Anti-overflow glue low-pressure injection molding lower mold and mold

Abstract

The application provides a glue-overflow-preventing low-pressure injection molding lower mold, which comprises a lower mold plate and a lower mold cavity arranged on the lower mold plate, and further comprises a glue sealing structure, wherein the glue sealing structure comprises a fixing base and a glue sealing plate; the fixing base is fixed on the lower mold plate and is provided with a main runner and a branch runner; the glue sealing plate is movably arranged between the fixing base and the lower mold cavity; the glue sealing plate is provided with a supporting plate, one side of the supporting plate extends into the branch runner on the fixing base, and the other side of the supporting plate extends into the lower mold cavity and abuts against a placed PCB plate; and a mold comprising the lower mold is provided. Since the movable glue sealing plate is adopted, the PCB is convenient to place, the glue sealing plate is tightly combined with the bottom edge of the PCB plate, the size tolerance of the bottom edge of the PCB plate is effectively compensated, and the glue overflow at the edge of the PCB plate is prevented.

Description

TECHNICAL FIELD

[0001] The application relates to an injection molding lower mold and a mold, in particular to a glue-overflow-preventing low-pressure injection molding lower mold and a mold. BACKGROUND

[0002] As an initiating device, a detonator is widely used in industry and military. In the 1980s, human beings began to research electronic detonators, and the electronic detonator has achieved rapid development since the 1990s. The electronic detonator uses electronic components to replace the delay composition in the traditional detonator, thereby improving the safety of the detonator. Up to now, the electronic detonator still occupies a certain position in the market.

[0003] The existing electronic detonator comprises a circuit delay module which is completed by packaging a circuit board and various components. In order to improve the protection of the internal circuit and components, a low-pressure injection molding mode is generally adopted to reduce the damage to the product during the injection molding process. However, the existing electronic product is placed in the mold cavity of the lower mold in the low-pressure injection molding mold disclosed in CN213675281U, and pouring is performed, thereby solving the problem of encapsulation injection molding of the electronic product. However, after the PCB board is cut, the tolerance of the width of the bottom edge is large, and manual grinding is required. At the same time, after the PCB board is placed in the mold, there will be a certain gap between the edge of the PCB board and the mold. Therefore, after injection molding, the plastic is easy to overflow from the gap, and it is difficult to remove the excess glue, especially the manpower and material resources need to be invested to solve the problem, which is time-consuming and laborious, and undoubtedly increases the production cost of the factory.

[0004] It is urgent to solve the problem of glue overflow during the injection molding process. SUMMARY

[0005] The application provides a glue-overflow-preventing low-pressure injection molding lower mold to solve the above technical problems. The glue-overflow-preventing low-pressure injection molding lower mold comprises a lower mold plate and a lower mold cavity arranged on the lower mold plate. The lower mold further comprises a glue sealing structure. The glue sealing structure comprises a fixing seat and a glue sealing plate. The fixing seat is fixed on the lower mold plate. The fixing seat is provided with a main flow channel and a branch flow channel. The glue sealing plate is movably arranged between the fixing seat and the lower mold cavity. The glue sealing plate is provided with a support plate. One side of the support plate extends into the branch flow channel on the fixing seat, and the other side of the support plate extends into the lower mold cavity and abuts against the placed PCB board.

[0006] The glue sealing structure further comprises a biasing member. The biasing member is connected to the fixing seat and the glue sealing plate. The biasing member always biases the glue sealing plate to move in the direction of the lower mold cavity.

[0007] The biasing member is a compression spring. One end of the compression spring is arranged in a spring hole on the fixing seat, and the other end of the compression spring abuts against the glue sealing plate.

[0008] The lower mold comprises two symmetrical lower mold cavities. The glue sealing structure is located between the two lower mold cavities.

[0009] The glue sealing plate is movably installed on the fixing base.

[0010] The fixing base is provided with a positioning hole, and the lower mold plate is provided with a positioning pin installed in the positioning hole.

[0011] The lower mold further comprises a bolt, the fixing base is provided with a bolt hole, and the fixing base is fixed to the lower mold plate through the bolt.

[0012] The glue sealing structure further comprises a guide pin installed on the fixing base, and the glue sealing plate is provided with a guide pin hole matched with the guide pin.

[0013] The biasing member is a compression spring installed in a spring hole of the fixing base and abutting against the glue sealing plate at two ends.

[0014] The anti-glue-overflow low-pressure injection mold further comprises an upper mold, an upper mold base and a pouring gate, the upper mold is fixed below the upper mold base, the lower mold is below the upper mold, the upper mold is provided with an upper mold cavity, the lower mold is provided with a lower mold cavity, the upper mold cavity and the lower mold cavity are matched with each other, the upper mold and the lower mold are provided with a main runner and a branch runner, the pouring gate is arranged on the upper mold base, and the pouring gate is communicated with the main runner.

