Automatic control method and device for wall surface polishing machine

Abstract

The application discloses an automatic control method and device for a wall polisher, and the method comprises the following steps: determining polishing demand parameters of a plurality of burst point areas needing polishing corresponding to a target wall according to wall parameters of the target wall and predicted parameters after polishing; determining target polishing control parameters of the wall polisher according to the polishing demand parameters of all the burst point areas, and controlling the wall polisher to perform target polishing operation on all the burst point areas according to the target polishing control parameters. It can be seen that the application can intelligently control the wall polisher to polish the target wall according to the related parameters of the target wall, and manual control of the wall polisher is not needed, so that the polishing efficiency of the wall is improved, the polishing depth of each burst point area can be accurately controlled, the polishing precision of the wall is improved, the wall is smoothed, and the situation that the operator inhales dust is reduced, so that the health of the operator is not seriously damaged.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of intelligent devices, and in particular to an automatic control method and device for a wall polisher. BACKGROUND

[0002] A wall polisher is an important processing device for a concrete construction surface, which can make the wall smooth without protrusions, so that people can install wall bricks and decorations on the wall, making the house they live in more beautiful.

[0003] Currently, when people need to polish the wall, they generally first measure the size of the polishing area of the wall by hand, and then manually control the wall polisher to polish the wall. However, manually controlling the wall polisher not only has low polishing efficiency, but also makes it difficult for the operator to control the polishing depth of the wall, so that the wall is still uneven, and the operator inhales a large amount of dust, which seriously damages the health of the operator. Therefore, it is particularly important to provide a method for intelligently controlling the wall polisher. SUMMARY

[0004] The technical problem to be solved by the present application is to provide an automatic control method and device for a wall polisher, which can improve the polishing efficiency of the wall, accurately control the polishing depth of each blast point area, improve the polishing accuracy of the wall, make the wall smooth, and reduce the inhalation of dust by the operator, thereby ensuring the health of the operator is not seriously damaged.

[0005] To solve the above technical problems, the present application discloses a first aspect of an automatic control method for a wall polisher, the method comprising:

[0006] determining the wall surface parameters of the target wall surface to be polished and the predicted polished parameters of the target wall surface; the wall surface parameters of the target wall surface include the wall surface concave-convex condition of the target wall surface, and the predicted polished parameters of the target wall surface include the predicted reference depth of the target wall surface;

[0007] determining a plurality of blast point areas to be polished corresponding to the target wall surface and polishing requirement parameters of each blast point area according to the wall surface parameters of the target wall surface and the predicted polished parameters of the target wall surface; the polishing requirement parameters of each blast point area include the polishing depth of the blast point area and the polishing area range of the blast point area;

[0008] determining target polishing control parameters of the wall polisher according to the polishing requirement parameters of all the burst point areas, and controlling the wall polisher to perform target polishing operations on all the burst point areas according to the target polishing control parameters of the wall polisher; the target polishing control parameters of the wall polisher include at least one of a saw blade polishing rotation speed of the wall polisher, a saw blade wall pressure of the wall polisher, a starting working position of the wall polisher, and a termination working position of the wall polisher, which are matched with each of the burst point areas.

[0009] As an optional implementation, in the first aspect of the present application, the wall polisher includes at least one saw blade; before the step of determining the target polishing control parameters of the wall polisher according to the polishing requirement parameters of all the burst point areas, the method further includes:

[0010] determining saw blade parameters of the wall polisher; the saw blade parameters of the wall polisher include an inter-saw blade valley depth of all the saw blades included in the wall polisher and an inter-saw blade distance between all the saw blades;

[0011] wherein the step of determining the target polishing control parameters of the wall polisher according to the polishing requirement parameters of all the burst point areas includes:

[0012] for each of the burst point areas, determining target parameters of at least one polishing layer corresponding to the burst point area according to a polishing depth of the burst point area, a polishing area range of the burst point area, and the inter-saw blade valley depth of all the saw blades; the target parameters of each of the polishing layers include a polishing depth of the polishing layer and a layer area range of the polishing layer, and the polishing depth of the polishing layer is matched with the inter-saw blade valley depth of all the saw blades;

[0013] determining an offset number of the wall polisher according to the inter-saw blade distance between all the saw blades, and determining a polishing number of each of the polishing layers corresponding to the burst point area according to the offset number of the wall polisher;

[0014] determining target polishing control parameters of the wall polisher at each polishing of each of the polishing layers according to the target parameters of each of the polishing layers and the corresponding polishing number.

[0015] As an optional implementation, in the first aspect of the present application, the step of controlling the wall polisher to perform target polishing operations on all the burst point areas according to the target polishing control parameters of the wall polisher includes:

[0016] According to the target polishing control parameters of the wall polisher for each polishing layer corresponding to the certain burst point area under each polishing, the wall polisher is controlled to perform target polishing operation on all the polishing layers of the burst point area, and after the target polishing operation on all the polishing layers of the burst point area is completed, the starting polishing position of a next burst point area adjacent to the burst point area is determined;

[0017] The wall polisher is moved to the starting polishing position of the next burst point area, and according to the target polishing control parameters of the wall polisher for each polishing layer corresponding to the next burst point area under each polishing, the wall polisher is controlled to perform target polishing operation on all the polishing layers of the next burst point area.

[0018] As an optional implementation, in the first aspect of the present application, the method further comprises:

[0019] After the target polishing operation on all the burst point areas is completed, the polishing conditions corresponding to all the burst point areas are determined, and whether a first transition polishing operation needs to be performed on all the burst point areas is judged according to the polishing conditions corresponding to all the burst point areas.

[0020] When it is judged that the first transition polishing operation needs to be performed on all the burst point areas, the transition polishing areas corresponding to all the burst point areas and the polishing requirement parameters of the transition polishing areas are determined according to the polishing conditions corresponding to all the burst point areas; the polishing requirement parameters of the transition polishing area include the transition polishing depth, the transition polishing starting position and the transition polishing ending position of the transition polishing area, and the transition polishing area is an area adjacent to all the burst point areas and located in the same row or column.

[0021] According to the polishing requirement parameters of the transition polishing area, the first transition polishing control parameters of the wall polisher are determined, and the wall polisher is controlled to perform the first transition polishing operation on the transition polishing area according to the first transition polishing control parameters of the wall polisher.

[0022] As an optional implementation, in the first aspect of the present application, the first transition polishing control parameters of the wall polisher include a first transition polishing wall pressing speed, a transition polishing feeding speed and a second transition polishing wall pressing speed, the speed directions of the first transition polishing wall pressing speed and the transition polishing feeding speed are parallel to the horizontal plane of the target wall, and the speed direction of the second transition polishing wall pressing speed is perpendicular to the horizontal plane of the target wall.

[0023] The first transition polishing control parameter of the wall polishing machine is used to control the wall polishing machine to perform the first transition polishing operation on the transition polishing area.

[0024] The transition polishing feed speed is used to control the wall polishing machine to move from the transition polishing starting position, pass through all the burst point areas, and move towards the transition polishing ending position.

[0025] During the movement of the wall polishing machine towards the transition polishing ending position, the first transition polishing wall pressing speed and the second transition polishing wall pressing speed are used to control the wall polishing machine to perform the first transition polishing operation on the transition polishing area.

[0026] As an optional implementation, in the first aspect of the present application, the method further comprises:

[0027] During the control of the wall polishing machine to perform the first transition polishing operation on the transition polishing area, the spring deformation condition caused by the floating buffer device of the wall polishing machine on the transition polishing area is monitored, and a spring deformation value corresponding to the spring deformation condition is determined.

[0028] It is judged whether the spring deformation value is greater than or equal to a preset first spring deformation value; before the wall polishing machine passes through all the burst point areas, the spring deformation value is less than the preset first spring deformation value.

[0029] When it is judged that the first spring deformation value is greater than or equal to the preset first spring deformation value, the first transition polishing wall pressing speed and the second transition polishing wall pressing speed corresponding to the wall polishing machine are reduced to zero.

[0030] It is judged whether the spring deformation value is less than or equal to a preset second spring deformation value; before the wall polishing machine reaches the transition polishing ending position, the spring deformation value is greater than the preset second spring deformation value.

[0031] When it is judged that the spring deformation value is less than or equal to the preset second spring deformation value, the transition polishing feed speed corresponding to the wall polishing machine is reduced to zero, and a return operation is performed on all the saw blades.

[0032] As an optional implementation, in the first aspect of the present application, the method further comprises:

[0033] After the target polishing operation on all the burst point areas is completed, it is determined whether other walls adjacent to the target wall and in the same continuous area need to be polished. If yes, the other walls are updated as the target wall, and the steps of determining the wall parameters of the target wall needing to be polished and the predicted parameters of the target wall after polishing, determining a plurality of burst point areas corresponding to the target wall needing to be polished and polishing requirement parameters of each burst point area according to the wall parameters of the target wall and the predicted parameters of the target wall after polishing, determining target polishing control parameters of the wall polisher according to the polishing requirement parameters of all the burst point areas, and controlling the wall polisher to perform target polishing operation on all the burst point areas according to the target polishing control parameters of the wall polisher are triggered.

