A display device

Abstract

The present invention discloses a display device, including: a display panel and a backlight module. The backlight module includes: a light board, a diffusion plate and a diffusion plate bracket, and a reflective sheet. The diffusion plate bracket includes a support portion and a base, the support portion is used to support the diffusion plate, and the base and the light board form a housing space. The light board includes a driving chip, and the driving chip is arranged in the housing space formed by the base and the light board, which can save the use space of the light board and avoid interference with the reflective sheet to form a shadow. A reflective layer is arranged on the surface of the base away from the light board, which is used to reflect incident light together with the reflective sheet to improve light utilization and uniformity.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display device. Background Art

[0002] Light Emitting Diode (LED) panels have been widely used in backlight modules of liquid crystal display (LCD) devices in recent years due to their high brightness, zoned control, energy saving and environmental protection, achieving higher quality image display effects.

[0003] A reflective layer or reflective sheet is usually required in the backlight module to improve the utilization and uniformity of the light source emitted by the LED light board. The LED light board with integrated lamp and driver integrates multiple driver chips on the light board to achieve multi-zone brightness control, and can effectively reduce the volume of the backlight module. The driver chip can be set on the light-emitting side of the LED light board. When setting the reflective layer or reflective sheet, the height of the reflective layer or reflective sheet covering the position of the driver chip changes, resulting in uneven reflection of light by the reflective layer or reflective sheet, affecting the display effect. Summary of the invention

[0004] In some embodiments of the present invention, the display device includes:

[0005] Display panel, used for image display;

[0006] The backlight module is located on the light incident side of the display panel. The backlight module includes:

[0007] The light board is used as the light source of the backlight module; the light board includes: a driver chip, which is located on the light-emitting side of the light board;

[0008] The diffuser is located on the light-emitting side of the lamp panel;

[0009] A diffuser plate bracket, located between the light panel and the diffuser plate, and used for supporting the diffuser plate;

[0010] Among them, the diffusion plate bracket includes a base and a supporting part; the base is fixed on the light-emitting side of the lamp board, and the supporting part is located on the side of the base away from the lamp board; a accommodating space is formed between the base and the light board, and a reflective layer is provided on the surface of the base away from the light board; at least one driving chip is arranged in the accommodating space formed by the base.

[0011] Placing the driver chip in the accommodation space can save a lot of space on the light board, reduce the difficulty of design and installation, and avoid uneven reflection of incident light when setting the reflector, which will affect the display effect. A reflective layer is set on the surface of the base away from the light board, which can reflect light.

[0012] In some embodiments of the present invention, the light board further includes a circuit board, a light emitting diode, a first solder pad, and a second solder pad. The circuit board includes a substrate, a circuit layer, and a solder resist layer. The first solder pad and the second solder pad are electrically connected to the circuit layer through vias on the solder resist layer. The light emitting diode is fixed to the circuit board by soldering through the first solder pad. The circuit board of the light board adopts a single-layer circuit structure, and the light board is simple to design and manufacture, which is conducive to reducing costs.

[0013] In some embodiments of the present invention, the driving chip and its auxiliary components, the diffusion plate bracket, etc. are all arranged on the light emitting side of the lamp board.

[0014] In some embodiments of the present invention, the surface of the reflective sheet facing away from the light board is flush with the surface of the reflective layer on the base facing away from the light board, thereby avoiding uneven reflection caused by the height difference between the surface of the reflective sheet facing away from the light board and the surface of the reflective layer facing away from the light board, forming shadows and affecting the display effect.

[0015] In some embodiments of the present invention, the support portion is made of transparent or translucent material, which can improve the light propagation efficiency and avoid shadows caused by the support portion, thereby improving the image display effect.

[0016] In some embodiments of the present invention, the base includes a chassis, a plurality of support legs, and a welding patch. The base is fixed on the light board by welding the welding patch. During the manufacturing process of the light board, the base is welded to the light board at one time together with components such as light-emitting diodes on the light board through a process such as reflow soldering. Compared with the currently used method of punching holes or gluing on the light board, the process steps are saved and the installation efficiency of the whole machine is greatly improved.

