Laminated filter

Abstract

A laminated filter includes a body formed by laminating a plurality of insulator layers, a first inductor and a second inductor, and a wall portion arranged between the first inductor and the second inductor and grounded. At least the second inductor is a longitudinal wound inductor whose winding axis extends in a direction orthogonal to a laminating direction in which the plurality of insulator layers are laminated. A through portion is formed in the wall portion and penetrates in a direction opposite to the first inductor and the second inductor. The size of the through portion in the laminating direction is larger than the size of one layer of the insulator layers.

Description

Technical Field

[0001] This invention relates to stacked filters. Background Technology

[0002] Regarding the technology related to existing cascaded filters, the technology described in Japanese Patent Application Publication No. 2010-41141 is known. This cascaded filter includes one inductor and another inductor, and its characteristics are adjusted by creating an opening by removing the grounding pattern between the two. Summary of the Invention

[0003] However, in cascaded filters, longitudinally wound inductors are sometimes used to obtain high-frequency in-band insertion characteristics. Longitudinally wound inductors are configured such that the winding axis extends in a direction orthogonal to the stacking direction. Longitudinally wound inductors are prone to electromagnetic coupling with adjacent inductors, which may degrade various characteristics. Furthermore, the presence of grounded walls or similar structures between inductors may impede the magnetic flux of the longitudinally wound inductors. As described above, it is necessary to address these various problems and improve the performance of cascaded filters.

[0004] This invention was made to solve the above-mentioned technical problems, and its purpose is to provide a stacked filter that can improve performance.

[0005] One aspect of the present invention provides a stacked filter, comprising: a body formed by stacking multiple insulating layers; a first inductor and a second inductor; and a grounded wall disposed between the first inductor and the second inductor, wherein at least the second inductor is a longitudinally wound inductor with a winding shaft extending in a direction orthogonal to the stacking direction of the multiple insulating layers, and a through portion is formed in the wall portion through the first inductor and the second inductor in a direction opposite to each other, wherein the size of the through portion is larger than the size of one insulating layer in the stacking direction.

[0006] In this cascaded filter, at least the second inductor is a longitudinally wound inductor with its winding shaft extending in a direction orthogonal to the stacking direction of the multiple insulating layers. By using such a longitudinally wound coil, the cascaded filter can achieve high-frequency insertion loss characteristics. Furthermore, the cascaded filter includes a wall portion disposed between the first and second inductors and grounded. Therefore, electromagnetic coupling between the first and second inductors can be suppressed. Here, a through portion is formed in the wall portion, extending through the opposing directions of the first and second inductors. Moreover, in the stacking direction, the size of the through portion is larger than the size of one insulating layer. Because the wall portion has a large through portion, the magnetic flux of the longitudinally wound inductor, i.e., the second inductor, can pass through the through portion. Therefore, the magnetic flux of the second inductor can be suppressed, and the Q value can be improved. Thus, the performance of the cascaded filter can be improved.

[0007] In this invention, a terminal electrode may be formed on one side of the substrate in the stacking direction, and the wall portion may have a first portion closer to one side in the stacking direction than the through portion and a second portion closer to the other side in the stacking direction than the through portion, wherein the first portion is larger than the second portion in the stacking direction. Because a terminal electrode is formed on one side of the substrate in the stacking direction, a large number of electrodes are present. Therefore, by increasing the size of the first portion on one side of the wall portion in the stacking direction, parasitic capacitance between the electrodes on one side and the other side of the wall portion can be suppressed.

[0008] In this invention, the first inductor and the second inductor may also be in different frequency bands. In this case, the wall portion can suppress the coupling between inductors in different frequency bands.

[0009] In this invention, one of the first inductor and the second inductor may be a high-frequency inductor, and the other may be a mid-frequency inductor. In this case, the technical problem of reduced isolation characteristics in so-called multiplexers can be suppressed.

[0010] In this invention, a terminal electrode may be formed on one side of the substrate in the stacking direction, and the wall portion may have a second portion that is closer to the other side in the stacking direction than the through portion. The second inductor may have a wiring portion disposed on the other side in the stacking direction, and when viewed from the opposite direction, the wiring portion overlaps with the second portion. In this case, electromagnetic coupling between the wiring portion of the second inductor and the first inductor can be suppressed.

