Battery assembly, battery module and manufacturing method of battery assembly
By integrating components such as busbars and fuses onto the same circuit board, and setting up heat dissipation modules and cavities on the circuit board, the problems of large space occupation and poor heat dissipation of battery modules are solved, achieving rapid heat dissipation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- AVARY HLDG (SHENZHEN) CO LTD
- Filing Date
- 2021-06-18
- Publication Date
- 2026-05-12
AI Technical Summary
In existing battery modules, the busbar, fuse, and heat pipe are independent components, which occupy a lot of space and have poor heat dissipation effect, and cannot meet the heat dissipation requirements when using high power.
The busbar, fuse and other components are concentrated on the same circuit board, and a first heat dissipation module, a second heat dissipation module and a cavity are set on the circuit board. The circuit board is formed by etching and bent to accommodate the battery cell, so as to achieve rapid heat dissipation.
This reduces the need for additional space, improves the heat dissipation efficiency of the battery pack, and ensures the working condition of the battery pack.
Smart Images
Figure CN116569386B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of battery heat dissipation, and more particularly to a battery component, a battery module, and a method for manufacturing the battery component. Background Technology
[0002] Batteries are a crucial power source for some devices, such as electric vehicles. To meet the high power demands of these devices, multiple battery cells are typically assembled into large battery modules. To ensure the safety of these high-power battery modules, they must possess overcurrent protection and thermal management functions.
[0003] Existing battery modules typically use busbars to combine the current from multiple cells, install fuses for overcurrent protection, and additional heat pipes for heat dissipation. However, busbars, fuses, and heat pipes are all independent components, requiring additional space for their installation. Furthermore, existing heat pipes are located at both ends of the cells, which cannot meet the heat dissipation requirements of the battery module under high-power operation. Summary of the Invention
[0004] In view of this, it is necessary to provide a battery assembly with small layout space and fast heat dissipation to solve the above-mentioned technical problems.
[0005] This application also provides a battery module.
[0006] This application also provides a method for manufacturing a battery assembly.
[0007] A battery assembly includes a circuit board and a battery cell. The circuit board includes a first dielectric layer, a second dielectric layer, a film, a busbar, a first heat dissipation copper block, a fuse, and a second heat dissipation copper block. The film is located between the first dielectric layer and the second dielectric layer and has multiple spaced cavities. The first heat dissipation copper block and the busbar are located on the surface of the first dielectric layer opposite to the second dielectric layer. The second heat dissipation copper block and the fuse are located on the surface of the second dielectric layer opposite to the first dielectric layer. The circuit board includes heat dissipation areas and bending areas arranged sequentially and at intervals, and the heat dissipation areas and the bending areas form a receiving groove. The busbar, the first heat dissipation copper block, the fuse, and the second heat dissipation copper block are all located in the heat dissipation areas, and the busbar and the first heat dissipation copper block are arranged facing the receiving groove. The battery cell is located in the receiving groove and is electrically connected to the circuit board through the busbar.
[0008] In some embodiments, the battery assembly further includes a first thermally conductive sheet and a second thermally conductive sheet, the first thermally conductive sheet being located on the surface of the first dielectric layer facing the cavity, and the second thermally conductive sheet being located on the surface of the second dielectric layer facing the cavity.
[0009] In some embodiments, the battery assembly further includes a monitoring element connected to the fuse.
[0010] In some embodiments, the busbar and the connecting piece are arranged correspondingly in the same heat dissipation area.
[0011] In some embodiments, the cavity is also filled with liquid.
[0012] A battery module includes the battery assembly, the number of battery assemblies being at least two, wherein the second heat dissipation copper block of one battery assembly is connected to the surface of the cell of the adjacent battery assembly.
[0013] A method for manufacturing a battery assembly includes the following steps: providing a first substrate, the first substrate including a first copper layer, a first dielectric layer and a plurality of first thermally conductive adhesives, the first dielectric layer being located on the surface of the first copper layer, and the plurality of first thermally conductive adhesives respectively penetrating the first dielectric layer and connecting to the first copper layer; providing a second substrate, the second substrate including a second copper layer, a second dielectric layer and at least one second thermally conductive adhesive, the second dielectric layer being located on the surface of the second copper layer, and the second thermally conductive adhesive penetrating the second dielectric layer and connecting to the second copper layer; providing a film, the film including a plurality of through holes, the positions of the through holes corresponding to the positions of the first thermally conductive adhesives; pressing the first substrate and the second substrate onto opposite sides of the film and sealing the through holes, so that the through holes form cavities, forming heat dissipation areas and bending areas arranged sequentially at intervals; etching the first copper layer to form a busbar and a first heat dissipation copper block, etching the second copper layer to form a fuse and a second heat dissipation copper block, thereby forming a circuit board; bending the circuit board in the bending area to form a receiving groove, placing a battery cell in the receiving groove, the battery cell being electrically connected to the busbar, thereby forming the battery assembly.
