An automatic device and method for adding copper oxide powder to an FCBGA packaging substrate

Abstract

This invention provides an automatic copper oxide powder addition device and method for FCBGA packaged substrate electroplating. The method includes: a vibration device vibrating the container to prevent copper oxide powder from clumping; and a monitoring device monitoring the measurement results of the weighing structure and the sensing results of the photosensitive sensor to control the transfer of copper oxide powder. This invention, by incorporating a vibration device in the container, prevents the copper oxide powder added during the FCBGA packaged substrate electroplating process from clumping before entering the dissolution tank, avoiding blockage caused by excessively low copper ion concentration or copper oxide powder precipitation on the product surface, thereby improving product yield. Simultaneously, the photosensitive sensor monitors the copper oxide powder level, preventing abnormal measurements by the weighing structure that could lead to excessive addition of copper oxide powder, thus improving the accuracy of the copper plating amount in the dissolution tank. Furthermore, the weighing structure, displacement structure, and filter circulation pump work together to move and clean the weighing structure after adding copper oxide powder, further improving the accuracy of the copper plating amount in the dissolution tank. Finally, the use of a protective cover prevents copper oxide powder from splashing out when entering the dissolution tank.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of semiconductor integrated circuit manufacturing, and particularly relates to an automatic copper oxide powder adding device and method for FCBGA packaging substrate electroplating. BACKGROUND

[0002] When electroplating is performed on a packaging substrate of FCBGA (flip chip ball grid array), a mixed solution of copper sulfate and sulfuric acid is often used. With the electroplating, copper sulfate and sulfuric acid are consumed, and need to be added regularly. Since the cost of copper sulfate is relatively high, the main adding method in the industry is to add copper oxide to the sulfuric acid solution, so that copper oxide reacts with sulfuric acid to produce copper sulfate. After filtration, the copper sulfate solution is added to the copper electroplating tank in a fixed amount.

[0003] Copper oxide powder is a main additive in copper electroplating, which is used to control the content of copper ions. Copper oxide has slight water absorption, and copper oxide powder is easy to agglomerate, so it is not easy to be automatically added to the sulfuric acid tank. Production line operators manually break the agglomerated copper oxide into small pieces and then add them to the sulfuric acid tank. In this method, the agglomerated copper oxide is broken into small pieces, but the core of the small pieces still contains agglomerated copper oxide. In the sulfuric acid tank, the small pieces of agglomerated copper oxide are not easy to be dissolved by sulfuric acid, which will cause the agglomerated copper oxide to reach the copper electroplating tank. During electroplating, the copper oxide powder that is not completely dissolved will be precipitated in the electroplating process, and will be electroplated on the cathode surface of the semiconductor structure, causing problems such as electroplated copper tumor, electroplated burr, and electroplated pitting, which will affect the yield of subsequent products and increase the scrap rate.

[0004] During the addition of copper oxide powder, the concentration of copper ions in the electroplating tank determines the quality of electroplating. If the concentration of copper ions is insufficient, the electroplating capacity will decrease, the uniformity of the electroplated layer will be poor, and if the concentration of copper ions is too high, crystallization will occur, which will reduce the yield of products. Therefore, it is necessary to accurately control the concentration of copper ions in the electroplating tank.

[0005] It should be noted that the above introduction to the technical background is only for the convenience of clearly and completely describing the technical solutions of the present application, and for the convenience of understanding by those skilled in the art, and the above technical solutions cannot be considered as known to those skilled in the art only because they are described in the background section of the present application. SUMMARY

[0006] In view of the above shortcomings of the prior art, the purpose of the present application is to provide an automatic copper oxide powder adding device and method for FCBGA packaging substrate electroplating, which solves the problems of blockage and inaccurate addition amount during the addition of copper oxide powder in the prior art.

[0007] In order to achieve the above object, the application provides a kind of FCBGA package substrate copper oxide powder electroplating automatic adding device, the device includes first container, vacuum pump, second container, monitoring device, third container, weighing structure, light sensor, dissolving tank;

[0008] The first container is used for storing copper oxide powder, and the first container is provided with a first vibrating device to vibrate the first container.

