A PCB hole copper plating device

Abstract

The application discloses a PCB hole copper plating device and particularly relates to the technical field of printed circuit board manufacturing, which comprises a vacuum bubble breaking section, a water blocking buffer section is arranged at the left end of the vacuum bubble breaking section, an electrolytic reaction tank is arranged at the left end of the water blocking buffer section, a circulating filter group is arranged at the front part of the electrolytic reaction tank, and the vacuum bubble breaking section, the water blocking buffer section, the electrolytic reaction tank and the circulating filter group all belong to the copper tank inlet section. The first suction disc and the second suction disc are arranged in the vacuum bubble breaking section, the bubbles in the holes are drawn off before PCB plating, the hole walls of the PCB can also be plated, the plating uniformity is good, and the quality is high. The sliding block capable of adjusting the height of the suction disc and the rack capable of adjusting the front and back positions of the suction disc are arranged in the vacuum bubble breaking section, so that the first suction disc and the second suction disc can fully break the bubbles in the holes of PCBs with different sizes, and the application range of the suction disc is widened.

Description

Technical Field

[0001] This invention relates to the field of printed circuit board manufacturing technology, and more specifically to a copper plating device for holes in PCB boards. Background Technology

[0002] A PCB (Printed Circuit Board) is a crucial component in the electronics industry. It consists of an insulating base plate, connecting wires, and pads for mounting and soldering electronic components. It serves the dual purpose of conducting circuitry and acting as an insulating base, replacing complex wiring to achieve electrical connections between components. During PCB manufacturing, unused spaces without wiring are filled with solid copper to reduce ground impedance, improve interference immunity, lower voltage drop, and increase power efficiency. Furthermore, it reduces loop area when connected to ground. Therefore, copper plating is a very important step in PCB manufacturing.

[0003] Copper electroplating involves depositing a copper layer on the surface of a PCB board using an electrolytic method. However, in existing copper electroplating processes, the conveyor unit first transports the PCB board to various pre-processing sections for pre-treatment, and then sends the pre-treated PCB board into the electroplating section. During the process of sending the PCB board into the electroplating section, the PCB board is exposed to air and enters the liquid, resulting in air bubbles adhering to its surface and inside the holes. Traditional defoaming methods are effective at removing air bubbles from the PCB board surface, but they are difficult to remove air bubbles inside the holes, especially small ones. If air bubbles remain inside the holes, the metal cannot adhere to the hole walls during electroplating, thus affecting the electroplating quality. Summary of the Invention

[0004] To achieve the above objectives, the present invention provides the following technical solution: a copper plating device for holes in a PCB board, comprising:

[0005] The vacuum bubble breaking section has a water-blocking buffer section at its left end, an electrolytic reaction tank at its left end, and a circulating filter group at the front of the electrolytic reaction tank. The vacuum bubble breaking section, the water-blocking buffer section, the electrolytic reaction tank, and the circulating filter group all belong to the copper tank inlet section.

[0006] The vacuum defoaming section, the water-blocking buffer section, and the electrolytic reaction tank are on the same horizontal line and are interconnected. The electrolytic reaction tank and the circulating filter group are on the same vertical line and are intermittently connected.

[0007] The vacuum bubble breaking section includes a mounting frame, a first suction cup, a second suction cup, and isolation balls. The mounting frame is fixedly installed on the right wall of the water-blocking buffer section. The front and rear parts of the mounting frame are respectively provided with the second suction cup and the first suction cup. Several isolation balls are rolled on the rear wall of the second suction cup and the front wall of the first suction cup.

