Wire cutting device and wire cutting control method

Abstract

The embodiment of the present application discloses a wire cutting device and a wire cutting control method. The wire cutting device includes a cutting mechanism for winding a cutting wire and cutting the material to be processed, and also includes a magnetic field component and a power supply component. The magnetic field component is used to generate magnetic flux lines that pass through the plane where the cutting wire of the cutting mechanism is located, and the power supply component is used to supply power to the cutting part of the cutting wire of the cutting mechanism. After adopting the solution of the embodiment of the present application, by activating the magnetic field component and the power supply component, the plane where the cutting wire of the cutting mechanism is located can generate magnetic flux lines that pass through, and the cutting part of the cutting wire of the cutting mechanism can be made conductive during the cutting process, so that the cutting part of the cutting wire of the cutting mechanism can generate an Ampere force toward the material to be processed (cutting workpiece), and the Ampere force presses the diamond wire on the cutting workpiece, increases the positive pressure between the cutting wire and the cutting workpiece, and improves the cutting efficiency.

Description

Technical Field

[0001] The present application relates to the technical field of diamond wire cutting, and in particular to a wire cutting device and a wire cutting control method. Background Art

[0002] In the field of photovoltaic crystalline silicon and semiconductor cutting, cutting mechanisms with single-wire or multi-wire diamond wires are often used to cut, square, and slice silicon materials in order to obtain corresponding silicon wafers or silicon materials.

[0003] Improving the efficiency of this wire cutting method has long been a challenge for those skilled in the art. Furthermore, during the cutting process, the diamond wire, formed by the closed loop of the cutting mechanism, can produce a wire bow where it contacts the silicon ingot. The size and duration of the wire bow can also affect cutting efficiency. Summary of the Invention

[0004] In view of this, embodiments of the present application provide a wire cutting device and a wire cutting control method to further improve the processing efficiency of wire cutting.

[0005] On the one hand, the wire cutting device of an embodiment of the present application includes a cutting mechanism for winding a cutting wire and cutting the material to be processed, and also includes a magnetic field component and a power supply component. The magnetic field component is used to generate magnetic lines of force that pass through the plane where the cutting wire of the cutting mechanism is located, and the power supply component is used to supply power to the cutting part of the cutting wire of the cutting mechanism.

[0006] Furthermore, the magnetic field assembly includes a first electromagnetic coil and a second electromagnetic coil which are sleeved on both sides of the cutting portion of the material to be processed.

[0007] Furthermore, the conductive component includes an annular guide rail, a fixed plate, a first conductive wheel, a second conductive wheel, a first elastic member and a second elastic member. The annular guide rail is arranged near the cutting position of the material to be processed, the fixed plate is arranged on the annular guide rail, the first conductive wheel and the second conductive wheel are respectively movably arranged on the annular guide rails on both sides of the fixed plate, one end of the first elastic member is connected to the fixed plate, and the other end is connected to the first conductive wheel, one end of the second elastic member is connected to the fixed plate, and the other end is connected to the second conductive wheel, and the cutting line cutting part of the cutting mechanism passes through the first conductive wheel and the second conductive wheel during the cutting process.

[0008] Furthermore, the first conductive wheel and the second conductive wheel each include a sliding portion with a slider and a rolling portion with a power supply wheel edge, the sliding portion is arranged on the annular guide rail, and the power supply wheel edge of the rolling portion is used to contact the cutting portion of the cutting line.

[0009] Furthermore, the magnetic flux lines are perpendicular to the plane where the cutting line of the cutting mechanism is located.

[0010] Furthermore, the wire cutting device further includes a first DC power supply and a second DC power supply, wherein the first DC power supply is used to supply power to the magnetic field component, and the second DC power supply is used to supply power to the power supply component.

[0011] Furthermore, the first DC power supply and / or the second DC power supply are connected to a control unit for controlling their respective power supply states.

