A double circulation temperature control device and a control method thereof

CN116558142BActive Publication Date: 2026-08-28BEIJING JINGYI AUTOMATION EQUIP CO LTD
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Patent Information

Application Number
CN202310345148.8
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-03-31
Publication Date
2026-08-28
Estimated Expiration
2043-03-31

AI Technical Summary

Technical Problem

[0004]但是,进入高温工况后,随着温控装置的运行温度大范围的升高,制冷系统的蒸发温度无法同步大范围升高,导致载冷剂温度与制冷系统蒸发温度温差过高,致使制冷系统运行不稳定,同时温控精度变差

Benefits of technology

[0019]本发明提供的一种双循环温控装置及其控制方法,使双循环温控装置在低温工况或高温工况下,通过两个四通换向阀切换与换热器的放热通路连通的循环管路,以及与蒸发器的放热通路连通的循环管路,达到控制双循环系统(冷剂循环系统)和制冷系统的换热方式。在高温工况下,通过外循环管路和内循环管路通过换热器进行换热,内循环管路通过蒸发器与制冷管路进行换热,双重换热,可以降低蒸发器内的温差,使制冷管路中的制冷压缩机吸气过热度处于合适的范围内,改善高温工况下制冷系统的运行状态,使制冷系统的运行状态更稳定,优化高温工况的制冷系统稳定性,提高温控精度。此外,双循环温控装置的出口温度,可以通过调节换热器内恒温的低温循环液的流量对外循环液进行控温,相比调节制冷系统,对换热量的控制更线性,双循环温控装置的出口温度控温精度更高。

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Abstract

The application provides a double-circulation temperature control device and a control method thereof, wherein the double-circulation temperature control device comprises a refrigeration system, a double-circulation system and an evaporator; a refrigeration pipeline of the refrigeration system is communicated with a heat absorption passage of the evaporator; the double-circulation system comprises an outer circulation pipeline, an inner circulation pipeline, two four-way reversing valves and a heat exchanger; the four-way reversing valves are used for switching the circulation pipelines communicated with the heat release passages of the evaporator and the heat exchanger; and the heat exchanger is used for heat exchange between the outer circulation pipeline and the inner circulation pipeline. The application realizes the switching of the heat exchange mode, reduces the temperature difference in the evaporator under high-temperature working conditions, improves the operation state of the refrigeration system and improves the temperature control precision. The flow of the constant-temperature low-temperature circulation liquid in the heat exchanger is adjusted to control the temperature of the outer circulation liquid, the control of the heat exchange amount is more linear, and the temperature control precision of the outlet temperature is further improved.
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Description

Technical Field

[0001] This invention relates to the field of refrigeration technology, and in particular to a dual-cycle temperature control device and its control method. Background Technology

[0002] In semiconductor wafer etching processes, temperature has a significant impact on etching accuracy. To control etching accuracy, high-precision temperature control is required within the processing cavity. Therefore, a dedicated temperature control device is needed for the etching equipment.

[0003] In existing technologies, most temperature control devices use Freon refrigeration systems, and select single-stage or cascade refrigeration based on the minimum operating temperature required by the temperature control device. These devices use electronic fluorinated liquid as a refrigerant, and achieve constant temperature control of the processing cavity environment by controlling the flow of this constant-temperature liquid into the inner channel of the wafer processing cavity base.

[0004] However, when entering high-temperature operating conditions, as the operating temperature of the temperature control device rises significantly, the evaporation temperature of the refrigeration system cannot rise simultaneously, resulting in an excessively high temperature difference between the refrigerant temperature and the evaporation temperature of the refrigeration system. This leads to unstable operation of the refrigeration system and a decrease in temperature control accuracy. Summary of the Invention

[0005] To address the problems existing in the prior art, the present invention provides a dual-cycle temperature control device and its control method.

[0006] This invention provides a dual-cycle temperature control device, comprising: Refrigeration system, dual-cycle system and evaporator; The refrigeration piping of the refrigeration system is connected to the heat absorption passage of the evaporator; The dual-circulation system includes an external circulation pipeline, an internal circulation pipeline, two four-way reversing valves, and a heat exchanger; the four-way reversing valves are used to switch the circulation pipeline connected to the heat release path of the evaporator and to switch the circulation pipeline connected to the heat release path of the heat exchanger; the heat exchanger is used for heat exchange between the external circulation pipeline and the internal circulation pipeline.

[0007] According to the present invention, a dual-circulation temperature control device is provided, wherein the external circulation pipeline includes an external circulation pump and a first temperature sensor for measuring the outlet temperature; The outlet of the external circulation pump is connected to the first four-way reversing valve of the two four-way reversing valves; the inlet of the first temperature sensor is connected to the second four-way reversing valve of the two four-way reversing valves; the external circulation pump and the first temperature sensor are connected to both sides of the wafer processing cavity base.

[0008] According to the present invention, a dual-circulation temperature control device is provided, wherein the internal circulation pipeline includes an internal circulation pump, a three-way regulating valve, and a second temperature sensor; The outlet of the internal circulation pump is connected to the first four-way reversing valve of the two four-way reversing valves; the inlet of the second temperature sensor is connected to the second four-way reversing valve of the two four-way reversing valves; the outlet of the second temperature sensor is connected to the inlet of the three-way regulating valve; the first outlet of the three-way regulating valve is connected to the inlet of the heat absorption passage of the heat exchanger; the second outlet of the three-way regulating valve and the outlet of the heat absorption passage of the heat exchanger are respectively connected to the inlet of the internal circulation pump.

[0009] According to the present invention, a dual-cycle temperature control device is provided, wherein the refrigeration pipeline includes a refrigeration compressor, a condenser and an electronic expansion valve connected in sequence; The electronic expansion valve is connected to the inlet of the heat absorption passage of the evaporator; the inlet of the refrigeration compressor is connected to the outlet of the heat absorption passage of the evaporator; the inlet of the condenser is connected to the outlet of the refrigeration compressor; and the outlet of the condenser is connected to the electronic expansion valve.