[0009] The vacuum pump is connected with the first container and the second container respectively, and is used to extract the copper oxide powder in the first container into the second container.

[0010] The third container is provided with a second vibrating device to vibrate the third container.

[0011] The weighing structure is arranged at the outlet of the third container to measure the weight of the copper oxide powder in the third container, and the light sensor is arranged beside the third container to sense the height of the copper oxide powder in the third container.

[0012] The monitoring device is arranged in the second container to monitor the measurement results of the weighing structure and the sensing results of the light sensor, and to control the start and stop of the copper oxide powder from the first container into the second container, from the second container into the third container and from the third container into the dissolving tank according to the measurement results and the sensing results.

[0013] Optionally, the device further comprises a dissolving protective cover arranged at the outlet of the third container to block the copper oxide powder from splashing out.

[0014] Optionally, the device further comprises a filtering circulating pump arranged beside the third container, and the filtering circulating pump comprises a water flushing nozzle to flush the weighing structure to flush the copper oxide powder on the weighing structure into the dissolving tank.

[0015] Optionally, a displacement structure is arranged below the weighing structure to enable the weighing structure to move in the direction from the outlet of the third container to the water flushing nozzle.

[0016] Optionally, the second container is provided with an air extraction pipe to keep the inside of the FCBGA package substrate copper oxide powder electroplating automatic adding device dry.

[0017] The application also provides a kind of FCBGA package substrate copper oxide powder electroplating automatic adding method, the method is carried out by using any one of the above-mentioned FCBGA package substrate copper oxide powder electroplating automatic adding device, and the method comprises:

[0018] placing the copper oxide powder in the first container;

[0019] vibrating the first container by the first vibrating device to prevent the copper oxide powder from caking;

[0020] extracting the copper oxide powder from the first container to the second container by the vacuum pump;

[0021] vibrating the third container by the second vibrating device to prevent the copper oxide powder from caking;

[0022] monitoring the weight of the copper oxide powder in the third container by the weighing structure and the height of the copper oxide powder in the third container by the light sensor, and controlling the transfer of the copper oxide powder from the first container to the second container, from the second container to the third container, and from the third container to the dissolving tank according to the monitoring results.

[0023] Optionally, the method for controlling the transfer of the copper oxide powder from the second container to the third container comprises: the passage from the second container to the third container is set to be closed by default; the monitoring device monitors the cumulative power consumption of the dissolving tank, and when the cumulative power consumption increases by a preset power, the monitoring device controls to open the passage from the second container to the third container, so that the copper oxide powder enters the third container from the second container; when the weighing structure measures that the weight of the copper oxide powder in the third container exceeds a preset weight, the monitoring device controls to close the passage from the second container to the third container and open the passage from the third container to the dissolving tank, so that the copper oxide powder enters the dissolving tank from the third container.

[0024] Optionally, the method for controlling the transfer of the copper oxide powder from the second container to the third container further comprises: when the light sensor senses that the height of the copper oxide powder in the third container exceeds a preset height and lasts for a preset time, the monitoring device closes the passage from the second container to the third container and resets the weighing structure.

[0025] Optionally, the method for controlling the passage of the third container to the dissolving tank comprises: the weighing structure itself is used as the passage of the third container to the dissolving tank, the weighing structure is arranged at the outlet of the third container to prevent the copper oxide powder in the third container from falling into the dissolving tank; a filter circulating pump is arranged beside the third container, the filter circulating pump is provided with a water flushing nozzle, and a displacement structure is arranged below the weighing structure; when the monitoring device monitors that the measurement result of the weighing structure reaches the preset weight, the monitoring device controls to close the passage of the second container to the third container, the displacement structure moves the weighing structure to the water flushing nozzle, the water flushing nozzle cleans the weighing structure, and the copper oxide powder in the third container enters the dissolving tank; when the monitoring device monitors that the measurement result of the weighing structure is 0, the monitoring device controls the water flushing nozzle to stop cleaning, and the displacement structure moves the weighing structure back to the outlet of the third container.

[0026] Optionally, the vacuum pump is in a default closed state, the monitoring device monitors the storage amount of the copper oxide powder in the second container, when the storage amount is lower than a preset value, the monitoring device starts the vacuum pump, and the vacuum pump extracts the copper oxide powder in the first container to the second container; when the storage amount reaches the preset value, the monitoring device closes the vacuum pump.

