Encapsulation composition and organic electronic device containing the same

Abstract

The encapsulating composition according to the present invention contains a radical-curable compound having at least one or more radical-curable functional groups and has a composition polarizability of 1.8 or less, wherein the composition polarizability is the sum of values ​​obtained by multiplying the "compound polarizability of each radical-curable compound" constituting the encapsulating composition and the "weight ratio of the relevant radical-curable compound to the encapsulating composition", and the compound polarizability can be calculated by the following General Formula 1. [General Formula 1] Compound polarizability = (value obtained by combining the number of carbons and the number of oxygens contained in the molecular structure of the relevant radical-curable compound) / (value obtained by subtracting the number of oxygens from the number of carbons in the molecular structure of the relevant radical-curable compound)

Description

Technical Field

[0001] The present invention relates to encapsulation compositions and organic electronic devices comprising the same. Background Art

[0002] A touch sensor refers to an input device installed in an image display device such as a liquid crystal display device, a field emission display device (FED), a plasma display panel (PDP), an electroluminescent display device (EL), or an electrophoretic display device, in which a user applies pressure (presses or touches) on the touch panel while looking at the image display device to input predetermined information.

[0003] Recently, with the trend of larger and thinner display devices, the structural form factor of touch sensors used in the above display devices has actually changed. Therefore, a display device in which a touch sensor is directly formed on a sealing layer has been developed.

[0004] Meanwhile, as the display device itself becomes thinner, the gap between the touch sensor electrodes constituting the touch sensor and the upper electrode in the image display device becomes narrower, so that there may be a problem in which the touch sensitivity of the touch sensor is reduced due to the generation of parasitic current.

[0005] Therefore, a major task to be solved is to reduce the dielectric constant of the sealing layer to improve the touch sensitivity of the user. Summary of the Invention

[0006] Technical issues

[0007] One problem to be solved by the present invention is to provide an encapsulation composition capable of achieving excellent touch sensitivity based on low dielectric constant characteristics. The technical problems of the present invention are not limited to the above technical problems, and those skilled in the art will clearly understand other unmentioned technical problems from the following description.

[0008] Technical Solution

[0009] The present invention is susceptible to various modifications and may have various embodiments, of which specific embodiments will be shown in the drawings and described in detail. However, this is not intended to limit the present invention to specific embodiments, and should be understood to include all modifications, equivalents, and alternatives included within the spirit and scope of the present invention.

[0010] When an element such as a layer, region, or substrate is referred to as being “on” another element, it can be directly on the other element or intervening elements may be present therebetween.

[0011] The terms used in this application are only used to describe specific examples and are not intended to limit the present invention. Unless the context clearly provides otherwise, singular expressions include plural expressions. In this application, it should be understood that terms such as "comprising" or "having" are intended to specify the presence of features, numbers, steps, operations, components, parts or combinations thereof described in the specification, but they do not exclude one or more other features, or the possibility of pre-existing or increasing numbers, steps, operations, components, parts or combinations thereof.

[0012] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs. Unless explicitly defined in this application, terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense.

[0013] <Encapsulation Composition>

[0014] The present application relates to an encapsulation composition for an organic electronic component. The encapsulation composition can be, for example, a sealing material used to seal or encapsulate an organic electronic device, such as an OLED. In one embodiment, the encapsulation composition of the present application can be applied to the top surface of the encapsulated or encapsulated organic electronic component. Thus, after the encapsulation composition is applied to the encapsulation, it can exist in the form of a seal on the top surface of the organic electronic device.

[0015] In this specification, the term "organic electronic device" refers to an article or device having the following structure: the structure includes an organic material layer that generates an alternating current of charge between a pair of electrodes facing each other by utilizing holes and electrons, wherein examples of organic electronic devices may include, but are not limited to, photovoltaic devices, rectifiers, emitters, and organic light-emitting diodes (OLEDs). In one example of the present application, the organic electronic device may be an OLED.

[0016] Since the present application provides an encapsulation composition applied to be in direct contact with the element on a top-emitting organic electronic element, it should have excellent optical properties after curing, and the element should be prevented from being degraded by the outgassing generated during the curing of the composition. In particular, the encapsulation composition of the present application should achieve excellent discharge characteristics, spreadability and low viscosity for application to inkjet methods, and achieve high surface hardness after curing, thereby preventing damage caused in the sealing layer by the inorganic layer formation process, and should be able to achieve excellent touch sensitivity in thin-film organic electronic devices based on low dielectric constant characteristics. Therefore, the present application can provide a composition for encapsulating organic electronic elements, which can not only achieve optical characteristics, element reliability, low viscosity characteristics and high hardness at the same time, but also achieve a low dielectric constant by using a specific composition as described below.

[0017] In the present application, the encapsulation composition may include a radical curable compound. A radical curable compound means a composition that can be cured by free radical polymerization according to light irradiation, which may have at least one or more radical curable functional groups. Here, the irradiated light may be generated by: irradiating a particle beam such as an alpha particle beam, a proton beam, a neutron beam, an electron beam, and electromagnetic waves such as microwaves, infrared (IR), ultraviolet (UV), X-rays or gamma rays. As an example, unless otherwise stated, the radical curable functional group is not limited, but as an example, the (meth) acrylic group may be an acryloyl group or a methacryloyl group, more specifically, the polyfunctional aliphatic compound may be a polyfunctional aliphatic (meth) acrylic compound; the monofunctional alicyclic compound may be a monofunctional alicyclic (meth) acrylic compound; the polyfunctional alicyclic compound may be a polyfunctional alicyclic (meth) acrylic compound; and the monofunctional aliphatic compound may be a monofunctional aliphatic (meth) acrylic compound.

[0018] In one embodiment, the encapsulation composition of the present application may include a radically curable compound having at least one or more radically curable functional groups, and may have a composition polarizability of 1.8 or less, 1.79 or less, 1.78 or less, 1.77 or less, 1.76 or less, 1.75 or less, 1.74 or less, 1.73 or less, 1.72 or less, 1.71 or less, 1.7 or less, 1.69 or less, 1.68 or less, 1.67 or less, 1.66 or less, 1.65 or less, 1.64 or less, 1.63 or less, 1.66 or less. In some embodiments, the polarizability of the composition may be 1 or less, 1.62 or less, 1.61 or less, 1.6 or less, 1.59 or less, 1.58 or less, 1.57 or less, 1.56 or less, 1.55 or less, 1.54 or less, 1.53 or less, 1.52 or less, 1.51 or less, 1.5 or less, 1.49 or less, 1.48 or less, 1.47 or less, 1.46 or less, 1.45 or less, 1.44 or less, 1.43 or less, 1.42 or less, 1.41 or less, 1.4 or less, 1.39 or less, 1.38 or less, 1.37 or less, or 1.36 or less. In addition, the lower limit of the polarizability of the composition may be 1 or more.