[0010] The present invention also provides a control method for a dual-cycle temperature control device, comprising: Obtain the current set outlet temperature of the dual-cycle temperature control device, wherein the dual-cycle temperature control device is the aforementioned dual-cycle temperature control device; Based on the currently set outlet temperature, determine the operating condition type of the dual-cycle temperature control device; When the operating condition is high temperature, two four-way reversing valves are controlled to connect the heat release path of the evaporator to the internal circulation pipeline, and the heat release path of the heat exchanger to the external circulation pipeline, so that the external circulation pipeline and the internal circulation pipeline exchange heat through the heat exchanger, and the internal circulation pipeline and the refrigeration pipeline exchange heat through the evaporator.

[0011] According to a dual-cycle temperature control device control method provided by the present invention, the method further includes: The real-time measured temperature and target temperature of the second temperature sensor in the internal circulation pipeline are obtained; The opening of the electronic expansion valve in the refrigeration pipeline is adjusted based on the difference between the real-time measured temperature and the target temperature.

[0012] According to a dual-cycle temperature control device control method provided by the present invention, the method further includes: Obtain the real-time outlet temperature of the first temperature sensor in the external circulation pipeline; The opening of the three-way regulating valve in the internal circulation pipeline is adjusted based on the difference between the real-time outlet temperature and the currently set outlet temperature.

[0013] According to a control method for a dual-cycle temperature control device provided by the present invention, determining the operating condition type of the dual-cycle temperature control device based on the currently set outlet temperature includes: The current set outlet temperature is compared with a reference temperature, which is determined based on the lowest set outlet temperature and a preset value of the dual-cycle temperature control device. When the current set outlet temperature is lower than the reference temperature, the operating condition of the dual-cycle temperature control device is determined to be a low-temperature operating condition. If the current set outlet temperature is greater than or equal to the reference temperature, the operating condition of the dual-cycle temperature control device is determined to be a high-temperature operating condition.

[0014] According to a control method for a dual-cycle temperature control device provided by the present invention, after determining the operating condition type of the dual-cycle temperature control device based on the currently set outlet temperature, the method further includes: When the operating condition is low temperature, the two four-way reversing valves are controlled to connect the heat release passage of the evaporator to the external circulation pipeline, and the heat release passage of the heat exchanger to the internal circulation pipeline, so that the external circulation pipeline and the refrigeration pipeline exchange heat through the evaporator.

[0015] According to a dual-cycle temperature control device control method provided by the present invention, the method further includes at least one of the following: Obtain the real-time outlet temperature of the first temperature sensor in the external circulation pipeline; adjust the opening of the electronic expansion valve in the refrigeration pipeline according to the difference between the real-time outlet temperature and the currently set outlet temperature. Obtain the superheat of the evaporator; adjust the opening of the electronic expansion valve in the refrigeration pipeline based on the superheat.

[0016] The present invention also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the dual-cycle temperature control device control method described above.

[0017] The present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the dual-cycle temperature control device control method as described above.

[0018] The present invention also provides a computer program product, including a computer program that, when executed by a processor, implements the dual-cycle temperature control device control method as described above.

[0019] This invention provides a dual-cycle temperature control device and its control method. Under low-temperature or high-temperature conditions, the dual-cycle temperature control device switches between the circulation pipeline connected to the heat exchanger's heat release path and the circulation pipeline connected to the evaporator's heat release path via two four-way reversing valves, thereby controlling the heat exchange mode of the dual-cycle system (refrigerant circulation system) and the refrigeration system. Under high-temperature conditions, heat exchange occurs through the heat exchanger via the external and internal circulation pipelines. The internal circulation pipeline exchanges heat with the refrigeration pipeline via the evaporator. This dual heat exchange reduces the temperature difference within the evaporator, keeping the superheat of the refrigeration compressor's suction gas within a suitable range. This improves the operating state of the refrigeration system under high-temperature conditions, making its operation more stable, optimizing its stability under high-temperature conditions, and improving temperature control accuracy. Furthermore, the outlet temperature of the dual-cycle temperature control device can be controlled by adjusting the flow rate of the constant-temperature low-temperature circulating liquid within the heat exchanger to regulate the external circulating liquid. Compared to regulating the entire refrigeration system, this provides more linear control over heat exchange, and the outlet temperature control device achieves higher accuracy. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0021] Figure 1 This is one of the structural schematic diagrams of the dual-cycle temperature control device provided by the present invention; Figure 2 This is the second schematic diagram of the dual-cycle temperature control device provided by the present invention; Figure 3 This is a flowchart illustrating the control method of the dual-cycle temperature control device provided by the present invention. Figure 4 This is a schematic diagram of the process for controlling the second temperature sensor under high-temperature conditions provided by the present invention. Figure 5 This is a schematic diagram of the process for controlling the first temperature sensor under high-temperature conditions provided by the present invention. Figure 6 This is a schematic diagram of the structure of the electronic device provided by the present invention.

[0022] Figure label: 1: Evaporator; 2: Heat exchanger; 3: External circulation pump; 4: First temperature sensor; 5: First four-way reversing valve; 6: Second four-way reversing valve; 7: Wafer processing chamber base; 8: Internal circulation pump; 9: Three-way regulating valve; 10: Second temperature sensor; 11: Refrigeration compressor; 12: Condenser; 13: Electronic expansion valve. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0024] To facilitate a clearer understanding of the various embodiments of the present invention, some relevant background knowledge will be introduced as follows.

[0025] In semiconductor wafer etching processes, temperature has a significant impact on etching accuracy. To control etching accuracy, high-precision temperature control is required within the processing cavity. Therefore, a dedicated temperature control device is needed for the etching equipment.

[0026] With the continuous development of etching technology, the requirements for etching precision are becoming increasingly stringent, leading to a gradual decrease in the required processing chamber temperature, which is currently in the range of -40℃ to -70℃. However, the temperatures used vary at different nodes in wafer fabrication processes or for different etching techniques. Therefore, temperature control devices need to meet a wide operating temperature range. For some advanced etching processes, the operating range of temperature control devices exceeds 50℃.

[0027] In existing technologies, most temperature control devices use Freon refrigeration systems, and select single-stage or cascade refrigeration based on the minimum operating temperature required by the temperature control device. These devices use electronic fluorinated liquid as a refrigerant, and achieve constant temperature control of the processing cavity environment by controlling the flow of this constant-temperature liquid into the inner channel of the wafer processing cavity base.