[0027] As described above, the FCBGA packaging substrate copper oxide powder automatic adding device and method has the following beneficial effects:

[0028] The present application can prevent the copper oxide powder from clogging, so that the concentration of copper ions in the electroplating process is not too low, and the copper oxide powder is not precipitated on the product surface, thereby improving the product yield.

[0029] The present application can prevent the copper oxide powder from clogging, so that the concentration of copper ions in the electroplating process is not too low, and the copper oxide powder is not precipitated on the product surface, thereby improving the product yield.

[0030] The present application can prevent the copper oxide powder from clogging, so that the concentration of copper ions in the electroplating process is not too low, and the copper oxide powder is not precipitated on the product surface, thereby improving the product yield.

[0031] The present application can prevent the copper oxide powder from clogging, so that the concentration of copper ions in the electroplating process is not too low, and the copper oxide powder is not precipitated on the product surface, thereby improving the product yield. BRIEF DESCRIPTION OF DRAWINGS

[0032] Figure 1 The figure shows the overall structure of the FCBGA packaging substrate copper oxide powder automatic adding device in the embodiment one of the present application.

[0033] Figure 2 Fig. 1 shows a front view of the first container of the embodiment of the present application.

[0034] Figure 3 Fig. 2 shows a side view of the first container of the embodiment of the present application.

[0035] Figure 4 Fig. 3 shows a top view of the first container of the embodiment of the present application.

[0036] Figure 5 Fig. 4 shows a structural view of the second container of the embodiment of the present application.

[0037] Figure 6 Fig. 5 shows a front view of the third container and the weighing structure of the embodiment of the present application.

[0038] Figure 7 Fig. 6 shows a side view of the third container and the weighing structure of the embodiment of the present application.

[0039] Element Number Description

[0040] 10, carrier; 11, armrest; 12, universal wheel; 13, elastic member; 14, connecting structure; 15, shock absorbing structure;

[0041] 20, first container; 21, first vibrating device; 22, emergency control structure; 23, vacuum pump; 24, first adding pipe;

[0042] 30, second container; 31, monitoring device; 32, air suction pipe;

[0043] 40, third container; 41, second vibrating device; 42, weighing structure; 421, weighing meter; 422, weighing disc; 43, displacement structure; 44, filtering circulation pump; 441, pressure gauge; 442, flushing nozzle; 443, first flushing pipe; 444, second flushing pipe; 45, light sensor; 451, probe protection cover; 452, light sensing probe; 46, motor; 47, second adding pipe;

[0044] 50, dissolving tank; 51, dissolving protection cover. DETAILED DESCRIPTION

[0045] The present application is described in detail below by specific embodiments. Other advantages and effects of the present application can be easily understood by those skilled in the art from the disclosure of the present specification. The present application can also be implemented or applied by other different embodiments, and the details in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present application.

[0046] In the detailed description of embodiments of the present invention, for ease of explanation, the schematic diagrams illustrating the device structure may be partially enlarged without adhering to the general scale, and the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. Furthermore, in actual manufacturing, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0047] For ease of description, spatial relation terms such as “below,” “under,” “lower than,” “below,” “above,” and “upper” may be used herein to describe the relationship between one element or feature shown in the accompanying drawings and other elements or features. It will be understood that these spatial relation terms are intended to include directions other than those depicted in the accompanying drawings for devices in use or operation.

[0048] In the context of this application, the structure described above the first feature may include embodiments in which the first and second features are in direct contact, or embodiments in which additional features are formed between the first and second features, such that the first and second features may not be in direct contact.

[0049] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Therefore, the illustrations only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0050] Example 1:

[0051] like Figure 1 As shown, the present invention provides an automatic addition device for electroplating copper oxide powder on an FCBGA packaging substrate. The device includes a first container 20, a vacuum pump 23, a second container 30, a monitoring device 31, a third container 40, a weighing structure 42, a photosensor 45, and a dissolving tank 50.

[0052] The first container 20 is used to store copper oxide powder. The first container 20 is equipped with a first vibration device 21, which can make the first container 20 vibrate.

