Automatic diode production system

Abstract

The present application relates to the field of diode forming technology, and particularly relates to a diode automatic production system, which comprises a first bending device, a flattening device and a shaping device arranged in sequence, the shaping device comprises an upper die seat, a lower die seat and a third changing table, the lower die seat is provided with a cutting area and a secondary bending area, and the secondary bending area is arranged at intervals with the cutting area; the upper die seat comprises an upper die plate and a driving part, the driving part is connected to the upper side of the upper die plate and is used for driving the upper die plate to move vertically relative to the lower die seat; the shaping device further comprises a moving and changing mechanism, the moving and changing mechanism comprises a mounting plate slidably arranged on one side of the lower die seat and at least three shaping clamping parts arranged on the mounting plate, and the distance between the shaping clamping parts is the same as the distance between the third changing table, the cutting area and the secondary bending area. The present application has the advantages of saving equipment cost and improving production efficiency.

Description

Technical Field

[0001] This invention relates to the field of diode processing and forming technology, and more particularly to an automated diode production system. Background Technology

[0002] In the field of photovoltaic power generation, junction boxes are essential components. Junction boxes contain diodes that are electrically connected to the external circuit to achieve bypass protection.

[0003] Because diodes generate resistive heat when conducting current, some current diodes typically have their leads flattened to increase the heat dissipation area and the connection area of ​​the leads, making it easier to connect the diode to external circuits.

[0004] like Figure 1 and Figure 2 As shown, a finished diode is formed by processing an axial diode 200. The axial diode 200 includes a diode body 210 and leads 220, with the leads 220 connected to opposite sides of the diode body 210. In the finished diode 200, the leads 220 are bent into an L-shape, and the ends of the leads 220 have flat portions 230. A portion of the flat portion 230 is cut off, and a portion is folded downwards to form a bent portion 240 for engaging with a junction box.

[0005] During the forming and production process of the aforementioned diodes, the straight pins 220 need to be bent, flattened, cut, and bent again in sequence. Each assembly process is independent of the others, the equipment occupies a large area, the operation is complicated, and the degree of automation is low. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to overcome the shortcomings of the existing technology in diode production, such as large equipment footprint and low degree of automation, and to provide an automated diode production system.

[0007] The present invention solves the above-mentioned technical problems through the following technical solution:

[0008] An automated diode production system includes a primary bending device, a flattening device, and a shaping device arranged sequentially. The primary bending device is used to bend the diode leads. The flattening device is located at the end of the primary bending device and is used to flatten the diode leads. The shaping device is used to cut and bend the flattened diode leads a second time.

[0009] The shaping device includes an upper mold base, a lower mold base, and a third changing table. The lower mold base has a cutting area and a secondary bending area, with the secondary bending area spaced apart from the cutting area. The upper mold base includes an upper template and a driving component. The driving component is connected above the upper template and is used to drive the upper template to move vertically relative to the lower mold base. The upper template has a cutting head and a secondary bending head on the side facing the lower mold base. The cutting head corresponds to the cutting area, and the secondary bending head corresponds to the secondary bending area. The third changing table is at the same height as the lower mold base, and the third changing table, the cutting area, and the secondary bending area are equidistantly arranged on the same straight line.

[0010] The shaping device further includes a transfer mechanism, which includes a mounting plate slidably disposed on one side of the lower mold base and at least three shaping clamping components disposed on the mounting plate. The at least three shaping clamping components are arranged parallel to the line connecting the third changing table, the cutting area and the secondary bending area, and the distance between the shaping clamping components is the same as the distance between the third changing table, the cutting area and the secondary bending area.

[0011] In this solution, the automated diode production system bends the leads using a first-end bending mechanism, then flattens the leads using a flattening device. The diode is then placed on a third changing table, where a transfer mechanism picks it up and places it onto a lower mold base. A drive unit drives the upper and lower mold bases to close, and a cutting head, in conjunction with the cutting area, cuts the diode into the desired shape. The upper and lower mold bases then open, and the transfer mechanism moves the cut diode to a secondary bending area. The upper and lower mold bases close again, and the secondary bending head, in conjunction with the bending area, further bends the cut leads into the desired shape. During this process, since both the cutting head and the secondary bending head are located on the upper mold plate, lead cutting and secondary bending can be achieved in a single mold closing operation, integrating the cutting and secondary bending functions. This saves equipment floor space and reduces operational steps. The transfer mechanism has at least three shaping clamping parts corresponding to the third changing table, the cutting area, and the secondary bending area, respectively. The three shaping clamping parts are used to clamp diodes in three positions. The transfer mechanism can be moved once to remove the secondary bent diodes for unloading, move the cut diodes to the secondary bending area, and move the diodes on the third changing table to the cutting area. The transfer of three diodes can be realized at one time, saving equipment costs and equipment space, while meeting the production cycle of mold closing of the upper and lower mold bases and improving production efficiency.

