An integrated circuit package sheet marking machine feeding module

Abstract

The application discloses an integrated circuit package piece marking machine feeding module, which comprises a mounting seat, a first feeding plate and a second feeding plate are fixedly connected to the outer side wall of the mounting seat, respectively, a plurality of placing grooves are arranged on the first feeding plate and the second feeding plate, the plurality of placing grooves are arranged in an equidistant manner, a fixed plate is fixedly connected to one side wall of the first feeding plate, and two first driving motors are installed on the fixed plate. The clockwise forward rotation and the counterclockwise reverse rotation of the second driving motor can be controlled, the blocking effect of the guide groove on the first feeding plate and the threaded connection effect between the threaded rod and the mounting seat are matched, and the feeding of the integrated circuit package piece to the marking processing, the turning of the integrated circuit package piece for the marking processing of the other side and the feeding of the processed material back to the original position are respectively completed, so that the processed material can be taken out and placed into new integrated circuit package pieces.

Description

Technical Field

[0001] This invention relates to the field of marking technology for integrated circuit packages, and more particularly to a feeding module for an integrated circuit package marking machine. Background Technology

[0002] In the production and processing of integrated circuit (IC) packages, laser marking is required to facilitate identification and differentiation of different models and brands of IC packages for subsequent use. Existing IC package marking machines require marking on both sides of some IC packages. However, the current feeding method is generally manual, requiring marking one side of the IC package before flipping it over to mark the other side. This is a laborious and tedious process. Furthermore, during manual feeding, the pins of the IC package are easily damaged due to movement, flipping, or vibration during marking. Summary of the Invention

[0003] The purpose of this invention is to address the shortcomings of existing technologies, such as: when using existing integrated circuit package marking machines, some integrated circuit packages need to be marked on both sides, but the existing feeding method is generally manual feeding, which requires marking one side of the integrated circuit package first, then flipping it over and marking the other side. This is very laborious and cumbersome. In addition, during manual feeding, the pins of the integrated circuit package are easily damaged due to shaking, vibration, etc. during movement, flipping, or marking.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] A feeding module for an integrated circuit packaged wafer marking machine includes a mounting base. A first feeding plate and a second feeding plate are fixedly connected to the outer side wall of the mounting base. Both the first and second feeding plates are provided with multiple placement slots, which are arranged in rows at equal intervals. A fixing plate is fixedly connected to one side wall of the first feeding plate. Two first drive motors are mounted on the fixing plate. The output ends of the two first drive motors pass through the fixing plate and are fixedly connected to threaded shafts. Multiple threaded sleeves are threadedly connected to the threaded shafts. Support plates are fixedly connected to the side walls of the multiple threaded sleeves near the first and second feeding plates. The multiple support plates are slidably connected to the first and second feeding plates respectively. Each support plate has a hollow groove, and an adsorption component is provided in the hollow groove.

[0006] A first negative pressure box is fixedly connected to the first feeding plate, and a second negative pressure box is fixedly connected to the second feeding plate. Both the first and second negative pressure boxes have negative pressure cavities. A connecting pipe is fixedly connected between the first and second negative pressure boxes. A groove is provided on one side wall of the negative pressure cavity. One end of the support plate is slidably connected to the side wall of the first negative pressure box with the groove. A turntable is rotatably connected in the groove. A connecting groove is provided in the turntable. A miniature vacuum pump is provided on the outer side wall of the first negative pressure box. A driving device is provided on the turntable. A threaded rod is threadedly connected to the mounting base. A bracket is provided at both ends of the threaded rod. The threaded rod is rotatably connected in the bracket. A flip-up conveying device is provided on the bracket.

[0007] Preferably, the adsorption assembly includes an adsorption tank that communicates with an empty tank. The adsorption tank is disposed on a side wall of the support plate near the first and second feeding plates. A fixing rod is fixedly connected to an inner side wall of the empty tank. One end of the fixing rod extends out of the adsorption tank, and the side wall of the fixing rod extending out of the adsorption tank is flush with the side wall of the support plate near the first and second feeding plates.

