Temperature control device and method

Abstract

The present invention provides a temperature control device and method, comprising: connecting a first liquid storage tank and a second liquid storage tank in parallel via a first three-way valve and a second three-way valve; determining the operating state of an etcher; controlling the opening and closing state of the three-way valve to cool the coolant in the second liquid storage tank using a refrigeration unit in an unloaded state; and controlling the opening and closing state of the three-way valve to control the temperature using a circulating cooling main circuit and the coolant stored in the second liquid storage tank. The present invention utilizes a circulating cooling branch to store excess cooling energy generated by the refrigeration unit when the etcher is unloaded, and controls the opening and closing of the three-way valve to release the cooling energy stored in the circulating cooling branch when the etcher is under a momentary high load. This cooling energy is then combined with the coolant in the circulating cooling main circuit to control the temperature of the etching temperature control chamber, thereby reducing energy consumption and heat exchange load of the temperature control device, improving the temperature control accuracy of the temperature control device, and ensuring the stability of the operating temperature of the etcher.

Description

Technical Field

[0001] The present invention relates to the field of automation control technology, and in particular to a temperature control device and method. Background Art

[0002] In the etching process of semiconductor manufacturing, it is necessary to provide a precise and stable operating temperature for the etching temperature control chamber. According to the load size of the etcher, the output of the temperature control device is adjusted in real time to ensure temperature control accuracy.

[0003] In the current existing technology, when the etcher is in an unloaded state, the refrigeration unit balances part of the excess cooling capacity by means of hot gas bypass, etc., which wastes energy and is not conducive to energy saving and consumption reduction; when the etcher is under a sudden large load, the temperature cannot be quickly lowered by adjusting the refrigeration unit, and the working requirements of the etcher cannot be met. There is a defect that the temperature overshoot is too large, and a high-energy-consuming compressor and evaporator are often required to meet the working requirements of the etcher.

[0004] Therefore, the industry is in urgent need of a temperature control device that can overcome the above-mentioned defects in the prior art. Summary of the Invention

[0005] The present invention provides a temperature control device and method to solve the defects in the prior art of wasting energy, being unfavorable for energy saving and consumption reduction, being prone to excessive temperature overshoot, and requiring high-energy-consuming compressors and evaporators.

[0006] In a first aspect, the present invention provides a temperature control device, comprising: a circulating cooling main circuit, a circulating cooling branch circuit, a refrigeration unit for cooling the coolant in the circulating cooling main circuit, and a controller; the circulating cooling main circuit comprises a first liquid storage tank, and the circulating cooling branch circuit comprises a second liquid storage tank; the first liquid storage tank and the second liquid storage tank are connected in parallel via a first three-way valve and a second three-way valve; the controller obtains the return temperature of the coolant in the connecting pipe from the etching temperature control chamber of the etcher to the first liquid storage tank, so as to determine the working state of the etcher based on the return temperature; the controller When the controller determines that the working state is a no-load state, the controller controls the opening and closing states of the first three-way valve and the second three-way valve, and only uses the circulating cooling main circuit to control the temperature of the etching temperature control cavity, and uses the refrigeration unit to cool down the coolant stored in the second liquid storage tank in the circulating cooling branch; when the controller determines that the working state is a momentary high-load state, the controller controls the opening and closing states of the first three-way valve and the second three-way valve, and uses the circulating cooling main circuit and the coolant stored in the cooled second liquid storage tank to jointly control the temperature of the etching temperature control cavity.

[0007] According to a temperature control device provided by the present invention, it also includes a cooling branch, which is a closed loop connected to the second liquid storage tank; the refrigeration unit includes a branch evaporator and a branch expansion valve for adjusting the liquid inlet flow rate of the branch evaporator; when the controller determines that the working state is a no-load state, the branch expansion valve is opened to utilize the branch evaporator to cool the coolant in the second liquid storage tank flowing through the cooling branch; when the controller determines that the working state is a momentary high-load state, the branch expansion valve is closed.

[0008] According to a temperature control device provided by the present invention, it also includes a first temperature sensor, which is arranged in the cooling branch and is used to obtain the first temperature of the coolant after cooling treatment by the branch evaporator; when the controller determines that the working state is a no-load state, based on the temperature difference between the first temperature and the target temperature value of the cooling branch, the controller adjusts the opening and closing state of the branch expansion valve to a first opening degree, so as to utilize the branch evaporator to cool the coolant flowing through the cooling branch.

[0009] According to a temperature control device provided by the present invention, the refrigeration unit also includes a main circuit evaporator and a main circuit expansion valve for adjusting the liquid inlet flow rate of the main circuit evaporator; the circulating cooling main circuit also includes a second temperature sensor, and the second temperature sensor is used to obtain the second temperature of the coolant after the cooling treatment of the main circuit evaporator; when the controller determines that the working state is an instantaneous high load state, based on the temperature difference between the second temperature and the target temperature value of the circulating cooling main circuit, the opening and closing state of the main circuit expansion valve is adjusted to the second opening degree, the opening and closing state of the first three-way valve is adjusted to the third opening degree, and the opening and closing state of the second three-way valve is adjusted to the fourth opening degree, so as to utilize the main circuit evaporator and the coolant stored in the second liquid storage tank to jointly cool the coolant flowing through the circulating cooling main circuit.

[0010] According to a temperature control device provided by the present invention, the circulating cooling main loop also includes a third temperature sensor, which is used to obtain a third temperature of the coolant before the main loop evaporator is cooled; when the controller determines that the working state is a momentary high load state, the controller obtains the temperature difference between the third temperature and the second temperature as the first temperature difference, and adjusts the opening and closing state of the first three-way valve to a fifth opening degree and the opening and closing state of the second three-way valve to a sixth opening degree based on the temperature difference between the first temperature difference and the first preset temperature difference, so as to utilize the coolant stored in the second liquid storage tank to cool the coolant flowing through the circulating cooling main loop; the second temperature is the coolant temperature after the main loop evaporator in the refrigeration unit is cooled.

[0011] According to a temperature control device provided by the present invention, the circulating cooling branch also includes a fourth temperature sensor, which is used to obtain a fourth temperature of the coolant in the second liquid storage tank; when the controller determines that the working state is a momentary high-load state, it obtains the temperature difference between the fourth temperature and the third temperature as the second temperature difference, and adjusts the opening and closing state of the first three-way valve to a seventh opening degree and the opening and closing state of the second three-way valve to an eighth opening degree based on the temperature difference between the second temperature difference and the second preset temperature difference, so as to utilize the coolant stored in the second liquid storage tank to cool the coolant flowing through the circulating cooling main circuit; the third temperature is the coolant temperature before the main circuit evaporator in the refrigeration unit is cooled.

[0012] According to a temperature control device provided by the present invention, the circulating cooling main loop also includes a fifth temperature sensor, which is used to obtain the return port temperature; when the controller determines that the return port temperature is less than a first preset temperature threshold and the return port temperature continues to decrease within a first preset time period, the controller determines that the working state is the no-load state; when the controller determines that the return port temperature is greater than a second preset temperature threshold and the return port temperature continues to increase within a second preset time period, the controller determines that the working state is the instantaneous high-load state; wherein, the first preset temperature threshold is greater than the second preset temperature threshold.

[0013] According to a temperature control device provided by the present invention, the circulating cooling main circuit is also equipped with a first flow meter, which is used to obtain the coolant flow in the circulating cooling main circuit; the cooling branch is also equipped with a second flow meter, which is used to obtain the coolant flow in the cooling branch.

[0014] According to a temperature control device provided by the present invention, the refrigeration unit also includes a pressure regulating valve, which is installed at the outlet of the branch evaporator and is used to adjust the pressure at the outlet of the branch evaporator so that the pressure difference between the pressure at the outlet of the branch evaporator and the pressure at the outlet of the main circuit evaporator is within a preset range.

