electronic control device

Abstract

An electronic control device includes a housing, a first plate disposed within the housing, a second plate disposed within the housing such that an inner surface of the second plate faces an inner surface of the first plate, a first control module disposed within the housing, and a second control module disposed within the housing. The first control module includes a first printed circuit board having an inner surface that is bonded to one side of the first plate and one side of the second plate, a first power supply substrate disposed on an outer surface of the second plate, and a first EMI filter disposed between the first plate and the second plate having an inner surface that faces the inner surface of the first printed circuit board. The second control module includes a second printed circuit board having an inner surface that is bonded to another side of the first plate and another side of the second plate, a second power supply substrate disposed on an outer surface of the first plate, and a second EMI filter disposed between the first plate and the second plate having an inner surface that faces the inner surface of the second printed circuit board.

Description

Technical Field

[0001] This embodiment relates to an electronic control device. Background Technology

[0002] As electric devices in automobiles, engine electric devices (starting devices, ignition devices, charging devices) and lighting devices are common, but in recent years, due to the increasing electronic control of vehicles, most systems, including chassis electric devices, have become electrified.

[0003] Generally speaking, electronic control units (ECUs) refer to various electronic control devices that control the internal operation of a vehicle. There are two main types of ECUs: one type operates when the vehicle is off, and the other type does not operate when the vehicle is off.

[0004] The electronic control unit is connected to the motor, and the vehicle's operation can be controlled by controlling the motor. Although many electronic components are housed within the electronic control unit, it is difficult to arrange these components due to the limited space within the housing. Summary of the Invention

[0005] Technical issues

[0006] The purpose of this invention is to provide an electronic control device that can compactly arrange multiple electronic components through improved structure and can achieve miniaturization.

[0007] Technical solution

[0008] The electronic control device according to this embodiment includes: a housing; a first plate disposed within the housing; a second plate disposed within the housing and having an inner surface facing the first plate; a first control module disposed within the housing; and a second control module disposed within the housing, wherein the first control module includes: a first printed circuit board, the inner surface of which is coupled to one side surface of the first plate and one side surface of the second plate; a first power supply substrate disposed on the outer surface of the second plate; and a first EMI filter disposed between the first plate and the second plate, the inner surface of which faces the inner surface of the first printed circuit board; and wherein the second control module includes: a second printed circuit board, the inner surface of which is coupled to another side surface of the first plate and another side surface of the second plate; a second power supply substrate disposed on the outer surface of the first plate; and a second EMI filter disposed between the first plate and the second plate, the inner surface of which faces the inner surface of the second printed circuit board.

[0009] The first printed circuit board and the first power supply substrate are configured to be perpendicular to each other, and the second printed circuit board and the second power supply substrate can be configured to be perpendicular to each other.

[0010] A first pin is formed on one side surface of the first power substrate, and a first pin hole is formed on the first printed circuit board to engage with the first pin. A second pin is formed on one side surface of the second power substrate, and a second pin hole can be formed on the second printed circuit board to engage with the second pin.

[0011] The two side surfaces of the first power substrate face the inner surface of the first printed circuit board and the inner surface of the second printed circuit board, while the two side surfaces of the second power substrate may face the inner surface of the first printed circuit board and the inner surface of the second printed circuit board.

[0012] A first joint and a third joint are provided on the inner surface of the first plate. The first joint and the third joint protrude inward. A first EMI filter is threadedly engaged with the first joint and a second EMI filter is threadedly engaged with the third joint. A second joint and a fourth joint may be provided on the inner surface of the second plate. The second joint and the fourth joint protrude inward. The first EMI filter is threadedly engaged with the second joint and the second EMI filter is threadedly engaged with the fourth joint.

[0013] The first printed circuit board is threadedly engaged with one side surface of the first board and the second board, and the second printed circuit board can be threadedly engaged with the other side surface of the first board and the second board.

[0014] The device includes a lower plate that is coupled to the lower surface of the housing, wherein the lower plate includes a first terminal and a second terminal that face each other relative to the center, and wherein the first terminal can be coupled to the first power substrate and the second terminal can be coupled to the second power substrate.

