Attaching method and attaching device

Abstract

The application relates to a laminating method and a laminating device. The laminating method comprises the following steps: placing a release adhesive and a to-be-laminated film part on a bearing surface of a carrier in a first direction; the outer contour of the normal projection of the release adhesive on a reference surface is located outside the outer contour of the normal projection of the to-be-laminated film part on the reference surface; the reference surface is perpendicular to the first direction; laminating a film material to the side surface of the to-be-laminated film part away from the bearing surface; and separating the release adhesive and the laminated film material and the to-be-laminated film part from the bearing surface; the adhesive force between the film material and the bearing surface is greater than the adhesive force between the release adhesive and the bearing surface. The laminating method and the laminating device at least comprise the carrier and the release adhesive. The release adhesive is arranged on the bearing surface, the release adhesive is easy to separate from the bearing surface, the laminated film material and the to-be-laminated film part are easy to separate from the carrier, the damage of the laminated film material and the to-be-laminated film part caused by the separation process is reduced, and thus the lamination quality of the to-be-laminated film part is improved.

Description

Technical Field

[0001] This application relates to the field of bonding technology, and in particular to a bonding method and bonding device. Background Technology

[0002] To ensure products meet usage requirements, some components need to have specific films bonded to their surfaces. When manufacturing these components (i.e., the parts to be bonded), adhesive is typically applied to one side of the film. The part to be bonded is first placed on a carrier, and then the film is bonded to the part using the adhesive. However, the bonding quality between the film and the part to be bonded is poor after they are removed from the carrier. Summary of the Invention

[0003] Therefore, it is necessary to provide a bonding method and bonding device to improve the bonding quality between the bonded film material and the film to be bonded.

[0004] According to one aspect of this application, a bonding method is provided, comprising:

[0005] The release adhesive and the part to be applied are placed on the bearing surface of the carrier along the first direction; the outer contour of the orthographic projection of the release adhesive on the reference surface is located outside the outer contour of the orthographic projection of the part to be applied on the reference surface; wherein, the reference surface is perpendicular to the first direction.

[0006] The film material is applied to the surface of the part to be covered, away from the bearing surface;

[0007] The release adhesive, the bonded film material, and the film to be bonded are detached from the bearing surface; the adhesion between the film material and the bearing surface is greater than the adhesion between the release adhesive and the bearing surface.

[0008] In one embodiment, placing the release adhesive and the film to be applied along a first direction on the bearing surface of the carrier of the bonding device includes:

[0009] The film to be applied and the release adhesive are placed sequentially on the bearing surface along the first direction.

[0010] In one embodiment, the step of detaching the release adhesive, the bonded film material, and the film to be bonded from the bearing surface includes:

[0011] This causes the release adhesive, the bonded film material, and the film to be bonded to detach simultaneously from the bearing surface.

[0012] In one embodiment, the inner contour of the release adhesive projected onto the reference surface is located outside the outer contour of the film to be applied to the reference surface.

[0013] In one embodiment, the carrier is provided with an adsorption hole penetrating the bearing surface along the first direction, and the orthographic projection of the adsorption hole on the reference surface is located within the orthographic projection of the release adhesive on the reference surface;

[0014] The release adhesive is adsorbed onto or detached from the bearing surface via the adsorption pores.

[0015] In one embodiment, the adhesion force between the release adhesive and the bearing surface is 0 N / mm; and / or

[0016] The release adhesive is made of polytetrafluoroethylene or polyetheretherketone.

[0017] According to another aspect of this application, a bonding device is provided for bonding a film component to be bonded and a film material, the bonding device comprising:

[0018] A carrier having a bearing surface; the bearing surface is used to bear the film to be applied in a first direction; and

[0019] Release adhesive, used to be placed on the bearing surface;

[0020] Wherein, the film to be applied and the release adhesive are supported on the support surface, and the outer contour of the orthographic projection of the release adhesive on the reference surface is located outside the outer contour of the orthographic projection of the film to be applied on the reference surface; the reference surface is perpendicular to the first direction.

[0021] The adhesion force between the membrane material and the bearing surface is greater than the adhesion force between the release adhesive and the bearing surface.

[0022] In one embodiment, the inner contour of the release adhesive projected onto the reference surface is located outside the outer contour of the film to be applied to the reference surface.

[0023] In one embodiment, the carrier is provided with an adsorption hole penetrating the bearing surface along the first direction, and the orthographic projection of the adsorption hole on the reference surface is located within the orthographic projection of the release adhesive on the reference surface;

[0024] The release adhesive is adsorbed onto or detached from the bearing surface via the adsorption pores.

[0025] In one embodiment, the bonding device further includes a vacuum device connected to the adsorption hole;

[0026] The vacuum device is used to provide an adsorption force that causes the release adhesive to adhere to the bearing surface via the adsorption hole, and a release force that causes the release adhesive to detach from the bearing surface.

[0027] In one embodiment, the adhesion force between the release adhesive and the bearing surface is 0 N / mm; and / or

[0028] The mold release adhesive has a dimension of 0.05 mm to 0.2 mm along the first direction; and / or

[0029] The release adhesive is made of polytetrafluoroethylene or polyetheretherketone.

[0030] In one embodiment, the vehicle includes a first platform and a plurality of second platforms arranged around the first platform and configured to move toward or away from the first platform to switch the vehicle between a first state and a second state.

[0031] The first platform has a first sub-bearing surface, and each second platform has a second sub-bearing surface; in the first state, each second sub-bearing surface is engaged with the first sub-bearing surface, and all the second sub-bearing surfaces and the first sub-bearing surface together constitute the bearing surface; in the second state, a gap is formed between each second sub-bearing surface and the first sub-bearing surface.

[0032] In one embodiment, the first sub-supporting surface is used to support at least a portion of the film to be applied in the first direction, and the second sub-supporting surface is used to support at least a portion of the release adhesive in the first direction; and / or

[0033] The first sub-supporting surface is adapted to the shape of the side surface of the film to be applied facing each other along the first direction.

[0034] The above-mentioned bonding method and bonding device include at least a carrier and a release adhesive. The film to be bonded and the release adhesive are both disposed on the carrier surface. The film material is bonded to the side of the film to be bonded that is away from the carrier surface. By disposing of the release adhesive on the carrier surface, and by ensuring that the adhesive force between the release adhesive and the carrier surface is less than the adhesive force between the film material and the carrier surface, the release adhesive is more likely to detach from the carrier surface. This facilitates the detachment of the bonded film material and the film to be bonded from the carrier, mitigating the damage caused to the bonded film material and the film to be bonded during the detachment process, thereby improving the bonding quality of the film to be bonded. Attached Figure Description

[0035] Figure 1 This is a front view schematic diagram of the film to be applied and the film material disposed on a carrier in one embodiment of the related technology.

[0036] Figure 2 for Figure 1 The corresponding top-down view.

[0037] Figure 3 for Figure 1The main view diagram shows the membrane material after it has been applied to the part to be covered.

[0038] Figure 4 for Figure 3 A front view diagram showing the membrane material and the part to be laminated separated from the carrier after lamination.

[0039] Figure 5 This is a flowchart illustrating the bonding method in one embodiment of this application.

[0040] Figure 6 This is a front view schematic diagram of the film to be applied and the film material placed on the bonding device in one embodiment of this application.

[0041] Figure 7 This is a top view schematic diagram of the film to be applied and the film material placed on the bonding device in one embodiment of this application.

[0042] Figure 8 This is a front view schematic diagram of the film-to-be-applied component and the film material after they are applied on the bonding device in one embodiment of this application.

[0043] Figure 9 This is a front view schematic diagram of the film to be bonded and the film material after bonding, as well as the release adhesive and bonding device after bonding, in one embodiment of this application.

