Optical sensing module and electronic device

Abstract

The present disclosure provides optical sensing modules and electronic devices. The optical sensing module includes a substrate, a plurality of optical sensing components, and a light blocking component. The substrate has a sensing region and a non-sensing region located at a periphery of the sensing region. The plurality of optical sensing components are disposed on the sensing region. The light blocking component is disposed on the non-sensing region and a portion of the sensing region. The light blocking component overlaps a portion of the plurality of optical sensing components in a normal direction of the substrate.

Description

Technical Field

[0001] This disclosure relates to an optical sensing module and electronic device, and more particularly to an optical sensing module and electronic device provided with a light-blocking component. Background Technology

[0002] Because optical sensing modules can convert received light into electrical signals, and then transmit these signals to a processor for analysis, they are widely used in consumer electronics products such as smartphones and wearable devices.

[0003] For example, optical sensing modules can be used in fingerprint recognition devices. To provide consumers with a good user experience, fingerprint recognition devices must meet the requirements of high security, high convenience, and / or high accuracy. However, current optical sensing modules are susceptible to noise from stray light such as external light, which reduces the accuracy of electrical signal recognition.

[0004] Therefore, although existing optical sensing modules and electronic devices have gradually met their intended uses, they are not yet completely satisfactory in all aspects. Thus, there are still some issues regarding optical sensing modules and electronic devices that need to be addressed. Summary of the Invention

[0005] In some embodiments, an optical sensing module is provided. The optical sensing module includes a substrate, a plurality of optical sensing components, and a light-blocking component. The substrate has a sensing area and a non-sensing area surrounding the sensing area. The plurality of optical sensing components are disposed on the sensing area. The light-blocking component is disposed on the non-sensing area and a portion of the sensing area. The light-blocking component overlaps a portion of the plurality of optical sensing components in the normal direction of the substrate.

[0006] In some embodiments, an electronic device is provided. The electronic device includes a display panel and an optical sensing module. The optical sensing module is disposed on one side of the display panel. The optical sensing module includes a substrate, a plurality of optical sensing components, and a light-blocking component. The substrate has a sensing area and a non-sensing area surrounding the sensing area. The plurality of optical sensing components are disposed on the sensing area. The light-blocking component is disposed on the non-sensing area and a portion of the sensing area. The light-blocking component overlaps a portion of the plurality of optical sensing components in the normal direction of the substrate.

[0007] The optical sensing module disclosed herein can be applied to various types of electronic devices, including display panels. To make the features and advantages of this disclosure more apparent, various embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0008] The following detailed description, in conjunction with the accompanying drawings, will provide a better understanding of the views expressed in the embodiments of this disclosure. It is worth noting that, according to industry standard practice, some features may not be drawn to scale. In fact, for clarity of discussion, the dimensions of different features may be increased or decreased.

[0009] Figure 1A The diagram shows a top view of an optical sensing module according to some embodiments of the present disclosure.

[0010] Figure 1B This diagram shows an equivalent circuit diagram of the optical sensing component of an optical sensing module according to some embodiments of the present disclosure.

[0011] Figure 2 The diagram shows a top view of an optical sensing module according to some embodiments of the present disclosure.

[0012] Figure 3 The diagram shows a top view of an optical sensing module according to some embodiments of the present disclosure.

[0013] Figure 4 The diagram shows a cross-sectional view of an electronic device according to some embodiments of the present disclosure.

[0014] Figure 5 The diagram shows a cross-sectional view of an electronic device according to some embodiments of the present disclosure.

[0015] Figure 6 The diagram shows a cross-sectional view of an electronic device according to some embodiments of the present disclosure.

[0016] Figure 7 The diagram shows a cross-sectional view of an electronic device according to some embodiments of the present disclosure.

[0017] Figure 8 The diagram shows a cross-sectional view of an electronic device according to some embodiments of the present disclosure.

[0018] Figure 9 The diagram shows a cross-sectional view of an electronic device according to some embodiments of the present disclosure.

[0019] Figure 10 This diagram shows a signal processing block diagram of an electronic device according to some embodiments of the present disclosure.

[0020] Figure 1A-10 The annotations in the accompanying drawings are explained as follows:

[0021] 1, 2, 3, 4, 5, 6: Electronic devices

[0022] 10A, 10B, 10C, 10D, 10E, 10F, 10G, 10H, 10I: Optical sensing modules

[0023] 100: Substrate

[0024] 110: Light-absorbing component

[0025] 200: Optical sensing layer

[0026] 200A: Overlapping portion

[0027] 200B: Non-overlapping portion

[0028] 200u: Optical sensing component

[0029] 200E, 300E, 400E: Edge

[0030] 210: Transmission line

[0031] 220, 610: Joint pads

[0032] 230: Connector

[0033] 300: Optical components

[0034] 310: Optical Collimation Structure

[0035] 320: Microlens

[0036] 400: Light-blocking component

[0037] 400A, 400B: Light-blocking section

[0038] 400S, 400S': Side surface

[0039] 401: Opening

[0040] 410: Chamber

[0041] 500: Display panel

[0042] 600: Flexible Circuit Board

[0043] 620: Processor

[0044] 700: Buffer

[0045] 800: Support component

[0046] a1: included angle

[0047] d1: First spacing

[0048] d2: Second spacing

[0049] d3: Third spacing

[0050] DL: Signal line

[0051] F: Fingerprint

[0052] L0: Light

[0053] L1: First Ray

[0054] L2: Second Ray

[0055] SA: Sensing Area

[0056] Sig1: First signal

[0057] Sig2: Second signal

[0058] SL: Scan line

[0059] PA: Non-sensing area

[0060] w1: First width

[0061] w2: Second width Detailed Implementation

[0062] The following disclosure provides numerous different embodiments or examples for implementing various components in the provided optical sensing module and / or electronic device. Specific examples of each component and its configuration are described below to simplify the embodiments of this disclosure. Of course, these are merely examples and are not intended to limit the scope of this disclosure. For instance, if the description refers to a first component forming on a second component, it may include embodiments where the first and second components are in direct contact, or embodiments where an additional component is formed between the first and second components such that they are not in direct contact. Furthermore, component symbols and / or characters may be repeated in different examples of the embodiments of this disclosure. Such repetition is for brevity and clarity and is not intended to indicate a relationship between the different embodiments and / or forms discussed.