[0034] A preset width of a to-be-determined secondary polishing area matched with the target wall and the other walls is determined, and a polishing difference condition between the target wall and the other walls is determined. According to the polishing difference condition, it is determined whether the to-be-determined secondary polishing area needs to be subjected to a second transition polishing operation.

[0035] When the determination result is yes, the polishing requirement parameters of the to-be-determined secondary polishing area are determined according to the polishing difference condition. The polishing requirement parameters of the to-be-determined secondary polishing area include a polishing depth of the to-be-determined secondary polishing area.

[0036] The second transition polishing control parameters of the wall polisher are determined according to the polishing requirement parameters of the to-be-determined secondary polishing area. The second transition polishing control parameters include at least one of a transition polishing frequency, a saw blade transition polishing rotating speed of the wall polisher, a saw blade transition polishing wall pressing force, a saw blade transition polishing starting position and a saw blade transition polishing ending position.

[0037] The second transition polishing operation of the to-be-determined secondary polishing area is performed by the wall polisher according to the second transition polishing control parameters of the wall polisher.

[0038] The second aspect of the present application discloses an automatic control device of a wall polisher, which comprises:

[0039] The first determining module is configured to determine a wall surface parameter of a target wall surface to be polished and a predicted post-polishing parameter of the target wall surface; the wall surface parameter of the target wall surface comprises a wall surface concave-convex condition of the target wall surface, and the predicted post-polishing parameter of the target wall surface comprises a predicted reference depth of the target wall surface; according to the wall surface parameter of the target wall surface and the predicted post-polishing parameter of the target wall surface, a plurality of burst point areas to be polished corresponding to the target wall surface and a polishing requirement parameter of each burst point area are determined; the polishing requirement parameter of each burst point area comprises a polishing depth of the burst point area and a polishing area range of the burst point area.

[0040] The second determining module is configured to determine a target polishing control parameter of the wall surface polisher according to the polishing requirement parameters of all the burst point areas.

[0041] The control module is configured to control the wall surface polisher to perform a target polishing operation on all the burst point areas according to the target polishing control parameter of the wall surface polisher; the target polishing control parameter of the wall surface polisher comprises at least one of a saw blade polishing rotating speed of the wall surface polisher matched with each burst point area, a saw blade wall pressure of the wall surface polisher, a starting working position of the wall surface polisher and a termination working position of the wall surface polisher.

[0042] As an optional implementation, in the second aspect of the present application, the wall surface polisher comprises at least one saw blade.

[0043] The first determining module is further configured to determine a saw blade parameter of the wall surface polisher before the second determining module determines the target polishing control parameter of the wall surface polisher according to the polishing requirement parameters of all the burst point areas; the saw blade parameter of the wall surface polisher comprises a saw blade inter-wave valley depth of all the saw blades comprised by the wall surface polisher and a saw blade spacing between all the saw blades.

[0044] The second determining module determines the target polishing control parameter of the wall surface polisher according to the polishing requirement parameters of all the burst point areas in the following manner:

[0045] For each burst point area, a target parameter of at least one polishing layer corresponding to the burst point area is determined according to the polishing depth of the burst point area, the polishing area range of the burst point area and the saw blade inter-wave valley depth of all the saw blades; the target parameter of each polishing layer comprises a polishing depth of the polishing layer and a layer area range of the polishing layer, and the polishing depth of the polishing layer is matched with the saw blade inter-wave valley depth of all the saw blades.

[0046] determine the number of offset times of the wall surface grinding machine according to the saw blade spacing between all the saw blades, and determine the grinding times of each of the grinding layers corresponding to the burst point area according to the number of offset times of the wall surface grinding machine;

[0047] determine the target grinding control parameter of the wall surface grinding machine for each of the grinding layers in each grinding according to the target parameter of each of the grinding layers and the corresponding grinding times.

[0048] As an optional implementation, in the second aspect of the present application, the manner of controlling the wall surface grinding machine to perform the target grinding operation on all the burst point areas according to the target grinding control parameter of the wall surface grinding machine is specifically:

[0049] perform the target grinding operation on all the grinding layers of the burst point area according to the target grinding control parameter of the wall surface grinding machine for each of the grinding layers of the burst point area in each grinding, and after the target grinding operation on all the grinding layers of the burst point area is completed, determine the starting grinding position of the next burst point area adjacent to the burst point area;

[0050] move the wall surface grinding machine to the starting grinding position of the next burst point area, and perform the target grinding operation on all the grinding layers of the next burst point area according to the target grinding control parameter of the wall surface grinding machine for each of the grinding layers of the next burst point area in each grinding.

[0051] As an optional implementation, in the second aspect of the present application, the first determining module is further configured to:

[0052] determine the post-grinding situation corresponding to all the burst point areas after the control module completes the target grinding operation on all the burst point areas,

[0053] and the device further comprises:

[0054] a first judging module configured to judge whether the first transition grinding operation needs to be performed on all the burst point areas according to the post-grinding situation corresponding to all the burst point areas;

[0055] The first determining module is further configured to, when the first judging module judges that the first transitional polishing operation needs to be performed on all the burst point regions, determine, according to the post-polishing conditions of all the burst point regions, a transitional polishing region corresponding to all the burst point regions and polishing requirement parameters of the transitional polishing region; the polishing requirement parameters of the transitional polishing region include a transitional polishing depth, a transitional polishing start position and a transitional polishing end position of the transitional polishing region, the transitional polishing region is a region adjacent to all the burst point regions and located in the same row or column as the burst point regions; and the first transitional polishing control parameters of the wall surface polisher are determined according to the polishing requirement parameters of the transitional polishing region.

[0056] The control module is further configured to control the wall surface polisher to perform the first transitional polishing operation on the transitional polishing region according to the first transitional polishing control parameters of the wall surface polisher.

[0057] As an optional implementation form, in the second aspect of the present application, the first transitional polishing control parameters of the wall surface polisher include a first transitional polishing wall pressing speed, a transitional polishing feeding speed and a second transitional polishing wall pressing speed, the speed directions of the first transitional polishing wall pressing speed and the transitional polishing feeding speed are parallel to the horizontal plane of the target wall surface, and the speed direction of the second transitional polishing wall pressing speed is perpendicular to the horizontal plane of the target wall surface.

[0058] The control module controls the wall surface polisher to perform the first transitional polishing operation on the transitional polishing region according to the first transitional polishing control parameters of the wall surface polisher, including:

[0059] The wall surface polisher is controlled to move from the transitional polishing start position, pass through all the burst point regions and move towards the transitional polishing end position according to the transitional polishing feeding speed;

[0060] In the process of moving the wall surface polisher towards the transitional polishing end position, the wall surface polisher is controlled to perform the first transitional polishing operation on the transitional polishing region according to the first transitional polishing wall pressing speed and the second transitional polishing wall pressing speed.

[0061] As an optional implementation form, in the second aspect of the present application, the device further includes:

[0062] The monitoring module is configured to monitor a spring deformation condition of the floating buffer device of the wall surface polisher caused by the transitional polishing region in the process that the control module controls the wall surface polisher to perform the first transitional polishing operation on the transitional polishing region.

[0063] The first determining module is further configured to determine a spring deformation value corresponding to the spring deformation condition.

[0064] The first judging module is further configured to judge whether the spring deformation value is greater than or equal to a preset first spring deformation value; and before the wall surface grinding machine passes through all the burst point areas, the spring deformation value is less than the preset first spring deformation value.

[0065] The control module is further configured to, when the first judging module judges that the first spring deformation value is greater than or equal to the preset first spring deformation value, reduce the first transition grinding pressure-on-wall speed and the second transition grinding pressure-on-wall speed corresponding to the wall surface grinding machine to zero.

[0066] The first judging module is further configured to judge whether the spring deformation value is less than or equal to a preset second spring deformation value; and before the wall surface grinding machine reaches the transition grinding termination position, the spring deformation value is greater than the preset second spring deformation value.

[0067] The control module is further configured to, when the first judging module judges that the spring deformation value is less than or equal to the preset second spring deformation value, reduce the transition grinding feed speed corresponding to the wall surface grinding machine to zero, and perform a back-knife operation on all the saw blades.

[0068] As an optional implementation, in the second aspect of the present application, the device further comprises:

[0069] A second judging module is configured to, after the control module performs the target grinding operation on all the burst point areas, judge whether other wall surfaces adjacent to the target wall surface in the same continuous area need to be ground.