[0015] The anti-glue-overflow low-pressure injection lower mold and the mold thereof have the movable glue sealing plate, the PCB is placed conveniently, the size tolerance of the bottom edge of the PCB is effectively compensated, one side of the glue sealing plate is abutted against the PCB, the overflow glue after the movement of the glue sealing plate can be transferred to the main runner, the overflow glue outside the runner is avoided, and the overflow glue at the edge of the PCB is prevented. BRIEF DESCRIPTION OF DRAWINGS

[0016] The specific embodiment of the present application is further described in detail below with reference to the drawings.

[0017] Figure 1 The overall perspective view of the mold of the present application;

[0018] Figure 2 The perspective view of the upper mold;

[0019] Figure 3 The perspective view of the glue sealing structure;

[0020] Figure 4 The top view of the glue sealing structure;

[0021] Figure 5 , Figure 2 The partial enlarged view;

[0022] Figure 6A partial cross-sectional view of the lower mold after casting.

[0023] 1. Upper mold base; 2. Upper mold; 3. Lower mold; 4. Backing plate; 5. Sprue; 6. Support plate; 7. Bolt; 8. Locating pin; 9. Compression spring; 10. Guide pin; 11. Lower mold base; 12. Demolding mechanism; 13. PCB board; 31. Lower mold plate; 32. Fixing base; 33. Rear sealing plate; 34. Front sealing plate; 35. Lower mold cavity; 320. Runner; 321. Locating hole; 322. Bolt hole; 323. Main runner; 324. Sub-runner; 325. Guide pin hole mounting hole; 326. Spring hole; 331. Support plate; 335. Guide pin hole. Detailed Implementation

[0024] It should be noted that the terms "up," "down," "left," "right," "front," and "back" used in this document are merely for ease of explanation based on the placement of the accompanying drawings and are not intended to limit the scope of this invention.

[0025] like Figures 1 to 6 As shown, a low-pressure injection mold for preventing glue overflow includes an upper mold base 1, an upper mold 2 fixed below the upper mold base 1, and a lower mold 3 located below the upper mold 2. The lower mold 3 has a lower mold cavity 35, and the upper mold 3 has an upper mold cavity. The upper mold cavity and the lower mold cavity 35 cooperate to form a product cavity, facilitating the formation of the final product after casting. The lower mold 3 is installed above a backing plate 4, and support plates 6 are provided on both sides below the backing plate 4. The left and right support plates can be symmetrically arranged. A demolding mechanism 12 is provided between the left and right support plates to facilitate product demolding. The left and right support plates and the demolding mechanism 12 are both located on the lower mold base 11. A flow channel 320 is provided between the upper mold 2 and the lower mold 3. The flow channel 320 has a cavity structure. Figure 6 The part shown is a cross-sectional schematic diagram of the solidified solid after the liquid flows through the runner 320. The runner 320 is divided into a main runner and a branch runner. The upper mold base 1 is provided with a sprue 5, which is connected to the main runner of the runner 320 and is used to pour liquid. The liquid enters the main runner through the sprue 5 and then enters the branch runner connected to the main runner. Finally, it enters the product cavity through the sprue, thus completing the sealing injection molding of the product.

[0026] The lower mold 3 comprises a lower mold plate 31, and a lower mold cavity 35 and a sealing structure for forming a cast product are arranged on the lower mold plate 31. The sealing structure comprises a fixed seat 32 fixed on the lower mold plate 31 of the lower mold 3. The fixed seat 32 is provided with a main runner 323 and a branch runner 324. The sealing structure further comprises a sealing plate movably arranged between the fixed seat 32 and the lower mold cavity 35. The sealing plate is provided with an extended supporting plate 331. One side of the supporting plate 331 extends into the branch runner 324 on the fixed seat 32, and the supporting plate 331 is completely attached to the surface of the branch runner 324. The other side of the supporting plate 331 extends into the lower mold cavity 35. Since the sealing plate is movable relative to the fixed seat 32 and the lower mold cavity, when the PCB board 13 is placed, the sealing plate is pushed to move towards the fixed seat 32, and the sealing plate is smoothly placed. When the sealing plate is placed, the edge of the supporting plate 331 of the sealing plate abuts against the edge of the PCB board 13, forming a seamless connection, preventing liquid from leaking at the edge of the PCB board 13, and solidifying on the edge of the PCB board, thereby causing difficulty in processing the finished product.

