A planar waveguide-based microwave metamaterial high-temperature sensor and a preparation method thereof
By using a microwave metamaterial sensor based on a planar waveguide, wireless passive real-time in-situ temperature monitoring is achieved by utilizing the change in dielectric constant of an alumina ceramic substrate. This solves the problem of high-temperature sensor failure in harsh environments and realizes efficient ultra-high temperature monitoring.
Patent Information
- Application Number
- CN202310735334.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-06-20
- Publication Date
- 2025-12-19
- Estimated Expiration
- 2043-06-20
AI Technical Summary
Existing high-temperature sensors fail or become unusable in harsh environments due to increased leakage current, complex manufacturing processes, difficulty in heat-resistant lead wire connections, and limited wireless transmission.
A microwave metamaterial sensor based on planar waveguides is used to form wireless signal transmission through a dielectric substrate, top and bottom metal layers and a ring complementary open resonant ring structure. Wireless passive real-time in-situ temperature monitoring is achieved by utilizing the change in dielectric constant of the alumina ceramic substrate.
It enables wireless, passive, real-time, in-situ, high-quality ultra-high temperature monitoring in harsh environments, reducing the complexity of sensor manufacturing and improving the level of device integration and miniaturization.
Smart Images
Figure CN116539182B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application relates to the technical field of sensors, in particular to a microwave metamaterial high-temperature sensor based on a planar waveguide and a preparation method. BACKGROUND
[0002] There are extensive demands for real-time, in-situ and non-contact temperature measurement in the fields of aerospace, metallurgy, chemical industry and pipeline transportation. The P-N junction leakage current of a conventional silicon-based high-temperature sensor increases sharply with the increase of temperature, resulting in the failure of the sensitive characteristics. The temperature sensor based on a traditional substrate integrated waveguide needs to use laser drilling technology to drill a cylindrical array of through holes in a dielectric substrate and fill the through holes with metal paste, which greatly increases the process manufacturing difficulty, and with the shift of the working waveband to a larger frequency, the precision of the screen printing filling of the through holes is lower or even cannot be realized. The wired and active measurement method needs to introduce a lead for signal transmission and a power supply for energy supply, and the matching circuit and the connecting welding point cannot withstand high temperature, and the power supply has a limited service life and is inconvenient to replace, so that the application is greatly limited. SUMMARY
[0003] The application aims to provide a microwave metamaterial high-temperature sensor based on a planar waveguide and a preparation method, which can realize wireless passive, real-time in-situ and high-quality factor super-high-temperature monitoring in harsh environments.
[0004] To achieve the above-mentioned purpose, the application provides the following scheme.
[0005] A microwave metamaterial high-temperature sensor based on a planar waveguide comprises a top metal layer, a dielectric substrate and a bottom metal layer arranged in sequence from top to bottom.
[0006] The top metal layer is integrated with a single square complementary open resonant ring structure and a periodically arranged annular complementary open resonant ring structure; the square complementary open resonant ring structure is located at the center position of the top metal layer; the annular complementary open resonant ring structures are located on both sides of the top metal layer, and the opening directions of the annular complementary open resonant ring structures on the two sides are oppositely arranged; wherein the dielectric substrate, the top metal layer, the bottom metal layer and the annular complementary open resonant ring structure form a planar waveguide, and the square complementary open resonant ring structure forms a resonant loop and performs wireless signal transmission.
[0007] Optionally, the material of the dielectric substrate is HTCC ceramic.
[0008] Optionally, the arrangement mode is that the annular complementary open resonant ring structures are periodically arranged on both sides of the top metal layer to form an array of annular complementary open resonant ring structures.
[0009] Optionally, the square complementary split ring resonator structure and the ring complementary split ring resonator structure are non-metal elements integrated in the top metal layer.
