Electronic component processing apparatus and electronic component testing apparatus

Abstract

The present application provides an electronic component processing device that can improve responsiveness and prevent damage to a heater. To this end, a processor (3) that processes a DUT (300) is provided with a push rod (6) that electrically connects the DUT (300) to a socket (2) by pressing the DUT (300) toward the socket (2), the push rod (6) is provided with a temperature adjustment device (7) that adjusts the temperature of the DUT (300), the temperature adjustment device (7) includes a heater unit (71) as a heating source, the heater unit (71) includes a planar heater (72), a first heat transfer material (73) arranged on a first main surface (721a) of the planar heater (72), and a second heat transfer material (74) arranged on a second main surface (721b) of the planar heater (72).

Description

Technical Field

[0001] This invention relates to an electronic component processing apparatus and an electronic component testing apparatus used in testing electronic components under test (hereinafter referred to as "DUT") such as semiconductor integrated circuit elements. Background Technology

[0002] The electronic component testing apparatus includes a processor for transporting the device under test (DUT) (see, for example, Patent Document 1). This processor holds the DUT by adsorption via a contact arm and presses it against a socket on the test head. At the lower part of the contact arm of such a processor, a push rod is provided for pressing the DUT against the socket, and inside the push rod is a heater for temperature control of the DUT.

[0003] Prior art literature

[0004] Patent documents

[0005] Patent Document 1: International Publication No. 2009 / 057203 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] As heaters in the aforementioned electronic component testing apparatus, ceramic heaters with built-in heating elements are generally used. However, ceramic heaters are heavy, resulting in a large heat capacity and a slow heating rate. Therefore, temperature control using these ceramic heaters sometimes suffers from deteriorated responsiveness.

[0008] Moreover, in such ceramic heaters, when the heating element heats up rapidly, there is a problem that the ceramic may deform due to localized thermal expansion, which can damage the ceramic heater.

[0009] The problem to be solved by the present invention is to provide an electronic component processing apparatus and an electronic component testing apparatus that can improve responsiveness and prevent damage to the heater.

[0010] Methods for solving problems

[0011] [1] The electronic component processing apparatus of the present invention is an electronic component processing apparatus for processing a DUT or a carrier containing the DUT, and includes a pressing device that electrically connects the DUT to a socket by pressing the DUT or the carrier toward a socket. The pressing device includes a temperature adjustment device for adjusting the temperature of the DUT. The temperature adjustment device includes a heater unit as a heating source. The heater unit includes: a planar heater; a first heat transfer material disposed on a first main surface that is a main surface of the planar heater; and a second heat transfer material disposed on a second main surface that is another main surface of the planar heater.

[0012] [2] In the above invention, the first heat transfer material and the second heat transfer material can also be configured such that the heat from the planar heater preferentially diffuses in a first direction parallel to the main surface of the planar heater.

[0013] [3] In the above invention, the first heat transfer material and the second heat transfer material may also be graphite sheets.

[0014] [4] In the above invention, the heater unit may also be configured as a sheet-like laminate with a thickness of less than 400 μm.

[0015] [5] In the above invention, the planar heater may also be configured to include: a first resin layer; a second resin layer stacked on the first resin layer; and a metal wiring layer sandwiched between the first and second resin layers.

[0016] [6] In the above invention, the planar heater may also be configured as a polyimide heater.

[0017] [7] In the above invention, the temperature adjustment device may also be configured to include a cooler unit, which is a cooling source and is in contact with the heater unit, the cooler unit including a flow channel for the refrigerant to flow.

[0018] [8] In the above invention, the pressing device may also be configured such that the pressing device further includes a force-applying mechanism that applies force to the cooler unit toward the heater unit, and the cooler unit presses the heater unit by being applied force by the force-applying mechanism.

[0019] [9] In the above invention, the pressing device may also be configured such that the pressing device further includes a contact plate that contacts the DUT or the carrier, the cooler unit presses the heater unit by being forceped by the force-applying mechanism, and the heater unit contacts the contact plate by being pressed by the cooler unit.

[0020]

[10] In the above invention, the cooler unit may also be configured to have: a nozzle member having an injection port for injecting refrigerant; and a cold plate opposite to the injection port, configured to be separate from the injection port, and having refrigerant injected from the nozzle member, the flow channel including an air gap formed between the nozzle member and the cold plate, wherein the refrigerant injected from the injection port flows in the air gap after reaching the cold plate.

[0021]

[11] In the above invention, the cold plate may also be configured such that the cold plate has a first opposing surface opposite to the nozzle member, the nozzle member has a second opposing surface opposite to the cold plate, the air gap is formed between the first opposing surface and the second opposing surface, and both the first opposing surface and the second opposing surface are planar.

[0022]

[12] In the above invention, the injection port may also be configured such that the injection port is disposed approximately at the center of the second opposing surface, the second opposing surface including a plurality of grooves extending radially outward from the injection port toward the nozzle member, the plurality of grooves being arranged approximately at equal intervals.

[0023]

[13] In the above invention, the width of the groove may also be configured such that it widens as it approaches the center of the second opposing surface.

[0024]

[14] In the above invention, the second opposing surface may also be configured such that the second opposing surface includes a step formed on the outside of the groove and extending in an annular shape, and the height of the second opposing surface on the outside of the step is higher than the height of the second opposing surface on the inside of the step.

[0025]

[15] In the above invention, the thickness of the air gap may also be less than 1 mm.

[0026]

[16] In the above invention, the pressing device may also be configured such that the pressing device further comprises a contact plate that contacts the DUT or the carrier, the heater unit contacts the contact plate, the cold plate contacts the heater unit, and the heater unit is pressed toward the contact plate.

