Packaging method, device and equipment of circuit module and storage medium
By acquiring the identifier and signal flow direction of the circuit module, the topology connection method and external ports are determined, enabling automated packaging of the circuit module. This solves the problems of high cost and long cycle of integrated circuit design, improves design efficiency, and saves labor costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- TSINGHUA UNIVERSITY
- Filing Date
- 2023-05-06
- Publication Date
- 2026-07-21
AI Technical Summary
Integrated circuit design is costly and time-consuming. The existing design process is lengthy and requires the participation of a large number of professional engineers, resulting in low design efficiency.
By acquiring the identifier, target parameters, and signal flow direction of the circuit module, the topology connection method and external ports are determined, thereby achieving automated encapsulation of the circuit module.
It improves the reusability and design efficiency of circuit modules, saves labor costs, and simplifies the integrated circuit design process.
Smart Images
Figure CN116522846B_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of integrated circuit design technology, and in particular to a method, apparatus, device and storage medium for packaging a circuit module. Background Technology
[0002] Integrated circuits are a crucial area for industrial development. However, integrated circuit design is costly and time-consuming. Developing a single chip often requires hundreds of specialized integrated circuit engineers and takes a year or even longer. This is because the current integrated circuit design process is lengthy. For example, for digital integrated circuits, it involves Register Transfer Level (RTL) design, RTL synthesis, placement and clock tree synthesis, and routing. Each stage requires specialized engineers. The situation is similar for analog circuits. Furthermore, considering that a System-on-Chip (SOC) includes both digital and analog circuits, the combination of the two requires additional verification work. Therefore, integrated circuit companies generally need a large number of specialized engineers.
[0003] This places extremely high demands on the number and expertise of R&D personnel in integrated circuit design. Therefore, improving the automation level of integrated circuit design to increase circuit design efficiency is a pressing issue that needs to be addressed. Summary of the Invention
[0004] This disclosure aims to at least partially address one of the technical problems in the related art.
[0005] The first aspect of this disclosure provides a method for packaging a circuit module, comprising:
[0006] Obtain the first identifier corresponding to the circuit module to be packaged, the target parameters contained in the circuit module, the sub-circuit modules and their corresponding second identifiers, and the signal flow direction corresponding to the circuit module:
[0007] Based on the signal flow direction, the target parameters of the circuit module and the second identifier are processed to obtain the topology connection method corresponding to the circuit module.
[0008] Determine the external port corresponding to the circuit module;
[0009] The circuit module is encapsulated based on the first identifier, the target parameters, the topology connection method, and the external port.
[0010] A second aspect of this disclosure provides a packaging device for a circuit module, comprising:
[0011] The first acquisition module is used to acquire a first identifier corresponding to the circuit module to be packaged, target parameters contained in the circuit module, sub-circuit modules and their corresponding second identifiers, and the signal flow direction corresponding to the circuit module.
[0012] The second acquisition module is used to process the target parameters of the circuit module and the second identifier based on the signal flow direction to obtain the topology connection method corresponding to the circuit module.
[0013] A determination module is used to determine the external ports corresponding to the circuit module;
[0014] The encapsulation module is used to encapsulate the circuit module based on the first identifier, the target parameters, the topology connection method, and the external port.
[0015] A third aspect of this disclosure provides an electronic device, including: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the program, it implements a packaging method for a circuit module as proposed in a first aspect of this disclosure.
[0016] A fourth aspect of this disclosure provides a non-transitory computer-readable storage medium storing a computer program that, when executed by a processor, implements a method for packaging circuit modules as described in a first aspect of this disclosure.
[0017] A fifth aspect of this disclosure provides a computer program product including a computer program that, when executed by a processor, implements a method for packaging circuit modules as described in a first aspect of this disclosure.