[0070] An updating module is configured to, when the second judging module judges that the other wall surfaces need to be ground, update the other wall surfaces as the target wall surface, trigger the first determining module to perform the operation of determining the wall surface parameters of the target wall surface that needs to be ground and the predicted parameters of the target wall surface after grinding, and determine the plurality of burst point areas that need to be ground corresponding to the target wall surface and the grinding demand parameters of each burst point area according to the wall surface parameters of the target wall surface and the predicted parameters of the target wall surface after grinding, and trigger the second determining module to perform the operation of determining the target grinding control parameters of the wall surface grinding machine according to the grinding demand parameters of all the burst point areas, and trigger the control module to perform the step of controlling the wall surface grinding machine to perform the target grinding operation on all the burst point areas according to the target grinding control parameters of the wall surface grinding machine.

[0071] The first determination module is further configured to determine a preset-width to-be-determined secondary polishing area matched with the target wall surface and the other wall surfaces, and determine a polishing difference between the target wall surface and the other wall surfaces.

[0072] The second determination module is further configured to determine whether a second transition polishing operation needs to be performed on the to-be-determined secondary polishing area.

[0073] The first determination module is further configured to, when the second determination module determines that the second transition polishing operation needs to be performed, determine a polishing requirement parameter of the to-be-determined secondary polishing area according to the polishing difference, wherein the polishing requirement parameter of the to-be-determined secondary polishing area comprises a polishing depth of the to-be-determined secondary polishing area, and determine a second transition polishing control parameter of the wall surface polisher according to the polishing requirement parameter of the to-be-determined secondary polishing area, wherein the second transition polishing control parameter comprises at least one of a transition polishing frequency, a transition polishing saw blade rotating speed of the wall surface polisher, a transition polishing wall pressing force of the wall surface polisher, a transition polishing start position of the wall surface polisher, and a transition polishing end position of the wall surface polisher.

[0074] The control module is further configured to control the wall surface polisher to perform the second transition polishing operation on the to-be-determined secondary polishing area according to the second transition polishing control parameter of the wall surface polisher.

[0075] The third aspect of the present application discloses another automatic control device of a wall surface polisher, which comprises:

[0076] A memory in which an executable program code is stored;

[0077] A processor coupled with the memory;

[0078] The processor invokes the executable program code stored in the memory to execute the automatic control method of the wall surface polisher disclosed in the first aspect of the present application.

[0079] The fourth aspect of the present application discloses a computer storage medium storing computer instructions, which, when invoked, are used to execute the automatic control method of the wall surface polisher disclosed in the first aspect of the present application.

[0080] Compared with the prior art, the embodiments of the present application have the following beneficial effects:

[0081] In the embodiment of the present application, the wall surface parameters of the target wall surface needing polishing and the predicted polishing parameters of the target wall surface are determined; the multiple blasting point areas needing polishing corresponding to the target wall surface and the polishing requirement parameters of each blasting point area are determined according to the wall surface parameters of the target wall surface and the predicted polishing parameters of the target wall surface; the target polishing control parameters of the wall surface polisher are determined according to the polishing requirement parameters of all the blasting point areas, and the target polishing operation of the wall surface polisher on all the blasting point areas is controlled according to the target polishing control parameters of the wall surface polisher. It can be seen that the present application can intelligently control the wall surface polisher to polish the target wall surface according to the related parameters of the target wall surface, without manual control of the wall surface polisher. In this way, the polishing efficiency of the wall surface is improved, the polishing depth of each blasting point area can be accurately controlled, the polishing accuracy of the wall surface is improved, the wall surface becomes smooth, and the operator's health is not seriously damaged. BRIEF DESCRIPTION OF DRAWINGS

[0082] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0083] Figure 1 is a scene schematic diagram of controlling a wall surface polisher to perform a target polishing operation disclosed by an embodiment of the present application;

[0084] Figure 2 is a scene schematic diagram of controlling a wall surface polisher to perform a first transition polishing operation disclosed by an embodiment of the present application;

[0085] Figure 3 is a scene schematic diagram of controlling a wall surface polisher to perform a second transition polishing operation disclosed by an embodiment of the present application;

[0086] Figure 4 is a structure schematic diagram of a wall surface polisher disclosed by an embodiment of the present application;

[0087] Figure 5 is a flow schematic diagram of an automatic control method of a wall surface polisher disclosed by an embodiment of the present application;

[0088] Figure 6 is a flow schematic diagram of another automatic control method of a wall surface polisher disclosed by an embodiment of the present application;

[0089] Figure 7 is a structure schematic diagram of an automatic control device of a wall surface polisher disclosed by an embodiment of the present application;

[0090] Figure 8 is another structure schematic view of the automatic control device of the wall surface polisher disclosed by the embodiment of the present application;

[0091] Figure 9 is another structure schematic view of the automatic control device of the wall surface polisher disclosed by the embodiment of the present application. DETAILED DESCRIPTION

[0092] In order to make the personnel in the technical field better understand the present application scheme, the technical scheme in the embodiment of the present application will be described clearly and completely below by combining the drawings in the embodiment of the present application. Obviously, the described embodiment is only a part of the embodiment of the present application, not all the embodiments. Based on the embodiment in the present application, all other embodiments obtained by the person skilled in the art without creative labor belong to the protection scope of the present application.

[0093] The terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish different objects, not to describe a specific order. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, device, product or end including a series of steps or units is not limited to the listed steps or units, but can optionally include steps or units not listed, or can optionally include other steps or units inherent to the process, method, product or end.

[0094] In this paper, the "embodiment" means that the specific features, structures or characteristics described in conjunction with the embodiment can be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment to other embodiments. The person skilled in the art explicitly and implicitly understands that the embodiments described herein can be combined with other embodiments.

[0095] The present application discloses an automatic control method and device of a wall surface polisher, which can improve the polishing efficiency of the wall surface, accurately control the polishing depth of each burst point area, improve the polishing accuracy of the wall surface, make the wall surface smooth, and reduce the inhalation of dust by the operator, thereby ensuring the health of the operator is not severely damaged. The following will be described in detail.

[0096] Embodiment one

[0097] Please refer to Figure 5 , Figure 5 is a flowchart of the automatic control method of the wall surface polisher disclosed by the embodiment of the present application. Among them, Figure 5The automatic control method of the wall polisher described can be applied to wall polishing work in various scenarios, such as office scenarios, home scenarios, and entertainment scenarios, and the like. The embodiments of the present application do not limit the type of scenario. Optionally, the method can be implemented by a polisher control system, which can be integrated in the wall polisher, or can exist independently of the wall polisher, or can be a local server or a cloud server for processing the wall polisher control process, and the like. The embodiments of the present application do not limit. As shown in Figure 5 The automatic control method of the wall polisher can include the following operations:

[0098] 101. Determine the wall parameters of the target wall to be polished and the predicted polished parameters of the target wall.

[0099] In the embodiments of the present application, optionally, the wall parameters of the target wall include the wall concave-convex condition of the target wall, and can also include the intersection condition (such as the intersection angle, the intersection position, and the like) of the target wall and the adjacent intersection wall. Further optionally, the predicted polished parameters of the target wall include the predicted reference depth of the target wall, that is, the shape of the wall after polishing.

[0100] 102. According to the wall parameters of the target wall and the predicted polished parameters of the target wall, determine a plurality of explosion point areas that need to be polished corresponding to the target wall and the polishing requirement parameters of each explosion point area.

[0101] In the embodiments of the present application, optionally, the polishing requirement parameters of each explosion point area include the polishing depth of the explosion point area and the polishing area range of the explosion point area. Further optionally, the number of explosion points of each explosion point area can be one or more. For example, as shown in Figure 1 Figure 1 is a scene diagram for controlling the wall polisher to perform target polishing operation disclosed by an embodiment of the present application, wherein, as shown in Figure 1 a certain explosion point area, the polishing depth of the explosion point area is the vertical distance from the highest convex point of the explosion point area to the reference level of the wall, and the polishing area range of the explosion point area is the range covered by the first polishing layer.

[0102] 103. According to the polishing requirement parameters of all explosion point areas, determine the target polishing control parameters of the wall polisher, and control the wall polisher to perform target polishing operation on all explosion point areas according to the target polishing control parameters of the wall polisher.

[0103] ​In the embodiment of the present application, optionally, the target polishing control parameters of the wall polisher include at least one of the saw blade polishing rotating speed of the wall polisher, the saw blade wall pressing force of the wall polisher, the starting working position of the wall polisher and the ending working position of the wall polisher matched with each burst point area, that is, the polishing depth and the polishing area range of each burst point area are different, and the target polishing control parameters of the wall polisher are also different. Further optionally, the direction of the saw blade polishing rotating speed and the direction of the saw blade wall pressing force can form an arbitrary angle with the reference horizontal plane of the target wall. Still further optionally, the polishing requirement parameters of each burst point area can also include the polishing times. For example, for a burst point area, the target polishing control parameters of the wall polisher in each polishing can be determined according to the polishing requirement parameters of the burst point area in each polishing, and then the target polishing operation of the wall polisher on the burst point area is controlled according to the target polishing control parameters of the wall polisher in each polishing.