[0008] Preferably, the driving device includes a rotating shaft, which is fixedly connected to one side wall of the turntable. The first negative pressure box and the second negative pressure box are each provided with a through hole facing the rotating shaft. One end of the rotating shaft is rotatably connected to the through hole. A transmission wheel is fixedly connected to the rotating shaft. Multiple transmission wheels are connected to each other by a transmission belt. Two of the transmission wheels are fixedly connected with gears. The two gears are respectively located close to the first feeding plate and the second feeding plate. A rack is fixedly connected to the support plate and is respectively meshed with the two gears.

[0009] Preferably, the reversible conveyor includes a second drive motor, which is disposed on the outer side wall of the support, and the output end of the second drive motor is fixedly connected to a threaded rod. The inner side wall of the support is provided with a guide groove.

[0010] Preferably, the length of the first feeding plate is greater than that of the second feeding plate, one end of the first feeding plate is slidably connected in the guide groove, and the outer wall of the first feeding plate slidably connected in the guide groove is curved.

[0011] Preferably, both the first feeding plate and the second feeding plate are fixedly connected to the outer wall of the mounting base by welding.

[0012] Preferably, the inner wall of the placement groove and the side wall of the support plate near the first and second feeding plates are both provided with rubber membranes.

[0013] The beneficial effects of this invention are:

[0014] 1. By controlling the counterclockwise and clockwise rotation of the second drive motor, the blocking effect of the guide groove on the first feeding plate and the threaded connection between the threaded rod and the mounting base can be used to complete the feeding and marking process of the integrated circuit package wafer, flipping it over for marking on the other side, and sending the processed material back to its original position so that the processed material can be taken out and put into a new integrated circuit package wafer.

[0015] 2. Through the cooperation between the two support plates and the placement slot, the support plates shield the bottom of the placement slot, allowing the integrated circuit package wafer to be placed into the placement slot. The placement slot is then transported by the mounting base, the first feeding plate, and the second feeding plate. During transportation, flipping, and marking, the negative pressure generated by the micro vacuum pump in the negative pressure chamber is transmitted to the adsorption slot through the connection between the empty slot in the support plate that is directly opposite the groove and the negative pressure chamber. The negative pressure adsorbs and fixes the integrated circuit package wafer, preventing damage to the pins due to shaking and vibration.

[0016] 3. During the process of the first drive motor driving the support plate to move and causing the support plate to be misaligned with the placement groove, the groove that was originally connected to this part of the support plate will be misaligned. During the movement of the support plate, the rack will drive the gear, transmission wheel, rotating shaft, turntable and connecting groove to rotate 90°, so that the connection between the negative pressure chamber and the groove through the connecting groove is cut off, thereby automatically disconnecting the connection and preventing the negative pressure from being consumed. During the process of the first drive motor driving the support plate to move and align with the placement groove, the connection will be automatically restored, forming an adsorption fixation. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the feeding module of an integrated circuit packaged wafer marking machine proposed in this invention;

[0018] Figure 2 This is a top view of a feeding module for an integrated circuit package marking machine proposed in this invention;

[0019] Figure 3 for Figure 2 AA section view in the middle;

[0020] Figure 4 for Figure 2 BB cross-section diagram in the middle;

[0021] Figure 5 This is a schematic diagram of the structure of the first and second feeding plates of the feeding module for an integrated circuit package marking machine proposed in this invention;

[0022] Figure 6 This is a schematic diagram of the first and second negative pressure boxes of the feeding module of the integrated circuit package marking machine proposed in this invention;

[0023] Figure 7 This is a schematic diagram of the internal structure of the negative pressure cavity of the feeding module of an integrated circuit package marking machine proposed in this invention;

[0024] Figure 8 This is a schematic diagram of the turntable structure of the feeding module of an integrated circuit package marking machine proposed in this invention.

