Thermally stable substrate for high precision optical instrument mounting

Abstract

The application provides a heat-stable substrate for high-precision optical instrument installation, comprising a substrate assembly and a heat control assembly, the substrate assembly comprises a heat-conducting substrate, and at least two optical instrument installation positions are arranged on the heat-conducting substrate at intervals; the heat control assembly is arranged on the outer surface of the heat-conducting substrate, and is used for temperature monitoring and temperature control of the heat-conducting substrate. The heat-conducting substrate adopts high-body aluminum-based silicon carbide material, has high heat conduction and low expansion performance, realizes the relative consistency of the temperature environment of two high-precision instruments, guarantees the consistency of the temperature distribution of multiple optical instrument installation positions, thereby realizes the small relative thermal deformation of the multiple optical instrument installation positions, and further helps to realize heat stability and high-precision and high-stability control; the electric heater and the temperature measuring point are arranged on the heat-conducting substrate, real-time temperature monitoring and precise temperature control are realized, and the temperature change of the heat-conducting substrate is guaranteed to be within ±0.5 DEG C, thereby helping to reduce the thermal deformation of the heat-conducting substrate.

Description

Technical Field

[0001] This invention relates to the field of aircraft structural design technology, and more specifically, to a thermally stable substrate for mounting high-precision optical instruments. Background Technology

[0002] Currently, large satellite platforms are developing towards higher precision and stability, which places increasingly higher demands on the precision, stability, and thermal deformation performance of satellite structural designs. Even minute precision deviations in the on-orbit operation of high-precision optical instruments on satellites can severely impact their functionality. Therefore, the installation environment provided by the satellite must exhibit minimal on-orbit deformation and stable deformation control. The thermal environment experienced by instruments at their installation locations in space is complex and harsh, leading to corresponding thermal deformation. Therefore, thermal deformation control design is a key focus of structural design.

[0003] In particular, for situations where multiple high-precision optical instruments are mounted on a single substrate, the substrate is designed to ensure that the relative deformation of the multiple high-precision optical instruments is small during satellite operation, thereby achieving thermal stability and high-precision, high-stability control.

[0004] A Chinese patent application with publication number CN104743138B discloses a mounting structure for a high-precision micro-deformation attitude control instrument for spacecraft. The instrument mounting plate includes a first wing plate, a second wing plate, and a web plate. The first wing plate is fixed to the outer surface of a thin-walled shell structure, and the second wing plate is disposed inside the thin-walled shell structure and connected to a planar flange of a heat conductor. The first and second wing plates are connected through the web plate, and heat exchange occurs through the web plate. The mounting surface of the heat conductor is connected to a cover plate. The cover plate is connected to the thin-walled shell structure to form the head of the mounting structure. One end of a support rod assembly is connected to the head of the mounting structure, and the other end of the support rod assembly is mounted on the main body of the spacecraft's optical imaging payload structure.

[0005] Existing high-precision micro-deformation attitude control instrument mounting structures provide on-orbit micro-deformation mounting designs for a single attitude control instrument, but cannot provide on-orbit relative micro-deformation mounting designs for two or more optical instruments, thus requiring improvement. Summary of the Invention

[0006] In view of the deficiencies in the prior art, the purpose of this invention is to provide a thermally stable substrate for mounting high-precision optical instruments.

[0007] The present invention provides a thermally stable substrate for mounting high-precision optical instruments, comprising a substrate assembly and a thermal control assembly. The substrate assembly includes a thermally conductive substrate, on which at least two optical instrument mounting positions are spaced apart. The thermal control assembly is disposed on the outer surface of the thermally conductive substrate and is used for temperature monitoring and temperature control of the thermally conductive substrate.

[0008] Preferably, the material of the thermally conductive substrate includes a high volumetric aluminum-based silicon carbide material, and the thermally conductive substrate includes an integrally molded structure.

[0009] Preferably, the substrate assembly further includes an aluminum alloy insert disposed within a hole in the thermally conductive substrate.

[0010] Preferably, the aluminum alloy insert is used as a drill base for connecting screws.

