A method, device, equipment and storage medium for determining a thermal processing path

Abstract

The embodiment of the present invention discloses a method, device, equipment and storage medium for determining a thermal processing path, which relates to the field of thermal processing technology. The method includes obtaining the area to be processed and workpiece parameter information of a workpiece sheet. A dot matrix is ​​established in the area to be processed, and multiple processing line segments of the workpiece in the area to be processed are determined based on the workpiece parameter information. All processing line segments are traversed once to determine multiple thermal processing paths corresponding to the workpiece. The thermal processing path also includes idle displacement segments in addition to the processing line segments. Then, the thermal avoidance area during thermal processing of each thermal processing path is determined. Finally, the optimal thermal processing path that meets the thermal avoidance condition is screened out. The thermal avoidance condition is determined based on at least the total segment length of all processing line segments corresponding to the thermal processing path located in the thermal avoidance area and the length ratio between the total length of the corresponding thermal processing path. Therefore, secondary cutting of the overheated area can be avoided in a short time, thereby improving the product quality of the workpiece.

Description

Technical Field

[0001] The present invention relates to the field of thermal processing technology, and in particular to a thermal processing path determination method, device, equipment and storage medium. Background Art

[0002] In existing technology, some workpiece machining paths are planned by calculating the shortest motion path, which can reduce machining time and improve productivity. To avoid uncertainty in the workpiece's position during machining, the inner contour is typically machined first, followed by the outer contour. This is the most common machining path planning method for cold machining methods (such as waterjet cutting or milling).

[0003] However, thermal processing requires consideration of heat accumulation, which can lead to localized overheating and directly impact machining quality and precision. Therefore, manual intervention is often required to plan machining paths to avoid approaching recently cut areas. This manual intervention often results in suboptimal machining paths, making it difficult to guarantee workpiece quality and making automation difficult. Summary of the Invention

[0004] In view of the above problems, the present invention is proposed to provide a method, device, apparatus and storage medium for determining a thermal processing path that overcomes the above problems or at least partially solves the above problems.

[0005] According to a first aspect of the present invention, a method for determining a thermal processing path is provided, the method comprising:

[0006] Obtain the area to be processed and workpiece parameter information of the workpiece sheet;

[0007] Establishing a dot matrix in the area to be processed, and determining a plurality of processing line segments of the workpiece in the area to be processed based on the workpiece parameter information, wherein the dot matrix includes a plurality of reference points;

[0008] Traversing all processing line segments once to determine a plurality of thermal processing paths corresponding to the workpiece, wherein the thermal processing paths also include idle displacement line segments other than the processing line segments;

[0009] Determining a heat avoidance region during heat processing of each heat processing path in the dot matrix, wherein the heat avoidance region refers to a region in the dot matrix where a heat value of a reference point is greater than a preset heat threshold and a distance from the reference point is within a preset distance threshold;

[0010] An optimal thermal processing path that meets a thermal avoidance condition is screened out from the multiple thermal processing paths, where the thermal avoidance condition is determined at least based on a ratio of a total segment length of all processing line segments corresponding to the thermal processing path located within the thermal avoidance area to a total length of the corresponding thermal processing path.

[0011] According to a second aspect of the present invention, there is also provided a device for determining a thermal processing path, the device comprising:

[0012] An information acquisition module is used to obtain the area to be processed and workpiece parameter information of the workpiece sheet;

[0013] a dot matrix creation module, configured to establish a dot matrix in the area to be processed and determine a plurality of processing line segments of the workpiece in the area to be processed based on the workpiece parameter information, wherein the dot matrix includes a plurality of reference points;

[0014] a path generation module, configured to traverse all processing line segments once to determine a plurality of thermal processing paths corresponding to the workpiece, wherein the thermal processing paths also include idle displacement line segments other than the processing line segments;

[0015] a region determination module, configured to determine, in the dot matrix, a heat avoidance region for each thermal processing path during thermal processing, wherein the heat avoidance region refers to a region in the dot matrix where a heat value of a reference point is greater than a preset heat threshold and a distance from the reference point is within a preset distance threshold;

[0016] an optimal path determination module for selecting an optimal thermal processing path that satisfies a thermal avoidance condition from the plurality of thermal processing paths, wherein the thermal avoidance condition is determined at least based on a ratio of a total segment length of all processing line segments corresponding to the thermal processing paths that are located within the thermal avoidance area to a total length of the corresponding thermal processing paths.

[0017] According to a third aspect of the present invention, there is further provided an electronic device, comprising:

[0018] one or more processors;

[0019] Memory;

[0020] One or more programs, wherein the one or more programs are stored in the memory and configured to be executed by the one or more processors, and the one or more programs are configured to perform any of the above methods.

[0021] According to a fourth aspect of the present invention, a computer-readable storage medium is further provided, storing a computer program for use in conjunction with an electronic device, wherein the computer program can be executed by a processor to perform any of the methods described above.

[0022] In the present invention, the method for determining a thermal machining path may include first acquiring a workpiece's to-be-machined region and workpiece parameter information. Then, a dot matrix is ​​established within the to-be-machined region, and based on the workpiece parameter information, multiple machining segments for the workpiece within the to-be-machined region are determined, wherein the dot matrix includes multiple reference points. Next, all machining segments are traversed to determine multiple thermal machining paths corresponding to the workpiece, wherein the thermal machining paths also include idle segments in addition to the machining segments. Then, a thermal avoidance region is determined within the dot matrix for each thermal machining path during thermal machining, wherein the thermal avoidance region is defined as an area within the dot matrix where the heat value of a reference point exceeds a preset heat threshold and the distance from the reference point is within a preset distance threshold. Finally, an optimal thermal machining path that satisfies a thermal avoidance condition is selected from the multiple thermal machining paths. The thermal avoidance condition is determined based on at least the ratio of the total length of all machining segments within the thermal avoidance region to the total length of the corresponding thermal machining path. This avoids re-cutting of overheated regions in a short period of time, thereby improving the quality of the workpiece.

[0023] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are specifically listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiment below. The accompanying drawings are for illustration purposes only and are not to be construed as limiting the present invention. The same reference numerals are used throughout the accompanying drawings to denote the same components.

[0025] In the attached figure:

[0026] Figure 1 This is a flowchart of a method for determining a thermal processing path provided by an embodiment of the present invention;

[0027] Figure 2 This is a schematic diagram of a workpiece path planning provided by an embodiment of the present invention;

[0028] Figure 3 is a flowchart of another method for determining a thermal processing path provided by an embodiment of the present invention;

[0029] Figure 4 This is a schematic diagram of target line segment segmentation provided by an embodiment of the present invention;

[0030] Figure 5 This is a schematic diagram of path planning for multiple workpieces provided by an embodiment of the present invention;

[0031] Figure 6 This is a block diagram of a thermal processing path determination device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0032] Exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.