[0010] The application further provides a preparation method of a microwave metamaterial high-temperature sensor based on a planar waveguide, comprising the following steps:
[0011] S1, processing HTCC into small cubes with a certain size and thickness to prepare an alumina ceramic substrate;
[0012] S2, printing a top metal layer, a square complementary split ring resonator structure and a ring complementary split ring resonator structure on the surface of the alumina ceramic substrate by using a screen printing process and selecting platinum paste, and placing the same into a drying box to be dried; preparing a bottom metal layer by using a screen printing process and selecting platinum paste, and placing the same into a drying box to be dried, to obtain a printed sensor; placing the printed sensor into a muffle furnace to perform high-temperature sintering according to a sintering curve, removing binder and organic solvent components in the platinum paste, and tightly adhering the platinum metal to the alumina ceramic substrate to form a platinum metal film, to obtain a high-temperature sensor.
[0013] Optionally, the step S1 specifically comprises:
[0014] The HTCC is processed into a square structure with a size of 28mm*28mm*1mm, as the alumina ceramic substrate.
[0015] Optionally, the step S2 specifically comprises:
[0016] The screen printing process is selected, the top metal layer, the square complementary split ring resonator structure and the ring complementary split ring resonator structure are printed by using platinum paste first, and are placed into a high-temperature furnace at 130 DEG C to be dried for 15 minutes; the bottom metal layer is prepared according to the same step; the printed sensor is placed into a muffle furnace, sintering is performed from 25 DEG C to 200 DEG C for 50 minutes, sintering is performed from 200 DEG C to 1350 DEG C for 120 minutes, 1350 DEG C is kept for 30 minutes, and then the temperature is decreased to room temperature, to obtain the high-temperature sensor.
[0017] According to the specific embodiments of the application, the following technical effects are provided:
[0018] The application discloses a kind of microwave metamaterial high-temperature sensors based on planar waveguide and preparation method, the sensor includes by top to bottom sequentially arranged top metal layer, dielectric substrate and bottom metal layer;The top metal layer integrates single square complementary open resonant ring structure and periodic arrangement of annular complementary open resonant ring structure;The square complementary open resonant ring structure is located in the center position of the top metal layer;The annular complementary open resonant ring structure is located in the two sides of the top metal layer, and the opening direction in the two sides annular complementary open resonant ring structure is oppositely arranged;Wherein, the dielectric substrate, the top metal layer, the bottom metal layer and the annular complementary open resonant ring structure form planar waveguide, and the square complementary open resonant ring structure forms resonant loop and carries out wireless signal transmission.By dielectric substrate, top metal layer, bottom metal layer and annular complementary open resonant ring structure form planar waveguide, and the square complementary open resonant ring structure forms resonant loop and carries out wireless signal transmission, realize the integration, miniaturization and high performance of sensor, reduce the manufacturing complexity of sensor, and based on the local action of square complementary open resonant ring structure to electromagnetic field as point dipole, sensor substrate dielectric constant is very sensitive to test environmental temperature change, when the temperature of outside changes, substrate dielectric constant changes, eventually leads to sensor resonant frequency to change with temperature, realizes wireless passive, real-time in-situ, high quality factor of harsh environment super high temperature monitoring. BRIEF DESCRIPTION OF DRAWINGS
[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the drawings needed in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.
[0020] Figure 1 It is a test principle schematic diagram of the embodiment of the present application.
[0021] Figure 2 It is a screen printing top metal layer, single square complementary open resonant ring, array annular complementary open resonant ring process schematic diagram of the embodiment of the present application.
[0022] Figure 3 It is a screen printing bottom metal layer process schematic diagram of the embodiment of the present application.
[0023] Figure 4 It is a sensor top surface structure schematic diagram of the embodiment of the present application.
[0024] Figure 5 It is a sensor bottom surface structure schematic diagram of the embodiment of the present application.
[0025] Reference signs:
[0026] 1. High temperature sensor; 2. Network analyzer; 3. Interrogation antenna; 4. Top layer of substrate; 5. Screen; 6. Scraper; 7. Hollow structure; 8. Top metal layer; 9. Bottom layer of substrate; 10. Bottom metal layer; 11. Dielectric substrate; 12. Square complementary open resonant ring structure; 13. Ring-shaped complementary open resonant ring structure. DETAILED DESCRIPTION
[0027] The technical solutions in the embodiments of the present application will be apparently and completely described below with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative work belong to the protection scope of the present application.
[0028] The purpose of the present application is to provide a kind of microwave metamaterial high temperature sensor based on planar waveguide and preparation method, can realize wireless passive, real-time in situ, high quality factor of harsh environment super high temperature monitoring.
