Light modulation device and projector

Abstract

A light modulation device and a projector capable of improving cooling efficiency. The light modulation device has a panel main body having a pixel arrangement region in which a plurality of pixels are arranged, a printed board extending from the panel main body, and a vapor chamber having an extension portion connected to the panel main body and extending to the outside of the panel main body, having a hollow space in which a working fluid is enclosed, and changing the working fluid in a liquid phase into a working fluid in a gas phase by evaporation of the working fluid by heat received, and changing the working fluid in the gas phase into a working fluid in the liquid phase by condensation of the working fluid by heat dissipation. The printed board extends in a manner overlapping the extension portion of the vapor chamber.

Description

[0001] This application is a divisional application of the invention patent application filed on March 29, 2022, with application number 202210315919.4 and title "Optical Modulation Device and Projector". Technical Field

[0002] This disclosure relates to optical modulation devices and projectors. Background Technology

[0003] Previously, liquid crystal projectors were known to have a cooling fan that circulates cooling air and a liquid crystal display element that is cooled by the cooling air (for example, see Patent Document 1).

[0004] Furthermore, electronic devices equipped with a cooling system that utilizes a circulating liquid refrigerant to cool a heating element are known (for example, see Patent Document 2). The cooling system described in Patent Document 2 includes: a housing that stores liquid refrigerant; a pump that pumps the liquid refrigerant stored in the housing; a heating section that transfers heat absorbed from the heating element to the liquid refrigerant pumped out; and a heat dissipation section that cools the liquid refrigerant by dissipating the heat transferred to it. The liquid refrigerant cooled by the heat dissipation section is stored in the housing, thereby circulating the liquid refrigerant within the cooling system.

[0005] Patent Document 1: Japanese Patent Application Publication No. 2002-107698

[0006] Patent Document 2: Japanese Patent Application Publication No. 2007-294655

[0007] In recent years, there has been a desire to miniaturize projectors. To address these requirements, the use of miniaturized light modulation devices has been considered to reduce the size of the projection optics, thereby miniaturizing the projector. However, in miniaturized light modulation devices, as the light density increases, the heat density also increases, potentially making it impossible to adequately cool the light modulation device.

[0008] As described in Patent Document 1, when cooling air is used to cool the light modulation device, the airflow needs to be increased to adequately cool the light modulation device. Conversely, using a large cooling fan results in a larger projector size, and driving the cooling fan at high speed increases noise.

[0009] In the cooling system described in Patent Document 2, the need to use large pumps to increase the amount of liquid refrigerant delivered also leads to the problem of increasing the size of the cooling system and consequently the projector.

[0010] Therefore, a light modulation device that can improve cooling efficiency even when miniaturized is desired. Summary of the Invention

[0011] The optical modulation apparatus of the first aspect of this disclosure has a pixel configuration area configured with a plurality of pixels. The optical modulation apparatus includes: a first substrate; a second substrate disposed opposite to the first substrate via a liquid crystal layer; and a cooling member disposed on the opposite side of the first substrate relative to the second substrate and thermally connected to the second substrate. The cooling member has a hollow space enclosed with a working fluid, and cools the liquid crystal layer via the second substrate by changing the liquid phase of the working fluid into a gaseous phase.

[0012] The projector of the second aspect of this disclosure includes: the light modulation device of the first aspect described above, which modulates light emitted from a light source; and the projection optics device, which projects light modulated by the light modulation device.

[0013] The projector of the third aspect of this disclosure includes: a light modulation device of the first aspect described above, which modulates light emitted from a light source; a projection optics device, which projects light modulated by the light modulation device; and a cooling device that allows cooling gas to flow in the cooling member, the cooling device having a first flow section that allows the cooling gas to flow in a first direction from the pixel configuration area toward the first heat dissipation member. Attached Figure Description

[0014] Figure 1 This is a schematic diagram showing the structure of the projector according to the first embodiment.

[0015] Figure 2 This is a perspective view showing the image forming unit of the first embodiment.

[0016] Figure 3 This is an exploded perspective view showing the optical modulation device and holding component of the first embodiment.

[0017] Figure 4 This is an exploded perspective view showing the optical modulation device and holding component of the first embodiment.

[0018] Figure 5 This is a cross-sectional view showing the optical modulation apparatus of the first embodiment.

[0019] Figure 6 This is a perspective view showing the main body of the cooling component according to the first embodiment.

[0020] Figure 7 This is a schematic diagram showing the inner surface of the heated substrate in the first embodiment.

[0021] Figure 8 This is a schematic diagram showing the inner surface of the heat dissipation substrate according to the first embodiment.

[0022] Figure 9 This is a schematic diagram showing other layouts of the plurality of columnar bodies in the first embodiment.

[0023] Figure 10 This is a perspective view showing the first heat dissipation component installed on the main body according to the first embodiment.

[0024] Figure 11 This is a perspective view showing a variation of the first heat dissipation component in the first embodiment.

[0025] Figure 12 This is a perspective view showing a portion of the cooling device according to the first embodiment.

[0026] Figure 13 This is a schematic diagram showing the flow of cooling gas circulating in the optical modulation apparatus of the first embodiment.

[0027] Figure 14 This is a perspective view showing the pipes of the cooling device included in the projector of the second embodiment.

[0028] Figure 15 This is a perspective view showing the pipe and light modulation device of the second embodiment.

[0029] Figure 16 This is a diagram showing the optical modulation apparatus of the second embodiment.

[0030] Figure 17 This is a perspective view showing a variation of the first heat dissipation component in the second embodiment.

[0031] Figure 18 This is a perspective view showing the cooling component and the second dustproof component of the light modulation device of the projector in the third embodiment.

[0032] Figure 19 This is a cross-sectional view showing the cooling component and the second dustproof component of the third embodiment.

[0033] Figure 20 This is a side view showing the light modulation device included in the projector of the fourth embodiment.

[0034] Label Explanation

[0035] 1: Projector; 31: Light source; 37: Projection optical device; 4A, 4B, 4C, 4D: Light modulation device; 41: Panel body; 42: Liquid crystal layer; 43: First substrate; 44: Second substrate; 45: Printed substrate; 451: Driving circuit (circuit element); 46: First dustproof component; 47: Second dustproof component (transparent substrate); 471: End face; 48: Holding housing; 5A, 5B, 5C, 5D: Cooling components; 51A, 51C: Main body; 52: 53: Heat-receiving substrate; 54: Opening; 57: First condensation section; 58 (581, 582, 583, 584): Bending section; 59: Second condensation section; 6A, 6B, 6C, 6D: First heat dissipation component; 6A1, 6B1, 6C2: Fins; 6F: Second heat dissipation component; 7A, 7B: Cooling device; 73: First flow section; 75: Second flow section; AR: Pixel configuration area; MS: Mesh structure; PL: Columnar body; SP: Hollow space. Detailed Implementation

[0036] [First Implementation]

[0037] Hereinafter, the first embodiment of the present disclosure will be described with reference to the accompanying drawings.

[0038] [General Structure of a Projector]

[0039] Figure 1 This is a schematic diagram showing the structure of the projector 1 in this embodiment.

[0040] In this embodiment, the projector 1 modulates light emitted from a light source to form an image corresponding to image information, and then magnifies and projects the formed image onto a projection surface such as a screen. Figure 1 As shown, the projector 1 has an outer casing 2 and an image projection device 3. Furthermore, although not shown in the diagram, the projector 1 includes a cooling device 7A (see reference). Figure 12 The projector 1 is equipped with a cooling device for cooling the object constituting the projector 1, a power supply device for supplying power to the electronic components constituting the projector 1, and a control device for controlling the operation of the projector 1.

[0041] [Structure of the outer casing]

[0042] The outer casing 2 constitutes the outer casing of the projector 1, and internally houses the image projection device 3, the cooling device 7A, the power supply device, and the control device.

[0043] The outer casing 2 has a front portion 21, a back portion 22, a left side portion 23, and a right side portion 24. Although not shown in the figure, the outer casing 2 has a top portion connecting one end of each of the portions 21 to 24 and a bottom portion connecting the other end of each of the portions 21 to 24. The outer casing 2 is formed, for example, in a generally cuboid shape.

[0044] The right side panel 24 has an air inlet 241. The air inlet 241 introduces air from outside the outer housing 2 as cooling gas into the interior of the outer housing 2. A filter may also be provided at the air inlet 241 to capture dust contained in the air passing through the air inlet 241.

[0045] The front portion 21 has a passage 211 located approximately in the center of the front portion 21. Light projected from the projection optical device 37, described later, passes through the passage 211.

[0046] The front part 21 has an exhaust port 212 located on the left side of the front part 21, near the face 23. The exhaust port 212 discharges the cooling gas disposed inside the outer housing 2 to the outside of the outer housing 2.

[0047] [Structure of the image projection device]

[0048] The image projection device 3 forms an image corresponding to the image information input from the control device and projects the formed image. The image projection device 3 includes a light source 31, a homogenization unit 32, a color separation unit 33, a relay unit 34, an image forming unit 35, an optical component housing 36, and a projection optical device 37.

[0049] The light source 31 emits illumination light into the homogenization section 32. For example, the structure of the light source 31 can include a solid-state light source that emits blue light as excitation light, and a wavelength conversion element that converts a portion of the wavelength of the blue light emitted from the solid-state light source into fluorescence containing green and red light. Furthermore, other structures of the light source 31 can include those using a light source lamp such as an ultra-high pressure mercury lamp, as well as structures with solid-state light sources that emit blue, green, and red light respectively.

[0050] The homogenization unit 32 homogenizes the light emitted from the light source 31. The homogenized light passes through the color separation unit 33 and the relay unit 34 to illuminate the modulation area of ​​the light modulation device 4A, which will be described later. The homogenization unit 32 includes two lens arrays 321 and 322, a polarization conversion element 323, and an overlapping lens 324.

[0051] The color separation unit 33 separates the light incident from the homogenization unit 32 into red, green, and blue light. The color separation unit 33 has two dichroic mirrors 331 and 332 and a reflector 333 that reflects the blue light separated by the dichroic mirror 331.

[0052] The relay unit 34 is positioned in the optical path of red light, which has a longer optical path than other colors of light, to suppress the loss of red light. The relay unit 34 includes an incident-side lens 341, a relay lens 343, and reflectors 342 and 344. In this embodiment, it is assumed that the relay unit 34 is positioned in the optical path of red light. However, it is not limited to this; for example, it could be configured such that the color with a longer optical path than other colors of light is blue light, and the relay unit 34 is positioned in the optical path of blue light.

[0053] The image forming unit 35 modulates incident red, green, and blue light, and combines the modulated light to form an image. The image forming unit 35 includes three field lenses 351, three incident-side polarizers 352, and an image forming unit 353A, all configured according to the incident light colors.

[0054] The image forming unit 353A has three light modulation devices 4A, three field-of-view compensation plates 354, three emission-side polarizers 355, and one color synthesis unit 356, which are integrated into one unit.

[0055] The light modulation device 4A modulates the light emitted from the light source 31 according to image information. Specifically, the light modulation device 4A modulates the light emitted from the incident-side polarizer 352 to form an image corresponding to the image information. The light modulation device 4A includes a light modulation device 4AR for modulating red light, a light modulation device 4AG for modulating green light, and a light modulation device 4AB for modulating blue light. The light modulation device 4A is composed of a transmissive liquid crystal panel, and the incident-side polarizer 352, the light modulation device 4A, and the emission-side polarizer 355 constitute a liquid crystal light valve.

[0056] The detailed structure of the optical modulation device 4A will be described in detail later.

[0057] The color combining unit 356 combines the three colors of light modulated by the light modulation devices 4AB, 4AG, and 4AR to form an image, and then projects the image onto the projection optical device 37. In this embodiment, the color combining unit 356 is composed of a cross-shaped dichroic prism that is approximately rectangular in shape. The cross-shaped dichroic prism is, for example, a prism that is approximately rectangular in shape formed by bonding four right-angled triangular prisms together, and two intersecting dielectric multilayer films are provided at the interfaces of the four prisms.

[0058] Figure 2 This is a stereoscopic view representing the image forming unit 353A.

