Capillary structure regulated working fluid storage ultra-thin vapor chamber assembly and manufacturing method
By designing capillary structure regions of varying thicknesses within the ultrathin vapor chamber assembly and adjusting the working fluid volume, the problem of the liquid working fluid drying out was solved, achieving rapid heat dissipation in high-frequency environments.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- GUANGZHOU NEOGENE THERMAL MANAGEMENT TECH CO LTD
- Filing Date
- 2022-01-14
- Publication Date
- 2026-06-05
Smart Images
Figure CN116481362B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to an ultrathin heat exchanger assembly, and more particularly to an ultrathin heat exchanger assembly with a special configuration and regional distribution of capillary structure for regulating the storage of working fluid, and its manufacturing method. Background Technology
[0002] A vapor chamber element is a flat, vacuum-sealed cavity. The inner wall of the sealed cavity is lined with capillary structures and contains a working fluid. The working principle of the vapor chamber is as follows: when the heat-absorbing zone of the vapor chamber comes into contact with a heat source, the liquid working fluid in the capillary structure of the heat-absorbing zone absorbs heat energy and changes from liquid to gas. Due to the pressure difference within the element, the gaseous working fluid flows rapidly towards the distant condensation zone through the gas channels in the cavity. When the gaseous working fluid reaches the condensation zone away from the heat source, it releases latent heat, changes from gaseous to liquid, and enters the capillary structure. Then, the liquid working fluid is transported back to the heat-absorbing zone by the capillary force of the continuous capillary structure in the cavity, forming a liquid-gas phase flow cycle. The vapor chamber element achieves rapid heat conduction through the phase change and circulation of the working fluid, thereby cooling and dissipating heat from the microprocessor.
[0003] With the widespread adoption of 5G mobile communication devices, the pursuit of thin and light product designs has become a trend, leading to increasingly stringent requirements for the thinness of vapor chamber components. Currently, the industry generally refers to vapor chamber components with a thickness of less than 1 mm as ultra-thin vapor chamber assemblies, while the maximum thickness that can be mass-produced in the market is still greater than 0.3 mm. Once the thickness of the vapor chamber component is less than 0.25 mm, the capillary structure thickness must be less than 0.05 mm. An excessively thin capillary structure affects the volume of liquid working fluid it carries, and also reduces the speed at which the liquid working fluid is transported and its ability to return to the heat absorption zone. Furthermore, the component area must be greater than 3000 mm². 2 Subsequently, the return path becomes longer, and the liquid working fluid at a distance cannot return to the heat absorption zone in time due to the slow transport speed. Therefore, under high-frequency operating conditions, the liquid working fluid in the heat absorption zone is often burned dry. Without working fluid, heat accumulates in the heat absorption zone and cannot dissipate in time. Thus, the insufficient burning of the liquid working fluid greatly limits the heat conduction and deheating capabilities of the heat spreader element.
[0004] Therefore, how to ensure the working fluid flows smoothly in ultra-thin vapor chamber assemblies, especially those with a thickness of less than 0.25 mm and an area greater than 3000 mm², is a key challenge. 2 Achieving rapid and sufficient circulation within the ultra-thin vapor chamber assembly to achieve ideal heat conduction and deheating functions is a challenge that needs to be addressed in the production of ultra-thin vapor chambers in the 5G era. Summary of the Invention
[0005] In view of this, the purpose of the present invention is to provide an ultra-thin heat exchanger assembly and manufacturing method for adjusting the working fluid storage through capillary structure, which can overcome the defects of the prior art. The ultra-thin heat exchanger assembly has the function of adjusting the working fluid storage through capillary structure, avoiding the situation where the working fluid in the heat absorption zone is burned dry under high frequency operation, and effectively improving the cooling and heat dissipation efficiency.
[0006] To achieve the above objectives, this invention discloses a method for manufacturing an ultrathin vapor chamber assembly with a capillary structure for regulating the storage of working fluid. This method is used to manufacture an ultrathin vapor chamber assembly comprising a capillary structure, which is applied to the thermal management of an electronic device. The method is characterized by comprising the following steps:
[0007] A sheet metal substrate is provided, the sheet metal substrate having a groove structure, the groove structure being divided into at least a heat-absorbing zone, a first laying zone and a second laying zone;
[0008] A first slurry is laid on the heat-absorbing zone and the first laying zone in the trench structure;
[0009] The first slurry is dried to form a continuous first solidified body;
[0010] A second slurry is laid on the heat-absorbing zone, the first laying zone, and the second laying zone in the trench structure;
[0011] Drying the second slurry forms a continuous second solidified body; and
[0012] The first cured body and the second cured body are heated to form the continuous capillary structure.