[0063] The directional terms used herein, such as “up,” “down,” “front,” “back,” “left,” “right,” and similar terms, are for directional reference only to the accompanying drawings. Therefore, the directional terms used are for illustrative purposes and not for limiting this disclosure.

[0064] In some embodiments of this disclosure, terms such as “connection,” “interconnection,” and similar terms related to joining or linking, unless specifically defined, may refer to two structures in direct contact, or to two structures not in direct contact, wherein another structure is disposed between the two structures. Terms related to joining or linking may also include situations where both structures are movable or both structures are fixed. Furthermore, the terms “electrical connection” and “coupling” include any direct or indirect electrical connection means.

[0065] Furthermore, the terms "first," "second," and similar terms used in this specification or claims are used only to name different components or to distinguish different embodiments or scopes, and are not intended to limit the upper or lower limit of the number of components, nor to limit the manufacturing or installation order of the components.

[0066] In the following text, terms such as “approximately” or “substantially” generally mean within 10%, 5%, 3%, 2%, 1%, or 0.5% of a given value or range. The quantities given here are approximate, meaning that the meaning of “approximately” or “substantially” may be implied even without a specific mention of it.

[0067] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art. It is understood that such terms, as defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the relevant art and the background or context of this disclosure, and should not be interpreted in an idealized or overly formal manner, unless specifically defined in embodiments of this disclosure.

[0068] The following describes some variations of the embodiments. In embodiments with different figures and descriptions, similar component symbols are used to designate similar components. It is understood that additional operations may be provided before, during, or after the method, and some described operations may be replaced or omitted for other embodiments of the method.

[0069] In this document, the directions are not limited to the three axes of a Cartesian coordinate system such as the X, Y, and Z axes, and can be interpreted in a broader sense. For example, the X, Y, and Z axes may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For ease of explanation, in the following text, the X-axis direction is the length direction, the Y-axis direction is the width direction, and the Z-axis direction is the thickness direction. In one embodiment of this disclosure, the Z-axis direction is the normal direction of the substrate.

[0070] In this disclosure, the electronic device may include, but is not limited to, display devices, backlight devices, antenna devices, sensing devices, splicing devices, touch displays, curved displays, and / or free-shape displays. The electronic device may be bendable or flexible. The electronic device may include light-emitting diodes (LEDs), fluorescent, phosphorescent, other suitable display media, or combinations thereof, but is not limited to these. The display device may be a non-emissive or emissive display device. The antenna device may be a liquid crystal type antenna device or a non-liquid crystal type antenna device. The sensing device may be a capacitance, light, heat, or ultrasonic sensing device, but is not limited to these. The sensing device may include fingerprint sensing devices, visible light sensing devices, infrared light sensing devices, and X-ray sensing devices, but is not limited to these. Electronic components may include passive and active components, such as capacitors, resistors, inductors, diodes, transistors, etc. Diodes may include light-emitting diodes (LEDs) or photodiodes. The light-emitting diode (LED) may include, for example, organic light-emitting diodes (OLEDs), miniLEDs, microLEDs, quantum dot LEDs, or other suitable materials, or any combination of the above materials, but is not limited thereto. The splicing device may be, for example, a display splicing device or an antenna splicing device, but is not limited thereto. It should be noted that the electronic device may be any combination of the aforementioned elements, but is not limited thereto. Furthermore, the electronic device may be rectangular, circular, polygonal, have curved edges, or other suitable shapes. The electronic device may have peripheral systems such as processing systems, drive systems, control systems, light source systems, and shelving systems to support the display device or splicing device. It should be noted that the electronic device may be any combination of the aforementioned elements, but is not limited thereto.

[0071] Reference Figure 1AThe figure shows a top view of the optical sensing module 10A according to some embodiments of the present disclosure. It should be understood that, for clarity, some components of the optical sensing module 10A are omitted from the figure, and only some components are schematically shown. In some embodiments, additional components may be added to the optical sensing module 10A described below. In other embodiments, some components of the optical sensing module 10A described below may be replaced or omitted. Furthermore, the structure of the optical sensing module 10A will be described below in conjunction with a method of forming the optical sensing module 10A. It should be understood that, in some embodiments, additional operating steps may be provided before, during, and / or after the method of forming the optical sensing module 10A. In some embodiments, some of the operating steps may be replaced or omitted, and the order of some of the operating steps is interchangeable.

[0072] like Figure 1A As shown, in some embodiments, the optical sensing module 10A includes a substrate 100. In some embodiments, the substrate 100 may include a flexible substrate, a rigid substrate, or a combination thereof, but is not limited thereto. In some embodiments, the substrate 100 may include glass, quartz, sapphire, ceramic, polyimide (PI), polycarbonate (PC), polyethylene terephthalate (PET), polypropylene (PP), other suitable materials, or combinations thereof, but is not limited thereto. In some embodiments, the substrate 100 may include a metal-glass fiber composite material or a metal-ceramic composite material, but is not limited thereto. In some embodiments, the substrate 100 may include a light-transmitting substrate, a semi-light-transmitting substrate, or an opaque substrate.

[0073] In some embodiments, the substrate 100 may include a sensing region SA and a non-sensing region PA surrounding the sensing region SA. In some embodiments, the non-sensing region PA may surround the sensing region SA. In some embodiments, the non-sensing region PA may completely surround the sensing region SA. In other embodiments, the non-sensing region PA may expose a portion of the edge of the sensing region SA. In some embodiments, an optical sensing layer 200 may be disposed on the sensing region SA. In some embodiments, the area on the substrate 100 on which the optical sensing layer 200 is disposed is the sensing region SA. In some embodiments, the area on the substrate 100 on which the optical sensing layer 200 is not disposed is the non-sensing region PA.