[0015] According to a temperature control device provided by the present invention, the refrigeration unit also includes a compressor and a condenser; the compressor, the condenser, the branch expansion valve and the branch evaporator are connected to form a closed loop, so that the coolant flowing through the cooling branch is cooled by the branch evaporator; the compressor, the condenser, the main circuit expansion valve and the main circuit evaporator are connected to form a closed loop, so that the coolant flowing through the circulating cooling main circuit is cooled by the main circuit evaporator.

[0016] In a second aspect, the present invention also provides a temperature control method, comprising: obtaining the return temperature of the coolant in the connecting pipe from the etching temperature control chamber of the etcher to the first liquid storage tank, so as to determine the working state of the etcher based on the return temperature; when it is determined that the working state is a no-load state, by controlling the opening and closing states of the first three-way valve and the second three-way valve, only the circulating cooling main circuit is used to control the temperature of the etching temperature control chamber, and the cooling liquid stored in the second liquid storage tank in the circulating cooling branch is cooled by a refrigeration unit; when it is determined that the working state is a momentary high load state, by controlling the opening and closing states of the first three-way valve and the second three-way valve, the etching temperature control chamber is jointly controlled by the circulating cooling main circuit and the cooling liquid stored in the cooled second liquid storage tank; the refrigeration unit is used to cool the cooling liquid in the circulating cooling main circuit; the circulating cooling main circuit includes a first liquid storage tank, and the circulating cooling branch includes a second liquid storage tank; the first liquid storage tank and the second liquid storage tank are connected in parallel through the first three-way valve and the second three-way valve.

[0017] The temperature control device and method provided by the present invention utilize a circulating cooling branch to store excess cooling energy produced by a refrigeration unit when the etcher is in an unloaded state. When the etcher is in an instantaneous high-load state, the cooling energy stored in the circulating cooling branch is released by controlling the opening and closing of a three-way valve. The cooling energy is combined with the coolant in the circulating cooling main circuit to jointly control the temperature of the etching temperature control chamber, thereby reducing energy consumption and heat exchange load of the temperature control device, improving the temperature control accuracy of the temperature control device, and ensuring the stability of the working temperature of the etcher. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the present invention or the prior art, a brief introduction is given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 It is a structural schematic diagram of the temperature control device provided by the present invention;

[0020] Figure 2 1 is a flow chart of the temperature control method provided by the present invention;

[0021] Figure 3 It is a structural schematic diagram of the electronic device provided by the present invention;

[0022] Wherein, the accompanying drawings are marked as follows:

[0023] 1: First liquid storage tank; 2: Second liquid storage tank; 3: First three-way valve;

[0024] 4: Second three-way valve; 5: Etching temperature control chamber; 6: Branch evaporator;

[0025] 7: Branch expansion valve; 8: First temperature sensor; 9: Main circuit evaporator;

[0026] 10: Main circuit expansion valve; 11: Second temperature sensor; 12: Third temperature sensor;

[0027] 13: fourth temperature sensor; 14: fifth temperature sensor; 15: first flow meter;

[0028] 16: Second flow meter; 17: Pressure regulating valve; 18: Compressor; 19: Condenser;

[0029] 20: Dry filter; 21: Sight glass; 22: Heater;

[0030] 23: Sixth temperature sensor; 24: Pressure sensor; 25: Branch water pump;

[0031] 26: Main water pump. DETAILED DESCRIPTION

[0032] To make the objectives, technical solutions, and advantages of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0033] It should be noted that in the description of the embodiments of the present invention, the terms "comprise," "include," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprises a..." does not preclude the presence of additional identical elements in the process, method, article, or apparatus comprising the element. Terms such as "upper" and "lower" indicate positions or location relationships based on those shown in the accompanying drawings and are intended solely for ease of description and simplification of the present invention. They are not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed, or operate in a specific orientation, and are therefore not to be construed as limiting the present invention. Unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be broadly construed, for example, to mean a fixed connection, a detachable connection, or an integral connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium; or internal communication between two elements. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] The terms "first," "second," and the like in this application are used to distinguish similar objects, and are not used to describe a particular order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of this application can be implemented in orders other than those illustrated or described herein. Furthermore, the objects distinguished by "first," "second," and the like generally refer to a class of objects and do not limit the number of objects. For example, the first object may be one or more.

[0035] The following combination Figures 1 to 3 The temperature control device and method provided by the present invention are described.

[0036] Figure 1 It is a structural diagram of the temperature control device provided by the present invention, such as Figure 1 As shown, the temperature control device provided by the present invention includes: a circulating cooling main loop, a circulating cooling branch, a refrigeration unit for cooling the coolant in the circulating cooling main loop, and a controller.

[0037] The circulating cooling main circuit includes a first liquid storage tank 1 , and the circulating cooling branch circuit includes a second liquid storage tank 2 ; the first liquid storage tank 1 and the second liquid storage tank 2 are connected in parallel via a first three-way valve 3 and a second three-way valve 4 .

[0038] The controller obtains the return temperature of the coolant in the connecting pipe from the etching temperature control chamber 5 of the etcher to the first liquid storage tank 1 to determine the working state of the etcher based on the return temperature.

[0039] When the controller determines that the working state is the no-load state, it controls the opening and closing states of the first three-way valve 3 and the second three-way valve 4, and only uses the circulating cooling main circuit to control the temperature of the etching temperature control chamber 5, and uses the refrigeration unit to cool the coolant stored in the second liquid storage tank 2 in the circulating cooling branch.

[0040] When the controller determines that the working state is a momentary high load state, it controls the opening and closing states of the first three-way valve 3 and the second three-way valve 4, and uses the circulating cooling main circuit and the coolant stored in the cooled second liquid storage tank 2 to jointly control the temperature of the etching temperature control chamber 5.

[0041] Specifically, the temperature control device provided by the present invention includes a circulating cooling main loop, a circulating cooling branch, a refrigeration unit for cooling the coolant in the circulating cooling main loop, and a controller.

[0042] Among them, a first liquid storage tank 1 is provided in the circulating cooling main circuit, and a second liquid storage tank 2 is provided in the circulating cooling branch. The first liquid storage tank 1 and the second liquid storage tank 2 are connected in parallel through a first three-way valve 3 and a second three-way valve 4. Water can be used as the coolant in the first liquid storage tank 1 and the second liquid storage tank 2, or different liquids with good thermal conductivity such as ethylene glycol can be used as the coolant.

[0043] Furthermore, the controller can obtain the return temperature of the coolant in the connecting pipe from the etching temperature control chamber 5 of the etcher to the first liquid storage tank 1, thereby determining the working state of the etcher based on the return temperature.

[0044] For example, when the return temperature of the coolant is higher than a preset temperature threshold, it can be determined that the current working state of the etcher is a momentary high-load state; when the return temperature of the coolant is lower than another preset temperature threshold, it can be determined that the current working state of the etcher is a no-load state.

[0045] Furthermore, when the controller determines that the working state of the etcher is a no-load state, that is, it determines that the cooling capacity generated by the refrigeration unit of the temperature control device at this time will be greater than the cooling capacity required by the coolant in the circulating cooling main loop, the controller can control the opening and closing states of the first three-way valve 3 and the second three-way valve 4, for example, by closing the first three-way valve 3 and the second three-way valve 4 to stop delivering the coolant in the second liquid storage tank 2 to the circulating cooling main loop, and stop allocating the high-temperature reflux coolant in the circulating cooling main loop to the circulating cooling branch, thereby realizing the temperature control of the etching temperature control chamber 5 using only the coolant in the circulating cooling main loop, and also realizing the use of the excess cooling capacity of the refrigeration unit to cool the coolant stored in the second liquid storage tank 2 in the circulating cooling branch, thereby storing the excess cooling capacity in the coolant in the second liquid storage tank 2, and realizing the cold storage process when the etcher is in a no-load state.