[0019] Here, the composition polarizability is the sum of the values ​​obtained by multiplying the “compound polarizability of each radically curable compound constituting the encapsulating composition” and the “weight ratio of the relevant radically curable compound relative to 100 parts by weight of the encapsulating composition (i.e., the weight ratio of the relevant radically curable compound to the encapsulating composition)”, wherein the compound polarizability can be calculated by the following General Formula 1.

[0020] [General formula 1]

[0021] Compound polarizability = (value obtained by combining the number of carbons and the number of oxygens contained in the molecular structure of the relevant radical-curable compound) / (value obtained by subtracting the number of oxygens from the number of carbons contained in the molecular structure of the relevant radical-curable compound)

[0022] In general formula 1, the number of carbons (or hydrogens) contained in the molecular structure of the radically curable compound refers to the sum of the numbers of all carbons (or hydrogens) constituting the structural formula of the radically curable compound. As an example, when the encapsulation composition is composed of a radically curable compound (X), a radically curable compound (Y), and a radically curable compound (Z), the polarizability of the composition can be calculated by (polarizability of compound X * weight ratio of compound X to the encapsulation composition) + (polarizability of compound Y * weight ratio of compound Y to the encapsulation composition) + (polarizability of compound Z * weight ratio of compound Z to the encapsulation composition). Here, when calculating the weight ratio of the radically curable compound, it is calculated based on the total weight of all components contained in the encapsulation composition and is calculated by including not only the radically curable compound but also a photoinitiator or a surfactant, etc.

[0023] That is, the present application can provide the desired composition of the present application by controlling the composition polarization degree of the radical curable compound constituting the composition.

[0024] In one example, the radical curable compound can include an alicyclic compound (X). Here, an alicyclic compound is a monomer having at least one or more cyclic structures as an alicyclic hydrocarbon system in a molecular structure, which can be a monomer not comprising an aromatic group such as a benzene ring. As an example, an alicyclic compound (X) can include a bicyclic or tricyclic compound. Different from the ring connected by the covalent bond between atoms belonging to different rings, a bicyclic or tricyclic compound means a ring as such: wherein 2 or 3 rings are each bonded in the molecular structure, and each ring shares at least one or more common atoms or common bonds. More specifically, the bicyclic or tricyclic compound can be a spirocyclic compound, a condensed ring compound or a bridged ring compound, and as an example, the bicyclic or tricyclic compound can be a carbobicyclic compound. A carbobicyclic compound means a compound in which all atoms constituting two bonded rings are carbon atoms. Therefore, the composition according to the present application includes an alicyclic compound (X) with a bulky structure, thereby increasing the molar volume of the composition and preventing the polarization phenomenon caused by steric hindrance, etc., and thus the low dielectric constant characteristics of the composition can be achieved.

[0025] In one example, the alicyclic compound (X) may be included in an amount of 10 wt % to 100 wt %, more specifically, 13 wt % or more, 15 wt % or more, 17 wt % or more, 20 wt % or more, 23 wt % or more, 25 wt % or more, 27 wt % or more, 30 wt % or more, 33 wt % or more, 35 wt % or more, 37 wt % or more, 40 wt % or more, 43 wt % or more, 45 wt % or more, 47 wt % or more, 50 wt % or more, 53 wt % or more, 55 wt % or more, 57 wt % or more, 60 wt % or more, 61 wt % or more, 62 wt % or more, 64 wt % or more, 66 wt % or more, 67 wt % or more, 68 wt % or more, 69 wt % or more, 70 wt % or more, 71 wt % or more, 72 wt % or more, 73 wt % or more, 74 wt % or more, 75 wt % or more, 76 wt % or more, 77 wt % or more, 78 wt % or more, 79 wt % or more, 80 wt % or more, 81 wt % or more, 82 wt % or more, 83 wt % or more, 84 wt % or more, 85 wt % or more, 86 wt % or more, 87 wt % or more, 88 wt % or more, 89 wt % or more, 90 3 % by weight or more, 65 % by weight or more, 68 % by weight or more, 70 % by weight or more, 73 % by weight or more or 75 % by weight or more, wherein this amount can be 97 % by weight or less, 95 % by weight or less, 93 % by weight or less, 90 % by weight or less, 87 % by weight or less, 85 % by weight or less, 83 % by weight or less, 80 % by weight or less, 77 % by weight or less, 75 % by weight or less, 73 % by weight or less, 70 % by weight or less, 67 % by weight or less, 65 % by weight or less, 63 % by weight or less, 60 % by weight or less, 55 % by weight or less, 50 % by weight or less, 45 % by weight or less or 40 % by weight or less. By regulating the composition of the encapsulation composition, the composition is adjusted to have a low dielectric constant, and the application can effectively prevent interference between circuits. In general, various methods can be adopted in the same industry to reduce dielectric constant, but this is separate from the realization of inkjet characteristics. According to the present application, it is possible to provide an encapsulation composition that satisfies excellent curing sensitivity after curing while maintaining inkjet characteristics and is capable of achieving a low dielectric constant and moisture barrier properties at the same time.

[0026] In one example, the alicyclic compound (X) may include a monofunctional alicyclic compound (X1). Here, the monofunctional alicyclic compound (X1) means an alicyclic compound, but one having a functional group in the molecule. As an example, the monofunctional alicyclic compound (X1) is not limited thereto, but may include isobornyl (meth) acrylate, 1,3-adamantanediol (meth) acrylate, 2-methyl-2-adamantyl (meth) acrylate, 2-ethyl-2-adamantyl (meth) acrylate, 1-adamantyl (meth) acrylate, etc. In addition, it may include a compound of the following formula 1. As an example, the compound of formula 1 may be 2-isopropyl-5-methylcyclohexyl (meth) acrylate.