[0018] The packaging method, apparatus, device, and storage medium for the circuit module disclosed herein have the following beneficial effects:
[0019] In this embodiment, the first identifier corresponding to the circuit module to be packaged, the target parameters contained in the circuit module, the sub-circuit modules and their corresponding second identifiers, and the signal flow direction of the circuit module can be obtained first. Then, based on the signal flow direction, the target parameters and second identifier of the circuit module are processed to obtain the topology connection method corresponding to the circuit module and determine the external port corresponding to the circuit module. Finally, the circuit module is packaged based on the first identifier, target parameters, topology connection method, and external port. Thus, by packaging the circuit module based on its target parameters, topology connection method, and external port, it is easier to instantiate the circuit module, improving its reusability, thereby providing conditions for improving the design efficiency of analog circuits and saving manpower costs.
[0020] Additional aspects and advantages of this disclosure will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this disclosure. Attached Figure Description
[0021] The above and / or additional aspects and advantages of this disclosure will become apparent and readily understood from the following description of the embodiments taken in conjunction with the accompanying drawings, in which:
[0022] Figure 1 A schematic flowchart illustrating a method for packaging a circuit module according to an embodiment of this disclosure;
[0023] Figure 2 A schematic flowchart illustrating a method for packaging a circuit module according to an embodiment of this disclosure;
[0024] Figure 3 A structural block diagram of a packaging device for a circuit module provided in an embodiment of this disclosure;
[0025] Figure 4 A block diagram of an exemplary electronic device suitable for implementing embodiments of the present disclosure is shown. Detailed Implementation
[0026] Embodiments of this disclosure are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this disclosure, and should not be construed as limiting this disclosure.
[0027] The foundation for agile development of analog and mixed-signal circuits lies in the limited types of analog circuits, with similar or even identical structures within the same type. The differences lie in parameters such as target process node, performance requirements, power consumption requirements, and area requirements in specific applications. Traditional circuit design often requires a repetitive design process involving schematic design, simulation verification, layout, parasitic parameter extraction, and post-simulation, resulting in low automation and poor reusability.
[0028] The following description, with reference to the accompanying drawings, describes a method, apparatus, electronic device, and storage medium for packaging circuit modules according to embodiments of the present disclosure.
[0029] It should be noted that the main body executing the circuit module packaging method in the embodiments of this disclosure is the circuit module packaging device, which can be implemented by software and / or hardware, and can be configured in any electronic device. In the scenario proposed in this disclosure, the "circuit module packaging device" will be used as the main body to describe the circuit module packaging method proposed in the embodiments of this disclosure, and no limitation is made here.
[0030] Figure 1 This is a schematic flowchart illustrating the packaging method for a circuit module provided in an embodiment of this disclosure.
[0031] like Figure 1 As shown, the packaging method for this circuit module may include the following steps:
[0032] Step 101: Obtain the first identifier corresponding to the circuit module to be packaged, the target parameters contained in the circuit module, the sub-circuit modules and their corresponding second identifiers, and the signal flow direction corresponding to the circuit module.
[0033] In this context, a circuit module can be understood as a component. For example, a latch is a circuit module. A circuit module can be composed of multiple sub-circuit modules, similar to a tree in data structures. The most basic components (such as transistors, resistors, capacitors, voltage sources, etc.) form the basic rectangles, similar to leaf nodes in a tree, which are represented as rectangles (i.e., a component) in the layout. A circuit module can be understood as consisting of multiple sub-circuit modules and several basic rectangles.
[0034] For example, the circuit module to be packaged can be a differential pair, a guard ring, a current mirror, etc. This disclosure does not specifically limit it in this regard.
[0035] The first identifier of the circuit module can be the name of the circuit module, etc. For example, if the circuit module is a latch, the corresponding first identifier can be "Latch". This disclosure does not limit this.
[0036] Optionally, the target parameter may include at least one of the following:
[0037] Input nodes, output nodes, control nodes, power nodes, and attribute parameters.
[0038] It should be noted that this disclosure follows the concept of a signal flow system, which allows for the definition of input and output nodes corresponding to circuit modules.
[0039] The power supply nodes may include VDD nodes and VSS nodes. Simple circuit modules typically have only one VDD node and one VDD node, while complex circuits may have multiple VDD nodes and multiple VDD nodes. This disclosure does not limit this.
[0040] The attribute parameters can be used to describe the properties of the circuit module. Attribute parameters may include the length, width, and dimensions of the circuit module. This disclosure does not limit this.
