smooth curved surface. The sealing plate 74 is slidably connected to the screw rod 71. A magnetic column 77 is arranged at the end of the support plate 41 away from the rotating shaft. The two magnetic columns 77 attract each other. An electromagnet 78 is fixedly installed on the inner wall of the frame 1. The starter of the electromagnet 78 is electrically connected to the pressure sensor. A material receiving box 79 is fixedly installed in the middle of the inner cavity of the frame 1.

[0052] It should be noted that when the test sample 5 presses the detection head 64 to move, the pressure sensor will trigger an alarm to turn on the starter of the electromagnet 78. When the electromagnet 78 is in the energized state, it will generate a huge magnetic field to attract the magnetic column 77 at the end of the support plate 41, so that the two support plates 41 on both sides will rotate downward at the same time, and the two magnetic columns 77 on both sides will be separated. At this time, there will be a huge gap between the two support plates 41 on both sides, and the unqualified test sample 5 will be able to fall from the support plate 41 and finally fall into the material receiving box 79. When the support plate 41 is on the inclined plane, under the action of the gravity of the counterweight 72 (as Figures 8-9 shown), the counterweight 72 will slide to the left side of the inner cavity of the positioning box 42. Since the screw rod 71 has a special shape, the screw rod 71 will drive the threaded sleeve 43 to rotate. Since the threaded sleeve 43 is threadedly connected to the threaded rod 44 and the positioning seat 45 is slidably connected to the support plate 41 through the sliding column 46, the threaded rod 44 will gradually contract towards the threaded sleeve 43. At this time, the positioning seat 45 will be separated from the test sample 5 in contact, so that the unqualified test sample 5 can fall from the support plate 41. When the counterweight 72 slides left and right in the inner cavity of the positioning box 42, the sealing plate 74 fixedly installed on the counterweight 72 through the support rod 73 will move to the left at the same time. At this time, as the space on the left side of the inner cavity of the positioning box 42 is continuously reduced, the internal air will enter the inner cavity of the screw rod 71 through the air inlet hole 711 and then be ejected from the blow pipe 75, which can blow the side wall of the falling unqualified test sample 5 to avoid the phenomenon of jamming and vertical falling when it slides on the support plate 41 (as Figures 10-11As shown in the figure, the unqualified samples to be tested 5 fall horizontally, which can better protect the unqualified samples to be tested 5 and avoid the difficulty of subsequent repair caused by the vertical fall and the resulting corner bumps. At the same time, multiple unqualified samples to be tested 5 falling horizontally can be neatly placed together, avoiding the need for workers to pick up the unqualified samples to be tested 5 frequently, reducing the work intensity of the workers and improving the practicality of the entire device.

[0053] The working principle of this semiconductor wafer thickness detection device:

[0054] When using this device to detect the thickness of a semiconductor wafer, the external motor is started to rotate the pulleys 2 on both sides. At this time, the belt 3 installed on the pulley 2 will rotate continuously back and forth. At this time, the sample to be tested 5 is placed in the positioning component 4 on the left side of the belt 3, specifically on the positioning seat 45. It should be noted that at this time, the return spring 76 is in its original length state, the sealing plate 74 is at the rightmost side of the inner cavity of the positioning box 42, and the positioning seat 45 is in its initial position, which can be used for the same batch of samples to be tested 5 with the same size. By using rubber as the material of the positioning seat 45, when the worker places the sample to be tested 5 on the positioning seat 45, the elastic deformation generated by the positioning seat 45 can well clamp the sample to be tested 5, and does not affect the subsequent rapid removal of the qualified sample by the worker, ensuring the stability of the clamping of the sample to be tested 5. On the one hand, it can ensure that the sample to be tested 5 does not fall due to vibration during the operation of the belt 3, ensuring the safety of the sample to be tested 5. On the other hand, it can improve the accuracy of the detection component 6 in detecting the sample to be tested 5, so as to improve the accuracy of the entire device detection;

