Transparent electronic devices, laminated glass, and manufacturing methods of transparent electronic devices

Abstract

The transparent electronic device of the present invention comprises: a transparent insulating substrate; and electronic components formed on the main surface of the transparent insulating substrate, having a surface area of ​​250,000 μm. 2 The area below; and an opaque power supply body, supplying power to the electronic components. The electronic components are light-emitting diodes or sensors. The transparent insulating substrate includes: a first transparent insulating substrate (10a) on one of its main surfaces having an electronic component and a first wiring (40) connected to the electronic component; and a second transparent insulating substrate (10b) on one of its main surfaces having a second wiring (40), the second transparent insulating substrate not having an electronic component formed thereon, one end of the first wiring (40) being electrically connected to one end of the second wiring (40), and an opaque power supply body (60) being connected to the other end of the second wiring (40) at the edge of the second transparent insulating substrate (10b).

Description

Technical Field

[0001] This invention relates to transparent electronic devices, laminated glass, and methods for manufacturing transparent electronic devices. Background Technology

[0002] As disclosed in Patent Document 1, the inventors have developed a transparent display device that uses tiny light-emitting diode (LED) elements formed on a transparent insulating substrate as pixels. Because the back side of such a transparent display device can be identified through it, it is installed in transparent components such as windows or partitions of vehicles or buildings. As a related technology, transparent sensing and detection devices with micro-sensors disposed on a transparent insulating substrate are known.

[0003] In this specification, electronic devices that have electronic components formed on a transparent insulating substrate and can be identified on the back side, such as transparent display devices and transparent sensing devices, are referred to as "transparent electronic devices".

[0004] Patent Document 1: International Publication No. 2019 / 146634

[0005] Regarding such transparent electronic devices, the inventors discovered the following problems.

[0006] The power supply unit (e.g., flexible wiring board) used to supply power to transparent electronic devices is opaque and therefore connected to the edge of the transparent electronic device. Consequently, depending on the placement of the electronic components within transparent components such as windows, the draw distance of the tiny wiring connecting the electronic components and the power supply unit increases (i.e., the transparent electronic device becomes larger), leading to a decrease in the yield rate of the transparent electronic device. Summary of the Invention

[0007] The present invention provides a transparent electronic device having the following structure[1].

[0008] [1] A transparent electronic device, wherein,

[0009] The aforementioned transparent electronic device possesses:

[0010] Transparent insulating substrate;

[0011] Electronic components, formed on the main surface of the aforementioned transparent insulating substrate, have a thickness of 250,000 μm. 2 The following areas; and

[0012] An opaque power supply element supplies power to the aforementioned electronic components.

[0013] The aforementioned electronic components are light-emitting diodes (LEDs) or sensors.

[0014] The aforementioned transparent insulating substrate includes:

[0015] A first transparent insulating substrate has the aforementioned electronic components and a first wiring connected to the aforementioned electronic components formed on one of its main surfaces; and

[0016] A second transparent insulating substrate has a second wiring formed on one of its main surfaces.

[0017] The aforementioned second transparent insulating substrate does not have the aforementioned electronic components formed on it.

[0018] One end of the first wiring is electrically connected to one end of the second wiring, and at the edge of the second transparent insulating substrate, the opaque power supply is connected to the other end of the second wiring.

[0019] In one embodiment of the invention,

[0020] [2] According to the transparent electronic device described in [1], the first transparent insulating substrate and the second transparent insulating substrate overlap when viewed from above, and one end of the first wiring is electrically connected to one end of the second wiring in the overlapping portion of the first transparent insulating substrate and the second transparent insulating substrate.

[0021] [3] According to the transparent electronic device described in [2], the entire first transparent insulating substrate overlaps with the second transparent insulating substrate when viewed from above.

[0022] [4] According to the transparent electronic device described in [2] or [3], the main surface of one of the first transparent insulating substrates is opposite to the main surface of one of the second transparent insulating substrates and overlaps when viewed from above.

[0023] [5] The transparent electronic device described in any one of [1] to [4], wherein the area in the first transparent insulating substrate in which the electronic element is disposed does not overlap with the second wiring.

[0024] [6] The transparent electronic device described in any one of [1] to [5], wherein the electronic element is a light-emitting diode element, and the light-emitting diode element constitutes a transparent display device.

[0025] [7] The transparent electronic device described in any one of [1] to [6], wherein the second transparent insulating substrate is flexible.

[0026] [8] A transparent electronic device according to any one of [1] to [7], wherein one end of the first wiring and one end of the second wiring are electrically connected via a conductive bonding layer.

[0027] [9] A laminated glass, wherein,

[0028] The aforementioned laminated glass has the following features:

[0029] A pair of glass plates arranged opposite each other; and

[0030] The first intermediate film and the second intermediate film are disposed between the pair of glass plates.

[0031] The transparent electronic device described in any of [1] to [8] is held between the first intermediate film and the second intermediate film.

[0032]

[10] According to the laminated glass described in [9], a shielding layer is formed at the periphery of at least one of the two glass plates.

[0033]

[11] According to the laminated glass described in

[10] , an opaque wiring area is formed around the periphery of the transparent electronic device, which is formed as a wide area by at least one of the first wiring and the second wiring, and the opaque wiring area is configured to overlap with the shielding layer when viewed from above.

[0034]

[12] According to the laminated glass described in

[10] or

[11] , wherein the opaque power supply is configured to overlap with the shielding layer when viewed from above.

[0035]

[13] The laminated glass according to any one of

[10] to

[12] , wherein the periphery of at least one of the first transparent insulating substrate and the second transparent insulating substrate is configured to overlap with the shielding layer when viewed from above.

[0036]

[14] The laminated glass according to any one of [9] to

[13] , wherein a protective layer covering the first transparent insulating substrate is formed between the first intermediate film and the second intermediate film.

[0037]

[15] According to the laminated glass described in

[14] , the protective layer includes an interlayer that is different from the first interlayer and the second interlayer described above.

[0038]

[16] The laminated glass described in any of [9] to

[15] , wherein the pair of glass plates are bent.

[0039]

[17] The laminated glass described in any one of [9] to

[16] , wherein the laminated glass is a laminated glass for a vehicle, and the thickness of the glass panel located on the outside of the vehicle in the pair of glass panels is 1.5 mm to 3.0 mm.

[0040]

[18] The laminated glass described in any one of [9] to

[17] , wherein the periphery of the first transparent insulating substrate does not overlap with the "Test Area A" specified in the Annex "Test Area for Optical Properties and Light Resistance of Safety Glass" of JIS Standard R3212:2015 (Test Methods for Safety Glass for Automobiles) when viewed from above.

[0041]

[19] The laminated glass described in any one of [9] to

[18] , wherein the periphery of the second transparent insulating substrate does not overlap with the "Test Area A" specified in the Annex "Test Area for Optical Properties and Light Resistance of Safety Glass" of JIS Standard R3212:2015 (Test Methods for Safety Glass for Automobiles) when viewed from above.

[0042] The present invention provides a method for manufacturing a transparent electronic device having the following

[20] structure.

[0043]

[20] A method for manufacturing a transparent electronic device, wherein,

[0044] On one of the main surfaces of the first transparent insulating substrate, a surface with a diameter of 250,000 μm is formed. 2 The following are electronic components of the area and the first wiring connected to the aforementioned electronic components.

[0045] Instead of forming the aforementioned electronic components, a second wiring is formed on one of the main surfaces of the second transparent insulating substrate.

[0046] One end of the first wiring is electrically connected to one end of the second wiring, and an opaque power supply body for supplying power to the electronic component is connected to the other end of the second wiring at the edge of the second transparent insulating substrate.

[0047] According to the present invention, transparent electronic devices with excellent yield can be provided. Attached Figure Description

[0048] Figure 1 This is a schematic top view illustrating an example of a transparent display device according to the first embodiment.

[0049] Figure 2 yes Figure 1 A cross-sectional view at the II-II cut line.

[0050] Figure 3 This is a schematic partial top view representing an example of display area 101.

[0051] Figure 4 yes Figure 3 A cross-sectional view at the IV-IV cut line.

[0052] Figure 5This is a cross-sectional view illustrating an example of a method for manufacturing a transparent display device according to the first embodiment.

[0053] Figure 6 This is a cross-sectional view illustrating an example of a method for manufacturing a transparent display device according to the first embodiment.

[0054] Figure 7 This is a cross-sectional view illustrating an example of a method for manufacturing a transparent display device according to the first embodiment.

[0055] Figure 8 This is a cross-sectional view illustrating an example of a method for manufacturing a transparent display device according to the first embodiment.

[0056] Figure 9 This is a cross-sectional view illustrating an example of a method for manufacturing a transparent display device according to the first embodiment.

[0057] Figure 10 This is a cross-sectional view illustrating an example of a method for manufacturing a transparent display device according to the first embodiment.

[0058] Figure 11 This is a cross-sectional view illustrating an example of a method for manufacturing a transparent display device according to the first embodiment.

[0059] Figure 12 This is a cross-sectional view illustrating an example of a method for manufacturing a transparent display device according to the first embodiment.

[0060] Figure 13 This is a schematic cross-sectional view showing the transparent display device according to a variation of the first embodiment, Example 1.

[0061] Figure 14 This is a schematic cross-sectional view showing the transparent display device according to Variation 2 of the first embodiment.

[0062] Figure 15 This is a schematic cross-sectional view showing the transparent display device according to Variation 3 of the first embodiment.

[0063] Figure 16 This is a schematic cross-sectional view showing the transparent display device involved in the modified example 4 of the first embodiment.

[0064] Figure 17 This is a schematic top view showing an example of the laminated glass according to the second embodiment.

[0065] Figure 18 yes Figure 17 A cross-sectional view at the XVIII-XVIII cut line.

[0066] Figure 19 This is a schematic cross-sectional view showing another example of the laminated glass involved in the second embodiment.

[0067] Figure 20 This is a schematic partial top view illustrating an example of a transparent display device according to the third embodiment.

[0068] Figure 21 This is a schematic partial top view illustrating an example of the transparent sensing detection device according to the fourth embodiment.

[0069] Figure 22 This is a schematic cross-sectional view of sensor 70. Detailed Implementation

[0070] Hereinafter, specific embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention should not be limited to the following embodiments. In addition, for clarity, the following description and drawings have been appropriately simplified.

[0071] In this specification, "transparent display device" refers to a display device that can identify visual information such as people and backgrounds located on the back side of the display device under the desired usage environment. The ability to identify is determined at least when the display device is in a non-display state, i.e., when it is not powered on.

[0072] Similarly, in this specification, "transparent sensing and detection device" refers to a sensing and detection component that can identify visual information such as people and backgrounds located on the back side of the sensing and detection device in the desired usage environment. "Sensing and detection device" refers to a device that can acquire various information using sensors.

