An encapsulation substrate testing device and a testing method

Abstract

The present invention provides a packaging substrate testing device and a testing method. The testing device includes: a packaging substrate, a feeding mechanism, a pre-alignment mechanism, a testing mechanism and a laser mechanism. A hollowed-out portion is formed on the packaging substrate; the feeding mechanism, the pre-alignment mechanism and the laser mechanism all include a carrying platform and a sensor located below the carrying platform. A notch exposing the sensor is formed in the carrying platform, and the size of the sensor is larger than the size of the hollowed-out portion; the sensor in the testing mechanism includes an adjustable light-emitting mechanism and a fixed light-receiving portion oppositely arranged at two ends of the carrying platform along the X direction, the notch is located on the optical path between the two, and the size of the sensor is larger than the size of the hollowed-out portion. In the present invention, the sensors in the feeding mechanism, the pre-alignment mechanism, the testing mechanism and the laser mechanism are improved, so that the testing device can test packaging substrates of various sizes, reduce the alarm frequency of the testing device, improve the recognition accuracy and enhance the testing efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of packaging substrate manufacturing, and particularly to a packaging substrate testing device and a testing method. Background Art

[0002] As an indispensable detection process in the packaging substrate manufacturing process, electrical testing can detect performance defects of the packaging substrate, thereby improving the yield of products and preventing defective packaging substrates from flowing into subsequent processes or even to the client. The testing performance of the electrical testing machine is directly related to the yield of products.

[0003] There are certain design defects in the sensors in the existing testing machines in the loading mechanism, pre-alignment mechanism, testing mechanism, and laser mechanism. When detecting some hollowed-out boards, the sensors cannot effectively identify and sense, resulting in the machine stopping operation, unable to test, and substrate damage. Among them, as Figures 1-4 shown, they are respectively the structural schematic diagram of the loading mechanism, the state schematic diagram of identifying the packaging substrate, the structural schematic diagram of the pre-alignment mechanism, and the structural schematic diagram of the laser mechanism. The sensors in the loading mechanism, pre-alignment mechanism, and laser mechanism emit dot-shaped infrared rays. When the infrared rays pass through the hollowed-out part of the substrate, they pass through the substrate, and the sensors cannot receive the reflected light, causing the machine to fail to identify the substrate, resulting in the machine alarming and stopping running. As Figure 5 shown, it is the structural schematic diagram of the testing mechanism. In the testing mechanism, the sensor identifies the substrate based on whether the light receiving part of the sensor located at one end of the machine table can receive the infrared light emitted by the light emitting part at the other end. When a substrate is placed on the testing machine table, when the infrared rays pass through the hollowed-out part of the substrate, the infrared light passes through the hollowed-out part of the substrate and reaches the other end, causing the sensor at the other end of the machine to receive the infrared light, resulting in the machine being unable to identify the substrate, thus causing the testing device to alarm or stop running, seriously affecting the testing efficiency.

[0004] Therefore, there is an urgent need for a packaging substrate testing device with accurate identification and high testing efficiency. Summary of the Invention

[0005] In view of the above-mentioned disadvantages of the prior art, the purpose of the present invention is to provide a packaging substrate testing device and a testing method, which are used to solve the problems of inaccurate identification and low testing efficiency of the packaging substrate testing device in the prior art.

[0006] To achieve the above purpose and other related purposes, the present invention provides a packaging substrate testing device, including:

[0007] A packaging substrate, provided with at least one hollowed-out part;

[0008] The loading mechanism includes a first carrier and a first sensor located below the first carrier. A first notch is formed in the first carrier to expose the first sensor, and the size of the first sensor is larger than that of the hollowed-out portion.

[0009] The pre-alignment mechanism includes a second carrier and a second sensor located below the second carrier. A second notch is formed in the second carrier to expose the second sensor, and the size of the second sensor is larger than that of the hollowed-out portion.

[0010] The testing mechanism includes a third sensor and a third carrier. A third notch is formed in the third carrier. The third sensor includes an adjustable light-emitting mechanism and a fixed light-receiving portion that are oppositely arranged at both ends of the third carrier along the X direction. The third notch is located on the optical path between the light-emitting mechanism and the light-receiving portion, and the size of the third sensor is larger than that of the hollowed-out portion.

[0011] The laser mechanism includes a fourth carrier and a fourth sensor located below the fourth carrier. A fourth notch is formed in the fourth carrier to expose the fourth sensor, and the size of the fourth sensor is larger than that of the hollowed-out portion.

[0012] Optionally, the loading mechanism further includes stoppers arranged around the first carrier.

[0013] Optionally, the pre-alignment mechanism further includes first clamping arms that are oppositely arranged on both sides of the second carrier along the X direction.

[0014] Optionally, the laser mechanism further includes second clamping arms that are oppositely arranged on both sides of the fourth carrier along the X direction.