[0008] Furthermore, the vacuum debubbling section also includes a horizontal limiting output pipe, a first limiting slide, a main flow input pipe, a vertical limiting branch pipe, a second limiting slide, and a connecting pipe. A horizontal limiting output pipe is fixedly installed on the lower left part of the rear wall of the second suction cup and the front wall of the first suction cup. The front horizontal limiting output pipe is connected to the second suction cup, and the rear horizontal limiting output pipe is connected to the first suction cup. The outer walls of both horizontal limiting output pipes are slidably fitted with first limiting slides. A main flow input pipe is fixedly installed at the rear end of the rear first limiting slide. The main flow input pipe is fixedly connected to the rear wall of the mounting frame. The front and rear first limiting slides are vertically slidable... The main inlet pipe is fixedly connected to the upper inlet of the vacuum degasser, and the outlet pipe of the vacuum degasser is connected to the water-blocking buffer section. Vertical limiting branch pipes are fixedly installed on the lower walls of the two first limiting slide cylinders, and the first limiting slide cylinders are connected to the vertical limiting branch pipes. Second limiting slide cylinders are slidably installed on the outer walls of the two vertical limiting branch pipes. A connecting pipe is fixedly installed between the lower walls of the two second limiting slide cylinders. The upper front end and upper rear end of the connecting pipe are respectively connected to the upper front and lower rear second limiting slide cylinders. The two second limiting slide cylinders and the connecting pipe are fixedly installed on the lower part of the mounting frame.

[0009] Furthermore, the vacuum debubbling section also includes a base, a slide rail, a slider, and a positioning plate. A pair of bases are fixedly installed at the four corners of the through groove in the middle of the mounting frame. Each pair of bases is vertically opposite to each other. A slide rail is fixedly installed between each pair of bases. A slider is slidably installed on the slide rail. A positioning plate is fixedly installed on the inner wall of the slider. The inner walls of the two front positioning plates and the two rear positioning plates are fixedly connected to the second suction cup and the first suction cup.

[0010] Furthermore, the vacuum debubbling section also includes mounting seats, rotating shafts, gears, limiting guide rails, and racks. The front and rear walls of the mounting frame are each provided with transmission grooves, and three pairs of mounting seats are fixedly installed in each transmission groove. Rotating shafts are rotatably connected between the three front and two rear mounting seats. Gears are fixedly sleeved on the upper and middle outer walls of the four rotating shafts. Two pairs of limiting guide rails are fixedly installed in each transmission groove. The three front pairs of mounting seats are respectively located at the upper, middle, and lower parts in front of the second suction cup. The three rear pairs of mounting seats... The mounting bases are respectively located at the upper, middle, and lower parts behind the first suction cup. The positions of the four pairs of limiting guide rails and gears correspond to the upper two pairs of mounting bases and the middle two pairs of mounting bases, respectively. A rack is provided above each of the four pairs of limiting guide rails. A guide bar is fixedly connected to the lower wall of the rack, and the guide bar is slidably connected to the limiting guide rail. The rear ends of the four front racks are slidably connected to the front wall of the second suction cup, and the front ends of the four rear racks are slidably connected to the rear wall of the first suction cup. The racks are meshed with the gears, and the racks are slidably installed in the transmission groove.

[0011] Furthermore, the vacuum debubbling section also includes a stepper motor, sprockets, and a chain. Stepper motors are fixedly installed on the two mounting seats at the lower right. The output end of the stepper motor is fixedly connected to the lower end of the two rotating shafts at the right. Sprockets are fixedly sleeved on the lower outer walls of the four rotating shafts. A chain is driven between the outer walls of the two front sprockets and the two rear sprockets.

[0012] The present invention has the following advantages:

[0013] 1. By setting a first suction cup and a second suction cup, the invention removes air bubbles from the holes of the PCB board before copper plating, so that the hole walls of the PCB board can also be plated, resulting in good uniformity and high quality of copper plating.

[0014] 2. By setting an adjustable slider for the height of the suction cup and a rack for adjusting the front and rear positions of the suction cup, the first and second suction cups can completely remove air bubbles in the holes of electroplated PCB boards of different sizes, thus broadening the application range of the suction cups. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the invention from a southwest perspective;

[0016] Figure 2 This is a three-dimensional structural diagram of the vacuum bubble-breaking section of the present invention from a southwest perspective;

[0017] Figure 3 This is a schematic cross-sectional view of the left side of the vacuum bubble breaking section of the present invention.