[0014] In some embodiments, the step of forming the first substrate includes: providing a single-sided copper-clad laminate, including the first dielectric layer and the first copper layer located on the surface of the first dielectric layer; removing a portion of the first dielectric layer and exposing the surface of the first copper layer to form a groove; and filling the groove with a first thermally conductive adhesive.
[0015] In some embodiments, the first substrate further includes a first thermally conductive sheet, and the step of forming the first substrate further includes attaching the first thermally conductive sheet to the surface of the first thermally conductive adhesive.
[0016] In some embodiments, the step of "bending the circuit board in the bending area to form a receiving groove, placing a battery cell in the receiving groove, and electrically connecting the battery cell to the busbar to form the battery assembly" includes: attaching a connecting piece to the surface of the busbar; bonding an adhesive to the surfaces of the first heat dissipation copper block and the second heat dissipation copper block; bending both ends of the circuit board toward the side where the connecting piece is located to form the receiving groove; and receiving the battery cell in the receiving groove, wherein the battery cell is connected to the circuit board through the connecting piece to form the battery assembly.
[0017] The battery assembly provided in this application avoids the need for additional space for busbars and fuses by centrally arranging components such as busbars and fuses on the same circuit board, resulting in a smaller arrangement space. The circuit board surrounds the battery cell on multiple sides, which can quickly dissipate the heat generated by the battery cell. At the same time, the circuit board is provided with a first heat dissipation module, a second heat dissipation module, and a cavity to further improve the heat dissipation efficiency of the circuit board, so as to ensure the working condition of the battery assembly. Attached Figure Description
[0018] Figure 1 A cross-sectional schematic diagram of a single-sided copper-clad laminate including a first dielectric layer and a first copper layer, provided for embodiments of this application.
[0019] Figure 2 To remove Figure 1 The diagram shows a portion of the first dielectric layer and exposes the surface of the first copper layer to form a groove.
[0020] Figure 3 In order to be in Figure 2 The diagram shows a cross-sectional view of the groove filled with the first thermally conductive adhesive.
[0021] Figure 4 In order to be in Figure 3 The diagram shows a cross-sectional view of the first thermally conductive sheet attached to the surface of the first thermally conductive adhesive.
[0022] Figure 5 This is a cross-sectional schematic diagram of the second substrate provided in an embodiment of this application.
[0023] Figure 6 This is a cross-sectional schematic diagram of the film provided in an embodiment of this application.
[0024] Figure 7 In accordance with Figure 4 The first substrate shown, Figure 6 The film shown and Figure 5 A cross-sectional schematic diagram showing the sequential placement of the second substrate.
[0025] Figure 8 For pressing Figure 7The diagram shows a cross-sectional view of the first substrate film and the second substrate.
[0026] Figure 9 For etching Figure 8 The diagram shows a cross-sectional view of the circuit board obtained after the first copper layer and the second copper layer.
[0027] Figure 10 In order to be in Figure 9 The diagram shows a cross-sectional view of the protective layer formed on the surface of the circuit board.
[0028] Figure 11 In order to be in Figure 10 The diagram shows a cross-sectional view of a connecting piece attached to the surface of the busbar.
[0029] Figure 12 In order to be in Figure 11 The diagram shows a cross-sectional view of the monitoring element connected to the fuse.
[0030] Figure 13 In order to be in Figure 12 The diagram shows a cross-sectional view of the adhesive bonding material on the surfaces of the first and second heat dissipation copper blocks.
[0031] Figure 14 To be Figure 13 The diagram shows a cross-sectional view of a battery assembly obtained by bending a circuit board to form a receiving groove and connecting a battery cell in the receiving groove.
[0032] Figure 15 For two Figure 14 The diagram shows a cross-sectional view of the battery module obtained after the battery components are interconnected.