[0059] like Figure 2 As shown, the color combining unit 356 has three incident surfaces 356R, 356G, and 356B, which are opposite to the light modulation devices 4AR, 4AG, and 4AB, and are used to receive light of various colors passing through the light modulation devices 4AR, 4AG, and 4AB, and one exit surface 356S. Blue and red light of the three colors incident on the incident surfaces 356R, 356G, and 356B are reflected towards the projection optics 37 by two dielectric multilayer films, while green light passes through the two dielectric multilayer films towards the projection optics 37. Thus, the three colors are combined to form image light. The formed image light exits from the exit surface 356S and is incident on the projection optics 37.

[0060] In addition to the above-described structure, the image forming unit 353A, such as Figure 2 As shown, it also has 3 retaining components 357.

[0061] The three holding components 357 respectively hold the optical modulation device 4A and the emission-side polarizer 355, and are fixed to the corresponding incident surfaces 356R, 356G, and 356B.

[0062] Figure 3 This is an exploded perspective view of the light modulation device 4A and the holding member 357, viewed from the light incident side. Figure 4 This is an exploded perspective view of the light modulation device 4A and the holding component 357, viewed from the light emission side of the light modulation device 4A.

[0063] The retaining component 357 has a mounting portion 358 and four insertion portions 359.

[0064] The mounting portion 358 is formed in the shape of a rectangular frame and is mounted to the corresponding incident surface by means of adhesive bonding or the like. The mounting portion 358 has an opening portion 3581 and a retaining portion 3582.

[0065] The opening 3581 is rectangular in shape and is located approximately in the center of the mounting portion 358. The opening 3581 allows light passing through the emission-side polarizer 355 to pass toward the color combining portion 356.

[0066] The holding part 3582 holds the emission-side polarizer 355.

[0067] Four insertion parts 359 protrude from the four corner portions of the mounting part 358 toward the light modulation device 4A. After the four insertion parts 359 are inserted into the position adjustment parts 483 of the light modulation device 4A, they are bonded and fixed to the light modulation device 4A by an adhesive such as an ultraviolet-cured adhesive.

[0068] With such a retaining component 357, the light modulation device 4A and the color combining unit 356 are integrated. However, the color combining unit 356 is not limited to a cross-shaped dichroic prism; for example, it may also be composed of multiple dichroic mirrors.

[0069] like Figure 2 As shown, the optical component housing 36 internally houses the aforementioned parts 32-34 and the field lens 351. Furthermore, the image projection device 3 is provided with an illumination optical axis Ax, which serves as the designed optical axis, and the optical component housing 36 holds the parts 32-34 and the field lens 351 at predetermined positions along the illumination optical axis Ax. The light source 31, the image forming unit 353A, and the projection optics 37 are positioned at predetermined positions along the illumination optical axis Ax.

[0070] The projection optical device 37 is a projection lens that magnifies and projects an image incident from the image forming unit 35 onto the projection surface. That is, the projection optical device 37 projects light modulated by the light modulation device 4A. As the projection optical device 37, a lens group having multiple lenses and a cylindrical lens barrel that houses multiple lenses can be exemplified.

[0071] [Structure of an optical modulation device]

[0072] As described above, the light modulation device 4A is a transmissive liquid crystal panel that modulates light incident from the incident polarizer 352, and the holding member 357 is positioned corresponding to each incident surface of the color combining unit 356. Figure 3 and Figure 4 As shown, the light modulation device 4A includes a panel body 41, a printed circuit board 45, a first dustproof component 46, a second dustproof component 47, a holding housing 48, and a cooling component 5A.

[0073] In the following description, the three mutually perpendicular directions are designated as the +X direction, +Y direction, and +Z direction. In this embodiment, the +Z direction is designated as the direction of light travel incident on the light modulation device 4A. The right side of the light modulation device 4A when viewed along the +Z direction with the +Y direction aligned with the top is designated as the +X direction. Although the illustration is omitted, the opposite direction of the +X direction is designated as the -X direction, the opposite direction of the +Y direction is designated as the -Y direction, and the opposite direction of the +Z direction is designated as the -Z direction. That is, the +Z direction relative to the light modulation device 4A is the light emission side relative to the light modulation device 4A, and the -Z direction relative to the light modulation device 4A is the light incident side relative to the light modulation device 4A.

[0074] [Structure of the panel body]

[0075] Figure 5 This is a cross-sectional view showing the optical modulation device 4A.

[0076] The panel body 41 modulates the incident light. For example... Figure 5 As shown, the panel body 41 has a liquid crystal layer 42, a first substrate 43 and a second substrate 44.

[0077] The liquid crystal layer 42 is formed by liquid crystal sealed between the first substrate 43 and the second substrate 44, and modulates the light incident through the first dustproof member 46 according to the voltage applied by the first substrate 43 or the second substrate 44.

[0078] The liquid crystal layer 42 generates heat when light is incident on it. The heat generated by the liquid crystal layer 42 is transferred to the first substrate 43 and the second substrate 44 sandwiching the liquid crystal layer 42.

[0079] The first substrate 43 is disposed relative to the liquid crystal layer 42 in the -Z direction, and the second substrate 44 is disposed relative to the liquid crystal layer 42 in the +Z direction. That is, the second substrate 44 is disposed opposite to the first substrate 43 with respect to the liquid crystal layer 42. In other words, the first substrate 43 is disposed relative to the liquid crystal layer 42 on the light incident side, and the second substrate 44 is disposed relative to the liquid crystal layer 42 on the light emitting side.

[0080] One of the first substrate 43 and the second substrate 44 is a counter substrate with a common electrode, and the other substrate is a component substrate with multiple switching elements such as TFT (Thin Film Transistor). The first substrate 43 and the second substrate 44 are light-transmitting substrates that allow light to pass through.

[0081] The liquid crystal layer 42, the first substrate 43, and the second substrate 44 constitute a pixel configuration area AR in which a plurality of pixels are configured. That is, the light modulation device 4A has a pixel configuration area AR in which a plurality of pixels are configured.

[0082] [Structure of Printed Substrate]

[0083] A printed circuit board 45 extends from the first substrate 43 and the second substrate 44 in the +Y direction and is connected to a control device (not shown). The printed circuit board 45 drives the panel body 41 according to an image signal input from the control device. The printed circuit board 45 has a drive circuit 451 that controls the movement of the panel body 41.

[0084] The driving circuit 451 is a circuit element disposed on the printed circuit board 45. The driving circuit 451 is disposed on the +Z direction surface of the printed circuit board 45. The +Z direction surface of the driving circuit 451 is thermally connected to the heated substrate 52 of the cooling component 5A.

[0085] [Structure of the first and second dustproof components]

[0086] The first dustproof component 46 is disposed on the surface of the first substrate 43 in the -Z direction, on the portion of the first substrate 43 corresponding to the pixel configuration area AR. That is, when the light modulation device 4A is viewed from the -Z direction, the first dustproof component 46 covers the pixel configuration area AR.

[0087] The second dustproof component 47 is disposed on the surface of the second substrate 44 in the +Z direction, on the portion of the second substrate 44 corresponding to the pixel configuration area AR. That is, when the light modulation device 4A is viewed from the +Z direction, the second dustproof component 47 covers the pixel configuration area AR. The second dustproof component 47 is equivalent to the light-transmitting substrate of this disclosure and is fitted into the opening 54 of the cooling component 5A.

[0088] The first dustproof component 46 and the second dustproof component 47 are light-transmitting substrates that are approximately rectangular when viewed from the +Z direction. The first dustproof component 46 and the second dustproof component 47 prevent dust from adhering to the panel body 41 and suppress shadows caused by dust in the light modulated by the panel body 41.

[0089] [Maintain the structure of the casing]

[0090] The retaining housing 48 covers a portion of the panel body 41, the printed circuit board 45, and the first dustproof component 46 in the -Z direction. The retaining housing 48 holds the panel body 41 and the first dustproof component 46 internally by combining with the cooling component 5A. That is, the retaining housing 48 is separate from the main body 51A of the cooling component 5A, which will be described later. Figure 3 As shown, the housing 48, in addition to having an opening 481 and a heat sink 482, has the following features: Figure 3 and Figure 4 As shown, it also has four position adjustment parts 483.

[0091] like Figure 3 As shown, viewed from the -Z direction, the opening 481 is set to be approximately rectangular, corresponding to the pixel configuration area AR. The opening 481 allows light emitted from the incident-side polarizer 352 to pass through and enter the first dustproof component 46.

[0092] Multiple heat sinks 482 are provided such that they protrude from the +Y direction relative to the opening 481 in the -Z direction. The heat sinks 482 dissipate heat transferred from the first substrate 43 and the first dustproof member 46 to the retaining housing 48.

[0093] like Figure 3 and Figure 4As shown, viewed from the -Z direction, four position adjustment parts 483 are provided at the four corners of the holding housing 48. Each position adjustment part 483 is a hole through which a corresponding insertion part 359 is inserted from the +Z direction. Based on the insertion amount of the insertion part 359 relative to each position adjustment part 483, the position of the holding housing 48 relative to the incident surface of the color combining part 356 on which the holding member 357 is mounted is adjusted, thereby adjusting the position of the light modulation device 4A. After the position of the light modulation device 4A is adjusted, as described above, the insertion part 359 and the position adjustment part 483 are fixed with adhesive.

[0094] [Structure of cooling components]

[0095] The cooling component 5A is disposed on the side opposite to the first substrate 43 relative to the second substrate 44, and is thermally connected to the second substrate 44. For example... Figure 5 As shown, the cooling component 5A has a hollow space SP enclosed with working fluid. Heat transferred from the thermally connected heating element causes the liquid-phase working fluid to change into a gaseous phase, thereby cooling the heating element. In this embodiment, the cooling component 5A cools the liquid crystal layer 42 by transferring heat from the liquid crystal layer 42 via the second substrate 44 and the second dustproof component 47, causing the liquid-phase working fluid to change into a gaseous phase. That is, the cooling component 5A cools the liquid crystal layer 42 via the second substrate 44 through the vaporization of the working fluid.

[0096] The cooling component 5A has a main body 51A and a first heat dissipation component 6A.

[0097] [Structure of the main body]

[0098] Figure 6 This is a perspective view of the main body 51A.

[0099] like Figure 6 As shown, the main body 51A has a heat-receiving substrate 52 disposed in the -Z direction and a heat-dissipating substrate 53 disposed in the +Z direction, and is constructed by combining the heat-receiving substrate 52 and the heat-dissipating substrate 53. In this embodiment, the main body 51A is composed of a vapor chamber, and a hollow space SP (see reference) is formed inside the main body 51A to seal in the working fluid. Figure 5 ).

[0100] Figure 7 This is a schematic diagram showing the inner surface of the heated substrate 52 that is opposite to the heat dissipation substrate 53.

[0101] The heated substrate 52 is connected to the second substrate 44, and the heat transferred from the second substrate 44 is used to change the liquid working fluid into a gaseous working fluid.

[0102] Specifically, the heated substrate 52 is formed as a flat plate, and its -Z direction surface is connected to the +Z direction surface of the second substrate 44 via a surface connection. The heated substrate 52 has a mesh structure MS disposed within the hollow space SP. Figure 7 As shown, the mesh structure MS is disposed on the surface of the heated substrate 52 opposite to the heat dissipation substrate 53.

[0103] The liquid working fluid sealed in the depressurized hollow space SP permeates into the mesh structure MS, and the mesh structure MS transports the permeated liquid working fluid to the part of the heated substrate 52 where heat is transferred from the outside.

[0104] The heated substrate 52 utilizes heat transferred from the outside, such as heat from the liquid crystal layer 42 transferred from the second substrate 44 and the second dustproof member 47, to change the liquid working fluid into a gaseous working fluid. That is, the heated substrate 52 uses the transferred heat to evaporate the liquid working fluid. The working fluid that has thus changed into a gaseous phase flows in the flow path formed in the heat dissipation substrate 53.

[0105] Figure 8 This is a schematic diagram showing the inner surface of the heat dissipation substrate 53 opposite to the heat-receiving substrate 52. Figure 8 In the figure, a portion of the columnar bodies PL disposed on the inner surface of the heat dissipation substrate 53 are labeled with numbers.

