Electroplating hanger automatic cleaning device

Abstract

The application relates to an automatic cleaning device for electroplating hangers, which comprises a rack, rotating shafts arranged on the rack, a plurality of rotating shafts, a transmission group and a support group, the rotating shafts of the transmission group are driven, and the rotating shafts of the support group form a polishing working area; a rotating wheel is sleeved on the rotating shafts, the rotating wheel is used for abutting against the inner side of the bending of a conductive sliding block, is used for driving the electroplating hanger to move forward in the transmission group, and is used for supporting the electroplating hanger in the support group; a polishing block is movably arranged on the rack, the polishing block is located in the polishing working area, and the polishing block is used for abutting against the inner side of the bending of the conductive sliding block; and a polishing driving assembly is arranged on the rack, the polishing driving assembly is connected with the polishing block, and is used for enabling the polishing block to abut against the conductive sliding block through relative movement. The application has the effects of realizing multi-frequency cleaning of the conductive sliding block and not needing to stop the machine.

Description

Technical Field

[0001] This application relates to the technical field of electroplating processing, and in particular to an automatic cleaning device for electroplating racks. Background Technology

[0002] Electroplating is the process of depositing a thin layer of another metal or alloy onto the surface of certain metals using electrolysis. It is a process that uses electrolysis to attach a metal film to the surface of metal or other material parts, thereby preventing metal oxidation, improving wear resistance, conductivity, reflectivity, corrosion resistance, and enhancing aesthetics. In the electroplating process of circuit boards, automatic circulating rack plating equipment is used to perform electroplating on multiple circuit boards.

[0003] In related technologies, when electroplating circuit boards, the circuit boards are first installed on an electroplating rack, and then the electroplating rack is placed on an anode guide rail. A conductive slider is connected to the electroplating rack to maintain electrical connection with the anode guide rail. Under the traction of the conveyor belt, the electroplating rack gradually moves forward, providing the time required for each circuit board to complete electroplating. After the circuit board is processed, it is removed from the electroplating rack, and the rack is circulated to the top of the electroplating equipment. Finally, the electroplating rack is returned to its starting point via a conveyor device at the top of the equipment, allowing new circuit boards to be reinstalled on it. Therefore, the electroplating rack moves in a circular cycle during operation, enabling efficient electroplating of multiple circuit boards.

[0004] Each electroplating rack is connected to two conductive sliders. The conductive sliders have an L-shaped cross-section perpendicular to the direction of movement of the electroplating rack, and the inner sides of the bends of the two conductive sliders face each other. The conveying device at the top of the plating equipment includes a rotating shaft, rollers, and a chain drive assembly. The rotating shaft is horizontally mounted at the top of the equipment, and multiple rotating shafts are evenly distributed along the direction of movement of the electroplating rack. Two rollers are spaced apart on each rotating shaft, and each roller is coaxially fixed on the rotating shaft. Each roller rolls against the inner side of the bend of the conductive slider to provide friction and power for the movement of the electroplating rack. The chain drive assembly is connected to multiple rotating shafts to drive them to rotate synchronously, thereby realizing the forward conveying of the electroplating rack at the top of the equipment.

[0005] Regarding the aforementioned technologies, there are drawbacks. During the electroplating process, the conductive slider is exposed to a strong acidic environment for a long time, which easily leads to the formation of copper rust. Copper rust forms a barrier between the conductive slider and the anode guide rail, reducing the conductivity of the conductive slider. Therefore, the conductive slider needs to be cleaned regularly. However, during cleaning, the plating equipment needs to be stopped first, and then the entire electroplating rack needs to be reversed before the conductive slider can be polished and cleaned. This results in both low production efficiency due to production stoppage and low electroplating quality due to infrequent cleaning. Summary of the Invention

[0006] In order to achieve frequent cleaning of conductive sliders without stopping the machine, this application provides an automatic cleaning device for electroplating racks.

[0007] The automatic cleaning device for electroplating racks provided in this application adopts the following technical solution:

[0008] An automatic cleaning device for electroplating racks, comprising:

[0009] frame;

[0010] A rotating shaft is mounted on the frame. Multiple rotating shafts are provided, and the multiple rotating shafts are divided into a transmission group and a support group. The rotating shafts in the transmission group are used to be driven, and a grinding working area is formed between the rotating shafts in the support group.