[0104] It can be seen that the embodiment of the present application can intelligently control the wall polisher to polish the target wall according to the related parameters of the target wall without manual control of the wall polisher, so that the polishing efficiency of the wall is improved, the polishing depth of each burst point area can be accurately controlled, the polishing accuracy of the wall is improved, the wall becomes flat, and the operator's health is not seriously damaged.

[0105] Embodiment two

[0106] Please refer to Figure 6 , Figure 6 is a flowchart of an automatic control method of a wall polisher disclosed in an embodiment of the present application. Among them, Figure 6 The automatic control method of the wall polisher described can be applied to wall polishing work in various scenes, such as office scenes, home scenes and entertainment place scenes, etc., and the type of scene is not limited in the embodiment of the present application. Optionally, the method can be realized by a polisher control system, which can be integrated in the wall polisher, can exist independently of the wall polisher, can be a local server or a cloud server for processing the wall polisher control flow, etc., and the present application is not limited. As Figure 6 shown, the automatic control method of the wall polisher can include the following operations:

[0107] 201, determine the wall parameters of the target wall to be polished and the predicted polishing parameters of the target wall.

[0108] 202. Determine the multiple burst point areas and the polishing requirement parameters of each burst point area corresponding to the target wall surface according to the wall surface parameters of the target wall surface and the predicted polishing parameters of the target wall surface.

[0109] 203. Determine the saw blade parameters of the wall polisher.

[0110] In the embodiments of the present application, specifically, the wall polisher comprises at least one saw blade. Optionally, the saw blade parameters of the wall polisher comprise the inter-saw blade valley depth of all the saw blades comprised by the wall polisher and the inter-saw blade spacing between all the saw blades, wherein, as shown in Figure 4 Figure 4 A structural schematic diagram of the wall polisher disclosed in the embodiments of the present application is shown in Figure 4 , wherein the multiple saw blades arranged inside the cutting head face upward and are vertically stacked, the spacing between every two saw blades is the inter-saw blade spacing, and all the saw blades protrude out of the cutting port of the cutting head. In addition, during the movement of the cutting head, the distance between the cutting port and the target wall surface to be polished can be controlled by adjusting the fixed guide wheels and / or the adjustable guide wheels arranged left and right of the cutting head, so as to control the polishing depth of all the saw blades on the target wall surface.

[0111] 204. For each burst point area, determine the target parameters of at least one polishing layer corresponding to the burst point area according to the polishing depth of the burst point area, the polishing area range of the burst point area and the inter-saw blade valley depth of all the saw blades.

[0112] In the embodiments of the present application, optionally, the target parameters of each polishing layer comprise the polishing depth of the polishing layer and the layer area range covered by the polishing layer. For example, as shown in Figure 1 , the burst point area has four polishing layers (i.e. the cutting layers in Figure 1 ), and each polishing layer has a fixed polishing depth (i.e. the single cutting depth in Figure 1 ) and a layer area range covered, wherein the layer area range covered by the polishing layer gradually decreases as it goes down. Specifically, the polishing depth of the polishing layer matches the inter-saw blade valley depth of all the saw blades.

[0113] Further, the inter-saw blade valley depth of all the saw blades is determined by the following way:

[0114] Determine the saw blade basic parameters of each saw blade, and determine the job requirement information matching all the burst point areas according to the polishing requirement parameters of each burst point area;

[0115] Determine the inter-saw blade valley depth of all the saw blades according to the saw blade basic parameters of all the saw blades and the job requirement information.

[0116] ​Optionally, the basic saw blade parameters of each saw blade include at least one of the saw blade depth, saw blade spacing, number of saw teeth, saw blade radius size, and wear condition; and the operation requirement information includes at least one of the operation requirement duration, operation requirement efficiency, and operation requirement effect.

[0117] 205. Determine the number of offsets of the wall grinding machine according to the saw blade spacing between all saw blades, and determine the number of grinding times for each grinding layer corresponding to the detonation point area according to the number of offsets of the wall grinding machine.

[0118] In an embodiment of the present invention, further, after determining the number of offsets of the wall grinding machine, the offset distance of the wall grinding machine can be obtained. For example, if the saw blade spacing is w and the number of offsets is n, the offset distance is w / n. For example, for a certain grinding layer in a certain detonation point area, first, initial grinding is required to grind out serrated patterns, and then, according to the determined number of offsets, such as n times, determine the number of grinding times required to flatten the serrated patterns. The number of flattening grinding times can be set to be equal to n, that is, the number of grinding times required for this grinding layer is 1 + n times.

[0119] 206. Determine the target grinding control parameters of the wall grinding machine for each grinding layer during each grinding according to the target parameters of each grinding layer and the corresponding number of grinding times.

[0120] In an embodiment of the present invention, for example, as Figure 1 shown, for the first grinding layer in a certain detonation point area, when the number of grinding times of the first grinding layer is determined to be 1 + n times, it can be determined that when grinding this grinding layer for the first time (i.e., initial grinding), the saw blade grinding speed of the wall grinding machine can be a and the saw blade pressure against the wall can be b, and place the wall grinding machine (i.e., Figure 1 the cutting device in) at Figure 1 the operation starting position in, and then move towards the operation end position for the first grinding. Immediately, when grinding this grinding layer for the second time, the saw blade grinding speed of the wall grinding machine can be c (where a < c) and the saw blade pressure against the wall can be d (where b > d), and control the wall grinding machine to move from the operation end position towards the operation starting position for the second grinding (where the target grinding control parameters for the 3rd to nth times can be set according to the second time), until the nth grinding is completed. In this way, the first grinding layer is cut. For the 2nd to 4th grinding layers, the corresponding number of grinding times and the target grinding control parameters for each grinding can also be determined by referring to the first grinding layer, and the difference is that the operation starting position and the operation end position of the wall grinding machine need to be adjusted according to the coverage range of each grinding layer.

[0121] 207. controlling the wall polisher to perform the target polishing operation on all of the burst point areas according to the target polishing control parameters of the wall polisher.

[0122] In the embodiments of the present application, for other descriptions of steps 201, 202 and 207, please refer to the detailed descriptions of steps 101-103 in Embodiment One, and the embodiments of the present application will not be repeated here.

[0123] It can be seen that the embodiments of the present application can combine the saw blade parameters of the wall polisher and the polishing requirement parameters of each burst point area to determine the target polishing control parameters of the wall polisher for all polishing layers in each burst point area. This is conducive to improving the polishing reliability and accuracy of the wall polisher for each polishing layer, and further conducive to improving the polishing accuracy of the wall polisher for each burst point area, so as to achieve accurate polishing of the target wall and reduce the occurrence of unevenness of the target wall after polishing.

[0124] In an optional embodiment, the method further comprises:

[0125] controlling the wall polisher to perform the target polishing operation on all of the burst point areas according to the target polishing control parameters of the wall polisher.

[0126] moving the wall polisher to the starting polishing position of the next burst point area, and controlling the wall polisher to perform the target polishing operation on all of the polishing layers of the next burst point area according to the target polishing control parameters of the wall polisher for each polishing layer of the next burst point area.

[0127] In this optional embodiment, optionally, the area position of the next burst point area and the current burst point area can be in the same row or column position when the wall polisher performs horizontal or vertical work, or can not be in the same row or column position.

[0128] It can be seen that this optional embodiment can intelligently perform the target polishing operation on each burst point area until all burst point areas are polished. This is conducive to improving the polishing reliability and accuracy of each burst point area, and further conducive to improving the polishing reliability and accuracy of the target wall, so as to improve the polishing effect of the overall target wall.

[0129] In another optional embodiment, the method further comprises:

[0130] After completing the target polishing operation on all the explosion point areas, determine the post-polishing condition of all explosion point areas, and based on the post-polishing condition of all explosion point areas, determine whether the first transition polishing operation needs to be performed on all explosion point areas.

[0131] When it is determined that the first transitional polishing operation needs to be performed on all the burst point areas, the transitional polishing areas corresponding to all the burst point areas and the polishing requirement parameters of the transitional polishing areas are determined according to the polishing status of all the burst point areas.

[0132] Based on the sanding requirements parameters of the transition sanding area, determine the first transition sanding control parameters of the wall sander, and control the wall sander to perform the first transition sanding operation on the transition sanding area according to the first transition sanding control parameters of the wall sander.