[0044] Figure 10 This is a magnified schematic diagram of a portion of the part to be coated and the film material after they have been separated from the bonding device in the comparative example.

[0045] Figure 11 This is a partially enlarged schematic diagram of the part to be coated and the film material after they have been separated from the bonding device in one embodiment of this application.

[0046] Explanation of icon numbers:

[0047] 10. Bonding device 11. Carrier

[0048] 111. First platform; 112. Second platform

[0049] A1, bearing surface; A2, first sub-bearing surface

[0050] A3, Second Sub-supporting Surface 2, Part to be Applied Film

[0051] A4, First Surface; B, Bubble

[0052] 3. Membrane material X, first direction;

[0053] 20. Bonding device 21. Carrier

[0054] 211. First platform; 212. Second platform

[0055] a1, bearing surface; a2, first sub-bearing surface

[0056] a3, Second Sub-supporting Surface 22, Release Adhesive

[0057] b1, First outer contour; b2, First inner contour

[0058] a6, third surface c, adsorption pores

[0059] d. First dimension 2, part to be coated

[0060] b3, second outer contour; a4, first surface

[0061] a5, Second Surface 3, Membrane Material

[0062] X, First direction S110, S120, S130, Steps. Detailed Implementation

[0063] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0064] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0065] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0066] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0067] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0068] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0069] To adhere a membrane material to the component to be coated (i.e., the part to be coated), an adhesive is typically applied to one side of the membrane material. The membrane material adheres to the part using the adhesive's stickiness. To ensure the membrane material completely covers the surface of the part, its overall dimensions generally need to be larger than the part's overall dimensions. However, the bonding quality between the membrane material and the part is often poor after separation from the carrier. The adhesive used is typically optically clear adhesive (OCA). Of course, other adhesives with tackiness can also be used, as long as they can bond the membrane material and the part to be coated together.

[0070] Figure 1 This is a front view schematic diagram showing the film to be applied and the film material disposed on a carrier in an embodiment of the related technology; Figure 2 It shows Figure 1 Corresponding top view diagram; Figure 3 It shows Figure 1The diagram shows the main view after the membrane material is attached to the part to be covered; for ease of explanation, only the content related to the relevant technical embodiments is shown, and the first platform 111, the second platform 112, and the part to be covered are shown in dashed lines.

[0071] See Figures 1 to 3 In one embodiment of the related technology, the bonding device 10 includes at least a carrier 11, the carrier 11 being positioned along a first direction X (refer to...). Figure 1 and Figure 3 It has a bearing surface A1 for bearing the film to be applied 2 (refer to) Figure 1 and Figure 3 The vehicle 11 includes at least a first platform 111 and a plurality of second platforms 112 arranged around the first platform 111. All the second platforms 112 are configured to move toward or away from the first platform 111 (the detailed structure of the vehicle 11 and the specific movement mode of the second platforms 112 are not relevant to this embodiment, and therefore will not be described in detail here). The first platform 111 has a first sub-bearing surface A2 along a first direction X (refer to...). Figure 1 and Figure 3 Each second platform 112 has a second sub-bearing surface A3 along the first direction X (refer to...). Figure 1 and Figure 3 The first sub-supporting surface A2 and all of the second sub-supporting surfaces A3 together constitute the supporting surface A1. The film to be applied 2 is at least partially placed on the first sub-supporting surface A2, and the film material 3 is adhered to the surface of the film to be applied 2 facing away from the supporting surface A1 along the first direction X. The surface of the film to be applied 2 facing away from the supporting surface A1 along the first direction X is denoted as the first surface A4 (refer to...). Figure 1 and Figure 3 When bonding the film material 3 and the film to be bonded 2, all the second platforms 112 are moved away from the first platform 111, that is, the first platform 111 and the second platform 112 are separated. Then the film to be bonded 2 is placed on the first sub-supporting surface A2 of the first platform 111. Then all the second platforms 112 are made to face the first platform 111, that is, the first platform 111 and all the second platforms 112 are brought together and bonded. Then the film material 3 is placed on the second sub-supporting surface A3. Then the bonding process is used to bond the film material 3 to the first surface A4 of the film to be bonded 2. During the bonding process, a certain pressure needs to be applied to the film material 3 to make the film material 3 and the film to be bonded 2 stick together. After the bonding is completed, the bonded film material 3 and the film to be bonded 2 are removed from the support surface A1 together.

[0072] Figure 4 It shows Figure 3 A front view of the film material and the film to be applied after being bonded and detached from the carrier; for ease of explanation, only the content related to the relevant technical embodiments is shown, and the first carrier 111 and the film to be applied 2 that are covered are shown in dashed lines.

[0073] See Figure 4 The inventors of this application have discovered that, in one embodiment of the aforementioned related technology, the bonding quality of the laminated film 3 and the film to be bonded 2 is poor after they detach from the bearing surface A1. For example, the edge portion of some laminated film 3 may warp and deform along the first direction X in a direction away from the film to be bonded 2, and there may be a gap between the edge of the film to be bonded 2 and the film 3 (this gap is not shown in the figure, but can be seen in the reference). Figure 4 The deformed membrane material 3 shows that its upward warping affects the adhesion between the edge of the film to be applied 2 and the membrane material 3, easily leading to gaps. In some cases, air bubbles B appear on the edge of the film to be applied 2 after adhesion (please refer to the following text). Figure 10 These factors can all affect the quality of the film application on the component 2 to be covered.

[0074] Through in-depth research, the inventors of this application discovered that, because the outer dimensions of the membrane material 3 are larger than those of the film to be applied 2, in this embodiment of the related art, after the membrane material 3 is applied to the first surface A4 of the film to be applied 2, the portion of the membrane material 3 exposed on the film to be applied 2 will adhere to the second platform 112. However, since adhesive (not shown in the figure) is provided on the side of the membrane material 3 facing the first surface A4, and the membrane material 3 and the film to be applied 2 are bonded by pressure, the adhesive force between the membrane material 3 and the second platform 112 is relatively large. Therefore, in order to detach the film to be applied 2 and the membrane material 3 from the second platform 112 after bonding, in this embodiment of the related art, the second platform 112 is moved away from the film to be applied 2 along the first direction X by external force (of course, it is also possible to move the film to be applied 2 and the membrane material 3 together along the first direction X in a direction away from the carrier 11), that is, the membrane material 3 bonded to the second platform 112 is forcibly detached from the second platform 112 by external force. However, due to the strong adhesive force of the adhesive, a large external force is required to detach the film material 3 (i.e., the edge portion of the film material 3) from the second platform 112. This causes the film material 3 attached to the second platform 112 to warp and deform along the first direction X in the direction away from the film to be applied 2. The warping deformation of the edge portion of the film material 3 also affects the film material 3 attached to the film to be applied 2, causing the film material 3 attached to the film to be applied 2 to deform. This causes a pull between the film material 3 attached to the film to be applied 2 and the film to be applied 2, resulting in a gap between the attached film to be applied 2 and the corresponding film material 3. This pull also causes air bubbles B to form on the edge of the film to be applied 2 (please refer to the following text). Figure 10This can affect the quality of the film application on the film-to-be-applied component 2. Furthermore, even after the edge of the film material 3 detaches from the second carrier 112, some adhesive residue will remain on the second carrier 112. Over time, the second carrier 112 will accumulate more and more adhesive, which will wear down the second carrier 112, thus shortening the service life of the entire carrier 11.

[0075] Therefore, in order to solve at least one of the problems existing in one embodiment of the above-mentioned related technology, this application provides a bonding method and a bonding device.

[0076] Figure 5 A schematic flowchart of the bonding method in one embodiment of this application is shown; for ease of explanation, only the content related to the embodiment of this application is shown.

