Cooling body arrangement and power converter arrangement

Abstract

The invention relates to a cooling body arrangement (KKA) for a plurality of semiconductor components (T1,..., T6), comprising a first cooling body (1) and a second cooling body (2), each having a component side (BS1, BS2) and a cooling fin side (KR1, KR2) with cooling fins (F), which are arranged successively such that a cooling medium (11) flows in a flow direction (10) first through cooling channels (K1i) formed by the cooling fins (F) of the first cooling body (1) and then through cooling channels (K2i) formed by the cooling fins (F) of the second cooling body (2), wherein a first inlet cross section (Q1), which consists of individual cross sections (EQK1i) of the assigned cooling channels (K1i) of the first cooling body (1) on an inlet side (E1) of the first cooling body (1), is reduced with respect to a second inlet cross section (Q2) by means of a partition, which at least partially covers the cooling channels (K1i) on the inlet side (E1) of the first cooling body (1), which second inlet cross section consists of individual cross sections (EQK2i) of the assigned cooling channels (K2i) of the second cooling body (2) on an inlet side (E2) of the second cooling body (2).

Description

Technical Field

[0001] The present invention relates to a cooling body device for multiple semiconductor components. The cooling body device includes a first cooling body and a second cooling body, each having a component side and a cooling rib side equipped with cooling ribs. They are arranged continuously such that the cooling medium first flows through the cooling channel formed by the cooling ribs of the first cooling body in the flow direction, and then flows through the cooling channel formed by the cooling ribs of the second cooling body.

[0002] It is also possible to conceive of a cooling device having two or more cooling bodies arranged in a continuous manner.

[0003] Furthermore, the present invention relates to a power converter device for supplying power to an electric motor, the power converter device including the cooling body device mentioned at the beginning. Background Technology

[0004] In practice, cooling bodies are known and commonly used to cool semiconductor components. An apparatus for convection cooling of a component is known from EP 0 340 520B1, which has a cooling body consisting of two overlapping portions.

[0005] For manufacturing reasons and due to simpler structural design and / or space-saving arrangements, such as in power converter devices, particularly converters, the semiconductor components required to control the motor are typically arranged on a common cooling body for heat dissipation. These semiconductor components are placed sequentially relative to the direction of the cooling medium flow, thereby creating thermal series connection. This thermal series connection results in poorer cooling performance the farther the respective semiconductor component to be cooled is from the inlet of the cooling medium. Summary of the Invention

[0006] The object of the present invention is to provide an apparatus for cooling semiconductor components, wherein the cooling medium has a sufficient temperature even for components located far from the inlet, so as to provide sufficient cooling capacity for components far from the inlet.

[0007] The aforementioned objective is achieved by reducing the first inlet cross-section relative to the second inlet cross-section using a separator. The first inlet cross-section is located on the inlet side of the first cooling body and consists of a single cross-section of the cooling channel associated with the first cooling body. The separator at least partially covers the cooling channel on the inlet side of the first cooling body. The second inlet cross-section is located on the inlet side of the second cooling body and consists of a single cross-section of the cooling channel associated with the second cooling body.

[0008] Due to compatibility issues, such as in existing converters with limited client interfaces, parallel connection of two cooling bodies is not possible; therefore, the two cooling bodies are connected in series. The first cooling body can be referred to as the thermally cooler cooling body, and the second cooling body can be referred to as the thermally hotter cooling body.

[0009] According to the invention, partial thermal decoupling of the individual intermediate cooling space is used in the cooler cooling body, which reduces its overall cooling capacity. With the same volumetric flow rate, for example, resulting from a fan with forced convection, the pressure in the fan's storage space increases, and the volumetric flow rate in the remaining "open" cooling channels increases. The cooling medium flowing out of the cooler cooling body is now colder than in a conventional series connection in the first cooling body without separators. Therefore, the static temperature of the first cooling body increases. This corresponds to a "deterioration" in heat dissipation of the cooling body equipped with, for example, plastic combs. The plastic does not necessarily have to completely seal the cooling fins; partial breakage and holes in the combs are also conceivable.

[0010] For example, it is conceivable to partially divide the cooling channel into segments via inserts that extend in a tapered shape along the entire length of the rib.

[0011] This measure can be used to influence multiple active cooling fins involved in cooling.

