Millimeter wave antenna device and module comprising such a device
By introducing an artificial dielectric structure into the millimeter-wave antenna module and combining it with the antenna array, the problem of limited space in mobile electronic devices is solved, multi-surface beam coverage and dual polarization are achieved, and the directivity and assembly efficiency of the antenna are improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2020-11-24
- Publication Date
- 2026-04-07
AI Technical Summary
In mobile electronic devices, the integration of millimeter-wave antenna modules faces the challenge of limited space, especially in achieving multi-surface beam coverage and dual polarization.
By combining an artificial dielectric structure with an antenna array, and by superimposing periodic conductor patterns of conductor layers on the dielectric layer, an antenna device with a high dielectric constant is formed, which simplifies the interface between the antenna array and the dielectric structure and achieves compact multi-surface beam coverage.
It achieves multi-surface beam coverage and dual polarization within a limited space, improving the antenna's directivity and flexibility, and simplifying the assembly process.
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Figure CN116547868B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present invention relates to a millimeter wave antenna device comprising an antenna array and an artificial dielectric structure. BACKGROUND
[0002] Electronic devices need to support an increasing number of cellular radio technologies, such as 2G / 3G / 4G radios, as well as non-cellular radio technologies. In the upcoming 5G New Radio technology, the frequency range used will be extended from sub-6 GHz frequencies to millimeter-wave (mmWave) frequencies, i.e. above 20 GHz. For mmWave frequencies, antenna arrays will be used to form radiated beams with higher gain to overcome the higher path loss in the propagation medium. However, the higher gain radiated beam pattern results in a narrower beam width, and therefore beam steering techniques, such as phased antenna arrays, are used to direct the beam to a specific direction on demand.
[0003] Mobile electronic devices, such as smartphones and tablets, can be used in any orientation. Therefore, such devices need to exhibit as close to global spherical beam coverage as possible, resulting in the necessity to implement dual polarization in order to achieve stable communication in all directions and azimuths.
[0004] Typically, millimeter wave antennas are implemented in modules, which in turn are fixed to the main printed circuit board (PCB) of the device. The PCB can comprise an antenna array, where the main radiated beam direction is the broadside direction, i.e. perpendicular to the display of the device. The PCB can also be configured such that the main radiated beam direction is the endfire direction, i.e. parallel to the display of the device.
[0005] Due to the necessity to implement several modules in order to achieve good multi-surface spherical beam coverage that can meet the demand, while at the same time including both broadside and endfire antenna directivity, the available space is limited, making it challenging to integrate these modules into a mobile device. SUMMARY
[0006] It is an object of the present invention to provide an improved millimeter wave antenna device. The above mentioned and other objects are achieved by the features of the independent claims. Other implementation forms are evident from the dependent claims, the description and the figures.
[0007] According to a first aspect, there is provided a millimeter wave antenna device comprising at least one first antenna array comprising a plurality of antenna elements and a meta-dielectric structure superimposed on the first antenna array. The meta-dielectric structure comprises a plurality of conductor layers separated by dielectric layers, each conductor layer comprising a plurality of periodically repeated conductor patterns, one conductor pattern of each conductor layer being associated with one of the antenna elements, the conductor patterns associated with one antenna element being at least partly different.
[0008] This configuration provides a way of achieving multi-surface beam coverage while maintaining a compact footprint. The antenna device using a meta-dielectric structure instead of a natural dielectric material is reliable and stable and has good performance characteristics due to the surface shape of the antenna array, so that the physical interface between the antenna array and the dielectric structure does not need to be considered when assembling. For example, there is no need for a step of assembling virtual antenna patches to achieve a flat antenna array surface. Furthermore, the conductor patterns can be designed such that the meta-dielectric structure obtains a high dielectric constant while still maintaining a relatively low height. With a high meta-dielectric constant, the size of the antenna array can be made smaller while improving the directivity of the array. Furthermore, this facilitates the implementation of an anisotropic meta-dielectric structure, e.g. with different meta-dielectric constants for different polarizations and / or different regions.
[0009] In a possible implementation form of the first aspect, the antenna elements are patch antennas.
[0010] In another possible implementation form of the first aspect, the first antenna array and the meta-dielectric structure extend in parallel planes, one antenna element and one conductor pattern of at least one conductor layer forming an antenna column in a direction perpendicular to the planes.
[0011] In another possible implementation form of the first aspect, the conductor patterns within one conductor layer are identical.