[0012] Preferably, the lower mold base has a first placement groove and a cutting hole on the side facing the upper mold base. The first placement groove and the cutting hole together form the cutting area. The first placement groove is connected to the cutting hole. The first placement groove is adapted to the diode. When the diode is placed in the first placement groove, the cutting hole is directly opposite the diode's pin.

[0013] In this design, the first placement slot is adapted to the diode and is used to place and limit the diode. The cutting hole is directly opposite the diode's pins, so that the cutting hole and the cutting head can cut the flattened diode's pins into the required shape.

[0014] Preferably, the lower mold base is provided with a second placement groove and a secondary bending hole on the side facing the upper mold base. The second placement groove and the secondary bending hole enclose the secondary bending area. The second placement groove is connected to the secondary bending hole. The second placement groove is adapted to the diode. When the diode is placed in the second placement groove, the secondary bending hole is directly opposite the diode pin.

[0015] In this design, the second placement slot of the lower mold base is adapted to the diode. The cut diode can be placed and confined in the second placement slot. The secondary bending hole is aligned with the diode's pins, so that the secondary bending hole and the secondary bending head can be combined to bend the cut diode's pins into the required shape.

[0016] Preferably, the lower mold base is provided with a clearance groove on the side facing the transfer mechanism, the clearance groove extends vertically, and is used to make way for the shaping clamping part; the clearance groove is connected to the first placement groove, and / or the clearance groove is connected to the second placement groove.

[0017] In this design, the clearance slot is vertically oriented and is connected to the first placement slot and / or the second placement slot. This clearance slot provides space for the shaping clamping part, avoids interference between the shaping clamping part and the lower mold base, and facilitates the shaping clamping part to clamp and place the diode on the lower mold base.

[0018] Preferably, the transfer mechanism further includes a transfer linear module, a vertical cylinder, and a mounting plate. The length direction of the transfer linear module is parallel to the line connecting the third changing table, the cutting area, and the secondary bending area. The mounting plate is slidably disposed along the length direction of the linear module.

[0019] The number of vertical cylinders corresponds to the number of shaping clamping parts. The vertical cylinders are fixedly mounted on the mounting plate, and the shaping clamping parts are mounted on the vertical cylinders and can move vertically under the drive of the vertical cylinders.

[0020] In this solution, the linear transfer module drives the vertical cylinder and the shaping clamp to slide horizontally, so that the shaping clamp corresponds to the third changing table, the cutting area and the secondary bending area; the vertical cylinder drives the shaping clamp to move vertically to grab or place the diode.

[0021] Preferably, the bending device includes a first-end bending mechanism, a second-end bending mechanism, and a bending and transferring mechanism. The first-end bending mechanism and the second-end bending mechanism are spaced apart. The first-end bending mechanism is used to bend one pin of the diode, and the second-end bending mechanism is used to bend the other pin of the diode. The bending and transferring mechanism is located above the first-end bending mechanism and the second-end bending mechanism and is used to move the diode to the first-end bending mechanism and the second-end bending mechanism.

[0022] In this design, the first-end bending mechanism and the second-end bending mechanism are used to bend the two pins of the diode, respectively. The first-end bending mechanism and the second-end bending mechanism are arranged at intervals, and the diode is bent into two pins in sequence. This makes it less likely for the first-end bending mechanism and the second-end bending mechanism to interfere with each other when bending a small diode. The bending and transferring mechanism is used to pick up and place the diode at the first-end bending mechanism and / or the second-end bending mechanism. The bending and transferring mechanism is arranged above the first-end bending mechanism and the second-end bending mechanism to avoid interference with the first-end bending mechanism and / or the second-end bending mechanism.

[0023] Preferably, the first end bending mechanism includes a first fixed plate, a first linear cylinder, a first push rod, and a first limiting plate. The first fixed plate is used to fix the diode, and the first limiting plate is disposed on the first fixed plate and is used to abut against the periphery of one pin of the diode. The cylinder body of the first linear cylinder is fixed to the first fixed plate, the first push rod is connected to the piston of the first linear cylinder, the first limiting plate is parallel to the moving direction of the first push rod, and a gap is formed between the first limiting plate and the first push rod.

[0024] In this scheme, the first fixing plate is used to place the diode, and the first limiting plate is set on the first fixing plate. When bending the diode, the periphery of one pin of the diode abuts against the first limiting plate. The first push rod moves parallel to the first limiting plate and abuts against the pin of the diode. Thus, the first push rod, driven by the first linear cylinder, cooperates with the first limiting plate to bend one pin of the diode.

[0025] Preferably, the second end bending mechanism includes a second fixed plate, a second linear cylinder, a second push rod, and a second limiting plate. The second fixed plate is used to fix the diode, and the second limiting plate is disposed on the second fixed plate and is used to abut against the periphery of another pin of the diode. The cylinder body of the second linear cylinder is fixed to the second fixed plate, the second push rod is connected to the piston of the second linear cylinder, the movement direction of the second limiting plate is parallel to that of the second push rod, and a gap is formed between the second limiting plate and the second push rod.