[0017] In some embodiments of the present invention, the support legs and the chassis of the diffuser bracket are hollow structures, and conductive materials are provided in the support legs and the chassis to electrically connect at least two support legs. A diffuser bracket with mutually conductive support legs can replace a cross-line resistor. For a light board with a single-layer circuit, when two driver chips need to be connected but cannot be directly connected through a signal line on the circuit layer due to being blocked by dense circuits, a diffuser bracket with mutually conductive support legs is used to connect across the line, thereby reducing the use of cross-line resistors and reducing costs, and at the same time avoiding the generation of shadows that affect the display effect.

[0018] In some embodiments of the present invention, a plurality of driver chips are arranged on the lamp board, and at least some of the driver chips are cascaded with each other. The output signal pins of the driver chips are connected to the input signal pins of the cascaded driver chips through the supporting feet electrically connected to each other by the diffuser support.

[0019] In some embodiments of the present invention, the display device also includes a control main board, and the control main board and each driver chip are cascaded in a daisy chain manner. The daisy chain connection method can make the line connection relationship between the control main board and the driver chip simpler. The control main board does not need to use too many pins to achieve more precise partition control, which reduces the difficulty of design and manufacturing and saves costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings introduced below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0021] Figure 1 A schematic diagram of the structure of a display device provided by an embodiment of the present invention;

[0022] Figure 2 A top view of the diffuser plate bracket provided by the present invention;

[0023] Figure 3 A schematic diagram of the connection between the driver chip and the control mainboard in the related art;

[0024] Figure 4 It is a schematic diagram of board connection in the related technology;

[0025] Figure 5 A schematic diagram of the connection between the driver chip and the control mainboard provided by the present invention;

[0026] Figure 6 A schematic diagram of board connection provided by the present invention;

[0027] Figure 7 It is a schematic diagram of the assembly of the diffuser plate bracket in the related art;

[0028] Figure 8 A schematic diagram of assembling a diffuser plate bracket is provided for an embodiment of the present invention.

[0029] Among them, 100-display panel, 200-backlight module, 11-liquid crystal layer, 12-lower polarizer, 13-upper polarizer, 14-array substrate, 15-color film substrate, 21-light board, 22-diffuser plate, 23-diffuser plate bracket, 24-reflector, 25-optical film, 212-circuit board, 213-light emitting diode, 214-first solder pad, 218-second solder pad, 211-driving chip, 215-substrate, 216-circuit layer, 217-solder resist layer, 232-base, 231-support part, 233-chassis, 234-support foot, 235 -Soldering patch, 236-conductive material, MOSI-input signal pin, MISO-output signal pin, SCK-clock signal pin, CSB-enable signal pin, Master-control main board, 211-1 / 211-2 / 211-N-driver chip, MOSI-M-input signal control pin, MISO-M-output signal feedback pin, SCK-M-clock signal control pin, CSB1-M / CSB2-M / CSBN-M-enable signal pin, A-cross-line resistor, B-ordinary diffusion plate bracket, C-reflector or reflective layer. DETAILED DESCRIPTION

[0030] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, the present invention will be further described below with reference to the accompanying drawings and examples. However, the exemplary embodiments can be implemented in various forms and should not be understood as being limited to the embodiments described herein; on the contrary, these embodiments are provided to make the present invention more comprehensive and complete, and to fully convey the concepts of the exemplary embodiments to those skilled in the art. The same figure marks in the figures represent the same or similar structures, and thus their repeated descriptions will be omitted. The words expressing position and direction described in the present invention are all explained using the accompanying drawings as examples, but changes can be made as needed, and the changes made are all included in the scope of protection of the present invention. The drawings of the present invention are only used to illustrate the relative position relationship and do not represent the true proportions.

[0031] Light Emitting Diode (LED) light panels have been widely used in backlight modules of liquid crystal displays (LCD) in recent years due to their high brightness, zoned control, energy saving and environmental protection, achieving higher quality image display effects.

[0032] The integrated LED light board integrates multiple driver chips on the light board to achieve multi-zone brightness control, which has gradually become the mainstream LED light board structure. At present, the integrated LED light board integrates multiple driver chips, and the circuit board routing is complicated. In order to avoid line interference and signal crosstalk, it is usually necessary to set up multi-layer lines for routing design. The setting of multi-layer lines makes the design and manufacturing of the light board more difficult and costly.

[0033] For a single-layer LED board with integrated driver, due to the limitation of the number of circuit layers, integrating multiple driver chips will cause circuit interference, and it is impossible to directly realize the cascade between multiple driver chips through the wiring on the circuit board. If you want to integrate multiple driver chips on a single-layer LED board with integrated driver, you need to use cross-line resistors, which greatly increases the number of electronic components loaded on the LED board.