[0133] In this optional embodiment, the sanding requirement parameters for the transition sanding area may optionally include the transition sanding depth, the transition sanding start position, and the transition sanding end position. Further optionally, the transition sanding area is an area that is in the same row or column as all the blown-out areas and is adjacent to them. Still further optionally, the first transition sanding control parameters of the wall sander include a first transition sanding wall pressing speed, a transition sanding feed speed, and a second transition sanding wall pressing speed. For example, such as... Figure 2 As shown, Figure 2 This is a schematic diagram illustrating a scenario where a wall sander is controlled to perform a first transition sanding operation, as disclosed in an embodiment of the present invention: after the wall sander has finished sanding all the blown-out areas (i.e.... Figure 2 The cutting area in the middle), in the area adjacent to all the explosion point areas (i.e. Figure 2 The initial or final transition area (the junction with the cutting area) may contain sanded stepped wall blocks. In this case, it's necessary to determine whether the first transition sanding operation needs to be performed on all explosion point areas based on the step height of these stepped wall blocks (if the step height is greater than or equal to the height threshold, then the first transition sanding operation needs to be performed). If so, the transition sanding area (i.e., the area after sanding all explosion point areas) is determined based on the sanding status of all explosion point areas. Figure 2 The initial and final transition areas (as shown in the image), and the sanding requirements parameters for the transition sanding area, i.e., the area where the target wall surface is actually sanded, are as follows: Figure 2 The actual cut area in the diagram is used to achieve a smooth transition.

[0134] It can be seen that the optional embodiment can determine whether the transition polishing is needed according to the polished state of all the burst point areas, so as to realize the intelligent polishing mode of the wall polisher. In this way, the polishing accuracy of all the burst point areas can be further improved, and the polishing effect of all the burst point areas can be further improved, so as to realize the smooth transition between the polished burst point areas and the adjacent areas.

[0135] In another optional embodiment, according to the first transition polishing control parameter of the wall polisher, the wall polisher is controlled to perform the first transition polishing operation on the transition polishing area, including:

[0136] According to the transition polishing feed speed, the wall polisher is controlled to move from the transition polishing starting position, pass through all the burst point areas, and move towards the transition polishing ending position;

[0137] In the process of moving the wall polisher towards the transition polishing ending position, according to the first transition polishing wall pressing speed and the second transition polishing wall pressing speed, the wall polisher is controlled to perform the first transition polishing operation on the transition polishing area.

[0138] In this optional embodiment, specifically, the speed directions of the first transition polishing wall pressing speed and the transition polishing feed speed are parallel to the horizontal plane of the target wall, and the speed direction of the second transition polishing wall pressing speed is perpendicular to the horizontal plane of the target wall. Further specifically, the transition polishing feed speed can be understood as the forward speed of the polishing head of the wall polisher, the first transition polishing wall pressing speed can be understood as the speed of the saw blade of the wall polisher when pressing the wall for polishing, and the second transition polishing wall pressing speed can be understood as the wall pressing speed of the polishing head of the wall polisher perpendicular to the horizontal plane of the target wall. For example, as shown in Figure 2 The transition polishing starting position is the initial contact point of the saw blade in Figure 2 , and then according to the transition polishing feed speed, the wall polisher is controlled to start from the transition polishing starting position, pass through all the polished burst point areas, and move towards the transition polishing ending position (i.e. the point where the saw blade is separated from the wall in Figure 2 . In the process of moving, according to the first transition polishing wall pressing speed and the second transition polishing wall pressing speed, the wall polisher is controlled to perform the first transition polishing operation on the initial transition area and the terminal transition area in Figure 2 .

[0139] It can be seen that the optional embodiment can perform the first transition polishing operation on the transition polishing area according to the determined first transition polishing control parameter, so as to improve the polishing reliability and accuracy of the transition polishing area, and further improve the area polishing effect between the transition polishing area and all the burst point areas, so as to better realize the smooth polishing effect of the target wall.

[0140] In yet another optional embodiment, the method further comprises:

[0141] In the process of controlling the wall polisher to perform the first transition polishing operation on the transition polishing area, the spring deformation caused by the transition polishing area to the floating buffer device of the wall polisher is monitored, and a spring deformation value corresponding to the spring deformation is determined;

[0142] It is determined whether the spring deformation value is greater than or equal to a preset first spring deformation value;

[0143] When it is determined that the first spring deformation value is greater than or equal to the preset first spring deformation value, the first transition polishing wall pressing speed and the second transition polishing wall pressing speed corresponding to the wall polisher are reduced to zero;

[0144] It is determined whether the spring deformation value is less than or equal to a preset second spring deformation value;

[0145] When it is determined that the spring deformation value is less than or equal to the preset second spring deformation value, the transition polishing feed speed corresponding to the wall polisher is reduced to zero, and a retracting operation is performed on all saw blades.

[0146] In this optional embodiment, specifically, before the wall polisher passes through all the burst point areas, the spring deformation value is less than the preset first spring deformation value; before the wall polisher reaches the transition polishing termination position, the spring deformation value is greater than the preset second spring deformation value. For example, when the wall polisher passes through the initial transition area in Figure 2 , the spring deformation value of the spring of the floating buffer device will be in a state of being less than the preset first spring deformation value, during which the wall polisher will control the wall polisher to polish the initial transition area according to the first transition polishing wall pressing speed and the second transition polishing wall pressing speed; when passing through all the burst point areas, the spring deformation value will be in a state of being greater than or equal to the preset first spring deformation value, during which the first transition polishing wall pressing speed and the second transition polishing wall pressing speed of the wall polisher will be reduced to zero, that is, the polishing head stops the wall pressing action, and the saw blades also stop rotating, and then the wall polisher will continue to advance according to the transition polishing feed speed; when the wall polisher passes through the final transition area in Figure 3When the wall surface grinder reaches the termination transition region, the spring deformation value of the floating buffer device is greater than the preset second spring deformation value, and the wall surface grinder continues to polish the termination transition region according to the first transition polishing wall pressing speed (which can be determined as a speed value greater than the first transition polishing wall pressing speed described above, so as to achieve slow-in and fast-out of the saw blade and improve work efficiency) and the second transition polishing wall pressing speed until the wall surface grinder reaches the transition polishing termination position, at which time the spring deformation value is less than or equal to the preset second spring deformation value, and then the transition polishing in speed of the wall surface grinder corresponding to the transition polishing termination position is reduced to zero, that is, the advance of the wall surface grinder is stopped, and the saw blade retraction operation is performed.

[0147] It can be seen that the optional embodiment can intelligently adjust the transition polishing control parameters of the wall surface grinder according to the spring deformation of the floating buffer device of the wall surface grinder, so as to control the wall surface grinder to perform the first transition polishing operation on the transition polishing region, which not only helps to improve the polishing control reliability and accuracy of the transition polishing region, thereby improving the polishing effect of the transition polishing region, but also helps to reduce the secondary polishing damage to the post-polishing burst point region.

[0148] In yet another optional embodiment, the method further comprises:

[0149] After the target polishing operation on all burst point regions is completed, it is determined whether other wall surfaces in the same continuous region as the target wall surface and adjacent to the target wall surface need to be polished. If so, the other wall surfaces are updated as the target wall surface, the wall surface parameters of the determined target wall surface to be polished and the predicted post-polishing parameters of the target wall surface are triggered to be determined, and the target wall surface corresponding to the plurality of burst point regions to be polished and the polishing requirement parameters of each burst point region are determined according to the wall surface parameters of the target wall surface and the predicted post-polishing parameters of the target wall surface. The target polishing control parameters of the wall surface grinder are determined according to the polishing requirement parameters of all burst point regions, and the wall surface grinder is controlled to perform the target polishing operation on all burst point regions according to the target polishing control parameters of the wall surface grinder.

[0150] A preset width of the to-be-determined secondary polishing region is determined according to the target wall surface and the other wall surfaces, and the polishing difference between the target wall surface and the other wall surfaces is determined.

[0151] According to the polishing difference, it is determined whether the second transition polishing operation needs to be performed on the to-be-determined secondary polishing region.

[0152] When the determination result is yes, the polishing requirement parameters of the to-be-determined secondary polishing region are determined according to the polishing difference.

[0153] determine the second transition polishing control parameter of the wall polisher according to the polishing requirement parameter of the to-be-polished secondary polishing region.

[0154] control the wall polisher to perform the second transition polishing operation on the to-be-polished secondary polishing region according to the second transition polishing control parameter of the wall polisher.

[0155] In this optional embodiment, optionally, the polishing requirement parameter of the to-be-polished secondary polishing region comprises a polishing depth of the to-be-polished secondary polishing region. Further optionally, the second transition polishing control parameter comprises at least one of a transition polishing frequency, a saw blade transition polishing rotation speed of the wall polisher, a saw blade transition polishing wall pressure, a saw blade transition polishing start position, a saw blade transition polishing end position, and a transition polishing reference position of the wall polisher in each transition polishing. For example, as shown in Figure 3 Figure 3 A scene diagram for controlling the wall polisher to perform the second transition polishing operation is disclosed in an embodiment of the present application: taking the case that the wall polisher performs horizontal cutting along the horizontal direction of the target wall as an example, the region of the target wall is the single operation region in Figure 3 , and the other walls adjacent to the target wall in the same continuous region are the next row of single operation regions adjacent to the single operation region in Figure 3 . Then, after the target wall and the other walls are both subjected to the target polishing operation, the to-be-polished secondary polishing region with a preset width is determined, which is the overlapping region with a width of b in Figure 3 , and whether the to-be-polished secondary polishing region needs to be subjected to the second transition polishing operation is determined according to the polishing difference between the target wall and the other walls (such as the height difference at the junction), if it needs, the polishing depth of the to-be-polished secondary polishing region is determined, and the second transition polishing control parameter of the wall polisher is determined according to the polishing depth of the to-be-polished secondary polishing region, so as to realize the secondary polishing of the to-be-polished secondary polishing region and the smooth transition at the junction between the target wall and the other walls.

