A star sensor CMOS circuit board target surface automatic assembly and adjustment device

Abstract

This invention belongs to the field of precision assembly technology for aerospace devices and relates to an automatic assembly and adjustment device for the target surface of a star sensor CMOS circuit board. This device is used for the automated assembly of star sensor components: a star sensor bracket, a CMOS circuit board, and adjustment gaskets. The device comprises, from left to right, a measurement module, a tooling clamping module, and a feeding module. The assembly module is mounted on top of the device via a truss. Each module is connected to an industrial computer for automated control. This device enables automatic loading and unloading of the CMOS circuit board and adjustment gaskets, measurement of target surface parallelism with a reference surface, component position adjustment and assembly, and automatic locking.

Description

Technical Field

[0001] The present invention belongs to the technical field of precision assembly of aerospace devices, and relates to an automatic assembly device for a target surface of a star sensor CMOS circuit board, which is an automatic assembly technology for star sensor parts (star sensor bracket, CMOS circuit board and adjustment gasket). Background Art

[0002] Star sensors are crucial celestial sensors in astronomical navigation systems. They feature high precision, low power consumption, high reliability, strong anti-interference capabilities, and high autonomy, making them widely used in attitude determination and control systems for various spacecraft. CMOS circuit boards are a core component of star sensors, and the assembly accuracy of their target surfaces significantly impacts the overall star sensor measurement accuracy. With the continuous advancement of aerospace technology, simply improving the machining and manufacturing technology of individual components is no longer sufficient. Therefore, research into automated assembly equipment to improve the assembly accuracy of star sensor components is crucial for enhancing star sensor measurement accuracy.

[0003] During assembly of the star sensor components, the target surface on the CMOS circuit board must be parallel to the reference surface on the star sensor bracket. The reference surface is the bottom surface of the hexahedron below the star sensor bracket. Furthermore, the target surface on the CMOS circuit board is a rectangle composed of pixels, and the edges of this rectangle must be parallel to the edges of the reference surface. After alignment and adjustment, the components are then tightened. Three adjustment shims are used to support the mounting of the CMOS circuit board and the star sensor bracket. The parallelism requirement for the target and reference surfaces is achieved by grinding these three adjustment shims to adjust their parallelism.

[0004] An analysis of the parts to be assembled and the aforementioned assembly tasks reveals the following: First, the positioning structure of the parts to be assembled is limited, and assembly accuracy must be guaranteed by equipment adjustment, requiring good precision maintenance during the subsequent screw tightening process. Second, the adjustment gasket is difficult to clamp and secure after assembly. Its outer surface is blocked by the star sensor bracket and CMOS circuit board, and its small inner hole size makes it unsuitable for clamping and securing. This requires the parts to be assembled vertically. When assembled in other directions, the adjustment gasket is prone to sliding and shifting under the action of gravity. Finally, the measurement reference plane and assembly plane are located on either side of the star sensor bracket, which is not conducive to measurement and assembly. These factors increase the difficulty of assembly, seriously affecting production efficiency and product performance, and placing higher demands on the structural design of assembly equipment, assembly methods, and process flow arrangements. In invention patent number 201910097415.8, Zhang Xuemin invented a system and method for achieving high-precision orthogonality adjustment of the star sensor image plane. By adjusting the position and posture of a target test target mounted on a one-dimensional translation stage and a star sensor mounted on an adjustment frame, the required adjustment angle and shim adjustment amount of the imaging target surface are measured and calculated. The entire star sensor is tested, and after the adjustment amount is obtained, the parts still need to be disassembled, adjusted, and reassembled, which is inefficient. In invention patent number 202010580709.9, Shen Jie invented an automatic focal plane calibration device and method for a star sensor. This device uses a three-coordinate measuring machine and a visual inspection system to position the star sensor parts, and then adjusts the assembly using an adjuster. The article mentions that the adjuster can be moved up, down, left, right, and forward and backward, requiring only in-plane position adjustment for assembly. However, in the assembly task of this patent, the target surface on the CMOS circuit board also needs to be rotated in the plane to meet assembly requirements. In the paper "Research on the Assembly and Calibration Method of Star Sensor Imaging Plane", Wei Yaxin designed a star sensor imaging surface attitude detection device based on three-dimensional guide rails. Using the pre-calibrated installation reference on the star sensor as a reference, the imaging surface tilt angle detection is achieved through laser triangulation and a plane fitting method based on the least squares method, and the imaging surface rotation angle detection is achieved through image edge extraction. The equipment and method in the article can realize the detection of assembly effect but do not involve actual assembly, and the parts to be detected are all located on the same surface of the fixed base. In the assembly task of the present invention, the CMOS circuit board target surface and the reference surface are respectively located on both sides of the star sensor bracket, which increases the measurement difficulty.

[0005] To sum up, the shapes and sizes of star sensor parts vary greatly, the span between the assembly surface and the reference surface is large, the assembly parts require high precision, the assembly process is complex, and the parts need to maintain assembly precision continuously. However, the existing assembly methods have a low degree of automation and require high assembly skills from workers. Only by formulating reasonable, feasible, convenient and efficient processing processes and developing automated assembly equipment can the current requirements for assembly efficiency and assembly precision be met. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to overcome the accuracy and efficiency defects brought about by the current assembly process of star sensor parts, and to propose an automatic assembly and adjustment device for the target surface of a CMOS circuit board of a star sensor. The device can realize the automatic loading and unloading of the CMOS circuit board and adjustment gaskets, the parallelism measurement function between the target surface and the reference surface, the part posture adjustment assembly function and the automatic locking function.