[0046] In addition, when it is determined that the working state of the etcher is a momentary high-load state, that is, it is determined that the cooling capacity generated by the refrigeration unit of the temperature control device at this time will be less than the cooling capacity required by the coolant in the circulating cooling main loop, the controller can control the opening and closing states of the first three-way valve 3 and the second three-way valve 4, for example, by opening the first three-way valve 3 and the second three-way valve 4 to transport the coolant in the second liquid storage tank 2 that has been cooled in the no-load state to the circulating cooling main loop, and to distribute the high-temperature reflux coolant in the circulating cooling main loop to the circulating cooling branch, thereby realizing the use of the coolant in the circulating cooling main loop and the coolant stored in the second liquid storage tank 2 after cooling to jointly control the temperature of the etching temperature control chamber 5.

[0047] Therefore, based on the above analysis, when the controller determines that the etcher is in an idle state, the two three-way valves can be controlled to be closed, thereby storing the excess cold produced by the refrigeration unit in the coolant in the second liquid storage tank 2 of the circulating cooling branch. When the controller determines that the etcher is in an instantaneous high load state, the cold produced by the refrigeration unit is likely to be unable to meet the cooling demand of the coolant in the circulating cooling main circuit. The two three-way valves can be controlled to be opened to transport the coolant in the second liquid storage tank 2 that has cooled down in the idle state to the circulating cooling main circuit, and to distribute the high-temperature reflux coolant in the circulating cooling main circuit to the circulating cooling branch, thereby cooling the coolant in the circulating cooling main circuit. By effectively storing and releasing cold, the energy consumption waste and heat exchange load of the temperature control device are reduced, the temperature control accuracy of the temperature control device is improved, and the stability of the working temperature of the etcher is ensured.

[0048] The temperature control device provided by the present invention utilizes a circulating cooling branch to store excess cooling energy produced by a refrigeration unit when the etcher is in an unloaded state. When the etcher is in an instantaneous high-load state, the cooling energy stored in the circulating cooling branch is released by controlling the opening and closing of a three-way valve. The cooling energy is combined with the coolant in the circulating cooling main circuit to jointly control the temperature of the etching temperature control chamber, thereby reducing energy consumption and heat exchange load of the temperature control device, improving the temperature control accuracy of the temperature control device, and ensuring the stability of the working temperature of the etcher.

[0049] Based on the content of the above embodiment, as an optional embodiment, a cooling branch is further included, and the cooling branch is a closed loop connected to the second liquid storage tank 2.

[0050] The refrigeration unit includes a branch evaporator 6 and a branch expansion valve 7 for adjusting the liquid inlet flow rate of the branch evaporator 6 .

[0051] When the controller determines that the working state is the no-load state, it opens the branch expansion valve 7 to use the branch evaporator 6 to cool the coolant flowing through the cooling branch in the second liquid storage tank 2.

[0052] When the controller determines that the working state is a momentary high load state, it closes the branch expansion valve 7.

[0053] Specifically, if Figure 1 As shown, the temperature control device provided by the present invention also includes a cooling branch circuit, which is a closed circuit connected to the second liquid storage tank 2. The refrigeration unit is provided with a branch evaporator 6 and a branch expansion valve 7 for adjusting the liquid flow rate of the branch evaporator 6. The branch expansion valve 7 can be an electronic expansion valve.

[0054] Furthermore, when the controller determines that the working state of the etcher is no-load, it can open the branch expansion valve 7 to use the branch evaporator 6 to cool the coolant flowing through the cooling branch in the second liquid storage tank 2, thereby storing excess cold in the coolant in the second liquid storage tank 2.

[0055] When the controller determines that the working state of the etcher is a momentary high load state, it can close the branch expansion valve 7 to ensure that the cooling capacity generated by the refrigeration unit is used to cool the coolant in the circulating refrigeration main loop.

[0056] The temperature control device provided by the present invention is configured to have a branch evaporator and a branch expansion valve for adjusting the liquid inlet flow rate of the branch evaporator in the refrigeration unit, so that when in a no-load state, the branch expansion valve is opened to cool the coolant flowing through the cooling branch in the second liquid storage tank to achieve a cold storage process. In a momentary high-load state, the branch expansion valve is closed to prevent the cold capacity generated by the refrigeration unit from being unable to be used to cool the coolant in the circulating refrigeration main circuit, thereby improving the temperature control accuracy of the temperature control device.

[0057] Based on the content of the above embodiment, as an optional embodiment, a first temperature sensor 8 is further included. The first temperature sensor 8 is arranged in the cooling branch and is used to obtain the first temperature of the coolant after the cooling treatment by the branch evaporator 6.

[0058] When the controller determines that the working state is the no-load state, it adjusts the opening and closing state of the branch expansion valve 7 to the first opening degree based on the temperature difference between the first temperature and the target temperature value of the cooling branch, so as to use the branch evaporator 6 to cool the coolant flowing through the cooling branch.

[0059] Specifically, if Figure 1 As shown, the temperature control device provided by the present invention further includes a first temperature sensor 8, which is arranged in the cooling branch and is used to obtain the first temperature of the coolant after the cooling treatment of the branch evaporator 6.

[0060] Furthermore, when the controller determines that the etching machine is operating in an idle state, it can determine the opening value of the branch expansion valve 7 as a first opening based on the temperature difference between the first temperature and the target temperature of the cooling branch, and adjust the opening and closing state of the branch expansion valve 7 to the first opening, so as to cool the coolant flowing through the cooling branch using the branch evaporator 6. The opening refers to the relative degree of opening of the valve at any position between fully closed and fully open. For example, when the valve is fully closed, the opening is 0%, and when the valve is fully open, the opening is 100%.

[0061] Among them, the target temperature value of the cooling branch can be pre-set according to the usage requirements of the specific scenario, or it can be determined based on the return port temperature of the etcher in the no-load state and the return port temperature of the etcher in the instantaneous high-load state. For example, the return port temperature of the etcher in the no-load state is T1, and the return port temperature of the etcher in the instantaneous high-load state is T1+N. The cooling branch target temperature value can be pre-set as T1-N based on the temperature difference N between the return port temperature of the etcher in the no-load state and the return port temperature of the etcher in the instantaneous high-load state, and the return port temperature T1 of the etcher in the no-load state.

[0062] Optionally, the above-mentioned determination of the opening value of the branch expansion valve 7 as the first opening based on the temperature difference between the first temperature and the target temperature value of the cooling branch can be implemented based on a PID (Proportional-Integral-Derivative, PID) control algorithm, that is, the temperature difference between multiple groups of first temperatures and the target temperature of the cooling branch under different conditions can be obtained as PID input values through pre-debugging settings, and the opening value of the branch expansion valve 7 corresponding to each PID input value can be determined, and then the opening value of the branch expansion valve 7 under different temperature differences between the first temperature and the target temperature of the cooling branch (that is, different PID input values) can be obtained through experimental linear fitting.

[0063] When the temperature difference between the first temperature and the target temperature of the cooling branch is obtained and input into the PID control algorithm, the opening value of the branch expansion valve 7 can be quickly determined as the first opening, and the branch expansion valve 7 can be adjusted to the first opening, thereby achieving the cooling of the coolant flowing through the cooling branch by the branch evaporator 6. The higher the first temperature is above the target temperature of the cooling branch, that is, the greater the temperature difference between the first temperature and the target temperature of the cooling branch, the greater the first opening of the branch expansion valve 7, and the higher the efficiency of the branch evaporator 6 in cooling the coolant flowing through the cooling branch.

[0064] The temperature control device provided by the present invention obtains the first temperature of the coolant after cooling treatment by the branch evaporator by setting a first temperature sensor, and adjusts the opening and closing state of the branch expansion valve according to the temperature difference between the first temperature and the target temperature value of the cooling branch, thereby achieving more precise control of the cooling capacity of the storage refrigeration unit and more efficient cold storage process.