[0055] When the sample to be tested 5 passes by the detection head 64 without contact, the sample to be tested 5 can directly pass under the detection component 6 to determine that the thickness of this sample to be tested 5 is qualified. When the sample to be tested 5 contacts the detection head 64 when passing by, the sample to be tested 5 will squeeze the detection head 64, causing it to drive the detection plate 63 to move to the right side of the inner cavity of the detection box 61 (as Figures 6-7 shown). At this time, under the limiting action of the limiting groove 621 and the sliding groove 611, the detection plate 63 will move upward to the upper part of the limiting groove 621, and the sliding rod 65 will move to the upper side of the sliding groove 611. Thus, the detection plate 63 will gradually lift upward, making room for the support plate 41 to rotate and the sample to be tested 5 to fall. After the sample to be tested 5 falls from the two support plates 41, at this time, the detection plate 63 is separated from the sample to be tested 5. Under the action of the spring seats 66 on the upper and lower sides, the detection plate 63 will be in the middle of the detection box 61 again, preparing for the detection of the next sample to be tested 5;

[0056] It should be noted that when the test sample 5 presses against the detection head 64 and moves, the pressure sensor will trigger an alarm to activate the starter of the electromagnet 78. When the electromagnet 78 is energized, a huge magnetic field will be generated to attract the magnetic column 77 at the end of the support plate 41. Thus, the two support plates 41 on both sides will rotate downward simultaneously, and the magnetic columns 77 on both sides will be separated. Furthermore, a huge gap will exist between the two support plates 41 on both sides at this time, and the unqualified test sample 5 will be able to fall from the support plate 41 and finally fall into the material collecting box 79. When the support plate 41 is on an inclined plane, under the action of the gravity of the counterweight 72 (as Figures 8-9 shown), the counterweight 72 will slide towards the left side of the inner cavity of the positioning box 42. Since the screw rod 71 has a special shape, the screw rod 71 will drive the threaded sleeve 43 to rotate. Since the threaded sleeve 43 is threadedly connected to the threaded rod 44 and the positioning seat 45 is slidably connected to the support plate 41 through the sliding column 46, the threaded rod 44 will gradually contract towards the threaded sleeve 43. At this time, the positioning seat 45 will be disengaged from the test sample 5, facilitating the unqualified test sample 5 to fall from the support plate 41;

[0057] Meanwhile, when the counterweight 72 slides left and right in the inner cavity of the positioning box 42, the sealing plate 74 fixedly installed on the counterweight 72 through the support rod 73 will move to the left simultaneously. At this time, as the space on the left side of the inner cavity of the positioning box 42 continuously decreases, the air inside will enter the inner cavity of the screw rod 71 through the air inlet hole 711 and then be ejected from the air blowing pipe 75, which can blow the side wall of the falling unqualified test sample 5 to avoid the phenomenon of it getting stuck during sliding on the support plate 41 and vertical falling (as Figures 10-11 shown), so that the unqualified test sample 5 falls horizontally (as Figure 12 shown), providing better protection for the unqualified test sample 5 and avoiding the corner bumps caused by its vertical falling, which increases the difficulty of subsequent repair. Meanwhile, multiple unqualified test samples 5 falling horizontally can be neatly placed together, avoiding the need for workers to pick up the unqualified test samples 5 frequently and reducing the working intensity of the workers;

[0058] Therefore, through the above description, this solution can automatically detect the thickness of the test sample 5, simultaneously eliminate the unqualified test samples 5, improve the automation of the detection of the test sample 5, reduce the working intensity of the workers, and greatly improve the practicality of the entire device.

[0059] It should be noted that the specific model and specification of the motor need to be selected according to the actual specifications of the device, etc. The specific selection calculation method adopts the existing technology in this field, so it will not be elaborated in detail here.