[0026] In this scheme, after one pin of the diode is bent, the bending and transferring mechanism picks up and places the diode onto the second fixed plate. The second limiting plate is set on the first fixed plate. When bending the diode, the periphery of the other pin of the diode abuts against the second limiting plate. The second push rod moves parallel to the second limiting plate and abuts against the pin of the diode. Thus, the second push rod, driven by the second linear cylinder, cooperates with the second limiting plate to bend one pin of the diode.

[0027] Preferably, the first end bending mechanism further includes a first bending table and a first pressing cylinder. The first bending table is fixed to the first fixed plate. The first bending table has a first limiting groove for placing the diode. The first pressing cylinder is disposed on the first fixed plate, and the piston of the first pressing cylinder can slide along the width direction of the first limiting groove. The first pressing cylinder is used to press the diode against the limiting groove.

[0028] In this design, the first bending table is fixed to the first fixed plate, the diode is placed in the first limiting groove, and is pressed by the first pressing cylinder to prevent the diode from shifting during the bending process.

[0029] Preferably, the bending and transferring mechanism includes a walking drive assembly and at least two bending and transferring claws. The bending and transferring claws are used to pick up and place diodes. The bending and transferring claws are disposed on the walking drive assembly and can move horizontally and / or vertically under the drive of the walking drive assembly. At least one bending and transferring claw corresponds to the first end bending mechanism, and at least one bending and transferring claw corresponds to the second end bending mechanism.

[0030] In this solution, the bending and transferring mechanism is driven by a travel drive component to move the bending and transferring claws. The bending and transferring claws pick up diodes and place them on the first bending mechanism and / or the second bending mechanism. At least two bending and transferring claws are provided. The claw corresponding to the first bending mechanism is used for picking up and placing diodes on the first bending mechanism, and the claw corresponding to the second bending mechanism is used for picking up and placing diodes on the second bending mechanism. A single travel drive component simultaneously drives both bending and transferring claws, simultaneously unloading diodes from the second bending mechanism and transferring diodes from the first bending mechanism to the second bending mechanism for bending another pin. This improves the efficiency of diode pin bending, saves equipment costs, and conserves equipment space.

[0031] The positive and progressive effects of this invention are as follows:

[0032] The present invention uses a cutting head that works with a cutting area to cut diodes into the required shape, and a secondary bending head that works with a bending area to further bend the cut leads into the required shape. During this process, since both the cutting head and the secondary bending head are mounted on the upper mold plate, the cutting and secondary bending of the leads can be achieved in a single mold closing operation, integrating the cutting and secondary bending functions, saving equipment floor space, and reducing operational steps. At least three shaping clamping parts of the transfer mechanism correspond to the third changing table, the cutting area, and the secondary bending area, respectively, enabling the transfer of three diodes at once, saving equipment costs and floor space, while simultaneously meeting the production cycle of the upper and lower mold plates, thus improving production efficiency. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of a axial diode structure in the prior art.

[0034] Figure 2 This is a schematic diagram of the structure of a finished diode in the prior art.

[0035] Figure 3 This is a three-dimensional structural diagram of an automated diode production system according to an embodiment of the present invention.

[0036] Figure 4 for Figure 3 Enlarged diagram of point A in the middle.

[0037] Figure 5 This is a perspective view of a first-end bending mechanism and a second-end bending mechanism according to an embodiment of the present invention. Figure 1 .

[0038] Figure 6 This is a perspective view of a first-end bending mechanism and a second-end bending mechanism according to an embodiment of the present invention. Figure 2 .

[0039] Figure 7 This is a perspective view of a flattening device according to an embodiment of the present invention.

[0040] Figure 8 This is a three-dimensional structural diagram of a shaping device according to an embodiment of the present invention.

[0041] Figure 9 This is a three-dimensional structural diagram of the upper mold base and the lower mold base according to an embodiment of the present invention.

[0042] Figure 10 This is a three-dimensional structural diagram of a transfer mechanism according to an embodiment of the present invention.

[0043] Explanation of reference numerals in the attached figures:

[0044] Diode Automated Production System 100

[0045] Diode 200

[0046] Diode body 210

[0047] Pin 220

[0048] Flat section 230

[0049] 240 bend

[0050] Diode feeding device 300

[0051] Diode discharge bin 310

[0052] 320 Conveyor Belt

[0053] One-time bending device 400

[0054] First bending mechanism 410

[0055] First fixing plate 411

[0056] First linear cylinder 412

[0057] First push rod 413

[0058] First limiting plate 414

[0059] First bending platform 415

[0060] First clamping cylinder 416

[0061] First limiting groove 417

[0062] First clamping block 418

[0063] Second bending mechanism 420

[0064] Second fixing plate 421

[0065] Second linear cylinder 422

[0066] Second push rod 423

[0067] Second limiting plate 424

[0068] Second bending table 425

[0069] Second clamping cylinder 426

[0070] Second limiting groove 427

[0071] Second clamping block 428

[0072] 430 Bending and Transfer Mechanism

[0073] Walking drive component 431

[0074] Bending and transferring claw 432

[0075] Diode transfer support 440

[0076] Flattening device 500

[0077] 510 bearing plate

[0078] Lower base 520

[0079] Flatten the head 530

[0080] Flattening and transferring mechanism 540

[0081] Flattened straight module 541

[0082] Sliding plate 542

[0083] Flattening the gripper 543

[0084] Drive cylinder 544

[0085] First changing station 550

[0086] Second changing station 560

[0087] Shaping device 600

[0088] Upper mold base 610

[0089] Template 611

[0090] Drive component 612

[0091] Cutting head 613

[0092] Secondary bending head 613

[0093] Lower mold base 620

[0094] First placement slot 621

[0095] Cutting hole 622

[0096] Second placement slot 623

[0097] Secondary bending hole 624

[0098] Leaving slot 625

[0099] Replacement mechanism 630

[0100] 631 Linear Module Transfer

[0101] Vertical cylinder 632

[0102] Mounting plate 633

[0103] Shaping clamp 634

[0104] Third changing station 640

[0105] Rack 700 Detailed Implementation

[0106] The present invention will be further illustrated by way of embodiments below, but the present invention is not limited to the scope of the embodiments.

[0107] Reference Figure 3 This embodiment discloses an automated diode production system 100. This automated diode production system 100 is used to process axial diodes 200 into shapes such as... Figure 2 The finished product of diode 200 is shown. (As shown) Figure 1 and Figure 2 As shown, the diode 200 is made of axial diode material, which includes a diode body 210 and two pins 220 respectively connected to the two ends of the diode body 210. The two pins 220 of the finished diode 200 are flattened into flat portions 230 at opposite ends, and the ends of the flat portions 230 are bent twice to form downward bent portions 240.

[0108] Reference Figure 3 and Figure 4 The automated diode production system 100 includes a frame 700 and, arranged sequentially along the frame 700, a diode feeding device 300, a primary bending device 400, a flattening device 500, and a shaping device 600. The diode feeding device 300 feeds diodes 200 sequentially. The primary bending device 400 bends the two straight leads 220 of the diode 200 horizontally, bending the diode 200 into a C-shape. The flattening device 500 is located at the end of the first bending mechanism 410 and flattens the ends of the bent leads 220. The shaping device 600 cuts and performs a secondary bending on the flattened ends of the leads 220.

[0109] Reference Figure 4 The diode feeding device 300 includes a diode storage bin 310 and a conveyor belt 320. The diode storage bin 310 is used to store diodes 200, and the conveyor belt 320 is connected to the diode storage bin 310 to transport the diodes 200 in the diode storage bin 310 to the frame 700 for bending by the primary bending device 400.

[0110] Reference Figure 4 and Figure 5 The bending device 400 includes a first-end bending mechanism 410, a second-end bending mechanism 420, and a bending and transferring mechanism 430. The first-end bending mechanism 410 bends one pin 220 of the diode 200, and the second-end bending mechanism 420 bends the other pin 220 of the diode 200. The first-end bending mechanism 410 and the second-end bending mechanism 420 are spaced apart, bending the two pins 220 of the diode 200 sequentially, so that when the relatively small diode 200 is bent, the first-end bending mechanism 410 and the second-end bending mechanism 420 are less likely to interfere with each other. The bending and transferring mechanism 430 moves the diode 200 to the positions of the first-end bending mechanism 410 and the second-end bending mechanism 420. It is positioned above the first-end bending mechanism 410 and the second-end bending mechanism 420 to avoid interference with them.

[0111] Reference Figures 4 to 6 The first end bending mechanism 410 includes a first fixed plate 411, a first linear cylinder 412, a first push rod 413, a first limiting plate 414, a first bending table 415, and a first pressing cylinder 416. The first fixed plate 411 is fixed to the frame 700. The first limiting plate 414 is disposed above the first fixed plate 411 and is used to abut against the periphery of one pin 220 of the diode 200. The cylinder body of the first linear cylinder 412 is fixed to the first fixed plate 411. The first push rod 413 is connected to the piston of the first linear cylinder 412. The moving direction of the first limiting plate 414 is parallel to that of the first push rod 413, and a gap is formed between the first limiting plate 414 and the first push rod 413.

[0112] A first bending table 415 is fixed to a first fixing plate 411. The first bending table 415 has a first limiting groove 417 for placing a diode 200. The first limiting groove 417 is adapted to the diode 200, that is, the diode body 210 can be placed and limited in the first limiting groove 417, and the pins 220 of the diode 200 extend out of the first limiting groove 417 for bending. A first pressing cylinder 416 is fixedly disposed on the first fixing plate 411 and is used to press the diode body 210 against the limiting groove. The piston of the first pressing cylinder 416 is connected to a first pressing block 418. The first pressing cylinder 416 drives the first pressing block 418 to move along the width direction of the first limiting groove 417 to press or release the diode body 210.