[0034] In addition, a reflective layer or reflective sheet is usually required in the backlight module to improve the utilization and uniformity of the light source emitted by the LED light board. Single-layer circuit LED light boards with integrated lamp drivers usually set the driver chip and cross-line resistors on the light-emitting side of the light board. When setting the reflective layer or reflective sheet, the height of the reflective layer or reflective sheet covering the driver chip and the cross-line resistor changes, resulting in uneven reflection of light by the reflective layer or reflective sheet, causing dark shadows and affecting the display effect.

[0035] In view of this, an embodiment of the present invention provides a display device, which adopts a new type of diffusion plate bracket, and can realize the integration of multiple cascaded driver chips on the LED lamp board of a single-layer circuit without setting up a cross-line resistor, which greatly reduces the design and manufacturing difficulty of the lamp board, reduces the cost, and can avoid the shadow caused by the uneven reflection of light by the reflective layer or the reflective sheet. At the same time, the diffusion plate bracket adopts a patch component to connect with the lamp board, which simplifies the installation process and improves production efficiency.

[0036] Figure 1 A schematic diagram of the structure of a display device provided by an embodiment of the present invention.

[0037] like Figure 1 As shown, the display device provided by the embodiment of the present invention includes: a display panel 100 and a backlight module 200 .

[0038] The display panel 100 is located at the light-emitting side of the backlight module 200 and is used for image display. The display panel 100 may be a liquid crystal display panel, which is usually designed in a rectangular or square shape. When applied to a special-shaped display device, it may also be a circular or irregular shape.

[0039] The display panel includes: a liquid crystal layer 11 , a lower polarizer 12 , an upper polarizer 13 , an array substrate 14 and a color filter substrate 15 .

[0040] The array substrate 14 and the color filter substrate 15 are arranged opposite to each other, and the liquid crystal layer 11 is located between the array substrate 14 and the color filter substrate 15. The array substrate 14 and the color filter substrate 15 serve as upper and lower substrates, and apply an electric field to the liquid crystal layer 11 to deflect the liquid crystal molecules, modulate the transmittance of light, and realize brightness control.

[0041] The surface of the array substrate 14 close to the liquid crystal layer 11 usually has a circuit layer made by thin film technology to provide a driving signal. The surface of the color filter substrate 15 close to the liquid crystal layer 11 usually has a color filter. The color filter can include three colors: red, green, and blue, which are arranged in sequence in the entire display area of ​​the color filter substrate 15. After the incident light is selected by the color filter, the color of the outgoing light is the same as the color of the filter.

[0042] The lower polarizer 12 is located on the side of the array substrate 14 away from the liquid crystal layer 11, and the upper polarizer 13 is located on the side of the color film substrate 15 away from the liquid crystal layer 11. The polarization direction of the upper polarizer 13 and the polarization direction of the lower polarizer 12 are perpendicular to each other, and the polarizer can only transmit light with the same polarization direction as the polarizer.

[0043] The backlight module 200 is located at the light incident side of the display panel 100 , and has a planar shape and size that is the same as or similar to that of the display panel 100 , and provides backlight for the entire display panel 100 .

[0044] The backlight module 200 includes a light board 21 , a diffusion plate 22 , a diffusion plate bracket 23 , a reflection sheet 24 and an optical film 25 .

[0045] The light board 21 is usually located at the bottom of the backlight module 200 and serves as the light source of the backlight module 200. The backlight module can use one light board or multiple light boards to provide backlight for the entire display panel, which is not limited here. At the same time, the LED light board can realize dynamic partition control of the light source and improve the dynamic contrast of the display panel. The shape and size of the light board 21 are usually designed to be the same or similar to the shape and size of the display panel 100.

[0046] The light board 21 includes a circuit board 212 , a light emitting diode 213 , a first solder pad 214 , a second solder pad 218 and a driving chip 211 .

[0047] The circuit board 212 is usually located at the bottom of the light board 21 and is used to provide a driving signal. Its shape and size are usually designed to be the same as or similar to the shape and size of the display panel.

[0048] The circuit board 212 includes a substrate 215 , a circuit layer 216 and a solder resist layer 217 .

[0049] The base material 215 is used as the substrate of the circuit board 212 , and is generally made of resin or an insulating material mixed with a reinforcing material, and is used to support and fix the circuit layer 216 and the solder resist layer 217 .