[0015] Optionally, the first sensor includes a strip-shaped sensor; the second sensor includes a strip-shaped sensor; the fourth sensor includes a strip-shaped sensor.

[0016] Optionally, the light-emitting mechanism includes a sliding groove, a moving bracket, and a light-emitting portion.

[0017] Optionally, the sliding groove is fixed to the edge of the third carrier, the moving bracket is located on the sliding groove, and the light-emitting portion is fixed to the moving bracket.

[0018] Optionally, the light-emitting portion includes a laser emitter.

[0019] Optionally, the moving bracket includes a liftable baffle and a base. The base slides along the sliding groove, and the light-emitting portion is fixed to the top of the baffle.

[0020] The present invention also provides a method for testing a packaging substrate, which is characterized by including the following steps:

[0021] Provide the above-mentioned packaging substrate testing device, set the test parameters, place the packaging substrate to be tested into the loading mechanism and start the packaging substrate testing device;

[0022] The first sensor recognizes the packaging substrate and activates the conveying function to convey the packaging substrate to the pre-alignment mechanism;

[0023] After the second sensor recognizes the packaging substrate conveyed from the loading mechanism, perform pre-alignment adjustment on the packaging substrate, and convey the packaging substrate to the testing mechanism after the pre-alignment adjustment is completed;

[0024] After the third sensor recognizes the packaging substrate, activate the testing function and perform electrical testing on the packaging substrate, and convey the packaging substrate to the laser mechanism after the electrical testing is completed;

[0025] After the fourth sensor recognizes the packaging substrate, activate the laser mechanism and perform laser operation on the packaging substrate.

[0026] Optionally, the process of setting the test parameters of the packaging substrate includes the step of adjusting the positions of the baffle, the base, and the light emitting part in the moving bracket based on the size of the packaging substrate.

[0027] Optionally, after performing the laser operation on the packaging substrate, it further includes the step of conveying the packaging substrate to the unloading mechanism.

[0028] As described above, the encapsulation substrate testing device and testing method of the present invention have the following beneficial effects: By respectively arranging the first sensor, the second sensor, the third sensor, and the fourth sensor with sizes larger than the size of the hollow part in the feeding mechanism, the pre-alignment mechanism, the testing mechanism, and the laser mechanism, the light emitted by the sensors cannot completely pass through the hollow part, so that the first sensor, the second sensor, and the fourth sensor receive the reflected light, and the third sensor cannot completely receive the emitted light, realizing the identification of the encapsulation substrate, and avoiding the alarm and stop of the testing device caused by the inability to identify the encapsulation substrate; In the testing mechanism, by arranging the moving bracket and the sliding groove at the position of the light emitting part on the surface of the third carrier, the base in the moving bracket can move along the sliding groove, and the size of the testing area on the surface of the third carrier is adjusted by moving the moving bracket along the sliding groove. By lifting the moving bracket, the position of the light emitting part is adjusted to enable the third sensor to work normally, and the testing mechanism can perform electrical tests on encapsulation substrates of various sizes. In addition, the encapsulation substrate testing device composed of the feeding mechanism, the pre-alignment mechanism, the testing mechanism, and the laser mechanism has a simple structure, is practical and stable, reduces the frequency of alarm and stop of the testing device, improves the recognition accuracy, and improves the testing efficiency. Therefore, the present invention effectively overcomes various shortcomings in the prior art and has high industrial utilization value. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 Shows a schematic structural diagram of the feeding mechanism.

[0030] Figure 2 Shows a schematic diagram of the identification state of the encapsulation substrate.

[0031] Figure 3 Shows a schematic structural diagram of the pre-alignment mechanism.

[0032] Figure 4 Shows a schematic structural diagram of the laser mechanism.

[0033] Figure 5 Shows a schematic structural diagram of the testing mechanism.

[0034] Figure 6 Shows a schematic structural diagram of the feeding mechanism of the encapsulation substrate testing device of the present invention.

[0035] Figure 7 Shows a schematic diagram of the identification state of the encapsulation substrate of the encapsulation substrate testing device of the present invention.

[0036] Figure 8Shown is a schematic structural view of the pre-alignment mechanism of the packaging substrate testing device of the present invention.

[0037] Figure 9 Shown is a schematic structural view of the testing mechanism of the packaging substrate testing device of the present invention.

[0038] Figure 10 Shown is a schematic structural view of the laser mechanism of the packaging substrate testing device of the present invention.

[0039] Figure 11 Shown is a schematic view of the packaging substrate testing process of the present invention.

