Power quality optimization device

Abstract

The application relates to the technical field of power quality treatment, and particularly discloses a power quality optimization device, which comprises a PCB main circuit part and a machine-mounted structural part; the PCB main circuit part comprises a network-side inductor, a filter plate, an inverter inductor, a power plate, an electrolytic capacitor plate, a main control plate, a fan plate and a switching plate; and the machine-mounted structural part comprises a machine case, a fan assembly and a finned radiator. The electric connection relationship is as follows: the fan assembly is electrically connected with the fan plate; the network-side inductor is electrically connected with the filter plate; the filter plate is electrically connected with the inverter inductor; the inverter inductor is electrically connected with the power plate; the power plate is electrically connected with the electrolytic capacitor plate; the main control plate is electrically connected with the switching plate, the filter plate, the power plate and the fan plate respectively; the load current measured by using a CT is transmitted to the main control plate through the switching plate; and the main control plate controls the filter plate, the power plate and the fan plate. The application realizes forced air cooling heat dissipation based on the detachable fan assembly, so that accurate and rapid power quality treatment is realized.

Description

Technical Field

[0001] The present invention relates to the technical field of power quality management, and in particular to a power quality optimization device. Background Art

[0002] For high-energy-consuming industrial application scenarios such as the steel and metallurgical industry, the petrochemical industry, and the automobile manufacturing industry, their internal power grid systems often have problems with low power factor and substandard power quality. This problem not only affects the normal operation of their internal equipment, but also faces electricity bill fines, resulting in additional economic losses.

[0003] To address this issue, power quality compensation or optimization devices have emerged. Currently, these devices are mainly divided into switching power quality compensation devices and power electronic power quality optimization devices. Switching power quality compensation devices, such as switching capacitors, can only compensate for inductive loads within the grid in a stepped manner, but cannot compensate for capacitive reactive loads. They also have slow response speeds and low compensation accuracy. Some switching devices also experience inrush currents and overvoltages, which not only shorten the device lifespan but also pose safety risks. Power electronic power quality optimization devices, on the other hand, offer the advantages of fast response speeds, high compensation accuracy, no inrush currents and overvoltages, and can manage inductive and capacitive reactive power, as well as harmonics. These devices are widely popular, but traditional power quality optimization devices often suffer from insufficient heat dissipation, and excessively high internal temperatures can affect their normal operation. Summary of the Invention

[0004] In view of the shortcomings and defects of the prior art, the present invention provides a power quality optimization device that realizes forced air cooling and heat dissipation based on a detachable fan assembly.

[0005] The purpose of the present invention can be achieved by the following technical solutions:

[0006] A power quality optimization device comprises a PCB main circuit part and an installation structural part.

[0007] The main circuit part of the PCB includes grid-side inductor, filter board, inverter inductor, power board, electrolytic capacitor board, main control board, fan board, and adapter board.

[0008] The installation structure includes chassis, fan assembly, and finned radiator.

[0009] The chassis consists of an upper cover, a lower shell, three internal support plates, an air inlet panel, and an air outlet panel.

[0010] The power board is equipped with an IGBT module.

[0011] The physical connection relationship is that the upper cover, the air inlet panel and the air outlet panel are all rectangular panels, which are respectively combined and installed with the U-shaped lower shell having a plurality of air holes on both sides to form a rectangular space, i.e. the device shell; in the internal space of the device, the adapter plate is installed on the air outlet panel, the electrolytic capacitor plate is fixed to the position close to the air inlet panel below the upper cover by the first internal support plate, the main control board is fixed to the second internal support plate, the power board, the second internal support plate and the filter plate are fixed to the third internal support plate, the third internal support plate is provided with IGBT fixing holes, one end of the third internal support plate is fixed to the air outlet panel, the IGBT module on the power board passes through the IGBT fixing holes to connect the top end of the finned radiator, the fan assembly is fixed on the fan plate, and the fan plate, the finned radiator, the inverter inductor and the bottom end of the grid-side inductor are sequentially fixed on the U-shaped lower shell in the air inlet direction.