[0156] It can be seen that this optional embodiment can determine whether the junction region between the target wall and the other walls needs to be subjected to the secondary polishing according to the polishing difference between the target wall and the other walls, which is beneficial to improve the polishing reliability and accuracy of the to-be-polished secondary polishing region, and further beneficial to improve the polishing effect of the junction region between the target wall and the other walls, so as to realize the smooth transition between the target wall and the other walls.

[0157] In yet another optional embodiment, the method further comprises:

[0158] ​After the target polishing operation is performed on all the shot areas of the target wall surface and all the shot areas of all the other wall surfaces, a target boundary transition area matching the target wall surface and all the other wall surfaces is determined, and an overall polishing difference between the target wall surface and all the other wall surfaces is determined;

[0159] According to the overall polishing difference, it is determined whether a third transition polishing operation needs to be performed on the target boundary transition area;

[0160] When the determination result is yes, according to the overall polishing difference, a polishing requirement parameter of the target boundary transition area is determined;

[0161] According to the polishing requirement parameter of the target boundary transition area, a third transition polishing control parameter of the wall surface polisher is determined;

[0162] According to the third transition polishing control parameter of the wall surface polisher, the wall surface polisher is controlled to perform a third transition polishing operation on the target boundary transition area.

[0163] In this optional embodiment, optionally, the polishing requirement parameter of the target boundary transition area includes a polishing depth of the target boundary transition area. Further optionally, the third transition polishing control parameter includes at least one of a boundary transition polishing frequency, a saw blade boundary transition polishing rotation speed, a saw blade boundary transition polishing wall pressing force, a saw blade boundary transition polishing starting position and a saw blade boundary transition polishing ending position of the wall surface polisher in each transition polishing. For example, as shown in Figure 7 the target boundary transition area can be a transition area with an up-down boundary with the target wall surface and all the other wall surfaces (or a transition area with a left-right boundary), and then according to the determined third transition polishing control parameter of the wall surface polisher, the wall surface polisher is controlled to perform a third transition polishing operation on the target boundary transition area, such as 5 times of polishing, with a saw blade boundary transition polishing rotation speed of a and a saw blade boundary transition polishing wall pressing force of b in each time.

[0164] It can be seen that this optional embodiment can also perform a transition polishing operation on the wall surface boundary area of the target wall surface and all the other wall surfaces according to the determined overall polishing difference, which is beneficial to improve the polishing reliability and accuracy of the target boundary transition area, and further beneficial to improve the polishing effect of the wall surface boundary area of the target wall surface and all the other wall surfaces, so as to realize the smooth transition of the boundary area of the overall wall surface.

[0165] Embodiment Three

[0166] Please refer to Figure 7 , Figure 7 is a structural schematic diagram of an automatic control device of a wall surface polisher disclosed by the embodiments of the present application. As shown in Figure 7As shown, the automatic control device of the wall polisher can include:

[0167] The first determining module 301 is configured to determine wall surface parameters of a target wall surface to be polished and predicted polished parameters of the target wall surface, and determine a plurality of burst point areas to be polished corresponding to the target wall surface and polishing requirement parameters of each burst point area according to the wall surface parameters of the target wall surface and the predicted polished parameters of the target wall surface.

[0168] The second determining module 302 is configured to determine target polishing control parameters of the wall polisher according to the polishing requirement parameters of all the burst point areas.

[0169] The control module 303 is configured to control the wall polisher to perform target polishing operations on all the burst point areas according to the target polishing control parameters of the wall polisher.

[0170] In the embodiments of the present application, the wall surface parameters of the target wall surface include wall surface concave-convex conditions of the target wall surface, the predicted polished parameters of the target wall surface include predicted reference depths of the target wall surface, the polishing requirement parameters of each burst point area include polishing depths of the burst point area and polishing area ranges of the burst point area, and the target polishing control parameters of the wall polisher include at least one of saw blade polishing rotating speeds of the wall polisher matched with each burst point area, saw blade wall pressing forces of the wall polisher, starting working positions of the wall polisher, and ending working positions of the wall polisher.

[0171] It can be seen that the embodiments of the present application can improve the polishing efficiency of the wall polisher, accurately control the polishing depths of the burst point areas, improve the polishing accuracy of the wall polisher, make the wall surface smooth, and reduce the situation of the operator inhaling dust, thereby ensuring the health of the operator is not seriously damaged. Figure 8 The automatic control device of the wall polisher described above can intelligently control the wall polisher to polish the target wall surface according to the related parameters of the target wall surface, without manually controlling the wall polisher, thereby improving the polishing efficiency of the wall polisher, accurately controlling the polishing depths of the burst point areas, improving the polishing accuracy of the wall polisher, making the wall surface smooth, and reducing the situation of the operator inhaling dust, thereby ensuring the health of the operator is not seriously damaged.

[0172] In an optional embodiment, the first determining module 301 is further configured to:

[0173] Before the second determining module 302 determines the target polishing control parameters of the wall polisher according to the polishing requirement parameters of all the burst point areas, the saw blade parameters of the wall polisher are determined.

[0174] The second determining module 302 determines the target polishing control parameters of the wall polisher according to the polishing requirement parameters of all the burst point areas in the following manner:

[0175] For each burst point area, according to the polishing depth of the burst point area, the polishing area range of the burst point area and the inter-saw valley depth of all saw blades, the target parameters of at least one polishing layer corresponding to the burst point area are determined;

[0176] According to the inter-saw spacing between all saw blades, the offset number of the wall surface polisher is determined, and according to the offset number of the wall surface polisher, the polishing number of each polishing layer corresponding to the burst point area is determined;

[0177] According to the target parameters of each polishing layer and the corresponding polishing number, the target polishing control parameters of the wall surface polisher for each polishing layer under each polishing are determined.

[0178] In this optional embodiment, the wall surface polisher comprises at least one saw blade; the saw blade parameters of the wall surface polisher comprise the inter-saw valley depth of all saw blades included in the wall surface polisher and the inter-saw spacing between all saw blades; the target parameters of each polishing layer comprise the polishing depth of the polishing layer and the layer area range of the polishing layer, and the polishing depth of the polishing layer matches the inter-saw valley depth of all saw blades.

[0179] It can be seen that the implementation Figure 8 The automatic control device of the wall surface polisher described can combine the saw blade parameters of the wall surface polisher and the polishing requirement parameters of each burst point area to determine the target polishing control parameters of the wall surface polisher for all polishing layers in each burst point area, which is beneficial to improve the polishing reliability and accuracy of the wall surface polisher for each polishing layer, and further beneficial to improve the polishing accuracy of the wall surface polisher for each burst point area, so as to realize accurate polishing of the target wall surface and reduce the occurrence of unevenness of the target wall surface after polishing.

[0180] In another optional embodiment, the control mode of the control module 303 according to the target polishing control parameters of the wall surface polisher to control the wall surface polisher to perform the target polishing operation on all burst point areas is specifically:

[0181] According to the target polishing control parameters of each polishing layer corresponding to a certain burst point area under each polishing of the wall surface polisher, the wall surface polisher is controlled to perform the target polishing operation on all polishing layers of the burst point area, and after the wall surface polisher performs the target polishing operation on all polishing layers of the burst point area, the starting polishing position of the next burst point area adjacent to the burst point area is determined;

[0182] The wall surface polisher is moved to the starting polishing position of the next burst point area, and according to the target polishing control parameters of each polishing layer corresponding to the next burst point area under each polishing of the wall surface polisher, the wall surface polisher is controlled to perform the target polishing operation on all polishing layers of the next burst point area.

[0183] It can be seen that the implementation Figure 8 The automatic control device of the wall surface polisher described can intelligently perform target polishing operations on each burst point area until all burst point areas are polished, which is beneficial to improve the polishing reliability and accuracy of each burst point area, and further beneficial to improve the polishing reliability and accuracy of the target wall surface, thereby being beneficial to improve the polishing effect of the overall target wall surface.

[0184] In yet another optional embodiment, the first determination module 301 is further configured to:

[0185] After the control module 303 performs the target polishing operation on all burst point areas, the post-polishing conditions of all burst point areas are determined.

[0186] The device further comprises:

[0187] The first determination module 301 is further configured to:

[0188] The first determination module 301 is further configured to, when the first determination module 304 determines that the first transition polishing operation needs to be performed on all burst point areas, determine the transition polishing area corresponding to all burst point areas and the polishing requirement parameters of the transition polishing area according to the post-polishing conditions of all burst point areas; and determine the first transition polishing control parameters of the wall surface polisher according to the polishing requirement parameters of the transition polishing area.