[0065] Based on the content of the above embodiment, as an optional embodiment, the refrigeration unit further includes a main circuit evaporator 9 and a main circuit expansion valve 10 for adjusting the liquid inlet flow rate of the main circuit evaporator 9 .

[0066] The circulating cooling main loop further includes a second temperature sensor 11 , which is used to obtain a second temperature of the coolant after being cooled by the main loop evaporator 9 .

[0067] When the controller determines that the working state is a momentary high-load state, based on the temperature difference between the second temperature and the target temperature value of the circulating cooling main circuit, it adjusts the opening and closing state of the main circuit expansion valve 10 to the second opening degree, the opening and closing state of the first three-way valve 3 to the third opening degree, and the opening and closing state of the second three-way valve 4 to the fourth opening degree, so as to utilize the main circuit evaporator 9 and the coolant stored in the second liquid storage tank 2 to jointly cool the coolant flowing through the circulating cooling main circuit.

[0068] Specifically, if Figure 1As shown, the refrigeration unit is further provided with a main circuit evaporator 9, which is mainly used to cool the coolant in the circulating cooling main circuit, and a main circuit expansion valve 10 for adjusting the liquid inlet flow rate of the main circuit evaporator 9.

[0069] In addition, the circulating cooling main loop is further provided with a second temperature sensor 11 , which is used to obtain the second temperature of the coolant after the cooling process of the main loop evaporator 9 .

[0070] Furthermore, when the controller determines that the working state of the etcher is a momentary high-load state, it can determine the opening value of the main circuit expansion valve 10 as the second opening, determine the opening value of the first three-way valve 3 as the third opening, and determine the opening value of the second three-way valve 4 as the fourth opening based on the temperature difference between the acquired second temperature and the target temperature value of the circulating cooling main circuit, and adjust the opening and closing state of the main circuit expansion valve 10 to the second opening, the opening and closing state of the first three-way valve 3 to the third opening, and the opening and closing state of the second three-way valve 4 to the fourth opening, so as to utilize the cooled coolant stored in the main circuit evaporator 9 and the second liquid storage tank 2 to jointly cool the coolant flowing through the circulating cooling main circuit.

[0071] Among them, the target temperature value of the circulating cooling main loop can be pre-set according to the specific usage requirements.

[0072] Optionally, the above-mentioned determination of the opening value of the main circuit expansion valve 10 as the second opening, the determination of the opening value of the first three-way valve 3 as the third opening, and the determination of the opening value of the second three-way valve 4 as the fourth opening based on the temperature difference between the second temperature and the target temperature value of the circulating cooling main circuit can be implemented based on the PID control algorithm, that is, the temperature difference between multiple groups of second temperatures and the target temperature value of the circulating cooling main circuit under different states can be obtained as PID input values through pre-debugging settings, and the opening value corresponding to each PID input value can be determined, and then the opening values of the three valves under different temperature differences between the second temperatures and the target temperature value of the circulating cooling main circuit (that is, different PID input values) can be obtained through experimental linear fitting.

[0073] When the temperature difference between the second temperature and the target temperature value of the circulating cooling main circuit is obtained and input into the PID control algorithm, the opening value of the main circuit expansion valve 10 can be quickly determined as the second opening, the opening value of the first three-way valve 3 can be determined as the third opening, and the opening value of the second three-way valve 4 can be determined as the fourth opening, and the three valves can be adjusted to the corresponding openings, so as to utilize the main circuit evaporator 9 and the cooled coolant stored in the second liquid storage tank 2 to jointly cool the coolant flowing through the circulating cooling main circuit.

[0074] For example, the second temperature value obtained is T2, the target temperature value of the circulating cooling main circuit is SVT2, the temperature difference between the second temperature and the target temperature value of the circulating cooling main circuit is ΔT2 and is used as the PID input value. The PID input value ranges from 0 to 100, which respectively corresponds to the opening value of the main circuit expansion valve 10 from 0% to x%, the opening value of the first three-way valve 3 from 0% to y%, and the opening value of the second three-way valve 4 from 0% to z%. When the PID input value is 50, it can be determined that the opening value of the main circuit expansion valve 10 is As the second opening, the opening value of the first three-way valve 3 is And as the third opening, and the opening value of the second three-way valve 4 is And as the fourth opening.

[0075] The temperature control device provided by the present invention obtains the second temperature of the coolant after cooling treatment by the main circuit evaporator by setting a second temperature sensor, and adjusts the opening and closing states of the three valves according to the temperature difference between the second temperature and the target temperature value of the circulating cooling main circuit, effectively utilizing the cold capacity stored in the coolant in the second liquid storage tank, and achieving more accurate control of the cooling amplitude of the coolant in the circulating cooling main circuit, thereby improving the temperature control accuracy of the temperature control device, so as to ensure the stability of the working temperature of the etcher.

[0076] Based on the content of the above embodiment, as an optional embodiment, the circulating cooling main loop further includes a third temperature sensor 12, which is used to obtain the third temperature of the coolant before being cooled by the main loop evaporator 9.

[0077] When the controller determines that the working state is a momentary high-load state, it obtains the temperature difference between the third temperature and the second temperature as the first temperature difference, and adjusts the opening and closing state of the first three-way valve 3 to the fifth opening degree and the opening and closing state of the second three-way valve 4 to the sixth opening degree based on the temperature difference between the first temperature difference and the first preset temperature difference, so as to use the coolant stored in the second liquid storage tank 2 to cool the coolant flowing through the circulating cooling main circuit.

[0078] The second temperature is the coolant temperature after the main circuit evaporator 9 in the refrigeration unit has been cooled.

[0079] Specifically, if Figure 1 As shown, a third temperature sensor 12 is further provided in the circulating cooling main loop, and the third temperature sensor 12 is used to obtain the third temperature of the coolant before being cooled by the main loop evaporator 9 .

[0080] Furthermore, when the controller determines that the working state of the etcher is a momentary high-load state, it can determine the opening value of the first three-way valve 3 as the fifth opening based on the temperature difference between the third temperature and the second temperature obtained as the first temperature difference, and determine the opening value of the second three-way valve 4 as the sixth opening based on the temperature difference between the first temperature difference and the first preset temperature difference, and adjust the opening and closing state of the first three-way valve 3 to the fifth opening and the opening and closing state of the second three-way valve 4 to the sixth opening, so as to use the coolant stored in the second liquid storage tank 2 to cool the coolant flowing through the circulating cooling main circuit.

[0081] Among them, the second temperature is the coolant temperature after the main circuit evaporator 9 in the refrigeration unit is cooled; the first preset temperature difference can be pre-set according to the specific scene usage requirements.

[0082] Optionally, the above-mentioned determination of the opening value of the first three-way valve 3 as the fifth opening and the determination of the opening value of the second three-way valve 4 as the sixth opening based on the temperature difference between the first temperature difference and the first preset temperature difference can be implemented based on a PID control algorithm.

[0083] Therefore, by directly comparing the temperature difference between the third temperature of the coolant before the main circuit evaporator 9 is cooled and the second temperature of the coolant after the main circuit evaporator 9 is cooled and obtained with the first preset temperature difference, it is possible to more directly reflect whether the main circuit evaporator 9 can meet the cooling requirements of the coolant in the circulating cooling main circuit, and then more accurately adjust the opening and closing states of the first three-way valve 3 and the second three-way valve 4 accordingly, so as to use the coolant stored in the second liquid storage tank 2 to cool the coolant flowing through the circulating cooling main circuit.