[0018] Figure 4 This is a three-dimensional schematic diagram of the vacuum bubble breaking section transmission structure of the present invention from a southwest perspective;

[0019] Figure 5 For the present invention Figure 4 Enlarged schematic diagram of the structure of region A in the middle;

[0020] Figure 6 This is a three-dimensional schematic diagram of the vacuum bubble breaking section transmission structure of the present invention from a southeast perspective;

[0021] Figure 7 For the present invention Figure 6 Enlarged schematic diagram of the structure of region B in the middle;

[0022] Figure 8 This is a schematic diagram of the gas-liquid flow direction in the vacuum degassing section of the present invention;

[0023] Figure 9 This is a flowchart of the electroplating process for the electroplated PCB board of the present invention.

[0024] In the picture:

[0025] 1. Vacuum bubble breaking section; 101. Mounting bracket; 102. First suction cup; 103. Second suction cup; 104. Isolation ball; 105. Horizontal limiting output tube; 106. First limiting slide cylinder; 107. Main stream input tube; 108. Vertical limiting branch tube; 109. Second limiting slide cylinder; 110. Connecting tube;

[0026] 111. Base; 112. Slide rail; 113. Slider; 114. Positioning plate; 115. Mounting base; 116. Rotating shaft; 117. Gear; 118. Limiting guide rail; 119. Rack; 120. Stepper motor; 121. Sprocket; 122. Chain;

[0027] 2. Water-blocking buffer section;

[0028] 3. Electrolytic reaction cell;

[0029] 4. Circulating filter group. Detailed Implementation

[0030] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments described are not intended to limit the present invention.

[0031] As described in the background section, during the process of feeding the PCB board into the electroplating section, the conveying unit of the existing electroplating production line causes the PCB board to be exposed to liquid from air. As a result, some air bubbles will adhere to the surface and holes of the PCB board. Traditional defoaming methods are very effective at removing air bubbles from the surface of the PCB board, but they are difficult to remove air bubbles from some holes, especially some small holes. If air bubbles remain in the holes, the metal will not be able to adhere to the hole walls during electroplating, and the plating will not be possible, thus affecting the electroplating quality.

[0032] like Figure 1 and Figure 9 As shown, to solve the above problems, the inventors devoted themselves to research and discovered that by setting two suction cups parallel to the front view of the PCB board in the entry section of the electroplating tank, activating the suction cups can break and remove air bubbles in the holes of the front and rear walls of the PCB board, extracting water and air bubbles from the electroplating tank. The de-foamed water is then discharged into the middle section of the electroplating tank, allowing bubble-free water to circulate into the entry section. This ensures that the plating tank has sufficient plating solution for electrolysis while simultaneously removing air bubbles from the holes of the PCB board. Therefore, a copper plating device for holes in PCB boards was invented, comprising:

[0033] Vacuum bubble breaking section 1, water-blocking buffer section 2 is set at the left end of vacuum bubble breaking section 1, electrolytic reaction tank 3 is set at the left end of water-blocking buffer section 2, and circulating filter group 4 is set at the front of electrolytic reaction tank 3. Vacuum bubble breaking section 1, water-blocking buffer section 2, electrolytic reaction tank 3 and circulating filter group 4 all belong to copper tank inlet section.

[0034] Vacuum degassing section 1 is used to remove bubbles from the holes of the electroplated PCB board and bubbles from the electrolyte before entering the electrolytic reaction tank 3.

[0035] The water-blocking buffer section 2 is used to receive the bubble-free electrolyte extracted from the vacuum degassing section 1 and processed by the vacuum degasser, and after depressurizing the electrolyte, it is discharged into the electrolysis reaction tank 3.

[0036] Electrolytic reaction tank 3 is used to electroplate PCB boards, so that metal is attached to the surface of the PCB board to form a coating;

[0037] The circulating filter group 4 is used to circulate the electrolyte in the electrolysis reaction tank 3, remove impurities from the electrolyte, add additives, and keep the chemical properties of the electrolyte unchanged.

[0038] Vacuum bubble breaking section 1, water-blocking buffer section 2 and electrolysis reaction tank 3 are on the same horizontal line and interconnected. Electrolysis reaction tank 3 and circulating filter group 4 are on the same vertical line and intermittently connected.