[0012] In another possible implementation form of the first aspect, each conductor pattern comprises a plurality of conductor patches, and the conductor patterns are arranged such that one conductor pattern of one conductor layer is superimposed with one antenna element and one corresponding conductor pattern of at least one further conductor layer.
[0013] In another possible implementation form of the first aspect, each conductor pattern is separated from an adjacent conductor pattern by a dielectric gap that is wider than a corresponding dielectric gap between adjacent conductor patches within a conductor pattern. This allows each antenna element to be coupled to a region with a high meta-dielectric constant while at the same time separating the antenna elements from each other.
[0014] In a further possible implementation form of the first aspect, the conductor patches of each conductor pattern are separated by dielectric gaps, thereby separating the conductor patterns from each other.
[0015] In a further possible implementation form of the first aspect, the conductor patches comprise copper.
[0016] In a further possible implementation form of the first aspect, the conductor patches of one conductor pattern are identical and non-identical in size and / or shape, which facilitates achieving isotropy and anisotropy in the overall artificial dielectric structure.
[0017] In a further possible implementation form of the first aspect, the conductor pattern comprises at least four conductor patches.
[0018] In a further possible implementation form of the first aspect, the conductor patches are rectangular and arranged in an m x n matrix pattern.
[0019] In a further possible implementation form of the first aspect, the artificial dielectric structure has an artificial permittivity and each dielectric layer has a natural permittivity, the artificial permittivity depending at least partly on the one or more natural permittivities. This facilitates achieving a more reliable dielectric structure than conventional dielectric materials, as the interface problem between the antenna array and the dielectric structure is eliminated.
[0020] In a further possible implementation form of the first aspect, the artificial permittivity further depends on the number of conductor layers, the distance between adjacent conductor layers, the size of the conductor patches and the size of the gaps between the conductor patches within one conductor pattern, which enables the artificial permittivity to be tuned in response to various properties.
[0021] In a further possible implementation form of the first aspect, the artificial permittivity has a value greater than the value of the natural permittivity, thereby achieving improved insulation performance.
[0022] In a further possible implementation form of the first aspect, the artificial permittivity has a value between 10 and 30, i.e. belongs to a relatively high permittivity.
[0023] In a further possible implementation form of the first aspect, the artificial dielectric structure is integrated with the first antenna array or is a standalone structure connected to the first antenna array.
[0024] In a further possible implementation form of the first aspect, each conductor pattern is coupled to at least one switch, the switch being configured to adjust the size and / or shape of the conductor pattern, which in turn can change the artificial permittivity.
[0025] In a further possible implementation form of the first aspect, the size and / or shape of the conductor pattern is controlled by switching on and off, thereby providing a simple and reliable method of tuning the artificial dielectric constant.
[0026] According to a second aspect, there is provided a millimeter wave antenna module, the module comprising a millimeter wave antenna device according to the above implementation forms and a substrate for at least accommodating the antenna device. The first antenna array of the antenna device is arranged between a portion of the substrate and the artificial dielectric structure of the antenna device. This configuration provides multi-surface beam coverage while keeping a compact footprint. The module can be designed flexibly to support single- or multi-surface beam coverage.
[0027] In a possible implementation form of the second aspect, the substrate comprises a first substrate section and a second substrate section, the first and second substrate sections are optionally interconnected by a third substrate section, the second substrate section extends at an angle to the first substrate section, the first antenna array is arranged on the first substrate section. The third substrate section can be made thinner than the first and second substrate sections so that it is easy to bend and also occupies as little space as possible within a device comprising the antenna module.
[0028] In a further possible implementation form of the second aspect, the first antenna array is integrated with the first substrate section and / or the third substrate section, or the first antenna array is a separate structure connected to the first substrate section and / or the third substrate section, thereby improving assembly tolerance and / or flexibility of the assembly process.
[0029] In a further possible implementation form of the second aspect, the millimeter wave antenna module further comprises at least one second antenna array, the second antenna array is arranged on the second substrate section. This way the antenna module comprises end-fire antenna elements and broadside antenna elements, thereby improving multi-surface beam coverage of the antenna module.
[0030] In a further possible implementation form of the second aspect, the millimeter wave antenna module further comprises a radio frequency integrated circuit, the radio frequency integrated circuit is optionally arranged on the second substrate section.
[0031] In a further possible implementation form of the second aspect, the second antenna array is arranged on a first side of the second substrate section, the radio frequency integrated circuit is arranged on a second side of the second substrate section, which facilitates a module footprint as small as possible.