[0084] The temperature control device provided by the present invention, by setting a third temperature sensor, realizes the comparison and acquisition of the temperature difference between the third temperature of the coolant before the cooling treatment of the main circuit evaporator and the second temperature of the coolant after the cooling treatment of the main circuit evaporator and the first preset temperature difference, which can more directly reflect whether the main circuit evaporator can meet the cooling demand of the coolant in the circulating cooling main circuit, and then more accurately adjust the opening and closing states of the first three-way valve and the second three-way valve accordingly, so as to utilize the coolant stored in the second liquid storage tank to cool the coolant flowing through the circulating cooling main circuit.

[0085] Based on the content of the above embodiment, as an optional embodiment, the circulating cooling branch further includes a fourth temperature sensor 13 , which is used to obtain a fourth temperature of the coolant in the second liquid storage tank 2 .

[0086] When the controller determines that the working state is a momentary high-load state, it obtains the temperature difference between the fourth temperature and the third temperature as the second temperature difference, and adjusts the opening and closing state of the first three-way valve 3 to the seventh opening degree and the opening and closing state of the second three-way valve 4 to the eighth opening degree based on the temperature difference between the second temperature difference and the second preset temperature difference, so as to use the coolant stored in the second liquid storage tank 2 to cool the coolant flowing through the circulating cooling main circuit.

[0087] The third temperature is the coolant temperature before the main circuit evaporator 9 in the refrigeration unit is cooled.

[0088] Specifically, if Figure 1 As shown, a fourth temperature sensor 13 is further provided in the circulating cooling branch. The fourth temperature sensor 13 is used to obtain a fourth temperature of the coolant in the second liquid storage tank 2 .

[0089] Furthermore, when the controller determines that the working state of the etcher is a momentary high-load state, it can determine the opening value of the first three-way valve 3 as the seventh opening based on the obtained temperature difference between the fourth temperature and the third temperature as the second temperature difference, and determine the opening value of the second three-way valve 4 as the eighth opening based on the temperature difference between the second temperature difference and the second preset temperature difference, and adjust the opening and closing state of the first three-way valve 3 to the seventh opening and the opening and closing state of the second three-way valve 4 to the eighth opening, so as to use the coolant stored in the second liquid storage tank 2 to cool the coolant flowing through the circulating cooling main circuit.

[0090] Among them, the third temperature is the coolant temperature before the main circuit evaporator 9 in the refrigeration unit is cooled; the second preset temperature difference can be pre-set according to the specific scene usage requirements.

[0091] Optionally, the above-mentioned determination of the opening value of the first three-way valve 3 as the seventh opening and the determination of the opening value of the second three-way valve 4 as the eighth opening based on the temperature difference between the second temperature difference and the second preset temperature difference can be implemented based on a PID control algorithm.

[0092] Therefore, by directly comparing the temperature difference between the third temperature of the coolant before the cooling treatment of the main circuit evaporator 9 and the fourth temperature of the coolant in the second liquid storage tank 2 with the second preset temperature difference, it can more directly reflect whether the coolant stored in the second liquid storage tank 2 can meet the cooling requirements of the coolant in the circulating cooling main circuit under the current opening and closing states of the first three-way valve 3 and the second three-way valve 4, and then more accurately adjust the opening and closing states of the first three-way valve 3 and the second three-way valve 4 accordingly, so as to use the coolant stored in the second liquid storage tank 2 to cool the coolant flowing through the circulating cooling main circuit.

[0093] The temperature control device provided by the present invention is provided with a fourth temperature sensor to compare and obtain the temperature difference between the third temperature of the coolant before the cooling treatment of the main circuit evaporator and the fourth temperature of the coolant in the second liquid storage tank and the second preset temperature difference. It can more directly reflect whether the coolant stored in the second liquid storage tank can meet the cooling demand of the coolant in the circulating cooling main circuit under the current opening and closing states of the first three-way valve and the second three-way valve, and then more accurately adjust the opening and closing states of the first three-way valve and the second three-way valve accordingly, so as to utilize the coolant stored in the second liquid storage tank to cool the coolant flowing through the circulating cooling main circuit.

[0094] Based on the content of the above embodiment, as an optional embodiment, the circulating cooling main loop further includes a fifth temperature sensor 14, and the fifth temperature sensor 14 is used to obtain the return port temperature.

[0095] When the controller determines that the return port temperature is lower than a first preset temperature threshold and the return port temperature continues to decrease within a first preset time period, the controller determines that the working state is a no-load state.

[0096] When the controller determines that the return port temperature is greater than the second preset temperature threshold and the return port temperature continues to rise within the second preset time period, the controller determines that the working state is a momentary high load state.

[0097] The first preset temperature threshold is greater than the second preset temperature threshold.

[0098] Specifically, if Figure 1 As shown, a fifth temperature sensor 14 is also provided in the circulating cooling main loop, and the fifth temperature sensor 14 is mainly used to obtain the return temperature of the coolant in the connecting pipe from the etching temperature control chamber 5 of the etcher to the first liquid storage tank 1.

[0099] Furthermore, when the controller obtains the return port temperature and determines the operating state of the etcher based on the return port temperature, if it is determined that the return port temperature is less than a first preset temperature threshold and the return port temperature continues to decrease within a first preset time period, the operating state of the etcher can be determined to be an idle state. The first preset temperature threshold and the first preset time period can both be pre-set according to the specific usage requirements of the scenario. For example, the first preset time period can be pre-set to 5 seconds.

[0100] When it is determined that the return port temperature is greater than a second preset temperature threshold and the return port temperature continues to rise within a second preset time period, it can be determined that the working state of the etcher is a momentary high load state. The second preset temperature threshold and the second preset time period can be pre-set according to the specific usage requirements of the scenario. For example, the second preset time period can be pre-set to 5 seconds.

[0101] Therefore, by obtaining the return port temperature and based on the comparison results of the return port temperature with each temperature threshold, as well as the temperature change trend within the corresponding preset time, the working status of the etcher can be determined more accurately, thereby achieving more effective control of the cold storage process and the cold release process.

[0102] The temperature control device provided by the present invention obtains the return temperature by setting a fifth temperature sensor in the circulating cooling main loop, and based on the comparison results of the return temperature with each temperature threshold, as well as the temperature change trend within the corresponding preset time, can more accurately determine the working state of the etcher, thereby achieving more effective control of the cold storage process and the cold release process, so as to ensure the stability of the working temperature of the etcher.

[0103] Based on the content of the above embodiment, as an optional embodiment, the circulating cooling main loop is further equipped with a first flow meter 15, and the first flow meter 15 is used to obtain the coolant flow in the circulating cooling main loop.

[0104] The cooling branch is further provided with a second flow meter 16, which is used to obtain the flow rate of the coolant in the cooling branch.

[0105] Specifically, if Figure 1 As shown, a first flow meter 15 is also installed in the circulating cooling main circuit, and the first flow meter 15 is mainly used to obtain the coolant flow in the circulating cooling main circuit. A second flow meter 16 is also installed in the cooling branch, and the second flow meter 16 is mainly used to obtain the coolant flow in the cooling branch.

[0106] Since the cooling capacity of the coolant is closely related to the flow rate of the coolant, by setting the first flow meter 15 and the second flow meter 16, the coolant flow rate in the circulating cooling main circuit and the coolant flow rate in the cooling branch can be better obtained, so as to ensure that the coolant output in the temperature control system can meet the heat dissipation requirements of the etcher and ensure the stability of the working temperature of the etcher.

[0107] Alternatively, as Figure 1 As shown, a branch water pump 25 is provided in the cooling branch, and a main water pump 26 is provided in the circulating cooling main loop, so that when the coolant flow in the cooling branch and the circulating cooling main loop cannot effectively meet the heat dissipation requirements of the etcher, the branch water pump 25 and the main water pump 26 can be started to increase the coolant flow in the cooling branch and the circulating cooling main loop, thereby better ensuring the stability of the working temperature of the etcher.