[0028] The cooling capacity of a Freon refrigeration system decreases significantly as the operating temperature drops. Therefore, the selection of a Freon refrigeration system is based on the minimum temperature of the temperature control device and its load capacity, determining the specifications of the components. When the temperature control device enters a high-temperature operating condition, as the operating temperature of the temperature control device rises significantly, the evaporation temperature of the refrigeration system cannot rise simultaneously. This results in an excessively high temperature difference between the refrigerant temperature and the evaporation temperature of the refrigeration system under high-temperature conditions, leading to problems such as exceeding the superheat limit and excessively high exhaust temperature. Consequently, the refrigeration system becomes unstable, and the temperature control accuracy deteriorates. Furthermore, the heat load of the semiconductor temperature control device is not significantly different between low and high-temperature conditions. Therefore, under high-temperature conditions, as the evaporation temperature rises, the upper limit of the refrigeration system's cooling capacity is large, but the heat load within the processing cavity does not increase. This causes a significant drop in the refrigeration system's output ratio, meaning the electronic expansion valve of the refrigeration system is prone to entering a small-opening dead zone, resulting in inaccurate adjustment and unstable temperature control.

[0029] The following is combined with Figures 1-5 The present invention describes a dual-cycle temperature control device and its control method.

[0030] Figure 1 This is one of the structural schematic diagrams of the dual-cycle temperature control device provided by the present invention. Figure 2 This is the second structural schematic diagram of the dual-cycle temperature control device provided by the present invention. (See also...) Figure 1 and Figure 2 The dual-cycle temperature control device includes: a refrigeration system, a dual-cycle system, and an evaporator 1; the refrigeration pipeline of the refrigeration system is connected to the heat absorption passage of the evaporator 1; the dual-cycle system includes an external circulation pipeline, an internal circulation pipeline, two four-way reversing valves, and a heat exchanger 2; the four-way reversing valves are used to switch the circulation pipeline connected to the heat release passage of the evaporator 1 and to switch the circulation pipeline connected to the heat release passage of the heat exchanger 2; the heat exchanger 2 is used for heat exchange between the external circulation pipeline and the internal circulation pipeline.

[0031] Specifically, the circulation pipeline refers to either the external circulation pipeline or the internal circulation pipeline. The external circulation pipeline is used to control the outlet temperature. The refrigeration system can be a single-stage refrigeration cycle or a low-temperature stage of a cascade refrigeration cycle.

[0032] like Figure 1 and Figure 2 As shown, the dual-circulation temperature control device is equipped with two four-way reversing valves in its dual-circulation system. By rotating and switching the two four-way reversing valves, the connection between the heat release path of evaporator 1 and the internal circulation pipeline and the external circulation pipeline can be switched. At the same time, the connection between the heat release path of heat exchanger 2 and the external circulation pipeline can also be switched.

[0033] When the dual-cycle temperature control device switches to high-temperature operation, such as Figure 1 As shown, rotate and switch the two four-way reversing valves to connect the heat dissipation passage of evaporator 1 with the internal circulation pipeline, as follows. Figure 1 The loop shown by the dashed line; the heat dissipation passage of heat exchanger 2 is connected to the external circulation pipeline, such as... Figure 1 The loop is shown by the solid line on the right side. At this time, the external circulation pipeline and the internal circulation pipeline work simultaneously. The external circulation pipeline and the internal circulation pipeline exchange heat through heat exchanger 2, and the internal circulation pipeline exchanges heat with the refrigeration pipeline through evaporator 1.

[0034] When the dual-cycle temperature control device switches to low-temperature operation, such as Figure 2 As shown, rotate and switch the two four-way reversing valves to connect the heat dissipation passage of evaporator 1 with the external circulation pipeline, as follows. Figure 2 The loop shown by the dashed line; the heat dissipation passage of heat exchanger 2 is connected to the internal circulation pipeline, such as... Figure 2The loop is shown by the solid line on the right side. At this time, the internal circulation pipe is stopped and not working, and the external circulation pipe exchanges heat with the refrigeration pipe through the evaporator 1.

[0035] The dual-cycle temperature control device provided by this invention allows for switching between the circulation pipeline connected to the heat exchanger's heat release path and the circulation pipeline connected to the evaporator's heat release path via two four-way reversing valves under low-temperature or high-temperature operating conditions. This controls the heat exchange mode of the dual-cycle system (refrigerant circulation system) and the refrigeration system. Under high-temperature conditions, heat exchange occurs through the heat exchanger via both the external and internal circulation pipelines. The internal circulation pipeline exchanges heat with the refrigeration pipeline via the evaporator. This dual heat exchange reduces the temperature difference within the evaporator, keeping the superheat of the refrigeration compressor's suction gas within a suitable range. This improves the operating state of the refrigeration system under high-temperature conditions, making its operation more stable and optimizing its stability, thus enhancing temperature control accuracy. Furthermore, the outlet temperature of the dual-cycle temperature control device can be controlled by adjusting the flow rate of the constant-temperature low-temperature circulating liquid within the heat exchanger to regulate the external circulating liquid. Compared to regulating the entire refrigeration system, this provides more linear control over heat exchange, resulting in higher outlet temperature control accuracy.

[0036] Based on the above embodiments, the external circulation pipeline further includes an external circulation pump 3 and a first temperature sensor 4 for measuring the outlet temperature; the outlet of the external circulation pump 3 is connected to the first four-way reversing valve 5 of the two four-way reversing valves; the inlet of the first temperature sensor 4 is connected to the second four-way reversing valve 6 of the two four-way reversing valves; the external circulation pump 3 and the first temperature sensor 4 are connected to both sides of the wafer processing cavity base 7.

[0037] See Figure 1 Under high-temperature conditions, the external circulation pipeline, the heat dissipation passage of the heat exchanger 2, and the wafer processing cavity base 7 form an external circulation liquid circuit. The external circulation liquid circuit includes an external circulation pump 3, a first four-way reversing valve 5, the heat dissipation passage of the heat exchanger 2, a second four-way reversing valve 6, a first temperature sensor 4, and a wafer processing cavity base 7 connected in sequence.