[0027] The lower mold cavity 35 can be provided with one product cavity, and preferably a plurality of product cavities are arranged in parallel. Since the electronic sealing member of the detonator is small, in order to improve the production efficiency of the product, the lower mold cavity 35 is provided with two left-right symmetrical product cavities. A recess is arranged in the middle of the lower mold plate 31, and the lower mold cavity 35 is left-right symmetrical relative to the recess. The fixed seat 32 is installed in the recess of the lower mold plate 31 of the lower mold 3, and the two ends of the fixed seat 32 are provided with bolt holes 322. Corresponding threaded holes are arranged on the lower mold plate 31, and the fixed seat 32 is fixed on the lower mold plate 31 by the bolt 7. In order to facilitate the installation and positioning of the fixed seat 32, the fixed seat 32 is further provided with a positioning hole 321, and a positioning pin mounting hole is arranged at the corresponding position of the lower mold plate 31. The positioning pin 8 is installed on the lower mold plate 31, and then the fixed seat 32 is positioned at the fixed position of the fixed seat 32 by cooperating the positioning hole 321 with the positioning pin 8, and then the bolt 7 is tightly fixed. When the lower mold cavity 35 is arranged in a symmetrical form, the sealing plate also comprises two symmetrical sealing plates, i.e. the front sealing plate 34 and the rear sealing plate 33, and the two sealing plates are movably arranged between the fixed seat 32 and the lower mold cavity 35. Since the liquid flows from the main runner 323 to the branch runner 324 and then enters the product cavity, the fluid can flow the sealing plate to the lower mold cavity, and further abut against the placed PCB board. In order to facilitate the supporting plate on the other side of the sealing plate extending into the mold cavity to better abut against the PCB board and prevent glue overflow, the sealing structure is further provided with a biasing structure. The biasing structure can be selected to be connected to one side of the sealing plate and connected to the other side of the fixed seat 32. The biasing structure always biases the sealing plate towards the lower mold cavity 35. The biasing structure can be selected to be a compression spring 9. In another way, the fixed seat 32 is transversely provided with a spring hole 326, the compression spring 9 is arranged in the spring hole 326 of the fixed seat 32, and the two ends of the compression spring 9 extend out of the fixed seat to press against the side surface of the sealing plate. At the same time, the biasing structure always biases the two sealing plates towards the two lower mold cavities 35.

[0028] In order to make the sealing plate position relatively stable in the distribution channel 324 and facilitate installation, the fixed seat 32 is provided with a guide pin mounting hole 325 parallel to the spring hole 326, and the sealing plate on both sides is provided with a corresponding guide pin hole 335. The guide pin 10 is first installed in the guide pin mounting hole 325, and then the guide pin hole 335 of the sealing plate is installed on the guide pin 10. The diameter of the guide pin hole 335 is greater than the diameter of the guide pin 10, which facilitates the movement of the sealing plate between the fixed seat 32 and the lower mold cavity 35.

[0029] Specific production operation, the sealing plate is actuated, the compression spring 9 is compressed, the PCB board is put into the fixed positioning pin, the compression spring 9 is rebounded, the sealing plate moves to the direction of the lower mold cavity 35, the support plate 331 abuts to the PCB edge, and then the conventional mold closing, pouring, cooling, demolding and other conventional operations are carried out, and the electronic product packaging injection molding is completed.

Claims

1. A glue overflow prevention low pressure injection molding lower mold, comprising a lower mold plate and a lower mold cavity arranged on the lower mold plate, characterized in that, The lower mold further comprises a glue sealing structure, the glue sealing structure comprises a fixing base and a glue sealing plate, the fixing base is fixed on the lower mold plate, the fixing base is provided with a main runner and a branch runner, the glue sealing plate is movably installed between the fixing base and the lower mold cavity, the glue sealing plate is provided with a supporting plate, one side of the supporting plate extends into the branch runner on the fixing base, and the other side extends into the lower mold cavity and abuts against the placed PCB.

2. The anti-overflow low pressure injection molding lower mold of claim 1, wherein, The biasing member is a compression spring, one end of the compression spring is installed in a spring hole on the fixing base, and the other end abuts against the glue sealing plate.

3. The anti-overflow low pressure injection lower mold of claim 1, wherein, The lower mold comprises two symmetrical lower mold cavities, and the glue sealing structure is located between the two lower mold cavities.

4. The anti-overflow low pressure injection lower mold of claim 3, wherein, The glue sealing plate is movably installed on the fixing base.

5. An anti-overflow low pressure injection under mold according to claim 4, characterized in that, The fixing base is provided with a positioning hole, and the lower mold plate is provided with a positioning pin, the positioning pin is installed in the positioning hole.

6. An anti-overflow low pressure injection under mold according to claim 5, characterized in that, The lower mold further comprises a bolt, the fixing base is provided with a bolt hole, and the fixing base is fixed to the lower mold plate through the bolt.

7. An anti-overflow low pressure injection under mold according to claim 6, wherein, The glue sealing structure further comprises a guide pin, the guide pin is installed on the fixing base, the glue sealing plate is provided with a guide pin hole, and the guide pin is matched with the guide pin hole.

8. An anti-overflow low pressure injection lower mold according to claim 7, characterized in that, The biasing member is a compression spring, the compression spring is installed in a spring hole on the fixing base, and both ends of the compression spring abut against the glue sealing plate.

9. An anti-squiggle low pressure injection mold characterized in that, The glue sealing structure further comprises a guide pin, the guide pin is installed on the fixing base, the glue sealing plate is provided with a guide pin hole, and the guide pin is matched with the guide pin hole. The biasing member is a compression spring, the compression spring is installed in a spring hole on the fixing base, and both ends of the compression spring abut against the glue sealing plate. The glue sealing structure further comprises a guide pin, the guide pin is installed on the fixing base, the glue sealing plate is provided with a guide pin hole, and the guide pin is matched with the guide pin hole.

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