[0033] Reference Figure 1 , shows a flowchart of a method for determining a thermal processing path provided by an embodiment of the present invention, the method may include:

[0034] S101: Acquire the area to be processed and workpiece parameter information of the workpiece sheet.

[0035] In an embodiment of the present invention, a workpiece sheet can be fixed to a cutting table during hot processing, and the area overlapping the cutting table is determined as the area to be processed. The shape of the workpiece sheet can be rectangular or irregular, without further limitation. The workpiece parameter information can include, but is not limited to, workpiece shape and workpiece dimensions.

[0036] S102 , establishing a dot matrix in the area to be processed, and determining a plurality of processing line segments of the workpiece in the area to be processed based on the workpiece parameter information, wherein the dot matrix includes a plurality of reference points.

[0037] In an embodiment of the present invention, a rectangular coordinate system or a polar coordinate system can be established based on the cutting workbench (which can also be understood as the area to be processed). Thus, based on the coordinate system, the coordinate range of the area to be processed in the coordinate system can be determined. In one example, random values ​​of reference points can be taken within the coordinate range. In other words, a certain number of reference points can be selected at will to generate a dot matrix including multiple reference points. In this scenario, the dot matrix is ​​an irregular dot matrix, that is, multiple reference points are randomly distributed. The coordinates of each reference point are randomly determined. Each reference point in the dot matrix is ​​used to subsequently track the heat changes on the workpiece sheet during the hot working process.

[0038] In another example, the reference point values ​​can be taken within the coordinate range according to a preset reference point generation rule. For example, the reference point generation rule is pre-set based on the shape of the dot matrix. For example, if the dot matrix to be generated is a regular square matrix, for a rectangular coordinate system, the corresponding reference point generation rule can be that the coordinate values ​​of the X-axis are superimposed one after another according to a first interval value, and the corresponding Y-axis coordinate values ​​remain unchanged, or that the coordinate values ​​of the Y-axis are superimposed one after another according to a second interval value, and the corresponding X-axis coordinate values ​​remain unchanged. It is also stipulated that the number of reference points along the X-axis direction is M, and the number of reference points along the Y-axis direction is N. In this way, a regular square matrix formed by M*N reference points can be obtained.

[0039] Thus, based on the information of the workpiece shape and workpiece size, multiple processing line segments in the area to be processed can be pre-planned. Among them, the processing line segments can be understood as the line segments that need to be hot-processed. In one example, referring to Figure 2 As shown, when the workpiece is in a triangular shape, three processing line segments corresponding to the triangular workpiece can be planned in advance in the dot matrix, and the length of each processing line segment can be determined according to the size of the workpiece.

[0040] S103 , traversing all processing line segments once to determine a plurality of thermal processing paths corresponding to the workpiece, wherein the thermal processing paths also include idle displacement segments other than the processing line segments.

[0041] In an embodiment of the present invention, when determining the thermal processing path, the starting point of the target idle shift segment (i.e., the initial position of the cutting blade) is used as the path starting point. All processing segments are traversed once to determine multiple thermal processing paths corresponding to the workpiece. Furthermore, when planning the thermal processing path for a corresponding workpiece, only continuous processing methods can be considered, or both continuous and discontinuous processing methods can be considered.

[0042] For continuous machining, when traversing all machining segments, the process begins with the current machining segment and continues toward the adjacent machining segments. In other words, there are no idle segments between any two machining segments. Therefore, by determining different target idle segments, multiple thermal machining paths corresponding to the workpiece under continuous machining can be obtained.

[0043] In one example, refer to Figure 2 When the workpiece is triangular, the corresponding 6 thermal processing paths can be obtained according to the order of continuous processing as follows:

[0044] Hot processing path a: idle movement segment 1: AB, processing segment 1: BC, processing segment 2: CD, processing segment 3: DB;

[0045] Hot processing path b: idle movement line segment 1: AB, processing line segment 1: BD, processing line segment 2: DC, processing line segment 3: CB;

[0046] Hot processing path c: idle movement segment 1: AC, processing segment 1: CD, processing segment 2: DB, processing segment 3: BC;

[0047] Hot processing path d: idle movement segment 1: AC, processing segment 1: CB, processing segment 2: BD, processing segment 3: DC;

[0048] Hot processing path e: idle movement segment 1: AD, processing segment 1: DB, processing segment 2: BC, processing segment 3: CD;

[0049] Hot processing path f: idle movement segment 1: AD, processing segment 1: DC, processing segment 2: CB, processing segment 3: BD.

[0050] In another example, when considering the two methods of continuous processing and discontinuous processing, for the continuous processing method, the multiple first processing paths corresponding to the workpiece can be obtained through the steps described in the above-mentioned continuous processing method. For the discontinuous processing method, when traversing all processing segments at one time, the current processing segment is traversed toward the processing segment adjacent to the current processing segment, or traversed toward the processing segment spaced from the current processing segment. In other words, there is at least one idle segment between all processing segments corresponding to the current hot processing path. Among them, the idle segment refers to no hot processing (it can also be understood that the cutting head only moves but does not cut). In this way, multiple second processing paths corresponding to the workpiece under the discontinuous processing method can be obtained.

[0051] For example, when the workpiece is triangular, multiple corresponding thermal processing paths can be obtained according to discontinuous processing, including but not limited to the following:

[0052] Hot processing path g: idle displacement segment 1: AB, processing segment 1: BC, processing segment 2: CD, idle displacement segment 2: DB; processing segment 3: BD;

[0053] Hot processing path h: idle displacement segment 1: AC, processing segment 1: CD, idle displacement segment 2: DB; processing segment 2: BC; idle displacement segment 3: CD, processing segment 3: DB.

[0054] Therefore, when considering both continuous processing and discontinuous processing, the number of plannable thermal processing paths can be increased, and it is more conducive to subsequently screening out the optimal thermal processing path from all thermal processing paths.

[0055] It should be noted that the beneficial effects of the continuous processing method are mainly: it can avoid the frequent switching of the cutting head and the cutting process when starting cutting. For example, in laser cutting, the light source and gas source of the laser cutting must be turned on when starting cutting, and there may also be a perforation process. The beneficial effects of the discontinuous processing method are mainly: to avoid the heat-affected zone as much as possible, and to avoid the reduction in efficiency caused by deceleration and acceleration when the path changes direction (for example, it is suitable for processing scenarios where the speed of laser cutting thin plates is very fast and perforation can be completed in an instant). Those skilled in the art can select any of the above-mentioned feasible technical solutions according to the actual application scenario, and are not limited here.

[0056] S104, determining a heat avoidance area during thermal processing of each thermal processing path in the dot matrix.

