Epoxy plastic packaging material, its preparation method and application

Abstract

The present application relates to the technical field of epoxy plastic packaging materials, and particularly relates to an epoxy plastic packaging material and a preparation method and application thereof. The epoxy plastic packaging material is prepared from raw materials containing epoxy resin, a curing agent, solid fillers, an ion capture agent, a low stress modifier, a coupling agent, a curing accelerator, a release agent, a flame retardant and a colorant. The curing accelerator contains a compound with a structure shown in formula (1), and the content of the compound with the structure shown in formula (1) is 40-100 wt% based on 100 wt% of the total weight of the curing accelerator. The curing agent is a mixture of linear phenolic resin and XYLOK phenolic resin, and the content of the linear phenolic resin is 20-90 wt% based on 100 wt% of the total weight of the curing agent. The epoxy plastic packaging material prepared by the present application can significantly reduce the normal temperature and high temperature storage modulus of the epoxy plastic packaging material under the premise of having higher Tg and lower water absorption.

Description

Technical Field

[0001] This invention relates to the field of epoxy molding compound technology, specifically to an epoxy molding compound, its preparation method, and its application. Background Technology

[0002] With the rapid development of 5G technology, the application scenarios and environments of electronic products are becoming more diversified, and the performance requirements for semiconductor packaging materials are also becoming increasingly stringent. In addition to possessing certain mechanical properties to prevent damage to semiconductor chips from the external environment, molding compounds also need to have low-stress characteristics to ensure that the semiconductor device does not crack during high-temperature soldering processes. Traditional techniques involve adding incompatible silicone oils or silicone resins to the epoxy molding compound raw material system as stress modifiers to reduce the flexural modulus of the molding compound, thereby reducing stress. However, this method often introduces other problems into the prepared epoxy molding compound, such as high water absorption and low triglyceride (TG). Summary of the Invention

[0003] The purpose of this invention is to address the shortcomings of existing technologies by providing an epoxy molding compound, its preparation method, and its applications. The raw material composition of this epoxy molding compound contains specific types and proportions of curing accelerators and curing agents. By controlling the amounts of each raw material component, the prepared epoxy molding compound achieves a high Tg and low water absorption rate, while also significantly reducing the storage modulus at both room temperature and high temperature.

[0004] To achieve the above objectives, the first aspect of the present invention provides an epoxy molding compound, which, based on the total weight of the raw material composition of 100% by weight, is made from a raw material composition containing 2-11% by weight of epoxy resin, 1-6% by weight of curing agent, 80-90% by weight of solid filler, 0.1-1% by weight of ion trap, 0.1-1% by weight of low-stress modifier, 0.1-1% by weight of coupling agent, 0.1-1% by weight of curing accelerator, 0.1-1% by weight of release agent, 1-10% by weight of flame retardant and 0.1-1% by weight of colorant;

[0005] The curing accelerator contains a compound with the structure shown in formula (1), and the content of the compound with the structure shown in formula (1) is 40-100% by weight, based on the total weight of the curing accelerator being 100% by weight.

[0006] The curing agent is a mixture of linear phenolic resin and XYLOK phenolic resin, and the content of the linear phenolic resin is 20-90% by weight, based on 100% by weight of the total weight of the curing agent.

[0007]

[0008] Preferably, the curing accelerator further contains triphenylphosphine and / or 2-undecylimidazole.

[0009] Preferably, the content of the compound with the structure shown in formula (1) is 65-100% by weight, and the content of triphenylphosphine and / or 2-undecylimidazole is 0-35% by weight, based on 100% by weight of the total weight of the curing accelerator.

[0010] Preferably, based on 100% by weight of the total weight of the curing agent, the content of the linear phenolic resin is 30-85% by weight, and the content of the XYLOK phenolic resin is 15-70% by weight. More preferably, based on 100% by weight of the total weight of the curing agent, the content of the linear phenolic resin is 55-82% by weight, and the content of the XYLOK phenolic resin is 18-45% by weight.