[0015] A first inductor is disposed on the inner surface of the first EMI filter, and a second inductor is disposed on the inner surface of the second EMI filter. The first inductor and the second inductor can be configured to have a step difference in the vertical direction.

[0016] The first EMI filter includes a first busbar protruding to one side, the first power supply substrate includes a first bonding hole that is coupled to the first busbar, the second EMI filter includes a second busbar protruding to one side, and the second power supply substrate may include a second bonding hole that is coupled to the second busbar.

[0017] A first groove for accommodating the second busbar is provided on the side surface of the second plate, and a second groove for accommodating the first busbar may be provided on the side surface of the first plate.

[0018] Technical effect

[0019] Through this embodiment, multiple control modules can be compactly integrated into a single housing relative to the bracket, and the product is miniaturized.

[0020] Furthermore, since it eliminates the connection structure achieved through welding between multiple electronic components, it has the advantage of being advantageous in terms of manufacturing process.

[0021] In addition, the advantage is that not only can the vertically arranged EMI filter and the power supply board be compactly connected through the busbar module, but the EMI filter can also be firmly fixed in the bracket. Attached Figure Description

[0022] Figure 1 This is a perspective view illustrating the appearance of an electronic control device according to an embodiment of the present invention;

[0023] Figure 2 This is an explanation Figure 1 A perspective view excluding the housing;

[0024] Figure 3 This is an exploded perspective view of an electronic control device according to an embodiment of the present invention;

[0025] Figure 4 yes Figure 3 A magnified view of a portion;

[0026] Figure 5 This is a plan view illustrating the interior of the housing according to an embodiment of the present invention;

[0027] Figure 6 This is a perspective view illustrating the combined structure of the support and the printed circuit board according to an embodiment of the present invention;

[0028] Figure 7 This is a plan view of an EMI filter according to an embodiment of the present invention;

[0029] Figure 8 This is a perspective view illustrating the combined state of the bracket and the EMI filter according to an embodiment of the present invention;

[0030] Figure 9 This is a perspective view of a busbar module according to an embodiment of the present invention;

[0031] Figure 10 This is an exploded perspective view of a busbar module according to an embodiment of the present invention;

[0032] Figure 11 This is a cross-sectional view illustrating the connection state between the busbar and the main body in the busbar module according to an embodiment of the present invention. Detailed Implementation

[0033] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0034] However, the technical concept of the present invention is not limited to the embodiments described, but can be implemented in various forms. Within the scope of the technical concept of the present invention, one or more constituent elements can be selectively combined or substituted among embodiments.

[0035] Furthermore, the terms (including technical and scientific terms) used in the embodiments of this invention, unless explicitly defined and described, can be interpreted as having meanings that are generally understood by those skilled in the art. Common terms, such as those defined in dictionaries, can be interpreted in consideration of the contextual meaning of the relevant technology.

[0036] Furthermore, the terminology used in this specification is for describing embodiments and is not intended to limit the invention. In this specification, singular forms may include plural forms, and unless specifically stated in the phrase, when described as "at least one (or more) of A, B, and C," it may include one or more of all combinations that can be combined with A, B, and C.

[0037] Furthermore, when describing components of embodiments of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are merely for distinguishing these components from other components, and they do not limit the nature, order, or sequence of the components.

[0038] Furthermore, when a component is described as being 'connected,' 'joined,' or 'interconnected' with another component, the component is not only directly connected, joined, or interconnected with the other component, but may also include cases where it is 'connected,' 'joined,' or 'interconnected' due to another component between other components.

[0039] Furthermore, when described as being formed or arranged "above" or "below" each component, "above" or "below" means that it includes not only the case where two components are in direct contact, but also the case where one or more other components are formed or arranged between the two components. Additionally, when expressed as "above" or "below," it can include not only an upward direction based on a component, but also a downward direction based on a component.

