Solid-state temperature equalizing plate, preparation method thereof, and electronic component

Abstract

The present application relates to the field of heat dissipation technology, and in particular to a solid-state temperature averaging plate, its preparation method, and electronic components. It is used to solve the problem in related technologies that the metal shell is easily damaged during the preparation process, which is not conducive to improving the yield of temperature averaging plate production. A solid-state temperature averaging plate comprises: a heat conducting plate, the material of the heat conducting plate is a graphene metal composite material; a metal shell, the metal shell is coated on the outside of the heat conducting plate, and is in close contact with or welded to the heat conducting plate; along the thickness direction of the heat conducting plate, the metal shell includes a top shell and a bottom shell located on both sides of the thickness direction of the heat conducting plate, the heat conducting plate is provided with a plurality of first through holes along its thickness direction, a plurality of metal columns are provided in the metal shell, each metal column is correspondingly passed through a first through hole, and the two ends of each metal column are respectively connected to the top shell and the bottom shell. The present application is used to prepare a solid-state temperature averaging plate.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a solid-state temperature homogenizer, a preparation method thereof, and electronic components. Background Art

[0002] As electronic products become smaller, more integrated, lighter, and more powerful, their heat density continues to increase. Research shows that for every 2°C increase in the temperature of electronic components, their reliability decreases by 10%. This increase in operating temperature significantly reduces their service life.

[0003] Currently, the above-mentioned problems are mainly alleviated by installing heat dissipation devices to dissipate heat from electronic components, thereby improving the service life and performance of electronic components. As a heat dissipation device, the phase change heat spreader has the characteristics of high heat dissipation efficiency. However, as the name suggests, the phase change heat spreader uses a phase change medium to achieve phase change through heat absorption and heat release to achieve the purpose of heat dissipation. During use, it depends on the smoothness and sealing of the phase change medium in the pipeline during the phase change process. If the operating temperature exceeds the temperature window of the phase change medium or the phase change heat spreader leaks, it will cause the phase change heat spreader to fail. Therefore, the concept of a solid-state heat spreader was proposed.

[0004] A solid-state vapor chamber is a vapor chamber made by leveraging the high thermal conductivity of graphene and metal. Its core component is a graphene-metal high-thermal-conductivity material. This material is embedded in a metal shell, thermoformed, and then machined to its target size. In practical applications, the thermal diffusivity of metal shells is lower than that of graphene-metal high-thermal-conductivity materials. Therefore, to prevent the metal shell from being too thick, which would significantly reduce the efficiency of the vapor chamber, the metal shell should be as thin as possible (e.g., less than 1mm).

[0005] However, in the related art, when the graphene metal high thermal conductivity material is set in the metal shell, the metal shell is formed into a solid temperature equalizing plate by thermoforming, and then the target size of the temperature equalizing plate is achieved by machining. When the thickness of the metal shell is thin, the metal shell is often lifted up, causing the internal graphene metal high thermal conductivity material to leak out, resulting in failure of the temperature equalizing plate preparation, which is not conducive to improving the production yield of the temperature equalizing plate. Summary of the Invention

[0006] Based on this, the present application provides a solid-state temperature spreader and its preparation method and electronic components to solve the problem in the related art that the metal shell is easily damaged during the preparation process, which is not conducive to improving the yield of the temperature spreader.

[0007] In a first aspect of the present application, a solid-state vapor chamber is provided, comprising:

[0008] Heat conducting plate, the material of the heat conducting plate is graphene metal composite material;

[0009] A metal shell, the metal shell covering the outer side of the heat conducting plate and being in close contact with or welded to the heat conducting plate;

[0010] Along the thickness direction of the heat conducting plate, the metal shell includes a top shell and a bottom shell located on both sides of the thickness direction of the heat conducting plate. The heat conducting plate is provided with multiple first through holes along its thickness direction. Multiple metal columns are provided in the metal shell. Each metal column is correspondingly inserted into a first through hole, and the two ends of each metal column are respectively connected to the top shell and the bottom shell.

[0011] In a possible implementation manner of the first aspect, one end of each metal column is integrally formed with one of the top shell and the bottom shell, and the other end is welded to the other one of the top shell and the bottom shell.

[0012] In a possible implementation of the first aspect, the heat conducting plate includes a metal layer and a graphene layer stacked along a thickness direction of the heat conducting plate, and the outermost layer of the heat conducting plate is the metal layer;

[0013] The outermost metal layer of the heat conducting plate is welded to the top shell and the bottom shell respectively.

[0014] In a possible implementation manner of the first aspect, the solid-state vapor chamber further includes: a first welding layer and a second welding layer;

[0015] The first welding layer is located between the top shell and the heat conducting plate, and one side of the first welding layer is welded to the top shell and the first end of the metal column, and the other side is in close contact with or welded to the heat conducting plate;

[0016] The second welding layer is located between the bottom shell and the heat conducting plate, and one side of the second welding layer is welded to the bottom shell and the second end of the metal column, and the other side is in close contact with or welded to the heat conducting plate.