[0012] The electrical connection relationship is that the fan assembly is electrically connected with the fan plate; the grid-side inductor is electrically connected with the filter plate; the filter plate is electrically connected with the inverter inductor; the inverter inductor is electrically connected with the power board; the power board is electrically connected with the electrolytic capacitor plate; the main control board is electrically connected with the adapter plate, the filter plate, the power board and the fan plate, the load current measured by the CT is transmitted to the main control board through the adapter plate, and the main control board controls the filter plate, the power board and the fan plate.

[0013] Further, the case parts are made of sheet metal bending and stamping.

[0014] Further, the fan plate has double-sided fixing supports and side fixing lugs for pressing and fixing the fan assembly.

[0015] Further, the fan assembly includes five detachable axial flow fans, which are fixed on the fan plate by fixing screws.

[0016] Further, the finned radiator is made of aluminum alloy, the fin thickness is 1.0 mm, and the fin spacing is 3.5 mm.

[0017] Further, the internal space of the device is divided into two cold-hot isolated parts by the fan assembly, the IGBT module and the third internal support plate: the communication space between the left side of the fan assembly, the IGBT module and the third internal support plate and the air inlet panel is the first space; the other part of the communication space in the device is the second space.

[0018] Further, the device cooling mode is forced air cooling: after the fan assembly operates, a negative pressure is formed in the first space, cold air outside the device is sucked into the device through the air holes on both sides of the air inlet panel and the lower shell of the device to cool the electrolytic capacitor plate, the filter plate, the power board, the main control board and the adapter plate; at the same time, the axial flow fans operate to blow air to cool the finned radiator, the inverter inductor and the grid-side inductor in the second space.

[0019] The beneficial technical effect of the present invention is that forced air cooling and heat dissipation are achieved based on the detachable fan assembly, thereby achieving accurate and rapid power quality management. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is the electrical topology principle diagram of the power quality optimization device described in the present invention.

[0021] Figure 2 This is a schematic diagram of the PCB board of the power quality optimization device described in the present invention.

[0022] Figure 3 This is a schematic diagram of the installed structural components of the power quality optimization device described in the present invention.

[0023] Figure 4 This is a schematic cross-sectional diagram of the wind path flow direction of the power quality optimization device described in the present invention.

[0024] Figure 5 Schematic diagram of the fan fixing bracket of the power quality optimization device according to the present invention.

[0025] Explanation of the accompanying numbers: 1 is the electrolytic capacitor board, 2 is the power board, 3 is the main control board, 4 is the filter board, 5 is the adapter board, 6 is the grid-side inductor, 7 is the inverter inductor, 8 is the fan board, 9 is the air inlet panel, 10 is the internal support plate, 11 is the upper cover, 12 is the air outlet panel, 13 is the U-shaped lower shell, 14 is the finned heat sink, 15 is the fan assembly, 16 is the IGBT, 17 is the cold and hot isolation boundary schematic line, 18 is the fan assembly fixing screw point, 19 is the fan assembly side fixing ear, 20 is the fan assembly double-sided fixing bracket. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0027] Example:

[0028] like Figure 2 、 3 As shown, a power quality optimization device includes a PCB main circuit part and an installation structural part.

[0029] The main circuit part of the PCB includes the grid-side inductor 6, the filter board 4, the inverter inductor 7, the power board 2, the electrolytic capacitor board 1, the main control board 3, the fan board 8, and the adapter board 5.

[0030] The installation structure includes a chassis, a fan assembly 15, and a finned heat sink 14.

[0031] The chassis includes an upper cover 11 , a U-shaped lower shell 13 , three internal support plates 10 , an air inlet panel 9 , and an air outlet panel 12 .

[0032] An IGBT module 16 is provided on the power board 2 .

[0033] Its physical connection relationship is as follows: the upper cover 11, the air inlet panel 9, and the air outlet panel 12 are all rectangular panels, and the three are respectively combined and installed with a U-shaped lower shell 13 with multiple air holes on both sides to form a rectangular space, that is, the device shell; in the internal space of the device, the adapter plate 5 is installed on the air outlet panel 12, and the electrolytic capacitor plate 1 is fixed upside down under the upper cover 11 near the air inlet panel 9 through the first internal support plate, the main control board 3 is fixed on the second internal support plate, the power board 2, the second internal support plate and the filter board 4 are fixed on the third internal support plate, and the third internal support plate is provided with an IGBT fixing hole. One end of the third internal support plate is fixed to the air outlet panel 12, and the IGBT module 16 on the power board 2 is connected to the top of the finned heat sink 14 through the IGBT fixing hole. The fan assembly 15 is fixed on the fan plate 8, and the bottom ends of the fan plate 8, the finned heat sink 14, the inverter inductor 7, and the grid-side inductor 6 are fixed on the U-shaped lower shell 13 in sequence according to the air inlet direction.