[0040] Figure 1 This is a perspective view illustrating the appearance of an electronic control device according to an embodiment of the present invention. Figure 2 It shows the shell removed. Figure 1 Perspective view, Figure 3 This is an exploded perspective view of an electronic control device according to an embodiment of the present invention. Figure 4 yes Figure 3 A magnified image of a portion. Figure 5 This is a plan view showing the interior of the housing according to an embodiment of the present invention. Figure 6 This is a perspective view showing the combined structure of the support and the printed circuit board according to an embodiment of the present invention. Figure 7 This is a plan view of an EMI filter according to an embodiment of the present invention. Figure 8 This is a perspective view showing the combined state of the bracket and the EMI filter according to an embodiment of the present invention.

[0041] refer to Figures 1 to 8 According to an embodiment of the present invention, the external shape of the electronic control device 10 can be formed by combining the housing 100, the first body 130 and the second body 110.

[0042] The housing 100 may be formed with a circular or elliptical cross-section, and its upper and lower surfaces may be open. The cross-sectional shape of the housing 100 may correspond to the cross-sectional shape of the motor. The material of the housing 100 may be plastic. A space may be formed inside the housing 100 to accommodate electronic components for driving the electronic control device 10.

[0043] The second body 110 can be incorporated to cover the upper surface of the housing 100. A plurality of terminal engagement units 111 can be disposed on the second body 110. Each terminal engagement unit 111 can protrude upward from the upper surface of the second body 110 and can form a terminal recess 112 therein for engagement with an external terminal. Each of the plurality of terminal engagement units 111 can have a different terminal recess diameter or a different height protruding from the upper surface of the second body 110. When the external terminal is engaged with the terminal engagement unit 111, the internal configuration of the electronic control device 10 and the external terminal can be electrically connected. Therefore, signals for controlling the electronic control device 10 can be transmitted or received, or power can be supplied to the electronic control device 10.

[0044] The second body 110 may include a base 132 and a support, the support protruding upward from the upper surface of the base 132 and disposed within the housing 100. The support and the base 132 may be formed as a single unit.

[0045] The base 132 can be incorporated to cover the lower surface of the housing 100. Therefore, an opening formed in the upper surface of the base 100 can be covered by the second body 110, while an opening formed in the lower surface of the base 100 can be covered by the base 132. The second body 110 and the base 132 can be incorporated into the housing 100 via ribs and rib grooves. The second body 110 and the base 132 can be formed to have a cross-sectional shape corresponding to the cross-sectional shape of the housing 100.

[0046] A motor (not shown) can be attached to the lower surface of the electronic control device 10. Therefore, a lower plate 120 for attachment to the motor can be provided on the lower surface of the base 132. A plurality of terminals 125 are provided in the lower plate 120, the lower ends of which are electrically connected to the motor, and the upper ends of which can pass through the base 132 for electrical connection to the electronic control device 10.

[0047] An additional sealing member (not shown) for sealing may be provided between the lower plate 120 and the base 132. Terminal 125 may include a first terminal connected to the first control module (which will be described later) and a second terminal connected to the second control module. The first and second terminals may be configured to face each other relative to the center of the lower plate 120.

[0048] Meanwhile, an auxiliary substrate 250 is additionally provided between the lower plate 120 and the base 132. The auxiliary substrate 250 can be electrically connected to the first control module or the second control module, which will be described later.

[0049] Multiple electronic components for driving the electronic control device 10 can be disposed within the space inside the housing 100. These multiple electronic components may include a first control module and a second control module. The first control module and the second control module can be integrated into a support frame.

[0050] Specifically, the bracket protrudes upward from the upper surface of the base 132 and can be disposed within the housing 100. The bracket may include a first plate 140 and a second plate 150 arranged facing each other. The first plate 140 and the second plate 150 may have a predetermined thickness and can support the first control module and the second control module. The first plate 140 and the second plate 150 may be arranged spaced apart from each other in a first direction. The first plate 140 and the second plate 150 may be arranged in parallel.