[0007] The technical solutions of the present invention are as follows:

[0008] An automatic assembly and adjustment device for a star sensor CMOS circuit board target surface comprises, from left to right, a measurement module, a fixture clamping module, and a feeding module. The assembly module is mounted on top of the device via a truss. Each module is connected to an industrial computer for automated control. The measurement module, fixture clamping module, feeding module, and assembly module are all mounted on an optical platform 4.

[0009] The measurement module primarily consists of a three-axis precision displacement slide 5, a probe support a6, a combined laser displacement probe 7, a probe support b8, a measurement component bracket 9, and an industrial camera a10. The bottoms of the probe supports a6 and b8 are mounted on one side of the measurement component bracket 9, while the industrial camera a10 is mounted on the other side of the measurement component bracket 9. The measurement component bracket 9 is mounted on the Z axis of the three-axis precision displacement slide 5, the bottom of which is mounted on the optical platform 4. The combined laser displacement probe 7 is locked front and back by the probe supports a6 and b8. The combined laser displacement probe 7 consists of three independent micro-laser displacement meters mounted on a combination fixture, with the three micro-laser displacement meters arranged in a triangular pattern. After the combined laser displacement probe 7 is assembled on the CMOS circuit board 1, it realizes the function of measuring the parallelism of the target surface of the CMOS circuit board 1 and the reference surface under the star sensor bracket 3; when the industrial camera a10 is assembled on the CMOS circuit board 1, it realizes the function of measuring the parallelism of the rectangular target surface edge line on the CMOS circuit board 1 and the reference surface edge line of the star sensor bracket 3; the three-axis precision displacement slide 5 has three-dimensional linear motion capability, which can realize the function of adjusting different measurement positions of the combined laser displacement probe 7 and the industrial camera a10.

[0010] Further, when the combined laser displacement probe 7 measures the parallelism of the target surface of the CMOS circuit board 1 and the reference surface under the star sensor bracket 3, it is necessary to adjust the measuring position by the three-axis precision displacement slide 5 and the linear precision displacement slide d41, and adjust the posture of the CMOS circuit board 1 and the star sensor bracket 3 assembly by the precision turntable b42, so that the target surface of the CMOS circuit board 1 and the reference surface under the star sensor bracket 3 are facing the combined laser displacement probe 7; when the industrial camera a10 measures the parallelism of the rectangular target surface sideline on the CMOS circuit board 1 and the reference surface sideline of the star sensor bracket 3, it is necessary to adjust the measuring position by the three-axis precision displacement slide 5 and the linear precision displacement slide d41, and adjust the posture of the star sensor bracket 3 by the precision turntable b42, so that the reference surface under the star sensor bracket 3 is vertically downward toward the reflector 39, so that the industrial camera a10 can observe the rectangular target surface on the CMOS circuit board 1 and the reference surface of the star sensor bracket 3 from bottom to top through the reflector 39 from the side.

[0011] The tooling clamping module is mainly composed of a seat bearing 33, a rotating shaft support 34, a rotating shaft 35, a guide rod cylinder 36, a fixture assembly base 37, an angle cylinder 38, a reflector 39, a V-block 40, a linear precision displacement slide d41, a precision turntable b42 and a tooling clamping assembly bracket 43. The tooling clamping assembly bracket 43 is a U-shaped structure, with a reflector 39 installed in the middle, a seat bearing 33 installed on the side of one end, and a precision turntable b42 installed on the side of the other end, and its bottom is installed on the linear precision displacement slide d41, and the bottom of the linear precision displacement slide d41 is installed on the optical platform 4; the fixture assembly base 37 is an L-shaped structure, with a rotating shaft support 34 installed at one end, one end of the rotating shaft 35 passes through the opening of the rotating shaft support 34 and is locked and fixed, and the other end of the rotating shaft 35 passes through the seat bearing 33 and is fixed; the other end of the fixture assembly base 37 is installed on the turntable surface of the precision turntable b42; the guide rod cylinder 36 is installed at one end of the fixture assembly base 37, the angle cylinder 38 is vertically installed in the middle of the fixture assembly base 37, and the V-block 40 is installed on the side of the other end of the fixture assembly base 37. The reflector 39 enables the industrial camera a10 to observe the rectangular target surface on the CMOS circuit board 1 and the reference surface of the star sensor bracket 3 from the side from bottom to top; the L-shaped fixture assembly base 37 and the shaft support 34, the shaft 35 and the seat bearing 33, the precision turntable b42 and other components form a swing-like rotating structure. Under the drive of the precision turntable b42, the fixture assembly base 37 and the star sensor bracket 3 parts and the shaft support 34, the shaft 35, the guide rod cylinder 36, the angle cylinder 38 and the V-block 40 on it can rotate around the shaft of the precision turntable b42, realizing the adjustment of the CMOS circuit during assembly and measurement. The plate 1, the adjustment gasket 2 and the star sensor bracket 3 have the function of adjusting the posture of the parts; the V-block 40 is adapted to the outer contour design of the star sensor bracket 3, and realizes the positioning function during the positioning and clamping of the star sensor bracket 3; the push rod of the guide rod cylinder 36 can telescopically move along the opening direction of the V-block 40, and realizes the clamping function during the positioning and clamping of the star sensor bracket 3; the angle cylinder 38 can rotate 90° around its own rotation axis and then clamp, and realize the clamping function of the CMOS circuit board 1 after adjustment and assembly of the CMOS circuit board 1; the linear precision displacement slide d41 can be displaced in a single direction to realize the working position adjustment and assembly adjustment functions of the parts thereon.