[0053] Vacuum pump 23 is connected to the first container 20 and the second container 30 respectively, and is used to extract copper oxide powder in the first container 20 into the second container 30;

[0054] The third container 40 is equipped with a second vibration device 41, which can cause the third container 40 to vibrate;

[0055] Weighing structure 42 is installed at the outlet of third container 40 to measure the weight of copper oxide powder in third container 40; photosensor 45 is installed next to third container 40 to sense the height of copper oxide powder in third container 40.

[0056] The monitoring device 31 is installed inside the second container 30 to monitor the measurement results of the weighing structure 42 and the sensing results of the photosensitive sensor 45, and to control the start and stop of copper oxide powder entering the second container 30 from the first container 20, entering the third container 40 from the second container 30, and entering the dissolving tank 50 from the third container 40 based on the measurement and sensing results.

[0057] This invention solves the problems of copper oxide powder clumping due to water absorption in the container during the electroplating process of FCBGA packaging substrate by setting a vibration device in the first container 20 and the second container 30. This results in problems such as blockage during addition, electroplating nodules, electroplating burrs, and electroplating pits caused by the precipitation of electroplating agglomerates. The invention achieves the technical effect of reducing product scrap rate and improving product yield and performance reliability.

[0058] Specifically, the vacuum pump 23 is connected to the first addition tube 24, and the vacuum pump 23 extracts copper oxide powder from the first container 20 to the second container 30 through the first addition tube 24.

[0059] In one embodiment, the first container 20 is shaped like an inverted frustum, which allows copper oxide powder to gather at the center of the first container 20, making it easier to extract and improving the efficiency of extracting copper oxide powder.

[0060] In one embodiment, the second container 30 is an inverted frustum shape.

[0061] In one embodiment, the third container 40 is inverted V-shaped, which allows the copper oxide powder to converge at the center of the third container 40, thereby improving the measurement accuracy of the weighing structure 42.

[0062] The present invention, by setting the shapes of the first container 20, the second container 30, and the third container 40, enables copper oxide powder to be better gathered at the outlet of the container, thereby improving the control of the transfer speed and addition amount of copper oxide powder.

[0063] In another example, such as Figures 2-3 As shown, the automatic copper oxide powder addition device for FCBGA packaging substrate electroplating also includes a carrier 10, which is used to support and move the first container 20. A first vibration device 21 is installed on the carrier 10 to vibrate the first container 20 placed on the carrier 10 to prevent the copper oxide powder in the first container 20 from clumping. The carrier 10 may be equipped with a handle 11 to facilitate the movement of the carrier 10. An elastic element 13 is provided at the bottom of the carrier 10. The elastic element 13 is used to ensure that the first container 20 can still maintain a relatively stable height when the carrier 10 is vibrating, so as to ensure the stability of the copper oxide powder extracted by the vacuum pump 23.

[0064] In one embodiment, the carrier 10 is equipped with casters to facilitate flexible movement of the first container 20.

[0065] In one embodiment, the first container 20 is a righting bucket, which is arranged in an automatic righting structure, and functions as an anti-inclination device, so that the first container 20 can be kept in a stable upright position, facilitating the extraction of the copper oxide powder.

[0066] Specifically, as shown in Figure 4 The connecting structure 14 is provided with a damping structure 15 to prevent the connecting structure 14 from loosening due to long-term vibration of the carrier 10.

[0067] In one embodiment, the first vibration device 21 is provided with an emergency control structure 22 for stopping the first vibration device 21 in an emergency.

[0068] In one embodiment, the vibration frequency of the first vibration device 21 or / and the second vibration device 41 is 20-50 Hz, and the duration of vibration is less than or equal to 30 seconds, so as to achieve the best effect of preventing caking while avoiding the influence of long working time of the vibration device on the addition process of the copper oxide powder.

[0069] Specifically, as shown in Figure 5 The second addition pipe 47 is provided with a motor 46, which is used to control the on-off of the second addition pipe 47, so as to control the speed and amount of the copper oxide powder entering the dissolving tank 50 from the third container 40 through the second addition pipe 47.

[0070] In one embodiment, the motor 46 is a three-phase asynchronous motor.

