Glue dispensing positioning method, device, electronic device and computer-readable storage medium

By moving the camera and the workpiece to be glued within the axis coordinate system, the position of the positioning mark point is automatically calculated and adjusted, which solves the low efficiency and high cost problems caused by manual adjustment, realizes efficient automatic positioning and saves labor costs.

CN116550547BActive Publication Date: 2025-09-16KUNSHAN SAMON AUTOMATION TECH
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Patent Information

Application Number
CN202310557230.7
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-05-17
Publication Date
2025-09-16
Estimated Expiration
2043-05-17

AI Technical Summary

Technical Problem

In the prior art, manual adjustment of the position of the workpiece to be glued requires workers to observe the relative position of the workpiece to be glued and the camera in real time, resulting in low efficiency and high labor costs, thereby increasing production costs.

Method used

Automatic positioning is achieved by moving the camera within the axis coordinate system to obtain the positioning mark point image of the workpiece to be glued, calculating the position parameters of the positioning mark point, and automatically adjusting the position of the camera and/or the workpiece to be glued so that the positioning mark point enters the camera field of view.

Benefits of technology

The position of positioning mark points that do not fall within the camera's field of view can be automatically determined without human intervention, which improves positioning efficiency, reduces labor costs, and reduces production costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention belongs to the field of dispensing control technology, and discloses a dispensing positioning method, device, electronic device and computer-readable storage medium. The present invention expands the field of view of the camera by moving the camera and / or the workpiece to be dispensed, so that the positioning mark point can fall within the field of view of the camera, and the present invention can calculate the offset of the positioning mark point in the image coordinate system through the second actual image coordinate parameter and the preset image coordinate parameter, and calculate the offset of the positioning mark point in the image coordinate system and the movement parameter of the camera and / or the workpiece to be dispensed in the axis coordinate system compared with the preset position parameter in the axis coordinate system, thereby determining the actual position parameter of the positioning mark point. In the present invention, the position of the positioning mark point that does not fall within the field of view of the camera can be determined without human intervention, thereby determining the dispensing position of the workpiece to be dispensed, which is efficient and can save labor costs, thereby reducing production costs.
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Description

Technical Field

[0001] The present invention relates to the field of glue dispensing control technology, and in particular to a glue dispensing positioning method, device, electronic equipment and computer-readable storage medium. Background Art

[0002] A dispensing machine is a processing device that applies, seals, or drips electronic glue, oil, or other colloids onto products or workpieces. Automatic recognition and positioning technology enables high-precision dispensing during dispensing operations, significantly improving production efficiency.

[0003] In the prior art, a positioning mark point, i.e., a mark point, is provided on the workpiece to be glued. The position of the positioning mark point is determined by taking an image of the positioning mark point on the workpiece to be glued by a camera, and the glue dispensing position on the workpiece to be glued is calculated based on the position of the positioning mark point, thereby completing the glue dispensing positioning.

[0004] In actual operation, the positioning mark point may be offset due to factors such as the placement of the workpiece to be glued. When the offset of the positioning mark point is large, the positioning mark point will exceed the camera's field of view. In order to be able to capture the positioning mark point, the existing technology generally manually adjusts the position of the workpiece to be glued so that the positioning mark point falls within the camera's field of view. Specifically, when the positioning mark point exceeds the camera's field of view, the staff observes the relative position of the workpiece to be glued and the camera, and adjusts the position of the workpiece to be glued so that the positioning mark point falls within the camera's field of view. However, manual adjustment of the position of the workpiece to be glued requires the staff to observe the relative position of the workpiece to be glued and the camera in real time during the adjustment process, which is inefficient and has high labor costs, resulting in high production costs.

[0005] Therefore, the above problems need to be solved urgently. Summary of the Invention

[0006] The purpose of the present invention is to provide a dispensing positioning method, device, electronic device and computer-readable storage medium to solve the problem that manual adjustment of the position of the workpiece to be dispensed requires the staff to observe the relative position of the workpiece to be dispensed and the camera in real time during the adjustment process, which is inefficient and has high labor costs, thereby leading to high production costs.

[0007] To achieve this object, the present invention adopts the following technical solutions:

[0008] According to one aspect of the present invention, a dispensing positioning method is provided, comprising:

[0009] The method comprises the steps of: moving a camera in an axis coordinate system to sequentially acquire images of at least two positioning mark points of the workpiece to be glued; acquiring image coordinate parameters of the positioning mark points in the image coordinate system of the camera and axis coordinate parameters of the origin of the image coordinate system in the axis coordinate system; and determining position parameters of the positioning mark points in the axis coordinate system according to the image coordinate parameters and the axis coordinate parameters;

[0010] Acquire preset image coordinate parameters of the positioning mark point and preset position parameters in the axis coordinate system when the workpiece to be glued moves to a first preset position in the axis coordinate system, wherein the preset image coordinate parameters are acquired when the camera moves to a second preset position;

[0011] moving the camera to the second preset position;

[0012] If the positioning mark point is within the field of view of the camera, obtaining first actual image coordinate parameters of the positioning mark point in the image coordinate system, and determining actual position parameters of the positioning mark point according to the first actual image coordinate parameters and the axis coordinate parameters when the camera is located at the second preset position;

[0013] If the positioning mark point is not within the field of view of the camera, move the camera and / or the workpiece to be glued until the positioning mark point is within the field of view of the camera, obtain the second actual image coordinate parameters of the positioning mark point in the image coordinate system, and determine the actual position parameters of the positioning mark point according to the movement parameters of the camera and / or the workpiece to be glued in the axis coordinate system, the second actual image coordinate parameters and the preset image coordinate parameters;

[0014] The dispensing position is positioned according to the actual position parameters of at least two positioning mark points.