[0011] A rotating wheel, sleeved on the rotating shaft, is used to abut against the bent inner side of the conductive slider. In the transmission group, it is used to drive the electroplating rack forward. In the support group, it is used to support the electroplating rack.

[0012] A grinding block is movably mounted on the frame, the grinding block is located in the grinding work area, and the grinding block is used to abut against the bent inner side of the conductive slider;

[0013] A grinding drive assembly is mounted on the frame and is connected to the grinding block to allow the grinding block to move relative to and abut against the conductive slider.

[0014] By adopting the above technical solution, when the electroplating rack is circulated to the top of the equipment, it is first placed on the rotating shaft of the transmission group, and the rotating wheel abuts against the inner bent side of the conductive slider. Then, the rotating shaft of the transmission group moves to send the electroplating rack into the support group. As the electroplating rack is gradually pushed forward in the support group, the grinding drive component moves the grinding block to grind away the copper rust on the conductive slider by the relative movement and contact between the grinding block and the conductive slider, such as rolling or sliding. Finally, the electroplating rack leaves the support group so that it can be circulated back to the starting position where the workpiece is mounted on the electroplating rack. Compared with the method that requires stopping the machine and flipping the electroplating rack for cleaning, this design keeps the electroplating rack easy to remove from the conveyor device at the top of the equipment. On the one hand, it can clean the electroplating rack simultaneously during its circulating movement, so there is no need to stop the machine, which can reduce production costs. On the other hand, it can increase the cleaning frequency of the conductive slider, thereby reducing the maximum accumulation of copper rust and improving the electroplating quality.

[0015] Preferably, the grinding block is slidably disposed on the frame, and the grinding drive assembly is used to make the grinding block perform reciprocating linear motion.

[0016] By adopting the above technical solution, compared to a grinding block that is round and rotates, this design has two advantages. First, the grinding block performs grinding through linear motion, allowing it to make face contact with the conductive slider, thus improving grinding efficiency. Second, the grinding block can further perform grinding through reciprocating motion. After the grinding block completes one set of reciprocating motions, the displacement effect on the electroplating rack will disappear, thus not affecting the normal transport of the electroplating rack.

[0017] Preferably, the plurality of rotating shafts are further divided into an obstruction group, which enters the obstruction group after the electroplating hanger leaves the support group, and is used to apply an obstructing force to the electroplating hanger to prevent it from moving forward; there are two grinding work areas, and the grinding blocks in the two grinding work areas move closer to each other or further away from each other.

[0018] By adopting the above technical solution, on the one hand, when the two grinding blocks move closer to each other, the two electroplating racks in the support group will collide with each other, thus canceling out the force applied by the grinding blocks. When the two grinding blocks move away from each other, one electroplating rack will collide with the electroplating rack in the conveying group, so that the conveying force of the conveying group can cancel out the force applied by the grinding blocks. The other electroplating rack will collide with the electroplating rack in the obstruction group, so that the friction of the obstruction group can cancel out the force applied by the grinding blocks. This can further maintain the stability of the electroplating racks being conveyed at the top of the equipment, thereby maintaining the working stability of the circulating rack plating equipment. On the other hand, since there are two grinding work areas, each conductive slider will be ground twice by two grinding blocks. Therefore, the amount of copper rust removed by each grinding block will be reduced, thereby reducing the noise generated during the grinding process.

[0019] Preferably, the grinding drive assembly includes:

[0020] The drive shaft is rotatably mounted on the frame;

[0021] The active crankshaft is connected at one end to one end face of the drive shaft;

[0022] The driven rocker arm has one end hinged to the end of the driving crank arm away from the drive shaft, and the other end hinged to the grinding block. It is used to make the grinding block reciprocate linear motion when the drive shaft rotates.

[0023] A synchronous power source is mounted on the frame and connected to the drive shaft to simultaneously drive the grinding blocks in the two grinding work areas.