[0074] In some embodiments, the optical sensing layer 200 may include a plurality of optical sensing components 200u. In some embodiments, the optical sensing component 200u may be any component capable of converting light signals into electrical signals. The optical sensing component may include, for example, a photodiode, a phototransistor, a metal-semiconductor-metal photodetector (MSM photodetector), or any suitable optical sensing component, but is not limited thereto. In some embodiments, the plurality of optical sensing components 200u may be arranged in an array or matrix. In some embodiments, the optical sensing component 200u may include a first doped layer (not shown), an intrinsic layer (not shown), a second doped layer (not shown), and a transparent conductive layer (not shown) sequentially disposed. In some embodiments, when light irradiates the optical sensing component 200u, electron-hole pairs may be generated to form a photocurrent, but is not limited thereto. In some embodiments, the first doped layer may be, for example, an N-type doped region, and the second doped layer may be, for example, a P-type doped region, forming an NIP structure together with the intrinsic layer; therefore, the optical sensing component 200u may have an NIP structure. In other embodiments, the optical sensing component 200u may have a PIN structure or other suitable structure.

[0075] In some embodiments, the first doped layer, the intrinsic layer, and the second doped layer may comprise semiconductor materials, such as silicon or other suitable materials. In some embodiments, the first doped layer, the intrinsic layer, and the second doped layer may be formed by epitaxial growth, ion implantation, chemical vapor deposition, physical vapor deposition, other suitable processes, or combinations thereof. In some embodiments, the transparent conductive layer may comprise a transparent conductive material, such as a transparent conductive oxide (TCO). Transparent conductive oxides may include indium tin oxide (ITO), antimony zinc oxide (AZO), tin oxide (SnO), zinc oxide (ZnO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), indium tin zinc oxide (ITZO), antimony tin oxide (ATO), other suitable transparent conductive materials, or combinations thereof, but are not limited thereto.

[0076] In some embodiments, the transmission line 210 and the bonding pad 220 may be disposed on the non-sensing region PA of the substrate 100, and the transmission line 210 may electrically connect the bonding pad 220 to the optical sensing component 200u on the sensing region SA. In some embodiments, the transmission line 210 and the bonding pad 220 may be disposed on multiple sides adjacent to the sensing region SA according to the size of the non-sensing region PA.

[0077] In some embodiments, transmission line 210 and / or bonding pad 220 may include, but are not limited to, metallic materials, transparent conductive materials, other suitable conductive materials, or combinations thereof. In some embodiments, metallic materials may include, for example, copper (Cu), silver (Ag), gold (Au), tin (Sn), aluminum (Al), molybdenum (Mo), tungsten (W), chromium (Cr), nickel (Ni), platinum (Pt), titanium (Ti), alloys of the aforementioned metals, other suitable materials, or combinations thereof, but are not limited to. Transparent conductive materials may include transparent conductive oxides. Transparent conductive oxides may include indium tin oxide, antimony zinc oxide, tin oxide, zinc oxide, indium zinc oxide, indium gallium zinc oxide, indium tin zinc oxide, antimony tin oxide, other suitable transparent conductive materials, or combinations thereof, but are not limited to. According to some embodiments, transmission line 210 and / or bonding pad 220 may be formed by chemical vapor deposition processes, physical vapor deposition processes, electroplating processes, electroless plating processes, other suitable processes, or combinations thereof.

[0078] like Figure 1A As shown, in some embodiments, the light-blocking component 400 is disposed on the non-sensing area PA and a portion of the sensing area SA. Therefore, the light-blocking component 400 can block unwanted light. In some embodiments, the light-blocking component 400 may be disposed on the optical sensing component 200u, and the optical sensing component 200u may be located between the light-blocking component 400 and the substrate 100. In some embodiments, the light-blocking component 400 overlaps a portion of the optical sensing layer 200 (see reference 100) in the normal direction (Z direction) of the substrate 100. Figure 4Therefore, the multiple optical sensing components 200u in the overlapping portion 200A of the optical sensing layer 200 cannot receive light signals. So, although the multiple optical sensing components 200u in the overlapping portion 200A can still perform optical sensing functions, they do not receive any light signals that can be sensed. In other words, the multiple optical sensing components 200u in the overlapping portion 200A of the optical sensing layer 200 may have a dark state signal. In some embodiments, in order to enable at least a portion of the multiple optical sensing components 200u to perform sensing functions, the light-blocking component 400 may expose another portion of the optical sensing layer 200. The light-blocking component 400 overlaps a portion of the multiple optical sensing components 200u in the normal direction of the substrate 100 and exposes another portion of the multiple optical sensing components 200u. In some embodiments, the light-blocking component 400 exposes the non-overlapping portion 200B of the optical sensing layer 200. Therefore, the multiple optical sensing components 200u in the non-overlapping portion 200B of the optical sensing layer 200 can receive light signals and thus perform optical sensing functions. In other words, the multiple optical sensing components 200u in the non-overlapping portion 200B of the optical sensing layer 200 have a combined signal of dark state signal and light signal.

[0079] In some embodiments, when the light-blocking component 400 is disposed on one side of the sensing area SA, unwanted light illuminating other sides of the sensing area SA can be blocked by other subsequently formed components. For example, light illuminating other sides of the sensing area SA can be blocked by a subsequently formed flexible circuit board. In some embodiments, the light-blocking component 400 may be disposed on a portion of the sensing area SA and not on the remaining sides of the sensing area SA. In some embodiments, the light-blocking component 400 may be disposed around all sides of the sensing area SA.