[0015] Preferably, moving the camera and / or the workpiece to be glued comprises:

[0016] Moving the camera from the second preset position along the X-axis of the axis coordinate system in a positive direction by n times the first preset distance, or moving the workpiece to be dispensed from the first preset position along the X-axis in a positive direction by n times the first preset distance;

[0017] Moving the camera from the second preset position along the Y axis of the axis coordinate system in the positive direction by n times the second preset distance, or moving the workpiece to be dispensed from the first preset position along the Y axis in the positive direction by n times the second preset distance;

[0018] Resetting the camera along the X-axis direction, and then moving it in the opposite direction along the X-axis by n times the first preset distance, or resetting the workpiece to be glued along the X-axis direction, and then moving it in the opposite direction along the X-axis by n times the first preset distance;

[0019] Resetting the camera along the Y-axis direction, and then moving it in the opposite direction along the Y-axis by n times the second preset distance, or resetting the workpiece to be glued along the Y-axis direction, and then moving it in the opposite direction along the Y-axis by n times the second preset distance;

[0020] Increase the value of n and repeat the above movement process;

[0021] Where n≥1.

[0022] Preferably, the distance that the camera or the workpiece to be glued moves along the X-axis or the Y-axis increases gradually.

[0023] Preferably, a first positioning mark point and a second positioning mark point are provided on the workpiece to be glued, and the glue dispensing positioning method further comprises:

[0024] Determining the actual position parameters of the first positioning mark point;

[0025] Resetting the workpiece to be glued to the first preset position, and moving the camera to the second preset position corresponding to the second positioning mark point;

[0026] Determining the actual position parameters of the second positioning mark point;

[0027] The dispensing position is located according to the actual position parameter of the first positioning mark point and the actual position parameter of the second positioning mark point.

[0028] Preferably, the dispensing positioning method further comprises:

[0029] If the image of the first positioning mark point acquired by the camera is not clear, move the camera or the workpiece to be glued in a vertical direction until the image of the first positioning mark point acquired by the camera is clear;

[0030] If the image of the second positioning mark point acquired by the camera is not clear, the camera or the workpiece to be glued is moved in a vertical direction until the image of the second positioning mark point acquired by the camera is clear.

[0031] Preferably, the dispensing positioning method further comprises:

[0032] Recording a distance moved in a vertical direction when the camera acquires an image of the first positioning mark point, which is recorded as a first adjustment distance;

[0033] Recording the distance moved in the vertical direction when the camera acquires the image of the second positioning mark point, which is recorded as a second adjustment distance;

[0034] Calculate the slope of the line connecting the first positioning mark point and the second positioning mark point according to the actual position parameter of the first positioning mark point, the actual position parameter of the second positioning mark point, the first adjustment distance, and the second adjustment distance;

[0035] The inclination angle of the workpiece to be glued compared to the horizontal plane is calculated according to the slope.

[0036] Preferably, the workpiece to be glued is rotated around the X-axis or Y-axis of the axis coordinate system by half of the tilt angle.

[0037] According to another aspect of the present invention, a dispensing positioning device is provided for positioning the dispensing position of a workpiece to be dispensed with glue based on the dispensing positioning method described above. The dispensing positioning device comprises:

[0038] a first parameter acquisition module, configured to acquire the preset image coordinate parameters, the preset position parameters, and the axis coordinate parameters when the camera is located at the second preset position;

[0039] A second parameter acquisition module, configured to acquire the first actual image coordinate parameter, the second actual image coordinate parameter, and the movement parameter;

[0040] a first calculation module, configured to determine actual position parameters of the positioning mark point according to the first actual image coordinate parameters and the axis coordinate parameters when the camera is located at the second preset position;

[0041] a second calculation module, configured to determine the actual position parameters of the positioning mark point according to the movement parameters, the second actual image coordinate parameters, and the preset image coordinate parameters; and

[0042] The dispensing execution module is used to locate the dispensing position according to the actual position parameters.

[0043] According to another aspect of the present invention, an electronic device is provided, comprising:

[0044] at least one processor; and

[0045] a memory communicatively connected to the at least one processor; wherein,

[0046] The memory stores a computer program that can be executed by the at least one processor. The computer program is executed by the at least one processor so that the at least one processor can perform the above-mentioned dispensing positioning method.

[0047] According to another aspect of the present invention, a computer-readable storage medium is provided, wherein the computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the above-mentioned dispensing positioning method when executed.

[0048] Beneficial effects of the present invention: The present invention expands the camera's field of view by moving the camera and / or the workpiece to be glued, so that the positioning mark point can fall within the camera's field of view, and the present invention can calculate the offset of the positioning mark point in the image coordinate system through the second actual image coordinate parameter and the preset image coordinate parameter, and calculate the offset of the positioning mark point in the image coordinate system and the movement parameters of the camera and / or the workpiece to be glued in the axis coordinate system compared to the preset position parameter in the axis coordinate system, thereby determining the actual position parameters of the positioning mark point when the camera and the workpiece to be glued are not moved. That is, the present invention can automatically determine the position of the positioning mark point that does not fall within the camera's field of view without human intervention, thereby determining the gluing position of the workpiece to be glued, which is highly efficient and can save labor costs, thereby reducing production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1 is a flow chart of the dispensing positioning method in embodiment 1 of the present invention;

[0050] Figure 2 is a schematic diagram of an axis coordinate system and an image coordinate system in an embodiment of the present invention;

[0051] Figure 3 Schematic diagram of the structure of the dispensing positioning device in the second embodiment of the present invention;

[0052] Figure 4 is a structural diagram of a mobile module in the second embodiment of the present invention;

[0053] Figure 5 It is a structural diagram of an electronic device in the third embodiment of the present invention.

[0054] In the picture:

[0055] 100, workpiece to be glued; 110, first positioning mark point; 120, second positioning mark point;

[0056] 200, camera;

[0057] 310, first parameter acquisition module; 320, second parameter acquisition module; 330, first calculation module; 340, second calculation module; 350, dispensing execution module; 361, X-axis moving module; 362, Y-axis moving module; 363, Z-axis moving module;

[0058] 410, processor; 420, memory; 430, I / O interface; 440, input unit; 450, output unit; 460, storage unit; 470, communication unit;

[0059] 500. Carrier. DETAILED DESCRIPTION

[0060] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It will be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all structures.

