Filters and circuit elements

By designing a vertically arranged three-dimensional filter on the circuit board and using a figure-eight structure and grounding vias for connection, the problems of large filter size and high cost are solved, achieving dual-mode effect and bandwidth expansion, making it suitable for 5G millimeter-wave communication modules.

CN116632474BActive Publication Date: 2026-06-19UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO LTD
Filing Date
2023-07-13
Publication Date
2026-06-19

AI Technical Summary

Technical Problem

In existing technologies, the size, cost, and design complexity of filters are difficult to meet the requirements of 5G millimeter-wave communication modules, especially due to their large size and complex design.

Method used

The three-dimensional filter design with a vertical layout forms an 8-shaped structure by setting a first ring unit, a second coupling unit, a ground plane and a grounding via on the circuit board. The ring unit and the ground plane are connected by the grounding via, which realizes the low-frequency mode and dual-mode effect of the resonant frequency, reducing cost and size.

Benefits of technology

It achieves dual-mode effect of the filter, expands the operating bandwidth, and reduces the size and cost of the filter, making it suitable for 5G millimeter-wave products.

✦ Generated by Eureka AI based on patent content.

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Abstract

A filter is disposed on a circuit board and includes a first coupling unit, a second coupling unit, a first ring unit, at least one ground plane, and a ground via. The first ring unit includes at least two signal vias and is located on at least two conductive layers. The first coupling unit and the second coupling unit are coupled to the first ring unit. The at least one ground plane is located on another conductive layer of the circuit board and serves as a reference ground for the first coupling unit, the second coupling unit, and the first ring unit. The ground via connects the first ring unit and the at least one ground plane. This expands the operating bandwidth. This disclosure also relates to a circuit element.
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