[0011] [Invention Effects]

[0012] The present invention provides a stacked filter that can improve performance. Attached Figure Description

[0013] Figure 1 This is a perspective view of a stacked filter according to one embodiment.

[0014] Figure 2 It means Figure 1 A three-dimensional diagram of the internal structure of the substrate shown.

[0015] Figure 3 It means Figure 1 A three-dimensional diagram of the internal structure of the substrate shown.

[0016] Figure 4 It is along Figure 2 Enlarged cross-sectional view of line IV-IV.

[0017] Figure 5 This is a rough diagram of the wall as viewed from the X-axis direction.

[0018] Figure 6 This is a top view of the first inductor, the second inductor, and the wall from the front side along the Z1 axis.

[0019] Figure 7 This is a three-dimensional diagram showing the internal structure of the stacked filter in the comparative example.

[0020] Figure 8 This is a three-dimensional diagram showing the internal structure of the stacked filter in the comparative example.

[0021] Figure 9 (a) represents the measurement results of Comparative Example 1. Figure 9 (b) represents the measurement results of Comparative Example 2. Figure 9 (c) represents the measurement results of the example.

[0022] Figure 10 (a) represents the measurement results of Comparative Example 1. Figure 10 (b) represents the measurement results of Comparative Example 2. Figure 10 (c) represents the measurement results of the example.

[0023] Figure 11 (a) represents the measurement results of Comparative Example 1. Figure 11 (b) represents the measurement results of Comparative Example 2. Figure 11 (c) represents the measurement results of the example.

[0024] Figure 12 The simulation results of Comparative Example 1, Comparative Example 2, and the embodiment are shown. Detailed Implementation

[0025] Hereinafter, a preferred embodiment of a stacked filter according to one aspect of the present invention will be described in detail with reference to the accompanying drawings.

[0026] First, use Figures 1-6 The structure of the stacked filter 1 (electronic component) in this embodiment is explained.

[0027] Figure 1 This is a perspective view showing a cascaded filter 1 according to one embodiment. For example, a multiplexer can be exemplified as the cascaded filter 1. Figure 1 As shown, the stacked filter 1 has a body 2 and terminal electrodes 3, 4, and 6 (terminals).

[0028] The base body 2 is rectangular parallelepiped in shape. The base body 2 has the following outer surfaces: a pair of opposing side surfaces 2a and 2b; a pair of opposing main surfaces 2c and 2d extending between the pair of side surfaces 2a and 2b; and a pair of opposing side surfaces 2e and 2f extending between the pair of main surfaces 2c and 2d. For example, when the stacked filter 1 is mounted on other electronic devices (e.g., circuit boards or electronic components, not shown), the main surface 2d is defined as the surface opposite to the other electronic device.

[0029] The relative directions of each side surface 2a, 2b are approximately orthogonal to the relative directions of each main surface 2c, 2d and the relative directions of each side surface 2e, 2f. Furthermore, the cuboid shape includes a cuboid with chamfered corners and edges, and a cuboid with rounded corners and edges. Sometimes, XYZ coordinates are set for the layered filter 1 for explanation. The X-axis direction is the relative direction of sides 2e, 2f. The Y-axis direction is the relative direction of sides 2a, 2b. The Z-axis direction is the relative direction of main surfaces 2c, 2d. Side surface 2e is positioned on the positive side of the X-axis direction, and side surface 2f is positioned on the negative side of the X-axis direction. Side surface 2a is positioned on the positive side of the Y-axis direction, and side surface 2b is positioned on the negative side of the Y-axis direction. Main surface 2c is positioned on the positive side of the Z-axis direction, and main surface 2d is positioned on the negative side of the Z-axis direction.

[0030] like Figure 4 As shown, the substrate 2 is constructed, for example, by stacking multiple insulating layers 7. Each insulating layer 7 is stacked along the Z-axis. That is, the stacking direction of each insulating layer 7 is consistent with the relative direction of each principal face 2c, 2d of the substrate 2. Hereinafter, the relative direction of each principal face 2c, 2d is sometimes referred to as the "stacking direction." Each insulating layer 7 has a roughly rectangular shape. In the actual substrate 2, each insulating layer 7 is integrated to the point that the boundaries between its layers are indistinguishable (indicated by double-dotted lines in the figure). Each insulating layer 7 corresponds to a single piece of ceramic green sheet before firing.