[0027]

[17] In the above invention, the total thickness of the cold plate, the heater unit and the contact plate may be less than 2 mm.

[0028]

[18] The electronic component testing apparatus according to the present invention is an electronic component testing apparatus for testing DUT, which includes: the above-described electronic component processing apparatus; and a tester having a socket.

[0029] Invention Effects

[0030] In the electronic component processing apparatus and electronic component testing apparatus according to the present invention, the heater unit of the temperature adjustment device has a planar heater. Because this planar heater is thin, its heat capacity is smaller than that of a ceramic heater as described above. Therefore, the heating rate of the heater unit using the planar heater can be increased, thereby improving responsiveness.

[0031] Furthermore, since a first heat transfer material and a second heat transfer material are provided on the first and second main surfaces of the surface heater, heat can be released from the surface heater through the first and second heat transfer materials even when the surface heater is rapidly heated. Therefore, damage to the surface heater can be prevented. Attached Figure Description

[0032] Figure 1 This is a block diagram illustrating an example of the structure of an electronic component testing apparatus according to an embodiment of the present invention.

[0033] Figure 2 This is a cross-sectional view showing the state of the DUT before the pusher is adsorbed and held in an embodiment of the present invention.

[0034] Figure 3 This is a cross-sectional view showing the state of the DUT after the pusher is adsorbed and held in an embodiment of the present invention.

[0035] Figure 4 (a) is Figure 2 An enlarged sectional view of part IVa. Figure 4 (b) is Figure 3 An enlarged sectional view of part IVb.

[0036] Figure 5 This is a perspective view of the retainer in an embodiment of the present invention, viewed from below.

[0037] Figure 6 This is an enlarged cross-sectional view of the contact plate and temperature adjustment device in an embodiment of the present invention.

[0038] Figure 7 yes Figure 6 An enlarged sectional view of part VII.

[0039] Figure 8 This is a top view showing an example of the structure of a heater unit according to an embodiment of the present invention.

[0040] Figure 9 This is a perspective view of the nozzle component in an embodiment of the present invention, viewed from below. Detailed Implementation

[0041] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

[0042] Figure 1 This is a block diagram illustrating an example of the structure of the electronic component testing apparatus in this embodiment. Figure 2 This is a cross-sectional view showing the state of the DUT before the pusher is attracted and held in this embodiment. Figure 3 This is a cross-sectional view showing the state of the DUT after the pusher has been attracted and held. Figure 4 (a) is Figure 2 An enlarged sectional view of part IVa. Figure 4 (b) is Figure 3 An enlarged sectional view of part IVb. Figure 5 This is a perspective view of the retainer in this embodiment, viewed from below.

[0043] Figure 1 The electronic component testing apparatus 100 shown in this embodiment is an apparatus for testing the electrical characteristics of the DUT300. Specific examples of the DUT300 that can be used as the test object include SoC (System on a chip), logic devices, or memory devices. Figure 2 As shown, the DUT300 in this embodiment includes a substrate 301, an IC chip 302, a temperature detection circuit 303, a molding resin 304, and multiple terminals 305.

[0044] In this DUT 300, an IC chip 302 and a temperature detection circuit 303 are mounted on the upper surface of a substrate 301, and the IC chip 302 and the temperature detection circuit 303 are covered by molding resin 304. Furthermore, terminals 305 that are electrically connected to the IC chip 302 and the temperature detection circuit 303 are provided on the lower surface of the substrate 301. These terminals 305 contact and are electrically connected to the socket 2 described later. In this embodiment, the temperature detection circuit 303 is described as an electronic component separate from the IC chip 302, but this is not a limitation; the temperature detection circuit 303 may also be included within the IC chip 302.

[0045] like Figure 1 As shown, the electronic component testing apparatus 100 includes: a tester 1 that tests the DUT 300; a socket 2 that electrically connects the DUT 300 to the tester 1; and a processor 3 that delivers the DUT 300 and presses it into the socket 2.

[0046] The tester 1 includes a main frame 11 and a test head 12. The main frame 11 is connected to the test head 12 via a cable 13. The main frame 11 sends a test signal to the DUT300 via the test head 12 to test the DUT300, and the DUT300 is evaluated based on the test results. The test head 12 is connected to the main frame 11 via the cable 13, and sends the test signal from the main frame 11 to the DUT300 during testing.

[0047] like Figure 3 As shown, the test head 12 is electrically connected to the DUT 300 via a socket 2. The socket 2 includes a socket body 21 and a contact 22. The socket body 21 is fixed to the upper surface of the test head 12. The contact 22 is disposed on the socket body 21. Although not specifically illustrated, the contact 22 is electrically connected to a carrier plate disposed on the upper surface of the test head 12, and is also electrically connected to the DUT 300 by contacting the terminal 305 of the DUT 300. In this embodiment, a spring pin is used as the contact 22, but contacts other than spring pins can also be used as the contact 22. For example, a cantilever probe, an anisotropic conductive rubber sheet, or a membrane contact with bumps formed on an insulating film can also be used.

[0048] like Figure 1 As shown, the DUT300 is pressed against the socket 2 by the processor 3. The processor 3 includes a thermostatic bath 4, a contact arm 5, a push rod 6, and a refrigerant supply unit 9. In addition, the processor 3 in this embodiment is equivalent to an example of the "electronic component processing device" in this invention, and the push rod 6 in this embodiment is equivalent to an example of the "pressing device" in this invention.

[0049] The thermostat bath 4 can adjust the internal atmosphere temperature to a desired temperature, and can apply high or low temperatures to the DUT300. The thermostat bath 4 is not particularly limited; for example, the temperature can be adjusted within the range of -55°C to +155°C. The thermostat bath 4 houses the contact arm 5 and the push rod 6. Furthermore, the thermostat bath 4 accommodates the socket 2 through an opening formed at its bottom. Alternatively, the processor 3 may not include the thermostat bath 4.