[0080] In some embodiments, the light-blocking component 400 may have a closed shape. In some embodiments, the light-blocking component 400 may be a ring-shaped structure, a frame-shaped structure, or a polygonal structure with a hollow portion, other suitable structures, or combinations thereof. In other embodiments, the light-blocking component 400 may be a non-closed structure, such as a U-shaped structure, an L-shaped structure, a linear structure, other suitable structures, or combinations thereof. In some embodiments, the light-blocking component 400 may be a structure with an arbitrary shape, wherein the structure is capable of overlapping the overlapping portion 200A of the optical sensing layer 200 and exposing the non-overlapping portion 200B of the optical sensing layer 200.

[0081] In some embodiments, the shape of the overlapping portion 200A of the optical sensing layer 200 may correspond to the shape of a portion of the light-blocking component 400, for example, such as Figure 1AAs shown, when the light-blocking component 400 has a ring structure, the shape of the overlapping portion 200A of the optical sensing layer 200 may include two rectangles with parallel extending directions. That is, the shape of the overlapping portion 200A of the optical sensing layer 200 corresponds to the shape of the opposite side of the light-blocking component 400. In other embodiments, the shape of the overlapping portion 200A of the optical sensing layer 200 may correspond to the shape of the light-blocking component 400. For example, when the light-blocking component 400 has a ring structure, the shape of the overlapping portion 200A of the optical sensing layer 200 may be ring-shaped.

[0082] In some embodiments, at least one optical sensing component 200u may be disposed in the overlapping portion 200A of the optical sensing layer 200. In some embodiments, when the optical sensing components 200u are arranged in an array, at least one column or at least one row of optical sensing components 200u may be disposed in the overlapping portion 200A. In some embodiments, at least three rows or at least three columns of optical sensing components 200u may be disposed in the overlapping portion 200A, such that at least three rows or at least three columns of pixels are blocked by the light-blocking component 400. This increases the process tolerance of forming the light-blocking component 400 on the optical sensing component 200u, thereby reducing the error when forming the light-blocking component 400 and increasing the yield of the optical sensing module. Furthermore, having at least three rows or columns of pixels blocked by the light-blocking component 400 allows for the acquisition of more dark-state signals as a basis for subsequent image processing. For example, if three columns of sensing components 200u are blocked by the light-blocking component 400, the dark-state signals of the first column of sensing components 200u, the second column of sensing components 200u, and the third column of sensing components 200u can be acquired. The dark-state signals of the first column of sensing components 200u, the second column of sensing components 200u, or the third column of sensing components 200u can be selected as the basis for subsequent signal processing as needed. Figure 1A As shown, the light-blocking component 400 shields the three rows of optical sensing components 200u on the opposite side.

[0083] like Figure 1A As shown, in some embodiments, the light-blocking component 400 is disposed on the transmission line 210. In some embodiments, the light-blocking component 400 may be disposed on a portion of the bonding pad 220, exposing another portion of the bonding pad 220, so that the bonding pad 220 can be electrically connected to other components.

[0084] In some embodiments, the light-blocking component 400 may include resin, photoresist material, other suitable light-blocking materials, or combinations thereof, but is not limited thereto. In some embodiments, the light-blocking component 400 may be a black matrix, black adhesive, or black photoresist material. In some embodiments, the light-blocking component 400 has an absorption rate of more than 80% for light. For example, the absorption rate of the light-blocking component 400 is greater than 90%, 95%, 99%, 99.9%, 99.99%, or any value between the foregoing values, but is not limited thereto. Therefore, when the light-blocking component 400 has a high absorption rate, it can absorb light.

[0085] In some embodiments, the light-blocking component 400 may be formed on the optical sensing component 200u by an attachment process, a coating process, a deposition process, other suitable processes, or a combination thereof. In some embodiments, the light-blocking component 400 itself may include an adhesive material to facilitate connection to other components of the electronic device, thereby shortening the process time and / or reducing process costs. In some embodiments, the light-blocking component 400 may further include an adhesive layer (not shown) and be connected to other components by means of the adhesive layer. In some embodiments, the adhesive layer may include a photocurable adhesive, a thermocurable adhesive, a photothermal curable adhesive, other suitable materials, or a combination thereof, but is not limited thereto. For example, in some embodiments, the adhesive layer may include an optically clear adhesive (OCA), an optically clear resin (OCR), a pressure-sensitive adhesive (PSA), other suitable materials, or a combination thereof, but is not limited thereto.

[0086] Reference Figure 1B This diagram illustrates an equivalent circuit diagram of the optical sensing component 200u of an optical sensing module according to some embodiments of the present disclosure. In some embodiments, the optical sensing component 200u may include a transistor and a diode. In some embodiments, the transistor in the optical sensing component 200u may be electrically connected to a signal line DL and a scan line SL. In some embodiments, the transistor in the optical sensing component 200u may be a thin-film transistor. In some embodiments, the thin-film transistor may include a top-gate thin-film transistor, a bottom-gate thin-film transistor, a dual-gate thin-film transistor, or a combination thereof, but is not limited thereto. In some embodiments, the thin-film transistor may include at least one semiconductor layer, a gate dielectric layer, and a gate electrode layer. In some embodiments, the material of the semiconductor layer may include amorphous silicon, polycrystalline silicon, or metal oxide, but is not limited thereto. In some embodiments, the diode may be a photodiode that converts an optical signal into an electrical signal.

[0087] For the sake of brevity, identical or similar descriptions will not be repeated below.

[0088] Reference Figure 2 This diagram shows a top view of the optical sensing module 10B according to some embodiments of the present disclosure. In some embodiments, the light-blocking component 400 may be a U-shaped structure. The U-shaped structure may have an opening through which the transmission line 210 and the bonding pad 220 are exposed. In some embodiments, the edge 400E of the light-blocking component 400 is further away from the transmission line 210 than the edge 200E of the optical sensing layer 200. In other embodiments, the edge 400E of the light-blocking component 400 is closer to the transmission line 210 than the edge 200E of the optical sensing layer 200.