[0011] Preferably, based on the total weight of the raw material composition (100% by weight), the content of epoxy resin is 3-11% by weight, the content of curing agent is 2-5% by weight, the content of solid filler is 80-88% by weight, the content of ion scavenger is 0.1-0.8% by weight, the content of low-stress modifier is 0.1-0.8% by weight, the content of coupling agent is 0.1-0.8% by weight, the content of curing accelerator is 0.2-1% by weight, the content of release agent is 0.2-0.8% by weight, the content of flame retardant is 1-9% by weight, and the content of colorant is 0.1-0.8% by weight.

[0012] More preferably, based on the total weight of the raw material composition (100% by weight), the content of epoxy resin is 4-10% by weight, the content of curing agent is 3-5% by weight, the content of solid filler is 80-87% by weight, the content of ion scavenger is 0.1-0.7% by weight, the content of low-stress modifier is 0.2-0.8% by weight, the content of coupling agent is 0.2-0.8% by weight, the content of curing accelerator is 0.2-0.9% by weight, the content of release agent is 0.3-0.8% by weight, the content of flame retardant is 2-9% by weight, and the content of colorant is 0.1-0.7% by weight.

[0013] Preferably, the epoxy resin is selected from one or more of o-cresaldehyde epoxy resin, dicyclopentadiene epoxy resin, biphenyl epoxy resin, and aliphatic epoxy resin. More preferably, the epoxy resin is o-cresaldehyde epoxy resin and / or dicyclopentadiene epoxy resin.

[0014] Preferably, the solid filler is crystalline silica and / or molten silica.

[0015] Preferably, the low-stress modifier is selected from one or more of organosilicon-modified epoxy resin, silicone resin, and triblock copolymer containing organosilicon components, and more preferably organosilicon-modified epoxy resin.

[0016] Preferably, the coupling agent is one or more of γ-glycidoxypropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane, and γ-aminopropyltrimethoxysilane, more preferably γ-mercaptopropyltrimethoxysilane.

[0017] Preferably, the release agent is selected from one or more of carnauba wax, polyethylene wax, oxidized polyethylene wax, Fischer-Tropsch wax, and polypropylene wax. More preferably, the release agent is oxidized polyethylene wax.

[0018] Preferably, the ion scavenger is selected from one or more of anion scavengers, cation scavengers, anion-cation composite ion scavengers, and hydrotalcite compounds.

[0019] Preferably, the flame retardant is selected from one or more of halogenated flame retardants, non-halogenated flame retardants, phosphorus-based flame retardants, nitrogen-based flame retardants, phosphorus-halogenated flame retardants, phosphorus-nitrogen flame retardants, and hydroxide flame retardants.

[0020] A second aspect of the present invention provides a method for preparing the epoxy molding compound described above, the method comprising the following steps:

[0021] (1) Stir and mix the raw material composition of epoxy molding compound, and then melt and knead the mixed material at a temperature of 70-100℃ for 5-20 minutes;

[0022] (2) Cool and crush the molten compound obtained in step (1) and preform it to obtain epoxy molding compound.

[0023] A third aspect of the present invention provides an application of the epoxy molding compound described above as a semiconductor chip packaging material.

[0024] Through the above technical solution, the present invention has at least the following beneficial effects:

[0025] (1) In this invention, the compound with the structure shown in formula (1) is a highly efficient latent accelerator. Compared with traditional triphenylphosphine and imidazole accelerators, the resonance structure of benzoquinone in its structure increases the stability of the complex and reduces its alkalinity, thus exhibiting better latency. This ensures that the epoxy molding compound still has high reactivity at the process temperature (175±5℃) during transfer molding, and the crosslinking between resins is more compact, resulting in improved reliability.

[0026] (2) In this invention, by adding specific types and proportions of curing accelerators and curing agents to the raw material composition for preparing epoxy molding compound, and by controlling the amount of each raw material component, the epoxy molding compound prepared can have a high Tg and a low water absorption rate, and can also significantly reduce the room temperature and high temperature storage modulus of epoxy molding compound.

[0027] (3) In this invention, when the epoxy molding compound is used as a semiconductor packaging material, it can significantly improve the stable continuous molding properties of the epoxy molding compound during the packaging process, reduce the probability of defects, and significantly improve the reliability of the packaged semiconductor. Detailed Implementation

[0028] The following provides a detailed description of specific embodiments of the present invention. It should be understood that the specific embodiments described herein are for illustrative and explanatory purposes only and are not intended to limit the scope of the invention.