[0057] In the embodiment of the present invention, the heat avoidance area refers to an area in the dot matrix where the heat value of a reference point is greater than a preset heat threshold and the distance from the reference point is within a preset distance threshold. Both the preset heat threshold and the preset distance threshold can be selected by those skilled in the art based on actual processing scenarios and are not further limited herein.

[0058] Since the calorific value of the area to be processed corresponding to the dot matrix will change dynamically during the thermal processing process. When determining the heat avoidance area, it is necessary to update the calorific value of each reference point in the dot matrix in a timely manner. When the workpiece is not cut, the heat on the workpiece sheet is different everywhere. Therefore, the area to be processed of the workpiece sheet can be detected by a heat detection device (such as an infrared thermal imager), so as to collect the calorific value distribution information in the area to be processed, and determine the initial calorific value of each reference point in the dot matrix based on the calorific value distribution information. Among them, the calorific value distribution information is used to characterize the calorific value distribution corresponding to each reference point in the dot matrix. Therefore, the calorific value distribution information can be averaged, that is, the average calorific value corresponding to each reference point is calculated and used as the initial calorific value of each reference point. The initial calorific value of the reference point is recorded as H0.

[0059] According to the line segment processing sequence of each processing path, the heat value of all reference points in the dot matrix can be updated at the end point of each line segment corresponding to the current thermal processing path of the workpiece. Based on the updated current heat value of each reference point, the processing line segment of each thermal processing path located within the thermal avoidance area is determined.

[0060] The calorific value update of each reference point in the dot matrix can be divided into two parts. The first part is the overall attenuation of the calorific value of all reference points caused by the time interval between two update moments. That is, when updating, all reference points in the dot matrix need to subtract the corresponding attenuated calorific value. In addition, the current calorific value is inversely proportional to the time interval. That is, the longer the time interval, the smaller the current calorific value (the larger the attenuated calorific value). For example, the attenuated calorific value Hs can be calculated by referring to the following formula (1):

[0061] Hs = h0*(1-loga(ts)) Formula (1)

[0062] In the above formula (1), ho is the heat value of the corresponding reference point when the current thermal processing path was last updated; ts is the time interval between the last update time and the current update time; a is an experimental constant between 0.01-0.99. Therefore, the calculation method of the attenuated heat value can be preset to obtain the corresponding heat attenuation rule. The heat attenuation rule may include but is not limited to the calculation formula listed above, which is used to characterize the attenuation relationship of the heat value of each reference point in the dot matrix over time. Therefore, when executing the heat value update of the end point of the idle segment on the current thermal processing path, the heat value of each reference point in the dot matrix can be updated at the end point of the current idle segment of the thermal processing path based on the last updated heat value of the reference point in the dot matrix and the heat attenuation rule. Among them, if the current idle segment is the first idle segment of the corresponding thermal processing path, the last updated heat value is the initial heat value of each reference point in the dot matrix. That is, h0 in the current formula (1) is the initial heat value H0, and the heat value corresponding to each reference point after the current update is H0-Hs.

[0063] The second part is the update of the newly added heat value caused to the reference points in the adjacent area when the cutting head performs thermal processing. It is associated with the process parameter information corresponding to the workpiece. For example, for the laser cutting process, the corresponding process parameter information may include but is not limited to laser peak power, laser frequency, and laser duty cycle, etc. Among them, the adjacent area refers to the area whose radius from the end point of the current processing segment is within the preset radius threshold. The preset radius threshold can be determined by those skilled in the art based on the distribution density of the reference points in the dot matrix, and is not further defined here. In one example, during the thermal processing of the processing segment, the added heat value Hb can be calculated by the following formula (2):

[0064] Hb = hmax*ts Formula (2)

[0065] hmax = C*P*K Formula (3)

[0066] In the above formulas (2) and (3), hmax refers to the increased heat value generated by thermal processing per unit time, where P is the laser peak power, C is the proportional constant, and K is the duty cycle. Therefore, if the current line segment is a processing line segment, then at the end point of the processing line segment, after the attenuated heat values ​​corresponding to all reference points are updated once, the increased heat values ​​of multiple reference points in the adjacent area can be updated twice. For example, the updated heat values ​​of multiple reference points are H0-Hs+Hb / S. Where S is the total number of multiple reference points in the adjacent area at the end point of the processing line segment. During the heat update process, the increased heat value Hb can be evenly distributed to the multiple reference points.

[0067] In another example, non-uniform heat value distribution can also be performed based on the distance between each reference point within a preset processing threshold and the end point of the current line segment. For example, the closer the reference point is to the end point of the current line segment, the higher the increased heat value assigned to it; the farther the reference point is from the end point of the current line segment, the lower the increased heat value assigned to it.

[0068] Therefore, a preset method for calculating the added calorific value can be made to obtain a corresponding heat increase rule. The heat increase rule may include but is not limited to the calculation formula listed above. It is used to characterize the relationship between the calorific value of each reference point in the dot matrix and the process parameter information and time. For example, the added calorific value may also be related to parameters such as the cutting height, cutting speed, type of auxiliary gas, and pressure of the auxiliary gas in the process parameter information, which are not further limited here. Thus, the calorific value of multiple reference points in the adjacent area at the end point of each processing line segment corresponding to the thermal processing path is updated for the second time according to the preset heat increase rule.

[0069] Finally, based on the current heat value of each reference point in the dot matrix, it is determined whether any part of the next processing line segment adjacent to the current line segment in the processing sequence is located in the heat avoidance area.

[0070] In one example, for the above-mentioned thermal processing path a, the thermal value of each reference point in the dot matrix can be updated at the end point (end point B) of the idle segment 1 (only including the case where the thermal value decays over time), and the current thermal value of each reference point after the update is H1. Then, at the end point (end point C) of the processing segment 1, the thermal value of each reference point in the dot matrix is ​​updated. Considering that at the end point of the processing segment, the thermal value update needs to consider two situations: the thermal value decays over time and the thermal value increases during the thermal processing process, the thermal values ​​of all reference points in the dot matrix can be first updated for the case where the thermal value decays over time, and the current thermal value of each reference point after the update is H2a. Then, for the increase in thermal value caused by thermal processing, the thermal values ​​of multiple reference points located in the adjacent area of ​​the current segment end point are updated again based on H2a (the thermal value after the first update), and the current thermal values ​​of multiple reference points in the adjacent area of ​​the current segment end point are obtained as H2.

[0071] The current heat value of multiple reference points is compared with the preset heat threshold. The preset heat threshold can be used to divide the heat avoidance area. For example, when the current heat value of multiple reference points is greater than the preset heat threshold, the area centered on the multiple reference points and whose distance from the corresponding reference points is within the preset distance threshold (can also be understood as less than or equal to the preset distance threshold) is used as the heat avoidance area. For example, determine whether the next processing line segment 2 is located in this heat avoidance area. If it is in this heat avoidance area, the length of the processing line segment corresponding to the partial line segment of the processing line segment 2 located in the heat avoidance area can be determined.