[0073] In this specification, "transparent" means that the transmittance of visible light is 40% or more, preferably 60% or more, and more preferably 70% or more. Alternatively, it may mean that the transmittance is 5% or more and the haze value is 10 or less. If the transmittance is 5% or more, then when observing the outside during the day from inside, the outside can be observed with a brightness level equal to or greater than that of the indoor environment, ensuring sufficient visibility.

[0074] Furthermore, if the transmittance is 40% or higher, the back side of the transparent display device can be identified without significant problems even if the brightness of the front and back sides is the same. Additionally, if the haze value is 10 or lower, sufficient background contrast can be ensured.

[0075] The term "transparent" has nothing to do with whether it has color; that is, it can be colorless and transparent or colored and transparent.

[0076] Furthermore, transmittance refers to the value (%) determined according to the method of ISO 9050. Haze value refers to the value determined according to the method of ISO 14782.

[0077] (First Implementation)

[0078] <Structure of Transparent Display Devices>

[0079] First, refer to Figure 1 as well as Figure 2 The structure of the transparent display device according to the first embodiment will be described. Figure 1 This is a schematic top view illustrating an example of a transparent display device according to the first embodiment. Figure 2 yes Figure 1 A cross-sectional view at the II-II cut line. Transparent display devices are a type of transparent electronic device.

[0080] In addition, of course, Figure 1 The right-handed xyz orthogonal coordinate system shown in other figures is for illustrating the positional relationships of the constituent elements. Generally, the positive z-axis is vertically upward, and the xy plane is horizontal; this is common across different figures.

[0081] like Figure 1 as well as Figure 2 As shown, the transparent display device 100 according to the first embodiment includes transparent insulating substrates 10a and 10b and a flexible wiring board 60.

[0082] Here, as Figure 1 As shown, the transparent display device 100 includes a display area 101. The display area 101 is an area composed of multiple pixels (PIX) for displaying images. The images include text. As detailed later, each pixel (PIX) includes at least one light-emitting diode element (hereinafter referred to as an LED element). That is, the transparent display device according to this embodiment is a display device in which each pixel uses a tiny LED element, and is referred to as an LED display, etc.

[0083] No LED elements are formed in the non-display areas other than display area 101.

[0084] In addition, organic EL (Organic Electro-Luminescence) displays and inorganic EL (Inorganic Electro-Luminescence) displays are also included in LED displays that have LED elements.

[0085] The transparent insulating substrate 10a (first transparent insulating substrate) includes a display area 101. Wiring 40 and LED elements connected to the wiring 40 are formed on one of the main surfaces of the transparent insulating substrate 10a. Here, the LED elements have a diameter of 250,000 μm. 2 The following is an example of a tiny electronic component with a small area.

[0086] The transparent insulating substrate (second transparent insulating substrate) 10b does not include the display area 101. Wiring 40 is formed on one main surface of the transparent insulating substrate 10b, but no LED elements are formed thereon. Furthermore, no LED elements are formed on the other main surface of the transparent insulating substrate 10b.

[0087] In other words, the transparent insulating substrate 10a includes the entire display area 101, while the transparent insulating substrate 10b does not include the display area 101. Furthermore, the transparent insulating substrate 10b only has wiring 40 formed on it. However, the transparent insulating substrate 10b may also have only electronic components other than LED elements and sensors described later, in addition to wiring 40.

[0088] Here, in Figure 1 The wiring 40, represented as a line, extends along both the x-axis and y-axis directions. The wiring 40 extending along the x-axis is wider at the positive x-axis end of the transparent insulating substrates 10a and 10b, and extends along the negative y-axis to connect with the flexible wiring board 60. That is, at least a portion of the wiring 40 extending along the negative y-axis is thicker than the portion extending along the x-axis. Similarly, the wiring 40 extending along the y-axis is wider at the negative y-axis end of the transparent insulating substrate 10b, and connects with the flexible wiring board 60. That is, in the portion of the wiring 40 extending along the y-axis, the width at the negative y-axis end is thicker than the width at the positive y-axis end.

[0089] exist Figure 1 In the diagram, the wiring 40 is schematically shown as a wide, opaque area, designated as the opaque wiring region 40a. In practice, within the opaque wiring region 40a, the wide wiring 40 is arranged in a dense wiring group. Therefore, it can be said that at least a portion of the wiring 40 disposed in the opaque wiring region 40a is thicker than the portion disposed in the display area 101. Furthermore, the wiring 40 may have approximately the same line width in both the x-axis direction (display area) and the y-axis direction (opaque wiring region 40a), or a mesh-like wiring group may be formed within the opaque wiring region 40a. Driver ICs (Integrated Circuits) for driving LED elements and components for electrostatic discharge countermeasures may also be disposed in the opaque wiring region 40a.

[0090] In addition, Figure 1Each wire 40, depicted as a single line, is composed of multiple tiny wires, as described later.

[0091] As will be described in detail later, the width of the tiny wiring 40 is, for example, 1 μm to 100 μm, preferably 3 μm to 20 μm. Since the width of the wiring 40 is less than 100 μm, the wiring 40 is almost invisible even when the transparent display device is viewed from a close distance of, for example, 10 cm to 2 m, resulting in excellent visibility on the back side.

[0092] On the other hand, the width of the wiring 40 in the opaque wiring region 40a is, for example, 100 μm to 10000 μm, preferably 100 μm to 5000 μm. The spacing between the wirings is, for example, 3 μm to 5000 μm, preferably 50 μm to 1500 μm. The wiring 40 in the opaque wiring region 40a can be identified. Therefore, the opaque wiring region 40a, which is formed in a generally L-shape when viewed from above in the xy plane along the periphery of the transparent display device 100, is covered by some method, for example.

[0093] The flexible wiring board 60 is a strip-shaped, opaque power supply element used to supply power to the display area 101. Because it is opaque, the flexible wiring board 60 is connected to the ends of the wiring 40 formed on the edge of the transparent insulating substrate 10b. Figure 1 as well as Figure 2 In the example shown, the flexible wiring board 60 is connected to the end of the opaque wiring region 40a formed on the negative y-axis side of the transparent insulating substrate 10b. The flexible wiring board 60 is also similarly covered, for example, by some method, with respect to the opaque wiring region 40a.

[0094] like Figure 1 as well as Figure 2 As shown, the ends of the transparent insulating substrates 10a and 10b overlap. At the overlapping portion of the transparent insulating substrates 10a and 10b, one end of a wiring (first wiring) 40 formed on the transparent insulating substrate 10a is electrically connected to one end of a wiring (second wiring) 40 formed on the transparent insulating substrate 10b. Furthermore, at the edge of the transparent insulating substrate 10b, the other end of the wiring 40 formed on the transparent insulating substrate 10b is connected to the flexible wiring board 60. With this structure, power can be supplied from the flexible wiring board 60 to drive the electronic components of the display area 101. Moreover, the display area 101 does not overlap with the second wiring 40 formed on the transparent insulating substrate 10b. Therefore, the transparent display device 100 can suppress the reduction of transmittance in the display area 101, resulting in excellent visibility on the back side.

[0095] Furthermore, at the overlapping portion of the transparent insulating substrates 10a and 10b, at least one of the transparent insulating substrates 10a and 10b may also have one or more cut-out portions. The cut-out portions improve the adhesion between the transparent display device 100 and the intermediate film described later, thereby making it easier to securely hold the transparent display device 100 in the laminated glass.

[0096] exist Figure 1 as well as Figure 2 In the example shown, the negative y-axis end of the wiring 40 extending along the y-axis direction in the transparent insulating substrate 10a is opposite to the positive y-axis end of the wiring 40 extending along the y-axis direction in the transparent insulating substrate 10b, and is connected via the conductive bonding layer 40b.

[0097] As the conductive bonding layer 40b, conductive adhesives such as anisotropic conductive film (ACF) and solders can be used. By using conductive adhesives and solders, the pad size can be reduced. Furthermore, burrs that occur when forming through-holes on a transparent insulating substrate are avoided, resulting in good contact. Consequently, yield reduction can be suppressed.

[0098] exist Figure 1 In the example shown, both transparent insulating substrates 10a and 10b have a rectangular planar shape. By connecting the ends of the transparent insulating substrates 10a and 10b of equal width by overlapping each other, the transparent insulating substrates 10a and 10b as a whole also have a rectangular planar shape. Figure 1 As shown, the proportion in which the ends of the transparent insulating substrates 10a and 10b overlap each other is, for example, 20% or less of the area of ​​the transparent insulating substrate 10a, preferably 10% or less, and more preferably 5% or less.

[0099] In addition, two alignment marks AM are provided on each of the transparent insulating substrates 10a and 10b for alignment. The shape and number of alignment marks AM are not limited, but... Figure 1 In the example shown, a square mark is provided on one side of the transparent insulating substrate 10a, 10b, and a cross-shaped mark is provided on the other side. The number of alignment marks AM can be one or more.

[0100] Because current transparent display devices form the display area 101 and all wiring 40 on a single transparent insulating substrate, there is a problem of increased size and decreased yield in transparent display devices. For example, even if no defects occur in the display area 101, if defects occur in the non-display area, the entire device is judged as defective. Furthermore, even if no defects occur in the non-display area, if defects occur in the display area 101, the entire device is judged as defective.

[0101] In contrast, in the transparent display device according to this embodiment, it is divided into a transparent insulating substrate 10a including the display area 101 and a transparent insulating substrate 10b not including the display area 101. Therefore, it is possible to distinguish between defects in the transparent insulating substrate 10a including the display area 101 and defects in the transparent insulating substrate 10b not including the display area 101, thereby improving the overall yield.

[0102] In addition, if one of the connected transparent insulating substrates 10a and 10b malfunctions, it is easy to replace that substrate.

[0103] Furthermore, when designing transparent display devices 100 of different sizes, for example, the design of the transparent insulating substrate 10a containing the display area 101 can be changed without altering the design of the transparent insulating substrate 10b. That is, by making the transparent insulating substrate 10a universal, the design can be simplified and the productivity in manufacturing can be improved.

[0104] In addition, Figure 1 In the example shown, the opaque wiring area 40a is formed by dividing the transparent insulating substrates 10a and 10b. However, for example, it may also be divided into a rectangular transparent insulating substrate 10a that contains the entire display area 101 and an L-shaped transparent insulating substrate 10b that contains the entire opaque wiring area 40a when viewed from above in the xy plane. Other variations will be described later.

[0105] <Detailed structure of display area 101>

[0106] Next, refer to Figure 3 as well as Figure 4 The detailed structure of the display area 101 in the transparent display device 100 according to the first embodiment will be described. Figure 3 This is a schematic partial top view representing an example of display area 101. Figure 4 yes Figure 3 A cross-sectional view at the IV-IV cut line.

