Method and apparatus for measuring thickness of layers in a ring device

Abstract

The application provides a method and device for measuring thickness of each layer in a ring-shaped device, the method comprising: obtaining a ring-shaped cross-sectional image of the ring-shaped device and a gray value of each pixel point on the ring-shaped cross-sectional image; simulating ring-shaped isolation lines between each layer in the ring-shaped cross-sectional image according to the gray value of each pixel point; taking the center of the ring-shaped cross-sectional image as an end point, and simulating N rays in the direction of the outermost ring-shaped isolation line of the ring-shaped cross-sectional image, wherein N is an integer greater than 0; obtaining a length between adjacent thickness cutoff points on each ray as thickness data of a layer between the adjacent thickness cutoff points; performing summation average calculation on N thickness data of each layer to obtain a thickness value of each layer; and determining a real thickness value of each layer in the ring-shaped device according to a scale and the thickness value of each layer. The application can improve the accuracy of thickness data measurement of each layer in a cylindrical capacitor device and improve the speed of thickness data measurement.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor detection, in particular to a method and device for measuring thickness of layers in a ring-shaped device. BACKGROUND

[0002] Cylindrical capacitor devices are widely used in semiconductor chips, such as the current mainstream 3D-DRAM chips. The cylindrical capacitor device is composed of metal layers and dielectric layers arranged in intervals. In the production process of the semiconductor chip, the thickness data of each layer in the cylindrical capacitor device are obtained according to the cross-sectional pattern of the cylindrical capacitor device, so as to control the thickness of each layer of the cylindrical capacitor device to meet the manufacturing requirements of the semiconductor chip.

[0003] In the traditional method, the ring-shaped cross section of the cylindrical capacitor device is manually intercepted, and the thickness data of each layer in the ring-shaped cross section of the capacitor device is manually measured. The data measured by this method is not only inaccurate due to too many subjective factors in manual measurement, but also causes the manufacturing speed of the semiconductor chip to be reduced due to too long measurement time.

[0004] Therefore, how to improve the accuracy of the thickness data measurement of each layer in the cylindrical capacitor device and improve the speed of the thickness data measurement is still a problem to be solved. SUMMARY

[0005] The present application provides a method and device for measuring thickness of layers in a ring-shaped device, so as to improve the accuracy of the thickness data measurement of each layer in the cylindrical capacitor device and improve the speed of the thickness data measurement.

[0006] According to some embodiments, the present application provides a method for measuring thickness of layers in a ring-shaped device, comprising:

[0007] obtaining a ring-shaped cross-sectional image of the ring-shaped device and a gray value of each pixel point on the ring-shaped cross-sectional image;

[0008] simulating ring-shaped isolation lines between each layer in the ring-shaped cross-sectional image according to the gray value of each pixel point;

[0009] simulating N rays from the center of the ring-shaped cross-sectional image to the direction of the outermost ring-shaped isolation line of the ring-shaped cross-sectional image, N being an integer greater than 0;

[0010] taking the intersection point of the ray and each ring-shaped isolation line as a thickness cutoff point, and obtaining the length between adjacent thickness cutoff points on each ray as the thickness data of the layer between the adjacent thickness cutoff points;

[0011] summing and averaging the N thickness data of each layer to obtain the thickness value of each layer;

[0012] obtaining a scale between a size of the ring-shaped cross-section image and an actual size of the ring-shaped cross-section of the ring-shaped device, determining a real thickness value of each layer in the ring-shaped device according to the scale and the thickness value of each layer.

[0013] Optionally, the simulating the ring-shaped isolation lines between the layers in the ring-shaped cross-section image according to the gray value of each pixel point comprises:

[0014] screening out the target pixel points with a gray value of at least the top ten percent in the ring-shaped cross-section image;

[0015] detecting each pixel pair in the ring-shaped cross-section image, each pixel pair being composed of a first target pixel point and a second target pixel point adjacent to the first target pixel point and having the shortest distance;

[0016] connecting the first target pixel point and the second target pixel point in each pixel pair by a line segment to obtain the ring-shaped isolation lines between the layers in the ring-shaped cross-section image.

[0017] Optionally, the method further comprises:

[0018] dividing the ring-shaped cross-section image into M sub-image regions according to a length L at equal intervals along a first direction and a second direction, the first direction and the second direction being two perpendicular directions, L being greater than zero, and M being an integer greater than zero;

[0019] the connecting the first target pixel point and the second target pixel point in each pixel pair by a line segment to obtain the ring-shaped isolation lines between the layers in the ring-shaped cross-section image comprises:

[0020] the connecting the first target pixel point and the second target pixel point in each pixel pair by a line segment to obtain the ring-shaped isolation lines between the layers in the ring-shaped cross-section image comprises:

[0021] Optionally, the method further comprises:

[0022] dividing the ring-shaped cross-section image into four quadrants with a center of the ring-shaped cross-section image as an origin along the first direction and the second direction, wherein the first quadrant has a horizontal coordinate value and a vertical coordinate value both greater than 0, the second quadrant has a horizontal coordinate value less than 0 and a vertical coordinate value greater than 0, the third quadrant has a horizontal coordinate value and a vertical coordinate value both less than 0, and the fourth quadrant has a horizontal coordinate value greater than 0 and a vertical coordinate value less than 0;

[0023] the connecting the first target pixel point and the second target pixel point in each pixel pair by a line segment to obtain the ring-shaped isolation lines between the layers in the ring-shaped cross-section image comprises:

[0024] acquiring a first pixel pair in each quadrant, a first target pixel point in the first pixel pair having a horizontal coordinate value less than a horizontal coordinate value of a second target pixel point;

[0025] connecting the first target pixel point and the second target pixel point in the first pixel pair of the first quadrant and the third quadrant by a line segment, and erasing the line segment between the first target pixel point and the second target pixel point in the first pixel pair when the first target pixel point has a vertical coordinate value less than a vertical coordinate value of the second target pixel point;

[0026] connecting the first target pixel point and the second target pixel point in the first pixel pair of the second quadrant and the fourth quadrant by a line segment, and erasing the line segment between the first target pixel point and the second target pixel point in the first pixel pair when the first target pixel point has a vertical coordinate value greater than a vertical coordinate value of the second target pixel point (Y1>Y2);

[0027] obtaining the annular isolation lines between the layers in the annular cross-sectional image according to the remaining unerased line segments.

