A millimeter-wave one-to-many dual-polarized dual-band antenna assembly and its manufacturing method

Abstract

This invention discloses a millimeter-wave one-to-many dual-polarized dual-band antenna assembly and its manufacturing method, relating to the field of radar electronic antenna feed subsystem manufacturing technology. The method includes the following steps: Step 1: Manufacturing an integrated antenna microstrip board; Step 2: Welding and fixing elastic connectors in the grooves of the housing using a solder paste application process; Step 3: Laying conductive adhesive film and installing positioning pins on the antenna microstrip board; Step 4: Installing four sets of antenna microstrip boards onto the housing with welded connectors using positioning pins to form an antenna unit; Step 5: Curing the conductive adhesive film using vacuum bag pressing. This invention's dual-band dual-polarized assembly achieves dual polarization, high integration, and high reliability of the antenna assembly through elastic vertical interconnection between the integrated antenna microstrip board and connectors on multiple housings. The resulting dual-polarized microstrip antenna assembly can be used in the Ka band and above, achieving a standing wave ratio of ≤2.0, and exhibiting excellent electrical performance within the millimeter-wave range.

Description

Technical Field

[0001] This invention relates to the field of radar electronic antenna feed system manufacturing technology, specifically to a millimeter-wave one-to-many dual-polarized dual-band antenna assembly and its manufacturing method. Background Technology

[0002] With the development of military electronic equipment technology, antenna operating frequencies are increasing and bandwidths are widening, placing higher demands on antenna miniaturization. Compared with traditional antenna forms such as metal array antennas, waveguide antennas, and slot antennas, antenna microstrip boards have advantages such as simple structure, light weight, small size, low profile, ease of manufacturing, and low cost. Currently, dual-polarized antennas based on the combination of two axial antenna microstrip boards are used. Although the gain of dual-polarized array antennas can be optimized by increasing the number of elements and changing the spatial distribution of the elements, they are mostly used below the Ku band, with low requirements for element spacing and integration. Millimeter-wave dual-band dual-polarized antenna elements need to simultaneously achieve Ka-band and above transmission and reception and vertical interconnection in a three-dimensional space of 200mm×200mm×10mm. The existing traditional interconnection mode of vertically crossing two antenna microstrip boards and soldering them to the inner conductor of an SMP connector cannot meet the design requirements of Ku / Ka dual-band dual polarization.

[0003] The fabrication process of planar multilayer antenna microstrip boards allows for separate Ku-band and Ka-band antenna transmission and reception functions in different inner layers. Combined with flexible SMP connectors and large-area adhesive bonding with conductive film, an scalable splicing manufacturing method can be achieved. However, this method suffers from two-stage positioning and matching difficulties: controlling the normal position accuracy of the spliced ​​antenna elements' microstrip boards and controlling the flatness of the spliced ​​shells are both challenging. The combination of these two factors affects the overall flatness and consistency of the antenna array. When the total number of antenna elements exceeds 256, the electrical performance significantly degrades.

[0004] Therefore, there is an urgent need to establish a new manufacturing method for millimeter-wave one-to-many dual-polarized dual-band antenna components to solve the problems of low electrical performance degradation caused by low splicing accuracy of multiple antenna units and long and complex process flow, so as to improve the consistency and reliability of processing and assembly, simplify and speed up the process flow, improve the telecommunications indicators, and enhance the reliability.

[0005] In view of the above-mentioned defects, the inventors of this invention have finally obtained this invention after a long period of research and practice. Summary of the Invention

[0006] The purpose of this invention is to provide a millimeter-wave one-to-many dual-polarized dual-band antenna assembly and its manufacturing method, which effectively solves the problems of low flatness and consistency of the antenna array surface, decreased electrical performance after multiple splicing, and unsuitability for large-aperture and multi-group antenna element processes caused by the existing multi-group assembly and splicing process. This provides a further solution for the miniaturization and high integration of millimeter-wave dual-band dual-polarized microstrip antenna assemblies.

[0007] The present invention solves the above-mentioned technical problems through the following technical solution, and the present invention includes the following steps:

[0008] Step 1: Manufacturing an integrated antenna microstrip board;

[0009] Step 2: The elastic connector is welded and fixed in the groove of the housing using a solder paste dot application process;

[0010] Step 3: Lay conductive adhesive film on the antenna microstrip board and install positioning pins;

[0011] Step 4: Install the four sets of antenna microstrip boards onto the housing with soldered connectors using positioning pins to form an antenna unit;

[0012] Step 5: The conductive adhesive film is cured by vacuum bag pressing, the antenna microstrip board and the housing are bonded together, the inner conductor of the elastic connector is kept in close contact with the antenna microstrip to form the antenna array, and vapor deposition protection is performed.