[0051] A first connecting portion 142 protruding inward may be provided on the inner surface of the first plate 140. The first connecting portion 142 may be disposed adjacent to one side of the inner surface of the first plate 140. A second connecting portion 152 protruding inward may be provided on the inner surface of the second plate 150 facing the first plate 140. The second connecting portion 152 may be disposed adjacent to one side of the inner surface of the second plate 150. Multiple connecting portions 142 and 152 may be provided, and they may be spaced apart from each other in the vertical direction. The first connecting portion 142 and the second connecting portion 152 may have different heights in the vertical direction. For example, the second connecting portion 152 may be disposed above the first connecting portion 142.

[0052] A threaded hole is formed in each of the first joint 142 and the second joint 152 to allow the bolt S to pass through, and the first EMI filter 260 (described later) can be threaded into it.

[0053] A third connecting portion 144 protruding inward may be provided on the inner surface of the first plate 140. The third connecting portion 144 may be disposed adjacent to the other side of the inner surface of the first plate 140. The third connecting portion 144 may be configured to have a step difference from the first connecting portion 142 in the vertical direction. For example, the length of the base 130 from its upper surface to the third connecting portion 144 may be longer than the length of the first connecting portion 142. A fourth connecting portion 154 protruding inward may be provided on the inner surface of the second plate 150 facing the first plate 140. The fourth connecting portion 154 may be disposed adjacent to the other side of the inner surface of the second plate 150. Multiple third connecting portions 144 and fourth connecting portions 154 may be provided, and they may be configured to be spaced apart from each other in the vertical direction. The third connecting portions 144 and fourth connecting portions 154 may have different heights in the vertical direction. For example, the fourth connecting portion 154 may be disposed above the third connecting portion 144.

[0054] A threaded hole is formed in each of the third joint 144 and the fourth joint 154 to allow the bolt S to pass through, and the second EMI filter 270 (described later) can be threaded into it.

[0055] On one side surface of the first board 140, a second recess 147 that is further recessed inward than other areas may be provided. The side surface of the first board 140 with the second recess 147 may be the surface facing the first printed circuit board 210, as will be described later. The first busbar 340 of the first EMI filter 260, which will be described later, may be disposed in the second recess 147.

[0056] A first recess 157, further recessed inward than other areas, can be provided on a side surface of the second board 150. The side surface of the second board 150 with the first recess 157 can be the surface facing the second printed circuit board 220, as will be described later. The second busbar 340 of the second EMI filter 270, which will be described later, can be provided in the first recess 157.

[0057] The first control module may include a first printed circuit board 210, a first power module substrate 230, and a first EMI filter 260. The first control module may be configured to face the second control module relative to the bracket.

[0058] The first printed circuit board 210 can be disposed on one side surface of the bracket. The first printed circuit board 210 can control the first power supply board 230. Multiple components for the operation of the first control module can be disposed in the first printed circuit board 210.

[0059] Specifically, the inner surface of the first printed circuit board 210 can be configured to face one side surface of the first plate 140 and one side surface of the second plate 150. The first printed circuit board 210 can be threaded onto one side surface of the first plate 140 and one side surface of the second plate. For this purpose, a bolt can pass through the first printed circuit board 210 to thread onto one side surface of the first plate 140 and one side surface of the second plate 150. The length of the first printed circuit board 210 in a first direction can be longer than the length from the outer surface of the first plate 140 to the outer surface of the second plate 150 in the first direction. Therefore, both ends of the first printed circuit board 210 can protrude outward from the first plate 140 and the second plate 150. The lower end of the first printed circuit board 210 can contact the upper surface of the base 132, and the lower surface can contact the lower surface of the second body 110.

[0060] The first power supply board 230 can be disposed on the outer surface of the second board 150. The first power supply board 230 can be electrically connected to the first printed circuit board 210. The first power supply board 230 is used to control a large current and can be electrically connected to a motor. The first terminal 125 in the lower board 120 can pass through the base 132 to be combined with the first power supply board 230.