[0041] Input nodes, output nodes, control nodes, and power nodes can all be represented using arrays, such as node:Input(8), which indicates that there are 8 input nodes. The same applies to control nodes and output nodes. This disclosure does not impose any specific limitations on this.
[0042] It should be noted that users can customize the attribute parameters; different customized attribute information results in different circuit modules. Therefore, by adjusting the attribute parameters, circuit modules with different parameters can be generated to adapt to different application requirements.
[0043] It should be noted that, since this disclosure follows the concept of a signal flow system, it is also necessary to obtain the signal flow direction inside the circuit module, that is, the direction of signal transmission in the circuit module.
[0044] Step 102: Based on the signal flow direction, process the target parameters and second identifier of the circuit module to obtain the topology connection method corresponding to the circuit module.
[0045] Among them, the topology connection method can represent the connection between each node and each sub-circuit module in the circuit module.
[0046] Specifically, based on the signal flow direction, the target parameters and second identifier of the circuit module can be processed to connect each node in the circuit module with the second identifier corresponding to the sub-circuit module, so as to obtain the topology connection method corresponding to the circuit module.
[0047] In this embodiment of the disclosure, after the topology connection method is determined, it can be connected to the inside of the circuit module in the form of input nodes, output nodes, control nodes, and power nodes, so that users do not need to have much understanding of the internal structure of the circuit module to use it, thus achieving the effect of encapsulation.
[0048] Step 103: Determine the external ports corresponding to the circuit module.
[0049] In this embodiment of the disclosure, it is also necessary to determine the external port corresponding to the circuit module, which can be used to connect the circuit module to other modules.
[0050] Optionally, the target node specified by the user can be obtained first, and the rectangular module (i.e., component) corresponding to the target node can be identified as the external port. The target node can be an input node, an output node, a control node, etc. This disclosure does not limit this.
[0051] For example, if the specified target node is input node a, and r1 and r2 are rectangular modules of input node a, then r1 and r2 can be identified as the external ports corresponding to the circuit modules. Other circuit modules can be connected to r1 and r2.
[0052] Optionally, if the user-specified external node is not found, the external ports corresponding to the circuit module can be automatically completed. Specifically, the components (and rectangular modules) connected to each node can be determined first; then, the external ports can be determined according to the priority and level of the components.
[0053] Therefore, by encapsulating circuit modules through ports, users can quickly create devices based on the modules without needing to know the internal details of the circuit modules.
[0054] Step 104: Based on the first identifier, target parameters, topology connection method, and external ports, encapsulate the circuit module.
[0055] Figure 2 This is a schematic flowchart illustrating another packaging method for a circuit module provided in an embodiment of this disclosure, as shown below. Figure 2 As shown, the encapsulation of the circuit module based on the first identifier, target parameters, topology connection method, and external ports may include the following specific steps:
[0056] Step 201: Based on the decorator, process the first identifier and target parameters to generate the definition function corresponding to the circuit module.
[0057] The decorator can be the @module decorator, and there is no restriction on it here.
[0058] Step 202: Based on the preset connectors, process the topology connection method to generate the corresponding topology function of the circuit module.
[0059] Specifically, topological connection methods can be represented as functions based on connectors.
[0060] Optionally, the connector may include at least one of the following:
[0061] The first connector is used to connect the second identifier and the control node;
[0062] The second connector is used to connect an input node to a second identifier, or to connect an output node to a second identifier, or to connect a power node to a second identifier, or to connect nodes to nodes.
[0063] The first connector and the second connector are different; for example, the first connector can be "%" and the second connector can be ">>". This disclosure does not impose specific limitations on this.
[0064] Step 203: Based on the defined functions, topology functions, and external ports, encapsulate the circuit module.
[0065] In this embodiment of the disclosure, after encapsulating the circuit module, different instances can be generated by changing the corresponding attribute parameters of the circuit module. Each instance is an independent device with its own state and behavior. This achieves instance creation through parameterization, improving the reusability of circuit modules and thus enhancing the design efficiency of integrated circuits.