[0061] In the description of the present invention, unless otherwise expressly specified or limited, the terms "connected," "connected," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention in specific circumstances.

[0062] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0063] In the description of this embodiment, terms such as "upper," "lower," "left," and "right" are used to refer to positions or locations based on those shown in the accompanying drawings. These terms are intended solely to facilitate description and simplify operation, and are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.

[0064] Example 1

[0065] See also Figure 1 and Figure 2This embodiment provides a method for positioning glue. This method can be performed by a glue positioning device. The glue positioning device can be implemented in the form of hardware and / or software. The glue positioning device can be configured in an electronic device. In this embodiment, the glue positioning method includes:

[0066] By moving the camera 200 in the axial coordinate system, images of at least two positioning mark points of the workpiece 100 to be glued are obtained in sequence, the image coordinate parameters of the positioning mark points in the image coordinate system of the camera 200 and the axial coordinate parameters of the origin of the image coordinate system in the axial coordinate system are obtained, and the position parameters of the positioning mark points in the axial coordinate system are determined according to the image coordinate parameters and the axial coordinate parameters.

[0067] Figure 2 Schematic diagram of the axis coordinate system and image coordinate system of a dispensing positioning method provided in the first embodiment of the present invention. The axis coordinate system includes the X axis and the Y axis, and the image coordinate system includes the Xc axis and the Yc axis. For example, the image coordinate parameters of the positioning mark point are (X C0 , Y C0 ), the axis coordinate parameters of the origin of the image coordinate system are (X0, Y0), and the position parameters of the positioning mark point are (X C0 +X0,Y C0 +Y0).

[0068] Based on the above, the dispensing positioning method in this embodiment further includes:

[0069] Obtaining preset image coordinate parameters of the positioning mark point when the workpiece 100 to be glued moves to the first preset position in the axis coordinate system and preset position parameters in the axis coordinate system, and the preset image coordinate parameters are obtained when the camera 200 moves to the second preset position;

[0070] Moving the camera 200 to a second preset position;

[0071] If the positioning mark point is within the field of view of the camera 200, obtain first actual image coordinate parameters of the positioning mark point in the image coordinate system, and determine actual position parameters of the positioning mark point based on the first actual image coordinate parameters and the axis coordinate parameters when the camera 200 is located at the second preset position;

[0072] If the positioning mark point is not within the field of view of the camera 200, move the camera 200 and / or the workpiece to be glued 100 until the positioning mark point is within the field of view of the camera 200, obtain the second actual image coordinate parameters of the positioning mark point in the image coordinate system, and determine the actual position parameters of the positioning mark point based on the movement parameters of the camera 200 and / or the workpiece to be glued 100 in the axis coordinate system, the second actual image coordinate parameters, and the preset image coordinate parameters;

[0073] The dispensing position is located according to the actual position parameters of at least two positioning mark points.

[0074] It should be noted that, for each positioning mark point, the above-mentioned method is used in this embodiment to determine its actual position parameters, so that the dispensing position is located according to the actual position parameters of at least two positioning mark points. It can be understood that in this embodiment, the second preset position is different for different positioning mark points, that is, each positioning mark point corresponds to a second preset position. For any positioning mark point, the workpiece 100 to be dispensed with glue is first located at the first preset position, and the camera 200 first moves to the second preset position corresponding to the positioning mark point, thereby determining the actual position parameters of at least two positioning mark points in turn. Of course, in other optional embodiments, the second preset position may also be the same for different positioning mark points, and this is not specifically limited in this embodiment. When different positioning mark points correspond to the same second preset position, if the positioning mark point does not shift when the workpiece 100 to be glued moves to the first preset position, the camera 200 can directly obtain images of all positioning mark points at the same position. If the positioning mark point shifts when the workpiece 100 to be glued moves to the first preset position, then for different positioning mark points, the workpiece 100 to be glued is first located at the first preset position, and the camera 200 is first moved to the second preset position, thereby determining the actual position parameters of at least two positioning mark points in turn.

[0075] Based on the above, in this embodiment, the field of view of the camera 200 is expanded by moving the camera 200 and / or the workpiece to be glued 100, so that the positioning mark point can fall within the field of view of the camera 200, and in this embodiment, the offset of the positioning mark point in the image coordinate system can be calculated by the second actual image coordinate parameter and the preset image coordinate parameter, and the offset of the positioning mark point in the image coordinate system and the movement parameters of the camera 200 and / or the workpiece to be glued 100 in the axis coordinate system are calculated compared with the preset position parameters in the axis coordinate system, thereby determining the actual position parameters of the positioning mark point when the camera 200 and the workpiece to be glued 100 are not moved.

[0076] That is, in this embodiment, the position of the positioning mark point that does not fall within the field of view of the camera 200 can be automatically determined without human intervention, thereby determining the gluing position of the workpiece 100 to be glued. This is highly efficient and can save labor costs, thereby reducing production costs.

[0077] It is understandable that the specific process of positioning the dispensing position using the actual position parameters of at least two positioning mark points is prior art and will not be described in detail in this embodiment.