[0089] Reference Figure 3 This diagram shows a top view of the optical sensing module 10C according to some embodiments of the present disclosure. In some embodiments, the light-blocking component 400 may be an aperture-shaped structure, which surrounds the sensing region SA. In some embodiments, the aperture-shaped structure has an opening 401 through which the non-overlapping portion 200B of the optical sensing layer 200 is exposed. In some embodiments, the overlapping portion 200A of the optical sensing layer 200 is aperture-shaped. In some embodiments, the light-blocking component 400 is disposed on the transmission line 210. The light-blocking component 400 overlaps with the transmission line 210 in the normal direction of the substrate 100.

[0090] In the following Figures 4 to 9 The following diagram shows cross-sectional views of electronic devices 1 to 6 according to some embodiments of the present disclosure. In some embodiments, electronic devices 1, 2, 3, 4, 5, or 6 may include the aforementioned optical sensing modules 10A, 10B, or 10C, or combinations thereof, but are not limited thereto. Hereinafter, according to any combination of the foregoing embodiments, optical sensing modules 10D included in electronic device 1, 10E included in electronic device 2, 10F included in electronic device 3, 10G included in electronic device 4, 10H included in electronic device 5, and 10I included in electronic device 6 are shown.

[0091] Reference Figure 4 The diagram shows a cross-sectional view of electronic device 1 according to some embodiments of the present disclosure.

[0092] like Figure 4As shown, the electronic device 1 may include an optical sensing module 10D. In some embodiments, the optical sensing module 10D may further include a flexible circuit board 600 and a bonding pad 610 of the flexible circuit board 600. In some embodiments, the flexible circuit board 600 is electrically connected to the bonding pad 220. Specifically, the flexible circuit board 600 is electrically connected to the bonding pad 220 on the substrate 100 via the bonding pad 610 and the connector 230. In some embodiments, a portion of the flexible circuit board 600 is disposed on a non-sensing area PA of the substrate 100. In some embodiments, since the connector 230 can bond the bonding pad 220 and the bonding pad 610, the side edge of the bonding pad 610 and the side edge of the connector 230 can be spaced apart by a first distance d1, which can reduce the absorption of moisture by the connector 230 due to exposure to air, thereby affecting the signal transmission function. In some embodiments, the light-blocking component 400, the bonding pad 220, the connector 230, and the bonding pad 610 form an air gap.

[0093] In some embodiments, the flexible circuit board 600 may be a flexible printed circuit board (FPC) or a chip-on-film (COF) circuit board. In some embodiments, the connector 230 may be anisotropic conductive film (ACF).

[0094] In some embodiments, a flexible circuit board 600 may be first laminated onto a substrate 100, thereby electrically connecting the flexible circuit board 600 to the optical sensing layer 200. Next, a light-blocking component 400 is formed on the substrate 100, allowing the light-blocking component 400 to be disposed around and / or above the flexible circuit board 600. In this embodiment, since the flexible circuit board 600 is already laminated onto the substrate 100, the light-blocking efficiency is improved after the light-blocking component 400 is formed. In other embodiments, the light-blocking component 400 may be formed on the substrate 100 first, and then the flexible circuit board 600 and the optical sensing layer 200 may be electrically connected to each other by laminating bonding pads 220 and 610, thereby reducing the risk of damage to the flexible circuit board 600 during the process of forming the light-blocking component 400.

[0095] In some embodiments, the light-blocking component 400 overlaps with the flexible circuit board 600 in the normal direction (Z direction) of the substrate 100. The light-blocking component 400 is located between the flexible circuit board 600 and the substrate 100. In some embodiments, the light-blocking component 400 does not overlap with the flexible circuit board 600 in the normal direction of the substrate 100. The light-blocking component 400 may contact the flexible circuit board 600. In some embodiments, one edge of the light-blocking component 400 may be substantially flush with one end of the transmission line 210.

[0096] like Figure 4 As shown, in some embodiments, when viewed in cross-sectional view, the light-blocking component 400 may include a light-blocking portion 400A and a light-blocking portion 400B. The light-blocking portions 400A and 400B may be substantially continuous or substantially independent. In some embodiments, the light-blocking portion 400A has a first width w1 and the light-blocking portion 400B has a second width w2. In some embodiments, the first width w1 may be greater than or less than the second width w2, but is not limited thereto. In some embodiments, since the light-blocking component 400 may have a larger width, the light-blocking effect can be improved and / or better support can be provided for the display device. In some embodiments, the second width w2 of the light-blocking portion 400B is greater than the first width w1 of the light-blocking portion 400A, thus reducing the possibility that the internal circuit structure (not shown) may be affected by the second light L2, or that forming the light-blocking portion 400B first can disperse the pressure on the transmission line 210 during the lamination process, reducing the possibility of damage to the transmission line 210.

[0097] like Figure 4 As shown, a flexible circuit board 600 may be disposed on a light-blocking portion 400B. The light-blocking portion 400B is disposed between the flexible circuit board 600 and the optical sensing layer 200 to block a second ray of light L2, such as noise light, from incident on the optical sensing layer 200. In some embodiments, the light-blocking portion 400B has a protruding portion extending toward the flexible circuit board 600.

[0098] In some embodiments, combined Figure 2 and Figure 4 In the case where the light-blocking assembly 400 has a U-shaped structure exposing the transmission line 210 and the bonding pad 220, for example, where the light-blocking portion 400A is shown in the cross-sectional view but the light-blocking portion 400B is absent, the flexible circuit board 600 can be disposed on the transmission line 210 and the bonding pad 220 to block a portion of the second light ray L2, and to block the remaining portion of the second light ray L2 by means of the flexible circuit board 600 and the light-blocking portion 400A. In other words, the light-blocking assembly 400 and the flexible circuit board 600 can block the second light ray L2 individually or together. In some embodiments, since the flexible circuit board 600 has a thickness in the Z direction, a portion of the second light ray L2 can be blocked by means of the flexible circuit board 600.