[0029] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the present application will be further described in detail below with the drawings and specific embodiments.
[0030] As shown in Figures 4-5 The present application provides a kind of microwave metamaterial high temperature sensor based on planar waveguide, comprising: top metal layer 8, dielectric substrate 11 and bottom metal layer 10 arranged in order from top to bottom;
[0031] The top metal layer 8 is also integrated with structure 7;The structure 7 includes single square complementary open resonant ring structure 12 and periodic array ring-shaped complementary open resonant ring structure 13;That is, the top metal layer 8 integrates single square complementary open resonant ring structure 12 and periodic ring-shaped complementary open resonant ring structure 13;The square complementary open resonant ring structure 12 is located at the center position of the top metal layer 8;The ring-shaped complementary open resonant ring structure 13 is located at both sides of the top metal layer 8, and the opening direction of the two sides ring-shaped complementary open resonant ring structure 13 is oppositely arranged;Wherein, the dielectric substrate 11, the top metal layer 8, the bottom metal layer 10 and the periodic array ring-shaped complementary open resonant ring structure 13 form planar waveguide, and the single square complementary open resonant ring structure 12 forms resonant loop and carries out wireless signal transmission.
[0032] As a specific embodiment of the present embodiment, the material of the medium substrate 11 is alumina ceramic. The setting arrangement is that the annular complementary open resonant ring structure 13 is arranged periodically on both sides of the top metal layer 8 to form a side array annular complementary open resonant ring structure 13. The square complementary open resonant ring structure 12 and the annular complementary open resonant ring structure 13 are both non-metal elements integrated on the top metal layer 8. Among them, the square complementary open resonant ring structure 12 structure capable of localizing electromagnetic field can be equivalent to a simple LC resonant loop.
[0033] As shown in Figures 1-3 The present application also provides a preparation method of a microwave metamaterial high-temperature sensor based on a planar waveguide, comprising:
[0034] S1, process a small block of HTCC with a certain size and thickness to prepare an alumina ceramic substrate as the medium substrate 11;
[0035] S2, select platinum paste through a screen printing process, and use a screen plate 5 and a squeegee 6 to print the square complementary open resonant ring structure 12 and the annular complementary open resonant ring structure 13 on the top layer 4 of the alumina ceramic substrate, put it into a drying oven for drying, prepare the bottom metal layer 10 on the bottom layer 9 of the alumina ceramic substrate by selecting platinum paste through a screen printing process, obtain a printed sensor, put the printed sensor into a muffle furnace to perform high-temperature sintering according to a sintering curve, remove the binder and organic solvent components in the platinum paste, and make the platinum metal adhere to the alumina ceramic substrate to form a platinum metal film, thereby obtaining the high-temperature sensor 1.
[0036] As a specific embodiment of step S1, it comprises:
[0037] The HTCC is processed into a square structure with a size of 28mm×28mm×1mm as the alumina ceramic substrate.
[0038] As a specific embodiment of step S2, it comprises:
[0039] Select a screen printing process, first print the top metal layer 8, the square complementary open resonant ring structure 12 and the annular complementary open resonant ring structure 13 using platinum paste, put it into a high-temperature furnace at 130℃ for drying for 15 minutes, prepare the bottom metal layer 10 according to the same steps, put the above printed sensor into a muffle furnace, sinter from 25℃ to 200℃ for 50 minutes, sinter from 200℃ to 1350℃ for 120 minutes, keep 1350℃ for 30 minutes, and then cool to room temperature, thereby obtaining the high-temperature sensor 1.
[0040] In addition, after the wireless passive temperature sensor 1 is prepared, the interrogation antenna 3 is mounted on the wireless passive temperature sensor 1, and temperature monitoring is performed through the S11 curve in the network analyzer 2.