[0078] Preferably, a first positioning mark point 110 and a second positioning mark point 120 are provided on the workpiece 100 to be glued, and the camera 200 sequentially obtains the actual position parameters of the first positioning mark point 110 and the second positioning mark point 120. If the workpiece 100 to be glued is located at the first preset position and the camera 200 is located at the second preset position corresponding to the first positioning mark point 110, the first positioning mark point 110 is located within the field of view of the camera 200, and the actual position parameters of the first positioning mark point 110 are directly determined based on the first actual image coordinate parameters of the first positioning mark point 110 and the axis coordinate parameters of the camera 200. If the first positioning mark point 110 is outside the field of view of the camera 200, the second actual image coordinate parameters of the first positioning mark point 110 and the displacement of the camera 200 and / or the workpiece 100 to be glued in the axis coordinate system are determined according to the method described above. The motion parameters of the first positioning mark point 110 are determined, thereby determining the actual position parameters of the first positioning mark point 110. After determining the actual position parameters of the first positioning mark point 110, the workpiece 100 to be glued is reset to the first preset position, and the camera 200 moves to the second preset position corresponding to the second positioning mark point 120. If the second positioning mark point 120 is within the field of view of the camera 200, the actual position parameters of the second positioning mark point 120 are directly determined according to the first actual image coordinate parameters of the second positioning mark point 120 and the axis coordinate parameters of the camera 200. If the second positioning mark point 120 is outside the field of view of the camera 200, the second actual image coordinate parameters of the second positioning mark point 120 and the movement parameters of the camera 200 and / or the workpiece 100 to be glued in the axis coordinate system are determined according to the method described above, thereby determining the actual position parameters of the second positioning mark point 120.

[0079] Based on the above, the dispensing positioning method in this embodiment further includes:

[0080] Determine the actual position parameters of the first positioning mark point 110;

[0081] Reset the workpiece 100 to the first preset position, and move the camera 200 to the second preset position corresponding to the second positioning mark point 120;

[0082] Determine the actual position parameters of the second positioning mark point 120;

[0083] The dispensing position is positioned according to the actual position parameters of the first positioning mark point 110 and the actual position parameters of the second positioning mark point 120 .

[0084] It is understandable that if the second preset positions corresponding to the first positioning mark point 110 and the second positioning mark point 120 are the same, the camera 200 can be directly reset after determining the actual position parameters of the first positioning mark point 110.

[0085] For example, in this embodiment, the camera 200 can move along the X axis, and the stage 500 carrying the workpiece 100 to be glued can move along the Y axis. The preset position parameters of the first positioning mark point 110 when the workpiece 100 to be glued is at the first preset position are defined as (X1, Y1), and the preset image coordinate parameters are (X C1 , Y C1 ), when the workpiece 100 to be glued is located at the first preset position and the camera 200 is located at the second preset position corresponding to the first positioning mark point 110, if the first positioning mark point 110 is within the field of view of the camera 200, the first actual image coordinate parameter of the first positioning mark is (X C11 , Y C11 ), the axis coordinate parameters of the camera 200 are (X2, Y2), then the actual position parameters of the first positioning mark point 110 are (X2+X C11 , Y2+Y C11 ), if the first positioning mark point 110 is outside the field of view of the camera 200, move the camera 200 and / or the workpiece to be glued 100, that is, move the camera 200 along the X axis and / or move the workpiece to be glued 100 along the Y axis until the first positioning mark point 110 is within the field of view of the camera 200. At this time, the movement parameters of the camera 200 and / or the workpiece to be glued 100 in the axis coordinate system are (ΔX1, ΔY1), and the second actual image coordinate parameters of the first positioning mark are (X C12 , Y C12 ), the offset of the first positioning mark point 110 in the axis coordinate system is (ΔX K1 , ΔY K1 ), ΔX K1 and ΔY K1 The calculation formulas are shown in Formula 1 and Formula 2 respectively:

[0086] ΔX K1 =ΔX1+X C12 -X C1 (Formula 1)

[0087] ΔY K1 =ΔY1+Y C12 -Y C1 (Formula 2)

[0088] Based on the above, the actual position parameters of the first positioning mark point 110 are (X3, Y3), and the calculation formulas of X3 and Y3 are shown in Formula 3 and Formula 4 respectively:

[0089] X3=X1-ΔX K1 (Formula 3)

[0090] Y3=Y1-ΔY K1 (Formula 4)

[0091] After determining the actual position parameters of the first positioning mark point 110, the workpiece 100 to be glued is reset to the first preset position, and the camera 200 is moved to the second preset position corresponding to the second positioning mark point 120. The preset position parameters of the second positioning mark point 120 when the workpiece 100 to be glued is at the first preset position are defined as (X4, Y4), and the preset image coordinate parameters are (X C2 , Y C2 ), when the workpiece 100 to be glued is located at the first preset position and the camera 200 is located at the second preset position corresponding to the second positioning mark point 120, if the second positioning mark point 120 is within the field of view of the camera 200, the first actual image coordinate parameter of the second positioning mark is (X C21 , Y C21 ), the axis coordinate parameters of the camera 200 are (X5, Y5), then the actual position parameters of the first positioning mark point 110 are (X5+X C21 , Y5+Y C21 ), if the second positioning mark point 120 is outside the field of view of the camera 200, move the camera 200 and / or the workpiece to be glued 100, that is, move the camera 200 along the X axis and / or move the workpiece to be glued 100 along the Y axis until the second positioning mark point 120 is within the field of view of the camera 200. At this time, the movement parameters of the camera 200 and / or the workpiece to be glued 100 in the axis coordinate system are (ΔX2, ΔY2), and the second actual image coordinate parameters of the second positioning mark are (X C22 , Y C22 ), the offset of the second positioning mark point 120 in the axis coordinate system is (ΔX K2 , ΔY K2 ), ΔX K2 and ΔY K2 The calculation formulas are shown in Formula 5 and Formula 6 respectively:

[0092] ΔX K2 =ΔX2+X C22 -X C2 (Formula 5)

[0093] ΔY K2 =ΔY2+Y C22 -Y C2 (Formula 6)

[0094] Based on the above, the actual position parameters of the second positioning mark point 120 are (X6, Y6), and the calculation formulas of X6 and Y6 are shown in Formula 7 and Formula 8 respectively:

[0095] X6=X4-ΔX K2 (Formula 7)

[0096] Y6=Y4-ΔY K2 (Formula 8)

[0097] After determining the actual position parameters of the second positioning mark point 120, the glue dispensing position is determined according to the actual position parameters of the first positioning mark point 110 and the actual position parameters of the second positioning mark point 120. Then, the workpiece 100 to be glued is reset to the first preset position, so that glue is dispensed on the workpiece 100 to be glued.