[0027] [Formula 1]

[0028]

[0029] In Formula 1, R1 and R2 may each independently be a linear or branched alkyl group having 1 to 6 carbon atoms. As an example, R1 and R2 are not limited thereto, but may be a methyl group, an isopropyl group, or a tert-butyl group. In particular, when the alkyl group has a branched structure, the dipole moment can be reduced, and thus an aliphatic compound (Y) having a branched alkyl group may be more preferred.

[0030] Furthermore, in one example, the monofunctional alicyclic compound (X1) may be contained in an amount of 10 wt % to 60 wt % based on the encapsulation composition, more specifically, it may be contained in an amount of 12 wt % or more, 14 wt % or more, 16 wt % or more, 18 wt % or more, 20 wt % or more, 22 wt % or more, 30 wt % or more, 35 wt % or more, or 40 wt % or more, and the amount may be 58 wt % or less, 56 wt % or less, 54 wt % or less, 52 wt % or less, 50 wt % or less, 48 ​​wt % or less, 46 wt % or less, 44 wt % or less, 42 wt % or less, 30 wt % or less, or 25 wt % or less.

[0031] In addition, in one example, the alicyclic compound (X) may include a polyfunctional alicyclic compound (X2). Here, the polyfunctional alicyclic compound (X2) means an alicyclic compound containing two or more functional groups in the molecule. As an example, the polyfunctional alicyclic compound (X2) can be exemplified by tricyclodecane dimethanol diacrylate or tricyclodecane dimethanol di(meth)acrylate, but is not limited thereto.

[0032] In one example, the polyfunctional alicyclic compound (X2) may be included in an amount of 20 to 120 parts by weight relative to 100 parts by weight of the monofunctional alicyclic compound (X1). Specifically, the lower limit of the polyfunctional alicyclic compound (X2) relative to 100 parts by weight of the monofunctional alicyclic compound (X1) may be 23 parts by weight or more, 25 parts by weight or more, 27 parts by weight or more, 30 parts by weight or more, 33 parts by weight or more, 35 parts by weight or more, 37 parts by weight or more, 40 parts by weight or more, 50 parts by weight or more, 60 parts by weight or more, 70 parts by weight or more, 75 parts by weight or more, 80 parts by weight or more, or 90 parts by weight or more, and the upper limit thereof may be 110 parts by weight or less, 105 parts by weight or less, 100 parts by weight or less, 95 parts by weight or less, 93 parts by weight or less, 91 parts by weight or less, 90 parts by weight or less, 80 parts by weight or less, 70 parts by weight or less, 60 parts by weight or less, 50 parts by weight or less, or 45 parts by weight or less.

[0033] In one embodiment, the radical curable compound may include an aliphatic compound (Y) having a linear or branched alkyl group. Here, the aliphatic compound (Y) having a linear or branched alkyl group refers to a monomer having a linear or branched alkyl group in the molecular structure as an aliphatic hydrocarbon system. It can be distinguished from the alicyclic compound (X) in that it does not have a cyclic structure in the molecular structure and may be one without any aromatic group. In particular, when the alkyl group in the aliphatic compound (Y) has a branched structure, the dipole moment can be reduced, and therefore the aliphatic compound (Y) having a branched alkyl group may be more preferred.

[0034] In one example, the aliphatic compound (Y) having a linear or branched alkyl group may be included in an amount of 30 to 300 parts by weight relative to 100 parts by weight of the monofunctional alicyclic compound (X1). Specifically, the lower limit of the aliphatic compound (Y) having a linear or branched alkyl group may be 35 parts by weight or more, 40 parts by weight or more, 45 parts by weight or more, 50 parts by weight or more, 55 parts by weight or more, 60 parts by weight or more, 61 parts by weight or more, 62 parts by weight or more, 70 parts by weight or more, 80 parts by weight or more, 100 parts by weight or more, 200 parts by weight or more, or 250 parts by weight or more, and the upper limit thereof may be 280 parts by weight or less, 270 parts by weight or less, 260 parts by weight or less, 200 parts by weight or less, 150 parts by weight or less, 100 parts by weight or less, 90 parts by weight or less, 80 parts by weight or less, 70 parts by weight or less, 60 parts by weight or less, or 50 parts by weight or less, relative to 100 parts by weight of the monofunctional alicyclic compound (X1).

[0035] In addition, in one example, the aliphatic compound (Y) having a linear or branched alkyl group may be contained in an amount of 5 to 250 parts by weight relative to 100 parts by weight of the alicyclic compound (X). Specifically, the lower limit of the aliphatic compound (Y) having a linear or branched alkyl group may be 15 parts by weight or more, 25 parts by weight or more, 35 parts by weight or more, 45 parts by weight or more, 55 parts by weight or more, 60 parts by weight or more, 80 parts by weight or more, 100 parts by weight or more, 120 parts by weight or more, or 140 parts by weight or more, and the upper limit thereof may be 200 parts by weight or less, 150 parts by weight or less, 100 parts by weight or less, 70 parts by weight or less, 50 parts by weight or less, or 30 parts by weight or less, relative to 100 parts by weight of the alicyclic compound (X).

[0036] Furthermore, in one embodiment, the aliphatic compound (Y) having a linear or branched alkyl group may include a monofunctional aliphatic compound (Y1), wherein the monofunctional aliphatic compound (Y1) means one having one functional group in the molecule as an aliphatic compound.

[0037] In addition, in one example, monofunctional aliphatic compound (Y1) can include an aliphatic compound with an alkyl group containing 12 to 24 carbon atoms. For example, it can be n-dodecyl (meth) acrylate, isododecyl (meth) acrylate, n-tridecyl (meth) acrylate, isotridecyl (meth) acrylate, n-pentadecyl (meth) acrylate, isopentadecyl (meth) acrylate, n-hexadecyl (meth) acrylate, isohexadecyl (meth) acrylate, n-heptadecyl (meth) acrylate, isoheptadecyl (meth) acrylate, stearyl (meth) acrylate, isooctadecyl (meth) acrylate, n-nonadecyl (meth) acrylate, isononadecyl (meth) acrylate, etc., and is not limited thereto. Therefore, by introducing an aliphatic compound with a long chain skeleton, the polarity of the entire molecule can be reduced, thereby achieving a low dielectric constant of the composition.