[0012] Furthermore, the wire cutting device includes a base with an extension guide rail and a loading platform for carrying the processing material. The loading platform is movably arranged on the extension guide rail of the base, and the cutting mechanism is arranged above the base.

[0013] Furthermore, the loading platform is provided with a support for upwardly supporting the material to be processed.

[0014] Furthermore, the cutting mechanism includes a mounting frame, on which a cutting wheel mechanism for winding the cutting line is provided, and the cutting wheel mechanism includes a first cutting wheel, a second cutting wheel, a tension wheel and a transition wheel that are arranged at intervals.

[0015] On the other hand, the wire cutting control method of an embodiment of the present application is used for the wire cutting device described in any of the aforementioned items, and the wire cutting control method includes: after the material to be processed is in place, starting the magnetic field component and the power supply component so that the cutting wire cutting part of the cutting mechanism generates an Ampere force toward the material to be processed; controlling the cutting wire cutting part of the cutting mechanism to feed and cut the material to be processed until the cutting is completed.

[0016] Furthermore, the wire cutting control method further includes: after the cutting is completed, turning off the magnetic field component and the power supply component, and restoring the cutting mechanism to an initial position.

[0017] Furthermore, the wire cutting control method further includes: adjusting the magnetic field strength of the magnetic field component, or adjusting the power supply strength of the power supply component.

[0018] After adopting the solution of the embodiment of the present application, by activating the magnetic field component and the power supply component, magnetic lines of force can be generated passing through the plane where the cutting wire of the cutting mechanism is located, and the cutting part of the cutting wire of the cutting mechanism can be made conductive during the cutting process. In this way, the cutting part of the cutting wire of the cutting mechanism can generate an Ampere force toward the material to be processed (cutting workpiece). The Ampere force presses the diamond wire on the cutting workpiece, increases the positive pressure between the cutting wire (diamond wire) and the cutting workpiece, and improves the cutting efficiency; in addition, a wire bow will be generated during diamond wire cutting. After the Ampere force is generated, the positive pressure between the diamond wire and the cutting workpiece in the feed direction is increased, and the tension that the diamond wire can withstand is used more in the cutting direction, reducing the tension and breakage probability of the diamond wire, and also improving the cutting efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0020] Figure 1 A schematic structural diagram of a wire cutting device provided in an embodiment of the present application;

[0021] Figure 2 for Figure 1 Schematic diagram of the structure from the left perspective;

[0022] Figure 3 for Figure 1 Schematic diagram of the structure from an axonometric perspective;

[0023] Figure 4 for Figure 3 An enlarged schematic diagram of the location of the power supply components;

[0024] Figure 5 for Figure 3 Schematic diagram of the structure of the power supply component;

[0025] Figure 6 for Figure 3 Schematic diagram of the structure of the conductive wheel of the power supply component.

[0026] Reference numerals:

[0027] 100 bases

[0028] 200 loading platform

[0029] 300 cutting mechanism

[0030] 400 materials to be processed

[0031] 301 cutting line

[0032] 302 cutting part

[0033] 501 first electromagnetic coil

[0034] 502 second electromagnetic coil

[0035] 503 power supply components

[0036] 504 ring guide rail

[0037] 505 first conductive wheel

[0038] 506 first elastic member

[0039] 507 fixed plate

[0040] 508 second elastic member

[0041] 509 second conductive wheel

[0042] 5051 sliding part

[0043] 5052 Slider

[0044] 5053 rolling part

[0045] 5054 power supply wheel edge DETAILED DESCRIPTION

[0046] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without paying creative work are within the scope of protection of this application. It should be noted that, in the absence of conflict, the embodiments in this application and the features in the embodiments can be combined with each other in any way.