[0038] See Figure 2 Under low-temperature conditions, the external circulation pipeline, the heat dissipation passage of the evaporator 1 and the wafer processing cavity base 7 form an external circulation liquid circuit. The external circulation liquid circuit includes an external circulation pump 3, a first four-way reversing valve 5, the heat dissipation passage of the evaporator 1, a second four-way reversing valve 6, a first temperature sensor 4 and a wafer processing cavity base 7 connected in sequence.

[0039] It should be noted that the first temperature sensor 4 is located on the inlet side of the wafer processing cavity base 7, and the external circulation pump 3 is located on the outlet side of the wafer processing cavity base 7.

[0040] Thus, by installing an external circulation pump on the external circulation pipeline, the circulating fluid in the pipeline can be circulated. By placing the first temperature sensor and the external circulation pump on both sides of the wafer processing cavity base, the first temperature sensor can detect the temperature of the circulating fluid flowing into the wafer processing cavity base, i.e., the outlet temperature. This helps to provide a suitable temperature environment for the etching process and ensures the smooth progress of the etching process.

[0041] Based on the above embodiments, the internal circulation pipeline further includes an internal circulation pump 8, a three-way regulating valve 9, and a second temperature sensor 10; the outlet of the internal circulation pump 8 is connected to the first four-way reversing valve 5 of the two four-way reversing valves; the inlet of the second temperature sensor 10 is connected to the second four-way reversing valve 6 of the two four-way reversing valves; the outlet of the second temperature sensor 10 is connected to the inlet of the three-way regulating valve 9; the first outlet of the three-way regulating valve 9 is connected to the inlet of the heat absorption passage of the heat exchanger 2; the second outlet of the three-way regulating valve 9 and the outlet of the heat absorption passage of the heat exchanger 2 are respectively connected to the inlet of the internal circulation pump 8.

[0042] Specifically, the three-way regulating valve 9 is an electric three-way regulating valve.

[0043] See Figure 1 Under high-temperature conditions, the internal circulation pipeline, the heat release passage of evaporator 1, and the heat absorption passage of heat exchanger 2 form an internal circulation liquid loop. This internal circulation liquid loop includes, in sequence, an internal circulation pump 8, a first four-way reversing valve 5, the heat release passage of evaporator 1, a second four-way reversing valve 6, a second temperature sensor 10, a three-way regulating valve 9, and the heat absorption passage of heat exchanger 2. Under high-temperature conditions, the internal circulation system is in the start-up or working state, that is, the internal circulation pump 8 is turned on.

[0044] See Figure 2 Under low-temperature conditions, the internal circulation pipeline, the heat release passage of heat exchanger 2, and the heat absorption passage of heat exchanger 2 form an internal circulation liquid loop. This internal circulation liquid loop includes, in sequence, an internal circulation pump 8, a first four-way reversing valve 5, the heat release passage of heat exchanger 2, a second four-way reversing valve 6, a second temperature sensor 10, a three-way regulating valve 9, and the heat absorption passage of heat exchanger 2. Under low-temperature conditions, the internal circulation system is in a stopped state, that is, the internal circulation pump 8 is turned off.

[0045] Thus, by installing an internal circulation pump in the internal circulation pipeline, the circulating fluid in the pipeline can be circulated. By placing the second temperature sensor on the inlet side of the three-way regulating valve and connecting the first outlet of the three-way regulating valve to the inlet of the heat exchanger's absorption passage, the second temperature sensor can detect the temperature of the circulating fluid flowing into the heat exchanger. This helps to maintain a suitable temperature difference between the medium (circulating fluid) on both sides of the heat exchanger under high-temperature conditions, ensuring high heat exchange efficiency and providing a suitable temperature environment for the etching process, thus guaranteeing its smooth operation.

[0046] Based on the above embodiments, the refrigeration pipeline further includes a refrigeration compressor 11, a condenser 12, and an electronic expansion valve 13 connected in sequence; the electronic expansion valve is connected to the inlet of the heat absorption passage of the evaporator; the inlet of the refrigeration compressor is connected to the outlet of the heat absorption passage of the evaporator; the inlet of the condenser is connected to the outlet of the refrigeration compressor; and the outlet of the condenser is connected to the electronic expansion valve.

[0047] See Figure 1 and Figure 2 Under high-temperature or low-temperature conditions, the refrigeration pipeline and the heat absorption passage of the evaporator 1 form a refrigeration circulating liquid circuit. This refrigeration circulating liquid circuit includes the heat absorption passage of the refrigeration compressor 11, condenser 12, electronic expansion valve 13 and evaporator 1 connected in sequence.

[0048] By installing a refrigeration compressor, condenser, and electronic expansion valve on the refrigeration pipeline, and by adjusting the electronic expansion valve, the refrigeration temperature and refrigeration capacity of the refrigeration system can be regulated. This helps to provide a suitable temperature environment for the etching process and ensures the smooth progress of the etching process.

[0049] The control method of the dual-cycle temperature control device provided by the present invention is described below. The control method of the dual-cycle temperature control device described below can be referred to in correspondence with the dual-cycle temperature control device described above.

[0050] Figure 3 This is a flowchart illustrating the control method of the dual-cycle temperature control device provided by the present invention. See [link / reference]. Figure 3 As shown, the method includes steps 301-304, wherein: Step 301: Obtain the current set outlet temperature of the dual-cycle temperature control device, wherein the dual-cycle temperature control device is the aforementioned dual-cycle temperature control device.

[0051] Specifically, the dual-cycle temperature control device is the dual-cycle temperature control device described above in this invention. The currently set outlet temperature refers to the temperature corresponding to the etching process that needs to be performed, that is, the temperature that needs to be controlled and reached by the dual-cycle temperature control device, which is also the target outlet temperature.

[0052] In practical applications, there are several methods to obtain the currently set exit temperature. One method is to identify the current etching process and compare it with a pre-stored temperature lookup table. The temperature at which a match is found is determined as the currently set exit temperature. This lookup table lists the temperatures corresponding to each etching process. Another method is to display an input page for the currently set exit temperature on a monitor, allowing operators to input the set temperature. Alternatively, the currently set exit temperature can be directly received from an external source.

[0053] Step 302: Determine the operating condition type of the dual-cycle temperature control device based on the current set outlet temperature.

[0054] Specifically, operating condition type refers to the type of working condition, including two categories: high temperature operating condition and low temperature operating condition.

