Optical chip lens press film mold and manufacturing method thereof
By designing an optical chip lens lamination mold with a movable core, the problems of low mold utilization and insufficient or excessive adhesive in lenses were solved, enabling the manufacture of lenses of different thicknesses and improving lens yield.
Patent Information
- Application Number
- CN202310393359.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-04-06
- Publication Date
- 2026-02-13
- Estimated Expiration
- 2043-04-06
AI Technical Summary
The fixed shape of existing optical chip lens molds results in low mold utilization, which can easily lead to insufficient or excessive adhesive in the lenses, affecting the lens yield.
Design a molding die including a first mold base, a second mold base, a mold core, and a moving component. The mold core has a cavity with a shape corresponding to the shape of a lens. The mold core is fixedly connected to the moving component, and the moving component moves within a closed space to manufacture lenses of different thicknesses.
This improved mold utilization, prevented lens defects such as insufficient or excessive adhesive, and increased lens yield.
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Figure CN116476296B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of optical lens, in particular to an optical chip lens film pressing mold and a manufacturing method thereof. BACKGROUND
[0002] In the preparation of optical chips, a layer of lens structure is usually molded on the surface of the chip. However, the general film pressing mold is fixed in shape, and a single mold can only produce a lens structure with a single thickness, so the utilization rate of the mold is not high. Moreover, using a fixed mold for molding is prone to lens glue defects or overflow, resulting in a low yield of lenses. SUMMARY
[0003] Therefore, the present application provides an optical chip lens film pressing mold and a manufacturing method thereof. The film pressing mold can produce lens structures with different thicknesses according to production needs, thereby improving the utilization rate of the mold and the yield of the lens.
[0004] In a first aspect, the present application provides an optical chip lens film pressing mold for manufacturing an optical chip lens, comprising a first mold base, a second mold base, a mold core and a moving member. The first mold base, the second mold base and the mold core form a closed space after being combined. The mold core is provided with a cavity, the shape of the cavity is set according to the shape of the optical chip lens, and the position of the cavity is set corresponding to the position of the optical chip lens. The mold core and the moving member are fixedly connected, and the moving member can drive the mold core to move within the closed space.
[0005] Optionally, the moving member comprises a support structure, a spring structure and a buckle structure. The support structure is used to support the mold core, the spring structure is used to drive the mold core to move, and the buckle structure is used to fix the mold core at a target position.
[0006] Optionally, the moving member further comprises a pressure sensor, which is used to detect the pressure of the liquid material in the closed space.
[0007] Optionally, the moving member further comprises a distance sensor, which is used to detect the position of the mold core.
[0008] In a second aspect, the present application provides a manufacturing method of an optical chip lens, which adopts the optical chip lens film pressing mold as described above. The manufacturing method of the optical chip lens comprises the following steps: fixing a chip substrate after die bonding and wire bonding at a corresponding position of the first mold base; injecting a liquid material with a target weight corresponding to a target thickness of the optical chip lens into the cavity of the mold core; combining the first mold base, the second mold base and the mold core to form a closed space; driving the mold core to move by the moving member to press the liquid material; and after the liquid material is fixed and formed, demolding and taking out the chip substrate to obtain the optical chip lens.
[0009] Optionally, the weight of the liquid material is determined by: obtaining a first weight of the liquid material corresponding to a first lens thickness of the sample chip; determining a thickness difference according to the target thickness and the first lens thickness, and determining a weight difference according to the thickness difference; and determining the target weight according to the weight difference and the first weight.
[0010] Optionally, the moving of the mold core by the moving member to press the liquid material includes: simultaneously performing vacuumizing treatment on the sealed space while the moving member moves the mold core; stopping the moving member when the distance sensor of the moving member detects that the mold core reaches a position corresponding to the target thickness of the lens of the optical chip; and waiting for the liquid material to be heated and solidified in the mold cavity.