[0072] Based on this calorific value update logic, it can be determined whether processing segments 2 and 3 are within the thermal avoidance zone. If so, the length of the corresponding processing segments within the thermal avoidance zone can be further determined. Furthermore, based on the segment processing sequence of each thermal processing path, it is determined whether any portion of each processing segment of the corresponding thermal processing path is within the thermal avoidance zone. This continues until the thermal avoidance zone for each thermal processing path is determined.

[0073] S105. Filter out an optimal thermal processing path that satisfies a thermal avoidance condition from the multiple thermal processing paths, where the thermal avoidance condition is determined at least based on a ratio of a total segment length of all processing line segments corresponding to the thermal processing paths located within the thermal avoidance area to a total length of the corresponding thermal processing paths.

[0074] In an embodiment of the present invention, the heat avoidance condition may be that the ratio of the total length of all processing line segments corresponding to each thermal processing path within the thermal avoidance area to the total length of the corresponding thermal processing path is minimum.

[0075] Thus, the total segment length of all processing segments corresponding to each thermal processing path located within the thermal avoidance area can be pre-calculated, and the length ratio between the total segment length of the corresponding thermal processing path can be calculated. The total segment length can be the cumulative sum of the lengths of each processing segment determined to be located within the thermal avoidance area. For example, when a thermal processing path includes processing segment 1, processing segment 2, and processing segment 3, the corresponding processing segment 2 located within the thermal avoidance area is L1, and the corresponding processing segment 3 located within the thermal avoidance area is L2. Then, the total segment length corresponding to the thermal processing path is L1+L2. The total length of the thermal processing path refers to the cumulative length of all processing segments and idle segments corresponding to the path. Subsequently, after determining the length ratio of all thermal processing paths, the thermal processing path with the smallest length ratio among the thermal processing paths is selected as the optimal thermal processing path. This effectively avoids secondary cutting of the overheated area in a short period of time, effectively avoids overmelting and explosion, and improves the product quality of the workpiece.

[0076] Reference Figure 3 , shows a flowchart of another method for determining a thermal processing path provided by an embodiment of the present invention, the method may include:

[0077] S301: Acquire the area to be processed and workpiece parameter information of the workpiece sheet.

[0078] S302: Establish a dot matrix in the area to be processed, wherein the dot matrix includes a plurality of reference points.

[0079] In the embodiment of the present invention, the description of steps S301 and S302 may refer to the description of steps S101 and S102 described above.

[0080] S303 : Determine each vertex of the workpiece in the area to be processed according to the workpiece shape in the workpiece parameter information.

[0081] S304 : Determine multiple target line segments corresponding to the workpiece according to each vertex, wherein a line segment between two adjacent vertices is determined as a target line segment, and the target line segment includes a straight line segment and / or a curve segment.

[0082] In an embodiment of the present invention, the workpiece parameter information may include the workpiece shape and workpiece dimensions. If the workpiece shape is triangular, the corresponding multiple target line segments are all straight line segments. If the workpiece shape is irregular, the corresponding multiple target line segments may include straight line segments, curved line segments, or both straight line segments and curved line segments. The workpiece shape is divided according to the vertices corresponding to the workpiece shape. For example, the line segment between two adjacent vertices is determined as a target line segment. Similarly, multiple target line segments corresponding to the workpiece in the area to be processed are determined.

[0083] S305 , segmenting the multiple target line segments to obtain multiple processing line segments corresponding to the workpiece.

[0084] In this embodiment of the present invention, considering factors such as the potential length of a single target segment or the possibility of heat processing on the same target segment due to conversion of different process parameters during heat processing, the target segment can be segmented to obtain multiple processing segments corresponding to the workpiece. The calorific value is then updated based on the endpoints of the processing segments. This shortens the update interval for the calorific value, improves the accuracy of the update, and facilitates the accuracy of the subsequent determination of the thermal avoidance zone.

[0085] In an optional embodiment of the invention, a segmentation length threshold for line segmentation can be preset, and the length of each target line segment can be determined based on the workpiece size in the workpiece parameter information, and the length of the target line segment can be compared with the preset segmentation length threshold. If the line segment length of any target line segment is greater than the segmentation length threshold, the target line segment greater than the segmentation length threshold will be segmented at least once (which can also be understood as the end point interpolation of the line segment). For example, the segmentation length threshold can be used as the segmentation interval to perform equal-spaced length segmentation, and finally any line segment of the target line segment after segmentation is less than or equal to the segmentation length threshold. Refer to Figure 4 As shown, the processing line segment DB can be divided into multiple segments, and the corresponding line segment lengths are S1, S2, S3 and Si (i is a positive integer greater than 0), etc.

[0086] In another optional embodiment of the invention, the process parameter information corresponding to each target line segment can be obtained. It is then detected whether the process parameter information of the target line segment has changed during the processing process. When a change in process parameter information is detected on the same target line segment, segmentation can be performed on the line segment points where the process parameter information corresponding to the target line segment has changed, thereby obtaining multiple processing line segments corresponding to the workpiece. Increasing the number of processing line segments (which can also be understood as shortening the line segment length of a single processing line segment) in the above manner can facilitate improving the accuracy of subsequent updates of calorific value.

[0087] S306 , traversing all processing line segments once to determine a plurality of thermal processing paths corresponding to the workpiece, wherein the thermal processing paths also include idle displacement segments other than the processing line segments.

[0088] S307 , determining a heat avoidance area during thermal processing of each thermal processing path in the dot matrix.

[0089] In the embodiment of the present invention, the description of steps S306 and S307 refers to the description of steps S103 and S104.

[0090] S308. Filter out an optimal thermal processing path that satisfies a thermal avoidance condition from the multiple thermal processing paths, where the thermal avoidance condition is determined at least based on a ratio of a total segment length of all processing line segments corresponding to the thermal processing paths located within the thermal avoidance area to a total length of the corresponding thermal processing paths.

[0091] In an embodiment of the present invention, the thermal avoidance condition may be: the combined ratio of the length ratio and the efficiency ratio is minimum, wherein the length ratio refers to the ratio of the total segment length of all processing line segments corresponding to each thermal processing path located within the thermal avoidance area to the total length of the corresponding thermal processing path, and the efficiency ratio refers to the ratio of the path length of the shortest thermal processing path to the path length of the current thermal processing path.

[0092] Thus, the ratio of the total segment length of all processing segments corresponding to each thermal processing path within the thermal avoidance area to the total length of the corresponding thermal processing path can be pre-calculated. Next, the efficiency ratio corresponding to each thermal processing path is calculated, which is determined by the ratio of the path length of the shortest thermal processing path to the path length of the current thermal processing path.