[0033] Figure 16 A cross-sectional schematic diagram of a battery module including a bracket, provided for an embodiment of this application.
[0034] Explanation of main component symbols
[0035] Battery Components 100 circuit board 10 First substrate 20 Single-sided copper clad laminate 21 First dielectric layer 22 Grooving 23
[0036] First copper layer 24 bus 242 First heat dissipation copper block 245 First thermal conductive adhesive 25 First heat-conducting sheet 26 Second substrate 30 Second dielectric layer 32 Second copper layer 34 fuse 342 Second heat dissipation copper block 345 Second thermal conductive adhesive 35 Second heat-conducting plate 36 film 40 Through hole 42 cavity 45a, 45b protective layer 47 Connecting piece 52 Monitoring components 55 colloid 57 Container slot 60 battery cells 70 Battery Module 200 support 210 Heat dissipation area I Bending area II
[0037] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation
[0038] To better understand the above-mentioned objectives, features, and advantages of this application, the application will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. Many specific details are set forth in the following description to provide a thorough understanding of this application; the described embodiments are merely a part of the embodiments of this application, not all of them. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.
[0039] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The term "and / or" as used herein includes all and any combination of one or more of the associated listed items.
[0040] In the various embodiments of this application, for ease of description and not limitation, the term "connection" used in the patent application specification and claims is not limited to physical or mechanical connections, whether direct or indirect. Terms such as "upper," "lower," "above," "below," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship also changes accordingly.
[0041] Please see Figures 1 to 14 This application provides a method for manufacturing a battery assembly 100, including the following steps:
[0042] Step S1: Please refer to Figures 1 to 4 A first substrate 20 is provided. The first substrate 20 includes a first copper layer 24, a first dielectric layer 22 and a plurality of first thermally conductive adhesives 25. The first dielectric layer 22 is located on the surface of the first copper layer 24, and the plurality of first thermally conductive adhesives 25 respectively penetrate the first dielectric layer 22 and are connected to the first copper layer 24.
[0043] The material of the first dielectric layer 22 can be selected from flexible materials such as polyimide (PI), liquid crystal polymer (LCP), and modified polyimide (MPI) to facilitate bending in subsequent processes. In this embodiment, the material of the first dielectric layer 22 is polyimide.
[0044] In some embodiments, the first substrate 20 further includes a plurality of first thermally conductive sheets 26, which are disposed on the surface of the first thermally conductive adhesive 25 facing away from the first copper layer 24. The plurality of first thermally conductive adhesives 25 are spaced apart, and the plurality of first thermally conductive sheets 26 are also spaced apart. The spaced-apart first thermally conductive adhesives 25 and first thermally conductive sheets 26 facilitate bending in subsequent processes; the arrangement of the first thermally conductive sheets 26 facilitates rapid heat transfer.
[0045] The first heat-conducting sheet 26 is made of a material with good thermal conductivity, including but not limited to metals and carbon materials. In this embodiment, the first heat-conducting sheet 26 is made of copper.
[0046] In some embodiments, the first substrate 20 may be formed by the following steps:
[0047] Step S101: Please refer to Figure 1 A single-sided copper-clad laminate 21 is provided, including the first dielectric layer 22 and the first copper layer 24 located on the surface of the first dielectric layer 22.
[0048] Step S102: Please refer to Figure 2 A portion of the first dielectric layer 22 is removed to expose the surface of the first copper layer 24, thereby forming a groove 23.
[0049] The slot 23 penetrates the first dielectric layer 22 along the stacking direction of the first copper layer 24 and the first dielectric layer 22. There are multiple slots 23. The position of the slot 23 is related to the position of the cavities 45a and 45b to be formed subsequently.
[0050] Step S103: Please refer to Figure 3 The groove 23 is filled with a first thermally conductive adhesive 25.
[0051] The first thermally conductive adhesive 25 is used for rapid heat conduction and also serves as an adhesive.
[0052] Step S104: Please refer to Figure 4 The first thermally conductive sheet 26 is attached to the surface of the first thermally conductive adhesive 25.
[0053] Step S2: Please refer to Figure 5 A second substrate 30 is provided, the second substrate 30 includes a second copper layer 34, a second dielectric layer 32 and at least one second thermally conductive adhesive 35, the second dielectric layer 32 is located on the surface of the second copper layer 34, and the second thermally conductive adhesive 35 penetrates the second dielectric layer 32 and is connected to the second copper layer 34.