[0098] Since the workpiece 100 to be glued and carried on the carrier 500 may be tilted due to dust particles on the carrier 500, when the first positioning mark 110 or the second mark is within the field of view of the camera 200, the camera 200 may not be able to clearly capture the image of the first positioning mark 110 or the second mark. To solve the above problem, the glue positioning method in this embodiment further includes:

[0099] If the image of the first positioning mark point 110 acquired by the camera 200 is not clear, move the camera 200 or the workpiece to be glued 100 in the vertical direction until the image of the first positioning mark point 110 acquired by the camera 200 is clear;

[0100] If the image of the second positioning mark point 120 acquired by the camera 200 is not clear, the camera 200 or the workpiece to be glued 100 is moved in a vertical direction until the image of the second positioning mark point 120 acquired by the camera 200 is clear.

[0101] That is, the axis coordinate system in this embodiment also includes the Z axis, and the camera 200 or the workpiece to be glued 100 can move along the Z axis. For example, in this embodiment, the camera 200 can move along the Z axis. If the image of the first positioning mark point 110 acquired by the camera 200 is not clear, the camera 200 is moved along the Z axis by ΔZ1 to make the image of the first positioning mark point 110 acquired by the camera 200 clear, thereby clearly acquiring the first actual image coordinate parameter or the second actual image coordinate parameter of the first positioning mark. If the image of the second positioning mark point 120 acquired by the camera 200 is not clear, the camera 200 is moved along the Z axis by ΔZ2 to make the image of the second positioning mark point 120 acquired by the camera 200 clear, thereby clearly acquiring the first actual image coordinate parameter or the second actual image coordinate parameter of the second positioning mark.

[0102] Furthermore, the dispensing positioning method further includes:

[0103] The distance moved in the vertical direction when recording the image of the first positioning mark point 110 acquired by the camera 200 is recorded as the first adjustment distance;

[0104] The distance moved in the vertical direction when recording the image of the second positioning mark point 120 acquired by the camera 200 is recorded as the second adjustment distance;

[0105] Calculate the slope of the line connecting the first positioning mark point 110 and the second positioning mark point 120 according to the actual position parameter of the first positioning mark point 110, the actual position parameter of the second positioning mark point 120, the first adjustment distance, and the second adjustment distance;

[0106] The inclination angle of the workpiece 100 to be glued compared to the horizontal plane is calculated according to the slope.

[0107] Based on the above, in this embodiment, the inclination angle of the workpiece 100 to be glued compared to the horizontal plane can be obtained according to calculation, so that the workpiece 100 to be glued can be rotated to the horizontal or the subsequent glue head can perform glue according to the inclination angle of the workpiece 100 to be glued, thereby ensuring that the quality of glue dispensing meets the requirements.

[0108] Specifically, based on the above, the first adjustment distance is ΔZ1, and the second adjustment distance is ΔZ2. If the spacing between the first positioning mark point 110 and the second positioning mark point 120 on the Y axis is small, and the spacing on the X axis is large, then the slope k of the line connecting the first positioning mark point 110 and the second positioning mark point 120 is calculated by Formula 9, Formula 10, Formula 11, or Formula 12:

[0109] k=(ΔZ2-ΔZ1) / (X5+X C21 -(X2+X C11 )) (Formula 9)

[0110] k=(ΔZ2-ΔZ1) / (X4-ΔX K2 -(X1-ΔX K1 )) (Formula 10)

[0111] k=(ΔZ2-ΔZ1) / (X5+X C21 -(X1-ΔX K1 )) (Formula 11)

[0112] k=(ΔZ2-ΔZ1) / (X4-ΔX K2 -(X2+X C11 )) (Formula 12)

[0113] If the distance between the first positioning mark point 110 and the second positioning mark point 120 on the X-axis is small, but the distance between them on the Y-axis is large, then the slope k of the line connecting the first positioning mark point 110 and the second positioning mark point 120 is calculated using Formula 13, Formula 14, Formula 15, or Formula 16:

[0114] k=(ΔZ2-ΔZ1) / (Y5+Y C21 -(Y2+Y C11 )) (Formula 13)

[0115] k=(ΔZ2-ΔZ1) / (Y4-ΔY K2 -(Y1-ΔY K1 )) (Formula 14)

[0116] k=(ΔZ2-ΔZ1) / (Y5+Y C21 -(Y1-ΔY K1 )) (Formula 15)

[0117] k=(ΔZ2-ΔZ1) / (Y4-ΔY K2 -(Y2+Y C11 )) (Formula 16)

[0118] Among them, Formula 9 and Formula 13 are used when the workpiece 100 to be glued is located at the first preset position and the camera 200 is located at the second preset position corresponding to the first positioning mark point 110, the first positioning mark point 110 is located within the field of view of the camera 200, and at the same time, when the workpiece 100 to be glued is located at the first preset position and the camera 200 is located at the second preset position corresponding to the second positioning mark point 120, the second positioning mark point 120 is located within the field of view of the camera 200, and the slope k is calculated. Formula 10 and Formula 14 are used when the workpiece 100 to be glued is located at the first preset position and the camera 200 is located at the second preset position corresponding to the first positioning mark point 110, the first positioning mark point 110 is located outside the field of view of the camera 200, and at the same time, when the workpiece 100 to be glued is located at the first preset position and the camera 200 is located at the second preset position corresponding to the second positioning mark point 120, the second positioning mark point 120 is located outside the field of view of the camera 200. , Formula 11 and Formula 15 are used for calculating the slope k when the workpiece 100 to be glued is located at the first preset position and the camera 200 is located at the second preset position corresponding to the first positioning mark point 110, the first positioning mark point 110 is located outside the field of view of the camera 200, and the workpiece 100 to be glued is located at the first preset position and the camera 200 is located at the second preset position corresponding to the second positioning mark point 120, and the second positioning mark point 120 is located within the field of view of the camera 200. Formula 12 and Formula 16 are used for calculating the slope k when the workpiece 100 to be glued is located at the first preset position and the camera 200 is located at the second preset position corresponding to the first positioning mark point 110, the first positioning mark point 110 is located within the field of view of the camera 200, and the workpiece 100 to be glued is located at the first preset position and the camera 200 is located at the second preset position corresponding to the second positioning mark point 120, and the second positioning mark point 120 is located outside the field of view of the camera 200.