[0050] The circuit layer 216 is located on the substrate 215 , and is usually made of a metal material with good electrical conductivity coated on the surface of the substrate 215 , and patterned to form the routing of the signal circuit.

[0051] The solder resist layer 217 is located on the side of the circuit layer 216 away from the substrate 215, and covers the surface of the circuit board 212. The solder resist layer 217 is usually made of insulating materials such as acrylic resin, epoxy resin, silicone resin, etc., and has the function of protecting the circuit layer. A plurality of vias are reserved on the surface of the solder resist layer 217, and the first pad 214 and the second pad 218 are electrically connected to the circuit layer 216 through these vias.

[0052] The light emitting diode 213 is located on a side of the solder resist layer 217 away from the substrate 215 . The light emitting diode 213 has a plurality of patch electrodes, and the patch electrodes are fixed to the first pads 214 by soldering.

[0053] The driving chip 211 is electrically connected to the circuit board 212 and controls the light emitting diode 213 to emit light through the circuit board 212 .

[0054] The diffuser 22 is located on the light-emitting side of the lamp board 21, and is used to change the traveling direction of the light emitted from the lamp board 21, so that the emitted light is more uniform. Its shape and size are usually designed to be the same or similar to the shape and size of the display panel. The diffuser usually adds inorganic or organic light diffusion particles to the diffuser substrate (such as PMMA, PC, PS, PP, etc.), or adjusts the light through the array arrangement of the micro-feature structure on the surface of the substrate, so that the light is refracted, reflected and scattered in different directions, thereby changing the traveling route of the light, so that the light emitted by the lamp board 21 can be emitted as a uniform surface light source through the diffuser.

[0055] The diffuser support 23 is located between the light board 21 and the diffuser 22, and is used to support the diffuser 22. Usually, the distance between the light board 21 and the diffuser 22 is called the optical distance (OD). The emitted light of a single LED is usually distributed in a Brownian body, and a certain optical distance is required to ensure that the emitted light of the LED light board is uniform. Therefore, the height of the diffuser support 23 can be designed according to the optical distance required by the backlight module.

[0056] The optical film 25 is located on the side of the diffuser 22 away from the light board 21. The optical film 25 includes an angle selection film, a quantum dot film, a prism film, etc., which are used to further improve the uniformity of the light emitted by the backlight module and improve the backlight quality. For example, the angle selection film can increase the reflection or transmittance of the incident light at a preset angle. For the Brownian distribution of the light emitted by a single LED, the reflection of the incident light at a small angle can be increased, and the transmittance of the incident light at a large angle can be increased, so that the light emitted through the angle selection film is more uniform. For monochromatic LED light boards, such as blue LED light boards, a quantum dot film can be set. The quantum dot film emits green light and red light under the excitation of blue light, and then mixes into high-quality white light, achieving high color gamut coverage of the display device and restoring color. In specific implementation, the optical film 25 can be selected and set according to actual needs, and is not limited here.

[0057] In the embodiment of the present invention, the diffuser plate bracket 23 includes a base 232 and a support portion 231 .

[0058] The base 232 is fixed on the light emitting side of the lamp board 21 , and a receiving space is formed between the base 232 and the lamp board 21 . The size and height of the receiving space match the size and height of the driver chip 211 , and the driver chip 211 can be disposed in the receiving space.

[0059] Since the circuit board of the lamp board in the embodiment of the present invention adopts a single-layer circuit, the driver chip 211 and its auxiliary components and the diffuser plate bracket 23 need to be arranged on the light-emitting side of the lamp board 21, resulting in more components being arranged on this side, and the components are placed very densely, which makes design and installation more difficult. In the embodiment of the present invention, a receiving space is formed between the diffuser plate bracket 23 and the lamp board 21, and the driver chip is placed in the receiving space, which can save a lot of space on the lamp board and reduce the difficulty of design and installation. At the same time, the cost of the driver chip 211 is relatively high, and the diffuser plate bracket 23 can also play a certain protective role for the driver chip 211.

[0060] In specific implementation, according to the number of driving chips on the lamp board and design requirements, at least one or at least part of the driving chips are arranged in the accommodating space formed by the diffusion plate bracket and the lamp board, and one driving chip can be arranged under one diffusion plate bracket.

