Contactors and socket apparatus for burn-in and testing of semiconductor devices

Abstract

The present invention relates to a contactor and socket device for burn-in and testing of semiconductor devices, the contactor comprising: an upper terminal portion (111) having an upper tip portion (111b) at an upper end portion; a lower terminal portion (112) having a lower tip portion (112c) at a lower end portion, and disposed on the same axis as the upper terminal portion (111); and a resilient portion (113) for elastically supporting the upper terminal portion (111) and the lower terminal portion (112), the contactor being formed of a strip-shaped plate (t < w) having a predetermined width (w) and thickness (t), wherein the upper terminal portion (111) and the lower terminal portion (112) each include a shoulder portion (111a), (112a) protruding in the width direction thereof, the resilient portion (113) has a third width (w3) which is greater than a first width (w1) of the upper terminal portion (111) and a second width (w2) of the lower terminal portion (112) (w1, w2 < w3), the resilient portion (113) is formed of a first strip (113a) and a second strip (113b) which are formed perpendicularly along a horizontal center axis (z-axis), a slot (113c) having a fourth width (w4) is provided between the first strip (113a) and the second strip (113b), the first strip (113a) and the second strip (113b) have the same fifth width (w5) and are curved in opposite thickness directions, and the fifth width (w5) is greater than or equal to the thickness (t) of the strip-shaped plate and less than or equal to the fourth width (w4).

Description

Technical Field

[0001] The present invention relates to a contactor and socket device for pre-burning and testing semiconductor devices. Background Art

[0002] Typically, a socket for a semiconductor element (IC, Integrated Circuit) (hereinafter referred to as "IC") is set on a test board (Test Board) or a burn-in board (Burn-in Board, also called an aging board). Through the I / O terminals (input and output terminals) formed on the board, a burn-in chamber (Burn-in Chamber) or its peripheral devices that can input and output the power supply and electrical signals of a predetermined voltage required to drive the IC is connected to another test device for testing IC characteristics, thereby being used in a system for testing ICs.

[0003] Among widely used ICs, a ball grid array (BGA) type IC innovatively reduces the size and thickness of an IC by arranging IC terminals, ie, balls, across the entire bottom surface of the IC. Figure 1 (a) and (b) are a plan view and a side view of a BGA type IC. A plurality of ball terminals 2 are provided on the bottom surface of the IC 1.

[0004] Figure 2 A plan view of a BGA socket device having a pinch-type contactor according to the prior art is shown. Figure 3 for Figure 2 The cross-sectional composition diagram of the AA line, Figure 4 for Figure 3 A partial enlarged view of .

[0005] Reference Figures 2 to 4 The BGA socket device of the prior art includes: a contactor 16, which includes a fixed side terminal 20 and a movable side terminal 21 that contact the ball terminal 2 of the BGA type IC; a body 17, which accommodates the body of the contactor 16; a stopper 18, which is provided at the lower end of the body 17 and is used to fix the contactor 16; a lead guide 19, which guides the position of the lead of the contactor 16; a cover body 11, which is configured to be elastically supported on the upper side of the body 17 and can move up and down relative to the body 17 within a predetermined distance range; a sliding member 15, which is provided on the upper side of the body 17 and moves left and right in conjunction with the up and down movement of the cover body 11, thereby realizing the opening and closing operation of the movable side terminal 21; a plurality of IC holders 14, which are rotatably assembled on the sliding member 15, and apply pressure to the IC and fix the upper side of the IC as the cover body 11 moves up and down; and a holder spring 13, which is provided on the sliding member 15 and is used to elastically support the IC holder 14.

[0006] The contactor 16 has a fixed terminal 20 and a movable terminal 21 symmetrically arranged to contact the ball terminal 2 of the IC 1. The lower ends of the fixed terminal 20 and the movable terminal 21 are fixed to the body 24 and have leads 25 extending from the body 24. The leads 25 are soldered to the PCB (not shown).

[0007] The cover 11 is elastically supported by the spring 9 on the upper side of the main body 17 and can move up and down within a predetermined distance range. The cover 11 also has a sliding cam for operating the slider 15 left and right according to the up and down position.

[0008] The sliding member 15 is formed with a terminal hole 23 for allowing two terminals 20 and 21 of the contactor 16 fixed vertically to the body 17 to pass through. Here, the terminal hole 23 is provided with a movable member 22 for separating the fixed side terminal 20 and the movable side terminal 21.

[0009] In particular, refer to Figure 5 When the cover is pressed downward, the slider 15 moves rightward via the cover's sliding cam. As the movable member 22 moves together, it spreads the movable terminal 21 outward, allowing the IC's ball terminal to be positioned between the fixed terminal 20 and the movable terminal 21. Furthermore, in the slider 15's initial position, the distance between the fixed terminal 20 and the movable terminal 21 on either side of the movable member 22 is designed to be smaller than the ball terminal size. Reference numeral 12 denotes an IC guide that guides the placement of the IC 1 when loading.

[0010] Figure 5 (a), (b), and (c) are schematic diagrams showing a simplified operation example of a socket device in the prior art.

[0011] Figure 5 (a) shows the initial state, the cover 11 is elastically supported on the body 7 and is located at a predetermined height, the fixed side terminal 20 and the movable side terminal 21 of the contactor are in close contact with the movable member 22, and a predetermined interval L1 is maintained between the two terminals 20 and 21.

[0012] Afterwards, if Figure 5 As shown in (b), when the cover 11 is pressed downward, the movable member 22 moves to the right in the figure together with the slider, and the movable-side terminal 21 is pushed outward, and the IC 1 is loaded into the socket device. Here, the distance L2 between the two terminals 2021 is greater than the diameter of the ball terminal 2.

[0013] Finally, if Figure 5 As shown in (c), when the cover body 11 returns to its original position, the movable part 22 returns to its initial position together with the sliding part, and the movable side terminal 21 also returns to its original position, and the ball terminal 2 is fixed by the fixed side terminal 20 and the movable side terminal 21.

[0014] The BGA socket device of the prior art constructed as above has the following problems:

[0015] 1. Due to the large number of complex components, assembly is time-consuming and costly.

[0016] 2. Since the IC guide or cover surrounds the IC when loaded, air flow is not smooth and the heat generated by the IC cannot be effectively dissipated to the surrounding area.

[0017] 3. Due to the cover that can be operated up and down at the top, the height of the socket is high, resulting in a higher overall height of the burn-in plate. Therefore, when it is necessary to arrange multiple burn-in plates in the burn-in chamber in the vertical direction and ensure proper air flow between the plates, the number of burn-in plates that can be arranged is reduced;

[0018] 4. The forced flow of air generated in the burn-in chamber is hindered by the socket cover or IC guide, so the forced flow of air cannot be effectively transmitted to the IC surface, making it difficult to maintain a uniform IC temperature.

[0019] 5. In the clamping type contactor, the contact with the ball terminal is achieved or released by the horizontal operation of the movable side terminal. At this time, the movable side terminal will repeatedly undergo elastic deformation, and the durability will be reduced due to repeated use, so the contact force with the ball terminal will decrease. In particular, the structure of the BGA socket device in the prior art is as follows: during the process of the movable side terminal returning (refer to Figure 5 In (c), the operating force generated by the elastic force of the movable side terminal causes the slider to return to its initial position. As the number of times the movable side terminal is used increases, fatigue (stress) occurs in the movable side terminal, causing the return elasticity to gradually decrease, thereby weakening the contact force with the ball terminal, which leads to a decrease in the reliability of IC testing.

[0020] Typically, clamp-type BGA socket devices are required to have a lifespan of approximately 20,000 cover cycles. Therefore, improving the durability of the clamp-type contactor terminals so that the elastic recovery force of the terminals does not decrease during repeated use is crucial for determining the test reliability of the BGA socket device.

[0021] Prior art literature

[0022] Patent Literature

[0023] Korean Patent Publication No. 10-2011-0051668 (Published on May 18, 2011) Summary of the Invention

[0024] Problems to be solved by the invention

[0025] The present invention aims to improve the problems of such prior art, and provides a socket device for pre-burning and testing semiconductor devices. The socket device is a lidless type socket device, which removes the lid provided on the upper side of the socket body for the loading / unloading operation of ICs, and has a structure capable of testing in a state where the semiconductor device (hereinafter, also referred to as "IC") loaded on the socket body is exposed outside.