[0039] In the process of using this invention, the electroplated PCB board, after pre-plating treatment, is moved horizontally above the vacuum degassing section 1 by the conveying unit of the electroplating production line, and then descends into the vacuum degassing section 1. The vacuum degassing section 1 uses vacuum to generate suction, removing air bubbles from the front wall, back wall, and holes of the electroplated PCB board. During the suction process, the electrolyte in the vacuum degassing section 1 is also sucked away. The gas-liquid mixture passes through a vacuum degasser for gas-liquid separation, and the electrolyte is discharged into the water-blocking buffer section 2. After the water-blocking buffer section 2 depressurizes the electrolyte, it is discharged into the electrolysis reaction tank 3. At the same time, the electrolyte flows back into the vacuum degassing section 1, and the PCB board also undergoes vacuum degassing. Section 1 is horizontally moved by the conveyor unit of the electroplating production line to the water-blocking buffer section 2, and then enters the electrolytic reaction tank 3. The electrolytic reaction tank 3 electroplats the PCB board, causing the metal to adhere to the surface of the PCB board, including the small holes, to form a coating. As the electrolyte in the electrolytic reaction tank 3 continuously undergoes electrolytic reactions, the additives in the electrolyte are continuously consumed and reduced, while impurities continuously increase. At this time, the circulating filter group 4 extracts and filters the old electrolyte, adds new additives, and then discharges the treated electrolyte into the electrolytic reaction tank 3. By maintaining the circulating filtration of the electrolyte, the chemical properties of the electrolyte can be kept unchanged, resulting in good copper plating quality.

[0040] Example 1

[0041] Based on the above embodiments, this embodiment provides a copper plating device for in-hole plating on a PCB board, such as... Figure 1-4 As shown in Figures 6-9, the vacuum bubble-breaking section 1 includes a mounting frame 101, a first suction cup 102, a second suction cup 103, and an isolation ball 104. The mounting frame 101 is fixedly installed on the right wall of the water-blocking buffer section 2. The second suction cup 103 and the first suction cup 102 are respectively installed at the front and rear parts of the mounting frame 101. By this arrangement, the suction frequencies of the second suction cup 103 and the first suction cup 102 are staggered. Then, the second suction cup 103 and the first suction cup 102 are activated to respectively suction the bubbles in the holes in the front wall of the electroplated PCB board, the bubbles in the holes in the rear wall, and the bubbles in the through holes penetrating the PCB board. During the suction process, the electrolyte in the vacuum bubble-breaking section 1 is drawn into the output pipe along with the bubbles. The rear wall of suction cup 103 and the front wall of first suction cup 102 are both provided with a number of isolation balls 104. The isolation balls 104 are used to separate the distance between the second suction cup 103 and the first suction cup 102 and the outer wall of the PCB board. On the one hand, this allows the second suction cup 103 and the first suction cup 102 to work normally without the suction hole being blocked by the electroplated PCB board, thus ensuring the suction effect. On the other hand, it prevents the second suction cup 103 and the first suction cup 102 from directly contacting the electroplated PCB board, avoiding damage to the PCB board caused by squeezing during suction. When the PCB board moves left and right between the second suction cup 103 and the first suction cup 102, the isolation balls 104 rotate accordingly, which also assists in the movement of the PCB board.