[0050] The contact arm 5 is supported on a track (not shown) provided by the processor 3. The contact arm 5 has an actuator (not shown) for horizontal movement, enabling it to move forward, backward, left, and right along the track. Furthermore, the contact arm 5 has an actuator (not shown) for vertical movement, enabling it to move in the up-down direction.

[0051] A push rod 6 is disposed at the lower end of the contact arm 5. For example... Figure 2 As shown, the push rod 6 includes a push rod body 61, a contact plate 62, a retainer 63, an adsorption pad 68, a vertical guide 69, a temperature adjustment device 7, and a force application mechanism 8.

[0052] like Figure 2 As shown, the push rod body 61 in this embodiment has multiple (two in this example) first suction holes 611, first refrigerant supply holes 612, and (two in this example) first refrigerant recovery holes 613. The first suction hole 611 is a through hole opening on the lower surface of the push rod body 61, which connects to the second suction hole 67 (described later) of the retainer 63. The first suction hole 611 is connected to a vacuum pump (not shown), and the interior of the first suction hole 611 is pressurized by the vacuum pump.

[0053] The first refrigerant supply hole 612 is also a through hole opening on the lower surface of the push rod body 61. A supply-side cylindrical portion 772 (described later) of the refrigerant guide 77 (described later) is inserted into the first refrigerant supply hole 612. Refrigerant is supplied from a refrigerant supply source 200 located outside the processor 3 through the first refrigerant supply hole 612. Furthermore, the first refrigerant recovery hole 613 is also a through hole opening on the lower surface of the push rod body 61. A recovery-side cylindrical portion 773 (described later) of the refrigerant guide 77 (described later) is inserted into the first refrigerant recovery hole 613. Refrigerant used by the temperature adjustment device 7 is recovered through the first refrigerant recovery hole 613. Alternatively, the first suction hole 611, the first refrigerant supply hole 612, and the first refrigerant recovery hole 613 may also be located outside the push rod body 61.

[0054] like Figure 2 As shown, the contact plate 62 is a plate with a convex shape that bends downwards. (As indicated...) Figure 3 As shown, the contact plate 62 is a component that directly contacts the DUT300 while the push rod 6 holds the DUT300. Furthermore, the temperature adjustment device 7 heats or cools the DUT300 via this contact plate 62.

[0055] As the material constituting the contact plate 62, a metal with an insulating coating formed on its surface can be used. Specifically, for example, aluminum with an anodized coating on its surface can be used. In order to transfer heat from the temperature adjustment device 7 to the DUT300, the contact plate 62 is preferably made of a metal material with high thermal conductivity. In addition, by using a metal with an insulating coating formed on its surface, electromagnetic noise generated from the push rod 6 can be shielded from the DUT300, and the push rod 6 can be electrically insulated relative to the DUT300. Furthermore, in order to prevent electrostatic discharge (ESD), although not specifically illustrated, the contact plate 62 can also be connected to ground.

[0056] The contact plate 62 has a contact portion 621 and a side portion 622. The contact portion 621 extends in a direction generally parallel to the DUT 300. The contact portion 621 has a contact surface 621a that contacts the DUT 300. In this embodiment, the contact surface 621a is the lower surface of the contact portion 621, such as... Figure 3 As shown, when the push rod 6 holds the DUT300, it contacts and presses against the DUT300. Furthermore, the aforementioned temperature adjustment device 7 applies heat to the DUT300 via this contact surface 621a. Figure 4 As shown in (a), the thickness T1 of the contact portion 621 is not particularly limited and can be set to 500μm to 550μm (500μm≤T1≤550μm).

[0057] like Figure 2 As shown, the width W of the contact surface 621a c As shown in equation (1) below, the width W of DUT300 is... D Smaller, and as shown in equation (2) below, than the width W of the retainer. R Smaller width of the contact surface 621a of the contact plate 62 reduces the heat capacity of the contact portion 621, thereby increasing the rate of temperature change of the contact portion 621 when the temperature adjustment device 7 controls the temperature of the DUT300. In other words, it improves the responsiveness of temperature adjustment based on the push rod 6.

[0058] W D >W C …(1)

[0059] W R >W C …(2)

[0060] In equation (1) above, W D It is the width of DUT300, W C W is the width of the contact surface 621a of the contact plate 62, in the above formula (2). R It is the width of retainer 63.

[0061] The side portion 622 of the contact plate 62 is connected to the outer peripheral end of the contact portion 621 and extends in a direction substantially perpendicular to the contact portion 621. This side portion 622 has a locking surface 622a and a side surface 622b. In this embodiment, the locking surface 622a is the lower surface of the side portion 622. This locking surface 622a is an inclined surface with an annular shape surrounding the contact surface 621a, inclined in such a way that the width of the contact plate 62 widens as it moves away from the contact surface 621a. Figure 2 as well as Figure 4As shown in (a), the locking surface 622a is the surface that contacts the retainer 63. Furthermore, the side surface 622b is a side surface connected to the upper end of the locking surface 622a, extending in a direction substantially perpendicular to the contact portion 621. This side surface 622b is always separate from the retainer 63.

[0062] The retainer 63 is a component that retains the contact plate 62. The retainer 63 is as follows: Figure 2 As shown, it is disposed on the lower surface of the push rod body 61. Figure 2 as well as Figure 5 As shown, the retainer 63 in this embodiment has an annular shape and surrounds the contact plate 62. Furthermore, as... Figure 2 As shown, the retainer 63 is separate from the temperature adjustment device 7, and a space S is formed between the retainer 63 and the temperature adjustment device 7. Through this space S, the heat generated from the temperature adjustment device 7 is difficult to transfer to the retainer 63, thus enabling efficient temperature adjustment of the DUT300.