[0026] In addition, the present invention aims to provide a contactor, which, compared with the prior art, relatively shortens the length of the contactor to be suitable for the socket device.

[0027] Solution to the problem

[0028] A contactor according to an aspect of the present invention includes: an upper terminal portion having an upper tip portion at its upper side end; a lower terminal portion having a lower tip portion at its lower side end and provided on the same axis as the upper terminal portion; and an elastic portion for elastically supporting the upper terminal portion and the lower terminal portion. The contactor is formed of a strip-shaped plate having a predetermined width (w) and thickness (t) (t < w). Wherein, the upper terminal portion and the lower terminal portion respectively include shoulders protruding in the width direction thereof. The elastic portion has a third width (w3), and the third width (w3) is greater than the first width (w1) of the upper terminal portion and the second width (w2) of the lower terminal portion (w1, w2 < w3). The elastic portion is composed of a first strip and a second strip vertically formed along the central axis (z-axis) in the horizontal direction. The first strip and the second strip are spaced apart by a slot having a fourth width (w4) therebetween. The first strip and the second strip have the same fifth width (w5), and are bent in opposite thickness directions. The fifth width (w5) is greater than or equal to the thickness (t) of the strip-shaped plate and less than or equal to the fourth width (w4).

[0029] A contactor according to another aspect of the present invention includes: an upper terminal portion having an upper pointed end portion at its upper side end; a lower terminal portion having a lower pointed end portion at its lower side end and provided on the same axis as the upper terminal portion; and an elastic portion for elastically supporting the upper terminal portion and the lower terminal portion. The contactor is formed of a strip-shaped plate having a predetermined width (w) and thickness (t) (t < w). Wherein, the upper terminal portion and the lower terminal portion respectively include shoulders protruding in the width direction thereof. The elastic portion has a third width (w3), and the third width (w3) is greater than the first width (w1) of the upper terminal portion and the second width (w2) of the lower terminal portion (w1, w2 < w3). The elastic portion is composed of a first strip and a second strip vertically formed along a central axis (z-axis) in the horizontal direction. A slot with a fourth width (w4) is provided between the first strip and the second strip. The first strip and the second strip have the same fifth width (w5) and are bent in the same thickness direction. The fifth width (w5) is greater than or equal to the thickness (t) of the strip-shaped plate and less than or equal to the fourth width (w4).

[0030] Preferably, the upper pointed end portion or the lower pointed end portion has at least one sharp contact point.

[0031] Preferably, the upper terminal portion or the lower terminal portion is a hollow cylindrical shape formed by rolling and bending a sheet material. The upper pointed end portion or the lower pointed end portion has a plurality of contact points, which are sharply protruded along the outer periphery of the cylindrical end of the upper terminal portion or the lower terminal portion.

[0032] Preferably, the length of the lower pointed end portion is longer than that of the upper pointed end portion.

[0033] Preferably, the lower terminal portion has an operation hole formed therethrough.

[0034] Next, a test socket device according to one aspect of the present invention includes the contactor as described above, and further includes: a main body portion formed with a first receiving hole, the first receiving hole allowing the upper pointed end portion to pass through and protrude outward, thereby compressing the contactor and causing it to move downward; and a lower plate assembled to the lower end of the main body portion, and a second receiving hole is formed at a position corresponding to the first receiving hole, the second receiving hole allowing the lower pointed end portion to protrude downward and be held therein.

[0035] Furthermore, a test socket device according to another aspect of the present invention includes the contactor as described above, and further includes: a main body portion, which is formed with a first receiving hole and is provided with a plurality of assembly portions fixed to a printed circuit board (PCB), the first receiving hole allowing the upper tip portion to pass through and protrude outward, thereby compressing the contactor and causing it to move downward; a lower plate, which is assembled to the lower end of the main body portion and is formed with a second receiving hole at a position corresponding to the first receiving hole, the second receiving hole allowing the lower tip portion to protrude downward and be retained therein; a floating plate, which is formed with a contact hole at a position corresponding to the first receiving hole so that the upper terminal portion is located in the contact hole, the floating plate being spaced apart from the upper end of the main body portion; and a plurality of floating springs for elastically supporting the main body portion and the floating plate.

[0036] According to another aspect of the present invention, a test socket device includes a contactor, the contactor comprising: an upper terminal portion having an upper tip portion located at an upper end thereof; a lower terminal portion having a lower tip portion located at a lower end thereof and assembled to cross the upper terminal portion in a longitudinal direction; and a spring disposed between the upper and lower terminal portions for elastically supporting the upper and lower terminal portions; a main body portion having a first receiving hole formed therein and a plurality of mounting portions fixed to a printed circuit board (PCB), the first receiving hole allowing the upper tip portion to pass therethrough and protrude outward, thereby compressing the contactor and causing it to move downward; a lower plate assembled to the lower end of the main body portion and having a second receiving hole formed at a position corresponding to the first receiving hole, the second receiving hole allowing the lower tip portion to protrude downward and be retained therein; a floating plate having a contact hole formed at a position corresponding to the first receiving hole so that the upper terminal portion is positioned in the contact hole, the floating plate being spaced apart from the upper end of the main body portion; and a plurality of floating springs for elastically supporting the main body portion and the floating plate.

[0037] Preferably, the socket device further comprises an IC holding portion, which is respectively provided at both ends of the upper side of the floating plate in a manner capable of elastically sliding in the lateral direction, thereby elastically supporting both ends of the semiconductor device, which is loaded and placed on the floating plate.

[0038] Preferably, the assembly portion is a columnar object protruding and extending from the lower portion of the main body.

[0039] Preferably, the fitting portion includes: a through hole formed therethrough; a groove formed by cutting at the lower end portion; and a disassembly prevention protrusion protruding from and formed on the outer peripheral surface of the fitting portion.

[0040] More preferably, the socket device further comprises a rivet, and the rivet is inserted into the through hole.

[0041] Preferably, the socket device includes: a cover portion, which is elastically supported on the upper part of the main body and can move up and down; a pair of pressure mechanisms, which are symmetrically arranged relative to the main body and are linked with the up and down movement of the cover portion to apply pressure to the IC.

[0042] The pressurizing mechanism includes: a pushing member for contacting and applying pressure to the top surface of the IC placed on the floating plate; a connecting member, one end of which is rotatably assembled to the main body via a first hinge axis (H1), and the other end of which is rotatably assembled to the pushing member via a second hinge axis (H2); and a latch, one end of which is rotatably assembled to the cover body via a third hinge axis (H3), and the other end of which can be rotated via a hinge axis common to the second hinge axis (H2), and is rotatably assembled to the pushing member via a fourth hinge axis (H4) spaced apart from the second hinge axis (H2).

[0043] Preferably, the socket device includes: a base, one end of which is provided with a hinge portion and the other end of which is provided with a locking flange, and the base is fixed to the main body; a socket cover, which is rotatably assembled on the hinge portion, and a latch fixed to the locking flange is rotatably provided on the socket cover; a pushing member, which is provided on the socket cover and applies pressure to the upper surface of the semiconductor device.

[0044] More preferably, the socket device further comprises a plurality of push springs, which are arranged between the socket cover and the push member and are used to apply pressure to the push member.

[0045] More preferably, the pushing member further includes a heat dissipation portion on the upper surface for dissipating heat, and the main body further includes an embedded nut for assembling to the PCB.

[0046] More preferably, the floating plate further includes an IC placement guide having a guide surface for guiding a placement position of the IC.

[0047] More preferably, the main body and the base are integrated, and the floating plate further includes a ball-type terminal receiving hole extending upward from the contact hole so as to place a terminal of the semiconductor device in the ball-type terminal receiving hole.

[0048] Effects of the Invention

[0049] The present invention provides a lidless socket device that eliminates a housing, which is an essential component of an existing socket structure and is typically located on top of a socket body for IC loading / unloading operations. This minimizes the size of the socket device and reduces its height to approximately half that of the prior art.

[0050] Therefore, the present invention can improve the space efficiency within test equipment, test cavities, or burn-in chambers. In particular, it can relatively shorten the length of the contactor built into the socket device, thereby enabling ultra-high-speed testing. Furthermore, by exposing the top surface of the IC to the top surface of the socket device, a heat source on the upper side capable of heating or cooling the IC can directly contact the top surface of the IC, directly controlling the IC's temperature and applying pressure to the top surface of the IC for testing. This allows the contactor and socket device to be used for burn-in and testing of semiconductor devices requiring high reliability, and in the future, it can be used in artificial intelligence, unmanned vehicles, and other applications requiring high reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Figure 1 (a) and (b) are the plan view and side view of the BGA type IC.