[0025] In the diagram: 1 Mounting base, 2 First feeding plate, 3 Second feeding plate, 4 Placement slot, 5 Fixing plate, 6 First drive unit, 7 Threaded shaft, 8 Threaded sleeve, 9 Support plate, 10 Empty slot, 11 Adsorption slot, 12 Fixing rod, 13 First negative pressure box, 14 Second negative pressure box, 15 Negative pressure chamber, 16 Connecting pipe, 17 Groove, 18 Turntable, 19 Connecting slot, 20 Rotating shaft, 21 Transmission wheel, 22 Transmission belt, 23 Gear, 24 Rack, 25 Threaded rod, 26 Bracket, 27 Second drive motor, 28 Guide slot. Detailed Implementation

[0026] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0027] Reference Figure 1-8 A feeding module for an integrated circuit package wafer marking machine includes a mounting base 1. A first feeding plate 2 and a second feeding plate 3 are fixedly connected to the outer side wall of the mounting base 1, respectively. The first feeding plate 2 and the second feeding plate 3 are both fixedly connected to the outer side wall of the mounting base 1 by welding. The first feeding plate 2 and the second feeding plate 3 are provided with multiple placement slots 4, which are arranged in rows at equal intervals. A fixing plate 5 is fixedly connected to one side wall of the first feeding plate 2, and two first drive motors 6 are installed on the fixing plate 5.

[0028] The output ends of the two first drive motors 6 pass through the fixed plate 5 and are fixedly connected to the threaded shaft 7. Multiple threaded sleeves 8 are threadedly connected to the threaded shaft 7. Support plates 9 are fixedly connected to the side wall of the multiple threaded sleeves 8 near the first feeding plate 2 and the second feeding plate 3. The multiple support plates 9 are slidably connected to the first feeding plate 2 and the second feeding plate 3 respectively. A hollow groove 10 is provided in the support plate 9. An adsorption component is provided in the hollow groove 10. The adsorption component includes an adsorption groove 11. The adsorption groove 11 is connected to the hollow groove 10. The adsorption groove 11 is set on the side wall of the support plate 9 near the first feeding plate 2 and the second feeding plate 3. A fixed rod 12 is fixedly connected to one inner side wall of the hollow groove 10.

[0029] One end of the fixing rod 12 extends out of the adsorption tank 11. The side wall of the end of the fixing rod 12 extending out of the adsorption tank 11 is flush with the side wall of the support plate 9 near the first feeding plate 2 and the second feeding plate 3. The inner side wall of the placement tank 4 and the side wall of the support plate 9 near the first feeding plate 2 and the second feeding plate 3 are both provided with rubber membranes. The first feeding plate 2 is fixedly connected to the first negative pressure box 13, and the second feeding plate 3 is fixedly connected to the second negative pressure box 14. The first negative pressure box 13 and the second negative pressure box 14 are both provided with negative pressure chambers 15. The first negative pressure box 13 and the second negative pressure box 14 are fixedly connected with a connecting pipe 16. The side wall of the negative pressure chamber 15 is provided with a groove 17. One end of the support plate 9 is slidably connected to the side wall of the first negative pressure box 13 with the groove 17.

[0030] A turntable 18 is rotatably connected within the groove 17. The turntable 18 has a connecting groove 19. A miniature vacuum pump is provided on the outer wall of the first negative pressure box 13. A driving device is provided on the turntable 18. The driving device includes a rotating shaft 20, which is fixedly connected to one side wall of the turntable 18. Both the first negative pressure box 13 and the second negative pressure box 14 have through holes facing the rotating shaft 20. One end of the rotating shaft 20 is rotatably connected to the through hole. A transmission wheel 21 is fixedly connected to the rotating shaft 20. Multiple transmission wheels 21 are connected to each other by a transmission belt 22.

[0031] Two transmission wheels 21 are fixedly connected to gears 23. The two gears 23 are respectively located close to the first feeding plate 2 and the second feeding plate 3. The support plate 9 is fixedly connected to racks 24 that mesh with the two gears 23. The mounting base 1 is internally threaded with a threaded rod 25. The two ends of the threaded rod 25 are provided with brackets 26. The threaded rod 25 is rotatably connected in the brackets 26.

[0032] The support 26 is equipped with a tumbler conveyor, which includes a second drive motor 27. The second drive motor 27 is located on the outer side wall of the support 26. The output end of the second drive motor 27 is fixedly connected to the threaded rod 25. The inner side wall of the support 26 is provided with a guide groove 28. The length of the first feeding plate 2 is greater than that of the second feeding plate 3. One end of the first feeding plate 2 is slidably connected in the guide groove 28. The outer side wall of the first feeding plate 2 at the end slidably connected to the guide groove 28 is curved.