[0063] like Figure 5 As shown, the retainer 63 includes a frame-shaped portion 64, a retaining portion 65, and a plurality of second suction holes 67. The frame-shaped portion 64 has an annular shape. Figure 2 As shown, the frame-shaped portion 64 is fixed to the lower surface of the push rod body 61. Furthermore, although not particularly limited, the frame-shaped portion 64 can be fixed to the push rod body 61 using fasteners such as bolts.

[0064] like Figure 2 as well as Figure 5 As shown, a retaining portion 65 is formed on the lower surface of the frame-shaped portion 64 to contact and hold the contact plate 62. In this embodiment, the retaining portion 65 has a plurality of claw portions 66a to 66d (hereinafter sometimes collectively referred to as claw portions 66).

[0065] The claw portion 66 protrudes downward from the lower surface of the frame-shaped portion 64. The claw portion 66 is configured to surround the contact plate 62. In this embodiment, a pair of claw portions 66a and 66b are configured to face each other, and a pair of claw portions 66c and 66d are configured to face each other.

[0066] Furthermore, these claw portions 66a to 66d are arranged with a gap between them and surround the contact plate 62 along the annular locking surface 622a of the contact plate 62. In this way, by using the claw portions 66 arranged with a gap to hold the contact plate 62, the contact area between the holding portion 65 and the contact plate 62 can be reduced, making it difficult for heat to escape from the contact plate 62 to the holding portion 65. Therefore, temperature adjustment of the DUT 300 can be performed efficiently.

[0067] In addition, such as Figure 5 As shown, the claw portion 66 has a protrusion 661 and an opening 662. (As...) Figure 4 As shown in (a), in this embodiment, the protrusion 661 is disposed at the lower part of the claw portion 66 and protrudes toward the contact plate 62. The protrusion 661 in this embodiment has a retaining surface 661a. This retaining surface 661a is an inclined surface that faces and is substantially parallel to the locking surface 622a of the contact plate 62. When the contact plate 62 is not in contact with the DUT300, the retaining surface 661a holds the contact plate 62 by supporting it from below. At this time, the locking surface 622a of the contact plate 62 is not fixed to the retaining surface 661a of the retainer 63 by adhesive, screws, or the like, and the contact plate 62 is held in the retainer 63 in a separable manner.

[0068] like Figure 5 As shown, the claw portions 66a and 66b have openings 662. These openings 662 extend horizontally through the claw portions 66a and 66b. Through these openings 662, heat is difficult to dissipate from the contact plate 62 to the claw portions 66a and 66b, and the holder 63 can also be made lighter.

[0069] The second suction hole 67 passes through the frame-shaped portion 64 and the claw portions 66c and 66d. The upper end of the second suction hole 67 is connected to the first suction hole 611 of the push rod body 61. The second suction hole 67 is connected to a vacuum pump (not shown) via the first suction hole 611, thus creating a negative pressure inside the second suction hole 67.

[0070] like Figure 3 and Figure 4 As shown in (b), an adsorption pad 68 is disposed at the lower end of the second suction hole 67. The adsorption pad 68 abuts against the DUT300, thereby forming a space surrounded by the adsorption pad 68 and the DUT300. This space is connected to the second suction hole 67, so the DUT300 can be adsorbed and held on the lower end face 66e of the claws 66c and 66d.

[0071] like Figure 4 As shown in (b), with the DUT300 adsorbed on the adsorption pad 68, the contact surface 621a of the contact plate 62 contacts the DUT300. At this time, since the locking surface 622a of the contact plate 62 is not fixed to the holding surface 661a of the holder 63, the contact plate 62 is pushed upward by the DUT300, and the contact plate 62 moves away from the holder 63. In this way, by the contact plate 62 moving away from the holder 63, heat loss to the holder 63 can be prevented when the temperature adjustment device 7 controls the temperature of the DUT300. That is, the heat capacity of the components between the temperature adjustment device 7 and the DUT300 can be reduced, thereby improving the responsiveness of temperature adjustment.

[0072] like Figure 2 and Figure 3As shown, a temperature adjustment device 7 is disposed on the inner side of the contact plate 62. The temperature adjustment device 7 adjusts the temperature of the DUT300 via the contact plate 62.

[0073] Figure 6 This is an enlarged cross-sectional view of the contact plate and temperature adjustment device in this embodiment. Figure 7 yes Figure 6 An enlarged sectional view of part VII. Figure 8 This is a top view showing an example of the structure of the heater unit in this embodiment. (Example) Figure 6 As shown, the temperature adjustment device 7 includes a heater unit 71 as a heating source and a cooler unit 75 as a cooling source.

[0074] The heater unit 71 is disposed on the contact portion 621 of the contact plate 62. The heater unit 71 is a sheet-like laminate formed by stacking a planar heater 72, a first heat transfer material 73, and a second heat transfer material 74. The thickness T2 of the heater unit 71 is not particularly limited, but is 400 μm or less (T2≤400 μm).

[0075] like Figures 6 to 8 As shown, the planar heater 72 has a planar shape (sheet-like). Because the planar heater 72 is thin, its heat capacity is smaller than that of a ceramic heater or the like. Therefore, the heating rate of the temperature regulating device 7 can be increased, thus improving responsiveness.

[0076] like Figure 6 As shown, the thickness T3 of such a planar heater 72 is not particularly limited and can be set to 100μm to 150μm (100μm≤T3≤150μm). Furthermore, as the planar heater 72, resin film heaters such as polyimide heaters and polyester heaters can be used, for example. In particular, polyimide heaters are preferred as the planar heater 72. Polyimide heaters exhibit excellent heat resistance among resin-based heaters. Moreover, polyimide heaters are inexpensive compared to ceramic heaters, thus achieving cost reduction.