[0012] A particularly advantageous improvement to the cooling body device proposes that an intermediate space be arranged between the first cooling body and the second cooling body, the intermediate space being covered by a cover, wherein the intermediate space and the cover form a vortex chamber.

[0013] The individual flows from the cooling channels of the first cooling body are now able to swirl in the intermediate space and form a new flow for the second cooling body, which flows into the normally fully open cooling channels. The covered intermediate space acts as a diffuser for the cooling medium. To ensure that the cooling medium flowing from the first cooling body is evenly supplied to the second cooling body connected in series across all the cooling fins or channels, a front chamber is required, which guarantees the swirling and uniform distribution of the cooling medium.

[0014] In another advantageous design, the separator is constructed as a comb for insertion into the inlet side of the first cooling body.

[0015] Vortex elements and / or guiding elements for improving vortices are arranged in the intermediate space.

[0016] A plastic component can be inserted between the two cooling bodies to cover the intermediate space. This intermediate space serves to evenly distribute the cooling medium to the other cooling channels of the second cooling body. In an advantageous design, the plastic component can be designed to have an internal structure that performs the necessary functions of optimal vortex and cooling medium deflection. The vortex element can be designed in the form of, for example, a deflector, an airfoil, or a similar spoiler.

[0017] The aforementioned objective is also achieved through a power converter device for supplying power to a motor. Here, the power converter device includes a cooling body device for multiple semiconductor components. This cooling body device includes a first cooling body and a second cooling body, each having a component side and a cooling fin side equipped with cooling fins. They are arranged continuously such that the cooling medium flows first through a cooling channel formed by the cooling fins of the first cooling body in the flow direction, and then through a cooling channel formed by the cooling fins of the second cooling body. Here, the first inlet cross-section is reduced relative to the second inlet cross-section by means of a separator located on the inlet side of the first cooling body. This first inlet cross-section is composed of a single cross-section of the cooling channel associated with the first cooling body. The separator at least partially covers the cooling channel on the inlet side of the first cooling body. The second inlet cross-section is located on the inlet side of the second cooling body and is composed of a single cross-section of the cooling channel associated with the second cooling body.

[0018] To further improve the heat dissipation of the device, an intermediate space is provided between the first cooling body and the second cooling body. This intermediate space is covered by a cover, and the intermediate space and the cover form a vortex chamber.

[0019] Specifically, regarding the converter for controlling the motor, the power converter device is configured to be vertically mounted in the switch cabinet, wherein the longitudinal axis of the cooling body device is arranged vertically such that the flow direction through the power converter device is parallel to the longitudinal axis, and the inlet for the cooling medium is arranged below the inlet side of the first cooling body and the outlet for the cooling medium is arranged above the outlet side opposite to the inlet side of the second cooling body.

[0020] Advantageously, for power converter devices with this structural design, an additional bypass is no longer required for the cooling system; such an additional bypass would only reduce the remaining usable equipment volume, which would otherwise be needed to accommodate electronic and mechanical components. Therefore, more space can now be provided for equipment components such as fuses and intermediate circuit capacitors.

[0021] The previously expensive bypass components are no longer needed, and the device structure of the power converter is simplified in terms of design and installation. Depending on the design of the separator or insert comb (the number of closed cooling channels) and the available storage space between the cooling elements, heat dissipation of two series-connected cooling elements can be optimized, ensuring that both cooling elements reach approximately the same temperature during operation. This results in an increased lifespan of the power converter, as without the aforementioned measures, the thermally hotter cooling element would determine the lifespan of the semiconductor components. Cost reduction is also conceivable due to the use of potentially smaller power semiconductors, as the semiconductor clips no longer need to be designed for the hotter cooling elements that would otherwise flow through the air ducts. Attached Figure Description

[0022] The accompanying drawings illustrate an embodiment, in which...

[0023] Figure 1 A cooling body device for cooling semiconductor components is shown.

[0024] Figure 2 Another perspective view of the cooling unit is shown, with a top view of the cooling fin side.

[0025] Figure 3 It shows Figure 2 The known cooling devices focus primarily on the intermediate space.

[0026] Figure 4 A covering for the intermediate space is shown.

[0027] Figure 5 Other 3D diagrams are shown. Figure 4 Covers,

[0028] Figure 6 A comb-like structure is shown as a separator.

[0029] Figure 7 A diagram showing the effective inlet cross-section is provided.