[0012] Furthermore, the precision turntable b42 can adjust the posture of the star sensor bracket 3. When assembling the adjustment gasket 2 and the CMOS circuit board 1, the star sensor bracket 3 is adjusted to a vertical position by the precision turntable b42, with its bottom standard surface facing vertically downward toward the reflector 39. The reflector 39 assists the industrial camera a10 in observing the target surface of the CMOS circuit board 1 and the bottom reference surface of the star sensor bracket 3 from the side and from bottom to top. After the CMOS circuit board 1 is assembled, when measuring the parallelism between the target surface of the CMOS circuit board 1 and the reference surface under the star sensor bracket 3, the star sensor bracket 3 is adjusted to a horizontal position by the precision turntable b42, with its bottom standard surface oriented toward the combined laser displacement probe 7.

[0013] The assembly module primarily consists of a profile bracket 11, a linear precision displacement slide a12, a slide bracket 16, an assembly module, and a locking module. The slide bracket 16 is a U-shaped structure, with the assembly module and locking module mounted on either end. The center of the bracket is mounted on the linear precision displacement slide a12, the bottom of which is mounted on the profile bracket 11, and the bottom of the profile bracket 11 is mounted on the optical platform 4. The assembly module primarily consists of an industrial camera b13, an assembly component bracket 14, a linear precision displacement slide b15, a precision turntable a26, a cylindrical force sensor 27, and a parts suction head 28. The top of the parts suction head 28 is mounted on the bottom of the cylindrical force sensor 27, the top of the cylindrical force sensor 27 is mounted on the turntable surface at the bottom of the precision turntable a26, the top of the precision turntable a26 is mounted on the mounting surface at the bottom of the adjustment component bracket 14, the industrial camera b13 is mounted on the adjustment component bracket 14, the side of the adjustment component bracket 14 is mounted on the table surface of the linear precision displacement slide b15, and the linear precision displacement slide b15 is mounted on the side of the slide bracket 16. The locking module mainly consists of the slide cylinder 17, the locking cylinder 18, the locking component base 19, the linear guide 20, the electric screwdriver 21, the electric screwdriver bracket 22, and the screw suction head 23. The electric screwdriver 21 is installed on the electric screwdriver bracket 22. The electric screwdriver bracket 22 is an L-shaped structure, and its side is installed on the linear guide rail 20. The bottom of the linear guide rail 20 is installed on the locking component base 19. The locking component base 19 is an L-shaped structure, and its side is installed on the table top of the slide cylinder 17. The bottom of the slide cylinder 17 is installed on the side of the slide bracket 16. The locking cylinder 18 is fixedly installed on the locking component base 19, and its push rod is connected and installed with the electric screwdriver bracket 22. The screw adsorption head 23 is installed at the bottom of the locking component base 19.The linear precision displacement slide a12, linear precision displacement slide b15 and linear precision displacement slide d41 are combined to form a three-dimensional motion structure for parts picking and assembly; the linear precision displacement slide a12, slide cylinder 17 and linear precision displacement slide d41 are combined to form a three-dimensional motion structure for the screw adsorption and parts locking process; the precision turntable a26 can drive the adsorbed parts on the parts adsorption head 28 to rotate around the rotation axis, that is, to achieve the function of adjusting the parallelism of the rectangular target surface edge line on the CMOS circuit board 1 and the reference surface edge line of the star sensor bracket 3; the industrial camera b13 realizes the function of position recognition of the parts to be assembled The cylindrical force sensor 27 provides real-time feedback on the contact force between the part adsorption head 28 and the part during the assembly process, which not only avoids the failure of part picking due to insufficient contact, but also avoids damage to parts and equipment due to excessive contact force; the locking module can realize the screw adsorption and part locking functions, wherein the locking cylinder 18 realizes the function of driving the electric screwdriver bracket 22 and the electric screwdriver 21 thereon to reciprocate up and down for locking, the linear guide rail 20 realizes the guiding function of the electric screwdriver bracket 22 and the electric screwdriver 21 thereon to reciprocate up and down, and the screw adsorption head 23 realizes the screw adsorption and material picking function provided by the screw feeder 24.

[0014] The feeding module primarily consists of a screw feeder 24, a screw feeder base 25, a material tray 29, a pressure block 30, a linear precision displacement slide c31, and a feeding assembly base 32. The bottom of the screw feeder 24 is mounted on the screw feeder base 25, which is in turn mounted on the optical platform 4. The bottom of the material tray 29 is mounted on the linear precision displacement slide c31, which is in turn mounted on the feeding assembly base 32, which is in turn mounted on the optical platform 4. The pressure block 30 is placed in a fixed area on the material tray. The screw feeder 24 realizes the feeding function of screws; the material tray 29 is adapted to the hole positions on the CMOS circuit board 1, the adjustment gasket 2 and the pressing block 30, and is designed with a boss-shaped limiting structure, so that the three adjusting gaskets 2 are placed on the material tray 29 and are directly distributed in a triangular shape, so that the adjusting gasket 2 and the pressing block 30 are placed on the plane of the material tray 29 and are restricted by the limiting structure without generating excessive rotation, which is convenient for the adsorption and picking up of the parts adsorption head 28; the bottom of the pressing block 30 is coated with a buffer material. After the CMOS circuit board 1 is installed, the pressing block 30 is picked up by the adjustment module and pressed onto the CMOS circuit board 1, and then the pressing block 30 is pressed by the angle cylinder 38 to avoid the angle cylinder 38 directly pressing on the CMOS circuit board 1 and damaging the parts. Moreover, since the CMOS circuit board 1 and the star sensor bracket 3 eventually need to be screwed, after the pressing block 30 presses the CMOS circuit board 1, an opening structure is designed at the screw hole position corresponding to the CMOS circuit board 1 to ensure that the screw locking is not affected in the pressed state.