[0017] In a possible implementation manner of the first aspect, the first end of each metal pillar is integrally formed with the top shell, and the first welding layer is further provided with a plurality of second through holes for the second ends of the metal pillars to pass through;

[0018] or,

[0019] The second end of each metal column is integrally formed with the bottom shell, and the second welding layer is further provided with a plurality of third through holes for the first end of the metal column to pass through.

[0020] In a possible implementation of the first aspect, the solid-state temperature vapor chamber further includes: a first metal plate body and a second metal plate body stacked together;

[0021] A groove is provided on the surface of the first metal plate body facing the second metal plate body, the heat conducting plate is provided in the groove, and a portion of the first metal plate body surrounding the groove and a portion of the second metal plate body surrounding the groove are welded to form a metal shell;

[0022] The bottom of the groove forms a bottom shell, and the portion of the second metal plate body facing the groove forms a top shell.

[0023] In a possible implementation of the first aspect,

[0024] The second end of each metal column is integrally formed with the bottom shell, and a plurality of third through holes for the first end of the metal column to pass through are provided on the second welding layer. The first welding layer also extends to cover between the portion of the first metal plate body and the second metal plate body surrounding the groove, and is welded to the portion of the first metal plate body and the second metal plate body surrounding the groove.

[0025] In a possible implementation manner of the first aspect, a total projection area of ​​the plurality of first through holes on the heat conducting plate is no more than 40% of a total area of ​​the heat conducting plate.

[0026] In a possible implementation manner of the first aspect, the thickness of the top shell and the bottom shell are both 0.3-0.8 mm.

[0027] A second aspect of the present application provides an electronic component, comprising:

[0028] Electronic component body, and

[0029] The solid-state vapor chamber as described in the first aspect;

[0030] The top shell or bottom shell of the solid-state temperature homogenizer is in contact with the electronic component body and is used to dissipate heat from the electronic component body.

[0031] A third aspect of the present application provides a method for preparing a solid-state temperature vapor chamber, comprising:

[0032] A plurality of first through holes are processed on the heat conducting plate along the thickness direction thereof, wherein the material of the heat conducting plate is a graphene metal composite material;

[0033] Manufacturing a blank of a metal shell, and manufacturing a plurality of metal columns in the blank of the metal shell, wherein the blank of the metal shell includes a top shell blank and a bottom shell blank;

[0034] Placing the heat conducting plate within the blank of the metal shell so that the top shell blank and the bottom shell blank are located on opposite sides of the heat conducting plate along its thickness direction, and each metal column passes through a first through hole in a one-to-one correspondence to connect with the heat conducting plate;

[0035] The metal shell body is heat-treated so that the metal shell body is covered on the outside of the heat conducting plate and is in close contact with or welded to the heat conducting plate, and the two ends of each metal column are respectively connected to the top shell body and the bottom shell body;

[0036] The blank of the metal shell is machined to prepare a solid temperature averaging plate of a preset size.

[0037] In a possible implementation manner of the third aspect, a machining allowance of 5 to 10 mm is reserved for the thickness of the top shell blank and the bottom shell blank before heat treatment.

[0038] In a possible implementation manner of the third aspect, manufacturing a blank of the metal shell includes:

[0039] providing a third metal sheet and a fourth metal sheet;

[0040] A groove is formed on a surface of the third metal plate along its thickness direction, and a plurality of metal columns are formed in the groove;

[0041] The fourth metal sheet is placed on the groove and welded to the portion of the third metal sheet surrounding the groove to form a blank of the metal shell;

[0042] The bottom of the groove constitutes a bottom shell blank, and the portion of the fourth metal sheet facing the groove constitutes a top shell blank.

[0043] In a possible implementation manner of the third aspect, the thickness of the third metal plate is 2 to 10 mm; the thickness of the fourth metal plate is 0.5 to 10 mm.

[0044] In a possible implementation manner of the third aspect, before heat treating the blank of the metal shell, the method further includes:

[0045] A first welding piece is arranged between the top shell blank and the heat conducting plate, and a second welding piece is arranged between the bottom shell blank and the heat conducting plate.

[0046] In the solid-state temperature spreader provided in the present application, a plurality of first through holes are arranged in the heat conducting plate along its thickness direction, and a plurality of metal pillars are arranged in the metal shell. Since each metal pillar is correspondingly inserted into a first through hole, and the two ends of each metal pillar are respectively connected to the top shell and the bottom shell, when the top shell and the bottom shell are thinned by machining, the plurality of metal pillars can apply a pulling force between the top shell and the bottom shell to counteract the pulling force applied by machining, thereby reducing the probability of the top shell or the bottom shell being lifted up, and can improve the processing yield and manufacturing stability of the solid-state temperature spreader while ensuring that the thickness of the top shell and the bottom shell is relatively thin. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1A schematic diagram of the structure of a solid-state temperature vapor chamber provided in an embodiment of the present application;

[0048] Figure 2 A schematic diagram of a top view of a solid-state temperature vapor chamber provided in an embodiment of the present application;

[0049] Figure 3 A schematic diagram of the structure of a solid-state temperature vapor chamber provided in an embodiment of the present application;

[0050] Figure 4 A physical picture of a solid-state temperature vapor chamber provided in Example 1;

[0051] Figure 5 A physical picture of a solid-state temperature equalizing plate provided for comparative example 1. DETAILED DESCRIPTION

[0052] To facilitate understanding of the present application, a more comprehensive description of the present application will be provided below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present application. However, the present application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the disclosure of the present application.