[0052] Figure 2 It is a plan view of a socket device in the prior art.

[0053] Figure 3 for Figure 2 The cross-sectional structure diagram of the AA line.

[0054] Figure 4 for Figure 3 A partial enlarged view of .

[0055] Figure 5 (a), (b), and (c) are schematic diagrams showing a simplified operation example of a socket device in the prior art.

[0056] Figure 6 FIG. 1 is a plan view showing the configuration of a socket device according to a first embodiment of the present invention.

[0057] Figure 7 for Figure 6 The cross-sectional structure diagram of the BB line.

[0058] Figure 8 for Figure 6 The cross-sectional structure diagram of the CC line.

[0059] Figure 9 FIG. 1 is a perspective structural diagram of a contactor according to a first embodiment of the present invention.

[0060] Figure 10 (a) and (b) are respectively a front view and a side view of a contactor according to a first embodiment of the present invention.

[0061] Figure 11(a) is a plan view of a contactor according to a first embodiment of the present invention, and (b) is a side view and a schematic diagram vertically illustrating an operation example.

[0062] Figure 12 (a) and (b) are a plan view and a side view, respectively, for explaining an arrangement example of the contactor according to the first embodiment of the present invention.

[0063] Figure 13 (a) and (b) are front and side views of a contactor according to a second embodiment of the present invention.

[0064] Figure 14 FIG. 4 is a perspective view of a contactor according to a third embodiment of the present invention.

[0065] Figure 15 FIG. 4 is a perspective view of a contactor according to a fourth embodiment of the present invention.

[0066] Figure 16 (a) and (b) are front and side views of a contactor according to a fifth embodiment of the present invention.

[0067] Figure 17 1 is a schematic diagram showing an operation example of a contactor according to a fifth embodiment of the present invention.

[0068] Figure 18 1 is a plan view showing the main body of a socket device according to a first embodiment of the present invention.

[0069] Figure 19 1 is a back view of the main body of the socket device according to the first embodiment of the present invention.

[0070] Figure 20 for Figure 18 The cross-sectional structure diagram of the DD line.

[0071] Figure 21 for Figure 18 The cross-sectional structure diagram of the EE line.

[0072] Figure 22 for Figure 18 The cross-sectional structure diagram of the FF line.

[0073] Figure 23 for Figure 18 The cross-sectional structure diagram of the GG line.

[0074] Figure 24 for Figure 18 The cross-sectional structure diagram of the HH line.

[0075] Figure 25 FIG. 1 is a plan view of the lower plate of the socket device according to the first embodiment of the present invention.

[0076] Figure 26 (a) and (b) are Figure 25 The cross-sectional structure diagram of line II and line JJ.

[0077] Figure 27 (a) and (b) are Figure 25 The cross-sectional structure diagram and back structure diagram of the KK line.

[0078] Figure 28 FIG. 1 is a plan view showing the structure of a floating plate of a socket device according to a first embodiment of the present invention.

[0079] Figure 29 for Figure 28 Cross-sectional diagram of the LL line.

[0080] Figure 30 for Figure 28 The cross-sectional structure diagram of the MM line.

[0081] Figure 31 for Figure 28 The cross-sectional structure diagram of the NN line.

[0082] Figure 32 for Figure 28 The cross-sectional structure diagram of the OO line.

[0083] Figure 33 for Figure 28 Cross-sectional structure diagram of the PP line.

[0084] Figure 34 for Figure 28 The cross-sectional structure diagram of the QQ line.

[0085] Figure 35 1 is a plan view showing the configuration of an IC holding portion of a socket device according to a first embodiment of the present invention.

[0086] Figure 36 (a) and (b) are Figure 35 The cross-sectional structure diagram of the RR line and SS line.

[0087] Figure 37 (a) and (b) are Figure 35 The cross-sectional and side views of the TT line.

[0088] Figures 38 to 40 1 is a schematic diagram for explaining an operation example of the socket device according to the first embodiment of the present invention.

[0089] Figure 41 FIG. 1 is a plan view showing the configuration of a socket device according to a second embodiment of the present invention.

[0090] Figure 42 for Figure 41 The cross-sectional structure diagram of the UU line.

[0091] Figure 43 for Figure 41 The cross-sectional structure diagram of the XX line.

[0092] Figure 44 FIG. 1 is a plan view showing the configuration of a socket device according to a third embodiment of the present invention.

[0093] Figure 45 for Figure 44 The cross-sectional structure diagram of the YY line.

[0094] Figure 46 (a) and (b) are Figure 44 The cross-sectional composition diagram of the ZZ line and AA-AA line.

[0095] Figure 47 1 is a cross-sectional structural diagram showing an operation example of the socket device according to the third embodiment of the present invention.

[0096] Figure 48 FIG. 4 is a side view of a socket device according to a fourth embodiment of the present invention.

[0097] Figure 49 FIG. 4 is a plan view showing the structure of a main body unit of a socket device according to a fourth embodiment of the present invention.

[0098] Figure 50 for Figure 49 The cross-sectional structure diagram of the BB-BB line.

[0099] Figure 51 for Figure 49 The cross-sectional structure diagram of the CC-CC line.

[0100] Figure 52 FIG. 4 is a plan view showing the configuration of a socket cover unit of a socket device according to a fourth embodiment of the present invention.

[0101] Figure 53 for Figure 52 The cross-sectional structure diagram of the DD-DD line.

[0102] Figure 54 for Figure 52 The cross-sectional structure diagram of the EE-EE line. DETAILED DESCRIPTION

[0103] First, the terms or words used in this specification and claims should not be limited to the conventional or dictionary meanings, but should be interpreted based on the principle that the inventor can appropriately define the concept of the term in order to explain his invention in the best way, and should be interpreted as the meaning and concept that is consistent with the technical idea of ​​the present invention.

[0104] Therefore, the embodiments described in this specification and the configuration shown in the accompanying drawings are merely the most preferred embodiments of the present invention and do not represent all technical concepts of the present invention. Therefore, it should be understood that the present application is capable of realizing a variety of equivalents and variations.

[0105] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. For a plurality of identical configurations, only one configuration will be assigned a reference numeral. The reference numerals will be used to distinguish between the configurations only when they need to be distinguished.

[0106] Figure 6 is a plan view of the socket device according to the first embodiment of the present invention, Figure 7 for Figure 6 The cross-sectional diagram of the BB line, Figure 8 for Figure 6 The cross-sectional structure diagram of the CC line.

[0107] Reference Figures 6 to 8 The test socket device 200 according to this embodiment includes: a contactor 110; a main body 210 having a first receiving hole 211 formed therein, the first receiving hole 211 allowing the upper end of the contactor 110 to pass through, thereby compressing the contactor 110 and causing it to move downward, and the main body 210 further having a plurality of mounting portions 212 fixed to a PCB; a lower plate 220 assembled to the lower end of the main body 210 and having a second receiving hole 221 formed therein at a position corresponding to the first receiving hole 211, allowing the lower terminal portion 112 to pass through; a floating plate 230 having a contact hole 231 formed therein at a position corresponding to the first receiving hole 211, so that the upper end of the contactor 110 is located in the contact hole 231, and the floating plate 230 is spaced apart from the upper end of the main body 210; and a plurality of floating springs 240 elastically supporting the main body 210 and the floating plate 230.

[0108] The contactor 110 includes: an upper terminal portion 111, which is electrically in contact with a terminal of an IC or a terminal of a PCB; a lower terminal portion 112, which is arranged on the same axis as the upper terminal portion 111 and is electrically in contact with a terminal of the PCB; and an elastic portion 113, which is elastically supported axially between the upper terminal portion 111 and the lower terminal portion 112. Specific embodiments related to this will be further described in detail through relevant drawings.

[0109] The contactor 110 is inserted between the main body 210 and the lower plate 220. During the loading process of the IC 1, the upper terminal portion 111 is compressed and moved downward in the process of contacting the ball terminal 2, and then the elastic portion 113 is compressed in the axial direction. When the IC 1 is unloaded, the upper terminal portion 111 moves upward again under the elastic force of the elastic portion 113, but the rising height is limited within the first receiving hole 211.