[0015] The present invention has the following beneficial effects:

[0016] (1) Except for the star sensor bracket, which requires manual loading, the picking, unloading and locking processes of other parts are all automatically controlled, which improves assembly efficiency and avoids errors caused by manual assembly;

[0017] (2) The assembly process is visual, and the adjustment amount of the parts assembly is fed back by the visual measurement module, and the precision displacement slide action realizes the automatic adjustment function;

[0018] (3) The clamping fixture locates and clamps the parts, and then measures and adjusts the gasket adjustment amount. There is no need to lock, measure, and then disassemble and adjust, which reduces part damage and improves assembly efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1(a) and Figure 1(b) are exploded and overall schematic diagrams of the star sensor components;

[0020] Figure 2 This is the overall front diagram of the installation and adjustment equipment;

[0021] Figure 3 This is the overall schematic diagram of the back of the installation equipment;

[0022] Figure 4 This is a schematic diagram of the measurement module;

[0023] Figure 5 It is a schematic diagram of the tooling clamping module;

[0024] Figure 6 This is a schematic diagram of the assembly module.

[0025] In the figure: 1 CMOS circuit board; 2 adjustment spacer; 3 star sensor bracket; 4 optical platform; 5 three-axis precision displacement slide; 6 probe support a; 7 combined laser displacement probe; 8 probe support b; 9 measurement component bracket; 10 industrial camera a; 11 profile bracket; 12 linear precision displacement slide a; 13 industrial camera b; 14 adjustment component bracket; 15 linear precision displacement slide b; 16 slide bracket; 17 slide cylinder; 18 locking cylinder; 19 locking component base; 20 linear guide; 21 electric screwdriver; 22 electric 1. Dynamic screwdriver bracket; 23. Screw suction head; 24. Screw feeder; 25. Screw feeder base; 26. Precision turntable a; 27. Cylindrical force sensor; 28. Parts suction head; 29. ​​Material tray; 30. Pressure block; 31. Linear precision displacement slide c; 32. Feeding assembly base; 33. Bearing with seat; 34. Rotating shaft support; 35. Rotating shaft; 36. Guide rod cylinder; 37. Fixture assembly base; 38. Angle cylinder; 39. Reflector; 40. V-block; 41. Linear precision displacement slide d; 42. Precision turntable b; 43. Tooling clamping assembly bracket. DETAILED DESCRIPTION

[0026] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0027] The structure of the star sensor parts is shown in Figure 1 (a) and Figure 1 (b). The device of the present invention is specifically as follows Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 and Figure 6 The specific composition and usage process are as follows:

[0028] First, parts are loaded: Before assembly, the star sensor bracket 3 is manually placed in the V-block 40 of the fixture clamping module. The push rod of the guide cylinder 36 clamps the star sensor bracket 3 in the V-block 40. Then, the pressing block 30 and the components to be assembled—the CMOS circuit board 1 and the adjustment gasket 2—are placed on a tray 29 with a limiting structure, completing the loading process. The tray 29 has a boss-shaped limiting structure corresponding to the holes on the CMOS circuit board 1, the adjustment gasket 2, and the pressing block 30. This allows the three adjustment gaskets 2 to be placed directly on the tray 29 in a triangular arrangement. This allows the adjusting gaskets 2 and pressing block 30 to rest on the flat surface of the tray 29 and be restrained by the limiting structure, preventing excessive rotation and facilitating pickup by the part suction head 28.

[0029] Adjusting the assembly of gasket 2: After loading is completed, the assembly of gasket 2 is adjusted. Driven by the linear precision displacement slide a12, the adjusting assembly moves to the adsorption and picking working position of the adjusting gasket 2. With the assistance of the industrial camera b13, the linear precision displacement slide a12 and the linear precision displacement slide c31 are combined to form a two-dimensional plane movement to adjust the relative position between the part adsorption head 28 and the adjusting gasket 2. The precision turntable a26 adjusts the relative posture between the part adsorption head 28 and the adjusting gasket 2. After alignment, the linear precision displacement slide b15 drives the part adsorption head 28 to move downward to adsorb and pick up the adjusting gasket 2. After the material is picked up successfully, the linear precision displacement slide b15 drives the part adsorption head 28 to move upward to complete the picking up of the adjusting gasket 2. Among them, the mutual contact force between the part suction head 28 and the adjustment gasket 2 when taking materials is fed back in real time by the cylindrical force sensor 27 to ensure appropriate contact force and not damage parts and equipment; the positions of the three adjustment gaskets 2 relative to each other are limited by the triangularly distributed boss-shaped structure on the material tray 29 during loading, so that the part suction head 28 can pick up three adjustment gaskets 2 at a time, thereby improving assembly efficiency. After the material is taken, the assembly component is driven by the linear precision displacement slide a12 to move to the adjustment gasket 2 assembly working position. With the assistance of the industrial camera b13, the linear precision displacement slide a12 and the linear precision displacement slide d41 are combined to form a two-dimensional plane motion to adjust the relative position between the adjustment gasket 2 adsorbed on the part adsorption head 28 and the assembly hole on the star sensor bracket 3. The precision turntable a26 adjusts the relative posture between the adjustment gasket 2 adsorbed on the part adsorption head 28 and the installation hole on the star sensor bracket 3. After alignment, the linear precision displacement slide b15 drives the adjustment gasket 2 adsorbed on the part adsorption head 28 to move downward, and assemble the adjustment gasket 2 on the assembly hole of the star sensor bracket 3. After the assembly is completed, the linear precision displacement slide b15 drives the part adsorption head 28 to move upward to restore the initial position, and the assembly of the adjustment gasket 2 is completed. The mutual contact force between the adjustment gasket 2 adsorbed on the part adsorption head 28 and the assembly hole on the star sensor bracket 3 during assembly is fed back in real time by the cylindrical force sensor 27 to ensure appropriate contact force without damaging parts and equipment.