[0066] In this embodiment, the first identifier corresponding to the circuit module to be packaged, the target parameters contained in the circuit module, the sub-circuit modules and their corresponding second identifiers, and the signal flow direction of the circuit module can be obtained first. Then, based on the signal flow direction, the target parameters and second identifier of the circuit module are processed to obtain the topology connection method corresponding to the circuit module and determine the external port corresponding to the circuit module. Finally, the circuit module is packaged based on the first identifier, target parameters, topology connection method, and external port. Thus, by packaging the circuit module based on its target parameters, topology connection method, and external port, it is easier to instantiate the circuit module, improving its reusability, thereby providing conditions for improving the design efficiency of analog circuits and saving manpower costs.
[0067] To implement the above embodiments, this disclosure also proposes a packaging device for a circuit module.
[0068] Figure 3 This is a structural block diagram of a circuit module packaging device provided in an embodiment of the present disclosure.
[0069] like Figure 3 As shown, the packaging device 300 of the circuit module may include:
[0070] The first acquisition module 310 is used to acquire the first identifier corresponding to the circuit module to be packaged, the target parameters contained in the circuit module, the sub-circuit module and its corresponding second identifier, and the signal flow direction corresponding to the circuit module.
[0071] The second acquisition module 320 is used to process the target parameters and the second identifier of the circuit module based on the signal flow direction in order to obtain the topology connection method corresponding to the circuit module.
[0072] Module 330 is used to determine the external ports corresponding to the circuit modules;
[0073] The encapsulation module 340 is used to encapsulate the circuit module based on the first identifier, target parameters, topology connection method, and external ports.
[0074] In some embodiments, the target parameter includes at least one of the following:
[0075] Input nodes, output nodes, control nodes, power nodes, and attribute parameters.
[0076] In some embodiments, the determining module 330 is configured to:
[0077] Identify the components that connect to each node;
[0078] Determine the external ports based on the priority and level of the components.
[0079] In some embodiments, the encapsulation module 340 is used for:
[0080] Based on the decorator, the first identifier and target parameters are processed to generate the definition function corresponding to the circuit module;
[0081] Based on preset connectors, the topology connection method is processed to generate the corresponding topology function of the circuit module;
[0082] The circuit module is encapsulated based on the defined functions, topology functions, and external ports.
[0083] In some embodiments, the connector includes at least one of the following:
[0084] The first connector is used to connect the second identifier and the control node;
[0085] The second connector is used to connect an input node to a second identifier, or to connect an output node to a second identifier, or to connect a power node to a second identifier, or to connect nodes to nodes.
[0086] In this embodiment, the first identifier corresponding to the circuit module to be packaged, the target parameters contained in the circuit module, the sub-circuit modules and their corresponding second identifiers, and the signal flow direction of the circuit module can be obtained first. Then, based on the signal flow direction, the target parameters and second identifier of the circuit module are processed to obtain the topology connection method corresponding to the circuit module and determine the external port corresponding to the circuit module. Finally, the circuit module is packaged based on the first identifier, target parameters, topology connection method, and external port. Thus, by packaging the circuit module based on its target parameters, topology connection method, and external port, it is easier to instantiate the circuit module, improving its reusability, thereby providing conditions for improving the design efficiency of analog circuits and saving manpower costs.
[0087] To implement the above embodiments, this disclosure also proposes an electronic device, including: a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the program, it implements the packaging method of the circuit module as proposed in the foregoing embodiments of this disclosure.
[0088] To implement the above embodiments, this disclosure also proposes a non-transitory computer-readable storage medium storing a computer program, which, when executed by a processor, implements the packaging method for the circuit module as proposed in the foregoing embodiments of this disclosure.
[0089] To implement the above embodiments, this disclosure also proposes a computer program product that, when executed by an instruction processor, performs the encapsulation method for the circuit module as described in the foregoing embodiments of this disclosure.
[0090] Figure 4 A block diagram of an exemplary electronic device suitable for implementing embodiments of the present disclosure is shown. Figure 4 The electronic device 12 shown is merely an example and should not impose any limitation on the functionality and scope of use of the embodiments disclosed herein.
[0091] like Figure 4 As shown, the electronic device 12 is represented in the form of a general-purpose computing device. The components of the electronic device 12 may include, but are not limited to: one or more processors or processing units 16, system memory 28, and bus 18 connecting different system components (including system memory 28 and processing unit 16).
