Roll materials and their manufacturing methods

Abstract

This application relates to a roll material and its manufacturing method. The roll material includes a carrier film, a first metal film, and a second metal film. The carrier film includes a substrate layer and a functional layer disposed on the substrate layer. The substrate layer has a plurality of clearance holes, and the orthographic projection of the functional layer on the substrate layer and the orthographic projection of the clearance holes on the substrate layer at least partially overlap, so that at least a portion of the surface on each of the opposite sides of the functional layer is exposed. The first metal film is disposed in the area exposed on one side of the functional layer. The second metal film is disposed in the area exposed on the opposite side of the functional layer. A plurality of stress relief zones are provided around the clearance holes. This roll material can solve the problem that the metal film sputtered on the surface of the carrier film is easily scratched during deformation in the roll-to-roll process of flexible thin-film electronic materials.

Description

Technical Field

[0001] This application relates to the field of display device manufacturing technology, and in particular to a roll material and a method for manufacturing the same. Background Technology

[0002] Flexible thin-film electronic materials are commonly used in the manufacture of display devices, and typically consist of a flexible carrier film and a metal film sputtered onto the surface of the carrier film. In roll-to-roll processes, flexible thin-film electronic materials are easily deformed by the tensile forces generated during the winding process, making the metal film sputtered onto the surface of the carrier film susceptible to scratches during deformation. Summary of the Invention

[0003] Therefore, it is necessary to provide a roll material and its manufacturing method to address the problem that the metal film sputtered on the surface of the carrier film is easily scratched during the deformation process in the roll-to-roll manufacturing process of flexible thin-film electronic materials.

[0004] According to one aspect of this application, a roll material is provided, comprising: a carrier film, the carrier film including a substrate layer and a functional layer disposed on the substrate layer; the substrate layer having a plurality of clearance holes, the orthographic projection of the functional layer on the substrate layer and the orthographic projection of the clearance holes on the substrate layer at least partially overlapping, such that at least a portion of each of the opposite sides of the functional layer is exposed; a first metal film disposed on the exposed area of ​​one side surface of the functional layer; and a second metal film disposed on the exposed area of ​​the opposite side surface of the functional layer; wherein a plurality of stress relief zones are provided around the clearance holes.

[0005] In some embodiments, the substrate layer is provided with a plurality of stress relief holes located in the stress relief zone, and the stress relief holes and the clearance holes are arranged at intervals.

[0006] In some embodiments, the plurality of stress relief holes include a plurality of first stress relief holes; along a first direction, the opposite ends of the first stress relief holes are aligned with the opposite ends of the clearance holes; wherein, the first direction intersects the length direction of the roll material.

[0007] In some embodiments, the substrate layer is provided with a plurality of clearance holes spaced apart along a second direction; in the interval region between any two adjacent clearance holes, a plurality of first stress relief holes are spaced apart; wherein, the second direction is parallel to the length direction of the roll material.

[0008] In some embodiments, a plurality of the first stress relief holes are uniformly spaced along a second direction within the interval region between any two adjacent clearance holes.

[0009] In some embodiments, the substrate layer includes a first region and a second region located beside the clearance hole along a second direction; the first region is disposed adjacent to the clearance hole; the second region is disposed adjacent to the first region, and the second region and the clearance hole are spaced apart by the first region; the plurality of first stress relief holes are disposed in the second region.

[0010] In some embodiments, the plurality of stress relief holes include a plurality of second stress relief holes; along a first direction, the second stress relief holes and the first stress relief holes are arranged at intervals.

[0011] In some embodiments, a plurality of second stress relief holes are spaced apart on the substrate layer along a second direction; wherein the second direction is parallel to the length direction of the roll material.

[0012] In some embodiments, the second stress relief hole includes a plurality of sub-relief holes spaced apart along a first direction; along a second direction, a plurality of first stress relief holes are spaced apart on the substrate layer; the plurality of first stress relief holes spaced apart along the second direction are configured to correspond one-to-one with the plurality of second stress relief holes spaced apart along the second direction.