[0011] Preferably, a fiberglass gasket is provided on the mounting surface of the thermally conductive substrate and the satellite.

[0012] Preferably, a reference prism is provided on the surface of the thermally conductive substrate where the optical instrument mounting position is located.

[0013] Preferably, the thermal control component includes an electric heater and a temperature measuring point.

[0014] Preferably, the temperature variation range of the thermally conductive substrate is ±0.5℃.

[0015] Preferably, a cutout is provided on the heat-conducting substrate between any two spaced optical instrument mounting positions.

[0016] Preferably, the thermally conductive substrate has a first optical instrument mounting position and a second optical instrument mounting position spaced apart; the thermally conductive substrate between the first optical instrument mounting position and the second optical instrument mounting position has a cutout, and the thermally conductive substrate between the first optical instrument mounting position and the second optical instrument mounting position has a temperature measuring point.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. This invention uses a thermally conductive substrate made of high-volume aluminum-based silicon carbide material, which has high thermal conductivity and low expansion performance. This enables the temperature environment of two high-precision instruments to be relatively consistent, ensuring the consistency of temperature distribution at multiple optical instrument mounting positions. This results in relatively small thermal deformation at multiple optical instrument mounting positions, which in turn helps to achieve thermal stability and high-precision, high-stability control.

[0019] 2. By setting an electric heater and a temperature measuring point on the thermally conductive substrate, the present invention realizes real-time temperature monitoring and precise temperature control, ensuring that the temperature change of the thermally conductive substrate is within ±0.5℃, thereby helping to reduce the thermal deformation of the thermally conductive substrate.

[0020] 3. The present invention reduces heat transfer and temperature impact between the satellite and the substrate by providing a fiberglass gasket that serves as a heat insulation at the connection between the heat-conducting substrate and the satellite.

[0021] 4. The present invention provides a reference prism on the surface of the thermally conductive substrate. The reference prism serves two purposes: firstly, to ensure the installation accuracy of the optical instrument, and secondly, to monitor the relative deformation between the thermally conductive substrate and the optical instrument in the on-orbit state. Attached Figure Description

[0022] Other features, objects, and advantages of the present invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0023] Figure 1 This is a schematic diagram of the overall front structure of the thermally stable substrate, excluding the thermal control components, as shown in the present invention.

[0024] Figure 2 This is a schematic diagram illustrating the overall structure of the back side of the thermally stable substrate, excluding the thermal control components, as a key feature of this invention.

[0025] Figure 3 This is a schematic diagram illustrating the location of the electric heater on the front side of the thermally stable substrate, which is the main feature of this invention.

[0026] Figure 4 This is a schematic diagram illustrating the location of the temperature measuring points on the front side of the thermally stable substrate, which is the main feature of this invention.

[0027] Figure 5 This is a schematic diagram illustrating the position of the aluminum alloy insert, which is the main feature of this invention.

[0028] Figure 6 This is a cross-sectional view of the thermally stable substrate, which mainly illustrates the position of the aluminum alloy insert in this invention.

[0029] As shown in the figure:

[0030] Thermally conductive substrate 1 First electric heater 7

[0031] First optical instrument mounting position 2; Second electric heater 8

[0032] Second optical instrument mounting position 3; Third electric heater 9

[0033] Reference prism 4 First temperature measuring point 10

[0034] First fiberglass gasket 5; Second temperature measuring point 11

[0035] Second fiberglass gasket 6, aluminum alloy insert 12 Detailed Implementation

[0036] The present invention will now be described in detail with reference to specific embodiments. These embodiments will help those skilled in the art to further understand the present invention, but do not limit the invention in any way. It should be noted that those skilled in the art can make several changes and improvements without departing from the concept of the present invention. These all fall within the protection scope of the present invention.

[0037] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 as well as Figure 6 As shown, a thermally stable substrate for mounting high-precision optical instruments according to the present invention includes a substrate assembly and a thermal control assembly. The substrate assembly includes a thermally conductive substrate 1, on which at least two optical instrument mounting positions are spaced apart. The thermal control assembly is disposed on the outer surface of the thermally conductive substrate 1 and is used for temperature monitoring and temperature control of the thermally conductive substrate 1.