[0029] The endpoints and any values ​​of the ranges disclosed herein are not limited to the precise ranges or values, and these ranges or values ​​should be understood to include values ​​close to these ranges or values. For numerical ranges, the endpoint values ​​of the various ranges, the endpoint values ​​of the various ranges and individual point values, and individual point values ​​can be combined with each other to obtain one or more new numerical ranges, which should be considered as specifically disclosed herein.

[0030] In this invention, the raw material composition of the epoxy molding compound contains specific types and proportions of curing accelerators and curing agents. By controlling the amount of each raw material component, the prepared epoxy molding compound can not only have a high Tg and low water absorption rate, but also significantly reduce the room temperature and high temperature storage modulus of the epoxy molding compound.

[0031] The first aspect of the present invention provides an epoxy molding compound, which, based on the total weight of the raw material composition of 100% by weight, is made from a raw material composition containing 2-11% by weight of epoxy resin, 1-6% by weight of curing agent, 80-90% by weight of solid filler, 0.1-1% by weight of ion trapping agent, 0.1-1% by weight of low-stress modifier, 0.1-1% by weight of coupling agent, 0.1-1% by weight of curing accelerator, 0.1-1% by weight of release agent, 1-10% by weight of flame retardant and 0.1-1% by weight of colorant;

[0032] The curing accelerator contains a compound with the structure shown in formula (1), and the content of the compound with the structure shown in formula (1) is 40-100% by weight, based on the total weight of the curing accelerator being 100% by weight.

[0033] The curing agent is a mixture of linear phenolic resin and XYLOK phenolic resin, and the content of the linear phenolic resin is 20-90% by weight, based on 100% by weight of the total weight of the curing agent.

[0034]

[0035] In a preferred embodiment of the present invention, the curing accelerator further contains triphenylphosphine and / or 2-undecylimidazole.

[0036] In the present invention, in a preferred embodiment, the content of the compound with the structure shown in formula (1) is 65-100% by weight, for example, 65%, 85%, or 100% by weight, based on 100% by weight of the total weight of the curing accelerator, and the content of triphenylphosphine and / or 2-undecylimidazole is 0-35% by weight, for example, 0%, 15%, or 35% by weight.

[0037] In this invention, in a preferred embodiment, the content of the linear phenolic resin is 30-85% by weight and the content of the XYLOK phenolic resin is 15-70% by weight, based on 100% by weight of the total weight of the curing agent.

[0038] In a more preferred embodiment of the present invention, the content of the linear phenolic resin is 55-82% by weight, for example, 55% by weight, 60% by weight, 66.4% by weight, 75% by weight, 77% by weight, 78.3% by weight, or 82% by weight, based on 100% by weight of the total weight of the curing agent; and the content of the XYLOK phenolic resin is 18-45% by weight, for example, 18% by weight, 20% by weight, 21.7% by weight, 23% by weight, 25% by weight, 33.6% by weight, 40% by weight, or 45% by weight.

[0039] In this invention, in a preferred embodiment, based on the total weight of the raw material composition (100% by weight), the content of epoxy resin is 3-11% by weight, the content of curing agent is 2-5% by weight, the content of solid filler is 80-88% by weight, the content of ion scavenger is 0.1-0.8% by weight, the content of low-stress modifier is 0.1-0.8% by weight, the content of coupling agent is 0.1-0.8% by weight, the content of curing accelerator is 0.2-1% by weight, the content of release agent is 0.2-0.8% by weight, the content of flame retardant is 1-9% by weight, and the content of colorant is 0.1-0.8% by weight.

[0040] In a more preferred embodiment of the present invention, based on the total weight of the raw material composition (100% by weight), the content of epoxy resin is 4-10% by weight, the content of curing agent is 3-5% by weight, the content of solid filler is 80-87% by weight, the content of ion scavenger is 0.1-0.7% by weight, the content of low-stress modifier is 0.2-0.8% by weight, the content of coupling agent is 0.2-0.8% by weight, the content of curing accelerator is 0.2-0.9% by weight, the content of release agent is 0.3-0.8% by weight, the content of flame retardant is 2-9% by weight, and the content of colorant is 0.1-0.7% by weight.