[0032] In a further possible implementation form of the second aspect, the first substrate section and / or the third substrate section comprises a transmission line for transmitting at least one signal between the first antenna array and the radio frequency integrated circuit.
[0033] In a further possible implementation form of the second aspect, the substrate is a printed circuit board.
[0034] According to a third aspect, there is provided an apparatus comprising a millimeter wave antenna module according to the above implementation forms, a chassis and a housing at least partially enclosing the antenna module and the chassis. This can result in an apparatus with good multi-surface beam coverage and a compact footprint.
[0035] In a possible implementation form of the third aspect, the housing comprises at least a main surface and a peripheral surface extending along a periphery of the main surface and at an angle to the main surface, the first substrate section of the antenna module extends towards the adjacent peripheral surface, the artificial dielectric structure of the antenna module is located between the first antenna array of the antenna module and the peripheral surface, which makes efficient use of the available space within the apparatus.
[0036] In a further possible implementation form of the third aspect, the second substrate section of the antenna module extends at least partially parallel to the main surface, the second antenna array of the antenna module faces the main surface, and the radio frequency integrated circuit of the antenna module faces the interior of the housing. This allows for improved performance of the antenna module while protecting the relevant components.
[0037] In a further possible implementation form of the third aspect, the configuration of the size and / or shape of each individual conductor pattern associated with one antenna element of the antenna module depends on an adjacent structural component of the apparatus, optionally the housing and / or the chassis, which allows for taking into account properties of the structure forming the immediate environment of the antenna module.
[0038] In a further possible implementation form of the third aspect, the conductor patches of the conductor pattern arranged next to a dielectric structural component of the apparatus, optionally the back cover, have a first surface area size and / or shape.
[0039] The conductor patches of the conductor pattern arranged next to a conductive structural component of the apparatus, optionally the chassis, have a second surface area size and / or shape.
[0040] These and other aspects of the application are apparent from the examples described below. BRIEF DESCRIPTION OF DRAWINGS
[0041] In the following detailed portion of the application, aspects, embodiments and implementation forms will be explained in more detail with reference to the exemplary embodiments shown in the drawings, in which: 1. A millimeter wave antenna module comprising: 2. The millimeter wave antenna module according to claim 1, wherein the first substrate section and / or the third substrate section comprises a transmission line for transmitting at least one signal between the first antenna array and the radio frequency integrated circuit. 3. The millimeter wave antenna module according to claim 1 or 2, wherein the substrate is a printed circuit board. 4. The millimeter wave antenna module according to any of claims 1 to 3, wherein the first substrate section and / or the third substrate section comprises a transmission line for transmitting at least one signal between the first antenna array and the radio frequency integrated circuit. 5. The millimeter wave antenna module according to any of claims 1 to 4, wherein the substrate is a printed circuit board. 6. The millimeter wave antenna module according to any of claims 1 to 5, wherein the first substrate section and / or the third substrate section comprises a transmission line for transmitting at least one signal between the first antenna array and the radio frequency integrated circuit. 7. The millimeter wave antenna module according to any of claims 1 to 6, wherein the substrate is a printed circuit board. 8. The millimeter wave antenna module according to any of claims 1 to 7, wherein the first substrate section and / or the third substrate section comprises a transmission line for transmitting at least one signal between the first antenna array and the radio frequency integrated circuit. 9. The millimeter wave antenna module according to any of claims 1 to 8, wherein the substrate is a printed circuit board. 10. The millimeter wave antenna module according to any of claims 1 to 9, wherein the first substrate section and / or the third substrate section comprises a transmission line for transmitting at least one signal between the first antenna array and the radio frequency integrated circuit. 11. The millimeter wave antenna module according to any of claims 1 to 10, wherein the substrate is a printed circuit board. 12. The millimeter wave antenna module according to any of claims 1 to 11, wherein the first substrate section and / or the third substrate section comprises a transmission line for transmitting at least one signal between the first antenna array and the radio frequency integrated circuit. 13. The millimeter wave antenna module according to any of claims 1 to 12, wherein the substrate is a printed circuit board. 14. The millimeter wave antenna module according to any of claims 1 to 13, wherein the first substrate section and / or the third substrate section comprises a transmission line for transmitting at least one signal between the first antenna array and the radio frequency integrated circuit. 15. The millimeter wave antenna module according to any of claims 1 to 14, wherein the substrate is a printed circuit board. 