A method for measuring impedance line width, computer readable storage medium

Abstract

The application relates to the technical field of circuit board production, in particular to a kind of impedance line width measuring method and computer readable storage medium.The measuring method comprises S1, the impedance information of impedance line to be measured is obtained by pre-manufacturing auxiliary manufacturing automation equipment;S2, the impedance information on pre-manufacturing auxiliary manufacturing automation equipment is obtained by computer aided manufacturing software through automation script, and the automatic line width measuring instrument program is automatically generated according to the impedance information;S3, the actual value of impedance line width on the circuit board is measured according to the automatic line width measuring instrument program;S4, the impedance line width standard value generated by the automatic line width measuring instrument program and the actual value of impedance line width measured by the production equipment are generated into a report, and whether the impedance line width of the impedance circuit board meets the requirements is judged according to the comparison value, the impedance line width measuring method can directly and accurately measure the actual value of impedance line width on the circuit board, which is beneficial to improve the production quality of the circuit board and also beneficial to improve the precision of the circuit board.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board production, and particularly relates to a method for measuring impedance line width and a computer readable storage medium. BACKGROUND

[0002] With the development of miniaturization, digitization, high frequency and multi-function of electronic equipment, the printed circuit board as the electrical interconnection in the electronic equipment is not only the problem of whether the current flows or not, but also the role as the signal transmission line. That is, the electrical test of the PCB for the transmission of high frequency signal and high speed digital signal not only measures whether the circuit (or network) is in compliance with the requirements such as on-off and short circuit, but also measures whether the characteristic impedance value and the impedance line width are within the specified qualified range. The calculation formula of the characteristic impedance is as follows:

[0003] Z0 = 87 / SQRT (εr + 1.41) x ln [(5.98h) / (0.8w + t)]

[0004] Z0: characteristic impedance of the printed conductor:

[0005] εr: dielectric constant of the insulating material:

[0006] h: medium thickness between the printed conductor and the reference surface:

[0007] w: width of the printed conductor:

[0008] t: thickness of the printed conductor.

[0009] In order to measure the impedance line width, the current way of measuring the impedance line width is to separately simulate the impedance strip on the edge of the circuit board, the impedance strip concentrates all the impedance lines on the circuit board, and the actual impedance line width on the circuit board can be obtained by measuring the impedance line width on the impedance strip, that is, the impedance line on the impedance strip represents the actual impedance line. However, due to the differences in the uniformity of the plate thickness, the uniformity of the electroplated copper thickness and the uniformity of the etching in the processing process of the circuit board, there are certain differences in the copper thickness, the medium layer thickness and the etching line width between the plate and the edge, at this time, the impedance measured on the impedance strip cannot accurately represent the impedance in the plate, especially when there is a high precision impedance control requirement, the difference cannot be ignored. In addition, the impedance strip occupies the position of the circuit board, affects the utilization rate of the circuit board, and increases the production cost. SUMMARY

[0010] The present application aims to avoid the shortcomings in the prior art and provide a method for measuring the impedance line width, which can directly and accurately measure the actual value of the impedance line width on the circuit board, thereby improving the production quality of the circuit board and the precision of the circuit board.

[0011] To achieve the above object, the present application provides the following technical solutions.

[0012] A method for measuring impedance line width is provided, comprising the following steps,

[0013] S1, obtaining impedance information of an impedance line to be measured by using pre-manufacturing auxiliary manufacturing automation equipment;

[0014] S2, obtaining the impedance information on the pre-manufacturing auxiliary manufacturing automation equipment by using computer-aided manufacturing software, and automatically generating an automatic line width measuring instrument program according to the impedance information by using an automatic script;

[0015] S3, importing the automatic line width measuring instrument program into a production device, and measuring an actual value of the impedance line width on a circuit board according to the automatic line width measuring instrument program;

[0016] S4, generating a report of a standard value of the impedance line width generated by the automatic line width measuring instrument program and the actual value of the impedance line width measured by the production device, comparing the standard value of the impedance line width with the actual value of the impedance line width according to the report, and judging whether the impedance line width of the circuit board meets the requirements according to a comparison value.

[0017] In some embodiments, the pre-manufacturing auxiliary manufacturing automation equipment is InPlan software, and the impedance information is input into an Oracle database of the InPlan software.

[0018] In some embodiments, the impedance information is saved in Gerber data in the computer-aided manufacturing software, which is InCAMpro software.

[0019] In some embodiments, the InCAMpro automatically generates the automatic line width measuring instrument program according to the Gerber data by using the automatic script.

[0020] In some embodiments, in the step S2, the automatic script further automatically generates an impedance line width test diagram according to the impedance information.