[0028] Optionally, the obtaining the annular isolation lines between the layers in the annular cross-sectional image according to the first target pixel point and the second target pixel point in the first pixel pair includes:

[0029] erasing the line segment when the length of the line segment is greater than or equal to ;

[0030] obtaining the annular isolation lines between the layers in the annular cross-sectional image according to the remaining unerased line segments.

[0031] Optionally, the obtaining the thickness data of the layers between the adjacent thickness cutoff points on each ray according to the intersection points of the rays and the annular isolation lines as the thickness cutoff points includes:

[0032] reading coordinate data of each thickness cutoff point;

[0033] determining the thickness data of the layers between the adjacent thickness cutoff points on each ray according to the coordinate data of each thickness cutoff point.

[0034] Optionally, the summing and averaging the N thickness data of each layer to obtain the thickness value of each layer includes:

[0035] discarding the maximum value and the minimum value in the N thickness data of each layer, and summing and averaging the remaining thickness data to obtain the thickness value of each layer.

[0036] According to some embodiments, the second aspect of the present application provides a device for measuring the thickness of each layer in an annular device, comprising:

[0037] an acquisition module configured to acquire a ring cross-section image of the ring device and a gray value of each pixel point on the ring cross-section image;

[0038] a simulation module configured to simulate a ring isolation line between each layer in the ring cross-section image according to the gray value of each pixel point;

[0039] the simulation module is further configured to simulate N rays from a center of the ring cross-section image as an end point to a direction of an outermost ring isolation line of the ring cross-section image, N being an integer greater than zero;

[0040] a processing module configured to acquire a thickness data of a layer between adjacent thickness cutoff points on each ray, the thickness cutoff points being intersections of the ray and each ring isolation line;

[0041] the processing module is further configured to perform a sum average calculation on N thickness data of each layer to obtain a thickness value of the layer;

[0042] the processing module is further configured to acquire a scale between a size of the ring cross-section image and an actual size of the ring cross-section of the ring device, and determine a real thickness value of each layer in the ring device according to the scale and the thickness value of each layer.

[0043] Optionally, the simulation module is specifically configured to:

[0044] screen out a target pixel point with a gray value of at least a top ten percent in the ring cross-section image;

[0045] detect each pixel pair in the ring cross-section image, each pixel pair being composed of a first target pixel point and a second target pixel point adjacent to the first target pixel point and having a shortest distance;

[0046] connect the first target pixel point and the second target pixel point in each pixel pair by a line segment to obtain a ring isolation line between each layer in the ring cross-section image.

[0047] Optionally, the method further comprises:

[0048] an image division module configured to divide the ring cross-section image according to a length L at equal intervals along a first direction and a second direction to obtain M sub-image regions, the first direction and the second direction being two perpendicular directions, L being greater than zero, and M being an integer greater than zero;

[0049] the simulation module is specifically configured to:

[0050] Only when the first target pixel and the second target pixel in the first pixel pair are in the same sub-image region, the first target pixel and the second target pixel in the first pixel pair are connected by a line segment to obtain the annular isolation line between each layer in the annular cross-section image.

[0051] Optionally, the image division module is further configured to:

[0052] The annular cross-section image is divided into four quadrants with the center of the annular cross-section image as the origin along the first direction and the second direction, wherein the horizontal and vertical coordinate values of the first quadrant are greater than 0, the horizontal coordinate value of the second quadrant is less than 0 and the vertical coordinate value is greater than 0, the horizontal and vertical coordinate values of the third quadrant are both less than 0, and the horizontal coordinate value of the fourth quadrant is greater than 0 and the vertical coordinate value is less than 0.

[0053] The simulation module is specifically configured to:

[0054] Obtain the first pixel pair in each quadrant, wherein the horizontal coordinate value of the first target pixel in the first pixel pair is less than that of the second target pixel;

[0055] After connecting the first target pixel and the second target pixel in the first pixel pair of the first quadrant and the third quadrant by a line segment, when the vertical coordinate value of the first target pixel is less than that of the second target pixel, the line segment between the first target pixel and the second target pixel in the first pixel pair is erased.

[0056] After connecting the first target pixel and the second target pixel in the first pixel pair of the second quadrant and the fourth quadrant by a line segment, when the vertical coordinate value of the first target pixel is greater than that of the second target pixel (Y1>Y2), the line segment between the first target pixel and the second target pixel in the first pixel pair is erased.

[0057] The annular isolation line between each layer in the annular cross-section image is obtained according to the remaining unerased line segments.

[0058] Optionally, the simulation module is specifically configured to:

[0059] When the length of the line segment is greater than or equal to , the line segment is erased.

[0060] The annular isolation line between each layer in the annular cross-section image is obtained according to the remaining unerased line segments.

[0061] According to some embodiments, the third aspect of the present application provides an electronic device, comprising: a processor, and a memory connected in communication with the processor;

[0062] The memory stores computer execution instructions.

[0063] The processor executes computer-executed instructions stored in the memory to implement the method for measuring thickness of each layer in a ring-shaped device according to the first aspect.

[0064] According to some embodiments, the fourth aspect of the present application provides a computer-readable storage medium, which stores computer-executed instructions, when the instructions are executed, causing a computer to execute the method for measuring thickness of each layer in a ring-shaped device according to the first aspect.