16. The millimeter wave antenna module according to any of claims 1 to 15, wherein the first substrate section and / or the third substrate section comprises a transmission line for transmitting at least one signal between the first antenna array and the radio frequency integrated circuit. 17. The millimeter wave antenna module according to any of claims 1 to 16, wherein the substrate is a printed circuit board. 18. The millimeter wave antenna module according to any of claims 1 to 17, wherein the first substrate section and / or the third substrate section comprises a transmission line for transmitting at least one signal between the first antenna array and the radio frequency integrated circuit. 19. The millimeter wave antenna module according to any of claims 1 to 18, wherein the substrate is a printed circuit board. 20. The millimeter wave antenna module according to any of claims 1 to 19, wherein the first substrate section and / or the third substrate section comprises a transmission line for transmitting at least one signal between the first antenna array and the radio frequency integrated circuit. 21. The millimeter wave antenna module according to any of claims 1 to 20, wherein the substrate is a printed circuit board. 22. The millimeter wave antenna module according to any of claims 1 to 21, wherein the first substrate section and / or the third substrate section comprises a transmission line for transmitting at least one signal between the first antenna array and the radio frequency integrated circuit. 23. The millimeter wave antenna module according to any of claims 1 to 22, wherein the substrate is a printed circuit board. 24. The millimeter wave antenna module according to any of claims 1 to 23, wherein the first substrate section and / or the third substrate section comprises a transmission line for transmitting at least one signal between the first antenna array and the radio frequency integrated circuit. 25. The millimeter wave antenna module according to any of claims 1 to 24, wherein the substrate is a printed circuit board. 26. The millimeter wave antenna module according to any of claims 1 to 25, wherein the first substrate section and / or the third substrate section comprises a transmission line for transmitting at least one signal between the first antenna array and the radio frequency integrated circuit. 27. The millimeter wave antenna module according to any of claims 1 to 26, wherein the substrate is a printed circuit board. 28. The millimeter wave antenna module according to any of claims 1 to 27, wherein the first substrate section and / or the third substrate section comprises a transmission line for transmitting at least one signal between the first antenna array and the radio frequency integrated circuit. 29. The millimeter wave antenna module according to any of claims 1 to 28, wherein the substrate is a printed circuit board. 30. The millimeter wave antenna module according to any of claims 1 to 29, wherein the first substrate section and / or the third substrate section comprises a transmission line for transmitting at least one signal between the first antenna array and the radio frequency integrated circuit. 31. The millimeter wave antenna module according to any of claims 1 to 30, wherein the substrate is a printed circuit board. 32. The millimeter wave antenna module according to any of claims 1 to 31, wherein the first substrate section and / or the third substrate section comprises a transmission line for transmitting at least one signal between the first antenna array and the radio frequency integrated circuit. 33. The millimeter wave antenna module according to any of claims 1 to 32, wherein the substrate is a printed circuit board. 34. The millimeter wave antenna module according to any of claims 1 to 33, wherein the first substrate section and / or the third substrate section comprises a transmission line for transmitting at least one signal between the first antenna array and the radio frequency integrated circuit. 35. The millimeter wave antenna module according to any of claims 1 to 34, wherein the substrate is a printed circuit board. 36. The millimeter wave antenna module according to any of claims 1 to 35, wherein the first substrate section and / or the third substrate section comprises a transmission line for transmitting at least one signal between the first antenna array and the radio frequency integrated circuit. 37. The millimeter wave antenna module according to any of claims 1 to 36, wherein the substrate is a printed circuit board. 38. The millimeter wave antenna module according to any of claims 1 to
[0042] Figure 1 Image (a) shows a schematic side view of an artificial dielectric structure according to an embodiment of the present invention;
[0043] Figure 1 (b) shows a top view of different conductor layers of an artificial dielectric structure according to an embodiment of the present invention;
[0044] Figure 2 (a) to (e) show different conductor patterns of the conductor layer according to embodiments of the present invention;
[0045] Figure 3 A perspective view of a millimeter-wave antenna module according to an embodiment of the present invention is shown;
[0046] Figure 4 It shows Figure 3 Bottom view of an embodiment;
[0047] Figure 5 A top view of a millimeter-wave antenna module according to an embodiment of the present invention is shown;
[0048] Figure 6 A partial cross-sectional view of an apparatus including a millimeter-wave antenna module according to an embodiment of the present invention is shown;
[0049] Figure 7 A top view of a millimeter-wave antenna device according to an embodiment of the present invention is shown. Detailed Implementation
[0050] Figure 7 A millimeter-wave antenna device 1 is shown, comprising at least one first antenna array 2 and an artificial dielectric structure 3 superimposed on the first antenna array 2.