[0053] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0054] In order to solve the problem in the related art that the metal shell is easily damaged during the manufacturing process, which is not conducive to improving the yield rate of the vapor chamber, the applicant has sought a new solid-state vapor chamber structure to solve the above problem. The specific implementation method is described as follows:

[0055] Some embodiments of the present application provide a solid-state temperature distribution plate, such as Figure 1 and Figure 2 As shown, it includes: a heat conducting plate 1 and a metal shell 2. The material of the heat conducting plate 1 is a graphene metal composite material. The metal shell 2 is coated on the outside of the heat conducting plate 1 and is in close contact with or welded to the heat conducting plate 1. Along the thickness direction of the heat conducting plate 1, the metal shell 2 includes a top shell 21 and a bottom shell 22 located on both sides of the thickness direction of the heat conducting plate 1. The heat conducting plate 1 is provided with a plurality of first through holes P along its thickness direction. A plurality of metal columns 3 are provided in the metal shell 2. Each metal column 3 is correspondingly inserted into a first through hole P, and the two ends of each metal column 3 are respectively connected to the top shell 21 and the bottom shell 22.

[0056] A graphene-metal composite material refers to a material comprising graphene and metal. The graphene and metal can be combined in any form. For example, the graphene and metal can be combined in a stacked manner to form the graphene-metal composite material.

[0057] According to the material of the outermost layer of the heat conducting plate 1 , the metal shell 2 can be in close contact with or welded to the heat conducting plate 1 .

[0058] Specifically, when the outermost layer of the heat conducting plate 1 is made of graphene, the metal shell 2 can be in close contact with the heat conducting plate 1. When the outermost layer of the heat conducting plate 1 is made of metal, the metal shell 2 can be welded to the heat conducting plate 1. Both can effectively improve the heat transfer efficiency between the heat conducting plate 1 and the metal shell 2, thereby improving the heat dissipation effect.

[0059] However, experiments have shown that in the above structure, when multiple first through holes P are not provided on the above heat conducting plate 1 and multiple metal pillars 3 are not provided in the metal shell 2, no matter which of the above connection methods is used, when the solid temperature spreader is formed by the above-mentioned thermoforming method and then the metal shell 2 such as the top shell 21 and the bottom shell 22 are thinned by machining, the bonding force between the middle part of the top shell 21 and the bottom shell 22 and the heat conducting plate 1 is not sufficient to resist the pulling force applied by machining, especially when the top shell 21 and the bottom shell 22 are thinner, the middle part of the top shell 21 and the bottom shell 22 is torn, causing the top shell 21 or the bottom shell 22 to be easily lifted up, thereby causing the internal heat conducting plate 1 to leak out, which is not conducive to the processing yield and manufacturing stability of the solid temperature spreader.

[0060] Based on the above, the present application sets a plurality of first through holes P along the thickness direction of the heat conducting plate 1 and sets a plurality of metal pillars 3 in the metal shell 2. Since each metal pillar 3 is correspondingly arranged in a first through hole P, and the two ends of each metal pillar 3 are respectively connected to the top shell 21 and the bottom shell 22, when the top shell 21 and the bottom shell 22 are thinned by machining, the plurality of metal pillars 3 can apply a pulling force between the top shell 21 and the bottom shell 22 to counteract the pulling force applied by machining, thereby reducing the probability of the top shell 21 or the bottom shell 22 being lifted up, and can improve the processing yield and manufacturing stability of the solid-state temperature equalizing plate while ensuring that the thickness of the top shell 21 and the bottom shell 22 are relatively thin.

[0061] It should be noted that the number of metal pillars 3 and the total projected area on the plane where the heat conducting plate 1 is located are not necessarily larger. This is because: as the total projected area of ​​the metal pillars 3 on the plane where the heat conducting plate 1 is located increases, although it can increase the joint strength between the top shell 21 and the bottom shell 22, it is not conducive to maintaining the heat dissipation area of ​​the heat conducting plate 1.

[0062] In some embodiments, the total projection area of ​​the plurality of first through holes P on the heat conducting plate 1 is no greater than 40% of the total area of ​​the heat conducting plate 1 .

[0063] In these embodiments, by arranging the total projected area of ​​the plurality of first through holes P on the heat conducting plate 1 to be no greater than 40% of the total area of ​​the heat conducting plate 1, the bonding strength between the middle portion of the top shell 21 and the bottom shell 22 can be increased while maintaining a sufficient heat dissipation area of ​​the heat conducting plate 1, thereby ensuring that the solid-state temperature vapor chamber has good heat dissipation performance.