[0065] According to some embodiments, the fifth aspect of the present application provides a computer program product, which includes a computer program, when the computer program is executed by a processor, implementing the method for measuring thickness of each layer in a ring-shaped device according to the first aspect.

[0066] The method for measuring thickness of each layer in a ring-shaped device provided by some embodiments of the present application simulates ring-shaped isolation lines between each layer in a ring-shaped cross-sectional image of a ring-shaped device and the gray value of each pixel point in the ring-shaped cross-sectional image. Then, at least one ray is simulated with the center of the ring-shaped cross-sectional image as an end point, and the intersection point of the ray and each ring-shaped isolation line is taken as a thickness cutoff point, and the length between adjacent thickness cutoff points on the ray is taken as the thickness data of the layer between the adjacent thickness cutoff points. Then, the real thickness value of each layer in the ring-shaped device is determined according to the scale between the size of the ring-shaped cross-sectional image and the actual size of the ring-shaped cross-sectional of the ring-shaped device. The method provided by the embodiment does not need manual participation to measure the thickness of each layer in the ring-shaped device, only needs to simulate the ring-shaped isolation lines, the ray, and other processing to obtain the thickness value of each layer in the ring-shaped device, improves the accuracy of the thickness data measurement of each layer in the ring-shaped device (cylindrical capacitor device), and improves the speed of the thickness data measurement. BRIEF DESCRIPTION OF DRAWINGS

[0067] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and serve to explain the principles of the present disclosure, together with the description.

[0068] Figure 1 A schematic diagram of a cylindrical capacitor device provided by the present application.

[0069] Figure 2 An application scenario schematic diagram of the method for measuring thickness of each layer in a ring-shaped device provided by the present application.

[0070] Figure 3 A flowchart of the method for measuring thickness of each layer in a ring-shaped device provided by one embodiment of the present application.

[0071] Figure 4This is a schematic diagram of a cross-sectional image of a ring device provided for one embodiment of this application.

[0072] Figure 5 This is a schematic diagram of a cross-sectional image of a ring-shaped device provided in yet another embodiment of this application.

[0073] Figure 6 This is a schematic diagram of a cross-sectional image of a ring-shaped device provided for another embodiment of this application.

[0074] Figure 7 This is a schematic diagram of a device for measuring the thickness of each layer in a ring device provided in one embodiment of this application.

[0075] Figure 8 A schematic diagram of an electronic device provided for one embodiment of this application.

[0076] The accompanying drawings have illustrated specific embodiments of this disclosure, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concepts of this disclosure to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0077] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0078] Cylindrical capacitors are widely used in semiconductor chips (such as the currently mainstream 3D-DRAM chips). Cylindrical capacitors consist of alternating metal layers and dielectric layers (i.e., insulating material layers), such as... Figure 1 ( Figure 1 (As shown in the diagram, which only shows two metal layers and one spacer layer, and does not impose any limitations on the structure of the cylindrical capacitor, the two metal layers are separated by a dielectric layer.) Since the thickness of the metal and dielectric layers affects the performance of the cylindrical capacitor, during the semiconductor chip manufacturing process, it is necessary to obtain the thickness data of each layer in the cylindrical capacitor based on the cross-sectional shape of the cylindrical capacitor to control the thickness of each layer to meet the manufacturing requirements of the semiconductor chip.

[0079] In the conventional method, the thickness data of each layer in the ring-shaped section of the cylindrical capacitor device is manually measured after the ring-shaped section of the cylindrical capacitor device is manually intercepted. The data measured by this method is not only inaccurate due to too many subjective factors in manual measurement, but also causes the speed of semiconductor chip manufacturing to decrease due to too much workload and too long measurement time.

[0080] Embodiments of the present application provide a method for measuring the thickness of each layer in a ring-shaped device and a device for measuring the thickness of each layer in a ring-shaped device. The method for measuring the thickness of each layer in a ring-shaped device processes the image of the ring-shaped section of the ring-shaped device (for example, a cylindrical capacitor device) intercepted to calculate the thickness value of each layer in the image of the ring-shaped section of the ring-shaped device. Then, the real thickness value of each layer in the ring-shaped device is determined according to the scale between the image of the ring-shaped section and the actual size of the ring-shaped interface of the ring-shaped device. The method provided by the embodiments of the present application does not need manual participation to measure the thickness of each layer in the ring-shaped device. The thickness value of each layer in the ring-shaped device is obtained by simulating the ring-shaped isolation line, the ray, and other processing, which improves the accuracy of the thickness data measurement of each layer in the ring-shaped device (cylindrical capacitor device) and improves the speed of the thickness data measurement.

[0081] The method for measuring the thickness of each layer in a ring-shaped device provided by the present application is applied to an electronic device, such as a computer, a laboratory server, and the like. Figure 2 For the application of the method for measuring the thickness of each layer in a ring-shaped device provided by the present application, the electronic device obtains the image of the ring-shaped section of the ring-shaped device and the gray value of each pixel point on the ring-shaped interface from a measuring device (used for shooting the image of the ring-shaped section of the ring-shaped device and analyzing the gray value of each pixel point on the image of the ring-shaped section). Then, the thickness value of each layer on the image of the ring-shaped section is obtained after the image of the ring-shaped section is labeled and processed based on the gray value of each pixel point on the image of the ring-shaped section and other methods, and the real thickness value of each layer in the ring-shaped device is obtained according to the scale of the image of the ring-shaped section.

[0082] Please refer to Figure 3 The embodiment one of the present application provides a method for measuring the thickness of each layer in a ring-shaped device, which comprises the following steps:

[0083] In S310, the image of the ring-shaped section of the ring-shaped device and the gray value of each pixel point on the image of the ring-shaped section are obtained.