[0024] By adopting the above technical solution, on the one hand, the crank-slider mechanism formed by the drive shaft, the active crank, the driven rocker arm, and the grinding block can realize the reciprocating linear motion of the grinding block through the continuous unidirectional rotation of the drive shaft, thereby improving the smoothness of the reciprocating linear motion of the grinding block; on the other hand, the drive shaft can be rotated simultaneously by a synchronous power source to improve the coordination between the movements of the two grinding blocks, thereby further maintaining the transmission stability of the electroplating rack.

[0025] Preferably, the power source includes:

[0026] A drive motor is mounted on the frame;

[0027] The active worm gear is connected to the output shaft of the drive motor;

[0028] A driven worm gear is sleeved on the drive shaft, and the driven worm gear meshes with the driving worm.

[0029] By adopting the above technical solution, the drive motor, the active worm gear, and the driven worm wheel enable the drive shaft to rotate around its own axis. Furthermore, the meshing method between the active worm gear and the driven worm wheel reduces the relative error generated during the synchronous rotation of the two drive shafts, thereby improving the accuracy of the coordinated movement between the two grinding blocks. On the other hand, it allows for a more thorough application of torque to the grinding blocks, thus improving the smoothness of the grinding block's movement without increasing the power of the drive motor.

[0030] Preferably, an auxiliary posture-changing spring is connected between the two grinding blocks located on the same motion path in the two grinding work areas. The auxiliary posture-changing spring has two states: an elongated state and a compressed state. When the two grinding blocks are moving away from each other, the auxiliary posture-changing spring is in the elongated state, which provides an auxiliary force for the grinding blocks to switch from moving away from each other to moving closer to each other. When the two grinding blocks are moving closer to each other, the auxiliary posture-changing spring is in the compressed state, which provides an auxiliary force for the grinding blocks to switch from moving closer to moving away from each other.

[0031] By adopting the above technical solution, since the slider in the crank-slider mechanism is at the critical point of switching motion, which is exactly the dead point of the crank-slider mechanism, the auxiliary posture-changing spring can apply a pulling force to the two grinding blocks when they switch from moving away from each other to moving closer to each other, and apply a pushing force to the two grinding blocks when they switch from moving closer to each other to moving away from each other. Therefore, the movement switching of the grinding blocks can be made smoother, thereby further improving the synchronous coordination of the two grinding blocks moving in opposite directions, so as to further maintain the transmission stability of the electroplating rack.

[0032] Preferably, the frame is provided with mounting plates in the grinding work area, and each grinding block is fitted with two spaced mounting plates. A track block is provided on the side surface of the two mounting plates that are close to each other, and the length direction of the track block is parallel to the movement direction of the grinding block. The grinding block is provided with a connecting groove for the track block to pass through. There is a gap between the side wall of the connecting groove and the track block for the grinding block to move up or down. An elastic grinding pad is connected to the upper side of the grinding block. An adjusting telescopic cylinder is also provided between the two mounting plates. The piston rod of the adjusting telescopic cylinder is connected to an abutment roller. The abutment roller rolls against the lower side of the grinding block to move the piston rod of the adjusting telescopic cylinder upward on the grinding block.

[0033] By adopting the above technical solution, on the one hand, the deformation degree of the elastic grinding pad can be changed by adjusting the piston rod of the telescopic cylinder, thereby changing the frictional force applied by the grinding block to the conductive slider. When the thickness of the copper rust varies, the power level of the grinding block can be changed by primarily changing the reciprocating speed of the grinding block and secondarily by changing the frictional force between the grinding block and the conductive slider, thus allowing for more flexible adaptation to actual production conditions. On the other hand, when the copper rust thickness of the subsequent electroplating rack is significantly greater than that of the previous electroplating rack, the grinding block that cooperates with the subsequent electroplating rack will increase its reciprocating speed. At this time, the grinding block that cooperates with the previous electroplating rack can reduce the applied frictional force by adjusting the telescopic cylinder, thus preventing the conductive slider on the previous electroplating rack from being over-grinded. This allows the cleaning device to meet the application environment under different rust removal requirements, thereby helping to improve the overall performance of the cleaning device.