[0055] In practical applications, after obtaining the current set outlet temperature, the current set outlet temperature can be compared with the temperature corresponding to each operating condition to determine the operating condition type of the dual-cycle temperature control device; alternatively, the current set outlet temperature can be compared with the reference temperature to determine the operating condition type of the dual-cycle temperature control device.

[0056] For example, the temperature range corresponding to high-temperature operating conditions is 0 degrees Celsius and above, while the temperature range corresponding to low-temperature operating conditions is below 0 degrees Celsius. If the current set outlet temperature is 10 degrees Celsius, then the operating condition type of the dual-cycle temperature control device is high-temperature operating condition.

[0057] Step 304: When the operating condition is high temperature, control the two four-way reversing valves to connect the heat release passage of the evaporator with the internal circulation pipeline, and the heat release passage of the heat exchanger with the external circulation pipeline, so that the external circulation pipeline and the internal circulation pipeline exchange heat through the heat exchanger, and the internal circulation pipeline and the refrigeration pipeline exchange heat through the evaporator.

[0058] In practical applications, when the dual-cycle temperature control device is operating under high-temperature conditions, such as Figure 1 As shown, the two four-way reversing valves are controlled to switch and rotate, connecting the heat dissipation passage of evaporator 1 with the internal circulation pipeline, as follows. Figure 1 The loop shown by the dashed line; the heat dissipation passage of heat exchanger 2 is connected to the external circulation pipeline, such as... Figure 1 The loop is shown by the solid line on the right side. At this time, the external circulation pipeline and the internal circulation pipeline work simultaneously. The external circulation pipeline and the internal circulation pipeline exchange heat through heat exchanger 2. The internal circulation pipeline exchanges heat with the refrigeration pipeline through evaporator 1, so that the outlet temperature of the external circulation pipeline is consistent with the currently set outlet temperature.

[0059] The dual-cycle temperature control device and method provided by this invention uses two four-way reversing valves to switch between the circulation pipeline connected to the heat release path of the heat exchanger and the circulation pipeline connected to the heat release path of the evaporator, thereby controlling the heat exchange mode of the dual-cycle system (refrigerant circulation system) and the refrigeration system. Under high-temperature conditions, heat exchange occurs through the heat exchanger via the external and internal circulation pipelines. The internal circulation pipeline exchanges heat with the refrigeration pipeline via the evaporator. This dual heat exchange reduces the temperature difference within the evaporator, keeping the superheat of the refrigeration compressor suction gas within a suitable range. This improves the operating state of the refrigeration system under high-temperature conditions, making its operation more stable, optimizing its stability under high-temperature conditions, and improving temperature control accuracy. Furthermore, the outlet temperature of the dual-cycle temperature control device can be controlled by adjusting the flow rate of the constant-temperature low-temperature circulating liquid in the heat exchanger to regulate the external circulating liquid. Compared to regulating the refrigeration system, this provides more linear control over the heat exchange, and the outlet temperature control accuracy of the dual-cycle temperature control device is higher.

[0060] It should be noted that the dual-cycle temperature control device provided by this invention avoids the problem that the upper limit of the cooling capacity of the refrigeration system is large as the evaporation temperature increases under high-temperature conditions, while the heat load in the processing cavity does not increase, resulting in a significant decrease in the output ratio of the refrigeration system. In other words, it avoids the problem that the electronic expansion valve of the refrigeration system is prone to entering the small opening dead zone, resulting in inaccurate adjustment and unstable temperature control, thus further ensuring the stability and accuracy of temperature control.

[0061] Optionally, to further improve temperature control accuracy, the electronic expansion valve in the refrigeration piping can also be adjusted. That is, the dual-cycle temperature control device control method also includes: The real-time measured temperature and target temperature of the second temperature sensor in the internal circulation pipeline are obtained; The opening of the electronic expansion valve in the refrigeration pipeline is adjusted based on the difference between the real-time measured temperature and the target temperature.

[0062] Specifically, the target temperature refers to the target value set for the second temperature sensor.

[0063] In practical applications, the real-time measured temperature of the second temperature sensor can be collected first, and the target temperature of the second temperature sensor can be obtained.

[0064] There are several ways to obtain the target temperature of the second temperature sensor. It can be based on a pre-set specific value, such as 10 degrees, 0 degrees, etc.; or it can be based on the current operating condition to determine the selected temperature. For example, a high temperature condition corresponds to 10 degrees, and a low temperature condition corresponds to -10 degrees. If the current operating condition is high temperature, then the target temperature is 10 degrees.

[0065] Preferably, when obtaining the target temperature of the second temperature sensor, it can be determined based on the current set outlet temperature, the lowest set outlet temperature of the dual-cycle temperature control device, and a preset value. For example, the difference between the current set outlet temperature and 10 is taken as the first temperature, the sum of the lowest set outlet temperature and the preset value is taken as the second temperature, and the minimum value between the first temperature and the second temperature is taken as the target temperature of the second temperature sensor, as shown in Equation 1.

[0066] T' = MIN(T - 10, x + m) (Equation 1) Where T' is the target temperature, T is the current set outlet temperature, x is the minimum set outlet temperature, and m is the preset value.

[0067] In this way, the temperature difference between the medium (circulating liquid) on both sides of the heat exchanger can be kept high, not less than 10 degrees, which can ensure that the heat exchanger has a high heat exchange efficiency.

[0068] Furthermore, the difference between the real-time measured temperature and the target temperature is calculated. Then, based on this difference, the opening of the electronic expansion valve is adjusted using a PID (Proportion Integral Differential) algorithm. That is, the difference is used as the input of the PID algorithm, and the opening of the electronic expansion valve in the refrigeration pipeline is adjusted according to the output of the PID algorithm.

[0069] See Figure 4 , Figure 4 This invention provides a schematic flowchart for controlling the second temperature sensor under high-temperature conditions: The real-time measured temperature (temperature measurement value) of the second temperature sensor is acquired. Then, the difference between the real-time measured temperature and the target temperature is calculated, which is obtained by subtracting the target temperature from the real-time measured temperature of the second temperature sensor. Next, a PID algorithm is used to adjust the opening of the electronic expansion valve. The difference is input into the PID algorithm to calculate the target opening value of the electronic expansion valve. The opening of the electronic expansion valve is adjusted according to the target opening value, thereby achieving constant temperature control of the second temperature sensor.