[0108] The temperature control device provided by the present invention obtains the coolant flow in the circulating cooling main circuit and the cooling branch by setting a first flow meter and a second flow meter, so as to ensure that the coolant output from the temperature control device can meet the heat dissipation requirements of the etcher and ensure the stability of the working temperature of the etcher.

[0109] Based on the contents of the above embodiments, as an optional embodiment, the refrigeration unit further includes a pressure regulating valve 17, which is installed at the outlet of the branch evaporator 6 and is used to adjust the pressure at the outlet of the branch evaporator 6 so that the pressure difference between the pressure at the outlet of the branch evaporator 6 and the pressure at the outlet of the main circuit evaporator 9 is within a preset range.

[0110] Specifically, if Figure 1 As shown, in the refrigeration unit, a pressure regulating valve 17 is installed at the outlet of the branch evaporator 6 to adjust the pressure at the outlet of the branch evaporator 6 so that the pressure difference between the outlet pressure of the branch evaporator 6 and the outlet pressure of the main circuit evaporator 9 is within a preset range. The preset range can be pre-set according to the specific usage requirements.

[0111] If the pressure difference between the outlet of the main circuit evaporator 9 and the outlet of the branch evaporator 6 is too large, it can easily cause backflow, which can easily damage the equipment and affect the operating efficiency of the refrigeration unit. Therefore, the temperature control device provided by the present invention is provided with a pressure regulating valve 17 to ensure that the pressure difference between the outlet of the branch evaporator 6 and the outlet of the main circuit evaporator 9 is within a preset range, thereby reducing the possibility of abnormal conditions.

[0112] The temperature control device provided by the present invention provides a pressure regulating valve at the outlet of the branch evaporator to ensure that the pressure difference between the pressure at the outlet of the branch evaporator and the pressure at the outlet of the main loop evaporator is within a preset range, thereby reducing the possibility of abnormal situations and improving the stability of the temperature control device.

[0113] Based on the content of the above embodiment, as an optional embodiment, the refrigeration unit further includes a compressor 18 and a condenser 19 .

[0114] The compressor 18 , the condenser 19 , the branch expansion valve 7 and the branch evaporator 6 are connected to form a closed loop, so that the coolant flowing through the cooling branch is cooled by the branch evaporator 6 .

[0115] The compressor 18, the condenser 19, the main circuit expansion valve 10 and the main circuit evaporator 9 are connected to form a closed circuit, so that the coolant flowing through the circulating cooling main circuit is cooled by the main circuit evaporator 9.

[0116] Specifically, if Figure 1 As shown, the refrigeration unit is further provided with a compressor 18 and a condenser 19, wherein the compressor 18, the condenser 19, the branch expansion valve 7 and the branch evaporator 6 are connected to form a closed loop, so that the coolant flowing through the cooling branch is cooled by the branch evaporator 6.

[0117] In addition, the compressor 18, the condenser 19, the main circuit expansion valve 10 and the main circuit evaporator 9 are connected to form a closed circuit, so that the coolant flowing through the circulating cooling main circuit is cooled by the main circuit evaporator 9.

[0118] Therefore, when the compressor 18 is running at rated power and it is determined that the etcher is in an no-load state, the coolant flowing through the cooling branch is cooled by the branch evaporator 6 in the refrigeration unit, so that the excess cooling capacity generated in the refrigeration unit is stored in the coolant in the second liquid storage tank 2; when the compressor 18 is running at rated power and it is determined that the etcher is in an instantaneous high-load state, since the cooling capacity generated by the refrigeration unit may not meet the cooling demand, the cooling capacity stored in the coolant in the second liquid storage tank 2 is released to the circulating cooling main circuit to cool the coolant in the circulating cooling main circuit.

[0119] Alternatively, as Figure 1 As shown, a drying filter 20 is also provided at the outlet of the condenser 19 in the refrigeration unit. Since moisture or impurities in the gas or liquid may have an adverse effect on the pipeline and equipment during the gas or liquid transmission process, the function of the drying filter 20 is to remove moisture and impurities in the air or liquid to ensure the normal operation and working efficiency of the pipeline and equipment.

[0120] Alternatively, as Figure 1 As shown, a sight glass 21 may also be provided in the refrigeration unit, which is mainly used to check the horizontal position and flow rate of the fluid in the pipeline so that the operator can perform corresponding control and adjustment to ensure the normal flow of the fluid.

[0121] Alternatively, as Figure 1 As shown, a heater 22 can also be provided in the circulating cooling main loop to reheat the coolant after the cooling treatment of the main loop evaporator 9. Since excessive cooling may occur, in order to ensure the stability of the working temperature of the etcher, the heater 22 can be used to increase the temperature as needed.

[0122] Alternatively, as Figure 1 As shown, a sixth temperature sensor 23 is provided on the connecting pipe from the coolant in the circulating cooling main loop to the etching temperature control chamber 5, for obtaining the temperature of the coolant in the circulating cooling main loop when it flows to the etching temperature control chamber 5, thereby ensuring that the temperature of the coolant in the circulating cooling main loop meets the working temperature of the etching temperature control chamber 5, so as to ensure the stability of the working temperature of the etching temperature control chamber 5.

[0123] Alternatively, as Figure 1As shown, a pressure sensor 24 is provided on the connecting pipe from the coolant in the circulating cooling main loop to the etching temperature control chamber 5, for obtaining the pressure of the coolant in the circulating cooling main loop when it flows to the etching temperature control chamber 5, thereby ensuring that the coolant pressure in the circulating cooling main loop meets the working environment of the etching temperature control chamber 5, so as to ensure the working stability of the etching temperature control chamber 5.

[0124] The temperature control device provided by the present invention is provided with a compressor and a condenser, and then cooperates with a branch evaporator and a main circuit evaporator to cool the coolant in the cooling branch and the coolant in the circulating cooling main circuit respectively, thereby effectively utilizing the excess cooling capacity generated by the refrigeration unit, reducing the energy consumption waste and heat exchange load of the temperature control device, and improving the temperature control accuracy of the temperature control device.

[0125] Figure 2 It is a schematic flow chart of the temperature control method provided by the present invention, such as Figure 2 As shown, including but not limited to the following steps:

[0126] The return port temperature of the coolant in the connecting pipe from the etching temperature control chamber 5 of the etcher to the first liquid storage tank 1 is obtained, so as to determine the working state of the etcher based on the return port temperature.

[0127] When it is determined that the working state is a no-load state, the etching temperature control chamber 5 is temperature-controlled only by using the circulating cooling main circuit by controlling the opening and closing states of the first three-way valve 3 and the second three-way valve 4, and the coolant stored in the second liquid storage tank 2 in the circulating cooling branch is cooled by using the refrigeration unit.

[0128] When it is determined that the working state is a momentary high load state, the etching temperature control chamber 5 is temperature-controlled by controlling the opening and closing states of the first three-way valve 3 and the second three-way valve 4 and utilizing the circulating cooling main circuit and the coolant stored in the cooled second liquid storage tank 2.

[0129] Among them, the refrigeration unit is used to cool the coolant in the circulating cooling main circuit; the circulating cooling main circuit includes a first liquid storage tank 1, and the circulating cooling branch includes a second liquid storage tank 2; the first liquid storage tank 1 and the second liquid storage tank 2 are connected in parallel through a first three-way valve 3 and a second three-way valve 4.

[0130] Specifically, the return temperature of the coolant in the connecting pipe from the etching temperature control chamber 5 of the etcher to the first liquid storage tank 1 is obtained, so as to determine the working state of the etcher based on the return temperature.

[0131] Furthermore, when it is determined that the working state of the etcher is in the no-load state, by controlling the opening and closing states of the first three-way valve 3 and the second three-way valve 4, the temperature of the etching temperature control chamber 5 is controlled only by the circulating cooling main circuit, and the cooling liquid stored in the second liquid storage tank 2 in the circulating cooling branch is cooled by the refrigeration unit.