[0110] In particular, refer to Figure 7 The main body 210 is formed with a downwardly protruding mounting portion 212, which is used for fixing to the PCB. This mounting portion 212 can be in the shape of a cylindrical or polygonal post. Preferably, the mounting portion 212 is formed with a through hole 212a extending along its length and a groove 212b cut out to a predetermined height at its lower end. A protruding anti-tamper protrusion 212c is formed on the outer peripheral surface of the mounting portion 212, so that the front end of the mounting portion 212 can be pressed into the mounting hole of the PCB and firmly fixed.

[0111] Preferably, a rivet 260 can be added to be inserted into the through hole 212a. After the anti-tamper protrusion 212c is fixed in the assembly hole of the PCB, the rivet 260 is pressed into the through hole 212a to prevent the anti-tamper protrusion 212c from deforming and shrinking inward, causing the assembly portion 212 to loosen from the PCB. Figure 7 To facilitate understanding, the figure shows a case where the rivet 260 is inserted only into the fitting portion 212 on the left side.

[0112] The floating plate 230 is arranged at a predetermined height S1 from the main body 110 by a plurality of floating springs 240, and the upper terminal 111 is located in the contact hole 231. Figure 6 In the embodiment, a plurality of floating springs 240 are disposed on the floating plate 230 , and the number of the floating springs 240 can be increased or decreased within a range that can stably support the floating plate 230 .

[0113] Preferably, the floating plate 230 may further include a ball terminal receiving hole 232 formed to extend upward from the contact hole 231 to accommodate the IC's ball terminal 2. Furthermore, in a land grid array (LGA) type IC in which the IC's terminals are non-ball terminals (BGA), the ball terminal receiving hole 232 may be omitted.

[0114] Preferably, an IC holding portion 250 may be further included, and the IC holding portion 250 is used to fix the IC loaded on the upper side of the floating plate 230 .

[0115] The IC holding portions 250 are provided at both ends of the upper side of the floating plate 230 so as to be slidable in the lateral direction, thereby elastically supporting both ends of the IC 1 .

[0116] In particular, if Figure 6 and Figure 7As shown, the IC holding parts 250 are respectively provided on the left and right sides of the upper end of the floating plate 230, and are elastically supported in the inner direction by the holding springs 251 inserted into the floating plate 230 in the horizontal direction. Therefore, the interval D1 between the two IC holding parts 250 is maintained to be less than the width D2 of the IC 1 (D1 < D2).

[0117] When the IC holding parts 250 are pushed outward by the floating plate 230 and the IC 1 is loaded, after the two IC holding parts 250 are pushed outward, they firmly push the two ends of the IC 1 against each other while resetting by the elastic force of the holding springs 251, so that the IC 1 is held on the upper surface of the floating plate 230.

[0118] The IC holding part 250 is formed with a plurality of first operation holes 252 penetrating vertically. The first operation holes 252 are holes for operating the IC holding part 250 by an IC loading / unloading device (such as Figure 38 , 39 , as shown in 40), which will be described later with reference to the relevant drawings. Figure 6 The case where two first operation holes 252 are respectively provided in the left and right IC holding parts 250 in the up and down direction is shown.

[0119] Figure 9 FIG. is a three-dimensional configuration diagram of a contactor according to the first embodiment of the present invention. Figure 10 (a) and (b) of are front views and side views of a contactor according to the first embodiment of the present invention.

[0120] Referring to Figure 9 and Figure 10 (a) and (b) of, the upper terminal part 111 of the contactor 110 of this embodiment, the lower terminal part 112 provided on the same axis (z-axis) as the upper terminal part 111, and the elastic parts 113a, 113b elastically supported between the upper terminal part 111 and the lower terminal part 112 are composed of a strip-shaped plate having a predetermined width w and thickness t (t < w).

[0121] In this embodiment, the case where the first width w1 of the upper terminal part 111 is equal to the second width w2 of the lower terminal part 112 is shown, but the width w1 of the upper terminal part 111 and the width w2 of the lower terminal part 112 may also be unequal, as long as they are less than the third width w3 which is the total width of the elastic part 113 (w1, w2 < w3).

[0122] In particular, in this embodiment, the elastic portion 113 has a first strip 113a and a second strip 113b, and the first strip 113a and the second strip 113b are separated by a narrow groove 113c with a fourth width w4 along the central axis (z axis). The first strip 113a and the second strip 113b have the same fifth width w5 and are bent in opposite thickness directions (±x axis directions) to each other. The fifth width w5 is greater than or equal to the thickness t of the strip plate and less than or equal to the fourth width w4.

[0123] In addition, it should be understood that the fourth width w4 of the narrow slot 113a in this specification does not refer to the physical distance between the first strip 113a and the second strip 113b, but refers to the horizontal width between the first strip 113a and the second strip 113b on the width direction plane, that is, the yz plane.

[0124] Preferably, the upper terminal portion 111 further includes an upper shoulder portion 111a, which is formed to protrude along the width direction (y-axis) of the elastic portion 113 from a node connected to the lower end of the elastic portion 113. The lower terminal portion 112 may also include a lower shoulder portion 112a, which is formed to protrude along the width direction (y-axis) of the elastic portion 113 from a node connected to the upper end of the elastic portion 113.

[0125] Preferably, the lower terminal portion 112 may further have an operation hole 112 b for disassembling or assembling the contactor.

[0126] The upper terminal portion 111 has an upper tip portion 111b formed with multiple contacts at the upper front end, thereby enhancing contact with the ball terminal. The lower terminal portion 112 can also have multiple contacts at the lower front end to enhance contact with the PCB.

[0127] In this embodiment, the lower terminal portion 112 is provided with a lower tip portion 112c having a contact point at the lower front end, which can be sharp and pointed like the upper tip portion or composed of multiple contacts, or can be deformed in various ways to enhance contact with the PCB.

[0128] Figure 11 (a) is a plan view of a contactor according to a first embodiment of the present invention, and (b) is a side view schematically showing an operation example along a vertical direction.

[0129] Reference Figure 11 In (a) and (b), when the IC is placed in the socket device and contacts the terminal of the contactor 110 of this embodiment, the upper terminal portion 111 moves downward by a predetermined height k1 while the elastic portions 113a and 113b are compressed.

[0130] Figure 12 (a) and (b) are a plan view and a side view for explaining an arrangement example of the contactors according to the first embodiment of the present invention.

[0131] Referring to Figure 12 In (a) and (b) of Figure 12 , for this embodiment, even if multiple contactors are arranged in a row, they can operate without interfering with each other, so the space efficiency can be improved. For example, when two contactors 110A and 110B are arranged on a straight line (x-axis), the second strip 113B of the first contactor 110A and the first strip 113A of the second contactor 110B are separated by the fourth width w4 equivalent to the slot. During operation, electrical short circuits do not occur between adjacent contactors. Therefore, multiple contactors can be arranged in a row to achieve high density and reduce the size of the socket device.

[0132] The contactor of this embodiment configured as above can be variously deformed. Other embodiments are shown below for illustration. Among them, descriptions repeated with the first embodiment are omitted, and the differences between the embodiments are mainly described.

[0133] Figure 13 In (a) and (b) of <000,0385> are the front view and side view of the contactor according to the second embodiment of the present invention. The contactor 120 of this embodiment is composed of an upper terminal portion 121, a lower terminal portion 122, and elastic portions 123a and 123b, which is substantially the same as the first embodiment. In particular, by making the length L2 of the lower terminal portion 122 greater than the length L1 of the upper terminal portion 121 (L1 < L2), in the welded socket device, the lower terminal portion 122 can be directly welded to the PCB.

[0134] Figure 14 is a three-dimensional configuration diagram of the contactor according to the third embodiment of the present invention.

[0135] Referring to Figure 14 , the contactor 130 of this embodiment is composed of an upper terminal portion 131, a lower terminal portion 132, and elastic portions 133a and 133b, which is substantially the same as the first embodiment. In particular, the upper terminal portion 131 can be formed into a cylindrical shape by rolling and bending a plate, and includes an upper tip portion 131b, and the upper tip portion 131b has multiple contacts, which are sharply protruded along the outer periphery of the upper end portion of the upper terminal portion 131.

[0136] In addition, although only the case where the upper terminal portion is cylindrical is shown in this embodiment, the lower terminal portion can also be configured to be cylindrical according to the form of the terminal (pad) on the PCB side.