[0064] In some embodiments, the thickness of the top shell 21 and the bottom shell 22 are both 0.3-0.8 mm.

[0065] In these embodiments, by maintaining the thickness of the top shell 21 and the bottom shell 22 within the range of 0.3 to 0.8 mm, it is possible to ensure that heat is more effectively transferred to the heat conducting plate 1, thereby facilitating the solid-state temperature dispersion plate to better dissipate heat from the heat dissipation device and improve the heat dissipation efficiency.

[0066] There is no specific limitation on the connection method between the two ends of the above-mentioned multiple metal pillars 3 and the top shell 21 and the bottom shell 22. As long as the two ends of the multiple metal pillars 3 are in a connected state with the top shell 21 and the bottom shell 22 after the solid-state temperature plate is manufactured, it is sufficient. For example, the two ends of the multiple metal pillars 3 can be welded to the top shell 21 and the bottom shell 22. Since the metal pillars 3 and the top shell 21 and the bottom shell 22 are all made of metal materials, the connection strength of the metal pillars 3 and the top shell 21 and the bottom shell 22 can be increased, thereby improving the bonding force between the middle parts of the top shell 21 and the bottom shell 22, and reducing the chance of the top shell 21 or the bottom shell 22 being lifted.

[0067] In some embodiments, as Figure 1 As shown, the first end of each metal column 3 is integrally formed with one of the top shell 21 and the bottom shell 22 , and the second end is welded to the other one of the top shell 21 and the bottom shell 22 .

[0068] In these embodiments, since the first end of each metal pillar 3 is integrally formed with one of the top shell 21 and the bottom shell 22, and the second end is welded to the other one of the top shell 21 and the bottom shell 22, on the one hand, the material of the multiple metal pillars 3 is the same as that of the metal shell 2. During welding, the welding firmness of the second end of the metal pillar 3 and the top shell 21 or the bottom shell 22 can be improved, thereby further improving the bonding force between the middle part of the top shell 21 and the bottom shell 22, and reducing the probability of the top shell 21 or the bottom shell 22 being lifted up; on the other hand, the first ends of the multiple metal pillars 3 are integrally formed with the top shell 21 or the bottom shell 22, which can further improve the connection firmness of the first end of the metal pillar 3 and the top shell 21 or the bottom shell 22, thereby further improving the bonding force between the middle part of the top shell 21 and the bottom shell 22, and further reducing the probability of the top shell 21 or the bottom shell 22 being lifted up, and further improving the processing yield and manufacturing stability of the solid-state temperature dispersion board.

[0069] In some embodiments, the material of the metal shell 2 is selected from any one element or alloy composed of multiple elements among aluminum, copper and nickel.

[0070] In some embodiments, the heat conducting plate 1 includes a metal layer and a graphene layer stacked along the thickness direction of the heat conducting plate 1, and the outermost layer of the heat conducting plate 1 is a metal layer. The outermost metal layer of the heat conducting plate 1 is welded to the top shell 21 and the bottom shell 22 respectively.

[0071] In these embodiments, the heat conducting plate 1 is a laminated structure of metal and graphene layers, and along the thickness direction of the heat conducting plate 1, the outermost layer of the heat conducting plate 1 is a metal layer. In this way, during the thermoforming process, the top shell 21 and the bottom shell 22 of the metal shell 2 are both atomically diffused and welded to the metal layer of the heat conducting plate 1. Compared with close contact between the metal shell 2 and the heat conducting plate 1, this can further enhance the bond strength between the top shell 21 and the bottom shell 22 and the heat conducting plate 1, thereby further reducing the chance of the top shell 21 or the bottom shell 22 being lifted, and improving the processing yield and manufacturing stability of the solid-state temperature vapor chamber.

[0072] In some embodiments, as Figure 1 As shown, the solid-state vapor chamber further includes a first welding layer 4 and a second welding layer 5. The first welding layer 4 is located between the top shell 21 and the heat conducting plate 1. One side of the first welding layer 4 is welded to the top shell 21 and the first end of the metal pillar 3, while the other side is in close contact with or welded to the heat conducting plate 1. The second welding layer 5 is located between the bottom shell 22 and the heat conducting plate 1. One side of the second welding layer 5 is welded to the bottom shell 22 and the second end of the metal pillar 3, while the other side is in close contact with or welded to the heat conducting plate 1.

[0073] In these embodiments, by setting the first welding layer 4 and the second welding layer 5, the top shell 21 can be welded to the first welding layer 4, and the bottom shell 22 can be welded to the second welding layer 5. Compared with the top shell 21 directly in close contact or welding with the heat conducting plate 1, and the bottom shell 22 directly in close contact or welding with the heat conducting plate 1, the connection firmness of the middle part of the top shell 21 and the bottom shell 22 can be further increased, and the top shell 21 is welded to the first end of the metal column 3 through the first welding layer 4, and the bottom shell 22 is welded to the second end of the metal column 3 through the second welding layer 5, which can improve the bonding firmness of the middle part of the top shell 21 and the bottom shell 22.