[0113] When bending diode 200, diode body 210 is confined in first limiting groove 417, and first pressing cylinder 416 drives first pressing block 418 to press against diode body 210. One pin 220 of diode 200 extends out of limiting groove 417, and the periphery of pin 220 abuts against end of first limiting plate 414. First push rod 413 moves parallel to first limiting plate 414 and abuts against pin 220 of diode 200. Thus, driven by first linear cylinder 412, first push rod 413 cooperates with first limiting plate 414 to bend one pin 220 of diode 200. After bending, pin 220 of diode 200 is in the gap between first push rod 413 and first limiting plate 414.

[0114] The first push rod 413 has a chamfer at the end away from the first linear cylinder 412 so that the stress is more dispersed when it is pressed against the tube pin 220 and bent, thus avoiding damage to the tube pin 220.

[0115] Reference Figures 4 to 6 The second end bending mechanism 420 includes a second fixed plate 421, a second linear cylinder 422, a second push rod 423, a second limiting plate 424, a second bending table 425, and a second pressing cylinder 426. The second fixed plate 421 is fixed to the frame 700, and the second limiting plate 424 is disposed on the second fixed plate 421. The second limiting plate 424 is used to abut against the periphery of the other pin 220 of the diode 200. The cylinder body of the second linear cylinder 422 is fixed to the second fixed plate 421, and the second push rod 423 is connected to the piston of the second linear cylinder 422. The moving directions of the second limiting plate 424 and the second push rod 423 are parallel, and a gap is formed between the second limiting plate 424 and the second push rod 423.

[0116] The second bending table 425 is fixed to the second fixing plate 421. The second bending table 425 has a second limiting groove 427 for placing the diode 200. The second limiting groove 427 is adapted to the diode 200, that is, the diode body 210 can be placed and limited in the second limiting groove 427, and the pins 220 of the diode 200 extend out of the second limiting groove 427 for bending. The second pressing cylinder 426 is fixedly disposed on the second fixing plate 421 and is used to press the diode body 210 against the limiting groove. The piston of the second pressing cylinder 426 is connected to a second pressing block 428. The second pressing cylinder 426 drives the second pressing block 428 to move along the width direction of the second limiting groove 427 to press or release the diode body 210.

[0117] After one pin 220 of diode 200 is bent, the bending and transferring mechanism 430 picks up and places diode 200 into the second limiting groove 427, and the second pressing cylinder 426 drives the second pressing block 428 to press against the diode body 210. The periphery of the other pin 220 of diode 200 abuts against the second limiting plate 424, and the second push rod 423 moves parallel to the second limiting plate 424 and abuts against the pin 220 of diode 200. Thus, the second push rod 423, driven by the second linear cylinder 422, cooperates with the second limiting plate 424 to bend one pin 220 of diode 200.

[0118] Reference Figure 4 and Figure 5 The bending and transferring mechanism 430 includes a walking drive assembly 431 and at least two bending and transferring claws 432. The bending and transferring claws 432 are used to pick up and place diodes 200. The bending and transferring claws 432 are disposed on the walking drive assembly 431 and can move horizontally and / or vertically under the drive of the walking drive assembly 431. At least one bending and transferring claw 432 corresponds to the first end bending mechanism 410, and at least one bending and transferring claw 432 corresponds to the second end bending mechanism 420. The bending transfer claw 432 corresponding to the first bending mechanism 410 is used to pick up and place the diode 200 on the first bending mechanism 410, and the bending transfer claw 432 corresponding to the second bending mechanism 420 is used to pick up and place the diode 200 on the second bending mechanism 420. By driving the two bending transfer claws 432 simultaneously through a walking drive component 431, the diode 200 on the second bending mechanism 420 is unloaded and the diode 200 on the first bending mechanism 410 is transferred to the second bending mechanism 420 to bend another pin 220. This improves the efficiency of bending the diode 200 pin 220, saves equipment cost, and saves equipment space.

[0119] Specifically, refer to Figure 4In this embodiment, the bending device 400 further includes a diode transfer support 440, which is disposed between the first bending mechanism 410 and the conveyor belt 320. The bending and transferring mechanism 430 includes four bending and transferring claws 432. The four bending and transferring claws 432 are equidistantly disposed on the walking drive assembly 431. When the diode 200 forming equipment is not started, the four bending and transferring claws 432 are respectively located directly above the end of the conveyor belt 320 away from the diode discharge bin 310, directly above the diode transfer support 440, directly above the first limiting groove 417, and directly above the second limiting groove 427. Therefore, during a single bending operation, the four bending and transferring claws 432 simultaneously grasp diodes 200 at four different positions. As the traveling drive assembly 431 drives the bending and transferring claws 432 to move, the four diodes 200 simultaneously achieve a change in workstation. That is, the diodes 200 are simultaneously transferred from the conveyor belt 320 to the diode transfer support 440, from the diode transfer support 440 to the first bending mechanism 410, and the diode 200 with one pin 220 bent on the first bending mechanism 410 is transferred to the second bending mechanism 420. This improves the efficiency of diode 200 forming and saves equipment space.

