A connecting structure for a homogeneous ceramic thermal structure component

The introduction of a fiber-reinforced ceramic composite transition interface frame addresses the thermal mismatch between uniform ceramics and metals, preventing cracking and expanding the application range of ceramics in high-temperature environments.

CN116674739BActive Publication Date: 2025-07-15AEROSPACE INST OF ADVANCED MATERIALS & PROCESSING TECH
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Patent Information

Application Number
CN202310623600.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-05-30
Publication Date
2025-07-15
Estimated Expiration
2043-05-30

AI Technical Summary

Technical Problem

The homogeneous ceramic material has high brittleness and low thermal expansion coefficient, making it difficult to directly connect to the metal connecting end frame, causing the connection area to crack at high temperatures, limiting its application range.

Method used

The transition adapter frame is used, and fiber-reinforced ceramic matrix composite or high-strength high-mode resin matrix composite is used as the transition adapter frame to connect the homogeneous ceramic thermal structure parts and the metal connecting end frame, and is fixed by glue and pins to enhance the stability and thermal matching performance of the connection.

Benefits of technology

Effectively protect the internal load device to avoid cracking of homogeneous ceramic thermal structural parts, broaden the application range of homogeneous ceramic materials, allow the use of more mature alloy materials, and expand the use temperature range.

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Abstract

The present invention discloses a connection structure for a homogeneous ceramic thermal structure member of a high-speed aircraft, which relates to the field of application of aviation structural materials, and includes: a homogeneous ceramic thermal structure member, a transition adapter frame, and a metal connection end frame; wherein, the transition adapter frame is located between the homogeneous ceramic thermal structure member and the metal connection end frame and is used as a connecting member between the homogeneous ceramic thermal structure member and the metal connection end frame, and is made of fiber-reinforced ceramic matrix composite material or high-strength and high-modulus resin matrix composite material. The present invention solves the problem of thermal matching in the connection area of the homogeneous ceramic thermal structure member by adding a transition adapter frame between the homogeneous ceramic thermal structure member and the metal connection end frame.
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Description

Technical Field

[0001] The present invention relates to the field of application of aerospace structural materials, and particularly to a connection structure for a homogeneous ceramic thermal structural component. Background Art

[0002] With the development of aerospace technology, the flight speed and flight time of various aircraft have been continuously improved, which makes the force and heat tests faced by the structural components everywhere on the aircraft more severe. Due to its excellent high-temperature resistance and good insulation characteristics, homogeneous ceramic materials are considered ideal materials for thermal structural components. However, homogeneous ceramic materials are relatively brittle and difficult to be directly connected to metal cabin sections.

[0003] Currently, the commonly adopted method is to directly connect the homogeneous ceramic thermal structural component to the metal connection end frame. However, homogeneous ceramic materials are brittle and have a low coefficient of thermal expansion. To match the lower coefficient of thermal expansion of homogeneous ceramics, low-expansion alloy Invar is mostly used. The service temperature of homogeneous ceramics and Invar generally does not exceed 200°C. When the temperature in the connection area is above 200°C, it will exceed the service limit of the Invar connection end frame and the homogeneous ceramic thermal structural component, resulting in the connection ring heating up and expanding to damage the ceramic thermal structural component, thus restricting the wider application of homogeneous ceramic materials with excellent temperature-resistant insulation performance. Summary of the Invention

[0004] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a connection structure for a homogeneous ceramic thermal structural component, by adding a transition adapter frame between the homogeneous ceramic thermal structural component and the metal connection end frame to solve the problem of thermal matching in the connection area of the homogeneous ceramic thermal structural component.