[0070] Thus, by measuring the temperature and target temperature in real time through the second temperature sensor, not only can the opening of the electronic expansion valve be adjusted, but also the appropriate superheat at the evaporator outlet can be controlled, thereby adjusting the cooling capacity of the refrigeration system and achieving constant temperature control of the dual-cycle temperature control device.

[0071] Optionally, to ensure a constant outlet temperature, the opening of the three-way regulating valve can also be adjusted. That is, the dual-cycle temperature control device control method also includes: Obtain the real-time outlet temperature of the first temperature sensor in the external circulation pipeline; The opening of the three-way regulating valve in the internal circulation pipeline is adjusted based on the difference between the real-time outlet temperature and the currently set outlet temperature.

[0072] In practical applications, the real-time outlet temperature of the first temperature sensor can be collected first, and then the difference between the real-time outlet temperature and the current set outlet temperature can be calculated. Based on this difference, the opening of the three-way regulating valve can be adjusted using the PID (Proportion Integral Differential) algorithm. That is, the difference is used as the input of the PID algorithm, and the opening of the three-way regulating valve in the internal circulation pipeline is adjusted according to the output of the PID algorithm.

[0073] See Figure 5 , Figure 5 This invention provides a schematic flowchart for controlling the first temperature sensor under high-temperature conditions: The real-time outlet temperature (measured temperature value) of the first temperature sensor is collected. Then, the difference between the real-time outlet temperature and the currently set outlet temperature is calculated, which is obtained by subtracting the real-time outlet temperature from the currently set outlet temperature. Next, a PID algorithm is used to adjust the opening of the three-way control valve. The difference is input into the PID algorithm to calculate the target opening value of the three-way control valve. The opening of the three-way control valve is adjusted according to the target opening value, thereby achieving constant temperature control of the first temperature sensor.

[0074] Thus, by using the real-time outlet temperature of the first temperature sensor and the currently set outlet temperature, not only can the opening of the three-way regulating valve be adjusted, but the heat exchange in the heat exchanger can also be controlled, ensuring that the outlet temperature of the dual-cycle temperature control device remains constant.

[0075] It should be noted that under high-temperature conditions, the target temperature for the refrigeration system can be changed to the second temperature sensor, and a suitable target temperature can be set for the second temperature sensor. The outlet temperature of the dual-cycle temperature control device can then be kept constant by adjusting the electric three-way valve.

[0076] Optionally, the process of determining the operating condition type of the dual-cycle temperature control device based on the currently set outlet temperature can be implemented as follows: Compare the currently set outlet temperature with the reference temperature; When the current set outlet temperature is lower than the reference temperature, the operating condition of the dual-cycle temperature control device is determined to be a low-temperature operating condition. If the current set outlet temperature is greater than or equal to the reference temperature, the operating condition of the dual-cycle temperature control device is determined to be a high-temperature operating condition.

[0077] Specifically, reference temperature refers to the temperature used to measure high-temperature and low-temperature operating conditions.

[0078] In practical applications, the reference temperature can be obtained first. The reference temperature may be a directly obtained temperature value, for example, 10°C, 20°C, etc.; it may also be determined based on the minimum set outlet temperature of the dual-cycle temperature control device and a preset value. For example, the sum of the minimum set outlet temperature and the preset value is used as the reference temperature, wherein the preset value is a constant value obtained through system configuration and debugging, and generally ranges from 10 to 20.

[0079] Further, if the current set outlet temperature is lower than the reference temperature, it is determined that the dual-cycle temperature control device is in a low-temperature working condition; if the current set outlet temperature is higher than or equal to the reference temperature, it is determined that the dual-cycle temperature control device is in a high-temperature working condition.

[0080] For example, when T<x+m, the dual-cycle temperature control device is in a low-temperature working condition; when T≥x+m, the dual-cycle temperature control device is in a high-temperature working condition, wherein T is the current set outlet temperature, x is the minimum set outlet temperature, and m is the preset value.

[0081] In this way, the working condition type of the dual-cycle temperature control device can be quickly determined through the comparison between the current set outlet temperature and the reference temperature, which is conducive to adopting different heat exchange modes according to the working condition type, and further improves the temperature control accuracy of the dual-cycle temperature control device.

[0082] Optionally, after determining the working condition type of the dual-cycle temperature control device according to the current set outlet temperature, the method further includes: When the working condition type is a low-temperature working condition, control the two four-way reversing valves to communicate the heat release path of the evaporator with the outer circulation pipeline, and communicate the heat release path of the heat exchanger with the inner circulation pipeline, so that the outer circulation pipeline and the refrigeration pipeline exchange heat through the evaporator.

[0083] In practical applications, when the dual-cycle temperature control device is in a low-temperature working condition, as Figure 2 shows, the two four-way reversing valves are controlled to switch and rotate, so that the heat release path of the evaporator 1 is communicated with the outer circulation pipeline, as shown by Figure 2 the dashed line in the figure; the heat release path of the heat exchanger 2 is communicated with the inner circulation pipeline, as shown by Figure 2 the solid line on the right side in the figure. At this time, the inner circulation pipeline is in a stopped state and does not work, and the outer circulation pipeline exchanges heat with the refrigeration pipeline through the evaporator 1. In this way, when the dual-cycle temperature control device is in a low-temperature working condition, the inner circulation pipeline is deactivated, which can reduce resource waste while ensuring constant temperature control.

[0084] Optionally, when the dual-cycle temperature control device is in a low-temperature working condition, the temperature control accuracy can be further improved by adjusting the opening degree of the electronic expansion valve. That is, the control method of the dual-cycle temperature control device further includes at least one of the following: Acquiring a real-time outlet temperature of a first temperature sensor in the external circulation pipeline; adjusting an opening degree of an electronic expansion valve in the refrigeration pipeline according to a difference between the real-time outlet temperature and a current set outlet temperature; Acquiring a superheat degree of the evaporator; correcting the opening degree of the electronic expansion valve in the refrigeration pipeline according to the superheat degree.