[0030] Figure 8 A diagram illustrating the vortex flow lines in the intermediate space is shown.

[0031] Figure 9 The power converter device in the switch cabinet is shown. Detailed Implementation

[0032] according to Figure 1A cooling body device KKA for multiple semiconductor components T1, ..., T6 is shown. The cooling body device KKA includes a first cooling body 1 and a second cooling body 2, each having component sides BS1 and BS2, on which semiconductor components T1, ..., T6 can be placed for cooling. Cooling fin sides KR1 and KR2, equipped with cooling fins F, are located opposite the component sides BS1 and BS2, respectively. The cooling fins F are continuously arranged such that the cooling medium 11, according to... Figure 2 The flow first passes through the cooling channel K1i formed by the cooling fins F of the first cooling body 1 in the flow direction 10, and then passes through the cooling channel K2i formed by the cooling fins F of the second cooling body 2.

[0033] Figure 2 The cooling body device KK1 is shown from the perspective of the cooling fins KR1 and KR2.

[0034] Cooling medium 11 can enter the cooling body device KKA at the first inlet side E1 and exit again via the outlet side A2 of the second cooling body 2. A cover 4 connects the two cooling bodies 1 and 2 to each other in terms of flow. A comb-like structure 6 reduces the cross-section of the first inlet side E1.

[0035] Figure 3 A first inlet cross-section Q1 is shown, which on the inlet side E1 of the first cooling body 1 is composed of a single cross-section EQK1i of the cooling channels K1i associated with the first cooling body. By means of a comb-like structure 6 that at least partially covers the cooling channels K1i on the inlet side E1 of the first cooling body 1, the first inlet cross-section Q1 is relative to the second inlet cross-section Q2 (see [link to diagram]). Figure 3 The second inlet cross section is reduced, and the second inlet cross section is formed on the inlet side E2 of the second cooling body 2 by the individual cross section EQK2i of the cooling channel K2i associated with the second cooling body 2.

[0036] according to Figure 3 The intermediate space 3 is arranged between the first cooling body 1 and the second cooling body 2. According to... Figure 2 The intermediate space 3 is covered by a covering 4. The intermediate space 3 and the covering 4 form a vortex chamber. The covered intermediate space 3 is used to evenly distribute the cooling medium 11 to all the cooling channels K2i of the second cooling body 2.

[0037] Figure 4 and Figure 5 The cover 4 is shown, wherein the cover 4 is provided with a first guide element 7 and a second guide element 8.

[0038] Figure 6 A comb-like separator 6 is shown. Each comb element is designed to fit precisely into the space between the two cooling fins F and thus separate the cooling channels.

[0039] Figure 7 The reduction in the first inlet cross-section Q1 relative to the second inlet cross-section Q2 is shown. Looking at the cooling fins F1, ..., F19 of the first cooling body 1, the corresponding cooling channels K11, K12, ..., K1... can also be seen. 17 K1 18 The cooling channels K1i are closed with even-number coefficients by means of the comb 6 inserted into them. Cooling channels K1i with odd-number coefficients remain open. For the first inlet cross-section Q1, the following formula is obtained.

[0040]

[0041] Furthermore, for the second inlet cross-section of the second cooling body 2 located thereafter, where no cooling channel K2i is closed, the following formula is obtained for the second inlet cross-section Q2.

[0042]

[0043] Figure 8 The diagram illustrates the vortex of the flow of cooling medium 11 into the intermediate space 3. Due to the comb 6 inserted on the inlet side E1 of the first cooling body 1, the cooling medium can only flow out from the cooling channels K1i with an odd coefficient. The resulting nine outflowing channels are then distributed on the cooling channels K2i of the second cooling body 2, where the cooling medium 11, which has not yet been fully heated in the first cooling body, then flows completely through the second cooling body.

[0044] according to Figure 9 The diagram illustrates a power converter device 20 for supplying power to a motor M in a switch cabinet 24. The longitudinal axis 21 of the power converter device 20, or its internally integrated cooling unit KKA, is arranged vertically, and therefore parallel to the longitudinal axis 21 via the flow direction 10 of the converter device 20. An inlet 22 for the cooling medium 11 is located below, and an outlet 23 for the cooling medium 11 is located above. In the power converter device 20, a first cooling unit 1 and another substantially identical cooling unit 2 are continuously arranged in the flow direction 10 for cooling components. The power converter device 20 can control the motor M via line L.