[0040] Component label description

[0041] 01 Packaging substrate

[0042] 011 Hollow part

[0043] 02 Loading mechanism

[0044] 021 First carrier

[0045] 022 First sensor

[0046] 023 First notch

[0047] 024 Stopper

[0048] 03 Pre-alignment mechanism

[0049] 031 Second carrier

[0050] 032 Second sensor

[0051] 033 Second notch

[0052] 034 First clamping arm

[0053] 04 Testing mechanism

[0054] 041 Third carrier

[0055] 042 Third sensor

[0056] 0421 Light emission mechanism

[0057] 0421a Light emission part

[0058] 0421b Fixed bracket

[0059] 0422 Light receiving part

[0060] 043 Third notch

[0061] 05 Laser mechanism

[0062] 051 Fourth carrier

[0063] 052 Fourth sensor

[0064] 053 Fourth notch

[0065] 054 Fourth clamping arm

[0066] 1 Encapsulation substrate

[0067] 11 Hollow part

[0068] 2 Loading mechanism

[0069] 21 First carrier

[0070] 22 First sensor

[0071] 23 First notch

[0072] 24 Stop block

[0073] 3 Pre-alignment mechanism

[0074] 31 Second carrier

[0075] 32 Second sensor

[0076] 33 Second notch

[0077] 34 First clamping arm

[0078] 4 Testing mechanism

[0079] 41 Third carrier

[0080] 42 Third sensor

[0081] 421 Light emitting mechanism

[0082] 421a Light emitting part

[0083] 421b Moving bracket

[0084] 421c Slide groove

[0085] 422 Light receiving part

[0086] 43 Third notch

[0087] 5 Laser mechanism

[0088] 51 Fourth carrier

[0089] 52 Fourth sensor

[0090] 53 Fourth notch

[0091] 54 Fourth clamping arm Detailed implementation mode

[0092] The following specific embodiments illustrate the implementation manners of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0093] Please refer to Figures 1 to 11 . It should be noted that the structures, ratios, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those skilled in the art to understand and read, and are not used to limit the implementation conditions of the present invention. Therefore, they do not have technical essential meanings. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope that can be covered by the technical content disclosed in the present invention. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" cited in this specification are only for the convenience of clear narration, and are not used to limit the implementation scope of the present invention. The change or adjustment of their relative relationships, without substantial change of the technical content, should also be regarded as the implementation scope of the present invention.

[0094] Embodiment 1

[0095] The present invention provides a package substrate testing device, and the package substrate testing device includes: a package substrate 1, a loading mechanism 2, a pre-alignment mechanism 3, a testing mechanism 4 and a laser mechanism 5. Among them, at least one hollow part 11 is formed in the package substrate 1; the loading mechanism 2 includes a first carrier 21 and a first sensor 22 located below the first carrier 21. A first notch 23 exposing the first sensor 22 is formed in the first carrier 21, and the size of the first sensor 22 is larger than the size of the hollow part 11; the pre-alignment mechanism 3 includes a second carrier 31 and a second sensor 32 located below the second carrier 31. A second notch 33 exposing the second sensor 32 is formed in the second carrier 31, and the size of the second sensor 32 is larger than the size of the hollow part 11; the testing mechanism 4 includes a third carrier 41 and a third sensor 42. A third notch 43 is formed in the third carrier 41. The third sensor 42 includes an adjustable light emitting mechanism 421 and a fixed light receiving part 422 oppositely arranged at two ends of the third carrier 41 along the X direction. The third notch is on the optical path between the light emitting mechanism 421 and the light receiving part 422, and the size of the third sensor 42 is larger than the size of the hollow part 11; the laser mechanism 5 includes a fourth carrier 51 and a fourth sensor 52 located below the fourth carrier 51. A fourth notch 53 exposing the fourth sensor 52 is formed in the fourth carrier 51, and the size of the fourth sensor 52 is larger than the size of the hollow part 11.

[0096] Specifically, the testing device further includes a conveying device (not shown) for conveying the packaging substrate 1 to a preset position.

[0097] Specifically, when the conveying device can convey the packaging substrate 1, the type of the conveying device can be selected according to the actual situation and is not limited herein.

[0098] Specifically, as Figure 6 shown, it is a schematic structural diagram of the loading mechanism 2. When the first carrier 21 can carry the packaging substrate 1, the material, size and shape of the first carrier 21 can be selected according to the actual situation and are not limited herein.

[0099] Specifically, as Figure 7 shown, it is a schematic diagram of the identification state of the packaging substrate 1. The number, shape and size of the hollow portions 11 on the packaging substrate 1 can be set according to the actual situation and are not limited herein.

[0100] As an example, the loading mechanism 2 further includes stoppers 24 disposed around the first carrier 21.

[0101] Specifically, the upper surface of the first carrier 21 includes at least four such stoppers 24.

[0102] Specifically, the shape of the stopper 24 includes a T shape or other suitable shapes.

[0103] Specifically, the stopper 24 is used to prevent the movement of the packaging substrate 1 on the carrier 21, and prevent the packaging substrate 1 from falling or sliding, resulting in damage to the packaging substrate 1.

[0104] Specifically, when the stopper 24 can prevent the movement of the packaging substrate 1, the size and material of the stopper 24 can be selected according to the actual situation and are not limited herein.

[0105] Specifically, the shape of the first sensor 22 includes a circular shape, a square shape or other suitable shapes.