[0054] The material of the second dielectric layer 32 may be one of the aforementioned flexible materials.
[0055] The thicknesses of the first dielectric layer 22 and the second dielectric layer 32 can be 12.5μm-25μm respectively, to facilitate bending in subsequent processes.
[0056] In some embodiments, the second substrate 30 further includes at least one second thermally conductive sheet 36, which is located on the surface of the second thermally conductive adhesive 35 opposite to the second copper layer 34. The second thermally conductive sheet 36 is disposed corresponding to at least one of the first thermally conductive sheets 26. The material of the second thermally conductive sheet 36 includes, but is not limited to, metal, carbon materials, etc.
[0057] The steps for forming the second substrate 30 can be substantially the same as those for forming the first substrate 20, or other methods can be used to form the second substrate 30.
[0058] Step S3: Please refer to Figure 6 A film 40 is provided, the film 40 including a plurality of through holes 42, the positions of the through holes 42 corresponding to the positions of the first thermally conductive adhesive 25.
[0059] Step S4: Please refer to Figure 7 and Figure 8 The first substrate 20 and the second substrate 30 are respectively pressed onto the opposite sides of the film 40 and the through hole 42 is sealed so that the through hole 42 forms a cavity 45a, forming a heat dissipation area I and a bending area II arranged in sequence at intervals.
[0060] Wherein, along the stacking direction of the first substrate 20, the film 40 and the second substrate 30, the area corresponding to the first thermally conductive adhesive 25 and / or the second thermally conductive adhesive 35 is the heat dissipation area I, and the bending area II is located between two adjacent heat dissipation areas I.
[0061] In some embodiments, the first copper layer 24 and the second copper layer 34 are both located on the surface opposite to the film 40, and the first thermal conductive sheet 26 and the second thermal conductive sheet 36 are both located in the through hole 42. The first thermal conductive sheet 26 and the second thermal conductive sheet 36 located in the through hole 42 are used to quickly transfer heat.
[0062] In some embodiments, the number of through holes 42 is greater than the number of the first heat-conducting sheets 26, thereby forming multiple cavities 45a and 45b, so that the bending region II also has cavities 45b. The cavities 45a and 45b are filled with air. Since the heat dissipation performance of air is better than that of the first dielectric layer 22 and the second dielectric layer 32, the arrangement of cavities 45a and 45b can improve the heat dissipation performance. On the other hand, the arrangement of some cavities 45b facilitates bending in subsequent processes.
[0063] In some embodiments, the cavity 45a may also be filled with liquid, such as water, to further improve heat dissipation efficiency.
[0064] In some embodiments, the number of cavities 45a and 45b located in the same heat dissipation area I or the same bending area II is not limited to one, but can also be multiple, with the multiple cavities 45a and 45b separated by the film 40. The distance between two adjacent cavities 45a and 45b is greater than or equal to 1 mm, to allow for some overflow space due to the possibility of glue overflow during the subsequent pressing process.
[0065] The thickness of the film 40 can be 100μm-300μm to ensure that the first dielectric layer 22 and the second dielectric layer 32 will not connect to each other due to being too close during the subsequent bending process.
[0066] Step S5: Please refer to Figure 9 The first copper layer 24 is etched to form a busbar 242 and a first heat dissipation copper block 245, and the second copper layer 34 is etched to form a fuse 342 and a second heat dissipation copper block 345, thereby forming a circuit board 10.
[0067] Both the first copper layer 24 and the second copper layer 34 located in the bending region II are removed to facilitate bending of the bending region II in subsequent processes.
[0068] The first copper layer 24 and the second copper layer 34 located in the heat dissipation area I are partially etched. The bus 242 is used to connect to the battery cell 70 (see [link]). Figure 14 Electrical connection; the fuse 342 is used to electrically connect with the battery cell 70, and when a certain threshold is exceeded, it blocks the current in the battery cell 70 to protect the battery cell 70; the first heat dissipation copper block 245 and the second heat dissipation copper block 345 are used to contact the battery cell 70 to quickly transfer the heat generated by the battery cell 70 away.
[0069] The thickness of the first copper layer 24 is greater than or equal to 35 μm to ensure the range of current that can pass through after the current is collected.