[0021] In some embodiments, in the step S4, if an absolute value of the standard value of the impedance line width and the actual value of the impedance line width is equal to 0, the impedance line width of the actual circuit board meets the requirements, otherwise, the impedance line width does not meet the requirements; when the impedance line width does not meet the requirements, an abnormality is analyzed through the report to improve the impedance line width of the circuit board.

[0022] In some embodiments, the production device measures the actual value of the impedance line width by using an automatic line width measuring instrument.

[0023] The method for measuring the impedance line width has the following beneficial effects:

[0024] (1) The impedance line width measurement method of the present application generates an impedance line width standard value by using software through impedance information, and also picks out the actual impedance line on the circuit board according to the impedance information, and the production equipment automatically measures the actual value of the impedance line width on the circuit board, and compares the impedance line width standard value and the actual value of the impedance line width to directly measure whether the impedance line on the circuit board meets the requirements, so that it is not necessary to measure the impedance line width on the impedance strip, the problem of distortion of the impedance line represented by the impedance strip is avoided, the test accuracy is improved, and automatic measurement is realized, which is convenient for large-scale production.

[0025] (2) The impedance line width measurement method of the present application directly measures the impedance line on the circuit board, and does not need to additionally set an impedance strip, that is, the method can directly measure the actual line width of the impedance line on the circuit board, and does not need to set the impedance strip for detection, so that the position of the impedance strip on the surface of the circuit board is avoided, the heat dissipation efficiency of the circuit board is improved, the weight of the circuit board is reduced, the precision of the circuit board is effectively improved, the manufacturing efficiency of the circuit board is improved, and the cost is saved.

[0026] Also provided is a computer readable storage medium storing a computer program, which, when read and run by a processor, implements the impedance line width measurement method described above BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 is an impedance line width test diagram of an embodiment. DETAILED DESCRIPTION

[0028] Preferred embodiments of the present application will be described in more detail with reference to the drawings. Although the preferred embodiments of the present application are shown in the drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present application more thorough and complete, and to fully convey the scope of the present application to those skilled in the art.

[0029] The terms used in the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular form "a", "an", and "the" used in the present application and the appended claims are intended to include the plural form, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein means and includes any or all possible combinations of one or more associated listed items.

[0030] It should be understood that, although the terms "first", "second", "third", etc. can be used herein to describe various information, these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, the first information can also be referred to as the second information, and similarly, the second information can also be referred to as the first information, without departing from the scope of the present application. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specifically limited.

[0031] Embodiment 1

[0032] In order to measure the impedance line width, the current way to measure the impedance line width is to separately simulate the impedance bar on the edge of the circuit board, and the impedance bar concentrates all the impedance lines on the circuit board. By measuring the impedance line width on the impedance bar, the actual impedance line width on the circuit board can be obtained, that is, the impedance line on the impedance bar represents the actual impedance line. However, due to the differences in the uniformity of the plate thickness, the uniformity of the plated copper thickness, and the uniformity of the etching in the processing process of the circuit board, there are certain differences in the copper thickness, the dielectric layer thickness, and the etching line width between the inside and the edge of the plate. At this time, the impedance measured on the impedance bar cannot accurately represent the impedance inside the plate, especially when there is a high-precision impedance control requirement, the difference cannot be ignored. In addition, the impedance bar occupies the position of the circuit board, affects the utilization rate of the circuit board, and increases the production cost.

[0033] In view of the above problems, the impedance line width measurement method disclosed in the embodiment includes the following steps,

[0034] S1, obtaining the impedance information of the impedance line to be measured by using pre-manufacturing auxiliary manufacturing automation equipment, which is provided by manual, such as provided by the customer;

[0035] S2, using computer-aided manufacturing software to obtain the impedance information on the pre-manufacturing auxiliary manufacturing automation equipment through an automatic script, and automatically generating an automatic line width measurement instrument program according to the impedance information. The automatic line width measurement instrument program is a calculation program, and the corresponding program can be output according to the software by those skilled in the art, which will not be described here.

[0036] S3, importing the automatic line width measurement instrument program into the production equipment, and measuring the actual value of the impedance line width on the circuit board according to the automatic line width measurement instrument program;

[0037] S4, generating a report of the impedance line width standard value generated by the automatic line width measurement instrument program and the actual value of the impedance line width measured by the production equipment, comparing the impedance line width standard value with the actual value of the impedance line width according to the report, and judging whether the impedance line width of the impedance circuit board meets the requirements according to the comparison value.