[0106] As an example, the first sensor 22 includes a strip-shaped sensor or other suitable sensors.

[0107] Specifically, the size of the first sensor 22 can be adjusted according to the size of the packaging substrate 1 and the size of the hollow portion 11.

[0108] Specifically, the first sensor 22 located below the first carrier 21 can both receive and emit optical signals, and the first sensor 22 identifies the packaging substrate 1 by receiving the optical signal reflected by the packaging substrate 1.

[0109] Specifically, when the first sensor 22 can identify the packaging substrate 1, the material and position of the first sensor 22 can be selected according to the actual situation, which is not limited here. In this embodiment, the first sensor 22 is located at the central position of the area below the first carrier 21.

[0110] Specifically, the first notch 23 exposes the first sensor 22, enabling the emitted light of the first sensor 22 to completely pass through the first notch 23, so as to perform inductive identification of the packaging substrate 1.

[0111] Specifically, when the light emitted by the first sensor 22 completely passes through the first notch 23, the position and size of the first notch 23 can be selected according to the actual situation, which is not limited here. In this embodiment, the first notch 23 is located at the central position of the area below the first carrier 21.

[0112] Specifically, the size of the first sensor 22 is larger than the size of the hollowed-out portion 11, so that the light emitted by the first sensor 22 cannot completely pass through the hollowed-out portion 11, and then part of the light is reflected back and received by the first sensor 22, thereby identifying the packaging substrate 1, avoiding the light completely passing through the hollowed-out portion 11, resulting in the first sensor 22 being unable to identify and causing the testing device to alarm and stop running, reducing the alarm frequency of the testing device, improving the identification accuracy, enhancing the testing efficiency, ensuring the smooth progress of the subsequent testing process, and the feeding mechanism 2 is composed of the first carrier 21, the first sensor 22, the first notch 23 and the stopper 24, with a simple structure, practical and stable.

[0113] As an example, as Figure 8 shown, it is a schematic structural diagram of the pre-alignment mechanism 3. The pre-alignment mechanism 3 further includes first clamping arms 34 oppositely arranged on both sides of the second carrier 31 along the X direction.

[0114] Specifically, through the combined action of the first clamping arms 34, the position of the packaging substrate 1 is corrected to the preset area of the pre-alignment mechanism 3.

[0115] Specifically, at least two first clamping arms 34 are included on the second carrier 31.

[0116] Specifically, the shape of the first clamping arm 34 includes a strip shape or other suitable shapes.

[0117] Specifically, when the first clamping arm 34 can correct the position of the packaging substrate 1, the size and material of the first clamping arm 34 can be selected according to the actual situation and are not limited herein.

[0118] Specifically, when the second carrier 31 can carry the packaging substrate 1, the material, size and shape of the second carrier 31 can be selected according to the actual situation and are not limited herein.

[0119] Specifically, the shape of the second sensor 32 includes a circular shape, a square shape or other suitable shapes.

[0120] As an example, the second sensor 32 includes a strip-shaped sensor or other suitable sensors.

[0121] Specifically, the size of the second sensor 32 can be adjusted according to the size of the packaging substrate 1 and the size of the hollow portion 11.

[0122] Specifically, the second sensor 32 located below the second carrier 31 can receive optical signals and also emit optical signals, and the second sensor 32 identifies the packaging substrate 1 by receiving the optical signals reflected by the packaging substrate 1.

[0123] Specifically, when the second sensor 32 can identify the packaging substrate 1, the position and material of the second sensor 32 can be selected according to the actual situation and are not limited herein. In this embodiment, the second sensor 32 is located at the center of the area below the second carrier 31.

[0124] Specifically, the second notch 33 exposes the second sensor 32, enabling the emitted light of the second sensor 32 to completely pass through the second notch 33, so as to perform inductive identification of the packaging substrate 1.

[0125] Specifically, when the light emitted by the second sensor 32 completely passes through the second notch 33, the position and size of the second notch 33 can be selected according to the actual situation and are not limited herein. In this embodiment, the second notch 33 is located at the center of the area below the second carrier 31.

[0126] Specifically, the size of the second sensor 32 is larger than that of the hollowed-out portion 11, so that part of the light is reflected back and received by the second sensor 32, thereby identifying the packaging substrate 1, avoiding the alarm and stoppage of the test device due to the inability of the light to be reflected, reducing the alarm frequency of the test device, improving the recognition accuracy rate, and enhancing the test efficiency of the test device; the pre-alignment mechanism 3 is composed of the second carrier 31, the second sensor 32, the second notch 33 and the first clamping arm 34, with a simple structure, practicality and stability.

[0127] Specifically, as Figure 9 shown, it is a schematic structural diagram of the test mechanism 4. When the third carrier 41 can carry the packaging substrate 1, the material, size and shape of the third carrier 41 can be selected according to the actual situation and are not limited herein.