[0045] By using the cooling body device KKA according to the invention, wherein the inlet cross-section Q1 of the first cooling body 1 is reduced by a separator, this power converter device 20 can be advantageously designed to have a small structural size because heat can be effectively dissipated from the series-connected semiconductor components T1, ..., T6 using the cooling body device KKA according to the invention.

Claims

1. A cooling body device (KKA) for multiple semiconductor components (T1, ..., T6), the cooling body device comprising a first cooling body (1) and a second cooling body (2), the first cooling body and the second cooling body each having a component side (BS1, BS2) and a cooling rib side (KR1, KR2) equipped with cooling ribs (F), the first cooling body and the second cooling body being arranged continuously such that a cooling medium (11) first flows through a cooling channel (K1i) formed by the cooling ribs (F) of the first cooling body (1) in the flow direction (10), and then flows through a cooling channel (K2i) formed by the cooling ribs (F) of the second cooling body (2). Its features are, -By means of a separator that at least partially covers the cooling channel (K1i) on the inlet side (E1) of the first cooling body (1), the first inlet cross section (Q1) on the inlet side (E1) of the first cooling body (1), consisting of the individual cross sections (EQK1i) of the cooling channel (K1i) associated with the first cooling body (1), and -The second inlet cross-section (Q2) on the inlet side (E2) of the second cooling body (2), which is composed of the individual cross-section (EQK2i) of the cooling channel (K2i) associated with the second cooling body (2), is reduced compared to the previous one. An intermediate space (3) is provided between the first cooling body (1) and the second cooling body (2), and the intermediate space is covered by a cover (4), the cover (4) including a first guide element (7) and a second guide element (8) arranged in the intermediate space.

2. The cooling body device (KKA) according to claim 1, wherein, The intermediate space (3) and the cover (4) form a vortex chamber.

3. The cooling body device (KKA) according to claim 1 or 2, wherein, The separator is implemented as a comb (6) for insertion into the inlet side (E1) of the first cooling body (1).

4. The cooling body device (KKA) according to claim 2, wherein, Eddy current elements and / or guiding elements are arranged in the intermediate space (3).

5. A power converter device (20) for supplying power to a motor (M), the power converter device comprising a cooling body device (KKA) for a plurality of semiconductor components (T1, ..., T6), the cooling body device comprising a first cooling body (1) and a second cooling body (2), the first cooling body and the second cooling body each having a component side (BS1, BS2) and a cooling fin side (KR1, KR2) equipped with cooling fins (F), the first cooling body and the second cooling body being arranged continuously such that a cooling medium (11) first flows in the flow direction (10) through a cooling channel (K1i) formed by the cooling fins (F) of the first cooling body (1), and then flows through a cooling channel (K2i) formed by the cooling fins (F) of the second cooling body (2). Its features are, -By means of a separator that at least partially covers the cooling channel (K1i) on the inlet side (E1) of the first cooling body (1), the first inlet cross section (Q1) on the inlet side (E1) of the first cooling body (1), consisting of the individual cross sections (EQK1i) of the cooling channel (K1i) associated with the first cooling body (1), and -The second inlet cross-section (Q2) on the inlet side (E2) of the second cooling body (2), which is composed of the individual cross-section (EQK2i) of the cooling channel (K2i) associated with the second cooling body (2), is reduced compared to the previous one. An intermediate space (3) is provided between the first cooling body (1) and the second cooling body (2), and the intermediate space is covered by a cover (4), the cover (4) including a first guide element (7) and a second guide element (8) arranged in the intermediate space.

6. The power converter device (20) according to claim 5, wherein the intermediate space (3) and the cover (4) form a vortex chamber (5).

7. The power converter device (20) according to claim 5 or 6, wherein the power converter device is configured for vertical installation in a switch cabinet (24), wherein, The longitudinal axis (21) of the cooling body device (KKA) is arranged vertically, such that the flow direction (10) through the power converter device (20) is parallel to the longitudinal axis (21), and the inlet (22) for the cooling medium is arranged below the inlet side (E1) of the first cooling body (1), and the outlet (23) for the cooling medium (11) is arranged above the outlet side opposite to the inlet side (E2) of the second cooling body (2).

Images