[0077] like Figure 8 As shown, the surface heater 72 has a heater section 72a and a lead-out section 72b. The heater section 72a is the part that heats the contact plate 62. On the other hand, the lead-out section 72b has a strip shape extending from the heater section 72a and is the part for connecting to a power source for supplying power to the surface heater 72.

[0078] like Figure 6 as well as Figure 8 As shown, the planar heater 72 has a resin layer 721, metal wiring 724, and terminals 725 (see reference). Figure 8Resin layer 721 is a planar layer. For example... Figure 7 As shown, resin layer 721 includes a first resin layer 722 and a second resin layer 723 laminated on the first resin layer 722. The first resin layer 722 and the second resin layer 723 are not particularly limited and are resin films bonded together by an adhesive (not shown). Alternatively, the first and second resin layers 722 and 723 may be bonded without an adhesive. The first and second resin layers 722 and 723 are, for example, made of resin materials such as polyimide or polyester. Especially from the viewpoint of heat resistance, polyimide is preferred as the resin material.

[0079] A metal wiring 724 is sandwiched between the first and second resin layers 722 and 723. This metal wiring 724 is made of, for example, a metal such as stainless steel. Figure 8 As shown, the metal wiring 724 meanders at the heater section 72a and connects to the terminal 725 at the lead-out section 72b. This terminal 725 is electrically connected to the aforementioned power supply.

[0080] like Figures 6-8 As shown, a first heat transfer material 73 is disposed on the first main surface (upper surface) 721a of the planar heater 72. Furthermore, a second heat transfer material 74 is disposed on the second main surface (lower surface) 721b of the planar heater 72. These first and second heat transfer materials 73 and 74 are thermally conductive materials that dissipate heat generated by the planar heater 72 from the planar heater 72. The thicknesses T4 and T5 of the first and second heat transfer materials 73 and 74 are not particularly limited and can be set to 50 μm to 100 μm (50 μm ≤ T4, T5 ≤ 100 μm).

[0081] In such a planar heater, the metal wiring generates heat, causing a localized temperature rise in the vicinity of the metal wiring. This results in the resin layer near the metal wiring becoming excessively hot, sometimes leading to resin layer burn-out. On the other hand, in the heater unit 71 of this embodiment, by utilizing the first and second heat transfer materials 73 and 74 to diffuse heat to areas outside the vicinity of the metal wiring 724, the localized temperature rise near the metal wiring 724 can be suppressed, thereby inhibiting the occurrence of resin layer 721 burn-out.

[0082] As the first and second heat transfer materials 73 and 74, for example, TIM (Thermal Interface Material) can be used. As TIM, for example, metal foil made of aluminum or copper, graphite sheet, silicone rubber sheet with thermally conductive filler dispersed therein, sheet containing carbon nanotubes (CNTs), and gel with thermally conductive filler dispersed therein can be used.

[0083] The first and second heat transfer materials 73 and 74 preferably allow heat from the planar heater 72 to preferentially diffuse in a first direction (horizontal in this example) parallel to the first and second main surfaces 721a and 721b of the planar heater 72. Furthermore, a heat transfer material that preferentially diffuses heat in the first direction refers to a material whose thermal conductivity in the first direction is greater than its thermal conductivity in the direction perpendicular to the first direction when pressed under a given pressure. Such materials can include graphite sheets as described above, sheets manufactured by bundling CNTs extending along the first direction, etc.

[0084] like Figure 7 As shown, the metal wiring 724 in the planar heater 72 generates heat, and thus the heat tends to concentrate in the first portion 73a of the first heat transfer material 73 located near the metal wiring 724. On the other hand, heat is less likely to concentrate in the second portion 73b of the first heat transfer material 73 located away from the metal wiring 724. Therefore, as in this embodiment, by using the first heat transfer material 73, which preferentially diffuses heat in the first direction, heat can be preferentially transferred from the first portion 73a to the second portion 73b, thus suppressing overheating of the first portion 73a. Therefore, it is possible to effectively suppress the localized high temperature of the portion near the metal wiring 724 of the planar heater 72. Furthermore, for the same reason, it is possible to effectively suppress the localized high temperature of the portion near the metal wiring 724 of the planar heater 72.

[0085] like Figure 2 and Figure 6 As shown, a cooler unit 75 is disposed on the heater unit 71. The cooler unit 75 cools the heater unit 71 while it is heating up, thereby adjusting the temperature of the heater unit 71 to a desired temperature. In addition, the DUT300 can also be cooled via the heater unit 71 and the contact plate 62 through the cooler unit 75.

[0086] like Figure 2 and Figure 6 As shown, the cooler unit 75 includes a cold plate 76, a refrigerant guide 77, a nozzle component 78, and a flow channel 79. The cold plate 76 is a bottomed cylindrical plate. The cold plate 76 is disposed on the heater unit 71 and is a component that contacts the heater unit 71 for cooling. As the material constituting the cold plate 76, similar to the contact plate 62 described above, a metal or the like with an insulating coating formed on its surface can be used.

[0087] The thickness T6 of the cold plate 76 is, for example, 300μm to 400μm (300μm≤T6≤400μm). Furthermore, the total thickness T7 of the cold plate 76 (T6), the heater unit 71 (T2), and the contact plate (T1) is less than 2mm (T6+T2+T1≤2mm). By shortening the distance between the cold plate 76 and the DUT300 in this way, the responsiveness to temperature adjustment can be improved.

[0088] Furthermore, the cold plate 76 has a first opposing surface 76a that faces the nozzle member 78. The first opposing surface 76a is a plane.