[0034] The electrical connection relationship is as follows: the fan assembly 15 is electrically connected to the fan board 8; the grid-side inductor 6 is electrically connected to the filter board 4; the filter board 4 is electrically connected to the inverter inductor 7; the inverter inductor 7 is electrically connected to the power board 2; the power board 2 is electrically connected to the electrolytic capacitor board 1; the main control board 3 is electrically connected to the adapter board 5, the filter board 4, the power board 2, and the fan board 8 respectively. The load current measured by CT is transmitted to the main control board 3 through the adapter board 5, and the main control board 3 controls the filter board 4, the power board 2, and the fan board 8. Figure 1 shown.

[0035] Each part of the chassis is made of sheet metal bending and stamping.

[0036] like Figure 5 As shown, the fan plate 8 is provided with a double-sided fixing bracket 20 and a side fixing ear 19 for pressing and fixing the fan assembly 15 .

[0037] The fan assembly 15 includes five detachable axial flow fans, which are fixed to the fan plate 8 by fixing screws.

[0038] The finned heat sink 14 is made of aluminum alloy, with a fin thickness of 1.0 mm and a fin spacing of 3.5 mm.

[0039] The internal space of the device is divided into two parts with cold and hot isolation by the fan assembly 15, the top of the fin-type radiator 14, and the third internal support plate: the connecting space between the fan assembly 15, the top of the fin-type radiator 14, the left side of the third internal support plate and the air inlet panel 9 is the first space, and the first space contains components with slightly heated components; the other part of the connecting space inside the device is the second space, and the second space contains components with severely heated components.

[0040] like Figure 4 As shown, the heat dissipation method of the device is forced air cooling: after the fan assembly 15 is running, negative pressure is formed in the first space, and cold air outside the device is sucked in from the air vents on both sides of the air inlet panel 9 and the U-shaped lower shell 13 of the device to dissipate heat for the electrolytic capacitor board 1, the filter board 4, the power board 2, the main control board 3, and the adapter board 5; at the same time, the axial flow fan is running to blow air to dissipate heat for the finned heat sink 14, the inverter inductor 7, and the grid-side inductor 6 in the second space.

[0041] like Figure 2 As shown, the electrolytic capacitor board 1 is sensitive to high temperature environment. Its life span is reduced by half for every 10°C increase in ambient temperature. Its function is to store DC energy and provide DC bus voltage. The main component of the power board 2 is the IGBT module 16. The function of the IGBT module 16 is to convert the AC current of the power grid into DC current. The main components of the filter board 4 are film capacitors and relays, among which the relays are used to control the on and off of this equipment. The inverter inductor 7, the grid-side inductor 6 and the film capacitors on the filter board 4 are combined into an LCL filter, which is used to filter a large number of high-order harmonics generated by the IGBT module 16 and improve the current quality fed back to the power grid by the equipment. The fan board 8 is used for fan control and power supply.

[0042] like Figure 3 As shown, the finned heat sink 14 is connected to the IGBT module 16 on the power board 2, with a thermal interface material coated in the middle. Heat is conducted from the IGBT module 16 to the fins of the heat sink 14, and the heat is taken away by forced air cooling. The fan assembly 15 is the core component of forced air cooling.

[0043] like Figure 4 As shown, the overall device has a double-layer compact layout structure, which maximizes the compression of the overall device size. According to actual verification, under the same working conditions, the temperature rise of the electrolytic capacitor plate 1 using the inverted fixing method is about 10 to 15 degrees Celsius lower than that using the upright fixing method, which can greatly extend the service life of the electrolytic capacitor. 17 is a schematic line for the hot and cold isolation boundary. The left and upper parts of the dotted line are components with slight heat generation. High temperature environment will seriously reduce their lifespan. The lower right part of the dotted line is a component with severe heat generation.