[0106] The heat dissipation substrate 53 is bonded to the heat-receiving substrate 52 on the side opposite to the second substrate 44, forming a hollow space SP together with the heat-receiving substrate 52. The heat dissipation substrate 53 dissipates heat from the gaseous working fluid, condensing the gaseous working fluid into a liquid working fluid.

[0107] like Figure 6 As shown, the heat dissipation substrate 53 is formed into the same flat plate shape as the heat-receiving substrate 52. Figure 8 As shown, a plurality of columnar bodies PL are provided on the inner surface of the heat dissipation substrate 53 opposite to the heat-receiving substrate 52. That is, the heat dissipation substrate 53 has a plurality of columnar bodies PL disposed within the hollow space SP.

[0108] In addition to ensuring the strength of the main body 51A, the multiple columnar bodies PL also form a flow path for the working fluid in the gas phase generated in the hollow space SP to flow.

[0109] exist Figure 8 In the example shown, multiple columnar bodies PL are arranged not only at predetermined intervals along the +X direction, but also at predetermined intervals along the +Y direction. That is, in Figure 8In the example shown, multiple columnar bodies PL are arranged at the intersection of multiple first imaginary lines Lx, which are equally spaced along the +X direction and in the +Y direction, and multiple second imaginary lines Ly, which are equally spaced along the +Y direction and in the +X direction. However, the arrangement of the multiple columnar bodies PL is not limited to this and other arrangements are also possible.

[0110] Figure 9 This is a schematic diagram showing other layouts of multiple columnar bodies (PL). Figure 9 In this example, only a portion of the columnar columns (PLs) are labeled.

[0111] For example Figure 9 As shown, the plurality of columnar bodies PL are not only positioned at the intersection of the odd-numbered first imaginary line Lx1 among the plurality of first imaginary lines Lx set at equal intervals along the +X direction and in the +Y direction, and the plurality of second imaginary lines Ly set at equal intervals along the +Y direction and in the +X direction, but are also positioned on the even-numbered first imaginary line Lx2 among the plurality of first imaginary lines Lx and between two adjacent second imaginary lines Ly. That is, in Figure 9 In the example shown, the multiple columns PL arranged on the even-numbered first imaginary line Lx2 are offset in the +X or -X direction relative to the multiple columns PL arranged on the odd-numbered first imaginary line Lx1.

[0112] Figure 8 The arrangement of the columnar bodies PL shown can be adopted, for example, when the dimensions in the +Z direction of the main body 51A are relatively large. In such an arrangement, the gap between the columnar bodies PL can be increased, thus ensuring the flow path of the gaseous working fluid.

[0113] Figure 9 The columnar body PL shown can be used, for example, when the dimension in the +Z direction of the main body 51A is relatively small. In such a main body 51A, the dimension in the +Z direction of the hollow space SP containing the working fluid is also reduced. Therefore, by adopting... Figure 9 The arrangement of the columnar body PL shown can improve the strength against impacts along the +Z or -Z direction relative to the main body 51A, and can ensure the flow path of the working fluid in the gas phase.

[0114] like Figure 6 As shown, the main body 51A has an opening 54, a sealing part 55, a protective part 56, and a first condensation part 57.

[0115] The opening 54 is a generally rectangular opening that extends through the main body 51A along the +Z direction. A second dustproof component 47 is fitted inside the opening 54. That is, the inner edge of the opening 54 is thermally connected to the side surface of the second dustproof component 47. The side surface of the second dustproof component 47 refers to the end surface of the outer surface of the second dustproof component 47, excluding the surface in the -Z direction (which serves as the light incident surface) and the surface in the +Z direction (which serves as the light emitting surface).

[0116] In this embodiment, the inner edge of the opening 54 is formed by the joint between the heat-receiving substrate 52 and the heat-dissipating substrate 53. Therefore, heat transferred from the liquid crystal layer 42 to the second dustproof member 47 via the second substrate 44 is transferred from the end face 471 of the second dustproof member 47 to the heat-receiving substrate 52. As a result, a portion of the liquid working fluid sealed within the hollow space SP is converted into a gaseous working fluid, and the heat transferred to the heat-receiving substrate 52 is consumed.

[0117] The sealing section 55 is provided at the end of the main body section 51A in the +Y direction. The sealing section 55 is a part for injecting working fluid into the hollow space SP of the main body section 51A. The sealing section 55 is sealed after the working fluid is injected into the hollow space SP.

[0118] The protective portion 56 is positioned to sandwich the sealing portion 55 in the +X direction. The end of the protective portion 56 in the +Y direction is positioned further in the +Y direction than the end of the sealing portion 55 in the +Y direction. Therefore, even if some impact is applied to the main body portion 51A from the +Y direction, the sealing portion 55 can be protected by the protective portion 56.

[0119] The first condenser 57 dissipates heat from the gaseous working fluid flowing within the hollow space SP, thereby condensing the gaseous working fluid into a liquid working fluid. The first condenser 57 is disposed on the heat dissipation substrate 53, between the opening 54 and the sealing portion 55. A first heat dissipation component 6A (see reference) is provided on the outer surface of the heat dissipation substrate 53 in the +Z direction corresponding to the first condenser 57. Figure 4 ).

[0120] The first heat dissipation member 6A dissipates heat transferred from the gaseous working fluid. The first condensation section 57, by providing the first heat dissipation member 6A, easily dissipates heat transferred from the gaseous working fluid to the outside of the cooling member 5A. In other words, the first condensation section 57 is a portion of the heat dissipation substrate 53 that receives heat from the gaseous working fluid, causing the gaseous working fluid to change into a liquid working fluid, and easily dissipates the received heat to the outside of the cooling member 5A. Therefore, in the cooling member 5A, the portion where the first heat dissipation member 6A is provided constitutes the first condensation section 57.

[0121] [Structure of the first heat dissipation component]

[0122] Figure 10 This is a perspective view showing the first heat dissipation component 6A installed on the main body 51A.

[0123] The first heat dissipation member 6A is provided on the outer surface of the heat dissipation substrate 53 in the +Z direction at a portion corresponding to the first condensation portion 57. That is, the first heat dissipation member 6A is provided on the outer surface of the heat dissipation substrate 53 corresponding to the first condensation portion 57. The first heat dissipation member 6A has a plurality of fins 6A1 for dissipating heat transferred from the first condensation portion 57.

[0124] In this embodiment, in order to facilitate the transfer of heat to the cooling gas flowing from the -Y direction along the +Y direction by the cooling fan 71 of the cooling device 7A described later, a plurality of fins 6A1 are provided with internal flow paths for the cooling gas to flow along the +Y direction.

[0125] Specifically, each fin 6A1 is a cylindrical body with no side in the shape of a generally square cylinder, and the cross-sectional shape of the fin 6A1 perpendicular to the extension direction of the fin 6A1 is generally U-shaped. The first heat dissipation component 6A is constituted by multiple fins 6A1 extending along the +Y direction and connected along the +X direction.

[0126] Figure 11 This is a perspective view of the first heat dissipation component 6B, which is a variation of the first heat dissipation component 6A.

[0127] Furthermore, the heat sink mounted on the heat sink substrate 53 is not limited to the first heat sink 6A. For example, it can be replaced by... Figure 11 The first heat dissipation component 6B is shown.

[0128] The first heat dissipation component 6B has a structure in which a plurality of fins 6B1 are arranged in the +Y direction along the +X direction. That is, the first heat dissipation component 6B has a plurality of fins 6B1 arranged along the +X direction and in the +Y direction.

[0129] The fin 6B1 has a plurality of protrusions 6B2 arranged at equal intervals in the +X direction, and a flat plate portion 6B3 disposed between one of the plurality of protrusions 6B2 and the protrusions 6B2 adjacent to that one protrusion 6B2.

[0130] The protrusion 6B2 is a roughly U-shaped section that protrudes in the +Z direction. Cooling gas can flow inside the protrusion 6B2.

[0131] The flat plate 6B3 is a portion along the XY plane that connects the ends of two adjacent protrusions 6B2 in the -Z direction in the +X direction.

[0132] In the first heat dissipation component 6B, the odd-numbered fins 6B11 and even-numbered fins 6B12 are staggered and connected to each other in the +X direction, facing the +Y direction. That is, when viewed from the +Y or -Y direction, the protrusions 6B2 of the odd-numbered fins 6B11 and even-numbered fins 6B12 do not completely overlap. Similarly, when viewed from the +Y or -Y direction, the flat plate portion 6B3 of the odd-numbered fins 6B11 and even-numbered fins 6B12 do not completely overlap. In other words, when viewed from the +Y or -Y direction, the protrusions 6B2 of the odd-numbered fins 6B11 are arranged to span across the protrusions 6B2 and flat plate portions 6B3 of the even-numbered fins 6B12. Similarly, when viewed from the +Y or -Y direction, the protrusion 6B2 of the even-numbered fin 6B12 is arranged to span the protrusion 6B2 and the flat plate 6B3 of the odd-numbered fin 6B11.

[0133] Therefore, a portion of the cooling gas flowing relative to the first heat dissipation component 6B in the +Y direction flows in the protrusions 6B2 of the odd-numbered fins 6B11, the protrusions 6B2 of the even-numbered fins 6B12, and the flat plate portion 6B3. Additionally, the remaining portion of the cooling gas flowing relative to the first heat dissipation component 6B in the +Y direction flows in the flat plate portion 6B3 of the odd-numbered fins 6B11, the protrusions 6B2 of the even-numbered fins 6B12, and the flat plate portion 6B3.

[0134] The first heat dissipation component 6B has a relatively large surface area in contact with the cooling gas. Therefore, the heat dissipation efficiency relative to the cooling gas, i.e., the heat transfer efficiency relative to the cooling gas, can be improved from the first condenser 57. As a result, the cooling efficiency of the liquid crystal layer 42 can be improved.

[0135] [Structure of the cooling device]

[0136] Figure 12 This is a perspective view showing a part of the cooling device 7A.

[0137] As described above, the cooling device 7A is disposed inside the outer casing 2, allowing cooling gas introduced from outside the outer casing 2 into the interior of the outer casing 2 to flow to the object being cooled, thereby cooling the object. In this embodiment, the cooling device 7A uses the optical modulation device 4A as one of the objects being cooled, and allows cooling gas to flow through the cooling component 5A to cool the optical modulation device 4A.

[0138] like Figure 12 As shown, the cooling device 7A has a cooling fan 71 and a pipe 72.

[0139] The cooling fan 71 circulates the cooling gas introduced into the outer housing 2 within the optical modulation device 4A. Specifically, the cooling fan 71 draws in cooling gas and sends it through the pipe 72, allowing the cooling gas to circulate within the optical modulation device 4A. In this embodiment, the cooling fan 71 is a centrifugal fan, but it could also be an axial fan.

[0140] The conduit 72 is connected to the cooling fan 71, allowing cooling gas from the cooling fan 71 to flow through the optical modulation device 4A. In this embodiment, the conduit 72 splits the cooling gas from the cooling fan 71, allowing the split cooling gas to flow through the optical modulation devices 4AR, 4AG, and 4AB respectively. The conduit 72 of the cooling device 7A has three first flow sections 73 that allow the cooling gas to flow separately through the three optical modulation devices 4A.

[0141] Three first flow sections 73 are disposed within the conduit 72 and open in the -Y direction relative to the corresponding optical modulation device 4A. Each first flow section 73 allows cooling gas delivered by the cooling fan 71 to flow in the +Y direction relative to the corresponding optical modulation device 4A. The +Y direction is the direction from the pixel configuration area AR toward the first heat dissipation component 6A, which corresponds to the first direction. The three first flow sections 73 include: a first flow section 73R, which allows cooling gas to flow in the optical modulation device 4AR; a first flow section 73G, which allows cooling gas to flow in the optical modulation device 4AG; and a first flow section 73B, which allows cooling gas to flow in the optical modulation device 4AB.

[0142] [The flow of cooling gas circulating in the optical modulation device]

[0143] Figure 13 This is a schematic diagram showing the flow of cooling gas in the optical modulation device 4A.