[0120] In this embodiment, the bending and transferring claw 432 is a clamping cylinder, which drives the claw to open and close to grip the diode 200. In other embodiments, the bending and transferring claw 432 can also be other suitable clamping components.

[0121] Reference Figure 3 and Figure 7 The flattening device 500 includes a support plate 510, a lower base 520, a flattening head 530, and a flattening and transferring mechanism 540. The support plate 510 is fixed to the frame 700, and the lower base 520 and the flattening and transferring mechanism 540 are disposed on the support plate 510. The flattening head 530 is disposed above the lower base 520 and can move vertically relative to the lower base 520 to cooperate with the lower base 520 in flattening the pins 220 of the diode 200. The flattening and transferring mechanism 540 is disposed on one side of the lower base 520 and is used to transfer the diode 200 onto the lower base 520 or remove the diode 200 from the lower base 520.

[0122] The flattening head 530 is connected to an external power source, which drives the flattening head 530 to move vertically to flatten the pin 220 of the diode 200.

[0123] The flattening and transferring mechanism 540 includes a horizontally arranged flattening linear module 541, a sliding plate 542 slidably arranged on the flattening linear module 541, a drive cylinder 544 disposed on the sliding plate 542, and a flattening gripper 543 connected to the drive cylinder 544. The flattening gripper 543 is used to hold the diode 200. The drive cylinder 544 drives the flattening gripper 543 to slide vertically to place or pick up the diode 200. The flattening linear module 541 drives the sliding plate 542 and the flattening gripper 543 on the sliding plate 542 to slide along the length direction of the flattening linear module 541, thereby moving the diode 200 horizontally to change the working position of the diode 200. There is a gap in the horizontal direction between the flattening claw 543 and the lower base 520. The width of the gap is less than the length of the bent pin 220 of the diode 200, so that when the diode 200 is placed on the lower base 520, only the pin 220 of the diode 200 is on the lower base 520, which makes it easier to flatten the pin 220 of the diode 200.

[0124] In this embodiment, a first changing table 550 is provided between the flattening device 500 and the primary bending device 400, and a second changing table 560 is provided between the flattening device 500 and the shaping device 600. The first changing table 550 is at the same height as the upper surface of the second end bending mechanism 420 and the lower base 520. The first changing table 550, the second end bending mechanism 420, the first end bending mechanism 410, and the diode transfer support 440 are equidistantly arranged on the same straight line. The first changing table 550, the lower base 520, and the second changing table 560 are arranged on the same straight line, and all three are at the same height, so as to facilitate the flattening and transferring mechanism 540 to transfer the diode 200 between the three. This facilitates the bending and transferring mechanism 430 to pick up the diode 200 with the pin 220 bent and place it on the first changing table 550. At the same time, it facilitates the flattening and transferring mechanism 540 to pick up the diode 200 on the first changing table 550 and place it on the lower base 520 or to pick up the diode 200 on the lower base 520 and transfer it to the second changing table 560, which makes it convenient to pick up and place the diode 200.

[0125] In this embodiment, a flattening gripper 543 is provided at each end of the sliding plate 542. The distance between the two flattening grippers 543 is equal to the distance between the first changing platform 550 and the lower base 520 (i.e., the distance between the second changing platform 560 and the lower base 520). Thus, by moving the sliding plate 542 once, the flattened diode 200 on the lower base 520 can be placed on the second changing platform 560, and the diode 200 on the first changing platform 550 can be placed on the lower base 520 for flattening the pin 220.

[0126] Reference Figure 3 and Figure 8The shaping device 600 includes an upper mold base 610, a lower mold base 620, a transfer mechanism 630, and a third mounting platform 640. The third mounting platform 640 is disposed between the second mounting platform 560 and the lower mold base 620, and is used to place the flattened diode 200. The upper mold base 610 is slidably disposed above the lower mold base 620, and the diode 200 is cut and bent twice by the closing of the upper and lower mold bases 620. The transfer mechanism 630 is used to pick up the diode 200 from the third mounting platform 640 and transfer it to the lower mold base 620, and then remove the diode 200 from the lower mold base 620.