[0005] The technical solution adopted by the present invention to achieve the above purpose is as follows:

[0006] A connection structure for a homogeneous ceramic thermal structural component, comprising: a homogeneous ceramic thermal structural component 101, a transition adapter frame 102, and a metal connection end frame 103; wherein, the transition adapter frame 102 is located between the homogeneous ceramic thermal structural component 101 and the metal connection end frame 103 and is used as a connecting member between the homogeneous ceramic thermal structural component 101 and the metal connection end frame 103; the first end of the transition adapter frame 102 is embedded inside the homogeneous ceramic thermal structural component 101 and is fixedly connected to the inner wall of the homogeneous ceramic thermal structural component 101; the second end of the transition adapter frame 102 is sleeved outside the metal connection end frame 103 and is fixedly connected to the outer wall of the metal connection end frame 103; the transition adapter frame 102 is made of fiber-reinforced ceramic matrix composite material or high-strength and high-modulus resin matrix composite material.

[0007] Further, the homogeneous ceramic thermal structural component 101 is made of fused silica ceramic or silicon nitride ceramic.

[0008] Furthermore, the transition connection frame is made of a quartz fiber reinforced silica ceramic matrix composite material, an alumina fiber reinforced ceramic matrix composite material, or a carbon fiber reinforced resin matrix composite material.

[0009] Furthermore, the metal connection end frame 103 is made of a titanium alloy material or invar.

[0010] Furthermore, the homogeneous ceramic thermal structure member 101 is made of a fused silica ceramic material, the transition adapter frame 102 is made of a quartz fiber reinforced silica ceramic matrix composite material, and the metal connection end frame 103 is made of TA15 titanium alloy.

[0011] Furthermore, the homogeneous ceramic thermal structure member 101 is made of a homogeneous silicon nitride ceramic material, the transition adapter frame 102 is made of an alumina fiber reinforced ceramic matrix composite material, and the metal connection end frame 103 is made of TA15 titanium alloy.

[0012] Furthermore, between the first end of the transition adapter frame 102 and the inner wall of the homogeneous ceramic thermal structure member 101, bonding and pin fixing are adopted; between the second end of the transition adapter frame 102 and the outer wall of the metal connection end frame 103, bonding and pin fixing are adopted.

[0013] Furthermore, a heat insulation component 202 is further provided inside the homogeneous ceramic thermal structure member 101, and the heat insulation component 202 is located outside the first end of the transition adapter frame 102.

[0014] Furthermore, the heat insulation component 202 is selected from heat insulation tiles or aerogels, or a combination of heat insulation tiles and aerogels.

[0015] Furthermore, an outer heat protection layer 203 is further provided on the outer walls of the homogeneous ceramic thermal structure member 101, the transition adapter frame 102, and the metal connection end frame 103, and the outer heat protection layer 203 is a sprayed ablation coating or a laid heat insulation tile.

[0016] Furthermore, inside the transition adapter frame 102, and in the region where the ends of the homogeneous ceramic thermal structure member 101 and the metal connection end frame 103 are close to each other, an internal load device 201 is provided.

[0017] The technical effects achieved by the technical solution of the present invention are as follows:

[0018] By avoiding the existing research idea of directly connecting a homogeneous ceramic thermal structure member to a metal connection end frame, the present invention uses a transition adapter frame to connect the homogeneous ceramic thermal structure member and the metal connection end frame. The transition adapter frame is made of a fiber-reinforced ceramic matrix composite material or a high-modulus and high-strength resin matrix composite material with a low coefficient of thermal expansion and high temperature resistance. Such a connection structure enables the homogeneous ceramic thermal structure member to effectively block heat flow to protect the internal load device. At the same time, the homogeneous ceramic thermal structure member is connected to the transition adapter frame, avoiding the problem of cracking of the homogeneous ceramic thermal structure member due to poor thermal matching performance with the metal connection end frame, ensuring the normal operation of the internal load device, greatly expanding the application of the homogeneous ceramic material, and avoiding the problem of low thermal matching temperature between the current homogeneous ceramic thermal structure member and the metal connection end frame. In addition, the present invention also broadens the selection of mature homogeneous ceramic materials for the homogeneous ceramic thermal structure member and the metal connection end frame. The metal connection end frame can also be made of more mature alloy materials, greatly expanding the use range of the homogeneous ceramic. The connection structure of the present invention can be applied to the connection between the homogeneous ceramic thermal structure member and the metal structure in various fields, and has reference significance for devices with similar structures. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings included are used to provide a further understanding of the embodiments of the present invention, which form a part of the specification, are used to illustrate the embodiments of the present invention, and are used to explain the principles of the present invention together with the written description. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0020] Figure 1 It is a schematic diagram of a connection structure of a homogeneous ceramic thermal structure member in an embodiment.