[0070] In some implementations, please refer to Figure 10 The manufacturing method further includes the step of forming a protective layer 47, which is located around the busbar 242 and the fuse 342 to protect the busbar 242 and the fuse 342.
[0071] Step S6: Please refer to Figures 11 to 14The circuit board 10 is bent in the bending area II to form a receiving groove 60. A battery cell 70 is placed in the receiving groove 60 and electrically connected to the busbar 242 to form the battery assembly 100.
[0072] In some implementations, step S6 may be formed by the following steps:
[0073] Step S601: Please refer to Figure 11 A connecting piece 52 is connected to the surface of the busbar 242.
[0074] The material of the connecting piece 52 needs to be conductive, including but not limited to nickel sheet.
[0075] Step S602: Please refer to Figure 12 A monitoring element 55 is connected to the fuse 342.
[0076] The monitoring element 55 is used to monitor the operating condition of the battery cell 70 and transmit it to the electrically connected battery management system (BMS) (not shown), so that the battery management system can control the working state of the battery according to the battery operating condition.
[0077] Step S603: Please refer to Figure 13 Adhesive 57 is bonded to the surfaces of the first heat dissipation copper block 245 and the second heat dissipation copper block 345.
[0078] The colloid 57 can be any material that can perform its adhesive function, such as a cured adhesive.
[0079] Step S604: Please refer to Figure 14 The two ends of the circuit board 10 are bent toward the side where the connecting piece 52 is located to form the receiving groove 60.
[0080] The bending is performed along the area where the bending zone II is located, with the connecting piece 52 and the first heat dissipation copper block 245 facing the receiving groove 60, and the fuse 342 and the second heat dissipation copper block 345 located on the side away from the receiving groove 60.
[0081] Step S605: Please refer to again Figure 14 The battery cell 70 is placed in the receiving groove 60, and the battery cell 70 is connected to the circuit board 10 through the connecting piece 52, thereby forming the battery assembly 100.
[0082] A first heat-dissipating copper block 245 facing into the receiving groove 60 is connected to the battery cell 70 via the colloid 57, thereby fixing the battery cell 70 in the receiving groove 60. A second heat-dissipating copper block 345 facing away from the receiving groove 60 is used to connect to another battery cell 70, thereby transferring heat from the other battery cell 70. The arrangement of the first heat-dissipating copper block 245 and the second heat-dissipating copper block 345 increases the contact area between the battery cell 70 and the first and second heat-dissipating copper blocks 245, thereby improving heat dissipation performance.
[0083] Please see Figure 14 This application also provides a battery assembly 100, including at least one circuit board 10 and at least one battery cell 70. The circuit board 10 has a receiving groove 60, and the battery cell 70 is received in the receiving groove 60 and electrically connected to the circuit board 10. The battery cell 70 includes a positive electrode tab (not shown) and a negative electrode tab (not shown), which are used for electrical connection to the circuit board 10.
[0084] The circuit board 10 includes a heat dissipation area I and a bending area II arranged sequentially and at intervals. The heat dissipation area I and the bending area II surround and form the receiving groove 60, wherein the bending area II corresponds to the corner area of the battery cell 70.
[0085] The circuit board 10 includes a first dielectric layer 22, a second dielectric layer 32, a film 40, a fuse 342, a bus 242, a first heat sink copper block 245, and a second heat sink copper block 345.
[0086] The materials of the first dielectric layer 22 and the second dielectric layer 32 can be selected from flexible materials such as polyimide, liquid crystal polymer and modified polyimide.
[0087] The film 40 is located between the first medium layer 22 and the second medium layer 32. The film 40 is used to bond and support the first medium layer 22 and the second medium layer 32 to form a cavity 45a between the first medium layer 22 and the second medium layer 32.
[0088] The cavity 45a is located at least in the heat dissipation zone I. The cavity 45a is filled with air. Since air has better heat dissipation performance than the first dielectric layer 22 and the second dielectric layer 32, the cavity 45a can improve heat dissipation performance and reduce the weight of the battery assembly 100. In some embodiments, a liquid, such as water, can be injected into the cavity 45a located in the heat dissipation zone I to further improve heat dissipation efficiency.
[0089] In some embodiments, a cavity 45b is also provided between the first dielectric layer 22 and the second dielectric layer 32 in the bending region II, to facilitate bending in the bending region II during the formation of the battery assembly 100.