[0071] As an example, the second container 30 can rotate along its central axis. The present application further reduces the possibility of caking of the copper oxide powder and improves the uniformity of the addition of the copper oxide powder by combining the vibration device with the rotating motion.

[0072] As an example, the device further comprises a dissolving protective cover 51 arranged at the outlet of the third container 40 for blocking the splashing of the copper oxide powder.

[0073] The present application solves the problems of inaccurate addition amount of the copper oxide powder and rapid loss of the addition equipment caused by splashing during the addition of the copper oxide powder by arranging the dissolving protective cover 51 at the outlet of the third container 40, so as to improve the accuracy of the addition amount of the copper oxide powder, avoid the splashing corrosion of the surrounding equipment, and improve the service life of the addition device.

[0074] As an example, as shown in Figures 6-7As shown, the device further comprises a filter circulating pump 44, which is arranged beside the third container 40, and the filter circulating pump 44 comprises a flushing nozzle 442 for flushing the weighing structure 42 to flush the copper oxide powder on the weighing structure 42 into the dissolving tank 50.

[0075] In one embodiment, two flushing nozzles 442 are arranged, which flush the weighing structure 42 in a regionally overlapping manner, so as to enhance the flushing capacity and improve the flushing efficiency.

[0076] Specifically, the two flushing nozzles 442 are connected to the filter circulating pump 44 through a first flushing pipe 443 and a second flushing pipe 444 respectively, and the filter circulating pump 44 provides pressure for the two flushing nozzles 442.

[0077] Specifically, a pressure gauge 441 is arranged on the filter circulating pump 44 to monitor the water pressure of the flushing nozzles 442, and the filter circulating pump 44 is arranged to provide a pressure greater than or equal to 0.5 kgf / cm2.

[0078] The present application can make all the copper oxide powder on the weighing structure 42 enter the dissolving tank 50 by arranging the filter circulating pump 44 and the flushing nozzles 442, thereby solving the problem of poor plating uniformity or product failure caused by crystallization due to the difficulty in controlling the amount of copper oxide powder added, and improving the accuracy of the amount of copper oxide powder added and the yield of the plated product.

[0079] As an example, a displacement structure 43 is arranged below the weighing structure 42, and the displacement structure 43 enables the weighing structure 42 to move in the direction from the outlet of the third container 40 to the flushing nozzles 442.

[0080] Specifically, the displacement structure 43 can be a moving guide rail.

[0081] The present application can separate the position of releasing the copper oxide powder from the second container 30 into the third container 40 and the position of flushing the copper oxide powder on the weighing structure 42 by arranging the displacement structure 43, so as to avoid the splashing solution generated during the flushing process from entering the second container 30, thereby further reducing the possibility of the copper oxide powder being agglomerated in the adding device, solving the problem of adding difficulty or poor plating caused by the agglomeration of the copper oxide powder, and achieving the effect of improving the yield of the plated product.

[0082] Specifically, the weighing structure 42 is composed of a weighing instrument 421 and a weighing disc 422, the weighing disc 422 is used to place the copper oxide powder and sense the weight information, and the weighing instrument 421 is used to process, display and transmit the weight information.

[0083] In one embodiment, the weighing disc 422 is arranged in the shape of a V-shaped channel to be flushed by the flushing nozzles 442, so as to improve the flushing efficiency and cleanliness.

[0084] As an example, the second container 30 is provided with an air extraction pipe 32 for keeping the FCBGA package substrate electroplating copper oxide powder automatic adding device dry.

[0085] The present application keeps the FCBGA package substrate electroplating copper oxide powder automatic adding device dry by providing the second container 30 with an air extraction pipe 32, thus avoiding the phenomenon of copper oxide clumping in a large area due to the hot gas generated by the solution reaction when the copper oxide powder is added from the third container 40 into the dissolving tank 50, thus further reducing the possibility of copper oxide powder clumping.

[0086] In one embodiment, a light sensor is provided in the second container 30 to detect the height of the copper oxide powder in the second container 30 to obtain the copper oxide powder storage in the second container 30.