[0093] Finally, based on the length ratio and the efficiency ratio, the corresponding comprehensive ratio is determined. The comprehensive ratio can be understood as the quotient of the length ratio and the efficiency ratio. Among them, the length ratio is the dividend and the efficiency ratio is the divisor. Considering that the length ratios corresponding to multiple thermal processing paths may all be zero, there will be multiple thermal processing paths with the smallest comprehensive ratios. On this basis, it is necessary to further screen out the thermal processing path with the largest efficiency ratio as the optimal thermal processing path.

[0094] In other words, if at most one thermal processing path has a length ratio of zero, the path with the smallest overall ratio is selected from the multiple thermal processing paths and deemed the optimal path. If at least two thermal processing paths have a length ratio of zero, the paths with zero overall ratios are selected from the multiple thermal processing paths, and the path with the largest efficiency ratio is selected from the multiple paths with zero overall ratios and deemed the optimal path. This effectively avoids re-cutting of overheated areas in a short period of time, effectively preventing over-melting and hole explosion, improving workpiece quality, and achieving the highest processing efficiency.

[0095] In an optional embodiment of the invention, when the number of workpieces is greater than or equal to 2, multiple workpieces processed on the same workpiece sheet can be treated as one workpiece, and the optimal thermal processing path can be determined according to the steps described in the above method embodiment. In another example, after planning the first workpiece, the thermal processing path of the next workpiece can be planned. Figure 5 As shown, when determining the thermal processing path of the next workpiece in the area to be processed, in the non-thermal avoidance area, the distance between the multiple processing line segments corresponding to the next workpiece and the path end point corresponding to the optimal thermal processing path of the current workpiece is used, and the line end point of the processing line segment that meets the preset distance condition is used as the line segment starting point of the first processing line segment corresponding to the thermal processing path of the next workpiece, and the current path end point is used as the path starting point (empty shift line segment) of the thermal processing path corresponding to the next workpiece. Then, multiple thermal processing paths corresponding to the next workpiece are determined according to the above method embodiment.

[0096] The preset distance condition may be the shortest distance between the end point of the path corresponding to the previous workpiece. Thus, based on the non-avoidance area, the starting point of the processing path of the next workpiece is determined based on the principle of proximity to the end point of the path of the current workpiece.

[0097] In summary, embodiments of the present invention disclose a method for determining a thermal machining path. The method may include first acquiring a workpiece's to-be-machined region and workpiece parameter information. Then, a dot matrix is ​​established within the to-be-machined region, and based on the workpiece parameter information, multiple machining segments for the workpiece within the to-be-machined region are determined. The dot matrix includes multiple reference points. Next, all machining segments are traversed to determine multiple thermal machining paths corresponding to the workpiece. The thermal machining paths also include idle segments in addition to the machining segments. Then, a thermal avoidance region is determined within the dot matrix for each thermal machining path during thermal machining. The thermal avoidance region refers to an area within the dot matrix where the heat value of a reference point exceeds a preset heat threshold and the distance from the reference point is within a preset distance threshold. Finally, an optimal thermal machining path that meets a thermal avoidance condition is selected from the multiple thermal machining paths. The thermal avoidance condition is determined based on at least the ratio of the total length of all machining segments corresponding to the thermal machining path within the thermal avoidance region to the total length of the corresponding thermal machining path. This avoids re-cutting of overheated regions in a short period of time, thereby improving the product quality of the workpiece.

[0098] It should be noted that for the method embodiments, for the sake of simplicity, they are all expressed as a series of action combinations, but those skilled in the art should be aware that the embodiments of the present application are not limited by the order of the actions described, because according to the embodiments of the present application, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions involved are not necessarily required by the embodiments of the present application.

[0099] Reference Figure 6 , shows a device for determining a thermal processing path provided by an embodiment of the present invention, the device may include:

[0100] The information acquisition module 601 is used to acquire the area to be processed of the workpiece sheet and workpiece parameter information.

[0101] The dot matrix creation module 602 is used to establish a dot matrix in the area to be processed and determine a plurality of processing line segments of the workpiece in the area to be processed based on the workpiece parameter information. The dot matrix includes a plurality of reference points.

[0102] The path generation module 603 is used to traverse all processing line segments once to determine multiple thermal processing paths corresponding to the workpiece, wherein the thermal processing paths also include idle displacement segments other than the processing line segments.

[0103] The area determination module 604 is used to determine the heat avoidance area of ​​each heat processing path during heat processing in the dot matrix, wherein the heat avoidance area refers to an area where the heat value of the reference point in the dot matrix is ​​greater than a preset heat threshold and the distance from the reference point is within a preset distance threshold.

[0104] The optimal path determination module 605 is used to screen out the optimal thermal processing path that meets the thermal avoidance condition from the multiple thermal processing paths, where the thermal avoidance condition is determined based on at least the ratio of the total segment length of all processing line segments corresponding to the thermal processing path located within the thermal avoidance area to the total length of the corresponding thermal processing path.

[0105] In an optional embodiment of the invention, the workpiece parameter information includes at least the workpiece shape, and the lattice creation module 602 may include:

[0106] The vertex determination submodule is used to determine each vertex of the workpiece in the area to be processed according to the shape of the workpiece.

[0107] The target line segment determination submodule is used to determine multiple target line segments corresponding to the workpiece according to each vertex, wherein the line segment between two adjacent vertices is determined as a target line segment, and the target line segment includes a straight line segment and / or a curve segment.

[0108] The target line segmentation submodule is used to segment multiple target line segments to obtain multiple processing line segments corresponding to the workpiece.

[0109] In an optional embodiment of the invention, the target line segment segmentation submodule may include:

[0110] The process parameter acquisition unit is used to obtain process parameter information corresponding to each target line segment.

[0111] The target line segment segmentation unit is used to segment the line segment points corresponding to the target line segment where the process parameter information changes when the process parameter information of the same target line segment changes, so as to obtain multiple processing line segments corresponding to the workpiece.

[0112] In an optional embodiment of the invention, the workpiece parameter information further includes workpiece dimensions, and the target line segmentation submodule may include:

[0113] The target line segment comparison unit is used to determine the length of each target line segment according to the size of the workpiece, and compare the length of the target line segment with a preset segmentation length threshold.

[0114] The target line segment segmentation unit is used to segment the target line segments that are larger than the segmentation length threshold according to the segmentation length threshold as the segmentation interval to obtain multiple processing line segments corresponding to the workpiece.

[0115] In an optional embodiment of the invention, the region determination module 604 may include:

[0116] The calorific value updating submodule is used to update the calorific value of all reference points in the dot matrix at the end points of each line segment of the corresponding thermal processing path according to the line segment processing sequence of each thermal processing path.