[0089] A refrigerant guide 77 is configured to fit into the opening at the top of the cold plate 76, thereby sealing the internal space of the cold plate 76. Figure 2 As shown, the refrigerant guide 77 is a component used to guide the refrigerant supplied from the first refrigerant supply hole 612 of the push rod body 61 to the interior of the cooler unit 75 and to guide the refrigerant used for cooling to the first refrigerant recovery hole 613 of the push rod body 61.

[0090] like Figure 2 and Figure 6 As shown, the refrigerant guide 77 has a pressing part 771, a supply-side cylindrical part 772, and a plurality of recovery-side cylindrical parts 773. The pressing part 771 is the main body of the refrigerant guide 77, which presses the nozzle member 78 downward.

[0091] like Figure 2 and Figure 6 As shown, a supply-side cylindrical portion 772 is disposed approximately at the center of the upper surface of the pressing portion 771. Figure 2 As shown, the supply-side cylindrical portion 772 is a cylindrical member extending upward from the upper surface of the pressing portion 771, and is inserted into the first refrigerant supply hole 612 of the push rod body 61. A second refrigerant supply hole 772a, which forms part of the flow channel 79, is formed inside the supply-side cylindrical portion 772 and extends to the lower surface of the pressing portion 771.

[0092] Multiple retraction-side cylindrical portions 773 are disposed on the upper surface of the pressing portion 771. For example... Figure 2 As shown, the recovery-side cylindrical portion 773 is a cylindrical member extending upward from the upper surface of the pressing portion 771, and is inserted into the first refrigerant recovery hole 613 of the push rod body 61. A second refrigerant recovery hole 773a, which forms part of the flow channel 79, is formed inside the recovery-side cylindrical portion 773 and extends to the lower surface of the pressing portion 771.

[0093] like Figure 2 and Figure 6As shown, the nozzle component 78 is located between the cold plate 76 and the refrigerant guide 77. This nozzle component 78 is used to inject refrigerant into the cold plate 76. Figure 6 As shown, the nozzle component 78 has a through hole 781, an injection port 782, and a protrusion 785. The through hole 781 is connected to the second refrigerant supply port 772a of the refrigerant guide 77. The through hole 781 forms part of the flow channel 79. The injection port 782 is formed approximately at the center of the lower end face (second opposing face 78a) of the through hole 781. The injection port 782 is separate from the cold plate 76 and sprays the refrigerant supplied from the second refrigerant supply port 772a of the refrigerant guide 77 toward the cold plate 76.

[0094] Furthermore, the nozzle component 78 has a second opposing surface 78a that is opposite to and separate from the first opposing surface 76a of the cold plate 76. Therefore, an air gap 791 is formed between the first opposing surface 76a and the second opposing surface 78a. This air gap 791 also forms part of the flow channel 79, through which the refrigerant injected from the injection port 782 flows after reaching the first opposing surface 76a of the cold plate 76. By allowing the refrigerant to flow through the air gap 791 on the cold plate 76, the refrigerant can be accelerated on the first opposing surface 76a, thus increasing the cooling rate. Therefore, responsiveness in temperature adjustment can be improved.

[0095] The refrigerant flowing in the air gap 791 is recovered to the second refrigerant recovery hole 773a through the gap between the side of the nozzle member 78 and the cold plate 76 and the gap between the upper surface of the nozzle member 78 and the refrigerant guide 77.

[0096] Figure 9 This is a perspective view of the nozzle component 78 of this embodiment, viewed from below. The second opposing surface 78a is planar. This second opposing surface 78a includes a plurality of grooves 783 (four in this example) and steps 784. The plurality of grooves 783 extend radially outward from the injection port 782. By providing such grooves 783, the refrigerant injected from the injection port 782 can be guided by the grooves 783 to flow radially outward.

[0097] Furthermore, the width of the groove 783 increases as it approaches the center of the second opposing surface 78a. Therefore, the refrigerant can also flow at a high speed at the front end of the groove 783.

[0098] Furthermore, multiple slots 783 are arranged at approximately equal intervals around the injection port 782, centered on the injection port 782. Within the air gap 791, the refrigerant can flow uniformly outward radially.

[0099] A step 784 is formed on the outer side of the groove 783. The step 784 has an annular shape. A second opposing surface 78a is divided by the step 784, including an outer opposing surface 78b located outside the step 784 and an inner opposing surface 78c located inside the step 784. (As...) Figure 6 As shown, the height H1 of the outer opposing surface 78b is higher than the height H2 of the inner opposing surface 78c. That is, the thickness of the air gap 791 decreases at the outer opposing surface 78b and increases at the inner opposing surface 78c. By providing such a step 784, the refrigerant can be accelerated at the outer periphery of the second opposing surface 78a.

[0100] Furthermore, the thickness T8 of the air gap 791 can be appropriately set according to the pressure of the supplied refrigerant, for example, it can be set to less than 1 mm (T8≤1 mm). If the thickness T8 of the air gap 791 is less than 1 mm, the refrigerant flowing in the air gap 791 can be accelerated, thus improving the cooling rate. Therefore, the responsiveness in temperature adjustment can be improved.

[0101] like Figure 6 and Figure 9 As shown, a plurality of protrusions 785 are disposed on the second opposing surface 78a. The protrusions 785 are spacers between the first opposing surface 76a and the second opposing surface 78a, separating the first and second opposing surfaces 76a and 78a. The front end of the protrusions 785 contacts the first opposing surface 76a of the cold plate 76, defining the aforementioned air gap 791.

