Heating apparatus and method for glass molding machines

Abstract

This invention relates to a heating device and method for molding glass lenses by precisely aligning the upper and lower molds. The heating device and method employed in this invention simultaneously process the through holes of the guide pillars and the mold closing limiting device to ensure the positional accuracy of the three holes, thereby ensuring the precise positioning of the upper and lower mold cores after assembly. Furthermore, by first closing the molds and then clamping them, precise alignment of the upper and lower molds is ensured, improving the shape and dimensional accuracy of the finished product.

Description

Technical Field

[0001] This invention belongs to the field of precision molding technology, and relates to a heating device and method for a glass molding machine, particularly to a heating device and method for molding glass lenses by precisely aligning the upper and lower molds. Background Technology

[0002] Optical glass lens molding technology is a high-precision optical component processing technology. It involves placing softened glass into a high-precision mold and, under heated, pressurized, and oxygen-free conditions, directly molding it in a single step to produce optical parts that meet usage requirements. Developed successfully in the mid-1980s, this technology has been in use for over a decade and is now one of the most advanced optical component manufacturing technologies internationally, having entered practical production in many countries.

[0003] However, some problems still exist with the above-mentioned technology. Current glass molding technology cannot ensure the precise alignment of the upper and lower molds. During the molding process, the eccentricity of the upper and lower molds will lead to a reduction in the shape and dimensional accuracy of the finished product.

[0004] Existing technology CN114163114A discloses an optical glass element molding apparatus, including a control system, a fixed bracket on which a conveying component, a heating component, a mold component, and a first fixed plate are mounted, and a displacement component, a limiting mechanism, and a flipping component are mounted on the first fixed plate. The conveying component, heating component, mold component, displacement component, and flipping component are all electrically connected to the control system. The mold component includes a base and a stamping component. Both ends of the base are equipped with connecting shafts and connected to the displacement component through the connecting shafts. The top surface of the limiting mechanism is in contact with the bottom surface of the base. The top surface of the base is used to mount the female mold. The upper end of the stamping component is connected to the fixed bracket. The stamping component can move up and down and its lower end can extend into the mold cavity. The heating component is implemented through a heating assembly, which includes a gas pipeline and a nozzle. The nozzle is installed in the gas pipeline, and the gas is ignited at the nozzle. The nozzle sprays the flame onto the lower end of the stamping component, thereby heating it.

[0005] CN114149168A discloses a molding apparatus for aspherical lenses that can be rapidly cooled after annealing, including a base, a first mounting seat, and a lower mold. The first mounting seat is located on the top of the base, and the lower mold is located on the front side of the first mounting seat. The lower mold is heated by an infrared lamp to heat the glass semi-finished product to the molding temperature. Then, the glass semi-finished product is molded into shape through a second closed adapting mold. At this time, the operator turns off the infrared lamp, allowing the compressed lens to complete the annealing process on its own. Finally, by introducing coolant into the gaps, the glass lens is rapidly cooled to room temperature, thereby achieving the purpose of rapidly cooling the annealed lens.

[0006] However, the equipment used in these existing technologies does not take into account how optical glass molding technology can ensure the shape and dimensional accuracy of the finished device under heating conditions. Summary of the Invention

[0007] The purpose of this invention is to provide a heating device and method for a glass molding machine, particularly a heating device and method for molding a glass lens by precisely aligning the upper and lower molds; this enables the upper and lower molds to have a high degree of concentricity, thus solving the problem that current glass molding technology cannot ensure precise alignment of the upper and lower molds, and that during the molding process, the eccentricity of the upper and lower molds leads to a reduction in the shape and dimensional accuracy of the finished product.

[0008] This invention provides a heating device for a glass molding machine, comprising: an upper mold frame, an upper mold core, a lower mold frame, a lower mold core, a mold closing limiting device, and a mold closing clamping device; wherein the upper mold core is located on the upper mold frame, the lower mold core is located on the lower mold frame, the mold closing limiting device and the mold closing clamping device are located between the upper mold core and the lower mold core, the mold closing limiting device is closer to the upper mold core, and the mold closing clamping device is closer to the lower mold core;

[0009] A first circular quartz plate and a second circular quartz plate are respectively placed at the middle position of the upper mold frame and the lower mold frame. The first circular quartz plate and the second circular quartz plate are used to separate the silicon mold from the upper and lower mold frames.