[0038] In one example, the monofunctional aliphatic compound (Y1) may be included in an amount of 20 to 120 parts by weight relative to 100 parts by weight of the monofunctional alicyclic compound (X1). Specifically, the lower limit of the monofunctional aliphatic compound (Y1) may be 25 parts by weight or more, 30 parts by weight or more, 35 parts by weight or more, 40 parts by weight or more, 45 parts by weight or more, 47 parts by weight or more, 50 parts by weight or more, 60 parts by weight or more, 70 parts by weight or more, 80 parts by weight or more, or 90 parts by weight or more, and the upper limit thereof may be 110 parts by weight or less, 107 parts by weight or less, 105 parts by weight or less, 103 parts by weight or less, 100 parts by weight or less, 97 parts by weight or less, 95 parts by weight or less, 93 parts by weight or less, 91 parts by weight or less, 80 parts by weight or less, 70 parts by weight or less, 60 parts by weight or less, or 50 parts by weight or less, relative to 100 parts by weight of the monofunctional alicyclic compound (X1).

[0039] In one embodiment, the aliphatic compound (Y) having a linear or branched alkyl group may include a polyfunctional aliphatic compound (Y2). Here, the polyfunctional aliphatic compound (Y2) means an aliphatic compound having at least two or more functional groups in the molecule.

[0040] In addition, in one example, the multifunctional aliphatic compound (Y2) may include an aliphatic compound having a functionality of di to octa, and as an example, it may include hexanediol di(meth)acrylate, tripropylene glycol di(meth)acrylate, ethylene glycol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, trimethylolpropane ethoxy tri(meth)acrylate, glycerol propoxylated tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, tripentaerythritol hexa(meth)acrylate, tripentaerythritol hepta(meth)acrylate, 1,12-dodecanediol di(meth)acrylate, and the like, and may include two or more thereof, but is not limited thereto.

[0041] In one example, the polyfunctional aliphatic compound (Y2) may be included in an amount of 20 to 200 parts by weight relative to 100 parts by weight of the monofunctional alicyclic compound (X1). Specifically, the lower limit of the polyfunctional aliphatic compound (Y2) relative to 100 parts by weight of the monofunctional alicyclic compound (X1) may be 23 parts by weight or more, 25 parts by weight or more, 27 parts by weight or more, 30 parts by weight or more, 33 parts by weight or more, 35 parts by weight or more, 37 parts by weight or more, 40 parts by weight or more, 80 parts by weight or more, 100 parts by weight or more, 130 parts by weight or more, or 160 parts by weight or more, and the upper limit thereof may be 195 parts by weight or less, 193 parts by weight or less, 190 parts by weight or less, 187 parts by weight or less, 185 parts by weight or less, 183 parts by weight or less, 180 parts by weight or less, 178 parts by weight or less, 175 parts by weight or less, 173 parts by weight or less, 170 parts by weight or less, 168 parts by weight or less, 100 parts by weight or less, 80 parts by weight or less, or 50 parts by weight or less.

[0042] As described above, in the present application, the encapsulation composition can be applied to the organic electronic component by an inkjet method using a specific composition formulation, and the applied encapsulation composition can provide an organic layer with excellent curing sensitivity after curing. When the curing sensitivity is insufficient, uncured portions or outgassing are generated in the composition, which may lead to serious durability reliability issues in terms of the characteristics of the encapsulation composition of the present application directly applied to the organic electronic component. In addition, the encapsulation composition can achieve low dielectric constant characteristics.

[0043] In this specification, the term "monomer" may refer to a compound having a weight average molecular weight in the range of 150 g / mol to 1,000 g / mol, 173 g / mol to 980 g / mol, 188 g / mol to 860 g / mol, 210 g / mol to 823 g / mol, or 330 g / mol to 780 g / mol. By adjusting the weight average molecular weight of the monomer included in the encapsulation composition to a low value, the present application can prevent the inkjet process from being unable to proceed due to the excessive viscosity of the composition, while improving the curing completion of the sealing material after curing, and can simultaneously provide moisture barrier properties and excellent curing sensitivity. In this specification, weight average molecular weight means the value converted from polystyrene of the standard measured by GPC (gel permeation chromatograph). In one example, a column consisting of a metal tube having a length of 250 mm to 300 mm and an inner diameter of 4.5 mm to 7.5 mm is filled with 3 mm to 20 mm polystyrene beads. When a solution diluted by dissolving the material to be measured in THF solvent is passed through the column, the weight average molecular weight can be indirectly measured based on the elution time. The amount of size separation from the column can be detected by plotting it against time.

[0044] In one embodiment, the encapsulation composition according to the present invention may include a photoinitiator. The photoinitiator may be a photoradical initiator, and a specific type may be appropriately selected in consideration of the curing rate, etc. For example, a benzoin-based photoinitiator, a hydroxyketone-based photoinitiator, an aminoketone-based photoinitiator, or a phosphine oxide-based photoinitiator may be used. Specifically, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin n-butyl ether, benzoin isobutyl ether, acetophenone, dimethylaminoacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-propan-1-one, 4-(2-hydroxyethoxy)phenyl-2-(hydroxyethoxy)phenyl 1-[4-(1-methyl)vinyl)phenyl]propanone] and 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, etc. The photoinitiator can be used alone or in combination of two or more.

[0045] In one example, the photoinitiator may be included in an amount of 0.01 to 10 wt% or less, specifically 0.01 to 5 wt% or less, based on the encapsulation composition. Regarding the properties of the encapsulation composition of the present application directly applied to an organic electronic component, physical and chemical damage to the component can be minimized by adjusting the content range of the photoinitiator.

[0046] In one embodiment, the encapsulation composition may include a surfactant. The surfactant is not limited thereto, but is preferably a silicone-based surfactant, a fluorine-based surfactant, or an acrylic surfactant.

