Oral hygiene devices and systems

Abstract

The present invention discloses an oral hygiene device and system. The device includes a mainboard, a metal baseboard, a light source, a heat sink, a heat sink cover, a first heat sink, and a second heat sink. The mainboard is provided with a control chip and a control circuit. The metal baseboard has a light source mounting surface, on which the light source is mounted, and is electrically connected to the mainboard. The heat sink contacts the surface of the metal baseboard opposite the light source mounting surface. The heat sink cover contacts the light source mounting surface. The first heat sink and the second heat sink are respectively provided on opposite sides of the mainboard. The device can promptly dissipate heat energy generated by the light source, improving the safety of the device.

Description

Technical Field

[0001] The present invention relates to an oral hygiene device and system, and in particular to a device and system for oral photodynamic therapy. Background Art

[0002] Photodynamic therapy (PDT) is a method of treating diseases using photosensitizing drugs and laser activation. Irradiating the lesion with light of a specific wavelength activates the photosensitizing drug, which selectively accumulates in the affected tissue, triggering a photochemical reaction that destroys the lesion. The photosensitizing drug in PDT transfers energy to the surrounding oxygen, generating highly reactive singlet oxygen. Singlet oxygen can undergo oxidative reactions with nearby biomacromolecules, generating cytotoxicity and killing diseased cells. Compared to traditional therapies, PDT offers the advantage of precise and effective treatment with minimal toxic side effects.

[0003] When using photodynamic therapy for oral sterilization, disinfection, or anti-inflammatory purposes, laser light can cause a significant amount of photosensitizer to enter the dentinal tubules, leading to significant tooth color changes. Furthermore, the heat generated by the laser can cause irreversible damage to the tissue surrounding the lesion.

[0004] CN114796885A discloses a device for root canal sterilization or whitening, comprising a housing, a battery, a control chip, an LED working light source, and a root canal light guide needle. The battery, control chip, and LED working light source are encapsulated inside the housing to form the main body of the device. The housing is provided with a working switch, a treatment time selection button, and a beam selection button, and the working switch, treatment time selection button, and beam selection button are all electrically connected to the control chip. The root canal working tip is mounted on the head of the housing using a mortise and tenon structure. The head structure of the housing includes a connector, and the LED working light source is arranged at the center of the connector, and the LED working light source is electrically connected to the control chip and the battery. The LED working light source generates a large amount of heat when operating for a long time. If this heat is not dissipated in time, it will damage the device and create a safety hazard. In addition, when not in use, the device is usually placed near the treatment chair. If the working switch is accidentally touched, causing the LED light source to operate, it will cause damage to the human eye.

[0005] CN209359898U discloses a toothbrush with an anti-inflammatory function, comprising a brush handle and a brush head with bristles. The brush head has a mounting cavity and several mounting holes connected to the mounting cavity. It also includes a first internal circuit board disposed within the mounting cavity, several anti-inflammatory LED lights mounted on the first internal circuit board, and a light guide mounted within the mounting hole. The light emitted by the anti-inflammatory LED lights is emitted into the user's oral cavity through the light guide. The toothbrush is used for a short time and is not placed where the public can touch it, so heat dissipation and safety issues are generally not a concern. Summary of the Invention

[0006] In view of this, one object of the present invention is to provide an oral hygiene device. This device can promptly dissipate heat energy generated by a light source, thereby improving the safety of the device. Furthermore, when the device is not connected to a working cannula, the light source cannot be activated, preventing damage to the human eye caused by accidental activation of the light source. Another object of the present invention is to provide an oral hygiene system. This system has excellent bactericidal and anti-inflammatory effects and causes minimal damage to teeth and surrounding tissues.

[0007] The above technical objectives are achieved through the following technical solutions.

[0008] In one aspect, the present invention provides an oral hygiene device comprising a main board, a metal base board, a light source, a heat dissipation plate, a heat dissipation cover, a first heat dissipation fin, and a second heat dissipation fin;

[0009] The mainboard is provided with a control chip and a control circuit;

[0010] The metal substrate has a light source mounting surface, the light source is arranged on the light source mounting surface, and the metal substrate is electrically connected to the mainboard;

[0011] The heat dissipation plate is in contact with a surface of the metal substrate opposite to the light source mounting surface;

[0012] The heat dissipation cover is in contact with the light source installation surface;

[0013] The first heat sink and the second heat sink are respectively arranged on two opposite sides of the mainboard.

[0014] The device according to the present invention preferably further comprises a light source sleeve and a working sleeve;

[0015] The metal substrate is provided with a spring, which is configured to control the connection and disconnection between the main board and the light source;

[0016] The heat dissipation cover is provided with an elastic plate opening, and at least a portion of the projection of the elastic plate opening on the plane where the light source installation surface is located coincides with the projection of the elastic plate on the plane where the light source installation surface is located;

[0017] The light source sleeve is sleeved outside the metal base plate, the heat sink and the heat sink cover; the light source sleeve is provided with a light source hole and a spring button, the light source hole is configured to be able to transmit light generated by the light source, and the spring button is configured to be able to trigger the spring under the action of an external force;

[0018] The working sleeve is provided with a working tip connecting hole, which is used to connect with the working tip; the working tip connecting hole is configured to be able to transmit light generated by the light source; when the working sleeve is sleeved on the outer periphery of the light source sleeve, the working sleeve triggers the spring button.