[0013] The step of providing the sheet metal substrate includes providing the sheet metal substrate having a plurality of sidewalls that continuously surround the sheet metal substrate to form the trench structure, the heat-absorbing area being located between the first laying area and the second laying area, the heat-absorbing area being close to a first sidewall of the sheet metal substrate, and the extent of the first laying area including at least the area extending from the heat-absorbing area to the first sidewall.
[0014] The step of drying the first slurry further comprises the following steps:
[0015] The first slurry is dried to form a continuous first cured body, the thickness of which is at most 80% of the thickness of the first slurry layer; and
[0016] The step of drying the second slurry further comprises the following steps:
[0017] The second slurry is dried to form a continuous second cured body, the thickness of which is at most 80% of the thickness of the second slurry.
[0018] The step of providing the sheet metal substrate includes providing the sheet metal substrate containing at least one supporting wall within the trench structure, wherein the at least one supporting wall divides the trench structure into a plurality of elongated sub-trench structures, one end of the at least one supporting wall and the elongated sub-trench structures points towards the heat absorption area, and the other end of the at least one supporting wall and the elongated sub-trench structures points towards a distant condensation area away from the heat absorption area.
[0019] The trench structure also includes multiple supporting columns, and the step of laying the second slurry within the trench structure further comprises the following steps:
[0020] The second slurry is laid on the heat-absorbing area, the first laying area and the second laying area within the trench structure, and the second slurry also covers the at least one supporting wall and the supporting columns;
[0021] The step of drying the second slurry further comprises the following steps:
[0022] The second slurry is dried to form a continuous second cured body within the trench structure, and a plurality of third cured bodies are formed on the at least one supporting wall and the supporting columns; and
[0023] The step of heating the first cured body and the second cured body further comprises the following steps.
[0024] The first cured body and the second cured body are heated to form the continuous capillary structure, while the third cured bodies are heated to form multiple capillary support structures.
[0025] The step of providing the sheet metal substrate includes the first laying area having a planar area of at most 30% of the planar area of the trench structure, and the second laying area having a planar area of at least 50% of the planar area of the trench structure.
[0026] The first slurry contains an organic solvent, a polymer, and a metal powder. The second slurry has the same composition as the first slurry. The step of drying the first slurry further includes the following steps:
[0027] Drying the first slurry to remove the organic solvent to form the first cured body; and
[0028] The step of heating the first cured body and the second cured body further comprises the following steps:
[0029] The first cured body and the second cured body are heated to pyrolyze the first polymer and sinter the metal powder to form the continuous capillary structure.
[0030] This includes the following steps:
[0031] A sheet metal cover is hermetically bonded to the sheet metal substrate to form a cavity between the sheet metal cover and the groove structure;
[0032] Injecting a working fluid into the chamber to store the working fluid in the capillary structure; and
[0033] After vacuuming, the chamber is sealed to form the ultrathin heat spreader assembly;
[0034] The average working fluid storage per unit area of the capillary structure located in the first laying area is greater than the average working fluid storage per unit area of the capillary structure located in the second laying area.
[0035] When the ultra-thin heat spreader assembly is used for the thermal management of the electronic device, the sheet-like metal substrate contacts a heat-generating element of the electronic device through the heat-absorbing area.
[0036] A capillary structure for regulating the storage of working fluid is also disclosed, used in the thermal management of an electronic device, characterized in that the ultrathin heat spreader assembly comprises:
[0037] A sheet-like metal substrate having a trench structure, the trench structure being divided into at least a heat-absorbing zone, a first laying zone, and a second laying zone; and
[0038] A powder-printed capillary structure is continuously laid on the sheet-like metal substrate, and the thickness of the capillary structure located in the heat-absorbing area and the first laying area is greater than the thickness of the capillary structure located in the second laying area.
[0039] In summary, the thicker capillary structure in the heat-absorbing zone and the first laying zone of this invention allows the ultra-thin vapor chamber assembly to store a larger amount of liquid working fluid, and facilitates faster replenishment of the liquid working fluid to the heat-absorbing zone during operation. The thinner capillary structure and higher gas channel space in the second laying zone facilitate the flow of gaseous working fluid from the heat-absorbing zone to the distant condensation zone. During manufacturing, the first slurry laid in the first laying zone and the heat-absorbing zone is first dried to obtain a first solidified body with reduced volume; then, a second slurry is evenly laid and dried throughout the trench to obtain a second solidified body with reduced volume. By using the first solidified body as a base, the thickness of the first laying zone and the heat-absorbing zone is increased, thereby adjusting the difference in capillary structure thickness and achieving the purpose of regulating the liquid working fluid storage. This facilitates rapid and complete circulation of the working fluid in the ultra-thin vapor chamber assembly with a large area and a very thin profile. Attached Figure Description
[0040] Figure 1 The flowchart of the manufacturing method of the ultrathin heat exchanger assembly of the present invention is shown.