[0042] Furthermore, such as Figure 1-4 and Figure 6-8 The vacuum debulking section 1 also includes a horizontal limiting output pipe 105, a first limiting slide cylinder 106, a main flow input pipe 107, a vertical limiting branch pipe 108, a second limiting slide cylinder 109, and a connecting pipe 110. A horizontal limiting output pipe 105 is fixedly installed on the lower left side of the rear wall of the second suction cup 103 and the front wall of the first suction cup 102. The front horizontal limiting output pipe 105 is connected to the second suction cup 103, and the rear horizontal limiting output pipe 105 is connected to the first suction cup 102. A first limiting slide cylinder 106 is slidably sleeved on the outer wall of both horizontal limiting output pipes 105. The first limiting slide 106 has a main flow input pipe 107 fixedly installed at its rear end. The electrolyte and bubbles extracted from the vacuum degassing section 1 by the first suction cup 102 flow into the rear horizontal limiting output pipe 105, and then flow into the main flow input pipe 107 via the rear first limiting slide 106, eventually reaching the vacuum degasser. At the same time, the electrolyte and bubbles extracted from the vacuum degassing section 1 by the second suction cup 103 flow into the front horizontal limiting output pipe 105, and then flow into the connecting pipe via the front first limiting slide 106 and the vertical limiting branch pipe 108. In pipe 110, the water flows into the rear second limiting slide 109, the vertical limiting branch pipe 108, and the first limiting slide 106, then into the main flow input pipe 107, and finally into the vacuum degasser. The main flow input pipe 107 is fixedly connected to the rear wall of the mounting frame 101. The front first limiting slide 106 and the rear first limiting slide 106 are respectively vertically slidably installed in the left and right walls of the mounting frame 101. The output end of the main flow input pipe 107 is fixedly connected to the upper input port of the vacuum degasser. The output pipe of the vacuum degasser is connected to the water-blocking buffer section 2. A vertical limiting branch pipe 108 is fixedly installed on the lower wall of a limiting slide cylinder 106, and the first limiting slide cylinder 106 is connected to the vertical limiting branch pipe 108. A second limiting slide cylinder 109 is slidably installed on the outer wall of the two vertical limiting branch pipes 108. A connecting pipe 110 is fixedly installed between the lower walls of the two second limiting slide cylinders 109. The upper front end and the upper rear end of the connecting pipe 110 are respectively connected to the upper front and the lower rear of the second limiting slide cylinder 109. The two second limiting slide cylinders 109 and the connecting pipe 110 are fixedly installed on the lower part of the mounting frame 101.

[0043] Specifically, when processing PCBs of the same batch and size, before the PCBs enter the electroplating tank for copper plating, they first reach the vacuum de-foaming section 1. Through a specific setup, the second suction cup 103 and the first suction cup 102 move synchronously towards the PCB. This allows the front and rear isolation balls 104 to contact the front and rear walls of the PCB, respectively, separating the second suction cup 103 and the first suction cup 102 from the outer wall of the PCB. This ensures that the second suction cup 103 and the first suction cup 102 can function normally, preventing the suction holes from being blocked by the electroplated PCB and guaranteeing the suction effect. Furthermore, it prevents direct contact between the second suction cup 103 and the first suction cup 102 and the electroplated PCB, avoiding damage caused by squeezing during suction. As the PCB moves left and right between the second suction cup 103 and the first suction cup 102, the isolation balls 104 rotate accordingly, further assisting the movement of the PCB. Then, through... The suction frequencies of the second suction cup 103 and the first suction cup 102 are staggered. When the second suction cup 103 and the first suction cup 102 are activated, they can respectively suck up air bubbles in the blind holes of the front and rear walls of the PCB board, as well as air bubbles in the through holes penetrating the electroplated PCB board. During the suction process, the electrolyte in the vacuum bubble-breaking section 1 is drawn into the vacuum degasser along with the air bubbles for degassing. After the degassing is completed, the bubble-free liquid is discharged into the water-blocking buffer section 2 and then flows back into the vacuum bubble-breaking section 1, so that the electrolyte level in the vacuum bubble-breaking section 1 is level with the water-blocking buffer section 2 and the electrolytic reaction tank 3. The PCB board after the bubble-breaking treatment will not be exposed to the air, thereby eliminating air bubbles in the holes of the electroplated PCB board. When the PCB board reaches the electrolytic reaction tank 3 for electroplating, the hole walls of the electroplated PCB board can also be plated. The copper layer thickness of the PCB board surface and the hole walls is basically the same, the copper plating surface of the PCB board is uniform, and the copper plating quality is high.