[0077] Please refer to Figure 5 And in conjunction with the following text Figures 6-9 In some embodiments of the bonding apparatus shown, this application provides a bonding method, including the following steps:

[0078] Step S110: Apply release adhesive 22 (see below) Figures 6-9 ) and component 2 to be coated (please refer to the following text) Figures 6-9 Along the first direction X (please refer to the following text) Figures 6-9 Place it in vehicle 21 (see below) Figures 6-9 The bearing surface a1 of ) (please refer to the following text) Figure 6 , Figure 8 , Figure 9 The outer contour of the orthographic projection of the release adhesive 22 on the reference surface is located outside the outer contour of the orthographic projection of the film to be applied 2 on the reference surface; wherein, the reference surface is perpendicular to the first direction X.

[0079] Specifically, the release adhesive 22 and the film to be applied 2 are first placed on the bearing surface a1 along the first direction X. Alternatively, the release adhesive 22 can be placed on the bearing surface a1 first, followed by the film to be applied 2; or the film to be applied 2 can be placed on the bearing surface a1 first, followed by the release adhesive 22; or both can be placed on the bearing surface a1 simultaneously. It is understood that the film to be applied 2 and the release adhesive 22 can be placed on the bearing surface a1 by an operator, a robotic arm, a feeding suction cup, etc., depending on the actual use, and no limitation is made here.

[0080] For ease of explanation, the surface of the part 2 to be coated with film that faces away from the bearing surface a1 is designated as the first surface a4 (please refer to the following text). Figure 6 , Figure 8 , Figure 9 The surface of the part to be coated 2 located on one side of the bearing surface a1 is designated as the second surface a5 (please refer to the following text). Figure 6 , Figure 8 , Figure 9 The outer contour of the orthographic projection of the release adhesive 22 onto the reference surface is denoted as the first outer contour b1 (please refer to the following text). Figure 7 The inner contour of the orthographic projection of the release adhesive 22 onto the reference surface is denoted as the first inner contour b2 (please refer to the following text). Figure 7 The outer contour of the orthographic projection of the film part 2 onto the reference plane is denoted as the second outer contour b3 (please refer to the following text). Figure 7 ).

[0081] It should be noted that release adhesive 22 refers to a sheet-like film material. The specific material, dimensions, and other parameters of release adhesive 22 can be set according to actual usage requirements. The first direction X can be referred to in the following text. Figures 6 to 9 The X direction is shown in the diagram. The reference plane refers to the plane perpendicular to the first direction X, which can be referred to in conjunction with the following text. Figure 7 The top view shown can be understood as the plane on which the top view is located. Orthographic projection refers to the projection formed on the projection plane when parallel projection lines are perpendicular to the projection plane. In this application, parallel projection lines are lines parallel to the first direction X, and the projection plane is the reference plane. Since the first direction X is perpendicular to the reference plane, the projections of the release adhesive 22 and the film to be applied 2 onto the reference plane using lines parallel to the first direction X as projection lines are orthographic projections. The outer contour refers to the part that affects the external lines; that is, all the lines around the outer perimeter of the orthographic projection together constitute the outer contour. The outer contour of the orthographic projection of the release adhesive 22 on the reference surface is located outside the outer contour of the orthographic projection of the film to be applied 2 on the reference surface. This means that the orthographic projection of the release adhesive 22 on the reference surface coincides with or does not coincide with the orthographic projection of the film to be applied 2 on the reference surface. Specifically, this includes several different situations. For example, the film to be applied 2 and the release adhesive 22 are spaced apart on the bearing surface a1, that is, the first inner contour b2 is located outside the second outer contour b3; another example is that there is no gap between the film to be applied 2 and the release adhesive 22, and the outer peripheral surface of the film to be applied 2 and the inner peripheral surface of the release adhesive 22 are bonded together, that is, the first inner contour b2 and the second outer contour b3 are bonded together; yet another example is that the orthographic projections of the film to be applied 2 and the release adhesive 22 on the reference surface coincide, that is, the second outer contour b3 is located outside the first inner contour b2 and inside the first outer contour b1. However, in this embodiment, since the first surface a4 of the film to be applied 2 needs to be bonded to the film material 3 (please refer to the following text)... Figures 6-9In order for the film material 3 to completely cover the first surface a4 of the part to be applied 2, the first surface a4 needs to be fully exposed. Therefore, the overlapping part of the part to be applied 2 and the release adhesive 22 is in the first direction X, and the part to be applied 2 is located above the release adhesive 22. In order to place the part to be applied 2 on the bearing surface a1, a groove structure (not shown in the figure) for accommodating part of the release adhesive 22 can be correspondingly provided on the carrier 21.

[0082] Step S120: Apply the membrane material 3 to the surface of the film piece 2 facing away from the bearing surface a1;

[0083] Specifically, before bonding the film material 3 to the film part 2, the film material 3 is first heated by a heating device (not shown in the figure). After the film material 3 is heated, pressure is applied to bond the film material 3 to the first surface a4 of the film part 2. At the same time, the portion of the film material 3 exposed from the film part 2 is bonded to the side of the release adhesive 22 facing away from the bearing surface a1. This side of the release adhesive 22 facing away from the bearing surface a1 is designated as the third surface a6 (see below). Figure 6 , Figure 8 , Figure 9 In some embodiments, after the membrane material 3 is heated, the carrier 21 is moved along the first direction X toward the membrane material 3, so that the film to be applied 2 reaches the position of the membrane material 3, and then pressure is applied to the membrane material 3 to make the membrane material 3 adhere to the first surface a4 of the film to be applied 2. It is understood that the applied pressure can be air pressure, hydraulic pressure, etc., as long as it can make the membrane material 3 adhere tightly to the film to be applied 2.

[0084] It should be noted that the heating of film material 3 is necessary because optical adhesive (OCA) needs to be heated to give it adhesive properties. If it is another type of adhesive, whether heating is required can be determined based on the characteristics of that adhesive, and no limitation is made here.

[0085] Step S130: The release adhesive 22, the bonded film material 3, and the film part 2 to be bonded are separated from the bearing surface a1; the adhesion force between the film material 3 and the bearing surface a1 is greater than the adhesion force between the release adhesive 22 and the bearing surface a1.

[0086] It should be noted that the adhesive force refers to the bonding force between molecules at the interface between the adhesive and the bonded object. In this application, the adhesive is the film material 3 and the release adhesive 22, the bearing surface a1 is the bonded object, and the adhesive force is the bonding force between molecules on the surface where the film material 3 or the release adhesive 22 is in contact with the bearing surface a1.

[0087] The above bonding method, by setting the release adhesive 22 and ensuring that the adhesion force between the release adhesive 22 and the bearing surface a1 is less than that between the film material 3 and the bearing surface a1, makes it easier for the release adhesive 22 to detach from the bearing surface a1 than for the film material 3 to detach from the bearing surface a1. Because the release adhesive 22 detaches more easily from the bearing surface a1, the external force required for detachment is smaller, resulting in less tensile force on the film material 3. This helps to reduce warping deformation of the film material 3 (the edge portion of the film material 3) located above the release adhesive 22 in the first direction X, thereby improving the deformation of the film material 3 bonded to the part to be bonded. This also helps to reduce gaps between the bonded part 2 and the corresponding film material 3, and reduces air bubbles B (see later text) at the edge of the part 2 to be bonded. Figure 10 (This is the situation.)

[0088] In some embodiments, in step S110, placing the release adhesive 22 and the film to be applied 2 along the first direction X on the bearing surface a1 of the carrier 21 of the bonding device 20 includes:

[0089] Place the film-to-be-applied part 2 and the release adhesive 22 sequentially on the bearing surface a1 along the first direction X.