[0084] As described above, the electronic device acquires an annular cross-sectional image of the annular device and the grayscale value of each pixel in the annular cross-sectional image from the measuring device. The cutting plane of the annular cross-sectional image is based on a plane perpendicular to the central axis of the annular device. Optionally, after receiving multiple annular cross-sectional images output by the measuring device, the electronic device can discard annular cross-sectional images with uncalculated pixel grayscale values ​​or poor image clarity.

[0085] S320 simulates the annular isolation lines between layers in the annular cross-sectional image based on the grayscale value of each pixel.

[0086] like Figure 4 As shown, the layers are not seamlessly connected; instead, there are isolation gaps between different layers. When these isolation gaps are presented in the annular cross-sectional image, the grayscale values ​​of the pixels are relatively high (higher grayscale values ​​correspond to lighter colors; areas without material or isolation gaps tend to have gray and white grayscale values). Conversely, areas with material in the annular cross-sectional image have relatively low grayscale values ​​(lower grayscale values ​​correspond to darker colors; areas with material tend to have black grayscale values). Therefore, annular isolation lines between layers can be simulated based on the grayscale characteristics of the isolation gaps between layers. These annular isolation lines represent the annular isolation gaps between layers.

[0087] Optionally, the target pixels can be selected from the annular cross-sectional image if their grayscale values ​​are at least in the top 10%. For example, if the grayscale values ​​of the pixels in the annular cross-sectional image range from 0 to 255, then the pixels with grayscale values ​​in the top 10% would be those with grayscale values ​​greater than or equal to 220 and less than or equal to 255. Alternatively, pixels with grayscale values ​​greater than 220 can also be directly selected as the target pixels.

[0088] After identifying the target pixels in the annular cross-sectional image, each pixel pair in the image is then detected. Each pixel pair consists of a first target pixel and a second target pixel that is adjacent to the first target pixel and has the shortest distance. The first target pixel can be any one of the target pixels in the annular cross-sectional image. Multiple pixel pairs may have the same target pixel; for example, the second target pixel in the first pixel pair may be the first target pixel in the second pixel pair.

[0089] The distance between the first target pixel point and other target pixel points can be calculated according to the coordinates of each target pixel point. After the annular cross-sectional image is obtained in step S320, the electronic device labels and records the coordinate values of each pixel point on the annular cross-sectional image, and when detecting the second target pixel point adjacent to the first target pixel point and having the shortest distance, the detection is performed according to the coordinate values of the pixel points. After each pixel pair is detected, the first target pixel point and the second target pixel point in each pixel pair are connected by a line segment to obtain the annular isolation lines between each layer in the annular cross-sectional image. The obtained annular isolation lines between each layer are as shown in Figure 5 The annular isolation lines may not be continuous annular lines, but are annular lines formed by intermittent connections. However, after the line segments are connected, the line segments may be interference line segments, and therefore, the interference line segments need to be removed from the line segments, so that the simulated annular isolation lines can more accurately and truly reflect the isolation lines between each layer in the annular device.

[0090] Optionally, as shown in Figure 6 (a), the annular cross-sectional image can also be equally divided in a first direction and a second direction according to a length L, L is greater than zero, and M is an integer greater than zero, the first direction and the second direction are two perpendicular directions. When the first target pixel point and the second target pixel point in each pixel pair on the annular cross-sectional image are connected, only when the first target pixel point and the second target pixel point in the pixel pair are in the same sub-image region, the first target pixel point and the second target pixel point in the first pixel pair are connected by a line segment to obtain the annular isolation lines between each layer in the annular cross-sectional image. Only connecting the first target pixel pairs and the second target pixel pairs in the sub-image region makes the direction of the connected line segment more likely to be the same as the direction of the isolation line between each layer of the annular device. If the pixel pairs in the same sub-image region are not limited to be connected, the line segment may be simulated incorrectly, which may cause the annular isolation line to fail to be simulated.

[0091] However, if after the first target pixel point and the second target pixel point in the pixel pair are connected by a line segment, some line segments (interference line segments) still have incorrect simulation, in order to avoid the influence of these interference line segments on the simulation of the annular isolation line, these interference line segments also need to be removed from the formed line segments. The method of removing these interference line segments can be to remove according to the direction of the line segment, or to remove according to the length of the line segment.

[0092] As shown in Figure 6(b) As shown, when removing the interfering line segments according to the line segment direction, the center of the circular cross-section image needs to be detected first, and then the circular cross-section image is divided into four quadrants with the center of the circular cross-section image as the origin. When detecting the center of the circular cross-section image, a circle with the center needs to be detected first, and then the center of the circle is obtained by averaging the coordinate values of all pixel points in the circle, which is also the center of the circular cross-section image. When dividing the circular cross-section image into four quadrants, the circular cross-section image is divided into four quadrants along the first direction and the second direction. Among them, the horizontal and vertical coordinate values of the first quadrant are greater than 0, the horizontal coordinate value of the second quadrant is less than 0 and the vertical coordinate value is greater than 0, the horizontal and vertical coordinate values of the third quadrant are both less than 0, and the horizontal coordinate value of the fourth quadrant is greater than 0 and the vertical coordinate value is less than 0.

[0093] A first pixel pair in each quadrant is obtained, and the horizontal coordinate value of the first target pixel point in the first pixel pair is less than that of the second target pixel point (X1X2). After connecting the first target pixel point and the second target pixel point in the first pixel pair of the first quadrant and the third quadrant by a line segment, when the vertical coordinate value of the first target pixel point is less than that of the second target pixel point (Y1Y2), the line segment between the first target pixel point and the second target pixel point in the first pixel pair is removed. X1: horizontal coordinate value of the first target pixel point, X2: horizontal coordinate value of the second target pixel point, Y1: vertical coordinate value of the first target pixel point, Y2: vertical coordinate value of the second target pixel point. After connecting the first target pixel point and the second target pixel point in the first pixel pair of the second quadrant and the fourth quadrant by a line segment, when the vertical coordinate value of the first target pixel point is greater than that of the second target pixel point (Y1>Y2), the line segment between the first target pixel point and the second target pixel point in the first pixel pair is removed.