[0034] Preferably, the frame is further provided with a negative pressure chip removal component, which is connected to the mounting plate and is used to adsorb the waste chips that fall between the two mounting plates; an air jet connector is connected to the piston rod of the adjusting telescopic cylinder, and two air jet connectors are symmetrically arranged relative to the piston rod of the adjusting telescopic cylinder, which are used to blow air onto the area exposed by the conductive slider when the grinding block moves.

[0035] By adopting the above technical solution, on the one hand, the waste chips generated during the grinding process can be collected by the negative pressure chip removal component, and the small waste chips attached to the conductive slider can be removed by blowing air through the jet connector, thereby improving the cleaning efficiency of waste chips; on the other hand, due to the setting of the mounting plate, the area where the grinding block is located is in a semi-enclosed state compared to the directly exposed state. Therefore, under the action of the negative pressure chip removal component, the area where the grinding block is located will be in a negative pressure state, which can further reduce the transmission of noise, thereby reducing the noise of the production environment.

[0036] Preferably, the upper and lower sides of the track block are connected to stabilizing elastic pads, which abut against the sidewall of the connecting groove.

[0037] By adopting the above technical solution, compared with the method without a stable elastic pad, this design can keep the movement trajectory of the grinding block stable after the grinding block is moved up or down by adjusting the telescopic cylinder. This makes it less likely for the end of the grinding block to lift up along its own movement direction, thus fully maintaining the grinding efficiency.

[0038] In summary, this application includes at least one of the following beneficial technical effects:

[0039] 1. By configuring the frame, shaft, roller, grinding block, and grinding drive assembly, compared to the method that requires stopping the machine and flipping the electroplating rack for cleaning, this design allows the electroplating rack to be easily removed from the conveyor at the top of the equipment. On the one hand, it allows cleaning to be performed simultaneously as the electroplating rack circulates, thus eliminating the need to stop the machine and reducing production costs. On the other hand, it increases the cleaning frequency of the conductive slider, thereby reducing the maximum accumulation of copper rust and improving electroplating quality.

[0040] 2. On the one hand, the grinding block performs grinding through linear motion, so the grinding block and the conductive slider can make face contact, thereby improving grinding efficiency; on the other hand, the grinding block can also perform grinding through reciprocating motion. After the grinding block completes a set of reciprocating motions, the displacement effect on the electroplating rack will disappear, thus not affecting the normal transmission of the electroplating rack. Attached Figure Description

[0041] Figure 1 This is a schematic diagram of the structure of the automatic cleaning device for electroplating racks in the embodiments of this application.

[0042] Figure 2 This is a schematic diagram of the support group in an embodiment of this application.

[0043] Figure 3 This is a schematic diagram in the embodiments of this application to illustrate how the telescopic cylinder cooperates with the grinding block.

[0044] Explanation of reference numerals in the attached drawings: 1. Frame; 11. Electroplating hanger; 12. Conductive slider; 2. Rotary shaft; 21. Transmission group; 22. Support group; 221. Grinding working area; 23. Obstruction group; 3. Rotary wheel; 4. Grinding block; 41. Connecting through groove; 42. Elastic grinding pad; 5. Grinding drive assembly; 51. Drive shaft; 52. Active crank; 53. Driven rocker arm; 54. Drive motor; 55. Active worm gear; 56. Driven worm wheel; 6. Auxiliary posture changing spring; 7. Mounting plate; 71. Track block; 72. Adjustable telescopic cylinder; 73. Abutment roller; 8. Negative pressure chip removal assembly; 9. Air jet connector; 10. Stabilizing elastic pad. Detailed Implementation

[0045] The following is in conjunction with the appendix Figure 1-3 This application will be described in further detail.

[0046] This application discloses an automatic cleaning device for electroplating racks. (Refer to...) Figure 1 and Figure 2The automatic cleaning device for the electroplating rack 11 includes a frame 1, a rotating shaft 2, a rotating wheel 3, a polishing block 4, and a polishing drive assembly 5. The frame 1 is the frame structure on top of the plating equipment, serving as the base for fixing and installing other components. The rotating shaft 2 is horizontally arranged on the frame 1, and multiple rotating shafts 2 are distributed along an axis perpendicular to themselves. These multiple rotating shafts 2 are divided into a transmission group 21 and a support group 22. The rotating shafts 2 of the transmission group 21 are rotatably mounted on the frame 1 and are connected to an external drive source to be driven to rotate. The rotating shafts 2 of the support group 22 are rotatably mounted on the frame 1 and are not connected to an external drive source to rotate freely. In addition, there is a predetermined distance between adjacent rotating shafts 2 of the support group 22 to form a polishing working area 221.