[0030] CMOS circuit board 1 assembly: After the adjustment gasket 2 is assembled, the CMOS circuit board 1 is assembled. Driven by the linear precision displacement slide a12, the adjustment assembly moves to the CMOS circuit board 1 adsorption and pickup working position. With the assistance of the industrial camera b13, the linear precision displacement slide a12 and the linear precision displacement slide c31 are combined to form a two-dimensional plane movement to adjust the relative position between the part adsorption head 28 and the CMOS circuit board 1. The precision turntable a26 adjusts the relative posture between the part adsorption head 28 and the CMOS circuit board 1. After alignment, the linear precision displacement slide b15 drives the part adsorption head 28 downward to adsorb and pick up the CMOS circuit board 1. After the material is successfully picked up, the linear precision displacement slide b15 drives the part adsorption head 28 to move upward to complete the CMOS circuit board 1 picking up. Among them, the mutual contact force between the part adsorption head 28 and the CMOS circuit board 1 when picking up the material is fed back in real time by the cylindrical force sensor 27 to ensure appropriate contact force and not damage parts and equipment. After the material is taken, the assembly is driven by the linear precision displacement slide a12 to move to the CMOS circuit board 1 to adjust the assembly working position. With the assistance of the industrial camera a10 and the industrial camera b13, the linear precision displacement slide a12 and the linear precision displacement slide d41 are combined to form a two-dimensional plane movement to adjust the relative position between the CMOS circuit board 1 adsorbed on the part adsorption head 28 and the assembly hole position on the star sensor bracket 3. The precision turntable a26 adjusts the parallelism of the rectangular target surface edge line of the CMOS circuit board 1 adsorbed on the part adsorption head 28 and the reference surface edge line of the star sensor bracket 3; wherein, the industrial camera a10 is on the side, and observes the rectangular target surface of the CMOS circuit board 1 from bottom to top through the reflector 39. The edge of the surface and the reference surface edge of the star sensor bracket 3 are adjusted by the auxiliary precision turntable a26 for edge parallelism. The industrial camera b13 is located at the top, observing the assembly holes on the star sensor bracket 3 from top to bottom, and assisting the linear precision displacement slide a12 and the linear precision displacement slide d41 to adjust the position between the CMOS circuit board 1 and the star sensor bracket 3. After the position and posture adjustment is completed, the linear precision displacement slide b15 drives the CMOS circuit board 1 adsorbed on the part suction head 28 to move downward and stack the CMOS circuit board 1 on the adjustment gasket 2. After assembly is completed, the linear precision displacement slide b15 drives the part suction head 28 to move upward to restore the initial position, completing the assembly of the CMOS circuit board 1. The mutual contact force between the CMOS circuit board 1 adsorbed on the part suction head 28 and the adjustment gasket 2 during assembly is fed back in real time by the cylindrical force sensor 27 to ensure appropriate contact force and prevent damage to parts and equipment.

[0031] CMOS circuit board 1 and adjustment gasket 2 are pressed: After the CMOS circuit board 1 is assembled, it needs to be pressed and fixed by the corner cylinder 38. In order to protect the parts from damage, the pressure block 30 is used as an intermediate buffer. The adjustment component is driven by the linear precision displacement slide a12 to move to the pressure block 30 adsorption and picking working position. With the assistance of the industrial camera b13, the linear precision displacement slide a12 and the linear precision displacement slide c31 are combined to form a two-dimensional plane movement to adjust the relative position between the part adsorption head 28 and the pressure block 30. The precision turntable a26 adjusts the relative posture between the part adsorption head 28 and the pressure block 30. After alignment, the linear precision displacement slide b15 drives the part adsorption head 28 to move downward to adsorb and pick up the material from the pressure block 30. After the material is picked up successfully, the linear precision displacement slide b15 drives the part adsorption head 28 to move the pressure block 30 upward to complete the material picking up of the pressure block 30. Among them, the mutual contact force between the part suction head 28 and the pressure block 30 when they contact to pick up materials is fed back in real time by the cylindrical force sensor 27 to ensure appropriate contact force and not damage parts and equipment. After the material is picked up, the assembly is driven by the linear precision displacement slide a12 to move to the pressure block 30 to adjust the assembly working position. With the assistance of the industrial camera b13, the linear precision displacement slide a12 and the linear precision displacement slide d41 are combined to form a two-dimensional plane movement to adjust the relative position between the pressure block 30 adsorbed on the part suction head 28 and the CMOS circuit board 1. The precision turntable a26 adjusts the relative posture between the pressure block 30 adsorbed on the part suction head 28 and the CMOS circuit board 1. After alignment, the linear precision displacement slide b15 drives the pressure block 30 adsorbed on the part suction head 28 to move downward and stack the pressure block 30 on the CMOS circuit board 1. After assembly is completed, the linear precision displacement slide b15 drives the part suction head 28 to move upward to restore the initial position, completing the assembly of the pressure block 30. Among them, the mutual contact force between the pressing block 30 adsorbed on the part adsorption head 28 and the CMOS circuit board 1 when stacked is fed back in real time by the cylindrical force sensor 27 to ensure appropriate contact force and not damage parts and equipment. After the pressing block 30 is assembled, the angle cylinder 38 rotates 90° and then presses down. Its pressure rod acts directly on the pressing block 30, pressing the pressing block 30 tightly against the CMOS circuit board 1, indirectly pressing the CMOS circuit board 1 against the adjustment gasket 2, and then indirectly pressing the adjustment gasket 2 against the star sensor bracket 3, completing the compression of all parts. Among them, the lower surface of the pressing block 30 is coated with a buffer material, so that the pressing force is evenly distributed on the back of the CMOS circuit board 1 to avoid damaging the CMOS circuit board 1.