[0010] The first circular quartz sheet is placed in the inner ring of the upper mold, and one or more upper mold clamps are fixed to the upper mold frame at the edge of the inner ring of the upper mold; an upper mold arc-shaped quartz sheet is placed on the first circular quartz sheet, which is used to cooperate with the upper mold clamps to clamp the first cylindrical silicon placed in the gap formed by the upper mold arc-shaped quartz sheet as the upper mold core;

[0011] The second circular quartz sheet is placed in the inner ring of the lower mold, and one or more lower mold clamps are fixed to the lower mold frame in the inner ring of the lower mold; an arc-shaped lower mold quartz sheet is placed on the second circular quartz sheet, which is used to cooperate with the lower mold clamps to clamp the second cylindrical silicon placed in the gap formed by the arc-shaped lower mold quartz sheet as the lower mold core.

[0012] The mold closing limiting device includes a mold closing limiting frame; the mold closing clamping device includes an outer ring and an inner ring, with at least one mold closing clamping claw fixed on the edge of the outer ring, one end of each mold closing clamping claw being fixed on the outer ring, and the mold closing clamping claw being clamped by rotating the inner ring by rotating the bolt, thereby clamping the mold closing limiting frame placed therein.

[0013] In another aspect of the heating device of the present invention, the edge of the inner ring of the upper mold is fixed to one or more upper mold clamps on the upper mold frame by pins and bolts.

[0014] In another aspect of the heating device of the present invention, the upper and lower arc-shaped quartz plates are at least two pieces, and are clamped by two opposing push blocks via springs and bolts.

[0015] In another aspect of the heating device of the present invention, at least one guide post is provided on the edge of the upper mold frame for positioning during operation in cooperation with the lower mold frame; at least one guide post is provided on the edge of the lower mold frame for positioning during operation in cooperation with the upper mold frame.

[0016] In another aspect of the heating device of the present invention, the mold closing limit frame is circular and includes a cross-shaped through hole in the middle. The cross-shaped through hole includes four quartz limiting blocks. The quartz limiting blocks are tightly fitted onto the mold closing limit frame by heating and are limited by the upper mold guide post and the lower mold guide post. The outer ring is fixed to the lower mold frame by bolts.

[0017] A method for heating using a heating device for a glass molding machine according to the present invention includes the following steps:

[0018] In an environment with a temperature of approximately 300 degrees Celsius, the heating device heats for approximately 5 minutes. By adjusting the temperature, the mold closing limiting device in the heating device is fastened to the mold closing clamping device, so that the mold closing limiting device and the mold closing clamping device are tightly assembled.

[0019] The wire is clamped into the inner ring of the upper mold and the inner ring of the lower mold using the upper and lower mold arc-shaped quartz plates, and the upper and lower mold claws are used to clamp the upper and lower mold arc-shaped quartz plates.

[0020] The mold closing limiting device is initially positioned using the lower mold core; the mold closing clamping device is fixed to the lower mold frame with screws; the lower mold frame is pushed to the mold closing position to ensure that the mold can be closed, and then the mold closing clamping device is clamped to precisely position the mold closing limiting device; and the lower mold frame is returned to the initial position to complete the installation.

[0021] In another aspect of the heating method of the present invention, the mold closing limiting device and the mold closing clamping device are separated; and

[0022] The upper mold guide post and the lower mold guide post are fixed to the upper mold frame and the lower mold frame respectively by screws, and the upper mold jaw and the lower mold jaw used to clamp the first cylindrical silicon and the second cylindrical silicon are fixed to the upper mold frame and the lower mold frame respectively by push block pins and screws.

[0023] The heating device and method for a glass molding machine provided by this invention employs a centering clamping mechanism to align and calibrate the mold, thereby improving the shape and dimensional accuracy of the finished optical glass lens. The method of using a quartz block to clamp the wire provides a fixed power supply: by clamping the wire onto the silicon pillar with an arc-shaped quartz block, both heat insulation and electrical insulation are ensured, while saving space. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly described below. Obviously, the drawings described below are merely some examples of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any innovative effort.

[0025] Figure 1 This is a schematic diagram of the heating device for a glass molding machine according to the present invention.

[0026] Figures 2(a)-(b) are schematic diagrams of the upper and lower mold frame structures of the heating device of the present invention.

[0027] Figure 3 This is a schematic diagram of the mold closing limiting device and mold closing clamping device of the heating device of the present invention.

[0028] Figure 4 This is a flowchart of a method for heating using the heating device of the present invention. Detailed Implementation

[0029] Specific embodiments of the present invention will now be described with reference to the accompanying drawings. However, the present invention can be embodied in many different forms and should not be construed as limited to the embodiments shown herein. These embodiments are provided only to make the invention detailed and comprehensive, thereby fully describing the scope of the invention to those skilled in the art. The wording used in the detailed description of the embodiments illustrated in the drawings should not be construed as limiting the invention.