[0013] Step 6: Connect the antenna array to the adapter board, and use the KK adapter connector to connect the flexible connector to the transceiver system.

[0014] Preferably, the antenna microstrip board has a multi-layer structure, with the upper half being a low-frequency antenna layer and the lower half being a high-frequency antenna layer. Both the low-frequency antenna layer and the high-frequency antenna layer have vertical interconnection contact pads on the bottom layer of the multi-layer antenna microstrip board, and the contact pads are interconnected with the inner conductor of the elastic connector.

[0015] Preferably, the bottom layer of the antenna microstrip board is covered with a large-area ground layer, the thickness of the large-area bottom metal is ≥45um, and the radius of the isolation area between the large-area ground layer and the contact pad is ≥0.25mm.

[0016] Preferably, in step two, the welding is performed using one of the following methods: vacuum phase welding, hot air reflow welding, or vacuum reflow welding, to interconnect the elastic connector and the housing, with a penetration rate ≥70%.

[0017] Preferably, in step two, a solder paste laying surface is provided in the groove according to the shape of the elastic connector, the width of the laying surface is 120% to 150% of the width of the spot solder paste, and the composition of the spot solder paste is one of 62Sn36Pb2Ag, SAC305, and Sn54Pb26In20.

[0018] Preferably, in step three, the antenna microstrip board is pre-baked at a temperature of 110–130°C for 1.5–4.5 hours.

[0019] Preferably, in step five, the assembled adhesive bonding fixture and antenna microstrip board are placed in a vacuum bag and then placed in a vacuum autoclave for curing. The curing conditions are: pressure 0.1 MPa, temperature 120-130°C, and curing time 1.5-3 hours.

[0020] Preferably, the external dimensions of the antenna microstrip board are consistent with the total external dimensions after multiple housings are spliced ​​together, the warpage of the antenna microstrip board should be ≤0.5%, and the thickness should be ≥2.0mm.

[0021] Preferably, in step six, the vapor deposition material used for vapor deposition protection of the antenna array is Parylene C.

[0022] The present invention also provides a one-to-many dual-polarized dual-band antenna manufactured using the above-described manufacturing method for a one-to-many dual-polarized dual-band antenna.

[0023] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0024] 1. This dual-band dual-polarization component is flexibly vertically interconnected with connectors on multiple housings through an integrated antenna microstrip board, realizing dual polarization, high integration, and high reliability of the antenna component; the fabricated dual-polarization microstrip antenna component can be used in the Ka band and above, with a standing wave ratio of ≤2.0, and excellent electrical performance in the millimeter wave range;

[0025] 2. This invention enables dual-polarized antenna transmission and reception with an element spacing of 9.2mm×9.2mm, a cross-sectional thickness of ≤9.2mm, and a flatness of ≤0.2mm (root mean square). Compared with antenna arrays spliced ​​from multiple antenna elements, the flatness is improved by more than 0.2mm (root mean square), resulting in better consistency. This effectively solves the inherent technical problem of decreased electrical performance of large-size arrays caused by discontinuities and poor flatness in the microstrip network of grouped antennas.

[0026] 3. The production efficiency of the process method of the present invention is higher; compared with the process method of splicing multiple antenna elements, multiple antenna microstrips are combined into one antenna microstrip board, which effectively reduces the number of adhesive bonding times and improves production efficiency.

[0027] 4. The dual-polarized microstrip antenna assembly prepared in this invention can meet the environmental test requirements of 50 temperature cycles (-40℃ to +75℃) and 13.88g random vibration, and has good reliability and environmental adaptability, which can meet the high service environment requirements of airborne, missile-borne and spaceborne applications. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the antenna microstrip board in the comparative example;

[0029] Figure 2 This is a schematic diagram of the conductive adhesive film in the comparative example;

[0030] Figure 3 This is a schematic diagram of the welded shell structure in the comparative example;

[0031] Figure 4 This is a schematic diagram of the adapter plate in the comparative example;

[0032] Figure 5 This is a schematic diagram of the antenna array structure after it has been assembled to scale.