[0031] Each insulating layer 7 is, for example, composed of a sintered body of a ceramic green sheet containing a dielectric material (BaTiO3-based material, Ba(Ti,Zr)O3-based material, (Ba,Ca)TiO3-based material, glass material, or alumina material, etc.).

[0032] like Figure 1As shown, terminal electrodes 3, 4, and 6 are respectively disposed on the negative side (one side of the stacking direction) of the main surface 2d in the Z-axis direction. Terminal electrode 3 is disposed near the corners of the negative sides of the Y-axis and X-axis directions in the main surface 2d. Terminal electrode 4 is disposed on the main surface 2d adjacent to terminal electrode 3 on the positive side in the X-axis direction. Terminal electrode 6 is disposed on the main surface 2d adjacent to terminal electrode 3 on the positive side in the Y-axis direction. Among terminal electrodes 3, 4, and 6, terminal electrode 3 is an output terminal, and terminal electrodes 4 and 6 are grounding terminals.

[0033] Each of the terminal electrodes 3, 4, and 6 (hereinafter sometimes simply referred to as electrodes) contains a conductive material (e.g., Ag or Pd). The electrode is constructed from a sintered body of a conductive paste containing a conductive material (e.g., Ag powder or Pd powder). A plating layer is formed on the surface of the electrode. The plating layer is formed, for example, by electroplating. The plating layer has the following structure: a layer structure consisting of a Cu plating layer, a Ni plating layer, and a Sn plating layer; or a layer structure consisting of a Ni plating layer and a Sn plating layer; etc.

[0034] Figure 2 and Figure 3 It means Figure 1 A three-dimensional diagram of the internal structure of body 2 is shown. Figure 2 and Figure 3 The base body 2 is omitted. Figure 4 It is along Figure 2 An enlarged cross-sectional view of line IV-IV. Furthermore, in Figure 4 The base 2 is represented in the text and is not omitted. For example... Figure 2 and Figure 3 As shown, the stacked filter 1 includes a first inductor 11, a second inductor 12, a wall portion 13, and a connection structure 14. Furthermore, in Figure 2 and Figure 3 Other conductors are omitted.

[0035] The first inductor 11 is a flat-wound inductor. A flat-wound inductor is an inductor in which the winding axis CL1 extends parallel to the Z-axis direction (stack direction). The first inductor 11 is constructed by winding a conductor portion around the winding axis CL1 in a generally rectangular loop. Specifically, the first inductor 11 has sides 11A, 11B, 11C, 11D, and 11E. Side 11A extends along the Y-axis direction from the negative side of the winding axis C1 in the X-axis direction. Side 11B extends from the end of side 11A towards the positive side of the winding axis C1 in the Y-axis direction. Side 11C extends from the end of side 11B towards the negative side of the winding axis C1 in the X-axis direction. Side 11D extends from the end of side 11C towards the negative side of the winding axis C1 in the Y-axis direction. The edge 11F extends from the end of the edge 11D toward the positive side of the Y-axis relative to the winding shaft C1 on the negative side of the X-axis direction.

[0036] Edges 11A, 11B, and 11C are formed in the same insulating layer 7 (see reference). Figure 4 The first inductor 11 has a pair of conductor patterns 18 of the same shape facing each other in the Z-axis direction. The edges 11D and 11E are formed by conductor patterns 19 formed on the insulating layer 7, which is closer to the positive side of the Z-axis direction than the conductor patterns 18. The end of the conductor pattern 18 on the negative side of the Y-axis direction of the edge 11C is connected to the end of the conductor pattern 19 on the positive side of the X-axis direction of the edge 11D via a through-hole conductor. The first inductor 11 has a pair of conductor patterns 18 and a pair of conductor patterns 19 of the same shape facing each other in the Z-axis direction. The pair of conductor patterns 18 are electrically connected to each other at both ends via through-hole conductors. The pair of conductor patterns 19 are electrically connected to each other at both ends via through-hole conductors.