[0087] In one embodiment, a probe protection cover 451 is provided around the light sensing probe 452 of the light sensor 45 to prevent the sputtering of copper oxide powder from interfering with the normal operation of the light sensing probe 452.

[0088] Embodiment two:

[0089] The present application provides a FCBGA package substrate electroplating copper oxide powder automatic adding method, which uses any one of the FCBGA package substrate electroplating copper oxide powder automatic adding devices of embodiment one, and the method comprises:

[0090] Step 1: Place the copper oxide powder in the first container 20, and vibrate the first container 20 with the first vibration device 21 to prevent the copper oxide powder from clumping;

[0091] Step 2: Extract the copper oxide powder to the second container 30 with the vacuum pump 23, and vibrate the third container 40 with the second vibration device 41 to prevent the copper oxide powder from clumping;

[0092] Step 3: Monitor the measurement results of the weight of the copper oxide powder in the third container 40 by the weighing structure 42 and the sensing results of the height of the copper oxide powder in the third container 40 by the light sensor 45, and control the transfer of the copper oxide powder in the first container 20, the second container 30, the third container 40 and the dissolving tank 50 according to the measurement results and the sensing results.

[0093] The FCBGA package substrate electroplating copper oxide powder automatic adding method of the present application will be described in detail below with reference to the accompanying drawings, and it should be noted that the above sequence does not strictly represent the sequence of the FCBGA package substrate electroplating copper oxide powder automatic adding method protected by the present application, and those skilled in the art can change the actual preparation steps accordingly.

[0094] Firstly, step 1 is performed, the copper oxide powder is placed in the first container 20, and the first vibrating device 21 vibrates the first container 20 to prevent the copper oxide powder from caking.

[0095] Then, step 2 is performed, the vacuum pump 23 extracts the copper oxide powder to the second container 30, and the second vibrating device 41 vibrates the third container 40 to prevent the copper oxide powder from caking.

[0096] Next, step 3 is performed, the monitoring device 31 monitors the measurement result of the weight measuring structure 42 on the weight of the copper oxide powder in the third container 40 and the sensing result of the light sensor 45 on the height of the copper oxide powder in the third container 40, and controls the transfer of the copper oxide powder in the first container 20, the second container 30, the third container 40, and the dissolving tank 50 according to the measurement result and the sensing result.

[0097] The present application prevents the copper oxide powder from caking due to water absorption by vibrating the container to which the copper oxide powder is added, thereby solving the problem of poor addition or poor plating caused by caking during the addition of the copper oxide powder in the FCBGA package substrate plating process, and improving the plating yield and plating efficiency.

[0098] As an example, the method of controlling the transfer of the copper oxide powder from the second container 30 to the third container 40 includes: the channel from the second container 30 to the third container 40 is set to be closed by default; the monitoring device 31 monitors the change in the cumulative power consumption of the dissolving tank 50, and when the cumulative power consumption increases by a preset power, the monitoring device 31 controls to open the channel from the second container 30 to the third container 40, so that the copper oxide powder enters the third container 40 from the second container 30; when the weight measuring structure 42 measures that the weight of the copper oxide powder in the third container 40 exceeds a preset weight, the monitoring device 31 controls to close the channel from the second container 30 to the third container 40 and open the channel from the third container 40 to the dissolving tank 50, so that the copper oxide powder enters the dissolving tank 50 from the third container 40.

[0099] The present application determines the time and amount of addition of the copper oxide powder by monitoring the change in the cumulative power consumption in the dissolving tank 50 by the monitoring device 31, thereby improving the control accuracy of the amount of copper oxide powder added.

[0100] As an example, when the cumulative power consumption increases by 10 kA, 250 g of copper oxide powder is added.

[0101] Specifically, when the cumulative power consumption increases by a preset power, the monitoring device 31 controls the third container 40 to rotate along its central axis, and the second vibrating device 41 starts to vibrate the third container 40. The present application further reduces the possibility of caking of the copper oxide powder by the vibrating device in the third container 40 cooperating with the central rotation.

[0102] As an example, the method for controlling the passage of the copper oxide powder from the second container 30 to the third container 40 further comprises: when the light sensor 45 senses that the height of the copper oxide powder in the third container 40 exceeds the preset height and lasts for a preset time, the monitoring device 31 closes the passage from the second container 30 to the third container 40 and resets the weighing structure 42.