[0047] Specific examples of silicone-based surfactants include BYK-077, BYK-085, BYK-300, BYK-301, BYK-302, BYK-306, BYK-307, BYK-310, BYK-320, BYK-322, BYK-323, BYK-325, BYK-330, BYK-331, BYK-333, BYK-334, BYK-335, BYK-336, BYK-337, BYK-338, BYK-339, BYK-400, BYK-401, BYK-402, BYK-403, BYK-404, BYK-405, BYK-406, BYK-407, BYK-408, BYK-409, BYK-410, BYK-411, BYK-412, BYK-413, BYK-414, BYK-415, BYK-416, BYK-417, BYK-418, BYK-419, BYK-420, BYK-421, BYK-422, BYK-423, BYK-424, BYK-425 BYK-335, BYK-341v344, BYK-345v346, BYK-348, BYK-354, BYK-355, BYK-356, BYK-358, BYK-361, BYK-370, BYK-371, BYK-375, BYK-380 or BYK-390, etc. Specific examples of fluorine-based surfactants include DIC (DaiNippon Ink & Chemicals) F-114, F-177, F-410, F-411, F-450, F-493, F-494, F-443, F-444, F-445, F-4 46. ​​F-470, F-471, F-472SF, F-474, F-475, F-477, F-478, F-479, F-480SF, F-482, F-483, F-484, F-486, F-487, F-172D, MCF-350SF, TF-1025SF, TF-1117SF, TF-1026SF, TF-1128, TF-1127, TF-1129, TF-1126, TF-1130, TF-1116SF, TF-1131, TF1132, TF1027SF, TF-1441 or TF-1442, etc. In order to control the surface tension of the encapsulation composition according to the present invention, a surfactant added to the composition may be included in an amount of 0.1 wt% to 1 wt% based on the encapsulation composition.

[0048] In addition to the above-mentioned components, the encapsulation composition according to the present application may include various additives within a range that does not affect the effects of the present invention as described above. For example, the encapsulation composition may include a defoaming agent, a tackifier, a UV stabilizer, or an antioxidant in an amount within an appropriate range according to the desired physical properties.

[0049] In one embodiment of the present application, the encapsulation composition of the present application may be in a liquid phase at room temperature, for example, 25° C. In one embodiment, the encapsulation composition may be in a solvent-free liquid phase. Here, solvent-free means containing a solvent in an amount of 0.05% or less. In addition, in one embodiment, the encapsulation composition may be an ink composition. That is, the encapsulation composition according to the present application may be designed to have appropriate physical properties when discharged onto a substrate using inkjet printing capable of non-contact patterning.

[0050] In one example, the viscosity of the encapsulation composition measured by Brookfield's DV-3 at a temperature of 25°C, a torque of 90% and a shear rate of 20 rpm can be in the range of 50 cP or less, 1 cP to 46 cP, 3 cP to 44 cP, 4 cP to 38 cP, 5 cP to 33 cP, or 14 cP to 24 cP. The present application can achieve physical properties that enable inkjet when applied to organic electronic components by controlling the viscosity of the composition within the above ranges, and can also provide a thin film encapsulation material by providing excellent coating properties.

[0051] As described in detail below, the encapsulation composition can be irradiated with light to induce crosslinking to form an organic layer. The irradiation with light can include irradiating with light having a wavelength range of about 250 nm to about 450 nm or about 300 nm to about 450 nm at 300 mJ / cm 2 Up to 6,000mJ / cm 2 The amount of light or 500mJ / cm 2 Up to 4,000mJ / cm 2 amount of light irradiation.

[0052] At this time, as described below, the thickness of the organic layer may be 25 μm or less. In one example, the thickness may be 23 μm or less, 22 μm or less, 21 μm or less, or 20 μm or less, and its lower limit may be 1 μm or more, or 2 μm or more. The present application can provide a thin organic electronic device by providing the organic layer with a thin thickness.

[0053] In one embodiment of the present application, the cured product after the encapsulation composition is cured can have a surface energy in the range of 10mN / m to 50mN / m, 12mN / m to 45mN / m, 15mN / m to 40mN / m, 18mN / m to 35mN / m or 20mN / m to 30mN / m. The measurement of surface energy can be measured by methods known in the art, for example, it can be measured by a ring pull method (Ring Method). Since the present application meets the above surface energy range, it can be easily discharged from the inkjet head during the inkjet process.

[0054] As an example, the surface energy (γ surface, mN / m) can be calculated as γ surface = γ dispersion + γ polarity, and the surface energy can be measured using a drop shape analyzer (DSA100 product from KRUSS). For example, when the encapsulation composition for measuring the surface energy is applied to a SiNx substrate to a thickness of about 50 μm and a thickness of 4 cm 2 After forming a sealing film on a coating area (width: 2 cm, height: 2 cm) (spin coater), it was dried at room temperature for about 10 minutes under a nitrogen atmosphere and then passed through a 4000 mJ / cm 2 The light intensity is 1000mW / cm 2 UV curing was performed with a strength of 100 nm. Deionized water with a known surface tension was added dropwise to the cured film, and the contact angle was obtained five times to obtain the average of the five contact angle values. Similarly, diiodomethane with a known surface tension was added dropwise to the film, and the contact angle was obtained five times to obtain the average of the five contact angle values. The average contact angles of deionized water and diiodomethane were then substituted into the solvent surface tension value (Strom value) using the Owens-Wendt-Rabel-Kaelble method to obtain the surface energy.

[0055] In one embodiment of the present application, after the encapsulation composition is cured into a thin film having a thickness of 20 μm, its dielectric constant under the conditions of any frequency between 110 kHz and 250 kHz and a temperature of 25° C. or less may be 2.8 or less, 2.79 or less, 2.78 or less, 2.77 or less, 2.76 or less, 2.75 or less, 2.74 or less, 2.73 or less, 2.72 or less, 2.71 or less, 2.7 or less, 2.69 or less, or 2.68 or less. As an example, each dielectric constant can be measured at any frequency between 150 kHz and 250 kHz, and more specifically, can be measured at a frequency of 250 kHz.

[0056] As an example, aluminum is deposited on glass to a thickness of about 50 nm, and the encapsulation composition is coated thereon by inkjet printing and irradiated with about 1,000 mJ / cm 2 After UV curing with a light intensity of 100 nm to form an organic layer with a thickness of about 20 μm, the dielectric constant of the sample with about 50 nm of aluminum deposited on the organic layer can be measured using an impedance / gain phase meter HP 4194A.

[0057] The dielectric constant of the films produced in large quantities in the prior art is in the range of about 3.4 or greater to 4.5, which is not suitable for large displays due to the parasitic capacitance between the electrodes. In addition, in general, as the thickness decreases, a higher dielectric constant value tends to be exhibited, but the present application can have such a low dielectric constant value even in a thin thickness of 20 μm or less. In this way, the organic layer formed by the composition having the above-mentioned composition satisfies the above-mentioned dielectric constant range, so that even if a thin organic layer is applied to an organic electronic device as described below, there is no interference problem between circuits, and thus an organic electronic device that can be thinned can be provided. Since lowering the dielectric constant is beneficial to improving the sensitivity of the touch sensor, the lower limit of the dielectric constant is not particularly limited, but as an example, it can be 0.01 or 0.1.