[0061] The first power supply substrate 230 can be vertically disposed within the first printed circuit board 210. A plurality of pins 232 can be formed on one side surface of the first power supply substrate 230, and pin holes 212 can be formed in the first printed circuit board 210 to connect the pins 232 to each other. By connecting the pins 232 to the pin holes 212, the first power supply substrate 230 can be electrically connected to the first printed circuit board 210. The two side surfaces of the first power supply substrate 230 can be supported by the inner surfaces of the first printed circuit board 210 and the second printed circuit board 220, as will be described later. The first power supply substrate 230 can be threaded to the outer surface of the second board 150.

[0062] The first EMI filter 260 may be disposed inside the second printed circuit board 220, as will be described later. The first EMI filter 260 may be disposed facing the inner surface of the first printed circuit board 210. The first EMI filter 260 may be disposed facing the inner surface of the second printed circuit board 220.

[0063] The first EMI filter 260 can be threaded to the first joint 142 and the second joint 152. The two side surfaces of the first EMI filter 260 can be configured to face the inner surfaces of the first plate 140 and the second plate 150. The two side surfaces of the first EMI filter 260 can contact the inner surfaces of the first plate 140 and the second plate 150.

[0064] The first EMI filter 260 may include a first busbar 340 projecting outward from a side surface. The first busbar 340 may be formed of a metallic material. A first connection hole 236 may be provided in the first power substrate 230 so that the first busbar 340 passes through it. Therefore, the first EMI filter 260 and the first power substrate 230 can be electrically connected to each other by connecting the first busbar 340 and the first connection hole 236. The first busbar 340 may be accommodated in a first recess 157.

[0065] The second control module may include a second printed circuit board 220, a second power module substrate 240, and a second EMI filter 270. The second control module may be configured to face the first control module relative to the bracket.

[0066] The second printed circuit board 220 can be disposed on the other side surface of the bracket. The second printed circuit board 220 can control the second power supply board 240. Multiple devices for the operation of the second control module can be disposed in the second printed circuit board 220. The second printed circuit board 220 can be configured to face the first printed circuit board 210.

[0067] In detail, the inner surface of the second printed circuit board 220 can be configured to face the other side surface of the second plate 150 and the other side surface of the second plate 150. The second printed circuit board 220 can be threadedly engaged with the other side surface of the first plate 140 and the other side surface of the second plate 150. For this purpose, a bolt can pass through the second printed circuit board 220 to thread it with the other side surface of the first plate 140 and the second plate 150. The length of the second printed circuit board 220 in a first direction can be longer than the length from the outer surface of the first plate 140 to the outer surface of the second plate 150 in the first direction. Therefore, both ends of the second printed circuit board 220 can protrude outward from the first plate 140 and the second plate 150. The lower end of the second printed circuit board 220 can contact the upper surface of the base 132, and the lower surface can contact the lower surface of the second body 110.

[0068] The second power supply board 240 can be disposed on the outer surface of the first board 140. The second power supply board 240 can be positioned facing the first power supply board 220. The second power supply board 240 can be electrically connected to the second printed circuit board 220. The second power supply board 240 is used to control large current and can be electrically connected to a motor. The second terminal 125 in the lower board 120 can pass through the base 132 to connect with the second power supply board 240.

[0069] The second power supply substrate 240 can be vertically disposed within the second printed circuit board 220. A plurality of pins 242 can be formed on one side surface of the second power supply substrate 240, and pin holes 222 can be formed in the second printed circuit board 220 to connect the pins 242 to each other. By connecting the pins 242 to the pin holes 222, the second power supply substrate 240 can be electrically connected to the second printed circuit board 220. The two side surfaces of the second power supply substrate 240 can be supported by the inner surface of the second printed circuit board 220 and the inner surface of the first printed circuit board 210. The second power supply substrate 240 can be threaded to the outer surface of the first board 140.

[0070] The second EMI filter 270 can be disposed inside the first printed circuit board 220. The second EMI filter 270 can be disposed facing the first EMI filter 270. The second EMI filter 270 can be disposed facing the inner surface of the second printed circuit board 220. The second EMI filter 270 can be disposed facing the inner surface of the first printed circuit board 210.