[0013] According to another aspect of this application, a method for manufacturing a roll material is provided, the method comprising the following steps: providing a substrate layer and a functional layer, and providing a plurality of clearance holes and a plurality of stress relief zones around the clearance holes on the substrate layer; disposing the functional layer on the substrate layer, and at least partially overlapping the orthographic projection of the functional layer on the substrate layer with the orthographic projection of the clearance holes on the substrate layer, so that at least a portion of the surfaces on opposite sides of the functional layer are exposed; and respectively disposing a first metal film and a second metal film on the exposed areas of the surfaces on opposite sides of the functional layer.

[0014] The roll material provided in this application, by providing clearance holes in the substrate layer, allows at least a portion of the surfaces on both sides of the functional layer disposed on the substrate layer to be exposed. This facilitates the placement of a first metal layer and a second metal layer on the opposite sides of the functional layer, resulting in a structure where the first metal layer, the functional layer, and the second metal layer are stacked sequentially. Based on this, one or more stress relief zones are provided around the clearance holes to reduce stress concentration in the area where the clearance holes are located, preventing deformation in the area of ​​the clearance holes or reducing the degree of deformation in the area of ​​the clearance holes, thereby solving the problem of the metal film being easily scratched during winding. Attached Figure Description

[0015] Figure 1 A cross-sectional view of the roll material according to an embodiment of this application is shown;

[0016] Figure 2 A schematic diagram of the structure of the substrate layer of the roll material in one embodiment of this application is shown;

[0017] Figures 3a to 3d The following are schematic diagrams illustrating the structure of the substrate layer, functional layer, and protective film in several embodiments of this application;

[0018] Figure 4 A schematic diagram of the structure of the substrate layer of the roll material is shown in another embodiment of this application;

[0019] Figure 5 A schematic diagram of the structure of the substrate layer of the roll material is shown in another embodiment of this application.

[0020] Explanation of icon numbers:

[0021] 10: Supporting membrane 12: Functional layer

[0022] 11: Substrate layer; 13: Protective film

[0023] 11a: Area 14: Tape

[0024] 11b: Second region 20: First metal film

[0025] h1: Clearance hole 30: Second metal film

[0026] h2: First stress relief hole; X: First direction

[0027] h3: Second stress relief hole; Y: Second direction

[0028] h31: Sub-release port Detailed Implementation

[0029] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0030] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0031] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0032] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0033] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0034] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0035] Flexible thin-film electronic materials are required in the production of display devices. Currently, commonly used flexible thin-film electronic materials typically consist of a structure of stacked metal films, a carrier film, and another metal film. In the roll-to-roll process of flexible thin-film electronic materials, sputtering technology is often used for film deposition. Specifically, the carrier film is first subjected to plasma surface treatment to increase its adhesion, and then a layer of metal film is sputtered onto each of the opposite surfaces of the carrier film.

[0036] When sheet-like piezoelectric films, such as polyvinylidene fluoride (PVDF), are used in roll-to-roll processes for flexible thin-film electronic materials, punch holes are typically created first on a substrate layer, and then the piezoelectric film is placed on the substrate layer to form a carrier film. The piezoelectric film is positioned corresponding to the punch holes. Thus, after a metal film is deposited on one side of the piezoelectric film, another metal film can be deposited on the other side through the punch holes. However, during the winding process, the deposited metal film is easily scratched by friction. Furthermore, if the metal film is subsequently patterned, the patterned metal film is prone to line breaks at the scratched areas.

[0037] Based on this, the inventors of this application have discovered that after opening holes in the substrate layer, the overall elastic modulus of the carrier film formed by the substrate layer and the piezoelectric film is not uniform. For example, when the shape of the cutting hole is rectangular, stress concentration is likely to occur at the four apex corners of the cutting hole. This makes the carrier film prone to deformation in the opening area due to the tensile force generated during the winding process. During the deformation of the carrier film, the opening edge in the opening area is prone to scratching the metal film.