[0051] The first antenna array 2 includes multiple antenna elements 2a. The antenna elements 2a can be patch antennas.
[0052] like Figure 1 As shown in (a), the artificial dielectric structure 3 includes multiple conductor layers 4 separated by dielectric layers 5. The artificial dielectric structure 3 can be integrated with the first antenna array 2 (not shown) by means of welding or adhesives (such as tape or glue), or the artificial dielectric structure 3 can be a separate structure attached to the first antenna array 2, such as... Figure 6 and 7 As shown.
[0053] Each conductor layer 4 includes multiple periodically repeating conductor patterns 6, such as Figure 1 As shown in (b) above. One conductor pattern 6 of each conductor layer 4 is associated with one of the antenna elements 2a.
[0054] The first antenna array 2 and the artificial dielectric structure 3 can extend in parallel planes, one antenna element 2a and one conductor pattern 6 of at least one conductor layer 4 forming an antenna column in a direction perpendicular to the planes. In other words, the conductor patterns 6 can be arranged such that one conductor pattern 6 of one conductor layer 4 is superimposed with one antenna element 2a and one respective conductor pattern 6 of at least one further conductor layer 4. Figure 1 (b) in Fig. 1 shows a plurality of conductor layers 4 mutually stacked with the dielectric layer 5, each conductor layer 4 having four conductor patterns 6, i.e. four antenna columns can be formed.
[0055] As shown in (a) to (e) in Fig. 1, each conductor pattern 6 can comprise a plurality of conductor patches 6a. The conductor patterns 6 can consist of any suitable number or size of conductor patches 6a, but comprise only one conductor patch. Figure 2 (b) in Fig. 1 shows an antenna column seen from the top of the figure, the antenna column comprising a conductor pattern 6 having 12 conductor patches 6a, a conductor pattern 6 having 4 conductor patches 6a and a conductor pattern 6 having 6 conductor patches 6a. Figure 1 The conductor patterns 6 within each individual conductor layer 4 can be identical, however, at least one conductor layer 4 can comprise non-identical conductor patterns 6, as shown in (a) in Fig. 1, wherein the two rightmost conductor patterns 6 have slightly smaller surface area conductor patches 6a than the two leftmost conductor patterns 6. This makes the artificial dielectric structure 3 anisotropic with respect to the artificial permittivity, e.g. having different polarizations and / or different regions. Further, as shown in (b) in Fig. 1, the conductor patterns 6 associated with one antenna element 2a can be at least partially non-identical, i.e. have different shaped, sized and / or numbered conductor patches 6a.
[0056] Figure 2 The conductor patches 6a of each conductor pattern 6 can be separated by dielectric gaps, as shown in (b) in Fig. 1, (a) to (e) in Fig. 2 and Fig. 7. Accordingly, each conductor pattern 6 can be separated from an adjacent conductor pattern 6 by a dielectric gap that is wider than the respective dielectric gap between adjacent conductor patches 6a within the conductor pattern, as shown in (b) in Fig. 1 and Fig. 7. Figure 1 The conductor patches 6a of one conductor pattern 6 can be identically sized and / or shaped conductor patches 6a, as shown in (a), (d), (e) and (f) in Fig. 1, (a) to (e) in Fig. 2 and Fig. 7, or can be non-identical conductor patches 6a, as shown in (b) and (c) in Fig. 1.
[0057] Figure 1 The conductor patches 6a of one conductor pattern 6 can be identically sized and / or shaped conductor patches 6a, as shown in (a), (d), (e) and (f) in Fig. 1, (a) to (e) in Fig. 2 and Fig. 7, or can be non-identical conductor patches 6a, as shown in (b) and (c) in Fig. 1. Figure 1
[0058] The conductor patches 6a of one conductor pattern 6 can be identically sized and / or shaped conductor patches 6a, as shown in (a), (d), (e) and (f) in Fig. 1, (a) to (e) in Fig. 2 and Fig. 7, or can be non-identical conductor patches 6a, as shown in (b) and (c) in Fig. 1. Figure 2 Figure 7 The conductor patches 6a of one conductor pattern 6 can be identically sized and / or shaped conductor patches 6a, as shown in (a), (d), (e) and (f) in Fig. 1, (a) to (e) in Fig. 2 and Fig. 7, or can be non-identical conductor patches 6a, as shown in (b) and (c) in Fig. 1. Figure 2
[0059] The conductor pattern 6 can comprise at least four conductor patches 6a. The conductor patches 6a can be rectangular and arranged in an m x n matrix pattern, as shown in Figure 1 (b) in 2, (a) to (e) in 2 and 7. The conductor patches 6a can comprise a copper material.