[0117] The area determination submodule is used to determine whether the next processing line segment adjacent to the current line segment in the processing sequence is located in the heat avoidance area based on the current heat value of each reference point in the dot matrix, until the heat avoidance area of ​​each thermal processing path during thermal processing is determined.

[0118] In an optional embodiment of the invention, the calorific value updating submodule may include:

[0119] The first updating unit is used to update the heat value of each reference point in the dot matrix at the end point of the idle shift segment according to the last updated heat value of each reference point in the dot matrix and the preset heat attenuation rule if the current line segment is an idle shift segment.

[0120] The second updating unit is used to update the heat value of each reference point in the dot matrix at the end point of the idle segment if the current line segment is a processing line segment based on the last updated heat value of each reference point in the dot matrix and the preset heat attenuation rule.

[0121] The second updating unit is further used to perform a secondary update on the heat values ​​of multiple reference points located in the adjacent area at the end point of each processing line segment corresponding to the thermal processing path according to a preset heat increase rule, wherein the adjacent area refers to an area whose radius from the end point of the current processing line segment is within a preset radius threshold.

[0122] In an optional embodiment of the invention, the second updating unit is further configured to:

[0123] If the current line segment is the first idle shift line segment of the corresponding thermal processing path, the last updated heat value is the initial heat value of each reference point in the dot matrix.

[0124] In an optional embodiment of the invention, the device further includes an initial information acquisition module for acquiring an initial calorific value of each reference point in the dot matrix. The initial information acquisition module may include:

[0125] The distribution information collection submodule is used to collect the calorific value distribution information in the to-be-processed area of ​​the workpiece sheet.

[0126] The initial information determination submodule is used to perform mean calculation on the calorific value distribution information to obtain the initial calorific value of each reference point in the dot matrix.

[0127] In an optional embodiment of the invention, the dot matrix creation module 602 may further include:

[0128] The coordinate system determination submodule is used to establish a coordinate system in the area to be processed and determine the coordinate range of the area to be processed corresponding to the coordinate system.

[0129] The dot matrix generation submodule is used to take reference point values ​​within the coordinate range and generate a dot matrix including multiple reference points.

[0130] In an optional embodiment of the invention, the dot matrix generation submodule may also be used for:

[0131] Randomly select reference points within the coordinate range to generate an irregular dot matrix including multiple reference points.

[0132] In an optional embodiment of the invention, the dot matrix generation submodule may also be used for:

[0133] According to the preset reference point generation rule, reference point values ​​are taken within the coordinate range to generate a regular lattice including multiple reference points.

[0134] In an optional embodiment of the invention, the path generation module 603 may be used to:

[0135] All processing line segments are traversed once in a continuous processing order to determine a plurality of thermal processing paths corresponding to the workpiece.

[0136] In an optional embodiment of the invention, the path generation module 603 may include:

[0137] The first path determination submodule is configured to traverse all processing line segments once in a continuous processing order to determine a plurality of first processing paths corresponding to the workpiece.

[0138] The second path determination submodule is configured to traverse all processing line segments once in a non-continuous processing order to determine a plurality of second processing paths corresponding to the workpiece.

[0139] The path generation submodule is used to combine multiple first processing paths and multiple second processing paths to obtain multiple thermal processing paths corresponding to the workpiece.

[0140] In an optional embodiment of the invention, the optimal path determination module 605 may include:

[0141] The ratio calculation submodule is used to calculate the ratio of the total segment length of all processing line segments corresponding to each thermal processing path located in the thermal avoidance area to the total length of the corresponding thermal processing path.

[0142] The optimal path determination submodule is used to select the thermal processing path with the smallest length ratio from multiple thermal processing paths as the optimal thermal processing path.

[0143] In an optional embodiment of the invention, the optimal path determination module 605 may include:

[0144] The ratio calculation submodule is used to calculate the ratio of the total segment length of all processing line segments corresponding to each thermal processing path located in the thermal avoidance area to the total length of the corresponding thermal processing path.

[0145] The efficiency ratio calculation submodule is used to calculate the efficiency ratio corresponding to each thermal processing path, and the efficiency ratio is determined according to the ratio of the path length of the shortest thermal processing path to the path length of the current thermal processing path.

[0146] The first optimal path submodule is used to screen out the optimal thermal processing path from multiple thermal processing paths with the smallest comprehensive ratio if the length ratio corresponding to at most one thermal processing path is zero. The comprehensive ratio is the quotient of the length ratio and the efficiency ratio.

[0147] The second optimal path submodule is used to screen out multiple thermal processing paths with corresponding comprehensive ratios of zero from multiple thermal processing paths if the length ratios corresponding to at least two thermal processing paths are zero, and to screen out the thermal processing path with the largest efficiency ratio from the multiple thermal processing paths with comprehensive ratios of zero as the optimal thermal processing path.

[0148] In an optional embodiment of the invention, the path generation module may also be used to:

[0149] When determining the thermal processing path of the next workpiece in the area to be processed, in the non-thermal avoidance area, the distance between the multiple processing line segments corresponding to the next workpiece and the path end point corresponding to the optimal thermal processing path of the current workpiece, the endpoint of the processing line segment that meets the preset distance condition is used as the line segment starting point of the first processing line segment of the next workpiece, and the multiple thermal processing paths corresponding to the next workpiece are determined.

[0150] In summary, embodiments of the present invention provide a device for determining a thermal machining path. The device may include first acquiring a workpiece's to-be-machined region and workpiece parameter information. Then, a dot matrix is ​​established within the to-be-machined region, and based on the workpiece parameter information, multiple machining segments for the workpiece within the to-be-machined region are determined. The dot matrix includes multiple reference points. Next, all machining segments are traversed to determine multiple thermal machining paths corresponding to the workpiece. The thermal machining paths also include idle segments in addition to the machining segments. Then, a thermal avoidance region is determined within the dot matrix for each thermal machining path during thermal machining. The thermal avoidance region refers to an area within the dot matrix where the heat value of a reference point exceeds a preset heat threshold and the distance from the reference point is within a preset distance threshold. Finally, an optimal thermal machining path that satisfies a thermal avoidance condition is selected from the multiple thermal machining paths. The thermal avoidance condition is determined based on at least the ratio of the total length of all machining segments corresponding to the thermal machining path within the thermal avoidance region to the total length of the corresponding thermal machining path. This avoids secondary cutting of overheated regions in a short period of time, thereby improving the product quality of the workpiece.

[0151] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0152] It is easy for those skilled in the art to think that any combination of the above embodiments is feasible, so any combination of the above embodiments is an implementation scheme of the present invention. However, due to space limitations, this specification will not describe them in detail here.

[0153] In the description provided herein, numerous specific details are described. However, it is understood that embodiments of the present invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques are not shown in detail so as not to obscure the understanding of this description.