[0128] Specifically, the shape of the third sensor 42 includes a circle, a square or other suitable shapes.

[0129] Specifically, the third sensor 42 includes a strip-shaped sensor or other suitable sensors.

[0130] As an example, the light-emitting mechanism 421 includes a chute 421c, a moving bracket 421b and a light-emitting part 421a.

[0131] As an example, the chute 421c is fixed to the edge of the third carrier 41, the moving bracket 421b is located on the chute 421c, and the light-emitting part 421a is fixed to the moving bracket 421b.

[0132] Specifically, when the base can slide along the chute 421c, the size and material of the chute 421c can be selected according to the actual situation and are not limited herein.

[0133] As an example, the moving bracket 421b includes a liftable baffle and a base. The base slides along the chute 421c, and the light-emitting part 421a is fixed to the top of the baffle.

[0134] Specifically, when the third sensor 42 can identify the packaging substrate 1, the range of the liftable height of the liftable baffle can be selected according to the actual situation and is not limited herein.

[0135] As an example, the light-emitting part 421a includes a laser emitter or other suitable light-emitting devices.

[0136] Specifically, when the third sensor 42 can recognize the packaging substrate 1, the type of light emitted by the light emitting part 421a can be selected according to the actual situation and is not limited herein.

[0137] Specifically, the position of the light emitting part 421a is adjusted by the lifting of the baffle and the sliding of the base along the chute 421c, so that the third sensor 42 can work normally and the testing mechanism 4 can perform electrical tests on packaging substrates 1 of various sizes.

[0138] Specifically, the third notch 43 is used to avoid the shielding effect of the third carrier 41 on the light emitted by the light emitting part 421a. Due to the blocking of the packaging substrate 1, the light receiving part 422 cannot fully receive the emitted light, enabling the third sensor 42 to recognize the packaging substrate 1; if the emitted light completely passes through the third notch 43 and is received by the light receiving part 422, the third sensor 42 cannot recognize the packaging substrate 1, causing the testing device to alarm and stop running.

[0139] Specifically, when the light path between the light emitting mechanism 421 and the light receiving part 422 is satisfied and the emitted light of the light emitting part 421a can completely pass through, the size of the third notch 43 can be selected according to the actual situation and is not limited herein.

[0140] Specifically, the size of the sensing range of the third sensor 42 is larger than the size of the hollow part 11, so that part of the light is reflected back and the light receiving part 422 cannot fully receive the light, then the third sensor 42 recognizes the packaging substrate 1, avoiding the testing device from alarming and stopping running due to the third sensor 42 not being able to recognize the packaging substrate 1, reducing the alarm frequency of the testing device, improving the recognition accuracy, and enhancing the testing efficiency of the testing device; and the testing mechanism 4 is composed of the third carrier 41, the third sensor 42, and the third notch 43, with a simple structure, practical and stable.

[0141] As an example, as Figure 10 shown, it is a schematic structural diagram of the laser mechanism 5. The laser mechanism 5 further includes second clamping arms 54 oppositely arranged on both sides of the fourth carrier 51 along the X direction.

[0142] Specifically, through the combined action of the second clamping arms 54, the position of the packaging substrate 1 is corrected to the preset area of the laser mechanism 5.

[0143] Specifically, there are at least two second clamping arms 54 on the fourth carrier 51.

[0144] Specifically, the shape of the second clamping arm 54 includes a strip shape or other suitable shapes.

[0145] Specifically, when the second clamping arm 54 can fix the encapsulation substrate 1, the size and material of the second clamping arm 54 can be selected according to the actual situation and are not limited herein.

[0146] Specifically, when the fourth carrier 51 can carry the encapsulation substrate 1, the material, size and shape of the fourth carrier 51 can be selected according to the actual situation and are not limited herein.

[0147] Specifically, the shape of the fourth sensor 52 includes a circular shape, a square shape or other suitable shapes.

[0148] As an example, the fourth sensor 52 includes a strip-shaped sensor or other suitable sensors.

[0149] Specifically, the size of the fourth sensor 52 can be adjusted according to the size of the encapsulation substrate 1 and the size of the hollow portion 11.

[0150] Specifically, the fourth sensor 52 located below the fourth carrier 51 can receive light signals and also emit light signals, and the fourth sensor 52 identifies the encapsulation substrate 1 by receiving the light signals reflected by the encapsulation substrate 1.

[0151] Specifically, when the fourth sensor 52 can identify the encapsulation substrate 1, the material and position of the fourth sensor 52 can be selected according to the actual situation and are not limited herein. In this embodiment, the fourth sensor 52 is located at the bottom position of the area below the fourth carrier 51.

[0152] Specifically, the fourth notch 53 exposes the fourth sensor 52, so that the emitted light of the fourth sensor 52 can completely pass through the fourth notch 53, so as to perform inductive identification of the encapsulation substrate 1.