[0021] In the figure:

[0022] 101 - Homogeneous ceramic thermal structure member;

[0023] 102 - Transition adapter frame;

[0024] 103 - Metal connection end frame;

[0025] 201 - Internal load device;

[0026] 202 - Heat insulation component;

[0027] 203 - External heat protection layer. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0028] It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and in no way limits the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0029] As Figure 1 shown, the embodiment of the present invention provides a connection structure for a homogeneous ceramic thermal structure member, including a high-temperature-resistant homogeneous ceramic thermal structure member 101, a transition adapter frame 102, and a metal connection end frame 103. Among them, the transition adapter frame 102 is located between the homogeneous ceramic thermal structure member 101 and the metal connection end frame 103 and is used as a connecting member between the homogeneous ceramic thermal structure member 101 and the metal connection end frame 103. The first end of the transition adapter frame 102 (i.e., Figure 1 the upper end in Figure 1 the figure) is embedded inside the homogeneous ceramic thermal structure member 101 and is fixed to the inner wall of the homogeneous ceramic thermal structure member 101 by adhesive bonding and pin fixing. The second end of the transition adapter frame 102 (i.e.,

[0030] the lower end in

[0031] the figure) is sleeved outside the metal connection end frame 103 and is fixed to the outer wall of the metal connection end frame 103 by adhesive bonding and pin fixing. The transition adapter frame 102 is made of a fiber-reinforced ceramic matrix composite material or a high-strength and high-modulus resin matrix composite material.

[0032] As a preferred embodiment, in order to ensure that the homogeneous ceramic thermal structure member 101 can not only withstand high temperatures but also be electrically insulated, the homogeneous ceramic thermal structure member 101 is made of fused quartz ceramic material or silicon nitride ceramic material.

[0033] As a more preferred embodiment, the homogeneous ceramic thermal structure member 101 is made of fused silica ceramic material, the transition adapter frame 102 is made of quartz fiber reinforced silica ceramic matrix composite material, and the metal connection end frame 103 is made of TA15 titanium alloy. With the above material configuration, while ensuring the excellent electrical insulation performance of the homogeneous ceramic thermal structure member 101, a certain high-temperature performance can be taken into account. The fused silica ceramic material belongs to high-temperature resistant wave-transparent material, and the large-area temperature can withstand 1100 °C.

[0034] As another more preferred embodiment, the homogeneous ceramic thermal structure member 101 is made of homogeneous silicon nitride ceramic material, the transition adapter frame 102 is made of alumina fiber reinforced ceramic matrix composite material, and the metal connection end frame 103 is made of TA15 titanium alloy. With this configuration method, while ensuring the excellent electrical insulation performance of the homogeneous ceramic thermal structure member 101, a certain high-temperature performance can be taken into account. The silicon nitride material belongs to high-temperature resistant wave-transparent material, and the large-area temperature can withstand 1400 °C.

[0035] As a preferred embodiment, in order to further ensure the heat resistance, the connection structure further includes a heat insulation component 202, and the heat insulation component 202 is arranged on the inner wall of the homogeneous ceramic thermal structure member 101 (the specific position is as Figure 1 shown), and the heat insulation component 202 is used for heat insulation of the internal load device 201. When the internal load device 201 needs to be started to work, the internal load device 201 can work normally under the protection of the homogeneous ceramic thermal structure member 101 and the heat insulation component 202. As a more preferred embodiment, the heat insulation component 202 is a heat insulation tile, aerogel or a combination of the two.