[0092] Bus 18 represents one or more of several bus architectures, including a memory bus or memory controller, a peripheral bus, a graphics acceleration port, a processor, or a local bus using any of the various bus architectures. Examples of these architectures include, but are not limited to, the Industry Standard Architecture (ISA) bus, the Micro Channel Architecture (MAC) bus, the Enhanced ISA bus, the Video Electronics Standards Association (VESA) local bus, and the Peripheral Component Interconnect (PCI) bus.
[0093] Electronic device 12 typically includes a variety of computer system readable media. These media can be any available media that can be accessed by electronic device 12, including volatile and non-volatile media, removable and non-removable media.
[0094] Memory 28 may include computer system readable media in the form of volatile memory, such as Random Access Memory (RAM) 30 and / or cache memory 32. Electronic device 12 may further include other removable / non-removable, volatile / non-volatile computer system storage media. By way of example only, storage system 34 may be used to read and write non-removable, non-volatile magnetic media (… Figure 4 Not shown; usually referred to as a "hard drive"). Although Figure 4 Not shown, a disk drive for reading and writing to a removable non-volatile disk (e.g., a "floppy disk") and an optical disc drive for reading and writing to a removable non-volatile optical disc (e.g., a compact disc read-only memory (CD-ROM), a digital video disc read-only memory (DVD-ROM), or other optical media) may be provided. In these cases, each drive may be connected to bus 18 via one or more data media interfaces. Memory 28 may include at least one program product having a set (e.g., at least one) of program modules configured to perform the functions of the embodiments of this disclosure.
[0095] A program / utility 40 having a set (at least one) of program modules 42 may be stored, for example, in memory 28. Such program modules 42 include, but are not limited to, an operating system, one or more application programs, other program modules, and program data. Each or some combination of these examples may include an implementation of a network environment. Program modules 42 typically perform the functions and / or methods described in the embodiments of this disclosure.
[0096] Electronic device 12 can also communicate with one or more external devices 14 (e.g., keyboard, pointing device, display 24, etc.), and with one or more devices that enable a user to interact with electronic device 12, and / or with any device that enables electronic device 12 to communicate with one or more other computing devices (e.g., network card, modem, etc.). This communication can be performed via input / output (I / O) interface 22. Furthermore, electronic device 12 can also communicate with one or more networks (e.g., local area network (LAN), wide area network (WAN), and / or public networks, such as the Internet) via network adapter 20. As shown, network adapter 20 communicates with other modules of electronic device 12 via bus 18. It should be understood that, although not shown in the figure, other hardware and / or software modules can be used in conjunction with electronic device 12, including but not limited to: microcode, device drivers, redundant processing units, external disk drive arrays, RAID systems, tape drives, and data backup storage systems.
[0097] The processing unit 16 executes various functional applications and data processing by running programs stored in the system memory 28, such as implementing the methods mentioned in the foregoing embodiments.
[0098] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this disclosure. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0099] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this disclosure, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0100] Any process or method description in the flowchart or otherwise herein can be understood as representing a module, segment, or portion of code comprising one or more executable instructions for implementing custom logic functions or processes, and the scope of preferred embodiments of this disclosure includes additional implementations in which functions may be performed not in the order shown or discussed, including substantially simultaneously or in reverse order depending on the functions involved, as will be understood by those skilled in the art to which embodiments of this disclosure pertain.
[0101] The logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as a sequenced list of executable instructions for implementing logical functions, and can be embodied in any computer-readable medium for use by, or in conjunction with, an instruction execution system, apparatus, or device (such as a computer-based system, a processor-included system, or other system that can fetch and execute instructions from, an instruction execution system, apparatus, or device). For the purposes of this specification, "computer-readable medium" can be any means that can contain, store, communicate, propagate, or transmit programs for use by, or in conjunction with, an instruction execution system, apparatus, or device. More specific examples (a non-exhaustive list) of computer-readable media include: an electrical connection having one or more wires (electronic device), a portable computer disk drive (magnetic device), random access memory (RAM), read-only memory (ROM), erasable and editable read-only memory (EPROM or flash memory), fiber optic devices, and portable optical disc read-only memory (CDROM). Alternatively, the computer-readable medium may be paper or other suitable media on which the program can be printed, since the program can be obtained electronically, for example, by optically scanning the paper or other medium, followed by editing, interpreting, or otherwise processing as necessary, and then stored in a computer memory.