[0137] Figure 15Stereo configuration diagram of a contactor according to a fourth embodiment of the present invention. In the contactor 140 of this embodiment, an upper terminal portion 141, a lower terminal portion 142 provided on the same axis (z-axis) as the upper terminal portion 141, and an elastic portion 143 elastically supported between the upper terminal portion 141 and the lower terminal portion 142 are formed of a strip-shaped plate having a predetermined width w and thickness t (t < w). The elastic portion 143 is composed of a first strip 143a and a second strip 143b that are separated by a long-hole-shaped slot 143b and have the same thickness as each other, which is the same as the above-described first embodiment. In particular, it is characterized in that the first strip 143a and the second strip 143b are bent in the same thickness direction (+x-axis direction).

[0138] For the contactor 140 configured as above, even if a plurality of contactors 140 are arranged in a straight line, the elastic portions of adjacent contactors are sufficiently electrically separated, and the spatial configuration of the contactors can be effectively ensured.

[0139] Figure 16 (a), (b), and (c) of are a plan view, a front view, and a side view of a contactor according to a fifth embodiment of the present invention. Figure 17 It is a schematic diagram showing an operation example of a contactor according to a fifth embodiment of the present invention.

[0140] Refer to Figure 16 (a) to (c) of, the contactor 150 of this embodiment includes: an upper terminal portion 151 having an upper tip portion 151b at its upper-side end; a lower terminal portion 152 having a lower tip portion 152b at its lower-side end and assembled to cross the upper terminal portion 151 in the length direction; and a spring 153 inserted between the upper terminal portion 151 and the lower terminal portion 152 for elastically supporting the upper terminal portion 151 and the lower terminal portion 152.

[0141] The upper terminal portion 151 and the lower terminal portion 152 have the same shape and are formed to have the thickness of a plate in their length direction. First slots 151c and second slots 152c are respectively formed in the upper terminal portion 151 and the lower terminal portion 152. The upper terminal portion 151 and the lower terminal portion 152 are inserted into the spring 153 in a manner of crossing each other at 90° to be assembled together.

[0142] As Figure 17 shown, the contactor 150 of this embodiment has an elastic force against an external force in its axial direction. During the process that the contactor 150 is compressed by an external force by a predetermined length k2, the terminals of a semiconductor device or a PCB that are respectively in contact with the upper terminal portion 151 and the lower terminal portion 152 are electrically connected to the terminals of the PCB.

[0143] Such a spring contactor can achieve electrical contact during axial compression and is therefore suitable for use in the socket device of this embodiment, similar to the contactor of the aforementioned embodiment. Furthermore, a contactor known as a "POGO Pin," a representative of existing spring contactors, is also suitable for use in the socket device of this embodiment.

[0144] Hereinafter, various components of the socket device according to the first embodiment of the present invention will be described in detail.

[0145] Figure 18 This is a plan view of the main body of the socket device according to the first embodiment of the present invention. Figure 19 This is a back view of the main body of the socket device according to the first embodiment of the present invention. Figure 20 for Figure 18 The cross-sectional diagram of the DD line, Figure 21 for Figure 18 The cross-sectional diagram of the EE line, Figure 22 for Figure 18 The cross-sectional diagram of the FF line, Figure 23 for Figure 18 The cross-sectional diagram of the GG line, Figure 24 for Figure 18 The cross-sectional structure diagram of the HH line.

[0146] Reference Figures 18 to 24 The main body 210 of this embodiment has a square planar structure with a horizontal upper surface, and a plurality of first receiving holes 211 are formed through the main body 210 at the center, and the upper tip portion of the contactor is arranged inside each first receiving hole 211 in a manner of inserting into the first receiving hole 211.

[0147] In particular, if Figure 22 As shown, in the main body 210, the guide surface 211a forming the first receiving hole 211 has an inclined surface that becomes narrower as it approaches the upper end opening, so the contactor of this embodiment (see Figure 9 ) is housed in the main body 210, and its upward movement is restricted, so that it can only be compressed and moved downward. Depending on the shape of the applicable contactor, the angle and shape of the guide surface 211a of the first receiving hole 211 can be modified in various ways so that the contactor can only be compressed and moved downward.

[0148] The main body 210 includes a cylindrical mounting portion 212 extending from its lower end. The mounting portion 212 includes a through-hole 212a extending longitudinally through the mounting portion 212; a groove 212b formed by cutting a predetermined height from the lower end; and a tamper-evident protrusion 212c protruding from and formed on the outer circumference of the mounting portion 212. A rivet can be pressed into the through-hole 212a to prevent the tamper-evident protrusion 212c from deforming and shrinking inward.

[0149] The main body 210 is provided with a plurality of first holding platforms 213 at its edge portion. The first holding platforms 213 are assembled with hook arms of the floating plate to guide the floating plate to move up and down on the upper side of the main body 210 .

[0150] A plurality of first receiving grooves 214 are formed on the upper surface of the main body 210 , and floating springs for elastically supporting the floating plate are placed in the first receiving grooves 214 .

[0151] The main body 210 is provided with a plurality of second retaining platforms 215, which protrude into a space formed at the lower end. These second retaining platforms 215 snap into a fixed arm provided on the lower plate, thereby securing the main body 210 and the lower plate. Reference numeral 216 denotes a guide groove, which guides the floating plate's vertical movement by inserting its guide protrusions into the grooves.

[0152] Figure 25 is a plan view of the lower plate of the socket device according to the first embodiment of the present invention, Figure 26 (a) and (b) are Figure 25 The cross-sectional diagram of the II line and JJ line, Figure 27 (a) and (b) are Figure 25 The cross-sectional structure diagram and back structure diagram of the KK line.

[0153] Reference Figures 25 to 27 (b), the lower plate 220 is assembled at the lower end of the main body, and a plurality of second receiving holes 221 are formed at positions corresponding to the first receiving holes of the main body. The lower tip of the contactor protrudes downward and is fixed in each second receiving hole 221.

[0154] In particular, if Figure 26 As shown in (b), in the lower plate 220, the guide surface 221a forming the second receiving hole 221 has an inclined surface that becomes narrower as it approaches the lower end opening, so the contactor of this embodiment (refer to Figure 9 ) is fixed in the second receiving hole 221 with its lower tip protruding downward by a predetermined length, and its downward movement is restricted. In addition, the angle and shape of the guide surface 221a of the second receiving hole 221 can be modified in various ways according to the shape of the applicable contactor.

[0155] Figure 28 is a plan view of a floating plate of a socket device according to a first embodiment of the present invention, Figure 29 for Figure 28 The cross-sectional diagram of the LL line, Figure 30 for Figure 28 The cross-sectional diagram of the MM line, Figure 31 for Figure 28 The cross-sectional structure diagram of the NN line, Figure 32 for Figure 28 The cross-sectional diagram of the OO line, Figure 33 for Figure 28 The cross-sectional structure diagram of the PP line, Figure 34 for Figure 28 The cross-sectional structure diagram of the QQ line.

[0156] Reference Figures 28 to 34 In this embodiment, floating plate 230 has contact holes 231 formed at positions corresponding to the first receiving holes in the main body, for receiving upper terminal portion 111. Floating plate 230 is spaced apart from the upper end of the main body. As described above, floating plate 230 is spaced a predetermined distance from main body 210 and is elastically supported by a floating spring.

[0157] Preferably, the floating plate 230 further includes a ball terminal receiving hole 232 . The ball terminal receiving hole 232 is formed by expanding upward from the contact hole 231 and is used to receive the ball terminal 2 of the semiconductor device.

[0158] The floating plate 230 is provided with a plurality of hook arms 233 extending from the edge portion to the lower end, and the hook arms 233 are connected to the first holding platform 213 (see FIG. Figure 18 ) assembly.

[0159] On the lower surface of the floating plate 230, a plurality of second receiving grooves 234 are formed at positions corresponding to the first receiving grooves 214 of the main body. Floating springs are placed in the second receiving grooves 234 to elastically support the main body and the floating plate. Reference numeral 235 is a guide groove 216 of the main body (see FIG. Figure 23 ) The guide protrusion assembled guides the up and down movement of the floating plate.