[0036] As a preferred embodiment, in order to further ensure the heat resistance, the connection structure further includes an external heat protection layer 203, and the external heat protection layer 203 is arranged on the outer walls of the homogeneous ceramic thermal structure member 101, the transition adapter frame 102, and the metal connection end frame 103, and the external heat protection layer 203 is used for heat insulation of the homogeneous ceramic thermal structure member 101, the transition adapter frame 102, and the metal connection end frame 103.

[0037] As a more preferred embodiment, the external heat protection layer 203 is a sprayed ablation coating or a laid heat insulation tile. The specific material selection and laying process need to be determined according to the use environment of the connection structure. If the temperature is within the heat resistance range of the homogeneous ceramic thermal structure member 101, the transition adapter frame 102, and the metal connection end frame 103, no external heat insulation treatment is required, and in this case, the external heat protection layer 203 may not be included.

[0038] The following Table 1 shows the test data of the physical properties of the materials. The coefficient of thermal expansion of the fused silica ceramic, which is the material of the homogeneous ceramic thermal structure part, is less than 0.8×10 -6 / °C at 400°C. The coefficient of thermal expansion of the silicon nitride composite ceramic is only 2.8×10 -6 / °C, which is much lower than that of the invar (4.5×10 -6 / °C) and TA15 titanium alloy (10×10 -6 / °C), the materials of the metal connection end frames. In addition, the above thermal structure parts are all brittle materials and their mechanical strength is much lower than that of the metal connection end frame materials. Therefore, during use, the homogeneous ceramic thermal structure parts will be damaged by the expansion of the metal connection end frames due to the inconsistent thermal expansion. Therefore, when the temperature in the connection area of the homogeneous ceramic thermal structure parts reaches 400°C and above, a transition adapter frame with a coefficient of linear expansion and mechanical strength close to those of the homogeneous ceramic cover body needs to be used. In addition, the material used for the transition adapter frame is a fiber-reinforced ceramic matrix composite material. The toughness of the material is better than that of the homogeneous ceramic material and it is not easily damaged by the expansion of the metal connection end frames. This ensures both the insulation and high-temperature resistance requirements of the homogeneous ceramic thermal structure parts and the stability of the connection area.

[0039] Table 1 Physical Properties of Materials

[0040]

[0041] Note 1: The coefficient of linear expansion increases with the increase in temperature in the range of room temperature - 400°C.

[0042] Note 2: The coefficient of linear expansion of the carbon fiber-reinforced resin matrix composite material can be changed by regulating the microstructure of the material.

[0043] The following Table 2 shows the flexural strength of the fused silica ceramic material at room temperature - 1200°C. As the temperature increases, the flexural strength of the fused silica ceramic material gradually increases, so that the thermal structure parts prepared from the fused silica ceramic material still have good structural strength when the temperature reaches 1100°C. However, under high-temperature conditions, the fused silica ceramic material will gradually soften and lose its modulus. It is actually measured that the specimens prepared from the fused silica ceramic material do not have the conditions for carrying out mechanical tests due to softening at 1230°C. Therefore, on the premise of considering a margin, it can be considered that the large-area use temperature of the fused silica ceramic thermal structure parts is 1100°C. In addition to good heat resistance, the more important advantage of the fused silica thermal structure parts is their low cost and strong versatility.

[0044] Table 2 below shows the flexural strength of the silicon nitride composite ceramic material from room temperature to 1500°C. As the temperature increases, the flexural strength of the silicon nitride composite ceramic material first rises rapidly and then gradually decreases. When the temperature rises to 1400°C, the high-temperature flexural strength of the silicon nitride composite ceramic is similar to its room-temperature flexural strength. Therefore, it can be considered that the thermal structural components prepared from the silicon nitride composite ceramic material still have good structural strength when the temperature reaches 1400°C. However, when the temperature further rises to 1500°C, the flexural strength of the material drops to 138 MPa. At the same time, the silicon nitride composite ceramic is prone to oxidation above 1400°C, which affects the electrical properties of the material. Therefore, the large-area use temperature of the thermal structural components made of the silicon nitride composite ceramic material is 1400°C.