[0044] Example 2

[0045] Based on the above embodiments, this embodiment provides a copper plating device for in-hole plating on a PCB board, such as... Figure 2-8As shown, the vacuum debubbling section 1 also includes a base 111, a slide rail 112, a slider 113, and a positioning plate 114. A pair of bases 111 are fixedly installed at the four corners of the central through-slot of the mounting bracket 101. Each pair of bases 111 is vertically opposite to each other. A slide rail 112 is fixedly installed between each pair of bases 111. A slider 113 slides on the slide rail 112. A positioning plate 114 is fixedly installed on the inner wall of the slider 113. The inner walls of the two front positioning plates 114 and the two rear positioning plates 114 are fixedly connected to the second suction cup 103 and the first suction cup 102. The position of the plated PCB board is higher or lower than the suction range of the second suction cup 103 and the first suction cup 102. When the holes located at the bottom or top of the electroplated PCB cannot be sucked up to break bubbles, the four sliders 113 are simultaneously activated to slide and rise on the four slide rails 112, which can simultaneously drive the first suction cup 102 and the second suction cup 103 to rise and fall, move to the part of the upper or lower part of the electroplated PCB that was originally not sucked up, and perform suction work. When the first suction cup 102 and the second suction cup 103 rise and fall, the horizontal limiting output pipe 105, the first limiting slide cylinder 106, the main input pipe 107 and the vertical limiting branch pipe 108 slide and rise and fall in the mounting bracket 101. At the same time, the lower end of the vertical limiting branch pipe 108 rises and falls in the second limiting slide cylinder 109.

[0046] Furthermore, the vacuum debubbling section 1 also includes mounting bases 115, rotating shafts 116, gears 117, limiting guide rails 118, and racks 119. The front and rear walls of the mounting frame 101 are each provided with transmission grooves, and three pairs of mounting bases 115 are fixedly installed in each transmission groove. Rotating shafts 116 are rotatably connected between the three front mounting bases and the two rear mounting bases 115. Gears 117 are fixedly sleeved on the upper and middle outer walls of the four rotating shafts 116. Each rotating shaft 116... Each gear can drive two corresponding gears 117 in upper and lower positions. Two pairs of limiting guide rails 118 are fixedly installed in each transmission groove. The front three pairs of mounting seats 115 are respectively located at the upper, middle, and lower parts in front of the second suction cup 103. The rear three pairs of mounting seats 115 are respectively located at the upper, middle, and lower parts behind the first suction cup 102. The positions of the four pairs of limiting guide rails 118 and gears 117 correspond to the upper two pairs of mounting seats 115 and the middle two pairs of mounting seats 115, respectively. Correspondingly, each of the four pairs of limiting guide rails 118 is provided with a rack 119 above it. A guide bar is fixedly connected to the lower wall of the rack 119. The rack 119 and the guide bar are linked, and the guide bar is slidably connected to the limiting guide rail 118, which restricts the movement path of the rack 119. The rear ends of the four front racks 119 are slidably connected to the front wall of the second suction cup 103, and the front ends of the four rear racks 119 are slidably connected to the rear wall of the first suction cup 102. The racks 119 are also meshed with gears 117. The rack 119 is slidably installed in the transmission groove. When the gear 117 rotates with the shaft 116 and meshes with the rack 119, the rack 119 can push the first suction cup 102 and the second suction cup 103 to move relative to or in opposite directions, so that the isolation ball 104 on the first suction cup 102 and the second suction cup 103 contacts the outer wall of the PCB board, so as to ensure that the first suction cup 102 and the second suction cup 103 maintain an effective adsorption distance with the electroplated PCB board, so as to achieve a good adsorption effect of air bubbles in the hole.

[0047] Furthermore, the vacuum debubbling section 1 also includes a stepper motor 120, a sprocket 121, and a chain 122. The two mounting bases 115 at the lower right are each fixedly equipped with a stepper motor 120. The output end of the stepper motor 120 is fixedly connected to the lower end of the two rotating shafts 116 on the right. The two stepper motors 120 provide power for the rotation of the two rotating shafts 116 on the left. The lower outer wall of the four rotating shafts 116 is fixedly sleeved with a sprocket 121. The outer walls of the two front sprockets 121 and the two rear sprockets 121 are connected by a chain 122. Under the chain drive of the sprockets 121 and the chain 122, the rotation of the two rotating shafts 116 on the left can drive the two rotating shafts 116 on the right to move together, driving the meshing transmission of the rack 119 and the gear 117.