[0189] The control module 303 is further configured to control the wall surface polisher to perform the first transition polishing operation on the transition polishing area according to the first transition polishing control parameters of the wall surface polisher.

[0190] In this optional embodiment, the polishing requirement parameters of the transition polishing area include the transition polishing depth, the transition polishing start position, and the transition polishing end position of the transition polishing area, and the transition polishing area is an adjacent area in the same row or column as all burst point areas.

[0191] It can be seen that the implementation Figure 8 The automatic control device of the wall surface polisher described can determine whether transition polishing needs to be performed on all burst point areas according to the post-polishing conditions of all burst point areas, which realizes an intelligent polishing method of the wall surface polisher, and is beneficial to further improve the polishing accuracy of all burst point areas, and further beneficial to further improve the polishing effect of all burst point areas, thereby realizing smooth transition between the polished burst point areas and adjacent areas.

[0192] In yet another optional embodiment, the control module 303 controls the wall surface polisher to perform the first transition polishing operation on the transition polishing area according to the first transition polishing control parameters of the wall surface polisher, including:

[0193] According to the transition polishing feed speed, the wall surface polisher is controlled to move from the transition polishing starting position, pass through all the burst point areas, and move towards the transition polishing ending position;

[0194] In the process of the wall surface polisher moving towards the transition polishing ending position, the wall surface polisher is controlled to perform the first transition polishing operation on the transition polishing area according to the first transition polishing wall pressing speed and the second transition polishing wall pressing speed.

[0195] In this optional embodiment, the first transition polishing control parameters of the wall surface polisher include the first transition polishing wall pressing speed, the transition polishing feed speed, and the second transition polishing wall pressing speed, the speed directions of the first transition polishing wall pressing speed and the transition polishing feed speed are parallel to the horizontal plane of the target wall surface, and the speed direction of the second transition polishing wall pressing speed is perpendicular to the horizontal plane of the target wall surface.

[0196] It can be seen that the implementation Figure 8 The automatic control device of the wall surface polisher described can perform the first transition polishing operation on the transition polishing area according to the determined first transition polishing control parameters, which can improve the polishing reliability and accuracy of the transition polishing area, and further improve the polishing effect of the area between the transition polishing area and all the burst point areas, so as to better achieve the smooth effect of the target wall surface after polishing.

[0197] In yet another optional embodiment, the device further includes:

[0198] The monitoring module 305 is configured to monitor the spring deformation caused by the floating buffer device of the wall surface polisher to the transition polishing area in the process that the control module 303 controls the wall surface polisher to perform the first transition polishing operation on the transition polishing area;

[0199] The first determining module 301 is further configured to determine a spring deformation value corresponding to the spring deformation;

[0200] The first determining module 301 is further configured to determine a spring deformation value corresponding to the spring deformation;

[0201] The control module 303 is further configured to reduce the first transition polishing wall pressing speed and the second transition polishing wall pressing speed of the wall surface polisher to zero when the first determining module 304 determines that the first spring deformation value is greater than or equal to the preset first spring deformation value;

[0202] The first judgment module 304 is also used to determine whether the spring deformation value is less than or equal to the preset second spring deformation value;

[0203] The control module 303 is also used to reduce the transition grinding feed speed of the wall grinder to zero and perform a return operation on all saw blades when the first judgment module 304 determines that the spring deformation value is less than or equal to the preset second spring deformation value.

[0204] In this optional embodiment, the spring deformation value is less than a preset first spring deformation value before the wall sander passes through all the bursting areas; and the spring deformation value is greater than a preset second spring deformation value before the wall sander reaches the transition sanding termination position.

[0205] It is evident that implementation Figure 9 The automatic control device of the wall sander described herein can intelligently adjust the transition sanding control parameters of the wall sander based on the spring deformation of the floating buffer device of the wall sander. This controls the wall sander to perform the first transition sanding operation on the transition sanding area, which not only improves the reliability and accuracy of sanding control on the transition sanding area, thus improving the sanding effect on the transition sanding area, but also helps to reduce the occurrence of secondary sanding damage to the blown area after sanding.

[0206] In yet another optional embodiment, the device further includes:

[0207] The second judgment module 306 is used to determine whether it is necessary to grind other walls that are in the same continuous area as the target wall and are adjacent to it after the control module 303 has completed the target grinding operation on all the explosion point areas.

[0208] The update module 307 is used to update other walls to the target wall when the judgment result of the second judgment module 306 is yes, and to trigger the first determination module 301 to perform the following operations: determine the wall parameters of the target wall to be sanded and the predicted sanding parameters of the target wall; determine multiple sanding point areas corresponding to the target wall and the sanding requirement parameters of each sanding point area based on the wall parameters of the target wall and the predicted sanding parameters of the target wall; trigger the second determination module 302 to perform the following operations: determine the target sanding control parameters of the wall sander based on the sanding requirement parameters of all sanding point areas; and trigger the control module 303 to perform the following steps: control the wall sander to perform target sanding operation on all sanding point areas based on the target sanding control parameters of the wall sander.

[0209] The first determining module 301 is also used to determine a predetermined secondary grinding area of ​​a preset width that matches the target wall and other walls, and to determine the grinding differences between the target wall and other walls.

[0210] The second judgment module 306 is also used to determine whether a second transitional grinding operation needs to be performed on the designated secondary grinding area;

[0211] The first determining module 301 is also used to determine the grinding requirement parameters of the area to be ground for secondary grinding based on the grinding difference when the judgment result of the second judging module 306 is yes; and to determine the second transition grinding control parameters of the wall sander based on the grinding requirement parameters of the area to be ground for secondary grinding.

[0212] The control module 303 is also used to control the wall sander to perform a second transition sanding operation on the designated secondary sanding area according to the second transition sanding control parameters of the wall sander.

[0213] In this optional embodiment, the grinding requirement parameters for the area to be determined for secondary grinding include the grinding depth of the area to be determined for secondary grinding; the second transition grinding control parameters include the number of transition grindings, and at least one of the following: the saw blade transition grinding speed, the saw blade transition grinding pressure on the wall, the saw blade transition grinding start position, and the saw blade transition grinding end position of the wall grinding machine during each transition grinding.

[0214] It is evident that implementation Figure 9 The automatic control device of the wall sander described can determine whether the interface between the target wall and other walls needs to be sanded again based on the sanding differences between the target wall and other walls. This helps to improve the reliability and accuracy of sanding the designated area for secondary sanding, and thus improves the sanding effect of the interface between the target wall and other walls, thereby achieving a smooth transition between the target wall and other walls.

[0215] Example 4

[0216] Please see Figure 9 , ​ This is a schematic diagram of the structure of an automatic control device for a wall sander disclosed in another embodiment of the present invention. ​ As shown, the automatic control device for the wall sander may include:

[0217] Memory 401 storing executable program code;

[0218] Processor 402 coupled to memory 401;

[0219] The processor 402 calls the executable program code stored in the memory 401 to execute the steps in the automatic control method of the wall sander described in Embodiment 1 or Embodiment 2 of the present invention.

[0220] Example 5

[0221] The embodiment of the present application discloses a computer storage medium, which stores computer instructions, and the computer instructions are used to execute the steps in the automatic control method of the wall surface polisher described in the embodiment one or the embodiment two of the present application.

[0222] Embodiment six

[0223] The embodiment of the present application discloses a computer program product, which comprises a non-transitory computer readable storage medium storing a computer program, and the computer program is operable to make a computer execute the steps in the automatic control method of the wall surface polisher described in the embodiment one or the embodiment two.

[0224] The above described device embodiments are only schematic, wherein the modules described as separate components may or may not be physically separate, and the components shown as modules may or may not be physical modules, i.e., may be located in one place, or may be distributed on multiple network modules. Some or all of the modules can be selected according to actual needs to achieve the purpose of the embodiment scheme. Those skilled in the art can understand and implement without creative labor.

[0225] Through the specific description of the above embodiments, those skilled in the art can clearly understand that each embodiment can be realized by means of software and necessary general hardware platform, and of course can also be realized by hardware. Based on such understanding, the above technical solutions can be embodied in the form of software product, and the computer software product can be stored in a computer readable storage medium, and the storage medium includes read-only memory (ROM), random access memory (RAM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), one-time programmable read-only memory (OTPROM), electrically erasable programmable read-only memory (EEPROM), compact disc read-only memory (CD-ROM) or other optical disk storage, magnetic disk storage, magnetic tape storage, or any other computer readable medium capable of carrying or storing data.