[0107] For reference Figure 1 , Figure 2 As explained, the display area 101 is formed on the transparent insulating substrate 10a. (As illustrated...) Figure 3 as well as Figure 4 As shown, in the display area 101, a light-emitting portion 20, an IC (Integrated Circuit) chip 30, wiring 40, and a protective layer 50 are formed on a transparent insulating substrate 10a. Figure 3 As shown, the display area 101 is composed of multiple pixels arranged in the row direction (x-axis direction) and the column direction (y-axis direction). Figure 3A portion of display area 101 is shown, with two pixels in the row direction and two pixels in the column direction, totaling four pixels. Here, a pixel is represented by a dashed line. Additionally, in... Figure 3 In the middle, the following was omitted. Figure 4 The transparent insulating substrate 10a and protective layer 50 are shown. Furthermore, although... Figure 3 It is a top view, but for ease of understanding, the light-emitting part 20 and the IC chip 30 are represented by dots.

[0108] <Planar configuration of light-emitting unit 20, IC chip 30 and wiring 40>

[0109] First, refer to Figure 3 The planar configuration of the light-emitting part 20, the IC chip 30, and the wiring 40 will be described.

[0110] like Figure 3 As shown, the pixels PIX enclosed by dashed lines are arranged in a matrix with pixel spacing Px in the row direction (x-axis direction) and pixel spacing Py in the column direction (y-axis direction). Here, as... Figure 3 As shown, each pixel PIX has a light-emitting unit 20 and an IC chip 30. That is, the light-emitting unit 20 and the IC chip 30 are arranged in a matrix with a pixel pitch Px in the row direction (x-axis direction) and a pixel pitch Py in the column direction (y-axis direction).

[0111] Furthermore, as long as the pixels are arranged in the specified direction with the specified pixel spacing, the arrangement of the pixels (PIX), i.e. the light-emitting part 20, is not limited to a matrix shape.

[0112] like Figure 3 As shown, the light-emitting part 20 in each pixel PIX includes at least one LED element.

[0113] exist Figure 3 In the example, each light-emitting unit 20 includes a red LED element 21, a green LED element 22, and a blue LED element 23. The LED elements 21 to 23 correspond to subpixels that constitute a pixel. Thus, since each light-emitting unit 20 has LED elements 21 to 23 that emit the three primary colors of light—red, green, and blue—the transparent display device according to this embodiment can display full-color images.

[0114] Furthermore, each light-emitting unit 20 may include two or more LED elements of the same color. This allows for an increase in the dynamic range of the image.

[0115] LED elements 21 to 23 have minute dimensions and are so-called micro LED elements. Specifically, the width (length in the x-axis direction) and length (length in the y-axis direction) of LED element 21 on the transparent insulating substrate 10a are, for example, 100 μm or less, preferably 50 μm or less, and more preferably 20 μm or less. The same applies to LED elements 22 and 23. Depending on various manufacturing conditions, the lower limit of the width and length of the LED elements is, for example, 3 μm or more.

[0116] also, Figure 3 The dimensions of LED elements 21 to 23 are the same, i.e., their width and length are the same, but they can also be different from each other.

[0117] Furthermore, the area occupied by each LED element 21 to 23 on the transparent insulating substrate 10a is, for example, 10,000 μm. 2 The preferred size is 3000 μm. 2 Below, 500 μm is more preferred. 2 Furthermore, depending on various manufacturing conditions, the lower limit of the area occupied by an LED element is, for example, 10 μm. 2 That's all. Here, in this specification, the area occupied by LED components, wiring, and other constituent parts refers to... Figure 3 The area of ​​the xy plane when viewed from above.

[0118] also, Figure 3 The LED elements 21 to 23 shown are rectangular (including square), but are not specifically limited in shape.

[0119] Here, LED elements 21-23, for example, have a mirror structure for efficiently extracting light to the recognition side, therefore the transmittance of LED elements 21-23 is, for example, less than 10%, which is low. However, in the transparent display device according to this embodiment, as described above, an area of ​​10000 μm is used. 2 The LED elements 21 to 23 are extremely small. Therefore, even when observing the transparent display device from a close distance of, for example, 10 cm to 2 m, the LED elements 21 to 23 are almost invisible. In addition, the area with low transmittance in the display area 101 is narrow, resulting in excellent visibility on the back side. Moreover, the arrangement of wiring 40 and the like is highly flexible.

[0120] Here, "areas with low transmittance in display area 101" refers, for example, to areas with transmittance below 20%. The same applies below.

[0121] Furthermore, because tiny LED elements 21-23 are used, the LED elements are unlikely to be damaged even when the transparent display device is bent. Therefore, the transparent display device according to this embodiment can be installed in a curved transparent plate such as automotive window glass, or sealed between two curved transparent plates. Here, if a flexible material is used as the transparent insulating substrate 10a, the transparent display device according to this embodiment can be bent.

[0122] LED elements 21 to 23 are not particularly limited, and may be made of inorganic materials. Examples of red-based LED elements 21 include AlGaAs, GaAsP, and GaP. Examples of green-based LED elements 22 include InGaN, GaN, AlGaN, GaP, AlGaInP, and ZnSe. Examples of blue-based LED elements 23 include InGaN, GaN, AlGaN, and ZnSe.

[0123] The luminous efficiency, or energy conversion efficiency, of the LED elements 21-23 is, for example, 1% or more, preferably 5% or more, and more preferably 15% or more. If the luminous efficiency of the LED elements 21-23 is 1% or more, then, as described above, even small-sized LED elements 21-23 can achieve sufficient brightness, thus enabling their use as display devices even during the day. Furthermore, if the luminous efficiency of the LED elements is 15% or more, heat generation is suppressed, and sealing the laminated glass with a resin adhesive layer becomes easier.

[0124] The pixel pitches Px and Py are, for example, 100 μm to 3000 μm, preferably 180 μm to 1000 μm, and more preferably 250 μm to 400 μm. By keeping the pixel pitches Px and Py within these ranges, sufficient display performance can be ensured, and high transparency can be achieved. In addition, diffraction phenomena that may occur due to light from the back side of the transparent display device can be suppressed.

[0125] Furthermore, the pixel density in the display area 101 of the transparent display device according to this embodiment is, for example, 10 ppi or more, preferably 30 ppi or more, and more preferably 60 ppi or more.

[0126] Additionally, the area of ​​a pixel PIX is Px×Py, which is, for example, 1×10 4 μm 2 ~9×10 6 μm 2 Preferably 3×10 4 ~1×10 6 μm 2 More preferably 6×10 4 ~2×10 5 μm 2By setting the area of ​​a pixel to 1×10 4 μm 2 ~9×10 6 μm 2 This ensures appropriate display performance and improves the transparency of the display device. The area of ​​a single pixel can be appropriately selected based on the size, purpose, and viewing distance of the display area 101.

[0127] The area occupied by LED elements 21-23 is, for example, 30% or less, preferably 10% or less, more preferably 5% or less, and even more preferably 1% or less, relative to the area of ​​a pixel. By setting the area occupied by LED elements 21-23 to the area of ​​a pixel to 30% or less, transparency and visibility on the back side are improved.

[0128] exist Figure 3 In this configuration, within each pixel, three LED elements 21-23 are arranged in a row facing the positive x-axis, but this is not a limitation. For example, the arrangement order of the three LED elements 21-23 can be changed. Alternatively, the three LED elements 21-23 can be arranged along the y-axis. Or, the three LED elements 21-23 can be positioned at the vertices of the triangle.

[0129] In addition, such as Figure 3 As shown, when each light-emitting section 20 has multiple LED elements 21 to 23, the spacing between the LED elements 21 to 23 in the light-emitting section 20 is, for example, 100 μm or less, preferably 10 μm or less. Furthermore, the LED elements 21 to 23 can also be arranged to contact each other. This facilitates the generalization of the first power branch line 41a and improves the aperture ratio.

[0130] In addition, Figure 3 In the example, the arrangement order and orientation of the multiple LED elements in each light-emitting part 20 are the same, but they can also be different. In addition, if each light-emitting part 20 contains three LED elements that emit light of different wavelengths, the LED elements in some light-emitting parts 20 can be arranged in the x-axis direction or y-axis direction, and the LED elements of each color can be arranged at the vertices of the triangle in other light-emitting parts 20.

[0131] exist Figure 3 In this example, the IC chip 30 is configured according to each pixel and drives the light-emitting part 20. Specifically, the IC chip 30 is connected to each LED element 21-23 via a drive line 45, and can drive the LED elements 21-23 individually. The IC chip 30 is, for example, a hybrid IC having analog and logic regions. The analog region includes, for example, current control circuits and transformer circuits.

[0132] Furthermore, the IC chip 30 can also be configured to drive multiple pixels connected to each IC chip 30, with each IC chip 30 being configured to drive multiple pixels. For example, if one IC chip 30 is configured for every four pixels, the number of IC chips 30 can be reduced to [number missing]. Figure 3 This reduces the area occupied by IC chip 30 to one-quarter of the original size. Furthermore, IC chip 30 is not strictly necessary.

[0133] The area of ​​each IC chip 30 is, for example, 100,000 μm. 2 The preferred value is 10000μm. 2 Below, 5000 μm is more preferred. 2 The following is an explanation of the situation. Although the transmittance of IC chip 30 is low, around 20%, by using IC chip 30 of the above size, the area with low transmittance in display area 101 is narrowed, and the visibility on the back side is improved.

[0134] like Figure 3 As shown, the wiring 40 includes multiple power lines 41, multiple ground lines 42, multiple row data lines 43, multiple column data lines 44, and multiple drive lines 45.

[0135] exist Figure 3 In this example, power line 41, ground line 42, and column data line 44 extend along the y-axis. On the other hand, row data line 43 extends along the x-axis.

[0136] Furthermore, in each pixel, the power line 41 and column data line 44 are positioned on the negative x-axis side compared to the light-emitting unit 20 and IC chip 30, while the ground line 42 is positioned on the positive x-axis side compared to the light-emitting unit 20 and IC chip 30. Here, the power line 41 is positioned on the negative x-axis side compared to the column data line 44. Additionally, in each pixel, the row data line 43 is positioned on the negative y-axis side compared to the light-emitting unit 20 and IC chip 30.

[0137] Furthermore, although details will be discussed later, as... Figure 3 As shown, power line 41 includes a first power branch line 41a and a second power branch line 41b. Ground line 42 includes a ground branch line 42a. Row data line 43 includes a row data branch line 43a. Column data line 44 includes a column data branch line 44a. These branch lines are included in wiring 40.

[0138] like Figure 3As shown, each power line 41 extending along the y-axis is connected to the light-emitting portion 20 and the IC chip 30 of each pixel PIX arranged side-by-side in the y-axis direction. More specifically, in each pixel PIX, LED elements 21 to 23 are arranged side-by-side facing the positive x-axis direction at a position closer to the positive x-axis direction than the power line 41. Therefore, the first power branch line 41a branching from the power line 41 in the positive x-axis direction is connected to the y-axis positive direction end of the LED elements 21 to 23.

[0139] Furthermore, in each pixel PIX, the IC chip 30 is disposed on the negative y-axis side of the LED elements 21 to 23. Therefore, between the LED element 21 and the column data line 44, the second power branch line 41b, which branches off from the first power branch line 41a in the negative y-axis direction, extends in a straight line and connects to the negative x-axis side of the end of the IC chip 30 on the positive y-axis side.