[0090] It should be noted that the film to be applied 2 can be placed on the bearing surface a1 along the first direction X first, and then the release adhesive 22 can be placed on the bearing surface a1 along the first direction X. Of course, in some embodiments, the release adhesive 22 can also be placed on the bearing surface a1 along the first direction X first, and then the film to be applied 2 can be placed on the bearing surface a1 along the first direction X. It is understood that the placement order of the film to be applied 2 and the release adhesive 22 can be selected according to the actual situation, and no further restrictions are imposed here. The film to be applied 2 and the release adhesive 22 are placed sequentially on the bearing surface a1 along the first direction X. It is not simply a matter of placing the film to be applied 2 and the release adhesive 22 on the bearing surface a1, but rather, after placing them on the bearing surface a1, it is necessary to fix the film to be applied 2 and the release adhesive 22 to the bearing surface a1 so that they can be stably fixed on the bearing surface a1. The fixing method between the film to be applied 2 and the release adhesive 22 and the bearing surface a1 can be vacuum adsorption or other fixing methods. There are no great limitations here, as long as it meets the actual use requirements.

[0091] Combined with the bonding device 20 described below (please refer to the following text) Figures 6-9 Regarding vehicle 21 (please refer to the following text) Figures 6-9 According to the description, in some embodiments, the vehicle 21 includes a first platform 211 (see below). Figures 6-9 ) and multiple secondary platforms 212 (see below) Figures 6-9Therefore, in this embodiment, the film to be applied 2 and the release adhesive 22 are arranged sequentially to adapt to the specific structure of the carrier 21. When the carrier 21 is in the second state, the film to be applied 2 is placed on the bearing surface a1. Then, the carrier 21 is switched to the first state, and the release adhesive 22 is placed on the bearing surface a1. In this way, by sequentially placing the film to be applied 2 and the release adhesive 22 on the bearing surface a1 along the first direction X, the structure of the carrier 21 is adapted, and the placement of the film to be applied 2 and the release adhesive 22 is also convenient.

[0092] In some embodiments, step S130, detaching the release adhesive 22, the bonded film material 3, and the film to be bonded 2 from the bearing surface a1, includes:

[0093] This causes the release adhesive 22, the laminated film material 3, and the film part to be laminated 2 to simultaneously detach from the bearing surface a1.

[0094] It should be noted that simultaneously detaching the release adhesive 22, the bonded film material 3, and the film piece 2 from the bearing surface a1 means simultaneously releasing the fixation between the release adhesive 22 and the bearing surface a1, as well as the fixation between the bonded film material 3 and the film piece 2 and the bearing surface a1. Since the outer dimensions of the film material 3 are larger than the outer dimensions of the film piece 2, that is, the outer contour of the orthographic projection of the film material 3 on the reference surface is outside the outer contour of the orthographic projection of the film piece 2 on the reference surface, a portion of the film material 3 protrudes from the film piece 2. The orthographic projection of the release adhesive 22 on the reference surface is within the orthographic projection of the film material 3 on the reference surface. Furthermore, since the film material 3 and the film piece 2 are bonded using adhesive, during bonding, the portion of the film material 3 protruding from the film piece 2 will adhere to the release adhesive 22 through the adhesive. It can be understood that after bonding, part of the film material 3 adheres to the film piece 2, and part of the film material 3 adheres to the release adhesive 22. After lamination, in order to obtain the laminated film material 3 and the film part 2 to be laminated, the entire film material 3 that is not laminated to the film part 2 can be cut off directly, that is, cut along the outer contour line of the film part 2 to be laminated, thereby cutting off the part of the film material 3 that is laminated with the release adhesive 22 and the part of the release adhesive 22 that is not laminated.

[0095] It is understandable that if the release adhesive 22, the bonded film material 3, and the film part 2 to be bonded are detached from the bearing surface a1 sequentially, the part that detaches from the bearing surface a1 first will pull on the part that detaches later, and the part that detaches later will also pull on the part that detached first. This pulling force will cause uneven stress on the bonded film material 3 and the film part 2, especially at the edges of the bonded film material 3 and the film part 2, which will be subjected to greater pulling force. This can easily lead to gaps between the bonded film material 3 and the film part 2, and can also easily cause deformation of the film material 3 and air bubbles B at the edges of the film part 2 (please refer to the following text). Figure 10 ).

[0096] In this way, by simultaneously removing the release adhesive 22, the laminated film material 3, and the film part 2 to be laminated from the bearing surface a1, the uneven stress on the laminated film material 3 and the film part 2 to be laminated can be improved, thereby further improving the lamination quality of the film part 2 to be laminated.

[0097] In some embodiments, the inner contour of the orthographic projection of the release adhesive 22 on the reference surface is located outside the outer contour of the orthographic projection of the film to be applied 2 on the reference surface.

[0098] It should be noted that the inner contour of the orthographic projection of the release adhesive 22 on the reference surface is outside the outer contour of the orthographic projection of the part to be applied 2 on the reference surface. This means that the orthographic projection of the release adhesive 22 on the reference surface does not coincide with the orthographic projection of the part to be applied 2 on the reference surface. It can be understood that there may be a gap between the release adhesive 22 and the part to be applied 2, or there may be no gap; they may be tightly adhered to each other. In other words, there may be a gap between the inner contour of the orthographic projection of the release adhesive 22 on the reference surface and the outer contour of the orthographic projection of the part to be applied 2 on the reference surface, or they may be tightly adhered to each other. Since a certain pressure needs to be applied to the film material 3 when bonding the film material 3 and the film to be bonded 2, so that the film material 3 and the film to be bonded 2 are bonded together, if there is a gap between the release adhesive 22 and the film to be bonded 2, the film material 3 may be squeezed into the gap under pressure and bonded to the carrier 21. Therefore, in order to facilitate the separation of the bonded film material 3 and the film to be bonded 2 from the carrier 21, no gap can be set between the release adhesive 22 and the film to be bonded 2.

[0099] Thus, by positioning the inner contour of the orthographic projection of the release adhesive 22 on the reference surface outside the outer contour of the orthographic projection of the film to be applied 2 on the reference surface, compared to the partial overlap of the release adhesive 22 and the film to be applied 2, the first surface a4 of the film to be applied 2 can be completely placed on the bearing surface a1, resulting in a larger adsorption area between the film to be applied 2 and the bearing surface a1, thereby making the film to be applied 2 more stably adsorbed on the bearing surface a1, which is beneficial to improving the film application quality of the film to be applied 2.

[0100] In some embodiments, the carrier 21 is provided with an adsorption hole c penetrating the bearing surface a1 along the first direction X (see below). Figure 10 The orthographic projection of the adsorption hole c on the reference surface lies within the orthographic projection of the release adhesive 22 on the reference surface; the release adhesive 22 is adsorbed onto or detached from the bearing surface a1 by means of the adsorption hole c. It can be understood that the number and shape of the adsorption hole c can be set according to actual use.

[0101] It should be noted that by changing the air pressure inside the adsorption hole c, the release adhesive 22 can be adsorbed onto or detached from the supporting surface a1. For example, the adsorption hole c is connected to a vacuum device. The vacuum device can remove the gas inside the adsorption hole c to create a negative pressure (negative pressure means that the air pressure inside the adsorption hole c is less than atmospheric pressure), thereby causing the release adhesive 22 to be adsorbed onto the supporting surface a1. Alternatively, the vacuum device can fill the adsorption hole c with gas at a certain pressure to create a positive pressure (positive pressure means that the air pressure inside the adsorption hole c is greater than atmospheric pressure), thereby causing the release adhesive 22 to detach from the supporting surface a1.