[0038] To address the aforementioned problems, this application provides a roll material including a carrier film and a metal film disposed on the carrier film. The carrier film includes a substrate layer with clearance holes and a functional layer corresponding to the clearance holes. The clearance holes expose the surfaces of the functional layer on opposite sides, and the metal film is disposed in the exposed areas of the functional layer. Furthermore, one or more stress-relieving zones are provided around the clearance holes to reduce stress concentration in the area where the clearance holes are located, thereby preventing deformation in the area of ​​the clearance holes or reducing the degree of deformation, thus solving the problem of the metal film being easily scratched during winding.

[0039] Figure 1 A cross-sectional view of the roll material according to one embodiment of this application is shown. Figure 2 A schematic diagram of the structure of the substrate layer of the roll material in one embodiment of this application is shown.

[0040] See Figure 1 and Figure 2 An embodiment of this application provides a roll material including a carrier film 10, a first metal film 20, and a second metal film 30. The carrier film 10 includes a substrate layer 11 and a functional layer 12 disposed on the substrate layer 11. The substrate layer 11 has a plurality of clearance holes h1. The orthographic projection of the functional layer 12 on the substrate layer 11 at least partially overlaps with the orthographic projection of the clearance holes h1 on the substrate layer 11, so that at least a portion of the surface on each of the opposite sides of the functional layer 12 is exposed. Exemplarily, the substrate layer 11 is a flexible substrate, such as polyethylene terephthalate (PET) or polyimide (PI), and the functional layer 12 is a piezoelectric film, such as polyvinylidene fluoride (PVDF). The provision of a plurality of clearance holes h1 on the substrate layer 11 includes one or more clearance holes h1 on the substrate layer 11. The first metal film 20 is disposed in the area exposed on one side of the functional layer 12, and the second metal film 30 is disposed in the area exposed on the opposite side of the functional layer 12. Several stress-relieving zones are provided around the clearance hole h1. Based on this, by utilizing the stress-relieving zones provided around the clearance hole h1, the stress concentrated in the area where the clearance hole h1 is located is reduced, thus preventing deformation of the area where the clearance hole h1 is located or reducing the degree of deformation in the area where the clearance hole h1 is located, thereby solving the problem that the metal film is easily scratched during the winding process.

[0041] Understandably, the stress relief zone can guide stress in one or more directions. For example, the stress guidance direction can be parallel to the length direction of the roll material, perpendicular to the length direction of the roll material, or intersect with but not perpendicular to the length direction of the roll material.

[0042] Optionally, the first metal film 20 and the second metal film 30 are deposited on opposite sides of the functional layer 12. For example, the first metal film 20 and the second metal film 30 are deposited on opposite sides of the functional layer 12 using a sputtering process. Specifically, the first metal film 20 and the second metal film 30 can be a multi-layer stacked structure, such as a three-layer stacked structure. The metal in the middle layer has low resistance and mainly serves to transmit electrical signals, while the metal in the outer layers prevents the middle layer metal from deteriorating and ensures ohmic contact with the interface, thus protecting the middle layer metal and improving the input and output current performance. For example, the first metal film 20 is titanium / aluminum / titanium (Ti / Al / Ti) or copper-nickel alloy / copper / copper-nickel alloy (CuNi / Cu / CuNi), and the material of the second metal film 30 may be the same as or different from that of the first metal film 20.

[0043] Furthermore, the first metal film 20 and the second metal film 30 are sequentially deposited on the surfaces of opposite sides of the functional layer 12. For example, the first metal film 20 is first sputtered on one side of the functional layer 12, and during this process, the roll is wound up while sputtering until the first metal film 20 of the entire roll is sputtered; then the second metal film 30 is sputtered on the surface of the opposite side of the functional layer 12.