[0132] Furthermore, when it is determined that the working state of the etcher is a momentary high load state, the opening and closing states of the first three-way valve 3 and the second three-way valve 4 are controlled, and the temperature of the etching temperature control chamber 5 is jointly controlled by utilizing the circulating cooling main circuit and the coolant stored in the second liquid storage tank 2 after cooling.

[0133] As an optional embodiment, when the etching machine is powered on, the controller adjusts the liquid level height between the first liquid storage tank 1 and the second liquid storage tank 2 to ensure that the liquid level difference between the first liquid storage tank 1 and the second liquid storage tank 2 is within a preset range.

[0134] Furthermore, the branch expansion valve 7, the first three-way valve 3 and the second three-way valve 4 are closed, and the etching temperature control chamber 5 is controlled by only the circulating cooling main circuit. Through the first flow meter 15 and the second flow meter 16, in conjunction with the branch water pump 25 and the main water pump 26, it is ensured that the coolant flow in the circulating cooling main circuit and the cooling branch meets the operating requirements of the etching machine.

[0135] Furthermore, the return port temperature is obtained by the fifth temperature sensor 14. When the etcher is in an idle state for the first time, the return port temperature obtained at this time is determined as the second preset temperature threshold. When the etcher is in an instantaneous high load state for the first time, the return port temperature obtained at this time is determined as the first preset temperature threshold.

[0136] Furthermore, when the etching machine returns to the no-load state, the PID input value is determined according to the first temperature obtained by the first temperature sensor 8, and then the opening of the branch expansion valve 7 is determined to control the opening and closing state of the branch expansion valve 7, so as to achieve cooling of the coolant in the cooling branch through the branch evaporator 6.

[0137] Then, when the return port temperature is greater than the second preset temperature threshold and the return port temperature continues to rise within the second preset time period, it is determined that the working state of the etcher is a momentary high load state, and the branch expansion valve 7 is closed.

[0138] Furthermore, the second temperature obtained by the second temperature sensor 11 and the temperature difference between the second temperature and the target temperature value of the circulating cooling main circuit are used as the input value of the PID to determine the opening of the main circuit expansion valve 10, the first three-way valve 3 and the second three-way valve 4, so as to control the opening and closing states of the main circuit expansion valve 10, the first three-way valve 3 and the second three-way valve 4, so as to realize the cooling of the coolant flowing through the circulating cooling main circuit by the main circuit evaporator 9 and the coolant stored in the second liquid storage tank 2.

[0139] Furthermore, when the return port temperature is lower than the first preset temperature threshold and the return port temperature continues to decrease within the first preset time period, it is determined that the working state of the etcher is in the no-load state, and the above-mentioned first temperature obtained according to the first temperature sensor 8 is repeated to determine the input value of the PID, and then determine the opening degree of the branch expansion valve 7 to control the opening and closing state of the branch expansion valve 7, thereby realizing the step of cooling the coolant in the cooling branch through the branch evaporator 6.

[0140] Therefore, by continuously circulating the branch evaporator of the refrigeration unit to store cold, when the etcher is in a momentary high-load state, the first three-way valve 3 and the second three-way valve 4 are controlled to release the cold capacity, so as to realize the temperature control of the etching temperature control chamber 5 by utilizing the circulating cooling main circuit and the coolant stored in the second liquid storage tank 2 after cooling.

[0141] The temperature control method provided by the present invention utilizes a circulating cooling branch to store excess cooling energy produced by a refrigeration unit when the etcher is in an unloaded state. When the etcher is in an instantaneous high-load state, the cooling energy stored in the circulating cooling branch is released by controlling the opening and closing of a three-way valve. The cooling energy is combined with the coolant in the circulating cooling main circuit to jointly control the temperature of the etching temperature control chamber, thereby reducing energy consumption and heat exchange load of the temperature control device, improving the temperature control accuracy of the temperature control device, and ensuring the stability of the working temperature of the etcher.

[0142] Figure 3 Schematic diagram of the structure of the electronic device provided by the present invention, such as Figure 3As shown, the electronic device may include: a processor 310, a communications interface 320, a memory 330, and a communications bus 340, wherein the processor 310, the communications interface 320, and the memory 330 communicate with each other via the communications bus 340. The processor 310 may call the logic instructions in the memory 330 to execute a temperature control method, which includes: obtaining the return temperature of the coolant in the connecting pipe from the etching temperature control chamber of the etcher to the first liquid storage tank, and determining the working state of the etcher based on the return temperature; when it is determined that the working state is a no-load state, by controlling the opening and closing states of the first three-way valve and the second three-way valve, only using the circulating cooling main circuit to control the temperature of the etching temperature control chamber, and using the refrigeration unit to cool the coolant stored in the second liquid storage tank in the circulating cooling branch; When it is determined that the working state is a momentary high-load state, the temperature of the etching temperature control cavity is jointly controlled by controlling the opening and closing states of the first three-way valve and the second three-way valve, using the circulating cooling main circuit and the coolant stored in the second liquid storage tank after cooling; the refrigeration unit is used to cool the coolant in the circulating cooling main circuit; the circulating cooling main circuit includes a first liquid storage tank, and the circulating cooling branch includes a second liquid storage tank; the first liquid storage tank and the second liquid storage tank are connected in parallel through the first three-way valve and the second three-way valve.

[0143] In addition, the logic instructions in the above-mentioned memory 330 can be implemented in the form of a software functional unit and can be stored in a computer-readable storage medium when sold or used as an independent product. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, or the part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions for enabling a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present invention. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0144] On the other hand, the present invention also provides a computer program product, which includes a computer program stored on a non-transitory computer-readable storage medium, and the computer program includes program instructions. When the program instructions are executed by a computer, the computer can execute the temperature control method provided in the above embodiments, the method comprising: obtaining the return temperature of the coolant in the connecting pipe of the etching temperature control chamber of the etcher to the first liquid storage tank, so as to determine the working state of the etcher based on the return temperature; when it is determined that the working state is a no-load state, by controlling the opening and closing states of the first three-way valve and the second three-way valve, only using the circulating cooling main circuit to circulate the etching temperature control chamber. The temperature of the etching temperature control cavity is controlled by controlling the opening and closing states of the first three-way valve and the second three-way valve, and the cooling liquid stored in the second liquid storage tank after cooling is used to control the temperature of the etching temperature control cavity; the cooling unit is used to cool the cooling liquid in the circulating cooling main circuit; the circulating cooling main circuit includes a first liquid storage tank, and the circulating cooling branch includes a second liquid storage tank; the first liquid storage tank and the second liquid storage tank are connected in parallel through the first three-way valve and the second three-way valve.

[0145] On the other hand, the present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, which is implemented when the computer program is executed by a processor to execute the temperature control method provided in the above embodiments, the method comprising: obtaining the return temperature of the coolant in the connecting pipe of the etching temperature control chamber of the etcher to the first liquid storage tank, so as to determine the working state of the etcher based on the return temperature; when it is determined that the working state is a no-load state, by controlling the opening and closing states of the first three-way valve and the second three-way valve, only using the circulating cooling main circuit to control the temperature of the etching temperature control chamber, and using the refrigeration unit to control the circulating cooling branch circuit. The cooling liquid stored in the second liquid storage tank is cooled; when it is determined that the working state is a momentary high load state, by controlling the opening and closing states of the first three-way valve and the second three-way valve, the etching temperature control cavity is jointly controlled by using the circulating cooling main circuit and the cooling liquid stored in the second liquid storage tank after cooling; the refrigeration unit is used to cool the coolant in the circulating cooling main circuit; the circulating cooling main circuit includes a first liquid storage tank, and the circulating cooling branch includes a second liquid storage tank; the first liquid storage tank and the second liquid storage tank are connected in parallel through the first three-way valve and the second three-way valve.