[0102] It should be understood that various parts of this disclosure can be implemented using hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented using software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware as in another embodiment, it can be implemented using any one or a combination of the following techniques known in the art: discrete logic circuits having logic gates for implementing logical functions on data signals, application-specific integrated circuits (ASICs) having suitable combinational logic gates, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), etc.
[0103] Those skilled in the art will understand that all or part of the steps of the methods in the above embodiments can be implemented by a program instructing related hardware. The program can be stored in a computer-readable storage medium, and when executed, the program includes one or a combination of the steps of the method embodiments.
[0104] Furthermore, the functional units in the various embodiments of this disclosure can be integrated into a processing module, or each unit can exist physically separately, or two or more units can be integrated into a module. The integrated module can be implemented in hardware or as a software functional module. If the integrated module is implemented as a software functional module and sold or used as an independent product, it can also be stored in a computer-readable storage medium.
[0105] The storage medium mentioned above can be a read-only memory, a disk, or an optical disk, etc. Although embodiments of the present disclosure have been shown and described above, it is to be understood that the above embodiments are exemplary and should not be construed as limiting the present disclosure. Those skilled in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present disclosure.
Claims
1. A method for packaging a circuit module, characterized in that, include: Obtain the first identifier corresponding to the circuit module to be packaged, the target parameters contained in the circuit module, the sub-circuit modules and their corresponding second identifiers, and the signal flow direction corresponding to the circuit module; Based on the signal flow direction, the target parameters of the circuit module and the second identifier are processed to obtain the topology connection method corresponding to the circuit module. Determine the external port corresponding to the circuit module; The circuit module is encapsulated based on the first identifier, the target parameters, the topology connection method, and the external port.
2. The method according to claim 1, characterized in that, The target parameter includes at least one of the following: Input nodes, output nodes, control nodes, power nodes, and attribute parameters.
3. The method according to claim 2, characterized in that, Determining the external port corresponding to the circuit module includes: Identify the components that connect to each node; The external port is determined based on the priority and level of the component.
4. The method according to claim 3, characterized in that, The encapsulation of the circuit module based on the first identifier, the target parameters, the topology connection method, and the external port includes: Based on the decorator, the first identifier and the target parameters are processed to generate the definition function corresponding to the circuit module; Based on preset connectors, the topology connection method is processed to generate the corresponding topology function of the circuit module; The circuit module is encapsulated based on the defined function, the topology function, and the external port.
5. The method according to claim 4, characterized in that, The connector includes at least one of the following: A first connector is used to connect the second identifier and the control node; The second connector is used to connect the input node to the second identifier, or to connect the output node to the second identifier, or to connect the power node to the second identifier, or to connect nodes to nodes.
6. A packaging device for a circuit module, characterized in that, include: The first acquisition module is used to acquire the first identifier corresponding to the circuit module to be packaged, the target parameters contained in the circuit module, the sub-circuit module and its corresponding second identifier, and the signal flow direction corresponding to the circuit module; The second acquisition module is used to process the target parameters of the circuit module and the second identifier based on the signal flow direction to obtain the topology connection method corresponding to the circuit module. A determination module is used to determine the external ports corresponding to the circuit module; The encapsulation module is used to encapsulate the circuit module based on the first identifier, the target parameters, the topology connection method, and the external port.
7. The apparatus according to claim 6, characterized in that, The target parameter includes at least one of the following: Input nodes, output nodes, control nodes, power nodes, and attribute parameters.
8. An electronic device, characterized in that, It includes a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the program, it implements the packaging method of the circuit module as described in any one of claims 1-5.
9. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is executed by the processor, it implements the encapsulation method of the circuit module as described in any one of claims 1-5.
10. A computer program product, characterized in that, It includes a computer program that, when executed by a processor, implements the packaging method of the circuit module as described in any one of claims 1-5.