[0071] The second EMI filter 270 can be threaded into the third joint 144 and the fourth joint 154. The two side surfaces of the second EMI filter 270 can be configured to face the inner surfaces of the first plate 140 and the second plate 150. The two side surfaces of the second EMI filter 270 can contact the inner surfaces of the first plate 140 and the second plate 150.

[0072] The second EMI filter 270 may include a second busbar 340 protruding outward from one side surface. The second busbar 340 may be formed of a metallic material. A second bonding hole 248 may be provided in the second power substrate 240 to allow the second busbar 340 to pass through it. Therefore, the second EMI filter 270 and the second power substrate 240 can be electrically connected to each other by bonding the second busbar 340 to the second bonding hole 248.

[0073] The first EMI filter 260 and the second EMI filter 270 may each include a plate-shaped substrate 261, a CM inductor 263, and a DM inductor 266. The DM inductor 266 may be disposed below the CM inductor 263. The DM inductor 266 and the CM inductor 263 may be disposed on the inner surface of the substrate 251. The DM inductors in the first EMI filter 260 and the second EMI filter 270 may be arranged in a stepped manner in the vertical direction. The CM inductors in the first EMI filter 260 and the second EMI filter 270 may be arranged in a stepped manner in the vertical direction. The CM inductors 263 and DM inductors 266 in the EMI filters 260 and 270 convert the input current, and the converted current can be transmitted to the first power supply substrate 220 and the second power supply substrate 240 respectively through the busbar 340.

[0074] According to the structure described above, multiple control modules can be compactly combined in a single housing relative to the bracket, and the advantage is that the product is miniaturized.

[0075] Furthermore, since the connection structure made by welding is eliminated between multiple electronic components, the manufacturing process is simplified.

[0076] The following describes a busbar module that electrically connects a first EMI filter 260 to a first power supply board 230 and a second EMI filter 270 to a second power supply board 240.

[0077] Figure 9 This is a perspective view of a busbar module according to an embodiment of the present invention. Figure 10 This is an exploded perspective view of a busbar module according to an embodiment of the present invention. Figure 11 This is a cross-sectional view illustrating the connection state between the busbar and the body in the busbar module according to an embodiment of the present invention.

[0078] refer to Figures 1 to 11The first EMI filter 260 and the first power supply substrate 230, the second EMI filter 270 and the second power supply substrate 240 can be electrically connected to each other via the busbar module 300. The busbar module 300 can be disposed on the substrate 261 (see reference) that forms the external shape of the first EMI filter 260 and the second EMI filter 270. Figure 7 )superior.

[0079] In detail, the busbar module 300 may include: a busbar 340, one end of which is attached to a substrate 261, and the other end of which is attached to a first power substrate 230 or a second power substrate 240; and a body 310 for attaching the busbar 340 to the substrate 261. The body 310 is formed of plastic material, and because the busbar 340 is supported on the substrate 261, the body 310 may be referred to as a support.

[0080] The body 310 may have an inner surface that engages with the support and an outer surface that engages with the substrate 261. A first through-hole 314 through the busbar 340 may be formed on the outer surface of the body 310 facing the substrate 261. Furthermore, a second through-hole 312 may be formed on the side surface of the body 310 facing the first power substrate 230 or the second power substrate 240. Inside the body 310, a space 313 may be formed to accommodate at least a portion of the busbar 340, the two ends of which are defined by the first through-hole 314 and the second through-hole 312. Therefore, at least a portion of the busbar 340 is disposed in the space 313, and the busbar 340 can be securely fixed within the body 310.

[0081] A first protrusion 322 protruding outward from other areas may be provided on the outer surface of the body 310. A second protrusion 324 protruding outward from other areas may be provided on the inner surface of the body 310. The first protrusion 322 and the second protrusion 324 may be configured to overlap in the vertical direction. The first protrusion 322 and the second protrusion 324 may have a circular cross-sectional shape. The body 310 may include an extension 320 protruding outward from other areas, such that the first protrusion 322 is provided on the outer surface and the second protrusion 324 is provided on the inner surface.