[0047] The following combination Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 and Figure 6The wire cutting device and wire cutting control method of the embodiment of the present application are described in detail. As shown in the figure, the wire cutting device of the embodiment of the present application may include a base 100, a loading platform 200, a cutting mechanism 300, a magnetic field component and a power supply component 503. Among them, the loading platform 200 is arranged on the base 100, and the loading platform 200 is used to support the material 400 to be processed. The cutting mechanism 300 is arranged above the base 100. In specific implementation, the cutting mechanism 300 can be arranged on the upper side of the base 100 through a column. A cutting line 301 for cutting the material 400 to be processed is formed on the cutting mechanism 300. During the cutting process, the cutting part 302 of the cutting line 301 contacts the material 400 to be processed and cuts the material 400 from top to bottom. The magnetic field component is used to generate magnetic flux lines that pass through the plane where the cutting line 301 of the cutting mechanism 300 is located, and the power supply component 503 is used to supply power to the cutting part 302 of the cutting line 301 of the cutting mechanism 300.

[0048] During operation, the magnetic field component and the power supply component 503 can be enabled, so that magnetic flux lines can be generated passing through the plane where the cutting line 301 of the cutting mechanism 300 is located, and the cutting part 302 of the cutting line 301 of the cutting mechanism 300 can be conductive during the cutting process, so that the cutting part 302 of the cutting line 301 of the cutting mechanism 300 can generate an Ampere force toward the material 400 to be processed (cutting workpiece), and the Ampere force presses the cutting wire (diamond wire) on the cutting workpiece, increases the positive pressure between the cutting wire and the cutting workpiece, and improves the cutting efficiency; in addition, a wire bow will be generated during diamond wire cutting, and after the Ampere force is generated, the positive pressure between the diamond wire and the cutting workpiece in the feed direction is increased, and the tension that the diamond wire can withstand is used more in the cutting direction, reducing the tension and breakage probability of the diamond wire, and also improving the cutting efficiency.

[0049] Combine Figures 2 to 6As shown, in a specific implementation process, the magnetic field assembly may include a first electromagnetic coil 501 and a second electromagnetic coil 502 , and the first electromagnetic coil 501 and the second electromagnetic coil 502 are respectively sleeved on both sides of the cutting position of the material to be processed 400 . Correspondingly, the conductive component 503 may include an annular guide rail 504, a fixed plate 507, a first conductive wheel 505, a second conductive wheel 509, a first elastic member 506 and a second elastic member 508, wherein the annular guide rail 504 is sleeved near the cutting position of the material to be processed 400 (that is, the annular guide rail is sleeved on the material to be processed 400 and near its cutting position), the fixed plate 507 is arranged on the annular guide rail 504, the first conductive wheel 505 and the second conductive wheel 509 are respectively movably arranged on the annular guide rail 504 on both sides of the fixed plate 507, one end of the first elastic member 506 is connected to the fixed plate 507, and the other end is connected to the first conductive wheel 505, one end of the second elastic member 508 is connected to the fixed plate 507, and the other end is connected to the second conductive wheel 509, and the cutting line 301 and the cutting part 302 of the cutting mechanism 300 pass around the power supply wheel edges of the first conductive wheel 505 and the second conductive wheel 509 during the cutting process.