[0019] According to the device of the present invention, preferably, the projection of the light source on the plane where the light source installation surface is located falls within the range of the projection of the light source hole on the plane where the light source installation surface is located;

[0020] When the working sleeve is sleeved on the outer periphery of the light source sleeve, the projection of the light source on the plane where the light source installation surface is located falls within the range of the projection of the working tip connecting hole on the plane where the light source installation surface is located.

[0021] According to the device of the present invention, preferably, the heat sink comprises a heat sink body and a heat sink connecting portion; the heat sink body is configured to be in contact with the surface of the metal substrate opposite to the light source mounting surface; in a direction perpendicular to the light source mounting surface, the thickness of the heat sink connecting portion is greater than the thickness of the heat sink body, so that the heat sink connecting portion forms a protrusion toward the side where the metal substrate is located; and the metal substrate is located on the protrusion formed by the heat sink connecting portion;

[0022] The heat dissipation cover comprises a heat dissipation cover body and a heat dissipation cover connection portion; the heat dissipation cover body is arranged to cover the light source installation surface, and the heat dissipation cover body does not block the light source; the heat dissipation cover connection portion is connected to the heat dissipation plate connection portion.

[0023] According to the device of the present invention, preferably, the light source mounting surface falls within the projection of the heat sink body on the plane where the light source mounting surface is located, or the light source mounting surface coincides with the projection of the heat sink body on the plane where the light source mounting surface is located;

[0024] The light source installation surface falls within the projection of the heat dissipation cover body on the plane where the light source installation surface is located, or the light source installation surface coincides with the projection of the heat dissipation cover body on the plane where the light source installation surface is located.

[0025] According to the device of the present invention, preferably, the first heat sink comprises a first heat sink connecting portion and a first heat sink mainboard accommodating portion; the first heat sink connecting portion is configured to be connected to the heat sink connecting portion; the surface area of ​​the first heat sink is greater than the surface area of ​​the heat sink, and greater than the surface area of ​​the heat sink cover;

[0026] The second heat sink has a second heat sink connecting portion and a second heat sink mainboard accommodating portion; the second heat sink connecting portion is configured to be connected to the heat sink connecting portion; the surface area of ​​the second heat sink is greater than the surface area of ​​the heat sink and greater than the surface area of ​​the heat sink cover;

[0027] The first heat sink mainboard accommodating portion and the second heat sink mainboard accommodating portion are arranged to form a mainboard accommodating cavity, and the mainboard is located in the mainboard accommodating cavity.

[0028] According to the device of the present invention, preferably, the mainboard accommodating cavity comprises a first cavity portion, a second cavity portion and a third cavity portion which are sequentially connected; the first cavity portion is close to the first heat sink connecting portion and the second heat sink connecting portion;

[0029] In the first cavity portion, the distance between the first heat sink and the second heat sink is represented by F; in the second cavity portion, the distance between the first heat sink and the second heat sink is represented by S; in the third front cavity portion, the distance between the first heat sink and the second heat sink is represented by T; S>T≥F.

[0030] According to the device of the present invention, preferably, the light source is configured to emit blue light or red light, and the heat dissipation plate, heat dissipation cover, first heat dissipation fin and second heat dissipation fin are all formed of metal material.

[0031] According to the device of the present invention, preferably, the device further comprises a battery, a charging interface, a housing and a control button;

[0032] The charging interface is electrically connected to the battery, and the charging interface is configured to supply electrical energy to the battery;

[0033] The battery is electrically connected to the mainboard, and the battery is configured to store electrical energy and supply electrical energy to the mainboard;

[0034] The battery, mainboard, first heat sink, second heat sink and at least a portion of the charging port are located in the cavity formed by the housing;

[0035] The charging interface is provided with a power connection end, the housing is provided with a housing opening, and the power connection end is exposed to the outside through the housing opening;

[0036] The control button is arranged on the housing, the control button is connected to the control chip, and the control button is configured to control the lighting and extinguishing of the light source, the lighting time of the light source, and the wavelength of the light emitted by the light source.

[0037] In another aspect, the present invention provides an oral hygiene system comprising the above device and a compound having formula (I):

[0038]

[0039] Wherein, R1, R2, R3, R4, R5, R6 and R7 are independently selected from H or C1-C6 alkyl.

[0040] The device of the present invention is equipped with a heat sink, a heat dissipation cover, a first heat sink, and a second heat sink, which can timely dissipate heat energy generated by the light source, thereby improving the safety of the device. Furthermore, the device of the present invention is equipped with a spring and a matching button, so that the light source cannot be activated when the working sleeve is not connected, preventing accidental activation of the light source and damage to the human eye. When paired with specific compounds, the device of the present invention can achieve effective bactericidal and anti-inflammatory effects, while causing minimal damage to teeth and surrounding tissues. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 It is a schematic diagram of the overall structure of an oral hygiene device of the present invention.

[0042] Figure 2 for Figure 1 An exploded view of the device is shown.

[0043] Figure 3 for Figure 2 An enlarged view of a portion of the structure of the device shown.

[0044] Figure 4 This is an exploded view of the local structure of the working tip and working sleeve.