[0061] The support portion 231 is located on the side of the base 232 away from the light board 21, and is used to support the diffuser 22. The support portion can be made of translucent material or transparent material according to needs. In order to improve the propagation efficiency of the light emitted by the light board and reduce the generation of shadows, it is best to use a transparent material with good light transmittance. The shape of the support portion can be designed to be a cone, a cylinder or other shapes, which are not limited here. The support portion 231 and the base 232 can be made in an integrated manner, or they can be connected and fixed by adhesives, screws, etc., which are not limited here.

[0062] In the embodiment of the present invention, Figure 1 As shown, the backlight module 200 also includes: a reflective sheet 24. The reflective sheet 24 is located on the light-emitting side of the lamp panel 21, and includes a plurality of openings for exposing the base 232 of the diffuser bracket and the light-emitting diode 213. After the light emitted from the lamp panel 21 reaches the position where the diffuser 22 is located, part of the light is refracted by the diffuser 22 and continues to move in the direction of the emitted light, and the other part of the light is reflected by the surface of the diffuser 22 at the diffuser 22 and then incident on the surface of the reflective sheet 24. The reflective sheet 24 reflects this part of the light and re-emits it in the direction of the diffuser 22. After repeated reflection and refraction, the utilization rate of the light can be improved, and the light can be mixed more evenly.

[0063] The surface of the base 232 of the diffuser bracket facing away from the light board 21 is provided with a reflective layer, and the surface of the reflective sheet 24 facing away from the light board 21 is flush with the surface of the reflective layer facing away from the light board 21 .

[0064] In a specific implementation, since the driving chip 211 is set on the surface of the light-emitting side of the lamp board 21, the height of the lamp board 21 changes at the position where the chip 211 is set. Therefore, when the reflecting sheet is set, the height of the reflecting sheet covering the position of the driving chip changes, causing the reflecting sheet at this position to reflect light unevenly, produce dark shadows, and affect the display effect.

[0065] In this embodiment, by reasonably designing the layout of the driver chip 211, at least one or at least part of the driver chip 211 is arranged in the accommodation space formed by the diffuser bracket 23 and the light board 21, which can effectively reduce the number of driver chips 211 that interfere with the reflective sheet 24, and reduce the position where the reflective sheet reflects unevenly. When all the driver chips 211 are arranged in the accommodation space formed by the diffuser bracket 23 and the light board 21, it can avoid the shadow caused by the height change of the covering driver chip position affecting the display effect of the display device. At the same time, the reflective layer arranged on the base 232 of the diffuser bracket also has the function of reflecting light, so that the surface of the reflective sheet 24 away from the light board 21 is flush with the surface of the reflective layer away from the light board 21, which can avoid the shadow caused by the uneven distribution of reflected light to the greatest extent.

[0066] The material of the reflective layer can be white ink, which is evenly covered on the side of the base 232 away from the light board 21, except for the surface of the contact portion with the support portion 231. When the surface of the reflective sheet 24 away from the light board 21 is set to be flush with the surface of the reflective layer away from the light board 21, the surface flushing effect can be achieved by controlling the thickness of the reflective sheet 24.

[0067] Figure 2 A top view of the diffuser plate bracket provided by the present invention.

[0068] In an embodiment of the present invention, Figure 1 and Figure 2 As shown, the base 232 includes: a chassis 233, a plurality of supporting legs 234 and a welding patch 235.

[0069] The support part 231 is fixed to the side of the chassis 233 away from the light board 21, and the reflective layer covers the side of the chassis 233 where the support part 231 is fixed, except for the surface of the part in contact with the support part 231. The shape of the chassis 233 can be designed to be circular, square or rectangular according to actual needs, which is not limited here.

[0070] One end of the support foot 234 is connected to the four sides of the chassis 233, and the other end is fixed to each other by the welding patch 235. The welding patch 235 can be directly welded to the second solder pad 218 on the lamp board 21 to fix the diffuser plate bracket 23. During the manufacturing process of the lamp board, the diffuser plate bracket 23 can be welded to the lamp board at one time together with components such as light-emitting diodes on the lamp board through processes such as patch and reflow soldering. Compared with the currently used method of punching holes or gluing on the lamp board, it saves process steps and greatly improves the installation efficiency of the whole machine. The number of support feet can be set according to actual needs. Generally, it is set to an even number and is not limited here.