[0037] The first inductor 11 is electrically connected to the connection structure 14 via a post 16 at its negative end in the Y-axis direction of side portion 11A. The first inductor 11 is electrically connected to the connection structure 14 via a post 17 at its positive end in the Y-axis direction of side portion 11E. Posts 16 and 17 extend from the ends of the first inductor 11 toward the negative side in the Z-axis direction. Posts 16 and 17 are connected by penetrating each insulating layer 7 (see reference). Figure 4 It is formed by continuously connecting through-hole conductors in the Z-axis direction.

[0038] The second inductor 12 is a longitudinally wound inductor. A longitudinally wound inductor is an inductor in which the winding shaft CL2 extends in a direction orthogonal to the Z-axis direction (stack direction). In this embodiment, the winding shaft CL2 extends parallel to the X-axis direction. The second inductor 12 is constructed by winding the conductor portion into a gate shape around the winding shaft CL2. Specifically, the second inductor 12 includes a wiring portion 20 and post portions 21 and 22. Furthermore, there is no particular limitation on the number of turns of the longitudinally wound inductor; it can be set to two or more turns.

[0039] The wiring section 20 extends along the Y-axis relative to the positive side of the winding shaft CL2 in the Z-axis direction. The wiring section 20 is formed in the insulating layer 7 (see reference 7). Figure 4 The wiring section 20 is composed of a pair of conductor patterns 23 on the surface. The wiring section 20 has a pair of conductor patterns 23 of the same shape that are opposite each other in the Z-axis direction. The pair of conductor patterns 23 are electrically connected to each other at both ends via through-hole conductors.

[0040] The column portion 21 extends along the Z-axis relative to the negative side of the winding shaft CL2 in the Y-axis direction. The column portion 21 electrically connects the negative end of the wiring portion 20 in the Y-axis direction to the connecting structure 14. The column portion 21 is a component that extends from the negative end of the wiring portion 20 in the Y-axis direction toward the negative side of the Z-axis direction. The column portion 22 extends along the Z-axis relative to the positive side of the winding shaft CL2 in the Y-axis direction. The column portion 22 electrically connects the positive end of the wiring portion 20 in the Y-axis direction to the connecting structure 14. The column portion 22 is a component that extends from the positive end of the wiring portion 20 in the Y-axis direction toward the negative side of the Z-axis direction.

[0041] Here, the first inductor 11 and the second inductor 12 operate in different frequency bands. In this embodiment, one of the first inductor 11 and the second inductor is a high-frequency inductor, and the other is a mid-frequency inductor. The high-frequency inductor corresponds to the 5150–7125 MHz frequency band. The mid-frequency inductor corresponds to the 2400–2500 MHz frequency band. Furthermore, in this embodiment, the first inductor 11 is a mid-frequency inductor, and the second inductor 12 is a high-frequency inductor, but there is no particular limitation on this. Alternatively, the first inductor 11 and the second inductor 12 may also be inductors operating in the same frequency band.

[0042] The wall portion 13 is a component disposed between the first inductor 11 and the second inductor 12 and grounded. The wall portion 13 extends parallel to the YZ plane, with the X-axis direction opposite to the first inductor 11 and the second inductor 12 as the thickness direction. The wall portion 13 includes column portions 26 and 27 and a wall panel component 28.

[0043] The end of column 26 on the negative side of wall 13 in the Y-axis direction extends along the Z-axis direction. The end of column 26 on the negative side of Z-axis direction is electrically connected to connecting structure 14. The end of column 27 on the positive side of wall 13 in the Y-axis direction extends along the Z-axis direction. The end of column 27 on the negative side of Z-axis direction is electrically connected to connecting structure 14.

[0044] The wall panel component 28 extends along the Y-axis between the column portion 26 and the column portion 27. The wall panel component 28 is formed in the insulating layer 7 (see reference). Figure 4The panel component 28 is composed of conductor patterns 29. Multiple conductor patterns 29 of the same shape are arranged opposite each other in the Z-axis direction. The multiple conductor patterns 29 are electrically connected to each other at both ends via posts 26 and 27.

[0045] A through portion 30 is formed in the wall portion 13, extending through the first inductor 11 and the second inductor 12 in the opposite direction, i.e., the X-axis direction. The through portion 30 is formed by omitting the conductor pattern 29 in a portion of the wall panel member 28 in the Z-axis direction. The wall portion 13 has: a first portion 31 that is closer to the negative side (one side) in the Z-axis direction (stack direction) than the through portion 30; and a second portion 32 that is closer to the positive side (the other side) in the Z-axis direction (stack direction) than the through portion 30. In the Z-axis direction, the first portion 31 is larger than the second portion.