[0058] In one embodiment of the present application, after curing, it may be 1.5 GPa or more, 1.7 GPa or more, 1.9 GPa or more, 2.1 GPa or more, 2.2 GPa or more, 2.3 GPa or more, 2.4 GPa or more, 2.5 GPa or more, 2.6 GPa or more, or 2.7 GPa or more at 25° C. Since it satisfies such a modulus, the surface hardness is excellent, and thus, in the process for forming the inorganic layer, such as CVD, damage to the organic layer (which is a cured product of the encapsulation composition) can be prevented.

[0059] The modulus can be determined by forming the encapsulation composition into a film on a glass substrate to a predetermined thickness and then irradiating the film with an LED UV lamp at 1000 mW / cm 2 The sample was cured under UV conditions to prepare a sample having a width and length of 20 cm and a thickness of 3 μm for measurement. In particular, for the cured sample, the modulus can be measured using a nanoindenter HM-2000 (Fisher) by loading the sample for 5 seconds, holding it for 2 seconds, and then unloading the sample for 5 seconds. The measurement conditions can be experimental mode conditions: indentation mode (using Berkovitz), control mode: force control, maximum force: 2 mN, 250 kHz, and 25°C.

[0060] In addition, in one embodiment of the present application, the transmittance of the encapsulation composition in the visible light region after curing may be 90% or more, 92% or more, or 95% or more. Within the above range, by applying the encapsulation composition to a top-emitting organic electronic device, the present application provides an organic electronic device with high resolution, low power consumption and long life. In addition, the haze of the encapsulation composition of the present application after curing according to the JIS K7105 standard test may be 3% or less, 2% or less or 1% or less, wherein the lower limit is not particularly limited, but it may be 0%. Within this haze range, the encapsulation composition may have excellent optical properties after curing. In this specification, the transmittance or haze as described above can be measured in a state where the encapsulation composition is cured into an organic layer, which may be an optical property measured when the thickness of the organic layer is any thickness between 2 μm and 20 μm. In one embodiment of the present application, in order to achieve optical properties, a hygroscopic agent or inorganic filler as described above may not be included.

[0061] <Organic Electronic Devices>

[0062] The present application also relates to organic electronic devices. Figure 1 As shown, the exemplary organic electronic device 3 may include a substrate 31 ; an organic electronic element 32 formed on the substrate 31 ; and an organic layer 33 sealing the top side of the organic electronic element 32 and formed of the above-mentioned encapsulation composition.

[0063] In one embodiment of the present application, the organic electronic element 32 may include a first electrode layer, an organic material layer formed on the first electrode layer and including at least a light-emitting layer, and a second electrode layer formed on the organic material layer. The first electrode layer may be a transparent electrode layer or a reflective electrode layer, and the second electrode layer may also be a transparent electrode layer or a reflective electrode layer. More specifically, the organic electronic element 32 may include a reflective electrode layer formed on a substrate, an organic material layer formed on the reflective electrode layer and including at least a light-emitting layer, and a transparent electrode layer formed on the organic material layer.

[0064] In the present application, the organic electronic element 32 may be an organic light emitting diode.

[0065] In one example, the organic electronic device according to the present application may be a top emission type, but is not limited thereto and may be applied to a bottom emission type.

[0066] The organic electronic device 3 protects the electrodes and light-emitting layer of the organic electronic element 32. The organic electronic device 3 may further include an inorganic layer 35 between the organic electronic element 32 and the organic layer. The inorganic layer 35 may be a protective layer using chemical vapor deposition (CVD). As an example, the inorganic layer 35 may be one or more metal oxides or nitrides selected from Al, Zr, Ti, Hf, Ta, In, Sn, Zn, and Si. The thickness of the inorganic layer may be 10 nm to 70 nm or about 20 nm to about 60 nm. In an example, the inorganic layer 35 of the present application may be an inorganic material that does not contain a dopant or an inorganic material that contains a dopant. The dopant that may be doped may be one or more elements selected from Ga, Si, Ge, Al, Sn, Ge, B, In, Tl, Sc, V, Cr, Mn, Fe, Co, and Ni, or oxides of the elements, but is not limited thereto.

[0067] As an example, the organic electronic device 3 may further include an inorganic layer 34 formed on the organic layer 33. The inorganic layer 34 may use the same or different material as the inorganic layer 35 formed between the organic electronic element 32 and the organic layer, and the inorganic layer 34 may be formed in the same manner as the inorganic layer 35.

[0068] In addition, the thickness of the organic layer may be 25 μm or less. As an example, the thickness may be 23 μm or less, 22 μm or less, 21 μm or less, or 20 μm or less, and its lower limit may be 1 μm or more, or 2 μm or more. The present application can provide a thin organic electronic device by providing an organic layer having a thin thickness.

[0069] As an example, the organic electronic device 3 of the present application may include an encapsulation structure including the organic layer 33 and the inorganic layer 34 as described above, wherein the encapsulation structure may include at least one or more organic layers 33 and at least one or more inorganic layers 34, and the organic layers 33 and the inorganic layers 34 may be repeatedly laminated. For example, the organic electronic device may have a structure of substrate / organic electronic element / inorganic layer / (organic layer / inorganic layer)n, where n may be a number in the range of 1 to 100. Figure 1 is a cross-sectional view exemplarily showing a case where n is 1.

[0070] In one embodiment, it may include: an encapsulation structure 36 including at least one or more organic layers and at least one or more inorganic layers, and a touch sensor 37 formed on the encapsulation structure.

[0071] In one embodiment, the touch sensor 37 can be formed directly on the encapsulation structure 36. That is, it can have a structure in which the touch sensor 37 and the encapsulation structure 36 are in direct contact with each other without interposing a separate layer such as a pressure-sensitive adhesive layer or an adhesive layer between the touch sensor 37 and the encapsulation structure 36. Such a laminated structure may be referred to as a TOE (touch on encapsulation) structure. By having such a TOE structure, the thickness of the organic electronic device can be reduced compared to existing structures.