[0011] Optionally, the moving of the mold core by the moving member to press the liquid material includes:
[0012] Optionally, the moving of the mold core by the moving member to press the liquid material includes: simultaneously performing vacuumizing treatment on the sealed space while the moving member moves the mold core; stopping the moving member when the distance sensor of the moving member detects that the mold core reaches a position corresponding to the target thickness of the lens of the optical chip; and waiting for the liquid material to be heated and solidified in the mold cavity.
[0013] Optionally, after the liquid material is fixed and formed, the chip substrate is demolded and taken out to obtain the optical chip lens, and the method includes: separating the first mold base, the second mold base and the mold core after the liquid material is fixed and formed; demolding the chip substrate, taking out the chip substrate, and cutting to obtain the optical chip lens.
[0014] Optionally, the manufacturing method further includes: spraying a mold release agent on the surface of the mold core before injecting the liquid material; or covering a release film on the surface of the mold core before injecting the liquid material.
[0015] The present application comprises the following beneficial effects: the film pressing mold provided by the present application comprises a first mold base, a second mold base, a mold core and a moving member, wherein the first mold base, the second mold base and the mold core form a closed space after being closed, the mold core is provided with a cavity, the shape of the cavity is arranged according to the shape of the optical chip lens, the position of the cavity is arranged correspondingly to the position of the optical chip lens, the mold core and the moving member are fixedly connected, and the moving member can drive the mold core to move within the closed space. Accordingly, the present application provides a manufacturing method of an optical chip lens, which adopts the optical chip lens film pressing mold as described above, and the manufacturing method of the optical chip lens comprises the following steps: fixing the chip substrate after die bonding and wire bonding at the corresponding position of the first mold base; injecting the liquid material with the target weight corresponding to the target thickness of the optical chip lens into the cavity of the mold core; closing the first mold base, the second mold base and the mold core to form a closed space; driving the mold core to move through the moving member to press the liquid material; and after the liquid material is fixed and formed, the chip substrate is demolded and taken out to obtain the optical chip lens. The film pressing mold and the manufacturing method can produce lens structures with different thicknesses according to production requirements, improve the utilization rate of the mold, prevent the liquid material from overflowing or being insufficient, and improve the yield of the lens. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 is the preparation process of the optical chip lens in the related art;
[0017] Figure 2 is a structure and working principle schematic diagram of the optical chip lens in the related art;
[0018] Figure 3 is a structure schematic diagram of different chip thicknesses of the optical chip lens in the related art;
[0019] Figure 4 is a defect structure schematic diagram in the process of preparing the optical chip lens in the related art;
[0020] Figure 5 is a structure schematic diagram of an optical lens film pressing mold provided by the embodiment of the present application;
[0021] Figure 6 is a flow schematic diagram of a manufacturing method of an optical chip lens provided by the embodiment of the present application;
[0022] Figure 7 is a structure schematic diagram of an optical chip lens with different thicknesses provided by the embodiment of the present application;
[0023] Figure 8 is a flow schematic diagram of a manufacturing method of an optical chip lens with different thicknesses provided by the embodiment of the present application;
[0024] Figure 9 is a flowchart of a process for pressing a flow material according to an embodiment of the present application;
[0025] Figure 10 is a flowchart of a process for spraying a mold release agent on the surface of a mold core according to an embodiment of the present application;
[0026] Figure 11 is a flowchart of a process for covering a layer of release film on the surface of a mold core according to an embodiment of the present application.
[0027] Legend: 101, chip substrate; 102, chip; 103, bonding wire; 104, lens structure; 601, first mold seat; 602, second mold seat; 603, mold core; 604, moving member. DETAILED DESCRIPTION
[0028] The present application will be further described below in conjunction with the accompanying drawings and specific embodiments. For the step numbers in the following embodiments, they are only set for the purpose of facilitating the description and explanation, and the order between the steps is not limited in any way, and the execution order of each step in the embodiments can be adaptively adjusted according to the understanding of those skilled in the art.
[0029] In the following description, "some embodiments" are described, which describe a subset of all possible embodiments, but it can be understood that "some embodiments" can be the same subset or different subsets of all possible embodiments, and can be combined with each other without conflict.