[0046] The edge of the through portion 30 in the Z-axis direction corresponds to the conductor pattern 29 on the most positive side in the Z-axis direction in the first part 31 and the conductor pattern 29 on the most negative side in the Z-axis direction in the second part 32. The edge of the through portion 30 in the Y-axis direction corresponds to the pillar portion 26 and the pillar portion 27.

[0047] The connection structure 14 is used to electrically connect the first inductor 11, the second inductor 12, and the wall portion 13 to the terminal electrodes 3, 4, and 6. Additionally, the connection structure 14 also forms a structure for multiple capacitors. The connection structure 14 has multiple plate-shaped internal electrodes. The lower end of the column portion 16, which is connected to the first inductor 11, is directly connected to the internal electrode 41. An internal electrode 42A is provided on the negative side of the internal electrode 41 in the Z-axis direction. An internal electrode 42B is provided on the positive side of the internal electrode 41 in the Z-axis direction. The internal electrode 42A is directly connected to the terminal electrode 3 through a through-hole conductor. The internal electrode 42B is directly connected to the internal electrode 42A through a through-hole conductor.

[0048] The lower end of the post 17, which is connected to the first inductor 11, is directly connected to the internal electrode 43A. An internal electrode 43B is provided on the negative side of the internal electrode 43A in the Z-axis direction. The internal electrode 43B is directly connected to the internal electrode 43A and the terminal electrode 6 via a through-hole conductor. An internal electrode 45A is provided between the internal electrodes 41 and 42B. Additionally, an internal electrode 45B is provided between the internal electrodes 43A and 43B. The internal electrode 45B is directly connected to the internal electrode 45A via a through-hole conductor. Furthermore, the internal electrode 43B is integral with the third conductor pattern 29 extending from the negative side of the wall 13 in the Z-axis direction. Additionally, the internal electrode 43C extends from the first conductor pattern 29 extending from the negative side of the wall 13 in the Z-axis direction. The internal electrode 43C is directly connected to the terminal electrode 4 via a through-hole conductor.

[0049] The lower end of the post portion 21 of the second inductor 12 is directly connected to the internal electrode 44A. The internal electrode 44A is opposite to the internal electrode 43C on the positive side in the Z-axis direction. The lower end of the post portion 22 of the second inductor 12 is directly connected to the internal electrode 44B. The internal electrode 44B is opposite to the internal electrode 44A on the positive side in the Z-axis direction.

[0050] Next, refer to Figures 4-6 The positional relationship between the first inductor 11, the second inductor 12, and the wall portion 13 is described in more detail. Figure 5 This is a schematic diagram of the wall portion 13 as viewed from the X-axis direction. Figure 6 This is a top view of the first inductor 11, the second inductor 12, and the wall 13 viewed from the front side along the Z-axis.

[0051] like Figure 4 As shown, the wall panel component 28 of the wall portion 13 is composed of conductor patterns 29 disposed on each insulating layer 7. Therefore, the conductor patterns 29 are separated from each other in the Z-axis direction and have gaps. However, since the stacked filter 1 is a component that processes high frequencies, the wall panel component 28 is a structure that electromagnetically cuts off the first inductor 11 and the second inductor 12.

[0052] In contrast, in the Z-axis direction, the size of the through portion 30 is larger than the size of a single layer of insulating layer 7. For example... Figure 5 As shown, the size L1 of the through portion 30 in the Z-axis direction is larger than the size of the first inductor 11 and the size of the wiring portion 20 of the second inductor 12. When viewed from the X-axis direction, the through portion 30 is set to overlap with the winding shaft CL2 of the second inductor 12 in terms of position and size. Although there is no particular limitation, the size L1 of the through portion 30 in the Z-axis direction can be set to a range of 0.1 to 0.5 mm.