[0153] Specifically, when the light emitted by the fourth sensor 52 completely passes through the fourth notch 53, the position and size of the fourth notch 53 can be selected according to the actual situation and are not limited herein. In this embodiment, the fourth notch 53 is located at the bottom position of the area below the fourth carrier 51.

[0154] Specifically, the size of the fourth sensor 52 is larger than that of the hollowed-out portion 11, so that part of the light is reflected back and received by the fourth sensor 52, thereby identifying the packaging substrate 1. This avoids the emitted light completely passing through the hollowed-out portion 11 and causing the test device to alarm and stop, reduces the alarm frequency of the test device, improves the recognition accuracy, and enhances the test efficiency of the test device; moreover, the laser mechanism 5 is composed of the fourth carrier 51, the fourth sensor 52, the fourth notch 53 and the second clamping arm 54, with a simple structure, practical and stable.

[0155] Specifically, the test device further includes a blanking mechanism (not shown).

[0156] Specifically, the blanking mechanism is located behind the laser mechanism 4 and is used to remove the packaging substrate 1 that has passed through the above-mentioned loading mechanism 1, the pre-alignment mechanism 2, the test mechanism 3 and the laser mechanism 4, completing the entire test process and enhancing the test efficiency of the test device.

[0157] In this embodiment, by respectively arranging the first sensor 22, the second sensor 32, the third sensor 42 and the fourth sensor 52 in the loading mechanism 2, the pre-alignment mechanism 3, the test mechanism 4 and the laser mechanism 5, the sizes of the first sensor 22, the second sensor 32, the third sensor 42 and the fourth sensor 52 are all larger than that of the hollowed-out portion 11, so that the light emitted by the sensors cannot completely pass through the hollowed-out portion 11, enabling the sensors to receive reflected light or not completely receive the emitted light, realizing the recognition of the packaging substrate 1, and avoiding the test device alarming and stopping operation due to the inability to recognize the packaging substrate 1; by arranging the moving bracket 421b and the sliding groove 421c at the position of the light emitting part 421a, the base in the moving bracket 421b can move along the sliding groove 421c, and the size of the test area on the surface of the third carrier 41 is adjusted by the movement of the moving bracket 421b along the sliding groove 421c. By lifting the moving bracket 421b, the position of the light emitting part 421a is adjusted to enable the third sensor 42 to work properly, and the test mechanism 4 can perform electrical tests on packaging substrates 1 of various sizes. The sensors in the above-mentioned various mechanisms reduce the alarm frequency of the test device, improve the recognition accuracy, and enhance the test efficiency of the test device. In addition, the packaging substrate test device composed of the packaging substrate 1, the loading mechanism 2, the pre-alignment mechanism 3, the test mechanism 4 and the laser mechanism 5 has a simple structure, practical and stable.

[0158] Embodiment 2

[0159] The present invention also provides a method for testing a packaging substrate, as Figure 11 shown, which is a schematic diagram of the test process of the packaging substrate, including the following steps:

[0160] S1: Provide the packaging substrate testing device described in Embodiment 1, set the test parameters, place the packaging substrate to be tested into the loading mechanism, and start the packaging substrate testing device;

[0161] S2: The first sensor recognizes the packaging substrate and starts the conveying function, and conveys the packaging substrate to the pre-alignment mechanism;

[0162] S3: After the second sensor recognizes the packaging substrate conveyed from the loading mechanism, perform pre-alignment adjustment on the packaging substrate, and convey the packaging substrate to the testing mechanism after the pre-alignment adjustment is completed;

[0163] S4: After the third sensor recognizes the packaging substrate, start the testing function, and perform electrical testing on the packaging substrate, and convey the packaging substrate to the laser mechanism after the electrical testing is completed;

[0164] S5: After the fourth sensor recognizes the packaging substrate, start the laser mechanism, and perform laser operation on the packaging substrate.

[0165] Specifically, execute step S1, provide the packaging substrate testing device described in Embodiment 1, set the test parameters, place the packaging substrate to be tested into the loading mechanism 2, and start the packaging substrate testing device.

[0166] Specifically, the loading method of the loading mechanism 2 includes adsorption loading or other suitable loading methods.

[0167] Specifically, execute step S2, the first sensor 22 recognizes the packaging substrate 1 and starts the conveying function, and conveys the packaging substrate 1 to the pre-alignment mechanism 3.

[0168] Specifically, the light emitted by the first sensor 22 irradiates the packaging substrate 1 through the first notch 23, and generates reflection on the lower surface of the packaging substrate 1, and the first sensor 22 receives the reflected light, thereby recognizing the packaging substrate 1.

[0169] Specifically, in the loading mechanism 2, the stopper 23 is used to prevent the packaging substrate 1 from shifting at the position of the first carrier 21, ensure that the packaging substrate 1 can pass through the loading mechanism 2 smoothly and be conveyed to the pre-alignment mechanism 3, and improve the testing efficiency of the testing device.