[0030] In the following description, the terms "first, second, third" are only to distinguish similar objects, and do not represent a specific order of the objects. It can be understood that "first, second, third" can be interchanged in a specific order or sequence as allowed, so that the embodiments of the application described herein can be implemented in an order other than that illustrated or described herein.
[0031] Unless otherwise defined, all technical and scientific terms used in the embodiments of the present application have the same meanings as those commonly understood by those skilled in the art to which the present application belongs. The terms used in the embodiments of the present application are only for the purpose of describing the embodiments of the present application, and are not intended to limit the present application.
[0032] As shown in Figure 1 The preparation process of the optical chip lens includes: first providing a chip substrate 101, then mounting a chip 102 on the surface of the substrate 101, then realizing the electrical connection between the chip 102 and the chip substrate 101 through the bonding wire 103, and then preparing an optical lens on the surface of the chip 102. Specifically, the optical chip includes a photosensitive chip and a light-emitting chip, etc.
[0033] The purpose of the lens structure of the molded lens is to make the optical chip play its best effect; for example Figure 2 As shown in (a), for the light-sensing chip, the lens structure makes the external light signal focused as much as possible on the light-sensing area of the light-sensing chip after passing through the lens structure, so as to achieve the best light-receiving effect, and the light-sensing area is the best chip plane corresponding to the position of the dashed line shown in (a); for example Figure 2 As shown in (b), for the light-emitting chip, the lens structure makes the light emitted by the light-emitting area more concentratedly emitted to the outside after passing through the lens structure, so as to achieve the best light-emitting effect, and the light-emitting area is the best chip plane corresponding to the position of the dashed line shown in (b). Figure 2 Figure 2 As shown in (b), for the light-emitting chip, the lens structure makes the light emitted by the light-emitting area more concentratedly emitted to the outside after passing through the lens structure, so as to achieve the best light-emitting effect, and the light-emitting area is the best chip plane corresponding to the position of the dashed line shown in (b).
[0034] As shown in (b), for the light-emitting chip, the lens structure makes the light emitted by the light-emitting area more concentratedly emitted to the outside after passing through the lens structure, so as to achieve the best light-emitting effect, and the light-emitting area is the best chip plane corresponding to the position of the dashed line shown in (b). Figure 3 As shown in (b), for the light-emitting chip, the lens structure makes the light emitted by the light-emitting area more concentratedly emitted to the outside after passing through the lens structure, so as to achieve the best light-emitting effect, and the light-emitting area is the best chip plane corresponding to the position of the dashed line shown in (b).
[0035] As shown in (b), for the light-emitting chip, the lens structure makes the light emitted by the light-emitting area more concentratedly emitted to the outside after passing through the lens structure, so as to achieve the best light-emitting effect, and the light-emitting area is the best chip plane corresponding to the position of the dashed line shown in (b). Figure 4 As shown in (b), for the light-emitting chip, the lens structure makes the light emitted by the light-emitting area more concentratedly emitted to the outside after passing through the lens structure, so as to achieve the best light-emitting effect, and the light-emitting area is the best chip plane corresponding to the position of the dashed line shown in (b). Figure 4 (a) overflow or Figure 4 (b) lack of glue.
[0036] As shown in (b), for the light-emitting chip, the lens structure makes the light emitted by the light-emitting area more concentratedly emitted to the outside after passing through the lens structure, so as to achieve the best light-emitting effect, and the light-emitting area is the best chip plane corresponding to the position of the dashed line shown in (b). Figure 5 As shown in (b), for the light-emitting chip, the lens structure makes the light emitted by the light-emitting area more concentratedly emitted to the outside after passing through the lens structure, so as to achieve the best light-emitting effect, and the light-emitting area is the best chip plane corresponding to the position of the dashed line shown in (b).