[0045] The detailed description of the reference numerals is as follows:

[0046] 1- Mainboard; 2- Metal substrate; 201- Light source; 202- First metal substrate connection hole; 203- Second metal substrate connection hole; 204- Spring clip; 3- Heat sink; 301- Heat sink body; 3011- First heat sink connection hole; 3012- Heat sink connection column; 302- Heat sink connection portion; 3021- Second heat sink connection hole; 4- Heat sink cover; 401- Heat sink cover body; 4011- Heat sink connection hole; 4012- Spring clip opening; 402- Heat sink cover connection portion; 5- First heat sink; 501- First heat sink connection column Connecting part; 5011-first heat sink connecting hole; 502-first heat sink mainboard accommodating part; 6-second heat sink; 601-second heat sink connecting part; 6011-second heat sink connecting hole; 602-second heat sink mainboard accommodating part; 7-light source sleeve; 701-light source hole; 702-spring button; 8-working sleeve; 801-working tip connecting hole; 9-battery; 10-charging interface; 11-housing; 12-control button; 131-first cavity part; 132-second cavity part; 133-third cavity part; 14-working tip. DETAILED DESCRIPTION

[0047] The present invention will be further described below with reference to specific embodiments, but the protection scope of the present invention is not limited thereto.

[0048] <Oral Hygiene Device>

[0049] The oral hygiene device of the present invention is primarily used for oral hygiene, such as disinfection, whitening, and treatment. Preferably, the oral hygiene device of the present invention is a device for oral photodynamic therapy. The oral hygiene device of the present invention includes a mainboard, a metal substrate, a light source, a heat sink, a heat sink cover, a first heat sink, and a second heat sink. In some embodiments, the device further includes one or more of a light source sleeve, a working sleeve, a battery, a charging port, a housing, control buttons, and a working tip. This is described in detail below.

[0050] motherboard

[0051] The motherboard of the present invention is configured to control a light source. The motherboard of the present invention can control the on / off state of the light source. The motherboard of the present invention can control the duration of the light source's illumination. The motherboard of the present invention can control the wavelength of the light emitted by the light source. According to one embodiment of the present invention, the motherboard of the present invention can control the on / off state of the light source, the duration of the light source's illumination, and the wavelength of the light emitted by the light source. The motherboard is provided with a control chip and a control circuit. Conventional control chips and control circuits can be used and will not be described in detail here.

[0052] Light source and metal substrate

[0053] The metal substrate is electrically connected to the mainboard. The metal substrate has two oppositely arranged first surfaces and second surfaces, the first surface being the light source mounting surface, and the second surface being the opposite surface of the light source mounting surface. The light source mounting surface is used to mount the light source (first surface). A first metal substrate connecting hole may be provided on the metal substrate. The metal substrate and the heat sink and heat sink cover can be connected through the first metal substrate connecting hole. A second metal substrate connecting hole may also be provided on the metal substrate. The second metal substrate connecting hole is used to fix the heat sink connecting column, thereby fixing the relative position of the heat sink and the metal substrate. Specifically, the heat sink connecting column is located in the second metal substrate connecting hole. The metal substrate may be formed of aluminum.

[0054] The metal substrate may be provided with a spring clip. The spring clip controls the connection and disconnection between the mainboard and the light source. In certain embodiments, the spring clip may be provided near one end of the metal substrate close to the mainboard. The spring clip may be provided on the light source mounting surface.

[0055] The light source is disposed on the light source mounting surface. In certain embodiments, the light source is disposed on an end of the metal substrate away from the mainboard. The light source of the present invention is preferably a light source capable of emitting blue light of 430 to 450 nm and / or red light of 630 to 650 nm. The light source may be an LED light source.

[0056] heat sink

[0057] The heat sink of the present invention is configured to evacuate and conduct the heat generated by the light source. In certain embodiments, the heat sink is configured to evacuate and conduct the heat generated by the light source to the first heat sink. In other embodiments, the heat sink is configured to evacuate and conduct the heat generated by the light source to the first heat sink and the second heat sink. The heat sink is in contact with the surface (second surface) of the metal substrate opposite to the light source mounting surface. Preferably, the heat sink is in contact with the surface of the metal substrate opposite to the light source mounting surface. According to one embodiment of the present invention, the heat sink is connected to or in contact with the heat dissipation cover. In certain embodiments, the heat sink is also connected to or in contact with the first heat sink. In other embodiments, the heat sink is also connected to or in contact with the first heat sink and the second heat sink.

[0058] The heat sink may include a heat sink body and a heat sink connecting portion. The heat sink body and the heat sink connecting portion are connected. The heat sink body and the heat sink connecting portion may be an integral structure.

[0059] The heat sink body is in contact with the surface (second surface) of the metal substrate opposite to the light source mounting surface. The area of ​​the projection of the heat sink body on the plane where the light source mounting surface is located is greater than or equal to the area of ​​the light source mounting surface. In some embodiments, the projection of the heat sink body on the plane where the light source mounting surface is located coincides with the light source mounting surface. A first heat sink connection hole may be provided on the heat sink body. The heat sink can be connected to the metal substrate and the heat dissipation cover through the first heat sink connection hole. A heat sink connection column may be provided on the heat sink body. The heat sink connection column cooperates with the second metal substrate connection hole to fix the relative position of the heat sink and the metal substrate. Specifically, the heat sink connection column is located in the second metal substrate connection hole.

[0060] In a direction perpendicular to the light source mounting surface, the heat sink connection portion has a thickness greater than that of the heat sink body, resulting in a protrusion of the heat sink connection portion toward the side where the metal substrate is located. The heat sink connection portion has a second heat sink connection hole. The second heat sink connection hole is used to connect to the first and second heat sinks. The heat sink connection portion may be provided with a groove. The groove contains a connecting wire for connecting the mainboard and the metal substrate.

[0061] The metal substrate can be arranged on the protrusion formed by the heat sink connecting portion. In some embodiments, the metal substrate abuts against the protrusion formed by the heat sink connecting portion.