[0053] When viewed along the X-axis, the wiring portion 20 of the second inductor 12 overlaps with the second portion 32 of the wall portion 13. The entire area of ​​the wiring portion 20 of the second inductor 12 overlaps with the second portion 32 of the wall portion 13. Furthermore, when viewed along the X-axis, the first inductor 11 overlaps with the second portion 32 of the wall portion 13. The entire area of ​​the first inductor 11 overlaps with the second portion 32 of the wall portion 13. The pillar portion 21 of the second inductor 12 is positioned closer to the positive side than the negative end of the wall portion 13 in the Y-axis direction. When viewed along the X-axis, the pillar portion 21 of the second inductor 12 overlaps with the pillar portion 26 of the wall portion 13. When viewed along the X-axis, the pillar portion 22 of the second inductor 12 is positioned near the center of the wall portion 13.

[0054] like Figure 6As shown, the edge 11C of the first inductor 11 is positioned on the negative side of the wall 13 away from the X-axis direction. The wiring portion 20 of the second inductor 12 is positioned on the positive side of the wall 13 away from the X-axis direction. The edge 11C of the first inductor 11 is positioned closer to the wall 13 than the wiring portion 20 of the second inductor 12.

[0055] Next, the function and effect of the stacked filter 1 in this embodiment will be explained.

[0056] In this stacked filter 1, at least the second inductor 12 is a longitudinally wound inductor with a winding shaft CL2 extending in a direction orthogonal to the stacking direction of the multiple insulating layers 7. By using such a longitudinally wound coil, the stacked filter 1 can obtain high-frequency in-band insertion loss characteristics. Furthermore, the stacked filter 1 includes a wall portion 13 disposed between the first inductor 11 and the second inductor 12 and grounded. Therefore, electromagnetic coupling between the first inductor 11 and the second inductor 12 can be suppressed. Here, a through portion 30 is formed in the wall portion 13, extending through the first inductor 11 and the second inductor 12 in their opposing directions. Moreover, in the stacking direction, the size of the through portion 30 is larger than the size of one layer of insulating layers 7. Because the wall portion 13 has a large through portion 30, the magnetic flux of the longitudinally wound inductor, i.e., the second inductor 12, can pass through the through portion 30. Therefore, the magnetic flux of the second inductor 12 can be suppressed, and the Q value can be improved. This improves the performance of the stacked filter 1.

[0057] Terminal electrodes 3, 4, and 6 are formed on one side of the substrate 2 in the stacking direction. The wall portion 13 has a first portion 31 that is closer to the side in the stacking direction than the through portion 30, and a second portion 32 that is closer to the other side in the stacking direction than the through portion 30. In the stacking direction, the first portion 31 can be larger than the second portion 32. Because terminal electrodes 3, 4, and 6 are formed on one side of the substrate 2 in the stacking direction, there are many electrodes. Therefore, by increasing the size of the first portion 31 on one side of the wall portion 13 in the stacking direction, it is possible to suppress the generation of parasitic capacitance between the electrodes on one side and the other side of the wall portion 13.

[0058] The first inductor 11 and the second inductor 12 can be in different frequency bands. In this case, the wall portion 13 can suppress the coupling between inductors in different frequency bands.

[0059] In this invention, one of the first inductor 11 and the second inductor 12 may be a high-frequency inductor and the other may be a mid-frequency inductor. In this case, the technical problem of reduced isolation characteristics in so-called multiplexers can be suppressed.

[0060] Terminal electrodes 3, 4, and 6 are formed on one side of the substrate 2 in the stacking direction. The wall portion 13 has a second portion 32 that is closer to the other side in the stacking direction than the through portion 30. The second inductor 12 has a wiring portion 20 disposed on the other side in the stacking direction. When viewed from the opposite direction, the wiring portion 20 can overlap with the second portion 32. In this case, electromagnetic coupling between the wiring portion 20 of the second inductor 12 and the first inductor 11 can be suppressed.