[0074] When the outermost layer of the heat conducting plate 1 is made of graphene, during the thermoforming process, both the first welding layer 4 and the second welding layer 5 are in close contact with the heat conducting plate 1. When the outermost layer of the heat conducting plate 1 is made of metal, during the thermoforming process, both the first welding layer 4 and the second welding layer 5 are welded to the heat conducting plate 1.

[0075] It should be noted that in the above structure, since one end of the metal column 3 is integrally formed with one of the top shell 21 and the bottom shell 22, and the other end is welded to the other of the top shell 21 and the bottom shell 22, when setting the first welding layer 4 and the second welding layer 5, the first welding layer 4 or the second welding layer 5 can be provided with a through hole for the metal column 3 to pass through, so that the first welding layer 4 and the second welding layer 5 can be welded or in close contact with the metal shell 2 and the heat conducting plate 1 respectively.

[0076] Here, there are two possible situations:

[0077] In the first scenario, the first end of each metal pillar 3 is integrally formed with the top shell 21, and the first soldering layer 4 is provided with a plurality of second through-holes for the second ends of the metal pillars 3 to pass through. In other words, each metal pillar 3 is integrally formed with the top shell 21, and the first soldering layer 4 is provided with through-holes.

[0078] The second scenario: The second end of each metal pillar 3 is integrally formed with the bottom shell 22, and the second welding layer 5 is further provided with a plurality of third through holes Q for the first ends of the metal pillars 3 to pass through. In other words, each metal pillar 3 is integrally formed with the bottom shell 22, and the second welding layer 5 is provided with through holes.

[0079] Of course, in some embodiments, such as Figure 1 As shown, the first ends of the first metal pillars 3 are integrally formed with the top shell 21, and the first welding layer 4 is further provided with a plurality of second through-holes for the second ends of the first metal pillars 3 to pass through. The second ends of the second metal pillars 3 are integrally formed with the bottom shell 22, and the second welding layer 5 is further provided with a plurality of third through-holes Q for the first ends of the second metal pillars 3 to pass through. In other words, some metal pillars 3 are integrally formed with the top shell 21, while another portion of the metal pillars 3 is integrally formed with the bottom shell 22, and through-holes are provided on both the first welding layer 4 and the second welding layer 5, which also fall within the scope of protection of this application.

[0080] The above describes the specific structure of the solid-state temperature equalizer. In the actual manufacturing process, the metal shell 2 and the metal column 3 can be combined in any possible form as long as the solid-state temperature equalizer can be obtained.

[0081] In some embodiments, as Figure 1 As shown, the solid-state temperature vapor chamber further comprises: a first metal plate 6 and a second metal plate 7, which are stacked. A groove W is provided on the surface of the first metal plate 6 facing the second metal plate 7. The heat conducting plate 1 is disposed within the groove. The portion of the first metal plate 6 surrounding the groove and the portion of the second metal plate 7 surrounding the groove are welded to form a metal shell 2. The bottom of the groove forms the bottom shell 22, and the portion of the second metal plate 7 facing the groove forms the top shell 21.

[0082] In these embodiments, the metal shell 2 can be obtained by welding the first metal plate 6 as the bottom plate and the second metal plate 7 as the cover plate, which is simple and convenient to manufacture.

[0083] In some embodiments, as Figure 1 As shown, in the case where the solid-state temperature equalizing plate further includes: a first welding layer 4 and a second welding layer 5, the second end of each metal column 3 is integrally formed with the bottom shell 22, and the second welding layer 5 is provided with a plurality of third through holes Q for the first end of the metal column 3 to pass through, and the first welding layer 4 also extends to cover between the portion of the first metal plate body 6 and the second metal plate body 7 surrounding the groove W, and is welded to the portion of the first metal plate body 6 and the second metal plate body 7 surrounding the groove W.

[0084] In these embodiments, since the second end of each metal pillar 3 is integrally formed with the bottom housing 22, multiple metal pillars 3 are reserved when forming the groove W in the first metal plate 6, thereby improving processing efficiency. Furthermore, by providing multiple third through holes Q in the second welding layer 5, the metal pillars 3 can pass through the second welding layer 5, allowing the bottom housing 22 to be welded to the heat conducting plate 1 through the second welding layer 5. When the top housing is welded to the heat conducting plate 1 and the first ends of the metal pillars 3 via the first welding layer 4, the first metal plate 6 and the second metal plate 7 are welded together around the groove via the first welding layer 4.

[0085] Some embodiments of the present application further provide an electronic component comprising: an electronic component body and a solid-state temperature vapor chamber as described above. The top or bottom shell of the solid-state temperature vapor chamber contacts the electronic component body and is used to dissipate heat from the electronic component body. The electronic component body can be any component in an electronic device that requires heat dissipation, such as a circuit board or battery.