[0044] Figures 3a to 3d The diagram shows structural schematics of the substrate layer, functional layer, and protective film in several embodiments of this application.

[0045] Optionally, see Figure 1 and Figure 3a During the sputtering of the first metal film 20, a protective film 13 is provided on the surface of the functional layer 12 facing away from the first metal film 20. Thus, during the sputtering and winding of the first metal film 20, the protective film 13 protects the surface of the functional layer 12 facing away from the first metal film 20, preventing scratches. After the sputtering of the first metal film 20 is completed, the protective film 13 is peeled off to expose the surface of the functional layer 12 facing away from the first metal film 20, and the sputtering of the second metal film 30 continues.

[0046] Optionally, see Figures 3a to 3d To improve the stability between the functional layer 12 and the substrate layer 11, an adhesive tape 14 can be used to fix the functional layer 12 and the substrate layer 11.

[0047] Optionally, the substrate layer 11 has a clearance hole h1, and the functional layer 12 is embedded in the clearance hole h1. Alternatively, the functional layer 12 is attached to one side surface of the substrate layer 11 and covers the clearance hole h1. Further, the protective film 13 includes an adhesive layer, and the protective film 13 is bonded to one side of the functional layer 12 through the adhesive layer. To improve the stability of the protective film 13, it can be further fixed to the substrate layer 11 by tape 14.

[0048] In some embodiments, the substrate layer 11 is provided with a plurality of stress relief holes located in the stress relief zone, and the stress relief holes and the clearance holes h1 are arranged at intervals. Based on this, during the winding process of the roll material, some stress is transferred to the stress relief holes, thereby preventing stress from accumulating in the area where the clearance holes h1 are located.

[0049] Optionally, see Figure 1 and Figure 2 The system includes several stress relief holes, including several first stress relief holes h2. Furthermore, along a first direction X, the opposite ends of the first stress relief holes h2 are aligned with the opposite ends of the clearance holes h1. The first direction X intersects the length direction of the roll material; for example, the first direction X intersects perpendicularly to the length direction of the roll material, or the angle between the first direction X and the length direction of the roll material is less than 90°. Based on this, the stress distribution in different areas along the length direction of the roll material is more uniform, thereby reducing stress concentration in the area where the clearance holes h1 are located.

[0050] In some embodiments, the substrate layer 11 is provided with a plurality of clearance holes h1 spaced apart along a second direction Y, wherein the second direction Y is parallel to the length direction of the roll material. In the interval region between any two adjacent clearance holes h1, a plurality of first stress relief holes h2 are spaced apart. Thus, the plurality of first stress relief holes h2 spaced apart along the second direction Y can disperse stress multiple times, further reducing stress concentration in the area where the clearance holes h1 are located.

[0051] Furthermore, within the interval region between any two adjacent clearance holes h1, a plurality of first stress relief holes h2 are uniformly spaced along the second direction Y. Because the plurality of first stress relief holes h2 are uniformly spaced along the second direction Y, the stress within the interval region between any two adjacent clearance holes h1 is evenly distributed, thereby improving the uniformity of stress distribution along the length of the roll material.

[0052] For example, the shape of the clearance hole h1 is rectangular, and the size of the clearance hole h1 is from 10cm×10cm to 20cm×20cm. The spacing between two adjacent clearance holes h1 can be adjusted according to the dimensional accuracy of the cutting die.

[0053] Figure 4A schematic diagram of the substrate layer of the roll material is shown in another embodiment of this application.

[0054] See Figure 1 and Figure 4 In some embodiments, the substrate layer 11 includes a first region 11a and a second region 11b located beside the clearance hole h1 along the second direction Y. The first region 11a is adjacent to the clearance hole h1, and the second region 11b is adjacent to the first region 11a, with the second region 11b separated from the clearance hole h1 by the first region 11a. A plurality of first stress relief holes h2 are provided within the second region 11b. Optionally, the number of first stress relief holes h2 provided within the second region 11b may be one or more. This disperses stress in areas farther from the clearance hole h1, resulting in lower stress in the area where the clearance hole h1 is located.