[0090] In some embodiments, the number of cavities 45a and 45b in the same area is not limited to one, but can be multiple, with the multiple cavities 45a and 45b separated by the film 40.
[0091] The busbar 242 and the first heat dissipation copper block 245 are located on the surface of the first dielectric layer 22 away from the second dielectric layer 32. The fuse 342 and the second heat dissipation copper block 345 are located on the surface of the second dielectric layer 32 away from the first dielectric layer 22. The fuse 342, the busbar 242, the first heat dissipation copper block 245 and the second heat dissipation copper block 345 are all located in the heat dissipation area I.
[0092] The busbar 242 corresponds to the positions of the positive and negative terminals of the battery cell 70, so that the circuit board 10 can be electrically connected to the battery cell 70.
[0093] In some embodiments, the battery assembly 100 further includes a connecting piece 52 located on the surface of the busbar 242 facing the cell 70 for electrically connecting the busbar 242 and the cell 70.
[0094] The fuse 342 is located on the surface of the second dielectric layer 32 away from the busbar 242, and the position of the fuse 342 corresponds to the position of the busbar 242 in the same area.
[0095] The second thermal conductive sheet 36 is not provided on the surface of the second dielectric layer 32 located in heat dissipation area I that is away from the fuse 342, which can prevent heat from being transferred to the fuse 342 and causing the fuse 342 to overheat.
[0096] The first heat dissipation copper block 245 is connected to the surface of the battery cell 70 to facilitate rapid heat transfer. In some embodiments, an adhesive 57 may also be provided between the first heat dissipation copper block 245 and the battery cell 70. The adhesive 57 is used to connect the first heat dissipation copper block 245 and the battery cell 70, and the adhesive 57 is also elastic, which can play a cushioning role.
[0097] The second heat dissipation copper block 345 is located on the surface of the second dielectric layer 32 away from the surface of the battery cell 70. The heat generated by the battery cell 70 is dissipated sequentially through the first heat dissipation copper block 245, the cavity 45, and finally through the second heat dissipation copper block 345. The second heat dissipation module is also used to connect to the surface of another adjacent battery cell 70 to dissipate the heat generated by the other battery cell 70.
[0098] The first heat dissipation copper block 245 and the first heat-conducting sheet 26 can be bonded together using the first thermally conductive adhesive 25. The second heat dissipation copper block 345 and the second heat-conducting sheet 36 can be bonded together using the second thermally conductive adhesive 35.
[0099] In some embodiments, the battery assembly 100 further includes a first thermally conductive sheet 26 and a second thermally conductive sheet 36, the first thermally conductive sheet 26 being located on the surface of the first dielectric layer 22 facing the cavity 45a, and the second thermally conductive sheet 36 being located on the surface of the second dielectric layer 32 facing the cavity 45a.
[0100] The thickness of the first heat-conducting sheet 26 and the second heat-conducting sheet 36 can be 25μm-50μm, so that the cavities 45a and 45b have a certain degree of flexibility and facilitate the bending of the circuit board 10 during the manufacturing process.
[0101] In some embodiments, the battery assembly 100 further includes a monitoring element 55 located on the same surface of the second dielectric layer 32 as the fuse 342, and the monitoring element 55 is connected to the fuse 342.
[0102] Please see Figure 15 and Figure 16 This application also provides a battery module 200, wherein the battery assembly 100 includes at least two battery assemblies 100, and two adjacent cells 70 are spaced apart by the circuit board 10, wherein the second heat dissipation copper block 345 of one battery assembly 100 is connected to the surface of the cell 70 of the adjacent battery assembly 100.
[0103] In some embodiments, the battery module 200 further includes a bracket 210 for securing a plurality of battery components 100.
[0104] The battery assembly 100 provided in this application avoids the need for additional space for components such as the busbar 242 and fuse 342 by centrally arranging them on the same circuit board 10. The circuit board 10 surrounds the battery cell 70 on multiple sides, which can quickly dissipate the heat generated by the battery cell 70. At the same time, the circuit board 10 is provided with a first heat dissipation module, a second heat dissipation module and a cavity 45a, which further improves the heat dissipation efficiency of the circuit board 10 to ensure the working state of the battery assembly 100.
[0105] The above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the spirit and scope of the technical solutions of this application.