[0082] On the other hand, the first protrusion 322 and the second protrusion 324 can be formed as a single axis and coupled to the body 310. In this case, the extension 320 may include a hole extending from the inner surface through the outer surface so that the single axis can be coupled.

[0083] The substrate 261 may include a bonding hole that engages with the first protrusion 322. The bonding hole may have a hole shape extending from the outer surface through the inner surface so that the first protrusion 322 is engaged. When the busbar module 300 is engaged with the EMI filters 260 and 270, the first protrusion 322 may engage with the bonding hole.

[0084] Meanwhile, an additional protrusion 318 protruding outward may be provided on the outer surface of the body 310. In this case, the protrusion 318 may be configured to face the first protrusion 322 relative to the first through hole 314. Furthermore, an additional connecting hole may be provided in the substrate 261 to engage with the protrusion 318. Thus, the protrusion 318 and the first protrusion 322 engage with the connecting hole so that the body 310 and the substrate 261 can be joined together.

[0085] Multiple first protrusions 322 and connecting holes can be provided and arranged to correspond to each other. The cross-sectional shapes of the protrusions 318 and the first protrusions 322 can be different from each other. In this case, the protrusion 318 can be set as the central region of the imaginary line connecting the multiple first protrusions 322 with the first through hole 314 as the reference surface.

[0086] The second protrusion 324 can be coupled to the bracket. A main body coupling portion 149 for coupling with the second protrusion 324 can be formed on the inner surface of the first plate 140 and the second plate 150, protruding further inward than other areas. A hole is provided on the side surface of the main body coupling portion 149 to correspond to the cross-sectional shape of the second protrusion 324, and the second protrusion 324 can be coupled to the hole. Therefore, the first EMI filter 260 and the second EMI filter 270 can be securely fixed to the bracket not only by couplings 142 and 144, but also by coupling the second protrusion 324 to the main body coupling portion 149.

[0087] Busbar 340 may include a first terminal 342 protruding outward from a side surface of body 310 and a second terminal 348 protruding outward from an outer surface of body 310. The first terminal 342 may be coupled to a first power substrate 230 or a second power substrate 240. The second terminal 348 may be coupled to substrate 261. The second terminal 348 may be formed as a pin to engage with a terminal hole (not shown) on substrate 261. The second terminal 348 may be formed by a combination of multiple pins.

[0088] The busbar 340 may have an area that bends at least once. At least a portion of the area between the first terminal 342 and the second terminal 348 may be disposed in the space 313 inside the body 310.

[0089] In detail, the busbar 340 may include a first bend 344 and a second bend 346. The first bend 344 bends inward from one end of the first terminal 342, and the second bend 346 connects the first bend 344 and the second terminal 348 and bends from the extended end of the first bend 344. The first bend 344 may be arranged parallel to the second terminal 348, and the second bend 346 may be arranged parallel to the first terminal 342. The first bend 344 and the second terminal 348 may be perpendicular to the second bend 346 and the first terminal 342. The inner surface of the first bend 344 may contact one side surface of the body 310. As described above, the first terminal 342 may engage with the grooves 147 and 157 of the first plate 140 and the second plate 150.

[0090] According to the above structure, the advantage is that the EMI filter and the power supply board, which are arranged perpendicularly to each other through the busbar module, can be connected compactly, and the EMI filter can also be firmly fixed on the bracket.

[0091] In the foregoing, even though all components constituting embodiments of the present invention are described as working in combination or in combination, the present invention is not necessarily limited to these embodiments. That is, within the scope of the present invention, all constituent elements can be selectively combined into one or more and operate. Furthermore, the terms 'comprising,' 'consisting of,' or 'having' described above mean that the corresponding component may be present unless otherwise stated, so other components are excluded. Rather, they should be interpreted as being able to further include other components. All terms, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art, unless otherwise defined. Commonly used terms, such as those defined in dictionaries, should be interpreted as having the meaning consistent with the context of the relevant art and are not to be interpreted as having an ideal or overly formal meaning unless explicitly defined in the present invention.