[0072] At the same time, as organic electronic devices become thinner, the gap between the electrodes for the touch panel (i.e., the conductive layer) and the electrodes for the organic electronic elements adjacent to the touch panel becomes narrower, causing parasitic currents to flow between them, which may lead to a decrease in the sensitivity of the touch sensor. Therefore, the TOE structure requires an organic layer for the encapsulation material with a low dielectric constant to prevent a decrease in touch sensitivity. Therefore, the present application provides an encapsulation composition to meet this demand.

[0073] The touch sensor 37 is a device capable of recognizing input information obtained through contact with a user and may be a sensor known in the relevant technical field. For example, the touch sensor may be a capacitive sensor that recognizes touch based on static electricity generated by a user's body contact area (e.g., a hand) and the resulting change in current; or a pressure-sensitive sensor that recognizes touch based on the change in capacitance that occurs when the conductive layers of the upper and lower plates of the touch sensor come into contact due to pressure applied by the user. The configuration of sensors that recognize user contact in either manner is known in the relevant technical field.

[0074] In one embodiment, the touch sensor 37 may include a conductive layer (not shown) on one or both sides. The material of the conductive layer is not particularly limited, and for example, a transparent conductive film such as ITO or metal nanowires can be used. The conductive layer may have a channel region through which current flows and a non-channel region through which current does not flow. These regions may be formed by methods such as etching or photolithography.

[0075] In one embodiment, the organic electronic device 3 may further include a cover substrate (not shown) on the uppermost surface. That is, the organic electronic device 3 according to the present invention may sequentially include an encapsulation structure 36, a touch sensor 37, and a cover substrate. In this case, the cover substrate and the touch sensor may be collectively referred to as a touch panel 37. Since the encapsulation material is located on the touch panel, a TOE structure may be implemented.

[0076] The covering substrate may be light-transmitting, for example, when the transmittance for visible light is 80% or greater. In the case of light-transmitting, the type of material contained in the covering substrate is not particularly limited. For example, the covering substrate may contain a polymer resin or a glass component. In one example, when it is necessary to impart flexible properties, the covering substrate may contain a polymer resin. The covering substrate is not particularly limited, but for example, the covering substrate may include, for example, a polyester film, such as PC (polycarbonate), PEN (poly(ethylene naphthalate)) or PET (poly(ethylene terephthalate)); an acrylic film, such as PMMA (poly(methyl methacrylate)); or a polyolefin film, such as PE (polyethylene) or PP (polypropylene); a polyimide film; or a polyamide film, and the like.

[0077] <Method for Manufacturing Organic Electronic Device>

[0078] The present application also relates to a method for producing an organic electronic device.

[0079] In one example, the manufacturing method may include forming an organic layer 33 on a substrate 31 having an organic electronic element 32 formed thereon, such that the encapsulation composition seals a top side of the organic electronic element 32 .

[0080] Here, it can be produced by forming a reflective electrode or a transparent electrode on a substrate 31 (e.g., glass or a polymer film) as a substrate 31 of an organic electronic element 32 by a method such as vacuum deposition or sputtering, and forming an organic material layer on the reflective electrode. The organic material layer may include a hole injection layer, a hole transport layer, a light-emitting layer, an electron injection layer, and / or an electron transport layer. Subsequently, a second electrode is further formed on the organic material layer. The second electrode may be a transparent electrode or a reflective electrode.

[0081] The manufacturing method of the present application may further include the step of forming an inorganic layer 35 on the first electrode, the organic material layer, and the second electrode formed on the substrate 31. Then, the organic layer 33 is applied to cover the top side of the organic electronic element 32 on the substrate 31. Here, the step of forming the organic layer 33 is not particularly limited, and the encapsulation composition can be applied to the top side of the substrate 31 using methods such as inkjet printing, gravure coating, spin coating, screen printing, or reverse offset coating.

[0082] The manufacturing method may further include the step of irradiating the organic layer with light. In the present invention, the organic layer of the sealed organic electronic device may also be subjected to a curing process, such a curing process may be performed, for example, in a heating chamber or a UV chamber, preferably in a UV chamber. In one embodiment, the organic layer may be formed by applying the above-mentioned encapsulation composition by inkjet printing and inducing crosslinking of the applied encapsulation composition by irradiation with light, wherein the organic layer may be formed by applying light in a wavelength range of 250 nm to 450 nm and 300 mJ / cm 2 Up to 6,000mJ / cm 2 It is formed by irradiating a range of light amounts, as described above.

[0083] The manufacturing method of the present application may further include the step of forming an inorganic layer 34 on the organic layer 33. In the step of forming the inorganic layer 34, a method known in the art may be used, which may be similar to the method for forming the inorganic layer ( Figure 1 The method of 35) is the same or different.

[0084] In addition, a step of providing a touch sensor 37 on the organic layer 33 or the inorganic layers 35 and 34 (ie, the encapsulation structure 36 ) may be added.

[0085] Beneficial effects

[0086] As described above, the encapsulation composition according to the example of the present invention can improve the touch sensitivity of adjacent touch sensors and provide excellent protection against the external environment. However, the effects of the present invention are not limited to the above effects, and those skilled in the art will clearly understand other effects not mentioned from the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0087] Figure 1 is a cross-sectional view showing an organic electronic device according to one example of the present invention. DETAILED DESCRIPTION

[0088] Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings. In describing the present invention, in order to facilitate overall understanding, the same components in the drawings are denoted by the same reference numerals, and repeated description of the same components is omitted.

[0089] Experimental example

[0090] 1. Polarizability of the composition

[0091] The composition polarizability is the sum of the values ​​obtained by multiplying the “compound polarizability of each radically curable compound constituting the encapsulating composition” and the “parts by weight of the relevant radically curable compound relative to 100 parts by weight of the encapsulating composition (i.e., the weight ratio of the radically curable compound to the encapsulating composition)”, wherein the compound polarizability is calculated by the following general formula 1

[0092] That is, when the encapsulating composition is composed of a radically curable compound (X), a radically curable compound (Y), and a radically curable compound (Z), the polarizability of the composition can be calculated by (polarizability of compound X * weight ratio of compound X to the encapsulating composition) + (polarizability of compound Y * weight ratio of compound Y to the encapsulating composition) + (polarizability of compound Z * weight ratio of compound Z to the encapsulating composition). Here, when calculating the weight ratio of the curable compound, it is calculated based on the total weight of all components included in the encapsulating composition, and is calculated by including not only the radically curable compound but also a photoinitiator or surfactant, etc.