[0033] Figure 6 This is a schematic diagram of the antenna microstrip board in Embodiment 1;

[0034] Figure 7 This is a schematic diagram of the conductive adhesive film in Example 1;

[0035] Figure 8 This is a schematic diagram of the assembled antenna array structure in Example 1;

[0036] Figure 9 This is a schematic diagram of the process flow for the Ka / Ku dual-polarized microstrip antenna assembly in Example 1.

[0037] Figure 10 This is a top view schematic diagram of the antenna microstrip board in Example 3;

[0038] Figure 11 This is a schematic diagram of the shell structure after assembly in Example 3, viewed from below. Detailed Implementation

[0039] The above-mentioned and other technical features and advantages of the present invention will be described in more detail below with reference to the accompanying drawings.

[0040] Comparative Example

[0041] The structural design of the Ka / Ku dual-polarized microstrip antenna assembly in the comparison example is shown below. Figure 1-5The antenna assembly comprises four antenna elements. Each Ka / Ku dual-polarized microstrip antenna assembly includes 64 Ku-band elastic connectors 11 and 64 Ka-band elastic connectors 9. The structure, from top to bottom, consists of four 64-element antenna microstrip boards 1 (32 elements each for Ku and Ka bands), a large-area bottom layer 3 of the antenna microstrip board, contact pads 2 that contact the connectors, four conductive films 4 with first mounting through holes 5, and four housings 7 with elastic connectors soldered on them. Multiple partially silver-plated grooves 10 are formed on the housings 7. Each groove 10 is fixed with a Ku-band elastic connector 9 or a Ka-band elastic connector 11 by solder paste 8. The elastic connector includes an outer conductor, a glass sintered body, a PTFE insulating dielectric sleeve 12, an elastic mechanism, and an inner conductor 6 (the glass sintered body and the elastic mechanism are internal structures and are not shown in the figure).

[0042] Comparative antenna assembly according to Figure 5 The antenna is assembled in a manner where one antenna microstrip board is paired with one set of housings 7 to form an antenna assembly. Four sets of antenna assemblies are spliced ​​together to form an antenna array. The antenna array includes, from bottom to top, a KK adapter connector 15, screws 16, an adapter plate 13, and its second mounting through hole 14.

[0043] The comparative process flow is as follows: 62Sn36Pb2Ag solder paste 8 is applied to the groove 10 of the partially silver-plated housing 7; Ka-band flexible connector 11 and Ku-band flexible connector 9 are installed into the groove 10 of the housing 7 using a fixture, and the welding fixture is assembled; the flexible connectors are interconnected with the housing using vacuum phase welding; a conductive adhesive film 4 (CF3350) is laid on the 64-element antenna microstrip board 1; the antenna microstrip board 1 is mounted on the housing 7 with the connectors soldered on, and assembled into the adhesive welding fixture; the conductive adhesive film 4 is cured by vacuum bag pressing at 120℃ for 2 hours. Four antenna elements are assembled on the adapter plate 13 to form an antenna array. The antenna array is protected by vapor deposition and then assembled with the adapter plate 13 using screws 16. The tolerance between the elements after assembly is ±0.075mm.

[0044] Example 1

[0045] This embodiment provides a technical solution: a method for manufacturing a millimeter-wave one-to-many dual-polarized dual-band antenna assembly, such as... Figure 6-9 As shown, it includes the following steps:

[0046] Step 1: Manufacturing the integrated antenna microstrip board 17;

[0047] The antenna microstrip board 17 includes all antenna patterns and composite networks for dual-polarization and dual-band; in this embodiment, the antenna microstrip board 17 is a 256-element antenna.

[0048] The antenna microstrip board 17 has a multi-layer structure. The upper part is a low-frequency antenna layer and the lower part is a high-frequency antenna layer. Both the low-frequency antenna layer and the high-frequency antenna layer have vertical interconnection contact pads 2 on the bottom layer of the multi-layer antenna microstrip board 17. The contact pads 2 are interconnected with the inner conductor 6 of the elastic connector.

[0049] The antenna microstrip board 17 has a large-area ground layer laid on the bottom layer, the thickness of the large-area bottom metal is ≥45um, and the radius of the isolation area between the large-area ground layer and the contact pad 2 is ≥0.25mm.

[0050] The external dimensions of the antenna microstrip board 17 are consistent with the overall external dimensions after the multiple housings 7 are spliced ​​together. The warpage of the antenna microstrip board 17 should be ≤0.5%, and the thickness should be ≥2.0mm.