[0086] When the solid-state temperature equalizer is used to dissipate heat from the electronic component body, the top shell 21 or bottom shell 22 of the solid-state temperature equalizer is in contact with the heat-generating part of the electronic component body, and the heat is transferred to the heat conducting plate 1 through the top shell 21 or bottom shell 22, and then transferred to the cooling end by the heat conducting plate 1.

[0087] Some embodiments of the present application also provide a method for preparing a solid-state temperature homogenizer, such as Figure 3 Shown, including:

[0088] A plurality of first through holes P are machined on the heat conducting plate 1 along its thickness direction. The heat conducting plate 1 is made of a graphene metal composite material.

[0089] A metal shell blank 10 is manufactured, and a plurality of metal columns 3 are manufactured in the metal shell blank 10. The metal shell blank 10 includes a top shell blank 101 and a bottom shell blank 102.

[0090] Place the heat conducting plate 1 in the blank 10 of the metal shell, so that the top shell blank 101 and the bottom shell blank 102 are respectively located on opposite sides of the heat conducting plate 1 along its thickness direction, and each metal pillar 3 is connected to the heat conducting plate 1 by passing through a first through hole P in a one-to-one correspondence;

[0091] The metal shell body 10 is heat-treated so that the metal shell body 10 is wrapped around the outside of the heat conducting plate 1 and is in close contact with or welded to the heat conducting plate 1. The two ends of each metal column 3 are respectively connected to the top shell body 101 and the bottom shell body 102;

[0092] The blank 10 of the metal shell is machined to prepare a solid temperature balancing plate of a preset size.

[0093] Before heat treatment, the thickness of the heat conducting plate 1 and the size of the metal shell body 10 can be designed based on the target size of the solid-state vapor chamber (i.e., the preset size). The structure combining the heat conducting plate 1 and the metal shell body 10 is then fabricated based on the thickness of the heat conducting plate 1 and the size of the metal shell body 10. Heat treatment and machining are then performed to obtain a solid-state vapor chamber of the preset size.

[0094] In order to ensure that the blank (ie the blank 10 of the metal shell) does not deform excessively during the subsequent forming process, optionally, a processing allowance of 5 to 10 mm is reserved for the thickness of the top shell blank and the bottom shell blank before heat treatment.

[0095] That is, the thickness of the top shell blank and the bottom shell blank has a processing allowance of 5 to 10 mm relative to the thickness of the top shell and the bottom shell of the metal shell to be finally obtained.

[0096] In some embodiments, the blank 10 for making the metal shell includes:

[0097] Providing a third metal sheet 30 and a fourth metal sheet 40;

[0098] A groove W is formed on one surface of the third metal plate 30 along its thickness direction, and a plurality of metal pillars 3 are formed in the groove W;

[0099] The fourth metal plate 40 is placed on the groove W and welded to the portion of the third metal plate 30 surrounding the groove W to form the blank 10 of the metal shell;

[0100] The bottom of the groove W constitutes a bottom shell blank 102 , and the portion of the fourth metal plate 40 facing the groove W constitutes a top shell blank 101 .

[0101] In these embodiments, a plurality of metal pillars 3 can be formed by forming the grooves W on the third metal plate 30 , which is convenient to manufacture.

[0102] like Figure 1 、 Figure 2 and Figure 3 As shown, taking the example of using the third metal plate 30 as the bottom plate, the fourth metal plate 40 as the cover plate, and the metal column 3 and the bottom shell blank 102 to form an integrated structure during manufacturing, the thickness of the final solid temperature equalizing plate is equal to the sum of the thickness of the top shell 21, the thickness of the bottom shell 22 and the thickness of the heat conducting plate 1.

[0103] Taking the final thickness of the top shell 21 and the bottom shell 22 as 0.1-1 mm, and the metal shell blank 10 having a processing allowance of 5 to 10 mm relative to the size of the final metal shell as an example, the thickness of the third metal sheet 30 can be 2-10 mm, and the thickness of the fourth metal sheet 40 is 0.5-10 mm.

[0104] Based on the above structure, when the third metal sheet 30 and the fourth metal sheet 40 are combined to form the blank 10 of the metal shell, the blank 10 of the metal shell can be heat treated by stir friction welding. In this way, the third metal sheet 30 and the fourth metal sheet 40 can be welded together around the groove, so that the fourth metal sheet 40 is in close contact or welded with the heat conducting plate 1 and welded with the first end of the metal column 3, and the bottom of the groove is in close contact or welded with the heat conducting plate 1.

[0105] In some embodiments, before heat treating the blank 10 of the metal shell, the method further comprises:

[0106] A first welding piece 20 is provided between the top shell blank 101 and the heat conducting plate 1 , and a second welding piece 50 is provided between the bottom shell blank 102 and the heat conducting plate 1 .