[0093] [General formula 1]

[0094] Compound polarizability = (value obtained by combining the number of carbons and the number of oxygens contained in the molecular structure of the relevant radical-curable compound) / (value obtained by subtracting the number of oxygens from the number of carbons in the molecular structure of the relevant radical-curable compound)

[0095] 2. Curing rate

[0096] The encapsulation compositions prepared according to the examples and comparative examples were each inkjet coated on a clean bare glass and irradiated with an LED UV lamp at 1,000 mJ / cm 2 The composition and the organic layer as the cured product were then measured using a Cary 5660 FT-IR (manufacturer: Agilent) instrument and the peaks of the organic layer were determined by 1420 cm -1 The integrated value of the area measures the cure rate.

[0097] Curing rate (%) = (1-at 1420cm -1 The organic layer integral value in the region at 1420 cm -1 The integrated value of the composition in the region) × 100%

[0098] 3. Dielectric constant

[0099] A 150 nm thick Al plate (conductive plate) was deposited on a clean bare glass. The encapsulation compositions prepared in the examples and comparative examples were inkjet coated on the surface of the deposited Al plate and then irradiated with an LED UV lamp at 1000 mJ / cm 2The coated composition was cured by applying a light amount of 10 μm to form an organic layer with a thickness of 10 μm. A sample was prepared by depositing an Al plate (conductive plate) again to 150 nm on the organic layer. Thereafter, the dielectric constant of the prepared sample was measured using an impedance / gain phase meter HP 4194A under the conditions of 250 kHz and 25 ° C. In this application, the dielectric constant may mean a relative value (ratio) relative to the dielectric constant in a vacuum when the dielectric constant in a vacuum is set to 1.

[0100] Example

[0101] Examples 1 to 3

[0102] Compositions according to Examples 1 to 3 were prepared according to the compositions and contents of Table 1 below (representing each part by weight based on 100 parts by weight of the composition) and mixed at 25° C. for 3 hours or more.

[0103] Comparative Examples 1 to 3

[0104] Compositions according to Comparative Examples 1 to 3 were prepared according to the compositions and contents of Table 1 below (representing each part by weight based on 100 parts by weight of the composition) and mixed at 25° C. for 3 hours or more.

[0105] [Table 1]

[0106]

[0107] Table 2 below summarizes the experimental data according to the above embodiments and comparative examples.

[0108] [Table 2]

[0109] Example 1 Example 2 Example 3 Comparative Example 1 Comparative Example 2 Comparative Example 3 Polarizability of the composition 1.52 1.47 1.3 1.88 1.7 1.5 Curing rate (%) 92 91 93 90 88 91 Dielectric constant (250kHz, 25℃) 2.75 2.72 2.68 3.2 2.95 2.95

[0110] While described with reference to the exemplary embodiments, those skilled in the art will appreciate that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention as set forth in the following claims.

[0111] Reference numerals

[0112] 3: Organic electronic devices

[0113] 31: Base

[0114] 32: Organic electronic components

[0115] 36: Package structure

[0116] 35: Inorganic layer

[0117] 33: Organic layer

[0118] 34: Inorganic layer

[0119] 37: Touch sensor

Claims

1. An encapsulation composition comprising a free radical curable compound having at least one free radical curable functional group and having a composition polarizability, wherein the radical curable compound comprises a monofunctional alicyclic compound X1, a polyfunctional alicyclic compound X2 and an aliphatic compound Y having a linear or branched alkyl group, The aliphatic compound Y having a linear or branched alkyl group includes a monofunctional aliphatic compound Y1, wherein the monofunctional aliphatic compound Y1 is contained in an amount of 20 parts by weight to 120 parts by weight relative to 100 parts by weight of the monofunctional alicyclic compound X1, wherein the composition polarizability is the sum of values ​​obtained by multiplying the "compound polarizability of each radical curable compound" constituting the encapsulating composition and the "weight ratio of the relevant radical curable compound to the encapsulating composition," and The polarizability of the compound is calculated by the following general formula 1: The composition has a polarizability of 1.8 or less, and The encapsulation composition has a dielectric constant of 2.8 or less at any frequency of 110 kHz to 250 kHz and a temperature of 25° C. after curing: [General formula 1] Compound polarizability=(the sum of the number of carbon and the number of oxygen contained in the molecular structure of the relevant radical-curable compound) / (the difference between the number of carbon and the number of oxygen contained in the molecular structure of the relevant radical-curable compound).

2. The encapsulation composition according to claim 1, wherein The monofunctional alicyclic compound X1 is included in an amount of 10 wt % to 60 wt % based on the encapsulation composition.

3. The encapsulation composition according to claim 1, wherein The polyfunctional alicyclic compound X2 is included in an amount of 20 to 120 parts by weight relative to 100 parts by weight of the monofunctional alicyclic compound X1.

4. The encapsulation composition according to claim 1, wherein The aliphatic compound Y having a linear or branched alkyl group is included in an amount of 30 to 300 parts by weight relative to 100 parts by weight of the monofunctional alicyclic compound X1.

5. The encapsulation composition according to claim 1, wherein The monofunctional aliphatic compound Y1 includes an aliphatic compound having an alkyl group having 12 to 24 carbon atoms.

6. The encapsulation composition according to claim 1, wherein The aliphatic compound Y having a linear or branched alkyl group includes a polyfunctional aliphatic compound Y2.

7. The encapsulation composition according to claim 6, wherein The polyfunctional aliphatic compound Y2 is included in an amount of 20 parts by weight to 200 parts by weight relative to 100 parts by weight of the monofunctional alicyclic compound X1.

8. The encapsulation composition according to claim 1, Also contains a photoinitiator.

9. The encapsulation composition according to claim 1, Also contains a surfactant.

10. The encapsulation composition according to claim 1, The packaging composition is a solvent-free ink composition.

11. An organic electronic device comprising: substrate; an organic electronic element formed on the substrate; and an organic layer that seals the entire surface of the organic electronic element and is formed of the encapsulation composition according to any one of claims 1 to 10.

12. The organic electronic device according to claim 11, An inorganic layer is included, which is formed between the organic electronic element and the organic layer or formed on the organic layer.

13. A method for manufacturing an organic electronic device, comprising the step of forming an organic layer formed of the encapsulation composition according to any one of claims 1 to 10 on a substrate having an organic electronic element formed thereon, such that the encapsulation composition seals the entire surface of the organic electronic element.

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