[0094] On the contrary, after connecting the first target pixel point and the second target pixel point in the first pixel pair of the first quadrant and the third quadrant by a line segment, when the vertical coordinate value of the first target pixel point is greater than that of the second target pixel point (Y1>Y2), the line segment between the first target pixel point and the second target pixel point in the first pixel pair is retained. After connecting the first target pixel point and the second target pixel point in the first pixel pair of the second quadrant and the fourth quadrant by a line segment, when the vertical coordinate value of the first target pixel point is less than that of the second target pixel point (Y1<Y2), the line segment between the first target pixel point and the second target pixel point in the first pixel pair is retained.

[0095] Another method of removing interfering line segments is to remove them according to the length of the line segment. The circular cross-section image is divided into M sub-image regions according to equal intervals of length L along the first direction and the second direction, and when the length of the line segment is greater than or equal to When the length of the line segment is greater than L, the line segment should be removed, and the annular isolation lines between the layers in the annular cross-sectional image are obtained according to the remaining line segments that are not removed. That is, the first target pixel point and the second target pixel point are two end points of a diagonal line of the sub-image region. Therefore, when the length of the line segment is greater than L, the line segment should be removed, and the annular isolation lines between the layers in the annular cross-sectional image are obtained according to the remaining line segments that are not removed. That is, the first target pixel point and the second target pixel point are two end points of a diagonal line of the sub-image region. Therefore, when the length of the line segment is greater than L, the line segment should be removed, and the annular isolation lines between the layers in the annular cross-sectional image are obtained according to the remaining line segments that are not removed. That is, the first target pixel point and the second target pixel point are two end points of a diagonal line of the sub-image region. Therefore, when the length of the line segment is greater than L, the line segment should be removed, and the annular isolation lines between the layers in the annular cross-sectional image are obtained according to the remaining line segments that are not removed.

[0096] The specific generation method of the annular isolation line is described in this step. When the annular isolation line is generated based on the line segment connection between the pixel pairs, it is necessary to exclude the interference line segments, which include the line segments with abnormal direction and the line segments with abnormal length. When the line segments with abnormal direction are removed, the annular cross-sectional image is divided into four quadrants with the center of the annular cross-sectional image as the origin, and then the first pixel pair (the coordinate value of the first target pixel point is greater than that of the second target pixel point) in each quadrant is found, and then it is determined whether the line segment connecting the pixel points in the first pixel pair is an interference line segment according to the comparison result of the longitudinal coordinates of the first target pixel point and the second target pixel point. Alternatively, the first pixel pair can also be defined according to the size of the longitudinal coordinate value, and then it is determined whether the line segment connecting the pixel points in the first pixel pair is an interference line segment by comparing the horizontal coordinate values of the first target pixel point and the second target pixel point in the first pixel pair in different quadrants.

[0097] S330, N rays are simulated from the center of the annular cross-sectional image to the outermost annular isolation line of the annular cross-sectional image, N being an integer greater than 0.

[0098] As shown in Figure 6 (c), after the annular isolation lines between the layers are simulated, the center of the annular cross-sectional image is detected, and N rays are simulated from the center of the annular cross-sectional image to the outermost annular isolation line of the annular cross-sectional image, N being an integer greater than 0.

[0099] S340, the intersection point of each ray and each annular isolation line is taken as a thickness cutoff point, and the length between adjacent thickness cutoff points on each ray is taken as the thickness data of the layer between the adjacent thickness cutoff points.

[0100] As shown in Figure 6(c) as shown, A point and B point on a ray are two adjacent thickness cutoff points, the length between A point and B point is a thickness data of layer 1, N rays can obtain N thickness data of layer 1. In this way, according to the length between each pair of adjacent thickness cutoff points, N thickness data of each layer in the annular cross-section image can be obtained, the greater the value of N is, the more thickness data of each layer is obtained, which is more conducive to more accurate calculation of the thickness of each layer.

[0101] Optionally, the thickness data of each layer is obtained according to the coordinate data of the thickness cutoff point, that is, the coordinate data of each thickness cutoff point is read, and then the length between adjacent thickness cutoff points on each ray is determined according to the coordinate data of each thickness cutoff point, which is the thickness data of the layer between adjacent thickness cutoff points.

[0102] Optionally, because the annular isolation line is not a continuous line, the intersection point of the ray emitted from the center of the circle and the annular isolation line is not necessarily a pixel point, that is, the thickness cutoff point is not necessarily a pixel point. When the intersection point of the ray and the annular isolation line is not a pixel point, the coordinate data of each thickness cutoff point can be obtained by taking the center of the annular cross-section image as the origin and taking the first direction and the second direction described in step S320 as the X-axis and the Y-axis in the two-dimensional plane, respectively. Optionally, when the intersection point of the ray and the annular isolation line is not a pixel point, the nearest pixel point on the annular isolation line to the intersection point can also be found as the thickness cutoff point, and then the thickness data is calculated according to the thickness cutoff point.

[0103] S350, sum and average calculation is performed on the N thickness data of each layer to obtain the thickness value of each layer.

[0104] As shown in Table 1, the finally obtained c1 layer to c8 layer has 13 thickness data respectively, and sum and average calculation is performed on the 13 thickness data of each layer to obtain the thickness value of each layer. Among them, c1, c2, c3 to c8 represent the simulated layers in the annular cross-section image, and a total of 8 layers are simulated in the annular cross-section image, that is, 7 annular isolation lines are simulated.