[0044] like Figure 5As shown, screws are used to press and fix the fan on both sides, which reduces the local force strength of the fan, avoids a corner of the fan from being crushed, and makes the fixation more stable and secure, avoids fan vibration and noise, and extends the service life of the fan; the side fixing ears 19 of the fan assembly are fixed to the side wall of the U-shaped lower shell 13 by fixing screws, and the fan assembly 15 can be removed and replaced by removing the air inlet panel 9 and removing the fan assembly fixing screw points 18 in turn, which is convenient for later maintenance.

[0045] After the power quality optimization device described in the present invention is connected to the power grid, the AC power in the power grid is input into the device and converted into DC power for providing internal positive and negative DC bus voltages mainly through the IGBT module 16. Based on the cooperation between the high-frequency and high-power IGBT module 16 and the LCL filter and the support of other components, the regulated AC current and voltage are output to the power grid in real time and quickly, completing the accurate and dynamic compensation and optimization of the power quality of the power grid.

[0046] The above embodiments are illustrations of specific implementation methods of the present invention, rather than limitations of the present invention. Technicians in the relevant technical fields may make various transformations and changes to obtain corresponding equivalent technical solutions without departing from the spirit and scope of the present invention. Therefore, all equivalent technical solutions should be included in the patent protection scope of the present invention.

Claims

1. A power quality optimization device, characterized in that: Including the PCB main circuit part and the installation structure part; The main circuit part of the PCB includes the grid-side inductor, filter board, inverter inductor, power board, electrolytic capacitor board, main control board, fan board, and adapter board; The installation structure includes chassis, fan assembly, and finned radiator; The finned heat sink is made of aluminum alloy, with a fin thickness of 1.0mm and a fin spacing of 3.5mm; The chassis includes an upper cover, a U-shaped lower shell, three internal support plates, an air inlet panel, and an air outlet panel; The power board is equipped with an IGBT module; Its physical connection relationship is as follows: the upper cover, air inlet panel and air outlet panel are all rectangular panels, and the three are respectively installed in combination with a U-shaped lower shell with multiple air holes on both sides to form a rectangular space, that is, the device shell; in the internal space of the device, the adapter plate is installed on the air outlet panel, the electrolytic capacitor plate is fixed upside down under the upper cover near the air inlet panel through the first internal support plate, the main control board is fixed on the second internal support plate, the power board, the second internal support plate and the filter board are fixed on the third internal support plate, the third internal support plate is provided with an IGBT fixing hole, one end of the third internal support plate is fixed to the air outlet panel, the IGBT module on the power board is connected to the top of the fin-type heat sink through the IGBT fixing hole, the fan assembly is fixed on the fan board, and the bottom ends of the fan board, fin-type heat sink, inverter inductor and grid-side inductor are fixed on the U-shaped lower shell in sequence according to the air inlet direction; the fan board is provided with a double-sided fixing bracket and a side fixing ear for pressing and fixing the fan assembly; Its electrical connection relationship is as follows: the fan assembly is electrically connected to the fan board; the grid-side inductor is electrically connected to the filter board; the filter board is electrically connected to the inverter inductor; the inverter inductor is electrically connected to the power board; the power board is electrically connected to the electrolytic capacitor board; the main control board is electrically connected to the adapter board, filter board, power board, and fan board respectively. The load current measured by CT is transmitted to the main control board through the adapter board, and the main control board controls the filter board, power board, and fan board. The internal space of the device is divided into two parts with cold and hot isolation by the fan assembly, IGBT module, and third internal support plate: the connecting space between the fan assembly, IGBT module, the left side of the third internal support plate and the air inlet panel is the first space; the other connecting space inside the device is the second space; The device adopts forced air cooling as the heat dissipation method: after the fan assembly is running, negative pressure is formed in the first space, and cold air outside the device is sucked in from the air inlet panel and the air vents on both sides of the U-shaped lower shell of the device to dissipate heat for the electrolytic capacitor board, filter board, power board, main control board, and adapter board; at the same time, the axial fan runs to blow air to dissipate heat for the finned heat sink, inverter inductor, and grid-side inductor in the second space.

2. The power quality optimization device according to claim 1, characterized in that: Each part of the chassis is made of sheet metal bending and stamping.

3. The power quality optimization device according to claim 1, characterized in that: The fan assembly includes five detachable axial-flow fans, which are fixed to the fan plate with fixing screws.

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