[0051] Step 2: The elastic connector is welded and fixed in the groove 10 of the housing 7 using the solder paste 8 dot application process;

[0052] After applying solder paste 8 to the inside of the groove 10, the elastic connector is manually transferred into the groove 10, and the installation is judged by whether the end face of the housing 7 is flush with the end face of the housing 7. The welding fixture is installed to fix the position of the elastic connector and the housing 7. Then the fastening device is installed and the welding fixture is tightened, and the welding operation can be carried out.

[0053] The interconnection between the elastic connector and the housing 7 is completed by one of the following methods: vacuum phase welding, hot air reflow welding, or vacuum reflow welding, with a penetration rate of ≥70%. After welding, the welding fixture is removed, and the housing 7 is ultrasonically cleaned and dried.

[0054] The housing 7 is made of aluminum alloy, for example, 5A06 aluminum alloy;

[0055] The groove 10 of the housing 7 is partially silver-plated, and the other parts outside the groove 10 are conductively oxidized. A solder paste 8 laying surface is provided in the groove 10 according to the shape of the elastic connector. The width of the laying surface is 120% to 150% of the width of the spot solder paste 8. The composition of the spot solder paste 8 is one of 62Sn36Pb2Ag, SAC305, and Sn54Pb26In20.

[0056] The flexible connectors welded in each housing 7 include Ku-band flexible connectors 9 and Ka-band flexible connectors 11; and the number of Ku-band flexible connectors 9 and Ka-band flexible connectors 11 in each housing 7 is 64.

[0057] The flexible connector includes a flexible mechanism, an insulating medium, a glass sintered body, a PTFE insulating medium sleeve 12, an outer conductor, and an inner conductor 6. The outer conductor is made of either brass or Kovar alloy and is gold-plated. The inner conductor 6 is made of either beryllium bronze or Kovar alloy and is gold-plated. The flexible mechanism is made of either beryllium bronze or Kovar alloy. The insulating medium is made of either glass or PTFE, or a combination of both.

[0058] Step 3: Lay the conductive adhesive film 18 on the antenna microstrip board 17 and install the positioning pins;

[0059] The antenna microstrip board 17 is pre-baked to ensure its dryness. The drying temperature is 110-130℃ and the drying time is 1.5-4.5 hours.

[0060] The conductive adhesive film 18 is cut into a shape consistent with the housing 7 by laser cutting. The installation area of ​​the elastic connector and the positioning pin is hollowed out, namely the first mounting through hole 5, to avoid interference with the conductive adhesive film 18. The hollowed-out size at the elastic connector is the radius of the contact pad 2 plus 0.05 to 0.15 mm. Then the cut conductive adhesive film 18 is laid on the bonding surface of the antenna microstrip board 17 and the positioning pin is assembled.

[0061] The process parameters for the outer shape cutting are set as follows: laser power 10-20W, laser frequency 50-70KHz, processing speed 1000-1500mm / s, number of scans 30-50, and spot diameter 0.01-0.03mm; the process parameters for the hole making are set as follows: laser power 10-15W, laser frequency 50-70KHz, processing speed 1000-1500mm / s, number of scans 5-10, and spot diameter 0.01-0.04mm.

[0062] The number of conductive adhesive films 18 is the same as the number of shells 7; the conductive adhesive films 18 are one of Henkel's CF3350, Zhonglan Chenguang's CSJM8272, and Heilongjiang Petrochemical Research Institute's J-468;

[0063] Step 4: Install the four sets of antenna microstrip boards onto the housing 7 with the connectors soldered on using positioning pins to form an antenna unit;

[0064] Multiple sets of welded housings 7 are assembled onto an antenna microstrip board 17. Then, several sets of assembled antenna microstrip boards 17 and housings 7 are combined and assembled in a bonding fixture to complete the splicing assembly. The bonding fixture and additional fastening device ensure tight contact between the antenna microstrip board 17 and the conductive film 18, the conductive film 18 and the housing 7, and the inner conductor 6 of the elastic connector and the antenna microstrip board 17.

[0065] Step 5: The conductive adhesive film 18 is cured by vacuum bag pressing, the antenna microstrip board 17 and the housing 7 are bonded together, the inner conductor 6 of the elastic connector is kept in close contact with the antenna microstrip board 17 to form the antenna array, and vapor deposition protection is performed.