[0062] The heat sink is made of metal.

[0063] The heat dissipation plate of the present invention can play a role in preliminary heat dissipation and can transfer heat to the first heat dissipation fin and the second heat dissipation fin, quickly reducing the heat generated by the light source. The heat dissipation plate of the present invention has a compact structure and is compactly integrated with other components, making it easy to insert into the oral cavity for treatment.

[0064] heat sink cover

[0065] The heat dissipation cover of the present invention is configured to dissipate and conduct heat energy generated by the light source. In certain embodiments, the heat dissipation cover is configured to dissipate and conduct heat generated by the light source to a second heat sink. In other embodiments, the heat dissipation cover is configured to dissipate and conduct heat generated by the light source to a first heat sink and a second heat sink. The heat dissipation cover contacts the light source mounting surface (first surface). In certain embodiments, the heat dissipation cover covers the light source mounting surface without obstructing the light source.

[0066] The heat dissipation cover may include a heat dissipation cover body and a heat dissipation cover connecting portion. The heat dissipation cover body and the heat dissipation cover connecting portion are connected to each other. The heat dissipation cover body and the heat dissipation cover connecting portion may be an integral structure.

[0067] The heat dissipation cover body covers the light source mounting surface. The heat dissipation cover body does not block the light source. The area of ​​the projection of the heat dissipation cover body on the plane where the light source mounting surface is located is greater than or equal to the area of ​​the light source mounting surface. In some embodiments, the projection of the heat dissipation cover body on the plane where the light source mounting surface is located coincides with the light source mounting surface. The outer contour of the cross section of the heat dissipation cover body is an outwardly convex arc. "Convex" means convex in the direction away from the metal substrate. This can increase the surface area of ​​the heat dissipation cover body and improve the efficiency of heat conduction and diffusion. Such a heat dissipation cover body has a small volume and is easy to use.

[0068] The heat dissipation cover connection portion is connected to the heat dissipation plate connection portion. The conductive substrate, heat dissipation plate, and heat dissipation cover are connected together through the first conductive substrate connection hole, the first heat dissipation plate connection hole, and the heat dissipation cover connection hole. Specifically, a first fixing screw passes through the first conductive substrate connection hole, the first heat dissipation plate connection hole, and the heat dissipation cover connection hole, thereby connecting the conductive substrate, heat dissipation plate, and heat dissipation cover together. In this way, the conductive substrate is fixed between the heat dissipation cover and the heat dissipation plate.

[0069] The heat sink cover may be provided with an opening for an elastic fragment. The opening for the elastic fragment may be located on the heat sink cover body. The position of the opening for the elastic fragment matches the elastic fragment. Specifically, at least a portion of the projection of the opening for the elastic fragment on the plane where the light source mounting surface is located coincides with the projection of the elastic fragment on the plane where the light source mounting surface is located. In some embodiments, the projection of the opening for the elastic fragment on the plane where the light source mounting surface is located falls within the range of the projection of the elastic fragment on the plane where the light source mounting surface is located. In other embodiments, the projection of the opening for the elastic fragment on the plane where the light source mounting surface is located falls within the middle of the projection of the elastic fragment on the plane where the light source mounting surface is located.

[0070] The heat dissipation cover is formed of metal.

[0071] First heat sink and second heat sink

[0072] The first heat sink and the second heat sink are located on opposite sides of the mainboard. The first heat sink is located on one side of the mainboard, and the second heat sink is located on the other side of the mainboard.

[0073] The surface area of ​​the first heat sink is greater than the surface area of ​​the heat sink plate. The surface area of ​​the first heat sink is greater than the surface area of ​​the heat sink cover. The first heat sink is connected to the mainboard. The first heat sink contacts the heat sink plate and / or the heat sink cover. In certain embodiments, the first heat sink has a first heat sink connection portion and a first heat sink mainboard receiving portion. The first heat sink connection portion is connected to the first heat sink mainboard receiving portion. The first heat sink connection portion and the first heat sink mainboard receiving portion may be an integral structure. The first heat sink may be formed of metal.

[0074] The surface area of ​​the second heat sink is greater than that of the heat sink plate. The surface area of ​​the second heat sink is greater than that of the heat sink cover. The second heat sink is connected to the mainboard. The second heat sink contacts the heat sink plate and / or the heat sink cover. In some embodiments, the second heat sink has a second heat sink connection portion and a second heat sink mainboard accommodating portion. The second heat sink connection portion is connected to the second heat sink mainboard accommodating portion. The second heat sink connection portion and the second heat sink mainboard accommodating portion may be integrally formed. The second heat sink may be formed of metal.

[0075] The first heat sink connection portion is connected to the heat sink and / or the heat sink cover. In some embodiments, the first heat sink connection portion is connected to the heat sink. The first heat sink connection portion may be provided with a first heat sink connection hole.

[0076] The second heat sink connection portion is connected to the heat sink and / or the heat sink cover. In some embodiments, the second heat sink connection portion is connected to the heat sink. The second heat sink connection portion may be provided with a second heat sink connection hole.

[0077] According to one embodiment of the present invention, the first heat sink and the second heat sink are respectively located on both sides of the heat sink, and the second fixing screw passes through the first heat sink connection hole, the second heat sink connection hole and the second heat sink connection hole, thereby fixing the first heat sink, the second heat sink and the heat sink.