[0154] Similarly, it should be understood that in order to streamline the present invention and aid in understanding one or more of the various inventive aspects, in the above description of exemplary embodiments of the present invention, various features of the present invention are sometimes grouped together into a single embodiment, figure, or description thereof. However, this disclosed method should not be interpreted as reflecting an intention that the claimed invention requires more features than are expressly recited in each claim. Rather, as reflected in the claims, inventive aspects lie in less than all the features of the individual embodiments disclosed above. Accordingly, the claims that follow the detailed description are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate embodiment of the present invention.

[0155] Those skilled in the art will appreciate that the modules in the devices in the embodiments may be adaptively changed and arranged in one or more devices different from the embodiments. The modules or units or components in the embodiments may be combined into one module or unit or component, and in addition may be divided into multiple submodules or subunits or subcomponents. All features disclosed in this specification (including the accompanying claims, abstracts and drawings) and all processes or units of any method or device disclosed herein may be combined in any combination, except that at least some of such features and / or processes or units are mutually exclusive. Unless expressly stated otherwise, each feature disclosed in this specification (including the accompanying claims, abstracts and drawings) may be replaced by an alternative feature providing the same, equivalent or similar purpose.

[0156] An electronic device, comprising:

[0157] One or more processors.

[0158] Memory.

[0159] One or more programs, wherein the one or more programs are stored in the memory and configured to be executed by the one or more processors, and the one or more programs are configured to execute the method described in the above embodiment.

[0160] A computer-readable storage medium stores a computer program for use in conjunction with an electronic device, wherein the computer program can be executed by a processor to implement the method described in the above embodiment.

[0161] Those skilled in the art will appreciate that embodiments of the present invention may be provided as methods, apparatus, or computer program products. Thus, embodiments of the present invention may take the form of a fully hardware embodiment, a fully software embodiment, or an embodiment combining software and hardware. Furthermore, embodiments of the present invention may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to magnetic disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0162] The embodiments of the present invention are described with reference to the flowcharts and / or block diagrams of the methods, terminal devices (systems), and computer program products according to the embodiments of the present invention. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of the processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing terminal device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing terminal device generate instructions for implementing the process in the flowchart and / or block diagram. Figure 1 a process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0163] These computer program instructions may also be stored in a computer readable memory that can direct a computer or other programmable data processing terminal device to operate in a specific manner, so that the instructions stored in the computer readable memory produce a manufactured product including an instruction device, which implements the process Figure 1 a process or multiple processes and / or boxes Figure 1 The function specified in one or more boxes.

[0164] These computer program instructions can also be loaded onto a computer or other programmable data processing terminal device so that a series of operating steps are executed on the computer or other programmable terminal device to produce a computer-implemented process, thereby providing instructions for executing on the computer or other programmable terminal device to implement the process. Figure 1 a process or multiple processes and / or boxes Figure 1 A step that specifies a function in one or more boxes.

[0165] Although the preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they become aware of the basic creative concepts. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the embodiments of the present invention.

[0166] Finally, it should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or terminal device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article, or terminal device that includes the element.

[0167] The above describes in detail a method and device for determining a thermal processing path provided by the present invention. Specific examples are used herein to illustrate the principles and implementations of the present invention. The description of the above embodiments is intended only to facilitate understanding of the method and core concepts of the present invention. Furthermore, those skilled in the art will appreciate that variations in the specific implementations and scope of application are possible based on the concepts of the present invention. In summary, the contents of this specification should not be construed as limiting the present invention.

Claims

1. A method for determining a thermal processing path, characterized in that: The method comprises: Obtain the area to be processed and workpiece parameter information of the workpiece sheet; Establishing a dot matrix in the area to be processed, and determining a plurality of processing line segments of the workpiece in the area to be processed based on the workpiece parameter information, wherein the dot matrix includes a plurality of reference points; Traversing all processing line segments at most twice to determine a plurality of thermal processing paths corresponding to the workpiece, wherein the thermal processing paths also include idle displacement line segments other than the processing line segments; Determining a heat avoidance region during heat processing of each heat processing path in the dot matrix, wherein the heat avoidance region refers to a region in the dot matrix where a heat value of a reference point is greater than a preset heat threshold and a distance from the reference point is within a preset distance threshold; Selecting an optimal thermal processing path that meets the thermal avoidance condition from the multiple thermal processing paths includes: calculating a ratio of a total length of all processing line segments corresponding to each thermal processing path located within the thermal avoidance area to a total length of the corresponding thermal processing path, and selecting a thermal processing path with the smallest length ratio from the multiple thermal processing paths as the optimal thermal processing path; or The method comprises the steps of calculating a total segment length of all processing line segments corresponding to each thermal processing path within the thermal avoidance area and a length ratio thereof to the total length of the corresponding thermal processing path; calculating an efficiency ratio corresponding to each thermal processing path, wherein the efficiency ratio is determined based on a ratio of a path length of the shortest thermal processing path to a path length of a current thermal processing path; if the length ratio corresponding to at most one thermal processing path is zero, selecting the thermal processing path with the smallest comprehensive ratio from the multiple thermal processing paths as the optimal thermal processing path, wherein the comprehensive ratio is the quotient of the length ratio and the efficiency ratio; and if the length ratio corresponding to at least two thermal processing paths is zero, selecting multiple thermal processing paths with corresponding comprehensive ratios of zero from the multiple thermal processing paths, and selecting the thermal processing path with the largest efficiency ratio from the multiple thermal processing paths as the optimal thermal processing path.

2. The method for determining a thermal processing path according to claim 1, wherein: The workpiece parameter information includes at least the shape of the workpiece, and determining a plurality of processing line segments of the workpiece in the area to be processed based on the workpiece parameter information includes: Determining each vertex of the workpiece in the area to be processed according to the shape of the workpiece; Determining a plurality of target line segments corresponding to the workpiece according to each vertex, wherein a line segment between two adjacent vertices is determined as a target line segment, and the target line segment includes a straight line segment and / or a curved line segment; The multiple target line segments are segmented to obtain multiple processing line segments corresponding to the workpiece.

3. The method for determining a thermal processing path according to claim 2, wherein: The step of segmenting the plurality of target line segments to obtain the plurality of processing line segments corresponding to the workpiece includes: Obtain process parameter information corresponding to each target line segment; In the case where process parameter information changes on the same target line segment, line segmentation is performed on the line segment points corresponding to the target line segment where the process parameter information changes, to obtain multiple processing line segments corresponding to the workpiece.

4. The method for determining a thermal processing path according to claim 2, wherein: The workpiece parameter information also includes the workpiece size. The segmentation of the plurality of target line segments to obtain the plurality of processing line segments corresponding to the workpiece includes: Determining the length of each target line segment according to the size of the workpiece, and comparing the length of the target line segment with a preset segmentation length threshold; The target line segments that are greater than the segmentation length threshold are segmented according to the segmentation length threshold as the segmentation interval to obtain a plurality of processing line segments corresponding to the workpiece.