[0119] The inclination angle α of the workpiece 100 to be glued relative to the horizontal plane is calculated using Formula 13:

[0120] α=actan(k) (Formula 13)

[0121] Furthermore, in this embodiment, the workpiece to be glued 100 is rotated to a horizontal position to ensure that the quality of glue dispensing meets the requirements. Specifically, the workpiece to be glued 100 is rotated around the X-axis or Y-axis of the axial coordinate system by half of the tilt angle. If the spacing between the first positioning mark point 110 and the second positioning mark point 120 on the Y-axis is small, and the spacing on the X-axis is large, the workpiece to be glued 100 is rotated around the Y-axis of the axial coordinate system by half of the tilt angle to ensure that the quality of glue dispensing meets the requirements. If the spacing between the first positioning mark point 110 and the second positioning mark point 120 on the X-axis is small, and the spacing on the Y-axis is large, the workpiece to be glued 100 is rotated around the X-axis of the axial coordinate system by half of the tilt angle to ensure that the quality of glue dispensing meets the requirements.

[0122] Preferably, the mobile camera 200 and / or the workpiece to be glued 100 includes:

[0123] Move the camera 200 from the second preset position along the X-axis of the axis coordinate system in the positive direction by n times the first preset distance, or move the workpiece 100 to be glued from the first preset position along the X-axis in the positive direction by n times the first preset distance;

[0124] Move the camera 200 from the second preset position along the Y axis of the axis coordinate system in the positive direction by n times the second preset distance, or move the workpiece 100 to be glued from the first preset position along the Y axis in the positive direction by n times the second preset distance;

[0125] Reset the camera 200 along the X-axis direction, and then move it in the opposite direction along the X-axis by n times the first preset distance, or reset the workpiece 100 to be glued along the X-axis direction, and then move it in the opposite direction along the X-axis by n times the first preset distance;

[0126] Reset the camera 200 along the Y-axis direction, and then move it in the opposite direction along the Y-axis by n times the second preset distance, or reset the workpiece 100 to be glued along the Y-axis direction, and then move it in the opposite direction along the Y-axis by n times the second preset distance;

[0127] Increase the value of n and repeat the above movement process;

[0128] Where n≥1.

[0129] Exemplarily, based on the above, in this embodiment, the camera 200 can move along the X-axis, and the carrier 500 carrying the workpiece 100 to be glued can move along the Y-axis, that is, in this embodiment, the camera 200 is first moved from the second preset position along the X-axis of the axis coordinate system in the positive direction of n times the first preset distance. If the positioning mark point is still not within the field of view of the camera 200, the workpiece 100 to be glued is moved from the first preset position along the Y-axis in the positive direction of n times the second preset distance. If the positioning mark point is still not within the field of view of the camera 200, the camera 200 is reset along the X-axis direction, and then moved in the opposite direction along the X-axis by n times the first preset distance. If the positioning mark point is still not within the field of view of the camera 200, the workpiece 100 to be glued is reset along the Y-axis direction, and then moved in the opposite direction along the Y-axis by n times the second preset distance. If the positioning mark point is still not within the field of view of the camera 200, the value of n is increased, and the above steps are repeated until the positioning mark point is within the field of view of the camera 200. Based on the above, in this embodiment, the field of view of the camera 200 is adaptively expanded so that the positioning mark point can fall within the field of view of the camera 200, thereby determining the actual position parameters of the positioning mark point.

[0130] Of course, in other optional embodiments, the field of view of the camera 200 can be expanded by moving the camera 200 along the Y axis and / or moving the platform 500 carrying the workpiece to be glued 100 along the X axis, or moving the camera 200 along the X axis and / or the Y axis, or moving the platform 500 carrying the workpiece to be glued 100 along the X axis and / or the Y axis. There is no specific limitation on this in this embodiment.

[0131] Furthermore, in this embodiment, the distance that the camera 200 or the workpiece 100 to be glued moves along the X-axis or Y-axis is gradually increased. That is, in this embodiment, the field of view of the camera 200 is gradually increased to ensure that the positioning mark point can be located within the field of view of the camera 200 during the process of moving the camera 200 and / or the workpiece 100 to be glued.

[0132] Specifically, the first preset distance is defined as ΔX, and the second preset distance is defined as ΔY. Then, ΔX1 and ΔX2 mentioned above can be calculated by Formula 17, and ΔY1 and ΔY2 can be calculated by Formula 18, wherein Formula 17 and Formula 18 are:

[0133] ΔX1 / ΔX2=nΔX (Formula 17)

[0134] ΔY1 / ΔY2=nΔY (Formula 18)

[0135] Example 2

[0136] like Figure 3As shown, based on the same inventive concept, embodiment 2 of the present invention provides a dispensing positioning device, which locates the dispensing position of the workpiece 100 to be dispensed based on the dispensing positioning method of embodiment 1, and the dispensing positioning device includes a first parameter acquisition module 310, a second parameter acquisition module 320, a first calculation module 330, a second calculation module 340 and a dispensing execution module 350. The first parameter acquisition module 310 is used to obtain preset image coordinate parameters, preset position parameters and axis coordinate parameters when the camera 200 is located at the second preset position, the second parameter acquisition module 320 is used to obtain the first actual image coordinate parameters, the second actual image coordinate parameters and the movement parameters, the first calculation module 330 is used to determine the actual position parameters of the positioning mark point according to the first actual image coordinate parameters and the axis coordinate parameters when the camera 200 is located at the second preset position, the second calculation module 340 is used to determine the actual position parameters of the positioning mark point according to the movement parameters, the second actual image coordinate parameters and the preset image coordinate parameters, and the dispensing execution module 350 is used to locate the dispensing position according to the actual position parameters.