[0140] like Figure 3 As shown, each grounding line 42 extending along the y-axis is connected to the IC chip 30 of each pixel PIX arranged side by side in the y-axis direction. Specifically, the grounding branch line 42a branching from the grounding line 42 in the negative x-axis direction extends in a straight line and connects to the positive x-axis side end of the IC chip 30.

[0141] Here, the grounding wire 42 is connected to the LED elements 21-23 via the grounding branch wire 42a, the IC chip 30, and the driving line 45.

[0142] like Figure 3 As shown, each row data line 43 extending along the x-axis is connected to an IC chip 30 for each pixel PIX arranged side-by-side in the x-axis direction (row direction). Specifically, a row data branch line 43a branching from the row data line 43 in the positive y-axis direction extends in a straight line and connects to the negative y-axis end of the IC chip 30.

[0143] Here, the row data line 43 is connected to the LED elements 21-23 via the row data branch line 43a, the IC chip 30, and the driver line 45.

[0144] like Figure 3 As shown, each column data line 44 extending along the y-axis is connected to the IC chip 30 of each pixel PIX arranged side by side in the y-axis direction (column direction). Specifically, the column data branch line 44a branching from the column data line 44 in the positive x-axis direction extends in a straight line and connects to the negative x-axis side end of the IC chip 30.

[0145] Here, column data line 44 is connected to LED elements 21-23 via column data branch line 44a, IC chip 30 and driver line 45.

[0146] The driving lines 45 connect the LED elements 21-23 to the IC chip 30 in each pixel. Specifically, in each pixel, three driving lines 45 extend along the y-axis direction and connect the negative y-axis end of the LED elements 21-23 to the positive y-axis end of the IC chip 30, respectively.

[0147] also, Figure 3 The configuration of power line 41, ground line 42, row data line 43, column data line 44 and their branches, and drive line 45 shown is only an example and can be modified appropriately. For example, at least one of the power line 41 and ground line 42 may extend along the x-axis instead of the y-axis. Alternatively, the structures of power line 41 and column data line 44 may be interchanged.

[0148] Alternatively, it can be made Figure 3 The structures shown are formed by reversing the top and bottom or by reversing the left and right sides.

[0149] Furthermore, row data line 43, column data line 44 and their branch lines, and drive line 45 are not required.

[0150] The wiring 40 can be made of metals such as copper (Cu), aluminum (Al), silver (Ag), or gold (Au). From the viewpoint of low resistivity and cost, metals with copper or aluminum as the main component are preferred. Alternatively, to reduce reflectivity, the wiring 40 can also be coated with materials such as titanium (Ti), molybdenum (Mo), copper oxide, or carbon. Furthermore, unevenness can be formed on the surface of the coated material.

[0151] Figure 3 The width of the wiring 40 in the display area 101 shown is, for example, 1μm to 100μm, preferably 3μm to 20μm. When the width of the wiring 40 is 100μm or less, the wiring 40 is almost invisible even when the transparent display device is viewed from a close distance of, for example, several tens of centimeters to about 2 meters, resulting in excellent visibility on the back side. On the other hand, in the thickness range described later, if the width of the wiring 40 is set to 1μm or more, it is possible to suppress excessive increase in the resistance of the wiring 40, suppress voltage drop, and suppress signal strength reduction. In addition, it is also possible to reduce the reduction in heat conduction caused by the wiring 40.

[0152] Here, as Figure 3As shown, when the wiring 40 extends primarily along the x-axis and y-axis directions, cross-shaped diffraction patterns extending along the x-axis and y-axis directions may sometimes occur due to light irradiated from outside the transparent display device, resulting in reduced visibility on the back side of the transparent display device. By reducing the width of each wiring, this diffraction can be suppressed, further improving the visibility on the back side. From the viewpoint of suppressing diffraction, the width of the wiring 40 is 50 μm or less, preferably 10 μm or less, and more preferably 5 μm or less.

[0153] The resistivity of wiring 40 is, for example, 1.0 × 10⁻⁶. -6 Below Ωm, preferably 2.0 × 10 -8 Below Ωm. Furthermore, the thermal conductivity of the wiring 40 is, for example, 150 W / (m·K) to 5500 W / (m·K), preferably 350 W / (m·K) to 450 W / (m·K).

[0154] Figure 3 The spacing between adjacent wirings 40 in the display area 101 shown is, for example, 3μm to 100μm, preferably 5μm to 30μm. If there are areas where the wirings 40 become denser, it may sometimes hinder the recognition of the rear side. If the spacing between adjacent wirings 40 is 3μm or more, this obstruction to recognition can be suppressed. On the other hand, if the spacing between adjacent wirings 40 is 100μm or less, sufficient display performance can be ensured.

[0155] Furthermore, when the spacing between the wiring 40s is not constant due to factors such as bending of the wiring 40s, the aforementioned spacing between adjacent wiring 40s refers to their minimum value.

[0156] The area occupied by the wiring 40 relative to the area of ​​a pixel is, for example, 30% or less, preferably 10% or less, more preferably 5% or less, and even more preferably 3% or less. The transmittance of the wiring 40 is low, for example, 20% or less, or 10% or less. However, by making the proportion of the area occupied by the wiring 40 in a pixel less than 30%, the area with low transmittance in the display area 101 is narrowed, and the visibility on the rear side is improved.

[0157] Furthermore, relative to the area of ​​a pixel, the total area occupied by the light-emitting part 20, the IC chip 30, and the wiring 40 is, for example, 30% or less, preferably 20% or less, and more preferably 10% or less.

[0158] <Cross-sectional structure of display area 101 (transparent insulating substrate 10a)>

[0159] Next, refer to Figure 4The cross-sectional structure of the display region 101 formed on the transparent insulating substrate 10a in the transparent display device according to this embodiment will be described.

[0160] Transparent insulating substrate 10a is a transparent material with insulating properties. Figure 4 In the example, the transparent insulating substrate 10a has a double-layer structure, namely a main substrate 11 and an adhesive layer 12.

[0161] As will be described in detail later, the main substrate 11 is, for example, a transparent resin.

[0162] The adhesive layer 12 is, for example, a transparent resin adhesive such as epoxy, acrylic, silicone, olefin, polyimide, or phenolic varnish.

[0163] Furthermore, the main substrate 11 can also be a thin glass plate with a thickness of, for example, 200 μm or less, preferably 100 μm or less. Additionally, the adhesive layer 12 is not mandatory.

[0164] Examples of transparent resins constituting the main substrate 11 include polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), olefin resins such as cyclic olefin polymers (COP) and cyclic olefin copolymers (COC), cellulose resins such as cellulose, acetyl cellulose, and triacetyl cellulose (TAC), imide resins such as polyimide (PI), amide resins such as polyamide (PA), amide-imide resins such as polyamide-imide (PAI), and polycarbonate (PC). Carbonate resins such as polyethersulfone (PES) and sulfone resins such as poly(p-xylene) and p-xylene silicone resins, polyethylene (PE), polyvinyl chloride (PVC), polystyrene (PS), polyvinyl acetate (PVAc), polyvinyl alcohol (PVA), polyvinyl butyral (PVB) and other vinyl resins, polymethyl methacrylate (PMMA) and other acrylic resins, ethylene-vinyl acetate copolymer resin (EVA), thermoplastic polyurethane (TPU) and other polyurethane resins, epoxy resins, etc.

[0165] Among the materials used for the main substrate 11 described above, polyethylene naphthalate and polyimide are preferred from the viewpoint of improving heat resistance. Furthermore, cyclic olefin polymers, cyclic olefin copolymers, and polyvinyl butyral are preferred from the viewpoint of low birefringence and the ability to reduce distortion and bleed-out of the image seen through the transparent insulating substrate.

[0166] The above materials can be used alone or in combination. Furthermore, the main substrate 11 can be constructed by stacking plates of different materials.

[0167] The overall thickness of the transparent insulating substrate 10a is, for example, 3 μm to 1000 μm, preferably 5 μm to 200 μm. The internal transmittance of visible light of the transparent insulating substrate 10a is, for example, 50% or more, preferably 70% or more, and more preferably 90% or more.

[0168] Furthermore, the transparent insulating substrate 10a can also be flexible, thereby enabling, for example, the transparent display device to be mounted on a bent transparent plate or sandwiched between two bent transparent plates. Additionally, the transparent insulating substrate 10a can also be a material that shrinks when heated to above 100°C.

[0169] like Figure 4 As shown, LED elements 21-23 and IC chip 30 are disposed on the transparent insulating substrate 10a, i.e., the adhesive layer 12, and connected to wiring 40 disposed on the transparent insulating substrate 10a. Figure 4 In this example, the wiring 40 is composed of a first metal layer M1 formed on the main substrate 11 and a second metal layer M2 formed on the adhesive layer 12.

[0170] The thickness of the wiring 40, which is the sum of the thickness of the first metal layer M1 and the thickness of the second metal layer M2, is, for example, 0.1 μm to 10 μm, preferably 0.5 μm to 5 μm. The thickness of the first metal layer M1 is, for example, about 0.5 μm, and the thickness of the second metal layer M2 is, for example, about 3 μm.

[0171] In detail, such as Figure 4 As shown, the grounding wire 42 extending along the y-axis has a double-layer structure comprising a first metal layer M1 and a second metal layer M2 due to the large current flow. That is, at the location where the grounding wire 42 is provided, the adhesive layer 12 is removed, and the second metal layer M2 is formed on top of the first metal layer M1. Although in Figure 4 Not shown in the image, but Figure 3 The power line 41, row data line 43, and column data line 44 shown also have a double-layer structure including a first metal layer M1 and a second metal layer M2.

[0172] Here, as Figure 3 As shown, the power line 41, ground line 42, and column data line 44 extending along the y-axis intersect with the row data line 43 extending along the x-axis. Although in Figure 4 Not shown in the diagram, but in this intersection, the row data line 43 is composed only of the first metal layer M1, and the power line 41, ground line 42, and column data line 44 are composed only of the second metal layer M2. Moreover, in this intersection, an adhesive layer 12 is provided between the first metal layer M1 and the second metal layer M2 to insulate the first metal layer M1 and the second metal layer M2.

[0173] Similarly, in Figure 3 In the intersection of the column data line 44 and the first power branch line 41a shown, the first power branch line 41a is composed only of the first metal layer M1, and the column data line 44 is composed only of the second metal layer M2.

[0174] In addition, Figure 4 In the example, the grounding branch line 42a, the driving line 45, and the first power supply branch line 41a are composed solely of the second metal layer M2, and are formed in a manner that covers the ends of the LED elements 21-23 and the IC chip 30. Although in Figure 4 Although not shown in the diagram, the second power supply branch line 41b, the row data branch line 43a, and the column data branch line 44a are also similarly composed solely of the second metal layer M2.