[0030] Figure 1 A schematic diagram of the heating device for a glass molding machine according to the present invention. The heating device of the present invention is divided into several parts: an upper mold frame 1, an upper mold core 2, a lower mold frame 6, a lower mold core 5, a mold closing limiting device 3, and a mold closing clamping device 4. The upper mold core 2 is located on the upper mold frame 1, the lower mold core 5 is located on the lower mold frame 6, the mold closing limiting device 3 and the mold closing clamping device 4 are located between the upper mold core 2 and the lower mold core 6, with the mold closing limiting device 3 located closer to the upper mold core 2 and the mold closing clamping device 4 located closer to the lower mold core 6.

[0031] Figures 2(a)-(b) are schematic diagrams of the upper and lower mold frame structures of the heating device of the present invention. A first circular quartz plate 11 and a second circular quartz plate 16 are respectively placed at the middle positions of the upper mold frame 1 and the lower mold frame 6. The first circular quartz plate 11 and the second circular quartz plate 16 are used to separate the silicon mold from the upper and lower mold frames, reducing heat loss and ensuring that there is no electrical connection between them. The first circular quartz plate 11 is placed in the inner ring 10 of the upper mold. One or more upper mold clamps are secured to the edge of the inner ring 10 by pins 28, 28', 28" and bolts 27, 27', 27". Claws 9, 9', 9" are fixed to the upper mold frame 1; at least two arc-shaped quartz plates 8, 8' are placed on the first circular quartz plate 11, and clamped by two opposing push blocks 29, 29' through springs 30, 30', 30", 30''' and bolts 31, 31', to cooperate with the upper mold claws 9, 9', 9" to clamp the first cylindrical silicon 13 placed in the gap formed by the arc-shaped quartz plates as the upper mold core 2; in addition, at least one [missing information] is provided on the edge of the upper mold frame 1. In one embodiment, three guide posts 12, 12', 12" are used for positioning during operation with the lower mold frame 6; correspondingly, the second circular quartz plate 16 on the lower mold frame 6 has the same arrangement, that is, the second circular quartz plate 16 is placed in the lower mold inner ring 18, and one or more lower mold clamps 17, 17', 17" are fixed to the edge of the lower mold inner ring 18 by pins 34, 34', 34" and bolts 33, 33', 33". The lower mold base 6 is fixed on the second circular quartz plate 16; at least two arc-shaped quartz plates 15, 15' are placed on the second circular quartz plate 16 to cooperate with the lower mold claws 17, 17', 17" to clamp the second cylindrical silicon 14 placed in the gap formed by the arc-shaped quartz plates as the lower mold core 5; in addition, at least one, in one embodiment, three guide posts 19, 19', 19" are provided on the edge of the lower mold base 6 to play a positioning role in the process of cooperating with the upper mold base 1.

[0032] Figure 3This is a schematic diagram of the mold closing limiting device and the mold closing clamping device of the heating device of the present invention. The mold closing limiting device 3 includes a mold closing limiting frame 22, which is circular and includes a cross-shaped through hole 40 in the middle. The cross-shaped through hole 40 includes four quartz limiting blocks 21(a)-(d). The quartz limiting blocks 21(a)-(d) are tightly fitted onto the mold closing limiting frame 22 by heating and are limited by the upper mold guide posts 12, 12', 12" and the lower mold guide posts 19, 19', 19". The mold clamping device 4 includes an outer ring 25 and an inner ring 24. At least one, or three, mold clamping jaws 23, 23', and 23" are fixed on the edge of the outer ring 25. One end of each mold clamping jaw is fixed to the outer ring. The inner ring 24 is rotated by rotating the bolt 26' to clamp the mold clamping jaws 23, 23', and 23" thereby clamping the mold clamping limit frame 22 placed therein. The outer ring 25 is fixed to the lower mold frame 6 by the bolt 26.