[0041] Figure 2This diagram shows a sheet-like metal substrate of an ultrathin heat spreader assembly according to a specific embodiment of the present invention.
[0042] Figure 3A Showing according to Figure 2 The embodiment is a schematic diagram showing the first slurry laying step as presented by the cross-section of the BB section line on the sheet metal substrate.
[0043] Figure 3B Showing according to Figure 2 The schematic diagram of the drying step of the first slurry is shown in the cross-section of the BB section line on the sheet metal substrate in the embodiment.
[0044] Figure 3C Showing according to Figure 2 The embodiment is a schematic diagram showing the second slurry laying step as presented by the cross-section of the BB section line on the sheet metal substrate.
[0045] Figure 3D Showing according to Figure 2 The embodiment shows a schematic diagram of the drying step of the second slurry, presented by the cross-section of the BB section line on the sheet metal substrate.
[0046] Figure 3E Showing according to Figure 2 The embodiment is a schematic diagram showing the heating of the first and second cured bodies through the cross-section of the BB section line on the sheet metal substrate.
[0047] Figure 4 This diagram shows a sheet-like metal substrate of an ultrathin heat spreader assembly according to another specific embodiment of the present invention.
[0048] Figure 5A Showing according to Figure 4 The embodiment is a schematic diagram showing the first slurry laying step as presented by the cross-section of the DD section line on the sheet metal substrate.
[0049] Figure 5B Showing according to Figure 4 The embodiment shows a schematic diagram of the drying step of the first slurry, as presented by the cross-section of the DD section line on the sheet metal substrate.
[0050] Figure 5C Showing according to Figure 4 The embodiment is a schematic diagram showing the second slurry laying step as presented by the cross-section of the DD section line on the sheet metal substrate.
[0051] Figure 5D Showing according to Figure 4 The embodiment shows a schematic diagram of the drying step of the second slurry, as presented by the cross-section of the DD section line on the sheet metal substrate.
[0052] Figure 5E Showing according to Figure 4The embodiment is a schematic diagram showing the heating of the first cured body, the second cured body, and the third cured body through the cross-section of the DD section line on the sheet metal substrate.
[0053] Figure 6 This diagram shows a sheet-like metal substrate of an ultrathin heat spreader assembly in another specific embodiment of the present invention.
[0054] Figure 7 This diagram shows a sheet-like metal substrate of an ultrathin heat spreader assembly in another specific embodiment of the present invention.
[0055] Figure 8 A schematic diagram of the capillary structure of the ultrathin heat exchanger assembly of the present invention is shown. Detailed Implementation
[0056] To make the advantages, spirit, and features of the present invention easier and clearer to understand, detailed descriptions and discussions will follow with reference to specific embodiments and the accompanying drawings. It should be noted that these specific embodiments are merely representative examples of the present invention, and the specific methods, apparatus, conditions, materials, etc., exemplified are not intended to limit the present invention or the corresponding specific embodiments. Furthermore, the vertical and horizontal directions and the various elements in the figures are only used to express their relative positions and are not drawn to scale; this is to be stated beforehand.
[0057] Please see Figures 1 to 3A -3E. Figure 1 A flowchart illustrating the steps of the manufacturing method of the ultrathin heat exchanger assembly of the present invention is shown. Figure 2 A schematic diagram illustrating the sheet-like metal substrate of an ultrathin heat spreader assembly in a specific embodiment of the present invention is shown. Figures 3A to 3E According to Figure 2 A schematic diagram of the steps in this embodiment is shown in the cross-section of the BB section line on the medium-sized sheet metal substrate.
[0058] The method for manufacturing an ultrathin heat spreader assembly for regulating working fluid storage using a capillary structure provided by the present invention includes the following steps: Step S1: Provide a sheet metal substrate 1, the sheet metal substrate 1 having a groove structure 10, the groove structure 10 being at least divided into a heat absorption zone H, a first laying zone A1 and a second laying zone A2, the three being non-overlapping, the heat absorption zone H being located between the first laying zone A1 and the second laying zone A2; Step S2: Lay a first slurry 21 on the heat absorption zone H and the first laying zone A1 in the groove structure 10; Step S3: Dry the first slurry 21 to form a continuous first cured body 31; Step S4: Lay a second slurry 22 on the heat absorption zone H, the first laying zone A1 and the second laying zone A2 in the groove structure 10; Step S5: Dry the second slurry 22 to form a continuous second cured body 32; Step S6: Heat the first cured body 31 and the second cured body 32 to form a continuous capillary structure 4.
[0059] Compared to the common method of laying copper mesh, heating after applying a slurry to form a capillary structure allows for more efficient mass production of ultra-thin vapor chamber assemblies. This is especially true when the capillary structure has a specific configuration and distribution area; using a slurry application method effectively achieves the required capillary structure design. In particular, this invention utilizes two-stage localized slurry application and curing to form a continuous capillary structure with thickness variations, achieving the design goal of regulating the liquid working fluid storage capacity within the capillary structure.