[0055] Figure 5 A schematic diagram of the structure of the substrate layer of the roll material is shown in another embodiment of this application.

[0056] See Figure 1 and Figure 5 In some embodiments, the stress relief holes include a plurality of first stress relief holes h2 and a plurality of second stress relief holes h3. Along a first direction X, the opposite ends of the first stress relief holes h2 are aligned with the opposite ends of the avoidance holes h1, and the second stress relief holes h3 are arranged at intervals from the first stress relief holes h2. The first direction X intersects the length direction of the roll material. Thus, the first stress relief holes h2 disperse the stress of the roll material along the length direction, while the second stress relief holes h3 disperse the stress of the roll material in a direction intersecting the length direction, such as the width direction, thereby reducing the stress in the area where the avoidance holes h1 are located.

[0057] Furthermore, along the second direction Y, a plurality of second stress relief holes h3 are arranged at intervals on the substrate layer 11. The second direction Y is parallel to the length direction of the roll material. This enhances the stress dispersion effect.

[0058] Optionally, the substrate layer 11 is provided with a plurality of second stress relief holes h3 spaced apart along the second direction Y, and the second stress relief holes h3 include a plurality of sub-stress relief holes h31 spaced apart along the first direction X. Furthermore, along the second direction Y, the substrate layer 11 is provided with a plurality of first stress relief holes h2 spaced apart. The plurality of first stress relief holes h2 spaced apart along the second direction Y are corresponding one-to-one with the plurality of second stress relief holes h3 spaced apart along the second direction Y. Based on this, while the plurality of first stress relief holes h2 spaced apart along the second direction Y and the plurality of second stress relief holes h3 spaced apart along the second direction Y disperse the stress of the roll multiple times along the length direction of the roll, the plurality of sub-stress relief holes h31 spaced apart along the first direction X disperse the stress of the roll multiple times along the width direction of the roll, thereby improving the stress dispersion effect.

[0059] Based on the same inventive purpose, this application provides a method for manufacturing a roll material.

[0060] See Figure 1 and Figure 2 In one embodiment of this application, the method for manufacturing the roll material includes the following steps: providing a substrate layer 11 and a functional layer 12, and providing a plurality of clearance holes h1 and a plurality of stress relief areas around the clearance holes h1 on the substrate layer 11; disposing the functional layer 12 on the substrate layer 11, and at least partially overlapping the orthographic projection of the functional layer 12 on the substrate layer 11 with the orthographic projection of the clearance holes h1 on the substrate layer 11, so that at least a portion of the surface on each of the opposite sides of the functional layer 12 is exposed; and respectively disposing a first metal film 20 and a second metal film 30 on the exposed areas on the opposite sides of the functional layer 12. The first metal film 20 and the second metal film 30 can be disposed on the surface of the functional film using a sputtering process. For example, the thickness of the functional layer 12 is 120 μm, the thickness of the first metal film 20 is 300 nm, and the thickness of the second metal film 30 is 300 nm.

[0061] The method for manufacturing the roll material provided in this embodiment, by providing clearance holes h1 on the substrate layer 11, allows at least a portion of the surfaces on both sides of the functional layer 12 disposed on the substrate layer 11 to be exposed. This facilitates the placement of a first metal layer and a second metal layer on the opposite sides of the functional layer 12, resulting in a structure where the first metal layer, the functional layer 12, and the second metal layer are stacked sequentially. Based on this, one or more stress relief zones are provided around the clearance holes h1 to reduce stress concentration in the area where the clearance holes h1 are located, preventing deformation in the area where the clearance holes h1 are located or reducing the degree of deformation in the area where the clearance holes h1 are located, thereby solving the problem that the metal film is easily scratched during the winding process.