[0102] Thus, by setting the adsorption hole c, and using the adsorption hole c to allow the release adhesive 22 to be adsorbed onto or detached from the bearing surface a1, it is possible to control the adsorption and detachment between the release adhesive 22 and the bearing surface a1. It can also alleviate the pulling on the laminated film material 3 and the film part 2 when the release adhesive 22 is detached from the bearing surface a1. This is beneficial to improve the warping deformation of the film material 3 and the gap between the edge of the laminated film part 2 and the film material 3. It is also beneficial to improve the situation of air bubbles B generated at the edge of the film part 2, thereby improving the film application quality of the film part 2.

[0103] In some embodiments, the adhesion between the release adhesive 22 and the bearing surface a1 is 0 N / mm.

[0104] It is understandable that an adhesion force of 0 N / mm means there is no adhesion between the release adhesive 22 and the bearing surface a1. N / mm is the unit of adhesion force, which is Newtons per millimeter. The magnitude of the adhesion force between the release adhesive 22 and the bearing surface a1 is related to the materials of the release adhesive 22 and the bearing surface a1. The material of the carrier 21 is generally iron, polytetrafluoroethylene, etc. In order to reduce the adhesion force between the release adhesive 22 and the bearing surface a1, the material of the release adhesive 22 can be set accordingly to make the adhesion force between the release adhesive 22 and the carrier 21 as small as possible. The adhesive force between the release adhesive 22 and the bearing surface a1 is also related to the size of the contact area between them. For example, in some embodiments, the release adhesive 22 and the film to be applied 2 partially overlap; in other embodiments, they do not overlap. When they partially overlap, the contact area between the release adhesive 22 and the bearing surface a1 is larger, resulting in a stronger adhesive force. Therefore, to facilitate the release adhesive 22's detachment from the bearing surface a1, they can be designed to have no overlap.

[0105] In some embodiments, the release adhesive 22 is made of polytetrafluoroethylene or polyetheretherketone. It is understood that the material of the release adhesive 22 is not limited to these; it can also be other materials with low or no adhesion. Furthermore, the thickness of the release adhesive 22 provided in this application is also related to its material. If the material of the release adhesive 22 is relatively soft, its thickness can be appropriately increased; if the material of the release adhesive 22 is relatively hard, its thickness can be appropriately decreased. Thus, by setting the release adhesive 22 with appropriate thickness and material, the release adhesive 22 has a certain supporting strength, while the release adhesive 22 will not be too hard, thus affecting its adhesion effect on the bearing surface a1.

[0106] Figure 6 This is a front view schematic diagram of the film to be applied 2 and film material 3 placed on the bonding device 20 in one embodiment of this application; Figure 7 This is a top view of an embodiment of the present application, showing the film to be applied 2 and the film material 3 placed on the bonding device 20. Figure 8 This is a front view schematic diagram of the film-to-be-applied component 2 and the film material 3 after being applied on the bonding device 20 in one embodiment of this application; Figure 9 This is a front view schematic diagram of the film to be bonded 2 and film material 3, as well as the release adhesive 22, after being bonded and separated from the bonding device 20 in one embodiment of this application; for ease of explanation, only the content related to the embodiment of this application is shown.

[0107] See Figures 6 to 9 This application also provides a bonding device 20 for bonding a film component 2 and a film material 3. The bonding device 20 includes a carrier 21 and a release adhesive 22. The carrier 21 has a bearing surface a1 (see reference). Figure 6 , Figure 8 , Figure 9 The bearing surface a1 is used in the first direction X (see reference). Figure 6 , Figure 8 , Figure 9 The film to be applied 2 is supported on the support surface a1, and the release adhesive 22 is placed on the support surface a1. The film to be applied 2 and the release adhesive 22 are supported on the support surface a1. The outer contour of the orthographic projection of the release adhesive 22 on the reference surface is outside the outer contour of the orthographic projection of the film to be applied 2 on the reference surface. The reference surface is perpendicular to the first direction X. The adhesive force between the film 3 and the support surface a1 is greater than the adhesive force between the release adhesive 22 and the support surface a1.

[0108] It is understood that the detailed description of the positional relationship between the release adhesive 22, the first direction X, the reference surface and the part to be bonded 2 is the same as that described in the bonding method above, so it will not be repeated here.

[0109] The aforementioned bonding device 20 includes at least a carrier 21 and a release adhesive 22. By providing the release adhesive 22 on the bearing surface a1 and ensuring that the adhesive force between the release adhesive 22 and the bearing surface a1 is less than the adhesive force between the film material 3 and the bearing surface a1, the release adhesive 22 can easily detach from the bearing surface a1. The exposed film material 3 of the part to be bonded 2 is bonded to the third surface a6 of the release adhesive 22 (i.e., the surface of the release adhesive 22 facing away from the bearing surface a1, please refer to...). Figure 6 , Figure 8 , Figure 9 Instead of adhering to the carrier 21, the release agent 22 and the adhered film 3 are bonded together. This helps to reduce the amount of adhesive residue on the carrier 21, thereby slowing down the wear of the carrier 21 and extending its service life. After the film 3 and the film to be applied 2 are bonded together, it is the release agent 22 and the bonded film 3 and the film to be applied 2 that need to be separated from the carrier 21, rather than directly removing the film 3 from the carrier 21. This makes it easier to separate the bonded film 3 and the film to be applied 2 from the carrier 21, requiring less external force and less pulling on the film 3. This helps to reduce the deformation of the film 3, the gap between the bonded film to be applied 2 and the film 3, and the air bubbles B on the edge of the film to be applied 2 (please refer to the following text). Figure 10 (This is the situation.)

[0110] See Figure 7 In some embodiments, the inner contour of the orthographic projection of the release adhesive 22 on the reference surface is located outside the outer contour of the orthographic projection of the film to be applied 2 on the reference surface.

[0111] It is understood that the detailed description of the positional relationship between the release adhesive 22 and the film part 2 to be bonded is the same as that described in the bonding method above, so it will not be repeated here.

[0112] See Figures 6-9 In some embodiments, the vehicle 21 is along a first direction X (see reference). Figure 6 , Figure 8 , Figure 9 An adsorption hole c is provided that penetrates the bearing surface a1. The orthographic projection of the adsorption hole c on the reference surface is located within the orthographic projection of the release adhesive 22 on the reference surface. The release adhesive 22 is adsorbed onto or detached from the bearing surface a1 by means of the adsorption hole c.

[0113] It is understood that the detailed description of the specific method by which the release adhesive 22 is fixed on the bearing surface a1 is the same as that described in the bonding method above, so it will not be repeated here.

[0114] See Figure 7 In some embodiments, multiple adsorption holes c are provided, and all adsorption holes c are spaced apart along the circumference of the carrier 21. Furthermore, the orthographic projection of all adsorption holes c on the reference surface lies within the orthographic projection of the release adhesive 22 on the reference surface.

[0115] It is understandable that the number and shape of the multiple adsorption holes c can be set according to actual needs. The shape of all adsorption holes c can be set to be the same, some adsorption holes c can be set to be the same, or all can be set to be different. However, for ease of processing and manufacturing, all adsorption holes c can be set to be the same shape. This also helps to make the adsorption force of the release adhesive 22 more uniform when it is adsorbed onto the bearing surface a1. When the film material 3 is subjected to external force and is bonded to the film part 2, it is less likely that the adsorption force of the release adhesive 22 will be different due to the different adsorption holes c, thus preventing the film material 3 from deforming.

[0116] In this way, by setting multiple adsorption holes c, the adsorption or desorption rate of the release adhesive 22 and the bearing surface a1 can be accelerated without affecting the support strength of the carrier 21.