[0105] Table 1:

[0106] sample c1 c2 c3 c4 c5 c6 c7 c8 0 degrees 4.225 3.085 0.638 4.787 3.617 4.468 1.596 1.383 30 degrees 3.444 3.183 1.587 4.921 4.101 4.41 1.105 3.833 60 degrees 3.451 2.821 1.001 4.369 3.473 3.995 1.215 2.347 90 degrees 3.59 2.865 1.027 4.479 3.488 4.105 1.217 2.404 120 degrees 3.507 2.879 1.045 4.486 3.517 4.107 1.35 2.451 150 degrees 3.588 3.006 1.125 4.412 3.474 4.114 1.412 2.348 180 degrees 3.649 2.979 1.058 4.434 3.505 4.145 1.222 2.356 210 degrees 3.565 2.994 1.059 4.568 3.584 4.064 1.274 2.366 240 degrees 3.473 2.928 1.139 4.439 3.605 4.019 1.217 2.51 270 degrees 3.515 2.864 1.027 4.492 3.531 4.171 1.353 2.377 300 degrees 3.578 2.97 1.039 4.504 3.522 4.105 1.411 2.364 330 degrees 3.51 2.92 1.094 4.526 3.651 4.123 1.415 2.477 360 degrees 3.476 2.868 1.144 4.527 3.511 4.153 1.403 2.444

[0107] Optionally, the maximum value and the minimum value of the N thickness data of each layer can be removed, and then sum and average calculation is performed on the remaining thickness data to obtain the thickness value of each layer. For example, 4.225 and 3.444 are removed from the 13 thickness data of the c1 layer in Table 1.

[0108] S360, obtaining a scale between a size of the annular cross-section image and an actual size of the annular cross-section of the annular device, and determining the real thickness value of each layer in the annular device according to the scale and the thickness value of each layer.

[0109] The scale is a scale of reduction or magnification of the annular cross-section image. After the thickness value of each layer in the annular cross-section image is calculated in step S350, the real thickness value of each layer in the annular device can be determined according to the scale, i.e., the measured thickness value of each layer in the annular device.

[0110] After the real thickness value of each layer in the annular device is measured, the electronic device transmits the real thickness value of each layer in the annular device to other systems, such as a statistical process control (SPC) system. The tester can compare the real thickness value of each layer in the annular device with an expected thickness value of each layer in the annular device. If a preset condition is met, the production is continued. If the preset condition is not met, the tester can adjust the production process of the annular device according to the difference between the real thickness value and the expected thickness value, and generate the next batch of annular devices according to the adjusted production process. The next batch of annular devices is subjected to steps S310 to S360 to obtain the real thickness value of each layer.

[0111] In summary, the method for measuring the thickness of each layer in the annular device provided in the embodiment simulates the annular isolation lines between each layer in the annular cross-section image of the annular device according to the annular cross-section image and the gray value of each pixel point on the annular cross-section image. At least one ray is simulated with the center of the annular cross-section image as an end point. The intersection point of the ray and each annular isolation line is taken as a thickness cutoff point. The length between adjacent thickness cutoff points on the ray is taken as the thickness data of the layer between the adjacent thickness cutoff points. The real thickness value of each layer in the annular device is determined according to the scale between the size of the annular cross-section image and the actual size of the annular cross-section of the annular device. The method provided in the embodiment does not require manual participation in the measurement of the thickness of each layer in the annular device. Only the annular isolation lines and the ray need to be simulated, and the thickness value of each layer in the annular device can be obtained through other processing. The accuracy of the thickness data measurement of each layer in the annular device (cylindrical capacitor device) is improved, and the speed of the thickness data measurement is improved.

[0112] Please refer to Figure 7 The second embodiment of the present application provides a device 10 for measuring the thickness of each layer in an annular device, comprising:

[0113] The obtaining module 11 is configured to obtain an annular cross-section image of the annular device and a gray value of each pixel point on the annular cross-section image.

[0114] The simulation module 12 is used to simulate the annular isolation line between the layers in the annular cross-sectional image based on the gray value of each pixel.

[0115] The simulation module 12 is also used to simulate N rays from the center of the annular cross-sectional image to the outermost annular isolation line of the annular cross-sectional image, where N is an integer greater than zero.

[0116] The processing module 13 is used to obtain the thickness data of the layer between adjacent thickness cutoff points on each ray, with the intersection of the ray and each annular isolation line as the thickness cutoff point.

[0117] The processing module 13 is also used to sum and average the N thickness data of each layer to obtain the thickness value of each layer.

[0118] The processing module 13 is also used to obtain a scale between the size of the annular cross-section image and the actual size of the annular cross-section of the annular device, and to determine the actual thickness value of each layer in the annular device based on the scale and the thickness value of each layer.

[0119] The simulation module 12 is specifically used to: select the pixels with gray values ​​of at least the top 10% in the annular cross-sectional image as target pixels; detect each pixel pair in the annular cross-sectional image, each pixel pair consisting of a first target pixel and a second target pixel that is adjacent to the first target pixel and has the shortest distance; and connect the first target pixel and the second target pixel in each pixel pair with line segments to obtain the annular isolation line between each layer in the annular cross-sectional image.

[0120] The thickness measurement device 10 of each layer in the annular device also includes an image segmentation module 14, which is used to divide the annular cross-sectional image along a first direction and a second direction at equal intervals of length L to obtain M sub-image regions. The first direction and the second direction are two mutually perpendicular directions, L is greater than zero, and M is a positive integer. The simulation module 12 is specifically used to: only when the first target pixel and the second target pixel in the pixel pair are in the same sub-image region, connect the first target pixel and the second target pixel in the first pixel pair with line segments to obtain annular isolation lines between the layers in the annular cross-sectional image.

[0121] The image segmentation module 14 is further configured to: take the center of the annular cross-sectional image as the origin, and divide the annular cross-sectional image into four quadrants along the first direction and the second direction, wherein the horizontal and vertical coordinate values ​​of the first quadrant are greater than 0, the horizontal coordinate value of the second quadrant is less than 0 and the vertical coordinate value is greater than 0, the horizontal and vertical coordinate values ​​of the third quadrant are both less than 0, and the horizontal coordinate value of the fourth quadrant is greater than 0 and the vertical coordinate value is less than 0.