[0102] like Figure 2 As shown, the force-applying mechanism 8 is located between the push rod body 61 and the refrigerant guide 77 of the temperature adjustment device 7. This force-applying mechanism 8 applies force downward to the refrigerant guide 77, thereby applying force to the cooler unit 75 towards the heater unit 71. In this embodiment, the force-applying mechanism 8 is a spring such as a coil spring. Alternatively, the force-applying mechanism 8 can also be other elastomers such as rubber. Furthermore, the force-applying mechanism 8 can also be part of a universal joint structure.

[0103] The cooling plate 76 of the cooler unit 75, which is subjected to force by the force-applying mechanism 8, always presses the heater unit 71 toward the contact plate 62. In this way, by using the cooling plate 76 to press the heater unit 71 toward the contact plate 62, the first and second heat transfer materials 73 and 74 are in close contact with the surface heater 72, thereby promoting heat dissipation from the surface heater 72 to the first and second heat transfer materials 73 and 74.

[0104] like Figure 2As shown, the vertical guide 69 is disposed on the outside of the retainer 63. This vertical guide 69 is fixed to the lower surface of the push rod body 61 and extends downward from the lower surface of the push rod body 61. Furthermore, although not particularly limited, the vertical guide 69 can be fixed to the push rod body 61 using fasteners such as bolts. Figure 3 As shown, the vertical guide 69 abuts against the DUT300 when the push rod 6 holds the DUT300, thereby enabling the positioning of the DUT300 relative to the push rod 6 in both the vertical and horizontal directions.

[0105] return Figure 1 The refrigerant supply unit 9 supplies refrigerant to the push rod 6. This refrigerant supply unit 9 includes a connection part 91, a valve 92, and a valve control part 93. The connection part 91 is connected to a refrigerant supply source 200 located outside the electronic component testing device 100. The refrigerant supplied by this refrigerant supply source 200 may be compressed dry air, liquid nitrogen, or the like. When the refrigerant supply source 200 supplies compressed dry air, it may, for example, include a compressor that draws in and compresses external air and a dryer that dries the compressed air. Alternatively, the refrigerant supply source 200 may be an existing factory piping capable of supplying compressed dry air. When the refrigerant supply source 200 supplies liquid nitrogen, it may, for example, be a pressure vessel for storing liquid nitrogen at high pressure or a factory piping for supplying liquid nitrogen.

[0106] A valve 92 is provided downstream of the connection 91. This valve 92 adjusts the flow rate of refrigerant supplied from the refrigerant supply source 200. Figure 2 As shown, the refrigerant passing through the valve 92 is supplied to the first refrigerant supply port 612 of the push rod body 61.

[0107] like Figure 1 As shown, the valve control unit 93 controls the opening and closing of the valve 92. In this embodiment, the valve control unit 93 is input to the temperature detection circuit 303 of the DUT300 (see reference). Figure 2 The valve control unit 93 performs PID control based on the input detection value, aiming to achieve the desired temperature of the DUT300. However, the control method of the valve control unit 93 is not limited to PID control; other control methods may also be used.

[0108] If the electronic component testing apparatus 100 in this embodiment is as described above, the heater unit 71 of the temperature adjustment device 7 has a planar heater 72. Since the planar heater 72 is thinner, its heat capacity is smaller than that of a ceramic heater. Therefore, the heating rate of the heater unit 71 can be increased, thereby improving responsiveness.

[0109] Furthermore, in the electronic component testing apparatus 100 of this embodiment, first and second heat transfer materials 73 and 74 are provided on the first and second main surfaces 721a and 721b of the surface heater 72. Therefore, even when the surface heater 72 is rapidly heated, the first and second heat transfer materials 73 and 74 can suppress the surface heater 72 from becoming locally hot, and heat can be released from the surface heater 72. Therefore, damage to the surface heater 72 can be prevented.

[0110] Furthermore, in the electronic component testing apparatus 100 of this embodiment, since ceramic heaters, which are prone to becoming heavy, are not used, the push rod 6 can also be made lighter.

[0111] Furthermore, the embodiments described above are provided for ease of understanding of the present invention and are not intended to limit the present invention. Therefore, the elements disclosed in the above embodiments are intended to include all design modifications and equivalents that fall within the scope of the present invention.

[0112] For example, in the above embodiment, the push rod 6 adsorbs and holds the DUT 300, but it is not limited to this. The push rod 6 can also adsorb and hold a carrier containing the DUT. There are no particular limitations on such a carrier, for example, the carriers described in Japanese Patent Application Publication No. 2019-197012 and Japanese Patent Application Publication No. 2013-79860 can be used.

[0113] Furthermore, the push rod 6 can also press against multiple DUT300s mounted on a test tray that houses multiple DUT300s. In this case, the processor 3 has multiple push rods 6, each of which presses against the multiple DUT300s mounted on the test tray. In this case, all push rods 6 can also have the structure described in this embodiment.