[0117] See Figure 7 In some embodiments, all adsorption holes c are arranged at equal intervals. This ensures that the release adhesive 22 is subjected to uniform force, which helps to improve the situation where the film material 3 is deformed due to uneven force on the release adhesive 22. Moreover, deformation of the film material 3 will also affect the film application quality of the part to be filmed 2.

[0118] See Figures 6-9 In some embodiments, the bonding device 20 further includes a vacuum device (not shown) connected to the adsorption hole c. The vacuum device is used to provide suction through the adsorption hole c to allow the release adhesive 22 to adhere to the bearing surface a1 (see reference). Figure 6 , Figure 8 , Figure 9 The adsorption force of the release adhesive 22 and the release force that causes the release adhesive 22 to detach from the bearing surface a1.

[0119] It should be noted that the adsorption force refers to the force required to adsorb the release adhesive 22 onto the supporting surface a1, or the force required to fix the release adhesive 22 onto the supporting surface a1. In one embodiment of this application, the release adhesive 22 is adsorbed onto the supporting surface a1 by vacuum adsorption. Therefore, the adsorption force refers to the magnitude of the negative pressure required to form in the adsorption hole c to make the release adhesive 22 adsorb onto the supporting surface a1. The detachment force refers to the force required to detach the release adhesive 22 from the supporting surface a1. In one embodiment of this application, the detachment force specifically refers to the magnitude of the positive pressure required to form in the adsorption hole c by introducing gas to make the adsorption hole c detach from the supporting surface a1. When multiple adsorption holes c are provided, in order to make the release adhesive 22 more evenly stressed, the vacuuming device can simultaneously evacuate or fill all adsorption holes c with gas. For example, the vacuuming device can be connected to all adsorption holes c simultaneously through multiple branch pipes, so that the vacuuming device can simultaneously evacuate or fill all adsorption holes c with gas. Because the adhesion between the release adhesive 22 and the bearing surface a1 is relatively small, when separating the release adhesive 22 from the bearing surface a1, the vacuum device can provide a suitable amount of release force according to actual needs. However, due to the continuous provision of release force for a long time, the release adhesive 22 may exert a force on the film material 3 in the first direction X away from the bearing surface a1 after being subjected to the release force (or it could be the component of the force exerted by the release adhesive 22 on the film material 3 in the first direction X away from the bearing surface a1), thereby causing deformation of the film material 3 and affecting the film application quality of the film to be applied 2. To address this, the vacuum device can provide the release force multiple times in a short period of time. For example, the time for each gas injection into the adsorption hole c is about 1 second, and the gas pressure for each injection is 0.2 MPa to 0.5 MPa (megapascals). Of course, the magnitude of the release force and whether it can be continuously provided need to be set according to the actual situation, and no further limitations are imposed here.

[0120] Thus, by setting up a vacuum device connected to the adsorption hole c, an adsorption force is provided for the release adhesive 22 to adhere to the bearing surface a1, and a release force is provided to separate the release adhesive 22 from the bearing surface a1. By using vacuum adsorption and desorption to adsorb or detach the release adhesive 22 from the bearing surface a1, the stability of the release adhesive 22 fixed on the bearing surface a1 can be improved. Moreover, by controlling the magnitude of the release force, the impact on the laminated film material 3 and the film to be laminated 2 when detaching the release adhesive 22 from the bearing surface a1 can be reduced. This improves the situation where the laminated film material 3 warps and deforms due to external force pulling, or even causes gaps between the film material 3 and the film to be laminated 2, which is beneficial to improving the lamination quality of the film to be laminated 2.

[0121] See Figures 6-9In some embodiments, the vacuuming device includes a vacuuming apparatus (not shown) and an inflation apparatus (not shown). The bonding device 20 also includes a control element (not shown), which connects the adsorption hole c to the vacuuming apparatus and the inflation apparatus. The control element can controllably connect the adsorption hole c to the vacuuming apparatus or to the inflation apparatus. Optionally, the control element is a three-way valve.

[0122] See Figures 6-9 In some embodiments, the adhesion between the release adhesive 22 and the bearing surface a1 is 0 N / mm. It is understood that the detailed description of the adhesion between the release adhesive 22 and the bearing surface a1 is the same as that described in the bonding method above, and therefore will not be repeated here.

[0123] See Figure 6 , Figure 8 , Figure 9 In some embodiments, the size of the release adhesive 22 along the first direction X is 0.05 mm to 0.2 mm.

[0124] It should be noted that the dimension of the release adhesive 22 along the first direction X is denoted as the first dimension d. When bonding the film material 3 and the part to be bonded 2, a certain external force needs to be applied to the film material 3 so that the film material 3 exerts a force or component force on the release adhesive 22 along the first direction X toward the bearing surface a1. If the first dimension d is too small (less than 0.05 mm), that is, the thickness of the release adhesive 22 is too thin, the support strength of the release adhesive 22 is low. When the release adhesive 22 is subjected to the force from the film material 3, it is easy to deform. This will cause the film material 3 to deform as well, thus affecting the bonding quality of the part to be bonded 2. Moreover, the low support strength of the release adhesive 22 will also cause problems when the release adhesive is bonded to the part to be bonded 2 through the vacuum device. When the release adhesive 22 is adsorbed onto the bearing surface a1, the location of the adsorption hole c is prone to deformation, which in turn causes the film material 3 to deform, affecting the film application quality. Furthermore, if the release adhesive 22 is too thin, it is not convenient for the gripping tool (e.g., a robotic arm) to grip and move the release adhesive 22. If the first dimension d is too large (greater than 0.2 mm), that is, the thickness of the release adhesive 22 is too thick, it is difficult for the release adhesive 22 to deform. As a result, the release adhesive 22 is difficult to adhere tightly to the bearing surface a1 when subjected to adsorption force, which can easily lead to unstable fixation of the release adhesive 22 and affect the film application quality of the film-to-be-applied part 2. In addition, if the release adhesive 22 is too thick, it will also waste material.

[0125] See Figures 6-9 In some embodiments, the release adhesive 22 is made of polytetrafluoroethylene or polyetheretherketone. It is understood that the detailed description of the material of the release adhesive 22 is the same as that described in the bonding method above, and therefore will not be repeated here.

[0126] See Figures 6-9In some embodiments, the vehicle 21 includes a first platform 211 and a plurality of second platforms 212, the plurality of second platforms 212 being arranged around the first platform 211 and configured to move toward or away from the first platform 211 to allow the vehicle 21 to switch between a first state and a second state. The first platform 211 has a first sub-support surface a2 (see reference...). Figure 6 , Figure 8 , Figure 9 Each second platform 212 has a second sub-support surface a3 (see reference). Figure 6 , Figure 8 , Figure 9 In the first state, each second sub-bearing surface a3 is engaged with the first sub-bearing surface a2, and all the second sub-bearing surfaces a3 and the first sub-bearing surfaces a1 together constitute the bearing surface a1; in the second state, a gap is formed between each second sub-bearing surface a3 and the first sub-bearing surface a2.

[0127] Combining the bonding method described above, the bonding device 20 can be applied to the bonding method. Specifically, step S110 includes: first, placing the carrier 21 in the second state; then, placing the film to be bonded 2 on the first sub-supporting surface a2; then, switching the carrier 21 to the first state and setting the release adhesive 22 on the second sub-supporting surface a3.