[0122] The simulation module 12 is specifically configured to: acquire a first pixel pair in each quadrant, a first target pixel point in the first pixel pair having a horizontal coordinate value less than a horizontal coordinate value of a second target pixel point; connect the first target pixel point and the second target pixel point in the first pixel pair of the first quadrant and the third quadrant through a line segment, and erase the line segment between the first target pixel point and the second target pixel point in the first pixel pair when the first target pixel point has a vertical coordinate value less than a vertical coordinate value of the second target pixel point; connect the first target pixel point and the second target pixel point in the first pixel pair of the second quadrant and the fourth quadrant through a line segment, and erase the line segment between the first target pixel point and the second target pixel point in the first pixel pair when the first target pixel point has a vertical coordinate value greater than a vertical coordinate value of the second target pixel point (Y1>Y2); and obtain the annular isolation lines between the layers in the annular cross-sectional image according to the remaining unerased line segments.

[0123] The simulation module 12 is specifically configured to: when a length of the line segment is greater than or equal to , erase the line segment; and obtain the annular isolation lines between the layers in the annular cross-sectional image according to the remaining unerased line segments.

[0124] The processing module 13 is specifically configured to: read coordinate data of each thickness cutoff point; and determine, according to the coordinate data of each thickness cutoff point, a length between adjacent thickness cutoff points on each ray as thickness data of a layer between the adjacent thickness cutoff points.

[0125] The processing module 13 is specifically configured to: eliminate a maximum value and a minimum value in N thickness data of each layer, and perform summation average calculation on the remaining thickness data to obtain a thickness value of each layer.

[0126] Referring to Figure 8 , the third embodiment of the present application further provides an electronic device 20, comprising: a processor 21, and a memory 22 in communication connection with the processor; the memory 22 stores computer execution instructions; and the processor 21 executes the computer execution instructions stored in the memory 22 to implement the measurement method of the thicknesses of the layers in the annular device as described in any one of the above embodiments.

[0127] One embodiment of the present application further provides a computer readable storage medium, which stores computer execution instructions, and when the instructions are executed, the computer execution instructions are executed by a processor to implement the measurement method of the thicknesses of the layers in the annular device as provided in any one of the above embodiments.

[0128] One embodiment of the present application further provides a computer program product, comprising a computer program, which is executed by a processor to implement the measurement method of the thicknesses of the layers in the annular device as provided in any one of the above embodiments.

[0129] It should be noted that the computer readable storage medium described above can be a Read Only Memory (ROM), a Programmable Read-Only Memory (PROM), an Erasable Programmable Read-Only Memory (EPROM), an Electrically Erasable Programmable Read-Only Memory (EEPROM), a Ferromagnetic Random Access Memory (FRAM), a Flash Memory, a magnetic surface memory, an optical disc, a Compact Disc Read-Only Memory (CD-ROM), or the like. It can also be various electronic devices including one or any combination of the above memories, such as a mobile phone, a computer, a tablet device, a personal digital assistant, and the like.

[0130] It should be noted that in this document, the term "comprising" or "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that processes, methods, articles or devices including a series of elements not only include those elements, but also include other elements not explicitly listed, or inherent to such processes, methods, articles or devices. Without more limitations, the element defined by the statement "comprising a" does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0131] The above-mentioned sequence numbers of the embodiments of the present application are only for description, and do not represent the advantages and disadvantages of the embodiments.

[0132] From the above description of the embodiments, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be realized by software plus a general hardware platform, of course, they can also be realized by hardware, but in many cases the former is a better embodiment. Based on such understanding, the technical solutions of the present application can be embodied in the form of a software product, which is stored in a storage medium (such as a ROM / RAM, a magnetic disc, an optical disc), and includes a plurality of instructions for making a terminal device (which can be a mobile phone, a computer, a server, an air conditioner, or a network device, etc.) execute the methods described in various embodiments of the present application.

[0133] The computer program instructions can also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer-implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart block or blocks. Figure 1 one or more flow or blocks. Figure 1 one or more flow or blocks.

[0134] These computer program instructions can also be stored in a computer readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer readable memory produce an article of manufacture including instructions which implement the function specified in the flowchart block or blocks. Figure 1 one or more flow or blocks. Figure 1 one or more flow or blocks.

[0135] The computer program instructions can also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer-implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart block or blocks. Figure 1 one or more flow or blocks. Figure 1 one or more flow or blocks.