[0060] Figure 2 The dashed lines in Figure 3 represent the boundary between the first laying area A1 and the second laying area A2. These dashed lines are only for the purpose of helping those skilled in the art to understand the meaning of the figures and do not imply that the sheet metal substrate 1 must actually contain obvious lines. Similarly, the dashed lines in Figure 3 represent the boundary between areas and do not imply that the sheet metal substrate 1 must actually contain obvious lines.
[0061] The configuration of the capillary structure 4 on the first laying area A1 and the second laying area A2 described in this article is not limited to neat straight lines or curves, but may have naturally irregular edges due to slurry flow or curing shrinkage, such as... Figure 3A and Figure 3B A sheet-like metal substrate 1 contacts a heat-generating element of an electronic device through a heat-absorbing region H. The shape of the heat-absorbing region H depends on the shape of the heat-generating element of the electronic device. For example, the shape of a microchip is usually rectangular, but there is no restriction on the shape of the heat-absorbing region H here.
[0062] In step S2, when laying the first slurry 21, one of the following methods can be used to ensure that the first slurry 21 is distributed in a limited manner in the first laying area A1: using a slurry with a high solid content, using a slurry with a high viscosity, slightly tilting the sheet metal substrate 1 towards the first laying area A1 when laying the slurry, or temporarily blocking the first slurry 21 at the dotted line boundary using a scraper or baffle. The method of laying the slurry can be screen printing, plate printing, or spray printing, etc.
[0063] Step S4, which involves laying the second grout 22, can also be understood as filling the trench structure 10 with grout to a certain height, rather than simply laying it in a specific area. The second grout 22 must be at least higher than the first cured body 31, such as... Figure 3C .
[0064] The first cured body 31 and the second cured body 32 have irregular surfaces. When the slurry is laid on an irregular surface, it is more difficult to control its distribution area. Therefore, the first slurry 21 used for laying in the first laying area A1 and the heat absorption area H should be preferentially laid on the smooth surface sheet metal substrate 1 in the process (step S2). The second slurry 22 is laid in step S4 only after the first slurry 21 is dried. The second slurry 22 is used to fill the entire trench structure 10 to a certain height without limiting the area, so it is not necessary to pay attention to whether the laying area is smooth. Furthermore, since the amount of the first slurry 21 laid is much less than the amount of the second slurry 22 laid, and the error tolerance of laying the first slurry 21 is low, if defective products with poor distribution are generated during the laying of the first slurry 21, they can be discarded in time, thereby improving the product yield at a lower process cost.
[0065] In step S5, when drying the second slurry 22, since a layer of solidified and reduced-volume first cured body 31 has already been formed on the heat-absorbing zone H and the first laying zone A1, the first cured body 31 will not shrink in volume again in step S5. Therefore, in step S5, the drying and sinking amplitude of the second slurry 22 in the second laying zone A2 is greater than that of the second slurry 22 on the heat-absorbing zone H and the first laying zone A1, making the surface of the second cured body 32 have a stepped shape, such as... Figure 3D The lower the solid content of the second slurry 22, the more obvious the surface drop of the second solidified body 32.
[0066] In step S6, when heating the first cured body 31 and the second cured body 32, the first cured body 31 and the second cured body 32 will continuously fuse together without a clear boundary, such as... Figure 3E The overall thickness of the capillary structure 4 will decrease further, but the thickness of the capillary structure 4 in the heat absorption zone H and the first laying zone A1 is still greater than the thickness of the capillary structure 4 located in the second laying zone A2.
[0067] In another embodiment, the first slurry 21 in step S2 is also confined to the heat-absorbing zone H and the first laying zone A1, with a laying height X; the height Y of the first solidified body 31 in step S3; and the second slurry 22 in step S4 is confined to the second laying zone A2, with a laying height Z; X>Y≧Z.
[0068] The sheet-like metal substrate 1 has multiple sidewalls 14 that continuously surround the sheet-like metal substrate 1 to form a groove structure 10. Figure 2In this embodiment, the sheet-like metal substrate 1 is a long rectangle with four sidewalls 14: top, bottom, left, and right. Due to the design limitations of the mobile phone, the heat-absorbing zone H is usually not located at the exact center of the sheet-like metal substrate 1, but may be offset towards any of the sidewalls 14. When the heat-absorbing zone H and the sidewall 14 are too close, the distance that the gaseous working fluid carrying latent heat travels is short, resulting in limited temperature uniformity and low space utilization efficiency. Therefore, the area between the heat-absorbing zone H and the nearest sidewall 14 can be used to increase the working fluid storage capacity of the capillary structure 4, thereby improving space utilization efficiency.