[0050] Combine Figure 6 As shown, in a specific implementation, the first conductive wheel 505 and the second conductive wheel 509 can each include a sliding portion 5051 with a slider 5052 and a rolling portion 5053 with a power-supplying edge 5054. The sliding portion 5051 is disposed on the annular guide rail 504, and the power-supplying edge 5054 of the rolling portion 5053 is configured to maintain contact with both ends of the cutting portion 302 of the cutting wire 301 during the cutting process. The first electromagnetic coil 501 and the second electromagnetic coil 502 are configured to ensure that the magnetic flux lines generated by them are perpendicular to the plane of the cutting wire 301 of the cutting mechanism 300. In a specific implementation, the two electromagnetic coils are symmetrically mounted on either side of the diamond wire cutting portion 302 and coaxial with the silicon rod (material to be processed 400), providing a stable magnetic field within the electromagnetic coils. The two electromagnetic coils can be as close to the diamond wire as possible to reduce the leakage of magnetic flux lines from the gap between the two electromagnetic coils. Furthermore, the annular rail 504 is coaxially mounted with the silicon rod, and the two elastic members can be springs, with the ends of the springs mounted on the fixed plate 507 and the conductive wheel 505 or 509, respectively, so that the conductive wheels 505 and 509 always press against the diamond wire (the cutting portion 302 of the cutting wire 301). The two conductive wheels 505 and 509 are positioned as close to the silicon rod as possible to reduce the Ampere force on the diamond wire between the outer edge of the silicon rod seam and the conductive wheels. The slider 5052 is mounted on the annular rail 504 and moves freely. The power supply assembly 503 is used to energize the diamond wire between the two conductive wheels 505 and 509 (i.e., the cutting portion 302), causing the diamond wire in the magnetic field to generate an Ampere force. Preferably, the wire cutting device may also include a first DC power supply and a second DC power supply. The first DC power supply is used to power the magnetic field assembly, and the second DC power supply is used to power the power supply assembly 503.

[0051] In this embodiment, the first DC power supply and / or the second DC power supply are preferably configured with a control unit to control its power supply status (such as whether power is supplied, the supply voltage, etc.). For example, the control unit of the first DC power supply can control the power supply status of the first DC power supply to control the magnetic field strength formed by the magnetic field component. The control unit of the first DC power supply can control the power supply status of the second DC power supply to control the power supply strength of the power supply component, thereby adjusting the current generated in the cutting line. The above configuration can adjust the magnitude of the Ampere force generated by the magnetic field on the cutting line, which is beneficial for controlling the cutting efficiency and line bow of the cutting line.

[0052] Based on the above embodiments and their various implementation methods, in order to achieve flexible processing of the wire cutting device, an extension guide rail can be set on the base 100, and the loading platform 200 can be movably set on the extension guide rail of the base 100. In addition, a plurality of supports can be set on the loading platform 100 to support the material 400 to be processed upward. After adopting this solution, by adjusting the position of the loading platform 200 on the base 100, the material 400 to be processed can be moved and prepared, thereby facilitating the cutting mechanism 300 to achieve cutting processing at the corresponding position.

[0053] In addition, the cutting mechanism 300 can adopt various forms of diamond wire cutting mechanisms. As shown in the figure, the cutting mechanism 300 can include a mounting frame, on which a cutting wheel mechanism for winding the cutting wire 301 is provided. The cutting wheel mechanism includes a first cutting wheel, a second cutting wheel, a tension wheel and a transition wheel (i.e., a guide wheel) that are arranged at intervals.

[0054] The present application also provides a wire cutting control method, which can be used with any of the aforementioned wire cutting devices. The wire cutting control method may include: after the material 400 to be processed is in place, activating the magnetic field assembly and the power supply assembly so that the cutting line 301 of the cutting mechanism 300 generates an Ampere force at the cutting portion 302 toward the material 400; and controlling the cutting line 301 of the cutting mechanism 300 to feed the cutting portion 302 toward the material 400 until cutting is complete. Furthermore, after cutting is completed, the wire cutting control method may further include: deactivating the magnetic field assembly and the power supply assembly 503, and returning the cutting mechanism 300 to its initial position. To flexibly adjust the Ampere force, the wire cutting control method may further include: adjusting the magnetic field strength of the magnetic field assembly, or adjusting the power supply strength of the power supply assembly, i.e., adjusting the current flowing through the cutting portion 302 of the cutting line 301, during the cutting process. Preferably, both adjusting the magnetic field strength generated by the magnetic field assembly and adjusting the current of the power supply assembly can be achieved by controlling the power supply status of the power supply that provides power to each of the power supply components. By adjusting the Ampere force applied to the cutting wire in a timely manner during the cutting process, the cutting force of the cutting wire can be controlled accordingly, thereby controlling the cutting efficiency and the size of the wire bow during cutting to a certain extent. Combined with the above, it can be seen that the wire cutting control method of this application also has the relevant technical effects of the aforementioned wire cutting device, which will not be elaborated here.