[0038] The above-mentioned impedance line width measurement method has the following advantages: the software generates impedance line width standard values from impedance information, and the actual impedance lines on the circuit board are selected according to the impedance information, the production equipment automatically measures the actual values of the impedance line width on the circuit board, and the impedance lines on the circuit board are directly measured by comparing the impedance line width standard values and the actual values of the impedance line width, so that it is not necessary to measure the impedance line width on the impedance strip, the distortion problem of the impedance lines represented by the impedance strip is avoided, the test accuracy is improved, and automatic measurement is realized, which is convenient for mass production. The impedance lines on the circuit board are directly measured, and the impedance strip is not additionally arranged, that is, the method can directly measure the actual line width of the impedance lines on the circuit board, and the impedance strip for detection is not arranged, so that the position of the impedance strip on the circuit board is avoided, the heat dissipation efficiency of the circuit board is improved, and the weight of the circuit board is reduced, the precision of the circuit board is effectively improved, the manufacturing efficiency of the circuit board is improved, and the cost is saved.

[0039] In this embodiment, the pre-manufacturing auxiliary manufacturing automation equipment is InPlan software, and the impedance information is input into the Oracle data of the InPlan software. The InPlan software is a common pre-manufacturing engineering automation software in PCB production and manufacturing, and can input the instructions sent by others such as customers into the data of the nPlan software. Therefore, the impedance information can be intelligently obtained through the InPlan software, and the production efficiency is improved.

[0040] In this embodiment, the impedance information is saved in the Oracle data of the InPlan software in the form of Gerber data. The Gerber data refers to a file data, and the Gerber data can realize file saving.

[0041] In this embodiment, the computer-aided manufacturing software is InCAMpro, and the automatic script automatically generates an automatic line width measurement program according to the Gerber data.

[0042] The above-mentioned automatic script is obtained by programming. Since the InCAMPro software can analyze the Gerber designed by the customer, the automatic script is used in the InCAMPro, the InCAMPro directly obtains the database through the automatic script, and realizes data acquisition in combination with the Gerber data of the customer.

[0043] In this embodiment, in the step S2, Figure 1 As shown in the figure, the automatic script also automatically generates an impedance line width test diagram according to the impedance information. The impedance line width test diagram is convenient for an operator to observe the impedance line standard distribution pattern.

[0044] In the step S4, if the absolute value of the impedance line width standard value and the impedance line width actual value is equal to 0, then the impedance line width of the actual circuit board meets the requirements, otherwise, it does not meet the requirements; when the impedance line width does not meet the requirements, the report is analyzed to improve the impedance line width of the circuit board.

[0045] According to the absolute value, it is directly judged whether the impedance line width meets the requirements, which is convenient for observation.

[0046] In the embodiment, the production equipment measures the impedance line width actual value by using an automatic line width measuring instrument. The automatic line width measuring instrument is, for example, XK32A automatic line width monitoring instrument, which can be purchased on the market.

[0047] Exemplarily, the following gives a chart of the impedance line width standard value and the impedance line width actual value, which is shown in Table 1.

[0048] Table 1

[0049] ABC 06A890153LA1 COMP 20220924 A 38.8208525 50.8300975 2 B 530.1391475 50.8300975 2 C 38.8208525 411.4499025 2 Measurement point Coordinate X Coordinate Y Angle Finished product Measurement method Upper tolerance Lower tolerance Film Minimum isolated line width 306.98948 121.9267425 90 7.801 1 10 10 9.97 Minimum isolated line width 79.364335 370.80661 90 7.801 1 10 10 9.97 Minimum line width 307.0437125 75.095735 0 4 1 10 10 6.16 Minimum line width 79.4185675 323.9756025 0 4 1 10 10 6.16 Minimum line spacing 297.13454 73.215925 10 4.798 2 10 10 0 Minimum line spacing 69.509395 322.0957925 10 4.798 2 10 10 0 SMD 305.550315 73.8059225 90 14 1 15 15 0 SMD 77.92517 322.68579 90 14 1 15 15 0 Unit impedance line width 298.8835775 111.3191825 135 6.2 1 8.064 8.064 0 Unit impedance line width 308.7116 96.50768 90 7.8 1 6.41 6.41 0 Break edge impedance line width 407.611835 51.52174 0 7.8 1 6.41 6.41 0 Break edge impedance line width 407.63587 49.1516675 0 6.2 1 8.06 8.06 0 Loss impedance line width 51.8024125 281.99724 78.7 6.2 1 8.064 8.064 0

[0050] According to Table 1, two impedance line width standard values and two impedance line width actual values are shown, and by comparing the upper and lower values, it can be obtained whether the impedance line width on the circuit board meets the requirements.

[0051] Embodiment 2

[0052] The computer readable storage medium disclosed in the embodiment stores a computer program, and when the computer program is read and run by a processor, the measurement method of the impedance line width in the embodiment 1 is realized.