[0144] like Figure 13 As shown, the cooling gas supplied from the first flow section 73 is split at the end of the optical modulation device 4A in the -Y direction into cooling gas A1 flowing in the -Z direction relative to the optical modulation device 4A and cooling gas A3 flowing in the +Z direction relative to the optical modulation device 4A. That is, cooling gas A1 flows along the surface 48A in the -Z direction of the holding housing 48, and cooling gas A3 flows along the surface in the +Z direction of the heat dissipation substrate 53 of the cooling member 5A.

[0145] As the cooling gas A1 flows along the surface 48A of the retaining housing 48 in the +Y direction, it cools the first dustproof member 46 and the retaining housing 48, which are disposed corresponding to the pixel configuration area AR. That is, the heat generated in the liquid crystal layer 42, which is transferred to the first dustproof member 46 and the retaining housing 48 via the first substrate 43, is transferred to the cooling gas A1. As a result, a portion of the heat generated in the liquid crystal layer 42 is dissipated.

[0146] The cooling gas A2, after cooling the first dustproof component 46, flows further along the surface 48A of the retaining housing 48 in the +Y direction, cooling the heat sink 482 of the retaining housing 48. As a result, the heat transferred to the liquid crystal layer 42 of the retaining housing 48 is further cooled.

[0147] Cooling gas A3 flows in the +Y direction and into the second dustproof component 47, cooling the second dustproof component 47 which is disposed corresponding to the pixel configuration area AR. Since the heat of the liquid crystal layer 42 is transferred to the second dustproof component 47 via the second substrate 44, the cooling gas A3 flows in the second dustproof component 47, thereby dissipating a portion of the heat of the liquid crystal layer 42.

[0148] Cooling gas A4, after cooling the second dustproof component 47, flows along the heat dissipation substrate 53 in the +Y direction, passing through the flow paths within each fin 6A1 of the first heat dissipation component 6A. Each fin 6A1 transfers heat received from the gaseous working fluid by the first condenser 57 to the cooling gas A4. The heat transferred to the working fluid in the heated substrate 52 originates from the heat of the liquid crystal layer 42. Therefore, the heat transferred to each fin 6A1 is transferred to the cooling gas A4, thereby dissipating a portion of the heat from the liquid crystal layer 42.

[0149] In the optical modulation apparatus 4A, a first condensation section 57, which condenses the gaseous working fluid into a liquid working fluid, is provided at a position in the +Y direction relative to the connection portion of the heated substrate 52 that is connected to the second substrate 44 and the connection portion that is connected to the second dustproof member 47. In other words, the first condensation section 57 is provided in the +Y direction relative to the opening 54.

[0150] Therefore, when the +Y direction represents the direction upwards in the vertical direction of the light modulation device 4A, the working fluid condensed from the first condenser 57 can be easily transported to the connection portion connected to the second substrate 44 and the connection portion connected to the second dustproof member 47 in the heated substrate 52, utilizing not only the capillary force generated by the mesh structure MS but also gravity. Thus, the heat transferred from the liquid crystal layer 42 through the second substrate 44 and the second dustproof member 47 promotes the phase change of the working fluid from liquid to gas phase in the heated substrate 52. That is, the heat dissipation efficiency of the liquid crystal layer 42 can be improved, thereby improving the cooling efficiency of the liquid crystal layer 42.

[0151] [Effects of the first embodiment]

[0152] The projector 1 of this embodiment described above has the following effects.

[0153] The projector 1 has: a light source 31; a light modulation device 4A that modulates the light emitted from the light source 31; and a projection optics 37 that projects the light modulated by the light modulation device 4A.

[0154] The light modulation device 4A has a pixel configuration area AR in which multiple pixels are configured. The light modulation device 4A has a liquid crystal layer 42, a first substrate 43, a second substrate 44, and a cooling component 5A.

[0155] The second substrate 44 is positioned opposite the first substrate 43 across the liquid crystal layer 42.

[0156] The cooling component 5A is disposed on the side opposite to the first substrate 43 relative to the second substrate 44 and is thermally connected to the second substrate 44. The cooling component 5A has a hollow space SP enclosed with working fluid, and cools the liquid crystal layer 42 by changing the liquid phase working fluid into a gas phase working fluid.

[0157] According to this structure, the heat of the liquid crystal layer 42 is transferred to the second substrate 44, and thus the heat of the liquid crystal layer 42 is transferred to the cooling member 5A via the second substrate 44. The cooling member 5A uses the transferred heat to change the liquid-phase working fluid sealed in the hollow space SP into a gas-phase working fluid, consuming the heat of the liquid crystal layer 42 and thereby cooling the liquid crystal layer 42. Therefore, the heat of the liquid crystal layer 42 transferred to the cooling member 5A can be consumed efficiently, thus achieving efficient cooling of the liquid crystal layer 42. Therefore, even if the pixel configuration area AR of the light modulation device 4A is small, the cooling efficiency of the liquid crystal layer 42 can be improved. Furthermore, this not only increases the amount of light incident on the light modulation device 4A, but also extends the lifespan of the light modulation device 4A.

[0158] Furthermore, since the cooling efficiency of the light modulation device 4A can be improved, the flow rate of cooling gas circulating in the light modulation device 4A via the cooling fan 71 of the cooling device 7A can be reduced. Therefore, even if a small fan is used for the cooling fan 71, a sufficient flow rate of cooling gas for cooling the light modulation device 4A can be ensured, thus enabling miniaturization of the projector 1. On the other hand, if a large fan is used for the cooling fan 71, the rotational speed of the cooling fan 71 per unit time can be reduced, thus reducing the noise of the projector 1.

[0159] Furthermore, since the cooling efficiency of the light modulation device 4A can be improved, the light modulation device 4A can be miniaturized. Therefore, a small projection optical device 37 can be used in the projector 1, thereby enabling the miniaturization of the projector 1.

[0160] In the optical modulation apparatus 4A, the cooling component 5A includes a heat-receiving substrate 52 and a heat-dissipating substrate 53. The heat-receiving substrate 52 is connected to a second substrate 44, and the heat transferred from the second substrate 44 changes the liquid working fluid into a gaseous working fluid. The heat-dissipating substrate 53 is bonded to the heat-receiving substrate 52 on the side opposite to the second substrate 44, forming a hollow space SP together with the heat-receiving substrate 52. The heat-dissipating substrate 53 dissipates heat from the gaseous working fluid, condensing the gaseous working fluid into a liquid working fluid.

[0161] With this structure, the cooling component 5A can be configured as a vapor chamber. Furthermore, by connecting the heated substrate 52 to the second substrate 44, the transferred heat can efficiently transform the liquid working fluid into a gaseous working fluid. Additionally, by positioning the heat dissipation substrate 53 opposite to the heated substrate 52 on the side opposite to the second substrate 44, heat dissipation from the gaseous working fluid can be efficiently achieved, and the gaseous working fluid can be efficiently condensed into a liquid working fluid. Therefore, the heat transferred to the cooling component 5A from the liquid crystal layer 42 can be efficiently dissipated, improving the cooling efficiency of the liquid crystal layer 42.

[0162] The light modulation device 4A has a second dustproof member 47 disposed on the second substrate 44 in a portion corresponding to the pixel configuration area AR. The second dustproof member 47 corresponds to the light-transmitting substrate of this disclosure. The cooling member 5A has an opening 54 for fitting the second dustproof member 47. The inner edge of the opening 54 is thermally connected to the end face 471 of the second dustproof member 47.

[0163] With this structure, the light modulation device 4A can be configured as a transmissive light modulation device that allows light to pass through the pixel configuration area AR. Furthermore, the inner surface of the light-passing opening 54 in the cooling member 5A is thermally connected to the end face 471 of the second dustproof member 47, which is disposed on the second substrate 44 corresponding to the pixel configuration area AR. Therefore, the heat transferred from the liquid crystal layer 42 to the second substrate 44 is not only directly transferred from the second substrate 44 to the cooling member 5A, but also transferred from the second substrate 44 via the second dustproof member 47. Thus, the heat transfer path from the liquid crystal layer 42 to the cooling member 5A can be increased, and therefore, even when the cooling member 5A has the opening 54, the heat from the liquid crystal layer 42 can be efficiently transferred to the cooling member 5A. Therefore, the cooling efficiency of the liquid crystal layer 42 can be improved.

[0164] In the optical modulation device 4A, the heated substrate 52 has a mesh structure MS disposed within the hollow space SP, into which a liquid working fluid permeates. The heat dissipation substrate 53 has multiple columnar bodies PL disposed within the hollow space SP, forming a flow path for the gaseous working fluid to circulate.

[0165] With this structure, the liquid working fluid can be easily held in the heated substrate 52, and the heat transferred to the heated substrate 52 can easily convert the liquid working fluid into a gaseous working fluid. Furthermore, since the heat dissipation substrate 53 has multiple columnar bodies PL, in addition to improving the strength of the cooling component 5A, the gaseous working fluid can easily flow through the portion where it changes from gaseous to liquid phase. Therefore, the phase change of the working fluid within the cooling component 5A can be promoted, and the cooling efficiency of the liquid crystal layer 42 can be improved.

[0166] The optical modulation device 4A includes: a printed circuit board 45 extending from a first substrate 43 and a second substrate 44; and a driving circuit 451 disposed on the printed circuit board 45. The driving circuit 451 corresponds to the circuit element of this disclosure. The driving circuit 451 is thermally connected to a heated substrate 52.

[0167] With this structure, the heat generated by the drive circuit 451 can be transferred to the heated substrate 52, and thus the drive circuit 451 can be cooled by the cooling component 5A. Therefore, there is no need to provide a separate structure for cooling the drive circuit 451, thereby reducing the structural complexity of the optical modulation device 4A.

[0168] In the optical modulation device 4A, the cooling component 5A has a first condensation section 57 and a first heat dissipation component 6A. The first condensation section 57 is provided on the heat dissipation substrate 53 and condenses the gaseous working fluid flowing in the hollow space SP into a liquid working fluid. The first heat dissipation component 6A is provided on the outer surface of the heat dissipation substrate 53 corresponding to the first condensation section 57. The first heat dissipation component 6A dissipates heat transferred from the gaseous working fluid.

[0169] According to this structure, the first heat dissipation component 6A dissipates heat transferred from the gaseous working fluid. This promotes the condensation of the gaseous working fluid into the liquid working fluid in the first condensation section 57, and further promotes the change from the liquid working fluid to the gaseous working fluid caused by the heat transferred from the liquid crystal layer 42. Therefore, the heat dissipation efficiency of the liquid crystal layer 42 can be improved, thereby increasing the cooling efficiency of the liquid crystal layer 42.

[0170] The light modulation device 4A has a holding housing 48 that is combined with the cooling component 5A to hold the liquid crystal layer 42, the first substrate 43, and the second substrate 44 inside. The holding housing 48 has a position adjustment part 483 for adjusting the position of the holding housing 48.

[0171] With this structure, heat transferred from the liquid crystal layer 42 can be dissipated by maintaining the housing 48. This increases the heat dissipation area of ​​the liquid crystal layer 42.

[0172] Furthermore, since the retaining housing 48 has a position adjustment section 483, it is not necessary to provide the same position adjustment section on the cooling component 5A that is combined with the retaining housing 48. As a result, the load applied to the cooling component 5A can be suppressed, thus enabling the cooling component 5A to function stably.

[0173] In addition to the light source 31, the light modulation device 4A, and the projection optics 37, the projector 1 also has a cooling device 7A that allows cooling gas to flow through the cooling component 5A. The cooling device 7A has a first flow section 73 that allows cooling gas to flow in the +Y direction from the pixel configuration area AR toward the first heat dissipation component 6A. The +Y direction corresponds to the first direction.

[0174] According to this structure, the second dustproof member 47 and the first heat dissipation member 6A are cooled by cooling gas flowing in the +Y direction through the cooling device 7A. That is, the pixel configuration area AR, where the second dustproof member 47 is disposed, and the first heat dissipation member 6A can be cooled by the cooling gas flowing in the +Y direction. Since the pixel configuration area AR is positioned upstream of the first heat dissipation member 6A in the cooling gas flow path, compared to the case where the pixel configuration area AR is positioned downstream of the first heat dissipation member 6A, the cooler cooling gas can flow to the second dustproof member 47 corresponding to the pixel configuration area AR. Therefore, the cooling efficiency of the pixel configuration area AR can be improved, thereby improving the cooling efficiency of the liquid crystal layer 42.