[0041] In this invention, in specific embodiments, the epoxy resin is selected from one or more of o-cresphenolic epoxy resin, dicyclopentadiene epoxy resin, biphenyl epoxy resin, and aliphatic epoxy resin. In a preferred embodiment, the epoxy resin is o-cresphenolic epoxy resin and / or dicyclopentadiene epoxy resin.

[0042] In this invention, in a specific embodiment, the solid filler is crystalline silicon dioxide and / or molten silicon dioxide.

[0043] In this invention, in specific embodiments, the low-stress modifier is selected from one or more of silicone-modified epoxy resin, silicone resin, and triblock copolymers containing silicone components. In a preferred embodiment, the low-stress modifier is silicone-modified epoxy resin.

[0044] In this invention, in specific embodiments, the coupling agent is one or more selected from γ-glycidoxypropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane, and γ-aminopropyltrimethoxysilane. In a preferred embodiment, the coupling agent is γ-mercaptopropyltrimethoxysilane.

[0045] In this invention, in specific embodiments, the release agent is selected from one or more of carnauba wax, polyethylene wax, oxidized polyethylene wax, Fischer-Tropsch wax, and polypropylene wax. In a preferred embodiment, the release agent is oxidized polyethylene wax.

[0046] In this invention, in specific embodiments, the ion scavenger is selected from one or more of anion scavengers, cation scavengers, anion-cation composite ion scavengers, and hydrotalcite compounds.

[0047] In this invention, in specific embodiments, the flame retardant is selected from one or more of halogenated flame retardants, non-halogenated flame retardants, phosphorus-based flame retardants, nitrogen-based flame retardants, phosphorus-halogenated flame retardants, phosphorus-nitrogen flame retardants, and hydroxide flame retardants.

[0048] A second aspect of the present invention provides a method for preparing the epoxy molding compound described above, the method comprising the following steps:

[0049] (1) Stir and mix the raw material composition of epoxy molding compound, and then melt and knead the mixed material at a temperature of 70-100℃ for 5-20 minutes;

[0050] (2) Cool and crush the molten compound obtained in step (1) and preform it to obtain epoxy molding compound.

[0051] In the method of the present invention, in a preferred embodiment, in step (1), the temperature is 80-90°C and the melting and mixing time is 10-15 min.

[0052] A third aspect of the present invention provides an application of the epoxy molding compound described above as a semiconductor chip packaging material.

[0053] The present invention will be described in detail below through embodiments, but the scope of protection of the present invention is not limited thereto.

[0054] Unless otherwise specified, all reagents used in the embodiments and comparative examples of this invention are commercially available products.

[0055] Compounds with the structure shown in formula (1): Manufacturer: Nanjing Lanbian Biochemical Technology Co., Ltd., Brand: TB;

[0056] Linear phenolic resin: Manufacturer: Jinan Shengquan, Grade: SQCN701-4, Epoxy equivalent (g / eq): 196-206;

[0057] New phenolic resin (XYLOK): Manufacturer: Jinan Shengquan, Brand: SH-4064.

[0058] The raw material components of Examples 1-7 and Comparative Examples 1-7 were proportioned according to Tables 1 and 2, respectively, and were carried out according to the following methods:

[0059] (1) Weigh each raw material component, then stir and mix each raw material composition, and melt and mix the mixed material on a two-roller mixer at a temperature of 85℃ for 15 minutes.

[0060] (2) Cool and crush the molten compound obtained in step (1) and preform it into cake to obtain epoxy molding compound.

[0061] Table 1 Raw material ratios for Examples 1-7

[0062]

[0063]

[0064] Table 2 Raw material ratios for Comparative Examples 1-7

[0065]

[0066]

[0067] Test case

[0068] (1) Gelation time: Heat the electric heating plate to 175±1℃, take 2-3g of sample and place it on the iron plate, stir continuously with a small needle, and test the time when the sample changes from fluid to gel.

[0069] (2) Spiral flow length: A 30g sample was taken and measured using a resin transfer injection molding machine with a spiral flow metal mold. The injection pressure was 70 kgf / cm². 2 The mold temperature was 175±1℃, and the spiral flow length was recorded. A longer spiral flow length indicates better material flowability.