[0060] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A semiconductor wafer thickness detection device, characterized in that, Including: A frame (1), with belt pulleys (2) fixedly installed at both ends of the frame (1), and a belt (3) drivingly installed between the two belt pulleys (2); A positioning assembly (4) and a sample to be tested (5), the positioning assembly (4) is arranged inside the belt (3), and the positioning assembly (4) is used for clamping the sample to be tested (5); A detection assembly (6), the detection assembly (6) is fixedly installed above the belt (3), and the detection assembly (6) is used for performing a pass detection on the sample to be tested (5); A sorting assembly (7), the sorting assembly (7) is arranged in the middle of the inner cavity of the frame (1), and the sorting assembly (7) is used for removing unqualified samples to be tested (5); The positioning assembly (4) includes a support plate (41) rotatably installed on the inner wall of the belt (3) through a rotating shaft. On one side of the upper end surface of the support plate (41) close to the rotating shaft, a positioning box (42) is fixedly installed. Inside the left side wall cavity of the positioning box (42), a threaded sleeve (43) is rotatably installed. Inside the threaded sleeve (43), a threaded rod (44) is threadedly installed. The end of the threaded rod (44) is fixedly installed with a positioning seat (45). On the lower end surface of the positioning seat (45), a sliding column (46) is fixedly installed. A torsion spring (47) is wound and installed on the side wall of the rotating shaft. The two ends of the torsion spring (47) are respectively fixedly connected to the inner wall of the support plate (41) and the inner wall of the belt (3). The sliding column (46) is slidably connected to the support plate (41). The positioning seat (45) is made of rubber material, and the sample to be tested (5) is placed on the side wall of the positioning seat (45); The sorting assembly (7) includes a spiral rod (71) rotatably installed inside the positioning box (42), and a counterweight block (72) threadedly installed on the outer wall of the spiral rod (71). On the side wall of the counterweight block (72), a sealing plate (74) is fixedly installed through a support rod (73). In the middle of the right end surface of the positioning box (42), a blow pipe (75) is fixedly installed. The spiral rod (71) is fixedly installed on the outer wall of the threaded rod (44). The lead angle of the spiral rod (71) is greater than the equivalent friction angle of the counterweight block (72). The right part of the inner cavity of the spiral rod (71) is hollow. The right part of the inner cavity of the spiral rod (71) is communicated with the blow pipe (75). An air inlet hole (711) is arranged on the right outer wall of the spiral rod (71). A return spring (76) is fixedly installed on the side wall of the counterweight block (72). The other end of the return spring (76) is fixedly installed on the inner wall of the positioning box (42). The right outer wall of the spiral rod (71) is set as a smooth curved surface. The sealing plate (74) is slidably connected to the spiral rod (71); A magnetic column (77) is arranged at the end of the support plate (41) away from the rotating shaft. The two magnetic columns (77) attract each other. An electromagnet (78) is fixedly installed on the inner wall of the frame (1). The starter of the electromagnet (78) is electrically connected to a pressure sensor. A material receiving box (79) is fixedly installed in the middle of the inner cavity of the frame (1).

2. The semiconductor wafer thickness detection device according to claim 1, characterized in that, The detection component (6) includes a detection box (61) and a limit plate (62) fixedly installed on the left side wall of the detection box (61). A detection plate (63) is slidably installed in the inner cavity of the limit plate (62). A detection head (64) is fixedly installed at the end of the detection plate (63). A sliding rod (65) is fixedly installed in the inner cavity of the detection plate (63).

3. The semiconductor wafer thickness detection device according to claim 2, wherein A limit groove (621) is provided on the limit plate (62). The detection plate (63) slides in the inner cavity of the limit groove (621). A sliding groove (611) is provided in the inner cavity of the detection box (61). The sliding rod (65) slides in the inner cavity of the sliding groove (611). A spring seat (66) is fixedly installed on the inner wall of the detection box (61). The other end of the spring seat (66) abuts against the side wall of the detection plate (63). A pressure sensor is provided on the inner wall of the detection head (64).

Images