[0066] The assembled adhesive bonding fixture and antenna microstrip board 17 are placed in a vacuum bag and then placed in a vacuum autoclave for curing. The curing conditions are: pressure 0.1 MPa, temperature 120-130℃, curing time 1.5-3 hours.

[0067] Subsequently, the antenna array was protected by vapor deposition using Parylene C as the vapor deposition material.

[0068] Step 6: Connect the antenna array to the adapter board 13, and connect the flexible connector to the transceiver system using the KK adapter connector 15;

[0069] The adapter plate 13 has a second mounting through hole 14 corresponding to the position of the elastic connector. After hot pressing, the adhesive tooling is removed, and the assembled antenna array is installed on the overall adapter plate 13 with screws 16. The screws 16 pass through the adapter plate 13 and do not penetrate the antenna array.

[0070] After the antenna array is assembled, the connector on the housing 7 is interconnected with the transceiver subsystem via the KK adapter connector 15.

[0071] The Ka / Ku dual-polarized microstrip antenna assembly in this embodiment has a Ka-band element VSWR ≤1.8 and a Ku-band element VSWR ≤2.0. The cross-sectional thickness is ≤9.2mm, and the flatness is ≤0.2mm (RMS). It can meet the environmental test requirements of 50 temperature cycles (-40℃ to +75℃) and 13.88g random vibration, demonstrating good reliability and environmental adaptability.

[0072] Example 2

[0073] like Figure 6-9 As shown, the dual-polarized dual-band antenna assembly in this embodiment includes 4 antenna units. The antenna unit is a Ka / Ku dual-polarized antenna microstrip unit, which includes 64 Ku-band elastic connectors 9 and 64 Ka-band elastic connectors 11. Its structure from top to bottom is 1 antenna microstrip board with 256 units

[17] , 1 conductive film with first mounting through hole 5

[18] , and 4 housings 7 with elastic connectors welded on. The housing 7 has multiple second mounting through holes 14, and the multiple second mounting through holes 14 correspond one-to-one with multiple sets of elastic connectors.

[0074] In this embodiment, one antenna unit is formed by splicing four sets of housings 7 with one microstrip board. The antenna unit is locked and installed to the adapter plate 13 by screws 16.

[0075] In this embodiment, the fabrication process of the housing 7 is the same as that of the comparative example. A conductive adhesive film 18 (model CSJM8272) is laid on the 256-element antenna microstrip board 17. One set of antenna microstrip boards 17 is assembled with four sets of housings 7 with welded elastic connectors, and then assembled into a bonding fixture. The conductive adhesive film 18 is cured by vacuum bag pressing at 120°C for 2 hours. One set of antenna elements is assembled on the adapter plate to form an antenna array. The antenna array is protected by vapor deposition and then assembled with the adapter plate using screws. After assembly, the tolerance between the antenna elements is ±0.05mm.

[0076] S107. This Ka / Ku dual-polarized microstrip antenna assembly exhibits a Ka-band element VSWR ≤1.8 and a Ku-band element VSWR ≤2.0. The profile thickness is ≤9.2mm, and the flatness is ≤0.2mm (RMS). It meets the environmental test requirements for 50 temperature cycles (-40℃~+75℃) and 13.88g random vibration, demonstrating good reliability and environmental adaptability.

[0077] Example 3

[0078] like Figure 10-11 As shown, the antenna unit in this embodiment is divided into two types: a first housing 21 and a second housing 23. The first housing 21 contains 96 sets of Ku-band flexible connectors 20 and 96 sets of Ka-band flexible connectors 22, totaling 2 sets. The second housing 23 contains 48 sets of Ku-band flexible connectors and 48 sets of Ka-band flexible connectors, totaling 2 sets. Furthermore, the antenna microstrip board 19 in this embodiment has the same shape as the four assembled housings, forming a 288-element antenna. The assembled antenna array is shown in the image. Figure 11 As shown (the number of connectors has been reduced in the schematic diagram to optimize the display effect).

[0079] The process flow of this embodiment is as follows: 62Sn36Pb2Ag solder paste is applied to the grooves of the partially silver-plated housing; the corresponding number of Ka-band flexible connectors 22 and Ku-band flexible connectors 20 are installed into the grooves of the housing using a tooling, and the welding tooling is assembled; the interconnection between the connectors and the housing is completed by hot air reflow soldering; a conductive adhesive film, model J-468, is laid on the 288-element antenna microstrip board 19; the antenna microstrip board 19 is installed on the housing with the soldered connectors using positioning pins and assembled into the adhesive tooling; the conductive adhesive film is cured by vacuum bag pressing at 130°C for 1.5 hours; one set of antenna elements is assembled on the adapter board to form an antenna array; the antenna array is protected by vapor deposition and then assembled with the adapter board by screws; after assembly, the tolerance between the antenna elements is ±0.045mm.