[0070] (3) Water absorption rate: The water absorption rate test is conducted according to the “PCT24H” method, where the sample size is 50mm*3mm (diameter*thickness), and the test conditions are 121℃, 100RH%, 2atm, 24h; the water absorption rate is calculated as follows: the weight increase of the sample after PCT24H / the initial weight of the sample * 100%.

[0071] (4) Opening flexural strength and opening flexural modulus: 110g of powdered epoxy resin composition was added to an injection molding machine. Under the conditions of injection pressure of 60 bar and injection time of 15s, the material was injected into a specially made flexural strength test mold at 175℃ to form a sample block with specifications of 15.41*10.78*120mm. After curing for 120s, the resin product hardened and was formed. Within 15s, the thermosetting sample was quickly taken out and placed in the test area of ​​a universal testing machine, and the pressure test was started. The opening flexural strength affects the operability of epoxy molding compound. The greater the opening flexural strength, the higher the degree of curing of epoxy molding compound and the better the operability.

[0072] (5) Glass transition temperature (Tg) and coefficient of linear expansion: The Tg and coefficient of linear expansion of the epoxy molding compound in this invention can be determined by thermomechanical analysis (TMA). The epoxy molding compound powder is first cured at a mold temperature of 180℃ for 150 seconds in a molding machine to form sample strips / sheets, and then placed in an oven at 180℃ for post-curing for 6 hours. The sample size for TMA testing is 5mm*5mm (diameter*thickness). The higher the glass transition temperature, the better the thermal stability of the epoxy molding compound.

[0073] (6) Storage Modulus: The storage modulus of the epoxy molding compound in this invention is determined by DMA. First, the epoxy molding compound powder is cured at a mold temperature of 180℃ for 150 seconds in a molding machine to form a sample / sheet, which is then placed in an oven at 180℃ for post-curing for 6 hours. The sample size for DMA testing is 60mm*13mm*3.2mm (length*width*thickness). The smaller the storage modulus, the lower the internal stress of the epoxy molding compound and the better the thermal stability of the material.

[0074] The flowability, water absorption, mold opening flexural strength, mold opening flexural modulus, glass transition temperature, coefficient of linear expansion and storage modulus of the epoxy molding compounds prepared in Examples 1-7 and Comparative Examples 1-7 were tested, and the results are shown in Table 3.

[0075] Table 3

[0076]

[0077]

[0078] As can be seen from the test results of Examples 1-7 and Comparative Examples 1-7, the epoxy resin composition of the present invention has good mechanical properties, a high glass transition temperature (Tg), and good fluidity. While maintaining a low water absorption rate, it also has a low storage modulus at both room temperature and high temperature. This can meet the stability requirements of semiconductor devices in the packaging process, reduce the probability of defects in the process, improve the efficiency of the packaging process, and the higher glass transition temperature (Tg) can improve the reliability of traditional packaging materials during use.

[0079] The above are merely embodiments of the present invention and do not limit the scope of the patent. Any equivalent modifications made based on the content of this specification, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of the present invention.

Claims

1. An epoxy encapsulant, characterized by, The epoxy encapsulating material is made of a raw material composition of 2-11 wt% of an epoxy resin, 1-6 wt% of a curing agent, 80-90 wt% of a solid filler, 0.1-1 wt% of an ion trapping agent, 0.1-1 wt% of a low stress modifier, 0.1-1 wt% of a coupling agent, 0.1-1 wt% of a curing accelerator, 0.1-1 wt% of a mold release agent, 1-10 wt% of a flame retardant, and 0.1-1 wt% of a colorant, based on the total weight of the raw material composition being 100 wt%; The curing accelerator contains a compound having a structure represented by Formula (1); The curing accelerator further contains triphenylphosphine and / or 2-undecylimidazole; The content of the compound having a structure represented by Formula (1) is 65-100 wt%, and the content of triphenylphosphine and / or 2-undecylimidazole is 0-35 wt%, based on the total weight of the curing accelerator being 100 wt%; The curing agent is a mixture of a linear phenol formaldehyde resin and a XYLOK phenol formaldehyde resin, the content of the linear phenol formaldehyde resin is 30-85 wt%, and the content of the XYLOK phenol formaldehyde resin is 15-70 wt%, based on the total weight of the curing agent being 100 wt%; Formula (1).