[0038] Specifically, the thermally conductive substrate 1 is made of high-volume aluminum-based silicon carbide material, and the thermally conductive substrate 1 includes an integrally molded structure. The silicon carbide content of the high-volume aluminum-based silicon carbide material is 60%. This material has high thermal conductivity and low expansion properties, which makes the structure have good thermal conductivity and heat transfer characteristics. It can also reduce its own thermal deformation caused by its harsh thermal environment and reduce the deformation impact on other structures. At the same time, the thermally conductive substrate 1 is integrally molded during the processing, thus making the thermally conductive substrate 1 have good on-track performance and small deformation.

[0039] The substrate assembly also includes an aluminum alloy insert 12, which is disposed within a hole in the thermally conductive substrate 1. The aluminum alloy insert 12 serves as a drilling base for connecting screws. Because the material of the thermally conductive substrate 1 is relatively hard, directly drilling threaded holes is difficult. Therefore, using the aluminum alloy insert 12 as a drilling base for connecting screws reduces the processing difficulty. During processing, a larger hole can be first drilled in the thermally conductive substrate 1, and the aluminum alloy insert 12 can be inserted to accommodate the threaded hole.

[0040] A reference prism 4 is provided on the surface of the thermally conductive substrate 1 where the optical instrument mounting position is located. The reference prism 4 serves two purposes: firstly, to ensure the mounting accuracy of the optical instrument, and secondly, to monitor the relative deformation between the substrate and the optical instrument in the on-orbit state.

[0041] A fiberglass gasket is provided on the mounting surface of the satellite and the thermally conductive substrate 1. The fiberglass gasket serves as a heat insulation layer, thereby reducing heat transfer and temperature fluctuations between the satellite and the thermally conductive substrate 1.

[0042] The thermal control component includes an electric heater and a temperature measuring point, used to achieve real-time temperature monitoring and precise temperature control. It ensures that the temperature variation range of the heat-conducting substrate 1 is ±0.5℃.

[0043] Furthermore, each optical instrument mounting position is provided with a scraping surface to ensure installation accuracy. A cutout is provided on the heat-conducting substrate 1 between any two spaced-apart optical instrument mounting positions. The cutout can be regular or irregular in shape, its purpose being twofold: firstly, to reduce weight, and secondly, to control the heat transfer path within the surface of the heat-conducting substrate 1, facilitating accurate temperature control.

[0044] The present invention provides a feasible implementation: a first optical instrument mounting position 2 and a second optical instrument mounting position 3 are provided on a heat-conducting substrate 1 at intervals. A cutout is provided on the heat-conducting substrate 1 between the first optical instrument mounting position 2 and the second optical instrument mounting position 3, and a temperature measuring point is provided on the heat-conducting substrate 1 between the first optical instrument mounting position 2 and the second optical instrument mounting position 3.

[0045] Two high-precision optical instruments are respectively installed at the first optical instrument mounting position 2 and the second optical instrument mounting position 3. Three triangular cutouts are formed on the heat-conducting substrate 1 between the first optical instrument mounting position 2 and the second optical instrument mounting position 3. A first temperature measuring point 10 and a second temperature measuring point 11 are respectively positioned between the first optical instrument mounting position 2 and the second optical instrument mounting position 3 for temperature detection of the heat-conducting substrate 1. A first electric heater 7, a second electric heater 8, and a third electric heater 9 are installed on the second optical instrument mounting position 3 for temperature regulation of the heat-conducting substrate 1.

[0046] The fiberglass gaskets include a first fiberglass gasket 5 and a second fiberglass gasket 6. The first fiberglass gasket 5 is positioned on the mounting surface of the satellite at the first optical instrument mounting position 2, and the second fiberglass gasket 6 is positioned on the mounting surface of the satellite at the second optical instrument mounting position 3. This reduces heat transfer and temperature fluctuations between the satellite and the thermally conductive substrate 1. A reference prism 4 is mounted on the upper side of the thermally conductive substrate 1, on the same side as the optical instrument mounting position. The reference prism 4 serves as a mounting reference for the two high-precision optical instruments, used to calibrate the instrument mounting positions.