[0136] The above merely provides the preferred embodiment of the present application, and is not intended to limit the patent scope of the present application, and any equivalent structure or equivalent flow transformation made by using the content of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A method of measuring the thickness of layers in a ring device, characterized by, The method comprises the following steps: acquiring a ring cross-sectional image of the ring device and a gray value of each pixel point on the ring cross-sectional image; screening out target pixel points with a gray value of at least the top 10% in the ring cross-sectional image; detecting each pixel pair in the ring cross-sectional image, each pixel pair being composed of a first target pixel point and a second target pixel point adjacent to the first target pixel point and having the shortest distance; dividing the ring cross-sectional image into M sub-image regions at equal intervals along a first direction and a second direction according to a length L, the first direction and the second direction being two perpendicular directions, L being greater than zero, and M being an integer greater than zero; dividing the ring cross-sectional image into four quadrants along the first direction and the second direction with a center of the ring cross-sectional image as an origin, wherein the first quadrant has a horizontal coordinate value and a vertical coordinate value both greater than 0, the second quadrant has a horizontal coordinate value less than 0 and a vertical coordinate value greater than 0, the third quadrant has a horizontal coordinate value and a vertical coordinate value both less than 0, and the fourth quadrant has a horizontal coordinate value greater than 0 and a vertical coordinate value less than 0; acquiring a first pixel pair in each quadrant, the first target pixel point in the first pixel pair having a horizontal coordinate value less than that of the second target pixel point; after connecting the first target pixel point and the second target pixel point in the first pixel pair of the first quadrant and the third quadrant by a line segment, erasing the line segment between the first target pixel point and the second target pixel point in the first pixel pair when the vertical coordinate value of the first target pixel point is less than that of the second target pixel point; after connecting the first target pixel point and the second target pixel point in the first pixel pair of the second quadrant and the fourth quadrant by a line segment, erasing the line segment between the first target pixel point and the second target pixel point in the first pixel pair when the vertical coordinate value Y1 of the first target pixel point is greater than the vertical coordinate value Y2 of the second target pixel point; obtaining ring isolation lines between layers in the ring cross-sectional image according to the remaining unerased line segments; simulating N rays from the center of the ring cross-sectional image to the outermost ring isolation line of the ring cross-sectional image, N being an integer greater than 0; taking the intersection point of each ray and each ring isolation line as a thickness cutoff point, and acquiring a length between adjacent thickness cutoff points on each ray as thickness data of layers between the adjacent thickness cutoff points; summing and averaging N thickness data of each layer to obtain a thickness value of each layer; acquiring a scale between the size of the ring cross-sectional image and the actual size of the ring cross-sectional image of the ring device, and determining a real thickness value of each layer in the ring device according to the scale and the thickness value of each layer.

2. The method according to claim 1, wherein: When the length of the line segment is greater than or equal to L, the line segment is erased. obtaining ring isolation lines between layers in the ring cross-sectional image according to the remaining unerased line segments.

3. The method of claim 1, wherein, the step of taking the intersection point of each ray and each ring isolation line as a thickness cutoff point, and acquiring a length between adjacent thickness cutoff points on each ray as thickness data of layers between the adjacent thickness cutoff points comprises: reading coordinate data of each thickness cut-off point; determining thickness data of each layer between adjacent thickness cut-off points on each ray according to the coordinate data of each thickness cut-off point.

4. The method of claim 1, wherein, the sum average calculation of N thickness data of each layer to obtain the thickness value of each layer includes: eliminating the maximum value and the minimum value in N thickness data of each layer, and performing the sum average calculation on the remaining thickness data to obtain the thickness value of each layer.

5. A device for measuring the thickness of layers in a ring, characterized in that including: an acquisition module, configured to acquire a ring cross-sectional image of the ring device and a gray value of each pixel point on the ring cross-sectional image; an analog module, configured to select pixel points with a gray value of at least the top ten percent in the ring cross-sectional image as target pixel points; and detect each pixel pair in the ring cross-sectional image, each pixel pair being composed of a first target pixel point and a second target pixel point adjacent to the first target pixel point and having the shortest distance; an image division module, configured to divide the ring cross-sectional image into M sub-image regions according to an equal interval of a length L along a first direction and a second direction, the first direction and the second direction being two perpendicular directions, L being greater than zero, and M being an integer greater than zero; the image division module is further configured to divide the ring cross-sectional image into four quadrants with a center of the ring cross-sectional image as an origin along the first direction and the second direction, wherein a horizontal and vertical coordinate value of a first quadrant is greater than 0, a horizontal coordinate value of a second quadrant is less than 0 and a vertical coordinate value is greater than 0, horizontal and vertical coordinate values of a third quadrant are both less than 0, and a horizontal coordinate value of a fourth quadrant is greater than 0 and a vertical coordinate value is less than 0; the analog module is specifically configured to: acquire a first pixel pair in each quadrant, a horizontal coordinate value of a first target pixel point in the first pixel pair being less than a horizontal coordinate value of a second target pixel point; connect the first target pixel point and the second target pixel point in the first pixel pair of the first quadrant and the third quadrant through a line segment, and erase the line segment between the first target pixel point and the second target pixel point in the first pixel pair when a vertical coordinate value of the first target pixel point is less than a vertical coordinate value of the second target pixel point; connect the first target pixel point and the second target pixel point in the first pixel pair of the second quadrant and the fourth quadrant through a line segment, and erase the line segment between the first target pixel point and the second target pixel point in the first pixel pair when a vertical coordinate value Y1 of the first target pixel point is greater than a vertical coordinate value Y2 of the second target pixel point; and obtain ring isolation lines between each layer in the ring cross-sectional image according to the remaining unerased line segments; the analog module is further configured to simulate N rays from a center of the ring cross-sectional image to a direction of an outermost ring isolation line of the ring cross-sectional image, N being an integer greater than zero; a processing module, configured to acquire thickness data of each layer between adjacent thickness cut-off points on each ray as a cross point of a ray and each ring isolation line. The processing module is further configured to perform a summation average calculation on the N thickness data of each layer to obtain a thickness value of each layer; The processing module is further configured to obtain a scale between a size of the ring cross-section image and an actual size of the ring cross-section of the ring device, and determine a real thickness value of each layer in the ring device according to the scale and the thickness value of each layer.

6. The apparatus of claim 5, wherein, The simulation module is specifically configured to: When the length of the line segment is greater than or equal to L, the line segment is erased. Obtain ring isolation lines between the layers in the ring cross-section image according to the remaining unerased line segments.

7. An electronic device, comprising: Comprise: A processor, and a memory connected to the processor in communication; The memory stores computer-executable instructions; The processor executes the computer-executable instructions stored in the memory to implement the method for measuring the thickness of each layer in the ring device according to any one of claims 1 to 4.

8. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions, and when the instructions are executed, the computer executes the method for measuring the thickness of each layer in the ring device according to any one of claims 1 to 4.

9. A computer program product comprising a computer program, characterized in that, The computer program is executed by the processor to implement the method for measuring the thickness of each layer in the ring device according to any one of claims 1 to 4.

Images