[0047] Reference Figure 1 The rotating wheel 3 is coaxially mounted on the rotating shaft 2. Each rotating shaft 2 has two rotating wheels 3 mounted on it. Each rotating wheel 3 abuts against the inner side of the bend of a conductive slider 12 on an electroplating rack 11. In the transmission group 21, the rotating wheel 3 is solidly mounted on the rotating shaft 2 so that it can drive the electroplating rack 11 forward when the rotating shaft 2 rotates. In the support group 22, the rotating wheel 3 is rotatably mounted on the rotating shaft 2 so that the electroplating rack 11 on the transmission group 21 can smoothly push the electroplating rack 11 in the support group 22 forward during the forward movement, so as to realize one of the necessary links for the electroplating rack 11 to perform cyclic movement on the plating equipment.

[0048] Reference Figure 1 and Figure 2 The grinding block 4 is slidably mounted on the frame 1, and is located in the grinding work area 221. Each conductive slider 12 is paired with a grinding block 4, and the grinding block 4 abuts against the inner bent side of the conductive slider 12 to grind away the copper rust on the conductive slider 12. The grinding drive assembly 5 is mounted on the frame 1, and is also connected to the grinding block 4 to perform grinding through the reciprocating linear motion of the grinding block 4. In this way, after the grinding block 4 completes one reciprocating motion, the displacement effect of the grinding block 4 on the electroplating rack 11 will disappear, and thus will not affect the normal movement of the electroplating rack 11.

[0049] In other embodiments, the grinding block 4 may also be in the shape of a wheel and rotatably mounted on the frame 1, and the grinding drive assembly 5 may grind the copper rust by rotating the grinding block 4.

[0050] Reference Figure 1Compared to the method that requires stopping the machine and flipping the electroplating rack 11 over for cleaning, this design allows the electroplating rack 11 to be easily removed from the conveyor at the top of the equipment. On the one hand, it allows cleaning to be carried out simultaneously during the cyclical movement of the electroplating rack 11, so there is no need to stop the machine, which can reduce production costs. On the other hand, it can increase the cleaning frequency of the conductive slider 12, thereby reducing the maximum amount of copper rust accumulation and improving the electroplating quality.

[0051] Reference Figure 1 In order to further reduce the impact on the electroplating hanger 11 during the polishing process, the arrangement of the rotating shaft 2 on the frame 1 and the movement of the polishing block 4 are configured as follows: First, the multiple rotating shafts 2 are further divided into a barrier group 23. The rotating shafts 2 in the barrier group 23 are fixedly mounted on the frame 1, but the rotating wheel 3 is rotatably mounted on the rotating shaft 2. Therefore, the frictional resistance provided by the barrier group 23 is greater than the frictional resistance provided by the support group 22. In addition, the electroplating hanger 11 will enter the barrier group 23 after leaving the support group 22.

[0052] Reference Figure 1 and Figure 2 Secondly, there are two grinding work areas 221. The grinding blocks 4 in the two grinding work areas 221 will move closer to each other or further away from each other. When the two grinding blocks 4 move closer to each other, the two electroplating hangers 11 in the support group 22 will collide with each other and cancel out the force applied by the grinding blocks 4. When the two grinding blocks 4 move further away from each other, one electroplating hanger 11 will collide with the electroplating hanger 11 in the conveying group, so as to cancel out the force applied by the grinding blocks 4 through the conveying force of the conveying group. The other electroplating hanger 11 will collide with the electroplating hanger 11 in the obstruction group 23, so as to cancel out the force applied by the grinding blocks 4 through the friction of the obstruction group 23. This can further maintain the stability of the electroplating hanger 11 when it is conveyed on the top of the equipment.