[0045] Table 2 Flexural Strength of Homogeneous Ceramic Materials

[0046]

[0047] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they specify the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0048] Unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions, and values set forth in these embodiments do not limit the scope of the present invention. At the same time, it should be understood that for the sake of convenience of description, the dimensions of the various parts shown in the drawings are not drawn in actual proportional relationships. Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the said technologies, methods, and devices should be regarded as part of the authorized specification. In all the examples shown and discussed here, any specific value should be interpreted as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0049] It should be noted that the use of terms such as "first" and "second" to limit the parts of components is only for the convenience of distinguishing the corresponding parts of the components. Without additional statements, the above terms have no special meanings and therefore cannot be construed as limiting the protection scope of the present invention.

[0050] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A connection structure for a homogeneous ceramic thermal structure component of a high-speed aircraft, characterized in that, Including: A homogeneous ceramic thermal structure member (101), a transition adapter frame (102), and a metal connection end frame (103); wherein, the transition adapter frame (102) is located between the homogeneous ceramic thermal structure member (101) and the metal connection end frame (103) and is used as a connecting member between the homogeneous ceramic thermal structure member (101) and the metal connection end frame (103); the first end of the transition adapter frame (102) is embedded inside the homogeneous ceramic thermal structure member (101) and is fixedly connected to the inner wall of the homogeneous ceramic thermal structure member (101); the second end of the transition adapter frame (102) is sleeved outside the metal connection end frame (103) and is fixedly connected to the outer wall of the metal connection end frame (103); the homogeneous ceramic thermal structure member (101) is made of fused silica ceramic or silicon nitride ceramic; the transition adapter frame (102) is made of quartz fiber reinforced silica ceramic matrix composite material, alumina fiber reinforced ceramic matrix composite material, or M40J carbon fiber reinforced resin matrix composite material; the metal connection end frame (103) is made of titanium alloy material or invar.

2. The connection structure according to claim 1, characterized in that, The homogeneous ceramic thermal structure member (101) is a conical structure.

3. The connection structure according to claim 1, wherein The homogeneous ceramic thermal structure member (101) is made of fused silica ceramic material, the transition adapter frame (102) is made of quartz fiber reinforced silica ceramic matrix composite material, and the metal connection end frame (103) is made of TA15 titanium alloy.

4. The connection structure according to claim 1, characterized in that The homogeneous ceramic thermal structure member (101) is made of homogeneous silicon nitride ceramic material, the transition adapter frame (102) is made of alumina fiber reinforced ceramic matrix composite material, and the metal connection end frame (103) is made of TA15 titanium alloy.

5. The connection structure according to claim 1, wherein The first end of the transition adapter frame (102) and the inner wall of the homogeneous ceramic thermal structure member (101) are fixed by bonding and pins; and / or The second end of the transition adapter frame (102) and the outer wall of the metal connection end frame (103) are fixed by bonding and pins.

6. The connection structure according to claim 1, wherein An insulation component (202) is further provided inside the homogeneous ceramic thermal structure member (101), and the insulation component (202) is located outside the first end of the transition adapter frame (102).

7. The connection structure according to claim 6, characterized in that, The insulation component (202) is selected from insulation tiles or aerogels, or a combination of insulation tiles and aerogels.

8. The connection structure according to claim 1, characterized in that, An outer heat protection layer (203) is further provided on the outer walls of the homogeneous ceramic thermal structure member (101), the transition adapter frame (102), and the metal connection end frame (103), and the outer heat protection layer (203) is a sprayed ablation coating or a laid insulation tile.

9. The connection structure according to claim 1, wherein, An internal load device (201) is provided inside the transition adapter frame (102) and in the area where the ends of the homogeneous ceramic thermal structure member (101) and the metal connection end frame (103) are close to each other.

Citation Information

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