[0170] Specifically, the light range emitted by the first sensor 22 is larger than the size of the hollowed-out portion 11, preventing the light from being unable to be reflected and resulting in the failure to recognize the packaging substrate 1, which would cause the testing device to alarm and stop running. This reduces the alarm frequency of the testing device, improves the recognition accuracy rate, and enhances the testing efficiency of the testing device.

[0171] Specifically, when performing step S3, after the second sensor 32 recognizes the packaging substrate 1 conveyed from the loading mechanism 2, it performs pre-alignment adjustment on the packaging substrate 1, and after the pre-alignment adjustment is completed, it conveys the packaging substrate 1 to the testing mechanism 4.

[0172] Specifically, the light emitted by the second sensor 32 located below the second carrier 31 irradiates the packaging substrate through the second notch 33, and the reflected light is received by the second sensor 32, thereby recognizing the packaging substrate 1.

[0173] Specifically, the first clamping arm 34 is used to correct the position of the packaging substrate 1 on the surface of the second carrier 31, enabling the packaging substrate 1 to smoothly reach the preset position of the pre-alignment mechanism 3.

[0174] Specifically, the light range emitted by the second sensor 32 is larger than the size of the hollowed-out portion 11, preventing the light from being unable to be reflected and resulting in the failure to recognize the packaging substrate 1, which would cause the testing device to alarm and stop running. This reduces the alarm frequency of the testing device, improves the recognition accuracy rate, and enhances the testing efficiency of the testing mechanism of the testing device.

[0175] Specifically, when performing step S4, after the third sensor 42 recognizes the packaging substrate 1, it activates the testing function and performs an electrical test on the packaging substrate 1. After the electrical test is completed, it conveys the packaging substrate 1 to the laser mechanism 5.

[0176] As an example, the process of setting the test parameters of the packaging substrate 1 includes steps of adjusting the positions of the baffle, the base, and the light-emitting part 421a in the moving bracket 421b based on the size of the packaging substrate 1.

[0177] Specifically, by moving the position of the light-emitting part 421a along the sliding groove 421c using the base and raising the position of the light-emitting part 421a using the baffle, the third sensor 42 can recognize the packaging substrate 1, and the testing mechanism 4 can perform electrical tests on packaging substrates 1 of various sizes.

[0178] Specifically, the light emitted by the light emitting part 421a irradiates the surface of the packaging substrate 1. Since part of the light is reflected, the emitted light cannot completely pass through the third notch 43 to reach the light receiving part 422, so that the third sensor 42 recognizes the packaging substrate 1.

[0179] Specifically, the range of the light emitted by the light emitting part 421a is larger than the size of the hollow part 11, which avoids the situation that the emitted light cannot be completely received by the light receiving part 422, resulting in the third sensor 42 being unable to recognize the packaging substrate 1, causing the testing device to alarm and stop running, reducing the alarm frequency of the testing device, improving the recognition accuracy rate, and enhancing the testing efficiency of the testing device.

[0180] Specifically, after the third sensor 42 successfully recognizes the packaging substrate 1, an electrical test is performed on the packaging substrate 1 to screen out defective packaging substrates 1, improving the yield of subsequent device manufacturing.

[0181] Specifically, when performing step S5, after the fourth sensor 52 recognizes the packaging substrate 1, the laser mechanism 5 is started, and a laser operation is performed on the packaging substrate 1.

[0182] Specifically, the light emitted by the fourth sensor 52 located below the fourth carrier 51 irradiates the packaging substrate 1 through the fourth notch 53. The light is reflected on the lower surface of the packaging substrate 1, and the reflected light is received by the fourth sensor 52, thereby enabling the fourth sensor 52 to recognize the packaging substrate 1.

[0183] Specifically, the second clamping arm 54 is used to correct the position of the packaging substrate 1 on the surface of the fourth carrier 51, enabling the packaging substrate 1 to smoothly reach the preset position of the laser mechanism 5 and ensuring the smooth progress of the laser operation.

[0184] Specifically, after the fourth sensor 52 successfully recognizes the packaging substrate 1, a laser operation is performed on the packaging substrate 1, ensuring the smooth progress of subsequent device manufacturing.

[0185] As an example, after performing the laser operation on the packaging substrate 1, it further includes the step of conveying the packaging substrate 1 to the blanking mechanism.

[0186] In this embodiment, the testing device described in Embodiment 1 is used to test the packaging substrate 1. The first sensor 22, the second sensor 32, the third sensor 42, and the fourth sensor 52 can all recognize the packaging substrate 1, reducing the alarm frequency of the testing device, improving the recognition accuracy rate, and enhancing the testing efficiency of the testing device.