[0032] Parallelism test between the target surface of the CMOS circuit board 1 and the reference surface of the star sensor bracket 3: After the CMOS circuit board 1 and the adjustment gasket 2 are pressed tightly against the star sensor bracket 3, the parallelism between the target surface of the CMOS circuit board 1 and the reference surface of the star sensor bracket 3 is measured. Driven by the linear precision displacement slide d41, the tooling clamping module moves to the parallelism detection working position for the target surface of the CMOS circuit board 1 and the reference surface of the star sensor bracket 3. The precision turntable b42 drives the V-block 40 and the posture of the CMOS circuit board 1, the adjustment gasket 2, and the star sensor bracket 3 assembly clamped by the angular cylinder 38 thereon, so that the target surface of the CMOS circuit board 1 and the standard surface of the star sensor bracket 3 face the combined laser displacement probe 7. The three-axis precision displacement slide 5 drives the combined laser displacement probe 7 to move, respectively measure the target surface of the CMOS circuit board 1 and the standard surface of the star sensor bracket 3, and transmit the data to the industrial computer. The parallelism between the two planes is calculated by an algorithm. After the parallelism detection of the target surface of the CMOS circuit board 1 and the reference surface of the star sensor bracket 3 is completed, the precision turntable b42 drives the V-block 40 and the posture of the CMOS circuit board 1, the adjustment gasket 2, and the star sensor bracket 3 assembly clamped by the angular cylinder 38 thereon, so that the target surface of the CMOS circuit board 1 and the standard surface of the star sensor bracket 3 return to a vertical downward position. If the parallelism test between the target surface of the CMOS circuit board 1 and the reference surface of the star sensor bracket 3 is qualified, the screw locking process is carried out; if the parallelism test between the target surface of the CMOS circuit board 1 and the reference surface of the star sensor bracket 3 is unqualified, the adjustment amount of the three adjustment gaskets 2 is calculated and recorded and fed back to the operator. The adjustment module then unloads the pressing block 30, the CMOS circuit board 1 and the adjustment gaskets 2. The specific steps are opposite to the adjustment and assembly steps. The operator removes the adjustment gaskets 2 and grinds and adjusts them. After adjustment, the assembly measurement is readjusted.

[0033] CMOS circuit board 1 locking: After the parallelism test between the target surface of the CMOS circuit board 1 and the reference surface of the star sensor bracket 3 is passed, the CMOS circuit board 1 is locked. Driven by the linear precision displacement slide d41, the fixture clamping module moves to the CMOS circuit board 1 locking working position. Driven by the linear precision displacement slide a12, the locking assembly moves to the adsorption and material removal position on the screw feeder 24. The slide cylinder 17 drives the screw adsorption head 23 in the locking assembly downward to adsorb and remove the screw. After the material is successfully removed, the slide cylinder 17 drives the screw adsorption head 23 and the adsorbed screw therein upward to complete the adsorption and material removal of the screw. The position of the screw for each adsorption and pickup is fixed. The screw outlet of the screw feeder 24 has been adjusted and aligned in advance. Driven by the linear precision displacement slide a12, the locking assembly moves to the same position each time for adsorption and material removal, without the need for visual positioning feedback. After the screw adsorption and material removal is completed, the locking component is driven by the linear precision displacement slide a12 to move to the locking working position of the CMOS circuit board 1. With the assistance of the industrial camera b13, the linear precision displacement slide a12 and the linear precision displacement slide d41 are combined to form a two-dimensional plane motion to adjust the relative position between the screw adsorption head 23 in the locking component and the assembly hole on the star sensor bracket 3. After alignment, the slide cylinder 17 drives the screw adsorption head 23 and the screw adsorbed therein to move downward, and then the push rod of the locking cylinder 18 pushes the electric screwdriver bracket 22 and the electric screwdriver 21 installed thereon to move downward under the guidance of the linear guide rail 20, pushing the screw out of the screw adsorption head 23, locking the CMOS circuit board 1 and the adjustment gasket 2 on the star sensor bracket 3, and then completing the picking and locking of the remaining two screws in sequence to complete the locking of the CMOS circuit board 1. Finally, the modules of the equipment are reset, and the operator removes the locked CMOS circuit board 1, adjustment gasket 2 and star sensor bracket 3 assembly to complete the assembly.

[0034] The present invention is an automatic assembly and adjustment device for the target surface of a star sensor CMOS circuit board. The present invention is not limited to the automatic assembly of star sensor parts. By modifying the fixture module and the loading module, the adaptability of the device can be enhanced to complete the assembly of parts of other specifications.