[0053] Reference Figure 1 and Figure 2To minimize the impact on the electroplating rack 11 during the polishing process by ensuring smooth reciprocating motion of the polishing block 4, the polishing drive assembly 5 specifically includes a drive shaft 51, a drive crank 52, a driven rocker arm 53, and a synchronous power source. The drive shaft 51 is cylindrical and rotatably mounted on the frame 1. One end of the drive crank 52 is fixedly connected to one end face of the drive shaft 51. One end of the driven rocker arm 53 is connected to the end of the drive crank 52 away from the drive shaft 51. The first end is hinged to the second end, and the second end is hinged to the grinding block 4. When the drive shaft 51 rotates, the grinding block 4 is made to reciprocate linearly by the rocker arm 53, so as to improve the smoothness of the reciprocating motion of the grinding block 4. In addition, in this embodiment, a drive shaft 51, a drive crank 52 and a rocker arm 53 cooperate with a grinding block 4. At the same time, in order to realize that the grinding blocks 4 in the two grinding work areas 221 move in opposite directions, it is only necessary to change the starting posture of the drive crank 52 to start rotating.

[0054] Reference Figure 1 and Figure 2 The synchronous power source is mounted on the frame 1 and is used to drive the movement of two grinding blocks 4 on the same side. Specifically, the synchronous power source includes a drive motor 54, a driving worm gear 55, and a driven worm wheel 56. The drive motor 54 is fixedly mounted on the frame 1. The driving worm gear 55 is coaxially and fixedly connected to the output shaft of the drive motor 54. The driven worm wheel 56 is coaxially and fixedly sleeved on the drive shaft 51, and the driven worm wheel 56 meshes with the driving worm gear 55 to realize the rotation of the two drive shafts 51 through the drive motor 54. In addition, this method can improve the accuracy of the coordinated movement between the two grinding blocks 4 by means of the meshing between the driving worm gear 55 and the driven worm wheel 56, and can also fully add torque to the movement of the grinding blocks 4 without increasing the power of the drive motor 54.

[0055] Reference Figure 1 and Figure 2In this embodiment, the drive shaft 51, the active crank 52, the driven rocker arm 53, and the grinding block 4 form a complete crank-slider mechanism. When the grinding block 4 is at the critical point of switching motion, it is exactly the dead point of the crank-slider mechanism. Therefore, in order to better overcome the dead point, an auxiliary posture-changing spring 6 is connected between the two grinding blocks 4 on the same motion path. The two ends of the auxiliary posture-changing spring 6 are respectively connected to the two grinding blocks 4. At the same time, the auxiliary posture-changing spring 6 has an elongated state and a compressed state. In the elongated state, the auxiliary posture-changing spring 6 provides the grinding blocks 4 with an auxiliary force to switch from moving away from each other to moving closer to each other. In the compressed state, the auxiliary posture-changing spring 6 provides the grinding blocks 4 with an auxiliary force to switch from moving closer to each other to moving away from each other. Therefore, the motion switching of the grinding blocks 4 can be made smoother, thereby further improving the synchronous coordination of the two grinding blocks 4 moving in opposite directions.

[0056] Reference Figure 1 and Figure 3 In actual processing and production, the grinding efficiency is mainly determined by the reciprocating speed of the grinding block 4, and secondarily by the friction between the grinding block 4 and the conductive slider 12. When the copper rust on the next electroplating rack 11 is thick, the reciprocating speed of the grinding block 4 is usually increased. At the same time, in order to avoid excessive grinding of the conductive slider 12 on the previous electroplating rack 11, the following settings are made: First, the frame 1 is provided with a mounting plate 7 in the grinding work area 221. Each grinding block 4 is equipped with two spaced mounting plates 7. A track block 71 is integrally fixed on the side surface of the two mounting plates 7 that are close to each other. The length direction of the track block 71 is parallel to the movement direction of the grinding block 4. At the same time, a connecting groove 41 is opened on the side of the grinding block 4 for the track block 71 to pass through, so as to realize the sliding connection between the grinding block 4 and the frame 1. In addition, there is a gap between the side wall of the connecting groove 41 and the track block 71 that allows the grinding block 4 to move up or down.