[0037] Specifically, the first mold seat is used for fixing the chip substrate, and the first mold seat is a rectangular flat plate; the second mold seat is used for abutting with the first mold seat and the mold core to form a closed space, and the shape of the second mold seat is determined according to actual application, for example, the second mold seat is a circular pipe or a rectangular pipe; the cross section of the mold core corresponds to the cross section of the second mold seat. The shape of the cavity is adapted to the shape of the lens; for example, if the lens is a convex lens, the shape of the cavity is a concave cavity correspondingly; if the lens is a concave lens, the shape of the cavity is a convex shape correspondingly.
[0038] Optionally, the moving member 604 comprises a supporting structure for supporting the mold core 603, a spring structure for driving the mold core 603 to move, and a buckle structure for fixing the mold core 603 at a target position.
[0039] Specifically, the supporting structure can be a regular symmetrical shape, fixedly connected to the bottom surface of the mold core and located at the center of the bottom surface of the mold core, so that the mold core is not inclined when being pressed.
[0040] Optionally, the moving member 604 further comprises a pressure sensor for detecting the pressure of the liquid material in the sealed space.
[0041] Specifically, the pressure sensor can be a piezoelectric sensor, which detects the pressure of the liquid material in the sealed space at certain time intervals or in real time during the pressing process.
[0042] Optionally, the moving member 604 further comprises a distance sensor for detecting the position of the mold core 603.
[0043] Specifically, the distance sensor can be a laser distance sensor, which controls the mold core to stop moving when the position of the mold core is detected to reach a set position, and the set position corresponds to the position of the target thickness of the lens structure.
[0044] As shown in Figure 6 , the embodiment of the present application provides a manufacturing method of an optical chip lens, which adopts the optical chip lens film pressing mold as shown in Figure 5 , and the manufacturing method of the optical chip lens comprises the following steps:
[0045] Step S1: fixing the chip substrate after die bonding and wire bonding at a corresponding position of the first mold base 601;
[0046] Step S2: injecting a liquid material with a target weight corresponding to the target thickness of the optical chip lens into the cavity of the mold core 603;
[0047] Step S3: combining the first mold base 601, the second mold base 602 and the mold core 603 to form a sealed space;
[0048] Step S4: driving the mold core 603 to move by the moving member 604 to press the liquid material;
[0049] Step S5: after the liquid material is fixed and formed, the chip substrate is demolded and taken out to obtain the optical chip lens.
[0050] Specifically, the chip substrate in step S1 can also be a device such as a chip holder for placing the chip; and the chip substrate can be fixed on the corresponding position of the first mold base 601 by means of vacuum adsorption.
[0051] Specifically, the liquid material in step S2 is a mold glue such as silica gel or fluorescent glue.
[0052] Specifically, the injection of the liquid material in step S2 can be performed by an automatic injection such as a mechanical arm injection or a manual injection.
[0053] Optionally, the weight of the liquid material is determined by the following method: obtaining a first weight of the liquid material corresponding to a first lens thickness of the sample chip; determining a thickness difference according to the target thickness and the first lens thickness, and determining a weight difference according to the thickness difference; and determining the target weight according to the weight difference and the first weight.
[0054] Specifically, as shown in Figure 7 , let the first lens thickness of the sample chip be h0, the first weight of the liquid material corresponding to h0 be M0, the target thickness be h, the weight of the liquid material corresponding to h be M, the cross-sectional area of the chip at the dashed line be S, and the density of the liquid material be p. The weight difference is determined according to the thickness difference by the following formula:
[0055] M-M0= p*S*(h-h0)
[0056] The functional expression of the target thickness h and the weight M of the corresponding liquid material is:
[0057] h= [(M-M0) / (p*S)]+h0
[0058] Specifically, in actual production, due to various differences, the positions of the optical surfaces of different batches of optical chips are different, and the lens structure needs to be adjusted according to the position of the light-emitting plane or the light-receiving plane of the optical chip, and the weight of the required liquid material also needs to be changed accordingly; as shown in Figure 8 , the light-emitting plane or the light-receiving plane is adjusted to be lower, and the weight of the liquid material needs to be reduced accordingly, so that the thickness of the molded lens structure is smaller; and the light-emitting plane or the light-receiving plane is adjusted to be higher, and the weight of the liquid material needs to be increased accordingly, so that the thickness of the molded lens structure is larger.