[0055] Although the preferred embodiments of the present application have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present application.

[0056] Obviously, those skilled in the art may make various changes and modifications to this application without departing from the spirit and scope of this application. Thus, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalents, this application is intended to include these modifications and variations.

Claims

1. A wire cutting device, comprising a cutting mechanism for winding a cutting wire and cutting a material to be processed, characterized in that: It also includes a magnetic field component and a power supply component, wherein the magnetic field component is used to generate magnetic flux lines that pass through the plane where the cutting line of the cutting mechanism is located, and the power supply component is used to supply power to the cutting part of the cutting line of the cutting mechanism; The magnetic field assembly includes a first electromagnetic coil and a second electromagnetic coil which are sleeved on both sides of the cutting portion of the material to be processed; The power supply assembly includes an annular guide rail, a fixed plate, a first conductive wheel, a second conductive wheel, a first elastic member, and a second elastic member. The annular guide rail is sleeved adjacent to the cutting portion of the material to be processed. The fixed plate is arranged on the annular guide rail. The first conductive wheel and the second conductive wheel are movably arranged on the annular guide rails on both sides of the fixed plate. One end of the first elastic member is connected to the fixed plate, and the other end is connected to the first conductive wheel. One end of the second elastic member is connected to the fixed plate, and the other end is connected to the second conductive wheel. The cutting line cutting portion of the cutting mechanism passes through the first conductive wheel and the second conductive wheel during the cutting process. The first conductive wheel and the second conductive wheel each include a sliding portion with a slider and a rolling portion with a power supply wheel. The sliding portion is arranged on the annular guide rail, and the power supply wheel of the rolling portion is used to contact the cutting portion of the cutting line.

2. The wire cutting device according to claim 1, characterized in that The magnetic flux lines are perpendicular to the plane where the cutting line of the cutting mechanism is located.

3. The wire cutting device according to claim 1, characterized in that The wire cutting device further includes a first DC power supply and a second DC power supply, wherein the first DC power supply is used to supply power to the magnetic field component, and the second DC power supply is used to supply power to the power supply component.

4. The wire cutting device according to claim 3, characterized in that The first DC power supply and / or the second DC power supply are connected to a control unit for controlling their respective power supply states.

5. The wire cutting device according to any one of claims 1 to 4, characterized in that: The wire cutting device further comprises a base with an extension guide rail and a loading platform for carrying the material to be processed. The loading platform is movably arranged on the extension guide rail of the base, and the cutting mechanism is arranged above the base.

6. The wire cutting device according to claim 5, characterized in that The loading platform is provided with a support for supporting the material to be processed upward.

7. The wire cutting device according to claim 5, characterized in that The cutting mechanism comprises a mounting frame, on which a cutting wheel mechanism for winding a cutting line is provided. The cutting wheel mechanism comprises a first cutting wheel, a second cutting wheel, a tension wheel and a transition wheel which are arranged at intervals.

8. A wire cutting control method, used for the wire cutting device according to any one of claims 1 to 7, characterized in that: The wire cutting control method includes: after the material to be processed is in place, starting the magnetic field component and the power supply component to make the cutting part of the cutting wire of the cutting mechanism generate an Ampere force toward the material to be processed; controlling the cutting part of the cutting wire of the cutting mechanism to feed and cut the material to be processed until the cutting is completed.

9. The wire cutting control method according to claim 8, wherein: The wire cutting control method further includes: after the cutting is completed, turning off the magnetic field component and the power supply component, and restoring the cutting mechanism to an initial position.

10. The wire cutting control method according to claim 8, wherein: The wire cutting control method further includes: during the cutting process, adjusting the magnetic field strength of the magnetic field component, or adjusting the power supply strength of the power supply component.

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