[0099] like Figure 4As shown, in some embodiments, the optical sensing module 10D may further include an optical component 300. In some embodiments, the optical component 300 may include a light collimation structure 310 and a microlens 320 disposed on the light collimation structure 310. In some embodiments, the light collimation structure 310 may be located between the optical sensing layer 200 and the microlens 320. In some embodiments, the light collimation structure 310 may include a conductive layer, a dielectric layer, a light-blocking layer such as a black matrix, a transmissive layer, other suitable layers, or combinations thereof, but is not limited thereto. In some embodiments, a light-blocking component 400 is disposed on the optical component 300, and the optical component 300 is located between the light-blocking component 400 and the optical sensing layer 200.

[0100] In some embodiments, the light collimation structure 310 may include a conductive layer and a plurality of light-blocking layers sequentially disposed on the optical sensing layer 200. In some embodiments, the conductive layer may be electrically connected to the optical sensing layer 200. In some embodiments, each of the plurality of light-blocking layers has an opening of a different size, and the openings in each light-blocking layer overlap in the normal direction (Z direction) of the substrate 100, and the size of the opening gradually decreases toward the substrate 100 (along a direction opposite to the Z direction) to achieve the effect of light collimation. The light-blocking layers may absorb light reflected by the conductive layer or light reflected back and forth between the conductive layers to achieve the effect of anti-reflection or reduction of optical noise. The light-blocking layers may also block light at large angles to achieve the effect of reducing the signal-to-noise ratio (SNR). A functional layer such as a dielectric layer or a planarization layer may be disposed between the conductive layer and the plurality of light-blocking layers. In some embodiments, the microlens 320 overlaps with the opening in the light-blocking layer in the normal direction of the substrate 100, and the microlens 320 helps to focus light on a specific area (e.g., the optical sensing component 200u of the optical sensing layer 200). In some embodiments, a portion of the optical sensing component 200u is disposed in the portion illuminated by the light collected by the microlens 320, while another portion of the optical sensing component 200u is shielded by the light-blocking component 400. This reduces the influence of stray capacitance on the photocurrent of the optical sensing component 200u, thereby improving the sensitivity of the optical sensing component or enhancing the overall performance of the optical sensing module.

[0101] In some embodiments, a plurality of microlenses 320 are provided, and each of the plurality of microlenses 320 corresponds to an optical sensing component 200u. In other embodiments, a portion of the optical sensing components 200u are not provided with the optical collimation structure 310 and the microlenses 320. Specifically, the optical sensing components 200u disposed in the overlapping portion 200A of the optical sensing layer 200 are not provided with the optical collimation structure 310 and the microlenses 320 to reduce manufacturing costs (see below). Figure 5 ).

[0102] like Figure 4 As shown, in some embodiments, the display device may include a display panel 500. In some embodiments, the display panel 500 may include, for example, a liquid crystal display panel, a light-emitting diode display panel, such as an inorganic light-emitting diode display panel, an organic light-emitting diode display panel, a sub-millimeter light-emitting diode display panel, a micro light-emitting diode display panel, or a quantum dot light-emitting diode display panel, but is not limited thereto.

[0103] In some embodiments, the optical sensing module 10D may be disposed below the display panel 500. In some embodiments, the optical sensing module 10D may be fixed below the display panel 500 by an adhesive layer (not shown). In some embodiments, the adhesive layer may include a photocurable adhesive, a thermocurable adhesive, a photothermal curable adhesive, other suitable materials, or combinations thereof, but is not limited thereto. For example, in some embodiments, the adhesive layer may include an optically transparent adhesive, an optically transparent resin, a pressure-sensitive adhesive, other suitable materials, or combinations thereof, but is not limited thereto. In some embodiments, as described above, since the light-blocking component 400 may include an adhesive material, the display panel 500 and the optical sensing module 10D can be connected via the light-blocking component 400 in the optical sensing module 10D.

[0104] like Figure 4 As shown, in some embodiments, the light L0 emitted by the display panel 500 is reflected by the fingerprint F on the finger to generate reflected light, and the optical sensing module 10D receives at least a portion of the reflected light as a first light ray L1. The first light ray L1 can be incident on the optical sensing module 10D, so that the optical sensing module 10D senses the touch of the finger, thereby converting the light signal into an electrical signal for the corresponding processor to identify and analyze.

[0105] In some embodiments, the second ray L2 may include light illuminating outside the sensing area SA. The second ray L2 may include external light, ambient light, noise light, or other light that is not intended to be sensed. In some embodiments, the light-blocking component 400 may block the second ray L2 from entering the optical sensing module 10D. Specifically, the light-blocking component 400 blocks reflected or diffracted light generated after the second ray L2 illuminates the substrate 100 or the stacked structure on the substrate 100 from entering the sensing area SA. The second ray L2 may interfere with the optical sensing layer 200, causing subsequent imaging degradation. Therefore, this disclosure reduces the possibility of the second ray L2 directly or indirectly interfering with the optical sensing layer 200 by providing the light-blocking component 400, thereby improving the accuracy of the optical sensing module 10D.

[0106] In some embodiments, the optical sensing module 10D may receive all the reflected light generated by the display panel 500 as the first ray L1. In other embodiments, the optical sensing module 10D receives a portion of the reflected light as the first ray L1, and the light not received by the optical sensing module 10D may become part of the second ray L2. In other words, because the light not received by the optical sensing module 10D may generate noise by reflecting on the substrate 100 or by reflecting back and forth and / or diffracting between the stacked structures on the substrate 100, the light reflected from the display panel 500 after illuminating a finger outside the sensing area SA is also considered noise light. Even when there is no external light when using the electronic device 1, the second ray L2 that is not intended to be sensed may still be generated by the light L0 emitted by the display panel 500.