[0069] In previous copper mesh capillary technology, the thickness of the entire capillary structure within the heat spreader was uniform, and the gas flow channels within the heat spreader also had a uniform height. However, in an extremely thin capillary structure, the total amount of liquid working fluid that can be stored and transported is limited, and the liquid working fluid often cannot be replenished in time, causing the heat absorption zone H to burn out.
[0070] In this embodiment, the heat-absorbing zone H is close to a first sidewall 141 of the sheet metal substrate 1, and the distance that the gaseous working fluid can move is relatively short. Therefore, a portion of the gas passage space between the first sidewall 141 and the heat-absorbing zone H can be sacrificed to thicken the capillary structure 4, thereby retaining a larger working fluid storage capacity. That is, the range of the first laying area A1 at least includes the area extending from the heat-absorbing zone H to the first sidewall 141. The average working fluid storage capacity per unit area of the capillary structure 4 located in the first laying area A1 is greater than the average working fluid storage capacity per unit area of the capillary structure 4 located in the second laying area A2. When the operating temperature is low, the working fluid in the thin heat spreader mainly circulates between the heat-absorbing zone H and the second laying area A2. When the operating temperature begins to rise, the liquid working fluid in the second laying area A2 cannot replenish the heat-absorbing zone H in time, but at this time the liquid working fluid in the first laying area A1 can be replenished to the heat-absorbing zone H in time and enter a two-phase circulation.
[0071] In step S2, drying the first slurry 21 further forms a continuous first cured body 31, the thickness of which is at most 80% of the thickness of the first slurry 21. In step S4, drying the second slurry 22 further forms a continuous second cured body 32, the thickness of which is at most 80% of the thickness of the second slurry 22. Due to the evaporation of the solvent in the slurry, the volume of the cured body will be smaller than that of the slurry. Those skilled in the art can adjust the solid content in the slurry to determine the degree of volume reduction of the cured body. The thickness of the first cured body 31 can be one of 80%, 75%, 70%, 65%, 60%, 55%, 50%, 45%, 40%, 35%, or 30% of the thickness of the first slurry 21. The thickness of the second solidified body 32 can be one of 80%, 75%, 70%, 65%, 60%, 55%, 50%, 45%, 40%, 35%, or 30% of the thickness of the second slurry 22.
[0072] For example, the thickness of the first cured body 31 is 50% of the thickness of the first slurry 21, and the thickness of the second cured body 32 is 40% of the thickness of the second slurry 22. First, 100 μm of the first slurry 21 is laid in the first laying area A1 and the heat-absorbing area H. After drying, the thickness of the first cured body 31 is 50 μm. Then, the second slurry 22 with a total height of 200 μm is laid in the trench structure 10, covering the heat-absorbing area H, the first laying area A1, and the second laying area A2. After drying, the total thickness of the first cured body 31 and the second cured body on the first laying area A1 and the heat-absorbing area H is 50 + (200 - 50) * 40% = 110 μm, and the thickness of the second cured body on the second laying area A2 is 200 * 40% = 80 μm, thus creating a 30 μm thickness difference in the cured body.
[0073] In one embodiment, the first slurry 21 and the second slurry 22 may be the same slurry, having the same solid content and volume reduction after drying, differing only in the process steps used. The first slurry 21 contains an organic solvent, a polymer, and metal powder. The composition of the second slurry is the same as that of the first slurry. In step S3 of drying the first slurry 21, the first slurry 21 is further dried to remove the organic solvent, forming a first cured body 31. In step S5 of drying the second slurry 22, the second slurry 22 is further dried to remove the organic solvent, forming a second cured body 32. In step S6 of heating the first cured body 31 and the second cured body 32, the first cured body 31 and the second cured body 32 are further heated to pyrolyze the first polymer and sinter the metal powder to form a continuous capillary structure 4.
[0074] The metal powder can be copper-based, including copper (Cu), copper alloys (Cu alloys), copper oxide (CuO), cuprous oxide (Cu2O), and copper trioxide (Cu2O3). In one embodiment, a mixture of hexagonal, octagonal, spindle-shaped cuprous oxide particles and near-spherical copper particles is selected. During sintering of the metal powder, the approximately 3-5 μm spindle-shaped cuprous oxide particles deform and stretch into chains (sticks), and interlock in three dimensions. The approximately 5-30 μm near-spherical copper particles do not deform during sintering and can serve as supports for the overall structure. The capillary structure formed by sintering in this embodiment has good capillary capacity.
[0075] The curing principle of the first cured body 31 and the second cured body 32 is based on the adhesion of the metal powder to form a solid mass by a viscous polymer.