[0078] The first heat sink mainboard receiving portion and the second heat sink mainboard receiving portion form a mainboard receiving cavity. The mainboard receiving portion of the first heat sink and the mainboard receiving portion of the second heat sink are arranged opposite each other. The mainboard receiving cavity can accommodate a mainboard. The mainboard can be fixedly connected to the upper mainboard receiving portion and the lower mainboard receiving portion.

[0079] The mainboard accommodating cavity has a first cavity portion, a second cavity portion and a third cavity portion which are connected in sequence. The first cavity portion is close to the first heat sink connecting portion and the second heat sink connecting portion. In the first cavity portion, the distance between the first heat sink and the second heat sink is represented by F; in the second cavity portion, the distance between the first heat sink and the second heat sink is represented by S; in the third front cavity portion, the distance between the first heat sink and the second heat sink is represented by T; S>T≥F. In some embodiments, S>T>F. This can improve the efficiency of heat conduction. The first heat sink located in the second cavity portion protrudes away from the mainboard. The second heat sink located in the second cavity portion protrudes away from the mainboard. This is convenient for users to hold and can also increase the surface area of ​​the heat sink, thereby improving the efficiency of heat conduction.

[0080] Light source sleeve

[0081] The light source sleeve is sleeved outside the metal base plate, the heat dissipation plate and the heat dissipation cover.

[0082] The light source sleeve is provided with a light source hole. Light generated by the light source can pass through the light source hole. The area of ​​the projection of the light source hole on the plane where the light source mounting surface is located is larger than the area of ​​the projection of the light source on the plane where the light source mounting surface is located. Preferably, the projection of the light source on the plane where the light source mounting surface is located falls within the range of the projection of the light source hole on the plane where the light source mounting surface is located. Preferably, the projection of the light source on the light source mounting surface is located in the middle of the projection of the light source hole on the light source mounting surface.

[0083] A spring button is provided on the light source sleeve. The spring button is configured to activate the spring when an external force is applied. In certain embodiments, at least a portion of the spring button is provided on the outer surface of the light source sleeve and protrudes outward from the sleeve. The spring button can move in the direction of the spring when an external force is applied. The projection of the spring button on the plane of the light source mounting surface falls within the projection of the spring opening on the plane of the light source mounting surface. The spring button activates the spring through the spring opening, thereby compressing the spring and connecting the mainboard and the light source.

[0084] Working casing

[0085] The working sleeve of the present invention is provided with a working tip connecting hole. The working tip connecting hole is connected to the working tip. The light generated by the light source can pass through the working tip connecting hole. The area of ​​the projection of the working tip connecting hole on the plane where the light source mounting surface is located is greater than or equal to the area of ​​the projection of the light source on the plane where the light source mounting surface is located. When the working sleeve is sleeved on the outer periphery of the light source sleeve, the projection of the light source on the plane where the light source mounting surface is located falls within the projection range of the working tip connecting hole on the plane where the light source mounting surface is located. Due to the squeezing effect of the working sleeve on the spring button, the spring button moves toward the spring, thereby compressing the spring, so that the light source is connected to the mainboard.

[0086] The working sleeve can be connected to the housing. The connection method between the working sleeve and the housing is not limited, and can be a conventional connection method in the art, such as a snap connection or a mortise and tenon connection.

[0087] Battery and charging port

[0088] The battery of the present invention is electrically connected to the mainboard, stores electrical energy and supplies electrical energy to the mainboard.

[0089] The charging interface is electrically connected to the battery. The charging interface supplies electrical energy to the battery. The charging interface has a power connection terminal that is connected to an external power source.

[0090] Housing and control buttons

[0091] The battery, the mainboard, the first heat sink, the second heat sink and at least a portion of the charging interface are located in a cavity formed by the housing. The housing is provided with a housing opening, which exposes the power connection end to the outside.

[0092] The control button is arranged on the housing and is connected to the control chip. The control button can control the lighting and extinguishing of the light source, the lighting time of the light source and / or the wavelength of the light emitted by the light source.

[0093] Working tip

[0094] The working tip is connected to the working tip connection hole. The working tip focuses the light source through the working tip connection hole on the treatment area. The shape of the working tip can be determined based on the shape suitable for the treatment area. For example, the working tip can be conical or cylindrical.

[0095] <Oral Hygiene System>

[0096] The oral hygiene system of the present invention comprises an oral hygiene device and a compound having formula (I):

[0097]

[0098] The oral hygiene device is specifically described above and will not be described in detail here.

[0099] In formula (I), R1, R2, R3, R4, R5, R6, and R7 are independently selected from H or a C1-C6 alkyl group. Preferably, R1, R2, R3, R4, R5, R6, and R7 are independently selected from H or a C1-C3 alkyl group. Examples of C1-C6 alkyl groups include, but are not limited to, methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, tert-butyl, n-pentyl, isopentyl, neopentyl, n-hexyl, and the like. In certain embodiments, R1, R6, and R7 are each methyl, and R2, R3, R4, and R5 are each H.

[0100] According to one embodiment of the present invention, the compound has the structure shown below:

[0101]

[0102] Such compounds can achieve better bactericidal and anti-inflammatory effects when combined with the device of the present invention.

[0103] Example 1

[0104] like Figure 1 and Figure 2 As shown, the oral hygiene device of the present invention is a device for oral photodynamic therapy, which includes a main board 1, a metal base plate 2, a light source 201, a heat sink 3, a heat sink cover 4, a first heat sink 5, a second heat sink 6, a light source sleeve 7, a working sleeve 8, a battery 9, a charging interface 10, a shell 11 and a control button 12.