[0048] Specifically, after a batch of PCBs of the same size, whose dimensions match the original positions of the second suction cup 103 and the first suction cup 102, is processed, if the position of the next batch of PCBs is higher or lower than the suction range of the second suction cup 103 and the first suction cup 102, and the width of the PCBs does not match the original positions of the second suction cup 103 and the first suction cup 102, then the four sliders 113 can be simultaneously activated to slide and rise on the four slide rails 112, thereby simultaneously driving the first suction cup 102 and the second suction cup 103 to rise and fall, moving towards the electroplated PC. The upper or lower part of the PCB board that was originally inaccessible to suction is suctioned, allowing air bubbles in the holes at various locations on the PCB board to be broken. When the first suction cup 102 and the second suction cup 103 rise and fall, the horizontal limiting output pipe 105, the first limiting slide cylinder 106, the main input pipe 107, and the vertical limiting branch pipe 108 slide and rise and fall in the mounting bracket 101. At the same time, the lower end of the vertical limiting branch pipe 108 rises and falls in the second limiting slide cylinder 109. Then, the two stepper motors 120 are activated to drive the two rotating shafts 11 on the left. 6. With the chain drive of sprocket 121 and chain 122, the rotation of the two left-side rotating shafts 116 can drive the two right-side rotating shafts 116 in conjunction, driving the meshing transmission of rack 119 and gear 117. This causes rack 119 to move back and forth under the sliding limit action of guide bar and limiting guide rail 118, pushing the first suction cup 102 and the second suction cup 103 to move relative to or in opposite directions, reducing or increasing the distance between the first suction cup 102 and the second suction cup 103 to accommodate electroplated PCB boards of different thicknesses. When the distance is adjusted, the first suction cup... The isolation ball 104 on the first suction cup 102 and the second suction cup 103 contacts the outer wall of the PCB board to ensure that the first suction cup 102 and the second suction cup 103 maintain an effective adsorption distance with the electroplated PCB board. The suction force of the suction cup is sufficient to break and remove air bubbles in the holes of the PCB board, so that the adsorption effect of air bubbles in the holes is good. The position of the first suction cup 102 and the second suction cup 103 can be adjusted so that it can be applied to the de-bubbling work of electroplated PCB boards of different sizes, thus broadening the application range of the first suction cup 102 and the second suction cup 103, making it highly applicable and easy to promote.

[0049] Although the present invention has been described in detail above with general descriptions and specific embodiments, modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, all such modifications or improvements made without departing from the spirit of the present invention fall within the scope of protection claimed by the present invention.