[0076] The planar area of the first laying area A1 can account for 1%, 5%, 10%, 15%, 20%, 25%, or 30% of the planar area of the trench structure 10. The planar area of the second laying area A2 can account for 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85%, 90%, or 95% of the planar area of the trench structure 10. If the area of the thickened capillary structure in the first laying area A1 is too large, and the area of the original thickness capillary structure in the second laying area A2 is too small, the space for the gaseous working fluid to carry latent heat is limited, which reduces the temperature uniformity.
[0077] The manufacturing method of the present invention further includes the following steps (not shown in the figure). Step S7: A sheet-like metal cover is hermetically bonded to the sheet-like metal substrate 1 to form a chamber between the sheet-like metal cover and the groove structure 10, and a connecting pipe in the chamber leads to the outside space; Step S8: Working fluid is injected into the chamber through the connecting pipe to store the working fluid in the capillary structure 4; Step S9: After evacuating through the connecting pipe, the connecting pipe is closed to seal the chamber to form an ultrathin heat spreader assembly.
[0078] Please see Figure 4 , Figures 5A to 5E . Figure 4 A schematic diagram illustrating the sheet-like metal substrate of the ultrathin heat spreader assembly in another specific embodiment of the present invention is shown. Figures 5A to 5E According to Figure 4The cross-section of the DD section line on the sheet-like metal substrate illustrates the steps of this embodiment. Unless otherwise specified, the components described by the same reference numerals and names in this embodiment have the same structure and function as those in the preceding embodiments. In this embodiment, the trench structure 10 includes at least one supporting wall 11 and multiple supporting columns 16. The supporting wall 11 divides the trench structure 10 into multiple elongated sub-trench structures 100. One end of the supporting wall 11 and the elongated sub-trench structures 100 points towards the heat absorption zone H, and the other end of the supporting wall 11 and the elongated sub-trench structures 100 points towards a distant condensation zone C, which is far from the heat absorption zone H. The distant condensation zone C refers to the end of the sheet-like metal substrate 1 that is farthest from the heat absorption zone H, which is usually the endpoint of the movement of the remaining gaseous working fluid, where it condenses into a liquid working fluid.
[0079] The support columns 16 are generally evenly distributed within the groove structure 10. The support columns 16 are used to maintain a certain distance between the sheet metal substrate 1 and the sheet metal top cover during their connection, preventing the ultra-thin heat spreader from collapsing due to negative pressure within the internal chamber. The support walls 11 also serve a supporting function and are generally distributed between the heat absorption zone H and the distal condensation zone C. Furthermore, the longitudinally arranged support walls 11 also guide the direction of the liquid working fluid, making it easier for the liquid working fluid to flow back to the heat absorption zone H. The support walls 11 are not limited to straight lines and may be curved, bent, or discontinuous depending on the shape of the sheet metal substrate 1 and the location of the heat absorption zone H.
[0080] Step S4, which involves laying the second mortar 22 within the trench structure 10, further comprises: laying the second mortar 22 on the heat-absorbing zone H, the first laying zone A1, and the second laying zone A2 within the trench structure 10, and the second mortar 22 also covering the supporting wall 11 and the supporting column 16, as shown below. Figure 5C Step S5, which involves drying the second slurry 22, further involves forming a continuous second cured body 32 within the trench structure 10 to dry the second slurry 22, and forming a plurality of third cured bodies 33 on the supporting wall 11 and the supporting column 16, such as... Figure 5D In step S6, which involves heating the first cured body 31 and the second cured body 32, the first cured body 31 and the second cured body 32 are further heated to form a continuous capillary structure 4, while the third cured body 33 is heated to form multiple capillary support structures 43, such as... Figure 5E .
[0081] When the second slurry 22 is laid to a sufficiently high height, it can submerge the supporting wall 11 and the supporting column 16. Alternatively, when the second slurry 22 is laid by the scraper, it naturally remains on the supporting wall 11 and the supporting column 16. In the drying step S5, the second slurry 22 is directly cured on the supporting wall 11 and the supporting column 16 to form a third cured body 33. In the step S7 of airtight bonding of the sheet metal substrate 1, the capillary support structure 43 is compressed slightly but still retains capillary capacity and permeability. Therefore, the capillary support structure 43 serves two purposes: firstly, as a vertical extension of the supporting wall 11 and the supporting column 16; and secondly, together with the capillary structure 4 in the groove structure 10, it constitutes a composite capillary structure in the heat spreader, providing channels for communication between the multiple elongated sub-groove structures 100.
[0082] When a vapor chamber is installed in an electronic component, it is usually not parallel to the ground surface, resulting in uneven distribution of the gaseous and liquid working fluids. The capillary support structure 43 in this embodiment allows multiple elongated sub-grooves 100 to exchange the liquid working fluid across the grooves, maintaining efficient fluid circulation.