[0080] In this embodiment, the standing wave ratio of the Ka-band unit is ≤1.8 and the standing wave ratio of the Ku-band unit is ≤2.0; the profile thickness is ≤9.2mm and the flatness is ≤0.2mm (root mean square); it can meet the environmental test requirements of 50 temperature cycles (-40℃~+75℃) and 13.88g random vibration, and has good reliability and environmental adaptability.

[0081] The above description is merely a preferred embodiment of the present invention and is illustrative rather than restrictive. Those skilled in the art will understand that many changes, modifications, and even equivalents can be made within the spirit and scope defined by the claims of the present invention, all of which will fall within the protection scope of the present invention.

Claims

1. A method for manufacturing a millimeter-wave one-to-many dual-polarized dual-band antenna assembly, characterized in that: Includes the following steps: Step 1: Manufacturing an integrated antenna microstrip board; Step 2: The elastic connector is welded and fixed in the groove of the housing using a solder paste dot application process; Step 3: Lay conductive adhesive film on the antenna microstrip board and install positioning pins; Step 4: Install the four sets of antenna microstrip boards onto the housing with soldered connectors using positioning pins to form an antenna unit; Step 5: The conductive adhesive film is cured by vacuum bag pressing, the antenna microstrip board and the housing are bonded together, the inner conductor of the elastic connector is kept in close contact with the antenna microstrip to form the antenna array, and vapor deposition protection is performed. Step 6: Connect the antenna array to the adapter board, and use the KK adapter connector to connect the flexible connector to the transceiver system; The antenna microstrip board has a multi-layer structure, with the upper part being a low-frequency antenna layer and the lower part being a high-frequency antenna layer. Both the low-frequency and high-frequency antenna layers have vertical interconnection contact pads on the bottom layer of the multi-layer antenna microstrip board, and the contact pads are interconnected with the inner conductor of the elastic connector. The antenna microstrip board has a large-area ground layer laid on the bottom layer, with a metal thickness of ≥45um and an isolation area radius of ≥0.25mm between the large-area ground layer and the contact pads. In step five, the assembled adhesive bonding fixture and antenna microstrip board are placed in a vacuum bag and then placed in a vacuum autoclave for curing. The curing conditions are: pressure 0.1 MPa, temperature 120~130℃, curing time 1.5~3 hours.

2. The manufacturing method of a millimeter-wave one-to-many dual-polarized dual-band antenna assembly according to claim 1, characterized in that, In step two, the welding is performed using one of the following methods: vacuum phase welding, hot air reflow welding, or vacuum reflow welding, to interconnect the elastic connector and the housing, with a penetration rate of ≥70%.

3. The method for manufacturing a millimeter-wave one-to-many dual-polarized dual-band antenna assembly according to claim 1, characterized in that, In step two, a solder paste laying surface is provided in the groove according to the shape of the elastic connector. The width of the laying surface is 120% to 150% of the width of the spot solder paste. The composition of the spot solder paste is one of 62Sn36Pb2Ag, SAC305, and Sn54Pb26In20.

4. The manufacturing method of a millimeter-wave one-to-many dual-polarized dual-band antenna assembly according to claim 1, characterized in that, In step three, the antenna microstrip board is pre-baked at a temperature of 110~130℃ for 1.5~4.5 hours.

5. The method for manufacturing a millimeter-wave one-to-many dual-polarized dual-band antenna assembly according to claim 1, characterized in that, The external dimensions of the antenna microstrip board are consistent with the overall external dimensions after multiple housings are spliced ​​together. The warpage of the antenna microstrip board should be ≤0.5%, and the thickness should be ≥2.0mm.

6. The method for manufacturing a millimeter-wave one-to-many dual-polarized dual-band antenna assembly according to claim 1, characterized in that, In step six, the vapor deposition material used for vapor deposition protection of the antenna array is Parylene C.

7. A pair of multiple dual-polarized dual-band antennas manufactured using the manufacturing method of a pair of multiple dual-polarized dual-band antennas as described in any one of claims 1-6.

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