2. The epoxy encapsulating material according to claim 1, wherein The content of the linear phenol formaldehyde resin is 55-82 wt%, and the content of the XYLOK phenol formaldehyde resin is 18-45 wt%, based on the total weight of the curing agent being 100 wt%.

3. The epoxy encapsulating material of claim 1, wherein the epoxy encapsulating material is a liquid at room temperature. The content of the epoxy resin is 3-11 wt%, the content of the curing agent is 2-5 wt%, the content of the solid filler is 80-88 wt%, the content of the ion trapping agent is 0.1-0.8 wt%, the content of the low stress modifier is 0.1-0.8 wt%, the content of the coupling agent is 0.1-0.8 wt%, the content of the curing accelerator is 0.2-1 wt%, the content of the mold release agent is 0.2-0.8 wt%, the content of the flame retardant is 1-9 wt%, and the content of the colorant is 0.1-0.8 wt%, based on the total weight of the raw material composition being 100 wt%.

4. The epoxy encapsulating material of claim 3, wherein the epoxy encapsulating material is a liquid at room temperature. The content of the epoxy resin is 4-10 wt%, the content of the curing agent is 3-5 wt%, the content of the solid filler is 80-87 wt%, the content of the ion trapping agent is 0.1-0.7 wt%, the content of the low stress modifier is 0.2-0.8 wt%, the content of the coupling agent is 0.2-0.8 wt%, the content of the curing accelerator is 0.2-0.9 wt%, the content of the mold release agent is 0.3-0.8 wt%, the content of the flame retardant is 2-9 wt%, and the content of the colorant is 0.1-0.7 wt%, based on the total weight of the raw material composition being 100 wt%.

5. The epoxy encapsulating material according to claim 1 or 4, wherein The epoxy resin is selected from one or two or more of an o-cresol novolac type epoxy resin, a dicyclopentadiene type epoxy resin, a biphenyl type epoxy resin, and an aliphatic epoxy resin.

6. The epoxy encapsulating material of claim 5, wherein, The epoxy resin is an o-cresol novolac type epoxy resin and / or a dicyclopentadiene type epoxy resin.

7. The epoxy encapsulating material according to claim 1 or 4, wherein The solid filler is crystalline silica and / or fused silica.

8. The epoxy encapsulating material according to claim 1 or 4, wherein The low stress modifier is selected from one or two or more of a silicone-modified epoxy resin, a silicone resin, and a triblock copolymer containing a silicone component.

9. The epoxy encapsulating material of claim 8, wherein, The low stress modifier is a silicone-modified epoxy resin.

10. The epoxy encapsulating material according to claim 1 or 4, wherein The coupling agent is one or two or more of γ-glycidoxypropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane and γ-aminopropyltrimethoxysilane.

11. The epoxy encapsulating material of claim 10, wherein, The coupling agent is γ-mercaptopropyltrimethoxysilane.

12. The epoxy encapsulating material according to claim 1 or 4, wherein The release agent is one or two or more of carnauba wax, polyethylene wax, oxidized polyethylene wax, Fischer-Tropsch wax and polypropylene wax.

13. The epoxy encapsulating material of claim 12, wherein the epoxy encapsulating material is a liquid at room temperature. The release agent is oxidized polyethylene wax.

14. The epoxy encapsulating material according to claim 1 or 4, wherein The ion capture agent is one or two or more of an anion capture agent, a cation capture agent, a cation-anion complex ion capture agent and a hydrotalcite compound.

15. The epoxy encapsulating material according to claim 1 or 4, wherein The flame retardant is one or two or more of a halogen-based flame retardant, a phosphorus-based flame retardant, a nitrogen-based flame retardant, a phosphorus-halogen flame retardant, a phosphorus-nitrogen flame retardant and a hydroxide flame retardant.

16. A method of preparing the epoxy encapsulating material according to any one of claims 1 to 15, characterized by, The method comprises the following steps: (1) mixing the raw material composition of the epoxy plastic encapsulant by stirring, and then melting and mixing the mixed material at a temperature of 70-100°C for 5-20 min; (2) cooling, crushing and preforming the melting and mixing material obtained in step (1) to obtain the epoxy plastic encapsulant.

17. Use of the epoxy plastic encapsulant according to any one of claims 1-15 and the epoxy plastic encapsulant prepared by the method of claim 16 as a semiconductor chip packaging material.

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