[0107] In some embodiments, since the optical sensing module 10D is disposed below the display panel 500, a cavity 410 may be provided between the optical sensing module 10D and the display panel 500. In some embodiments, the light-blocking component 400, the optical component 300, and the display panel 500 may form a cavity 410. In some embodiments, the cavity 410 may be filled with an organic material. In some embodiments, the cavity 410 may be an air gap. The gas in the cavity 410 may be air, an inert gas, other suitable gases, or a combination thereof.

[0108] For the sake of brevity, identical or similar descriptions will not be repeated below.

[0109] Reference Figure 5 The diagram shows a cross-sectional view of the electronic device 2 according to some embodiments of the present disclosure. In some embodiments, in the optical sensing module 10E, the optical sensing layer 200 overlapping with the light-blocking component 400 is not provided with an optical component 300. In some embodiments, there is a distance between the edge 200E of the optical sensing layer 200 and the edge 300E of the optical component 300, thereby simplifying the process of forming the optical component 300 on the optical sensing layer 200 and / or reducing the process cost.

[0110] like Figure 5 As shown, in some embodiments, one side edge of the bonding pad 610 and one side edge of the flexible circuit board 600 have a second distance d2, reducing the possibility of damage to the bonding pad 610 of the flexible circuit board 600 during the cutting process. In some embodiments, the light-blocking assembly 400, transmission line 210, bonding pad 220, flexible circuit board 600 and connector 230 have an air gap.

[0111] Reference Figure 6The diagram shows a cross-sectional view of the electronic device 3 according to some embodiments of the present disclosure. In some embodiments, the optical sensing module 10F may further include a light-absorbing component 110. In some embodiments, the light-absorbing component 110 is disposed on a substrate 100, and the substrate 100 is located between the optical sensing layer 200 and the light-absorbing component 110. In some embodiments, the light-absorbing component 110 has an absorption rate of more than 80% for light. For example, the absorption rate of the light-absorbing component 110 is greater than 90%, 95%, 99%, 99.9%, 99.99%, or any value between the foregoing values, but is not limited thereto. In some embodiments, the light-absorbing component 110 may block the second light ray L2 that is reflected or diffracted between the components. Therefore, the light-absorbing component 110 may further improve the accuracy and / or imaging quality of the optical sensing layer 200.

[0112] In some embodiments, the flexible circuit board 600 and the light-blocking component 400 have a third spacing d3. The third spacing d3 may be larger than the first spacing d1 and the second spacing d2. This allows the flexible circuit board 600 to have greater process variability during the bonding process.

[0113] In some embodiments, the electronic device 3 may further include a support member 800. The display panel 500 is disposed on one side of the substrate 100, and the support member 800 is disposed on the other side of the substrate 100, providing support for the optical sensing module 10F. In some embodiments, the electronic device 3 may further include a buffer member 700. The buffer member 700 is disposed on the support member 800, and the buffer member 700 may be located between the substrate 100 and the support member 800. In some embodiments, the buffer member 700 is in direct contact with the substrate 100 to reduce the overall thickness of the electronic device 3. The buffer member 700 and the support member 800 are disposed on the same side of the substrate 100. In some embodiments, the optical sensing module 10F and the support member 800 are connected by the buffer member 700 to fix the relative position of the optical sensing module 10F in the electronic device. In some embodiments, the optical sensing module 10F is disposed on one side of the display panel 500, and the buffer member 700 is also disposed on the aforementioned side of the display panel 500.

[0114] In some embodiments, the buffer 700 may include a material capable of absorbing impact or having elasticity. In some embodiments, the buffer 700 may include a cushion. In some embodiments, the buffer 700 itself may include an adhesive material to facilitate connection with the optical sensing module 10F and the support 800. In some embodiments, the buffer 700 may further include an adhesive layer (not shown) and be connected to other components via the adhesive layer. In some embodiments, the adhesive layer may include, but is not limited to, a photocurable adhesive, a thermocurable adhesive, a photothermal curable adhesive, other suitable materials, or combinations thereof. In some embodiments, the support 800 may include a material with supporting force. In some embodiments, the support 800 may be a mid-frame.

[0115] like Figure 6 As shown, in some embodiments, the optical sensing module 10F can be connected to the display panel 500 first, and then connected to the buffer 700 and the support 800. This can improve the process margin for connection to the buffer 700 and the support 800.

[0116] Reference Figure 7 The diagram shows a cross-sectional view of electronic device 4 according to some embodiments of the present disclosure.

[0117] In some embodiments, the optical sensing module 10G can be connected to the buffer 700 and the support 800 first, and then connected to the display panel 500. Therefore, the process margin for the connection with the display panel 500 can be improved.

[0118] Reference Figure 8 The diagram shows a cross-sectional view of electronic device 5 according to some embodiments of the present disclosure.

[0119] In some embodiments, in the optical sensing module 10H, the light-blocking component 400 may be disposed on the flexible circuit board 600, and the flexible circuit board 600 is disposed between the light-blocking component 400 and the substrate 100. In some embodiments, the light-blocking component 400 is in direct contact with the bonding pad 220, the connector 230, the flexible circuit board 600, and the bonding pad 610.

[0120] like Figure 8 As shown, in some embodiments, the inner surface of the light-blocking component 400 adjacent to the optical sensing layer 200 has a non-linear side surface 400S. For example, the light-blocking component 400 may have a stepped, inclined, or curved side surface 400S. In some embodiments, the light-blocking component 400 may have a stepped side surface 400S with a step height that gradually decreases toward the optical sensing layer 200. In some embodiments, because the light-blocking component 400 has a stepped side surface 400S, the probability of total internal reflection of the second ray L2 can be reduced, thereby improving the accuracy of the optical sensing layer 200.