[0137] In addition to the first parameter acquisition module 310, the second parameter acquisition module 320, the first calculation module 330, the second calculation module 340 and the dispensing execution module 350, the dispensing positioning device also includes a moving module, see Figure 4 The moving module is used to move the camera 200 and / or the workpiece to be glued 100. The moving module includes an X-axis moving module 361 and a Y-axis moving module 362. The X-axis moving module 361 is used to drive the camera 200 to move along the X-axis direction, and the Y-axis moving module 362 is used to drive the carrier 500 carrying the workpiece to be glued 100 to move along the Y-axis direction.

[0138] It is understandable that the moving module further includes a Z-axis moving module 363 , and the Z-axis moving module 363 is used to drive the camera 200 to move along the Z-axis direction.

[0139] It should be noted that the dispensing and positioning device further includes a rotation module (not shown in the figure), which is used to drive the carrier 500 carrying the workpiece 100 to be dispensed with glue to rotate around the X-axis or the Y-axis.

[0140] Example 3

[0141] like Figure 5 As shown, based on the same inventive concept, a fourth embodiment of the present invention provides an electronic device, which includes at least one processor 410 and a memory 420 communicatively connected to the at least one processor 410. The memory 420 stores a computer program executable by the at least one processor 410, and the computer program is executed by the at least one processor 410 to enable the at least one processor 410 to perform the above-mentioned dispensing positioning method.

[0142] Electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. Electronic device may also represent various forms of mobile devices, such as personal digital assistants, cellular phones, smart phones, wearable devices (such as helmets, glasses, watches, etc.) and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the invention described and / or claimed herein.

[0143] like Figure 5 As shown, the electronic device includes at least one processor 410 and a memory 420, such as a read-only memory, a random access memory, etc., which is communicatively connected to the at least one processor 410. The read-only memory is ROM and the random access memory is RAM. The memory 420 stores a computer program that can be executed by the at least one processor 410. The processor 410 can perform various appropriate actions and processes according to the computer program stored in the read-only memory or the computer program loaded from the storage unit 460 to the random access memory. Various programs and data required for the operation of the electronic device can also be stored in the random access memory. The processor 410, the read-only memory and the random access memory are connected to each other via a bus. The input / output interface is also connected to the bus, and the input / output interface is the I / O interface 430.

[0144] Multiple components in the electronic device are connected to the I / O interface 430, including an input unit 440, such as a keyboard, a mouse, etc.; an output unit 450, such as various types of displays, speakers, etc.; a storage unit 460, such as a magnetic disk, an optical disk, etc.; and a communication unit 470, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 470 allows the electronic device to exchange information / data with other devices via a computer network such as the Internet and / or various telecommunication networks.

[0145] The processor 410 can be a variety of general-purpose and / or specialized processing components with processing and computing capabilities. Some examples of the processor 410 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various processors 410 that run machine learning model algorithms, a digital signal processor (DSP), and any suitable processor 410, controller, microcontroller, etc. The processor 410 executes the various methods and processes described above, such as the dispensing positioning method.

[0146] Example 4

[0147] In this embodiment, the dispensing positioning method is implemented as a computer program, which is tangibly contained in a computer-readable storage medium. To this end, this embodiment provides a computer-readable storage medium, which stores computer instructions, and the computer instructions are used to implement the above-mentioned dispensing positioning method when executed by the processor.

[0148] Various embodiments of the systems and techniques described herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), system-on-chip systems (SOCs), programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments can include being implemented in one or more computer programs that are executable and / or interpreted on a programmable system that includes at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0149] Computer programs for implementing the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when the computer program is executed by the processor, the functions / operations specified in the flowcharts and / or block diagrams are implemented. The computer program may be executed entirely on the machine, partially on the machine, as a stand-alone software package, partially on the machine and partially on a remote machine, or entirely on a remote machine or server.

[0150] In the context of the present invention, computer-readable storage media can be tangible media that can contain or store a computer program for use with an instruction execution system, device or equipment or used in combination with an instruction execution system, device or equipment. Computer-readable storage media can include but are not limited to electronic, magnetic, optical, electromagnetic, infrared or semiconductor systems, devices or equipment, or any suitable combination of the foregoing. Alternatively, computer-readable storage media can be machine-readable signal media. More specific examples of machine-readable storage media can include electrical connections based on one or more lines, portable computer disks, hard disks, random access memories (RAM), read-only memories (ROM), erasable programmable read-only memories (EPROM or flash memory), optical fibers, portable compact disk read-only memories (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing.

[0151] To provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user can provide input to the electronic device. Other types of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, voice input, or tactile input).

[0152] The systems and techniques described herein can be implemented in a computing system that includes back-end components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes front-end components (e.g., a user computer with a graphical user interface or web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such back-end components, middleware components, or front-end components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.

[0153] A computing system may include clients and servers. The clients and servers are typically remote from each other and typically interact via a communication network. This client-server relationship arises through computer programs running on the respective computers, creating a client-server relationship. The server may be a cloud server, also known as a cloud computing server or cloud host. This server is a hosting product within the cloud computing service ecosystem that addresses the management difficulties and limited scalability of traditional physical hosting and VPS services.

[0154] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in the present invention can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution of the present invention can be achieved. This is not limited herein.