[0175] Furthermore, as described above, the first power branch line 41a is composed only of the first metal layer M1 at its intersection with the column data line 44, and only of the second metal layer M2 at other locations. Alternatively, metal pads made of copper, silver, gold, etc., may be disposed on the wiring 40 formed on the transparent insulating substrate 10a, and at least one of LED elements 21 to 23 and IC chip 30 may be disposed thereon.

[0176] The protective layer 50 is a transparent resin formed on the transparent insulating substrate 10a in a manner that protects the light-emitting part 20, the IC chip 30, and the wiring 40. Here, "the entire surface" means the entire surface of the transparent insulating substrate 10a, except for the portion that is electrically connected to the transparent insulating substrate 10b and the flexible wiring board 60.

[0177] The thickness of the protective layer 50 is, for example, 3 μm to 1000 μm, preferably 5 to 200 μm. The thickness of the protective layer 50 can be non-uniform as long as it is within the above range.

[0178] The elastic modulus of the protective layer 50 is, for example, below 10 GPa. A low elastic modulus can absorb the impact during peeling and suppress damage to the protective layer 50.

[0179] The internal transmittance of visible light of the protective layer 50 is, for example, 50% or more, preferably 70% or more, and more preferably 90% or more.

[0180] Furthermore, protective layer 50 is not required.

[0181] Examples of transparent resins constituting the protective layer 50 include vinyl resins such as polyethylene (PE), polyvinyl chloride (PVC), polystyrene (PS), polyvinyl acetate (PVAc), polyvinyl alcohol (PVA), and polyvinyl butyral (PVB); olefin resins such as cyclic olefin polymers (COP) and cyclic olefin copolymers (COC); polyurethane resins such as thermoplastic polyurethane (TPU); polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN); acrylic resins such as polymethyl methacrylate (PMMA); and thermoplastic resins such as ethylene-vinyl acetate copolymer (EVA). Alternatively, the transparent resin adhesive constituting the adhesive layer 12 can also be used as the transparent resin constituting the protective layer 50. Furthermore, the protective layer 50 can be composed of one type of transparent resin or multiple types of transparent resins.

[0182] <Cross-sectional structure of the non-display area (transparent insulating substrate 10b)>

[0183] Next, refer to Figure 2 The cross-sectional structure of the non-display area formed on the transparent insulating substrate 10b in the transparent display device according to this embodiment will be described.

[0184] like Figure 2 As shown, instead of forming a display area 101, wiring 40 is formed on the transparent insulating substrate 10b. For example, wiring 40 composed solely of the first metal layer M1 is formed on the transparent insulating substrate 10b, which is composed solely of the aforementioned main substrate 11. Furthermore, similar to the display area 101, a protective layer 50 covering the wiring 40 may be formed on the transparent insulating substrate 10b. The main substrate 11 constituting the transparent insulating substrate 10b can be made of the same material as the main substrate 11 constituting the transparent insulating substrate 10a. Alternatively, the material of the main substrate 11 constituting the transparent insulating substrate 10b may differ from the material of the main substrate 11 constituting the transparent insulating substrate 10a.

[0185] <Manufacturing Method of Transparent Display Devices>

[0186] Next, refer to Figure 2 , Figures 5-12 An example of a method for manufacturing a transparent display device according to the first embodiment will be described. Figures 5-12 This is a cross-sectional view illustrating an example of a method for manufacturing a transparent display device according to the first embodiment. Figures 5-12 Is with Figure 4 The corresponding cross-sectional view shows the case where the display area 101 is formed on the transparent insulating substrate 10a.

[0187] First, such as Figure 5As shown, after the first metal layer M1 is deposited on approximately the entire surface of the main substrate 11, the first metal layer M1 is patterned by photolithography to form the lower layer wiring. Specifically, in forming Figure 3 The positions of the power line 41, ground line 42, row data line 43, and column data line 44 shown are formed by the first metal layer M1 to form the lower layer wiring.

[0188] Furthermore, no lower-level wiring is formed at the intersections of the power line 41, ground line 42, and column data line 44 with the row data line 43.

[0189] Next, as Figure 6 As shown, after the adhesive layer 12 is formed on approximately the entire surface of the main substrate 11, LED elements 21-23 and IC chip 30 are mounted on the adhesive layer 12 (i.e. on the transparent insulating substrate 10a).

[0190] Here, LED elements 21-23 are obtained by growing crystals on a wafer using methods such as liquid phase growth, HVPE (Hydride Vapor Phase Epitaxy), or MOCVD (Metal Organic Chemical Vapor Deposition), followed by patterning. Using, for example, micro-transfer technology, the patterned LED elements 21-23 on the wafer are transferred onto the transparent insulating substrate 10a. Similarly, IC chip 30, like LED elements 21-23, is also transferred onto the transparent insulating substrate 10a using micro-transfer technology, for example, by patterning an IC chip on a Si wafer.

[0191] Next, as Figure 7 As shown, after photoresist FR1 is deposited on approximately the entire surface of the transparent insulating substrate 10a, which includes the main substrate 11 and the adhesive layer 12, the photoresist FR1 on the first metal layer M1 is removed by patterning. Here, Figure 3 The photoresist FR1 at the intersections of the row data line 43 with the power line 41, the ground line 42, and the column data line 44 is not removed.

[0192] Next, as Figure 8 As shown, the portion of the adhesive layer 12 where the photoresist FR1 has been removed is removed by dry etching, thereby exposing the first metal layer M1, i.e., the underlying wiring.

[0193] Next, as Figure 9As shown, the photoresist FR1 on the transparent insulating substrate 10a is completely removed. Subsequently, a seed layer for plating (not shown) is formed on approximately the entire surface of the transparent insulating substrate 10a.

[0194] Next, as Figure 10 As shown, after the photoresist FR2 is formed on approximately the entire surface of the transparent insulating substrate 10a, the seed layer is exposed by patterning the removal of the portion of the photoresist FR2 that forms the upper wiring.

[0195] Next, as Figure 11 As shown, a second metal layer M2 is formed on the seed layer, where the photoresist FR2 has been removed, by plating. The upper layer wiring is then formed through the second metal layer M2.

[0196] Next, as Figure 12 As shown, the photoresist FR2 is removed. Furthermore, the seed layer exposed by the removal of the photoresist FR2 is removed by etching.

[0197] Through the above, a display area 101 is formed on the transparent insulating substrate 10a.

[0198] On the other hand, although not illustrated separately, as described above, wiring 40 is formed on the transparent insulating substrate 10b. For example, as... Figure 5 As shown, a pattern of wiring 40 consisting of only the first metal layer M1 described above is implemented on a transparent insulating substrate 10b consisting only of the main substrate 11.

[0199] Then, as Figure 2 As shown, one end of the wiring 40 formed on the transparent insulating substrate 10a and one end of the wiring 40 formed on the transparent insulating substrate 10b are electrically connected by bonding via a conductive bonding layer 40b. Furthermore, the other end of the wiring 40 is connected to the flexible wiring board 60 at the edge of the transparent insulating substrate 10b.

[0200] Subsequently, a protective layer 50 may be formed on the transparent insulating substrates 10a and 10b.

[0201] Through the above, the transparent display device 100 involved in this embodiment can be manufactured.

[0202] (A variation of the first embodiment)

[0203] Next, refer to Figures 13-16 The transparent display device involved in the modified example of the first embodiment will be described.

[0204] Figures 13-16 These are schematic cross-sectional views illustrating the transparent display devices described in Modifications 1 to 4 of the first embodiment. Additionally, Figures 13-16 Is with Figure 2 The corresponding diagram.

[0205] Figure 13 The transparent display device 100 shown in Modification 1 has a structure with its top and bottom reversed. That is, a transparent insulating substrate 10a can also be formed on a transparent insulating substrate 10b. In the transparent display device 100 of Modification 1, the display area 101 does not overlap with the second wiring 40 formed on the transparent insulating substrate 10b. Therefore, the transparent display device 100 of Modification 1 can suppress the decrease in transmittance in the display area 101 and has excellent visibility on the back side. Furthermore, the same applies to the transparent display devices 100 of Modifications 2 to 4 described later.

[0206] Figure 14 The transparent display device 100 involved in the modified example 2 shown has a... Figure 13 The transparent display device 100 shown in Modification 1 has a structure in which the transparent insulating substrate 10b extends over the entire underside of the transparent insulating substrate 10a. That is, the entirety (100% of the area of ​​the transparent insulating substrate 10a) overlaps with the transparent insulating substrate 10b. Therefore, when the transparent display device 100 is encapsulated within the laminated glass as described later, the shape of the transparent insulating substrate 10a (i.e., the display area 101) can be made more compact than... Figure 2 , Figure 13 The structure shown is stable.

[0207] Figure 15 The transparent display device 100 involved in the modified example 3 shown has a... Figure 14 The transparent display device 100 shown in Modification 2 has a structure formed by simply reversing the transparent insulating substrate 10a vertically. That is, wiring 40 is formed on the upper surface of the transparent insulating substrate 10a. Therefore, the wiring 40 formed on the upper surface of the transparent insulating substrate 10a and the wiring 40 formed on the upper surface of the transparent insulating substrate 10b are connected through a through hole 40c penetrating the transparent insulating substrate 10a.

[0208] Figure 16 The transparent display device 100 shown in Modification 4 has a structure in which a transparent insulating substrate 10a including a display area 101 and a transparent insulating substrate 10b connected to a flexible wiring board 60 are connected via a transparent insulating substrate (third transparent insulating substrate) 10c. In this way, the transparent insulating substrate can be divided into three or more parts. The transparent insulating substrates 10a and 10b do not overlap, and wiring 40 is formed on the upper surface of both transparent insulating substrates 10a and 10b.

[0209] In Modification 4, the negative y-axis end of the wiring 40 extending along the y-axis direction in the transparent insulating substrate 10a faces the positive y-axis end of the wiring 40 extending along the y-axis direction in the transparent insulating substrate 10c, and is connected via a conductive bonding layer 40b. Similarly, the positive y-axis end of the wiring 40 in the opaque wiring region 40a formed in the transparent insulating substrate 10b faces the negative y-axis end of the wiring 40 in the opaque wiring region 40a formed in the transparent insulating substrate 10c, and is connected via a conductive bonding layer 40b.

[0210] Here, the transparent insulating substrate 10b has an opaque wiring region 40a forming the wiring 40, but no LED element is formed therein. Therefore, the transparent insulating substrate 10b can be patterned by printing instead of by photolithography, thereby easily forming the wiring 40.

[0211] Furthermore, both opaque wiring regions 40a and minute wiring regions 40 are formed on the lower surface of the transparent insulating substrate 10c.

[0212] (Second Implementation)

[0213] <Structure of laminated glass with transparent display devices>

[0214] Next, refer to Figure 17 , Figure 18 The structure of the laminated glass according to the second embodiment will be described. Figure 17 This is a schematic top view showing an example of the laminated glass according to the second embodiment. Figure 18 yes Figure 17 A cross-sectional view at the XVIII-XVIII cut line. Figure 17 , Figure 18 The laminated glass 200 shown is used for the windshield of a car, but is not particularly limited thereto. For example, the laminated glass according to the embodiment can be used for all windows of moving bodies, including trams, ships, airplanes, etc. Besides the windshield, the window glass may also include, for example, the rear window, side windows, and roof glass.