[0105] The mainboard 1 is provided with a control chip and a control circuit. The mainboard 1 controls the light source 201. The light source 201 can be an LED light source.

[0106] The metal substrate 2 is electrically connected to the mainboard 1. The metal substrate 2 has a light source mounting surface. The light source 201 is located on the light source bulk surface. The light source 201 is arranged at an end of the metal substrate 2 away from the mainboard 1.

[0107] like Figure 3 As shown, the metal substrate 2 is provided with a first metal substrate connection hole 202 and a second metal substrate connection hole 203 near the light source 201. The metal substrate 2 can be formed of aluminum. The light source 201 can emit blue light and red light.

[0108] In some embodiments, the heat dissipation plate 3 dissipates the heat generated by the light source 201 and conducts it to the first heat sink 5 and the second heat sink 6 .

[0109] like Figure 3 As shown, the heat sink 3 includes a heat sink body 301 and a heat sink connecting portion 302. The heat sink body 301 and the heat sink connecting portion 302 are connected. The heat sink body 301 and the heat sink connecting portion 302 can be an integral structure.

[0110] like Figure 3 As shown, the heat sink body 301 is bonded to the surface of the metal substrate 2 opposite the light source mounting surface. The light source mounting surface coincides with the projection of the heat sink body 301 onto the same plane as the light source mounting surface. The heat sink body 301 is provided with a first heat sink connection hole 3011 and a heat sink connection post 3012. The heat sink connection post 3012 is positioned in the second metal substrate connection hole 203, thereby fixing the relative position of the heat sink 3 and the metal substrate 2.

[0111] like Figure 3 As shown, in a direction perpendicular to the light source mounting surface, the thickness of the heat sink connection portion 302 is greater than the thickness of the heat sink body 301, thereby forming a protrusion on the side where the metal substrate 2 is located. The metal substrate 2 can be mounted on the protrusion formed by the heat sink connection portion 302. The heat sink connection portion 302 has a second heat sink connection hole 3021.

[0112] The heat sink 3 is made of metal.

[0113] In some embodiments, the heat dissipation cover 4 dissipates the heat generated by the light source 201 and conducts it to the first heat dissipation fin 5 and the second heat dissipation fin 6 .

[0114] like Figure 3 As shown, the heat dissipation cover 4 comprises a heat dissipation cover body 401 and a heat dissipation cover connecting portion 402. The heat dissipation cover body 401 and the heat dissipation cover connecting portion 402 are connected. The heat dissipation cover body 401 and the heat dissipation cover connecting portion 402 may be an integral structure.

[0115] The heat dissipation cover body 401 can cover the light source installation surface without blocking the light source 201. The light source installation surface falls within the projection range of the heat dissipation cover body 401 on the plane where the light source installation surface is located. The heat dissipation cover body 401 is provided with a heat dissipation cover connection hole 4011.

[0116] The heat dissipation cover connection portion 402 is connected to the heat dissipation plate connection portion 302. The metal base plate 2, heat dissipation plate 3, and heat dissipation cover 4 are connected together through the first metal base plate connection holes 202, the first heat dissipation plate connection holes 3011, and the heat dissipation cover connection holes 4011. Specifically, the first fixing screw passes through the first metal base plate connection holes 202, the first heat dissipation plate connection holes 3011, and the heat dissipation cover connection holes 4011, thereby connecting the metal base plate 2, heat dissipation plate 3, and heat dissipation cover 4 together. In this way, the metal base plate 2 is fixed between the heat dissipation cover 4 and the heat dissipation plate 3.

[0117] like Figure 3 As shown, the first heat sink 5 is located on one side of the mainboard 1. The surface area of ​​the first heat sink 5 is greater than that of the heat sink 3 and greater than that of the heat sink cover 4. In certain embodiments, the first heat sink 5 dissipates heat conducted from the heat sink 3 and the heat sink cover 4. The first heat sink 5 has a first heat sink connecting portion 501 and a first heat sink mainboard receiving portion 502. The first heat sink connecting portion 501 and the first heat sink mainboard receiving portion 502 are connected. The first heat sink connecting portion 501 and the first heat sink mainboard receiving portion 502 can be an integral structure.

[0118] The second heat sink 6 is located on the other side of the mainboard 1. The surface area of ​​the second heat sink 6 is greater than the surface area of ​​the heat sink 3 and greater than the surface area of ​​the heat sink cover 4. The first heat sink 5 and the second heat sink 6 are located on opposite sides of the mainboard 1. In certain embodiments, the second heat sink 6 dissipates heat conducted from the heat sink 3 and the heat sink cover 4. The second heat sink 6 has a second heat sink connecting portion 601 and a second heat sink mainboard receiving portion 602. The second heat sink connecting portion 601 and the second heat sink mainboard receiving portion 602 are connected. The second heat sink connecting portion 601 and the second heat sink mainboard receiving portion 602 can be an integral structure.

[0119] The first heat sink connection portion 501 has a first heat sink connection hole 5011. The second heat sink connection portion 601 has a second heat sink connection hole 6011. The heat sink 3, the first heat sink 5, and the second heat sink 6 are connected via the first heat sink connection hole 5011, the second heat sink connection hole 6011, and the second heat sink connection hole 3021. Specifically, the first heat sink 5 and the second heat sink 6 are located on either side of the heat sink 3, respectively. The second fixing screws pass through the first heat sink connection hole 5011, the second heat sink connection hole 6011, and the second heat sink connection hole 3021, thereby connecting the first heat sink 5 and the second heat sink 6 to the heat sink 3.