[0053] The storage medium is integrated with the controller as an integrated control panel structure, and various electrical elements and modules such as microchips, photovoltaic conversion modules, wireless transmission modules, positioning modules and timing modules are integrated and installed thereon, which can coordinate and control the operation of each electrical device; the monitoring data can also be transmitted to the remote end in time through wireless transmission, or the remote end can be remotely controlled to realize intelligent control and monitoring; it should be noted that the electrical elements, modules and circuit connection methods used are common, and the electrical components can be purchased on the market, and the specific structure and connection method will not be described.

[0054] The foregoing description, for purposes of clarity, describes the present application in terms of its components, processes and operations. Such descriptions and representations are the means used by those skilled in the art of describing the structural and functional necessities of and changes to the present application, but are not meant to limit the present application to a particular embodiment. Also, the various embodiments of the present application presented are not necessarily the only ones in which the present application can be practiced. The embodiments presented are intended to convey the scope of the present application, its energy saving and cost saving advantages, and its intended advantages to those skilled in the art. Numerous adaptations and modifications can be practiced without departing from the scope of the present application. Accordingly, the scope of the present application is to be indicated by the appended claims, rather than by the foregoing description, and all changes that come within the meaning and range of equivalents are intended to be embraced therein.

[0055] In the description of the present application, it is to be understood that the specific locations of the components and the relative arrangement of the components and steps illustrated in the drawings are for purposes of illustration and description only, and that these locations and arrangements can be varied significantly without departing from the scope of the present application. Also, it is to be understood that the specific dimensions of the various parts, if shown, are to be understood not as limitations but as exemplifications of preferred embodiments. The terms "front," "back," "leading," "trailing" and the like, if used, are used for convenience only, and are not intended to be limiting.

[0056] For purposes of the description hereinafter, the terms "upper," "lower," "right," "left," "vertical," "horizontal," and the like, shall relate to the application as it is shown in the drawings and are used merely for purposes of description and illustration, and do not limit the present application to any particular position or orientation. The terms "in," "on" and "over" shall not, without further qualification, mean "directly" unless specifically stated otherwise. The terms "front," "back," "rear," "upper," "lower," "up," "down," "vertical," "horizontal," and the like, are used for convenience only and are not intended to limit the present application to any particular position or orientation.

[0057] Also, it is to be understood that the use of relational terms such as "first," "second," "third," and / or "fourth," and / or the like, if any, are used solely to distinguish one from another entity or action without necessarily implying a specific order or sequence. Also, the use of the term "about" is intended to cover variations that are a few percent above or below the stated value, unless otherwise indicated.

[0058] The above merely provides the preferred embodiments of the present application, and is not used to limit the present application. For those skilled in the art, the present application can have various modifications and changes. Any modifications, equivalent replacements, improvements, etc. made within the principles and technical scope of the present application shall fall into the scope of the present application.

Claims

1. A method of measuring the line width of an impedance, characterized by: The method comprises the following steps: S1, obtaining impedance information of an impedance line to be measured by using pre-manufacturing auxiliary manufacturing automation equipment; S2, obtaining the impedance information on the pre-manufacturing auxiliary manufacturing automation equipment by using computer-aided manufacturing software through an automatic script, and automatically generating an automatic line width measurement instrument program according to the impedance information; S3, importing the automatic line width measurement instrument program into a production device, and measuring an actual impedance line width value on a circuit board according to the automatic line width measurement instrument program; S4, generating a report of a standard impedance line width value generated by the automatic line width measurement instrument program and the actual impedance line width value measured by the production device, comparing the standard impedance line width value with the actual impedance line width value according to the report, and judging whether the impedance line width of the circuit board meets the requirements according to the comparison value; in the step S4, if an absolute value of the standard impedance line width value and the actual impedance line width value is equal to 0, the actual impedance line width of the circuit board meets the requirements, otherwise, the actual impedance line width of the circuit board does not meet the requirements; when the impedance line width does not meet the requirements, the impedance line width of the circuit board is improved by analyzing the abnormality through the report.

2. The method of claim 1, wherein: The pre-manufacturing auxiliary manufacturing automation equipment is InPlan software, and the impedance information is input into Oracle data of the InPlan software.

3. The method of claim 2, wherein: The impedance information is saved in the Oracle data of the InPlan software in the form of Gerber data.

4. The method of claim 3, wherein: The computer-aided manufacturing software is InCAMpro, and the automatic script automatically generates the automatic line width measurement instrument program according to the Gerber data.

5. The method of claim 1, wherein: In the step S2, the automatic script also automatically generates an impedance line width test diagram according to the impedance information.

6. The method of claim 1, wherein: The production device measures the actual impedance line width value by using an automatic line width measurement instrument.

7. A computer readable storage medium characterized by: The computer readable storage medium stores a computer program, and the computer program is read and run by a processor to realize the measurement method of the impedance line width in any one of claims 1-6.

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