[0215] like Figure 18 As shown, the laminated glass 200 is a structure formed by bonding a pair of opposing glass plates 220a and 220b together via an interlayer film 210. In the laminated glass 200, the pair of glass plates 220a and 220b are held together by the interlayer films 210a and 210b. Figure 2 The transparent display device 100 according to the first embodiment shown.

[0216] When the laminated glass 200 is installed in a vehicle, for example, glass panel 220a is disposed on the inner side of the vehicle (recognition side) and glass panel 220b is disposed on the outer side of the vehicle (background side). In addition, the interlayer film (first interlayer film) 210a and the interlayer film (second interlayer film) 210b are integrated to form interlayer film 210.

[0217] like Figure 17 , Figure 18 As shown, a transparent display device 100 is disposed at the end of the laminated glass 200, and a flexible wiring board 60 extends from the glass plates 220a and 220b. Alternatively, multiple transparent display devices 100 may be disposed inside the laminated glass 200.

[0218] Although Figure 17 The laminated glass 200 is represented in a planar manner, but it can also have a curved shape. The curved shape can be a unidirectional curved shape bending in one direction, or a multidirectional curved shape bending in two orthogonal directions. When the laminated glass 200 is curved, the radius of curvature is preferably between 1000 mm and 100000 mm. The radii of curvature of glass plates 220a and 220b can be the same or different. When the radii of curvature of glass plates 220a and 220b are different, the radius of curvature of glass plate 220b is greater than that of glass plate 220a.

[0219] In addition, Figure 17 In the case of laminated glass 200, the planar shape is rectangular, but it is not limited to rectangular shape. It can also be any shape including trapezoidal shape, parallelogram shape, triangular shape, etc.

[0220] Here, in Figure 2 In the transparent display device 100 shown, the peripheries of the transparent insulating substrates 10a and 10b are respectively designed not to overlap with the specified test areas in the glass plates 220a and 220b. Here, the specified test area is "Test Area A" as defined in Annex "Test Areas for Optical Properties and Light Resistance of Safety Glass" of JIS Standard R3212:2015 (Test Methods for Safety Glass for Automobiles). This is because if the peripheries of the transparent insulating substrates 10a and 10b overlap with "Test Area A", it may negatively affect the driver's vision due to reflection, scattering, etc., and may fail tests such as perspective distortion.

[0221] Here, in Figure 17 The "Test Area A" is schematically shown.

[0222] Furthermore, in cases where the periphery of the transparent insulating substrate 10a does not overlap with "test area A", except... Figure 17The cases shown include not only the case where the transparent insulating substrate 10a does not overlap with the test area A (i.e., the case where the transparent insulating substrate 10a is located outside the test area A), but also the case where the transparent insulating substrate 10a completely overlaps with the test area A and includes the test area A. The same applies to the transparent insulating substrate 10b.

[0223] In addition, such as Figure 17 As shown, the laminated glass 200 has a strip-shaped shielding layer 201 along its entire periphery. Because the shielding layer 201 blocks sunlight, it can prevent the adhesive (e.g., a resin such as polyurethane) used to assemble the laminated glass 200 into the automobile from deteriorating due to ultraviolet radiation.

[0224] also, Figure 17 This is a top view, but for ease of understanding, the masking layer 201 and the opaque wiring area 40a are represented by dots.

[0225] exist Figure 18 In the example shown, when the laminated glass 200 is installed in a vehicle, a shielding layer 201 is formed on the inner side of the glass panel 220a and the inner side of the glass panel 220b.

[0226] In addition, the shielding layer 201 may be formed only on either the inner surface of the glass panel 220a or the inner surface of the glass panel 220b.

[0227] Here, as Figure 17 , Figure 18 As shown, the shielding layer 201 is formed to overlap with the flexible wiring board 60 and the opaque wiring area 40a. Therefore, the flexible wiring board 60 and the opaque wiring area 40a are difficult to distinguish from the inside and outside of the vehicle, thus improving the appearance design of the laminated glass 200.

[0228] In addition, such as Figure 17 , Figure 18 As shown, a portion of the periphery of the transparent insulating substrates 10a and 10b of the transparent display device 100 overlaps with the shielding layer 201, making them difficult to distinguish. For example, when enlarging the transparent display device 100, the periphery of the transparent insulating substrates 10a and 10b may be made to completely overlap with the shielding layer 201.

[0229] Furthermore, as long as the portion where the flexible wiring board 60 and the opaque wiring area 40a are located is within 20mm of the end of the glass panel 220a or 220b, it can be easily hidden by the vehicle body frame and interior materials; therefore, it is preferable, and more preferably, within 15mm. Additionally, when the laminated glass 200 is slidably assembled to the door glass of the vehicle, as long as the portion where the opaque wiring area 40a is located is within 15mm of the end of the glass panel 220a or 220b, it can be easily hidden by the door window frame; therefore, it is preferable, and more preferably, within 10mm.

[0230] The masking layer 201 is not particularly limited. For example, it can be formed by applying a ceramic color paste containing molten glass frit of pigment and firing it. Alternatively, it can be formed by applying an organic ink containing pigment and drying it. Furthermore, the masking layer 201 can also be formed by a colored film. The color of the pigment and the color of the colored film need to be sufficient to block visible light to a degree that allows for concealment, at least in the areas where concealment is required. Any color is acceptable, but a dark color is preferred, and black is more preferable. Moreover, the masking layer 201 is preferably opaque.

[0231] Here, the glass plates 220a and 220b, as well as the intermediate film 210, are described in detail.

[0232] Glass panels 220a and 220b can be either inorganic glass or organic glass. There are no particular restrictions on the type of inorganic glass used; for example, soda-lime glass, aluminosilicate glass, borosilicate glass, alkali-free glass, and quartz glass can be used. From the viewpoint of damage resistance, inorganic glass is preferred for the glass panel 220b located on the exterior of the vehicle; from the viewpoint of formability, soda-lime glass is preferred. Furthermore, glass panels 220a and 220b can be made of glass that absorbs ultraviolet or infrared radiation, and are more preferably transparent, but glass panels that are colored to the extent that they do not impair transparency can also be used. When glass panels 220a and 220b are soda-lime glass, transparent glass, green glass containing a specified amount or more of iron, and UV-resistant green glass are suitable options.

[0233] Inorganic glass can also be made from either unstrengthened glass or strengthened glass. Unstrengthened glass is obtained by forming molten glass into a sheet and then slowly cooling it. Strengthened glass is made by forming a compressive stress layer on the surface of unstrengthened glass.

[0234] Tempered glass can be either physically strengthened glass, such as air-cooled strengthened glass, or chemically strengthened glass. Physically strengthened glass, for example, strengthens the glass surface by using operations other than slow cooling, such as rapidly cooling a uniformly heated glass sheet from a temperature near its softening point during bending, thereby creating a compressive stress layer on the glass surface due to the temperature difference between the glass surface and the interior of the glass.

[0235] Chemically strengthened glass can be achieved by inducing compressive stress on the glass surface through methods such as ion exchange after bending and shaping.

[0236] On the other hand, materials used for plexiglass include polycarbonate, acrylic resins such as polymethyl methacrylate, polyvinyl chloride, and transparent resins such as polystyrene.

[0237] The shapes of glass plates 220a and 220b are not particularly limited to rectangular shapes; they can also be processed into various shapes and curvatures. The bending and forming of glass plates 220a and 220b can be achieved using gravity forming, stamping, roll forming, etc. The forming method for glass plates 220a and 220b is not particularly limited; for example, in the case of inorganic glass, glass plates formed using the float glass process are preferred.

[0238] When the laminated glass 200 is installed in a vehicle, the thinnest part of the glass panel 220b located on the outer side of the vehicle is preferably 1.5 mm to 3.0 mm or less. If the thickness of the glass panel 220b is 1.5 mm or more, the strength, such as its resistance to flying stones, is sufficient; if it is 3.0 mm or less, the mass of the laminated glass will not become excessive, which is preferable from the perspective of vehicle fuel consumption. The thinnest part of the glass panel 220b is more preferably 1.5 to 2.8 mm, and even more preferably 1.5 mm to 2.6 mm.

[0239] When installing the laminated glass 200 into a vehicle, the thickness of the glass panel 220a located on the inner side of the vehicle is preferably 0.3mm to 2.3mm. If the thickness of the glass panel 220a is 0.3mm or more, the operability is good; if it is less than 2.3mm, the weight will not be too great.

[0240] The thickness of each glass panel 220a and 220b may not be constant, but can be varied according to location as needed. For example, if the laminated glass 200 is a windshield, the thickness of each glass panel 220a and 220b may be a wedge shape, where the thickness increases from the bottom edge to the top of the windshield when the windshield is installed in the vehicle. In this case, if the thickness of the interlayer film 210 is constant, the combined wedge angle of the glass panels 220a and 220b may vary, for example, in the range of greater than 0 mrad and less than 1.0 mrad.

[0241] The laminated glass 200 may also have a coating on the outer side of the glass plates 220a and 220b that has waterproof, UV-resistant, and infrared-resistant functions, or a coating with low reflectivity and low emissivity. Additionally, the laminated glass 200 may also have a coating on the inner side of the glass plates 220a and 220b (the side in contact with the interlayer film 210) that has UV-resistant, infrared-resistant, low emissivity, visible light absorption, or coloring properties.

[0242] When glass plates 220a and 220b are inorganic glass, for example, after being formed using methods such as float glass, they are bent into shape before being bonded using an intermediate film 210. Bending is performed by heating to soften the glass. The heating temperature of the glass during bending is approximately 550°C to 700°C.

[0243] Thermoplastic resins are mostly used as the interlayer film 210. Examples include plasticized polyvinyl acetal resins, plasticized polyvinyl chloride resins, saturated polyester resins, plasticized saturated polyester resins, polyurethane resins, plasticized polyurethane resins, ethylene-vinyl acetate copolymer resins, ethylene-ethyl acrylate copolymer resins, cycloolefin polymer resins, and ionomer resins. Additionally, resin compositions containing modified block copolymer hydrogenates as described in Japanese Patent No. 6065221 are also suitable.

[0244] Among these, plasticized polyvinyl acetal resins are suitable for use due to their excellent balance of various properties, including transparency, weather resistance, strength, adhesion, penetration resistance, impact energy absorption, moisture resistance, thermal insulation, and sound insulation. These thermoplastic resins can be used alone or in combination of two or more. The term "plasticized" in the above-mentioned plasticized polyvinyl acetal resins means that they can be plasticized by adding a plasticizer. The same applies to other plasticized resins.