[0062] Optionally, a first metal film 20 and a second metal film 30 are respectively disposed on the exposed areas of the opposite sides of the functional layer 12, including sequentially sputtering the first metal film 20 and the second metal film 30 on the opposite sides of the functional layer 12. For example, the first metal film 20 is first sputtered on one side of the functional layer 12, and the roll is wound up while sputtering until the first metal film 20 of the entire roll is sputtered; then the second metal film 30 is sputtered on the opposite side of the functional layer 12.

[0063] Optionally, the method further includes providing a protective film 13, such as a release film, on the surface of the functional layer 12 facing away from the first metal film 20. Thus, during the sputtering and winding of the first metal film 20, the protective film 13 protects the surface of the functional layer 12 facing away from the first metal film 20, preventing scratches. After the sputtering of the first metal film 20 is completed, the protective film 13 is peeled off to expose the surface of the functional layer 12 facing away from the first metal film 20, and the sputtering of the second metal film 30 continues.

[0064] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0065] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A roll material, characterized in that, include: A carrier film includes a substrate layer and a functional layer disposed on the substrate layer; the substrate layer is provided with a plurality of clearance holes, and the orthographic projection of the functional layer on the substrate layer and the orthographic projection of the clearance holes on the substrate layer at least partially overlap, so that at least a portion of the surface on each of the opposite sides of the functional layer is exposed. A first metal film is disposed on the exposed area of ​​one side surface of the functional layer; and The second metal film is disposed on the exposed area of ​​the opposite side surface of the functional layer; The avoidance hole is surrounded by several stress relief areas; the substrate layer is provided with several stress relief holes located in the stress relief areas, and the stress relief holes and the avoidance hole are arranged at intervals; the several stress relief holes include several first stress relief holes; Along the first direction, the opposite ends of the first stress relief hole are aligned with the opposite ends of the clearance hole; The first direction intersects with the length direction of the roll material.

2. The roll material according to claim 1, characterized in that, The substrate layer is provided with a plurality of clearance holes spaced apart along the second direction; In the interval area between any two adjacent avoidance holes, a plurality of the first stress relief holes are provided at intervals; The second direction is parallel to the length direction of the roll material.

3. The roll material according to claim 2, characterized in that, Within the interval region between any two adjacent clearance holes, a plurality of the first stress relief holes are uniformly spaced along the second direction.

4. The roll material according to claim 2, characterized in that, The substrate layer includes a first region and a second region located beside the clearance hole along the second direction; The first region is disposed adjacent to the clearance hole; The second region is disposed adjacent to the first region, and the second region is separated from the clearance hole by the first region; The plurality of first stress relief holes are provided in the second region.

5. The roll material according to any one of claims 1-4, characterized in that, The plurality of stress relief holes includes a plurality of second stress relief holes; Along the first direction, the second stress relief hole and the first stress relief hole are arranged at intervals.

6. The roll material according to claim 5, characterized in that, Along the second direction, a plurality of second stress relief holes are arranged at intervals on the substrate layer; The second direction is parallel to the length direction of the roll material.

7. The roll material according to claim 6, characterized in that, The second stress relief hole includes a plurality of sub-relief holes spaced apart along the first direction; Along the second direction, a plurality of the first stress relief holes are arranged at intervals on the substrate layer; The plurality of first stress relief holes arranged at intervals along the second direction are respectively provided in a one-to-one correspondence with the plurality of second stress relief holes arranged at intervals along the second direction.

8. A method for manufacturing a roll material, characterized in that, The method includes the following steps: A substrate layer and a functional layer are provided, and a plurality of clearance holes and a plurality of stress relief zones are provided on the substrate layer. The functional layer is disposed on the substrate layer, and the orthographic projection of the functional layer on the substrate layer and the orthographic projection of the clearance hole on the substrate layer at least partially overlap, so that at least a portion of the surface on each of the opposite sides of the functional layer is exposed. A first metal film and a second metal film are respectively disposed in the areas exposed on opposite sides of the surface of the functional layer.

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