[0127] Combination Figure 9 The lower mold base 620 is provided with a cutting area and a secondary bending area, which are spaced apart from the cutting area. In this embodiment, the lower mold base 620 has a first placement groove 621 and two cutting holes 622 on the side facing the upper mold base 610. The first placement groove 621 and the cutting holes 622 together form the cutting area. The first placement groove 621 and the cutting holes 622 are connected, and the first placement groove 621 is adapted to the diode 200. When the diode 200 is placed in the first placement groove 621, the two cutting holes 622 are respectively aligned with the two pins 220 of the diode 200, so that the cutting holes 622 and the cutting head can cut the flattened pins 220 of the diode 200 into the required shape. The lower mold base 620 is provided with a second placement groove 623 and two secondary bending holes 624 on the side facing the upper mold base 610. The second placement groove 623 and the secondary bending holes 624 form a secondary bending area. The second placement groove 623 and the secondary bending holes 624 are connected. The second placement groove 623 is adapted to the diode 200. When the diode 200 is placed in the second placement groove 623, the two secondary bending holes 624 are directly opposite the two pins 220 of the diode 200. Thus, the secondary bending holes 624 and the secondary bending head can bend the cut pins 220 of the diode 200 into the required shape.

[0128] The upper mold base 610 includes an upper template 611 and a driving component 612. The driving component 612 is connected above the upper template 611 and is used to drive the upper template 611 to move vertically relative to the lower mold base 620. The upper template 611 is provided with a cutting head 613 and a secondary bending head 614 on the side facing the lower mold base 620. The cutting head 613 corresponds to the cutting area, and the secondary bending head 614 corresponds to the secondary bending area.

[0129] Therefore, during the cutting and secondary bending of diode 200, the transfer mechanism 630 picks up and places diode 200 from the third mounting table 640 onto the lower mold base 620. The drive unit 612 drives the upper mold base 610 and lower mold base 620 to close the mold, and the cutting head cooperates with the cutting area to cut diode 200 into the required shape. Subsequently, the upper mold base 610 and lower mold base 620 open the mold, and the transfer mechanism 630 transfers the cut diode 200 to the secondary bending area. The upper mold base 610 and lower mold base 620 close the mold, and the secondary bending head cooperates with the bending area to further bend the cut pin 220 into the required shape.

[0130] In this process, since both the cutting head and the secondary bending head are set on the upper template 611, the cutting and secondary bending of the tube pin 220 can be achieved by closing the mold once, realizing the integration of the cutting function and the secondary bending function, saving the equipment floor space, and reducing the number of operation steps.

[0131] Reference Figures 8 to 10 The transfer mechanism 630 includes a transfer linear module 631, a vertical cylinder 632, a mounting plate 633, and a shaping clamping component 634. The length direction of the transfer linear module 631 is parallel to the line connecting the third changing table 640, the cutting area, and the secondary bending area. The mounting plate 633 is slidably disposed along the length direction of the linear module.

[0132] A vertical cylinder 632 is fixedly installed below the transfer linear module 631 to drive the transfer linear module 631 to move in the vertical direction, and a shaping clamping component 634 is installed on the mounting plate.

[0133] In this embodiment, the second changing table 560, the third changing table 640, the first placement slot 621 and the second placement slot 623 are all located on the same straight line, and the second changing table 560, the third changing table 640, the first placement slot 621 and the second placement slot 623 are equidistant from each other.

[0134] The number of shaping clamping parts 634 is at least three, corresponding to the clamping of diodes 200 in the third changing table 640, the cutting area, and the secondary bending area. In this embodiment, the number of shaping clamping parts 634 is four, with the four shaping clamping parts 634 corresponding to the second changing table 560, the third changing table 640, the cutting area, and the secondary bending area, respectively. Thus, only one movement of the transfer mechanism 630 is needed to remove the secondary bent diodes 200 for unloading, transfer the cut diodes 200 to the secondary bending area, transfer the diodes 200 on the third changing table 640 to the cutting area, and transfer the diodes 200 on the second changing table 560 to the third changing table 640, achieving the transfer of three diodes 200 in one operation. This saves equipment costs and space, while simultaneously meeting the production cycle of mold closing of the upper mold base 610 and the lower mold base 620, thus improving production efficiency.

[0135] The lower mold base 620 has a clearance groove 625 on the side facing the transfer mechanism 630, and the clearance groove 625 extends vertically. In this embodiment, there are two clearance grooves 625, one of which communicates with the first placement groove 621, and the other communicates with the second placement groove 623. Thus, the clearance groove 625 provides clearance for the shaping clamping part, avoiding interference between the shaping clamping part and the lower mold base 620, facilitating the clamping of the shaping clamping part and the placement of the diode 200 on the lower mold base 620.

[0136] While specific embodiments of the present invention have been described above, those skilled in the art should understand that these are merely illustrative examples, and the scope of protection of the present invention is defined by the appended claims. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principles and essence of the present invention, but all such changes and modifications fall within the scope of protection of the present invention.