[0245] However, depending on the type of transparent display device, deterioration may sometimes occur due to specific plasticizers. In such cases, it is preferable to use a resin that does not substantially contain the plasticizer as the intermediate film 210. Examples of resins that do not contain plasticizers include ethylene-vinyl acetate copolymer resins.

[0246] Examples of polyvinyl alcohol acetal resins include polyvinyl alcohol formal resin obtained by reacting polyvinyl alcohol (PVA) with formaldehyde, polyvinyl alcohol acetal resins in the narrow sense obtained by reacting PVA with acetaldehyde, and polyvinyl alcohol butyral resin (PVB) obtained by reacting PVA with n-butyraldehyde. PVB is particularly suitable due to its excellent balance of various properties, including transparency, weather resistance, strength, adhesion, penetration resistance, impact energy absorption, moisture resistance, thermal insulation, and sound insulation. Furthermore, these polyvinyl alcohol acetal resins can be used alone or in combination of two or more.

[0247] However, the material of the interlayer 210 is not limited to thermoplastic resin. Furthermore, the interlayer 210 may also contain functional particles such as infrared absorbers, ultraviolet absorbers, and luminescent agents. Additionally, the interlayer 210 may have a colored portion known as a shadow band.

[0248] Furthermore, the interlayer films 210a and 210b included in the interlayer film 210 are preferably made of the same material, but they can also be made of different materials. The interlayer film 210 may also have three or more layers. For example, an interlayer film is further formed between the interlayer films 210a and 210b, and the shear modulus of elasticity of this interlayer film is made smaller than that of the interlayer films 210a and 210b by adjusting the plasticizer, etc., thereby improving the sound insulation of the laminated glass 200. In this case, the shear modulus of elasticity of the interlayer films 210a and 210b may be the same or different. Alternatively, at least one of the interlayer films 210a and 210b may have three or more layers.

[0249] The thickness of the interlayer film 210 is preferably 0.5 mm or more at its thinnest point. If the thickness of the interlayer film 210 is 0.5 mm or more, the penetration resistance required for laminated glass becomes sufficient. The minimum thickness of the interlayer film 210 is more preferably 0.7 mm or more, and even more preferably 1.0 mm or more. Furthermore, the thickness of the interlayer film 210 is preferably 3.5 mm or less at its thickest point. If the maximum thickness of the interlayer film 210 is 3.5 mm or less, the mass of the laminated glass will not become excessive. The maximum thickness of the interlayer film 210 is more preferably 3.4 mm or less, even more preferably 2.8 mm or less, and particularly preferably 2.6 mm or less.

[0250] Next, the manufacturing method of laminated glass 200 will be explained.

[0251] First, a laminate is formed by sandwiching intermediate films 210a and 210b and a transparent display device 100 between glass plates 220a and 220b.

[0252] Next, for example, the laminate is placed in a rubber bag and bonded in a vacuum of -65 kPa to -100 kPa at a temperature of 70°C to 110°C.

[0253] In order to prevent the transparent display device 100 from deteriorating during manufacturing, appropriate heating conditions, temperature conditions, and lamination methods are selected.

[0254] Furthermore, for example, by performing a pressing process at a temperature of 100°C to 150°C and an absolute pressure of 0.6 MPa to 1.3 MPa, a laminated glass 200 with superior durability can be obtained. However, considering the simplification of the process and the characteristics of the material encapsulated in the laminated glass 200, there are also cases where this pressing process is not performed.

[0255] The total thickness of the laminated glass 200 is preferably 2.8 mm to 10 mm. If the total thickness of the laminated glass 200 is 2.8 mm or more, sufficient rigidity can be ensured. In addition, if the total thickness of the laminated glass 200 is 10 mm or less, sufficient transmittance can be obtained and haze can be reduced.

[0256] Figure 19 This is a schematic cross-sectional view showing another example of the laminated glass involved in the second embodiment. Figure 19 The laminated glass 200 has Figure 14 The transparent display device 100 involved in Modification Example 2 is used to replace Figure 2 The transparent display device 100 according to the first embodiment shown.

[0257] Furthermore, the laminated glass 200 has a protective layer 50 formed to cover the transparent display device 100. That is, the protective layer 50 is formed to cover and surround the periphery of the transparent insulating substrate 10a. Therefore, it is preferable that the periphery of the transparent insulating substrate 10a is difficult to discern. Alternatively, the protective layer 50 may also be an interlayer (third interlayer). Furthermore, the protective layer 50 may have different types of transparent resin in the portion containing the transparent insulating substrate 10a and the transparent insulating substrate 10b, and in the remaining portions.

[0258] Furthermore, vehicle window glass can also be multi-layered glass, consisting of laminated glass 200 and at least one glass panel spaced apart by a spacer. When the vehicle window glass is multi-layered glass, a hollow layer is provided between the laminated glass 200 and the glass panel. This hollow layer can be filled with dry air, or with rare gases such as krypton or argon. Alternatively, the hollow layer can be a vacuum. When the hollow layer is a vacuum, to maintain the gap between the laminated glass 200 and the glass panel, multiple gap-maintaining components made of metal materials such as stainless steel or resin materials can be disposed between the laminated glass 200 and the glass panel in the hollow layer area. The spacer can be made of metal such as aluminum, or resin such as polyamide or polypropylene. When the vehicle window glass is multi-layered glass, the laminated glass 200 can be disposed on the outer side of the vehicle or on the inner side.

[0259] Furthermore, there are no regulations governing the visible light transmittance of window glass other than the windshield, allowing for arbitrary settings. Therefore, in the laminated glass 200, the total visible light transmittance of components located closer to the inside or outside of the vehicle than the transparent display device 100 can be set to, for example, 50% or less. Consequently, the periphery of the transparent insulating substrate 10a and 10b, the wiring 40, and the light-emitting portion 20 become difficult to discern from the inside or outside of the vehicle.

[0260] For example, privacy glass can be used for the glass panel 220a located on the inner side of the vehicle. Alternatively, a tinted interlayer film can be used for the interlayer film 210a located on the inner side of the vehicle. Furthermore, a tinted film (including smoke film) and a dimming element can also be additionally provided on the laminated glass 200. The same applies to the glass panel 220b located on the outer side of the vehicle and the interlayer film 210b located on the outer side of the vehicle.

[0261] Privacy glass is a type of glass with lower transparency than green glass and clear glass; it is also known as dark gray glass. Privacy glass can be made more transparent by adjusting the total iron content (converted to Fe2O3). For example, the visible light transmittance of privacy glass can be adjusted to approximately 40%–50% for a thickness of 1.8 mm, and to approximately 30%–45% for a thickness of 2.0 mm.

[0262] Furthermore, privacy glass is described in detail, for example, in International Publication No. 2015 / 088026, the contents of which are incorporated herein by reference.

[0263] A colored interlayer is an interlayer with lower transparency than a transparent interlayer. For example, with a film thickness of 0.76 mm, the visible light transmittance of a transparent interlayer is approximately 90% to 95%. A colored interlayer is obtained by coloring the materials listed above as interlayer 210. Specifically, a colored interlayer is obtained by containing a colorant in a composition mainly comprising a thermoplastic resin. The colored interlayer may also contain a plasticizer for adjusting the glass transition point.

[0264] Furthermore, the laminated glass 200 can also reduce the total visible light transmittance of components located on the outer side of the vehicle compared to the transparent display device 100. As a result, it becomes more difficult to distinguish the periphery of the transparent insulating substrate 10a and 10b, the wiring 40, the light-emitting part 20, etc., from the outside of the vehicle, and also from the inside of the vehicle. Additionally, it can also reduce the total visible light transmittance of components located on the inner side of the vehicle compared to the transparent display device 100. As a result, it becomes more difficult to distinguish the periphery of the transparent insulating substrate 10a and 10b, the wiring 40, the light-emitting part 20, etc., from the inside of the vehicle, and also from the outside of the vehicle.

[0265] (Third Implementation)

[0266] <Structure of Transparent Display Devices>

[0267] Next, refer to Figure 20 The structure of the transparent display device according to the third embodiment will be described. Figure 20 This is a schematic partial top view illustrating an example of a transparent display device according to the third embodiment. (e.g.) Figure 20 As shown, the transparent display device involved in this embodiment is... Figure 3 Based on the structure of the transparent display device according to the first embodiment shown, a sensor 70 is provided in the display area 101. That is, it has the function of a transparent sensing detection device.

[0268] exist Figure 20 In the example shown, sensor 70 is positioned between defined pixels and connected to power line 41 and ground line 42. Furthermore, detection data based on sensor 70 is output via data output line 46 extending from sensor 70 along the y-axis. Conversely, a control signal is input to sensor 70 via control signal line 47 extending along the y-axis, thereby controlling sensor 70. Sensor 70 can be single or multiple. Multiple sensors 70 can be arranged at defined intervals, for example, along the x-axis or y-axis.

[0269] In the following description, the transparent display device according to this embodiment is used in the windshield of an automobile. That is, the transparent display device according to this embodiment can also be applied to the laminated glass according to the second embodiment.

[0270] Sensor 70 is, for example, an illuminance sensor (e.g., a light-receiving element) used to detect illuminance inside and outside the vehicle. For example, the brightness of the display area 101 based on LED elements 21-23 is controlled based on the illuminance detected by sensor 70. For example, the greater the illuminance outside the vehicle relative to the illuminance inside the vehicle, the greater the brightness of the display area 101 based on LED elements 21-23. This structure further improves the visibility of the transparent display device.

[0271] Alternatively, sensor 70 can also be an infrared sensor (e.g., a light-receiving element) or an image sensor (e.g., a CMOS (Complementary Metal-Oxide-Semiconductor) image sensor) used to sense the gaze of an observer (e.g., a driver). For example, the transparent display device is driven only when the sensor 70 senses a gaze. For example, when using the transparent display device... Figure 17In the case of the laminated glass shown, the transparent display device does not obstruct the observer's view unless the observer directs their gaze toward it, which is therefore preferable. Alternatively, the observer's actions can be detected by sensor 70, which functions as an image sensor, and based on these actions, such as turning the transparent display device on / off or switching the display screen.

[0272] The other structures are the same as those of the transparent display device involved in the first embodiment.

[0273] (Fourth Implementation)

[0274] <Structure of Transparent Sensing Device>

[0275] Next, refer to Figure 21 The structure of the transparent sensing and detection device according to the fourth embodiment will be described. Figure 21 This is a schematic partial top view illustrating an example of the transparent sensing detection device according to the fourth embodiment. (See attached image.) Figure 21 As shown, the transparent sensing detection device according to this embodiment is configured to be suitable for... Figure 3 The transparent display device according to the first embodiment shown has a structure in which each pixel PIX has a sensor 70 instead of a light-emitting unit 20 and an IC chip 30. That is, Figure 21 The transparent sensing device shown does not have a light-emitting part 20 and does not have a display function. The transparent sensing device is a form of transparent electronic device. The sensing area of ​​the transparent sensing device can also be equivalent to the display area 101 of the transparent display device 100.