[0175] [Second Implementation]

[0176] Next, the second embodiment of this disclosure will be described.

[0177] The projector of this embodiment has the same structure as the projector 1 of the first embodiment. However, the projector of this embodiment differs from the projector 1 of the first embodiment in that the structure of the pipes in the cooling device differs from the structure of the heat sink provided on the cooling component. Furthermore, in the following description, parts that are the same as or substantially the same as those already described will be marked with the same reference numerals and their descriptions will be omitted.

[0178] [General Structure of a Projector]

[0179] Figure 14 This is a perspective view showing the pipes 74 of the cooling device 7B in the projector of this embodiment.

[0180] The projector in this embodiment, in addition to replacing the image forming unit 353A and cooling device 7A of the first embodiment, has Figure 14 Apart from the image forming unit 353B and the cooling device 7B shown, it has the same structure and function as the projector 1 of the first embodiment. The image forming unit 353B has the same structure and function as the image forming unit 353A, except that it has three light modulation devices 4B instead of three light modulation devices 4A.

[0181] Similar to the light modulation device 4A in the first embodiment, the light modulation device 4B modulates the light emitted from the light source 31 according to image information, and is composed of a transmissive liquid crystal panel. The light modulation device 4B includes a light modulation device 4BR for modulating red light, a light modulation device 4BG for modulating green light, and a light modulation device 4BB for modulating blue light.

[0182] The structure of the optical modulation device 4B will be described in detail later.

[0183] [Structure of the cooling device]

[0184] Similar to the cooling device 7A in the first embodiment, the cooling device 7B circulates cooling gas introduced into the interior of the outer casing 2 through the object being cooled, thereby cooling the object. Specifically, the cooling device 7B cools the optical modulation device 4B. The cooling device 7B has the same structure and function as the cooling device 7A in the first embodiment, except that it has a pipe 74 instead of the pipe 72 in the first embodiment. That is, as... Figure 14 As shown, the cooling device 7B has a cooling fan 71 and a pipe 74.

[0185] Figure 15 This is a perspective view of the pipe 74 and the optical modulation device 4BG from the light incident side.

[0186] Similar to pipe 72 in the first embodiment, pipe 74 diverts the cooling gas delivered from cooling fan 71, allowing it to circulate through the three optical modulation devices 4B. For example... Figure 14 and Figure 15 As shown, in addition to having three first flow sections 73, the pipe 74 of the cooling device 7B also has a second flow section 75.

[0187] Additionally, the three first circulation sections 73 include: a first circulation section 73R, which allows cooling gas to circulate in the optical modulation device 4BR; a first circulation section 73G, which allows cooling gas to circulate in the optical modulation device 4BG; and a first circulation section 73B, which allows cooling gas to circulate in the optical modulation device 4BB.

[0188] The second flow section 75 extends in the +Y direction from a position near the first flow sections 73G and 73R. The second flow section 75 allows a portion of the cooling gas diverted within the pipe 74 to flow through the first heat dissipation component 6C of the cooling component 5B of the optical modulation device 4BG.

[0189] like Figure 15 As shown, the second flow section 75 has a discharge port 751 at its end in the +Y direction. The discharge port 751 discharges cooling gas flowing within the second flow section 75 in a direction perpendicular to the upright direction of the second flow section 75, i.e., the +Y direction. That is, the discharge port 751 discharges cooling gas in a direction perpendicular to the flow direction of the cooling gas flowing from the first flow section 73 to the +Y direction. Specifically, the second flow section 75 allows cooling gas to flow in the first heat dissipation member 6C in the +X direction, which intersects the +Y direction (which is the first direction). More specifically, the discharge port 751 discharges cooling gas into the first heat dissipation member 6C in the +X direction relative to the optical modulation device 4BG.

[0190] [Structure of an optical modulation device]

[0191] Figure 16 This is a diagram showing the optical modulation device 4BG viewed from the +Z direction. In other words, Figure 16 This is a diagram showing the flow of cooling gas in the first heat dissipation component 6C of the optical modulation device 4BG. Furthermore, in Figure 16 In the text, a portion of the 6C2 fins are labeled with numbers.

[0192] like Figure 16 As shown, the optical modulation device 4B has the same structure and function as the optical modulation device 4A of the first embodiment, except that it has a cooling component 5B instead of the cooling component 5A of the first embodiment. The cooling component 5B has the same structure and function as the cooling component 5A of the first embodiment, except that it has a first heat dissipation component 6C instead of the first heat dissipation components 6A and 6B of the first embodiment.

[0193] The first heat dissipation component 6C, like the first heat dissipation components 6A and 6B, is disposed on the heat dissipation substrate 53 corresponding to the first condensation section 57, and transfers the heat of the working fluid in the gas phase transmitted from the first condensation section 57 to the cooling gas.

[0194] The first heat dissipation component 6C has a heat-receiving plate 6C1 and multiple fins 6C2.

[0195] The heat-receiving plate 6C1 is disposed on the surface of the heat dissipation substrate 53 in the +Z direction, on the portion of the heat dissipation substrate 53 corresponding to the first condensation portion 57, and is thermally connected to the first condensation portion 57.

[0196] Multiple fins 6C2 protrude cylindrically from the heat-receiving plate 6C1 in the +Z direction. The multiple fins 6C2 are arranged at equal intervals along the +X and +Y directions. Between the multiple fins 6C2, in addition to a first flow path allowing cooling gas to flow along the +Y direction, a second flow path allowing cooling gas to flow along the +X direction is also provided. That is, the first heat dissipation component 6C has multiple fins 6C2 that allow cooling gas to flow along both the +Y and +X directions.

[0197] [The flow of cooling gas circulating in the optical modulation device]

[0198] Similar to the light modulation apparatus 4A in the first embodiment, a portion of the cooling gas flowing from the first flow section 73 in the +Y direction flows in the space in the -Z direction relative to the light modulation apparatus 4B, cooling the first dustproof component 46 and the holding housing 48. As a result, a portion of the heat from the liquid crystal layer 42 is cooled.

[0199] Other cooling gas flowing from the first flow section 73 in the +Y direction flows in the space in the +Z direction relative to the optical modulation device 4B, and flows along the heat dissipation substrate 53 and the second dustproof component 47 to cool the heat dissipation substrate 53 and the second dustproof component 47.

[0200] Gas A4, after cooling the second dustproof component 47, flows in the +Y direction within the first heat dissipation component 6C, which is positioned relative to the second dustproof component 47 in the +Y direction. That is, cooling gas A4 flows in the +Y direction between the plurality of fins 6C2.

[0201] Furthermore, from the outlet 751 of the second circulation section 75 (see reference) Figure 15 Cooling gas A5 flows in the +X direction in the first heat dissipation component 6C. That is, cooling gas A5 flows in the +X direction between multiple fins 6C2.

[0202] Therefore, in the first heat dissipation component 6C, the cooling gas A4 flowing in the +Y direction collides with the cooling gas A5 flowing in the +X direction, thereby generating turbulence. This turbulence efficiently contacts the multiple fins 6C2. As a result, through each fin 6C2, the heat transferred to the first heat dissipation component 6C can be efficiently transferred to the cooling gas, thus enabling efficient dissipation of a portion of the heat generated in the liquid crystal layer 42.

[0203] [Other structures of the heatsink]

[0204] Figure 17 This is a perspective view showing a variation of the first heat dissipation component 6D, which is the first heat dissipation component 6C. In other words, Figure 17This is a perspective view showing a variation of the first heat dissipation member 6B, namely the first heat dissipation member 6D, according to the first embodiment. Furthermore, in Figure 17 In the text, a portion of the protrusion 6B2, a portion of the flat plate 6B3, and a portion of the through hole 6D1 are marked with labels.

[0205] The heat sink, in which cooling gas flows between multiple fins in two mutually perpendicular directions, is not limited to the first heat sink 6C. For example, it can be replaced by... Figure 17 The first heat dissipation component 6D is shown.

[0206] The first heat dissipation component 6D, like the first heat dissipation component 6B of the first embodiment, has a structure in which multiple fins 6B1 arranged in the +Y direction are arranged along the +X direction. However, unlike the first heat dissipation component 6B of the first embodiment, the first heat dissipation component 6D is provided with multiple through holes 6D1 that penetrate the protrusions 6B2 of each fin 6B1 in the +X direction. Therefore, the first heat dissipation component 6D has a first flow path through which the protrusions 6B2 of each fin 6B1 and the flat plate portion 6B3 flow in the +Y direction, and a second flow path through which the through holes 6D1 flow in the +X direction.

[0207] In this first heat dissipation component 6D, cooling gas A4 can also flow in the +Y direction, and cooling gas A5 can also flow in the +X direction. Therefore, cooling gas A4 and cooling gas A5 collide in the first heat dissipation component 6D, thereby generating turbulence. As a result, the heat transferred to the first heat dissipation component 6D can be efficiently transferred to the cooling gas through each fin 6B1, thus efficiently dissipating a portion of the heat generated in the liquid crystal layer 42.

[0208] Furthermore, the through-hole 6D1 in the +X direction of the two through-holes 6D1 formed in the protrusion 6B2 is positioned closer to the +Z direction than the through-hole 6D1 in the -X direction. Therefore, the cooling gas A5 flowing through the through-hole 6D1 in the -X direction of the protrusion 6B2 easily comes into contact with the wall in the +X direction of the protrusion 6B2. The cooling gas A5 flowing through the through-hole 6D1 in the +X direction of the protrusion 6B2 easily comes into contact with the wall in the -X direction of the adjacent protrusion 6B2 in the +X direction. This improves the heat transfer efficiency from the protrusion 6B2 to the cooling gas A5, i.e., the heat dissipation efficiency of the protrusion 6B2.

[0209] [Effects of the second implementation method]

[0210] In addition to having the same effect as the projector 1 of the first embodiment, the projector described above also has the following effects.

[0211] In the projector of the second embodiment, the cooling device 7B has a second flow section 75 through which cooling gas flows along the +X direction, which intersects the +Y direction. The +Y direction corresponds to the first direction, and the +X direction corresponds to the second direction.

[0212] According to this structure, in the first heat dissipation member 6C, the cooling gas flowing in the +Y direction can collide with the cooling gas flowing in the +X direction. This generates turbulence in the cooling gas within the first heat dissipation member 6C, thus facilitating its cooling. Therefore, the heat dissipation efficiency of the liquid crystal layer 42 can be improved, and the cooling efficiency of the liquid crystal layer 42 can be enhanced. The same applies when a first heat dissipation member 6D is used instead of the first heat dissipation member 6C.

[0213] In the projector of the second embodiment, the first heat dissipation component 6C has a plurality of fins 6C2 through which cooling gas can flow in the +Y and +X directions respectively. Additionally, the first heat dissipation component 6D has a plurality of fins 6B1 through which cooling gas can flow in the +Y and +X directions respectively.

[0214] With this structure, turbulent flow of cooling gas can be generated between the multiple fins 6C2 and 6B1. Therefore, the heat dissipation efficiency of the first heat dissipation components 6C and 6D can be improved, and the cooling efficiency of the liquid crystal layer 42 can be improved.

[0215] [Third Implementation]

[0216] Next, the third embodiment of this disclosure will be described.

[0217] The projector of this embodiment has the same structure as the projector 1 of the first embodiment, but the structure of the cooling component is different. Furthermore, in the following description, parts that are the same as or substantially the same as those already described are marked with the same reference numerals and their descriptions are omitted.

[0218] [General Structure of a Projector]

[0219] Figure 18 This is a perspective view showing the cooling component 5C and the second dustproof component 47 of the light modulation device 4C in the projector of this embodiment.

[0220] The projector of this embodiment has the same structure and function as the projector 1 of the first embodiment, except that it has a light modulation device 4C instead of the light modulation device 4A of the first embodiment. The light modulation device 4C has a light modulation device 4C instead of the cooling component 5A of the first embodiment. Figure 18 Apart from the cooling component 5C shown, it has the same structure and function as the optical modulation device 4A of the first embodiment.