[0047] When the high-precision optical instrument is turned on or exposed to sunlight, it generates heat. This heat is transferred between the first optical instrument mounting position 2 and the second optical instrument mounting position 3 on the heat-conducting substrate 1, and finally transferred to the heat dissipation surface on the high-precision optical instrument.

[0048] Simultaneously, temperature monitoring is conducted through the first temperature measuring point 10 and the second temperature measuring point 11. When temperature changes are significant, temperature control is achieved through the first electric heater 7, the second electric heater 8, or the third electric heater 9. Due to the rational design of the overall structure, connection design, and material selection, the device possesses sufficient strength, rigidity, and thermal stability, while also being relatively lightweight. Compared to conventional designs, this invention reduces on-orbit thermal deformation, meeting the requirements of high-precision optical instruments.

[0049] This embodiment solves the technical challenge of thermal deformation in the demanding installation structure of high-precision optical instruments. It has three characteristics: excellent thermal conductivity, on-orbit thermal stability, and precise temperature control, thus meeting the high-precision and high-stability imaging requirements of high-precision optical instruments in orbit. It also features a novel structural form and light weight.

[0050] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0051] Specific embodiments of the present invention have been described above. It should be understood that the present invention is not limited to the specific embodiments described above, and those skilled in the art can make various changes or modifications within the scope of the claims, which do not affect the essence of the present invention. Unless otherwise specified, the embodiments and features described in this application can be arbitrarily combined with each other.

Claims

1. A thermally stable substrate for mounting high-precision optical instruments, characterized in that, It includes a substrate assembly and a thermal control assembly. The substrate assembly includes a thermally conductive substrate (1), on which at least two optical instrument mounting positions are provided at intervals. The thermal control component is disposed on the outer surface of the thermally conductive substrate (1), and the thermal control component is used for temperature monitoring and temperature control of the thermally conductive substrate (1); The thermal control component includes an electric heater and a temperature measuring point; The thermally conductive substrate (1) is provided with a first optical instrument mounting position (2) and a second optical instrument mounting position (3) at intervals. A hollowed-out area is provided on the heat-conducting substrate (1) between the first optical instrument mounting position (2) and the second optical instrument mounting position (3), and a temperature measuring point is provided on the heat-conducting substrate (1) between the first optical instrument mounting position (2) and the second optical instrument mounting position (3). A first electric heater, a second electric heater, and a third electric heater are installed at the second optical instrument mounting position for temperature regulation of the heat-conducting substrate.

2. The thermally stable substrate for mounting high-precision optical instruments as described in claim 1, characterized in that, The material of the thermally conductive substrate (1) includes high volumetric aluminum-based silicon carbide material, and the thermally conductive substrate (1) includes an integrally formed structure.

3. The thermally stable substrate for mounting high-precision optical instruments as described in claim 1, characterized in that, The substrate assembly also includes an aluminum alloy insert (12), which is disposed in a hole on the thermally conductive substrate (1).

4. The thermally stable substrate for mounting high-precision optical instruments as described in claim 3, characterized in that, The aluminum alloy insert (12) is used to connect the drill base of the screw.

5. The thermally stable substrate for mounting high-precision optical instruments as described in claim 1, characterized in that, A fiberglass gasket is provided on the mounting surface of the heat-conducting substrate (1) and the satellite.

6. The thermally stable substrate for mounting high-precision optical instruments as described in claim 1, characterized in that, The surface of the thermally conductive substrate (1) with the optical instrument mounting position is provided with a reference prism (4).

7. The thermally stable substrate for mounting high-precision optical instruments as described in claim 1, characterized in that, The temperature variation range of the thermally conductive substrate (1) is ±0.5℃.

8. The thermally stable substrate for mounting high-precision optical instruments as described in claim 1, characterized in that, A cutout is provided on the heat-conducting substrate (1) between any two spaced optical instrument mounting positions.

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