[0041] The embodiment has the following beneficial effects:
[0042] Compared with the prior art, the microwave metamaterial high-temperature sensor based on the planar waveguide adopts the LC resonance principle, and the local action of the square complementary open resonant structure on the electromagnetic field, and when the temperature of the test environment changes, the dielectric constant of the alumina ceramic substrate of the high-temperature sensor 1 is particularly sensitive to the temperature change. When the temperature of the outside changes, the dielectric constant of the substrate changes, and finally the resonant frequency of the wireless passive temperature sensor 1 changes with the temperature, realizing the wireless passive measurement of the temperature. The present application designs a single-plane metamaterial structure, greatly reducing the complexity of the sensor manufacturing, and the square complementary open resonant ring structure and the ring-shaped complementary open resonant ring structure are embedded in the top metal layer 8, realizing the integration, miniaturization and high performance of the device. The structure of the wireless passive temperature sensor is simple and reasonable, easy to process, and low in cost.
[0043] The embodiments in the specification are described in a progressive manner, and each embodiment focuses on the difference from other embodiments, and the same or similar parts between the embodiments can be referred to each other.
[0044] The principles and implementation modes of the present application are described by applying specific examples in the specification, and the above description of the embodiments is only used to help understand the core idea of the present application; at the same time, for those skilled in the art, according to the idea of the present application, the specific implementation mode and application range will be changed. In view of the above, the content of the specification should not be understood as a limitation of the present application.
Claims
1. A microwave metamaterial high-temperature sensor based on a planar waveguide, characterized in that, include: The top metal layer, dielectric substrate, and bottom metal layer are arranged sequentially from top to bottom; The top metal layer integrates a single square complementary open-ring resonator structure and a periodically arranged annular complementary open-ring resonator structure. The square complementary open-ring resonator structure is located at the center of the top metal layer. The annular complementary open-ring resonator structures are located on both sides of the top metal layer, and the opening directions of the annular complementary open-ring resonator structures on both sides are opposite. The dielectric substrate, the top metal layer, the bottom metal layer, and the annular complementary open-ring resonator structures form a planar waveguide. The square complementary open-ring resonator structures form a resonant circuit for wireless signal transmission. The annular complementary open-ring resonator structures are periodically arranged on both sides of the top metal layer to form an array of annular complementary open-ring resonator structures.
2. The microwave metamaterial high-temperature sensor based on planar waveguide according to claim 1, characterized in that, The substrate material is HTCC ceramic.
3. The microwave metamaterial high-temperature sensor based on planar waveguide according to claim 1, characterized in that, The square complementary open-ring resonator structure and the ring complementary open-ring resonator structure are non-metallic components integrated into the top metal layer.
4. A method for fabricating a microwave metamaterial high-temperature sensor based on a planar waveguide as described in any one of claims 1-3, characterized in that, include: S1. Process HTCC into small cubes of a certain size and thickness to prepare alumina ceramic substrate; S2. Using screen printing, a top metal layer, a square complementary open-ring resonator structure, and a ring complementary open-ring resonator structure are printed on the surface of the alumina ceramic substrate using platinum paste. The substrate is then dried in a drying oven. A bottom metal layer is prepared using screen printing with platinum paste and dried in a drying oven to obtain the printed sensor. The printed sensor is then placed in a muffle furnace and sintered at high temperature according to the sintering curve to remove the binder and organic solvent components from the platinum paste, allowing the platinum metal to adhere tightly to the alumina ceramic substrate to form a platinum metal film, thus obtaining a high-temperature sensor.
5. The method for fabricating a microwave metamaterial high-temperature sensor based on a planar waveguide according to claim 4, characterized in that, Step S1 specifically includes: HTCC was processed into a square structure of 28mm×28mm×1mm to serve as an alumina ceramic substrate.
6. The method for fabricating a microwave metamaterial high-temperature sensor based on a planar waveguide according to claim 4, characterized in that, Step S2 specifically includes: The screen printing process is selected. First, the top metal layer, square complementary open-ring resonator structure, and ring complementary open-ring resonator structure are printed using platinum paste. The layers are then dried in a high-temperature furnace at 130°C for 15 minutes. The bottom metal layer is prepared in the same manner. The printed sensor is then placed in a muffle furnace and sintered from 25°C to 200°C for 50 minutes, then from 200°C to 1350°C for 120 minutes, and finally held at 1350°C for 30 minutes. The temperature is then lowered to room temperature to obtain the high-temperature sensor.