[0057] Reference Figure 1 and Figure 3 Secondly, an elastic polishing pad 42 is fixedly connected to the upper surface of the polishing block 4. The material of the elastic polishing pad 42 is, but is not limited to, sponge or rubber. Thirdly, an adjusting telescopic cylinder 72 is also fixedly installed between the two mounting plates 7. The piston rod end of the adjusting telescopic cylinder 72 is connected to an abutting roller 73. The abutting roller 73 rolls and abuts against the lower side of the polishing block 4. When the piston rod of the adjusting telescopic cylinder 72 extends or retracts, the polishing block 4 can move up or down. Therefore, the friction force between the polishing block 4 and the conductive slider 12 can be changed by the degree of deformation of the elastic polishing pad 42. Thus, when the speed of the polishing block 4 is increased, the polishing power can be weakened by reducing the friction force, so as to achieve the purpose of balancing the conductive slider 12 with less copper rust and preventing it from being over-processed.

[0058] Reference Figure 1 and Figure 3 Because of the mounting plate 7, the grinding block 4 can be connected to a rod-shaped or block-shaped structure that passes through the mounting plate 7 to connect with the driven rocker arm 53. At the same time, there can also be a sliding connection between the rod-shaped or block-shaped structure and the grinding block 4 to balance the upward or downward movement of the grinding block 4, thereby maintaining the stability of the grinding block 4 in reciprocating linear motion. In addition, in this embodiment, the upper and lower sides of the track block 71 are also connected with a stabilizing elastic pad 10 made of rubber material. The stabilizing elastic pad 10 abuts against the connecting through groove 41 to maintain the stability of the grinding block 4 in reciprocating linear motion during the upward or downward movement of the grinding block 4.

[0059] Reference Figure 1 and Figure 3 Because the grinding block 4 generates waste chips during the rust removal process, the following settings are implemented to clean up the waste chips in a timely manner: First, a negative pressure chip removal component 8 is also provided on the frame 1. The negative pressure chip removal component 8 includes, but is not limited to, an air pipe and an air pump. The air pipe is connected to the mounting plate 7 to suck up the waste chips by negative pressure. Second, an air jet connector 9 is connected to the piston rod of the telescopic cylinder 72. There are two air jet connectors 9 relative to the piston rod of the telescopic cylinder 72. During the movement of the grinding block 4, the area exposed by the conductive slider 12 will be blown off by the air jet connector 9, which will cause the small waste chips attached to the conductive slider 12 to fall off, thereby improving the cleaning efficiency of the waste chips.

[0060] In addition, in this embodiment, the negative pressure is used to remove chips while also reducing the noise generated during the polishing process.

[0061] The implementation principle of the automatic cleaning device for electroplating racks in this application embodiment is as follows: Compared with the method that requires stopping the machine and then flipping the electroplating rack 11 over for cleaning, this design, while keeping the electroplating rack 11 easy to remove from the conveyor at the top of the equipment, allows for simultaneous cleaning by having the grinding block 4 reciprocate linearly move via the grinding drive component 5 during the cyclical movement of the electroplating rack 11, thus eliminating the need to stop the machine and reducing production costs. On the other hand, it can increase the cleaning frequency of the conductive slider 12 to reduce the maximum accumulation of copper rust and improve electroplating quality.

[0062] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. An automatic cleaning device for electroplating racks, characterized in that: include: Rack (1); A rotating shaft (2) is provided on the frame (1). Multiple rotating shafts (2) are provided. The multiple rotating shafts (2) are divided into a transmission group (21) and a support group (22). The rotating shafts (2) of the transmission group (21) are used to be driven. A grinding working area (221) is formed between the rotating shafts (2) of the support group (22). A rotating wheel (3) is sleeved on the rotating shaft (2). The rotating wheel (3) is used to abut against the inner side of the bent conductive slider (12). In the transmission group (21), it is used to drive the electroplating rack (11) to move forward. In the support group (22), it is used to support the electroplating rack (11). A grinding block (4) is movably mounted on the frame (1). The grinding block (4) is located in the grinding work area (221). The grinding block (4) is used to abut against the inner side of the bent conductive slider (12). A grinding drive assembly (5) is mounted on the frame (1). The grinding drive assembly (5) is connected to the grinding block (4) and is used to make the grinding block (4) move relative to the conductive slider (12) and abut against it. The grinding block (4) is slidably disposed on the frame (1), and the grinding drive assembly (5) is used to make the grinding block (4) perform reciprocating linear motion; The multiple rotating shafts (2) are further divided into a blocking group (23), which enters the blocking group (23) after the electroplating hanger (11) leaves the support group (22) and is used to apply a force to the electroplating hanger (11) to resist its forward movement; there are two grinding work areas (221), and the grinding blocks (4) in the two grinding work areas (221) move closer to each other or further away from each other.