[0160] As described above, the floating plate 230 is formed with a plurality of guide platforms 236a and 236b. The plurality of guide platforms 236a and 236b are used to assemble the IC holding portion and guide the sliding of the IC holding portion within a predetermined distance range. In this embodiment, the guide platforms 236a and 236b are shown as a first guide platform 236a formed at the edge of the floating plate 230 and a second guide platform 236b provided on the inner side of the first guide platform 236a. Figure 28 As a reference, the case where four guide stages are provided for assembly to the IC holding portion on the left side of the floating plate 230 is shown, but the positions and number of the guide stages may be increased or decreased.

[0161] The floating plate 230 includes a holding spring assembly portion 237 in which a floating spring for elastically supporting the IC holding portion in a horizontal direction is assembled.

[0162] The floating plate 230 is formed with a plurality of second operation holes 238 that penetrate vertically. The second operation holes 238 are holes for guiding an IC loading / unloading device (not shown) serving as an auxiliary mechanism for IC loading / unloading.

[0163] Figure 35 This is a plan view of the IC holding portion of the socket device according to the first embodiment of the present invention. Figure 36 (a) and (b) are Figure 35 The cross-sectional diagram of the RR and SS lines, Figure 37 (a) and (b) are Figure 35 The cross-sectional and side views of the TT line.

[0164] Reference Figures 35 to 37 (b), the IC holding portion 250 of this embodiment includes a plurality of guide arms 253a, 253b, which are respectively provided at both ends of the upper side of the floating plate 230, for stably fixing the loaded IC and cooperating with the guide platforms 236a, 236b of the floating plate (refer to Figure 32 ) together guide the movement of the IC holding portion 250 in the horizontal direction.

[0165] The holding surface 254 of the IC holding portion 250 , which contacts the loaded IC, includes a holding spring fixing portion 255 formed at one end for fixing one end of the holding spring 251 .

[0166] Reference numeral 252 denotes a second operation hole formed vertically through, for guiding an IC loading / unloading device 270 (see FIG. Figures 38 to 40 Preferably, the upper open end of the second operating hole 252 is formed with an expanded guide inclined surface 252a to guide the insertion direction of the operating pin 273 provided in the IC loading / unloading device.

[0167] Figures 38 to 40 1 is a schematic diagram for explaining an operation example of the socket device according to the first embodiment of the present invention.

[0168] Reference Figure 38 In order to load IC 1, an IC loading / unloading device 270 can be used as another auxiliary mechanism. The IC loading / unloading device 270 includes a main body 272 and a plurality of operating pins 273. The main body 272 is formed with an opening 271 for loading IC, and the plurality of operating pins 273 are formed at the lower end of the main body 272 in a protruding manner.

[0169] The main body 272 includes a guide side wall 271 a forming a lower end of the opening 271 and a guide inclined surface 271 b extending obliquely from the guide side wall 271 a .

[0170] The distance D1 between the two IC holding portions 250 provided on the upper portion of the floating plate 230 in the socket device 200 is kept smaller than the width D2 (D1) of the loaded IC 1. <D2)。

[0171] Reference Figure 39 When the IC loading / unloading device 270 is inserted into the upper portion of the socket device 200, the operating pin 273 is inserted into the operating holes 252 and 238 of the IC holding portion 250 and the floating plate 230, thereby expanding the gap D3 between the two IC holding portions 250, and the IC 1 is placed on the upper portion of the floating plate 230.

[0172] like Figure 40 As shown, when IC 1 is placed on top of floating plate 230 and IC loading / unloading device 270 is removed, IC holding portion 250, via retaining spring 251, adheres tightly to the side of IC 1, securing IC 1. IC 1, thus placed on socket device 200, is pressed against the upper tip of contactor 110 by a pusher (not shown), causing the IC 1's terminals to contact the upper tip of contactor 110, enabling IC testing. Alternatively, to unload the IC, IC loading / unloading device 270 can be reassembled on socket device 200 and the IC holding portion 250, which originally secured IC 1, can be expanded to unload the IC 1.

[0173] Figure 41 is a plan view of a socket device according to a second embodiment of the present invention, Figure 42 for Figure 41 The cross-sectional structure diagram of the UU line, Figure 43 for Figure 41 The cross-sectional structure diagram of the XX line.

[0174] Reference Figures 41 to 43 The socket device 300 of this embodiment is a modified embodiment of the socket device of the first embodiment, and only includes a main body 310 , a lower plate 320 , and a plurality of contacts 110 provided on the main body 310 and the lower plate 320 .

[0175] The main body 310 and the lower plate 320 of this embodiment are the same as those of the socket device of the first embodiment, except that the assembly portion 212 of the main body 310 (see Figure 7 ) can be replaced by multiple guide pins 312 for assembly at precise positions on the PCB, or can be eliminated.

[0176] In the socket device 300 of this embodiment constructed as described above, the upper side of the contactor 110 contacts the terminals of the IC (or the terminals of the PCB), and the lower side contacts the terminals of the PCB, thereby performing IC testing or serving as a contactor for electrically connecting PCBs.

[0177] Such a contactor can include contacts arranged in different ways with different pitches, thereby achieving stable resistance characteristics and having a significant cost-reduction effect in mass production.

[0178] Figure 44 is a plan view of a socket device according to a third embodiment of the present invention, Figure 45 for Figure 44 The cross-sectional view of line YY, Figure 46 (a) and (b) are Figure 44 The cross-sectional view of the ZZ line and the AA-AA line, Figure 47 2 is a cross-sectional view showing an operation example of the socket device according to the third embodiment of the present invention.

[0179] Reference Figures 44 to 46 (b), the socket device 400 of this embodiment substantially includes the same as the first embodiment (refer to Figure 6 ) is composed of a main body 410, a lower plate 420 and a floating plate 430, and in particular, also includes: a cover body 440, which is elastically supported on the upper part of the main body 410 and can move up and down; and a pair of pressurizing mechanisms, which are open-top pressurizing mechanisms, which are symmetrically arranged relative to the main body 410, and are linked with the up and down movement of the cover body 440 to apply pressure to the IC 1 placed on the floating plate 430, so that the terminals of the IC 1 are in electrical contact with the contactor 110.

[0180] The main body 410 may include an embedded nut 411 on the lower end surface for assembling the socket device to the PCB. The main body 410 is fixed to the PCB via the embedded nut 411 and the screw B.

[0181] The cover portion 440 is spaced apart from the upper portion of the main body 410 by a coil spring 441 and is elastically supported. The cover portion 440 has a stop arm 442 extending from its lower end edge, and the upward movement of the stop arm 442 is restricted by a stop protrusion 412 protruding from the main body 410. When no operating force is applied to the cover portion 440, the cover portion 440 is positioned at a position sufficiently spaced apart from the upper portion of the main body 410 by the coil spring 441, and the floating plate 430 is positioned at a position spaced apart from the main body 410 by a floating spring 432. For reference, Figure 45 The cover 440 is located at the upper end, the pusher 450 descends, and the IC 1 is pressed by the pusher 450. Figure 47 The state in which the cover portion 440 is subjected to an operating force and a pressure corresponding to the cover stroke CS is shown is shown. This is a state in which the pusher 450 is open, and ICs can be loaded / unloaded.

[0182] The cover portion 440 includes a guide leg 443 vertically extending from a lower end thereof, the guide leg 443 being inserted into the main body 410 and guiding the up and down movement of the cover portion 440 .

[0183] The open-top pressure mechanism includes: a pusher 450 for contacting and applying pressure to the top surface of the IC 1 placed on the floating plate; a connector 460, one end of which is rotatably assembled to the main body 410 via a first hinge axis H1 and the other end of which is rotatably assembled to the pusher 450 via a second hinge axis H2; and a latch 470, one end of which is rotatably assembled to the cover 440 via a third hinge axis H3 and the other end of which is rotatable via a hinge axis common to the second hinge axis H2 and rotatably assembled to the pusher 450 via a fourth hinge axis H4 spaced apart from the second hinge axis H2.

[0184] Pusher 450 is used to contact the top surface of IC 1 to directly apply pressure to IC 1. It preferably also includes a heat sink for dissipating heat. In this embodiment, the heat sink comprises a heat sink fin 451 integrally formed with the top surface of pusher 450. Alternatively, a separate heat sink may be assembled above pusher 450. This heat sink dissipates heat generated by the IC during IC testing.