[0187] In summary, in the present invention, a first sensor, a second sensor, a third sensor, and a fourth sensor are respectively provided in the loading mechanism, the pre-alignment mechanism, the testing mechanism, and the laser mechanism. The sizes of the sensors are all larger than the size of the hollowed-out portion. After the light emitted by the sensors reaches the packaging substrate, the first sensor, the second sensor, and the fourth sensor receive the reflected light, and the third sensor cannot completely receive the emitted light, thereby identifying the packaging substrate, avoiding the alarm of the testing device and the stop of operation caused by the failure to identify the packaging substrate. In the testing mechanism, by moving the base in the moving bracket along the sliding groove, the size of the testing area on the surface of the third carrier is adjusted, realizing the electrical testing of packaging substrates of various sizes by the testing mechanism. By using the baffle in the moving bracket to lift the position of the light emitting part, the third sensor can work normally. That is, by improving the sensors in the loading mechanism, the pre-alignment mechanism, the testing mechanism, and the laser mechanism, the alarm frequency of the testing device is reduced, the recognition accuracy is improved, and the testing efficiency of the testing device is enhanced. In addition, the structure of the packaging substrate testing device composed of the loading mechanism, the pre-alignment mechanism, the testing mechanism, and the laser mechanism is simple, practical, and stable. Therefore, the present invention effectively overcomes various disadvantages in the prior art and has high industrial utilization value.

[0188] The above embodiments are only illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed by the present invention should still be covered by the claims of the present invention.

Claims

1. An encapsulation substrate testing device, characterized in that, Comprising: A packaging substrate with at least one hollowed-out part. A loading mechanism, including a first carrier table and a first sensor located below the first carrier table. A first notch exposing the first sensor is provided in the first carrier table, and the size of the first sensor is larger than the size of the hollowed-out part. A pre-alignment mechanism, including a second carrier table and a second sensor located below the second carrier table. A second notch exposing the second sensor is provided in the second carrier table, and the size of the second sensor is larger than the size of the hollowed-out part. A testing mechanism, including a third sensor and a third carrier table. A third notch is provided in the third carrier table. The third sensor includes an adjustable light-emitting mechanism and a fixed light-receiving part oppositely arranged at two ends of the third carrier table along the X direction. The third notch is on the optical path between the light-emitting mechanism and the light-receiving part, and the size of the third sensor is larger than the size of the hollowed-out part. A laser mechanism, including a fourth carrier table and a fourth sensor located below the fourth carrier table. A fourth notch exposing the fourth sensor is provided in the fourth carrier table, and the size of the fourth sensor is larger than the size of the hollowed-out part.

2. The encapsulation substrate testing device according to claim 1, wherein: The loading mechanism further includes stoppers arranged around the first carrier table.

3. The encapsulation substrate testing device according to claim 1, wherein: The pre-alignment mechanism further includes first clamping arms oppositely arranged on two sides of the second carrier table along the X direction.

4. The encapsulation substrate testing device according to claim 1, wherein: The laser mechanism further includes second clamping arms oppositely arranged on two sides of the fourth carrier table along the X direction.

5. The encapsulation substrate testing device according to claim 1, wherein: The first sensor includes a strip-shaped sensor; the second sensor includes a strip-shaped sensor; the fourth sensor includes a strip-shaped sensor.

6. The encapsulation substrate testing device according to claim 1, wherein: The light-emitting mechanism includes a chute, a moving bracket, and a light-emitting part.

7. The encapsulation substrate testing device according to claim 6, characterized in that: The chute is fixed to the edge of the third carrier table, the moving bracket is located on the chute, and the light-emitting part is fixed to the moving bracket.

8. The encapsulation substrate testing device according to claim 6, wherein: The light-emitting part includes a laser emitter.

9. The encapsulation substrate testing device according to claim 6, wherein: The moving bracket includes a liftable baffle and a base. The base slides along the chute, and the light-emitting part is fixed to the top of the baffle.

10. A test method for a packaging substrate, characterized in that, Including the following steps: Provide the packaging substrate testing device as described in any one of claims 1-9, set the test parameters, place the packaging substrate to be tested into the loading mechanism and start the packaging substrate testing device. The first sensor recognizes the packaging substrate and activates the conveying function to convey the packaging substrate to the pre-alignment mechanism. After the second sensor recognizes the packaging substrate conveyed from the loading mechanism, perform pre-alignment adjustment on the packaging substrate, and convey the packaging substrate to the testing mechanism after the pre-alignment adjustment is completed. After the third sensor recognizes the packaging substrate, activate the testing function and perform electrical testing on the packaging substrate, and convey the packaging substrate to the laser mechanism after the electrical testing is completed. After the fourth sensor recognizes the packaging substrate, activate the laser mechanism and perform laser operation on the packaging substrate.

11. The testing method of the encapsulation substrate according to claim 10, wherein: The process of setting the test parameters of the packaging substrate includes the step of adjusting the positions of the baffle, the base, and the light emitting part in the moving bracket based on the size of the packaging substrate.

12. The test method of the packaging substrate according to claim 10, wherein: After performing the laser operation on the packaging substrate, it further includes the step of conveying the packaging substrate to the blanking mechanism.

Images