[0155] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention and are not intended to limit the embodiments of the present invention. A person skilled in the art would be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is not necessary and impossible to enumerate all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.

Claims

1. Glue dispensing positioning method, characterized in that, include: The method comprises the steps of: moving a camera in an axis coordinate system to sequentially acquire images of at least two positioning mark points of the workpiece to be glued; acquiring image coordinate parameters of the positioning mark points in the image coordinate system of the camera and axis coordinate parameters of the origin of the image coordinate system in the axis coordinate system; and determining position parameters of the positioning mark points in the axis coordinate system according to the image coordinate parameters and the axis coordinate parameters; Acquire preset image coordinate parameters of the positioning mark point and preset position parameters in the axis coordinate system when the workpiece to be glued moves to a first preset position in the axis coordinate system, wherein the preset image coordinate parameters are acquired when the camera moves to a second preset position; moving the camera to the second preset position; If the positioning mark point is within the field of view of the camera, obtaining first actual image coordinate parameters of the positioning mark point in the image coordinate system, and determining actual position parameters of the positioning mark point according to the first actual image coordinate parameters and the axis coordinate parameters when the camera is located at the second preset position; If the positioning mark point is not within the field of view of the camera, move the camera and / or the workpiece to be glued until the positioning mark point is within the field of view of the camera, obtain the second actual image coordinate parameters of the positioning mark point in the image coordinate system, and determine the actual position parameters of the positioning mark point according to the movement parameters of the camera and / or the workpiece to be glued in the axis coordinate system, the second actual image coordinate parameters and the preset image coordinate parameters; Positioning the dispensing position according to the actual position parameters of at least two positioning mark points; Wherein, moving the camera and / or the workpiece to be glued comprises: Moving the camera from the second preset position along the X-axis of the axis coordinate system in a positive direction by n times the first preset distance, or moving the workpiece to be dispensed from the first preset position along the X-axis in a positive direction by n times the first preset distance; Moving the camera from the second preset position along the Y axis of the axis coordinate system in the positive direction by n times the second preset distance, or moving the workpiece to be dispensed from the first preset position along the Y axis in the positive direction by n times the second preset distance; Resetting the camera along the X-axis direction, and then moving it in the opposite direction along the X-axis by n times the first preset distance, or resetting the workpiece to be glued along the X-axis direction, and then moving it in the opposite direction along the X-axis by n times the first preset distance; Resetting the camera along the Y-axis direction, and then moving it in the opposite direction along the Y-axis by n times the second preset distance, or resetting the workpiece to be glued along the Y-axis direction, and then moving it in the opposite direction along the Y-axis by n times the second preset distance; Increase the value of n and repeat the above movement process; Where n≥1.

2. The dispensing positioning method according to claim 1, characterized in that: The distance that the camera or the workpiece to be glued moves along the X-axis or the Y-axis increases gradually.

3. The dispensing positioning method according to claim 1, characterized in that: The workpiece to be glued is provided with a first positioning mark point and a second positioning mark point, and the glue dispensing positioning method further includes: Determining the actual position parameters of the first positioning mark point; Resetting the workpiece to be glued to the first preset position, and moving the camera to the second preset position corresponding to the second positioning mark point; Determining the actual position parameters of the second positioning mark point; The dispensing position is located according to the actual position parameter of the first positioning mark point and the actual position parameter of the second positioning mark point.

4. The dispensing positioning method according to claim 3, characterized in that: The dispensing positioning method further includes: If the image of the first positioning mark point acquired by the camera is not clear, move the camera or the workpiece to be glued in a vertical direction until the image of the first positioning mark point acquired by the camera is clear; If the image of the second positioning mark point acquired by the camera is not clear, the camera or the workpiece to be glued is moved in a vertical direction until the image of the second positioning mark point acquired by the camera is clear.

5. The dispensing positioning method according to claim 4, characterized in that: The dispensing positioning method further includes: Recording a distance moved in a vertical direction when the camera acquires an image of the first positioning mark point, which is recorded as a first adjustment distance; Recording the distance moved in the vertical direction when the camera acquires the image of the second positioning mark point, which is recorded as a second adjustment distance; Calculate the slope of the line connecting the first positioning mark point and the second positioning mark point according to the actual position parameter of the first positioning mark point, the actual position parameter of the second positioning mark point, the first adjustment distance, and the second adjustment distance; The inclination angle of the workpiece to be glued compared to the horizontal plane is calculated according to the slope.

6. The dispensing positioning method according to claim 5, characterized in that: The workpiece to be glued is rotated around the X-axis or Y-axis of the axis coordinate system by half of the tilt angle.

7. A glue dispensing positioning device for positioning a glue dispensing position of a workpiece to be glued based on the glue dispensing positioning method according to any one of claims 1 to 6, characterized in that: The dispensing positioning device comprises: a first parameter acquisition module, configured to acquire the preset image coordinate parameters, the preset position parameters, and the axis coordinate parameters when the camera is located at the second preset position; A second parameter acquisition module, configured to acquire the first actual image coordinate parameter, the second actual image coordinate parameter, and the movement parameter; a first calculation module, configured to determine actual position parameters of the positioning mark point according to the first actual image coordinate parameters and the axis coordinate parameters when the camera is located at the second preset position; a second calculation module, configured to determine the actual position parameters of the positioning mark point according to the movement parameters, the second actual image coordinate parameters, and the preset image coordinate parameters; and The dispensing execution module is used to locate the dispensing position according to the actual position parameters.

8. An electronic device, characterized in that The electronic device comprises: at least one processor; and a memory communicatively connected to the at least one processor; wherein, The memory stores a computer program that can be executed by the at least one processor. The computer program is executed by the at least one processor to enable the at least one processor to perform the dispensing positioning method according to any one of claims 1 to 6.

9. A computer-readable storage medium, characterized in that The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the dispensing positioning method according to any one of claims 1 to 6 when executed.

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