[0103] In one embodiment, the preset time is 10 seconds and the preset height is 5 mm higher than the height corresponding to the preset weight of the weighing structure 42.

[0104] The present application avoids the excessive addition of copper oxide powder caused by the failure of the weighing structure 42 to recognize or repeatedly weigh, solves the problem of poor plating products caused by excessive crystallization of copper oxide powder, realizes double monitoring of the amount of copper oxide powder added, and improves the control accuracy of the amount of copper oxide powder added.

[0105] Specifically, when the weighing structure 42 measures the preset weight or the light sensor 45 senses the preset height, the monitoring device 31 controls the first vibrating device 21 on the first container 20 to start working, preparing for the subsequent addition of copper oxide powder to the third container 40 and eliminating the caking of copper oxide powder in the first container 20.

[0106] As an example, the method for controlling the passage of the third container 40 to the dissolving tank 50 comprises: the weighing structure 42 itself is used as the passage from the third container 40 to the dissolving tank 50, the weighing structure 42 is arranged at the outlet of the third container 40 to prevent the copper oxide powder in the third container 40 from falling into the dissolving tank 50; a filter circulating pump 44 is arranged beside the third container 40, the filter circulating pump 44 is provided with a water flushing nozzle 442, and a displacement structure 43 is arranged below the weighing structure 42; when the monitoring device 31 monitors that the measurement result of the weighing structure 42 reaches the preset weight, the monitoring device 31 controls to close the passage from the second container 30 to the third container 40, the displacement structure 43 moves the weighing structure 42 to the water flushing nozzle 442, the water flushing nozzle 442 cleans the weighing structure 42, and the copper oxide powder enters the dissolving tank 50 from the third container 40; when the monitoring device 31 monitors that the measurement result of the weighing structure 42 is 0, the monitoring device 31 controls the water flushing nozzle 442 to stop cleaning, and the displacement structure 43 moves the weighing structure 42 back to the outlet of the third container 40.

[0107] Specifically, the water flushing nozzle 442 stops flushing every preset time, the weighing structure 42 measures the weight, and the measurement result of the weighing structure 42 is not affected by the water pressure of the water flushing nozzle 442.

[0108] As an example, the vacuum pump 23 is set to a default closed state, the monitoring device 31 monitors the storage of copper oxide powder in the second container 30, when the storage is lower than a preset value, the monitoring device 31 starts the vacuum pump 23, and the vacuum pump 23 extracts the copper oxide powder in the first container 20 to the second container 30; when the storage reaches the preset value, the monitoring device 31 closes the vacuum pump 23.

[0109] In summary, the FCBGA packaging substrate copper oxide powder electroplating automatic adding device and method can prevent the copper oxide powder from clogging to make the electroplating copper ion concentration too low or the copper oxide powder precipitate on the product surface, thereby improving the product yield, by setting a vibration device in the container to prevent the copper oxide powder from clogging before entering the dissolving tank in the FCBGA packaging substrate electroplating process; meanwhile, the light sensor is used to monitor the height of the copper oxide powder to prevent the abnormal measurement of the weighing structure from causing excessive addition of the copper oxide powder, thereby improving the accuracy of the electroplating copper amount in the dissolving tank; in addition, the weighing structure, displacement structure and filtering circulating pump are used to move and clean the weighing structure after adding the copper oxide powder, thereby further improving the accuracy of the electroplating copper amount in the dissolving tank; finally, the use of the protective cover prevents the copper oxide powder from splashing when entering the dissolving tank.

[0110] Therefore, the present application effectively overcomes the shortcomings in the prior art and has high industrial utilization value.

[0111] The above embodiments only exemplarily illustrate the principles and effects of the present application, and are not used to limit the present application. Any person skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes completed by those skilled in the art without departing from the spirit and technical thought disclosed by the present application should be covered by the claims of the present application.