[0120] The first heat sink mainboard receiving portion 502 and the second heat sink mainboard receiving portion 602 are arranged opposite to each other, forming a mainboard receiving cavity. The mainboard 1 is located in the mainboard receiving cavity. The mainboard 1 is fixedly connected to the first heat sink mainboard receiving portion 502 and the second heat sink mainboard receiving portion 602.

[0121] The motherboard housing cavity comprises a first cavity portion 131, a second cavity portion 132, and a third cavity portion 133, which are interconnected in sequence. The first cavity portion 131 is adjacent to the first heat sink connection portion 501 and the second heat sink connection portion 601. In the first cavity portion 131, the distance between the first heat sink 5 and the second heat sink 6 is represented by F; in the second cavity portion 132, the distance between the first heat sink 5 and the second heat sink 6 is represented by S; and in the third front cavity portion 133, the distance between the first heat sink 5 and the second heat sink 6 is represented by T; S>T>F.

[0122] The first heat sink 5 and the second heat sink 6 are both formed of metal.

[0123] A spring 204 is provided near one end of the metal substrate 2 close to the mainboard 1. The spring 204 is located on the light source mounting surface and controls the connection and disconnection between the mainboard 1 and the light source 201.

[0124] like Figure 3As shown, a spring opening 4012 is provided at the location where the heat sink body 401 mates with the spring 204. The projection of the spring opening 4012 on the plane where the light source mounting surface is located at least partially overlaps with the projection of the spring 204 on the plane where the light source mounting surface is located. In some embodiments, the projection of the spring opening 4012 on the plane where the light source mounting surface is located falls within the range of the projection of the spring 204 on the plane where the light source mounting surface is located.

[0125] like Figure 2 As shown, the light source sleeve 7 is sleeved outside the metal base plate 2, the heat dissipation plate 3 and the heat dissipation cover 4. The light source sleeve 7 is provided with a light source hole 701 and a spring button 702.

[0126] Light generated by light source 201 can pass through light source hole 701. The area of ​​the projection of light source hole 701 on the plane where the light source mounting surface is located is larger than the area of ​​the projection of light source 201 on the plane where the light source mounting surface is located. In some embodiments, the center of the projection of light source hole 701 on the plane where the light source mounting surface is located coincides with the center of the projection of light source 201 on the plane where the light source mounting surface is located.

[0127] At least a portion of the spring button 702 is disposed on the outer surface of the light source sleeve 7 and protrudes outward from the light source sleeve 7. Under the action of force, the spring button 702 can move toward the spring plate 204. The projection of the spring button 702 on the plane of the light source mounting surface falls within the projection of the spring opening 4012 on the plane of the light source mounting surface. The spring button 702 triggers the spring plate 204 through the spring opening 4012, thereby compressing the spring plate 204 and establishing communication between the mainboard 1 and the light source 201.

[0128] The working sleeve 8 is provided with a working tip connection hole 801. The working tip connection hole 801 is connected to the working tip. The light generated by the light source 201 passes through the working tip connection hole 801. The projected area of ​​the working tip connection hole 801 on the plane where the light source mounting surface is located is larger than the projected area of ​​the light source 201 on the plane where the light source mounting surface is located. When the working sleeve 8 is sleeved on the outer periphery of the light source sleeve 7, the projection of the light source 201 on the plane where the light source mounting surface is located falls within the projection range of the working tip connection hole 801 on the plane where the light source mounting surface is located; and due to the squeezing effect of the working sleeve 8 on the spring button 702, the spring button 702 moves toward the spring 204, thereby compressing the spring 204, so that the light source 201 is connected to the main board 1.

[0129] like Figure 2 As shown, the battery 9 is electrically connected to the mainboard 1. The battery 9 stores electrical energy and supplies electrical energy to the mainboard 1.

[0130] The charging interface 10 is electrically connected to the battery 9. The charging interface 10 supplies power to the battery 9. The charging interface 10 has a power connection terminal, which is connected to an external power source.

[0131] The battery 9, the mainboard 1, the first heat sink 5, the second heat sink 6 and the charging port 10 are located in a cavity formed by the housing 11. The housing 11 is provided with a housing opening, which exposes the power connection end to the outside.

[0132] The control button 12 is provided on the housing 11 and is connected to the control chip. The control button 12 controls the lighting and extinguishing of the light source 201, the lighting time of the light source 201 and the wavelength of the light emitted by the light source 201.

[0133] Example 2

[0134] Except for the following structure, the rest is the same as Example 1:

[0135] The oral hygiene device of this embodiment further comprises a working tip 14. Figure 4 As shown, the working tip 14 is connected to the working tip connecting hole 801. The working tip 14 concentrates the light source emitted through the working tip connecting hole 801 on the part to be treated.

[0136] Example 3

[0137] The oral hygiene system of this embodiment includes the device of Example 2 and a compound having the following chemical structure:

[0138]

[0139] The aforementioned compounds, when combined with the red or blue light emitted by the device of the present invention, can stimulate singlet oxygen, achieving a potent bactericidal and anti-inflammatory effect. Furthermore, the red and blue light emitted by the device of the present invention has lower power than lasers, resulting in less damage to the tooth and surrounding tissue.

[0140] The present invention is not limited to the above-mentioned embodiments. Any modification, improvement, or substitution that can be conceived by those skilled in the art without departing from the essential content of the present invention shall fall within the scope of the present invention.