[0033] Figure 4This is a flowchart illustrating the heating process using the heating device of the present invention. Step 401: By adjusting the temperature, the mold closing limiting device 3 is fastened to the mold closing clamping device 4. The mold closing limiting device 3 is made of quartz material, and the mold closing clamping device 4 is made of stainless steel material. Under the same temperature conditions, the coefficient of thermal expansion of stainless steel is greater than that of quartz material. Therefore, under the same heating environment, the mold closing limiting device 3 can be tightly assembled with the mold closing clamping device 4. For example, in a temperature environment of approximately 300 degrees Celsius, with a heating time of approximately 5 minutes, the mold closing limiting device 3 and the mold closing clamping device 4 can be assembled without detaching. In a temperature environment of approximately 300 degrees Celsius, the mold closing limiting device 3 and the mold closing clamping device 4 can be easily separated using screws (32, 32', 32" and 36"). The upper mold guide pillars 12, 12', 12" and the lower mold guide pillars 19, 19', 19" are fixed to the upper mold frame 1 and the lower mold frame 6 respectively by push pins 29, 29' and screws (27, 27', 27" and 28, 28', 28" and 33, 33', 33" and 34, 34', 34"), which are used to clamp the first cylindrical silicon 13 and the second cylindrical silicon 14, i.e. the upper mold core 2 and the lower mold core 5, are fixed to the upper mold frame 1 and the lower mold frame 6 respectively; in step 402, the upper mold guide pillars 12, 12', 12" and the lower mold guide pillars 19, 19', 19" are fixed to the upper mold frame 1 and the lower mold frame 6 respectively by push pins 29, 29' and screws (27, 27', 27" and 28, 28', 28" and 33, 33', 33" and 34, 34', 34"). The arc-shaped quartz plates 8, 8' and the lower mold arc-shaped quartz plates 15, 15' clamp the wires and place them into the inner ring 10 of the upper mold and the inner ring 18 of the lower mold. The upper mold jaws 9, 9', 9" and the lower mold jaws 17, 17', 17" clamp the upper mold arc-shaped quartz plates 8, 8' and the lower mold arc-shaped quartz plates 15, 15'. In step 403, the mold closing limiting device 3 is initially positioned by the lower mold core 6. In step 404, the mold closing clamping device 4 is fixed to the lower mold frame 6 with screws. The lower mold frame is pushed to the mold closing position to ensure that the mold can be closed. Then, the mold closing clamping device 4 is clamped to precisely position the mold closing limiting device 3. The lower mold frame is returned to the initial position to complete the installation.

[0034] This invention employs a novel centering clamping mechanism for aligning the upper and lower molds: three grippers hold the lower mold core, upper mold core, and mold closing limit device at their geometric center. During machining, the through holes of the guide pillars and mold closing limit device are machined simultaneously to ensure the positional accuracy of the three holes, thereby ensuring precise positioning of the upper and lower mold cores after assembly. Precise alignment of the upper and lower molds is further ensured by closing the molds before clamping. A novel power supply method uses quartz blocks to clamp the wires, securing them to the silicon pillars. This method ensures both heat insulation and electrical insulation while saving space.

[0035] The terms "an embodiment," "embodiment," or "one or more embodiments" as used herein mean that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment of the invention. Furthermore, please note that the examples of the phrase "in one embodiment" do not necessarily all refer to the same embodiment.

[0036] The above description is only for illustrating the technical solutions of the present invention. Any person skilled in the art can modify and change the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims. The present invention has been described above with reference to examples. However, other embodiments besides those described above within the scope of the present invention are also feasible. Different features and steps of the present invention can be combined in ways other than those described. The scope of the present invention is limited only by the appended claims. More generally, those skilled in the art will readily understand that all parameters, dimensions, materials, and configurations described herein are for illustrative purposes. Actual parameters, dimensions, materials, and / or configurations will depend on the specific application or the application for which the teachings of the present invention are applied.