[0221] [Structure of cooling components]

[0222] Like cooling component 5A, cooling component 5C has a hollow space SP containing working fluid. Heat transferred from the liquid crystal layer 42 of the panel body 41 is used to change the liquid-phase working fluid into a gaseous phase, thereby cooling the liquid crystal layer 42. Cooling component 5C has a main body 51C and a heat sink (not shown). The heat sink for cooling component 5C can be any one of the first heat sinks 6A and 6B of the first embodiment and the first heat sinks 6C and 6D of the second embodiment.

[0223] [Structure of the main body]

[0224] The main body 51C has the same structure and function as the main body 51A in the first embodiment, except that it also has the bending portion 58. That is, in addition to the heat-receiving substrate 52, the heat-dissipating substrate 53, the opening 54, the first condensation portion 57, and the bending portion 58, the main body 51C also has the sealing portion 55 and the protective portion 56 (not shown in the figure).

[0225] Four bends 58 form part of the inner edge of the opening 54. Each of the four bends 58 is formed by bending a portion extending inward toward the opening 54. That is, each bend 58 is a portion of the main body 51C bent from the side of the second substrate 44 toward the side opposite to the second substrate 44. The four bends 58 include a bend 581 disposed relative to the opening 54 in the +Y direction, a bend 582 disposed relative to the opening 54 in the -Y direction, a bend 583 disposed relative to the opening 54 in the +X direction, and a bend 584 disposed relative to the opening 54 in the -X direction.

[0226] The bending portion 581 is formed by bending the portion extending inward toward the opening 54 in the +Z direction, and then bending it in the +Y direction. The bending portion 582 is formed by bending the portion extending inward toward the opening 54 in the +Z direction, and then bending it in the -Y direction. The bending portions 583 and 584 are formed in the same way.

[0227] The -Y direction surface 581A of the bent portion 581, the +Y direction surface 582A of the bent portion 582, the -X direction surface 583A of the bent portion 583, and the +X direction surface 584A of the bent portion 584 form a portion of the inner edge of the opening 54. Surfaces 581A, 582A, 583A, and 584A are thermally connected to the side surface of the second dustproof member 47, that is, the end face of the second dustproof member 47 along the circumferential direction centered on the optical axis. Surfaces 581A, 582A, 583A, and 584A are surfaces formed by the heated substrate 52.

[0228] Here, the main body of the steam chamber contains a working fluid within a hollow space, thus requiring the heated substrate and the heat dissipation substrate to be joined together. Therefore, for example, a joint is provided around the outer edge of the heated substrate, the outer edge of the heat dissipation substrate, and the opening, and the heated substrate and the heat dissipation substrate are joined together using the joint.

[0229] However, in such a structure, if the dimension of the joint in the direction towards the outside of the opening is large, the distance from the inner edge of the opening to the hollow space tends to increase, making it difficult for heat transferred from the end edge of the opening to the main body to the working fluid in the liquid phase within the hollow space. In other words, in such a structure, it is difficult to efficiently transfer heat from the inner edge of the opening to the working fluid in the liquid phase.

[0230] Figure 19 This is a diagram showing a cross-section of the cooling component 5C and the second dustproof component 47 along the YZ plane. Furthermore, in Figure 19 The diagrams of the mesh structure MS of the heated substrate 52 and the columnar body PL of the heat dissipation substrate 53 are omitted.

[0231] In contrast, the main body 51C has bending portions 581 to 584, and the end face 471 of the second dustproof member 47 that fits into the opening 54 is thermally connected to the surfaces 581A, 582A, 583A, and 584A formed by the heat-receiving substrate 52. Furthermore, the joint portion CN between the heat-receiving substrate 52 and the heat-dissipating substrate 53 in the main body 51C is positioned outside the opening 54, closer to the end face 471.

[0232] Therefore, compared to the case where the inner edge of the opening is formed from the end face of the joint as described above, as... Figure 19 As shown, the distance from the inner edge of the opening 54 to the hollow space SP can be reduced. Therefore, the heat transferred from the second dustproof member 47 can be easily transferred to the liquid working fluid that penetrates the mesh structure MS of the heated substrate 52. Therefore, by using the heat transferred from the second dustproof member 47 to the liquid liquid working fluid, the liquid working fluid can be efficiently converted into a gaseous working fluid, and the liquid crystal layer 42 can be efficiently cooled.

[0233] [Effects of the third embodiment]

[0234] In addition to having the same effect as the projector 1 of the first embodiment, the projector described above also has the following effects.

[0235] In the light modulation apparatus 4C of the projector according to the third embodiment, the cooling member 5C has a bent portion 58 that bends from the side of the second substrate 44 toward the side opposite to the second substrate 44. The bent portion 58 forms the inner edge of the opening 54, and the heated substrate 52 is thermally connected to the end face 471 of the second dustproof member 47. The second dustproof member 47 corresponds to the light-transmitting substrate of this disclosure.

[0236] As described above, on the heated substrate 52 and the heat dissipation substrate 53, a joint portion CN is provided on the outside of the hollow space SP containing the working fluid. The dimension from the outer end face of the joint portion CN in the direction perpendicular to the direction connecting the heated substrate 52 and the heat dissipation substrate 53 to the hollow space SP is larger than the dimension from the outer end face of the heated substrate 52 in the direction connecting the heated substrate 52 and the heat dissipation substrate 53 to the hollow space SP. For example, as... Figure 19 As shown, the distance L1 between the outer end face of the joint portion CN that intersects the +Y direction and the hollow space SP is longer than the distance L2 between the surface of the heated substrate 52 forming the inner edge of the opening portion 54 in the bent portion 58 and the hollow space SP.

[0237] Therefore, the bend 58 forms the inner edge of the opening 54, and the end faces 471 of the heated substrate 52 and the second dustproof member 47 are thermally connected at the inner edge of the opening 54. Thus, compared to the case where the end faces of the heated substrate 52 and the heat dissipation substrate 53 are thermally connected to each other at the joint portion CN, heat can be easily transferred from the second dustproof member 47 to the heated substrate 52. Therefore, the heat transferred to the cooling member 5C can easily change the liquid working fluid into a gaseous working fluid, thereby improving the cooling efficiency of the liquid crystal layer 42.

[0238] [Fourth Implementation]

[0239] The fourth embodiment of this disclosure will now be described.

[0240] The projector of this embodiment has the same structure as the projector 1 of the first embodiment, but the difference is that the cooling component also has heat sinks on the upstream side of the cooling gas relative to the opening. Furthermore, in the following description, parts that are the same as or substantially the same as those already described are marked with the same reference numerals and their descriptions are omitted.

[0241] [General Structure of a Projector]

[0242] Figure 20 This is a side view showing the light modulation device 4D included in the projector of this embodiment. In other words, Figure 20 This is a schematic diagram showing the flow of cooling gas relative to the optical modulation device 4D.

[0243] The projector in this embodiment, in addition to replacing the light modulation device 4A of the first embodiment, has Figure 20 Apart from the light modulation device 4D shown, it has the same structure and function as the projector 1 of the first embodiment. The three light modulation devices 4D include a light modulation device 4D for modulating red light, a light modulation device 4D for modulating green light, and a light modulation device 4D for modulating blue light.

[0244] The optical modulation device 4D has the same structure and function as the optical modulation device 4A, except that it has a cooling component 5D instead of the cooling component 5A in the first embodiment.

[0245] [Structure of cooling components]

[0246] The cooling component 5D has the same structure and function as the cooling component 5A in the first embodiment, except that it has the second condensation section 59, the heat transfer section 6E, and the second heat dissipation section 6F. In this embodiment, the cooling component 5D is described as having a main body section 51A, but the main body section of the cooling component 5D may also be the main body section 51C of the third embodiment.

[0247] The second condenser 59 is disposed on the side opposite to the first condenser 57 in the heat dissipation substrate 53 relative to the pixel configuration area AR. That is, the second condenser 59 is disposed on the side opposite to the first condenser 57 in the -Y direction in the heat dissipation substrate 53 relative to the opening 54. Like the first condenser 57, the second condenser 59 condenses the gaseous working fluid flowing within the hollow space SP into a liquid working fluid. The second condenser 59 is thermally connected to the second heat dissipation member 6F.

[0248] The heat transfer component 6E is connected to the portion of the heat sink substrate 53 corresponding to the second condensation section 59, and is also connected to the second heat dissipation component 6F. The heat transfer component 6E transfers the heat of the working fluid in the gaseous phase heated in the second condensation section 59 to the second heat dissipation component 6F. Such a heat transfer component 6E is, for example, formed of a metal with good thermal conductivity.

[0249] The second heat dissipation component 6F is thermally connected to the second condensation portion 59 via the heat transfer component 6E. Furthermore, the second heat dissipation component 6F is thermally connected to the outer surface of the heat dissipation substrate 53 in the +Z direction corresponding to the second condensation portion 59. The second heat dissipation component 6F is not only positioned opposite to the first heat dissipation component 6A relative to the opening 54, but also opposite to the first heat dissipation component 6A relative to the main body portion 51A. That is, the second heat dissipation component 6F is positioned in the -Y direction relative to the first heat dissipation component 6A and the opening 54, and also in the -Z direction relative to the first heat dissipation component 6A. Specifically, the second heat dissipation component 6F is located in the -Z direction within the light modulation device 4D and is mounted on the holding housing 48.

[0250] In this embodiment, the second heat dissipation component 6F has the same structure as the first heat dissipation component 6A in the first embodiment, but it may also have the same structure as one of the first heat dissipation component 6B in the first embodiment and the first heat dissipation components 6C and 6D in the second embodiment.

[0251] [The flow of cooling gas circulating in the optical modulation device]

[0252] Similar to the light modulation apparatus 4A in the first embodiment, a portion of the cooling gas A3 flowing from the first flow section 73 in the +Y direction flows in the space in the +Z direction relative to the light modulation apparatus 4D, cooling the cooling member 5D and the second dustproof member 47. As a result, a portion of the heat of the liquid crystal layer 42 is dissipated.

[0253] Furthermore, when the light modulation device 4D adopts the first heat dissipation component 6C or the first heat dissipation component 6D of the second embodiment, and the projector adopts the cooling device 7B of the second embodiment, the cooling gases A4 and A5 circulate in the first heat dissipation component 6C.

[0254] The cooling gas A1D, which flows from the first flow section 73 in the +Y direction, flows in the -Z direction relative to the light modulation device 4D. Specifically, the cooling gas A1D flows in the +Y direction along a flow path provided inside the second heat dissipation member 6F. As a result, the heat transferred from the second condensation section 59 is transferred to the cooling gas A1D through the second heat dissipation member 6F. As a result, a portion of the heat in the liquid crystal layer 42 is dissipated.

[0255] Additionally, the cooling gas A1D flowing in the second heat dissipation member 6F flows along the -Z direction surface 48A in the holding housing 48 towards the +Y direction, cooling the holding housing 48, and also flows along the first dustproof member 46, cooling the first dustproof member 46. As a result, a portion of the heat from the liquid crystal layer 42 is dissipated.

[0256] The cooling gas A2, after cooling the first dustproof component 46, flows further in the +Y direction to cool the heat sink 482. As a result, a portion of the heat from the liquid crystal layer 42 is dissipated.

[0257] In the optical modulation device 4D, the second condenser 59 is disposed on the side opposite to the first condenser 57 relative to the opening 54. That is, the second condenser 59 is disposed in the -Y direction relative to the opening 54. A second dustproof member 47, which is disposed corresponding to the pixel configuration area AR, is fitted into the opening 54.

[0258] Therefore, when the -Y direction represents the direction upwards in the vertical direction of the light modulation device 4D, the working fluid condensed by the liquid phase in the second condenser 59 can be easily transported to the connection portion connected to the second substrate 44 and the connection portion connected to the second dustproof member 47 in the heated substrate 52, utilizing not only the capillary force of the mesh structure MS but also gravity. Thus, the heat transferred from the liquid crystal layer 42 through the second substrate 44 and the second dustproof member 47 promotes the phase change of the working fluid from liquid to gas phase in the heated substrate 52. That is, the heat dissipation efficiency of the liquid crystal layer 42 can be improved, thereby improving the cooling efficiency of the liquid crystal layer 42.