Claims

1. A star sensor CMOS circuit board target surface automatic alignment device, characterized in that: It includes a measuring module, a fixture clamping module and a feeding module, and the adjustment module is installed on the top of the equipment through a truss. Each module is connected to an industrial computer to realize automatic control. The measuring module, fixture clamping module, feeding module and adjustment module are all installed on the optical platform (4); The measuring module is composed of a three-axis precision displacement slide (5), a probe support a (6), a combined laser displacement probe (7), a probe support b (8), a measuring component bracket (9) and an industrial camera a (10); the bottoms of the probe support a (6) and the probe support b (8) are mounted on one side of the measuring component bracket (9), the industrial camera a (10) is mounted on the other side of the measuring component bracket (9), the measuring component bracket (9) is mounted on the Z axis of the three-axis precision displacement slide (5), the bottom of the three-axis precision displacement slide (5) is mounted on the optical platform (4), the combined laser displacement probe (7) is locked front and back by the probe support a (6) and the probe support b (8), wherein the combined laser displacement probe (7) is Three independent micro laser displacement meters are mounted on a combined fixture, and the three micro laser displacement meters are distributed in a triangle. After the combined laser displacement probe (7) is assembled on the CMOS circuit board (1), it realizes the measurement function of the parallelism between the target surface of the CMOS circuit board (1) and the reference surface under the star sensor bracket (3). When the industrial camera a (10) is assembled on the CMOS circuit board (1), it realizes the measurement function of the parallelism between the rectangular target surface edge line on the CMOS circuit board (1) and the reference surface edge line of the star sensor bracket (3). The three-axis precision displacement slide (5) has three-dimensional linear motion capability, and realizes the function of adjusting different measurement positions of the combined laser displacement probe (7) and the industrial camera a (10). Furthermore, when the combined laser displacement probe (7) measures the parallelism of the target surface of the CMOS circuit board (1) and the reference surface under the star sensor bracket (3), it is necessary to adjust the measuring position by the three-axis precision displacement slide (5) and the linear precision displacement slide d (41), and adjust the assembly posture of the CMOS circuit board (1) and the star sensor bracket (3) by the precision turntable b (42), so that the target surface of the CMOS circuit board (1) and the reference surface under the star sensor bracket (3) are aligned with the combined laser displacement probe (7); the industrial camera a (10) measures C When the edge line of the rectangular target surface on the MOS circuit board (1) and the edge line of the reference surface of the star sensor bracket (3) are parallel, it is necessary to adjust the measurement position by the three-axis precision displacement slide (5) and the linear precision displacement slide d (41), and adjust the posture of the star sensor bracket (3) by the precision turntable b (42), so that the reference surface under the star sensor bracket (3) is vertically downward toward the reflector (39), so that the industrial camera a (10) can observe the rectangular target surface on the CMOS circuit board (1) and the reference surface of the star sensor bracket (3) from the bottom up through the reflector (39) from the side; The tooling clamping module is composed of a seat bearing (33), a rotating shaft support (34), a rotating shaft (35), a guide rod cylinder (36), a fixture assembly base (37), an angle cylinder (38), a reflector (39), a V-block (40), a linear precision displacement slide d (41), a precision turntable b (42) and a tooling clamping assembly bracket (43); the tooling clamping assembly bracket (43) is a U-shaped structure, wherein a reflector (39) is installed in the middle, a seat bearing (33) is installed on the side surface of one end, a precision turntable b (42) is installed on the side surface of the other end, and its bottom is installed on the linear precision displacement slide d (41), and the bottom of the linear precision displacement slide d (41) is installed On the optical platform (4); the fixture assembly base (37) is an L-shaped structure, one end of which is equipped with a rotating shaft support (34), one end of the rotating shaft (35) passes through the opening of the rotating shaft support (34) and is locked and fixed, and the other end of the rotating shaft (35) passes through the seat bearing (33) and is fixed; the other end of the fixture assembly base (37) is installed on the turntable surface of the precision turntable b (42); the guide rod cylinder (36) is installed on one end of the fixture assembly base (37), the angle cylinder (38) is vertically installed in the middle of the fixture assembly base (37), and the V-block (40) is installed on the side of the other end of the fixture assembly base (37); the reflector (39) realizes industrial phase The machine a (10) has the function of observing the rectangular target surface on the CMOS circuit board (1) and the reference surface of the star sensor bracket (3) from the bottom to the top from the side; the fixture assembly base (37) and the rotating shaft support (34), the rotating shaft (35) and the seat bearing (33), and the precision turntable b (42) form a swing-like rotating structure. Under the drive of the precision turntable b (42), the fixture assembly base (37) and the star sensor bracket (3) parts and the rotating shaft support (34), the rotating shaft (35), the guide rod cylinder (36), the angle cylinder (38) and the V-block (40) thereon are rotated around the rotating shaft of the precision turntable b (42), so that the adjustment of the CMOS circuit board (1), The function of adjusting the posture of the gasket (2) and the star sensor bracket (3) parts; the V-shaped block (40) is adapted to the outer contour design of the star sensor bracket (3), and realizes the positioning function in the positioning and clamping of the star sensor bracket (3); the top rod of the guide rod cylinder (36) telescopically moves along the opening direction of the V-shaped block (40), and realizes the clamping function in the positioning and clamping of the star sensor bracket (3); the angle cylinder (38) rotates 90 degrees around its own rotation axis and then clamps, realizing the clamping function of the CMOS circuit board (1) after the CMOS circuit board (1) is adjusted and assembled; the linear precision displacement slide d (41) moves in a single direction, and realizes the working position adjustment and assembly adjustment functions of the parts thereon; Furthermore, the precision turntable b (42) adjusts the posture of the star sensor bracket (3); when the adjustment gasket (2) and the