[0276] Sensor 70 is not specifically limited, but... Figure 21 The transparent sensing device shown is a CMOS image sensor. That is, Figure 21 The transparent sensing device shown has an imaging area 301 composed of multiple pixels (PIX) arranged in the row direction (x-axis direction) and column direction (y-axis direction), and has imaging capabilities. Figure 21 A portion of the camera area 301 is shown, with two pixels in the row direction and two pixels in the column direction, totaling four pixels. Here, a pixel (PIX) is represented by a dashed line. Additionally, in... Figure 21 In, with Figure 3 Similarly, the transparent insulating substrate 10a and the protective layer 50 are omitted. Furthermore, although... Figure 21 It is a top view, but for ease of understanding, sensor 70 is represented by a point.

[0277] exist Figure 21In the example shown, sensors 70 are individually disposed in each pixel, positioned between and connected to power line 41 and ground line 42 extending along the y-axis. Furthermore, detection data based on sensors 70 is output via data output line 46 extending from sensors 70 along the y-axis. On the other hand, control signals are input to sensors 70 via control signal line 47 extending along the y-axis to sensors 70, thereby controlling sensors 70. Control signals may include, for example, synchronization signals or reset signals.

[0278] In addition, power cord 41 can also be connected to a battery (not shown).

[0279] here, Figure 22 This is a schematic cross-sectional view of sensor 70. Figure 22 The sensor 70 shown is a back-illuminated CMOS image sensor. However, the sensor 70 used as an image sensor is not particularly limited and can also be a surface-illuminated CMOS image sensor or a CCD (Charge-Coupled Device) image sensor.

[0280] like Figure 22 As shown, each sensor 70 includes a wiring layer, a semiconductor substrate, color filters CF1 to CF3, and microlenses ML1 to ML3. Internal wiring IW is formed inside the wiring layer. Additionally, photodiodes PD1 to PD3 are formed inside the semiconductor substrate.

[0281] A semiconductor substrate (e.g., a silicon substrate) is formed on top of the wiring layer. Internal wiring IW formed within the wiring layer connects wiring 40 (power line 41, ground line 42, data output line 46, and control signal line 47) to photodiodes PD1 to PD3. When light shines on photodiodes PD1 to PD3, current is output from them. The current output from photodiodes PD1 to PD3 is amplified by an amplifier circuit (not shown) and output via the internal wiring IW and the data output line 46.

[0282] Color filters CF1 to CF3 are formed on photodiodes PD1 to PD3, which are formed inside a semiconductor substrate. For example, color filters CF1 to CF3 are red, green, and blue filters, respectively.

[0283] Microlenses ML1 to ML3 are respectively mounted on color filters CF1 to CF3. Light focused by microlenses ML1 to ML3, which act as convex lenses, passes through color filters CF1 to CF3 and is incident on photodiodes PD1 to PD3.

[0284] The sensor 70 involved in this embodiment has an area of ​​250,000 μm on the transparent insulating substrate 10a. 2 The following refers to a miniature sensor with an extremely small size. In other words, in this specification, the miniature sensor has an area of ​​250,000 μm when viewed from above. 2 The following is a sensor with a very small size. The area occupied by the sensor 70 is preferably, for example, 25000 μm. 2 Below, 2500 μm is more preferred. 2 Furthermore, depending on various manufacturing conditions, the lower limit of the area occupied by the sensor 70 is, for example, 10 μm. 2 above.

[0285] In addition, although Figure 21 The sensor 70 shown is rectangular in shape, but is not specifically limited to this shape.

[0286] The transparent sensing device described in this embodiment can also be applied to the laminated glass described in the second embodiment. When the transparent sensing device described in this embodiment is mounted on the windshield of a vehicle (e.g., an automobile), the sensor 70 can acquire images of at least one of the interior and exterior of the vehicle. That is, the transparent sensing device described in this embodiment functions as a dashcam.

[0287] Furthermore, the sensor 70 in the transparent sensing and detection device according to the fourth embodiment can also be a single sensor. Additionally, the sensor 70 in the transparent sensing and detection device according to the fourth embodiment is not limited to an image sensor, but can also be an illuminance sensor, infrared sensor, etc., as exemplified in the third embodiment. Moreover, the sensor 70 can also be a radar sensor, a LiDAR sensor, etc. By equipping a vehicle window glass with a transparent sensing and detection device using these sensors 70, it is possible to monitor, for example, the interior and exterior of the vehicle.

[0288] That is, the sensor 70 according to the fourth embodiment only needs to have an area of ​​250,000 μm on the transparent insulating substrate 10a. 2 The following tiny sensors are not particularly limited in size. For example, sensor 70 can also be a temperature sensor, ultraviolet sensor, radio wave sensor, pressure sensor, sound sensor, speed / accelerometer, etc.

[0289] The other structures are the same as those of the transparent display device involved in the first embodiment.

[0290] Furthermore, the present invention is not limited to the above-described embodiments, and appropriate modifications can be made without departing from the spirit of the invention.

[0291] For example, transparent display devices can also have touch panel functionality.

[0292] This application claims priority based on Japanese Application Special Hoc 2020-180421, filed on October 28, 2020, the entire contents of which are hereby cited.

[0293] Explanation of reference numerals in the attached figures

[0294] 10a, 10b, 10c...Transparent insulating substrate; 11...Main substrate; 12...Adhesive layer; 20...Light-emitting part; 21-23...LED element; 30...IC chip; 40...Wiring; 40a...Opaque wiring area; 40b...Conductive bonding layer; 40c...Through hole; 41...Power line; 41a...First power branch line; 41b...Second power branch line; 42...Ground line; 42a...Ground branch line; 43...Row data line; 43a...Row data branch line; 44...Column data line; 44a...Column data branch line; 45...Drive line; 46...Data output line; 47. ...Control signal line; 50...Protective layer; 60...Flexible wiring board; 70...Sensor; 100...Transparent display device; 101...Display area; 200...Laminated glass; 201...Shielding layer; 210, 210a, 210b...Intermediate film; 220a, 220b...Glass plate; 301...Camera area; AM...Alignment mark; CF1~CF3...Color filter; FR1, FR2...Photoresist; IW...Internal wiring; M1...First metal layer; M2...Second metal layer; ML1~ML3...Microlens; PD1~PD3...Photodiode; PIX...Pixel.

Claims

1. A transparent electronic device, wherein, The transparent electronic device comprises: Transparent insulating substrate; Electronic components, formed on the main surface of the transparent insulating substrate, have a diameter of 250,000 μm. 2 The following area; as well as An opaque power supply element supplies power to the electronic components. The electronic component is a light-emitting diode (LED) or a sensor. The transparent insulating substrate includes: A first transparent insulating substrate has the electronic component and a first wiring connected to the electronic component formed on one of its main surfaces; and A second transparent insulating substrate has a second wiring formed on one of its main surfaces. The second transparent insulating substrate does not have the electronic components formed thereon. One end of the first wiring is electrically connected to one end of the second wiring, and at the edge of the second transparent insulating substrate, the opaque power supply is connected to the other end of the second wiring.

2. The transparent electronic device according to claim 1, wherein, The first transparent insulating substrate and the second transparent insulating substrate overlap when viewed from above. In the overlapping portion of the first transparent insulating substrate and the second transparent insulating substrate, one end of the first wiring is electrically connected to one end of the second wiring.

3. The transparent electronic device according to claim 2, wherein, The entire first transparent insulating substrate overlaps with the second transparent insulating substrate when viewed from above.

4. The transparent electronic device according to claim 2 or 3, wherein, The main surface of one side of the first transparent insulating substrate is opposite to the main surface of one side of the second transparent insulating substrate and overlaps when viewed from above.

5. The transparent electronic device according to any one of claims 1 to 3, wherein, The area in the first transparent insulating substrate where the electronic components are disposed does not overlap with the second wiring.

6. The transparent electronic device according to any one of claims 1 to 3, wherein, The electronic component is a light-emitting diode (LED) component. The light-emitting diode element constitutes a transparent display device.

7. The transparent electronic device according to any one of claims 1 to 3, wherein, The second transparent insulating substrate is flexible.

8. The transparent electronic device according to any one of claims 1 to 3, wherein, One end of the first wiring and one end of the second wiring are electrically connected via a conductive bonding layer.

9. A laminated glass, wherein, The laminated glass comprises: A pair of glass plates arranged opposite each other; and A first intermediate film and a second intermediate film are disposed between the pair of glass plates. The transparent electronic device according to any one of claims 1 to 8 is sandwiched between the first intermediate film and the second intermediate film.

10. The laminated glass according to claim 9, wherein, A shielding layer is formed around the periphery of at least one of the pair of glass plates.

11. The laminated glass according to claim 10, wherein, Around the periphery of the transparent electronic device, an opaque wiring region is formed, which is wide and is formed by at least one of the first wiring and the second wiring. The opaque wiring area is configured to overlap with the masking layer when viewed from above.

12. The laminated glass according to claim 10 or 11, wherein, The opaque power supply is configured to overlap with the shielding layer when viewed from above.

13. The laminated glass according to claim 10 or 11, wherein, The periphery of at least one of the first transparent insulating substrate and the second transparent insulating substrate is configured to overlap with the shielding layer when viewed from above.

14. The laminated glass according to any one of claims 9 to 11, wherein, A protective layer covering the first transparent insulating substrate is formed between the first intermediate film and the second intermediate film.

15. The laminated glass according to claim 14, wherein, The protective layer includes an intermediate film that is different from the first intermediate film and the second intermediate film.

16. The laminated glass according to any one of claims 9 to 11, 15, wherein, The pair of glass plates are bent.

17. The laminated glass according to any one of claims 9 to 11, 15, wherein, This laminated glass is for use in vehicles. The thickness of the outer glass panel of the pair of glass panels is 1.5mm to 3.0mm.

18. The laminated glass according to any one of claims 9 to 11, 15, wherein, When viewed from above, the periphery of the first transparent insulating substrate does not overlap with "Test Area A" as specified in Annex "Test Areas for Optical Properties and Light Resistance of Safety Glass" of JIS Standard R3212:2015 (Test Methods for Safety Glass for Automobiles).

19. The laminated glass according to any one of claims 9 to 11, 15, wherein, The periphery of the second transparent insulating substrate does not overlap with "Test Area A" as specified in Annex "Test Areas for Optical Properties and Light Resistance of Safety Glass" of JIS Standard R3212:2015 (Test Methods for Safety Glass for Automobiles) when viewed from above.

20. A method for manufacturing a transparent electronic device, wherein, On one of the main surfaces of the first transparent insulating substrate, a surface with a diameter of 250,000 μm is formed. 2 The following area of ​​electronic components and the first wiring connected to said electronic components, Instead of forming the electronic components, a second wiring is formed on one of the main surfaces of the second transparent insulating substrate. One end of the first wiring is electrically connected to one end of the second wiring, and an opaque power supply body for supplying power to the electronic component is connected to the other end of the second wiring at the edge of the second transparent insulating substrate.

Images