[0083] In addition to the two embodiments described above, this invention also provides different ways of dividing the heat-absorbing zone H, the first laying zone A1, and the second laying zone A2 in different embodiments. Please refer to [link / reference needed]. Figure 6 and Figure 7 . Figure 6 and Figure 7 Schematic diagrams of the sheet-like metal substrate of the ultrathin heat spreader assembly in different embodiments of the present invention are shown respectively.
[0084] exist Figure 6 In this design, the first laying area A1 extends conically from the heat-absorbing area H to the first sidewall 141, preserving more gas space. The first laying area A1 slightly covers the heat-absorbing area H, which is more convenient in the manufacturing process. Furthermore, the area on the sheet metal substrate 1 furthest from the heat-absorbing area H (usually considered the distal condensation area) is also designated as the first laying area A1, extending to the distal second sidewall 142. When the sheet metal substrate 1 is designed with a long shape, most of the gaseous working fluid releases latent heat and condenses before reaching the second sidewall 142, making the thickened capillary structure at the terminal for storing the liquid working fluid highly efficient.
[0085] exist Figure 7In this diagram, the heat-absorbing zone H is connected to the first laying zone A1 on only one side. This arrangement allows the gaseous working fluid in the heat-absorbing zone H to dissipate away from the high-temperature area more quickly. Furthermore, the first laying zone A1 surrounds the second laying zone A2 and touches each sidewall 14. The liquid working fluid in the first laying zone A1 near the second sidewall 142 can be transported more quickly to the first laying zone A1 near the first sidewall 141 via the thickened capillary structures on the left and right sides of the diagram. This division method is suitable for sheet-like metal substrates with relatively uniform length and width, and can help the liquid working fluid at a distance to flow back to the heat-absorbing zone H more quickly.
[0086] Please see Figure 8 . Figure 8 A schematic diagram of the ultrathin vapor chamber assembly of the present invention is shown. The present invention also provides an ultrathin vapor chamber assembly V for regulating the working fluid storage via capillary structure, applied to the thermal management of an electronic device. The ultrathin vapor chamber assembly V comprises a sheet-like metal substrate 1 and a capillary structure 4. The sheet-like metal substrate 1 has a groove structure 10, which is at least divided into a heat-absorbing region H, a first laying region A1, and a second laying region A2, with the heat-absorbing region H located between the first laying region A1 and the second laying region A2. The powder-sintered capillary structure 4 is continuously laid on the sheet-like metal substrate 1, and the thickness of the capillary structure 4 located in the heat-absorbing region H and the first laying region A1 is greater than the thickness of the capillary structure 4 located in the second laying region A2.
[0087] Unless otherwise specified, the components described by the same reference numerals and names in this embodiment have the same structure and function as those in the preceding embodiments. As can be seen from the figures, the capillary structures 4 on the heat-absorbing zone H, the first laying zone A1, and the second laying zone A2 are continuous, and the supporting wall 11 and the supporting column 16 have capillary support structures 43. This ultra-thin heat spreader assembly V has a relatively thick capillary structure 4 in the heat-absorbing zone H, which can store a larger amount of liquid working fluid and achieve the purpose of regulating the liquid working fluid storage. This facilitates the rapid and complete circulation of the working fluid in the ultra-thin heat spreader assembly with a large area and a very thin profile.
[0088] In summary, the thicker capillary structure in the heat-absorbing zone and the first laying zone of this invention allows the ultra-thin vapor chamber assembly to store a larger amount of liquid working fluid, and facilitates faster replenishment of the liquid working fluid to the heat-absorbing zone during operation. The thinner capillary structure and higher gas channel space in the second laying zone facilitate the flow of gaseous working fluid from the heat-absorbing zone to the distant condensation zone. During manufacturing, the first slurry laid in the first laying zone and the heat-absorbing zone is first dried to obtain a first solidified body with reduced volume; then, a second slurry is evenly laid and dried throughout the trench to obtain a second solidified body with reduced volume. By using the first solidified body as a base, the thickness of the first laying zone and the heat-absorbing zone is increased, thereby adjusting the difference in capillary structure thickness and achieving the purpose of regulating the liquid working fluid storage. This facilitates rapid and complete circulation of the working fluid in the ultra-thin vapor chamber assembly with a large area and a very thin profile.
[0089] The detailed description of the preferred embodiments above is intended to more clearly illustrate the features and spirit of the present invention, and is not intended to limit the scope of the invention to the preferred embodiments disclosed above. Rather, the aim is to cover various modifications and equivalent arrangements within the scope of the patent claims made by this invention. Therefore, the scope of the patent claims made by this invention should be interpreted in the broadest possible sense based on the foregoing description, so as to cover all possible modifications and equivalent arrangements.