[0185] One end of the connector 460 is rotatably assembled to the main body 410 via a first hinge axis H1, and the other end is rotatably assembled to the latch 470 via a second hinge axis H2. Preferably, the first hinge axis H1 of the connector 460 is elastically supported by a torsion spring 461, thereby elastically supporting the connector 460 in the opening direction or the closing direction.

[0186] The latch 470 includes three hinge axes H2, H3, and H4. One end of the latch 470 is rotatably assembled to the guide leg 443 of the cover 440 via the third hinge axis H3. The other end has a hinge axis that is common to the second hinge axis H2. The latch 470 is directly hingedly assembled to the pusher 450 via a fourth hinge axis H4, which is spaced apart from the second hinge axis H2. Preferably, the fourth hinge axis H4 is arranged below the second hinge axis H2, allowing the latch 470 to be hingedly assembled with the pusher 450.

[0187] The hinge shafts of the connector 460 and the latch 470 can be assembled with the guide leg 443 , the main body 410 , and the pusher 450 in a freely rotatable manner via the hinge shafts and the snap rings.

[0188] Therefore, the first hinge axis H1 acts as a hinge axis fixed to the main body 410, the third hinge axis H3 acts as a hinge axis that moves with the up and down movement of the cover body 440, and the second hinge axis H2 and the fourth hinge axis H4 also act as hinge axes that enable the pusher 450 to open and close along a predetermined trajectory by linking with the up and down positions of the third hinge axis H3.

[0189] The open top pressurizing mechanism described above can obtain a sufficient opening angle and only requires a small up and down stroke CS of the cover 440 , thereby minimizing interference with the pusher 450 when loading the IC 1 .

[0190] Figure 48 FIG. 4 is a side view of a socket device according to a fourth embodiment of the present invention.

[0191] Reference Figure 48 The socket device 500 of this embodiment substantially includes the same components as those of the first embodiment (see Figure 6 ) is composed of a main body 510, a lower plate 520 and a floating plate 530, and in particular, also includes a pressing mechanism, which is a clamshell type pressing mechanism. By applying pressure to the IC 1 placed on the floating plate 530, the terminals of the IC 1 are electrically contacted with the contactor 110.

[0192] The flip-top pressure mechanism described above includes: a base 540, which is fixed to the main body 510; a socket cover 550, which is rotatably assembled to the base 540 and has a latch 551 that can be hooked and fixed to the base 540; and a pusher 560, which is provided on the socket cover 550 and applies pressure to the top surface of the IC 1.

[0193] The base 540 is fixed to the main body 510 in a manner of surrounding the main body 510 , and has a hinge portion 541 at one end and a locking flange 542 at the other end.

[0194] The socket cover 550 is rotatably assembled to the hinge portion 541 via a hinge pin and includes a latch 551 fixed to the locking flange 542. A hinge spring 541a is inserted into the hinge end of the socket cover 550, and the socket cover 550 elastically opens and closes relative to the base 540.

[0195] Preferably, the latch 551 is rotatably assembled to the socket cover 550 via a hinge, and the latch 551 may further include a latch spring 552 that elastically supports the latch 551. The latch spring 552 applies pressure to the latch 551 along the locking direction to prevent the latch 551 from easily falling off the locking flange 542.

[0196] The pusher 560 is provided on the socket cover 550 for applying pressure to the top surface of the IC 1 , and preferably further includes a heat dissipation portion for dissipating heat.

[0197] When the socket cover 550 is closed, the latch 551 is hooked and fixed by the locking flange 542, and the pusher 560 applies pressure to the top surface of IC 1, so that the terminals of IC 1 are in electrical contact with the contactor 110, so that IC 1 can be tested.

[0198] In addition, in this embodiment, the main body 510 and the base 540 are distinguished, but the main body 510 and the base 540 can also be integrated.

[0199] Figure 49 A plan view of the main body unit of a socket device according to a fourth embodiment of the present invention is shown. Figure 50 for Figure 49 The cross-sectional diagram of the BB-BB line, Figure 51 for Figure 49 The cross-sectional structure diagram of the CC-CC line.

[0200] Reference Figures 49 to 51 As described above, the main body 510, the lower plate 520 and the floating plate 530 of the fixed contactor 110 in the main body unit are substantially the same as those in the first embodiment, so repeated description is omitted and the differences are mainly described.

[0201] One end of the base 540 is provided with a hinge portion 541, and the other end is provided with a locking flange 542 that can be hooked and fixed with a latch. The hinge portion 541 is formed with a hinge hole 541b and is hingedly assembled with the socket cover through a hinge pin 544.

[0202] The base 540 may further include a plurality of guide pins 543, which are fixed to the main body 510 via a plurality of bolts 540a so as to allow the base 540 to be mounted at a precise position on the PCB. The guide pins 543 may further include embedded nuts (not shown) for mounting to the PCB.

[0203] Preferably, the floating plate 530 further includes IC placement guides 531 a and 531 b located on an upper surface thereof, and the IC placement guides 531 a and 531 b have guide surfaces for placing ICs.

[0204] The IC placement guides 531 a and 531 b may include a guide sidewall 531 a facing the side surface of the IC 1 and a guide inclined surface 531 b inclined upward from the guide sidewall 531 a . Figure 51 Reference numeral 532 is a floating spring.

[0205] Figure 52 A plan view of a socket cover unit of a socket device according to a fourth embodiment of the present invention is shown. Figure 53 for Figure 52 The cross-sectional diagram of the DD-DD line, Figure 54 for Figure 52 The cross-sectional structure diagram of the EE-EE line.

[0206] Reference Figures 52 to 54 The socket cover unit includes: a socket cover 550, which is formed with a hinge arm 550a for hinge assembly with the base and has a latch 551 that can be fixed to a locking flange of the base; and a pusher 560, which is provided on the socket cover 550 and applies pressure to the top surface of the IC.

[0207] The socket cover 550 is assembled with a latch 551 via a hinge pin 553 , and a latch spring 552 elastically supports the latch 551 in a locking direction of the socket cover 550 .

[0208] The pusher 560 is arranged approximately in the center of the socket cover 550, contacts the top surface of the IC and applies pressure to the IC. Preferably, the pusher 560 is assembled to the socket cover 550 through a plurality of push springs 561, and the force pressing the IC can be adjusted by the elastic force of the push springs 561.

[0209] Preferably, the pusher 560 may further include a heat sink 570 on the upper portion for dissipating heat. In addition, the heat sink 570 may be a heat sink fin integrally formed with the upper surface of the pusher 560.

[0210] As described above, although the present invention is described through limited embodiments and drawings, the present invention is not limited thereto. A person skilled in the art in the art to which the present invention belongs may make various modifications and variations within the scope of equivalence of the technical concept of the present invention and the appended claims.

[0211] Description of Reference Numerals

[0212] 1: IC

[0213] 110, 120, 130, 140, 150: Contactors

[0214] 111: Upper terminal

[0215] 112: Lower terminal

[0216] 113: Elastic part

[0217] 200, 300, 400, 500: socket device

[0218] 210, 310, 410, 510: Main body

[0219] 220, 320, 420, 520: Lower plate

[0220] 230, 330, 430, 530: floating plate

[0221] 240: Floating spring

[0222] 250: IC holding unit

[0223] 260: Rivets

[0224] 270: IC loading / unloading device

Claims

1. A contactor for testing a semiconductor device, comprising: An upper terminal portion having an upper tip portion at its upper side end; A lower terminal portion having a lower tip portion at its lower side end and provided on the same axis as the upper terminal portion; and an elastic portion for elastically supporting the upper terminal portion and the lower terminal portion; the contactor for testing a semiconductor device is formed of a strip plate having a predetermined width (w) and thickness (t) (t < w), characterized in that The upper terminal portion and the lower terminal portion respectively include shoulders protruding in the width direction thereof, the shoulder of the upper terminal portion is formed to protrude in the width direction of the elastic portion from a node connected to the lower end of the elastic portion, and the shoulder of the lower terminal portion is formed to protrude in the width direction of the elastic portion from a node connected to the upper end of the elastic portion; The elastic portion has a third width (w3) which is greater than the first width (w1) of the upper terminal portion and the second width (w2) of the lower terminal portion (w1, w2 < w3), the elastic portion is composed of a first strip and a second strip vertically formed along a central axis (z-axis) in the horizontal direction, a slot having a fourth width (w4) is provided between the first strip and the second strip, the first strip and the second strip have the same fifth width (w5), and are bent in opposite thickness directions, and the fifth width (w5) is greater than or equal to the thickness (t) of the strip plate and less than or equal to the fourth width (w4); The upper terminal portion or the lower terminal portion is a hollow cylindrical shape formed by rolling and bending a plate material, and the upper tip portion or the lower tip portion has a plurality of contacts, which are sharply protruded along the outer circumference of the cylindrical end of the upper terminal portion or the lower terminal portion.