[0033] In use, the invention first controls the upper first drive motor 6 of the two first drive motors 6 to reverse. The output end of the first drive motor 6 drives the threaded shaft 7 to rotate. Since the threaded shaft 7 and the threaded sleeve 8 are threadedly connected, and the threaded sleeve 8 is fixedly connected to the support plate 9, the first loading plate 2 and the second loading plate 3 have a limiting effect on the support plate 9. Therefore, under the drive of the threaded shaft 7, the threaded sleeve 8 will move along the direction of the threaded shaft 7, so that the upper support plate 9 no longer blocks the placement slots 4 on the first loading plate 2 and the second loading plate 3, and the lower support plate 9 blocks the placement slots 4 from below, and the integrated circuit package wafers are placed into multiple placement slots 4 in sequence.

[0034] After the integrated circuit package chip is placed, the micro vacuum pump is turned on. The micro vacuum pump works to create a negative pressure environment in the negative pressure chambers 15 of the first negative pressure box 13 and the second negative pressure box 14. During the process of the first drive motor 6 located above being reversed to open the upper end of the placement slot 4, the support plate 9 located above moves, which drives the two racks 24 located above to move. Through the meshing connection between the racks 24 and the gears 23, the two gears 23 are driven to rotate, which in turn drives multiple transmission wheels 21 to rotate simultaneously, which in turn drives multiple turntables 18 to rotate 90° in the groove 17. The connecting groove 19 also rotates 90° with the turntables 18, so that the connection between the negative pressure chamber 15 located above and the groove 17 is cut off.

[0035] The empty slot 10 in the support plate 9 below is set directly opposite the groove 17 below. The negative pressure chamber 15 is connected to the empty slot 10 through the connecting slot 19 and the groove 17. Then, by generating negative pressure in the adsorption slot 11, the integrated circuit package placed in the placement slot 4 is adsorbed and fixed, so as to prevent the pins from being damaged due to shaking and vibration during the subsequent material movement for marking.

[0036] The second drive motor 27 is controlled to rotate counterclockwise. The output end of the second drive motor 27 drives the threaded rod 25 to rotate counterclockwise. Due to the obstruction of the guide groove 28 on the mounting base 1, the first feeding plate 2, the second feeding plate 3 and the mounting base 1 cannot rotate together with the threaded rod 25. With the help of the threaded connection between the threaded rod 25 and the mounting base 1, the mounting base 1 is driven to move the first feeding plate 2 and the second feeding plate 3 along the guide groove 28 to the other end away from the second drive motor 27, so as to send the integrated circuit package wafer for marking.

[0037] After marking one side of the integrated circuit package placed in the placement slot 4, the first drive motor 6 located above is controlled to rotate forward, driving the support plate 9 to reset and cover the upper end of the placement slot 4 again. At the same time, during the process of moving and resetting the support plate 9, the rack 24 drives the gear 23, transmission wheel 21, rotating shaft 20, turntable 18 and connecting slot 19 to rotate 90°, so that the empty slot 10 in the support plate 9 located above is reconnected to the negative pressure chamber 15 through the groove 17 and the connecting slot 19.

[0038] The second drive motor 27 is controlled to rotate clockwise and reverse, and the threaded rod 25 drives the mounting base 1, the first feeding plate 2, and the second feeding plate 3 to rotate 180°. The first feeding plate 2 falls into the other side of the guide groove 28 and is blocked by it, and then the second drive motor 27 is turned off. Then the first drive motor 6, which has flipped to the top, is controlled to rotate in reverse, opening the top of the flipped placement groove 4, so as to facilitate the marking process on the other side of the integrated circuit package wafer. After the marking on both sides is completed, the second drive motor 27 is controlled to rotate clockwise and reverse, driving the mounting base 1, the first feeding plate 2, and the second feeding plate 3 to move and reset, returning to the end closer to the second drive motor 27, thus completing the entire process of conveying, flipping, and double-sided marking.