[0092] The above description merely illustrates the technical concept of the present invention. Those skilled in the art can make various modifications and changes without departing from the basic characteristics of the present invention. Therefore, the embodiments disclosed in this invention are not intended to limit the technical concept of the invention, but rather to explain it. The scope of the technical concept of the present invention is not limited by these embodiments. The scope of protection of this invention should be interpreted through the following claims and all the technical concepts.

Claims

1. An electronic control device comprising: a housing; a first plate disposed within the housing; a second plate disposed within the housing and an inner surface of the second plate facing an inner surface of the first plate; a first control module disposed within the housing; and a second control module disposed within the housing, wherein the first control module comprises: a first printed circuit board whose inner surface is combined with one side surface of the first plate and one side surface of the second plate; a first power supply substrate disposed on an outer surface of the second plate; and a first EMI filter disposed between the first plate and the second plate, an outer surface of the first EMI filter facing the inner surface of the first printed circuit board, and wherein the second control module comprises: a second printed circuit board whose inner surface is combined with another side surface of the first plate and another side surface of the second plate; a second power supply substrate disposed on an outer surface of the first plate; and a second EMI filter disposed between the first plate and the second plate, an outer surface of the second EMI filter facing the inner surface of the second printed circuit board, wherein a first pin is formed on one side surface of the first power supply substrate, wherein a first pin hole combined with the first pin is formed on the first printed circuit board, wherein a second pin is formed on one side surface of the second power supply substrate, and wherein a second pin hole combined with the second pin is formed on the second printed circuit board. the first printed circuit board and the first power supply substrate are disposed perpendicular to each other, and 2. The electronic control device of claim 1, wherein, wherein the second printed circuit board and the second power supply substrate are disposed perpendicular to each other. 3.The electronic control device of claim 2, the first printed circuit board is disposed in parallel with the first EMI filter, and wherein, wherein the second printed circuit board is disposed in parallel with the second EMI filter. two side surfaces of the first power supply substrate face the inner surface of the first printed circuit board and the inner surface of the second printed circuit board, 4. The electronic control device of claim 1, wherein, wherein two side surfaces of the second power supply substrate face the inner surface of the first printed circuit board and the inner surface of the second printed circuit board. a first combining portion and a third combining portion are disposed on the inner surface of the first plate, the first combining portion and the third combining portion protrude inward, the first EMI filter is threadedly combined with the first combining portion, the second EMI filter is threadedly combined with the third combining portion, and 5. The electronic control device of claim 1, wherein, wherein a second combining portion and a fourth combining portion are disposed on the inner surface of the second plate, the second combining portion and the fourth combining portion protrude inward, the first EMI filter is threadedly combined with the second combining portion, and the second EMI filter is threadedly combined with the fourth combining portion. ​ 6. The electronic control device of claim 1, wherein, The first printed circuit board is threadedly coupled with one side surface of the first plate and the second plate, and The second printed circuit board is threadedly coupled with the other side surface of the first plate and the second plate. 7.The electronic control device of claim 1, comprising a lower plate coupled with a lower surface of the housing, wherein, The lower plate includes first and second terminals facing each other with respect to the center, The first terminal is coupled with the first power supply substrate, and The second terminal is coupled with the second power supply substrate.

8. The electronic control device of claim 1, wherein, A first inductor is provided on an inner surface of the first EMI filter, A second inductor is provided on an inner surface of the second EMI filter, and The first and second inductors are provided to have a step difference in the up-and-down direction.

9. The electronic control device of claim 1, wherein, The first EMI filter includes a first bus bar protruding to one side, The first power supply substrate includes a first coupling hole coupled with the first bus bar, The second EMI filter includes a second bus bar protruding to one side, The second power supply substrate includes a second coupling hole coupled with the second bus bar.

10. The electronic control device of claim 9, wherein, A first groove accommodating the second bus bar is provided on a side surface of the second plate, and A second groove accommodating the first bus bar is provided on a side surface of the first plate.

Images