Claims

1. A diode automatic production system characterized by comprising: The automatic diode production system comprises a first bending device, a flattening device and a shaping device arranged in sequence, the first bending device is used for bending the pin of the diode, the flattening device is arranged at the end of the first bending device and is used for flattening the pin of the diode, and the shaping device is used for cutting and secondly bending the flattened pin of the diode. The shaping device comprises an upper die seat, a lower die seat and a third changing table, the lower die seat is provided with a cutting area and a second bending area, the second bending area is arranged at intervals with the cutting area, the upper die seat comprises an upper die plate and a driving member, the driving member is connected above the upper die plate and is used for driving the upper die plate to move vertically relative to the lower die seat, one side of the upper die plate towards the lower die seat is provided with a cutting head and a second bending head, the cutting head corresponds to the cutting area, and the second bending head corresponds to the second bending area, the third changing table is equal in height to the lower die seat, and the third changing table, the cutting area and the second bending area are equidistantly arranged on the same straight line. The shaping device further comprises a moving and changing mechanism, the moving and changing mechanism comprises a mounting plate slidably arranged on one side of the lower die seat and at least three shaping clamping members arranged on the mounting plate, the at least three shaping clamping members are arranged in parallel to the connecting line of the third changing table, the cutting area and the second bending area, and the distance between the shaping clamping members is the same as the distance between the third changing table, the cutting area and the second bending area. One side of the lower die seat towards the upper die seat is provided with a first placing groove and a cutting hole, the first placing groove and the cutting hole jointly enclose the cutting area, the first placing groove is in communication with the cutting hole, the first placing groove is matched with the diode, when the diode is placed in the first placing groove, the cutting hole is opposite to the pin of the diode. The moving and changing mechanism further comprises a moving and changing linear module, a vertical air cylinder and a mounting plate, the length direction of the moving and changing linear module is parallel to the connecting line of the third changing table, the cutting area and the second bending area, and the mounting plate is slidably arranged along the length direction of the linear module. The number of the vertical air cylinders corresponds to the number of the shaping clamping members, the vertical air cylinders are fixedly arranged on the mounting plate, and the shaping clamping members are arranged on the vertical air cylinders and can move vertically under the driving of the vertical air cylinders.

2. The automatic diode production system according to claim 1, wherein One side of the lower die seat towards the upper die seat is provided with a second placing groove and a second bending hole, the second placing groove and the second bending hole enclose the second bending area, the second placing groove is in communication with the second bending hole, the second placing groove is matched with the diode, when the diode is placed in the second placing groove, the second bending hole is opposite to the pin of the diode.

3. The automatic diode production system according to claim 2, wherein One side of the lower die seat towards the moving and changing mechanism is provided with a giving-way groove, the giving-way groove extends vertically and is used for giving way to the shaping clamping members, the giving-way groove is in communication with the first placing groove, and / or the giving-way groove is in communication with the second placing groove.

4. The automatic diode production system according to claim 1, wherein The one-time bending device comprises a first end bending mechanism, a second end bending mechanism and a bending and material moving mechanism, the first end bending mechanism is arranged at intervals with the second end bending mechanism, the first end bending mechanism is used for bending one pin of a diode, and the second end bending mechanism is used for bending another pin of the diode; the bending and material moving mechanism is arranged above the first end bending mechanism and the second end bending mechanism and is used for moving the diode to the first end bending mechanism and the second end bending mechanism.

5. The automatic diode production system according to claim 4, wherein The first end bending mechanism comprises a first fixed plate, a first linear cylinder, a first top rod and a first limiting plate, the first fixed plate is used for fixing the diode, the first limiting plate is arranged on the first fixed plate and is used for abutting against the circumferential side of one pin of the diode; the cylinder body of the first linear cylinder is fixed to the first fixed plate, the first top rod is connected with the piston of the first linear cylinder, the moving direction of the first limiting plate is parallel to the first top rod, and a gap is formed between the first limiting plate and the first top rod.

6. The automatic diode production system according to claim 4, wherein The second end bending mechanism comprises a second fixed plate, a second linear cylinder, a second top rod and a second limiting plate, the second fixed plate is used for fixing the diode, the second limiting plate is arranged on the second fixed plate and is used for abutting against the circumferential side of another pin of the diode; the cylinder body of the second linear cylinder is fixed to the second fixed plate, the second top rod is connected with the piston of the second linear cylinder, the moving direction of the second limiting plate is parallel to the second top rod, and a gap is formed between the second limiting plate and the second top rod.

7. The automatic diode production system according to claim 5, wherein The first end bending mechanism further comprises a first bending table and a first abutting cylinder, the first bending table is fixed to the first fixed plate, the first bending table is provided with a first limiting groove for placing the diode, the first abutting cylinder is arranged on the first fixed plate, the piston of the first abutting cylinder can slide along the width direction of the first limiting groove, and the first abutting cylinder is used for abutting the diode in the limiting groove.

8. The automatic diode production system according to claim 4, wherein The bending and material moving mechanism comprises a walking driving assembly and at least two bending and material moving claws, the bending and material moving claws are used for taking and placing the diode, the bending and material moving claws are arranged on the walking driving assembly and can move horizontally and / or vertically under the driving of the walking driving assembly, at least one of the bending and material moving claws corresponds to the first end bending mechanism, and at least one of the bending and material moving claws corresponds to the second end bending mechanism.

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