[0121] Reference Figure 9 The diagram shows a cross-sectional view of the electronic device 6 according to some embodiments of the present disclosure. In some embodiments, in the optical sensing module 10I, the top surface of the light-blocking component 400 is substantially flush with the top surface of the flexible circuit board 600. In some embodiments, the light-blocking component 400 may have a tilted side surface 400S', thereby reducing the probability of total internal reflection of the second light ray L2, thereby improving the accuracy of the optical sensing layer 200. In some embodiments, the angle α1 between the tilted side surface 400S of the light-blocking component 400 and the substrate 100 may be between 45 degrees and 80 degrees. For example, the angle α1 may be 50 degrees, 55 degrees, 60 degrees, 65 degrees, 70 degrees, 75 degrees, or any value between the aforementioned values.

[0122] Reference Figure 10 The diagram shows a block diagram of signal processing for electronic device 1 according to some embodiments of the present disclosure. It should be noted that the block diagram of signal processing is described using electronic device 1, which includes optical sensing module 10A, as an example, but is not limited thereto.

[0123] like Figure 10 As shown, in some embodiments, the optical sensing component 200u in the overlapping portion 200A of the optical sensing layer 200 that overlaps with the light-blocking component in the normal direction of the substrate provides a first signal Sig1. In some embodiments, the optical sensing component 200u in the non-overlapping portion 200B of the optical sensing layer 200 that does not overlap with the light-blocking component in the normal direction of the substrate provides a second signal Sig2. The first signal Sig1 and the second signal Sig2 are transmitted to the flexible circuit board 600 and to the processor 620 electrically connected to the flexible circuit board 600. Therefore, the processor 620 can obtain an optical signal by analyzing the first signal Sig1 and the second signal Sig2. For example, the first signal Sig1 is a dark state signal, and the second signal Sig2 is the sum of the dark state signal and the optical signal. Therefore, the processor 620 subtracts the first signal Sig1 from the second signal Sig2 to obtain the optical signal. In other words, the processor 620 can correct the signal.

[0124] In summary, according to the embodiments of this disclosure, an optical sensing module and an electronic device are provided. By incorporating a light-blocking component, interference from a second light source (e.g., ambient light) can be reduced in the optical sensing component, thereby improving the accuracy of sensing the first light source or the reliability of the electronic device. For example, this can reduce the probability of misjudgment when the optical sensing module and / or electronic device are used for fingerprint recognition.

[0125] While the embodiments and advantages of this disclosure have been disclosed above, it should be understood that any person skilled in the art can make modifications, substitutions, and refinements without departing from the spirit and scope of this disclosure. Features between embodiments of this disclosure can be freely combined and used as long as they do not violate the spirit of the invention or conflict with it. Furthermore, the scope of protection of this disclosure is not limited to the processes, machines, manufacturing, material composition, apparatus, methods, and steps described in the specific embodiments of the specification. Any person skilled in the art can understand from the disclosure of this disclosure that current or future developed processes, machines, manufacturing, material composition, apparatus, methods, and steps can be used according to this disclosure as long as they can perform substantially the same function or obtain substantially the same results in the embodiments described herein. Therefore, the scope of protection of this disclosure includes the aforementioned processes, machines, manufacturing, material composition, apparatus, methods, and steps. The scope of protection of this disclosure shall be determined by the scope of the claims. No embodiment or claim of this disclosure needs to achieve all the purposes, advantages, and / or features disclosed in this disclosure.

[0126] Several embodiments have been summarized above to enable those skilled in the art to better understand the viewpoints of the embodiments described herein. Those skilled in the art should understand that they can design or modify other processes and structures based on the embodiments described herein to achieve the same purpose and / or advantages as the embodiments described herein. Those skilled in the art should also understand that such equivalent processes and structures do not depart from the spirit and scope of this disclosure, and that they can make various changes, substitutions, and replacements without departing from the spirit and scope of this disclosure.

Claims

1. An optical sensing module, characterized in that, include: A substrate having a sensing area and a non-sensing area located around the sensing area; Multiple optical sensing components are disposed on the sensing area; as well as A light-blocking component is disposed on the non-sensing area and a portion of the sensing area; The light-blocking component overlaps a portion of the plurality of optical sensing components in the normal direction of the substrate, and the light-blocking component has a non-linear side surface.

2. The optical sensing module as described in claim 1, characterized in that, The light-blocking component has a ring structure, and the ring structure forms an opening to expose another portion of the plurality of optical sensing components.

3. The optical sensing module as described in claim 1, characterized in that, Including: Multiple bonding pads and multiple transmission lines are disposed in the non-sensing area, and the multiple bonding pads are electrically connected to the multiple optical sensing components through the multiple transmission lines, and the light-blocking component is not disposed on the multiple transmission lines.

4. The optical sensing module as described in claim 1, characterized in that, Including: Multiple bonding pads and multiple transmission lines are disposed in the non-sensing area, and the multiple bonding pads are electrically connected to the multiple optical sensing components through the multiple transmission lines, and the light-blocking component is disposed on the multiple transmission lines.

5. The optical sensing module as described in claim 1, characterized in that, Including: A flexible circuit board is electrically connected to the plurality of bonding pads, and a portion of the light-blocking assembly is disposed on the flexible circuit board.

6. The optical sensing module as described in claim 1, characterized in that, Including: A flexible circuit board is electrically connected to the plurality of bonding pads, and a portion of the flexible circuit board is disposed on the light-blocking assembly.

7. The optical sensing module as described in claim 1, characterized in that, Including: A light-absorbing component is disposed on the substrate, and the substrate is disposed between the plurality of optical sensing components and the light-absorbing component.

8. An electronic device, characterized in that, include: A display panel; as well as An optical sensing module is disposed on one side of the display panel and includes: A substrate having a sensing area and a non-sensing area located around the sensing area; Multiple optical sensing components are disposed on the sensing area; and A light-blocking component is disposed on the non-sensing area and a portion of the sensing area; The light-blocking component overlaps a portion of the plurality of optical sensing components in the normal direction of the substrate, and the light-blocking component has a non-linear side surface.

9. The electronic device as claimed in claim 8, characterized in that, Including: A buffer element is disposed on one side of the display panel; as well as A support member is disposed on the buffer member, and the buffer member is located between the substrate and the support member.

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