2. A contactor for testing a semiconductor device, comprising: An upper terminal portion having an upper tip portion at its upper side end; A lower terminal portion having a lower tip portion at its lower side end and provided on the same axis as the upper terminal portion; and an elastic portion for elastically supporting the upper terminal portion and the lower terminal portion, the contactor for testing a semiconductor device is formed of a strip plate having a predetermined width (w) and thickness (t) (t < w), characterized in that The upper terminal portion and the lower terminal portion respectively include shoulders protruding in the width direction thereof, the shoulder of the upper terminal portion is formed to protrude in the width direction of the elastic portion from a node connected to the lower end of the elastic portion, and the shoulder of the lower terminal portion is formed to protrude in the width direction of the elastic portion from a node connected to the upper end of the elastic portion; The elastic part has a third width (w3), which is greater than the first width (w1) of the upper terminal part and the second width (w2) of the lower terminal part (w1, w2 < w3). The elastic part is composed of a first strip and a second strip vertically formed along the central axis (z-axis) in the horizontal direction. There is a slot with a fourth width (w4) between the first strip and the second strip. The first strip and the second strip have the same fifth width (w5) and are bent in the same thickness direction. The fifth width (w5) is greater than or equal to the thickness (t) of the strip-shaped plate and less than or equal to the fourth width (w4); The upper terminal part or the lower terminal part is a hollow cylindrical shape formed by rolling and bending a plate. The upper tip part or the lower tip part has a plurality of contacts, which are sharply protruded along the outer circumference of the cylindrical end of the upper terminal part or the lower terminal part.

3. The contactor for testing semiconductor devices according to claim 1 or 2, characterized in that: The upper tip part or the lower tip part has at least one sharp contact.

4. The contactor for testing semiconductor devices according to claim 1 or 2, characterized in that: The lower tip part is longer than the upper tip part.

5. The contactor for testing semiconductor devices according to claim 1 or 2, characterized in that: The lower terminal part has an operation hole formed therethrough.

6. A socket device for testing semiconductor devices, comprising the contactor according to any one of claims 1 to 5, characterized in that: Further comprising: A main body part, which is formed with a first receiving hole that allows the upper tip part to pass through and protrude outward, so as to compress the contactor and move it downward; And A lower plate, which is assembled at the lower end of the main body part and is formed with a second receiving hole at a position corresponding to the first receiving hole. The second receiving hole allows the lower tip part to protrude downward and be held therein.

7. A socket device for testing semiconductor devices, comprising the contactor according to any one of claims 1 to 5, characterized in that: Further comprising: A main body part, which is formed with a first receiving hole and provided with a plurality of assembling parts fixed to a printed circuit board (PCB). The first receiving hole allows the upper tip part to pass through and protrude outward, so as to compress and move the contactor downward; A lower plate, which is assembled at the lower end of the main body part and is formed with a second receiving hole at a position corresponding to the first receiving hole. The second receiving hole allows the lower tip part to protrude downward and be held therein; A floating plate, which is formed with a contact hole at a position corresponding to the first receiving hole so that the upper terminal part is located in the contact hole. The floating plate is spaced apart from the upper end of the main body part; and A plurality of floating springs for elastically supporting the main body part and the floating plate.

8. A socket device for testing semiconductor devices, characterized in that: Comprising: A contactor, which includes: an upper terminal part having an upper tip part at its upper side end; a lower terminal part having a lower tip part at its lower side end and assembled with the upper terminal part crosswise in the length direction; and a spring disposed between the upper terminal part and the lower terminal part for elastically supporting the upper terminal part and the lower terminal part; The upper terminal part or the lower terminal part is a hollow cylindrical shape formed by rolling and bending a plate. The upper tip part or the lower tip part has a plurality of contacts, which are sharply protruded along the outer circumference of the cylindrical end of the upper terminal part or the lower terminal part; a main body portion having a first receiving hole formed therein and provided with a plurality of mounting portions fixed to a printed circuit board (PCB), the first receiving hole allowing the upper tip portion to pass therethrough and protrude outward, thereby compressing and moving the contactor downward; a lower plate assembled at the lower end of the main body, and having a second receiving hole formed at a position corresponding to the first receiving hole, wherein the second receiving hole allows the lower tip portion to protrude downward and be retained therein; a floating plate having a contact hole formed at a position corresponding to the first receiving hole so that the upper terminal portion is located in the contact hole, the floating plate being spaced apart from an upper end of the main body portion; and A plurality of floating springs are used for elastically supporting the main body and the floating plate.

9. The socket device for testing a semiconductor device according to claim 7 or 8, characterized in that: Also includes: IC holding portions are provided at both ends of the upper side of the floating plate in a manner capable of elastically sliding in a lateral direction, thereby elastically supporting both ends of a semiconductor device loaded and placed on the floating plate.

10. The socket device for testing a semiconductor device according to claim 7 or 8, characterized in that: The assembly portion is a columnar object protruding and extending from the lower portion of the main body.

11. The socket device for testing a semiconductor device according to claim 10, wherein: The fitting portion includes: a through hole formed therethrough; a groove cut out by a lower end portion; and a tamper-proof protrusion protruding from and formed on an outer peripheral surface of the fitting portion.

12. The socket device for testing a semiconductor device according to claim 11, wherein: Also includes: A rivet is inserted into the through hole.

13. The socket device for testing a semiconductor device according to claim 7, wherein: include: a cover portion, which is elastically supported on the upper portion of the main body portion and is capable of moving up and down; A pair of pressurizing mechanisms are symmetrically arranged with respect to the main body, and apply pressure to the IC in conjunction with the up and down movement of the cover. The pressurizing mechanism comprises: a pushing member, configured to contact and apply pressure to a top surface of the IC placed on the floating plate; a connecting member, one end of which is rotatably assembled to the main body via a first hinge shaft (H1), and the other end of which is rotatably assembled to the pushing member via a second hinge shaft (H2); and A latch, one end of which is rotatably assembled to the cover body through a third hinge shaft (H3), and the other end of which can be rotated through a hinge shaft common to the second hinge shaft (H2), and is rotatably assembled to the pusher through a fourth hinge shaft (H4) arranged at a distance from the second hinge shaft (H2).

14. The socket device for testing a semiconductor device according to claim 13, wherein: The pushing member further includes a heat dissipation portion on its upper surface for dissipating heat.

15. The socket device for testing a semiconductor device according to claim 13, wherein: The main body also includes an embedded nut for mounting to a PCB.

16. The socket device for testing a semiconductor device according to claim 13, wherein: The floating plate further comprises: The IC placement guide has a guide surface for guiding the placement position of the IC.

17. The socket device for testing a semiconductor device according to claim 7, wherein: include: a base having a hinge portion at one end and a locking flange at the other end, wherein the base is fixed to the main body; a socket cover rotatably assembled to the hinge portion, and a latch fixed to the locking flange rotatably provided on the socket cover; The pushing member is arranged on the socket cover and applies pressure to the upper surface of the semiconductor device.

18. The socket device for testing a semiconductor device according to claim 17, wherein: The pushing member further includes a heat dissipation portion on the upper surface for dissipating heat.

19. The socket device for testing a semiconductor device according to claim 17, wherein: Also includes: A plurality of push springs are provided between the socket cover and the push member and are used for applying pressure to the push member.

20. The socket device for testing a semiconductor device according to claim 17, wherein The base also includes an embedded nut for mounting to a PCB.

21. The socket device for testing a semiconductor device according to claim 17, wherein The floating plate further comprises: The IC placement guide has a guide surface for guiding the placement position of the IC.

22. The socket device for testing a semiconductor device according to claim 17, wherein The main body and the base are integrated.

23. The socket device for testing a semiconductor device according to any one of claims 7, 8, 13 and 17, wherein: The floating plate further comprises: A ball-type terminal receiving hole is extended upward from the contact hole so that a terminal of the semiconductor device is placed in the ball-type terminal receiving hole.

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