[0114] Symbol Explanation

[0115] 100… Electronic Component Testing Equipment

[0116] 1…tester

[0117] 11…Main Frame

[0118] 12…test head

[0119] 13… Cable

[0120] 2… socket

[0121] 21…Socket body

[0122] 22…Touch

[0123] 3…processors

[0124] 4…Thermostatic bath

[0125] 5…Contact Arm

[0126] 6…Push

[0127] 61…Push rod body

[0128] 611…First suction hole

[0129] 612…First refrigerant supply port

[0130] 613…First refrigerant recovery port

[0131] 62…Contact Plate

[0132] 621…Contact Department

[0133] 621a…Contact Surface

[0134] 622…side

[0135] 622a…card stop surface

[0136] 622b…side view

[0137] 63… Holder

[0138] 64…Frame-shaped section

[0139] 65…Maintenance Department

[0140] 66 (66a~66d)…claw portion

[0141] 66e…lower end face

[0142] 661…protrusion

[0143] 661a…Keep the surface

[0144] 662…opening

[0145] 67…Second suction hole

[0146] 68… Adsorption pad

[0147] 69…Vertical Guide

[0148] 7…Temperature adjustment device

[0149] 71…Heater Unit

[0150] 72…Surface heater

[0151] 72a…Heater Section

[0152] 72b… Introduction

[0153] 721…resin layer

[0154] 721a, 721b... First and second main faces

[0155] 722, 723… First and second resin layers

[0156] 724…Metal wiring

[0157] 725…terminal

[0158] 73…First heat transfer material

[0159] 73a, 73b... Part 1 and Part 2

[0160] 74…Second heat transfer material

[0161] 75… Cooler Unit

[0162] 76…Cold Plate

[0163] 76a…First Opposite Plane

[0164] 77…Refrigerant Guide

[0165] 771… Pressing part

[0166] 772…Supply-side cylindrical section

[0167] 772a…Second refrigerant supply port

[0168] 773…Recovery of the side cylindrical section

[0169] 773a…Second refrigerant recovery port

[0170] 78… Nozzle components

[0171] 78a…Second Opposite Surface

[0172] 78b…Outer Opposite Surface

[0173] 78c…inner opposing surfaces

[0174] 781… Through hole

[0175] 782…jet nozzle

[0176] 783… slot

[0177] 784…steps

[0178] 785…sudden rise

[0179] 79… Distribution Channel

[0180] 791… air gap

[0181] 8…Force application mechanism

[0182] 9…Refrigerant Supply Department

[0183] 91…Connecting part

[0184] 92…valve

[0185] 93…Valve Control Section

[0186] 200…refrigerant supply source

[0187] 300…DUT

[0188] 301…Substrate

[0189] 302…IC chip

[0190] 303…Temperature Detection Circuit

[0191] 304… molding resin

[0192] 305…terminal.

Claims

1. A temperature adjustment device for adjusting the temperature of a DUT, wherein, The temperature adjustment device includes: The heater unit serves as a heating source; and A cooler unit that serves as a cooling source and is in contact with the heater unit. The heater unit includes: Surface heater; A first heat transfer material, disposed on a first main surface that serves as a main surface of the planar heater; and A second heat transfer material is disposed on the second main surface, which serves as another main surface of the planar heater. The cooler unit includes: A circulation channel that allows refrigerant to flow; A nozzle component having an injection port for injecting refrigerant; and A cold plate, which is opposite to the injection port and configured separately from the injection port, is sprayed with refrigerant from the nozzle component. The flow channel includes an air gap formed between the nozzle component and the cold plate. The refrigerant injected from the injection port flows through the air gap after reaching the cold plate.

2. The temperature adjustment device according to claim 1, wherein, The first heat transfer material and the second heat transfer material cause heat from the planar heater to preferentially diffuse in a first direction parallel to the main surface of the planar heater.

3. The temperature adjustment device according to claim 2, wherein, The first heat transfer material and the second heat transfer material are graphite sheets.

4. The temperature adjustment device according to claim 1, wherein, The heater unit is a sheet-like laminate with a thickness of less than 400 μm.

5. The temperature adjustment device according to claim 1, wherein, The planar heater comprises: First resin layer; A second resin layer, which is laminated on top of the first resin layer; and A metal wiring layer sandwiched between the first resin layer and the second resin layer.

6. The temperature adjustment device according to claim 5, wherein, The planar heater is a polyimide heater.

7. The temperature adjustment device according to claim 1, wherein, The cold plate has a first opposing surface that is opposite to the nozzle component. The nozzle component has a second opposing surface opposite to the cold plate. The air gap is formed between the first opposing surface and the second opposing surface. Both the first and second opposing surfaces are planes.

8. The temperature adjustment device according to claim 7, wherein, The injection port is positioned approximately at the center of the second opposing surface. The second opposing surface includes a plurality of grooves extending radially outward from the injection port toward the nozzle member. The multiple slots are arranged at approximately equal intervals.

9. The temperature adjustment device according to claim 8, wherein, The width of the groove increases as it approaches the center of the second opposing surface.

10. The temperature adjustment device according to claim 8, wherein, The second opposing surface includes a step formed on the outer side of the groove and extending in a ring shape. The height of the second opposing surface on the outer side of the step is higher than the height of the second opposing surface on the inner side of the step.

11. The temperature adjustment device according to claim 1, wherein, The thickness of the air gap is less than 1 mm.

12. An electronic component processing apparatus for processing a device for manufacturing a digital under-mounted unit (DUT) or a carrier housing the DUT, wherein... The electronic component processing device includes a pressing device that electrically connects the DUT to the socket by pressing the DUT or the carrier toward the socket. The pressing device includes the temperature adjustment device as described in claim 1.

13. The electronic component processing apparatus according to claim 12, wherein, The pressing device also includes a force-applying mechanism that applies force to the cooler unit toward the heater unit. The cooler unit presses down on the heater unit by being forced by the force-applying mechanism.

14. The electronic component processing apparatus according to claim 13, wherein, The pressing device also includes a contact plate that contacts the DUT or the carrier. The cooler unit presses down on the heater unit by the force applied by the force-applying mechanism. The heater unit comes into contact with the contact plate by being pressed by the cooler unit.

15. The electronic component processing apparatus according to claim 12, wherein, The pressing device also includes a contact plate that contacts the DUT or the carrier. The heater unit is in contact with the contact plate. The cold plate contacts the heater unit, pressing the heater unit toward the contact plate.

16. The electronic component processing apparatus according to claim 15, wherein, The combined thickness of the cold plate, the heater unit, and the contact plate is less than 2 mm.

17. An electronic component testing apparatus for testing a DUT (Device Under Test), comprising: The electronic component processing apparatus according to any one of claims 12 to 16; and A tester with a socket.

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