[0146] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, i.e., they may be located in one location or distributed across multiple network units. Some or all of the modules may be selected based on actual needs to achieve the objectives of the present embodiment. Persons of ordinary skill in the art will be able to understand and implement the present invention without inventive effort.

[0147] Through the description of the above embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus a necessary general hardware platform, or of course, by hardware. Based on this understanding, the essence of the above technical solution or the part that contributes to the existing technology can be embodied in the form of a software product. The computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, a magnetic disk, an optical disk, etc., and includes a number of instructions for enabling a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in each embodiment or certain parts of the embodiments.

[0148] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A temperature control device, characterized in that: include: A circulating cooling main loop, a circulating cooling branch, a refrigeration unit for cooling the coolant in the circulating cooling main loop, and a controller; The circulating cooling main circuit includes a first liquid storage tank, and the circulating cooling branch circuit includes a second liquid storage tank; the first liquid storage tank and the second liquid storage tank are connected in parallel via a first three-way valve and a second three-way valve; The controller obtains the return temperature of the coolant in the connecting pipe from the etching temperature control chamber of the etcher to the first liquid storage tank, so as to determine the working state of the etcher based on the return temperature; When the controller determines that the working state is a no-load state, the controller controls the opening and closing states of the first three-way valve and the second three-way valve, thereby controlling the temperature of the etching temperature control chamber using only the circulating cooling main circuit, and using the refrigeration unit to cool the coolant stored in the second liquid storage tank in the circulating cooling branch; When the controller determines that the working state is a momentary high-load state, the controller controls the opening and closing states of the first three-way valve and the second three-way valve, and uses the circulating cooling main circuit and the coolant stored in the second liquid storage tank after cooling to jointly control the temperature of the etching temperature control chamber.

2. The temperature control device according to claim 1, characterized in that: It also includes a cooling branch, which is a closed loop connected to the second liquid storage tank; The refrigeration unit includes a branch evaporator and a branch expansion valve for adjusting the liquid inlet flow rate of the branch evaporator; When the controller determines that the working state is a no-load state, the controller opens the branch expansion valve to cool the coolant in the second liquid storage tank flowing through the cooling branch using the branch evaporator; When the controller determines that the working state is a momentary high-load state, the controller closes the branch expansion valve.

3. The temperature control device according to claim 2, characterized in that: It also includes a first temperature sensor, which is arranged in the cooling branch and is used to obtain a first temperature of the coolant after the cooling treatment of the branch evaporator; When the controller determines that the working state is a no-load state, the controller adjusts the opening and closing state of the branch expansion valve to a first opening degree based on the temperature difference between the first temperature and the target temperature value of the cooling branch, so as to utilize the branch evaporator to cool the coolant flowing through the cooling branch.

4. The temperature control device according to claim 2, characterized in that: The refrigeration unit further includes a main circuit evaporator and a main circuit expansion valve for adjusting the liquid inlet flow rate of the main circuit evaporator; The circulating cooling main loop further includes a second temperature sensor, the second temperature sensor being used to obtain a second temperature of the coolant after being cooled by the main loop evaporator; When the controller determines that the working state is a momentary high-load state, the controller adjusts the opening and closing state of the main circuit expansion valve to a second opening degree, the opening and closing state of the first three-way valve to a third opening degree, and the opening and closing state of the second three-way valve to a fourth opening degree based on the temperature difference between the second temperature and the target temperature value of the circulating cooling main circuit, so as to utilize the main circuit evaporator and the coolant stored in the second liquid storage tank to jointly cool the coolant flowing through the circulating cooling main circuit.

5. The temperature control device according to claim 4, characterized in that: The circulating cooling main loop further includes a third temperature sensor, the third temperature sensor being used to obtain a third temperature of the coolant before being cooled by the main loop evaporator; When determining that the working state is a momentary high-load state, the controller obtains a temperature difference between the third temperature and the second temperature as a first temperature difference, and adjusts the opening and closing state of the first three-way valve to a fifth opening degree and the opening and closing state of the second three-way valve to a sixth opening degree based on the temperature difference between the first temperature difference and the first preset temperature difference, so as to use the coolant stored in the second liquid storage tank to cool the coolant flowing through the circulating cooling main circuit; The second temperature is the coolant temperature after the main loop evaporator in the refrigeration unit is cooled.

6. The temperature control device according to claim 2, characterized in that: The circulating cooling branch further includes a fourth temperature sensor, wherein the fourth temperature sensor is used to obtain a fourth temperature of the coolant in the second liquid storage tank; When determining that the working state is a momentary high-load state, the controller obtains a temperature difference between the fourth temperature and the third temperature as a second temperature difference, and adjusts the opening and closing state of the first three-way valve to a seventh opening degree and the opening and closing state of the second three-way valve to an eighth opening degree based on the temperature difference between the second temperature difference and a second preset temperature difference, so as to use the coolant stored in the second liquid storage tank to cool the coolant flowing through the circulating cooling main circuit; The third temperature is the coolant temperature before the main circuit evaporator in the refrigeration unit is cooled.

7. The temperature control device according to claim 1, characterized in that: The circulating cooling main loop further includes a fifth temperature sensor, and the fifth temperature sensor is used to obtain the return port temperature; The controller determines that the operating state is the no-load state when it is determined that the return port temperature is less than a first preset temperature threshold and the return port temperature continues to decrease within a first preset time period; The controller determines that the operating state is the instantaneous high-load state when it determines that the return port temperature is greater than a second preset temperature threshold and the return port temperature continues to rise within a second preset time period; Wherein, the first preset temperature threshold is greater than the second preset temperature threshold.

8. The temperature control device according to claim 2, characterized in that: The circulating cooling main circuit is further provided with a first flow meter, which is used to obtain the coolant flow in the circulating cooling main circuit; The cooling branch is further provided with a second flow meter, and the second flow meter is used to obtain the coolant flow in the cooling branch.

9. The temperature control device according to claim 4, characterized in that: The refrigeration unit also includes a pressure regulating valve, which is installed at the outlet of the branch evaporator and is used to adjust the pressure at the outlet of the branch evaporator so that the pressure difference between the pressure at the outlet of the branch evaporator and the pressure at the outlet of the main circuit evaporator is within a preset range.

10. The temperature control device according to claim 4, characterized in that: The refrigeration unit also includes a compressor and a condenser; The compressor, the condenser, the branch expansion valve and the branch evaporator are connected to form a closed circuit, so that the coolant flowing through the cooling branch is cooled by the branch evaporator; The compressor, the condenser, the main circuit expansion valve and the main circuit evaporator are connected to form a closed circuit, so that the coolant flowing through the circulating cooling main circuit is cooled by the main circuit evaporator.

11. A temperature control method, characterized in that: include: Obtaining a return temperature of coolant in a connecting pipe from an etching temperature control chamber of the etcher to a first liquid storage tank, so as to determine a working state of the etcher based on the return temperature; When it is determined that the working state is a no-load state, the etching temperature control chamber is controlled by only using the circulating cooling main circuit by controlling the opening and closing states of the first three-way valve and the second three-way valve, and the coolant stored in the second liquid storage tank in the circulating cooling branch is cooled by using a refrigeration unit; When it is determined that the working state is a momentary high load state, the etching temperature control chamber is temperature-controlled by controlling the opening and closing states of the first three-way valve and the second three-way valve, using the circulating cooling main circuit and the coolant stored in the second liquid storage tank after cooling; The refrigeration unit is used to cool the coolant in the circulating cooling main circuit; the circulating cooling main circuit includes a first liquid storage tank, and the circulating cooling branch includes a second liquid storage tank; the first liquid storage tank and the second liquid storage tank are connected in parallel through the first three-way valve and the second three-way valve.

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