Claims

1. A PCB in-hole copper plating apparatus, characterized by, The utility model relates to a copper tank inlet section vacuum bubble breaking section (1) is provided with water retaining buffer section (2) in left end, water retaining buffer section (2) is provided with electrolytic reaction tank (3) in left end, and the front part of electrolytic reaction tank (3) is provided with circulating filter group (4), and vacuum bubble breaking section (1), water retaining buffer section (2), electrolytic reaction tank (3) and circulating filter group (4) all belong to copper tank inlet section. Vacuum bubble breaking section (1), water retaining buffer section (2) and electrolytic reaction tank (3) are on the same horizontal line and are interconnected, and electrolytic reaction tank (3) and circulating filter group (4) are on the same vertical line and are intermittently connected. Vacuum bubble breaking section (1) includes mounting frame (101), right wall of water retaining buffer section (2) is fixedly provided with mounting frame (101), and front part and rear part in mounting frame (101) are provided with second suction disc (103) and first suction disc (102) respectively, rear wall of second suction disc (103) and front wall of first suction disc (102) are all rollingly provided with a plurality of isolation balls (104). Vacuum bubble breaking section (1) further includes horizontal limiting output pipe (105), left lower part of rear wall of second suction disc (103) and front wall of first suction disc (102) is fixedly provided with horizontal limiting output pipe (105), front part horizontal limiting output pipe (105) is communicated with second suction disc (103), rear part horizontal limiting output pipe (105) is communicated with first suction disc (102), outer wall of two horizontal limiting output pipes (105) is all slidably sleeved with first limiting sliding cylinder (106), rear end of rear part first limiting sliding cylinder (106) is fixedly installed with main stream input pipe (107), main stream input pipe (107) is fixedly connected with rear wall of mounting frame (101), front part first limiting sliding cylinder (106) and rear part first limiting sliding cylinder (106) are vertically slidably arranged in left wall and right wall of mounting frame (101) respectively, output end of main stream input pipe (107) is fixedly connected with upper input port of vacuum degassing machine, output pipe of vacuum degassing machine is communicated with water retaining buffer section (2), lower wall of two first limiting sliding cylinders (106) is all fixedly installed with vertical limiting branch pipe (108), and first limiting sliding cylinder (106) is communicated with vertical limiting branch pipe (108), outer wall of two vertical limiting branch pipes (108) is all slidably installed with second limiting sliding cylinder (109), lower wall of two second limiting sliding cylinders (109) is fixedly installed with communication pipe (110), front upper end and rear upper end of communication pipe (110) are communicated with front part and rear part second limiting sliding cylinder (109) respectively, and two second limiting sliding cylinders (109) and communication pipe (110) are all fixedly installed in lower part of mounting frame (101). ​ 2. The PCB in-hole copper plating device according to claim 1, characterized in that: The vacuum bubble breaking section (1) further comprises a base (111), four corners of the middle through slot of the mounting frame (101) are respectively fixedly provided with a pair of bases (111), each pair of the bases (111) are vertically arranged opposite to each other, and each pair of the bases (111) is fixedly installed with a sliding rail (112), the sliding rail (112) is slidably provided with a sliding block (113), the inner wall of the sliding block (113) is fixedly installed with a positioning plate (114), the inner walls of the front two positioning plates (114) and the inner walls of the rear two positioning plates (114) are fixedly connected with the second suction disc (103) and the first suction disc (102).

3. The PCB in-hole copper plating device according to claim 1, wherein: The vacuum bubble breaking section (1) further comprises a mounting seat (115), the front wall and the rear wall of the mounting frame (101) are provided with a transmission groove, three pairs of mounting seats (115) are fixedly installed in each transmission groove, a rotating shaft (116) is rotatably arranged between the front three mounting seats (115) and the rear two mounting seats (115), the upper outer wall and the middle outer wall of the four rotating shafts (116) are fixedly sleeved with a gear (117), two pairs of limiting guide rails (118) are fixedly installed in each transmission groove, the front three pairs of mounting seats (115) are arranged at the upper portion, the middle portion and the lower portion in front of the second suction disc (103), the rear three pairs of mounting seats (115) are arranged at the upper portion, the middle portion and the lower portion behind the first suction disc (102), the positions of the four pairs of limiting guide rails (118) correspond to the upper two pairs of mounting seats (115) and the middle two pairs of mounting seats (115), a rack (119) is arranged above the four pairs of limiting guide rails (118), the lower wall of the rack (119) is fixedly connected with a guide rod, the guide rod is slidably connected with the limiting guide rail (118), the rear ends of the front four racks (119) are slidably connected with the front wall of the second suction disc (103), the front ends of the rear four racks (119) are slidably connected with the rear wall of the first suction disc (102), and the rack (119) is meshingly connected with the gear (117), and the rack (119) is slidably installed in the transmission groove.

4. The PCB in-hole copper plating device according to claim 3, characterized in that: The vacuum bubble breaking section (1) further comprises a stepping motor (120), a stepping motor (120) is fixedly arranged on each of the two mounting seats (115) at the lower right portion, the output end of the stepping motor (120) is fixedly connected with the lower ends of the two rotating shafts (116) at the right portion, a sprocket (121) is fixedly sleeved with the lower outer wall of the four rotating shafts (116), and a chain (122) is transmissionally sleeved between the outer walls of the front two sprockets (121) and the rear two sprockets (121).

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