[0060] The artificial dielectric structure 3 has an artificial dielectric constant, each dielectric layer 5 has a natural dielectric constant. The artificial dielectric constant depends at least partially on the natural dielectric constant. The artificial dielectric constant can also depend on the number of conductor layers 4, the distance between adjacent conductor layers 4, the size of the conductor patches 6a and the size of the gap between the conductor patches 6a within one conductor pattern 6. Preferably, the artificial dielectric constant has a value higher than the natural dielectric constant. The value of the artificial dielectric constant can be in the range between 10 and 30, preferably around 20.
[0061] Each conductor pattern 6 can be coupled to at least one switch 14, as shown in Figure 2 (c). The switches 14 are used to adjust the size and / or shape of the conductor patterns 6, which in turn changes the value of the artificial dielectric constant, so that the artificial dielectric constant can be tuned according to specific requirements. The size and / or shape of the conductor patterns 6 can be adjusted by switching the switches 14 on and off, for example by controlling a voltage to switch the switches 14 on and off.
[0062] Figures 3 to 5 A millimeter wave antenna module 7 comprising the above described millimeter wave antenna device 1 and a substrate 8 for at least accommodating the antenna device 1 is shown. The first antenna array 2 of the antenna device 1 is arranged between a portion of the substrate 8 and the artificial dielectric structure 3 of the antenna device 1, so that the artificial dielectric structure 3 is arranged on top of the first antenna array 2, i.e. the artificial dielectric structure 3 is arranged closer to the outside and the first antenna array 2 is arranged closer to the inside of the device comprising the antenna module 7. The substrate 8 can be a printed circuit board.
[0063] The substrate 8 can comprise a first substrate section 8a and a second substrate section 8b, as shown in Figures 3 to 5 . The first substrate section 8a and the second substrate section 8b can be interconnected by a third substrate section 8c, as shown in Figure 3 and 4 . For example, the second substrate section 8b extends at an angle of 90° to the first substrate section 8a, but can also be adjusted to any suitable angle.
[0064] The first antenna array 2 is arranged on the first substrate section 8a. The first antenna array 2 can be integrated into the first substrate section 8a and / or the third substrate section 8c (not shown). The first antenna array 2 can also be a separate structure connected to the first substrate section 8a, as shown in Figures 3 to 5 , and / or connected to the third substrate section 8c (not shown).
[0065] The mmWave antenna module 7 can further comprise at least one second antenna array 9 arranged on a second substrate section 8b, as shown in Figure 3 The antenna module 7 can be arranged such that the second substrate section 8b and the second antenna array 9 extend next to a back cover of the device 11 comprising the antenna module 7, as in the case of the embodiment shown in Figure 3 and 4 The antenna module 7 without the second antenna array 9 can be arranged such that the second substrate section 8b extends next to a display of the device 11 comprising the antenna module 7, as in the case of the embodiment shown in Figure 5 The antenna module 7 without the second antenna array 9 can be arranged such that the second substrate section 8b extends next to a display of the device 11 comprising the antenna module 7, as in the case of the embodiment shown in
[0066] The mmWave antenna module 7 can further comprise a radio frequency integrated circuit 10, which is optionally arranged on the second substrate section 8b, as shown in Figure 4 The first substrate section 8a and / or the third substrate section 8c can comprise transmission lines for transmitting at least one signal between the first antenna array 2 and the radio frequency integrated circuit 10. The transmission lines can be routed on the substrate 8 and connected to the radio frequency integrated circuit 10 by soldering or conductive tape or the like.
[0067] As shown in Figure 3 The second antenna array 9 can be arranged on a first side of the second substrate section 8b and the radio frequency integrated circuit 10 can be arranged on a second side of the second substrate section 8b.
[0068] The invention further relates to a device 11 comprising a mmWave antenna module 7 according to the above implementations, a chassis 13 and a housing 12 at least partially surrounding the antenna module 7, as shown in Figure 6 The housing 12 comprises at least a cover, e.g. a back cover, and a display.
[0069] The housing 12 can comprise at least a main surface 12a, e.g. a display side or a back cover side of the device, and a peripheral surface 12b extending along a periphery of the main surface 12a and at an angle to the main surface 12a, e.g. a side frame arranged between the back cover side and the display side of the device.
[0070] The antenna module 7 is arranged such that the first substrate section 8a of the antenna module 7 extends adjacent to the peripheral surface 12b with the artificial dielectric structure 3 of the antenna module 7 between the first antenna array 2 of the antenna module 7 and the peripheral surface 12b, which enables end-fire of the first antenna array 2.