[0071] The structure of the supporting chassis 233 is set to connect the supporting feet 234 around the chassis 233, so that the chassis 233 and the light board 21 are separated by a set distance to form an accommodation space. In specific implementation, the height and size of the accommodation space can be designed to adapt to the size of the driver chip.

[0072] In the embodiment of the present invention, the support legs 234 and the chassis 233 are hollow structures, and the hollow structures are filled with conductive material 236 to achieve electrical connection between at least two support legs 234. The conductive material 236 can be a metal wire or a signal line connecting the support legs 234.

[0073] Since the light board 21 integrates the driver chip 211, the circuit routing is very complicated. Especially when there are a large number of integrated driver chips 211, it is necessary to simplify the circuit by setting up a cascade of each driver chip 211. In order to avoid line interference and signal crosstalk between the cascaded driver chip connection circuits, it is usually necessary to set up multiple layers of circuits for routing design. The setting of multiple circuit layers makes the design and manufacture of the light board more difficult and costly. In order to reduce the difficulty of designing and manufacturing the light board and reduce costs, the number of circuit layers of the light board should be minimized.

[0074] In the related art, for a light board with a single-layer circuit, when two driver chips cannot be directly connected through the signal line on the circuit layer due to being blocked by dense circuits, cross-line resistors are usually used to cross the dense circuits to connect the driver chips. However, the use of cross-line resistors increases the setting of components on the light board, which is more likely to interfere with the reflective sheet to form shadows, affecting the display effect.

[0075] In an embodiment of the present invention, a diffusion plate bracket whose supporting feet 234 are mutually conductive can be used to replace the cross-line resistor. By reasonably setting the signal line routing and the position of the diffusion plate bracket, the diffusion plate bracket can partially or completely replace the cross-line resistor to achieve the integration of multiple cascaded driver chips on a lamp board with fewer circuit layers or a single circuit layer lamp board, thereby reducing the use of cross-line resistors and reducing costs, and at the same time avoiding the generation of shadows that affect the display effect.

[0076] In order to make the cascade relationship between the above driver chips clearer, some embodiments are used for explanation below.

[0077] In a specific implementation, a plurality of driving chips 211 may be disposed on the light board 21 , and each driving chip 211 includes: an input signal pin MOSI, an output signal pin MISO, a clock signal pin SCK, and an enable signal pin CSB.

[0078] The display device further includes: a control motherboard Master. The control motherboard Master is electrically connected to the driver chip 211, and the control motherboard Master and the driver chip 211 can usually be connected through a flat cable or a flexible circuit board. Each driver chip 211 is controlled by the control motherboard Master, and the control motherboard Master can send a control signal to control the driver chip 211 to drive the light board to light up.

[0079] Figure 3 This is a schematic diagram of the connection between the driver chip and the control mainboard in the related technology. Figure 4 It is a schematic diagram of board connection in related technology.

[0080] like Figure 3 As shown, in the related art, the driving chip is connected to the control mainboard Master in parallel. The control mainboard Master includes: an input signal control pin MOSI-M, an output signal feedback pin MISO-M, a clock signal control pin SCK-M, and a plurality of enable signal control pins CSB1-M / CSB2-M / … / CSBN-M.

[0081] The input signal control pin MOSI-M of the control mainboard Master needs to be connected to the input signal pin MOSI of each driver chip 211 respectively, so as to send the driver chip operation instruction data; and the output signal pin MISO of each driver chip 211 needs to be connected to the output signal feedback pin MISO-M of the control mainboard Master respectively, so that the control mainboard Master can receive the driver chip operation status data; the number of the enable signal control pins CSB1-M / CSB2-M / … / CSBN-M of the control mainboard Master needs to be the same as the number of driver chips 211, and one enable signal control pin of the control mainboard Master corresponds to the enable signal pin CSB of one driver chip 211. The enable signal control pins CSB1-M / CSB2-M / … / CSBN-M of the control mainboard Master are respectively connected to the enable signal pin CSB of each driver chip 211, so as to send the enable control signal, and only the driver chip that receives the enable signal can execute the operation instruction; the clock signal control pin SCK-M of the control mainboard Master is respectively connected to the clock signal pin SCK of each driver chip 211, so as to transmit the clock control signal.