Claims
1. A battery assembly, characterized in that, include: Circuit board, including: First dielectric layer; Second dielectric layer; The film is located between the first dielectric layer and the second dielectric layer and has multiple spaced cavities; Busbar; The first heat dissipation copper block and the busbar are located on the surface of the first dielectric layer opposite to the second dielectric layer; Fuse; and The second heat dissipation copper block and the fuse are located on the surface of the second dielectric layer opposite to the first dielectric layer; The circuit board includes heat dissipation areas and bending areas arranged sequentially and at intervals, the heat dissipation areas and the bending areas forming a receiving groove. The busbar, the first heat dissipation copper block, the fuse, and the second heat dissipation copper block are all located in the heat dissipation areas, and the busbar and the first heat dissipation copper block are arranged facing the receiving groove; and The battery cell is located in the receiving slot and electrically connected to the circuit board through the busbar.
2. The battery assembly according to claim 1, characterized in that, The battery assembly further includes a first thermal conductive sheet and a second thermal conductive sheet, wherein the first thermal conductive sheet is located on the surface of the first dielectric layer facing the cavity, and the second thermal conductive sheet is located on the surface of the second dielectric layer facing the cavity.
3. The battery assembly according to claim 1, characterized in that, The battery assembly also includes a monitoring element connected to the fuse.
4. The battery assembly according to claim 1, characterized in that, The battery assembly also includes a connecting piece, and the busbar and the connecting piece are correspondingly arranged in the same heat dissipation area.
5. The battery assembly according to claim 1, characterized in that, The cavity is also filled with liquid.
6. A battery module, characterized in that, The battery assembly includes any one of claims 1-4, wherein the number of battery assemblies is at least two, wherein the second heat dissipation copper block of one battery assembly is connected to the surface of the cell of the adjacent battery assembly.
7. A method for manufacturing a battery assembly, characterized in that, Includes the following steps: A first substrate is provided, the first substrate including a first copper layer, a first dielectric layer and a plurality of first thermally conductive adhesives, the first dielectric layer being located on the surface of the first copper layer, and the plurality of first thermally conductive adhesives respectively penetrating the first dielectric layer and being connected to the first copper layer. A second substrate is provided, the second substrate including a second copper layer, a second dielectric layer and at least one second thermally conductive adhesive, the second dielectric layer being located on the surface of the second copper layer, and the second thermally conductive adhesive penetrating the second dielectric layer and being connected to the second copper layer; A film is provided, the film including a plurality of through holes, the positions of the through holes corresponding to the positions of the first thermally conductive adhesive; The first substrate and the second substrate are respectively pressed onto the opposite sides of the film and the through hole is sealed so that the through hole forms a cavity, forming a heat dissipation area and a bending area arranged in sequence at intervals; The first copper layer is etched to form a busbar and a first heat dissipation copper block, and the second copper layer is etched to form a fuse and a second heat dissipation copper block, thereby forming a circuit board; as well as The circuit board is bent in the bending area to form a receiving groove, and a battery cell is placed in the receiving groove. The battery cell is electrically connected to the busbar to form the battery assembly.
8. The method for manufacturing a battery assembly according to claim 7, characterized in that, The steps for forming the first substrate include: A single-sided copper-clad laminate is provided, including a first dielectric layer and a first copper layer located on the surface of the first dielectric layer; A portion of the first dielectric layer is removed to expose the surface of the first copper layer, thereby forming a groove; and The groove is filled with a first thermally conductive adhesive.
9. The method for manufacturing a battery assembly according to claim 8, characterized in that, The first substrate further includes a first thermally conductive sheet, and the step of forming the first substrate further includes: The first thermally conductive sheet is attached to the surface of the first thermally conductive adhesive.
10. The method for manufacturing a battery assembly according to claim 7, characterized in that, The steps of "bending the circuit board in the bending area to form a receiving groove, placing a battery cell in the receiving groove, and electrically connecting the battery cell to the busbar to form the battery assembly" include: A connecting piece is attached to the surface of the busbar; Adhesive is bonded to the surfaces of the first and second heat dissipation copper blocks; The two ends of the circuit board are bent toward the side where the connecting piece is located to form the receiving groove; and The battery cell is placed in the receiving slot, and the battery cell is connected to the circuit board through the connecting piece to form the battery assembly.