5. The method for determining a thermal processing path according to claim 3 or 4, characterized in that: Determining the heat avoidance area of ​​each thermal processing path during thermal processing in the dot matrix includes: According to the line segment processing sequence of each thermal processing path, at the end point of each line segment corresponding to the thermal processing path, executing the heat value update of all reference points in the dot matrix; According to the current heat value of each reference point in the dot matrix, it is determined whether the next processing line segment adjacent to the current line segment in the processing sequence is located in the heat avoidance area, until the heat avoidance area of ​​each thermal processing path during thermal processing is determined.

6. The method for determining a thermal processing path according to claim 5, wherein: The updating of the heat values ​​of all reference points in the dot matrix is ​​performed at the end points of each line segment of the corresponding thermal processing path according to the line segment processing sequence of each thermal processing path, including: If the current line segment is an empty shift line segment, the calorific value of each reference point in the dot matrix is ​​updated at the end point of the empty shift line segment according to the last updated calorific value of each reference point in the dot matrix and the preset calorific decay rule; If the current line segment is a processing line segment, the heat value of each reference point in the dot matrix is ​​updated at the end point of the idle shift line segment according to the last updated heat value of each reference point in the dot matrix and the preset heat attenuation rule; The heat values ​​of multiple reference points located in the adjacent area at the end point of each processing line segment corresponding to the thermal processing path are secondary updated according to a preset heat increase rule, wherein the adjacent area refers to an area whose radius from the end point of the current processing line segment is within a preset radius threshold.

7. The method for determining a thermal processing path according to claim 6, wherein: The method further comprises: If the current line segment is the first idle shift line segment of the corresponding thermal processing path, the last updated heat value is the initial heat value of each reference point in the dot matrix.

8. The method for determining a thermal processing path according to claim 7, wherein: The method further comprises the step of obtaining an initial calorific value of each reference point in the dot matrix: Collecting heat value distribution information in the area to be processed of the workpiece sheet; The calorific value distribution information is averaged to obtain the initial calorific value of each reference point in the dot matrix.

9. The method for determining a thermal processing path according to claim 1, wherein: The step of establishing a dot matrix in the area to be processed comprises: Establishing a coordinate system in the area to be processed, and determining a coordinate range of the area to be processed corresponding to the coordinate system; Reference point values ​​are taken within the coordinate range to generate a dot matrix including a plurality of reference points.

10. The method for determining a thermal processing path according to claim 9, wherein: The step of taking reference point values ​​within the coordinate range to generate a dot matrix including a plurality of reference points includes: Randomly select reference points within the coordinate range to generate an irregular dot matrix including multiple reference points.

11. The method for determining a thermal processing path according to claim 9, wherein: The step of taking reference point values ​​within the coordinate range to generate a dot matrix including a plurality of reference points includes: According to the preset reference point generation rule, reference point values ​​are taken within the coordinate range to generate a regular lattice including multiple reference points.

12. The method for determining a thermal processing path according to claim 1, wherein: The traversing all processing line segments at most twice to determine a plurality of thermal processing paths corresponding to the workpiece includes: All processing line segments are traversed once in a continuous processing order to determine a plurality of thermal processing paths corresponding to the workpiece.

13. The method for determining a thermal processing path according to claim 1, wherein: The traversing all processing line segments at most twice to determine a plurality of thermal processing paths corresponding to the workpiece includes: Traversing all processing line segments once in a continuous processing order to determine a plurality of first processing paths corresponding to the workpiece; Traversing all processing line segments once in a non-continuous processing order to determine a plurality of second processing paths corresponding to the workpiece; The plurality of first processing paths and the plurality of second processing paths are combined to obtain a plurality of thermal processing paths corresponding to the workpiece.

14. The method for determining a thermal processing path according to claim 1, wherein: The method further comprises: When determining the thermal processing path of the next workpiece in the area to be processed, in the non-thermal avoidance area, the distance between the multiple processing line segments corresponding to the next workpiece and the path end point corresponding to the optimal thermal processing path of the current workpiece, the endpoint of the processing line segment that meets the preset distance condition is used as the line segment starting point of the first processing line segment of the next workpiece, and the multiple thermal processing paths corresponding to the next workpiece are determined.

15. A device for determining a thermal processing path, characterized in that: The device comprises: An information acquisition module is used to obtain the area to be processed and workpiece parameter information of the workpiece sheet; a dot matrix creation module, configured to establish a dot matrix in the area to be processed and determine a plurality of processing line segments of the workpiece in the area to be processed based on the workpiece parameter information, wherein the dot matrix includes a plurality of reference points; a path generation module, configured to traverse all processing line segments at most twice to determine a plurality of thermal processing paths corresponding to the workpiece, wherein the thermal processing paths also include idle displacement line segments other than the processing line segments; a region determination module, configured to determine, in the dot matrix, a heat avoidance region for each thermal processing path during thermal processing, wherein the heat avoidance region refers to a region in the dot matrix where a heat value of a reference point is greater than a preset heat threshold and a distance from the reference point is within a preset distance threshold; an optimal path determination module, configured to select an optimal thermal processing path that satisfies a thermal avoidance condition from the plurality of thermal processing paths, and further configured to calculate a ratio of a total segment length of all processing line segments corresponding to each thermal processing path located within the thermal avoidance region to a total length of the corresponding thermal processing path, and select a thermal processing path having the smallest length ratio from the plurality of thermal processing paths as the optimal thermal processing path; or Used to calculate the ratio of the total segment length of all processing line segments corresponding to each thermal processing path located in the thermal avoidance area to the total length of the corresponding thermal processing path; calculate the efficiency ratio corresponding to each thermal processing path, wherein the efficiency ratio is determined based on the ratio of the path length of the shortest thermal processing path to the path length of the current thermal processing path; if the length ratio corresponding to at most one thermal processing path is zero, the thermal processing path with the smallest comprehensive ratio is selected from the multiple thermal processing paths as the optimal thermal processing path, wherein the comprehensive ratio is the quotient of the length ratio and the efficiency ratio; if the length ratio corresponding to at least two thermal processing paths is zero, multiple thermal processing paths with corresponding comprehensive ratios of zero are selected from the multiple thermal processing paths, and the thermal processing path with the largest efficiency ratio is selected from the multiple thermal processing paths as the optimal thermal processing path.

16. An electronic device comprising: one or more processors; Memory; One or more programs, wherein the one or more programs are stored in the memory and configured to be executed by the one or more processors, and the one or more programs are configured to perform the method according to any one of claims 1 to 14.

17. A computer-readable storage medium storing a computer program for use in conjunction with an electronic device, wherein the computer program can be executed by a processor to implement the method according to any one of claims 1 to 14.

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