[0082] In the related art, in which the driver chip is connected to the control motherboard Master in parallel, the input signal control pin MOSI-M, the output signal feedback pin MISO-M, and the clock signal control pin SCK-M of the control motherboard Master need to be connected in parallel with the input signal pin MOSI, the output signal pin MISO, and the clock signal pin SCK of each driver chip 211, respectively. In addition, in order to realize the chip selection of the driver chip 211, the control motherboard Master needs to independently set the enable signal control pin CSB1-M / CSB2-M / … / CSBN-M for each driver chip. When this method is used to connect the control motherboard Master to the driver chip 211, the number of signal lines is huge and the routing is complex. In addition, the number of pins of the control motherboard Master will limit the number of connected driver chips 211, thereby limiting the ability of fine-grained partition control of the backlight module.

[0083] Especially in a single-layer circuit light board, due to the complex circuits around the driver chip, it is impossible to directly connect multiple ICs on the single-layer circuit light board through routing.

[0084] like Figure 4 As shown, currently, for a single-layer circuit light board, multiple light boards 21 are usually required, and a driver chip 211 is separately set on each light board to realize the partition control of the light source of the backlight module, which greatly increases the production cost. Multiple light boards are usually connected and fixed by welding, and welds will inevitably appear at the connection position, resulting in unstable light board structure and uneven light distribution at that location.

[0085] Figure 5 This is a schematic diagram of the connection between the driver chip and the control mainboard provided by the present invention. Figure 6 This is a schematic diagram of board connection provided by the present invention.

[0086] In the embodiment of the present invention, by using the diffusion plate bracket 23 whose supporting feet 234 are mutually conductive, each driver chip 211 can be cascaded in a daisy chain manner. Figure 6 As shown, due to the use of a diffusion plate bracket 23 with mutually conductive support legs 234, the diffusion plate bracket 23 can cross dense circuits and easily connect multiple driver chips 211 on a single-layer circuit lamp board 21, thereby reducing the number of lamp boards and reducing costs.

[0087] like Figure 5 As shown, in the method of connecting the driver chips by daisy chain, it is only necessary to connect the output signal pin MISO of the first-stage driver chip 211-1 in the mutually cascaded driver chips with the input signal pin MOSI of the second-stage driver chip 211-2, and connect the output signal pin of the second-stage driver chip 211-2 with the input signal pin MOSI of the next-stage driver chip, and so on, until the input signal pin MOSI of the last-stage driver chip 211-N is connected with the output signal pin MISO of the previous-stage driver chip, so as to realize the cascade between the driver chips. The input signal control pin MOSI-M of the control mainboard Master only needs to be connected with the input signal pin MOSI of the first-stage driver chip 211-1, the output signal feedback pin MISO-M is connected with the output signal pin MISO of the last-stage driver chip 211-N, and only one enable signal control pin CSB-M is needed to be connected with the enable signal pin CSB of each driver chip, so as to realize the connection and control between the control mainboard Master and all the driver chips 211.

[0088] The daisy chain connection method provided in the embodiment of the present invention can make the line connection relationship between the control motherboard Master and the driver chip 211 simpler, and the control motherboard Master can achieve more precise partition control without using too many pins.

[0089] Furthermore, the output signal pin MISO and the input signal pin MOSI of the two adjacent levels of driving chips 211 can be connected through the mutually conductive supporting pins in the diffusion plate bracket 23. At this time, the mutually conductive supporting pins replace the role of the cross-line resistor, and there is no need to use an additional cross-line resistor on the lamp board, which greatly simplifies the lamp board structure and greatly reduces the manufacturing cost.

[0090] In specific implementation, according to actual usage requirements, some or all of the driver chips can be designed to be cascaded with each other, and the output signal pins of each driver chip are connected to the input signal pins of the cascaded driver chip through supporting feet electrically connected to each other through a diffusion plate bracket, which is not limited here.

[0091] Figure 7 This is a schematic diagram of the assembly of the diffuser plate bracket in the related art. Figure 8 A schematic diagram of assembling a diffuser plate bracket is provided for an embodiment of the present invention.

[0092] In the traditional diffuser bracket assembly process, such as Figure 7 As shown, the cross-line resistor A, the driver chip 211 and the ordinary diffuser bracket B are arranged separately. At the positions of the cross-line resistor A and the driver chip 211, the reflective sheet or the reflective layer C has a height change, and the reflected light is unevenly distributed, which easily produces shadows and affects the display quality. In addition, the cross-line resistor A, the driver chip 211 and the ordinary diffuser bracket B are densely arranged, so that the number of components placed on the light board 21 is too large, which increases the difficulty of design and manufacturing.