CMOS circuit board (1) are assembled, the star sensor bracket (3) is adjusted to a vertical state by the precision turntable b (42), and its bottom standard surface is vertically downward toward the reflector (39), and the reflector (39) assists the industrial camera a (10) to observe the target surface of the CMOS circuit board (1) and the bottom reference surface of the star sensor bracket (3) from the side from bottom to top; after the CMOS circuit board (1) is assembled, when measuring the parallelism of the target surface of the CMOS circuit board (1) and the reference surface under the star sensor bracket (3), the star sensor bracket (3) is adjusted to a horizontal state by the precision turntable b (42), and the direction of its bottom standard surface is adjusted to face the combined laser displacement probe (7); The adjustment module is composed of a profile bracket (11), a linear precision displacement slide a (12), a slide bracket (16), an adjustment module and a locking module; the slide bracket (16) is a U-shaped structure, and the adjustment module and the locking module are respectively installed at both ends, the middle of which is installed on the linear precision displacement slide a (12), the bottom of the linear precision displacement slide a (12) is installed on the profile bracket (11), and the bottom of the profile bracket (11) is installed on the optical platform (4); the adjustment module is composed of an industrial camera b (13), an adjustment component bracket (14), a linear precision displacement slide b (15), a precision turntable a (26), a cylindrical force sensor (27) and a part adsorption head (28); the top of the part adsorption head (28) is mounted on the top of the part adsorption head (28). The top of the cylindrical force sensor (27) is mounted on the bottom of the cylindrical force sensor (27), the top of the cylindrical force sensor (27) is mounted on the turntable surface at the bottom of the precision turntable a (26), the top of the precision turntable a (26) is mounted on the mounting surface at the bottom of the adjustment component bracket (14), the industrial camera b (13) is mounted on the adjustment component bracket (14), the side of the adjustment component bracket (14) is mounted on the table surface of the linear precision displacement slide b (15), and the linear precision displacement slide b (15) is mounted on the side of the slide bracket (16); the locking module consists of a slide cylinder (17), a locking cylinder (18), a locking component base (19), a linear guide rail (20), an electric screwdriver (21), an electric screwdriver bracket (22) and a screw adsorption head (23) The electric screwdriver (21) is mounted on the electric screwdriver bracket (22), the electric screwdriver bracket (22) is an L-shaped structure, the side of which is mounted on the linear guide rail (20), the bottom of the linear guide rail (20) is mounted on the lock assembly base (19), the lock assembly base (19) is an L-shaped structure, the side of which is mounted on the slide cylinder (17) table, the bottom of the slide cylinder (17) is mounted on the side of the slide bracket (16), the lock cylinder (18) is fixedly mounted on the lock assembly base (19), the top rod thereof is connected and mounted with the electric screwdriver bracket (22), and the screw adsorption head (23) is mounted on the bottom of the lock assembly base (19); the linear precision displacement slide a (12), the linear precision displacement slide b (15) and the linear precision displacement slide d (41) are combined to form a three-dimensional motion structure for part picking and assembly; the linear precision displacement slide a (12), the slide cylinder (17) and the linear precision displacement slide d (41) are combined to form a three-dimensional motion structure for the screw adsorption and part locking process; the precision turntable a (26) drives the adsorbed parts on the part adsorption head (28) to rotate around the rotation axis, that is, to achieve the function of adjusting the parallelism of the rectangular target surface edge line on the CMOS circuit board (1) and the reference surface edge line of the star sensor bracket (3); the industrial camera b (13) realizes the function of identifying the position of the part to be assembled; the cylindrical force sensor (27) provides real-time feedback of the contact force between the part adsorption head (28) and the part during the assembly process;The locking module realizes the screw adsorption and part locking functions, wherein the locking cylinder (18) realizes the function of driving the electric screwdriver bracket (22) and the electric screwdriver (21) thereon to reciprocate up and down for locking, the linear guide rail (20) realizes the function of guiding the electric screwdriver bracket (22) and the electric screwdriver (21) thereon to reciprocate up and down, and the screw adsorption head (23) realizes the screw adsorption and material taking function provided by the screw feeder (24); The feeding module is composed of a screw feeder (24), a screw feeder base (25), a material tray (29), a pressure block (30), a linear precision displacement slide c (31) and a feeding assembly base (32); the bottom of the screw feeder (24) is mounted on the screw feeder base (25), and the bottom of the screw feeder base (25) is mounted on the optical platform (4); the bottom of the material tray (29) is mounted on the linear precision displacement slide c (31), the bottom of the linear precision displacement slide c (31) is mounted on the feeding assembly base (32), and the bottom of the feeding assembly base (32) is mounted on the optical platform (4); the pressure block (30) is placed in a fixed area on the material tray; the screw feeder (24) realizes the feeding function of the screw; the material tray (29) is adapted to the holes on the CMOS circuit board (1), the adjustment gasket (2) and the pressure block (30), and is designed with a boss-shaped limiting structure so that The three adjusting gaskets (2) are placed on the material tray (29) in a triangular distribution, so that the adjusting gaskets (2) and the pressing block (30) are placed on the plane of the material tray (29) and are limited by the limiting structure, so that no excessive rotation occurs, which is convenient for the adsorption and picking up of the parts adsorption head (28); the bottom of the pressing block (30) is coated with a buffer material, and after the CMOS circuit board (1) is installed, the pressing block (30) is picked up by the adjustment module and pressed onto the CMOS circuit board (1), and then the pressing block (30) is pressed by the angle cylinder (38) to avoid the angle cylinder (38) directly pressing onto the CMOS circuit board (1) to damage the parts, and because the CMOS circuit board (1) and the star sensor bracket (3) finally need to be screwed, after the pressing block (30) presses the CMOS circuit board (1), an opening structure is designed at the screw hole position on the CMOS circuit board (1) to ensure that the screw locking is not affected in the pressed state.

Images