[0107] In these embodiments, by arranging a first welding piece 20 between the top shell blank 101 and the heat conducting plate 1, and arranging a second welding piece 50 between the bottom shell blank 102 and the heat conducting plate 1, when the blank 10 of the metal shell is heat treated, the top shell blank 101 and the heat conducting plate 1 can be welded together by the first welding piece 20, and the bottom shell blank 102 and the heat conducting plate 1 can be welded together by the second welding piece 50.

[0108] In this case, diffusion welding may be used to heat treat the blank 10 of the metal shell.

[0109] In some embodiments, the thickness of the first solder tab 20 and the second solder tab 50 may be 0.05-0.5 mm.

[0110] In some embodiments, the temperature and time of diffusion bonding can be selected according to the material of the metal shell.

[0111] In some embodiments, taking the blank of the metal shell as aluminum as an example, the diffusion welding temperature is 580-640°C, the time is 0.2-10 hours, and the vacuum degree is 1×10 -3 ~9×10 -3 Pa.

[0112] In some embodiments, taking the metal shell body as copper as an example, the diffusion welding temperature is 800-1100°C, the time is 0.2-20h, and the vacuum degree is 1×10 -3 ~9×10 -3 Pa.

[0113] The above describes the specific implementation methods of the present application. In order to objectively illustrate the technical effects produced by the present application, the following examples and comparative examples will be used for description.

[0114] In the following examples and comparative examples, all raw materials can be purchased commercially, and in order to maintain the reliability of the experiments, the raw materials used in the following examples and comparative examples have the same physical and chemical parameters or have undergone the same treatment.

[0115] Example 1

[0116] Step 1) The graphene metal high thermal conductivity layer is 2 mm thick, the outer metal layer is aluminum, and the thickness of the shell (that is, the third metal plate as the base plate) in the blank size is 10 mm, and the thickness of the cover (that is, the fourth metal plate as the cover plate) is 5 mm.

[0117] Step 2) Processing the graphene metal high thermal conductivity layer into an outer shape and processing 12 holes;

[0118] Step 3) Processing a corresponding groove in the bottom plate of the aluminum shell. The length and width of the groove and the position of the boss correspond to the size of the graphene metal high thermal conductivity layer. The thickness is the thickness of the graphene metal high thermal conductivity layer plus the thickness of a soldering sheet. The thickness of the soldering sheet is 0.1 mm.

[0119] Step 4) Processing a bottom aluminum soldering piece, the outer dimensions of which are the same as those of the graphene metal high thermal conductivity layer;

[0120] Step 5) Process the cover and upper aluminum welding piece in the aluminum shell. The dimensions of these two parts are the same as the outer dimensions of the bottom plate in the metal shell.

[0121] Step 6) The five samples (base plate, cover plate, upper and lower welding pieces and graphene metal high thermal conductivity layer) were acid- and alkali-washed, soaked in 15% sodium hydroxide solution at room temperature for 6 minutes, and soaked in 4% nitric acid at room temperature for 1 minute;

[0122] Step 7) The entire blank sample is formed by diffusion welding at a temperature of 620°C, a time of 0.5h, and a vacuum degree of 10 -3 Pa or above;

[0123] Step 8) Processing the high thermal conductivity graphene solid-state temperature equalizer to the target size by machining.

[0124] Comparative Example 1

[0125] The preparation method of Comparative Example 1 is basically the same as that of Example 1, except that no hole structure is processed on the graphene metal high thermal conductivity layer, and the forming of the base plate, cover plate, upper and lower welding plates and graphene metal high thermal conductivity layer is completed by diffusion welding.

[0126] Experimental example

[0127] After the preparation of Example 1, the Figure 3 After the solid-state temperature equalizing plate shown in the comparative example 1 is prepared, the Figure 4 Solid-state vapor chamber shown.

[0128] Depend on Figure 3 and Figure 4 It can be seen that by providing the metal pillars, the top shell or the bottom shell can be prevented from being lifted during the thermoforming and machining processes, thereby improving the processing yield and manufacturing stability of the solid-state temperature vapor chamber.

[0129] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0130] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A solid-state temperature equalizer, characterized in that: include: A heat conducting plate, wherein the material of the heat conducting plate is a graphene metal composite material; as well as A metal shell, the metal shell covering the outer side of the heat conducting plate and being in close contact with or welded to the heat conducting plate; Along the thickness direction of the heat conducting plate, the metal shell includes a top shell and a bottom shell located on both sides of the heat conducting plate in the thickness direction. The heat conducting plate is provided with a plurality of first through holes along its thickness direction. A plurality of metal pillars are provided in the metal shell, each of the metal pillars is correspondingly inserted into one of the first through holes, and both ends of each metal pillar are connected to the top shell and the bottom shell respectively. The solid-state temperature homogenizing plate further includes a first welding layer and a second welding layer; The first welding layer is located between the top shell and the heat conducting plate, and one side of the first welding layer is welded to the top shell and the first end of the metal column, and the other side is in close contact with or welded to the heat conducting plate; The second welding layer is located between the bottom shell and the heat conducting plate, and one side of the second welding layer is welded to the bottom shell and the second end of the metal column, and the other side is in close contact with or welded to the heat conducting plate; The first welding layer and the second welding layer are respectively obtained by welding a first welding piece and a second welding piece, and the thickness of the first welding piece and the second welding piece is 0.05-0.5 mm; The thickness of the top shell and the bottom shell are both 0.3-0.8 mm.