[0128] It should be noted that if multiple second platforms 212 are configured as an independent integral structure, since the second platform 212 and the first platform 211 cannot move relative to each other, it will be difficult to accurately place the film to be applied 2 on the bearing surface a1. In particular, the circumferential edge of the film to be applied 2 cannot transition smoothly and precisely, which is not conducive to the bonding of the film to be applied 2 and the film material 3. Moreover, since there will be a gap between the integral second platform 212 and the first platform 211, the film to be applied 2 can be easily placed on the bearing surface a1, but the gap between the integral second platform 212 and the first platform 211 cannot support the film to be applied 2 and the film material 3, which is not conducive to the bonding of the film to be applied 2 and the film material 3. Therefore, the inventors of this application, through further research, configured the carrier 21 as a first platform 211 and a plurality of second platforms 212, thereby improving the installation accuracy of the film to be applied 2 on the bearing surface a1 and facilitating the bonding between the film to be applied 2 and the film material 3. In particular, by reducing the gap between the first platform 211 and the second platform 212, the circumferential edge of the film to be applied 2 can be supported on the second sub-bearing surface a3.

[0129] Thus, by setting up a first platform 211 and multiple second platforms 212, it is convenient to place the film to be applied 2. When the carrier 21 switches to the second state, the film to be applied 2 can be placed on the first sub-supporting surface a2, and then all the second platforms 212 are moved toward the first platform 211, so that the carrier 21 switches to the first state, and all the second sub-supporting surfaces a3 engage with the first sub-supporting surface a2 to jointly support the film to be applied 2. In addition, the multiple second platforms 212 can also clamp the film to be applied 2 together to fix the film to be applied 2. Moreover, this can minimize the gap between the first platform 211 and the second platform 212 to better support the film to be applied 2, which is beneficial to the bonding of the film material 3 to the film to be applied 2.

[0130] See Figures 6 to 9 In some embodiments, the carrier 21 also includes a base (not shown). The first platform 211 is mounted on the base, and all the second platforms 212 are movably mounted on the base. In this way, the base can provide a more reliable mounting position for the first platform 211 and the second platform 212.

[0131] In some specific embodiments, one of the second platform 212 and the base is provided with a slider (not shown in the figure), and the other of the second platform 212 and the base is provided with a slide rail (not shown in the figure), with the slider and the slide rail slidably connected. In this way, the movement of the second platform 212 relative to the first platform 211 can be guided by the slide rail and the slider, thereby improving the smoothness of the second platform 212 moving toward or away from the first platform 211.

[0132] In some embodiments, one of the second platform 212 and the first platform 211 is provided with a magnetic attracting element (not shown in the figure), and the other of the second platform 212 and the first platform 211 is provided with a magnetic attracting element (not shown in the figure) or is a magnetically attractable element. Thus, when all the second platforms 212 are in the first state, the magnetic attraction ensures that the second platform 212 is more securely attached to the periphery of the first platform 211 without moving. Specifically, in some embodiments, the second platform 212 is provided with a magnetic attracting element, and the first platform 211 is provided with a magnetically attractable element. Of course, the second platform 212 itself can be a magnetic attracting element, and the first platform 211 itself can be a magnetically attractable element.

[0133] It should be noted that the property of an object to be attracted or repelled by an external magnetic field is called the object's magnetism, while magnetic attraction refers to the ability of an object to be attracted by an external magnetic field when it is subjected to such a field. For example, the magnetic attracting component can be, but is not limited to, a magnetic component, and the magnetically attractable component can be, but is not limited to, a metal component that can be attracted by a magnet, as long as it can ensure that the second platform 212 and the first platform 211 can be attracted to each other by means of magnetic attraction to securely attach to each other.

[0134] To illustrate the specific manner in which vehicle 21 switches between the first state and the second state, this application provides the exemplary embodiments described above. It should be understood that these exemplary embodiments are intended to explain the manner in which vehicle 21 switches, rather than to limit the manner in which vehicle 21 switches.

[0135] See Figures 6 to 9 In some embodiments, the first sub-supporting surface a2 is used to support at least a portion of the film to be applied 2 in the first direction X, and the second sub-supporting surface a3 is used to support at least a portion of the release adhesive 22 in the first direction X.

[0136] It should be noted that, in Figures 6-9 The diagram shows the film-to-be-applied component 2 entirely disposed on the first sub-supporting surface a2, and the release adhesive 22 entirely disposed on the second sub-supporting surface a3. However, depending on the specific structure of the film-to-be-applied component 2, the release adhesive 22, and the carrier 21, the positions of the film-to-be-applied component 2 and the release adhesive 22 can be configured accordingly. In the first state, the film-to-be-applied component 2 can be partially disposed on the first sub-supporting surface a2 and partially disposed on multiple second sub-supporting surfaces a3. In the first state, the release adhesive 22 can be entirely or partially disposed on the second sub-supporting surfaces a3. For example, some of the release adhesive 22 can be disposed on the first sub-supporting surface a2, and some of the release adhesive 22 can be disposed on all of the second sub-supporting surfaces a3, with the portion of the release adhesive 22 on the first sub-supporting surface a2 located below the film-to-be-applied component 2 along the first direction X.

[0137] See Figures 6 to 9 In some embodiments, each second platform 212 is provided with a first mounting groove (not shown in the figure), and the first mounting groove is provided through the second sub-support surface a3. All the first mounting grooves are used to jointly accommodate the release adhesive 22.

[0138] In this way, the release adhesive 22 can be completely placed on the second sub-support surface a3; by setting the first mounting groove, it is convenient to install the release adhesive 22, and it is beneficial to improve the installation accuracy of the release adhesive 22 and also improve the efficiency of film application.

[0139] See Figures 6 to 9 In some embodiments, each second platform 212 is provided with a first mounting groove (not shown in the figure), and the first platform 211 is provided with a second mounting groove (not shown in the figure) that communicates with the first mounting groove. The first mounting groove is provided through the second sub-supporting surface a3, and the second mounting groove is provided through the first sub-supporting surface a2. All the first mounting grooves and the second mounting grooves are used to jointly accommodate the release adhesive 22.

[0140] It should be noted that, in this embodiment of the application, since the release adhesive 22 is partially disposed on the first sub-supporting surface a2, the part to be coated 2 is disposed on the part of the release adhesive 22 located on the first sub-supporting surface a2.

[0141] In this way, the release adhesive 22 can be partially disposed on the first sub-supporting surface a2 and partially disposed on the second sub-supporting surface a3; by setting the first mounting groove and the second mounting groove that are connected, the release adhesive 22 can be installed, thereby improving the installation accuracy of the release adhesive 22 and the efficiency of film application.

[0142] See Figure 6 , Figure 8 , Figure 9 In some embodiments, the shape of the first sub-supporting surface a2 is adapted to the shape of the side surface of the film to be applied 2 facing each other along the first direction X. It is understood that if the shape of the side surface of the first sub-supporting surface a2 facing the film to be applied 2 does not match the shape of the side surface of the film to be applied 2 placed on the first sub-supporting surface a2, the film to be applied 2 will be prone to deformation, thereby affecting the quality of the film application.

[0143] In this way, by adapting the shape of the first sub-bearing surface a2 to the shape of the side surface of the film to be applied 2 facing each other along the first direction X, the deformation of the film to be applied 2 can be improved, thereby improving the film application quality of the film to be applied 2.

[0144] It should be noted that the film-to-be-applied component 2 shown in the accompanying drawings is for illustrative purposes only. The film-to-be-applied component 2 in this application can be a planar structure, a curved surface structure, or other irregular structures. The film-to-be-applied component 2 can be used for lens assembly, wearable display devices, or other electronic devices such as mobile phones. It is understood that in order to better fit the second surface a5 of the film-to-be-applied component 2 onto the bearing surface a1, and to make the circumferential edge of the second surface a5 transition more smoothly from the first sub-bearing surface a2 to the second sub-bearing surface a3, the outer contour shape of the surface of the second platform 212 that abuts against the film-to-be-applied component 2 also needs to be adapted to the outer contour shape of the second surface a5.