[0085] In practical application, the real-time outlet temperature of the first temperature sensor can be collected, then the difference between the real-time outlet temperature and the current set outlet temperature is calculated, and based on the difference, a PID algorithm is used to adjust the opening degree of the electronic expansion valve, that is, the difference is taken as the input of the PID algorithm, and the opening degree of the electronic expansion valve in the refrigeration pipeline is adjusted according to the output of the PID algorithm. The superheat degree of the evaporator can be acquired, and the opening degree of the electronic expansion valve in the refrigeration pipeline is adjusted according to the superheat degree. In order to improve the adjustment accuracy, the opening degree of the electronic expansion valve can be adjusted according to the difference between the real-time outlet temperature and the current set outlet temperature, and the opening degree of the electronic expansion valve can be corrected according to the superheat degree of the evaporator. In this way, by adjusting the opening degree of the electronic expansion valve, the cooling capacity of the refrigeration system is adjusted, and constant temperature control of the dual-cycle temperature control device is realized.

[0086] The following combination of Figure 1 and Figure 2 describes the control method of the dual-cycle temperature control device provided by the present invention.

[0087] Set the minimum design temperature (minimum set outlet temperature) of the outlet temperature of the dual-cycle temperature control device as x, and the preset value as m.

[0088] When the current set outlet temperature T of the dual-cycle temperature control device is less than x+m, the dual-cycle temperature control device is in a low-temperature working condition, as shown in Figure 1 , wherein m is a preset value. At this time, the temperature difference between the evaporation temperature of the refrigerant in the evaporator 1 and the temperature of the circulating fluid is appropriate, the opening degree of the electronic expansion valve 13 is adjusted according to the temperature measurement value (real-time outlet temperature) of the first temperature sensor 4, and an appropriate outlet superheat degree of the evaporator 1 is controlled at the same time, so as to adjust the cooling capacity of the refrigeration system and realize constant temperature control of the dual-cycle temperature control device. In this mode, the PID algorithm is used to adjust the electronic expansion valve 13 according to the actual temperature difference at the outlet point (the difference between the real-time outlet temperature and the current set outlet temperature), and the electronic expansion valve 13 can also be corrected according to the outlet superheat degree of the evaporator 1.

[0089] When the current set outlet temperature T of the dual-cycle temperature control device is greater than or equal to x+m, the dual-cycle temperature control device is in a high-temperature working condition, and it is necessary to switch the first four-way reversing valve 5 and the second four-way reversing valve 6. The dual-cycle temperature control device after switching is as shown in Figure 2As shown. In the internal circulation pipeline, the external circulation pump 3 is started, and the target temperature T' of the second temperature sensor 10 is set to MIN(T-10, x+m), which ensures that the temperature difference of the medium (circulating liquid) on both sides of the heat exchanger 2 is not less than 10℃, ensuring that the heat exchanger 2 has a high heat exchange efficiency. At the same time, it ensures that the temperature difference of the medium (circulating liquid) on both sides of the evaporator 1 is not too high. In this operating state, the opening of the electronic expansion valve 13 is adjusted according to the real-time measured temperature of the second temperature sensor 10 and the target temperature, and the appropriate outlet superheat of the evaporator 1 is controlled, thereby adjusting the cooling capacity of the refrigeration system and realizing constant temperature control of the internal circulation liquid. In addition, the opening of the three-way regulating valve 9 can be adjusted using a PID algorithm according to the temperature difference of the first temperature sensor 4 (the difference between the real-time outlet temperature and the currently set outlet temperature), controlling the heat exchange in the heat exchanger 2, and ensuring that the outlet temperature of the dual circulation temperature control device is constant.

[0090] Figure 6 An example is a schematic diagram of the physical structure of an electronic device, such as... Figure 6 As shown, the electronic device may include a processor 610, a communication interface 620, a memory 630, and a communication bus 640, wherein the processor 610, the communication interface 620, and the memory 630 communicate with each other through the communication bus 640. The processor 610 can call logic instructions in the memory 630 to execute a dual-cycle temperature control device control method, which includes: obtaining the current set outlet temperature of the dual-cycle temperature control device, wherein the dual-cycle temperature control device is the aforementioned dual-cycle temperature control device; determining the operating condition type of the dual-cycle temperature control device based on the current set outlet temperature; and, when the operating condition type is a high-temperature operating condition, controlling two four-way reversing valves to connect the heat dissipation passage of the evaporator to the inner circulation pipeline, and the heat dissipation passage of the heat exchanger to the outer circulation pipeline, so that the outer circulation pipeline and the inner circulation pipeline exchange heat through the heat exchanger, and the inner circulation pipeline and the refrigeration pipeline exchange heat through the evaporator.

[0091] Furthermore, the logical instructions in the aforementioned memory 630 can be implemented as software functional units and, when sold or used as independent products, can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0092] On the other hand, the present invention also provides a computer program product, which includes a computer program that can be stored on a non-transitory computer-readable storage medium. When the computer program is executed by a processor, the computer can execute the dual-cycle temperature control device control method provided by the above methods. The method includes: obtaining the current set outlet temperature of the dual-cycle temperature control device, wherein the dual-cycle temperature control device is the dual-cycle temperature control device described above; determining the operating condition type of the dual-cycle temperature control device based on the current set outlet temperature; and, when the operating condition type is a high-temperature operating condition, controlling two four-way reversing valves to connect the heat dissipation passage of the evaporator to the inner circulation pipeline and the heat dissipation passage of the heat exchanger to the outer circulation pipeline, so that the outer circulation pipeline and the inner circulation pipeline exchange heat through the heat exchanger, and the inner circulation pipeline and the refrigeration pipeline exchange heat through the evaporator.

[0093] In another aspect, the present invention also provides a non-transitory computer-readable storage medium storing a computer program thereon, which, when executed by a processor, implements the dual-cycle temperature control device control method provided by the above methods. The method includes: obtaining the current set outlet temperature of the dual-cycle temperature control device, wherein the dual-cycle temperature control device is the dual-cycle temperature control device described above; determining the operating condition type of the dual-cycle temperature control device based on the current set outlet temperature; and, when the operating condition type is a high-temperature operating condition, controlling two four-way reversing valves to connect the heat dissipation passage of the evaporator to the inner circulation pipeline, and the heat dissipation passage of the heat exchanger to the outer circulation pipeline, so that the outer circulation pipeline and the inner circulation pipeline exchange heat through the heat exchanger, and the inner circulation pipeline and the refrigeration pipeline exchange heat through the evaporator.