2. The automatic cleaning device for electroplating racks according to claim 1, characterized in that: The grinding drive assembly (5) includes: A drive shaft (51) is rotatably mounted on the frame (1); One end of the active crank (52) is connected to one end face of the drive shaft (51); The driven rocker arm (53) is hinged at one end to the end of the active crank arm (52) away from the drive shaft (51) and at the other end to the grinding block (4). It is used to make the grinding block (4) reciprocate linearly when the drive shaft (51) rotates. A synchronous power source is installed on the frame (1) and is connected to the drive shaft (51) to drive the grinding blocks (4) in the two grinding work areas (221) at the same time.

3. The automatic cleaning device for electroplating racks according to claim 2, characterized in that: The power source includes: A drive motor (54) is mounted on the frame (1); The active worm gear (55) is connected to the output shaft of the drive motor (54); A driven worm gear (56) is sleeved on the drive shaft (51), and the driven worm gear (56) meshes with the driving worm (55).

4. The automatic cleaning device for electroplating racks according to claim 3, characterized in that: An auxiliary posture-changing spring (6) is connected between two grinding blocks (4) located on the same motion path in the two grinding work areas (221). The posture of the auxiliary posture-changing spring (6) is divided into an elongated state and a compressed state. When the two grinding blocks (4) move away from each other, the auxiliary posture-changing spring (6) is in the elongated state, which is used to provide an auxiliary force for the grinding blocks (4) to switch from moving away from each other to moving closer to each other. When the two grinding blocks (4) move closer to each other, the auxiliary posture-changing spring (6) is in the compressed state, which is used to provide an auxiliary force for the grinding blocks (4) to switch from moving closer to each other to moving away from each other.

5. The automatic cleaning device for electroplating racks according to claim 2, characterized in that: The frame (1) is provided with mounting plates (7) in the grinding work area (221). Each grinding block (4) is fitted with two spaced mounting plates (7). A track block (71) is provided on the side surface of the two mounting plates (7) that are close to each other. The length direction of the track block (71) is parallel to the movement direction of the grinding block (4). The grinding block (4) is provided with a connecting slot (41). The connecting slot (41) is for the track block (71) to pass through. There is a gap between the side wall of 1) and the track block (71) for the grinding block (4) to move up or down. An elastic grinding pad (42) is connected to the upper side of the grinding block (4). An adjusting telescopic cylinder (72) is also provided between the two mounting plates (7). The piston rod of the adjusting telescopic cylinder (72) is connected to an abutting roller (73). The abutting roller (73) rolls against the lower side of the grinding block (4) to allow the piston rod of the adjusting telescopic cylinder (72) to move the grinding block (4) up.

6. The automatic cleaning device for electroplating racks according to claim 5, characterized in that: The frame (1) is also provided with a negative pressure chip removal assembly (8), which is connected to the mounting plate (7) and is used to adsorb the waste chips that fall between the two mounting plates (7); the piston rod of the adjusting telescopic cylinder (72) is connected with an air jet connector (9), and there are two air jet connectors (9) symmetrically arranged relative to the piston rod of the adjusting telescopic cylinder (72), which are used to blow air onto the area exposed by the conductive slider (12) when the grinding block (4) moves.

7. The automatic cleaning device for electroplating racks according to claim 5, characterized in that: The upper and lower sides of the track block (71) are connected to stabilizing elastic pads (10), and the stabilizing elastic pads (10) abut against the side wall of the connecting groove (41).

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