Claims
1. A method for manufacturing an ultrathin vapor chamber assembly with a capillary structure for regulating the storage of working fluid, used to manufacture an ultrathin vapor chamber assembly including a capillary structure, the ultrathin vapor chamber assembly being used in the thermal management of an electronic device, characterized in that... This production method includes the following steps: A sheet metal substrate is provided, the sheet metal substrate having a groove structure, the groove structure being divided into at least a heat-absorbing zone, a first laying zone and a second laying zone, and the groove structure including at least a supporting wall and a plurality of supporting columns. A first slurry is laid on the heat-absorbing zone and the first laying zone in the trench structure; The first slurry is dried to form a continuous first solidified body; A second mortar is laid on the heat-absorbing area, the first laying area and the second laying area in the trench structure, and the second mortar also covers the at least one supporting wall and the supporting columns. The second slurry is dried to form a continuous second cured body within the trench structure, and a plurality of third cured bodies are formed on the at least one supporting wall and the supporting columns; and The first cured body and the second cured body are heated to form the continuous capillary structure, while the third cured bodies are heated to form multiple capillary support structures.
2. The method for manufacturing the ultrathin temperature-regulating plate assembly for adjusting the working fluid storage using a capillary structure as described in claim 1, characterized in that, The step of providing the sheet metal substrate includes providing the sheet metal substrate having a plurality of sidewalls continuously surrounding the sheet metal substrate to form the trench structure, the heat-absorbing area being located between the first layup area and the second layup area, the heat-absorbing area being adjacent to a first sidewall of the sheet metal substrate, the first layup area including at least the area extending from the heat-absorbing area to the first sidewall.
3. The method for manufacturing the ultrathin temperature-regulating plate assembly for adjusting the working fluid storage using a capillary structure as described in claim 1, characterized in that, The step of drying the first slurry further comprises the following steps: The first slurry is dried to form a continuous first cured body, the thickness of which is at most 80% of the thickness of the first slurry layer; and The step of drying the second slurry further comprises the following steps: The second slurry is dried to form a continuous second cured body, the thickness of which is at most 80% of the thickness of the second slurry.
4. The method for manufacturing the ultrathin temperature-regulating plate assembly for adjusting the working fluid storage using a capillary structure as described in claim 1, characterized in that, The at least one supporting wall divides the trench structure into multiple elongated sub-trench structures. One end of the at least one supporting wall and the elongated sub-trench structures points towards the heat absorption zone, and the other end of the at least one supporting wall and the elongated sub-trench structures points towards a distant condensation zone away from the heat absorption zone.
5. The method for manufacturing the ultrathin temperature-regulating plate assembly for adjusting the working fluid storage using a capillary structure as described in claim 1, characterized in that, The step of providing the sheet metal substrate includes the planar area of the first laying area being at most 30% of the planar area of the trench structure, and the planar area of the second laying area being at least 50% of the planar area of the trench structure.
6. The method for manufacturing the ultrathin temperature-regulating plate assembly for adjusting the working fluid storage using a capillary structure as described in claim 1, characterized in that, The first slurry contains an organic solvent, a polymer, and a metal powder. The second slurry has the same composition as the first slurry. The step of drying the first slurry further includes the following steps: Drying the first slurry to remove the organic solvent to form the first cured body; and The step of heating the first cured body and the second cured body further comprises the following steps: The first and second cured bodies are heated to pyrolyze the polymer and sinter the metal powder to form a continuous capillary structure.
7. The method for manufacturing the ultrathin heat spreader assembly for regulating working fluid storage via capillary structure as described in claim 1, characterized in that... It further includes the following steps: A sheet metal cover is hermetically bonded to the sheet metal substrate to form a cavity between the sheet metal cover and the groove structure; A working fluid is injected into the chamber to store the working fluid in the capillary structure; as well as After vacuuming, the chamber is sealed to form the ultrathin heat spreader assembly; The average working fluid storage per unit area of the capillary structure located in the first laying area is greater than the average working fluid storage per unit area of the capillary structure located in the second laying area.
8. The method for manufacturing the ultrathin homogenizing plate assembly for regulating working fluid storage via capillary structure as described in claim 7, characterized in that, When the ultrathin heat spreader assembly is used for the thermal management of the electronic device, the sheet-like metal substrate contacts a heat-generating component of the electronic device through the heat-absorbing area.
9. An ultrathin heat spreader assembly for regulating working fluid storage via capillary structure, used in the thermal management of an electronic device, manufactured by the method described in claim 1, characterized in that... This ultrathin heat spreader assembly includes: A sheet of metal substrate has a groove structure, the groove structure being divided into at least a heat-absorbing zone, a first laying zone and a second laying zone, and the groove structure includes at least one supporting wall and multiple supporting columns. as well as A powder-printed capillary structure is continuously laid on the sheet-like metal substrate, the at least one supporting wall, and the supporting columns. The thickness of the capillary structure located in the heat-absorbing zone and the first laying zone is greater than the thickness of the capillary structure located in the second laying zone.