[0259] Furthermore, when the +Y direction represents the direction upwards in the vertical direction of the light modulation device 4A, as described above, not only by utilizing the capillary force of the mesh structure MS, but also by utilizing gravity, the working fluid in the liquid phase condensed by the first condenser 57 can be easily transported to the connection portion connected to the second substrate 44 and the connection portion connected to the second dustproof member 47 in the heated substrate 52. Thus, the heat transferred from the liquid crystal layer 42 through the second substrate 44 and the second dustproof member 47 can promote the phase change of the working fluid from the liquid phase to the gas phase in the heated substrate 52.

[0260] [Effects of the fourth implementation method]

[0261] In addition to having the same effect as the projector 1 of the first embodiment, the projector described above also has the following effects.

[0262] In the light modulation apparatus 4D of the projector according to the fourth embodiment, the cooling member 5D has a second condensation section 59 and a second heat dissipation member 6F. The second condensation section 59 is disposed on the side opposite to the first condensation section 57 in the heat dissipation substrate 53 opposite to the pixel configuration area AR. In other words, the second condensation section 59 is disposed on the side opposite to the first condensation section 57 in the heat dissipation substrate 53 opposite to the opening 54. The second condensation section 59 condenses the gaseous working fluid flowing in the hollow space SP into a liquid working fluid. The second heat dissipation member 6F is thermally connected to the outer surface of the heat dissipation substrate 53 corresponding to the second condensation section 59 via a heat transfer member 6E.

[0263] With this structure, the first condensation section 57 and the second condensation section 59 are arranged with the pixel configuration area AR and the opening 54 separated by a distance, and the first heat dissipation member 6A and the second heat dissipation member 6F are arranged with the pixel configuration area separated by a distance. This increases the heat dissipation area of ​​the liquid crystal layer 42 that is transferred to the cooling member 5D.

[0264] Furthermore, when the first condensation section 57 is positioned above the second condensation section 59, the working fluid condensed from the gas phase to the liquid phase in the first condensation section 57 can easily flow to the portion of the heated substrate 52 where heat is transferred to the liquid crystal layer 42 by gravity. Similarly, when the second condensation section 59 is positioned above the first condensation section 57, the working fluid condensed from the gas phase to the liquid phase in the second condensation section 59 can easily flow to the portion of the heated substrate 52 where heat is transferred to the liquid crystal layer 42 by gravity. Therefore, the working fluid can be easily converted from the liquid phase to the gas phase by the heat of the liquid crystal layer 42, thereby improving the cooling efficiency of the liquid crystal layer 42.

[0265] In the optical modulation device 4D, the first heat dissipation component 6A and the second heat dissipation component 6F are arranged on opposite sides of each other relative to the heated substrate 52 and the heat dissipation substrate 53.

[0266] According to this structure, the first heat sink 6A and the second heat sink 6F can be cooled independently by cooling gas flowing in the -Z direction and the +Z direction relative to the light modulation device 4D. This improves the cooling efficiency of the first heat sink 6A and the second heat sink 6F. Furthermore, since the pixel configuration region AR is disposed upstream in the flow path of the cooling gas flowing to the first heat sink 6A, the cooling gas A3 used before cooling the first heat sink 6A can be used to cool the pixel configuration region AR. Therefore, the cooling efficiency of the liquid crystal layer 42 can be improved.

[0267] [Variations on the implementation method]

[0268] This disclosure is not limited to the above-described embodiments. Modifications and improvements within the scope of achieving the purpose of this disclosure are included in this disclosure.

[0269] In the above embodiments, it is assumed that cooling components 5A, 5B, 5C, and 5D are vapor chambers having a heat-receiving substrate 52 and a heat-dissipating substrate 53, and containing working fluid within a hollow space SP. However, this is not a limitation; the cooling components of this disclosure can be any components that transfer heat from the heat-receiving part to a heat-dissipating part away from the heat-receiving part by changing the phase state of the working fluid contained inside, and dissipate heat through the heat-dissipating part, or other structures.

[0270] In the above embodiments, cooling components 5A, 5B, 5C, and 5D are thermally connected to the second substrate 44 disposed on the light emission side relative to the liquid crystal layer 42. However, this is not a limitation; the cooling components may also be thermally connected to the first substrate 43 disposed on the light incident side relative to the liquid crystal layer 42.

[0271] In the above embodiments, cooling components 5A, 5B, 5C, and 5D have openings 54. However, this is not a limitation; the openings may not be provided on the cooling components. In this case, the panel body constituting the light modulation device may not be a transmissive liquid crystal panel with different light incident and light emitting surfaces, but rather a reflective liquid crystal panel with the same light incident and light emitting surfaces. Furthermore, the second dustproof component 47, which serves as a light-transmitting substrate and is fitted into the opening 54, may be omitted. Moreover, the inner edge of the opening 54 and the second dustproof component 47 may not be directly connected, but may be thermally connected via a heat transfer component with thermal conductivity.

[0272] In the above embodiments, the heated substrate 52 is disposed within the hollow space SP and has a mesh structure MS for the liquid phase working fluid to permeate into it, while the heat dissipation substrate 53 has a plurality of columnar bodies PL disposed within the hollow space SP to form a flow path for the gas phase working fluid to flow through. However, this is not a limitation; the heated substrate 52 may not have the mesh structure MS, and the heat dissipation substrate 53 may not have the plurality of columnar bodies PL. That is, the structures of the heated substrate and the heat dissipation substrate of this disclosure are not limited to the structures described above.

[0273] In the above embodiments, the drive circuit 451, which is a circuit element disposed on the printed circuit board 45, is thermally connected to the heated substrate 52. However, it is not limited to this; the drive circuit 451 may not be thermally connected to the heated substrate 52. Alternatively, the drive circuit 451 may be thermally connected to the heated substrate 52 via a heat transfer member. Furthermore, the drive circuit 451 may be disposed on the surface of the printed circuit board 45 opposite to the heated substrate 52 side, or it may be disposed in a portion where cooling gas flows.

[0274] In the above embodiments, cooling components 5A, 5B, 5C, and 5D include: a first condensation section 57 disposed on the heat dissipation substrate 53, which condenses the gaseous working fluid flowing within the hollow space SP into a liquid working fluid; and first heat dissipation components 6A, 6B, 6C, and 6D disposed on the outer surface of the heat dissipation substrate 53 at positions corresponding to the first condensation section 57. However, this is not a limitation, and the first heat dissipation component may be omitted. Furthermore, the first heat dissipation component may not need to be disposed on the heat dissipation substrate 53, and may be disposed at a position away from the optical modulation device. In this case, it is sufficient to thermally connect the first heat dissipation component to the first condensation section 57 via a heat transfer component.

[0275] In the above embodiments, the holding housing 48, combined with the cooling components 5A, 5B, 5C, and 5D, has a position adjustment portion 483 that is inserted into the holding component 357 to adjust the position of the light modulation devices 4A, 4B, 4C, and 4D relative to the incident surface of the color combining unit 356. However, it is not limited to this; the position adjustment portion 483 may also be provided on the cooling component. Alternatively, the position adjustment portion may not be provided on the holding housing or the cooling component, and the position of the light modulation device relative to the incident surface of the color combining unit may be adjusted by holding the light modulation device with the holding component.

[0276] In the above embodiments, the cooling devices 7A and 7B have a first flow section 73 that allows cooling gas to flow in the +Y direction from the pixel configuration area AR toward the first heat dissipation members 6A, 6B, 6C, and 6D. The +Y direction corresponds to the first direction. However, it is not limited to this; the cooling gas flowing relative to the optical modulation device may also flow in the +X direction or the +Z direction.

[0277] Additionally, the cooling device 7A includes a cooling fan 71 and a duct 72 with a first flow section 73. However, it is not limited to this; the cooling device may also be one in which the cooling fan directly supplies cooling gas to the optical modulation device. That is, the duct 72 may not be required.

[0278] In the second embodiment described above, the cooling device 7B includes: a first flow section 73 that allows cooling gas to flow relative to the optical modulation device 4B in the +Y direction; and a second flow section 75 that allows cooling gas to flow relative to the optical modulation device 4B in the +X direction. However, it is not limited to this; the direction in which the cooling gas flows through the cooling device can also be any two directions selected from the +X direction, the +Y direction, and the +Z direction. Furthermore, the cooling devices 7A and 7B can also allow cooling gas to flow relative to the optical modulation device in the -X direction, the -Y direction, and the -Z direction.

[0279] Additionally, the cooling device 7B includes a cooling fan 71 and a duct 74 with a first flow section 73 and a second flow section 75. However, it is not limited to this; the cooling device may also be one in which the cooling fan directly supplies cooling gas to the optical modulation device. That is, the duct 74 may not be present.

[0280] In the third embodiment described above, the main body 51C of the cooling member 5C has a bent portion 58 that bends from the side of the second substrate 44 toward the side opposite to the second substrate 44. That is, the main body 51C has a bent portion 58 that bends in the +Z direction. At the bent portion 58, the heat dissipation substrates 53 are connected to each other. That is, the bent portion 58 is formed by bending a part of the main body 51C by 180°. However, it is not limited to this, the bent portion 58 may also be formed by bending a part of the main body 51C at an angle of 180° or less. For example, the bent portion 58 may also be formed by bending a part of the main body 51C by 90°.

[0281] In the fourth embodiment described above, the second condensation portion 59 is disposed on the side opposite to the first condensation portion 57, separated by the pixel configuration area AR. That is, the second condensation portion 59 is disposed on the side opposite to the first condensation portion 57, separated by the opening 54. However, it is not limited to this, the second condensation portion may also be disposed on the same side as the first condensation portion 57, with respect to the pixel configuration area AR and the opening 54.

[0282] Furthermore, the second heat dissipation component 6F is thermally connected to the second condensation portion 59. However, the second heat dissipation component 6F may be omitted, or it may be disposed on the outer surface of the heat dissipation substrate 53 in the +Z direction at a position corresponding to the second condensation portion 59. That is, the heat transfer component that thermally connects the heat dissipation substrate and the second heat dissipation component may be omitted, and the second heat dissipation component may be disposed on the same side as the first heat dissipation component relative to the heat dissipation substrate 53.

[0283] [Summary of this disclosure]

[0284] The following is a summary published in this note.

[0285] The light modulation apparatus of the first aspect of the present invention has a pixel configuration area configured with a plurality of pixels, wherein the light modulation apparatus has: a first substrate; a second substrate disposed opposite to the first substrate through a liquid crystal layer; and a cooling member disposed on the opposite side of the first substrate relative to the second substrate and thermally connected to the second substrate, the cooling member having a hollow space sealed with a working fluid, and cooling the liquid crystal layer via the second substrate by changing the liquid phase of the working fluid into a gas phase of the working fluid.

[0286] According to this structure, heat from the liquid crystal layer is transferred to the second substrate, and thus heat from the liquid crystal layer is transferred to the cooling unit via the second substrate. The cooling unit uses the transferred heat to change the liquid-phase working fluid sealed within the internal space into a gas-phase working fluid, consuming the heat from the liquid crystal layer and thereby cooling it. Therefore, the heat from the liquid crystal layer transferred to the cooling unit can be consumed efficiently, resulting in efficient cooling of the liquid crystal layer. Thus, even in light modulation devices with small pixel configuration areas, the cooling efficiency of the liquid crystal layer can be improved. Furthermore, this not only increases the amount of light incident on the light modulation device but also extends the lifespan of the light modulation device.

[0287] Furthermore, since the cooling efficiency of the optical modulation device can be improved, the flow rate of cooling gas flowing through the optical modulation device can be reduced when using cooling gas circulated by a cooling fan to cool the optical modulation device. Therefore, even when a small cooling fan is used, a sufficient flow rate of cooling gas for cooling the optical modulation device can be ensured, thus enabling miniaturization of the projector equipped with the optical modulation device and the cooling fan. On the other hand, when a large cooling fan is used, the fan speed per unit time can be reduced, thereby reducing the noise of the projector.

[0288] Furthermore, since the cooling efficiency of the light modulation device can be improved, the light modulation device can be miniaturized. Therefore, when the light modulation device of this disclosure is used in a projector, a small projection optics device can be used in the projector, thereby enabling projector miniaturization.