2. The solid-state temperature vapor chamber according to claim 1, wherein: One end of each metal column is integrally formed with one of the top shell and the bottom shell, and the other end is welded to the other one of the top shell and the bottom shell.

3. The solid-state temperature vapor chamber according to claim 1, wherein: The heat conducting plate comprises a metal layer and a graphene layer stacked along a thickness direction of the heat conducting plate, and the outermost layer of the heat conducting plate is the metal layer; The outermost metal layer of the heat conducting plate is welded to the top shell and the bottom shell respectively.

4. The solid-state temperature vapor chamber according to claim 1, wherein: The first end of each metal column is integrally formed with the top shell, and the first welding layer is further provided with a plurality of second through holes for the second end of the metal column to pass through; Alternatively, the second end of each of the metal pillars is integrally formed with the bottom shell, and the second welding layer is further provided with a plurality of third through holes for the first end of the metal pillar to pass through.

5. The solid-state temperature vapor chamber according to claim 1 or 4, characterized in that: The solid-state temperature homogenizing plate further comprises a first metal plate body and a second metal plate body which are stacked; A groove is provided on the surface of the first metal plate body facing the second metal plate body, the heat conducting plate is provided in the groove, and a portion of the first metal plate body surrounding the groove and a portion of the second metal plate body surrounding the groove are welded to form the metal shell; The bottom of the groove constitutes the bottom shell, and the portion of the second metal plate facing the groove constitutes the top shell.

6. The solid-state temperature vapor chamber according to claim 5, characterized in that: The second end of each metal column is integrally formed with the bottom shell, and a plurality of third through holes are provided on the second welding layer for the first end of the metal column to pass through. The first welding layer also extends to cover between the first metal plate body and the second metal plate body around the groove, and is welded to the first metal plate body and the second metal plate body around the groove.

7. The solid-state temperature vapor chamber according to any one of claims 1 to 4 and 6, characterized in that: A total projection area of ​​the plurality of first through holes on the heat conducting plate is no greater than 40% of a total area of ​​the heat conducting plate.

8. The solid-state temperature vapor chamber according to any one of claims 1 to 4 and 6, characterized in that: The material of the metal shell is selected from any one element or alloy composed of multiple elements among aluminum, copper and nickel.

9. An electronic component, characterized in that: include: Electronic component body, and The solid-state temperature vapor chamber according to any one of claims 1 to 8; The top shell or the bottom shell of the solid-state temperature homogenizing plate is in contact with the electronic component body, and is used to dissipate heat from the electronic component body.

10. A method for preparing a solid-state temperature vapor chamber according to any one of claims 1 to 8, characterized in that: The steps include: A plurality of first through holes are processed on the heat conducting plate along the thickness direction thereof, wherein the material of the heat conducting plate is a graphene metal composite material; Manufacturing a blank of a metal shell, and manufacturing a plurality of metal columns in the blank of the metal shell, wherein the blank of the metal shell includes a top shell blank and a bottom shell blank; Placing the heat conducting plate within the blank of the metal shell so that the top shell blank and the bottom shell blank are respectively located on opposite sides of the heat conducting plate along the thickness direction thereof, and each metal column passes through one of the first through holes in a one-to-one correspondence to connect with the heat conducting plate; Heat-treating the blank of the metal shell so that the blank of the metal shell is wrapped around the outer side of the heat conducting plate and is in close contact with or welded to the heat conducting plate, and both ends of each metal column are connected to the top shell blank and the bottom shell blank respectively; The blank of the metal shell is machined to prepare the solid temperature homogenizing plate of a preset size.

11. The method according to claim 10, characterized in that A processing allowance of 5 to 10 mm is reserved for the thickness of the top shell blank and the bottom shell blank before heat treatment.

12. The method according to claim 10 or 11, characterized in that The method of manufacturing the blank of the metal shell comprises the following steps: providing a third metal sheet and a fourth metal sheet; A groove is formed on one surface of the third metal plate along its thickness direction, and a plurality of metal columns are formed in the groove; The fourth metal sheet is placed on the groove and welded to the portion of the third metal sheet surrounding the groove to form a blank of the metal shell; The bottom of the groove constitutes a bottom shell blank, and the portion of the fourth metal sheet facing the groove constitutes a top shell blank.

13. The method according to claim 12, characterized in that The thickness of the third metal plate is 2-10 mm; the thickness of the fourth metal plate is 0.5-10 mm.

14. The method according to claim 12, characterized in that Before heat treating the blank of the metal shell, the method further comprises: A first welding piece is provided between the top shell blank and the heat conducting plate, and a second welding piece is provided between the bottom shell blank and the heat conducting plate.

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