[0094] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0095] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus necessary general-purpose hardware platforms, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solutions, in essence or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods described in the various embodiments or some parts of the embodiments.

[0096] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A dual-cycle temperature control device, characterized in that, include: Refrigeration system, dual-cycle system and evaporator; The refrigeration piping of the refrigeration system is connected to the heat absorption passage of the evaporator; The dual-circulation system includes an external circulation pipeline, an internal circulation pipeline, two four-way reversing valves, and a heat exchanger; the four-way reversing valves are used to switch the circulation pipeline connected to the heat release path of the evaporator and to switch the circulation pipeline connected to the heat release path of the heat exchanger; the heat exchanger is used for heat exchange between the external circulation pipeline and the internal circulation pipeline. When the dual-cycle temperature control device switches to high-temperature operation, the two four-way reversing valves rotate and switch, the heat release passage of the evaporator is connected to the inner circulation pipeline, and the heat release passage of the heat exchanger is connected to the outer circulation pipeline, so that the outer circulation pipeline and the inner circulation pipeline work simultaneously. The outer circulation pipeline and the inner circulation pipeline exchange heat through the heat exchanger, and the inner circulation pipeline exchanges heat with the refrigeration pipeline through the evaporator. When the dual-cycle temperature control device switches to low-temperature operation, the two four-way reversing valves rotate and switch, the heat release passage of the evaporator is connected to the external circulation pipeline, and the heat release passage of the heat exchanger is connected to the internal circulation pipeline, so that the internal circulation pipeline is in a stopped state and does not work, and the external circulation pipeline exchanges heat with the refrigeration pipeline through the evaporator.

2. The dual-cycle temperature control device according to claim 1, characterized in that, The external circulation pipeline includes an external circulation pump and a first temperature sensor for measuring the outlet temperature; The outlet of the external circulation pump is connected to the first four-way reversing valve of the two four-way reversing valves; the inlet of the first temperature sensor is connected to the second four-way reversing valve of the two four-way reversing valves; the external circulation pump and the first temperature sensor are connected to both sides of the wafer processing cavity base.

3. The dual-cycle temperature control device according to claim 1 or 2, characterized in that, The internal circulation pipeline includes an internal circulation pump, a three-way regulating valve, and a second temperature sensor. The outlet of the internal circulation pump is connected to the first four-way reversing valve of the two four-way reversing valves; the inlet of the second temperature sensor is connected to the second four-way reversing valve of the two four-way reversing valves; the outlet of the second temperature sensor is connected to the inlet of the three-way regulating valve; the first outlet of the three-way regulating valve is connected to the inlet of the heat absorption passage of the heat exchanger; the second outlet of the three-way regulating valve and the outlet of the heat absorption passage of the heat exchanger are respectively connected to the inlet of the internal circulation pump.

4. The dual-cycle temperature control device according to claim 1, characterized in that, The refrigeration piping includes a refrigeration compressor, a condenser, and an electronic expansion valve connected in sequence. The electronic expansion valve is connected to the inlet of the heat absorption passage of the evaporator; the inlet of the refrigeration compressor is connected to the outlet of the heat absorption passage of the evaporator; the inlet of the condenser is connected to the outlet of the refrigeration compressor; and the outlet of the condenser is connected to the electronic expansion valve.

5. A control method for a dual-cycle temperature control device, characterized in that, include: The current set outlet temperature of the dual-cycle temperature control device is obtained, wherein the dual-cycle temperature control device is the dual-cycle temperature control device according to any one of claims 1 to 4; Based on the currently set outlet temperature, determine the operating condition type of the dual-cycle temperature control device; When the operating condition is high temperature, two four-way reversing valves are controlled to connect the heat release path of the evaporator to the internal circulation pipeline, and the heat release path of the heat exchanger to the external circulation pipeline, so that the external circulation pipeline and the internal circulation pipeline exchange heat through the heat exchanger, and the internal circulation pipeline and the refrigeration pipeline exchange heat through the evaporator.

6. The control method for the dual-cycle temperature control device according to claim 5, characterized in that, The method further includes: The real-time measured temperature and target temperature of the second temperature sensor in the internal circulation pipeline are obtained; The opening of the electronic expansion valve in the refrigeration pipeline is adjusted based on the difference between the real-time measured temperature and the target temperature.

7. The control method for the dual-cycle temperature control device according to claim 5 or 6, characterized in that, The method further includes: Obtain the real-time outlet temperature of the first temperature sensor in the external circulation pipeline; The opening of the three-way regulating valve in the internal circulation pipeline is adjusted based on the difference between the real-time outlet temperature and the currently set outlet temperature.

8. The control method for the dual-cycle temperature control device according to claim 5, characterized in that, The step of determining the operating condition type of the dual-cycle temperature control device based on the currently set outlet temperature includes: The current set outlet temperature is compared with a reference temperature, which is determined based on the lowest set outlet temperature and a preset value of the dual-cycle temperature control device. When the current set outlet temperature is lower than the reference temperature, the operating condition of the dual-cycle temperature control device is determined to be a low-temperature operating condition. If the current set outlet temperature is greater than or equal to the reference temperature, the operating condition of the dual-cycle temperature control device is determined to be a high-temperature operating condition.

9. The control method for the dual-cycle temperature control device according to claim 5, characterized in that, After determining the operating condition type of the dual-cycle temperature control device based on the currently set outlet temperature, the method further includes: When the operating condition is low temperature, the two four-way reversing valves are controlled to connect the heat release passage of the evaporator to the external circulation pipeline, and the heat release passage of the heat exchanger to the internal circulation pipeline, so that the external circulation pipeline and the refrigeration pipeline exchange heat through the evaporator.

10. The control method for the dual-cycle temperature control device according to claim 9, characterized in that, The method further includes at least one of the following: Obtain the real-time outlet temperature of the first temperature sensor in the external circulation pipeline; adjust the opening of the electronic expansion valve in the refrigeration pipeline according to the difference between the real-time outlet temperature and the currently set outlet temperature. Obtain the superheat of the evaporator; The opening degree of the electronic expansion valve in the refrigeration pipeline is adjusted according to the superheat.

Citation Information

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