Claims

1. An oral hygiene device, characterized in that It includes a mainboard, a metal base plate, a light source, a heat dissipation plate, a heat dissipation cover, a first heat dissipation fin and a second heat dissipation fin; The mainboard is provided with a control chip and a control circuit; The metal substrate has a light source mounting surface, the light source is arranged on the light source mounting surface, and the metal substrate is electrically connected to the mainboard; The heat dissipation plate is in contact with a surface of the metal substrate opposite to the light source mounting surface; The heat dissipation cover is in contact with the light source installation surface; The first heat sink and the second heat sink are respectively arranged on two opposite sides of the mainboard; It also includes a light source sleeve and a working sleeve; The metal substrate is provided with a spring, which is configured to control the connection and disconnection between the main board and the light source; The heat dissipation cover is provided with an elastic plate opening, and at least a portion of the projection of the elastic plate opening on the plane where the light source installation surface is located coincides with the projection of the elastic plate on the plane where the light source installation surface is located; The light source sleeve is sleeved outside the metal base plate, the heat sink and the heat sink cover; the light source sleeve is provided with a light source hole and a spring button, the light source hole is configured to be able to transmit light generated by the light source, and the spring button is configured to be able to trigger the spring under the action of an external force; The working sleeve is provided with a working tip connecting hole, which is used to connect with the working tip; the working tip connecting hole is configured to be able to transmit light generated by the light source; when the working sleeve is sleeved on the outer periphery of the light source sleeve, the working sleeve triggers the spring button.

2. The device according to claim 1, characterized in that The projection of the light source on the plane where the light source installation surface is located falls within the range of the projection of the light source hole on the plane where the light source installation surface is located; When the working sleeve is sleeved on the outer periphery of the light source sleeve, the projection of the light source on the plane where the light source installation surface is located falls within the range of the projection of the working tip connecting hole on the plane where the light source installation surface is located.

3. The device according to claim 1, characterized in that The heat sink comprises a heat sink body and a heat sink connecting portion; the heat sink body is configured to fit the surface of the metal substrate opposite to the light source mounting surface; in a direction perpendicular to the light source mounting surface, the heat sink connecting portion has a thickness greater than that of the heat sink body, thereby forming a protrusion on the side where the metal substrate is located; the metal substrate is located on the protrusion formed by the heat sink connecting portion; The heat dissipation cover comprises a heat dissipation cover body and a heat dissipation cover connection portion; the heat dissipation cover body is arranged to cover the light source installation surface, and the heat dissipation cover body does not block the light source; the heat dissipation cover connection portion is connected to the heat dissipation plate connection portion.

4. The device according to claim 3, characterized in that The light source mounting surface falls within the projection of the heat sink body on the plane where the light source mounting surface is located, or the light source mounting surface coincides with the projection of the heat sink body on the plane where the light source mounting surface is located; The light source installation surface falls within the projection of the heat dissipation cover body on the plane where the light source installation surface is located, or the light source installation surface coincides with the projection of the heat dissipation cover body on the plane where the light source installation surface is located.

5. The device according to claim 3, characterized in that The first heat sink has a first heat sink connecting portion and a first heat sink mainboard accommodating portion; the first heat sink connecting portion is configured to be connected to the heat sink connecting portion; the surface area of ​​the first heat sink is greater than the surface area of ​​the heat sink and greater than the surface area of ​​the heat sink cover; The second heat sink has a second heat sink connecting portion and a second heat sink mainboard accommodating portion; the second heat sink connecting portion is configured to be connected to the heat sink connecting portion; the surface area of ​​the second heat sink is greater than the surface area of ​​the heat sink and greater than the surface area of ​​the heat sink cover; The first heat sink mainboard accommodating portion and the second heat sink mainboard accommodating portion are arranged to form a mainboard accommodating cavity, and the mainboard is located in the mainboard accommodating cavity.

6. The device according to claim 5, characterized in that The mainboard accommodating cavity comprises a first cavity portion, a second cavity portion and a third cavity portion which are sequentially connected; the first cavity portion is close to the first heat sink connecting portion and the second heat sink connecting portion; In the first cavity, the distance between the first heat sink and the second heat sink is represented by F; in the second cavity, the distance between the first heat sink and the second heat sink is represented by S; In the third front cavity portion, the distance between the first heat sink and the second heat sink is represented by T; S>T≥F.

7. The device according to claim 1, characterized in that The light source is configured to emit blue light or red light, and the heat dissipation plate, heat dissipation cover, first heat dissipation fin and second heat dissipation fin are all formed of metal materials.

8. The device according to any one of claims 1 to 7, characterized in that: The device also includes a battery, a charging port, a housing, and control buttons; The charging interface is electrically connected to the battery, and the charging interface is configured to supply electrical energy to the battery; The battery is electrically connected to the mainboard, and the battery is configured to store electrical energy and supply electrical energy to the mainboard; The battery, mainboard, first heat sink, second heat sink and at least a portion of the charging port are located in the cavity formed by the housing; The charging interface is provided with a power connection end, the housing is provided with a housing opening, and the power connection end is exposed to the outside through the housing opening; The control button is arranged on the housing, the control button is connected to the control chip, and the control button is configured to control the lighting and extinguishing of the light source, the lighting time of the light source, and the wavelength of the light emitted by the light source.

9. An oral hygiene system, characterized in that The system comprises the device according to any one of claims 1 to 8 and a compound represented by formula (I): Wherein, R1, R2, R3, R4, R5, R6 and R7 are independently selected from H or C1-C6 alkyl.

Images