[0059] Optionally, as shown in Figure 9 , the step S4 specifically includes the following steps:
[0060] Step S411: performing vacuumizing treatment on the sealed space while the moving member 604 drives the mold core 603 to move;
[0061] Step S412: When the distance sensor of the moving member 604 detects that the mold core 603 reaches the position corresponding to the target thickness of the lens of the optical chip, the moving member 604 is controlled to stop moving.
[0062] Step S413: The liquid material is heated in the mold cavity and solidified to form a shape.
[0063] Optionally, as shown in Figure 9 Step S4 specifically includes the following steps:
[0064] Step S421: The sealed space is vacuumized while the moving member 604 moves the mold core 603.
[0065] Step S422: When the pressure sensor of the moving member 604 detects that the liquid material reaches a preset pressure value, the moving member 604 is controlled to stop moving.
[0066] Step S423: The liquid material is heated in the mold cavity and solidified to form a shape.
[0067] Specifically, in steps S411 and S421, the method of vacuumizing is to pre-arrange one or more small holes on the second mold base 602 of the compression molding mold close to the chip substrate, the small holes are connected to a vacuumizing device, and when the first mold base 601, the second mold base 602 and the mold core 603 form a sealed space, the compression molding mold starts to be compressed, and the sealed space is vacuumized.
[0068] Optionally, Step S5 specifically includes: after the liquid material is solidified and formed, the first mold base 601, the second mold base 602 and the mold core 603 are separated; the chip substrate is demolded, the chip substrate is taken out, and the chip substrate is cut to obtain the optical chip lens.
[0069] Optionally, the manufacturing method further includes: before the liquid material is injected, a release agent is sprayed on the surface of the mold core; or, before the liquid material is injected, a release film is covered on the surface of the mold core.
[0070] Specifically, Step S5 specifically includes: there are two methods for demolding:
[0071] Method 1: as shown in Figure 10 Before the liquid material is injected, a release agent is sprayed on the surface of the mold core 603, so that the mold core 603 and the chip substrate are separated after the liquid material is solidified and formed, and the demolding is completed.
[0072] Method 2: as shown in Figure 11As shown, before the liquid material is injected, a release film is covered on the surface of the mold core 603, and the release film is tightly attached to the surface of the mold core 603 by vacuum adsorption. After the liquid material is solidified and formed, the mold core 603 is separated from the chip substrate, the release film on the surface of the optical chip lens is torn off, and the demolding is completed.
[0073] The implementation of the embodiment of the present application includes the following beneficial effects: The compression mold provided by the present application includes a first mold base, a second mold base, a mold core, and a moving member, wherein the first mold base, the second mold base, and the mold core form a closed space after being closed, the mold core is provided with a cavity, the shape of the cavity is set according to the shape of the optical chip lens, the position of the cavity is set in correspondence with the position of the optical chip lens, the mold core and the moving member are fixedly connected, and the moving member can drive the mold core to move within the closed space. Accordingly, the present application provides a manufacturing method of an optical chip lens, which adopts the optical chip lens compression mold as described above, and includes the following steps: fixing a chip substrate after die bonding and wire bonding at a corresponding position of the first mold base; injecting a liquid material with a target weight corresponding to a target thickness of the optical chip lens into the cavity of the mold core; closing the first mold base, the second mold base, and the mold core to form a closed space; driving the mold core to move by the moving member to compress the liquid material; and demolding to take out the chip substrate after the liquid material is fixed and formed, to obtain the optical chip lens. The compression mold and the manufacturing method can produce lens structures with different thicknesses according to production requirements, improve the utilization rate of the mold, prevent the liquid material from overflowing or being insufficient, and improve the yield of the lens.