[0145] For example, see Figure 6 , Figure 8 and Figure 9When the film to be applied 2 is a curved structure, and the second surface a5 is also constructed as a curved surface, the outer shape of the first sub-supporting surface a2 can also be constructed as a curved surface that matches the outer shape of the second surface a5 of the film to be applied 2. Furthermore, the outer shape of the surface of the second platform 212 that abuts against the film to be applied 2 can also be constructed as a curved surface that matches the corresponding portion of the second surface a5. This facilitates the placement and application of the film to be applied 2. It is understandable that curved structures are more difficult to place than planar structures. If the curved second surface a5 is directly applied to the planar support surface a1, the applied pressure during the application of the film material 3 and the film to be applied 2 can easily cause deformation of the film to be applied 2, leading to damage. Therefore, when applying the film material 3 to the curved film to be applied 2, it is necessary to design a support surface a1 that is constructed as a matching curved surface to ensure complete adhesion between the second surface a5 and the support surface a1. Moreover, the embodiments of this application are described in detail with the example of the film to be applied 2 having a curved surface structure. Of course, if the film to be applied 2 has a planar structure, the bearing surface a1 can be set as a plane that matches the second surface a5 of the film to be applied 2. That is, the specific shape and structure of the carrier 21 can be adapted accordingly.

[0146] Figure 10 A partially enlarged schematic diagram of the film to be applied and the film material after being separated from the bonding device in the comparative example is shown; for ease of explanation, only the content related to the comparative example is shown, and the two black parts are the edges of the opposite sides of the film to be applied 2, and the white part between the two black parts is the surface of the film to be applied 2 exposed after the film material 3 is cut off.

[0147] See Figure 10 The comparative example can be the bonding device 10 and bonding method in one embodiment of the related technology mentioned above. In this comparative example, after the bonded film 2 and film 3 are detached from the carrier 11, the deformation of the film 3 can be clearly seen, and air bubbles B are generated at the edge of the film 2.

[0148] Figure 11 This is a partially enlarged schematic diagram of the film to be applied and the film material after they have been separated from the bonding device in one embodiment of this application. For ease of explanation, only the content related to the embodiment of this application is shown, and the two black parts are the edges of the opposite sides of the film to be applied 2, and the white part between the two black parts is the surface of the film to be applied 2 exposed after the film material 3 has been cut off.

[0149] See Figure 11 In one embodiment of this application, after the laminated film 2 and film 3 are detached from the carrier 21, the film 3 does not exhibit significant deformation, and no air bubbles B are generated at the edge of the film 2 (please refer to the above). Figure 10 ).

[0150] contrast Figure 10 and Figure 11 This is sufficient to demonstrate that the bonding method and bonding device 20 of this application can effectively improve the problems existing in the comparative example and is conducive to improving the bonding quality of the film to be bonded to the part 2.

[0151] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0152] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A method of conforming, characterized by, The application relates to a laminating device and a laminating method. The laminating device comprises: a carrier having a carrier surface, wherein the carrier is provided with suction holes penetrating through the carrier surface in a first direction, and the suction holes are configured to generate negative pressure or positive pressure; and a release adhesive for being placed on the carrier surface, wherein the suction holes in a reference surface are within the projection of the release adhesive on the reference surface. The release adhesive and the to-be-laminated member are placed on the carrier surface in the first direction, and the negative pressure is formed in the suction holes so that the release adhesive is adsorbed on the carrier surface; the outer contour of the projection of the release adhesive on the reference surface is located outside the outer contour of the projection of the to-be-laminated member on the reference surface, and the projection of the suction holes on the reference surface is located within the projection of the release adhesive on the reference surface.

2. The method of claim 1, wherein The film material is laminated on the side surface of the to-be-laminated member away from the carrier surface; the part of the film material exposed to the to-be-laminated member is laminated on the side surface of the release adhesive away from the carrier surface. The release adhesive and the laminated film material and to-be-laminated member are separated from the carrier surface; the adhesive force between the film material and the carrier surface is greater than the adhesive force between the release adhesive and the carrier surface; and the release adhesive is separated from the carrier surface by the positive pressure formed in the suction holes.

3. The method of claim 1, wherein The release adhesive and the to-be-laminated member are placed on the carrier surface in the first direction, and the negative pressure is formed in the suction holes so that the release adhesive is adsorbed on the carrier surface; the outer contour of the projection of the release adhesive on the reference surface is located outside the outer contour of the projection of the to-be-laminated member on the reference surface, and the projection of the suction holes on the reference surface is located within the projection of the release adhesive on the reference surface. The release adhesive and the to-be-laminated member are placed on the carrier surface in the first direction, and the negative pressure is formed in the suction holes so that the release adhesive is adsorbed on the carrier surface; the outer contour of the projection of the release adhesive on the reference surface is located outside the outer contour of the projection of the to-be-laminated member on the reference surface, and the projection of the suction holes on the reference surface is located within the projection of the release adhesive on the reference surface.

4. The method of claim 1-3, wherein, The adhesive force between the release adhesive and the carrier surface is 0 N / mm.

5. The method of claim 1-3, wherein, The material of the release adhesive is polytetrafluoroethylene or polyether ether ketone.

6. The method of claim 1-3, wherein, The laminating device comprises:

7. A bonding device for bonding a film component to be bonded and a film material, characterized in that, a carrier having a carrier surface; the carrier surface is used for carrying the to-be-laminated member in a first direction, and the carrier is provided with suction holes penetrating through the carrier surface in the first direction, and the suction holes are configured to generate negative pressure or positive pressure; and a release adhesive for being placed on the carrier surface; the projection of the suction holes on a reference surface is within the projection of the release adhesive on the reference surface. The to-be-laminated member and the release adhesive are carried on the carrier surface, the outer contour of the projection of the release adhesive on the reference surface is located outside the outer contour of the projection of the to-be-laminated member on the reference surface, and the reference surface is perpendicular to the first direction. When the film material is laminated on the side surface of the to-be-laminated member away from the carrier surface, the part of the film material exposed to the to-be-laminated member is laminated on the side surface of the release adhesive away from the carrier surface; the adhesive force between the film material and the carrier surface is greater than the adhesive force between the release adhesive and the carrier surface. The inner contour of the projection of the release adhesive on the reference surface is located outside the outer contour of the projection of the to-be-laminated member on the reference surface.

8. The application of claim 7, wherein, The laminating device further comprises a vacuumizing device connected with the suction holes.

9. The application of claim 7, wherein, ​ The vacuumizing device is configured to provide an adsorbing force for adsorbing the release adhesive to the carrier surface and a releasing force for releasing the release adhesive from the carrier surface via the adsorbing hole.

10. The application according to any one of claims 7-9, wherein, The adhesive force between the release adhesive and the carrier surface is 0 N / mm; and / or The size of the release adhesive in the first direction is 0.05 mm to 0.2 mm; and / or The material of the release adhesive is polytetrafluoroethylene or polyether ether ketone.

11. The application according to any one of claims 7-9, wherein, The carrier includes a first carrier and a plurality of second carriers, the plurality of second carriers are arranged around the first carrier and are configured to be movable toward or away from the first carrier to switch the carrier between a first state and a second state; Wherein, the first carrier has a first sub-carrier surface, each second carrier has a second sub-carrier surface; in the first state, each second sub-carrier surface is engaged with the first sub-carrier surface, and all the second sub-carrier surfaces and the first sub-carrier surface jointly constitute the carrier surface; in the second state, a gap is formed between each second sub-carrier surface and the first sub-carrier surface.

12. The application of claim 11, wherein, The first sub-carrier surface is configured to carry at least part of the film to be attached in the first direction, and the second sub-carrier surface is configured to carry at least part of the release adhesive in the first direction. And / or The first sub-carrier surface is adapted to the shape of the side surface of the film to be attached and the release adhesive facing each other in the first direction.

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