[0226] It should be pointed out finally that the automatic control method and device of the wall polisher disclosed in the embodiments of the present application are only the preferred embodiments of the present application and are used for illustrating the technical solutions of the present application but not for limiting the same. Although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that the technical solutions recorded in the foregoing embodiments can be modified or some technical features thereof can be replaced equivalently, and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An automatic control method for a wall sander, characterized in that, The method includes: Determine the wall parameters of the target wall surface that needs to be sanded and the predicted parameters of the target wall surface after sanding; the wall parameters of the target wall surface include the unevenness of the target wall surface, and the predicted parameters of the target wall surface after sanding include the predicted reference depth of the target wall surface; Based on the wall parameters of the target wall and the predicted parameters of the target wall after sanding, determine multiple areas of the target wall that need to be sanded and the sanding requirements for each area of ​​the target wall; the sanding requirements for each area of ​​the target wall include the sanding depth of the area of ​​the target wall and the sanding area range of the area of ​​the target wall. Determine the saw blade parameters of the wall sander; the wall sander includes at least one saw blade, and the saw blade parameters of the wall sander include the depth of the trough between all the saw blades included in the wall sander and the saw blade spacing between all the saw blades; For each burst point area, the target parameters of at least one grinding layer corresponding to the burst point area are determined based on the grinding depth of the burst point area, the grinding area range of the burst point area, and the inter-saw blade valley depth of all the saw blades. The target parameters of each grinding layer include the grinding depth of the grinding layer and the layer area range of the grinding layer. The grinding depth of the grinding layer matches the inter-saw blade valley depth of all the saw blades. Based on the saw blade spacing between all the saw blades, determine the number of offsets of the wall sander, and based on the number of offsets of the wall sander, determine the number of sanding times for each sanding layer corresponding to the burst point area; Based on the target parameters of each sanding layer and the corresponding number of sanding passes, the target sanding control parameters of the wall sander are determined for each sanding layer in each sanding pass. Based on the target sanding control parameters of the wall sander, the wall sander is controlled to perform target sanding operations on all the burst point areas. The target sanding control parameters of the wall sander include at least one of the following: the saw blade sanding speed of the wall sander, the saw blade pressure on the wall of the wall sander, the starting working position of the wall sander, and the ending working position of the wall sander, which are matched to each burst point area.

2. The automatic control method for the wall sander according to claim 1, characterized in that, The step of controlling the wall sander to perform target sanding operations on all the blemish areas according to the target sanding control parameters of the wall sander includes: Based on the target grinding control parameters of the wall sander for each grinding layer corresponding to a certain explosion point area, the wall sander is controlled to perform target grinding operations on all grinding layers of the explosion point area. After the wall sander has completed the target grinding operations on all grinding layers of the explosion point area, the starting grinding position of the next explosion point area adjacent to the explosion point area is determined. The wall sander is moved to the starting sanding position of the next burst point area, and the wall sander is controlled to perform target sanding operation on all the sanding layers of the next burst point area according to the target sanding control parameters of the wall sander for each sanding layer corresponding to the next burst point area in each sanding.

3. The automatic control method for a wall sander according to claim 1 or 2, characterized in that, The method further includes: After the target polishing operation is completed on all the burst point areas, the polishing status of all the burst point areas is determined, and based on the polishing status of all the burst point areas, it is determined whether a first transition polishing operation needs to be performed on all the burst point areas. When it is determined that a first transitional polishing operation needs to be performed on all the burst point areas, the transitional polishing areas corresponding to all the burst point areas and the polishing requirement parameters of the transitional polishing areas are determined according to the polishing status of all the burst point areas. The polishing requirement parameters of the transitional polishing areas include the transitional polishing depth, the transitional polishing start position, and the transitional polishing end position of the transitional polishing areas. The transitional polishing areas are areas that are in the same row or column as all the burst point areas and are adjacent to each other. Based on the sanding requirement parameters of the transition sanding area, the first transition sanding control parameters of the wall sander are determined, and based on the first transition sanding control parameters of the wall sander, the wall sander is controlled to perform a first transition sanding operation on the transition sanding area.

4. The automatic control method for the wall sander according to claim 3, characterized in that, The first transition grinding control parameters of the wall sander include a first transition grinding wall pressing speed, a transition grinding feed speed, and a second transition grinding wall pressing speed. The speed directions of the first transition grinding wall pressing speed and the transition grinding feed speed are parallel to the horizontal plane of the target wall surface, and the speed direction of the second transition grinding wall pressing speed is perpendicular to the horizontal plane of the target wall surface. The step of controlling the wall sander to perform a first transition sanding operation on the transition sanding area according to the first transition sanding control parameters of the wall sander includes: Based on the transition sanding feed speed, the wall sander is controlled to move from the transition sanding start position, through all the burst point areas, and toward the transition sanding end position; As the wall sander moves toward the transition sanding termination position, the wall sander is controlled to perform a first transition sanding operation on the transition sanding area based on the first transition sanding pressure speed and the second transition sanding pressure speed.

5. The automatic control method for the wall sander according to claim 4, characterized in that, The method further includes: During the process of controlling the wall sander to perform the first transition sanding operation on the transition sanding area, the spring deformation caused by the transition sanding area to the floating buffer device of the wall sander is monitored, and the spring deformation value corresponding to the spring deformation is determined. Determine whether the spring deformation value is greater than or equal to a preset first spring deformation value; before the wall sander passes through all the burst point areas, the spring deformation value is less than the preset first spring deformation value; When it is determined that the first spring deformation value is greater than or equal to the preset first spring deformation value, the first transition grinding wall speed and the second transition grinding wall speed corresponding to the wall sander are reduced to zero. Determine whether the spring deformation value is less than or equal to a preset second spring deformation value; before the wall sander reaches the transition sanding termination position, the spring deformation value is greater than the preset second spring deformation value; When it is determined that the spring deformation value is less than or equal to the preset second spring deformation value, the transition grinding feed speed corresponding to the wall sander is reduced to zero, and a return operation is performed on all the saw blades.

6. The automatic control method for a wall sander according to claim 1 or 2, characterized in that, The method further includes: After completing the target sanding operation on all the aforementioned spot areas, it is determined whether other walls that are in the same continuous area as the target wall and are adjacent to it need to be sanded. If so, the other walls are updated to the target wall, and the following steps are triggered: determining the wall parameters of the target wall that needs to be sanded and the predicted sanding parameters of the target wall; determining multiple spot areas that need to be sanded and the sanding requirement parameters of each spot area corresponding to the target wall based on the wall parameters of the target wall and the predicted sanding parameters of the target wall; determining the target sanding control parameters of the wall sander based on the sanding requirement parameters of all the spot areas; and controlling the wall sander to perform the target sanding operation on all the spot areas based on the target sanding control parameters of the wall sander. Determine a predetermined secondary sanding area of ​​a preset width that matches the target wall and the other walls, and determine the sanding differences between the target wall and the other walls; Based on the differences in polishing, determine whether a second transition polishing operation needs to be performed on the area to be polished a second time. When the judgment result is yes, the grinding requirement parameters of the area to be ground for secondary grinding are determined based on the grinding difference; the grinding requirement parameters of the area to be ground for secondary grinding include the grinding depth of the area to be ground for secondary grinding. Based on the grinding requirement parameters of the area to be determined for secondary grinding, the second transition grinding control parameters of the wall grinding machine are determined; the second transition grinding control parameters include the number of transition grindings, and at least one of the following for each transition grinding: the saw blade transition grinding speed, the saw blade transition grinding pressure on the wall, the saw blade transition grinding start position, and the saw blade transition grinding end position. According to the second transition sanding control parameters of the wall sander, the wall sander is controlled to perform a second transition sanding operation on the area to be sanded.

7. An automatic control device for a wall sander, characterized in that, The apparatus is used to perform the automatic control method for a wall sander as described in any one of claims 1-6, and the apparatus comprises: The first determining module is used to determine the wall parameters of the target wall surface to be sanded and the predicted parameters of the target wall surface after sanding; the wall parameters of the target wall surface include the unevenness of the target wall surface, and the predicted parameters of the target wall surface after sanding include the predicted reference depth of the target wall surface; based on the wall parameters of the target wall surface and the predicted parameters of the target wall surface after sanding, multiple sanding point areas corresponding to the target wall surface and sanding requirement parameters for each sanding point area are determined; the sanding requirement parameters for each sanding point area include the sanding depth of the sanding point area and the sanding area range of the sanding point area. The second determining module is used to determine the target grinding control parameters of the wall sander based on the grinding requirement parameters of all the burst point areas; The control module is used to control the wall sander to perform target sanding operations on all the burst point areas according to the target sanding control parameters of the wall sander; the target sanding control parameters of the wall sander include at least one of the following: the saw blade sanding speed of the wall sander, the saw blade wall pressure of the wall sander, the starting working position of the wall sander, and the ending working position of the wall sander, which are matched to each burst point area.

8. An automatic control device for a wall sander, characterized in that, The device includes: Memory containing executable program code; A processor coupled to the memory; The processor calls the executable program code stored in the memory to execute the automatic control method of the wall sander as described in any one of claims 1-6.

9. A computer storage medium, characterized in that, The computer storage medium stores computer instructions, which, when invoked, are used to execute the automatic control method for the wall sander as described in any one of claims 1-6.

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