[0039] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A feeding module for an integrated circuit packaged wafer marking machine, comprising a mounting base (1), characterized in that, The mounting base (1) has a first feeding plate (2) and a second feeding plate (3) fixedly connected to its outer side wall. The first feeding plate (2) and the second feeding plate (3) are provided with multiple placement slots (4). The multiple placement slots (4) are arranged in rows with equal spacing. A fixing plate (5) is fixedly connected to one side wall of the first feeding plate (2). Two first drive motors (6) are installed on the fixing plate (5). The output ends of the two first drive motors (6) pass through the fixing plate (5) and are fixedly connected to a threaded shaft (7). Multiple threaded sleeves (8) are threadedly connected to the threaded shaft (7). Support plates (9) are fixedly connected to the side wall of the multiple threaded sleeves (8) near the first feeding plate (2) and the second feeding plate (3). The multiple support plates (9) are symmetrically slidably connected to the upper and lower sides of the first feeding plate (2) and the second feeding plate (3). A hollow groove (10) is provided in the support plate (9). An adsorption component is provided in the hollow groove (10). A first negative pressure box (13) is fixedly connected to the first feeding plate (2), and a second negative pressure box (14) is fixedly connected to the second feeding plate (3). Negative pressure chambers (15) are provided in both the first negative pressure box (13) and the second negative pressure box (14). A connecting pipe (16) is fixedly connected between the first negative pressure box (13) and the second negative pressure box (14). A groove (17) is provided on one side wall of the negative pressure chamber (15). One end of the support plate (9) is slidably connected to the side wall of the first negative pressure box (13) with the groove (17). A turntable (18) is rotatably connected in the groove (17). A connecting groove (19) is provided in the turntable (18). A miniature vacuum pump is provided on the outer side wall of the first negative pressure box (13). A driving device is provided on the turntable (18). A threaded rod (25) is threadedly connected in the mounting base (1). A bracket (26) is provided on both ends of the threaded rod (25). The threaded rod (25) is rotatably connected to the mounting base (1). Inside the bracket (26), the bracket (26) is provided with a flip-up conveying device. The inner side wall of the bracket (26) is provided with a guide groove (28). One end of the first feeding plate (2) is slidably connected in the guide groove (28). The driving device includes a rotating shaft (20). The rotating shaft (20) is fixedly connected to one side wall of the turntable (18). The first negative pressure box (13) and the second negative pressure box (14) are both provided with through holes facing the rotating shaft (20). One end of the rotating shaft (20) is rotatably connected in the through hole. A transmission wheel (21) is fixedly connected to the rotating shaft (20). Multiple transmission wheels (21) are connected to each other by a transmission belt (22). Two of the transmission wheels (21) are fixedly connected with gears (23). The two gears (23) are respectively located close to the first feeding plate (2) and the second feeding plate (3). A rack (24) is fixedly connected to the support plate (9) and meshes with the two gears (23). The adsorption assembly includes an adsorption tank (11) which is connected to an empty tank (10). The adsorption tank (11) is set on a side wall of the support plate (9) near the first feeding plate (2) and the second feeding plate (3). A fixing rod (12) is fixedly connected to an inner side wall of the empty tank (10). One end of the fixing rod (12) extends out of the adsorption tank (11). The side wall of the fixing rod (12) extending out of the adsorption tank (11) is flush with the side wall of the support plate (9) near the first feeding plate (2) and the second feeding plate (3). The reversible conveyor includes a second drive motor (27), which is mounted on the outer wall of the support (26), and the output end of the second drive motor (27) is fixedly connected to the threaded rod (25).

2. The integrated circuit package wafer marking machine feeding module according to claim 1, characterized in that, The length of the first feeding plate (2) is greater than that of the second feeding plate (3), and the outer wall of the first feeding plate (2) is slidably connected to one end of the guide groove (28) and is curved.

3. The feeding module for an integrated circuit packaged wafer marking machine according to claim 1, characterized in that, The first feeding plate (2) and the second feeding plate (3) are both fixedly connected to the outer wall of the mounting base (1) by welding.

4. The feeding module for an integrated circuit packaged wafer marking machine according to claim 1, characterized in that, The inner wall of the placement groove (4) and the side wall of the support plate (9) near the first feeding plate (2) and the second feeding plate (3) are both provided with rubber membranes.

Images