[0061] Next, refer to Figures 7-12 The embodiments and comparative examples will be described. As Comparative Example 1, for example... Figure 7 As shown, a stacked filter without walls was prepared. As a comparative example 2, as... Figure 8 As shown, a stacked filter with a wall portion 113 without an opening was prepared. Furthermore, the structure other than the wall portion in Comparative Examples 1 and 2 is the same as in the embodiment. Figure 2 The stacked filter shown is an example. The results of measuring the characteristics of these stacked filters are presented in... Figures 9-12 The Chinese side indicated that... Figure 9 (a) represents the measurement results of Comparative Example 1. Figure 9 (b) represents the measurement results of Comparative Example 2. Figure 9 (c) represents the measurement results of the embodiment. Furthermore, Figures 9-11 The vertical axis represents decibels (dB), and the horizontal axis represents frequency (GHz). Figure 9 This indicates the attenuation characteristic of "S31". Figure 10 This indicates the attenuation characteristics of "S41". In Figure 9 (a) and Figure 10 In Comparative Example 1 of (a), the portion enclosed by the dashed line forms a peak, such as... Figure 9 (b) Figure 9 (c) and Figure 10 (b) Figure 10 As shown in (c), no peaks were formed in Comparative Example 2 and the embodiments having wall portions. Additionally, Figure 11 This indicates the isolation characteristic of "S43". For example... Figure 11 of (a), Figure 11 (b) Figure 11 As shown in (c), compared to Comparative Example 1, the isolation characteristics of 2400-2500MHz and 5150-7125MHz were improved in Comparative Example 2 and the embodiment having a wall portion. Figure 12 This represents the simulation results indicating the insertion loss characteristics. For example... Figure 12As shown, Comparative Example 1 exhibits the best insertion loss characteristics; however, as described above, Comparative Example 1 has poor isolation characteristics. In Comparative Example 2, although the isolation characteristics are improved by providing a wall portion, its insertion loss characteristics deteriorate. In contrast, in this embodiment, not only are the isolation characteristics improved, but the deterioration of the insertion loss characteristics is also suppressed.

[0062] The present invention is not limited to the embodiments described above.

[0063] For example, in the above embodiment, one inductor is configured as a flat-wound inductor and the other as a longitudinally wound inductor; however, the configuration can be reversed. Alternatively, both can be longitudinally wound inductors. Furthermore, there is no limitation on the number of inductors; three or more inductors can be used. In this case, walls can be provided between the inductors.

[0064] [Explanation of reference numerals in the attached figures]

[0065] 1. Stacked filter;

[0066] 2 body;

[0067] Terminal electrodes 3, 4, and 6;

[0068] 7. Insulating layer;

[0069] 11. First inductor;

[0070] 12. Second inductor;

[0071] 13. Wall section;

[0072] 20 Wiring section;

[0073] 30 through sections;

[0074] 31 Part One;

[0075] 32 Part Two.

Claims

1. A stacked filter, wherein, have: A base body formed by stacking multiple insulating layers; The first inductor and the second inductor; and A wall portion disposed between the first inductor and the second inductor and grounded. At least the second inductor is a longitudinally wound inductor with a winding shaft extending in a direction orthogonal to the stacking direction of the plurality of insulating layers, and it has a pair of first post portions and a wiring portion, the wiring portion being composed of a first conductor pattern supported at both ends by the pair of first post portions. The wall portion includes a pair of second column portions and wall panel components. The wall panel component is composed of multiple second conductor patterns supported at both ends by the pair of second columns. A through portion is formed in the wall panel component of the wall portion, extending through the first inductor and the second inductor in opposite directions. In the stacking direction, the size of the through portion is larger than the size of one layer of the insulating layer. The second conductor pattern constituting the wall panel component is more numerous than the first conductor pattern of the second inductor.

2. The stacked filter according to claim 1, wherein, A terminal electrode is formed on one side of the substrate in the stacking direction. The wall portion has a first portion that is closer to one side of the through portion in the stacking direction and a second portion that is closer to the other side of the through portion in the stacking direction. In the stacking direction, the first portion is larger than the second portion.

3. The stacked filter according to claim 1, wherein, The first inductor and the second inductor are in different frequency bands.

4. The stacked filter according to any one of claims 1 to 3, wherein, One of the first inductor and the second inductor is a high-frequency inductor, and the other is a mid-frequency inductor.

5. The stacked filter according to any one of claims 1 to 3, wherein, A terminal electrode is formed on one side of the substrate in the stacking direction. The wall portion has a second portion that is closer to the opposite side in the stacking direction than the through portion. The second inductor has the wiring portion disposed on the other side of the stacking direction. When viewed from the relative direction, the wiring portion overlaps with the second portion.

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