[0093] In the embodiment of the present invention, Figure 8 As shown, the diffuser support 23 provided by the present invention is used to replace the ordinary diffuser support B and the cross-line resistor A, so that the additional cross-line resistor can be avoided, and the driver chip 211 is arranged in the accommodation space formed by the diffuser support 23 and the light board 21, so that the components on the surface of the light board 21 are not arranged too densely. At the same time, the surface of the reflective sheet 24 facing away from the light board 21 is flush with the surface of the reflective layer on the base of the diffuser support 23 facing away from the light board, so that the generation of dark shadows is avoided and the display quality is improved.

[0094] Although the preferred embodiments of the present invention have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0095] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A display device, characterized in that: include: Display panel, used for image display; A backlight module, located at the light incident side of the display panel; The backlight module comprises: A light board, serving as the light source of the backlight module; the light board comprises: a driving chip, the driving chip is located at the light emitting side of the light board; A diffusion plate, located at the light-emitting side of the light board; A diffusion plate bracket, located between the light board and the diffusion plate, and used for supporting the diffusion plate; The diffuser bracket includes a base and a support portion; the base is fixed to the light-emitting side of the lamp board, and the support portion is located on the side of the base away from the lamp board; an accommodation space is formed between the base and the lamp board, and a reflective layer is provided on the surface of the base away from the lamp board; at least one of the driver chips is provided in the accommodation space formed by the base; The base comprises: chassis; the support portion is fixed on the chassis; the reflective layer is located on the surface of the chassis away from the light board; A plurality of supporting legs are connected around the chassis; the supporting legs separate the chassis and the light panel by a set distance to form the accommodation space; The supporting legs and the chassis are hollow structures, and conductive materials are arranged in the supporting legs and the chassis to electrically connect at least two of the supporting legs.

2. The display device according to claim 1, wherein: The backlight module also includes: A reflective sheet is located on the light-emitting side of the lamp panel; the reflective sheet includes an opening exposing the base of the diffuser bracket; the surface of the reflective sheet facing away from the lamp panel is flush with the surface of the reflective layer arranged on the base facing away from the lamp panel.

3. The display device according to claim 1, wherein: The supporting part is made of transparent material or translucent material.

4. The display device according to claim 1, wherein: The reflective layer adopts white ink.

5. The display device according to any one of claims 1 to 4, characterized in that: The base also includes: A welding patch is fixed on the side of the supporting foot facing the lamp board; the welding patch is welded to the lamp board.

6. The display device according to any one of claims 1 to 4, characterized in that: A plurality of the driving chips are arranged on the lamp board, and at least some of the driving chips are cascaded with each other; The driving chip comprises an output signal pin and an input signal pin; the output signal pin of the driving chip is connected to the input signal pin of the cascaded driving chip through supporting feet electrically connected to each other by the diffusion plate bracket.

7. The display device according to claim 6, wherein: Also includes: Control main board; The control mainboard includes an input signal control pin and an output signal feedback pin; The input signal pin of the first-stage driver chip among the multiple driver chips cascaded together is connected to the input signal control pin of the control mainboard; the output signal pin of the last-stage driver chip among the multiple driver chips cascaded together is connected to the output signal feedback pin of the control mainboard.

8. The display device according to claim 7, characterized in that The driving chip further comprises: a clock signal pin and an enable signal pin; The control mainboard also includes: a clock signal control pin and an enable signal control pin; The clock signal control pins of the control mainboard are respectively connected to the clock signal pins of each of the driving chips; the enable signal control pins of the control mainboard are respectively connected to the enable signal pins of each of the driving chips.

9. The display device according to any one of claims 1 to 4, characterized in that: The light board also includes: A circuit board, used for providing a driving signal; a light emitting diode, located on the circuit board and electrically connected to the circuit board; Wherein, the circuit board includes a plurality of first solder pads and a plurality of second solder pads; the first solder pads are used for soldering the light-emitting diodes, and the second solder pads are used for soldering the diffusion plate bracket; The circuit board comprises: Base material; A circuit layer is located on a side of the substrate close to the driving chip; A solder resist layer, located on a side of the circuit layer facing away from the substrate; The first pad and the second pad are arranged on the surface of the solder resist layer and are electrically connected to the circuit layer through via holes in the solder resist layer.

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