[0289] In the first embodiment described above, the cooling component may also include: a heat-receiving substrate connected to the second substrate, which converts the liquid phase working fluid into a gaseous phase working fluid by heat transferred from the second substrate; and a heat-dissipating substrate joined to the heat-receiving substrate on the opposite side from the second substrate, forming the hollow space together with the heat-receiving substrate, dissipating heat from the gaseous phase working fluid and condensing the gaseous phase working fluid into the liquid phase working fluid.

[0290] Based on this structure, the cooling component can be configured as a vapor chamber. Furthermore, by connecting the heated substrate to the second substrate, the transferred heat can efficiently transform the liquid working fluid into a gaseous working fluid. Additionally, by positioning the heat dissipation substrate opposite the heated substrate to the second substrate, heat dissipation from the gaseous working fluid can be efficiently achieved, and the gaseous working fluid can be efficiently condensed into a liquid working fluid. Therefore, heat transferred to the liquid crystal layer by the cooling component can be efficiently dissipated, improving the cooling efficiency of the liquid crystal layer.

[0291] In the first embodiment described above, a light-transmitting substrate may also be provided, wherein the light-transmitting substrate is disposed on the portion of the second substrate corresponding to the pixel configuration area, the cooling component has an opening, the light-transmitting substrate is fitted into the opening, and the inner edge of the opening is thermally connected to the side of the light-transmitting substrate.

[0292] Based on this structure, the light modulation device can be configured as a transmissive light modulation device that allows light to pass through the pixel arrangement area. Furthermore, the inner edge of the opening in the cooling member through which light can pass is thermally connected to the end face of a light-transmitting substrate disposed in the second substrate corresponding to the pixel arrangement area. Therefore, heat from the liquid crystal layer transferred to the second substrate is transferred not only directly from the second substrate to the cooling member, but also from the second substrate via the light-transmitting substrate. Thus, the heat transfer path from the liquid crystal layer to the cooling member can be increased, and therefore, even when the cooling member has an opening, heat from the liquid crystal layer can be efficiently transferred to the cooling member. Therefore, the cooling efficiency of the liquid crystal layer can be improved.

[0293] In the first embodiment described above, the cooling component may have a bent portion that bends from the side of the second substrate toward the side opposite to the second substrate, the bent portion forming the inner edge of the opening, and the heated substrate being thermally connected to the side of the light-transmitting substrate.

[0294] Here, on the heated substrate and the heat dissipation substrate, there are joint portions that engage with each other on the outside of the hollow space containing the working fluid. The dimension from the outer end face of the joint portion to the inner space in the direction perpendicular to the direction connecting the heated substrate and the heat dissipation substrate is larger than the dimension from the outer end face of the heated substrate to the inner space in the direction connecting the heated substrate and the heat dissipation substrate.

[0295] Therefore, the inner edge of the opening is formed by the bend, and the end faces of the heated substrate and the light-transmitting substrate are thermally connected at the inner edge of the opening. This allows for easier heat transfer from the light-transmitting substrate to the heated substrate compared to the case where the end faces of the heated substrate and the heat-dissipating substrate are thermally connected to the end faces of the light-transmitting substrate at the joint. Consequently, the liquid working fluid can be easily converted into a gaseous working fluid by the heat transferred to the cooling components, thus improving the cooling efficiency of the liquid crystal layer.

[0296] In the first embodiment described above, the heated substrate may have a mesh structure that allows the liquid phase working fluid to permeate into the hollow space, and the heat dissipation substrate may have a plurality of columnar bodies that are disposed within the hollow space to form a flow path for the gas phase working fluid to circulate.

[0297] With this structure, the liquid working fluid can be easily held within the heated substrate, allowing the heat transferred to the substrate to easily transform the liquid working fluid into a gaseous working fluid. Furthermore, since the heat dissipation substrate has multiple columnar sections, not only is the strength of the cooling component improved, but the gaseous working fluid can also easily flow through the areas where it changes from gaseous to liquid phase. Therefore, the phase change of the working fluid within the cooling component can be promoted, thereby improving the cooling efficiency of the liquid crystal layer.

[0298] In the first embodiment described above, it may also include: a printed substrate extending from the first substrate and the second substrate; and a circuit element disposed on the printed substrate, the circuit element being thermally connected to the heated substrate.

[0299] With this structure, heat generated by the circuit elements can be transferred to the heated substrate, thus allowing the circuit elements to be cooled using a cooling component. Therefore, there is no need for a separate structure to cool the circuit elements, thereby reducing the structural complexity of the optical modulation device.

[0300] In the first embodiment described above, the cooling component may also include: a first condensation section disposed on the heat dissipation substrate, which condenses the gaseous working fluid flowing in the hollow space into a liquid working fluid; and a first heat dissipation component disposed on the outer surface of the heat dissipation substrate corresponding to the first condensation section, which dissipates heat transferred from the gaseous working fluid.

[0301] According to this structure, the first heat dissipation component dissipates heat transferred from the gaseous working fluid, thereby promoting the condensation of the gaseous working fluid into the liquid working fluid in the first condensation section, and further promoting the change from the liquid working fluid to the gaseous working fluid caused by the heat transferred from the liquid crystal layer. Therefore, the heat dissipation efficiency of the liquid crystal layer can be improved, thus improving the cooling efficiency of the liquid crystal layer.

[0302] In the first embodiment described above, the cooling component may also include: a second condensation section disposed on the opposite side of the first condensation section in the heat dissipation substrate relative to the pixel configuration area, which condenses the gaseous working fluid flowing in the hollow space into the liquid working fluid; and a second heat dissipation component thermally connected to the outer surface of the heat dissipation substrate corresponding to the second condensation section.

[0303] With this structure, the first condenser and the second condenser are arranged apart from the pixel arrangement area, and the first heat dissipation member and the second heat dissipation member are also arranged apart from the pixel arrangement area. This increases the heat dissipation area of ​​the liquid crystal layer transferred to the cooling members. Furthermore, with the first condenser positioned above the second condenser, the working fluid condensed from the gas phase to the liquid phase in the first condenser can easily flow to the portion of the liquid crystal layer in the heated substrate that is being heated by gravity. Similarly, with the second condenser positioned above the first condenser, the working fluid condensed from the gas phase to the liquid phase in the second condenser can easily flow to the portion of the liquid crystal layer in the heated substrate that is being heated by gravity. Therefore, the liquid phase working fluid can be easily converted back to the gas phase by the heat of the liquid crystal layer, improving the cooling efficiency of the liquid crystal layer.

[0304] In the first embodiment described above, the first heat dissipation component and the second heat dissipation component may also be configured on opposite sides of the heated substrate and the heat dissipation substrate.

[0305] With this structure, when cooling gas flows through spaces on the opposite side of the heated substrate and the heat dissipation substrate, respectively, the first heat dissipation member and the second heat dissipation member can be cooled using the cooling gas flowing through each space. This improves the cooling efficiency of both the first and second heat dissipation members. Furthermore, since the pixel configuration region is located upstream of the flow path of the cooling gas flowing through one of the heat dissipation members, the pixel configuration region can be cooled using the cooling gas used before cooling one of the heat dissipation members. Therefore, the cooling efficiency of the liquid crystal layer can be improved.

[0306] In the first embodiment described above, a retaining housing may also be provided, which is combined with the cooling component to hold the liquid crystal layer, the first substrate, and the second substrate inside. The retaining housing may also have a position adjustment part for adjusting the position of the retaining housing.

[0307] With this structure, heat transferred from the liquid crystal layer can be dissipated by maintaining the housing. This increases the heat dissipation area of ​​the liquid crystal layer.

[0308] Furthermore, since the retaining housing has a position adjustment section, it is not necessary to provide the same position adjustment section on the cooling component that is combined with the retaining housing. As a result, the load on the cooling component can be suppressed, thus enabling the cooling component to function stably.

[0309] The projector of the second aspect of this disclosure includes: a light source; a light modulation device of the first aspect described above, which modulates the light emitted from the light source; and a projection optics device that projects the light modulated by the light modulation device.

[0310] Based on this structure, it can achieve the same effect as the optical modulation device of the first method.

[0311] The projector of the third aspect of this disclosure includes: a light source; a light modulation device of the first aspect described above, which modulates light emitted from the light source; a projection optics device that projects light modulated by the light modulation device; and a cooling device that allows cooling gas to flow in the cooling component, the cooling device having a first flow section that allows the cooling gas to flow in a first direction from the pixel configuration area toward the first heat dissipation component.

[0312] According to this structure, the same effect as the light modulation device of the first embodiment can be achieved. Furthermore, the pixel arrangement region and the first heat dissipation member can be cooled using cooling gas flowing in the first direction through the cooling device. Since the pixel arrangement region is positioned upstream of the first heat dissipation member in the cooling gas flow path, compared to the case where the pixel arrangement region is positioned downstream of the first heat dissipation member, cooler cooling gas can flow through the pixel arrangement region. Therefore, the cooling efficiency of the pixel arrangement region can be improved, thereby improving the cooling efficiency of the liquid crystal layer.

[0313] In the third embodiment described above, the cooling device may also have a second flow section that allows the cooling gas to flow through the first heat dissipation component along a second direction that intersects the first direction.

[0314] With this structure, in the first heat dissipation component, cooling gas flowing in the first direction can collide with cooling gas flowing in the second direction. This generates turbulence in the cooling gas within the first heat dissipation component, thus facilitating its cooling. Therefore, the heat dissipation efficiency of the liquid crystal layer can be improved, and the cooling efficiency of the liquid crystal layer can be enhanced.

[0315] In the third method described above, the first heat dissipation component may have multiple fins, and the cooling gas may flow through the multiple fins along the first direction and the second direction, respectively.

[0316] With this structure, turbulent flow of cooling gas can be generated between the multiple fins. Therefore, the heat dissipation efficiency of the first heat sink can be improved, and the cooling efficiency of the liquid crystal layer can be improved.

Claims

1. An optical modulation device, characterized in that, It has the following characteristics: The panel body has a liquid crystal layer, a first substrate, a second substrate disposed opposite to the first substrate through the liquid crystal layer, and has a pixel configuration area disposed of a plurality of pixels. A printed circuit board extending from the first and second substrates in a direction away from the pixel configuration area; and The cooling component includes a vapor chamber and a first heat dissipation component. The steam chamber is positioned opposite the first substrate to the second substrate and is thermally connected to the second substrate. The vapor chamber has a hollow space that encloses the working fluid, and the liquid-phase working fluid is transformed into a gaseous-phase working fluid by heat transferred from the thermally connected heating element, which then cools the liquid crystal layer via the second substrate. The steam chamber has an extension that is connected to the panel body and extends outward away from the pixel configuration area. The steam chamber also has: A heated substrate, which is connected to the second substrate, causes the liquid phase working fluid to change into the gas phase working fluid by heat transferred from the second substrate; as well as A heat dissipation substrate, which is bonded to the heat-receiving substrate on the opposite side from the second substrate, together with the heat-receiving substrate, forms the hollow space to dissipate heat from the gaseous working fluid and condense the gaseous working fluid into a liquid working fluid. A first condensation component is provided on the heat dissipation substrate. The first condensation component is located between the heat dissipation substrate and the first heat dissipation component, and dissipates heat from the gaseous working fluid flowing in the hollow space, thereby condensing the gaseous working fluid into a liquid working fluid. The first heat dissipation component is disposed on the outer surface of the heat dissipation substrate corresponding to the first condensation component. The printed circuit board extends in a manner that overlaps with the extension of the vapor chamber. The printed circuit board has circuit elements that control the movement of the panel body, and the circuit elements are thermally connected to the heated substrate. The steam chamber is thermally connected to the circuit element.

2. The optical modulation device according to claim 1, characterized in that, The heated substrate has a mesh structure disposed within the hollow space, allowing the liquid working fluid to permeate in. The heat dissipation substrate has multiple columnar bodies disposed within the hollow space and forming a flow path for the working fluid to circulate in the gas phase.

3. A projector, characterized in that, It has the following characteristics: light source; The light modulation apparatus of claim 1 or 2 modulates light emitted from the light source; and A projection optical device that projects light modulated by the light modulation device.

4. The projector according to claim 3, characterized in that, The projector also features: Cooling fan; and A conduit that allows cooling gas from the cooling fan to circulate within the optical modulation device. The cooling gas delivered from the pipe is sent from the panel body to the printed substrate.

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