[0071] The second substrate section 8b of the antenna module 7 can extend at least partially parallel to the main surface 12a, i.e. parallel to the display side and / or the back cover side, and either immediately adjacent to the main surface 12a or at a distance to the main surface 12a. If the second substrate section 8b is provided with the second antenna array 9, the second antenna array 9 is preferably arranged to face the main surface 12a. The radio frequency integrated circuit 10 of the antenna module 7 faces the interior of the housing 12, e.g. the chassis 13. Figure 3 and 4 The antenna module 7 shown in Fig. 1 would, if arranged as shown in Fig. 2, cause the second antenna array 9 to be arranged in the form of a back cover near the main surface 12a and cause the second antenna array 9 to radiate only in the direction of the back cover, i.e. to form a so-called broadside radiation. The radiation in the direction of the display would be blocked by the conductive display. Figure 6 The antenna module 7 shown in Fig. 1 would, if arranged as shown in Fig. 2, cause the second antenna array 9 to be arranged in the form of a back cover near the main surface 12a and cause the second antenna array 9 to radiate only in the direction of the back cover, i.e. to form a so-called broadside radiation. The radiation in the direction of the display would be blocked by the conductive display. Figure 5 The antenna module 7 shown in Fig. 1 would, if arranged as shown in Fig. 2, cause the second antenna array 9 to be arranged in the form of a back cover near the main surface 12a and cause the second antenna array 9 to radiate only in the direction of the back cover, i.e. to form a so-called broadside radiation. The radiation in the direction of the display would be blocked by the conductive display. Figure 6 The antenna module 7 shown in Fig. 1 would, if arranged as shown in Fig. 2, cause the second antenna array 9 to be arranged in the form of a back cover near the main surface 12a and cause the second antenna array 9 to radiate only in the direction of the back cover, i.e. to form a so-called broadside radiation. The radiation in the direction of the display would be blocked by the conductive display.
[0072] The configuration of the size and / or shape of each individual conductor pattern 6 associated with one particular antenna element 2a depends on the properties of any adjacent structural components of the device 11, e.g. the housing 12 and / or the chassis 13. The conductor patches 6a of the conductor pattern arranged immediately adjacent to a dielectric structural component of the device, e.g. a back cover made of glass or plastic, can have a first surface area size and / or shape. Correspondingly, the conductor patches 6a of the conductor pattern arranged immediately adjacent to a conductive structural component of the device, e.g. a chassis made of steel or aluminum, can have a second surface area size and / or shape. The first surface area can be larger than the second surface area or vice versa.
[0073] Various aspects and implementations have been described herein in conjunction with various embodiments. However, other variations than those described are possible and within the scope of the claimed subject matter. In the claims, the word "comprising" does not exclude other elements or steps, and the words "a" or "an" do not exclude a plurality. In the claims, means-plus-function clauses are intended to cover the structures described herein as performing the recited function and not only structural equivalents. In the claims, the term "consisting of" is intended to mean the listed items "and nothing else". In the claims, the term "consisting essentially of" means the listed items and other items that affect the basic and novel characteristics of the claimed subject matter. In the claims, the term "comprising" is intended to mean "including at least the recited elements or steps, and not excluding other elements or steps."
[0074] The use of reference signs in the claims should not be construed as limiting the scope. The drawings (e.g., cross-shading, component placement, scale, degrees, etc.) should be read in conjunction with the specification, and should be considered a part of the entire written description of the application. As used in the description, the terms “horizontal,” “vertical,” “left,” “right,” “up,” and “down,” and their adjective and adverbial derivatives (e.g., “horizontally,” “rightwardly,” “upwardly,” etc.) refer to the orientation of the illustrated structure as the particular drawing figure faces the reader. Similarly, the terms “inwardly” and “outwardly” generally refer to the orientation of a surface relative to its normal axis of elongation, or rotation, as the context dictates.