Claims

1. A heating device for a glass molding machine, comprising: Upper mold frame (1), upper mold core (2), lower mold frame (6), lower mold core (5), mold closing limit device (3), mold closing clamping device (4); wherein the upper mold core (2) is located on the upper mold frame (1), the lower mold core (5) is located on the lower mold frame (6), the mold closing limit device (3) and the mold closing clamping device (4) are located between the upper mold core (2) and the lower mold core (5), the mold closing limit device (3) is close to the upper mold core (2), and the mold closing clamping device (4) is close to the lower mold core (5); A first circular quartz plate (11) and a second circular quartz plate (16) are respectively placed at the middle positions of the upper mold frame (1) and the lower mold frame (6). The first circular quartz plate (11) and the second circular quartz plate (16) are used to separate the silicon mold from the upper mold frame and the lower mold frame. The first circular quartz plate (11) is placed in the inner ring (10) of the upper mold, and one or more upper mold clamps (9, 9', 9") are fixed to the upper mold frame (1) at the edge of the inner ring (10); on the first circular quartz plate (11), an upper mold arc-shaped quartz plate (8, 8') is placed to cooperate with the upper mold clamps (9, 9', 9") to clamp the first cylindrical silicon (13) placed in the gap formed by the upper mold arc-shaped quartz plate (8, 8') as the upper mold core (2); The second circular quartz plate (16) is placed in the inner ring (18) of the lower mold, and one or more lower mold clamps (17, 17', 17") are fixed to the lower mold frame (6) in the inner ring (18); on the second circular quartz plate (16), a lower mold arc-shaped quartz plate (15, 15') is placed to cooperate with the lower mold clamps (17, 17', 17") to clamp the second cylindrical silicon (14) placed in the gap formed by the lower mold arc-shaped quartz plate (15, 15') as the lower mold core (5); The mold closing limiting device (3) includes a mold closing limiting frame (22); the mold closing clamping device (4) includes an outer ring (25) and an inner ring (24). At least one mold closing claw (23, 23', 23") is fixed on the edge of the outer ring (25). One end of each mold closing claw is fixed on the outer ring. The mold closing claw (23, 23', 23") is clamped by rotating the inner ring (24) by rotating the first bolt (26'), thereby clamping the mold closing limiting frame (22) placed therein.

2. The heating device as described in claim 1, wherein, The edge of the inner ring (10) of the upper mold is fixed to one or more upper mold clamps (9,9,9") on the upper mold frame (1) by pins (28, 28', 28") and second bolts (27, 27', 27").

3. The heating device as described in any one of claims 1-2, wherein, The upper mold arc-shaped quartz sheet (8, 8') and the lower mold arc-shaped quartz sheet (15, 15') are at least two pieces, and are clamped by two opposing push blocks (29, 29') through springs (30, 30', 30", 30''') and a third bolt (31, 31').

4. The heating device as described in any one of claims 1-2, wherein, At least one guide post (12, 12', 12") is provided on the edge of the upper mold frame (1) to play a positioning role in the process of working with the lower mold frame (6); at least one guide post (19, 19', 19") is provided on the edge of the lower mold frame (6) to play a positioning role in the process of working with the upper mold frame (1).

5. The heating device as described in any one of claims 1-2, wherein the mold closing limit frame (22) is circular and includes a cross-shaped through hole (40) in the middle, wherein the cross-shaped through hole (40) includes four quartz limiting blocks (21(a)-(d)), wherein the quartz limiting blocks (21(a)-(d)) are tightly fitted onto the mold closing limit frame (22) by heating, and are limited by the upper mold guide post (12,12',12") and the lower mold guide post (19,19',19"); wherein the outer ring (25) is fixed to the lower mold frame (6) by the fourth bolt (26).

6. A method for heating using a heating device for a glass molding machine, comprising the following steps: In a temperature environment of 300 degrees Celsius, the heating device as described in claim 5 is heated for 5 minutes. By adjusting the temperature, the mold closing limiting device (3) in the heating device is fastened to the mold closing clamping device (4); so that the mold closing limiting device (3) and the mold closing clamping device (4) are tightly assembled. The wire is clamped into the inner ring (10) of the upper mold and the inner ring (18) of the lower mold using the upper mold arc-shaped quartz plates (8, 8') and the lower mold arc-shaped quartz plates (15, 15'), and the upper mold claws (9, 9', 9") and the lower mold claws (17, 17', 17") are used to clamp the upper mold arc-shaped quartz plates (8, 8') and the lower mold arc-shaped quartz plates (15, 15'). The mold closing limit device (3) is initially positioned by the lower mold core (5); Fix the mold clamping device (4) to the lower mold frame (6) with screws; push the lower mold frame to the mold closing position to ensure that the mold can be closed, clamp the mold clamping device (4) to precisely position the mold closing limit device (3); and return the lower mold frame to the initial position to complete the installation.

7. The heating method as described in claim 6, wherein... The mold closing limiting device (3) and the mold closing clamping device (4) are separated; and The upper mold guide post (12, 12, 12") and the lower mold guide post (19, 19, 19") are fixed to the upper mold frame (1) and the lower mold frame (6) respectively by screws (32, 32', 32", 36, 36', 36"), and the upper mold clamping jaw (9, 9', 9") and the lower mold clamping jaw (17, 17', 17") for clamping the first cylindrical silicon (13) and the second cylindrical silicon (14) are fixed to the upper mold frame (1) and the lower mold frame (6) respectively by push blocks (29, 29'), pins (28, 28', 28") and second bolts (27, 27', 27") respectively.

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