[0074] It can be seen that the contents of the above method embodiments are applicable to the device embodiments, the device embodiments specifically implement the same functions as the above method embodiments, and achieve the same beneficial effects as the above method embodiments.
[0075] The above is a specific description of the preferred embodiments of the present application, but the present application is not limited to the above embodiments. Those skilled in the art can make various equivalent modifications or replacements without departing from the spirit of the present application, and these equivalent modifications or replacements are all included in the scope defined by the claims of the present application.
Claims
1. An optical chip lens lamination mold, used for manufacturing optical chip lenses, characterized in that, The device includes a first mold base, a second mold base, a mold core, and a moving component. The first mold base, the second mold base, and the mold core, when closed, form a sealed space. The mold core has a cavity, the shape of which is determined according to the shape of the optical chip lens, and the position of the cavity corresponds to the position of the optical chip lens. The mold core and the moving component are fixedly connected, and the moving component can move the mold core within the sealed space. A fluid material corresponding to the optical chip lens is injected into the cavity of the mold core. The weight of the fluid material is determined according to the thickness of the optical chip lens.
2. The optical chip lens lamination mold according to claim 1, characterized in that, The movable component includes a support structure, a spring structure, and a snap-fit structure. The support structure supports the mold core, the spring structure drives the mold core to move, and the snap-fit structure fixes the mold core at the target position.
3. The optical chip lens lamination mold according to claim 2, characterized in that, The moving component also includes a pressure sensor for detecting the pressure of the fluid material within the confined space.
4. The optical chip lens lamination mold according to claim 2, characterized in that, The moving component also includes a distance sensor, which is used to detect the location of the mold core.
5. A method for manufacturing an optical chip lens, characterized in that, The optical chip lens lamination mold according to claim 1 comprises: The die-bonded and wire-bonded chip substrate is fixed at the corresponding position in the first mold base; A fluid material of target weight corresponding to the target thickness of the optical chip lens is injected into the cavity of the mold core; The first mold base, the second mold base, and the mold core are joined together to form a sealed space; The fluid material is pressed by moving the mold core through the moving components. After the fluid material is solidified, the chip substrate is demolded and removed to obtain the optical chip lens.
6. The method for manufacturing an optical chip lens according to claim 5, characterized in that, The weight of the fluid material is determined in the following manner: Obtain the first weight of the fluid material corresponding to the first lens thickness of the sample chip; The thickness difference is determined based on the target thickness and the thickness of the first lens, and the weight difference is determined based on the thickness difference. The target weight is determined based on the weight difference and the first weight.
7. The method for manufacturing an optical chip lens according to claim 5, characterized in that, The method of pressing the fluid material by moving the mold core through a moving component specifically includes: While the moving component drives the mold core to move, a vacuum process is performed on the sealed space. When the distance sensor of the moving component detects that the mold core has reached the position corresponding to the target thickness of the optical chip lens, the moving component is controlled to stop moving. The liquid material is heated in the mold cavity and solidifies to form a shape.
8. The method for manufacturing an optical chip lens according to claim 5, characterized in that, The method of pressing the fluid material by moving the mold core through a moving component specifically includes: While the moving component drives the mold core to move, a vacuum process is performed on the sealed space. When the pressure sensor of the moving component detects that the fluid material has reached a preset pressure value, the moving component is controlled to stop moving. The liquid material is heated in the mold cavity and solidifies to form a shape.
9. The method for manufacturing an optical chip lens according to claim 5, characterized in that, After the fluid material is fixed and shaped, the chip substrate is demolded and removed to obtain the optical chip lens, specifically including: After the fluid material is fixed and formed, the first mold base, the second mold base and the mold core are separated; The chip substrate is demolded, removed, and cut to obtain an optical chip lens.
10. The method for manufacturing an optical chip lens according to claim 5, characterized in that, The manufacturing method further includes: Before injecting the liquid material, spray release agent onto the mold core surface; Alternatively, a release film can be applied to the surface of the mold core before injecting the fluid material.
Citation Information
Patent Citations
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