Claims

1. An automatic FCBGA package substrate copper oxide powder plating adding device, characterized in that, The device comprises a first container, a vacuum pump, a second container, a monitoring device, a third container, a weighing structure, a light sensor, a dissolving tank. The first container is used for storing copper oxide powder, and is provided with a first vibrating device to vibrate the first container. The vacuum pump is connected with the first container and the second container respectively, and is used for extracting the copper oxide powder in the first container into the second container. The third container is provided with a second vibrating device to vibrate the third container. The weighing structure is arranged at the outlet of the third container, and is used for measuring the weight of the copper oxide powder in the third container. The light sensor is arranged beside the third container, and is used for sensing the height of the copper oxide powder in the third container. The monitoring device is arranged in the second container, and is used for monitoring the measurement result of the weighing structure and the sensing result of the light sensor, and controlling the start and stop of the copper oxide powder from the first container into the second container, from the second container into the third container, and from the third container into the dissolving tank according to the measurement result and the sensing result. The device further comprises a dissolving protection cover arranged at the outlet of the third container, and used for blocking the copper oxide powder from splashing out. The device further comprises a filtering circulating pump arranged beside the third container, and comprising a water flushing nozzle used for flushing the weighing structure to flush the copper oxide powder on the weighing structure into the dissolving tank. A displacement structure is arranged below the weighing structure, and the displacement structure enables the weighing structure to move along the direction from the outlet of the third container to the water flushing nozzle.

2. A method for automatically adding electroplated copper oxide powder to an FCBGA package substrate, characterized by, The second container is provided with an air extraction pipe to keep the inside of the FCBGA package substrate copper oxide powder automatic adding device dry. The method is performed by using the FCBGA package substrate copper oxide powder automatic adding device in claim 1, and comprises the following steps. The copper oxide powder is placed in the first container. The first vibrating device vibrates the first container to prevent the copper oxide powder from caking. The vacuum pump extracts the copper oxide powder into the second container. The second vibrating device vibrates the third container to prevent the copper oxide powder from caking. The monitoring device monitors the measurement result of the weighing structure on the weight of the copper oxide powder in the third container and the sensing result of the light sensor on the height of the copper oxide powder in the third container, and controls the transfer of the copper oxide powder in the first container, the second container, the third container and the dissolving tank according to the measurement result and the sensing result. The method for controlling the copper oxide powder from the second container to the third container comprises that the channel from the second container to the third container is set to be closed by default. The monitoring device monitors the cumulative power consumption change of the dissolving tank, and when the cumulative power consumption increases by a preset power, the monitoring device controls to open the channel from the second container to the third container, so that the copper oxide powder enters the third container from the second container. When the weighing structure measures that the weight of the copper oxide powder in the third container exceeds a preset weight, the monitoring device controls to close the passage from the second container to the third container, open the passage from the third container to the dissolving tank, and make the copper oxide powder from the third container enter the dissolving tank; The method for controlling the transfer of the copper oxide powder from the second container to the third container further comprises: when the light sensor senses that the height of the copper oxide powder in the third container exceeds a preset height and lasts for a preset time, the monitoring device closes the passage from the second container to the third container and resets the weighing structure; The method for controlling the transfer of the copper oxide powder from the third container to the dissolving tank comprises: The weighing structure itself is used as the passage from the third container to the dissolving tank, and the weighing structure is arranged at the outlet of the third container to prevent the copper oxide powder in the third container from falling into the dissolving tank; A filter circulating pump is arranged beside the third container, the filter circulating pump is provided with a water flushing nozzle, and a displacement structure is arranged below the weighing structure; When the monitoring device monitors that the measurement result of the weighing structure reaches the preset weight, the monitoring device controls to close the passage from the second container to the third container, the displacement structure moves the weighing structure to the water flushing nozzle, the water flushing nozzle cleans the weighing structure, and the copper oxide powder from the third container enters the dissolving tank; When the monitoring device monitors that the measurement result of the weighing structure is 0, the monitoring device controls the water flushing nozzle to end the cleaning, and the displacement structure moves the weighing structure back to the outlet of the third container; The vacuum pump is in a default closed state, the monitoring device monitors the storage amount of the copper oxide powder in the second container, when the storage amount is lower than a preset value, the monitoring device starts the vacuum pump, and the vacuum pump extracts the copper oxide powder in the first container to the second container; when the storage amount reaches the preset value, the monitoring device closes the vacuum pump.

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