Claims
1. A millimeter-wave antenna device (1), characterized in that, include: At least one first antenna array (2), the first antenna array (2) comprising a plurality of antenna elements (2a); An artificial dielectric structure (3) superimposed on the first antenna array (2); The artificial dielectric structure (3) includes multiple conductor layers (4) separated by dielectric layers (5). Each conductor layer (4) includes a plurality of periodically repeating conductor patterns (6), one conductor pattern (6) of each conductor layer (4) is associated with one of the antenna elements (2a), and at least one conductor pattern (6) of a conductor layer (4) is superimposed on an antenna element (2a); The conductor patterns (6) associated with an antenna element (2a) are at least partially different; The artificial dielectric structure (3) has an artificial dielectric constant, and each dielectric layer (5) has a natural dielectric constant, wherein the artificial dielectric constant is at least partially dependent on the one or more natural dielectric constants; Each conductor pattern (6) is coupled to at least one switch (14) for adjusting the size and / or shape of the conductor pattern (6), and the change in the conductor pattern (6) in turn can change the artificial dielectric constant.
2. The millimeter-wave antenna device (1) according to claim 1, characterized in that, Each conductor pattern (6) includes multiple conductor patches (6a). The conductor pattern (6) is arranged such that a conductor pattern (6) of a conductor layer (4) is superimposed on a corresponding conductor pattern (6) of an antenna element (2a) and at least one other conductor layer (4).
3. The millimeter-wave antenna device (1) according to claim 2, characterized in that, The artificial dielectric constant also depends on the number of conductor layers (4), the distance between adjacent conductor layers (4), the size of the conductor patch (6a), and the size of the gap between conductor patches (6a) within a conductor pattern.
4. The millimeter-wave antenna device (1) according to claim 3, characterized in that, The value of the artificial dielectric constant is greater than the value of the natural dielectric constant.
5. A millimeter-wave antenna module (7), characterized in that, include: Millimeter-wave antenna device (1) according to any one of claims 1 to 4; A substrate (8) for at least accommodating the antenna device (1); The first antenna array (2) of the antenna device (1) is arranged between a portion of the substrate (8) and the artificial dielectric structure (3) of the antenna device (1).
6. The millimeter-wave antenna module (7) according to claim 5, characterized in that, The substrate (8) includes a first substrate segment (8a) and a second substrate segment (8b). The first substrate segment (8a) and the second substrate segment (8b) are interconnected through the third substrate segment (8c). The second substrate segment (8b) extends toward the first substrate segment (8a) at a certain angle, and the first antenna array (2) is arranged on the first substrate segment (8a).
7. The millimeter-wave antenna module (7) according to claim 6, characterized in that, The millimeter-wave antenna module (7) further includes at least one second antenna array (9), which is arranged on the second substrate segment (8b).
8. The millimeter-wave antenna module (7) according to claim 6 or 7, characterized in that, The millimeter-wave antenna module (7) also includes a radio frequency integrated circuit (10), which is disposed on the second substrate segment (8b).
9. The millimeter-wave antenna module (7) according to claim 8, characterized in that, The millimeter-wave antenna module (7) further includes at least one second antenna array (9), which is arranged on a first side of the second substrate segment (8b), and the radio frequency integrated circuit (10) is arranged on a second side of the second substrate segment (8b).
10. The millimeter-wave antenna module (7) according to claim 8, characterized in that, The first substrate segment (8a) and / or the third substrate segment (8c) include a transmission line for transmitting at least one signal between the first antenna array (2) and the radio frequency integrated circuit (10).
11. The millimeter-wave antenna module (7) according to any one of claims 5 to 7, characterized in that, The substrate (8) is a printed circuit board.
12. An apparatus (11), characterized in that, The device includes a millimeter-wave antenna device (1) according to any one of claims 1 to 4, or a millimeter-wave antenna module (7) according to any one of claims 5 to 11, a chassis (13) and a housing (12) that at least partially surrounds the antenna module (7) and the chassis (13).
13. The apparatus (11) according to claim 12, characterized in that, The outer casing (12) includes at least a main surface (12a) and a peripheral surface (12b) extending along the periphery of the main surface (12a) and at an angle to the main surface (12a). The first substrate section (8a) of the antenna module (7) extends adjacent to the peripheral surface (12b). The artificial dielectric structure (3) of the antenna module (7) is located between the first antenna array (2) of the antenna module (7) and the peripheral surface (12b).
14. The apparatus (11) according to claim 13, characterized in that, The second substrate segment (8b) of the antenna module (7) extends at least partially parallel to the main surface (12a), and the second antenna array (9) of the antenna module (7) faces the main surface (12a). The radio frequency integrated circuit (10) of the antenna module (7) faces the interior of the housing (12).
15. The apparatus (11) according to any one of claims 12 to 14, characterized in that, The size and / or shape configuration of each individual conductor pattern (6) associated with an antenna element (2a) of the antenna module (7) depends on the adjacent structural components of the device (11), namely the housing (12) and / or the chassis (13).
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